TEXAS INSTRUMENTS ADS8343 Technical data

ADS8343
AD
S8
343
SBAS183C – JANUARY 2001 – REVISED APRIL 2003
16-Bit, 4-Channel Serial Output Sampling
ANALOG-TO-DIGITAL CONVERTER

FEATURES

BIPOLAR INPUT RANGE
ADS7841 AND ADS8341
SINGLE SUPPLY: 2.7V to 5V
4-CHANNEL SINGLE-ENDED OR
2-CHANNEL DIFFERENTIAL INPUT
UP TO 100kHz CONVERSION RATE
86dB SINAD
SERIAL INTERFACE
SSOP-16 PACKAGE

APPLICATIONS

DATA ACQUISITION
TEST AND MEASUREMENT
INDUSTRIAL PROCESS CONTROL
PERSONAL DIGITAL ASSISTANTS
BATTERY-POWERED SYSTEMS

DESCRIPTION

The ADS8343 is a 4-channel, 16-bit sampling Analog-to­Digital (A/D) converter with a synchronous serial interface. Typical power dissipation is 8mW at a 100kHz throughput rate and a +5V supply. The reference voltage (V varied between 500mV and V input voltage range of ±V
/2, providing a corresponding
CC
. The device includes a shut-
REF
down mode which reduces power dissipation to under 15µW. The ADS8343 is ensured down to 2.7V operation.
Low power, high speed, and an onboard multiplexer make the ADS8343 ideal for battery-operated systems such as personal digital assistants, portable multi-channel data log­gers, and measurement equipment. The serial interface also provides low-cost isolation for remote data acquisition. The ADS8343 is available in an SSOP-16 package and is en­sured over the –40°C to +85°C temperature range.
REF
) can be
CH0 CH1 CH2 CH3
COM
V
REF
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Four
Channel
Multiplexer
CDAC
SAR
www.ti.com
Comparator
DCLK
CS
Serial
Interface
and
Control
Copyright © 2001-2003, Texas Instruments Incorporated
SHDN DIN DOUT BUSY

PACKAGE/ORDERING INFORMATION

MAXIMUM NO
INTEGRAL MISSING SPECIFIED
PRODUCT ERROR (LSB) ERROR (LSB) PACKAGE-LEAD DESIGNATOR
LINEARITY CODES PACKAGE TEMPERATURE ORDERING TRANSPORT
ADS8343E 8 14 SSOP-16 DBQ –40°C to +85°C ADS8343E Rails, 100
(1)
RANGE NUMBER MEDIA, QUANTITY
""""""ADS8343E/2K5 Tape and Reel, 2500
ADS8343EB 6 15 SSOP-16 DBQ –40°C to +85°C ADS8343EB Rails, 100
""""""ADS8343EB/2K5 Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

+V
to GND ........................................................................ –0.3V to +6V
CC
Analog Inputs to GND ............................................ –0.3V to +V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature................................................... +150°C
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.
(1)
+ 0.3V
CC
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru­ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada­tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PIN CONFIGURATIONS

Top View SSOP
+V
CH0 CH1 CH2 CH3
COM
SHDN
V
REF
1
CC
2 3 4 5 6 7 8
ADS8343
DCLK
16
CS
15
DIN
14
BUSY
13
DOUT
12
GND
11
GND
10
+V
9
CC

PIN DESCRIPTIONS

PIN NAME DESCRIPTION
1+V 2 CH0 Analog Input Channel 0 3 CH1 Analog Input Channel 1 4 CH2 Analog Input Channel 2 5 CH3 Analog Input Channel 3 6 COM Common reference for analog inputs. This pin is typically connected to V 7 8V
9+V 10 GND Ground 11 GND Ground 12 DOUT Serial Data Output. Data is shifted on the falling edge of DCLK. This output is high impedance when 13 BUSY Busy Output. This output is high impedance when 14 DIN Serial Data Input. If CS is LOW, data is latched on rising edge of DCLK. 15 16 DCLK External Clock Input. This clock runs the SAR conversion process and synchronizes serial data I/O. Maximum input clock frequency
CC
SHDN
REF
CC
CS
Power Supply, 2.7V to 5V
. Shutdown. When LOW, the device enters a very low power shutdown mode. Voltage Reference Input. See Electrical Characteristic Table for ranges. Power Supply, 2.7V to 5V
is HIGH.
CS
Chip Select Input. Controls conversion timing and enables the serial input/output register.
equals 2.4MHz to achieve 100kHz sampling rate.
REF
CS
is HIGH.
2
www.ti.com
ADS8343
SBAS183C

