The ADS8343 is a 4-channel, 16-bit sampling Analog-toDigital (A/D) converter with a synchronous serial interface.
Typical power dissipation is 8mW at a 100kHz throughput
rate and a +5V supply. The reference voltage (V
varied between 500mV and V
input voltage range of ±V
/2, providing a corresponding
CC
. The device includes a shut-
REF
down mode which reduces power dissipation to under 15µW.
The ADS8343 is ensured down to 2.7V operation.
Low power, high speed, and an onboard multiplexer make
the ADS8343 ideal for battery-operated systems such as
personal digital assistants, portable multi-channel data loggers, and measurement equipment. The serial interface also
provides low-cost isolation for remote data acquisition. The
ADS8343 is available in an SSOP-16 package and is ensured over the –40°C to +85°C temperature range.
REF
) can be
CH0
CH1
CH2
CH3
COM
V
REF
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
ADS8343E814SSOP-16DBQ–40°C to +85°CADS8343ERails, 100
(1)
RANGENUMBERMEDIA, QUANTITY
""""""ADS8343E/2K5Tape and Reel, 2500
ADS8343EB615SSOP-16DBQ–40°C to +85°CADS8343EBRails, 100
""""""ADS8343EB/2K5 Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
+V
to GND ........................................................................ –0.3V to +6V
CC
Analog Inputs to GND ............................................ –0.3V to +V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature................................................... +150°C
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
(1)
+ 0.3V
CC
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PIN CONFIGURATIONS
Top ViewSSOP
+V
CH0
CH1
CH2
CH3
COM
SHDN
V
REF
1
CC
2
3
4
5
6
7
8
ADS8343
DCLK
16
CS
15
DIN
14
BUSY
13
DOUT
12
GND
11
GND
10
+V
9
CC
PIN DESCRIPTIONS
PINNAMEDESCRIPTION
1+V
2CH0Analog Input Channel 0
3CH1Analog Input Channel 1
4CH2Analog Input Channel 2
5CH3Analog Input Channel 3
6COMCommon reference for analog inputs. This pin is typically connected to V
7
8V
9+V
10GNDGround
11GNDGround
12DOUTSerial Data Output. Data is shifted on the falling edge of DCLK. This output is high impedance when
13BUSYBusy Output. This output is high impedance when
14DINSerial Data Input. If CS is LOW, data is latched on rising edge of DCLK.
15
16DCLKExternal Clock Input. This clock runs the SAR conversion process and synchronizes serial data I/O. Maximum input clock frequency
CC
SHDN
REF
CC
CS
Power Supply, 2.7V to 5V
.
Shutdown. When LOW, the device enters a very low power shutdown mode.
Voltage Reference Input. See Electrical Characteristic Table for ranges.
Power Supply, 2.7V to 5V
is HIGH.
CS
Chip Select Input. Controls conversion timing and enables the serial input/output register.
No Missing Codes1415Bits
Integral Linearity Error±8±6LSB
Bipolar Error±2±1mV
Bipolar Error Match2.38.0✻✻LSB
Gain Error±0.05±0.024%
Gain Error Match1.04.0✻✻ LSB
Noise20✻µVrms
Power-Supply Rejection+4.75V < V
No Missing Codes1415Bits
Integral Linearity Error±12±8LSB
Bipolar Error±1±0.5mV
Bipolar Error Match1.24.0✻✻ LSB
Gain Error±0.05±0.0024% of FSR
Gain Error Match1.04.0✻✻ LSB
Noise20✻µVrms
Power-Supply Rejection+2.7 < V
NOTES: (1) LSB means Least Significant Bit. With V
(PD1 = PD0 = 0) active or
= GND. (4) Power-down after conversion mode with external clock gated ‘HIGH’.
SHDN
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
ADS8343EADS8343EB
REF
Negative Input–0.2+V
< +3.3V3✻LSB
CC
SHDN
= V
DD
2.4✻MHz
+V
REF
+ 0.2✻✻V
CC
+ 0.2✻✻V
CC
✻✻V
When Used with Internal Clock0.0242.0✻✻MHz
Data Transfer Only02.4✻✻MHz
VIN = 2.5Vp-p at 1kHz–94✻dB
= 2.5Vp-p at 1kHz81✻dB
IN
= 2.5Vp-p at 1kHz98✻dB
IN
= 2.5Vp-p at 10kHz100✻dB
IN
f
= 12.5kHz2.5✻µA
SAMPLE
DCLK Static0.0013✻✻ µA
| I
| ≤ +5µA+V
IH
| I
| ≤ +5µA–0.3+0.8✻✻V
IL
IOH = –250µA+V
IOL = 250µA0.4✻V
• 0.75.5✻✻V
CC
• 0.8✻V
CC
Specified Performance2.73.6✻✻V
f
= 10kHz105µA
SAMPLE
Power-Down Mode
(3, 4)
, CS = +V
equal to +1.25V, one LSB is 38µV. (2) First nine harmonics of the test frequency. (3) Auto power-down mode
REF
CC
3✻µA
(1)
4
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ADS8343
SBAS183C
TYPICAL CHARACTERISTICS: +5V
0
–20
–40
–60
–80
–100
–120
–140
FREQUENCY SPECTRUM
(4096 Point FFT; f
IN
= 9.985kHz, –0.2dB)
05020104030
Frequency (kHz)
Amplitude (dB)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
101100
Frequency (kHz)
SFDR (dB)
110
100
90
80
70
60
THD (dB)
–110
–100
–90
–80
–70
–60
SFDR
THD
(1)
NOTE: (1) First nine harmonics of the input frequency.
