The ADS1286 is a 12-bit, 20kHz analog-to-digital
converter with a differential input and sample and hold
amplifier and consumes only 250µA of supply current. The ADS1286 offers an SPI and SSI compatible
serial interface for communications over a two or three
wire interface. The combination of a serial two wire
interface and micropower consumption makes the
ADS1286 ideal for remote applications and for those
requiring isolation.
The ADS1286 is available in a 8-pin plastic mini DIP
and a 8-lead SOIC.
Control
SBAS053
V
REF
D
+In
–In
S/H Amp
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Resolution12✻✻Bits
No Missing Codes12✻✻Bits
Integral Linearity±1±2✻✻±0.5±1LSB
Differential Linearity±0.5±1.0✻±0.75±0.25±0.75LSB
Offset Error0.75±3✻✻✻✻LSB
Gain Error±2±8✻✻✻✻LSB
Noise50✻✻µVrms
Power Supply Rejection82✻✻dB
SAMPLING DYNAMICS
Conversion Time12✻✻
Acquisition Time1.5✻✻
Small Signal Bandwidth500✻✻kHz
External Reference Voltage .............................................................. +5.5V
NOTE: (1) Stresses above these ratings may permanently damage the device.
(1)
+ 300mV)
CC
+ 300mV)
CC
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. BurrBrown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
ESD damage can range from subtle performance degrada-
PIN CONFIGURATION
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
V
REF
+In
–In
GND
1
2
3
4
8-Pin Mini PDIP
8-Lead SOIC
ADS1286
8
7
6
5
+V
CC
DCLOCK
D
OUT
CS/SHDN
published specifications.
PIN ASSIGNMENTS
PINNAMEDESCRIPTION
1V
2+InNon Inverting Input.
3–InInverting Input. Connect to ground or remote ground sense point.
4GNDGround.
5CS/SHDNChip Select when low, Shutdown Mode when high.
6D
7DCLOCKData Clock synchronizes the serial data transfer and determines conversion speed.
8+V
REF
OUT
Reference Input.
The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The
second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.
Power Supply.
CC
PACKAGE/ORDERING INFORMATION
PRODUCTLINEARITY RANGEPACKAGENUMBER
INTEGRALTEMPERATUREDRAWING
ADS1286P±20°C to +70°CPlastic DIP006
ADS1286PK±20°C to +70°CPlastic DIP006
ADS1286PL±10°C to +70°CPlastic DIP006
ADS1286U±20°C to +70°CSOIC182
ADS1286UK±20°C to +70°CSOIC182
ADS1286UL±10°C to +70°CSOIC182
ADS1286PA±2–40°C to +85°CPlastic DIP006
ADS1286PB±2–40°C to +85°CPlastic DIP006
ADS1286PC±1–40°C to +85°CPlastic DIP006
ADS1286UA±2–40°C to +85°CSOIC182
ADS1286UB±2–40°C to +85°CSOIC182
ADS1286UC±1–40°C to +85°CSOIC182
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix
C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
PACKAGE
(1)
®
3
ADS1286
TYPICAL PERFORMANCE CURVES
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
2.5
2.0
1.5
1.0
Reference Current (µA)
0.5
0
5
4.5
4
3.5
3
2.5
2
1.5
Change in Offset (LSB)
1