ELECTRICAL CHARACTERISTICS: +5V

At TA = –40°C to +85°C, +VCC = +5V, V
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS RESOLUTION 16 Bits
ANALOG INPUT
Full-Scale Input Span Positive Input-Negative Input –V Absolute Input Range Positive Input –0.2 +V
Capacitance 25 pF Leakage Current ±1 µA
SYSTEM PERFORMANCE
No Missing Codes 14 15 Bits Integral Linearity Error ±8 ±6LSB Bipolar Error ±2 ±1mV Bipolar Error Match 2.3 8.0 ✻✻LSB Gain Error ±0.05 ±0.024 % Gain Error Match 1.0 4.0 ✻✻ LSB Noise 20 µVrms Power-Supply Rejection +4.75V < V
SAMPLING DYNAMICS
Conversion Time 16 Clk Cycles Acquisition Time 4.5 Clk Cycles Throughput Rate 100 kHz Multiplexer Settling Time 500 ns Aperture Delay 30 ns Aperture Jitter 100 ps Internal Clock Frequency External Clock Frequency 0.024 2.4 ✻✻MHz
DYNAMIC CHARACTERISTICS
Total Harmonic Distortion
(2)
Signal-to-(Noise + Distortion) V Spurious-Free Dynamic Range V Channel-to-Channel Isolation V
REFERENCE INPUT
Range 0.5 +VCC/2 ✻✻V Resistance DCLK Static 5 G Input Current 40 100 ✻✻ µA
DIGITAL INPUT/OUTPUT
Logic Family CMOS Logic Levels
V
IH
V
IL
V
OH
V
OL
Data Format Binary Twos Complement
POWER-SUPPLY REQUIREMENTS
+V
CC
Quiescent Current 1.5 2.0 mA
Power Dissipation 7.5 10 mW
TEMPERATURE RANGE
Specified Performance –40 +85 ✻✻°C
= +2.5V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
ADS8343E ADS8343EB
REF
Negative Input –0.2 +V
< 5.25V 3 LSB
CC
SHDN
= V
DD
2.4 MHz
+V
REF
+ 0.2 ✻✻V
CC
+ 0.2 ✻✻V
CC
✻✻V
Data Transfer Only 0 2.4 ✻✻MHz
VIN = 5Vp-p at 10kHz –95 dB
= 5Vp-p at 10kHz 86 dB
IN
= 5Vp-p at 10kHz 97 dB
IN
= 5Vp-p at 50kHz 100 dB
IN
f
= 12.5kHz 2.5 µA
SAMPLE
DCLK Static 0.001 3 ✻✻ µA
| IIH | +5µA 3.0 5.5 ✻✻V | IIL | +5µA –0.3 +0.8 ✻✻V
IOH = –250µA 3.5 V
IOL = 250µA 0.4 V
Specified Performance 4.75 5.25 ✻✻V
f
= 10kHz 150 µA
SAMPLE
Power-Down Mode
(3, 4)
, CS = +V
CC
3 µA
(1)
(1)
Same specifications as ADS8343E. NOTES: (1) LSB means Least Significant Bit. With V
(PD1 = PD0 = 0) active or
= GND. (4) Power-down after conversion mode with external clock gated ‘HIGH’.
SHDN
ADS8343
SBAS183C
equal to +2.5V, one LSB is 76µV. (2) First nine harmonics of the test frequency. (3) Auto power-down mode
REF
www.ti.com
3

ELECTRICAL CHARACTERISTICS: +2.7V

At TA = –40°C to +85°C, +VCC = +2.7V, V
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS RESOLUTION 16 BITS
ANALOG INPUT
Full-Scale Input Span Positive Input-Negative Input –V Absolute Input Range Positive Input –0.2 +V
Capacitance 25 pF Leakage Current ±1 µA
SYSTEM PERFORMANCE
No Missing Codes 14 15 Bits Integral Linearity Error ±12 ±8LSB Bipolar Error ±1 ±0.5 mV Bipolar Error Match 1.2 4.0 ✻✻ LSB Gain Error ±0.05 ±0.0024 % of FSR Gain Error Match 1.0 4.0 ✻✻ LSB Noise 20 µVrms Power-Supply Rejection +2.7 < V
SAMPLING DYNAMICS
Conversion Time 16 Clk Cycles Acquisition Time 4.5 Clk Cycles Throughput Rate 100 kHz Multiplexer Settling Time 500 ns Aperture Delay 30 ns Aperture Jitter 100 ps Internal Clock Frequency External Clock Frequency 0.024 2.4 ✻✻MHz
DYNAMIC CHARACTERISTICS
Total Harmonic Distortion
(2)
Signal-to-(Noise + Distortion) V Spurious-Free Dynamic Range V Channel-to-Channel Isolation V
REFERENCE INPUT
Range 0.5 +VCC/2 ✻✻V Resistance DCLK Static 5 G Input Current 13 40 ✻✻ µA
DIGITAL INPUT/OUTPUT
Logic Family CMOS Logic Levels
V
IH
V
IL
V
OH
V
OL
Data Format Binary Twos Complement
POWER-SUPPLY REQUIREMENTS
+V
CC
Quiescent Current 1.2 1.85 ✻✻ mA
Power Dissipation 3.2 5 mW
TEMPERATURE RANGE
Specified Performance 40 +85 ✻✻°C
Same specifications as ADS8343E.
NOTES: (1) LSB means Least Significant Bit. With V (PD1 = PD0 = 0) active or
= GND. (4) Power-down after conversion mode with external clock gated ‘HIGH’.
SHDN
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
ADS8343E ADS8343EB
REF
Negative Input –0.2 +V
< +3.3V 3 LSB
CC
SHDN
= V
DD
2.4 MHz
+V
REF
+ 0.2 ✻✻V
CC
+ 0.2 ✻✻V
CC
✻✻V
When Used with Internal Clock 0.024 2.0 ✻✻MHz
Data Transfer Only 0 2.4 ✻✻MHz
VIN = 2.5Vp-p at 1kHz –94 dB
= 2.5Vp-p at 1kHz 81 dB
IN
= 2.5Vp-p at 1kHz 98 dB
IN
= 2.5Vp-p at 10kHz 100 dB
IN
f
= 12.5kHz 2.5 µA
SAMPLE
DCLK Static 0.001 3 ✻✻ µA
| I
| +5µA+V
IH
| I
| +5µA –0.3 +0.8 ✻✻V
IL
IOH = –250µA+V
IOL = 250µA 0.4 V
0.7 5.5 ✻✻V
CC
0.8 V
CC
Specified Performance 2.7 3.6 ✻✻V
f
= 10kHz 105 µA
SAMPLE
Power-Down Mode
(3, 4)
, CS = +V
equal to +1.25V, one LSB is 38µV. (2) First nine harmonics of the test frequency. (3) Auto power-down mode
REF
CC
3 µA
(1)
4
www.ti.com
ADS8343
SBAS183C