Temperature (°C)
0.1
0
–0.1
–0.2
–0.3
CHANGE IN SIGNAL-TO-(NOISE + DISTORTION)
vs TEMPERATURE
25100–50–2505075
Delta from 25°C (dB)
fIN = 4.956kHz, –0.2dB
At TA = +25°C, +VCC = +5V, V
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
100
(4096 Point FFT; f
05020104030
SIGNAL-TO-(NOISE + DISTORTION)
= +2.5V, f
REF
FREQUENCY SPECTRUM
SIGNAL-TO-NOISE RATIO AND
vs INPUT FREQUENCY
= 1.001kHz, –0.2dB)
IN
Frequency (kHz)
= 100kHz, and f
SAMPLE
CLK
= 24 • f
SAMPLE
= 2.4MHz, unless otherwise noted.
90
80
70
SNR and SINAD (dB)
60
15.0
14.5
14.0
13.5
13.0
12.5
12.0
Effective Number of Bits
11.5
11.0
ADS8343
SBAS183C
SNR
101100
Frequency (kHz)
EFFECTIVE NUMBER OF BITS
vs INPUT FREQUENCY
101100
Frequency (kHz)
SINAD
www.ti.com
5
TYPICAL CHARACTERISTICS: +5V (Cont.)
At TA = +25°C, +VCC = +5V, V
= +2.5V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
3
2
1
0
ILE (LSBs)
–1
–2
–3
–4
8000
1.6
1.5
1.4
INTEGRAL LINEARITY ERROR vs CODE
C000
H
H
0000
H
Output Code
SUPPLY CURRENT vs TEMPERATURE
4000
DIFFERENTIAL LINEARITY ERROR vs CODE
4
3
2
1
0
DLE (LSBs)
–1
–2
–3
7FFF
H
H
8000
C000
H
H
0000
H
4000
H
7FFF
H
Output Code
CHANGE IN BPZ vs TEMPERATURE
1
0
–1
–2
1.3
Supply Current (mA)
1.2
–50–250255075100
Temperature (°C)
CHANGE IN GAIN vs TEMPERATURE
1.0
0.5
0
Delta from 25°C (LSBs)
–0.5
–50–250255075100
Temperature (°C)
Delta from 25°C (LSBs)
–3
–4
–50–250255075100
Temperature (°C)
WORST-CASE CHANNEL-TO-CHANNEL
BPZ MATCH vs TEMPERATURE
4.5
4.0
3.5
BPZ Match (LSBs)
3.0
–50–250255075100
Temperature (°C)
6
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ADS8343
SBAS183C
TYPICAL CHARACTERISTICS: +5V (Cont.)
0
–20
–40
–60
–80
–100
–120
–140
FREQUENCY SPECTRUM
(4096 Point FFT; f
IN
= 9.985kHz, –0.2dB)
05020104030
Frequency (kHz)
Amplitude (dB)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
101100
Frequency (kHz)
SFDR (dB)
100
90
80
70
60
500
THD (dB)
–100
–90
–80
–70
–60
–50
SFDR
THD
(1)
NOTE: (1) First nine harmonics of the input frequency.
At TA = +25°C, +VCC = +5V, V
WORST CASE CHANNEL-TO-CHANNEL
GAIN MATCH vs TEMPERATURE
0.4
= +2.5V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
100
COMMON-MODE REJECTION vs FREQUENCY
0.3
0.2
0.1
Gain Match (LSBs)
0
–0.1
–50–250255075100
Temperature (°C)
TYPICAL CHARACTERISTICS: +2.7V
At TA = +25°C, +VCC = +2.7V, V
(4096 Point FFT; f
0
–20
–40
= +1.25V, f
REF
FREQUENCY SPECTRUM
IN
SAMPLE
= 1.001kHz, –0.2dB)
= 100kHz, and f
CLK
= 24 • f
SAMPLE
90
80
70
CMRR (dB)
60
VCM = 2Vp-p Sinewave
Centered Around V
50
= 2.4MHz, unless otherwise noted.
