TEXAS INSTRUMENTS bq2058T Technical data

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bq2058T
Lithium Ion PackSupervisor
For 2-Cell Packs
Features
Protects and individually moni-
tors two Li-Ion series cells for overvoltage,undervoltage
Monitors pack for overcurrentDesigned for battery pack inte-
gration
Minimal external componentsDrives external FET switchesSelectable overvoltage (V
OV
thresholds
Mask programmable by
-
Benchmarq
- Standard version–4.25V
Supply current: 12µA typicalSleep current: 0.7µA typical16-pin 150-mil narrow SOIC
General Description
The bq2058T Lithium Ion Pack Su­pervisor is designed to control the charge and discharge cell voltage lim­its for two lithium-ion (Li-Ion) series cells, accommodating battery packs containing series/parallel configura­tions. The low operating current does not overdischarge the cells during pe­riods of storage and does not signifi­cantly increase the system discharge load. The bq2058T can be part of a low-cost Li-Ion charge control system
)
within the battery pack. The bq2058T controls two external
FETs to limit the charge and discharge potentials. The bq2058T allows charg­ing when each individual cell voltage is below V voltage on any cell exceeds VOVfor a user-configurable delay period (t the open-drain CHG pin goes to the high-impedance state, shutting off
(overvoltage limit). If the
OV
charge to the battery pack. This safety feature prevents overcharge of any cell within the battery pack. After an over­voltage condition occurs, each cell must fall below V for the bq2058T to re-enable charging.
(charge enable voltage)
CE
The bq2058T protects batteries from overdischarge. If the voltage on any cell falls below V limit) for a user-configurable delay pe­riod (t low, shutting off the battery discharge.
), the DSG output is driven
UVD
UV
This safety feature prevents overdis­charge of any cell within the battery pack.
The bq2058T also stops discharge on detection of an overcurrent condition, such as a short circuit. If an overcur­rent condition occurs for a user­configurable delay period (t DSG output is driven low, disconnect-
),
ing the load from the pack. DSG re-
OVD
mains low until removal of the short circuit or overcurrent condition.
(undervoltage
), the
OCD
Pin Connections
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
July 1997
BAT
BAT
BAT BAT
CHG
CTL
V
CSL
SS
2N
2N
2N 1N
16-Pin Narrow SOIC
DSG
V
CC
UVD
OVD
OCD
V
CC CSH BAT
PN2058T1.eps
Pin Names
CHG Charge control output CTL Pack disable input V
SS
Low potential input
CSL Overcurrent sense low-side
input
BAT
1P
BAT
Battery 2 negative input
2N
Battery 1 negative input
1N
1
DSG Discharge control output UVD Undervoltagedelay input OVD Overvoltage delay input OCD Overcurrent delay input V
CC
High potential input
CSH Overcurrent sense high-side
input
BAT
Battery 1 positive input
1P
bq2058T
Pin Descriptions
CHG Charge control output
This open-drain output controls the charge path to the battery pack. Charging is allowed when high.
CTL Packdisable input
When high, this input allows an external source to disable the pack by making both DSG and CHG inactive. For normal opera­tion,the CTL pin is low.
V
SS
CSL Overcurrent sense low-side input
BAT
BAT
DSG Discharge control output
Low potential input
This input is connected between the low-side discharge FET (or sense resistor) and BAT2Nto enable overcurrent sensing in the battery pack’sground path.
Battery 2 negative inputs (3 pins)
2N
These pins are connected to the negative termi­nal of the cell designated BAT2 in Figure 2.
Battery 1 negative input
1N
This input is connected to the negative termi­nal of the cell designated BAT1 in Figure 2.
This push-pull output controls the discharge path to the battery pack. Discharge is al­lowed when high.
UVD Undervoltage delay input
This input uses an external capacitor to V to set the undervoltage delay timing.
OVD Overvoltage delay input
This input uses an external capacitor to V to set the overvoltage delay timing.
OCD Overcurrent delay input
This input uses an external capacitor to V to set the overcurrent delay timing.
V
CC
High potential inputs (2 pins)
CSH Overcurrent sense high-side input
This input is connected between the high-side discharge FET (or sense resistor) and BAT1Pto enable overcurrent sense in the battery pack’spositive supply path.
BAT
Battery 1 positive input
1P
This input is connected to the positive terminal of the cell designated BAT1in Figure2.