0.5
0
REFERENCE CURRENT vs SAMPLE RATE
024681012
Sample Rate (kHz)
CHANGE IN OFFSET vs REFERENCE VOLTAGE
12345
Reference Voltage (V)
4.0
3.5
3.0
2.5
2.0
Reference Current (µA)
1.5
1.0
0.6
0.4
0.2
0
–0.2
Delta from 25°C (LSB)
–0.4
–0.6
REFERENCE CURRENT vs TEMPERATURE
–55–40–250257085
Temperature (°C)
CHANGE IN OFFSET vs TEMPERATURE
–55–40–250257085
Temperature (°C)
CHANGE IN INTEGRAL LINEARITY AND DIFFERENTIAL
0.10
0.05
0.00
–0.05
–0.10
–0.15
Delta from +5V Reference (LSB)
–0.20
12345
LINEARITY vs REFERENCE VOLTAGE
Change in Differential
Linearity (LSB)
Change in Integral
Linearity (LSB)
Reference Voltage (V)
®
ADS1286
CHANGE IN GAIN vs REFERENCE VOLTAGE
4
3.5
3
2.5
2
1.5
1
Change in Gain (LSB)
0.5
0
12345
Reference Voltage (V)
4
DIFFERENTIAL LINEARITY ERROR vs CODE
3.0
2.0
1.0
0
–1.0
–2.0
–3.0
Differential Linearity Error (LSB)
020484095
Code
TYPICAL PERFORMANCE CURVES (CONT)
TOTAL HARMONIC DISTORTION vs FREQUENCY
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Total Harmonic Distortion (dB)
0.1110
Frequency (kHz)
At TA = +25, VCC = +5V, V
12
11.75
11.5
11.25
11
10.75
10.5
Effective Number of Bits (rms)
10.25
10
0.1110
= +5V, f
REF
EFFECTIVE NUMBER OF BITS
vs REFERENCE VOLTAGE
Reference Voltage (V)
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
SIGNAL-TO-(NOISE + DISTORTION)
100
90
80
70
60
50
40
30
20
Signal-to-(Noise + Distortion) (dB)
10
0
0.1110
SIGNAL-TO-(NOISE + DISTORTION) vs INPUT LEVEL
80
70
60
50
40
30
20
10
Signal-to-(Noise + Distortion) (dB)
0
–40–35–30–25–20–15–10–50
vs FREQUENCY
Frequency (kHz)
Input Level (dB)
SPURIOUS FREE DYNAMIC RANGE
100
and Signal-to-Noise Ratio (dB)
Spurious Free Dynamic Range
5
AND SIGNAL-TO-NOISE RATIO vs FREQUENCY
90
80
70
60
50
40
30
20
10
0
0.1110
Spurious Free Dynamic Range
Signal-to-Noise Ratio
Frequency (kHz)
ADS1286
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
0
–25
–50
–75
Magnitude (dB)
–100
–125
0246
POWER SUPPLY REJECTION vs RIPPLE FREQUENCY
0
–10
V
= 20mV
–20
–30
–40
–50
–60
–70
Power Supply Rejection (dB)
–80
–90
RIPPLE
110100100010000
4096 POINT FFT
Frequency (kHz)
Ripple Frequency (kHz)
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE
10
9
8
7
6
5
4
3
2
Peak-to-Peak Noise (LSB)
1
0
0.1110
Reference Voltage (V)
0.15
0.1
0.05
0
–0.05
Delta from 25°C (LSB)
–0.1
–0.15
–55–40–250257085
CHANGE GAIN vs TEMPERATURE
Temperature (°C)
POWER DOWN SUPPLY CURRENT
vs TEMPERATURE
3
2.5
2
1.5
1
Supply Current (µA)
0.5
0
–55–40–250257085
Temperature (°C)
®
ADS1286
400
350
300
250
200
Supply Current (µA)
150
100
–55–40–250257085
SUPPLY CURRENT vs TEMPERATURE
f
= 12.5kHz
SAMPLE
f
= 1.6kHz
SAMPLE
Temperature (°C)
6
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, V
= +5V, f
REF
SAMPLE
= 12.5kHz, f
CLK
= 16 • f
, unless otherwise specified.
