TEXAS INSTRUMENTS ADS1286 Technical data

®
ADS1286
ADS1286
ADS1286
12-Bit Micro Power Sampling
ANALOG-TO-DIGITAL CONVERTER
FEATURES
SERIAL INTERFACE
GUARANTEED NO MISSING CODES
20kHz SAMPLING RATE
LOW SUPPLY CURRENT: 250µA
APPLICATIONS
REMOTE DATA ACQUISITION
ISOLATED DATA ACQUISITION
TRANSDUCER INTERFACE
BATTERY OPERATED SYSTEMS
SAR
DESCRIPTION
The ADS1286 is a 12-bit, 20kHz analog-to-digital converter with a differential input and sample and hold amplifier and consumes only 250µA of supply cur­rent. The ADS1286 offers an SPI and SSI compatible serial interface for communications over a two or three wire interface. The combination of a serial two wire interface and micropower consumption makes the ADS1286 ideal for remote applications and for those requiring isolation.
The ADS1286 is available in a 8-pin plastic mini DIP and a 8-lead SOIC.
Control
SBAS053
V
REF
D
+In
–In
S/H Amp
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
1996 Burr-Brown Corporation PDS-1335B Printed in U.S.A. October, 1998
CDAC
Comparator
Serial
Interface
OUT
DCLOCK
CS/SHDN
SPECIFICATIONS
At TA = T
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS ANALOG INPUT
Full-Scale Input Range +In – (–In) 0 V Absolute Input Voltage +In –0.2 V
Capacitance 25 ✻✻pF Leakage Current ±1 ✻✻µA
SYSTEM PERFORMANCE
Resolution 12 ✻✻Bits No Missing Codes 12 ✻✻Bits Integral Linearity ±1 ±2 ✻✻ ±0.5 ±1 LSB Differential Linearity ±0.5 ±1.0 ±0.75 ±0.25 ±0.75 LSB Offset Error 0.75 ±3 ✻✻ ✻✻LSB Gain Error ±2 ±8 ✻✻ ✻✻LSB Noise 50 ✻✻µVrms Power Supply Rejection 82 ✻✻dB
SAMPLING DYNAMICS
Conversion Time 12 ✻✻ Acquisition Time 1.5 ✻✻ Small Signal Bandwidth 500 ✻✻kHz
DYNAMIC CHARACTERISTICS
Total Harmonic Distortion V
SINAD V Spurious Free Dynamic Range V
REFERENCE INPUT
REF Input Range 1.25 2.5 Input Resistance CS = V
Current Drain CS = V
DIGITAL INPUT/OUTPUT
Logic Family CMOS ✻✻
Logic Levels: V V V V
Data Format Straight Binary ✻✻
POWER SUPPLY REQUIREMENTS
Power Supply Voltage
V
CC
Quiescent Current, V
Power Down CS = V
TEMPERATURE RANGE
Specified Performance ADS1286, K, L 0 +70 ✻✻✻✻°C
Specifications same as grade to the left.
to T
MIN
, +VCC = +5V, V
MAX
= +5V, f
REF
SAMPLE
= 12.5kHz, , f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
ADS1286, ADS1286A ADS1286K, ADS1286B ADS1286C, ADS1286L
REF
+0.2 ✻✻✻✻V
–In –0.2 +0.2 ✻✻✻✻V
CC
✻✻✻✻V
Clk Cycles Clk Cycles
= 5.0Vp-p at 1kHz –85 ✻✻dB
IN
V
= 5.0Vp-p at 5kHz –83 ✻✻dB
IN
= 5.0Vp-p at 1kHz 72 ✻✻dB
IN
= 5.0Vp-p at 1kHz 90 ✻✻dB
IN
VCC+0.05V
CS = GND, f
t
640 µs, f
CYC
t
= 80µs, f
CYC
IH IL OH OL
CC
= 0Hz 5000 ✻✻M
CLK
CC
25kHz
CLK
= 200kHz
CLK
IIH = +5µA3 +VCC✻✻✻✻V
IIL = +5µA 0.0 0.8 ✻✻✻✻V IOH = 250µA3 +VCC✻✻✻✻V IOL = 250µA 0.0 0.4 ✻✻✻✻V
5000 ✻✻M
0.01
2.4
2.4
2.5 20 20
✻✻✻✻✻✻V
✻✻ ✻✻µA ✻✻ ✻✻µA ✻✻ ✻✻µA
+4.50 5 5.25 ✻✻✻✻✻✻V
ANA
640µS, f
CYC
t
= 90µS, f
CYC
25kHz
CLK
= 200kHz
CLK
CC
200 400 ✻✻ ✻✻µA 250 500 ✻✻ ✻✻µA
3 ✻✻µA
t
ADS1286A, B, C –40 +85 ✻✻✻✻°C
TIMING CHARACTERISTICS
f
= 200kHz, TA = T
CLK
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
t
SMPL
t
SMPL (MAX)
t
CONV
t
dDO
t
dis
t
en
t
hDO
t
f
t
r
t
CSD
t
SUCS
to T
MAX
.
