The bq24180 is a compact, flexible, high-efficiency, USB-friendly switch-mode charge management device for
single-cell Li-ion and Li-polymer batteries used in a wide range of portable applications. The charge parameters
is programmable using an I2C compatible interface. The bq24180 integrates a synchronous PWM controller,
power MOSFETs, input current sensing and overvoltage protection, high-accuracy current and voltage regulation,
and charge termination, into a small WCSP package.
1
2
2I
C is a trademark of Phillips Electronics.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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DESCRIPTION (CONTINUED)
The bq24180 charges the battery in three phases: conditioning, constant current and constant voltage. Charge
current is programmable using the I2C interface. Additionally, the input current can be limited to a host
programmable threshold to maintain maximum charge current from current-limited sources, such as USB ports.
Charge is terminated based on user-selectable minimum current level. A software watchdog provides a safety
backup for I2C interface while a safety timer prevents overcharging the battery. During normal operation,
bq24180 automatically restarts the charge cycle if the battery voltage falls below an internal threshold and
automatically enters sleep mode or high impedance mode when the input supply is removed. The charge status
is reported to the host using the I2C interface. During the charging process, the bq24180 monitors its junction
temperature (TJ) and reduces the charge current if TJincreases to 125°C. The bq24180 is available in 25-pin
WCSP package.
ORDERING INFORMATION
PART NUMBER
bq24180YFFR16.5 V6B
bq24180YFFT16.5 V6B
(1) The YFF package is available in the following options:
R – taped and reeled in quantities of 3,000 devices per reel.
T – taped and reeled in quantities of 250 devices per reel.
(2) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including
bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(1)(2)
V
OVP
I2C ADDRESS
ABSOLUTE MAXIMUM RATINGS
(1)(2)
over operating free-air temperature range (unless otherwise noted)
LIMITSUNIT
Supply voltage range (with respect to PGND)VBUS–2 to 20V
Input voltage range (with respect to and PGND)SCL, SDA, PSEL, CSIN, CSOUT, DRV, DCOUT, INT–0.3 to 7V
Output voltage range (with respect to and PGND)V
Voltage difference between CSIN and CSOUT inputs (VCSIN –VCSOUT)±7V
Voltage difference between BOOT and SW inputs (VBOOT –VSW)–0.3 to 7V
Output sinkmA
Output currentDCOUT1.5A
Output current (average)SW2A
T
A
T
J
T
stg
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
Operating free-air temperature range–30 to +85°C
Junction temperature range–40 to +125°C
Storage temperature–45 to +150°C
Faulty adapter threshold3.63.84.0V
Deglitch time for Faulty adapter30ms
Hysteresis for faulty adapter protectionV
Current source for faulty adapter protection203040mA
Detection Interval2s
Input current limiting thresholdI
DCOUT Pass FET on-resistanceI
DCOUT current limit programmable range3501400mA
Deglitch time from DCOUT current-limit event
(1) Bottom N-channel MOSFET always turns on for ~60 ns and then turns off if current is too low.
Oscillator frequency3.0MHz
Frequency accuracy–10%10%
Maximum duty cycle99.5%
Minimum duty cycle0
Synchronous mode to non-synchronous
mode transition current threshold
Internal bias voltage regulatorI
DRV Output CurrentExternal load on DRV10mA
DRV Dropout Voltage (V
Input OVP threshold voltageThreshold over V
V
hysteresisV
OVP
Input High thresholdV
VIN_HIGH_USB hysteresisV
OVP deglitch timeV
Cycle-by-cycle current limit for chargeCharge mode operation1.82.43.0A
Precharge to fast charge thresholdV
VPRECHG hysteresisV
Precharge charge charging currentV
Thermal trip165°C
Thermal hysteresis10°C
Thermal regulation thresholdCharge current begins to taper down120°C
Timeout for the watchdog timerWatchdog timer12s
Safety timer accuracy–20%20%
TS Hot ThresholdCorresponds to 55°C, VTSFalling0.1530.1600.169V
TS Hot Threshold HysteresisVTS Rising12.5mV
TS Warm ThresholdCorresponds to 45°C VTSFalling0.2100.2250.240V
TS Warm Threshold HysteresisVTSRising12.5mV
TS Cold ThresholdCorresponds to 5°C, VTSRising1.061.101.14V
TS Cold Threshold HysteresisVTSFalling75mV
TS Bias Current95100105µA
TS Open ResistanceResistance on TS that translates to open circuit on TS200kΩ
= 5V, HZ_MODE=0, CD=0, TJ= –40°C to 125°C and TJ= 25°C for typical values (unless otherwise
VBUS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Measured from SW to PGND125210mΩ
Low-side MOSFET cycle-by-cycle current sensing100mA
VBUSA1, A2I/O Charger Input Voltage. Connect to an input supply up to 16V. Bypass VBUS to PGND with a 1µF ceramic
BOOTA3OHigh-Side MOSFET Gate Driver Supply. Connect a 10nF ceramic capacitor (voltage rating above 10V) from
SCLA4II2C interface clock. Connect SCL to the logic rail through a 10kΩ resistor.
SDAA5I/OI2C interface data. Connect SCL to the logic rail through a 10kΩ resistor.