SAMPLE
3.0
2.0
1.0
0
–1.0
–2.0
Integral Linearity Error (LSB)
–3.0
INTEGRAL LINEARITY ERROR vs CODE
020484095
Code
DIGITAL INPUT LINE THRESHOLD
vs SUPPLY VOLTAGE
3
2.5
2
1.5
1
0.5
Digital Input Threshold Voltage (V)
0
3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
Supply Voltage (V)
INPUT LEAKAGE CURRENT vs TEMPERATURE
10
1
0.1
Leakage Current (nA)
0.01
–55–40–250257085
Temperature (°C)
®
7
ADS1286
TIMING DIAGRAMS AND TEST CIRCUITS
1.4V
DCLOCK
D
OUT
Voltage Waveforms for D
CS/SHDN
D
OUT
Load Circuit for t
V
IL
t
hDO
t
dDO
3kΩ
100pF
C
LOAD
, tr, and t
dDO
Delay Times, t
OUT
Test Point
f
V
IH
dDO
V
D
OUT
t
r
Voltage Waveforms for D
Rise and Fall Times tr, and t
OUT
OH
V
OL
t
f
f
Test Point
V
CC
t
den
dis
t
dis
Waveform 2, t
Waveform 1
en
D
V
OH
V
OL
OUT
3kΩ
100pF
C
LOAD
Load Circuit for t
dis
and t
CS/SHDN
D
Waveform 1
D
Waveform 2
OUT
(1)
OUT
(2)
Voltage Waveforms for t
t
dis
dis
90%
10%
NOTES: (1) Waveform 1 is for an output with internal conditions such that
the output is HIGH unless disabled by the output control. (2) Waveform 2
is for an output with internal conditions such that the output is LOW unless
disabled by the output control.
DCLOCK
D
OUT
1
2
Voltage Waveforms for t
V
OL
B11
t
en
en
®
ADS1286
8
CS/SHDN
1000
100
10
1
Supply Current (µA)
0.1k1k10k100k
Sample Rate (kHz)
TA = 25°C
V
CC
= 5V
V
REF
= 5V
f
CLK
= 16 • f
SAMPLE
DCLOCK
D
OUT
CS/SHDN
DCLOCK
D
OUT
t
CYC
t
SUCS
t
CSD
NULL
BIT
B11
B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
t
SMPL
Note: (1) After completing the data transfer, if further clocks are applied with CS
LOW, the ADC will output LSB-First data then followed with zeroes indefinitely.
HI-ZHI-Z
t
SMPL
Note: (2) After completing the data transfer, if further clocks are applied with CS
LOW, the ADC will output zeroes indefinitely.
t
DATA
becomes a high impedance node, leaving the CLK running to clock out LSB-First data or zeroes.
(MSB)
t
SUCS
t
CSD
NULL
BIT
B11
B10 B9 B8 B7 B6 B5 B4B4B3B3B2B2B1B1B0
(MSB)
: During this time, the bias current and the comparator power down and the reference input
t
CONV
t
t
CONV
CYC
POWER
DOWN
NULL
HI-ZHI-Z
(1)
t
DATA
BIT
B11 B10 B9 B8
POWER DOWN
B5 B6 B7 B8 B9 B10 B11
t
DATA
(2)
FIGURE 1. ADS1286 Operating Sequence.
SERIAL INTERF ACE
The ADS1286 communicates with microprocessors and other
external digital systems via a synchronous 3-wire serial interface. DCLOCK synchronizes the data transfer with each bit
being transmitted on the falling DCLOCK edge and captured
leaving the DCLOCK running to clock out the LSB first
data or zeroes. If the CS input is not running rail-to-rail, the
input logic buffer will draw current. This current may be
large compared to the typical supply current. To obtain the
lowest supply current, bring the CS pin to ground when it is
low and to supply voltage when it is high.
on the rising DCLOCK edge in the receiving system. A falling
CS initiates data transfer as shown in Figure 1. After CS falls,
the second DCLOCK pulse enables D
the A/D conversion result is output on the D
. After one null bit,
OUT
line. Bringing
OUT
CS high resets the ADS1286 for the next data exchange.
MICROPOWER OPERA TION
With typical operating currents of 250µA and automatic
shutdown between conversions, the ADS1286 achieves extremely low power consumption over a wide range of
sample rates (see Figure 2). The auto-shutdown allows the
supply current to drop with sample rate.
