Texas instruments AM1707 User Manual

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AM1707
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AM1707 ARM Microprocessor
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1 AM1707 ARM Microprocessor

123
• Highlights – 375/456-MHz ARM926EJ-S™ RISC Core – ARM9 Memory Architecture – Programmable Real-Time Unit Subsystem – Enhanced Direct-Memory-Access Controller
3 (EDMA3) • Two External Memory Interfaces: – Two External Memory Interfaces – EMIFA – Three Configurable 16550 type UART NOR (8-/16-Bit-Wide Data)
Modules – Two Serial Peripheral Interfaces (SPI) – Multimedia Card (MMC)/Secure Digital (SD) Space
Card Interface with Secure Data I/O (SDIO) – Two Master/Slave Inter-Integrated Circuit – USB 2.0 OTG Port With Integrated PHY Address Space – Three Multichannel Audio Serial Ports • Three Configurable 16550 type UART Modules: – 10/100 Mb/s Ethernet MAC (EMAC) – UART0 With Modem Control Signals – One 64-Bit General-Purpose Timer – 16-byte FIFO – One 64-bit General-Purpose/Watchdog Timer – 16x or 13x Oversampling Option – Three Enhanced Pulse Width Modulators – Autoflow control signals (CTS, RTS) on – Three 32-Bit Enhanced Capture Modules
• Applications – Industrial Automation – Home Automation – Test and Measurement – Portable Data Terminals – Educational Consoles – Power Protection Systems
• 375/456-MHz ARM926EJ-S™ RISC Core – 32-Bit and 16-Bit (Thumb®) Instructions – Single Cycle MAC – ARM®Jazelle®Technology – EmbeddedICE-RT™ for Real-Time Debug
• ARM9 Memory Architecture – 16K-Byte Instruction Cache – 16K-Byte Data Cache – 8K-Byte RAM (Vector Table) – 64K-Byte ROM
• Enhanced Direct-Memory-Access Controller 3 (EDMA3):
– 2 Transfer Controllers
– 32 Independent DMA Channels – 8 Quick DMA Channels – Programmable Transfer Burst Size
• 128K-Byte RAM Memory
• 3.3V LVCMOS IOs (except for USB interfaces)
NAND (8-/16-Bit-Wide Data)
16-Bit SDRAM With 128MB Address
– EMIFB
32-Bit or 16-Bit SDRAM With 256MB
UART0 only
• LCD Controller
• Two Serial Peripheral Interfaces (SPI) Each With One Chip-Select
• Programmable Real-Time Unit Subsystem (PRUSS)
– Two Independent Programmable Realtime
Unit (PRU) Cores
32-Bit Load/Store RISC architecture
4K Byte instruction RAM per core
512 Bytes data RAM per core
PRU Subsystem (PRUSS) can be disabled via software to save power
– Standard power management mechanism
Clock gating
Entire subsystem under a single PSC clock gating domain
– Dedicated interrupt controller – Dedicated switched central resource
• Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
• Two Master/Slave Inter-Integrated Circuit (I2C
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2ARM926EJ-S, EmbeddedICE-RT, ETM9, CoreSight are trademarks of ARM Limited. 3ARM, Jazelle are registered trademarks of ARM Limited.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phaseof development. Characteristic dataand other specifications are subjectto change without notice.
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Bus™) Timers)
• One Host-Port Interface (HPI) With 16-Bit-Wide • Three Enhanced Pulse Width Modulators Muxed Address/Data Bus For High Bandwidth (eHRPWM):
• USB 1.1 OHCI (Host) With Integrated PHY – Dedicated 16-Bit Time-Base Counter With (USB1) Period And Frequency Control
• USB 2.0 OTG Port With Integrated PHY (USB0) – 6 Single Edge, 6 Dual Edge Symmetric or 3 – USB 2.0 High-/Full-Speed Client – USB 2.0 High-/Full-/Low-Speed Host – End Point 0 (Control) – End Points 1,2,3,4 (Control, Bulk, Interrupt or
Dual Edge Asymmetric Outputs – Dead-Band Generation – PWM Chopping by High-Frequency Carrier – Trip Zone Input
ISOC) Rx and Tx • Three 32-Bit Enhanced Capture Modules
• Three Multichannel Audio Serial Ports: – Six Clock Zones and 28 Serial Data Pins – Supports TDM, I2S, and Similar Formats – DIT-Capable (McASP2) – FIFO buffers for Transmit and Receive
• 10/100 Mb/s Ethernet MAC (EMAC): – IEEE 802.3 Compliant (3.3-V I/O Only) – RMII Media Independent Interface – Management Data I/O (MDIO) Module
• Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
• One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
• One 64-bit General-Purpose/Watchdog Timer (Configurable as Two 32-bit General-Purpose
(eCAP): – Configurable as 3 Capture Inputs or 3
Auxiliary Pulse Width Modulator (APWM) outputs
– Single Shot Capture of up to Four Event
Time-Stamps
• Two 32-Bit Enhanced Quadrature Encoder Pulse Modules (eQEP)
• 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
• Commercial, Industrial, Automotive or Extended Temperature
• Community Resources – TI E2E CommunityTI Embedded Processors Wiki
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1.2 Trademarks

All trademarks are the property of their respective owners.
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1.3 Description

The device is a low-power ARM microprocessor based on an ARM926EJ-S™. The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating
systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.
The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; two inter-integrated circuit (I2C) Bus interfaces; 3 multichannel audio serial port (McASP) with 16/12/4 serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with RTS and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
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The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration.
The HPI, I2C, SPI, USB1.1 and USB2.0 ports allow the device to easily control peripheral devices and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The device has a complete set of development tools for the ARM. These include C compilers and a Windows™ debugger interface for visibility into source code execution.
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Switched Central Resource (SCR)
16 KB
I-Cache
16 KB
D-Cache
4 KB ETB
ARM926EJ-S CPU
With MMU
ARM Subsystem
JTAG Interface
System Control
Input
Clock(s)
64 KB ROM
8 KB RAM
(Vector Table)
Power/Sleep
Controller
Pin
Multiplexing
RTC/
32-KHz
OSC
PLL/Clock Generator
w/OSC
General­Purpose
Timer
General­Purpose
Timer
(Watchdog)
Serial Interfaces
I C
(2)
2
SPI
(2)
UART
(3)
Audio Ports
McASP w/FIFO
(3)
DMA
Peripherals
Display
Internal Memory
LCD
Ctlr
128 KB
RAM
External Memory Interfaces
Connectivity
EDMA3
Control Timers
eHRPWM
(3)
eCAP
(3)
eQEP
(2)
(10/100)
EMAC
(RMII)
MDIO
USB1.1
OHCI Ctlr
PHY
USB2.0
OTG Ctlr
PHY
HPI
MMC/SD
(8b)
EMIFA(8b/16B)
NAND/Flash 16b SDRAM
EMIFB
SDRAM Only
(16b/32b)
GPIO
Customizable Interface
PRU
Subsystem
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1.4 Functional Block Diagram

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1 AM1707 ARM Microprocessor ........................ 1
1.1 Features .............................................. 1 6.11 External Memory Interface A (EMIFA) ............. 66
1.2 Trademarks .......................................... 3
1.3 Description ........................................... 4
1.4 Functional Block Diagram ............................ 5
2 Revision History ......................................... 7
3 Device Overview ........................................ 8
3.1 Device Characteristics ............................... 8
3.2 Device Compatibility ................................. 9
3.3 ARM Subsystem ..................................... 9
3.4 Memory Map Summary ............................. 12
3.5 Pin Assignments .................................... 15
3.6 Terminal Functions ................................. 16
4 Device Configuration ................................. 34
4.1 Boot Modes ......................................... 34
4.2 SYSCFG Module ................................... 35
4.3 Pullup/Pulldown Resistors .......................... 37
5 Device Operating Conditions ....................... 38
5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range
(Unless Otherwise Noted) ................................. 38
5.2 Recommended Operating Conditions .............. 39
5.3 Notes on Recommended Power-On Hours (POH)
...................................................... 40
5.4 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction
Temperature (Unless Otherwise Noted) ............ 41
6 Peripheral Information and Electrical
Specifications .......................................... 42
6.1 Parameter Information .............................. 42
6.2 Recommended Clock and Control Signal Transition
Behavior ............................................ 43
6.3 Power Supplies ..................................... 43
6.4 Unused USB0 (USB2.0) and USB1 (USB1.1) Pin
Configurations ...................................... 43
6.5 Reset ............................................... 45
6.6 Crystal Oscillator or External Clock Input .......... 48
6.7 Clock PLLs ......................................... 50
6.8 Interrupts ............................................ 54
6.9 General-Purpose Input/Output (GPIO) ............. 58
6.10 EDMA ............................................... 61
6.12 External Memory Interface B (EMIFB) ............. 75
6.13 Memory Protection Units ........................... 82
6.14 MMC / SD / SDIO (MMCSD) ....................... 85
6.15 Ethernet Media Access Controller (EMAC) ......... 88
6.16 Management Data Input/Output (MDIO) ........... 93
6.17 Multichannel Audio Serial Ports (McASP0, McASP1,
and McASP2) ....................................... 95
6.18 Serial Peripheral Interface Ports (SPI0, SPI1) .... 108
6.19 Enhanced Capture (eCAP) Peripheral ............ 126
6.20 Enhanced Quadrature Encoder (eQEP) Peripheral
..................................................... 129
6.21 Enhanced High-Resolution Pulse-Width Modulator
(eHRPWM) ........................................ 131
6.22 LCD Controller .................................... 135
6.23 Timers ............................................. 150
6.24 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
..................................................... 152
6.25 Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 157
6.26 USB1 Host Controller Registers (USB1.1 OHCI)
..................................................... 159
6.27 USB0 OTG (USB2.0 OTG) ........................ 161
6.28 Host-Port Interface (UHPI) ........................ 169
6.29 Power and Sleep Controller (PSC) ................ 176
6.30 Programmable Real-Time Unit Subsystem (PRUSS)
..................................................... 179
6.31 Emulation Logic ................................... 182
6.32 IEEE 1149.1 JTAG ................................ 188
6.33 Real Time Clock (RTC) ........................... 190
7 Device and Documentation Support ............. 193
7.1 Device Support .................................... 193
7.2 Documentation Support ........................... 193
8 Mechanical Packaging and Orderable
Information ............................................ 194
8.1 Device and Development-Support Tool
Nomenclature ..................................... 194
8.2 Packaging Materials Information .................. 194
8.3 Thermal Data for ZKB ............................. 195
8.4 Mechanical Drawings ............................. 195
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2 Revision History