PMIDB1, B2, B3OConnection Point Between Reverse Blocking MOSFET and High-Side Switching MOSFET. Bypass PMID to
INTB4OHost Interface Status Output. INT is a low voltage open drain output used to signal charge status to the host
CDB5OHardware Disable Input. Connect CD to GND to enable charge. Drive CD high to disable charge and place
SWC1, C2,OInductor Connection. Connect the switched side of the inductor to SW.
C3
PSELC4IUSB Source Detection Input. Drive PSEL high to indicate a USB source is connected to the input and the PC
STATC5OStatus Output. STAT is an open drain output that is pulled low during charging. When charging is complete or
PGNDD1, D2,Power ground. Connect to the ground plane for the circuit.
D3
DCOUT D4, D5OAccessory Power Output. DCOUT is connected to the battery through an internal pass FET. When enabled
CSINE1ICharge Current-Sense Input. Battery current is sensed via the voltage drop across an external sense resistor.
BOOT pin to SW pin to supply the gate drive for the high side MOSFET.
PGND with a minimum of 3.3µF ceramic capacitor. Use caution when connecting an external load to PMID.
The PMID output is not current limited. Any short on PMID will result in damage to the IC.
processor. INT is pulled low during charging. When charging is complete or when charging is disabled, INT is
high impedance. When a fault occurs, a 128µs pulse is sent out as an interrupt for the host. INT is
enabled/disabled using the EN_STAT bit in the control register. Connect INT to a logic rail through a 10kΩ
resistor to communicate with the host processor.
the bq24180 into high impedance mode. Toggling CD resets the safety timer when in DEFAULT mode, but
does not reset the timer when in host mode. CD is pulled to PGND through a 100kΩ internal resistor.
mode default values should be used. When PSEL is high, the IC starts up with a 100mA input current limit.
Drive PSEL low to indicate that an AC Adapter is connected to the input. When PSEL is low, the IC starts up
with no input current limit and a 1A charge current. PSEL has an internal 100kΩ pullup resistor.
when charging is disabled, STAT is high impedance. When a fault occurs, a 128µs pulse is sent out as an
interrupt for the host. STAT is enabled/disabled using the EN_STAT bit in the control register. Connect STAT
to a logic rail using an LED for visual indication or through a 10kΩ resistor to communicate with the host
processor.
through I2C, DCOUT is connected to the battery. When disabled, DCOUT is high-impedance. Bypass DCOUT
to PGND with at least a 1µF ceramic capacitor.
Bypass CSIN to PGND with a 0.1µF ceramic capacitor.
Product Folder Link(s): bq24180
bq24180
SLUSA02 A –FEBRUARY 2010–REVISED FEBRUARY 2010
www.ti.com
PIN FUNCTIONS (continued)
NAMEPIN NO.I/ODESCRIPTION
TSE2IBattery Pack NTC Monitor. Connect TS to a 4.7kΩ NTC thermistor. During DEFAULT mode, when VTS>
DRVE3OGate Drive Supply. DRV is the supply for the gate drive of the internal MOSFETs. Bypass DRV to PGND with
CSOUT E4, E5IBattery voltage and Current Sense Input. Connect to the positive terminal of the battery pack. CSOUT is also
V
or VTS<V
COLD
reported by the I2C interface. During host mode, the TS function is active, but does not affect charging. The
charging is suspended. If V
HOT
HOT
< VTS< V
charging current is reduced. The faults are
WARM
faults are only reported by the I2C interface.
a 1µF ceramic capacitor. DRV may be used to drive external loads up to 10mA. DRV is active whenever the
input is connected.
the supply for the DCOUT output. Bypass CSOUT to PGND with 1µF ceramic capacitor.
The bq24180 is a highly integrated synchronous switch-mode charger featuring integrated MOSFETs and small
external components, targeted at extremely space-limited portable applications powered by 1-cell Li-Ion or
Li-polymer battery pack. For current limited power source, such as a USB host or hub, the high efficiency
converter is critical in fully utilizing the input power capacity and quickly charging the battery. Due to the high
efficiency in a wide range of the input voltage and battery voltage, the switching mode charger is a good choice
for high speed charging with less power loss and better thermal management.
The bq24180 has two operation modes: charge mode and high impedance mode. In charge mode, the bq24180
supports a precision Li-ion or Li-polymer charging system for single-cell applications. In high impedance mode,
the bq24180 stops charging and operates in a mode with very low current from IN and battery, to effectively
reduce the power consumption when the portable device in standby mode. Through proper control, bq24180
achieves the smooth transition among different operation modes.
Figure 25. Startup on Adapter Plug-In in DEFAULT Mode
Product Folder Link(s): bq24180
VUVLO < VIN < VOVP?
Yes
No
VBAT > 2V?
Enable 50mA
prechargecurrent
STAT = 0
No
/CEbit = 0?
No
Yes
BeginSafety Timer
V
HIGH<VIN<VOVP
No
Enable 50mA
prechargecurrent
Timer 2x
STAT = 0
Yes
Good Adapter
connected?
AdapterPlugIN
Watchdog Active
ActiveHost
Communication
Yes
BeginHOST
ModeBattery
Charging
Hi-Zbit = 0?