REF
1101000.1
Frequency (kHz)
–60
–80
Amplitude (dB)
–100
–120
–140
05020104030
95
85
SNR and SINAD (dB)
75
65
55
ADS8343
SBAS183C
Frequency (kHz)
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-(NOISE + DISTORTION)
vs INPUT FREQUENCY
SNR
SINAD
Frequency (kHz)
101100
www.ti.com
7
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
Effective Number of Bits
10.0
9.5
9.0
INTEGRAL LINEARITY ERROR vs CODE
3
2
1
0
ILE (LSBs)
–1
–2
EFFECTIVE NUMBER OF BITS
vs INPUT FREQUENCY
101100
Frequency (kHz)
0.4
0.2
0
–0.2
–0.4
Delta from 25°C (dB)
–0.6
–0.8
4
3
2
1
0
DLE (LSBs)
–1
–2
CHANGE IN SIGNAL-TO-(NOISE + DISTORTION)
vs TEMPERATURE
fIN = 4.956kHz, –0.2dB
25100–50–2505075
Temperature (°C)
DIFFERENTIAL LINEARITY ERROR vs CODE
–3
8000
C000
H
H
0000
H
4000
H
Output Code
SUPPLY CURRENT vs TEMPERATURE
1.2
1.1
1.0
Supply Current (mA)
0.9
–50–250255075100
Temperature (°C)
7FFF
–3
H
8000
C000
H
H
0000
H
4000
H
7FFF
H
Output Code
CHANGE IN BPZ vs TEMPERATURE
1.0
0.5
0
–0.5
Delta from 25°C (LSBs)
–1.0
–50–250255075100
Temperature (°C)
8
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ADS8343
SBAS183C
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
WORST-CASE CHANNEL-TO-CHANNEL
BPZ MATCH vs TEMPERATURE
–50–250255075100
Temperature (°C)
BPZ Match (LSBs)
1.5
1.0
0.5
0
+VSS (V)
1.4
1.3
1.2
1.1
1.0
SUPPLY CURRENT vs +V
SS
3.55.02.53.04.04.5
Supply Current (mA)
f
SAMPLE
= 100kHz
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
0.5
CHANGE IN GAIN vs TEMPERATURE
0
–0.5
Delta from 25°C (LSBs)
–1.0
–50–250255075100
Temperature (°C)
WORST-CASE CHANNEL-TO-CHANNEL
GAIN MATCH vs TEMPERATURE
0.16
0.15
0.14
80
COMMON-MODE REJECTION vs FREQUENCY
70
60
Gain Match (LSBs)
0.13
0.12
–50–250255075100
POWER-DOWN SUPPLY CURRENT
140
External Clock Disabled
120
100
80
60
40
Supply Current (mA)
20
0
–50–250255075100
Temperature (°C)
vs TEMPERATURE
Temperature (°C)
CMRR (dB)
50
40
VCM = 1Vp-p Sinewave
Centered Around V
REF
1101000.1
Frequency (kHz)
ADS8343
SBAS183C
www.ti.com
9
TYPICAL CHARACTERISTICS: +2.7V (Cont.)
At TA = +25°C, +VCC = +2.7V, V
= +1.25V, f
REF
= 100kHz, and f
SAMPLE
1.4
1.2
CLK
= 24 • f
= 2.4MHz, unless otherwise noted.
SAMPLE
SUPPLY CURRENT vs SAMPLING FREQUENCY
f
= 2.4MHz
CLK
1.0
0.8
0.6
0.4
Supply Current (mA)
0.2
0
Power-Down After Conversion Mode.
External Clock Gated HIGH After Conversion.
102030405060708090100
Sampling Frequency (kHz)
THEORY OF OPERATION
The ADS8343 is a classic Successive Approximation Register
(SAR) A/D converter. The architecture is based on capacitive
redistribution which inherently includes a sample-and-hold function. The converter is fabricated on a 0.6µm CMOS process.
The basic operation of the ADS8343 is shown in Figure 1.
The device requires an external reference and an external
clock. It operates from a single supply of 2.7V to 5.25V. The
external reference can be any voltage between 500mV and
+V
/2. The value of the reference voltage directly sets the
CC
input range of the converter. The average reference input
current depends on the conversion rate of the ADS8343.
VSS = 5.0V
VSS = 2.7V
The analog input to the converter is differential and is
provided via a 4-channel multiplexer. The input can be
provided in reference to a voltage on the COM pin (which is
generally V
) or differentially by using two of the four input
REF
channels (CH0-CH3). The particular configuration is selectable via the digital interface.
ANALOG INPUT
The analog input is bipolar and fully differential. There are
two general methods of driving the analog input of the
ADS8343: single-ended or differential, as shown in Figure 2.
1µF
+
to
10µF
Single-ended
or differential
analog inputs.
V
REF
+2.7V to +5V
0.1µF
1µF
ADS8343
1
+V
CC
2
CH0
3
CH1
4
CH2
5
CH3
6
COM
7
SHDN
8
V
REF
DCLK
CS
DIN
BUSY
DOUT
GND
GND
+V
16
15
14
13
12
11
10
9
CC
FIGURE 1. Basic Operation of the ADS8343.
Serial/Conversion
Clock
Chip Select
Serial Data In
Serial Data Out
(1)
±V
REF
Common-Mode
Voltage
(typically V
Common-Mode
NOTE: (1) Relative to common-mode voltage.