This data manual revision history highlights the changes made to the SPRS637A device-specific data manual to make it an SPRS637B revision.
Table 2-1. Revision History
ADDITIONS/MODIFICATIONS/DELETIONS
Global - Changed SPI td(SCSL_SPC)S min from P to 2P Global - Replaced all "CLKIN" references with "OSCIN" Global - Updated SPI Electrical parameters
Added Section 5.3, Notes on Recommended Power-On Hours (POH).
Section 6.5- Updated "All pins are tri-stated with the exception of RESETOUT which remains active through the reset sequence" to " All
pins are tri-stated with the exception of RESETOUT, which remains active through the reset sequence, and RTCK/GP7[14]. If an emulator is driving TCK into the device during reset, then RTCK/GP7[14] will drive out RTCK. If TCK is not being driven into the device during reset, then RTCK/GP7[14] will drive low."
Updated Warm Reset Timing Diagram - Figure 6-5 Updated the PLL diagram - Figure 6-9
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3 Device Overview

3.1 Device Characteristics

Table 3-1 provides an overview of the device . The table shows significant features of the device, including
the capacity of on-chip RAM, peripherals, and the package type with pin count.
Table 3-1. Characteristics of the device
HARDWARE FEATURES AM1707
EMIFB 16/32bit, upto 512Mb SDRAM EMIFA Asynchronous (8/16-bit bus width) RAM, Flash, 16bit upto 128Mb SDRAM, NOR, NAND Flash Card Interface MMC and SD cards supported. EDMA3 32 independent channels, 8 QDMA channels, 2 Transfer controllers
Timers UART 3 (one with RTS and CTS flow control)
SPI 2 (Each with one hardware chip select) I2C 2 (both Master/Slave)
Peripherals Not all peripherals pins
are available at the same time (for more detail, see the Device Configurations section).
On-Chip Memory
JTAG BSDL_ID DEVIDR0 register CPU Frequency MHz ARM926 375 MHz (1.2V) or 456 MHz (1.3V)
Voltage
Package 17 mm x 17 mm, 256-Ball 1 mm pitch, PBGA (ZKB)
Product Status
(1) ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
(1)
Multichannel Audio Serial Port [McASP]
10/100 Ethernet MAC with Management Data 1 (RMII Interface) I/O
eHRPWM 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs eCAP 3 32-bit capture inputs or 3 32-bit auxiliary PWM outputs eQEP 2 32-bit QEP channels with 4 inputs/channel UHPI 1 (16-bit multiplexed address/data) USB 2.0 (USB0) High-Speed OTG Controller with on-chip OTG PHY USB 1.1 (USB1) Full-Speed OHCI (as host) with on-chip PHY General-Purpose
Input/Output Port PRU Subsystem
(PRUSS) LCD Controller 1 Size (Bytes) 168KB RAM, 64KB ROM
Organization
Core (V) I/O (V) 3.3 V
Product Preview (PP), Advance Information (AI), or Production Data (PD)
2 64-Bit General Purpose (configurable as 2 separate 32-bit timers, 1 configurable as
Watch Dog)
3 (each with transmit/receive, FIFO buffer, 16/12/4 serializers)
8 banks of 16-bit
2 Programmable PRU Cores
ARM
16KB I-Cache
16KB D-Cache
8KB RAM (Vector Table)
64KB ROM
ADDITIONAL MEMORY
128KB RAM
0x8B7D F02F (Silicon Revision 1.1) 0x9B7D F02F (Silicon Revision 2.0)
1.2 V nominal for 375 MHz version
1.3 V nominal for 456 MHz version
375 MHz Versions -PD
456 MHz Version - AI
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3.2 Device Compatibility

The ARM926EJ-S RISC CPU is compatible with other ARM9 CPUs from ARM Holdings plc.

3.3 ARM Subsystem

The ARM Subsystem includes the following features:
ARM926EJ-S RISC processor
ARMv5TEJ (32/16-bit) instruction set
Little endian
System Control Co-Processor 15 (CP15)
MMU
16KB Instruction cache
16KB Data cache
Write Buffer
Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)
ARM Interrupt controller

3.3.1 ARM926EJ-S RISC CPU

The ARM Subsystem integrates the ARM926EJ-S processor. The ARM926EJ-S processor is a member of ARM9 family of general-purpose microprocessors. This processor is targeted at multi-tasking applications where full memory management, high performance, low die size, and low power are all important. The ARM926EJ-S processor supports the 32-bit ARM and 16 bit THUMB instruction sets, enabling the user to trade off between high performance and high code density. Specifically, the ARM926EJ-S processor supports the ARMv5TEJ instruction set, which includes features for efficient execution of Java byte codes, providing Java performance similar to Just in Time (JIT) Java interpreter, but without associated code overhead.
SPRS637B–FEBRUARY 2010–REVISED AUGUST 2010
The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both hardware and software debug. The ARM926EJ-S processor has a Harvard architecture and provides a complete high performance subsystem, including:
ARM926EJ -S integer core
CP15 system control coprocessor
Memory Management Unit (MMU)
Separate instruction and data caches
Write buffer
Separate instruction and data (internal RAM) interfaces
Separate instruction and data AHB bus interfaces
Embedded Trace Module and Embedded Trace Buffer (ETM/ETB) For more complete details on the ARM9, refer to the ARM926EJ-S Technical Reference Manual, available
at http://www.arm.com

3.3.2 CP15

The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and data caches, Memory Management Unit (MMU), and other ARM subsystem functions. The CP15 registers are programmed using the MRC and MCR ARM instructions, when the ARM in a privileged mode such as supervisor or system mode.
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3.3.3 MMU

A single set of two level page tables stored in main memory is used to control the address translation, permission checks and memory region attributes for both data and instruction accesses. The MMU uses a single unified Translation Lookaside Buffer (TLB) to cache the information held in the page tables. The MMU features are:
Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme.
Mapping sizes are: – 1MB (sections) – 64KB (large pages) – 4KB (small pages) – 1KB (tiny pages)
Access permissions for large pages and small pages can be specified separately for each quarter of the page (subpage permissions)
Hardware page table walks
Invalidate entire TLB, using CP15 register 8
Invalidate TLB entry, selected by MVA, using CP15 register 8
Lockdown of TLB entries, using CP15 register 10

3.3.4 Caches and Write Buffer

The size of the Instruction cache is 16KB, Data cache is 16KB. Additionally, the caches have the following features:
Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA)
Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with two dirty bits in the Dcache
Dcache supports write-through and write-back (or copy back) cache operation, selected by memory region using the C and B bits in the MMU translation tables
Critical-word first cache refilling
Cache lockdown registers enable control over which cache ways are used for allocation on a line fill, providing a mechanism for both lockdown, and controlling cache corruption
Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the possibility of TLB misses related to the write-back address.
Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of the Dcache or Icache, and regions of virtual memory.
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The write buffer is used for all writes to a noncachable bufferable region, write-through region and write misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a four-address buffer. The Dcache write-back has eight data word entries and a single address entry.

3.3.5 Advanced High-Performance Bus (AHB)

The ARM Subsystem uses the AHB port of the ARM926EJ-S to connect the ARM to the Config bus and the external memories. Arbiters are employed to arbitrate access to the separate D-AHB and I-AHB by the Config Bus and the external memories bus.