Yes
No
Wait 2s
No
EnableHi-ZMode
bq24180
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SLUSA02 A –FEBRUARY 2010–REVISED FEBRUARY 2010
Charge Profile
In charge mode, bq24180 has five control loops to regulate input voltage, input current, charge current, charge
voltage and device junction temperature. During the charging process, all five loops are enabled and the one that
is dominant will take over the control. The bq24180 supports a precision Li-ion or Li-polymer charging system for
single-cell applications. Figure 27 indicates a typical charge profile without input current regulation loop and it is
similar to the traditional CC/CV charge curve, while Figure 27 shows a typical charge profile when input current
limiting loop is dominant during the constant current mode, and in this case the charge current is higher than the
input current so the charge process is faster than the linear chargers. For bq24180, the input current limits, the
charge current, termination current, and charge voltage are all programmable using I2C interface.
Figure 26. Startup on Adapter Plug-In in Host-Controlled Mode
The bq24180 provides an integrated, fixed 3 MHz frequency voltage-mode controller with Feed-Forward function
to regulate charge current or voltage. This type of controller is used to help improve line transient response,
thereby simplifying the compensation network used for both continuous and discontinuous current conduction
operation. The voltage and current loops are internally compensated using a Type-III compensation scheme that
provides enough phase margin for stable operation, allowing the use of small ceramic capacitors with very low
ESR. There is a 0.5V offset on the bottom of the PWM ramp to allow the device to operate between 0% to 99.5%
duty cycles.
The bq24180 has two back to back common-drain N-channel MOSFETs at the high side and one N-channel
MOSFET at low side. An input N-MOSFET (Q1) prevents battery discharge when VBUS is lower than V
The second high-side N-MOSFET (Q2) behaves as the switching control switch (see Figure 1). A charge pump
circuit is used to provide gate drive for Q1, while a boot strap circuit with external boot-strap capacitor is used to
boost up the gate drive voltage for Q2.
Cycle-by-cycle current limit is sensed through the internal sense MOSFETs for Q2 and Q3. The threshold for Q2
is set to a nominal 2.5-A peak current. The low-side MOSFET (Q3) also has a current limit that decides if the
PWM Controller will operate in synchronous or non-synchronous mode. This threshold is set to 100mA and it
turns off the low-side N-channel MOSFET (Q3) before the current reverses, preventing the battery from
discharging. Synchronous operation is used when the current of the low-side MOSFET is greater than 100mA to
minimize power losses.
Battery Charging Process
At the beginning of precharge, while battery voltage is below the V
50mA precharge current, I
PRECHARGE
When the battery voltage is above V
current, I
OCHARGE
, or a charge current that corresponds to the input current of I
, to the battery.
PRECHARGE
and below V
PRECHARGE
, the charge current ramps up to fast charge
OREG
charge current is controlled to minimize the current and voltage over-shoot during transient. The input current
limit, I
to the regulation voltage, V
, and fast charge current, I
IN_LIMIT
OCHARGE
, the charge current is tapered down as shown in Figure 27. The voltage
OREG
, are programmable by the host. Once the battery voltage is close
regulation feedback occurs by monitoring the battery-pack voltage between the CSOUT and PGND pins. The
bq24180 is a fixed single-cell voltage version, with adjustable regulation voltage (3.5V to 4.44V) programmed
using the I2C interface.
The bq24180 monitors the charging current during the voltage regulation phase. Once the termination threshold,
I
, is detected and the battery voltage is above the recharge threshold, the bq24180 terminates charge. The
TERM
termination current level is programmable. To disable the charge current termination, the host sets the charge
termination bit (TE) of charge control register to 0, refer to I2C section for details.
A new charge cycle is initiated when one of the following conditions is detected:
1. The battery voltage falls below the V
OREG-VRCH
2. VBUS Power-on reset (POR), if battery voltage is below the V
threshold.
PRECHARGE
3. CE bit toggle or RESET bit is set (Host controlled)
DEFAULT mode is used when I2C communication is not available. DEFAULT mode is entered in the following
situations:
1. When the charger is enabled and V
2. When the watchdog timer expires without a reset from the I2C interface and the safety timer has not expired.
3. When the device comes out of any fault condition (sleep mode, OVP, faulty adapter mode, etc.) before I2C
communication is established
In default mode, the I2C registers are reset to the default values. The 27 min safety timer is reset and starts when
DEFAULT mode is entered. The default value for V
input current limit is determined by the PSEL input. If PSEL selects adapter mode, there is no input current limit.
If PSEL selects PC mode, the input current limit is set to 100mA. Default mode is exited by programming the I2C
interface. Startup into DEFAULT mode is shown in Figure 29. Note that if termination is enabled and charging
has terminated, a new charge cycle is NOT initiated when entering DEFAULT mode.
At the beginning of charging process, the bq24180 starts the safety timer. This timer is active during the entire
charging process. If charging has not terminated before the safety timer expires, the IC enters suspend mode
where charging is halted. The safety timer time is selectable using the I2C interface. A single 128µs pulse is sent
on the STAT and INT outputs and the STATx bits of the status registers are updated in the I2C. The EN bit or
power must be toggled in order to clear the safety timer fault. The safety timer duration is selectable using the
TMR_X bits in the V
timer.
In addition to the safety timer, the bq24180 contains a watchdog timer that monitors the host through the I2C
interface. Once a read/write is performed on the I2C interface, a 12-second timer (t
12-second timer is reset by the host using the I2C interface. This is done by writing a "1" to the reset bit
(TMR_RST) in the control register. The TMR_RST bit is automatically set to “0” when the 12-second timer is
reset. This process continues until battery is fully charged or the safety timer expires. If the 12-second timer
expires, the IC enters DEFAULT mode where the default charge parameters are loaded, the safety timer restarts
at 27 minutes and charging continues. The I2C may be accessed again to reinitialize the desired values and
restart the watchdog timer as long as the 27 minute safety timer has not expired. Once the safety timer expires,
charging is disabled. This function prevents continuous charging of a defective battery if the host fails to reset the
safety timer. The watchdog timer flow chart is shown in Figure 30.