Voltage
REF
)
Single-Ended Input
(1)
V
REF
±
2
(1)
V
REF
±
2
Differential Input
CHX
ADS8343
COM
CHX+
ADS8343
CHX–
FIGURE 2. Methods of Driving the ADS8343—Single-Ended
or Differential.
10
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ADS8343
SBAS183C
When the input is single-ended, the COM input is held at a
fixed voltage. The CHX input swings around the same
voltage and the peak-to-peak amplitude is 2 • V
value of V
determines the range over which the common
REF
REF
. The
voltage may vary, as shown in Figure 3.
5
4.9
4
3
2
1
Common Voltage Range (V)
0.1
0
–1
0.51.01.52.02.5
Single-Ended Input
V
REF
(V)
FIGURE 3. Single-Ended Input—Common Voltage Range vs V
= 5V
V
CC
2.8
2.1
REF
When the input is differential, the amplitude of the input is the
difference between the CHX and COM input. A voltage or
signal is common to both of these inputs. The peak-to-peak
amplitude of each input is V
about this common voltage.
REF
However, since the inputs are 180° out-of-phase, the peakto-peak amplitude of the difference voltage is 2 • V
value of V
also determines the range of the voltage that
REF
REF
. The
may be common to both inputs, as shown in Figure 4.
5.2
5
4
= 5V
V
CC
4.2
In each case, care should be taken to ensure that the output
impedance of the sources driving the CHX and COM inputs
are matched. If this is not observed, the two inputs could
have different settling times. This may result in offset error,
gain error, and linearity error which change with both temperature and input voltage. If the impedance cannot be
matched, the errors can be lessened by giving the ADS8343
additional acquisition time.
The input current on the analog inputs depends on a number
of factors: sample rate, input voltage, and source impedance.
Essentially, the current into the ADS8343 charges the internal capacitor array during the sample period. After this
capacitance has been fully charged, there is no further input
current.
Care must be taken regarding the absolute analog input
voltage. Outside of these ranges, the converter’s linearity
may not meet specifications. Please refer to the electrical
characteristics table for min/max ratings.
REFERENCE INPUT
The external reference sets the analog input range. The
ADS8343 will operate with a reference in the range of 500mV
to +V
ence between the CHX input and the COM input, as shown
.
in Figure 5. For example, in the single-ended mode, with
V
(CH0-CH3) will properly digitize a signal in the range of 0V to
2.50V relative to GND. If the COM pin is connected to 2.0V,
the input range on the selected channel is 0.75V to 3.25V.
/2. Keep in mind that the analog input is the differ-
CC
and COM pin set to 1.25V, the selected input channel
REF
A2-A0
(Shown 001
CH0
CH1
CH2
CH3
)
B
+IN
–IN
Converter
3
2
1
Common Voltage Range (V)
0.2
0
0.01.01.52.02.5
Differential Input
0.8
V
(V)
REF
FIGURE 4. Differential Input—Common Voltage Range vs V
ADS8343
SBAS183C
REF.
www.ti.com
COM
SGL/DIF
(Shown HIGH)
FIGURE 5. Simplified Diagram of the Analog Input.
There are several critical items concerning the reference
input and its wide voltage range. As the reference voltage is
reduced, the analog voltage weight of each digital output
code is also reduced. This is often referred to as the LSB
(Least Significant Bit) size and is equal to the reference
voltage divided by 65,536. Any offset or gain error inherent
in the A/D converter will appear to increase, in terms of LSB
11
size, as the reference voltage is reduced. For example, if the
offset of a given converter is 2LSBs with a 2.5V reference,
then it will typically be 10LSBs with a 0.5V reference. In each
case, the actual offset of the device is the same, 76µV.
The noise or uncertainty of the digitized output will increase
with lower LSB size. With a reference voltage of 500mV, the
LSB size is 7.6µV. This level is below the internal noise of the
device. As a result, the digital output code will not be stable
and vary around a mean value by a number of LSBs. The
distribution of output codes will be gaussian and the noise
can be reduced by simply averaging consecutive conversion
results or applying a digital filter.
With a lower reference voltage, care should be taken to
provide a clean layout including adequate bypassing, a clean
(low-noise, low-ripple) power supply, a low-noise reference,
and a low-noise input signal. Because the LSB size is lower,
the converter will also be more sensitive to nearby digital
signals and electromagnetic interference.
The voltage into the V
input is not buffered and directly
REF
drives the Capacitor Digital-to-Analog Converter (CDAC)
portion of the ADS8343. Typically, the input current is 13µA
with a 2.5V reference. This value will vary by microamps
depending on the result of the conversion. The reference
current diminishes directly with both conversion rate and
reference voltage. As the current from the reference is drawn
on each bit decision, clocking the converter more quickly
during a given conversion period will not reduce overall
current drain from the reference.
converter enters the conversion mode. At this point, the input
sample-and-hold goes into the hold mode. The next 16 clock
cycles accomplish the actual A/D conversion.