3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)

To support real-time trace, the ARM926EJ-S processor provides an interface to enable connection of an Embedded Trace Macrocell (ETM). The ARM926EJ-S Subsystem in the device also includes the Embedded Trace Buffer (ETB). The ETM consists of two parts:
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Trace Port provides real-time trace capability for the ARM9.
Triggering facilities provide trigger resources, which include address and data comparators, counter, and sequencers.
The device trace port is not pinned out and is instead only connected to the Embedded Trace Buffer. The ETB has a 4KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace data.
This device uses ETM9™ version r2p2 and ETB version r0p1. Documentation on the ETM and ETB is available from ARM Ltd. Reference the ' CoreSight™ ETM9™ Technical Reference Manual, revision r0p1' and the 'ETM9 Technical Reference Manual, revision r2p2'.

3.3.7 ARM Memory Mapping

By default the ARM has access to most on and off chip memory areas, EMIFA, EMIFB, and the additional 128K byte on chip SRAM. Likewise almost all of the on chip peripherals are accessible to the ARM by default.
See Table 3-2 for a detailed top level device memory map that includes the ARM memory space.
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3.4 Memory Map Summary

Table 3-2. AM1707 Top Level Memory Map
Start Address End Address Size ARM Mem Map EDMA Mem PRUSS Mem Master LCDC
0x0000 0000 0x0000 0FFF 4K - PRUSS Local
0x0000 1000 0x01BB FFFF
0x01BC 0000 0x01BC 0FFF 4K ARM ETB -
memory 0x01BC 1000 0x01BC 17FF 2K ARM ETB reg ­0x01BC 1800 0x01BC 18FF 256 ARM Ice -
Crusher 0x01BC 1900 0x01BF FFFF ­0x01C0 0000 0x01C0 7FFF 32K EDMA3 Channel Controller ­0x01C0 8000 0x01C0 83FF 1024 EDMA3 Transfer Controller 0 ­0x01C0 8400 0x01C0 87FF 1024 EDMA3 Transfer Controller 1 ­0x01C0 8800 0x01C0 FFFF ­0x01C1 0000 0x01C1 0FFF 4K PSC 0 ­0x01C1 1000 0x01C1 1FFF 4K PLL Controller ­0x01C1 2000 0x01C1 3FFF ­0x01C1 4000 0x01C1 4FFF 4K SYSCFG ­0x01C1 5000 0x01C1 FFFF ­0x01C2 0000 0x01C2 0FFF 4K Timer64P 0 ­0x01C2 1000 0x01C2 1FFF 4K Timer64P 1 ­0x01C2 2000 0x01C2 2FFF 4K I2C 0 ­0x01C2 3000 0x01C2 3FFF 4K RTC ­0x01C2 4000 0x01C3 FFFF - ­0x01C4 0000 0x01C4 0FFF 4K MMC/SD 0 ­0x01C4 1000 0x01C4 1FFF 4K SPI 0 ­0x01C4 2000 0x01C4 2FFF 4K UART 0 ­0x01C4 3000 0x01CF FFFF ­0x01D0 0000 0x01D0 0FFF 4K McASP 0 Control ­0x01D0 1000 0x01D0 1FFF 4K McASP 0 AFIFO Control ­0x01D0 2000 0x01D0 2FFF 4K McASP 0 Data ­0x01D0 3000 0x01D0 3FFF ­0x01D0 4000 0x01D0 4FFF 4K McASP 1 Control ­0x01D0 5000 0x01D0 5FFF 4K McASP 1 AFIFO Control ­0x01D0 6000 0x01D0 6FFF 4K McASP 1 Data ­0x01D0 7000 0x01D0 7FFF ­0x01D0 8000 0x01D0 8FFF 4K McASP 2 Control ­0x01D0 9000 0x01D0 9FFF 4K McASP 2 AFIFO Control ­0x01D0 A000 0x01D0 AFFF 4K McASP 2 Data ­0x01D0 B000 0x01D0 BFFF ­0x01D0 C000 0x01D0 CFFF 4K UART 1 ­0x01D0 D000 0x01D0 DFFF 4K UART 2 ­0x01D0 E000 0x01DF FFFF - -
0x01E0 0000 0x01E0 FFFF 64K USB0 ­0x01E1 0000 0x01E1 0FFF 4K UHPI -
Map Map Peripheral Mem
Mem Map Map
Address
Space
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Table 3-2. AM1707 Top Level Memory Map (continued)
Start Address End Address Size ARM Mem Map EDMA Mem PRUSS Mem Master LCDC
0x01E1 1000 0x01E1 1FFF ­0x01E1 2000 0x01E1 2FFF 4K SPI 1 ­0x01E1 3000 0x01E1 3FFF 4K LCD Controller ­0x01E1 4000 0x01E1 4FFF 4K Memory Protection Unit 1 (MPU 1) ­0x01E1 5000 0x01E1 5FFF 4K Memory Protection Unit 2 (MPU 2) ­0x01E1 6000 0x01E1 FFFF ­0x01E2 0000 0x01E2 1FFF 8K EMAC Control Module RAM ­0x01E2 2000 0x01E2 2FFF 4K EMAC Control Module Registers ­0x01E2 3000 0x01E2 3FFF 4K EMAC Control Registers ­0x01E2 4000 0x01E2 4FFF 4K EMAC MDIO port ­0x01E2 5000 0x01E2 5FFF 4K USB1 ­0x01E2 6000 0x01E2 6FFF 4K GPIO ­0x01E2 7000 0x01E2 7FFF 4K PSC 1 ­0x01E2 8000 0x01E2 8FFF 4K I2C 1 ­0x01E2 9000 0x01EF FFFF ­0x01F0 0000 0x01F0 0FFF 4K eHRPWM 0 ­0x01F0 1000 0x01F0 1FFF 4K HRPWM 0 ­0x01F0 2000 0x01F0 2FFF 4K eHRPWM 1 ­0x01F0 3000 0x01F0 3FFF 4K HRPWM 1 ­0x01F0 4000 0x01F0 4FFF 4K eHRPWM 2 ­0x01F0 5000 0x01F0 5FFF 4K HRPWM 2 ­0x01F0 6000 0x01F0 6FFF 4K ECAP 0 ­0x01F0 7000 0x01F0 7FFF 4K ECAP 1 ­0x01F0 8000 0x01F0 8FFF 4K ECAP 2 -
0x01F0 9000 0x01F0 9FFF 4K EQEP 0 ­0x01F0 A000 0x01F0 AFFF 4K EQEP 1 ­0x01F0 B000 0x3FFF FFFF -
0x4000 0000 0x47FF FFFF 128M EMIFA SDRAM data (CS0) -
0x4800 0000 0x5FFF FFFF
0x6000 0000 0x61FF FFFF 32M EMIFA async data (CS2) -
0x6200 0000 0x63FF FFFF 32M EMIFA async data (CS3) -
0x6400 0000 0x65FF FFFF 32M EMIFA async data (CS4) -
0x6600 0000 0x67FF FFFF 32M EMIFA async data (CS5) -
0x6800 0000 0x6800 7FFF 32K EMIFA Control Registers -
0x6800 8000 0x7FFF FFFF -
0x8000 0000 0x8001 FFFF 128K On-chip RAM -
0x8002 0000 0xAFFF FFFF -
0xB000 0000 0xB000 7FFF 32K EMIFB Control Registers
0xB000 8000 0xBFFF FFFF ­0xC000 0000 0xCFFF FFFF 256M EMIFB SDRAM Data 0xD000 0000 0xFFFC FFFF 0xFFFD 0000 0xFFFD FFFF 64K ARM local -
ROM 0xFFFE 0000 0xFFFE DFFF ­0xFFFE E000 0xFFFE FFFF 8K ARM Interrupt -
Controller
Map Map Peripheral Mem
Mem Map Map
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Table 3-2. AM1707 Top Level Memory Map (continued)
Start Address End Address Size ARM Mem Map EDMA Mem PRUSS Mem Master LCDC