Voltage/ Safety Timer Register. Changing the safety timer duration resets the safety
IN-DPM
WATCHDOG
Product Folder Link(s): bq24180
) is started. The
StartSafety Timer
ChargeDone?
I
CHG
< I
TERM
No
STAT = Hi
UpdateSTAT
bits
I2CRead/Write
performed?
Start 12 second
watchdogtimer
No
Yes
12stimerexpired?
No
Yes
ReceivedSWwatchdog
RESET?
No
Yes
Safetytimerexpired?
No
Yes
Safetytimer
fault
Chargingsuspended
Entersuspended
mode
Faultindicatedin
STAT registers
Yes
ChargeDone?
I
CHG
< I
TERM
No
STAT = Hi
UpdateSTAT
bits
Yes
Reset 12 second
watchdogtimer
Resettodefault
valuesinI2C
register
Restart 27min
safetytimer
Safetytimerexpired?
Safetytimer
fault
Chargingsuspended
Entersuspended
mode
Faultindicatedin
STAT registers
No
Yes
bq24180
SLUSA02 A –FEBRUARY 2010–REVISED FEBRUARY 2010
www.ti.com
Figure 30. The Watchdog Timer Flow Chart for bq24180
Power Source Selector Input (PSEL)
The bq24180 contains a PSEL input that is used to program the input current limit during DEFAULT mode. Drive
PSEL high to indicate a USB source is connected to the input and the PC mode default values should be used.
When PSEL is high, the IC starts up with a 100mA input current limit and a 1A charge current. Drive PSEL low to
indicate that an AC Adapter is connected to the input. When PSEL is high, the IC starts up with no input current
limit and a 1A charge current. PSEL is internally pulled up to the DRV supply with a 100kΩ resistor.
The bq24180 contains a CD input that is used to disable the charger and place the bq24180 into high-impedance
mode. Drive CD low to enable charge and enter normal operation. Drive CD high to disable charge and place the
bq24180 into high-impedance mode. Driving CD high during DEFAULT mode resets the safety timer. Driving CD
high during HOST mode suspends, but does NOT reset the safety timer. CD is internally pulled down to GND
with a 100kΩ resistor.
LDO Output (DRV)
The bq24180 contains a linear regulator (DRV) that is used to supply the internal MOSFET drivers and other
circuitry. Additionally, DRV supplies up to 10mA external loads to power the STAT LED or the USB transceiver
circuitry. The maximum value of the DRV output is 5.5V so it ideal to protect voltage sensitive USB circuits. The
LDO is on whenever a VBUS supply is connected to the bq24180. The DRV is disabled under the following
conditions:
1. Faulty adapter detected or VBUS < UVLO
2. Thermal Shutdown
AC Adapter Mode, Charge Current Limiting
After power is connected and startup is initiated, the PSEL input is read to determine the default startup values. If
PSEL is 0, AC Adapter mode is selected. In AC Adapter mode, the charge current is regulated to maximize the
charging time. The default parameters in AC Adapter mode are I
may be changed at any time using the I2C interface. Additionally, if input current monitoring is required, this may
be used during AC Adapter mode as well, but is disabled in DEFAULT mode.
CHARGE
=1A and V
=3.6V. These values
OUTREG
PC Mode, Input Current Limiting
After power is connected and startup is initiated, the PSEL input is read to determine the default startup values.
In PC mode, the input current is limited to maximize the charge rate of bq24180 without overloading the USB
port. The input current for bq24180 can be limited to 100mA, 500mA or 800mA and is programmed in the control
register. Once the input current reaches the input current limiting threshold, the charge current is reduced to
prevent the input current from exceeding the programmed threshold. The input current sensing resistor and
control loop are integrated into bq24180. The input current limit is disabled using I2C control; refer to the
definition of control register (01H) for detail. The default parameters in USB mode are I
V
=3.6V. Charge current may be monitored in PC mode as well, but by default it is set to a maximum such
OUTREG
=100mA and
INLIM
that the input current limit loop is active.
DCOUT Functionality
The bq24180 contains a DCOUT function that is used to connect a load to the battery through a switch. DCOUT
is implemented using back to back MOSFETs (Q4 and Q5 in Figure 1) to connect DCOUT to the battery. This
prevents reverse feeding the battery from DCOUT when DCOUT is disabled. DCOUT is a current limited source
and can provide up to 1A to power additional accessories. The current limit is programmable from 370mA to 1.5A
in 4 steps using the I2C interface. Additionally, the DCOUT output is enabled or disabled using the I2C interface.
If the load on DCOUT reaches the current limit, the FET that connects DCOUT to the battery is turned off after
the deglitch time (t
dgl_DCOUT
), a single 128µs pulse is sent on the STAT and INT outputs and the FAULT_x bits of
the status register are updated in the I2C. The DCOUT may be enabled after the fault using the I2C interface.