Control Byte
Also shown in Figure 6 is the placement and order of the
control bits within the control byte. Tables I and II give
detailed information about these bits. The first bit, the ‘S’ bit,
must always be HIGH and indicates the start of the control
byte. The ADS8343 will ignore inputs on the DIN pin until the
start bit is detected. The next three bits (A2-A0) select the
active input channel or channels of the input multiplexer, as
shown in Tables III and IV and Figure 5.
Bit 7Bit 0
(MSB)Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1(LSB)
S A2A1A0—
SGL/DIF
TABLE I. Order of the Control Bits in the Control Byte.
BITNAMEDESCRIPTION
7SStart Bit. Control byte starts with first HIGH bit on
6-4A2-A0Channel Select Bits. Along with the
2
SGL/DIF
1-0PD1-PD0Power-Down Mode Select Bits. See Table V for
DIN.
these bits control the setting of the multiplexer input.
Single-Ended/Differential Select Bit. Along with bits
A2-A0, this bit controls the setting of the multiplexer
input.
details.
PD1PD0
bit,
SGL/DIF
DIGITAL INTERFACE
Figure 6 shows the typical operation of the ADS8343’s digital
interface. This diagram assumes that the source of the digital
signals is a microcontroller or digital signal processor with a
basic serial interface (note that the digital inputs are overvoltage tolerant up to 5.5V, regardless of +V
munication between the processor and the converter consists of eight clock cycles. One complete conversion can be
accomplished with three serial communications, for a total of
24 clock cycles on the DCLK input.
The first eight cycles are used to provide the control byte via
the DIN pin. When the converter has enough information
about the following conversion to set the input multiplexer
appropriately, it enters the acquisition (sample) mode. After
three more clock cycles, the control byte is complete and the
CS
t
ACQ
81
AcquireIdleConversion
SGL/
PD1 PD0
DIF
DIN
BUSY
(START)
1DCLK
A2S
A1 A0
). Each com-
CC
TABLE II. Descriptions of the Control Bits within the Control Byte.
A2A1A0CH0CH1CH2CH3COM
001+IN–IN
101+IN–IN
010+IN–IN
110+IN–IN
TABLE III. Single-Ended Channel Selection (SGL/DIF HIGH).
A2A1A0CH0CH1CH2CH3COM
001+IN–IN
101–IN+IN
010+IN–IN
110–IN+IN
TABLE IV. Differential Channel Control (SGL/DIF LOW).
818
181
AcquireIdleConversion
SGL/
A2SA1A0
(START)
DIF
PD1 PD0
DOUT
14131211109 8 7654321 0Zero Filled...
15
(MSB)
(LSB)
15
(MSB)
14
FIGURE 6. Conversion Timing, 24-Clocks per Conversion, 8-Bit Bus Interface. No DCLK delay required with dedicated serial port.
12
www.ti.com
ADS8343
SBAS183C
The SGL/DIF
bit controls the multiplexer input mode: either
single-ended (HIGH) or differential (LOW). In single-ended
mode, the selected input channel is referenced to the COM
pin. In differential mode, the two selected inputs provide a
differential input. See Tables III and IV and Figure 5 for more
information. The last two bits (PD1-PD0) select the powerdown mode as shown in Table V. If both inputs are HIGH, the
device is always powered up. If both inputs are LOW, the
device enters a power-down mode between conversions.
When a new conversion is initiated, the device will resume
normal operation instantly—no delay is needed to allow the
device to power up and the very first conversion will be valid.
PD1PD0DESCRIPTION
00Power-down between conversions. When each
10Selects internal clock mode.
01Reserved for future use.
1 1No power-down between conversions, device al-
conversion is finished, the converter enters a lowpower mode. At the start of the next conversion,
the device instantly powers up to full power. There
is no need for additional delays to assure full
operation and the very first conversion is valid.
ways powered. Selects external clock mode.
TABLE V. Power-Down Selection.
Clock Modes
The ADS8343 can be used with an external serial clock or an
internal clock to perform the successive-approximation conversion. In both clock modes, the external clock shifts data
in and out of the device. Internal clock mode is selected
when PD1 is HIGH and PD0 is LOW.
If the user decides to switch from one clock mode to the
other, an extra conversion cycle will be required before the
ADS8343 can switch to the new mode. The extra cycle is
required because the PD0 and PD1 control bits need to be
written to the ADS8343 prior to the change in clock modes.
When power is first applied to the ADS8343, the user must
set the desired clock mode. It can be set by writing PD1 = 1
and PD0 = 0 for internal clock mode or PD1 = 1 and PD0
= 1 for external clock mode. After enabling the required clock
mode, only then should the ADS8343 be set to power-down
between conversions (i.e., PD1 = PD0 = 0). The ADS8343
maintains the clock mode it was in prior to entering the
power-down modes.
External Clock Mode
In external clock mode, the external clock not only shifts data
in and out of the ADS8343, it also controls the A/D conversion steps. BUSY will go HIGH for one clock period after the
last bit of the control byte is shifted in. Successive-approximation bit decisions are made and appear at DOUT on each
of the next 16 DCLK falling edges, see Figure 6. Figure 7
shows the BUSY timing in external clock mode.
