3 (EDMA3)• Two External Memory Interfaces:
– Two External Memory Interfaces– EMIFA
– Three Configurable 16550 type UART•NOR (8-Bit-Wide Data)
Modules
– Two Serial Peripheral Interfaces (SPI)
– Multimedia Card (MMC)/Secure Digital (SD)Space
Card Interface with Secure Data I/O (SDIO)
– Two Master/Slave Inter-Integrated Circuit
– USB 2.0 OTG Port With Integrated PHY
– Two Multichannel Audio Serial Ports
– 10/100 Mb/s Ethernet MAC (EMAC)
– One 64-Bit General-Purpose TimerUART0 only
– One 64-bit General-Purpose/Watchdog Timer• Two Serial Peripheral Interfaces (SPI) Each
– Three Enhanced Pulse Width Modulators
– Three 32-Bit Enhanced Capture Modules
• Applications
– Industrial Automation
– Home Automation
– Test and Measurement
– Portable Data Terminals
– Educational Consoles
– Power Protection Systems
• 375/456-MHz ARM926EJ-S™ RISC Core
– 32-Bit and 16-Bit (Thumb®) Instructions
– Single Cycle MAC
– ARM®Jazelle®Technology
– EmbeddedICE-RT™ for Real-Time Debug
• ARM9 Memory Architecture
– 16K-Byte Instruction Cache
– 16K-Byte Data Cache
– 8K-Byte RAM (Vector Table)
– 64K-Byte ROM
• Three Configurable 16550 type UART Modules:
– UART0 With Modem Control Signals
– 16-byte FIFO
– 16x or 13x Oversampling Option
– Autoflow control signals (CTS, RTS) on
With One Chip-Select
• Programmable Real-Time Unit Subsystem
(PRUSS)
– Two Independent Programmable Realtime
Unit (PRU) Cores
•32-Bit Load/Store RISC architecture
•4K Byte instruction RAM per core
•512 Bytes data RAM per core
•PRU Subsystem (PRUSS) can be disabled
via software to save power
– Standard power management mechanism
•Clock gating
•Entire subsystem under a single PSC
clock gating domain
– Dedicated interrupt controller
– Dedicated switched central resource
• Multimedia Card (MMC)/Secure Digital (SD)
Card Interface with Secure Data I/O (SDIO)
• Two Master/Slave Inter-Integrated Circuit (I2C
Bus™)
• USB 2.0 OTG Port With Integrated PHY (USB0)
– USB 2.0 Full-Speed Client
– USB 2.0 Full-/Low-Speed Host
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2ARM926EJ-S, EmbeddedICE-RT, ETM9, CoreSight are trademarks of ARM Limited.
3ARM, Jazelle are registered trademarks of ARM Limited.
ADVANCE INFORMATION concerns new products in the sampling
or preproduction phaseof development. Characteristic dataand other
specifications are subjectto change without notice.
– End Point 0 (Control)– 6 Single Edge, 6 Dual Edge Symmetric or 3
– End Points 1,2,3,4 (Control, Bulk, Interrupt or
Dual Edge Asymmetric Outputs
ISOC) Rx and Tx– Dead-Band Generation
• Two Multichannel Audio Serial Ports:– PWM Chopping by High-Frequency Carrier
– Six Clock Zones and 28 Serial Data Pins– Trip Zone Input
– Supports TDM, I2S, and Similar Formats• Three 32-Bit Enhanced Capture Modules
– FIFO buffers for Transmit and Receive
• 10/100 Mb/s Ethernet MAC (EMAC):
– IEEE 802.3 Compliant (3.3-V I/O Only)
– RMII Media Independent Interface
– Management Data I/O (MDIO) Module
• One 64-Bit General-Purpose Timer
(Configurable as Two 32-Bit Timers)
• One 64-bit General-Purpose/Watchdog Timer
(Configurable as Two 32-bit General-Purpose
Timers)
• Three Enhanced Pulse Width Modulators
(eHRPWM):
– Dedicated 16-Bit Time-Base Counter With
Period And Frequency Control
(eCAP):
– Configurable as 3 Capture Inputs or 3
Auxiliary Pulse Width Modulator (APWM)
outputs
– Single Shot Capture of up to Four Event
Time-Stamps
• Two 32-Bit Enhanced Quadrature Encoder
Pulse Modules (eQEP)
The device is a low-power ARM microprocessor based on an ARM926EJ-S™.
The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating
systems support, rich user interfaces, and high processing performance life through the maximum
flexibility of a fully integrated mixed processor solution.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and
processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and
memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory
Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and
16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core
also has a 8KB RAM (Vector Table) and 64KB ROM.
The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output
(MDIO) module; two inter-integrated circuit (I2C) Bus interfaces; 3 multichannel audio serial port (McASP)
with serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one configurable as
watchdog); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable
interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with RTS
and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced
capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width
modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals; and 2 external
memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower
memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
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The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and the
network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps
in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is
available for PHY configuration.
TheI2C, SPI, and USB2.0 ports allow the device to easily control peripheral devices and/or communicate
with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections later in this document
and the associated peripheral reference guides.