TYPICAL CHARACTERISTICS: +5V

0
20
40
60
80
100
120
140
FREQUENCY SPECTRUM
(4096 Point FFT; f
IN
= 9.985kHz, –0.2dB)
0502010 4030
Frequency (kHz)
Amplitude (dB)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
101 100
Frequency (kHz)
SFDR (dB)
110
100
90
80
70
60
THD (dB)
110
100
90
80
70
60
SFDR
THD
(1)
NOTE: (1) First nine harmonics of the input frequency.
Temperature (°C)
0.1
0
0.1
0.2
0.3
CHANGE IN SIGNAL-TO-(NOISE + DISTORTION)
vs TEMPERATURE
25 100–50 –25 0 50 75
Delta from 25°C (dB)
fIN = 4.956kHz, –0.2dB
At TA = +25°C, +VCC = +5V, V
0
20
40
60
80
Amplitude (dB)
100
120
140
100
(4096 Point FFT; f
0502010 4030
SIGNAL-TO-(NOISE + DISTORTION)
= +2.5V, f
REF
FREQUENCY SPECTRUM
SIGNAL-TO-NOISE RATIO AND
vs INPUT FREQUENCY
= 1.001kHz, –0.2dB)
IN
Frequency (kHz)
= 100kHz, and f
SAMPLE
CLK
= 24 • f
SAMPLE
= 2.4MHz, unless otherwise noted.
90
80
70
SNR and SINAD (dB)
60
15.0
14.5
14.0
13.5
13.0
12.5
12.0
Effective Number of Bits
11.5
11.0
ADS8343
SBAS183C
SNR
101 100
Frequency (kHz)
EFFECTIVE NUMBER OF BITS
vs INPUT FREQUENCY
101 100
Frequency (kHz)
SINAD
www.ti.com
5
TYPICAL CHARACTERISTICS: +5V (Cont.)
At TA = +25°C, +VCC = +5V, V
= +2.5V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
3
2
1
0
ILE (LSBs)
1
2
3
4
8000
1.6
1.5
1.4
INTEGRAL LINEARITY ERROR vs CODE
C000
H
H
0000
H
Output Code
SUPPLY CURRENT vs TEMPERATURE
4000
DIFFERENTIAL LINEARITY ERROR vs CODE
4
3
2
1
0
DLE (LSBs)
1
2
3
7FFF
H
H
8000
C000
H
H
0000
H
4000
H
7FFF
H
Output Code
CHANGE IN BPZ vs TEMPERATURE
1
0
1
2
1.3
Supply Current (mA)
1.2 –50 –25 0 25 50 75 100
Temperature (°C)
CHANGE IN GAIN vs TEMPERATURE
1.0
0.5
0
Delta from 25°C (LSBs)
0.5
50 25 0 25 50 75 100
Temperature (°C)
Delta from 25°C (LSBs)
3
4
50 25 0 25 50 75 100
Temperature (°C)
WORST-CASE CHANNEL-TO-CHANNEL
BPZ MATCH vs TEMPERATURE
4.5
4.0
3.5
BPZ Match (LSBs)
3.0 –50 –25 0 25 50 75 100
Temperature (°C)
6
www.ti.com
ADS8343
SBAS183C
TYPICAL CHARACTERISTICS: +5V (Cont.)
0
20
40
60
80
100
120
140
FREQUENCY SPECTRUM
(4096 Point FFT; f
IN
= 9.985kHz, –0.2dB)
0502010 4030
Frequency (kHz)
Amplitude (dB)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
101 100
Frequency (kHz)
SFDR (dB)
100
90
80
70
60
500
THD (dB)
100
90
80
70
60
50
SFDR
THD
(1)
NOTE: (1) First nine harmonics of the input frequency.
At TA = +25°C, +VCC = +5V, V
WORST CASE CHANNEL-TO-CHANNEL
GAIN MATCH vs TEMPERATURE
0.4
= +2.5V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
100
COMMON-MODE REJECTION vs FREQUENCY
0.3
0.2
0.1
Gain Match (LSBs)
0
0.1
50 25 0 25 50 75 100
Temperature (°C)