Since one clock cycle of the serial clock is consumed with
BUSY going HIGH (while the MSB decision is being made),
16 additional clocks must be given to clock out all 16 bits of
data; thus, one conversion takes a minimum of 25 clock
cycles to fully read the data. Since most microprocessors
communicate in 8-bit transfers, this means that an additional
transfer must be made to capture the LSB.
There are two ways of handling this requirement. One is
presented in Figure 6, where the beginning of the next
control byte appears at the same time the LSB is being
clocked out of the ADS8343. This method allows for maximum throughput and 24 clock cycles per conversion.
CS
t
CH
t
DS
DCLK
DIN
BUSY
t
CSS
t
DV
t
BDV
FIGURE 7. Detailed Timing Diagram.
ADS8343
SBAS183C
t
CL
t
BD
t
DH
PD0
t
BD
15DOUT
t
D0
14
www.ti.com
t
t
CSH
BTR
t
TR
13
The other method is shown in Figure 8, which uses 32 clock
cycles per conversion; the last seven clock cycles simply
shift out zeros on the DOUT line. BUSY and DOUT go into
a high-impedance state when
CS
falling edge, BUSY will go LOW.
CS
goes HIGH; after the next
Internal Clock Mode
In internal clock mode, the ADS8343 generates its own
conversion clock internally. This relieves the microprocessor
from having to generate the SAR conversion clock and
allows the conversion result to be read back at the processor’s
convenience, at any clock rate from 0MHz to 2.0MHz. BUSY
goes LOW at the start of conversion and then returns HIGH
when the conversion is complete. During the conversion,
BUSY will remain LOW for a maximum of 8µs. Also, during
the conversion, DCLK should remain LOW to achieve the
best noise performance. The conversion result is stored in an
internal register; the data may be clocked out of this register
any time after the conversion is complete.
If
CS
is LOW when BUSY goes LOW following a conversion,
the next falling edge of the external serial clock will write out
the MSB on the DOUT line. The remaining bits (D14-D0) will
be clocked out on each successive clock cycle following the
MSB. If
line will remain in tri-state until
Figure 9.
sion has started. Note that BUSY is not tri-stated when
CS
is HIGH when BUSY goes LOW then the DOUT
CS
goes LOW, as shown in
CS
does not need to remain LOW once a conver-
CS
goes HIGH in internal clock mode.
Data can be shifted in and out of the ADS8343 at clock rates
exceeding 2.4MHz, provided that the minimum acquisition time
t
, is kept above 1.7µs.
ACQ
Digital Timing
Figure 4 and Tables VI and VII provide detailed timing for the
digital interface of the ADS8343.
SYMBOLDESCRIPTIONMINTYPMAXUNITS
t
t
t
t
t
ACQ
t
DS
t
DH
t
DO
t
DV
t
TR
CSS
CSH
t
CH
t
CL
t
BD
BDV
BTR
Acquisition Time1.5µs
DIN Valid Prior to DCLK Rising100ns
DIN Hold After DCLK HIGH10ns
DCLK Falling to DOUT Valid200ns
Falling to DOUT Enabled200ns
CS
Rising to DOUT Disabled200ns
CS
CS
Falling to First DCLK Rising100ns
Rising to DCLK Ignored0ns
CS
DCLK HIGH200ns
DCLK LOW200ns
DCLK Falling to BUSY Rising200ns
Falling to BUSY Enabled200ns
CS
CS
Rising to BUSY Disabled200ns
TABLE VI. Timing Specifications (+VCC = +2.7V to 3.6V,
T
= –40°C to +85°C, C
A
LOAD
= 50pF).
SYMBOLDESCRIPTIONMINTYPMAXUNITS
t
t
t
t
t
ACQ
t
DS
t
DH
t
DO
t
DV
t
TR
CSS
CSH
t
CH
t
CL
t
BD
BDV
BTR
Acquisition Time1.7µs
DIN Valid Prior to DCLK Rising50ns
DIN Hold After DCLK HIGH10ns
DCLK Falling to DOUT Valid100ns
CS
Falling to DOUT Enabled70ns
Rising to DOUT Disabled70ns
CS
Falling to First DCLK Rising50ns
CS
CS
Rising to DCLK Ignored0ns
DCLK HIGH150ns
DCLK LOW150ns
DCLK Falling to BUSY Rising100ns
Falling to BUSY Enabled70ns
CS
Rising to BUSY Disabled70ns
CS
TABLE VII. Timing Specifications (+VCC = +4.75V to +5.25V,
T
= –40°C to +85°C, C
A
LOAD
= 50pF).
CS
t
DCLK
DIN
BUSY
DOUT
(START)
1
A1 A0
A2S
ACQ
81
AcquireIdleConversion
SGL/
PD1 PD0
DIF
15
14131211109 8 7654321 0
(MSB)
FIGURE 8. External Clock Mode 32 Clocks Per Conversion.
CS
t
DCLK
DIN
BUSY
DOUT
(START)
1
A1 A0
A2S
ACQ
8
AcquireIdleConversion
SGL/
PD1 PD0
DIF
9 1011121314151617181920212223242526272829303132
14131211109 8 7654321 0Zero Filled...