CC
CC
CC
July 1997
2
Cell Inputs
Pin 9 Pin 8
Pin 7
Pin 3
Chip Negative
Supply
B1P B1N
B2N
V
Sel2 Sel1
OV
bq2058T
+
-
+
Sel2
Sel1
Q
D CK
QB
Q
D CK
QB
Any_Above_V
OV
Edge
Non-Retrigger
Reset Capacitor
OVD
Pin 13 Discharge Off Delay Capacitor Input
Out
Oneshot
All_Below_V
CE
D CK
Reset
QB
Over_charge
Pin 1
CHG
Charge Control Output (open drain)
July 1997
Any_Below_V
+
Sel2
V
CE
Sel1
Q
D CK
QB
Q
D CK
QB
UVD Pin 14 Charge Off Delay Capacitor Input
Pin 10 Pin 9
Pin 4 Pin 7
+
Sel2
V
UV
Sel1
Q
D CK
QB
Q
D CK
Pin 10
QB
Pin 9
Pin 4 Pin 7
CSH B1P
B2N
160mV
CSL
Overcurrent Delay Capacitor Input
Pin 12
+
160mV
+
OCD
CSH B1P
CSL
B2N
UV
Edge
Non-Retrigger
Reset Capacitor
70mV
+
70mV
+
Edge
Reset Capacitor
Pin 2
Out
Oneshot
Out
Non-Retrigger
Oneshot
CTL
External Output Control
D CK
Reset
QB
Sleep
D CK
Reset
Q
QB
Pin 16
DSG
Discharge Control Output (totem pole)
Over_current
BD2058T1.eps
Figure 1. Block Diagram
3
bq2058T
Functional Description
Figure 1 is a block diagram outlining the major compo­nents of the bq2058T. Figure 2 shows a low-side control connection diagram. The following sections detail the various functional aspects of the bq2058T.
Thresholds
The bq2058T monitors the lithium ion pack for the con­ditions listed below. Shown with these conditions are the respective thresholds used to determine if that con­dition exists:
Overvoltage (VOV)
Undervoltage (VUV)
Overcurrent (V
Charge Enable (VCE)
Charge Detect (VCD)
POS
OCH,VOCL
R
2
)
2N 2N 2N
1N
DSG V UVD OVD OCD V CSH
BAT
CHG CTL V
SS
CSL BAT BAT BAT
BAT
bq2058T
The bq2058T samples a cell every 60ms (typical). Every sample is a fully differential measurement of each cell. During this sample period, the bq2058T compares the measurements with these thresholds to determine if any of the these conditions exist:V
OV,VUV
,and VCE.
Overcurrent and charge detect are conditions that are not sampled, but are continuously monitored.
Initialization
On initial power-up, such as connecting the battery pack for the first time to the bq2058T,the bq2058T enters the low-power sleep mode, disabling the DSG output. It is
recommended that a top to bottom cell connection be made at pack assembly for proper initializa­tion. A charging supplymust be applied to the bq2058T
circuit to enable the pack. See Low-Power Sleep Mode and Charge Detect sections.
CC
CC
1P
C
1
C
2
C
3
C
4
BAT1
NEG
R
1
C
7
Q
1
C
6
Q
2
Figure 2. 2-Cell Connection Diagram, Low-Side Control
4
C
5
FG2058T1.eps
BAT2
July 1997
bq2058T
Low-Power Sleep Mode
The bq2058T enters the low-power sleep mode in two different ways:
1. On initial power-up.
2. After the detection of an undervoltage condi-
UV
.
tion–V
When the bq2058T enters the low-power sleep mode, DSG is driven low and the device consumes 0.7µA (typi­cal). The bq2058T only comes out of low-power sleep mode when a valid charge detect condition exists.
Charge Detect
The bq2058T continuously monitors for a charge detect condition. A valid charge detect condition exists when ei­ther of the conditions is true:
CSL < BAT
CSH > BAT
- 70mV (VCD)
2N
+ 70mV (VCD)
1P
A valid charge detect enables the DSG output, allowing charging of the lithium ion cells. This is accomplished by applying the charging supply to the pack.
Undervoltage
Undervoltage (or overdischarge) protection is asserted when any cell voltage drops below the VUVthreshold and remains below the VUVthreshold for a time exceeding a user-configurable delay (t
). The DSG
UVD
output is driven low, disabling the discharge of the pack. The bq2058T then enters the low-power sleep mode. VUVis defined as follows:
= 2.25V
V
UV
Overvoltage
Overvoltage (or overcharge) protection is asserted when any cell voltage exceeds the VOVthreshold and remains above the VOVthreshold for a time exceeding a user­configurable delay (t high impedance state, disabling charge into the battery pack. Since the charge control output is an open drain output, a pull-down resistor is needed from the CHG pin to the negative side of the pack. This pulls the gate of the charge FET low when the CHG pin goes to high im­pedance. Charging is disabled until a valid charge en­able exists. See Charge Enable section.