MIN
Analog Input Sample Time See Operating Sequence 1.5 2.0 Clk Cycles
Maximum Sampling Frequency ADS1286 20 kHz
Conversion Time See Operating Sequence 12 Clk Cycles
Delay TIme, DCLOCK to D
Delay TIme, CS to D
Delay TIme, DCLOCK to D
Output Data Remains Valid After DCLOCK C
D
Fall Time See Test Circuits 70 100 ns
OUT
D
Rise Time See Test Circuits 60 100 ns
OUT
Data Valid See Test Circuits 85 150 ns
OUT
Hi-Z See Test Circuits 25 50 ns
OUT
Enable See Test Circuits 50 100 ns
OUT
= 100pF 15 30 ns
LOAD
Delay Time, CS to DCLOCK See Operating Sequence 0 ns Delay Time, CS to DCLOCK See Operating Sequence 30 ns
®
ADS1286
2
ABSOLUTE MAXIMUM RATINGS
+VCC.....................................................................................................+6V
Analog Input....................................................... –0.3V to (+V
Logic Input .........................................................–0.3V to (+V
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature..................................................................... +125°C
External Reference Voltage .............................................................. +5.5V
NOTE: (1) Stresses above these ratings may permanently damage the device.
(1)
+ 300mV)
CC
+ 300mV)
CC
ELECTROSTATIC DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per­formance degradation to complete device failure. Burr­Brown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods.
ESD damage can range from subtle performance degrada-
PIN CONFIGURATION
tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet
V
REF
+In –In
GND
1 2 3 4
8-Pin Mini PDIP
8-Lead SOIC
ADS1286
8 7 6 5
+V
CC
DCLOCK D
OUT
CS/SHDN
published specifications.
PIN ASSIGNMENTS
PIN NAME DESCRIPTION
1V 2 +In Non Inverting Input. 3 –In Inverting Input. Connect to ground or remote ground sense point. 4 GND Ground. 5 CS/SHDN Chip Select when low, Shutdown Mode when high. 6D
7 DCLOCK Data Clock synchronizes the serial data transfer and determines conversion speed. 8+V
REF
OUT
Reference Input.
The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.
Power Supply.
CC
PACKAGE/ORDERING INFORMATION
PRODUCT LINEARITY RANGE PACKAGE NUMBER
INTEGRAL TEMPERATURE DRAWING
ADS1286P ±20°C to +70°C Plastic DIP 006 ADS1286PK ±20°C to +70°C Plastic DIP 006 ADS1286PL ±10°C to +70°C Plastic DIP 006 ADS1286U ±20°C to +70°C SOIC 182 ADS1286UK ±20°C to +70°C SOIC 182 ADS1286UL ±10°C to +70°C SOIC 182 ADS1286PA ±2 –40°C to +85°C Plastic DIP 006 ADS1286PB ±2 –40°C to +85°C Plastic DIP 006 ADS1286PC ±1 –40°C to +85°C Plastic DIP 006 ADS1286UA ±2 –40°C to +85°C SOIC 182 ADS1286UB ±2 –40°C to +85°C SOIC 182 ADS1286UC ±1 –40°C to +85°C SOIC 182
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
PACKAGE
(1)
®
3
ADS1286
TYPICAL PERFORMANCE CURVES
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
2.5
2.0
1.5
1.0
Reference Current (µA)
0.5
0
5
4.5 4
3.5 3
2.5 2
1.5
Change in Offset (LSB)
1
0.5 0
REFERENCE CURRENT vs SAMPLE RATE
024681012
Sample Rate (kHz)
CHANGE IN OFFSET vs REFERENCE VOLTAGE
12345
Reference Voltage (V)
4.0
3.5
3.0
2.5
2.0
Reference Current (µA)
1.5
1.0
0.6
0.4
0.2
0
–0.2
Delta from 25°C (LSB)
–0.4
–0.6
REFERENCE CURRENT vs TEMPERATURE
–55 –40 –25 0 25 70 85
Temperature (°C)
CHANGE IN OFFSET vs TEMPERATURE
–55 –40 –25 0 25 70 85
Temperature (°C)
CHANGE IN INTEGRAL LINEARITY AND DIFFERENTIAL
0.10
0.05
0.00
–0.05
–0.10
–0.15
Delta from +5V Reference (LSB)