0xFFFF 0000 0xFFFF 1FFF 8K ARM local - ARM local
RAM RAM (PRU 0
0xFFFF 2000 0xFFFF FFFF -
Map Map Peripheral Mem
Mem Map Map
Only)
14 Device Overview Copyright © 2010, Texas Instruments Incorporated
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V
SS
V
SS
T
AXR1[0]/
GP4[0]
AXR1[11]/
GP5[11]
SPI0_CLK/
EQEP1I/
GP5[2]/
BOOT[2]
SPI1_CLK/
EQEP1S/
GP5[7]/
BOOT[7]
1 2 3 4 5 6
EMA_CS[3]/
AMUTE2/
GP2[6]
7
EMA_CS[0] UHPI_HAS//
GP2[4]
8
EMA_A[0]/ LCD_D[7]/
GP1[0]
9
EMA_A[4]/ LCD_D[3]/
GP1[4]
10
EMA_A[8]/
LCD_PCLK/
GP1[8]
11
EMA_SDCKE/
GP2[0]
12
EMA_D[0]/
MMCSD_DAT[0]/
UHPI_HD[0]/
GP0[0]/
BOOT[12]
13
EMA_D[9]/
UHPI_HD[9]/
LCD_D[9]/
GP0[9]
14
V
SS
V
SS
15 16
DV
DD
R
AXR1[1]/
GP4[1]
UART0_RXD/
I2C0_SDA/
TM64P0_IN12/
GP5[8]/
BOOT[8]
SPI1_ENA/
UART2_RXD/
GP5[12]
SPI0_ENA
UART0_CTS//
EQEP0A/
GP5[3]/
BOOT[3]
SPI0_SOMI[0]/
EQEP0I/
GP5[0]/
BOOT[0]
EMA_OE
UHPI_HDS1//
AXR0[13]/
GP2[7]
EMA_BA[0]/
LCD_D[4]/
GP1[14]
EMA_A[1]/
MMCSD_CLK/
UHPI_HCNTL0/
GP1[1]
EMA_A[5]/ LCD_D[2]/
GP1[5]
EMA_A[9]/
LCD_HSYNC/
GP1[9]
EMA_CLK/
OBSCLK/
AHCLKR2/
GP1[15]
EMA_D[2]/
MMCSD_DAT[2]/
UHPI_HD[2]/
GP0[2]
EMA_D[10]/
UHPI_HD[10]/
LCD_D[10]/
GP0[10]
EMA_D[1]/
MMCSD_DAT[1]/
UHPI_HD[1]/
GP0[1]
DV
DD
P
AXR1[3]/
EQEP1A/
GP4[3]
AXR1[2]/
GP4[2]
UART0_TXD/
I2C0_SCL/
TM64P0_OUT12/
GP5[9]/
BOOT[9]
SPI1_SCS[0]/ UART2_TXD/
GP5[13]
SPI1_SOMI[0]/
I2C1_SCL/
GP5[5]/
BOOT[5]
SPI0_SIMO[0]/
EQEP0S/
GP5[1]/
BOOT[1]
EMA_CS[2] UHPI_HCS//
GP2[5]/
BOOT[15]
EMA_BA[1]/
LCD_D[5]/
UHPI_HHWIL/
GP1[13]
EMA_A[2]/ MMCSD_CMD/ UHPI_HCNTL1/
GP1[2]
EMA_A[6]/ LCD_D[1]/
GP1[6]
EMA_A[11]/
/
GP1[11]
LCD_AC_
ENB_CS
EMA_WE_
DQM[1]
UHPI_HDS2//
AXR0[14]/
GP2[8]
EMA_D[4]/
MMCSD_DAT[4]/
UHPI_HD[4]/
GP0[4]
EMA_D[12]/
UHPI_HD[12]/
LCD_D[12]/
GP0[12]
EMA_D[3]/
MMCSD_DAT[3]/
UHPI_HD[3]/
GP0[3]
EMA_D[11]/
UHPI_HD[11]/
LCD_D[11]
GP0[11]
N
AXR1[5]/
EPWM2B/
GP4[5]
AXR1[4]/
EQEP1B/
GP4[4]
AXR1[10]/
GP5[10]
SPI0_SCS[0] UART0_RTS//
EQEP0B/
GP5[4]/
BOOT[4]
SPI1_SIMO[0]/
I2C1_SDA/
GP5[6]/
BOOT[6]
EMA_WAIT[0]/
/
GP2[10]
UHPI_HRDY
EMA_RAS/
EMA_CS[5]/
GP2[2]
EMA_A[10]/
LCD_VSYNC/
GP1[10]
EMA_A[3]/ LCD_D[6]/
GP1[3]
EMA_A[7]/ LCD_D[0]/
GP1[7]
EMA_A[12]/ LCD_MCLK/
GP1[12]
EMA_D[8]/
UHPI_HD[8]/
LCD_D[8]/
GP0[8]
EMA_D[6]/
MMCSD_DAT[6]/
UHPI_HD[6]/
GP0[6]
EMA_D[14]/
UHPI_HD[14]/
LCD_D[14]/
GP0[14]
EMA_D[5]/
MMCSD_DAT[5]/
UHPI_HD[5]/
GP0[5]
EMA_D[13]/
UHPI_HD[13]/
LCD_D[13]/
GP0[13]
M
AXR1[9]/
GP4[9]
AXR1[8]/
EPWM1A/
GP4[8]
AXR1[7]/
EPWM1B/
GP4[7]
AXR1[6]/
EPWM2A/
GP4[6]
DV
DD
V
SS
V
SS
DV
DD
DV
DD
V
SS
V
SS
DV
DD
EMA_WEW/
UHPI_HR /
AXR0[12]/
GP2[3]/
BOOT[14]]
EMA_WE_
DQM[0]
UHPI_HINT//
AXR0[15]/
GP2[9]
EMA_D[7]/
MMCSD_DAT[7]/
UHPI_HD[7]/
GP0[7]/
BOOT[13]
EMA_D[15]/
UHPI_HD[15]/
LCD_D[15]/
GP0[15]
L
AHCLKR1/
GP4[11]
ACLKR1/
ECAP2/ APWM2/ GP4[12]
AFSR1/ GP4[13]
AMUTE0/
RESETOUT
DV
DD
CV
DD
V
SS
V
SS
V
SS
V
SS
DV
DD
DVDDEMB_CAS EMB_D[22] EMB_D[23]
EMA_CAS
EMA_CS[4]//
GP2[1]
K
RTCK/GP7[14]
AHCLKX1/ EPWM0B/
GP3[14]
ACLKX1/
EPWM0A/
GP3[15]
AFSX1/
EPWMSYNCI/
EPWMSYNCO/
GP4[10]
DV
DD
CV
DD
V
SS
V
SS
CV
DD
CV
DD
DVDDEMB_D[20]
EMB_WE_
DQM[0]/ GP5[15]
EMB_WE EMB_D[21]CV
DD
TMS
J
TDI
TDO TRST
EMU0/GP7[15]
CV
DD
CV
DD
V
SS
V
SS
CV
DD
CV
DD
CV
DD
EMB_D[5]/
GP6[5]
EMB_D[19]
EMB_D[6]/
GP6[6]
EMB_D[7]/
GP6[7]
RTC_XI
H
RTC_XO
TCK
NC
USB0_
VDDA33
CV
DD
V
SS
V
SS
CV
DD
CV
DD
EMB_D[3]/
GP6[3]
EMB_D[17] EMB_D[18]
EMB_D[4]/
GP6[4]
RTC_CV
DD
G
RTC_V
SS
RESET USB0_DM
DV
DD
CV
DD
V
SS
V
SS
CV
DD
CV
DD
DV
DD
CV
DD
EMB_D[1]/
GP6[1]
EMB_D[31] EMB_D[16]
EMB_D[2]/
GP6[2]
OSCOUT
F
OSCIN
NC USB0_DP
DV
DD
CV
DD
RSV1
V
SS
V
SS
V
SS
DV
DD
DV
DD
EMB_D[15]/
GP6[15]
EMB_D[29] EMB_D[30]
EMB_D[0]/
GP6[0]
PLL0_VSSA
E
OSCVSS
USB0_
VDDA18
USB0_
DRVVBUS/
GP4[15]
DV
DD
V
SS
V
SS
DV
DD
V
SS
V
SS
DV
DD
DV
DD
EMB_D[13]/
GP6[13]
EMB_D[27] EMB_D[28]
EMB_D[14]/
GP6[14]
PLL0_VDDA
D
USB0_ID
USB0_VBUS
AMUTE1/
EHRPWMTZ/
GP4[14]
AFSX0/
GP2[13]/
BOOT[10]
UART1_TXD/
AXR0[10]/
GP3[10]
AXR0[6]/
RMII_RXER/
ACLKR2/
GP3[6]
AXR0[2]/
RMII_TXEN/
AXR2[3]/
GP3[2]
EMB_CS[0]
EMB_A[0]/
GP7[2]
EMB_A[4]/
GP7[6]
EMB_A[8]/
GP7[10]
EMB_D[9]/
GP6[9]
EMB_D[10]/
GP6[10]
EMB_D[11]/
GP6[11]
EMB_D[12]/
GP6[12]
USB1_
VDDA33
C
USB1_
VDDA18
USB0_
VDDA12
AFSR0/
GP3[12]
ACLKX0/
ECAP0/ APWM0/ GP2[12]
UART1_RXD/
AXR0[9]/
GP3[9]
AXR0[5]/
RMII_RXD[1]/
AFSX2/ GP3[5]
AXR0[1]/
RMII_TXD[1]/
ACLKX2/
GP3[1]
EMB_BA[0]/
GP7[1]
EMB_A[1]/
GP7[3]
EMB_A[5]/
GP7[7]
EMB_A[9]/
GP7[11]
EMB_SDCKE EMB_CLK
EMB_WE_
DQM[1]/ GP5[14]
EMB_D[8]/
GP6[8]
B
RSV2 VSSUSB1_DM
ACLKR0/
ECAP1/ APWM1/ GP2[15]
AHCLKX0/ AHCLKX2/
USB_
REFCLKIN/
GP2[11]
AXR0[8]/ MDIO_D/
GP3[8]
AXR0[4]/
RMII_RXD[0]/
AXR2[1]/
GP3[4]
AXR0[0]/
RMII_TXD[0]/
AFSR2/
GP3[0]
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
EMB_BA[1]/
GP7[0]
EMB_A[2]/
GP7[4]
EMB_A[6]/
GP7[8]
EMB_A[11]/
GP7[13]
EMB_WE_
DQM[2]
EMB_D[25]
EMB_A[12]/
GP3[13]
DV
DD
A
V
SS
V
SS
USB1_DP
AHCLKR0/
RMII_MHZ_
50_CLK/ GP2[14]/
BOOT[11]
AXR0[11]/
AXR2[0]/
GP3[11]
AXR0[7]/
MDIO_CLK/
GP3[7]
AXR0[3]/
RMII_CRS_DV/
AXR2[2]/
GP3[3]
EMB_RAS
EMB_A[10]/
GP7[12]
EMB_A[3]/
GP7[5]
EMB_A[7]/
GP7[9]
EMB_WE_
DQM[3]
EMB_D[24] EMB_D[26] V
SS
V
SS
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
RV
DD
RV
DD
AM1707
www.ti.com

3.5 Pin Assignments

Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using a combination of hardware configuration at device reset and software programmable register settings.