TYPICAL CHARACTERISTICS: +2.7V

At TA = +25°C, +VCC = +2.7V, V
(4096 Point FFT; f
0
20
40
= +1.25V, f
REF
FREQUENCY SPECTRUM
IN
SAMPLE
= 1.001kHz, –0.2dB)
= 100kHz, and f
CLK
= 24 • f
SAMPLE
90
80
70
CMRR (dB)
60
VCM = 2Vp-p Sinewave Centered Around V
50
= 2.4MHz, unless otherwise noted.
REF
1 10 1000.1
Frequency (kHz)
60
80
Amplitude (dB)
100
120
140
0502010 4030
95
85
SNR and SINAD (dB)
75
65
55
ADS8343
SBAS183C
Frequency (kHz)
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-(NOISE + DISTORTION)
vs INPUT FREQUENCY
SNR
SINAD
Frequency (kHz)
101 100
www.ti.com
7
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
Effective Number of Bits
10.0
9.5
9.0
INTEGRAL LINEARITY ERROR vs CODE
3
2
1
0
ILE (LSBs)
1
2
EFFECTIVE NUMBER OF BITS
vs INPUT FREQUENCY
101 100
Frequency (kHz)
0.4
0.2
0
0.2
0.4
Delta from 25°C (dB)
0.6
0.8
4
3
2
1
0
DLE (LSBs)
1
2
CHANGE IN SIGNAL-TO-(NOISE + DISTORTION)
vs TEMPERATURE
fIN = 4.956kHz, –0.2dB
25 100–50 –25 0 50 75
Temperature (°C)
DIFFERENTIAL LINEARITY ERROR vs CODE
–3
8000
C000
H
H
0000
H
4000
H
Output Code
SUPPLY CURRENT vs TEMPERATURE
1.2
1.1
1.0
Supply Current (mA)
0.9 –50 –25 0 25 50 75 100
Temperature (°C)
7FFF
–3
H
8000
C000
H
H
0000
H
4000
H
7FFF
H
Output Code
CHANGE IN BPZ vs TEMPERATURE
1.0
0.5
0
–0.5
Delta from 25°C (LSBs)
1.0
50 25 0 25 50 75 100
Temperature (°C)
8
www.ti.com
ADS8343
SBAS183C
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
WORST-CASE CHANNEL-TO-CHANNEL
BPZ MATCH vs TEMPERATURE
–50 –25 0 25 50 75 100
Temperature (°C)
BPZ Match (LSBs)
1.5
1.0
0.5
0
+VSS (V)
1.4
1.3
1.2
1.1
1.0
SUPPLY CURRENT vs +V
SS
3.5 5.02.5 3.0 4.0 4.5
Supply Current (mA)
f
SAMPLE
= 100kHz
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
0.5
CHANGE IN GAIN vs TEMPERATURE
0
–0.5
Delta from 25°C (LSBs)
1.0
50 25 0 25 50 75 100
Temperature (°C)
WORST-CASE CHANNEL-TO-CHANNEL
GAIN MATCH vs TEMPERATURE
0.16
0.15
0.14
80
COMMON-MODE REJECTION vs FREQUENCY
70
60
Gain Match (LSBs)
0.13
0.12 –50 –25 0 25 50 75 100
POWER-DOWN SUPPLY CURRENT
140
External Clock Disabled
120
100
80
60
40
Supply Current (mA)
20
0
–50 –25 0 25 50 75 100
Temperature (°C)
vs TEMPERATURE
Temperature (°C)
CMRR (dB)
50
40
VCM = 1Vp-p Sinewave Centered Around V
REF
1 10 1000.1
Frequency (kHz)
ADS8343
SBAS183C
www.ti.com
9
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
1.4
1.2
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
SUPPLY CURRENT vs SAMPLING FREQUENCY
f
= 2.4MHz
CLK
1.0
0.8
0.6
0.4
Supply Current (mA)
0.2
0
Power-Down After Conversion Mode. External Clock Gated HIGH After Conversion.
10 20 30 40 50 60 70 80 90 100
Sampling Frequency (kHz)

THEORY OF OPERATION

The ADS8343 is a classic Successive Approximation Register (SAR) A/D converter. The architecture is based on capacitive redistribution which inherently includes a sample-and-hold func­tion. The converter is fabricated on a 0.6µm CMOS process.
The basic operation of the ADS8343 is shown in Figure 1. The device requires an external reference and an external clock. It operates from a single supply of 2.7V to 5.25V. The external reference can be any voltage between 500mV and +V
/2. The value of the reference voltage directly sets the
CC
input range of the converter. The average reference input current depends on the conversion rate of the ADS8343.
VSS = 5.0V
VSS = 2.7V
The analog input to the converter is differential and is provided via a 4-channel multiplexer. The input can be provided in reference to a voltage on the COM pin (which is generally V
) or differentially by using two of the four input
REF
channels (CH0-CH3). The particular configuration is select­able via the digital interface.

ANALOG INPUT

The analog input is bipolar and fully differential. There are two general methods of driving the analog input of the ADS8343: single-ended or differential, as shown in Figure 2.
1µF
+
to 10µF
Single-ended
or differential
analog inputs.
V
REF
+2.7V to +5V
0.1µF
1µF
ADS8343
1
+V
CC
2
CH0
3
CH1
4
CH2
5
CH3
6
COM
7
SHDN
8
V
REF
DCLK
CS
DIN
BUSY
DOUT
GND GND
+V
16 15 14 13 12 11 10
9
CC
FIGURE 1. Basic Operation of the ADS8343.
Serial/Conversion Clock
Chip Select Serial Data In
Serial Data Out
(1)
±V
REF
Common-Mode
Voltage
(typically V
Common-Mode
NOTE: (1) Relative to common-mode voltage.
Voltage
REF
)
Single-Ended Input
(1)
V
REF
±
2
(1)
V
REF
±
2
Differential Input
CHX
ADS8343
COM
CHX+
ADS8343
CHX–
FIGURE 2. Methods of Driving the ADS8343Single-Ended
or Differential.
10
www.ti.com
ADS8343
SBAS183C
When the input is single-ended, the COM input is held at a fixed voltage. The CHX input swings around the same voltage and the peak-to-peak amplitude is 2 • V value of V
determines the range over which the common
REF
REF
. The
voltage may vary, as shown in Figure 3.
5
4.9
4
3
2
1
Common Voltage Range (V)
0.1
0
–1
0.5 1.0 1.5 2.0 2.5
Single-Ended Input
V
REF
(V)
FIGURE 3. Single-Ended InputCommon Voltage Range vs V
= 5V
V
CC
2.8
2.1
REF
When the input is differential, the amplitude of the input is the difference between the CHX and COM input. A voltage or signal is common to both of these inputs. The peak-to-peak amplitude of each input is V
about this common voltage.
REF
However, since the inputs are 180° out-of-phase, the peak­to-peak amplitude of the difference voltage is 2 • V value of V
also determines the range of the voltage that
REF
REF
. The
may be common to both inputs, as shown in Figure 4.
5.2
5
4
= 5V
V
CC
4.2
In each case, care should be taken to ensure that the output impedance of the sources driving the CHX and COM inputs are matched. If this is not observed, the two inputs could have different settling times. This may result in offset error, gain error, and linearity error which change with both tem­perature and input voltage. If the impedance cannot be matched, the errors can be lessened by giving the ADS8343 additional acquisition time.
The input current on the analog inputs depends on a number of factors: sample rate, input voltage, and source impedance. Essentially, the current into the ADS8343 charges the inter­nal capacitor array during the sample period. After this capacitance has been fully charged, there is no further input current.
Care must be taken regarding the absolute analog input voltage. Outside of these ranges, the converters linearity may not meet specifications. Please refer to the electrical characteristics table for min/max ratings.