–0.20
12345
LINEARITY vs REFERENCE VOLTAGE
Change in Differential
Linearity (LSB)
Change in Integral
Linearity (LSB)
Reference Voltage (V)
®
ADS1286
CHANGE IN GAIN vs REFERENCE VOLTAGE
4
3.5 3
2.5 2
1.5 1
Change in Gain (LSB)
0.5 0
12345
Reference Voltage (V)
4
DIFFERENTIAL LINEARITY ERROR vs CODE
3.0
2.0
1.0
0
–1.0
–2.0
–3.0
Differential Linearity Error (LSB)
0 2048 4095
Code
TYPICAL PERFORMANCE CURVES (CONT)
TOTAL HARMONIC DISTORTION vs FREQUENCY
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
–100
Total Harmonic Distortion (dB)
0.1 1 10 Frequency (kHz)
At TA = +25, VCC = +5V, V
12
11.75
11.5
11.25 11
10.75
10.5
Effective Number of Bits (rms)
10.25 10
0.1 1 10
= +5V, f
REF
EFFECTIVE NUMBER OF BITS
vs REFERENCE VOLTAGE
Reference Voltage (V)
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
SIGNAL-TO-(NOISE + DISTORTION)
100
90 80 70 60 50 40 30 20
Signal-to-(Noise + Distortion) (dB)
10
0
0.1 1 10
SIGNAL-TO-(NOISE + DISTORTION) vs INPUT LEVEL
80 70 60 50 40 30 20 10
Signal-to-(Noise + Distortion) (dB)
0
–40 –35 –30 –25 –20 –15 –10 –5 0
vs FREQUENCY
Frequency (kHz)
Input Level (dB)
SPURIOUS FREE DYNAMIC RANGE
100
and Signal-to-Noise Ratio (dB)
Spurious Free Dynamic Range
5
AND SIGNAL-TO-NOISE RATIO vs FREQUENCY
90 80 70 60 50 40 30 20 10
0
0.1 1 10
Spurious Free Dynamic Range
Signal-to-Noise Ratio
Frequency (kHz)
ADS1286
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
0
–25
–50
–75
Magnitude (dB)
–100
–125
0246
POWER SUPPLY REJECTION vs RIPPLE FREQUENCY
0
–10
V
= 20mV
–20 –30 –40 –50 –60 –70
Power Supply Rejection (dB)
–80 –90
RIPPLE
1 10 100 1000 10000
4096 POINT FFT
Frequency (kHz)
Ripple Frequency (kHz)
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE
10
9 8 7 6 5 4 3 2
Peak-to-Peak Noise (LSB)
1 0
0.1 1 10 Reference Voltage (V)
0.15
0.1
0.05
0
–0.05
Delta from 25°C (LSB)
–0.1
–0.15
–55 –40 –25 0 25 70 85
CHANGE GAIN vs TEMPERATURE
Temperature (°C)
POWER DOWN SUPPLY CURRENT
vs TEMPERATURE
3
2.5
2
1.5
1
Supply Current (µA)
0.5
0
–55 –40 –25 0 25 70 85
Temperature (°C)
®
ADS1286
400
350
300
250
200
Supply Current (µA)
150
100
–55 –40 –25 0 25 70 85
SUPPLY CURRENT vs TEMPERATURE
f
= 12.5kHz
SAMPLE
f
= 1.6kHz
SAMPLE
Temperature (°C)
6
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
3.0
2.0
1.0
0
–1.0
–2.0
Integral Linearity Error (LSB)
–3.0
INTEGRAL LINEARITY ERROR vs CODE
0 2048 4095
Code
DIGITAL INPUT LINE THRESHOLD
vs SUPPLY VOLTAGE
3
2.5
2
1.5
1
0.5
Digital Input Threshold Voltage (V)
0
3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
Supply Voltage (V)
INPUT LEAKAGE CURRENT vs TEMPERATURE
10
1
0.1
Leakage Current (nA)
0.01 –55 –40 –25 0 25 70 85
Temperature (°C)
®
7
ADS1286
TIMING DIAGRAMS AND TEST CIRCUITS
1.4V
DCLOCK
D
OUT
Voltage Waveforms for D
CS/SHDN
D
OUT
Load Circuit for t
V
IL
t
hDO
t
dDO
3k
100pF C
LOAD
, tr, and t
dDO
Delay Times, t
OUT
Test Point
f
V
IH
dDO
V
D
OUT
t
r
Voltage Waveforms for D
Rise and Fall Times tr, and t
OUT
OH
V
OL
t
f
f
Test Point
V
CC
t
den
dis
t
dis
Waveform 2, t
Waveform 1
en
D
V
OH
V
OL
OUT
3k
100pF C
LOAD
Load Circuit for t
dis
and t
CS/SHDN
D
Waveform 1
D
Waveform 2
OUT
(1)
OUT
(2)
Voltage Waveforms for t
t
dis
dis
90%
10%
NOTES: (1) Waveform 1 is for an output with internal conditions such that the output is HIGH unless disabled by the output control. (2) Waveform 2 is for an output with internal conditions such that the output is LOW unless disabled by the output control.