Important note: If any battery pin floats (BAT BAT1N,BAT2N), the bq2058T assumes an overvolt­age has occurred.
Because of different manufacturers’ specifications for overvoltage thresholds, the bq2058T can be available with different V different voltage thresholds.
July 1997
OV
). The CHG pin goes to the
OVD
1P
options. Table 1 summarizes these
Table 1. Overvoltage Threshold Options
Part # VOVLimit
bq2058T 4.25V bq2058TR 4.35V
The overvoltage threshold limits are programmed at Benchmarq. The bq2058T is the standard op­tion that is more readily available for sampling and prototyping purposes. Please contact Bench­marq for other voltage threshold and tolerance options.
Charge Enable
A valid charge enable indicates that an overvoltage (overcharge) condition no longer exists and that the pack is ready to accept further charge. Once overvoltage protection is asserted, charging will not be enabled un­til all cell voltages fall below VCE. The VCEthreshold is a function of V
and changes with different VOVlim-
OV,
its.
V
CE=VOV
- 150mV
Overcurrent
The bq2058T detects an overcurrent (or short circuit) condition only in the discharge direction. Overcurrent protection is asserted when either of the conditions oc­curs and remain for a time exceeding a user­configurable delay (t
where:
V
OCL
V
OCH
When either of these conditions occurs, DSG is driven low, disconnecting the load from the pack. DSG remains low until both of the voltage conditions are false, indi­cating removal of the short-circuit condition. The user can facilitate clearing these conditions by inserting the battery pack into a charger.
The high-side overcurrent sense can be disabled by con-
,
necting CSH to BAT greater than BAT1P. If high-side detection is disabled, low-side detection must be used with CSL.
The FETs in the charge/discharge path controlled by the CHG and DSG pins affect the overcurrent level. The on-resistance of these FETs need to be taken into ac­count when determining overcurrent levels.
):
OCD
CSL > BAT CSH < BAT1P-V
2N+VOCL
OCH
= 160mV (low-side detect)
= 160mV (high-side detect)
. This ensures that CSH is never
1P
5
bq2058T
CHG and DSG States
The CHG and DSG output truth table is shown below:
Condition CHG pin DSG pin
Normal operation High High Overvoltage Z High Undervoltage High Low Overcurrent High Low Floating battery input Z Indeterminate CTL = high Z Low
The polarities of CHG and DSGare mask programmable at Benchmarq. Push-pull vs. open-drain configuration is also mask-configurable at Benchmarq. Please contact Benchmarq for availability of these variations.
PackDisable Input–CTL
The CTL pin is used to electrically disconnect the bat­tery from the pack terminals through an externally sup­plied signal. When CTL is taken high, CHG goes to the high impedance state and DSG is driven low. Any load on the pack terminals will be interpreted as an overcur­rent condition by the bq2058T with the overcurrent de­lay timer held in reset. When the CTL pin is driven low, the overcurrent delay timer is allowed to start. If the programmed delay (t recovery circuit, if implemented, will be unable to cor­rect the overcurrent situation prior to the delay time­out. It is recommended that a delay time of greater than 10ms (C
0.01µF) be used if the CTL pin function
OCD
is to be utilized.
) is too short, the overcurrent
OCD
Important note: If CTL floats, it is internally pulled high making both DSG and CHG inactive, thus disabling the pack. If CTL is not used, it should be tied to V
SS
.
The polarity of CTL is mask-programmable at Bench­marq. Please contact Benchmarq for other polarity op­tions.
Protection DelayTimers
The delay time between the detection of an overcurrent, overvoltage, or undervoltage condition and the deactiva­tion of the CHG and/or DSG outputs is user-configurable by the selection of capacitorvalues between VCCand OCD, OVD,and UVD pins (respectively. SeeTable2 below.
The fault condition must persist through the entire de­lay period, or the bq2058T may not deactivate either FET control output.
Figure 3 shows a step-by-step event cycle for the bq2058T.
Table 2.Protection Delay Timers
Protection
Feature
Overcurrent t Overvoltage t Undervoltage t
Delay
Period
OCD OVD UVD
Capacitor from
VCCto:
OCD OVD UVD
Capacitor Time
0.010µF
0.100µF
0.100µF
Notes: 1. The delay time versus capacitance can be approximated bythe following equations:.
For t For t
:t
OCD OVD,tUVD
(s)
:t
(s)
1.2 C9.5 C
, where 0.001µF C0.1µF
(µf)
, where 0.01µF C1µF
(µf)
2. Overvoltage andundervoltage conditions are sampled by thebq2058T. The delay in Table 2 is in addition to the time required for the bq2058T todetect the violation, which may vary from 0 to 120 ms depending on where in the sampling periodthe violation occurs. Overcurrent is continuously monitored and is subject to a delay of approximately 1.5ms.