3.5.1 Pin Map (Bottom View)

Figure 3-1 shows the pin assignments for the ZKB package.
SPRS637B–FEBRUARY 2010–REVISED AUGUST 2010
Copyright © 2010, Texas Instruments Incorporated Device Overview 15
Figure 3-1. Pin Map (ZKB)
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3.6 Terminal Functions

Table 3-3 to Table 3-23 identify the external signal names, the associated pin/ball numbers along with the
mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any internal pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a functional pin description.

3.6.1 Device Reset and JTAG

Table 3-3. Reset and JTAG Terminal Functions
SIGNAL NAME TYPE
RESET G3 I Device reset input AMUTE0/ RESETOUT L4 O
TMS J1 I IPU JTAG test mode select TDI J2 I IPU JTAG test data input TDO J3 O IPD JTAG test data output TCK H3 I IPU JTAG test clock TRST J4 I IPD JTAG test reset EMU[0]/GP7[15] J5 I/O IPU Emulation Signal RTCK/GP7[14] K1 I/O IPD JTAG Test Clock Return Clock Output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor (3) Open drain mode for RESETOUT function.
PIN No.
ZKB
(1)
(3)
(2)
PULL
RESET
IPD Reset output. Multiplexed with McASP0 mute output.
JTAG
DESCRIPTION
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3.6.2 High-Frequency Oscillator and PLL

Table 3-4. High-Frequency Oscillator and PLL Terminal Functions
SIGNAL NAME TYPE
EMA_CLK/OBSCLK/AHCLKR2/ GP1[15]
OSCIN F2 I Oscillator input OSCOUT F1 O Oscillator output OSCVSS E2 GND Oscillator ground
PLL0_VDDA D1 PWR PLL analog VDD(1.2-V filtered supply) PLL0_VSSA E1 GND PLL analog VSS(for filter)
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
PIN No.
ZKB
R12 O IPU PLL Observation Clock
(1)
PULL
1.2-V OSCILLATOR
(2)
1.2-V PLL
DESCRIPTION
16 Device Overview Copyright © 2010, Texas Instruments Incorporated
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3.6.3 Real-Time Clock and 32-kHz Oscillator

Table 3-5. Real-Time Clock (RTC) and 1.2-V, 32-kHz Oscillator Terminal Functions
SIGNAL NAME TYPE
RTC_CVDD G1 PWR RTC module core power (isolated from rest of chip CVDD) RTC_XI H1 I Low-frequency (32-kHz) oscillator receiver for real-time clock RTC_XO H2 O Low-frequency (32-kHz) oscillator driver for real-time clock RTC_V
ss
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
PIN No.
ZKB
G2 GND Oscillator ground (for filter)
(1)
PULL
(2)
DESCRIPTION

3.6.4 External Memory Interface A (ASYNC, SDRAM)

Table 3-6. External Memory Interface A (EMIFA) Terminal Functions
PIN
SIGNAL NAME TYPE
EMA_D[15]/UHPI_HD[15]/LCD_D[15]/GP0[15] M16 I/O IPD EMA_D[14]/UHPI_HD[14]/LCD_D[14]/GP0[14] N14 I/O IPD EMA_D[13]/UHPI_HD[13]/LCD_D[13]/GP0[13] N16 I/O IPD EMA_D[12]/UHPI_HD[12]/LCD_D[12]/GP0[12] P14 I/O IPD EMA_D[11]/UHPI_HD[11]/LCD_D[11]/GP0[11] P16 I/O IPD EMA_D[10]/UHPI_HD[10]/LCD_D[10]/GP0[10] R14 I/O IPD EMA_D[9]/UHPI_HD[9]/LCD_D[9]/GP0[9] T14 I/O IPD EMA_D[8]/UHPI_HD[8]/LCD_D[8]/GP0[8] N12 I/O IPD
EMA_D[7]/MMCSD_DAT[7]/UHPI_HD[7]/GP0[7]/BOOT[13] M15 I/O IPU EMA_D[6]/MMCSD_DAT[6]/UHPI_HD[6]/GP0[6] N13 I/O IPU
EMA_D[5]/MMCSD_DAT[5]/UHPI_HD[5]/GP0[5] N15 I/O IPU EMA_D[4]/MMCSD_DAT[4]/UHPI_HD[4]/GP0[4] P13 I/O IPU EMA_D[3]/MMCSD_DAT[3]/UHPI_HD[3]/GP0[3] P15 I/O IPU EMA_D[2]/MMCSD_DAT[2]/UHPI_HD[2]/GP0[2] R13 I/O IPU EMA_D[1]/MMCSD_DAT[1]/UHPI_HD[1]/GP0[1] R15 I/O IPU
EMA_D[0]/MMCSD_DAT[0]/UHPI_HD[0]/GP0[0]/BOOT[12] T13 I/O IPU
No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
UHPI, LCD, GPIO
MMC/SD, UHPI, GPIO, BOOT
MMC/SD, UHPI, GPIO
MMC/SD, UHPI, GPIO, BOOT
EMIFA data bus
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
Copyright © 2010, Texas Instruments Incorporated Device Overview 17
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Table 3-6. External Memory Interface A (EMIFA) Terminal Functions (continued)
PIN
SIGNAL NAME TYPE
EMA_A[12]/LCD_MCLK/GP1[12] N11 O IPU EMA_A[11]/ LCD_AC_ENB_CS/GP1[11] P11 O IPU EMA_A[10]/LCD_VSYNC/GP1[10] N8 O IPU EMA_A[9]/LCD_HSYNC/GP1[9] R11 O IPU EMA_A[8]/LCD_PCLK/GP1[8] T11 O IPU EMA_A[7]/LCD_D[0]/GP1[7] N10 O IPD EMA_A[6]/LCD_D[1]/GP1[6] P10 O IPD EMA_A[5]/LCD_D[2]/GP1[5] R10 O IPD EMA_A[4]/LCD_D[3]/GP1[4] T10 O IPD EMA_A[3]/LCD_D[6]/GP1[3] N9 O IPD EMA_A[2]/MMCSD_CMD/UHPI_HCNTL1/GP1[2] P9 O IPU EMA_A[1]/MMCSD_CLK/UHPI_HCNTL0/GP1[1] R9 O IPU EMIFA address bus. EMA_A[0]/LCD_D[7]/GP1[0] T9 O IPD LCD, GPIO
EMA_BA[1]/LCD_D[5]/UHPI_HHWIL/GP1[13] P8 O IPU EMA_BA[0]/LCD_D[4]/GP1[14] R8 O IPU LCD, GPIO EMA_CLK/OBSCLK/AHCLKR2/GP1[15] R12 O IPU EMIFA clock
EMA_SDCKE/GP2[0] T12 O IPU GPIO
EMA_RAS /EMA_CS[5]/GP2[2] N7 O IPU
EMA_CAS /EMA_CS[4]/GP2[1] L16 O IPU
EMA_RAS/ EMA_CS[5] /GP2[2] N7 O IPU EMA_CAS/ EMA_CS[4] /GP2[1] L16 O IPU
EMA_CS[3] /AMUTE2/GP2[6] T7 O IPU McASP2, GPIO EMA_CS[2] /UHPI_HCS/GP2[5]/BOOT[15] P7 O IPU
EMA_CS[0] /UHPI_HAS/GP2[4] T8 O IPU UHPI, GPIO
EMA_WE /UHPI_HRW/AXR0[12]/GP2[3]/BOOT[14] M13 O IPU
EMA_WE_DQM[1] /UHPI_HDS2/AXR0[14]/GP2[8] P12 O IPU enable/data mask for
EMA_WE_DQM[0] /UHPI_HINT/AXR0[15]/GP2[9] M14 O IPU enable/data mask for
EMA_OE /UHPI_HDS1/AXR0[13]/GP2[7] R7 O IPU EMIFA output enable
EMA_WAIT[0]/ UHPI_HRDY/GP2[10] N6 I IPU UHPI, GPIO
No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
LCD, GPIO EMIFA address bus
MMCSD, UHPI, GPIO
LCD, UHPI, GPIO
McASP2, GPIO, OBSCLK
EMIF A chip select, GPIO
EMIF A SDRAM, GPIO
UHPI, GPIO, BOOT
UHPI, MCASP0, EMIFA SDRAM write GPIO, BOOT enable
UHPI, McASP, GPIO
UHPI, McASP0, GPIO
EMIFA bank address
EMIFA SDRAM clock enable
EMIFA SDRAM row address strobe
EMIFA SDRAM column address strobe
EMIFA Async Chip Select
EMIFA SDRAM chip select
EMIFA write EMA_D[15:8]
EMIFA write EMA_D[7:0]
EMIFA wait input/interrupt
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3.6.5 External Memory Interface B (SDRAM only)

