The ADS1271 is a 24-bit, delta-sigma analog-to-digital
converter (ADC) with a data rate up to 105kSPS. It offers
a unique combination of excellent DC accuracy and
outstanding AC performance. The high-order,
chopper-stabilized modulator achieves very low drift with
low in-band noise. The onboard decimation filter
suppresses modulator and signal out-of-band noise. The
ADS1271 provides a usable signal bandwidth up to 90%
of the Nyquist rate with less than 0.005dB of ripple.
Traditionally, industrial delta-sigma ADCs offering good
drift performance use digital filters with large passband
droop. As a result, they have limited signal bandwidth and
are mostly suited for DC measurements. High-resolution
ADCs in audio applications offer larger usable bandwidths,
but the offset and drift specification are significantly
weaker than their industrial counterparts. The ADS1271
combines these converters, allowing high-precision
industrial measurement with excellent DC and AC
specifications ensured over an extended industrial
temperature range.
Three operating modes allow for optimization of speed,
resolution, and power. A selectable SPI or a frame-sync
serial interface provides for convenient interfacing to
microcontrollers or DSPs. All operations, including internal
offset calibration, are controlled directly by pins; there are
no registers to program.
VREFP VREFNAVDDDVDD
SYNC/PDWN
MODE
CLK
DRDY/FSYNC
SCLK
DOUT
DIN
FORMAT
AINP
AINN
∆Σ
Modulator
Digital
Filter
Control
Logic
Serial
Interface
DGNDAGND
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
over opera t i n g f r e e - a i r t e m p e r a t ure range u n l e s s o t h e r w i s e n o t e d
ADS1271UNIT
AVDD to AGND−0.3 to +6.0V
DVDD to DGND−0.3 to +3.6V
AGND to DGND−0.3 to +0.3V
100, MomentarymA
10, ContinuousmA
Analog Input to AGND−0.3 to AVDD + 0 .3V
Digital Input or Output to DGND−0.3 to DVDD + 0.3V
Maximum Junction Tem perature+150°C
Operating Temperature Range−40 to +105°C
Storage Temperature Range−60 to +150°C
Lead Temperature (soldering, 10s)+300°C
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only , an d
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(1)
ORDERING INFORMATION
For the most current package and ordering information,
see the Package Option Addendum located at the end of
this data sheet, or refer to our web site at www.ti.com.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible t o damage because very small parametric changes could
cause the device not to meet its published specifications.
2
Differential input
impedance
DATA
Data rate (f
DATA
)
Offset error
Noise
Power-supply
Power-supply
f = 60Hz
Signal-to-noise ratio
Signal-to-noise ratio
(SNR)
(2)
Stop band
Group delay
Group delay
Settling time (latency)
Settling time (latency)
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SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
ELECTRICAL CHARACTERISTICS
All specifications at TA = −40°C to +105°C, AVDD = +5V, DVDD = +1.8V, f
PARAMETERTEST CONDITIONSMINTYPMAX
Analog Inputs
Full-scale input voltage (FSR)
Absolute input voltageAINP or AINN to AGNDAGND – 0.1AVDD + 0.1V
Common-mode input voltageVCM = (AINP + AINN)/22.5V
DC Performance
ResolutionNo missing codes24Bits
Data rate (f
Integral nonlinearity (INL)Differential input, VCM = 2.5V± 0.0006± 0.0015 % of FSR
Offset drift1.8µV/_C
Gain error0.10.5%
Gain error drift2ppm/°C
Noise
Common-mode rejectionfCM = 60Hz90100dB
rejection
AC Performance
(2)
(SNR)
(unweighted)
Total harmonic distortion(THD)
Spurious free dynamic range−108dB
Passband ripple±0.005dB
Passband0.453 f
−3dB Bandwidth0.49 f
Stop band attenuation100dB
Stop band
(1)
FSR = full-scale range = 2V
(2)
Minimum SNR is ensured by the limit of the DC noise specification.
(3)
THD includes the first nine harmonics of the input signals.