15
(MSB)
FIGURE 9. Internal Clock Mode Timing.
818
(LSB)
18
Idle
Zero Filled...
(LSB)
14
www.ti.com
ADS8343
SBAS183C
DATA FORMAT
10k100k1k1M
f
SAMPLE
(Hz)
Supply Current (µA)
100
10
1
1000
f
CLK
= 2.4MHz
f
CLK
= 24 • f
SAMPLE
TA = 25°C
+V
CC
= +2.7V
V
REF
= +2.5V
PD1 = PD0 = 0
10k100k1k1M
f
SAMPLE
(Hz)
Supply Current (µA)
0.00
0.09
14
0
2
4
6
8
10
12
CS LOW
(GND)
CS HIGH (+V
CC
)
T
A
= 25°C
+V
CC
= +2.7V
V
REF
= +2.5V
f
CLK
= 24 • f
SAMPLE
PD1 = PD0 = 0
The output data from the ADS8343 is in Binary Two’s
Complement format, as shown in Table VIII. This table
represents the ideal output code for the given input voltage
and does not include the effects of offset, gain, or noise.
TABLE VIII. Ideal Input Voltages and Output Codes.
POWER DISSIPATION
There are three power modes for the ADS8343: full-power
(PD1 = PD0 = 1
shutdown (
depending on how the ADS8343 is being operated. For
example, at full conversion rate and 24-clocks per conversion, there is very little difference between full-power mode
and auto power-down, a shutdown (
lower power dissipation.
When operating at full-speed and 24 clocks per conversion
(see Figure 6), the ADS8343 spends most of its time acquiring or converting. There is little time for auto power-down,
assuming that this mode is active. Thus, the difference
between full-power mode and auto power-down is negligible.
If the conversion rate is decreased by simply slowing the
frequency of the DCLK input, the two modes remain approximately equal. However, if the DCLK frequency is kept at the
maximum rate during a conversion, but conversion are simply done less often, then the difference between the two
modes is dramatic. Figure 10 shows the difference between
reducing the DCLK frequency (“scaling” DCLK to match the
conversion rate) or maintaining DCLK at the highest frequency and reducing the number of conversion per second.
In the later case, the converter spends an increasing percentage of its time in power-down mode (assuming the auto
power-down mode is active).
), auto power-down (PD1 = PD0 = 0B), and
B
SHDN
LOW). The affects of these modes varies
SHDN
LOW) will not
If DCLK is active and CS is LOW while the ADS8343 is in
auto power-down mode, the device will continue to dissipate
some power in the digital logic. The power can be reduced
to a minimum by keeping
CS
HIGH. The differences in
supply current for these two cases are shown in Figure 11.
Operating the ADS8343 in auto power-down mode will result
in the lowest power dissipation, and there is no conversion
time “penalty” on power-up. The very first conversion will be
valid.
SHDN
can be used to force an immediate power-down.
FIGURE 10. Supply Current versus Directly Scaling the Fre-
quency of DCLK with Sample Rate or Keeping
DCLK at the Maximum Possible Frequency.
FIGURE 11. Supply Current vs State of CS.
ADS8343
SBAS183C
www.ti.com
15
NOISE
The noise floor of the ADS8343 itself is extremely low, as can
be seen from Figures 12 and 13, and is much lower than
competing A/D converters. The ADS8343 was tested at both
5V and 2.7V and in both the internal and external clock
modes. A low-level DC input was applied to the analog input
pins and the converter was put through 5000 conversions.
The digital output of the A/D converter will vary in output code
due to the internal noise of the ADS8343. This is true for all
16-bit, SAR-type, A/D converters. Using a histogram to plot
the output codes, the distribution should appear bell-shaped
with the peak of the bell curve representing the nominal code
for the input value. The ±1σ, ±2σ, and ±3σ distributions will
represent the 68.3%, 95.5%, and 99.7%, respectively, of all
codes. The transition noise can be calculated by dividing the
number of codes measured by 6 and this will yield the ±3σ
distribution or 99.7% of all codes. Statistically, up to 3 codes
could fall outside the distribution when executing 1000 conversions. The ADS8343, with < 3 output codes for the ±3σ
distribution, will yield a < ±0.5LSB transition noise at 5V
operation. Remember, to achieve this low noise performance, the peak-to-peak noise of the input signal and
reference must be < 50µV.
3295
774
95
FFFEHFFFFH0000H0001H0002
Code
FIGURE 12. Histogram of 5000 Conversions of a DC Input at the
FIGURE 13. Histogram of 5000 Conversions of a DC Input at the
Code Center, 2.7V Operation Internal Clock Mode.
705
131
H
905
512
H
AVERAGING
The noise of the A/D converter can be compensated by
averaging the digital codes. By averaging conversion results,
transition noise will be reduced by a factor of 1/
√n
, where n
is the number of averages. For example, averaging 4 conversion results will reduce the transition noise by 1/2 to
±0.25LSBs. Averaging should only be used for input signals
with frequencies near DC.