REFERENCE INPUT

The external reference sets the analog input range. The ADS8343 will operate with a reference in the range of 500mV to +V ence between the CHX input and the COM input, as shown
.
in Figure 5. For example, in the single-ended mode, with V (CH0-CH3) will properly digitize a signal in the range of 0V to
2.50V relative to GND. If the COM pin is connected to 2.0V, the input range on the selected channel is 0.75V to 3.25V.
/2. Keep in mind that the analog input is the differ-
CC
and COM pin set to 1.25V, the selected input channel
REF
A2-A0
(Shown 001
CH0
CH1 CH2 CH3
)
B
+IN
IN
Converter
3
2
1
Common Voltage Range (V)
0.2
0
0.0 1.0 1.5 2.0 2.5
Differential Input
0.8
V
(V)
REF
FIGURE 4. Differential InputCommon Voltage Range vs V
ADS8343
SBAS183C
REF.
www.ti.com
COM
SGL/DIF
(Shown HIGH)
FIGURE 5. Simplified Diagram of the Analog Input.
There are several critical items concerning the reference input and its wide voltage range. As the reference voltage is reduced, the analog voltage weight of each digital output code is also reduced. This is often referred to as the LSB (Least Significant Bit) size and is equal to the reference voltage divided by 65,536. Any offset or gain error inherent in the A/D converter will appear to increase, in terms of LSB
11
size, as the reference voltage is reduced. For example, if the offset of a given converter is 2LSBs with a 2.5V reference, then it will typically be 10LSBs with a 0.5V reference. In each case, the actual offset of the device is the same, 76µV.
The noise or uncertainty of the digitized output will increase with lower LSB size. With a reference voltage of 500mV, the LSB size is 7.6µV. This level is below the internal noise of the device. As a result, the digital output code will not be stable and vary around a mean value by a number of LSBs. The distribution of output codes will be gaussian and the noise can be reduced by simply averaging consecutive conversion results or applying a digital filter.
With a lower reference voltage, care should be taken to provide a clean layout including adequate bypassing, a clean (low-noise, low-ripple) power supply, a low-noise reference, and a low-noise input signal. Because the LSB size is lower, the converter will also be more sensitive to nearby digital signals and electromagnetic interference.
The voltage into the V
input is not buffered and directly
REF
drives the Capacitor Digital-to-Analog Converter (CDAC) portion of the ADS8343. Typically, the input current is 13µA with a 2.5V reference. This value will vary by microamps depending on the result of the conversion. The reference current diminishes directly with both conversion rate and reference voltage. As the current from the reference is drawn on each bit decision, clocking the converter more quickly during a given conversion period will not reduce overall current drain from the reference.
converter enters the conversion mode. At this point, the input sample-and-hold goes into the hold mode. The next 16 clock cycles accomplish the actual A/D conversion.

Control Byte

Also shown in Figure 6 is the placement and order of the control bits within the control byte. Tables I and II give detailed information about these bits. The first bit, the ‘S’ bit, must always be HIGH and indicates the start of the control byte. The ADS8343 will ignore inputs on the DIN pin until the start bit is detected. The next three bits (A2-A0) select the active input channel or channels of the input multiplexer, as shown in Tables III and IV and Figure 5.
Bit 7 Bit 0
(MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 (LSB)
S A2A1A0
SGL/DIF
TABLE I. Order of the Control Bits in the Control Byte.
BIT NAME DESCRIPTION
7 S Start Bit. Control byte starts with first HIGH bit on
6-4 A2-A0 Channel Select Bits. Along with the
2
SGL/DIF
1-0 PD1-PD0 Power-Down Mode Select Bits. See Table V for
DIN.
these bits control the setting of the multiplexer input. Single-Ended/Differential Select Bit. Along with bits
A2-A0, this bit controls the setting of the multiplexer input.
details.
PD1 PD0
bit,
SGL/DIF

DIGITAL INTERFACE

Figure 6 shows the typical operation of the ADS8343s digital interface. This diagram assumes that the source of the digital signals is a microcontroller or digital signal processor with a basic serial interface (note that the digital inputs are over­voltage tolerant up to 5.5V, regardless of +V munication between the processor and the converter con­sists of eight clock cycles. One complete conversion can be accomplished with three serial communications, for a total of 24 clock cycles on the DCLK input.
The first eight cycles are used to provide the control byte via the DIN pin. When the converter has enough information about the following conversion to set the input multiplexer appropriately, it enters the acquisition (sample) mode. After three more clock cycles, the control byte is complete and the
CS
t
ACQ
81
AcquireIdle Conversion
SGL/
PD1 PD0
DIF
DIN
BUSY
(START)
1DCLK
A2S
A1 A0
). Each com-
CC
TABLE II. Descriptions of the Control Bits within the Control Byte.
A2 A1 A0 CH0 CH1 CH2 CH3 COM
001+IN –IN 101 +IN –IN 010 +IN –IN 110 +IN–IN
TABLE III. Single-Ended Channel Selection (SGL/DIF HIGH).
A2 A1 A0 CH0 CH1 CH2 CH3 COM
001+IN–IN 101–IN +IN 010 +IN–IN 110 –IN +IN
TABLE IV. Differential Channel Control (SGL/DIF LOW).
81 8
181
AcquireIdle Conversion
SGL/
A2SA1A0
(START)
DIF
PD1 PD0
DOUT
14131211109 8 7654321 0 Zero Filled...
15
(MSB)
(LSB)
15
(MSB)
14
FIGURE 6. Conversion Timing, 24-Clocks per Conversion, 8-Bit Bus Interface. No DCLK delay required with dedicated serial port.
12
www.ti.com
ADS8343
SBAS183C
The SGL/DIF
bit controls the multiplexer input mode: either single-ended (HIGH) or differential (LOW). In single-ended mode, the selected input channel is referenced to the COM pin. In differential mode, the two selected inputs provide a differential input. See Tables III and IV and Figure 5 for more information. The last two bits (PD1-PD0) select the power­down mode as shown in Table V. If both inputs are HIGH, the device is always powered up. If both inputs are LOW, the device enters a power-down mode between conversions. When a new conversion is initiated, the device will resume normal operation instantlyno delay is needed to allow the device to power up and the very first conversion will be valid.
PD1 PD0 DESCRIPTION
0 0 Power-down between conversions. When each
1 0 Selects internal clock mode. 0 1 Reserved for future use. 1 1 No power-down between conversions, device al-
conversion is finished, the converter enters a low­power mode. At the start of the next conversion, the device instantly powers up to full power. There is no need for additional delays to assure full operation and the very first conversion is valid.
ways powered. Selects external clock mode.
TABLE V. Power-Down Selection.