Typical
12ms 950ms ±40% 950ms ±40%
6
Tolerance
±40%
July 1997
Cell Voltage
0
1 2 3 4 65 7 8 9 10 11 12
V
OV
V
CE
bq2058T
V
UV
CSL
BAT2N + 160mV (V BAT2N - 70mV (VCD)
DSG
t
OCD
t
UVD
CHG
t
OVD
CTL
TD2058T1.eps
Figure 3. Protector Event Diagram
Event Definition:
0: The bq2058T is inthe low-power sleep mode because oneor more of the cell voltagesare below V 1: A charger is appliedto the pack, causing the difference between CSL and BAT
than 70mV. This awakens the bq2058T,and the discharge pin DSG goes high.
2: One or more cellscharge to a voltage equal to V
, initiating the overvoltagedelay timer.
OV
3: The overvoltage delay timeexpires, causing CHGto go to high impedance (pulledlow externally). 4: All cell voltages fallbelow V
, causing CHG togo high.
CE
5: Stop charging, apply a load. 6: An overcurrent condition isdetected, initiating the overcurrent delay timer. 7: The overcurrent delay timeexpires, causing DSGto go low. 8: The overcurrent condition isno longer present. DSG is driven high. 9: Pin CTL is drivenhigh; both DSG and CHG go inactive. 10: PinCTL is driven low; both DSG and CHG go activeresuming their normal function. 11: Oneor more cells fall below V 12: Oncethe overdischarge delay timer expires, if any of the cells is below V
, initiating the overdischargedelay timer.
UV
UV
DSG low and enters the low-power sleep mode.
to become greater
2N
, the bq2058T drives
UV
OCL
.
)
July 15, 1997
7
bq2058T
Absolute Maximum Ratings
Symbol Parameter Value Unit Conditions
V
CC
T
OPR
T
STG
T
SOLDER
I
IN
Supply voltage 18 V Relative to V Operating temperature -30 to +70 °C Storage temperature -55 to +125 °C Soldering temperature 260 °C For 10 seconds Maximum input current
±100 µA
All pins except VCC,V
SS
SS
Notes: 1 Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional
operation should be limited to the Recommended DC OperatingConditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extendedperiods of time may affect device reliability.
2. Internal protectiondiodes are in place on everypin relative to V
Any pin
(except CHG)
V
CC
CHG pin
V
SS
FG2058tx .eps
V
CC
and VSS. See picture below.
CC
July 1997
8
bq2058T
DC Electrical Characteristics (T
A=TOPR)
Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes
V
OH
V
OL
V
OP
V
IL
V
IH
I
CCA
I
CCS
R
CELL
DC Thresholds (T
Output high voltage VCC- 0.5 - - V Output low voltage - - VSS+ 0.5 V
IOH=10µA, CHG, DSG
IOL=10µA, CHG, DSG Operating voltage 0 - 9.0 V VCCrelative to V Input low voltage - - VSS+ 0.5 V Pin CTL Input high voltage VSS+ 2.0 - - V Pin CTL Active current - 12 25 Sleep current - 0.7 1.5 Input impedance - 10 -
µA µA
M
Pins BAT
BAT1N, and BAT
2N,
A=TOPR)
SS
Symbol Parameter Value Unit Tolerance Conditons
V
Overvoltage threshold
OV
4.25 V
±55mV
See note 1
Table 1 Customer option V V
V
V V
t
OVD
t
UVD
t
OCD
Charge enable threshold VOV- 150mV V
CE
Undervoltage threshold 2.25 V
UV
Overcurrent detect
OCH
high-side Overcurrent detect
OCL
low-side Charge detect threshold 70 mV -60mV, +80mV
CD
Overvoltage delay threshold
Undervoltage delay threshold
Overcurrent delay thresh­old
160 mV
160 mV
950 ms
950 ms
12 ms
±55mV
±100mV
±35mV
±35mV
±40%
±40%
±40%
C
= 0.100µF
OVD
TA=30°C See note 2
C
= 0.100µF
UVD
TA=30°C See note 2
C
= 0.01µF
OCD
T
=30°C
A
1P
Notes: 1. Standard device. Contact Benchmarq for different thresholds and tolerance options