The device has a complete set of development tools for the ARM. These include C compilers and a
Windows™ debugger interface for visibility into source code execution.
This data manual revision history highlights the changes made to the SPRS657A device-specific data
manual to make it an SPRS657B revision.
Table 2-1. Revision History
ADDITIONS/MODIFICATIONS/DELETIONS
Global - Changed SPI td(SCSL_SPC)S min from P to 2P
Global - Replaced all "CLKIN" references with "OSCIN"
Global - Updated SPI Electrical parameters
Global - Document updated to indicate that the AM1705 does not support high-speed operation on USB0.
Figure 3-1 - Updated muxing on pins 116 and 118.
Added Section 5.3, Notes on Recommended Power-On Hours (POH).
Section 6.5- Updated "All pins are tri-stated with the exception of RESETOUT which remains active through the reset sequence" to " All
pins are tri-stated with the exception of RTCK/GP7[14]. If an emulator is driving TCK into the device during reset, then RTCK/GP7[14] will
drive out RTCK. If TCK is not being driven into the device during reset, then RTCK/GP7[14] will drive low."
The ARM926EJ-S RISC CPU is compatible with other ARM9 CPUs from ARM Holdings plc.
3.3ARM Subsystem
The ARM Subsystem includes the following features:
•ARM926EJ-S RISC processor
•ARMv5TEJ (32/16-bit) instruction set
•Little endian
•System Control Co-Processor 15 (CP15)
•MMU
•16KB Instruction cache
•16KB Data cache
•Write Buffer
•Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)
•ARM Interrupt controller
3.3.1ARM926EJ-S RISC CPU
The ARM Subsystem integrates the ARM926EJ-S processor. The ARM926EJ-S processor is a member of
ARM9 family of general-purpose microprocessors. This processor is targeted at multi-tasking applications
where full memory management, high performance, low die size, and low power are all important. The
ARM926EJ-S processor supports the 32-bit ARM and 16 bit THUMB instruction sets, enabling the user to
trade off between high performance and high code density. Specifically, the ARM926EJ-S processor
supports the ARMv5TEJ instruction set, which includes features for efficient execution of Java byte codes,
providing Java performance similar to Just in Time (JIT) Java interpreter, but without associated code
overhead.
SPRS657B–FEBRUARY 2010–REVISED OCTOBER 2010
The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both
hardware and software debug. The ARM926EJ-S processor has a Harvard architecture and provides a
complete high performance subsystem, including:
•ARM926EJ -S integer core
•CP15 system control coprocessor
•Memory Management Unit (MMU)
•Separate instruction and data caches
•Write buffer
•Separate instruction and data (internal RAM) interfaces
•Separate instruction and data AHB bus interfaces
•Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)
For more complete details on the ARM9, refer to the ARM926EJ-S Technical Reference Manual, available
at http://www.arm.com
3.3.2CP15
The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and
data caches, Memory Management Unit (MMU), and other ARM subsystem functions. The CP15 registers
are programmed using the MRC and MCR ARM instructions, when the ARM in a privileged mode such as
supervisor or system mode.
A single set of two level page tables stored in main memory is used to control the address translation,
permission checks and memory region attributes for both data and instruction accesses. The MMU uses a
single unified Translation Lookaside Buffer (TLB) to cache the information held in the page tables. The
MMU features are:
•Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme.
•Access permissions for large pages and small pages can be specified separately for each quarter of
the page (subpage permissions)
•Hardware page table walks
•Invalidate entire TLB, using CP15 register 8
•Invalidate TLB entry, selected by MVA, using CP15 register 8
•Lockdown of TLB entries, using CP15 register 10
3.3.4Caches and Write Buffer
The size of the Instruction cache is 16KB, Data cache is 16KB. Additionally, the caches have the following
features:
•Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA)
•Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with
two dirty bits in the Dcache
•Dcache supports write-through and write-back (or copy back) cache operation, selected by memory
region using the C and B bits in the MMU translation tables
•Critical-word first cache refilling
•Cache lockdown registers enable control over which cache ways are used for allocation on a line fill,
providing a mechanism for both lockdown, and controlling cache corruption
•Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG
RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the
TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the
possibility of TLB misses related to the write-back address.
•Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of
the Dcache or Icache, and regions of virtual memory.
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The write buffer is used for all writes to a noncachable bufferable region, write-through region and write
misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for
cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a
four-address buffer. The Dcache write-back has eight data word entries and a single address entry.
3.3.5Advanced High-Performance Bus (AHB)
The ARM Subsystem uses the AHB port of the ARM926EJ-S to connect the ARM to the Config bus and
the external memories. Arbiters are employed to arbitrate access to the separate D-AHB and I-AHB by the
Config Bus and the external memories bus.
3.3.6Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
To support real-time trace, the ARM926EJ-S processor provides an interface to enable connection of an
Embedded Trace Macrocell (ETM). The ARM926EJ-S Subsystem in the device also includes the
Embedded Trace Buffer (ETB). The ETM consists of two parts:
•Trace Port provides real-time trace capability for the ARM9.
•Triggering facilities provide trigger resources, which include address and data comparators, counter,
and sequencers.