Table 3-7. External Memory Interface B (EMIFB) Terminal Functions
SIGNAL NAME TYPE
EMB_D[31] G14 O IPD EMB_D[30] F15 O IPD EMB_D[29] F14 O IPD EMB_D[28] E15 O IPD EMB_D[27] E14 O IPD EMB_D[26] A14 O IPD EMB_D[25] B14 O IPD EMB_D[24] A13 O IPD EMB_D[23] L15 O IPD EMB_D[22] L14 O IPD EMB_D[21] K16 O IPD EMB_D[20] K13 O IPD EMB_D[19] J14 O IPD EMB_D[18] H15 O IPD EMB_D[17] H14 O IPD EMB_D[16] G15 O IPD EMB_D[15]/GP6[15] F13 I/O IPD EMB_D[14]/GP6[14] E16 I/O IPD EMB_D[13]/GP6[13] E13 I/O IPD EMB_D[12]/GP6[12] D16 I/O IPD EMB_D[11]/GP6[11] D15 I/O IPD EMB_D[10]/GP6[10] D14 I/O IPD EMB_D[9]/GP6[9] D13 I/O IPD EMB_D[8]/GP6[8] C16 I/O IPD EMB_D[7]/GP6[7] J16 I/O IPD EMB_D[6]/GP6[6] J15 I/O IPD EMB_D[5]/GP6[5] J13 I/O IPD EMB_D[4]/GP6[4] H16 I/O IPD EMB_D[3]/GP6[3] H13 I/O IPD EMB_D[2]/GP6[2] G16 I/O IPD EMB_D[1]/GP6[1] G13 I/O IPD EMB_D[0]/GP6[0] F16 I/O IPD EMB_A[12]/GP3[13] B15 O IPD EMB_A[11]/GP7[13] B12 O IPD EMB_A[10]/GP7[12] A9 O IPD EMB_A[9]/GP7[11] C12 O IPD EMB_A[8]/GP7[10] D12 O IPD EMB_A[7]/GP7[9] A11 O IPD EMB_A[6]/GP7[8] B11 O IPD EMB_A[5]/GP7[7] C11 O IPD
PIN No.
ZKB
(1)
PULL
SPRS637B–FEBRUARY 2010–REVISED AUGUST 2010
(2)
MUXED DESCRIPTION
EMIFB SDRAM data bus
GPIO
GPIO
EMIFB SDRAM row/column address bus
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
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Table 3-7. External Memory Interface B (EMIFB) Terminal Functions (continued)
SIGNAL NAME TYPE
EMB_A[4]/GP7[6] D11 O IPD EMB_A[3]/GP7[5] A10 O IPD EMB_A[2]/GP7[4] B10 O IPD EMB_A[1]/GP7[3] C10 O IPD GPIO EMB_A[0]/GP7[2] D10 O IPD EMB_BA[1]/GP7[0] B9 O IPU EMB_BA[0]/GP7[1] C9 O IPU EMB_CLK C14 O IPU EMIF SDRAM clock EMB_SDCKE C13 I/O IPU EMIFB SDRAM clock enable EMB_WE K15 O IPU EMIFB write enable
EMB_RAS A8 O IPU EMB_CAS L13 O IPU EMIFB column address strobe
EMB_CS[0] D9 O IPU EMIFB SDRAM chip select 0 EMB_WE_DQM[3] A12 O IPU EMB_WE_DQM[2] B13 O IPU EMB_WE_DQM[1] /GP5[14] C15 O IPU EMB_WE_DQM[0] /GP5[15] K14 O IPU
PIN No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
EMIFB SDRAM row/column address
EMIFB SDRAM bank address
EMIFB SDRAM row address strobe
EMIFB write enable/data mask
GPIO
for EMB_D

3.6.6 Serial Peripheral Interface Modules (SPI0, SPI1)

Table 3-8. Serial Peripheral Interface (SPI) Terminal Functions
PIN
SIGNAL NAME TYPE
SPI0_SCS[0] /UART0_RTS/EQEP0B/GP5[4]/BOOT[4] N4 I/O IPU SPI0 chip select
SPI0_ENA /UART0_CTS/EQEP0A/GP5[3]/BOOT[3] R5 I/O IPU SPI0 enable SPI0_CLK/EQEP1I/GP5[2]/BOOT[2] T5 I/O IPD eQEP1, GPIO, BOOT SPI0 clock SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1] P6 I/O IPD
SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0] R6 I/O IPD
SPI1_SCS[0] /UART2_TXD/GP5[13] P4 I/O IPU SPI1 chip select SPI1_ENA /UART2_RXD/GP5[12] R4 I/O IPU SPI1 enable SPI1_CLK/EQEP1S/GP5[7]/BOOT[7] T6 I/O IPD eQEP1, GPIO, BOOT SPI1 clock
SPI1_SIMO[0]/I2C1_SDA/GP5[6]/BOOT[6] N5 I/O IPU
SPI1_SOMI[0]/I2C1_SCL/GP5[5]/BOOT[5] P5 I/O IPU
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
SPI0
SPI1
(1)
PULL
(2)
MUXED DESCRIPTION
UART0, EQEP0B, GPIO, BOOT
UART0, EQEP0A, GPIO, BOOT
eQEP0, GPIO, BOOT
UART2, GPIO
I2C1, GPIO, BOOT
SPI0 data slave-in-master-out
SPI0 data slave-out-master-in
SPI1 data slave-in-master-out
SPI1 data slave-out-master-in
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3.6.7 Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)

The eCAP Module pins function as either input captures or auxilary PWM 32-bit outputs, depending upon how the eCAP module is programmed.
Table 3-9. Enhanced Capture Module (eCAP) Terminal Functions
PIN
SIGNAL NAME TYPE
eCAP0
ACLKX0/ECAP0/APWM0/GP2[12] C5 I/O IPD McASP0, GPIO
eCAP1
ACLKR0/ECAP1/APWM1/GP2[15] B4 I/O IPD McASP0, GPIO
eCAP2
ACLKR1/ECAP2/APWM2/GP4[12] L2 I/O IPD McASP1, GPIO
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
enhanced capture 0 input or auxiliary PWM 0 output
enhanced capture 1 input or auxiliary PWM 1 output
enhanced capture 2 input or auxiliary PWM 2 output
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3.6.8 Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)

Table 3-10. Enhanced Pulse Width Modulator (eHRPWM) Terminal Functions
PIN
SIGNAL NAME TYPE
ACLKX1/EPWM0A/GP3[15] K3 I/O IPD AHCLKX1/EPWM0B/GP3[14] K2 I/O IPD eHRPWM0 B output AMUTE1/EPWMTZ/GP4[14] D4 I/O IPD
AFSX1/EPWMSYNCI/EPWMSYNCO/GP4[10] K4 I/O IPD
AXR1[8]/EPWM1A/GP4[8] M2 I/O IPD AXR1[7]/EPWM1B/GP4[7] M3 I/O IPD eHRPWM1 B output AMUTE1/EPWMTZ/GP4[14] D4 I/O IPD
AXR1[6]/EPWM2A/GP4[6] M4 I/O IPD AXR1[5]/EPWM2B/GP4[5] N1 I/O IPD eHRPWM2 B output AMUTE1/EPWMTZ/GP4[14] D4 I/O IPD
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
eHRPWM0
eHRPWM1
eHRPWM2
(1)
PULL
(2)
MUXED DESCRIPTION
eHRPWM0 A output
McASP1, GPIO
McASP1, eHRPWM1, eHRPWM0 trip zone GPIO, eHRPWM2 input
McASP1, eHRPWM0, eHRPWM0 module or GPIO sync output to
McASP1, GPIO
McASP1, eHRPWM1, eHRPWM1 trip zone GPIO, eHRPWM2 input
McASP1, GPIO
McASP1, eHRPWM1, eHRPWM2 trip zone GPIO, eHRPWM2 input
(with high-resolution)
Sync input to
external PWM
eHRPWM1 A output (with high-resolution)
eHRPWM2 A output (with high-resolution)
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3.6.9 Enhanced Quadrature Encoder Pulse Module (eQEP)