2. Does not includecell sampling delay, which may add up to 120ms of additional delay until the condition is detected.
July 1997
9
bq2058T
Typical Characteristics
– Overvoltage – V V
OV
4.280
4.270
4.260
4.250
4.240
4.230
4.220
4.210
bq2058T 4.25V OVERVOLTAGE THRESHOLD
FREE-AIR TEMPERATURE
Measurement accuracy ± 2mV
-20 -10 0 10 20 30 40 50 60 70
-30
TA – Free-Air Temperature –
VS
˚
C
Figure 4
10
July 1997
Data Sheet Revision History
Change No. Page No. Description Nature of Change
1 5 CHG pin output state CHG pin state at overvoltage and floating battery
1 9 Overcurrent limits
1 9 Charge detect threshold Was:70mV +10mV, +80mV
2 4 Overvoltage options, Table 1 Added bq2058TR 2 4 Figure 2 Corrected schematic
2 6, 9 Delay thresholds
2 7 DSG and CHG timing diagram Inverted lines for proper logic levels 2 7 Timing Diagram
2 8 Maximum input current Added I 29V
tolerance
OV
2 9 Overcurrent limits
29V
OP
input was low, is nowZ Was:V
Is: V
= 100mV ±25mV
OCL
= 150mV ±25mV
OCL
Is: 70mV -60mV,+80mV
Was:t
Is: t
= 10ms ±30%
OCD
t
= 800ms ±30%
OVD
t
UVD
= 12ms ±40%
OCD
t
= 950ms ±40%
OVD
t
= 950ms ±40%
UVD
= 800ms ±30%
Was:CSH timing Is: CSL timing
IN
Was:±50mV Is: ±55mV
Was:V Is: V
= 160mV +25mV
OCH
V
= 150mV +25mV
OCL
= 160mV +35mV
OCH
V
= 160mV +35mV
OCL
Was:0V min,18V max Is: 4V min, 9V max
bq2058T
Note: Change1=June19,1997 changes from April 22, 1997.
Change2=July1997 changes from June 19, 1997
July 1997
11
bq2058T
SN: 16-Pin SN(0.150" SOIC
e
H
C
L
D
E
A
A1
B
.004
)
16-Pin SN(0.150" SOIC
Inches Millimeters
Dimension
A 0.060 0.070 1.52 1.78
A1 0.004 0.010 0.10 0.25
B 0.013 0.020 0.33 0.51 C 0.007 0.010 0.18 0.25 D 0.385 0.400 9.78 10.16 E 0.150 0.160 3.81 4.06
e 0.045 0.055 1.14 1.40 H 0.225 0.245 5.72 6.22 L 0.015 0.035 0.38 0.89
Min. Max. Min. Max.
)
12
July 1997
Ordering Information
bq2058T XXXX
Device:
bq2058T
Standard Device:
Blank = Standard device XXXX = Customer code assigned by Benchmarq
PackageOption:
SN = 16-pin narrow SOIC
Overvoltage Threshold
Blank = 4.25V (Standard device) Contact factory for availability of other thresholds
bq2058T Lithium Ion Pack Supervisor
July 1997
Package Devices
T
A
-30°Cto +70°C
Note: bq2058TSN isStandard Device
Contact factory for availability of other thresholds and tolerances.
VOVThreshold 16-pin Narrow SOIC (SN)
4.25V bq2058TSN
4.35V bq2058TRSN
13
Notes
14
July 1997
Notes
July 1997
15
bq2058T
BENCHMARQ Microelectronics,Inc.
17919 Waterview Parkway
Dallas, Texas 75252
Fax: (972) 437-9198
Tel: (972) 437-9195
E-mail: benchmarq @ benchmarq.com
World Wide Web: http://www.benchmarq.com
Copyright © 1997,BENCHMARQ Microelectronics,Inc. Allrights reserved. No part of this data sheet may be reproduced in any form or means,without express permission from Benchmarq.
Benchmarq reserves the right to make changes in its products without notice. Benchmarq assumes no responsibility for use of any products or circuitry described within. No license for use of in-
tellectual property (patents,copyrights,or other rights)owned by Benchmarq or other parties is granted or implied. Benchmarq does not authorize the use of its components in life-support systems where failure or malfunction may
cause injury to the user. If Benchmarq components are used in life-support systems, the user assumes all responsi­bilities and indemnifies Benchmarq from all liability or damages.
Benchmarq is a registered trademark of BENCHMARQ Microelectronics, Inc. Printed in U.S.A.
July 1997
16
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
BQ2058TRSN-C2 OBSOLETE SOIC D 16 TBD Call TI Call TI
BQ2058TSN-C2 OBSOLETE SOIC D 16 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will bediscontinued, and a lifetime-buy period isin effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not inproduction. Samples may or may notbe available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional productcontent details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable foruse in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% byweight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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