External NTC Monitoring (TS)
The bq24180 provides a TS input for monitoring an external NTC thermistor. A current is sourced to the NTC
from the TS input and the voltage is monitored. There are 3 temperature thresholds that are monitored; the cold
battery threshold (T
(T
> 55°C). These temperatures correspond to the V
NTC
NTC thermistor (b=3500). The TS input is monitored at all times, however, it only affects charging during default
mode. During default mode, charging is suspended and timers are suspended when T
When 45°C < T
NTC
remains at 100mA in this mode.
< 5°C), the warm battery threshold (45°C < T
NTC
HOT
, V
WARM
< 55°C) and the hot battery threshold
NTC
, and V
thresholds when using a 4.7kΩ
COLD
< 5°C or T
NTC
NTC
> 55°C.
< 55°C, the charging current is reduced to 400mA (max). In PC mode, the charge current
Figure 31. Charge Current During TS Conditions in Default Mode
When the bq24180 is not in default mode, the TS input is monitored and faults are displayed in the I2C registers.
If any of the 3 TS fault conditions occur, a single 128µs pulse is sent on the STAT and INT outputs and the
STATx and FAULT_x bits of the status registers are updated in the I2C. The FAULT_x bits signal a general
temperature fault. The TS_FAULTX bits in the NTC Monitor Register show the exact TS fault that has occurred.
Figure 32. TS Circuit
Thermal Regulation and Protection
During the charging process, to prevent overheat of the chip, bq24180 monitors the junction temperature, TJ, of
the die and begins to taper down the charge current once TJreaches the thermal regulation threshold, TCF. The
charge current is reduced to zero when the junction temperature increases about 10°C above TCF. At any state, if
TJexceeds T
shutdown mode, PWM is turned off, all timers are terminated and reset, and a single 128µs pulse is sent on the
STAT and INT outputs and the STATx and FAULT_x bits of the status registers are updated in the I2C. A new
charging cycle begins when TJfalls below T
after a thermal shutdown fault.
, bq24180 terminates charging and disables DCOUT in the I2C register. During thermal
SHTDWN
Product Folder Link(s): bq24180
by approximately 10°C. DCOUT must be enabled by the host
bq24180
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SLUSA02 A –FEBRUARY 2010–REVISED FEBRUARY 2010
Input Voltage Protection in Charge Mode
Sleep Mode
The bq24180 enters the low-power sleep mode if the voltage on V
threshold, V
CSOUT+VSLP
prevents draining the battery during the absence of V
, and V
is higher than the undervoltage lockout threshold, V
VBUS
. During sleep mode, both the reverse blocking
VBUS
switch Q1 and PWM are turned off. Once the input rises above the sleep threshold, the device returns to
normal operation.
Input Voltage Based DPM
During normal charging process, if the input power source is not able to support the programmed or default
charging current, VBUS voltage will decease. Once the VBUS drops to V
current is tapered down to prevent the further drop of VBUS. When the IC enters this mode, the charge
current is lower than the set value and the DPM_STATUS bit is set (B4 in Register 05H). This feature
ensures IC compatibility with adapters with different current capabilities.
Faulty Adapter Detection
When an input source is connected to the bq24180, the device enter faulty adapter detection mode. In this
mode, the IC sources 30mA to the battery for t
the device continues the startup sequence. If V
. After t
INT
VBUS<VIN(MIN)
, the input voltage is monitored. If V
INT
, a single 128µs pulse is sent on the STAT and
INT outputs and the STATx and FAULT_x bits of the status registers are updated in the I2C and the process
repeats until a good adapter is detected.
High-Input and Input Over-Voltage Protection
The bq24180 provides two levels over-voltage protection on the input. A high-input comparator disables the
PWM operation and sources the 50mA precharge current to the battery when V
allows for unregulated adapters to be used. The 50mA pulls the adapter voltage down to the usable voltage
and then normal operation begins.
The built-in input over-voltage protection to protect the device and other components against damage from
overvoltage on the input supply (Voltage from V
to PGND). When V
VBUS
the PWM converter, a single 128µs pulse is sent on the STAT and INT outputs and the STATx and FAULT_x
bits of the status registers are updated in the I2C. Once the OVP fault is removed, the STATx and FAULT_x
bits are cleared and the device returns to normal operation.
falls below sleep-mode entry
VBUS
UVLO
VBUS_LOW
VBUS
(default 4.76V), the charge
< V
> V
HIGH
, the bq24180 latches off
OVP
VBUS
. This feature
VBUS>VIN(MIN)
< V
OVP
,
. This
Charge Status Outputs (STAT, INT)
The STAT and INT outputs are used to indicate operation conditions for bq24180. STAT and INT are pulled low
during charging when EN_STAT bit in the control register (00H) is set to “1”. When charge is complete or
disabled, INT and STAT are high impedance. When a fault occurs, a 128-µs pulse (interrupt) is sent out to notify
the host. The status of STAT and INT during different operation conditions is summarized in Table 1. STAT
drives an LED for visual indication. INT is available for connecting to the logic rail for host communication.
Table 1. STAT Pin Summary
CHARGE STATESTAT and INT BEHAVIOR
Charge in progress and EN_STAT=1Low
Other normal conditionsOpen-drain
Charge mode faults: Timer fault, sleep mode,128-µs pulse, then open-drain
VBUS over voltage, VBUS UVLO, thermal
shutdown
Control Bits in Charge Mode
CE Bit (Charge Enable)
The bit of CE in control register is used to disable or enable the charge process. A low logic level (0) on this
bit enables the charge and a high logic level (1) disables the charge.