Table 3-11. Enhanced Quadrature Encoder Pulse Module (eQEP) Terminal Functions
PIN
SIGNAL NAME TYPE
SPI0_ENA/UART0_CTS/EQEP0A/GP5[3]/BOOT[3] R5 I IPU
SPI0_SCS[0]/UART0_RTS/EQEP0B/GP5[4]/BOOT[4] N4 I IPU SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0] R6 I IPD eQEP0 index
SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1] P6 I IPD eQEP0 strobe
AXR1[3]/EQEP1A/GP4[3] P1 I IPD
AXR1[4]/EQEP1B/GP4[4] N2 I IPD SPI0_CLK/EQEP1I/GP5[2]/BOOT[2] T5 I IPD eQEP1 index
SPI1_CLK/EQEP1S/GP5[7]/BOOT[7] T6 I IPD eQEP1 strobe
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
eQEP0
eQEP1
(1)
PULL
(2)
MUXED DESCRIPTION
SPIO, UART0, GPIO, BOOT
SPI1, GPIO, BOOT
McASP1, GPIO
SPI1, GPIO, BOOT
EQEP0A quadrature input
EQEP0B quadrature input
eQEP1 quadrature input
eQEP1 quadrature input
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3.6.10 Boot

Table 3-12. Boot Mode Selection Terminal Functions
SIGNAL NAME TYPE
EMA_CS[2]/UHPI_HCS/GP2[5]/BOOT[15] P7 I IPU EMIFA, UHPI, GPIO EMA_WE/UHPI_HRW/AXR0[12]/GP2[3]/BOOT[14] M13 I IPU EMA_D[7]/MMCSD_DAT[7]/UHPI_HD[7]/GP0[7]/BOOT[13] M15 I IPU
EMA_D[0]/MMCSD_DAT[0]/UHPI_HD[0]/GP0[0]/BOOT[12] T13 I IPU AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11] A4 I IPD AFSX0/GP2[13]/BOOT[10] D5 I IPD McASP0, GPIO UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9] P3 I IPU
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8] R3 I IPU SPI1_CLK/EQEP1S/GP5[7]/BOOT[7] T6 I IPD SPI1, eQEP1, GPIO
SPI1_SIMO[0]/I2C1_SDA/GP5[6]/BOOT[6] N5 I IPU SPI1_SOMI[0]/I2C1_SCL/GP5[5]/BOOT[5] P5 I IPU
SPI0_SCS[0]/UART0_RTS/EQEP0B/GP5[4]/BOOT[4] N4 I IPU
SPI0_ENA/UART0_CTS/EQEP0A/GP5[3]/BOOT[3] R5 I IPU SPI0_CLK/EQEP1I/GP5[2]/BOOT[2] T5 I IPD SPIO, eQEP1, GPIO
SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1] P6 I IPD SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0] R6 I IPD
(1) Boot decoding will be defined in the ROM datasheet. (2) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (3) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
PIN No.
ZKB
(2)
PULL
(3)
(1)
MUXED DESCRIPTION
EMIFA, UHPI, McASP0, GPIO
EMIFA, MMC/SD, UHPI, GPIO
McASP0, EMAC, GPIO
UART0, I2C0, Timer0, GPIO
UART0, I2C0, Timer0, GPIO
SPI1, I2C1, GPIO
SPI0, UART0, eQEP0, GPIO
SPI0, UART0, eQEP0, GPIO
SPI0, eQEP0, GPIO
Boot Mode Selection Pins
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3.6.11 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)

Table 3-13. Universal Asynchronous Receiver/Transmitter (UART) Terminal Functions
PIN
SIGNAL NAME TYPE
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8] R3 I IPU UART0 receive data
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9] P3 O IPU
SPI0_SCS[0]/ UART0_RTS /EQEP0B/GP5[4]/BOOT[4] N4 O IPU
SPI0_ENA/ UART0_CTS /EQEP0A/GP5[3]/BOOT[3] R5 I IPU
UART1_RXD/AXR0[9]/GP3[9] UART1_TXD/AXR0[10]/GP3[10]
SPI1_ENA/UART2_RXD/GP5[12] R4 I IPU UART2 receive data SPI1_SCS[0]/UART2_TXD/GP5[13] P4 O IPU
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor (3) As these signals are internally pulled down while the device is in reset, it is necessary to externally pull them high with resistors if
UART1 boot mode is used.
(3)
(3)
No. ZKB UART0
UART1
C6 I IPD UART1 receive data D6 O IPD
UART2
(1)
PULL
(2)
MUXED DESCRIPTION
I2C0, BOOT, Timer0, GPIO,
I2C0, Timer0, GPIO, UART0 transmit BOOT data
UART0
SPIO, eQEP0, GPIO, BOOT
McASP0, GPIO
SPI1, GPIO
ready-to-send output UART0
clear-to-send input
UART1 transmit data
UART2 transmit data

3.6.12 Inter-Integrated Circuit Modules(I2C0, I2C1)

Table 3-14. Inter-Integrated Circuit (I2C) Terminal Functions
PIN
SIGNAL NAME TYPE
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8] R3 I/O IPU I2C0 serial data
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9] P3 I/O IPU I2C0 serial clock
SPI1_SIMO[0]/I2C1_SDA/GP5[6]/BOOT[6] N5 I/O IPU I2C1 serial data SPI1_SOMI[0]/I2C1_SCL/GP5[5]/BOOT[5] P5 I/O IPU I2C1 serial clock
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No. ZKB
I2C0
I2C1
(1)
PULL
(2)
MUXED DESCRIPTION
UART0, Timer0, GPIO, BOOT
UART0, Timer0, GPIO, BOOT
SPI1, GPIO, BOOT
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3.6.13 Timers

Table 3-15. Timers Terminal Functions
PIN
SIGNAL NAME TYPE
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8] R3 I IPU Timer0 lower input UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9] P3 O IPU
TIMER1 (Watchdog )
No external pins. The Timer1 peripheral signals are not pinned out as external pins.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
TIMER0
(1)
PULL
(2)
UART0, I2C0, GPIO, BOOT
MUXED DESCRIPTION
Timer0 lower output
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3.6.14 Universal Host-Port Interface (UHPI)

Table 3-16. Universal Host-Port Interface (UHPI) Terminal Functions
PIN
SIGNAL NAME TYPE
EMA_D[15]/UHPI_HD[15]/LCD_D[15]/GP0[15] M16 I/O IPD EMA_D[14]/UHPI_HD[14]/LCD_D[14]/GP0[14] N14 I/O IPD EMA_D[13]/UHPI_HD[13]/LCD_D[13]/GP0[13] N16 I/O IPD EMA_D[12]/UHPI_HD[12]/LCD_D[12]/GP0[12] P14 I/O IPD EMA_D[11]/UHPI_HD[11]/LCD_D[11]/GP0[11] P16 I/O IPD EMA_D[10]/UHPI_HD[10]/LCD_D[10]/GP0[10] R14 I/O IPD EMA_D[9]/UHPI_HD[9]/LCD_D[9]/GP0[9] T14 I/O IPD EMA_D[8]/UHPI_HD[8]/LCD_D[8]/GP0[8] N12 I/O IPD EMA_D[7]/MMCSD_DAT[7]/UHPI_HD[7]/GP0[7]/ EMIFA, MMC/SD,
BOOT[13] GPIO, BOOT EMA_D[6]/MMCSD_DAT[6]/UHPI_HD[6]/GP0[6] N13 I/O IPU EMA_D[5]/MMCSD_DAT[5]/UHPI_HD[5]/GP0[5] N15 I/O IPU EMA_D[4]/MMCSD_DAT[4]/UHPI_HD[4]/GP0[4] P13 I/O IPU EMA_D[3]/MMCSD_DAT[3]/UHPI_HD[3]/GP0[3] P15 I/O IPU EMA_D[2]/MMCSD_DAT[2]/UHPI_HD[2]/GP0[2] R13 I/O IPU EMA_D[1]/MMCSD_DAT[1]/UHPI_HD[1]/GP0[1] R15 I/O IPU EMA_D[0]/MMCSD_DAT[0]/UHPI_HD[0]/GP0[0]/ EMIFA, MMC/SD,
BOOT[12] GPIO, BOOT EMA_A[2]/MMCSD_CMD/UHPI_HCNTL1/GP1[2] P9 I/O IPU EMIFA,
EMA_A[1]/MMCSD_CLK/UHPI_HCNTL0/GP1[1] R9 I/O IPU
EMA_BA[1]/LCD_D[5]/UHPI_HHWIL/GP1[13] P8 I/O IPU EMIFA, LCD, GPIO
EMA_WE/UHPI_HRW /AXR0[12]/GP2[3]/BOOT[14] M13 I/O IPU UHPI read/write
EMA_CS[2]/ UHPI_HCS /GP2[5]/BOOT[15] P7 I/O IPU UHPI chip select EMA_WE_DQM[1]/ UHPI_HDS2 /AXR0[14]/GP2[8] P12 I/O IPU
EMA_OE/ UHPI_HDS1 /AXR0[13]/GP2[7] R7 I/O IPU EMA_WE_DQM[0]/ UHPI_HINT /AXR0[15]/GP2[9] M14 I/O IPU UHPI host interrupt EMA_WAIT[0]/ UHPI_HRDY /GP2[10] N6 I/O IPU UHPI ready EMA_CS[0]/ UHPI_HAS /GP2[4] T8 I/O IPU UHPI address strobe
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
M15 I/O IPU
T13 I/O IPU
(1)
PULL
(2)
MUXED DESCRIPTION
EMIFA, LCD, GPIO
UHPI data bus
EMIFA, MMC/SD, GPIO
MMCSD_CMD, UHPI access control GPIO
UHPI half-word identification control
EMIFA, McASP, GPIO, BOOT
EMIFA, GPIO, BOOT
EMIFA, McASP0, GPIO
EMIFA, GPIO
UHPI data strobe
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3.6.15 Multichannel Audio Serial Ports (McASP0, McASP1, McASP2)