SHUTDOWN
The ADS1286 is equipped with automatic shutdown features. The device draws power when the CS pin is LOW and
shuts down completely when the pin is HIGH. The bias
circuit and comparator powers down and the reference input
becomes high impedance at the end of each conversion
FIGURE 2. Automatic Power Shutdown Between Conver-
sions Allows Power Consumption to Drop with
Sample Rate.
®
9
ADS1286
MINIMIZING POWER DISSIPATION
In systems that have significant time between conversions,
the lowest power drain will occur with the minimum CS
LOW time. Bringing CS LOW, transferring data as quickly
as possible, and then bringing it back HIGH will result in the
lowest current drain. This minimizes the amount of time the
device draws power. After a conversion the A/D automatically shuts down even if CS is held LOW. If the clock is left
running to clock out LSB-data or zero, the logic will draw a
small amount of current (see Figure 3).
6.00
TA = 25°C
= +5V
V
CC
5.00
V
= +5V
REF
f
= 16 • f
CLK
4.00
3.00
2.00
Supply Current (µA)
1.00
0.00
0.1110100
SAMPLE
Sample Rate (kHz)
CS = LOW
(GND)
CS HIGH
(V
CC
)
FIGURE 3. Shutdown Current with CS HIGH is Lower than
with CS LOW.
RC INPUT FILTERING
REDUCED REFERENCE
OPERATION
The effective resolution of the ADS1286 can be increased
by reducing the input span of the converter. The ADS1286
exhibits good linearity and gain over a wide range of
reference voltages (see Typical Performance Curves “ Change
in Linearity vs Reference Voltage” and “Change in Gain vs
Reference Voltage”). However, care must be taken when
operating at low values of V
size and the resulting higher accuracy requirement placed on
the converter. The following factors must be considered
when operating at low V
1. Offset
2. Noise
OFFSET WITH REDUCED V
The offset of the ADS1286 has a larger effect on the output
code. When the ADC is operated with reduced reference
voltage. The offset (which is typically a fixed voltage)
becomes a larger fraction of an LSB as the size of the LSB
is reduced. The Typical Performance Curve “Change in
Offset vs Reference Voltage” shows how offset in LSBs is
related to reference voltage for a typical value of VOS. For
example, a VOS of 122µV which is 0.1 LSB with a 5V
reference becomes 0.5LSB with a 1V reference and 2.5LSBs
with a 0.2V reference. If this offset is unacceptable, it can be
corrected digitally by the receiving system or by offsetting
the negative input of the ADS1286.
because of the reduced LSB
REF
values:
REF
REF
It is possible to filter the inputs with an RC network as
shown in Figure 4. For large values of C
FILTER
(e.g., 1µF),
the capacitive input switching currents are averaged into a
net DC current. Therefore, a filter should be chosen with a
small resistor and large capacitor to prevent DC drops across
the resistor. The magnitude of the DC current is approximately IDC = 20pF x VIN/t
and is roughly proportional to
CYC
VIN. When running at the minimum cycle time of 64µs, the
input current equals 1.56µA at VIN = 5V. In this case, a filter
resistor of 75Ω will cause 0.1LSB of full-scale error. If a
larger filter resistor must be used, errors can be eliminated
by increasing the cycle time.
R
V
IN
FILTER
I
DC
C
FILTER
ADS1286
FIGURE 4. RC Input Filtering.
NOISE WITH REDUCED V
REF
The total input referred noise of the ADS1286 can be
reduced to approximately 200µV peak-to-peak using a ground
plane, good bypassing, good layout techniques and minimizing noise on the reference inputs. This noise is insignificant
with a 5V reference but will become a larger fraction of an
LSB as the size of the LSB is reduced.
For operation with a 5V reference, the 200µV noise is only
0.15LSB peak-to-peak. In this case, the ADS1286 noise will
contribute virtually no uncertainty to the output code. However, for reduced references, the noise may become a significant fraction of an LSB and cause undesirable jitter in the
output code. For example, with a 2.5V reference this same
200µV noise is 0.3LSB peak-to-peak. If the reference is
further reduced to 1V, the 200µV noise becomes equal to
0.8LSBs and a stable code may be difficult to achieve. In
this case averaging multiple readings may be necessary.