If FORMAT = 0 (SPI), then pin 10 = DRDY output
If FORMAT = 1 (Frame-Sync), then pin 10 = FSYNC input
5
CONV
DATA
t
CONV
Conversion period (1/f
DATA
)
www.ti.com
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
TIMING CHARACTERISTICS: SPI FORMAT
t
CLK
CLK
t
CD
DRDY
t
DS
SCLK
t
DDO
DOUT
DIN
Bit 23 (MSB)Bit 22Bit 21
TIMING REQUIREMENTS: SPI FORMAT
For TA = −40°C to +105°C and DVDD = 1.65V to 3.6V.
SYMBOLPARAMETERMINTYPMAXUNIT
t
CLK
t
CPW
t
(1)
t
CD
(1)
t
DS
(1)
t
DDO
(1)
t
SD
t
S
t
SPW
t
DOHD
t
DOPD
t
DIST
t
DIHD
(1)
Load on DRDY and DOUT = 20pF.
CLK period (1/f
)371000ns
CLK
CLK positive or negative pulse width15ns
High-Speed mode256CLK periods
Conversion period (1/f
High-Resolution mode512CLK periods
)
Low-Power mode512CLK periods
Falling edge of CLK to falling edge of DRDY8ns
Falling edge of DRDY to rising edge of first SCLK to retrieve data5ns
Valid DOUT to falling edge of DRDY0ns
Falling edge of SCLK to rising edge of DRDY8ns
SCLK periodt
SCLK positive or negative pulse width12ns
(1)
SCLK falling edge to old DOUT invalid (hold time)5ns
(1)
SCLK falling edge to new DOUT valid (propagation delay)12ns
New DIN valid to falling edge of SCLK (setup time)6ns
Old DIN valid to falling edge of SCLK (hold time)6ns
t
t
SPW
CPW
t
SD
t
•••
CPW
t
DIST
t
CONV
t
S
t
DOHD
t
DIHD
t
SPW
t
DOPD
CLK
ns
6
www.ti.com
FRAME
DATA
t
FRAME
Frame period (1/f
DATA
)
S
τ
S
be continuously running)
TIMING CHARACTERISTICS: FRAME-SYNC FORMAT
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
t
CPW
•••
t
CPW
t
SPW
t
DIST
t
FRAME
t
FPW
t
S
t
DOHD
t
DIHD
t
SPW
t
DOPD
t
SF
t
FS
CLK
FSYNC
SCLK
DOUT
DIN
τ
C
t
CF
t
FPW
t
SPW
t
DDO
Bit 23(MSB)Bit 22Bit 21
TIMING REQUIREMENTS: FRAME-SYNC FORMAT
for TA = −40°C to +105°C and DVDD = 1.65V to 3.6V.
SYMBOLPARAMETERMINTYPMAXUNIT
t
CLK
t
CPW
t
CS
t
t
FPW
t
FS
t
SF
τ
t
SPW
t
DOHD
t
DOPD
t
DDO
t
DIST
t
DIHD
(1)
The ADS1271 automatically detects either frame period.
(2)
Load on DOUT = 20pF.
CLK period (1/f
)371000ns
CLK
CLK positive or negative pulse width15ns
Rising edge of CLK to falling edge of SCLK−28ns
High-Speed mode256CLK periods
Frame period (1/f
High-Resolution mode256 or 512
)
Low-Power mode256 or 512
(1)
(1)
FSYNC positive or negative pulse width1SCLK periods
Rising edge of FSYNC to rising edge of SCLK5ns
Rising edge of SCLK to rising edge of FSYNC5ns
SCLK period (SCLK must
High-Resolution modeτ
FRAME
Low-Power modeτ
High-Speed modeτ
SCLK positive or negative pulse width0.4τ
(2)
SCLK falling edge to old DOUT invalid (hold time)5ns
(2)
SCLK falling edge to new DOUT valid (propagation delay)12ns
(2)
Valid DOUT to falling edge of FSYNC0ns
SCLK
/64τ
FRAME
/128τ
/64τ
FRAME
0.6τ
SCLK
New DIN valid to falling edge of SCLK (setup time)6ns
Old DIN valid to falling edge of SCLK (hold time)6ns
The ADS1271 is a 24-bit, delta-sigma ADC. It offers the
combination of outstanding DC accuracy and superior AC
performance. Figure 37 shows the block diagram for the
ADS1271. The ADS1271 converter is comprised of an
advanced, 6th-order, chopper-stabilized, delta-sigma
modulator followed by a low-ripple, linear phase FIR filter.