The bit of RESET in control register is used to reset all the charge parameters. Write ‘1” to RESET bit to
reset all the charge parameters to default values and RESET bit is automatically cleared to zero once the
charge parameters get reset. It is designed for charge parameter reset before charge starts and it is not
recommended to set RESET bit when charging or boosting in progress.
Output Inductor and Capacitor Selection Guidelines
The bq24180 provides internal loop compensation. With this scheme, best stability occurs when LC resonant
frequency, of, is approximately 40 kHz (20 kHz to 80 kHz). Equation 1 can be used to calculate the value of the
output inductor, L
, and output capacitor, C
OUT
OUT
.
(1)
To reduce the output voltage ripple, a ceramic capacitor with the capacitance between 4.7µF and 47µF is
recommended for C
, refer to the application section for components selection.
OUT
Selecting Current Sense Resistor
Both the termination current range and charge current range are depending on the sensing resistor (R
termination current step (I
OTERM_STEP
) can be calculated using Equation 2:
Table 2 shows the termination current settings with two sensing resistors.
SNS
). The
(2)
Table 2. Termination Current Settings for 68mΩ and 100mΩ Sense Resistors
BITV
V
ITERM2
V
ITERM1
V
ITERM0
Offset1.72517
The charge current step (I
OCHARGE_STEP
) can be calculated using Equation 3:
(mV)I
ITERM
6.810068
3.45043
1.72517
TERM
R
= 68 mΩR
SNS
Table 3 shows the charge current settings with two sensing resistors.
Table 3. Charge Current Settings for 68 mΩ and 100 mΩ Sense Resistors
I2C is a 2-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1,
January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pull-up structures. When the
bus is idle, both SDA and SCL lines are pulled high. All the I2C compatible devices connect to the I2C bus
through open drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal
processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The
master also generates specific conditions that indicate the START and STOP of data transfer. A slave device
receives and/or transmits data on the bus under control of the master device.
The bq24180 device works as a slave and is compatible with the following data transfer modes, as defined in the
I2C Bus™ Specification: standard mode (100 kbps), fast mode (400 kbps), and high-speed mode (up to 3.4 Mbps
in write mode). The interface adds flexibility to the battery charge solution, enabling most functions to be
programmed to new values depending on the instantaneous application requirements. Register contents remain
intact as long as battery voltage remains above 2.5 V (typical). The I2C circuitry is powered from VBUS when a
supply is connected. If the VBUS supply is not connected, the I2C circuitry is powered from the battery through
CSOUT. The battery voltage must stay above 2.5V with no input connected in order to maintain proper operation.
The data transfer protocol for standard and fast modes is exactly the same; therefore, they are referred to as the
F/S-mode in this document. The protocol for high-speed mode is different from the F/S-mode, and it is referred to
as the HS-mode. The bq24150/1 device only supports 7-bit addressing. The device 7-bit address is defined as
‘1101011’ (6BH).
F/S Mode Protocol
The master initiates data transfer by generating a start condition. The start condition is when a high-to-low
transition occurs on the SDA line while SCL is high, as shown in Figure 33. All I2C -compatible devices should
recognize a start condition.
Figure 33. START and STOP Condition
The master then generates the SCL pulses, and transmits the 8-bit address and the read/write direction bit R/W
on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires
the SDA line to be stable during the entire high period of the clock pulse (see Figure 34). All devices recognize
the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a
matching address generates an acknowledge (see Figure 34) by pulling the SDA line low during the entire high
period of the ninth SCL cycle. Upon detecting this acknowledge, the master knows that communication link with a
slave has been established.
Figure 34. Bit Transfer on the Serial Interface
The master generates further SCL cycles to either transmit data to the slave (R/W bit 1) or receive data from the
slave (R/W bit 0). In either case, the receiver needs to acknowledge the data sent by the transmitter. So an
acknowledge signal can either be generated by the master or by the slave, depending on which one is the
receiver. the 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as
necessary. To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line
from low to high while the SCL line is high (see Figure 35). This releases the bus and stops the communication
link with the addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of
a stop condition, all devices know that the bus is released, and wait for a start condition followed by a matching
address. If a transaction is terminated prematurely, the master needs sending a STOP condition to prevent the
slave I2C logic from remaining in a incorrect state. Attempting to read data from register addresses not listed in
this section will result in FFh being read out.
Figure 35. Acknowledge on the I2C Bus
Figure 36. Bus Protocol
F/S Mode Protocol
When the bus is idle, both SDA and SCL lines are pulled high by the pull-up devices.
The master generates a start condition followed by a valid serial byte containing HS master code '00001XXX'.
This transmission is made in F/S mode at no more than 400 Kbps. No device is allowed to acknowledge the HS
master code, but all devices must recognize it and switch their internal setting to support 3.4-Mbps operation.
The master then generates a repeated start condition (a repeated start condition has the same timing as the start
condition). After this repeated start condition, the protocol is the same as F/S mode, except that transmission
speeds up to 3.4 Mbps are allowed. A stop condition ends the HS mode and switches all the internal settings of
the slave devices to support the F/S mode. Instead of using a stop condition, repeated start conditions should be
used to secure the bus in HS mode. If a transaction is terminated prematurely, the master needs sending a
STOP condition to prevent the slave I2C logic from remaining in a incorrect state.
Attempting to read data from register addresses not listed in this section results in FFh being read out.