®
ADS1286
10
+5V
TC
1
Thermocouple
D
1
TC
2
TC
3
ISO Thermal Block
R
1
150kΩ
R
2
59kΩ
R
4
1kΩ
1MΩ
C
10µF
+5V
R
7
10Ω
C
R
3
500kΩ
R
6
0.1µF
4
R
500Ω
5
V
REF
C
3
ADS1286
U
1
C
5
0.1µF
0.1µF
DCLOCK
D
OUT
CS/SHDN
2
OPA237
U
2
+5V
µP
3-Wire
Interface
U
4
FIGURE 5. Thermocouple Application Using a MUX to Scale the Input Range of the ADS1286.
+V
CC
C
10µF
R
8
46kΩ
0.4V
R
9
1kΩ
0.3V
R
1
MUX
1kΩ
10
0.2V
R
11
A
0
A
1
U
3
1kΩ
R
1kΩ
0.1V
12
REF200
(100µA)
RTD
FIGURE 6. ADS1286 with RTD Sensor.
2
3
V
REF
ADS1286
81
4
0.1µF
DCLOCK
D
OUT
CS/SHDN
µP
11
®
ADS1286
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
ADS1286PACTIVEPDIPP850Green (RoHS &
ADS1286PAACTIVEPDIPP850Green (RoHS &
ADS1286PBACTIVEPDIPP850Green (RoHS &
ADS1286PBG4ACTIVEPDIPP850Green (RoHS &
ADS1286PCACTIVEPDIPP850Green (RoHS &
ADS1286PG4ACTIVEPDIPP850Green (RoHS &
ADS1286PKACTIVEPDIPP850Green (RoHS &
ADS1286PLACTIVEPDIPP850Green (RoHS &
ADS1286UACTIVESOICD8100 Green (RoHS &
ADS1286U/2K5ACTIVESOICD82500 Green (RoHS &
ADS1286U/2K5G4ACTIVESOICD82500 Green (RoHS &
ADS1286UAACTIVESOICD8100 Green (RoHS &
ADS1286UA/2K5ACTIVESOICD82500 Green (RoHS &
ADS1286UA/2K5G4ACTIVESOICD82500 Green (RoHS &
ADS1286UAG4ACTIVESOICD8100 Green (RoHS &
ADS1286UBACTIVESOICD8100 Green (RoHS &
ADS1286UBG4ACTIVESOICD8100 Green (RoHS &
ADS1286UCACTIVESOICD8100 Green (RoHS &
ADS1286UCG4ACTIVESOICD8100 Green (RoHS &
ADS1286UG4ACTIVESOICD8100TBDCall TICall TI
ADS1286UKACTIVESOICD8100 Green (RoHS &
ADS1286UKG4ACTIVESOICD8100 Green (RoHS &
ADS1286ULACTIVESOICD8100 Green (RoHS &
ADS1286UL/2K5ACTIVESOICD82500 Green (RoHS &
ADS1286ULG4ACTIVESOICD8100 Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
8-Aug-2006
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
(1)
The marketing status values are defined as follows:
8-Aug-2006
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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Following are URLs where you can obtain information on other Texas Instruments products and application
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ProductsApplications
Amplifiersamplifier.ti.comAudiowww.ti.com/audio
Data Convertersdataconverter.ti.comAutomotivewww.ti.com/automotive
DSPdsp.ti.comBroadbandwww.ti.com/broadband
Interfaceinterface.ti.comDigital Controlwww.ti.com/digitalcontrol
Logiclogic.ti.comMilitarywww.ti.com/military
Power Mgmtpower.ti.comOptical Networkingwww.ti.com/opticalnetwork
Microcontrollersmicrocontroller.ti.comSecuritywww.ti.com/security
Low Power Wireless www.ti.com/lpwTelephonywww.ti.com/telephony
Video & Imagingwww.ti.com/video
Wirelesswww.ti.com/wireless
Mailing Address:Texas Instruments
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Copyright 2006, Texas Instruments Incorporated
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