Clock Modes

The ADS8343 can be used with an external serial clock or an internal clock to perform the successive-approximation con­version. In both clock modes, the external clock shifts data in and out of the device. Internal clock mode is selected when PD1 is HIGH and PD0 is LOW.
If the user decides to switch from one clock mode to the other, an extra conversion cycle will be required before the
ADS8343 can switch to the new mode. The extra cycle is required because the PD0 and PD1 control bits need to be written to the ADS8343 prior to the change in clock modes.
When power is first applied to the ADS8343, the user must set the desired clock mode. It can be set by writing PD1 = 1 and PD0 = 0 for internal clock mode or PD1 = 1 and PD0 = 1 for external clock mode. After enabling the required clock mode, only then should the ADS8343 be set to power-down between conversions (i.e., PD1 = PD0 = 0). The ADS8343 maintains the clock mode it was in prior to entering the power-down modes.

External Clock Mode

In external clock mode, the external clock not only shifts data in and out of the ADS8343, it also controls the A/D conver­sion steps. BUSY will go HIGH for one clock period after the last bit of the control byte is shifted in. Successive-approxi­mation bit decisions are made and appear at DOUT on each of the next 16 DCLK falling edges, see Figure 6. Figure 7 shows the BUSY timing in external clock mode.
Since one clock cycle of the serial clock is consumed with BUSY going HIGH (while the MSB decision is being made), 16 additional clocks must be given to clock out all 16 bits of data; thus, one conversion takes a minimum of 25 clock cycles to fully read the data. Since most microprocessors communicate in 8-bit transfers, this means that an additional transfer must be made to capture the LSB.
There are two ways of handling this requirement. One is presented in Figure 6, where the beginning of the next control byte appears at the same time the LSB is being clocked out of the ADS8343. This method allows for maxi­mum throughput and 24 clock cycles per conversion.
CS
t
CH
t
DS
DCLK
DIN
BUSY
t
CSS
t
DV
t
BDV
FIGURE 7. Detailed Timing Diagram.
ADS8343
SBAS183C
t
CL
t
BD
t
DH
PD0
t
BD
15DOUT
t
D0
14
www.ti.com
t
t
CSH
BTR
t
TR
13
The other method is shown in Figure 8, which uses 32 clock cycles per conversion; the last seven clock cycles simply shift out zeros on the DOUT line. BUSY and DOUT go into a high-impedance state when CS
falling edge, BUSY will go LOW.
CS
goes HIGH; after the next

Internal Clock Mode

In internal clock mode, the ADS8343 generates its own conversion clock internally. This relieves the microprocessor from having to generate the SAR conversion clock and allows the conversion result to be read back at the processor’s convenience, at any clock rate from 0MHz to 2.0MHz. BUSY goes LOW at the start of conversion and then returns HIGH when the conversion is complete. During the conversion, BUSY will remain LOW for a maximum of 8µs. Also, during the conversion, DCLK should remain LOW to achieve the best noise performance. The conversion result is stored in an internal register; the data may be clocked out of this register any time after the conversion is complete.
If
CS
is LOW when BUSY goes LOW following a conversion, the next falling edge of the external serial clock will write out the MSB on the DOUT line. The remaining bits (D14-D0) will be clocked out on each successive clock cycle following the MSB. If line will remain in tri-state until Figure 9. sion has started. Note that BUSY is not tri-stated when
CS
is HIGH when BUSY goes LOW then the DOUT
CS
goes LOW, as shown in
CS
does not need to remain LOW once a conver-
CS
goes HIGH in internal clock mode. Data can be shifted in and out of the ADS8343 at clock rates
exceeding 2.4MHz, provided that the minimum acquisition time t
, is kept above 1.7µs.
ACQ