B7(MSB)TMR_RSTRead/WriteWrite: TMR_RST function, write "1" to reset the watchdog timer (auto clear)
B6EN_STATRead/Write1-Enable STAT function, 0-Disable STAT function (default 1)
B5STAT2Read only
B4STAT1Read only
B3NARead onlyNA
B2FAULT_3Read only
B1FAULT_2Read onlyVBUS<V
B7(MSB)Vender2Read onlyVender Code: bit 2 (default 0)
B6Vender1Read onlyVender Code: bit 1 (default 1)
B5Vender0Read onlyVender Code: bit 0 (default 0)
B4PN1Read only
B3PN0Read only
B2Revision2Read only
B1Revision1Read only
Battery Termination/Fast Charge Current Register (READ/WRITE)
Memory location: 04, Reset state: 1010 1011
BITNAMERead/WriteFUNCTION
B7(MSB)ResetWrite onlyWrite: 1-Charger in reset mode, 0-No effect
B6V
B5V
B4V
B3V
B2V
B1V
B0(LSB)V
ICHRG3
ICHRG2
ICHRG1
ICHRG0
ITERM2
ITERM1
ITERM0
Read/WriteCharge current sense voltage: 54.4mV— (default 0)
Read/WriteCharge current sense voltage: 27.2mV—(default 1)
Read/WriteCharge current sense voltage: 13.6mV— (default 0)
Read/WriteCharge current sense voltage: 6.8mV (default 1)
Read/WriteTermination current sense voltage: 6.8mV (default 0)
Read/WriteTermination current sense voltage: 3.4mV (default 1)
Read/WriteTermination current sense voltage: 1.7mV (default 1)
Read: always get "1"
SLUSA02 A –FEBRUARY 2010–REVISED FEBRUARY 2010
blank paragraph for spacer
•Charge current sense voltage offset is 37.4mV and default charge current is 1050mA, if 68mΩ sense resistor
is used.
•Termination threshold voltage offset is 1.7mV and default termination current is 100mA if a 68mΩ sense
resistor is used.
blank paragraph for spacer
V
BITNAMERead/WriteFUNCTION
B7(MSB)NARead/WriteNA
B6NARead/WriteNA
B5LOW_CHGRead/Write1 – Low charge current sense voltage of 23.8mV,
B4DPM_STATUSRead Only1 – VIN-DPM mode is active,
B3CD_STATUSRead Only1 – CD high, Charger disabled,
Safety Limit Register (READ/WRITE, Write only once after reset!)
Memory location: 06, Reset state: 0101 0000
BITNAMERead/WriteFUNCTION
B7(MSB)V
B6V
B5V
B4V
B3V
B2V
B1V
B0(LSB)V
MCHRG3
MCHRG2
MCHRG1
MCHRG0
MREG3
MREG2
MREG1
MREG0
Read/WriteMaximum charge current sense voltage: 54.4mV (default 0)
Read/WriteMaximum charge current sense voltage: 27.2mV (default 1)
Read/WriteMaximum charge current sense voltage: 13.6mV (default 0)
Read/WriteMaximum charge current sense voltage: 6.8mV (default 1)
Read/WriteMaximum battery regulation voltage: 160mV (default 0)
Read/WriteMaximum battery regulation voltage: 80mV (default 0)
Read/WriteMaximum battery regulation voltage: 40mV (default 0)
Read/WriteMaximum battery regulation voltage: 20mV (default 0)
•Maximum charge current sense voltage offset is 550mA (default at 950mA) and the maximum charge current
option is 1.55A, if 68-mΩ sensing resistor is used.
•Maximum battery regulation voltage offset is 4.2V (default at 4.2V) and maximum battery regulation voltage
option is 4.44V.
•Memory location 06 resets only when V
voltage drops below V
BAT
threshold (typ. 2.0V) goes to logic '0'.
SHORT
During reset, the maximum values in 06H keep the default value regardless of the write action to this register.
After reset (V
BAT>VSHORT
), the maximum values for battery regulation voltage and charge current can be
programmed many times until any writing to other register locks the safety limits. Programmed values exclude
higher values from memory locations 02 (battery regulation voltage), and from memory location 04 (Fast
charge current).
If host accesses (write command) to some other register before Safety limit register, the default values hold!
One of the simple high-efficiency topologies connects the system load directly across the battery pack, as shown
in Figure 37. The input voltage has been converted to a usable system voltage with good efficiency from the
input. When the input power is on, it supplies the system load and charges the battery pack at the same time.
When the input power is off, the battery pack powers the system directly.
Figure 37. System Load After Sensing Resistor
The advantages:
•When the AC adapter is disconnected, the battery pack powers the system load with minimum power
dissipations. Consequently, the time that the system runs on the battery pack can be maximized.
•It saves the external path selection components and offers a low-cost solution.
•Dynamic power management (DPM) can be achieved. The total of the charge current and the system current
can be limited to a desired value by adjusting charge current. When the system current increases, the charge
current drops by the same amount. As a result, no potential over-current or over-heating issues are caused
by excessive system load demand.
•The total of the input current can be limited to a desired value by setting input current limit value. So USB
specifications can be met easily.
•The supply voltage variation range for the system can be minimized.
•The input current soft-start can be achieved by the generic soft-start feature of the IC.
Design considerations and potential issues:
•If the system always demands a high current (but lower than the regulation current), the charging never
terminates. Thus, the battery is always charged, and the lifetime may be reduced.