DCLOCK
D
OUT
1
2
Voltage Waveforms for t
V
OL
B11
t
en
en
®
ADS1286
8
CS/SHDN
1000
100
10
1
Supply Current (µA)
0.1k 1k 10k 100k Sample Rate (kHz)
TA = 25°C
V
CC
= 5V
V
REF
= 5V
f
CLK
= 16 • f
SAMPLE
DCLOCK
D
OUT
CS/SHDN
DCLOCK
D
OUT
t
CYC
t
SUCS
t
CSD
NULL
BIT
B11
B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
t
SMPL
Note: (1) After completing the data transfer, if further clocks are applied with CS LOW, the ADC will output LSB-First data then followed with zeroes indefinitely.
HI-Z HI-Z
t
SMPL
Note: (2) After completing the data transfer, if further clocks are applied with CS LOW, the ADC will output zeroes indefinitely.
t
DATA
becomes a high impedance node, leaving the CLK running to clock out LSB-First data or zeroes.
(MSB)
t
SUCS
t
CSD
NULL
BIT
B11
B10 B9 B8 B7 B6 B5 B4 B4B3 B3B2 B2B1 B1B0
(MSB)
: During this time, the bias current and the comparator power down and the reference input
t
CONV
t
t
CONV
CYC
POWER DOWN
NULL
HI-ZHI-Z
(1)
t
DATA
BIT
B11 B10 B9 B8
POWER DOWN
B5 B6 B7 B8 B9 B10 B11
t
DATA
(2)
FIGURE 1. ADS1286 Operating Sequence.
SERIAL INTERF ACE
The ADS1286 communicates with microprocessors and other external digital systems via a synchronous 3-wire serial inter­face. DCLOCK synchronizes the data transfer with each bit being transmitted on the falling DCLOCK edge and captured
leaving the DCLOCK running to clock out the LSB first data or zeroes. If the CS input is not running rail-to-rail, the input logic buffer will draw current. This current may be large compared to the typical supply current. To obtain the lowest supply current, bring the CS pin to ground when it is low and to supply voltage when it is high.
on the rising DCLOCK edge in the receiving system. A falling CS initiates data transfer as shown in Figure 1. After CS falls, the second DCLOCK pulse enables D the A/D conversion result is output on the D
. After one null bit,
OUT
line. Bringing
OUT
CS high resets the ADS1286 for the next data exchange.
MICROPOWER OPERA TION
With typical operating currents of 250µA and automatic shutdown between conversions, the ADS1286 achieves ex­tremely low power consumption over a wide range of sample rates (see Figure 2). The auto-shutdown allows the supply current to drop with sample rate.
SHUTDOWN
The ADS1286 is equipped with automatic shutdown fea­tures. The device draws power when the CS pin is LOW and shuts down completely when the pin is HIGH. The bias circuit and comparator powers down and the reference input becomes high impedance at the end of each conversion
FIGURE 2. Automatic Power Shutdown Between Conver-
sions Allows Power Consumption to Drop with Sample Rate.
®
9
ADS1286
MINIMIZING POWER DISSIPATION
In systems that have significant time between conversions, the lowest power drain will occur with the minimum CS LOW time. Bringing CS LOW, transferring data as quickly as possible, and then bringing it back HIGH will result in the lowest current drain. This minimizes the amount of time the device draws power. After a conversion the A/D automati­cally shuts down even if CS is held LOW. If the clock is left running to clock out LSB-data or zero, the logic will draw a small amount of current (see Figure 3).
6.00 TA = 25°C
= +5V
V
CC
5.00 V
= +5V
REF
f
= 16 • f
CLK
4.00
3.00
2.00
Supply Current (µA)
1.00
0.00
0.1 1 10 100
SAMPLE
Sample Rate (kHz)
CS = LOW
(GND)
CS HIGH
(V
CC
)
FIGURE 3. Shutdown Current with CS HIGH is Lower than
with CS LOW.
