Datasheet BQ3287EMT, BQ3287EAMT Datasheet (Texas Instruments)

Features
Direct clock/calendar replace-
ment for IBM computers and other applications
Functionally compatible with
the DS1287/DS1287A and MC146818A/ MC146818B
242 bytes of general nonvolatile
storage
Provides a 32.768kHz output for
power management
System wake-upcapability—
alarm interrupt active in battery-backup mode
Integral lithium cell and crystal160 ns cycle time allows fast bus
operation
14 bytes for clock/calendar and
control
Time of day in seconds, minutes,
and hours
-
12- or 24-hour format
®
AT-compatible
- Optional daylight saving
adjustment
Pin Connections
MOT
1
NC
2
NC
3 4
AD
0
5
AD
1
AD
6
2
AD
7
3
AD
8
4
AD
9
5
AD
10
6
11
AD
7
12
V
SS
24-Pin DIP Module
24 23
22 21 20 19 18 17 16 15 14
13
PN3287E1.eps
V
CC SQW EXTRAM NC/RCL NC INT RST DS NC R/W AS CS
bq3287E/bq3287EA
Real-Time Clock(RTC)Module
Calendar in day of the week, day
of the month, months, and years with automatic leap-year adjust­ment
Programmable square wave out-
put
Three individually maskable in-
terrupt event flags:
Periodic rates from 122µsto
-
500ms Time-of-day alarm once per
-
second to once per day End-of-clock update cycle
-
Better than one minute per
month clockaccuracy
General Description
The CMOS bq3287E/bq3287EA is a low-power microprocessor periph­eral providing a time-of-day clock and 100-year calendar with alarm features and battery operation. Other features include three maskable interrupt sources, square­wave output, and 242 bytes of gen­eral nonvolatile storage. A
32.768kHz output is available for sustaining power-management ac­tivities. Wake-up capability is pro-
Pin Names
AD0–AD7 Multiplex address/data
input/output
MOT
CS Chip select input
AS Address strobe input
DS Data strobe input
R/W Read/write input
INT Interrupt request output
vided by an alarm interrupt, which is active in battery-backup mode. The bq3287EA version is identical to the bq3287E, with the addition of the RAM clear input.
The bq3287E is a fully compatible real-time clock for IBM AT-compatible computers and other applications. The bq3287E write-protects the clock, cal­endar, and storage registers during power failure. The integral backup en­ergy source then maintains data and operates the clockandcalendar .
As shipped from Benchmarq, the real time clock is turned off to maxi­mize battery capacity for in-system operation.
The bq3287E is functionally equiva­lent to the bq3285E, except the bat­tery (16,20) and crystal pins (2,3) are not accessible. These pins are connected internally to a coin cell and quartz crystal. The coin cell is sized to provide 10 years of data re­tention and clock operation in the absence of power. For a complete de­scription of features, operating con­ditions, electrical characteristics, bus timing, and pin descriptions, see the bq3285E data sheet.
RST Reset input
SQW Square wave output
EXTRAM Extended RAM enable
NC No connect
RCL RAM clear input
(bq3287EA only)
V
CC
V
SS
+5V supply
Ground
Sept. 1996C
1
bq3287E/bq3287EA
Absolute Maximum Ratings
Symbol Parameter Value Unit Conditions
V
CC
V
T
T
OPR
T
STG
T
BIAS
T
SOLDER
DC voltage applied on VCCrelative to V DC voltage applied on any pin excluding V
relative to V
SS
SS
CC
Operating temperature 0 to +70 °C Commercial Storage temperature -40 to +70 °C Commercial Temperature under bias -10 to +70 °C Commercial Soldering temperature 260 °C For 10 seconds
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation
should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to
conditions beyond the operational limits for extended periods of time may affect device reliability.
-0.3 to 7.0 V
-0.3 to 7.0
VV
V
T
CC
+ 0.3
Recommended DC Operating Conditions (T
A=TOPR
)
Symbol Parameter Minimum Typical Maximum Unit
V
CC
V
SS
V
IL
V
IH
Supply voltage 4.5 5.0 5.5 V Supply voltage 0 0 0 V Input low voltage -0.3 - 0.8 V Input high voltage 2.2 - VCC+ 0.3 V
Note: Typical values indicate operation at TA= 25°C.
DC Electrical Characteristics (T
A=TOPR,VCC
=5V±10%)
Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes
I
LI
I
LO
V
OH
V
OL
Input leakage current - ­Output leakage current - -
± 1 µA ± 1 µA
VIN=VSSto V AD0–AD7, INT and
SQW in high impedance Output high voltage 2.4 - - V IOH= -1.0 mA Output low voltage - - 0.4 V IOL= 4.0 mA
Min. cycle, duty = 100%,
I
CC
V
SO
V
PFD
I
RCL
I
MOTH
I
XTRAM
Operating supply current - 7 15 mA Supply switch-over voltage - 3.0 - V Power-fail-detectvoltage 4.0 4.17 4.35 V
Input current when RCL =V Input current when MOT =
V
CC
Input current when EXTRAM = V
CC
SS
- - 185
- - -185
- - -185
IOH= 0mA, IOL= 0mA
Internal 30K pull-up
µA
(bq3287EA only)
Internal 30K pull-down
µA
Internal 30K pull-down
µA
Note: Typical values indicate operation at TA= 25°C, VCC=5V.
CC
Sept. 1996C
2
bq3287E/bq3287EA
Power-Down/Power-Up Timing (T
Symbol Parameter Minimum Typical Maximum Unit Conditions
t
F
t
R
t
CSR
t
DR
Note: Clock accuracy is better than±1 minute per month at 25°C for the period of tDR. Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode
VCCslew from 4.5V to 0V 300 - ­VCCslew from 0V to 4.5V 100 - -
CS at VIHafter power-up 20 - 200 ms
Data-retention and time­keeping time
may affect data integrity.
A=TOPR)
s
µ
s
µ
Internal write-protection period after VCCpasses V on power-up.
10 - - years TA= 25°C.
PFD
Power-Down/Power-Up Timing
Sept. 1996C
3
bq3287E/bq3287EA
24-Pin MT (T-type module)
24-Pin MT(T-Type Module
Inches Millimeters
Dimension
A 0.360 0.390 9.14 9.91
A1 0.015 - 0.38 -
B 0.015 0.022 0.38 0.56 C 0.008 0.013 0.20 0.33 D 1.320 1.335 33.53 33.91 E 0.710 0.740 18.03 18.80
e 0.590 0.620 14.99 15.75 G 0.090 0.110 2.29 2.79 L 0.110 0.130 2.79 3.30 S 0.100 0.120 2.54 3.05
Min. Max. Min. Max.
)
Sept. 1996C
4
bq3287E/bq3287EA
Data Sheet Revision History
Change No. Page No. Description Nature of Change
1 8 Register C, bit 2 Was0; is na (not affected) 22I 22I
max. was 275; is now 185. Pull-down = 30K. V aluechange
RCL
max. was -75; is now -185. Value change
XTRAM
Notes: Change 1 = Apr.1994 B “Final” changes from Dec. 1993 A “Preliminary.”
Change 2 = Sept. 1996 C changes from April 1994 B.
Ordering Information
bq3287E MT -
Temperature:
blank = Commercial (0 to +70°C)
PackageOption:
MT = T-type module
RAM Clear Option:
A = RAM clear on pin 21 no mark = No connect on pin 21
Device:
bq3287E Real-Time Clock Module
Sept. 1996C
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Loading...