TEXAS INSTRUMENTS bq29410, bq29411, bq29412 Technical data

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GND

OUT

VDD

CD

VC4

VC1

VC3

1

2 VC2

3

4 5

6

7

8

DCT PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

VC1

VC2

VC3

GND

OUT

VDD

CD

VC4

PW PACKAGE

(TOP VIEW)

查询BQ29410供应商

VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES

(2

FEATURES FUNCTION

• 2-, 3-, or 4-Cell Secondary Protection

• Low Power Consumption ICC< 2 µA

[VCELL

• Fixed High Accuracy Overvoltage Protection

Threshold
– bq29410 = 4.35 V
– bq29411 = 4.40 V
– bq29412 = 4.45 V

• Programmable Delay Time of Detection

• High Power Supply Ripple Rejection

• Stable During Pulse Charge Operation

< V

(ALL)

(PROTECT)

]

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

nd

-LEVEL PROTECTION)

Each cell in a multiple-cell pack is compared to an
internal reference voltage. If one cell reaches an
overvoltage condition, the protection sequence
begins. The bq2941x device starts charging an
external capacitor through the CD pin. When the CD
pin voltage reaches 1.2 V, the OUT pin changes from
a low level to a high level.

APPLICATIONS

• 2nd-Level Overvoltage Protection in Li-Ion

Battery Packs in:
– Notebook Computers
– Portable Instrumentation
– Portable Equipment

DESCRIPTION

The bq2941x is a secondary overvoltage protection
IC for 2-, 3-, or 4-cell lithium-ion battery packs that
incorporates a high-accuracy precision overvoltage
detection circuit. It includes a programmable delay
circuit for overvoltage detection time.

ORDERING INFORMATION

T

A

–40 ° C to 110 ° C 4.40 V bq29411DCT3R CJH bq29411PW bq29411PWR

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com .
(2) Contact your local Texas Instruments representative or sales office for alternative overvoltage threshold options.
(3) The "R" suffix indicates tape-and-reel packaging.

V

(PROTECT)

(2)

MSOP (DCT3) SYMBOL PW

4.35 V bq29410DCT3R CJG bq29410PW bq29410PWR

4.45 V bq29412DCT3R CJJ bq29412PW bq29412PWR

(1)

PACKAGE

(3)

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2005, Texas Instruments Incorporated

www.ti.com

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

Supply voltage range VDD –0.3 V to 28 V

Input voltage range

Output voltage range

Continuous total power dissipation See Dissipation Rating Table
Storage temperature range, T
Lead temperature (soldering, 10 s) 300 ° C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4, and VC4-GND.

VC1, VC2, VC3, VC4 –0.3 V to 28 V
VC1 TO VC2, VC2 TO VC3, VC3 TO VC4, VC4 TO GND –0.3 V to 8 V
OUT –0.3 V to 28 V
CD –0.3 V to 28 V

stg

(1) (2)

UNIT

–65 ° C to 150 ° C

PACKAGE DISSIPATION RATINGS

PACKAGE

DCT 412 mW 3.3 mW/ ° C 264 mW 214 mW

PW 525 mW 4.2 mW/ ° C 336 mW 273 mW

TA= 25 ° C DERATING FACTOR TA= 70 ° C TA= 85 ° C

POWER RATING ABOVE TA= 25 ° C POWER RATING POWER RATING

RECOMMENDED OPERATING CONDITIONS

V

V

t
R
C
R
C
T

Supply voltage 4 25 V

DD

Input voltage range V

I

Delay time capacitance 0.22 µF

d(CD)

Voltage-monitor filter resistance 100 1k Ω

IN

Voltage-monitor filter capacitance 0.01 0.1 µF

IN

Supply-voltage filter resistance 0 1 k Ω

VD

Supply-voltage filter capacitance 0.1 µF

VD

Operating ambient temperature range –40 110 ° C

A

VC1, VC2, VC3, VC4 0 V
VCn – VC (n=1), (n=1, 2, 3), VC4 – GND 0 5

MIN NOM MAX UNIT

DD

2

www.ti.com

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

ELECTRICAL CHARACTERISTICS

over recommended operating free-air temperature range, TA= 25 ° C (unless otherwise noted)

PARAMETER TEST CONDITION MIN NOM MAX UNIT

V

(OA)

V

(PROTECT)

V

hys

I

IN

t

D1

I

(CD_dis)

I

CC

I

OH

I

OL

Overvoltage detection
accuracy

Overvoltage
detection voltage

Overvoltage detection
hysteresis

(1)

(1)

Input current 0.3 µA
Overvoltage detection delay

time
CD GND clamp current V

Supply current µA

High-level output current –1 mA

Low-level output current 5 µA

(1) Levels of the overvoltage detection and the hysteresis can be adjusted. For assistance, contact a Texas Instruments sales

representative.

