The ADS7842 is a complete, 4-channel, 12-bit Analog-toDigital Converter (ADC). It contains a 12-bit, capacitorbased, Successive Approximation Register (SAR) ADC with
a sample-and-hold amplifier, interface for microprocessor
use, and parallel, 3-state output drivers. The ADS7842 is
specified at a 200kHz sampling rate while dissipating only
2mW of power. The reference voltage can be varied from
100mV to V
24µV to 1.22mV. The ADS7842 is tested down to 2.7V
operation.
Low power, high speed, and an onboard multiplexer make
the ADS7842 ideal for battery-operated systems such as
portable, multi-channel dataloggers and measurement equipment. The ADS7842 is available in an SSOP-28 package
and is tested over the –40°C to +85°C temperature range.
with a corresponding LSB resolution from
CC
A1
A0
AIN0
AIN1
AIN2
AIN3
V
REF
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
ADS7842E±268SSOP-28DB–40°C to +85°CADS7842EADS7842ERails, 48
"""""""ADS7842E/1KTape and Reel, 1000
ADS7842EB±170SSOP-28DB–40°C to +85°CADS7842EBADS7842EBRails, 48
"""""""ADS7842EB/1K Tape and Reel, 1000
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
(1)
RANGEMARKINGNUMBERMEDIA, QUANTITY
ABSOLUTE MAXIMUM RATINGS
+V
to GND ........................................................................–0.3V to +6V
CC
Analog Inputs to GND ............................................ –0.3V to +V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature................................................... +150°C
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s)............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
(1)
+ 0.3V
CC
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
6AGNDAnalog Ground
7DB11Data Bit 11 (MSB)
8DB10Data Bit 10
9DB9Data Bit 9
10DB8Data Bit 8
11DB7Data Bit 7
12DB6Data Bit 6
13DB5Data Bit 5
14DGNDDigital Ground
15DB4Data Bit 4
16DB3Data Bit 3
17DB2Data Bit 2
18DB1Data Bit 1
19DB0Data Bit 0 (LSB)
20RDRead Input. Active LOW. Reads the data outputs in
21CSChip Select Input. Active LOW. The combination of
22WRWrite Input. Active LOW. Starts a new conversion
23BUSYBUSY goes LOW and stays LOW during a
24CLKExternal Clock Input. The clock speed determines the
25, 26A0, A1Address Inputs. Selects one of four analog input
27V
28V
Voltage Reference Input. See Electrical Characteris-
REF
tics Tables for ranges.
combination with CS.
CS taken LOW and WR taken LOW initiates a new
conversion and places the outputs in the tri-state
mode.
and selects an analog channel via address inputs A0
and A1, in combination with CS.
conversion. BUSY rises when a conversion is
complete and enables the parallel outputs.
conversion rate by the equation f
channels in combination with CS and WR. The
address inputs are latched on the rising edge of
either RD or WR.