Digital Timing

Figure 4 and Tables VI and VII provide detailed timing for the digital interface of the ADS8343.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
t
t
t t
ACQ
t
DS
t
DH
t
DO
t
DV
t
TR CSS CSH
t
CH
t
CL
t
BD BDV
BTR
Acquisition Time 1.5 µs
DIN Valid Prior to DCLK Rising 100 ns
DIN Hold After DCLK HIGH 10 ns
DCLK Falling to DOUT Valid 200 ns
Falling to DOUT Enabled 200 ns
CS
Rising to DOUT Disabled 200 ns
CS
CS
Falling to First DCLK Rising 100 ns
Rising to DCLK Ignored 0 ns
CS
DCLK HIGH 200 ns
DCLK LOW 200 ns
DCLK Falling to BUSY Rising 200 ns
Falling to BUSY Enabled 200 ns
CS
CS
Rising to BUSY Disabled 200 ns
TABLE VI. Timing Specifications (+VCC = +2.7V to 3.6V,
T
= –40°C to +85°C, C
A
LOAD
= 50pF).
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
t
t
t t
ACQ
t
DS
t
DH
t
DO
t
DV
t
TR CSS CSH
t
CH
t
CL
t
BD BDV
BTR
Acquisition Time 1.7 µs
DIN Valid Prior to DCLK Rising 50 ns
DIN Hold After DCLK HIGH 10 ns
DCLK Falling to DOUT Valid 100 ns
CS
Falling to DOUT Enabled 70 ns Rising to DOUT Disabled 70 ns
CS
Falling to First DCLK Rising 50 ns
CS
CS
Rising to DCLK Ignored 0 ns
DCLK HIGH 150 ns
DCLK LOW 150 ns
DCLK Falling to BUSY Rising 100 ns
Falling to BUSY Enabled 70 ns
CS
Rising to BUSY Disabled 70 ns
CS
TABLE VII. Timing Specifications (+VCC = +4.75V to +5.25V,
T
= –40°C to +85°C, C
A
LOAD
= 50pF).
CS
t
DCLK
DIN
BUSY
DOUT
(START)
1
A1 A0
A2S
ACQ
81
AcquireIdle Conversion
SGL/
PD1 PD0
DIF
15
14131211109 8 7654321 0
(MSB)
FIGURE 8. External Clock Mode 32 Clocks Per Conversion.
CS
t
DCLK
DIN
BUSY
DOUT
(START)
1
A1 A0
A2S
ACQ
8
AcquireIdle Conversion
SGL/
PD1 PD0
DIF
9 1011121314151617181920212223242526272829303132
14131211109 8 7654321 0 Zero Filled...
15
(MSB)
FIGURE 9. Internal Clock Mode Timing.
81 8
(LSB)
18
Idle
Zero Filled...
(LSB)
14
www.ti.com
ADS8343
SBAS183C

DATA FORMAT

10k 100k1k 1M
f
SAMPLE
(Hz)
Supply Current (µA)
100
10
1
1000
f
CLK
= 2.4MHz
f
CLK
= 24 f
SAMPLE
TA = 25°C +V
CC
= +2.7V
V
REF
= +2.5V
PD1 = PD0 = 0
10k 100k1k 1M
f
SAMPLE
(Hz)
Supply Current (µA)
0.00
0.09
14
0
2
4
6
8
10
12
CS LOW
(GND)
CS HIGH (+V
CC
)
T
A
= 25°C
+V
CC
= +2.7V
V
REF
= +2.5V
f
CLK
= 24 f
SAMPLE
PD1 = PD0 = 0
The output data from the ADS8343 is in Binary Two’s Complement format, as shown in Table VIII. This table represents the ideal output code for the given input voltage and does not include the effects of offset, gain, or noise.
DESCRIPTION ANALOG VALUE
Full-Scale Range 2 • V Least Significant 2 • V
Bit (LSB) BINARY CODE HEX CODE +Full-Scale +V
Midscale 0V 0000 0000 0000 0000 0000 Midscale – 1LSB 0V – 1LSB 1111 1111 1111 1111 FFFF –Full-Scale –V
REF
/65536
REF
– 1LSB 0111 1111 1111 1111 7FFF
REF
REF
DIGITAL OUTPUT
BINARY TWOS COMPLEMENT
1000 0000 0000 0000 8000
TABLE VIII. Ideal Input Voltages and Output Codes.

POWER DISSIPATION

There are three power modes for the ADS8343: full-power (PD1 = PD0 = 1 shutdown ( depending on how the ADS8343 is being operated. For example, at full conversion rate and 24-clocks per conver­sion, there is very little difference between full-power mode and auto power-down, a shutdown ( lower power dissipation.
When operating at full-speed and 24 clocks per conversion (see Figure 6), the ADS8343 spends most of its time acquir­ing or converting. There is little time for auto power-down, assuming that this mode is active. Thus, the difference between full-power mode and auto power-down is negligible. If the conversion rate is decreased by simply slowing the frequency of the DCLK input, the two modes remain approxi­mately equal. However, if the DCLK frequency is kept at the maximum rate during a conversion, but conversion are sim­ply done less often, then the difference between the two modes is dramatic. Figure 10 shows the difference between reducing the DCLK frequency (scaling DCLK to match the conversion rate) or maintaining DCLK at the highest fre­quency and reducing the number of conversion per second. In the later case, the converter spends an increasing per­centage of its time in power-down mode (assuming the auto power-down mode is active).
), auto power-down (PD1 = PD0 = 0B), and
B
SHDN
LOW). The affects of these modes varies
SHDN
LOW) will not
If DCLK is active and CS is LOW while the ADS8343 is in auto power-down mode, the device will continue to dissipate some power in the digital logic. The power can be reduced to a minimum by keeping
CS
HIGH. The differences in
supply current for these two cases are shown in Figure 11. Operating the ADS8343 in auto power-down mode will result
in the lowest power dissipation, and there is no conversion time penalty on power-up. The very first conversion will be valid.
SHDN
can be used to force an immediate power-down.
FIGURE 10. Supply Current versus Directly Scaling the Fre-
quency of DCLK with Sample Rate or Keeping DCLK at the Maximum Possible Frequency.
FIGURE 11. Supply Current vs State of CS.
ADS8343
SBAS183C
www.ti.com
15

NOISE

The noise floor of the ADS8343 itself is extremely low, as can be seen from Figures 12 and 13, and is much lower than competing A/D converters. The ADS8343 was tested at both 5V and 2.7V and in both the internal and external clock modes. A low-level DC input was applied to the analog input pins and the converter was put through 5000 conversions. The digital output of the A/D converter will vary in output code due to the internal noise of the ADS8343. This is true for all 16-bit, SAR-type, A/D converters. Using a histogram to plot the output codes, the distribution should appear bell-shaped with the peak of the bell curve representing the nominal code for the input value. The ±1σ, ±2σ, and ±3σ distributions will represent the 68.3%, 95.5%, and 99.7%, respectively, of all codes. The transition noise can be calculated by dividing the number of codes measured by 6 and this will yield the ±3σ distribution or 99.7% of all codes. Statistically, up to 3 codes could fall outside the distribution when executing 1000 con­versions. The ADS8343, with < 3 output codes for the ±3σ distribution, will yield a < ±0.5LSB transition noise at 5V operation. Remember, to achieve this low noise perfor­mance, the peak-to-peak noise of the input signal and reference must be < 50µV.
3295
774
95
FFFEHFFFFH0000H0001H0002
Code
FIGURE 12. Histogram of 5000 Conversions of a DC Input at the
Code Transition, 5V Operation External Clock Mode.
2387
694
411
38 38
87
FFFE
FFFD
FFFC
H
FFFFH0000H0001H0002H0003H0004
H
H
Code
FIGURE 13. Histogram of 5000 Conversions of a DC Input at the
Code Center, 2.7V Operation Internal Clock Mode.
705
131
H
905
512
H