RC INPUT FILTERING
REDUCED REFERENCE OPERATION
The effective resolution of the ADS1286 can be increased by reducing the input span of the converter. The ADS1286 exhibits good linearity and gain over a wide range of reference voltages (see Typical Performance Curves “ Change in Linearity vs Reference Voltage” and “Change in Gain vs Reference Voltage”). However, care must be taken when operating at low values of V size and the resulting higher accuracy requirement placed on the converter. The following factors must be considered when operating at low V
1. Offset
2. Noise
OFFSET WITH REDUCED V
The offset of the ADS1286 has a larger effect on the output code. When the ADC is operated with reduced reference voltage. The offset (which is typically a fixed voltage) becomes a larger fraction of an LSB as the size of the LSB is reduced. The Typical Performance Curve “Change in Offset vs Reference Voltage” shows how offset in LSBs is related to reference voltage for a typical value of VOS. For example, a VOS of 122µV which is 0.1 LSB with a 5V reference becomes 0.5LSB with a 1V reference and 2.5LSBs with a 0.2V reference. If this offset is unacceptable, it can be corrected digitally by the receiving system or by offsetting the negative input of the ADS1286.
because of the reduced LSB
REF
values:
REF
REF
It is possible to filter the inputs with an RC network as shown in Figure 4. For large values of C
FILTER
(e.g., 1µF),
the capacitive input switching currents are averaged into a net DC current. Therefore, a filter should be chosen with a small resistor and large capacitor to prevent DC drops across the resistor. The magnitude of the DC current is approxi­mately IDC = 20pF x VIN/t
and is roughly proportional to
CYC
VIN. When running at the minimum cycle time of 64µs, the input current equals 1.56µA at VIN = 5V. In this case, a filter resistor of 75 will cause 0.1LSB of full-scale error. If a larger filter resistor must be used, errors can be eliminated by increasing the cycle time.
R
V
IN
FILTER
I
DC
C
FILTER
ADS1286
FIGURE 4. RC Input Filtering.
NOISE WITH REDUCED V
REF
The total input referred noise of the ADS1286 can be reduced to approximately 200µV peak-to-peak using a ground plane, good bypassing, good layout techniques and minimiz­ing noise on the reference inputs. This noise is insignificant with a 5V reference but will become a larger fraction of an LSB as the size of the LSB is reduced.
For operation with a 5V reference, the 200µV noise is only
0.15LSB peak-to-peak. In this case, the ADS1286 noise will contribute virtually no uncertainty to the output code. How­ever, for reduced references, the noise may become a signifi­cant fraction of an LSB and cause undesirable jitter in the output code. For example, with a 2.5V reference this same 200µV noise is 0.3LSB peak-to-peak. If the reference is further reduced to 1V, the 200µV noise becomes equal to
0.8LSBs and a stable code may be difficult to achieve. In this case averaging multiple readings may be necessary.
®
ADS1286
10
+5V
TC
1
Thermocouple
D
1
TC
2
TC
3
ISO Thermal Block
R
1
150k
R
2
59k
R
4
1k
1M
C
10µF
+5V
R
7
10
C
R
3
500k
R
6
0.1µF
4
R
500
5
V
REF
C
3
ADS1286
U
1
C
5
0.1µF
0.1µF
DCLOCK D
OUT
CS/SHDN
2
OPA237
U
2
+5V
µP
3-Wire
Interface
U
4
FIGURE 5. Thermocouple Application Using a MUX to Scale the Input Range of the ADS1286.
+V
CC
C
10µF
R
8
46k
0.4V
R
9
1k
0.3V
R
1
MUX
1k
10
0.2V
R
11
A
0
A
1
U
3
1k
R
1k
0.1V
12
REF200
(100µA)
RTD
FIGURE 6. ADS1286 with RTD Sensor.
2
3
V
REF
ADS1286
81
4
0.1µF
DCLOCK D
OUT
CS/SHDN
µP
11
®
ADS1286
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
ADS1286P ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PA ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PB ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PBG4 ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PC ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PG4 ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PK ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286PL ACTIVE PDIP P 8 50 Green (RoHS &
ADS1286U ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
ADS1286U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
ADS1286UA ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
ADS1286UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
ADS1286UAG4 ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UB ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UBG4 ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UC ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UCG4 ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UG4 ACTIVE SOIC D 8 100 TBD Call TI Call TI
ADS1286UK ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UKG4 ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UL ACTIVE SOIC D 8 100 Green (RoHS &
ADS1286UL/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
ADS1286ULG4 ACTIVE SOIC D 8 100 Green (RoHS &
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
8-Aug-2006
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
(1)
The marketing status values are defined as follows:
8-Aug-2006
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 2
IMPORTANT NOTICE
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