For AC signals, a digital filter can be used to low-pass filter
and decimate the output codes. This works in a similar
manner to averaging; for every decimation by 2, the signalto-noise ratio will improve 3dB.
LAYOUT
For optimum performance, care should be taken with the
physical layout of the ADS8343 circuitry. This is particularly true
if the reference voltage is low and/or the conversion rate is high.
The basic SAR architecture is sensitive to glitches or sudden
changes on the power supply, reference, ground connections,
and digital inputs that occur just prior to latching the output of the
analog comparator. Thus, during any single conversion for an nbit SAR converter, there are n “windows” in which large external
transient voltages can easily affect the conversion result. Such
glitches might originate from switching power supplies, nearby
digital logic, and high-power devices. The degree of error in the
digital output depends on the reference voltage, layout, and the
exact timing of the external event. The error can change if the
external event changes in time with respect to the DCLK input.
With this in mind, power to the ADS8343 should be clean and
well bypassed. A 0.1µF ceramic bypass capacitor should be
placed as close to the device as possible. In addition, a 1µF
to 10µF capacitor and a 5Ω or 10Ω series resistor may be
used to low-pass filter a noisy supply.
The reference should be similarly bypassed with a 1µF
capacitor. Again, a series resistor and large capacitor can be
used to low-pass filter the reference voltage. If the reference
voltage originates from an op amp, make sure that it can
drive the bypass capacitor without oscillation (the series
resistor can help in this case). The ADS8343 draws very little
current from the reference on average, but it does place
larger demands on the reference circuitry over short periods
of time (on each rising edge of DCLK during a conversion).
The ADS8343 architecture offers no inherent rejection of
noise or voltage variation in regards to the reference input.
This is of particular concern when the reference input is tied
to the power supply. Any noise and ripple from the supply will
appear directly in the digital results. While high-frequency
noise can be filtered out as discussed in the previous
paragraph, voltage variation due to line frequency (50Hz or
60Hz) can be difficult to remove.
The GND pin should be connected to a clean ground point. In
many cases, this will be the “analog” ground. Avoid connections which are too near the grounding point of a microcontroller
or digital signal processor. If needed, run a ground trace
directly from the converter to the power-supply entry point. The
ideal layout will include an analog ground plane dedicated to
the converter and associated analog circuitry.
16
www.ti.com
ADS8343
SBAS183C
PACKAGE DRAWING
DBQ (R-PDSO-G**) PLASTIC SMALL-OUTLINE
Gage Plane
0.008 (0,20) NOM
0.010 (0,25)
0.016 (0,40)
0.035 (0,89)
2420
Seating Plane
(8,74)
(8,56)
0.3370.337
(8,56)
(8,74)
0.3440.344
4073301/E 10/00
13
0.150 (3,81)
0.157 (3,99)
0.012 (0,30)
0.008 (0,20)
12
A
24 PINS SHOWN
1
24
16
DIM
PINS **
A MIN
A MAX
0.004 (0,10)
0.010 (0,25)
0.069 (1,75) MAX
0.244 (6,20)
0.228 (5,80)
0.197
(5,00)
(4,78)
0.188
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,64)
0°–8°
28
(10,01)
(9,80)
0.386
0.394
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-137
ADS8343
SBAS183C
www.ti.com
17
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable DeviceStatus
ADS8343EACTIVESSOP/
ADS8343E/2K5ACTIVESSOP/
ADS8343E/2K5G4ACTIVESSOP/
ADS8343EBACTIVESSOP/
ADS8343EB/2K5ACTIVESSOP/
ADS8343EB/2K5G4ACTIVESSOP/
ADS8343EBG4ACTIVESSOP/
ADS8343EG4ACTIVESSOP/
(1)
The marketingstatus valuesare definedas follows:
(1)
Package
Type
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
QSOP
Package
Drawing
Pins Package
Qty
Eco Plan
DBQ16100 Green (RoHS &
no Sb/Br)
DBQ162500 Green (RoHS&
no Sb/Br)
DBQ162500 Green (RoHS&
no Sb/Br)
DBQ16100 Green (RoHS &
no Sb/Br)
DBQ162500 Green (RoHS&
no Sb/Br)
DBQ162500 Green (RoHS&
no Sb/Br)
DBQ16100 Green (RoHS &
no Sb/Br)
DBQ16100 Green (RoHS &
no Sb/Br)
ACTIVE: Productdevice recommendedfor newdesigns.
LIFEBUY: TIhas announcedthat thedevice willbe discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a newdesign.
PREVIEW: Devicehas beenannounced butis notin production. Samples may or may not be available.
OBSOLETE: TIhas discontinuedthe productionof thedevice.
(2)
Lead/Ball Finish MSL PeakTemp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
TBD: ThePb-Free/Green conversionplan hasnot beendefined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at hightemperatures, TIPb-Free productsare suitablefor use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) asdefined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Bror Sbdo notexceed 0.1%by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information maynot beavailable forrelease.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customeron anannual basis.
Addendum-Page 1
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