The device trace port is not pinned out and is instead only connected to the Embedded Trace Buffer. The
ETB has a 4KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace
data.
This device uses ETM9™ version r2p2 and ETB version r0p1. Documentation on the ETM and ETB is
available from ARM Ltd. Reference the ' CoreSight™ ETM9™ Technical Reference Manual, revision r0p1'
and the 'ETM9 Technical Reference Manual, revision r2p2'.
3.3.7ARM Memory Mapping
By default the ARM has access to most on and off chip memory areas, EMIFA, EMIFB, and the additional
128K byte on chip SRAM. Likewise almost all of the on chip peripherals are accessible to the ARM by
default.
See Table 3-2 for a detailed top level device memory map that includes the ARM memory space.
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings.
Table 3-3 to Table 3-20 identify the external signal names, the associated pin/ball numbers along with the
mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any internal
pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a functional pin
description.
3.6.1Device Reset and JTAG
Table 3-3. Reset and JTAG Terminal Functions
SIGNAL NAMETYPE
RESET146IDevice reset input
TMS152IIPUJTAG test mode select
TDI153IIPUJTAG test data input
TDO156OIPDJTAG test data output
TCK155IIPUJTAG test clock
TRST150IIPDJTAG test reset
RTCK / GP7[14]157I/OIPDJTAG Test Clock Return Clock Output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
PLL0_VDDA141PWRPLL analog VDD(1.2-V filtered supply)
PLL0_VSSA142GNDPLL analog VSS(for filter)
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for
that particular peripheral.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
ACLKX0/ECAP0/APWM0/GP2[12]126I/OIPDMcASP0, GPIOinput or auxiliary
ACLKR0/ECAP1/APWM1/GP2[15]130I/OIPDMcASP0, GPIOinput or auxiliary
ACLKR1/ECAP2/APWM2/GP4[12]165I/OIPDMcASP1, GPIOinput or auxiliary
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
AXR1[8]/EPWM1A/GP4[8]168I/OIPD
AXR1[7]/EPWM1B/GP4[7]169I/OIPDeHRPWM1 B output
AMUTE1/EPWMTZ/GP4[14]132I/OIPDeHRPWM0, GPIO,
AXR1[6]/EPWM2A/GP4[6]170I/OIPD
AXR1[5]/EPWM2B/GP4[5]171I/OIPDeHRPWM2 B output
AMUTE1/EPWMTZ/GP4[14]132I/OIPDeHRPWM0, GPIO,
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(1) Boot decoding will be defined in the ROM datasheet.
(2) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
(3) As these signals are internally pulled down while the device is in reset, it is necessary to externally pull them high with resistors if
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8]2I/OIPUI2C0 serial data
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9]3I/OIPUI2C0 serial clock
SPI1_SIMO[0]/I2C1_SDA/GP5[6]/BOOT[6]14I/OIPUI2C1 serial data
SPI1_SOMI[0]/I2C1_SCL/GP5[5]/BOOT[5]13I/OIPUI2C1 serial clock
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
No external pins. The Timer1 peripheral pins are not pinned out as external pins.
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
Table 3-16. Universal Serial Bus (USB) Terminal Functions
SIGNAL NAMETYPE
USB0_DM138AUSB0 PHY data minus
USB0_DP137AUSB0 PHY data plus
USB0_VDDA33140PWRUSB0 PHY 3.3-V supply
USB0_VDDA18135PWRUSB0 PHY 1.8-V supply input
USB0_VDDA12
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
(3) Core power supply LDO output for USB PHY. This pin must be connected via a 0.22 uF capacitor to VSS.
(3)
PIN NO
PTP
USB0 2.0 OTG (USB0)
134PWRUSB0 PHY 1.2-V LDO output for bypass cap
(1)
PULL
(2)
DESCRIPTION
3.6.15 Ethernet Media Access Controller (EMAC)
Table 3-17. Ethernet Media Access Controller (EMAC) Terminal Functions
SIGNAL NAMETYPE
AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11]129I/OIPDMcASP0, GPIO, BOOTclock input or
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the the signal name
highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured
function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different
types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor
NO
PTP
(1)
PULL
(2)
MUXEDDESCRIPTION
EMIFA, GPIO
EMIFA, GPIOMMC/SD data
3.6.17 Reserved and No Connect
Table 3-19. Reserved and No Connect Terminal Functions
SIGNAL NAMETYPE
RSV2133PWR
RSV3149PWR
RSV4148IReserved. This pin may be tied high or low.
This device supports a variety of boot modes through an internal ROM bootloader. This device does not
support dedicated hardware boot modes; therefore, all boot modes utilize the internal ROM. The input
states of the BOOT pins are sampled and latched into the BOOTCFG register, which is part of the system
configuration (SYSCFG) module, when device reset is deasserted. Boot mode selection is determined by
the values of the BOOT pins
The following boot modes are supported:
•NAND Flash boot
– 8-bit NAND
•NOR Flash boot
– NOR Direct boot (8-bit or 16-bit)
– NOR Legacy boot (8-bit or 16-bit)
– NOR AIS boot (8-bit or 16-bit)