Table 3-17. Multichannel Audio Serial Ports (McASPs) Terminal Functions
PIN
SIGNAL NAME TYPE
McASP0
EMA_WE_DQM[0]/UHPI_HINT/AXR0[15]/GP2[9] M14 I/O IPU EMA_WE_DQM[1]/UHPI_HDS2/AXR0[14]/GP2[8] P12 I/O IPU EMA_OE/UHPI_HDS1/AXR0[13]/GP2[7] R7 I/O IPU
EMA_WE/UHPI_HRW/AXR0[12]/GP2[3]/BOOT[14] M13 I/O IPU AXR0[11]/ AXR2[0]/GP3[11] A5 I/O IPD McASP2, GPIO
UART1_TXD/AXR0[10]/GP3[10] D6 I/O IPD GPIO UART1_RXD/AXR0[9]/GP3[9] C6 I/O IPD GPIO
AXR0[8]/MDIO_D/GP3[8] B6 I/O IPU AXR0[7]/MDIO_CLK/GP3[7] A6 I/O IPD AXR0[6]/RMII_RXER/ACLKR2/GP3[6] D7 I/O IPD AXR0[5]/RMII_RXD[1]/AFSX2/GP3[5] C7 I/O IPD AXR0[4]/RMII_RXD[0]/AXR2[1]/GP3[4] B7 I/O IPD AXR0[3]/RMII_CRS_DV/AXR2[2]/GP3[3] A7 I/O IPD AXR0[2]/RMII_TXEN/AXR2[3]/GP3[2] D8 I/O IPD AXR0[1]/RMII_TXD[1]/ACLKX2/GP3[1] C8 I/O IPD AXR0[0]/RMII_TXD[0]/AFSR2/GP3[0] B8 I/O IPD
AHCLKX0/AHCLKX2/USB_REFCLKIN/GP2[11] B5 I/O IPD
ACLKX0/ECAP0/APWM0/GP2[12] C5 I/O IPD eCAP0, GPIO
AFSX0/GP2[13]/BOOT[10] D5 I/O IPD GPIO, BOOT
AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11] A4 I/O IPD
ACLKR0/ECAP1/APWM1/GP2[15] B4 I/O IPD eCAP1, GPIO
AFSR0/GP3[12] C4 I/O IPD GPIO
AMUTE0/RESETOUT L4 I/O IPD RESETOUT
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
EMIFA, UHPI, GPIO
EMIFA, UHPI, GPIO, BOOT
MDIO, GPIO data
EMAC, McASP2, GPIO
McASP2, USB, McASP1 transmit GPIO master clock
EMAC, GPIO, McASP0 receive BOOT master clock
McASP0 serial
McASP0 transmit bit clock
McASP0 transmit frame sync
McASP0 receive bit clock
McASP0 receive frame sync
McASP0 mute output
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Table 3-17. Multichannel Audio Serial Ports (McASPs) Terminal Functions (continued)
PIN
SIGNAL NAME TYPE
McASP1
AXR1[11]/GP5[11] T4 I/O IPU AXR1[10]/GP5[10] N3 I/O IPU GPIO AXR1[9]/GP4[9] M1 I/O IPD
AXR1[8]/EPWM1A/GP4[8] M2 I/O IPD
AXR1[7]/EPWM1B/GP4[7] M3 I/O IPD
AXR1[6]/EPWM2A/GP4[6] M4 I/O IPD
AXR1[5]/EPWM2B/GP4[5] N1 I/O IPD AXR1[4]/EQEP1B/GP4[4] N2 I/O IPD
AXR1[3]/EQEP1A/GP4[3] P1 I/O IPD AXR1[2]/GP4[2] P2 I/O IPD AXR1[1]/GP4[1] R2 I/O IPD GPIO AXR1[0]/GP4[0] T3 I/O IPD
AHCLKX1/EPWM0B/GP3[14] K2 I/O IPD
ACLKX1/EPWM0A/GP3[15] K3 I/O IPD
AFSX1/EPWMSYNCI/EPWMSYNCO/GP4[10] K4 I/O IPD
AHCLKR1/GP4[11] L1 I/O IPD GPIO
ACLKR1/ECAP2/APWM2/GP4[12] L2 I/O IPD eCAP2, GPIO
AFSR1/GP4[13] L3 I/O IPD GPIO
AMUTE1/EPWMTZ/GP4[14] D4 I/O IPD
McASP2
AXR0[0]/RMII_TXD[0]/AFSR2/GP3[0] B8 I/O IPD AXR0[2]/RMII_TXEN/AXR2[3]/GP3[2] D8 I/O IPD AXR0[3]/RMII_CRS_DV/AXR2[2]/GP3[3] A7 I/O IPD AXR0[4]/RMII_RXD[0]/AXR2[1]/GP3[4] B7 I/O IPD AXR0[11]/AXR2[0]/GP3[11] A5 I/O IPD
AHCLKX0/AHCLKX2/USB_REFCLKIN/GP2[11] B5 I/O IPD
AXR0[1]/RMII_TXD[1]/ACLKX2/GP3[1] C8 I/O IPD
AXR0[5]/RMII_RXD[1]/AFSX2/GP3[5] C7 I/O IPD
EMA_CLK/OBSCLK/AHCLKR2/GP1[15] R12 I/O IPU
AXR0[6]/RMII_RXER/ACLKR2/GP3[6] D7 I/O IPD
EMA_CS[3]/AMUTE2/GP2[6] T7 I/O IPU EMIFA, GPIO
No.
ZKB
(1)
PULL
(2)
MUXED DESCRIPTION
eHRPWM1 A, GPIO
eHRPWM1 B, GPIO
eHRPWM2 A, GPIO
eHRPWM2 B, GPIO
eQEP1, GPIO
eHRPWM0, McASP1 transmit GPIO master clock
eHRPWM0, McASP1 transmit GPIO bit clock
eHRPWM0, McASP1 transmit GPIO frame sync
eHRPWM0, eHRPWM1, McASP1 mute eHRPWM2, output GPIO
McASP0, McASP2 serial EMAC, GPIO data
McASP0, USB, McASP2 transmit GPIO master clock
McASP0, McASP2 transmit EMAC, GPIO bit clock
McASP0, McASP2 transmit EMAC, GPIO frame sync
EMIFA, GPIO, McASP2 receive OBSCLK master clock
McASP0, McASP2 receive EMAC, GPIO bit clock
McASP1 serial data
McASP1 receive master clock
McASP1 receive bit clock
McASP1 receive frame sync
McASP2 mute output
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3.6.16 Universal Serial Bus Modules (USB0, USB1)

Table 3-18. Universal Serial Bus (USB) Terminal Functions
PIN
SIGNAL NAME TYPE
USB0_DM G4 A NA USB0 PHY data minus USB0_DP F4 A NA USB0 PHY data plus USB0_VDDA33 H5 PWR NA USB0 PHY 3.3-V supply USB0_VDDA18 E3 PWR NA USB0 PHY 1.8-V supply input USB0_VDDA12 USB0_ID D2 A NA USB0 PHY identification (mini-A or mini-B plug) USB0_VBUS D3 A NA USB0 bus voltage USB0_DRVVBUS/GP4[15] E4 0 IPD GPIO USB0 controller VBUS control output.
AHCLKX0/AHCLKX2/USB_REFCLKIN/ GP2[11]
USB1_DM B3 A NA USB1 PHY data minus USB1_DP A3 A NA USB1 PHY data plus USB1_VDDA33 C1 PWR NA USB1 PHY 3.3-V supply USB1_VDDA18 C2 PWR NA USB1 PHY 1.8-V supply
AHCLKX0/AHCLKX2/USB_REFCLKIN/ GP2[11]
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral. (2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor (3) Core power supply LDO output for USB PHY. This pin must be connected via a 0.22 uF capacitor to VSS.
(3)
No.
ZKB
C3 PWR NA USB0 PHY 1.2-V LDO output for bypass cap
B5 I IPD USB_REFCLKIN. Optional clock input.
USB1 1.1 OHCI (USB1)
B5 I IPD NA USB_REFCLKIN. Optional clock input.
(1)
USB0 2.0 OTG (USB0)
PULL
(2)
MUXED DESCRIPTION
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