TA= 25 ° C 25 35
TA= –20 ° C to 85 ° C 25 50 mV
TA= –40 ° C to 110 ° C 80
bq29410 4.35
bq29411 4.40 V
bq29412 4.45

V2, V3 , VC4 input ,V
VC1 = VC2 = VC3 = VC4 = 3.5 V (see Figure 1 )

V

= VC1, CD = 0.22 µF 1 1.5 2 S

DD

= VC1, CD = 1 V 5 12 µA

DD

V

= VC1,

DD

VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V (see 2 3

= VC1

DD

Figure 1 )

V

= VC1,

DD

VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 2.3 V (see 1.5 2.5

Figure 1 )

OUT = 3 V, V
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 4.5 V

OUT = 0.1 V, V
VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V

= VC1,

DD

= VC1,

DD

300 mV

3

www.ti.com

1

2

6
5

8

1

2

6
5

8

1

2

6

5

8

3

4

887

GNDVC4

OUT

VC1
VC2
VC3

VDD

CD

GND

VC4

OUT

VC1

VC2
VC3

VDD

CD

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

Figure 1. ICC, IINMeasurement (DCT Package)

Terminal Functions

TERMINAL

MSOP TSSOP

(DCT) (PW)

NAME

8 1 VC1 Sense voltage input for most positive cell
7 2 VC2 Sense voltage input for second most positive cell
6 3 VC3 Sense voltage input for third most positive cell
5 4 GND Ground pin
4 5 VC4 Sense voltage input for least positive cell
3 6 CD An external capacitor is connected to determine the programmable delay time
2 7 VDD Power supply
1 8 OUT Output

DESCRIPTION

4

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VC1

VC2

VC4

VC3

GND

VDD

OUT

CD

1.2 V (TYP)

R

VD

C

VD

ICD= 0.2 A (TYP)

C

IN

R

IN

R

IN

R

IN

R

IN

C

IN

C

IN

C

IN

C

(DELAY)

t

d





1.2 V  C

(DELAY)



I

CD

C

(DELAY)





td I

CD



1.2 V

FUNCTIONAL BLOCK DIAGRAM

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

OVERVOLTAGE PROTECTION

When one of the cell voltages exceeds V
C

, connected to the CD pin. If the voltage at the CD pin, V

(DELAY)

(PROTECT)

transitions high. An externally connected NCH FET is activiated and blows the external fuse in the positive
battery rail; see the functional block diagram.

If all cell voltages fall below V

(PROTECT)

before the voltage at pin CD reaches 1.2 V, the delay time does not run
out. An internal switch clamps the CD pin to GND and discharges the capacitor, C
delay time for the next occurring overvoltage event.

Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V

DELAY TIME CALCULATION

The delay time is calculated as follows:

Where I

(CD)

= CD current source = 0.18 µA

, an internal current source begins to charge the capacitor,

reaches 1.2 V, the OUT pin is activated and

CD,

(DELAY)

, and secures the full

(PROTECT)

– V

hys.

5

www.ti.com

V

(PROTECT)

Cell Voltage

(VCn - VC(n-1),

VC4 - GND)

CD

OUT

1.2 V

t

DELAY

V

(PROTECT)

- V

hys

td = (1.2 V x C

DELAY

)/I

CD

224

223

222

111

GNDVC4

OUT

VC1
VC2
VC3

VDD
CD

6
5

8

GNDVC4

OUT

VC1
VC2
VC3

VDD
CD

6
5

8

GNDVC4

OUT

VC1
VC2
VC3

VDD
CD

6

5

8

887

1

2

6
5

8

1

2

6
5

8

1

2

6

5

8

3

4

887

GNDVC4

OUT

VC1
VC2
VC3

VDD

CD

GND

VC4

OUT

VC1
VC2
VC3

VDD

CD

bq29410, bq29411, bq29412

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

Figure 2. Timing for Overvoltage Sensing

APPLICATION INFORMATION

BATTERY CONNECTIONS

The following diagrams show the DCT package device in different cell configurations.

Figure 3. 4-Series Cell Configuration Figure 4. 3-Series Cell Configuration

(Connect together VC1 and VC2)

6

www.ti.com

1

2

6

3

4

7

GND

VC4

OUT

VC1
VC2
VC3

VDD
CD

6

5

8

7

SLUS669B – AUGUST 2005 – REVISED DECEMBER 2005

APPLICATION INFORMATION (continued)

Figure 5. 2-Series Cell Configuration

CELL CONNECTIONS

To prevent incorrect output activation, the following connection sequences must be used.

4-Series Cell Configuration

• VC1(=VDD) → VC2 → VC3 → VC4 → GND or

• GND → VC4 → VC3 → VC2 → VC1(=VDD)

3-Series Cell Configuration

• VC1(=VC2=VDD) → VC3 → VC4 → GND or

• GND → VC4 → VC3 → VC1(=VC2=VDD)

2-Series Cell Configuration

• VC1(=VC2=VC3=VDD) → VC4 → GND or

• GND → VC4 → VC1(=VC2=VC3=VDD)

bq29410, bq29411, bq29412

7

PACKAGE OPTION ADDENDUM

www.ti.com

12-Dec-2005

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

BQ29412DCT3R ACTIVE SM8 DCT 8 3000 Pb-Free

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU SNBI Level-1-250C-UNLIM

(3)

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1

MECHANICAL DATA

MPDS049B – MA Y 1999 – REVISED OCT OBER 2002

DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE

0,65

PIN 1
INDEX AREA

0,30

0,15

8

1

3,15
2,75

5

2,90
2,70

4

1,30 MAX

M

0,13

4,25
3,75

Seating Plane

0,15 NOM

0° – 8°

Gage Plane

0,25

0,60
0,20

0,10
0,00

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.

0,10

4188781/C 09/02

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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