•Because the total current regulation threshold is fixed and the system always demands some current, the
battery may not be charged with a full-charge rate and thus may lead to a longer charge time.
•If the system load current is large after the charger has been terminated, the voltage drop across the battery
impedance may cause the battery voltage to drop below the refresh threshold and start a new charge. The
charger would then terminate due to low charge current. Therefore, the charger would cycle between
charging and terminating. If the load is smaller, the battery has to discharge down to the refresh threshold,
resulting in a much slower cycling.
•In a charger system, the charge current is typically limited to about 10mA, if the sensed battery voltage is
below 2V short circuit protection threshold. This results in low power availability at the system bus. If an
external supply is connected and the battery is deeply discharged, below the short circuit protection threshold,
the charge current is clamped to the short circuit current limit. This then is the current available to the system
during the power-up phase. Most systems cannot function with such limited supply current, and the battery
supplements the additional power required by the system. Note that the battery pack is already at the
depleted condition, and it discharges further until the battery protector opens, resulting in a system shutdown.
•If the battery is below the short circuit threshold and the system requires a bias current budget lower than the
short circuit current limit, the end-equipment will be operational, but the charging process can be affected
depending on the current left to charge the battery pack. Under extreme conditions, the system current is
close to the short circuit current levels and the battery may not reach the fast-charge region in a timely
manner. As a result, the safety timers flag the battery pack as defective, terminating the charging process.
Because the safety timer cannot be disabled, the inserted battery pack must not be depleted to make the
application possible.
•For instance, if the battery pack voltage is too low, highly depleted, or totally dead or even shorted, the
system voltage is clamped by the battery and it cannot operate even if the input power is on.
System Load Before Sensing Resistor
The second circuit is very similar to first one; the difference is that the system load is connected before the sense
resistor, as shown in Figure 38.
Figure 38. System Load Before Sensing Resistor
The advantages of system load before sensing resistor to system load after sensing resistor:
•The charger controller is based only on the current goes through the current-sense resistor. So, the constant
current fast charge and termination functions work well, and are not affected by the system load. This is the
major advantage of it.
•A depleted battery pack can be connected to the charger without the risk of the safety timer expiration caused
by high system load.
•The host charger can disable termination and keep the converter running to keep battery fully charged, or let
the switcher terminate when the battery is full and then run off of the battery via the sense resistor.
Design considerations and potential issues:
•The total current is limited by the IC input current limit, or peak current protection, or the thermal regulation
but not the charge current setting. The charge current does not drop when the system current load increases
until the input current limit is reached. This solution is not applicable if the system requires a high current.
•Efficiency declines when discharging through the sense resistor to the system.
DESIGN EXAMPLE FOR TYPICAL APPLICATION CIRCUITS
Systems Design Specifications:
•VBUS = 5 V
•V
•I
•Inductor ripple current = 30% of fast charge current
This is a standard value. If it is not a standard value, then choose the next close value and calculate the real
charge current. Calculate the power dissipation on the sense resistor:
P
(RSNS)
P
(RSNS)
P
(RSNS)
= I
(CHARGE)
= 1252× 0.068
= 0.106 W
2
× R
(SNS)
Select 0805 0.25-W 68-mΩ 2% sense resistor, i.e. Sosomu RL122OT-R068-G or RL0816T-R068-F 68-mΩ,
0.125W, 0603, 1%.
PCB LAYOUT CONSIDERATION
It is important to pay special attention to the PCB layout. The following provides some guidelines:
•To obtain optimal performance, the power input capacitors, connected from input to PGND, should be placed
as close as possible to the bq24180. The output inductor should be placed close to the IC and the output
capacitor connected between the inductor and PGND of the IC. The intent is to minimize the current path loop
area from the SW pin through the LC filter and back to the PGND pin. To prevent high frequency oscillation
problems, proper layout to minimize high frequency current path loop is critical (see Figure 39). The sense
resistor should be adjacent to the junction of the inductor and output capacitor. Route the sense leads
connected across the RSNS(R1) back to the IC, close to each other (minimize loop area) or on top of each
other on adjacent layers (do not route the sense leads through a high-current path, see Figure 40).
•Place all decoupling capacitor close to their respective IC pin and as close as to PGND (do not place
components such that routing interrupts power stage currents). All small control signals should be routed
away from the high current paths.
•The PCB should have a ground plane (return) connected directly to the return of all components through vias
(two vias per capacitor for power-stage capacitors, two vias for the IC PGND, one via per capacitor for
small-signal components). A star ground design approach is typically used to keep circuit block currents
isolated (high-power/low-power small-signal) which reduces noise-coupling and ground-bounce issues. A
single ground plane for this design gives good results. With this small layout and a single ground plane, there
is no ground-bounce issue, and having the components segregated minimizes coupling between signals.
•The high-current charge paths into VBUS, PMID and from the SW pins must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces. The PGND pins should be
connected to the ground plane to return current through the internal low-side FET.
•Place 4.7mF input capacitor as close to PMID pin and PGND pin as possible to make high frequency current
loop area as small as possible. Place 1mF input capacitor as close to VBUS pin and PGND pin as possible to
make high frequency current loop area as small as possible (see Figure 41).
Changes from Original (February 2010) to Revision APage
•Changed ±7 to "-0.3 to 7 V" for "Voltage difference between BOOT and SW inputs (VBOOT –VSW)" parameter of
the Absolute Maximum Ratings table. .................................................................................................................................. 2
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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