AVERAGING

The noise of the A/D converter can be compensated by averaging the digital codes. By averaging conversion results, transition noise will be reduced by a factor of 1/
n
, where n is the number of averages. For example, averaging 4 conver­sion results will reduce the transition noise by 1/2 to ±0.25LSBs. Averaging should only be used for input signals with frequencies near DC.
For AC signals, a digital filter can be used to low-pass filter and decimate the output codes. This works in a similar manner to averaging; for every decimation by 2, the signal­to-noise ratio will improve 3dB.

LAYOUT

For optimum performance, care should be taken with the physical layout of the ADS8343 circuitry. This is particularly true if the reference voltage is low and/or the conversion rate is high.
The basic SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections, and digital inputs that occur just prior to latching the output of the analog comparator. Thus, during any single conversion for an n­bit SAR converter, there are n windows in which large external transient voltages can easily affect the conversion result. Such glitches might originate from switching power supplies, nearby digital logic, and high-power devices. The degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external event. The error can change if the external event changes in time with respect to the DCLK input.
With this in mind, power to the ADS8343 should be clean and well bypassed. A 0.1µF ceramic bypass capacitor should be placed as close to the device as possible. In addition, a 1µF to 10µF capacitor and a 5 or 10 series resistor may be used to low-pass filter a noisy supply.
The reference should be similarly bypassed with a 1µF capacitor. Again, a series resistor and large capacitor can be used to low-pass filter the reference voltage. If the reference voltage originates from an op amp, make sure that it can drive the bypass capacitor without oscillation (the series resistor can help in this case). The ADS8343 draws very little current from the reference on average, but it does place larger demands on the reference circuitry over short periods of time (on each rising edge of DCLK during a conversion).
The ADS8343 architecture offers no inherent rejection of noise or voltage variation in regards to the reference input. This is of particular concern when the reference input is tied to the power supply. Any noise and ripple from the supply will appear directly in the digital results. While high-frequency noise can be filtered out as discussed in the previous paragraph, voltage variation due to line frequency (50Hz or 60Hz) can be difficult to remove.
The GND pin should be connected to a clean ground point. In many cases, this will be the analog ground. Avoid connec­tions which are too near the grounding point of a microcontroller or digital signal processor. If needed, run a ground trace directly from the converter to the power-supply entry point. The ideal layout will include an analog ground plane dedicated to the converter and associated analog circuitry.
16
www.ti.com
ADS8343
SBAS183C

PACKAGE DRAWING

DBQ (R-PDSO-G**) PLASTIC SMALL-OUTLINE

Gage Plane
0.008 (0,20) NOM
0.010 (0,25)
0.016 (0,40)
0.035 (0,89)
2420
Seating Plane
(8,74)
(8,56)
0.3370.337
(8,56)
(8,74)
0.344 0.344
4073301/E 10/00
13
0.150 (3,81)
0.157 (3,99)
0.012 (0,30)
0.008 (0,20)
12
A
24 PINS SHOWN
1
24
16
DIM
PINS **
A MIN
A MAX
0.004 (0,10)
0.010 (0,25)
0.069 (1,75) MAX
0.244 (6,20)
0.228 (5,80)
0.197
(5,00)
(4,78)
0.188
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,64)
0°–8°
28
(10,01)
(9,80)
0.386
0.394
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-137
ADS8343
SBAS183C
www.ti.com
17
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device Status
ADS8343E ACTIVE SSOP/
ADS8343E/2K5 ACTIVE SSOP/
ADS8343E/2K5G4 ACTIVE SSOP/
ADS8343EB ACTIVE SSOP/
ADS8343EB/2K5 ACTIVE SSOP/
ADS8343EB/2K5G4 ACTIVE SSOP/
ADS8343EBG4 ACTIVE SSOP/
ADS8343EG4 ACTIVE SSOP/
(1)
The marketingstatus valuesare definedas follows:
(1)
Package
Type
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
Package Drawing
Pins Package
Qty
Eco Plan
DBQ 16 100 Green (RoHS &
no Sb/Br)
DBQ 16 2500 Green (RoHS&
no Sb/Br)
DBQ 16 2500 Green (RoHS&
no Sb/Br)
DBQ 16 100 Green (RoHS &
no Sb/Br)
DBQ 16 2500 Green (RoHS&
no Sb/Br)
DBQ 16 2500 Green (RoHS&
no Sb/Br)
DBQ 16 100 Green (RoHS &
no Sb/Br)
DBQ 16 100 Green (RoHS &
no Sb/Br)
ACTIVE: Productdevice recommendedfor newdesigns. LIFEBUY: TIhas announcedthat thedevice willbe discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a newdesign.
PREVIEW: Devicehas beenannounced butis notin production. Samples may or may not be available. OBSOLETE: TIhas discontinuedthe productionof thedevice.
(2)
Lead/Ball Finish MSL PeakTemp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent forthe latestavailability informationand additionalproduct content details.
TBD: ThePb-Free/Green conversionplan hasnot beendefined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at hightemperatures, TIPb-Free productsare suitablefor use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) asdefined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Bror Sbdo notexceed 0.1%by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information maynot beavailable forrelease.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customeron anannual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
Loading...