The modulator measures the differential input signal,
V
= (AINP – AINN), against the differential reference,
IN
= (VREFP – VREFN). The digital filter receives the
V
REF
modulator signal and provides a low-noise digital output.
To allow tradeoffs among speed, resolution, and power,
three modes of operation are supported on the ADS1271:
High-Speed, High-Resolution, and Low-Power. Table 1
VREFP
VREFN
Σ
V
REF
AINP
AINN
V
Σ
IN
∆Σ
Modulator
www.ti.com
summarizes the performance of each mode.
In High-Speed mode, the data rate is 105kSPS; in
High-Resolution mode, the SNR = 109dB; and in
Low-Power mode, the power dissipation is only 35mW.
The ADS1271 is configured by simply setting the
appropriate IO pins—there are no registers to program.
Data is retrieved over a serial interface that supports both
SPI and Frame-Sync formats. The ADS1271 has a
daisy-chainable output and the ability to synchronize
externally, so it can be used conveniently in multichannel
systems.
SYNC/PDWN
MODE
CLK
Digital
Filter
SPI
or
Frame−
Sync
Serial
Interface
DRDY/FSYNC
SCLK
DOUT
DIN
FORMAT
Figure 37. Block Diagram
Table 1. Operating Mode Performance Summary
MODEDATA RATE (SPS)PASSBAND (Hz)SNR (dB)NOISE (µV
High-Speed105,46947,7771069.092
High-Resolution52,73423,8891096.590
Low-Power52,73423,8891069.035
)POWER (mW)
RMS
14
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High-Resolution
Low-Power
ANALOG INPUTS (AINP, AINN)
The ADS1271 measures the differential input signal
V
= (AINP – AINN) against the differential reference
IN
= (VREFP – VREFN). The most positive measurable
V
REF
differential input is +V
positive digital output code of 7FFFFFh. Likewise, the
most negative measurable differential input is −V
which produces the most negative digital output code of
800000h.
While the ADS1271 measures the differential input signal,
the absolute input voltage is also important. This is the
voltage on either input (AINP or AINN) with respect to
AGND. The range for this voltage is:
−0.1V < (AINN or AINP) < AVDD +0.1V
, which produces the most
REF
REF
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
t
=1/f
ON
S1
OFF
ON
,
S2
OFF
SAMPLE
MOD
Figure 39. S1 and S2 Switch Timing for Figure 38
Table 2. Modulator Frequency for the Different
Mode and Format Settings
If either input is taken below –0.1V or above (AVDD + 0.1),
ESD protection diodes on the inputs may turn on.
The ADS1271 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are charged
by the inputs and then discharged. Figure 38 shows a
conceptual diagram of these circuits. Switch S2
represents the net effect of the modulator circuitry in
discharging the sampling capacitor; the actual
implementation is di fferent. The timing for switches S1 and
S2 is shown in Figure 39. The sampling time (t
the inverse of modulator sampling frequency (f
SAMPLE
MOD
) is
) and is
a function of the mode, format, and frequency of CLK, as
shown in Table 2. When using the Frame-Sync format with
High-Resolution or Low-Power modes, the ratio between
f
MOD
and f
depends on the frame period that is set by
CLK
the FSYNC input.
AGND
AVDD
S
AINP
1
S
9pF
2
INTERFACE
MODE
High-SpeedSPI or Frame-Syncf
FORMAT
SPIf
Frame-Syncf
SPIf
Frame-Syncf
CLK
CLK
f
MOD
CLK
CLK
/4 or f
CLK
/8 or f
/4
/4
CLK
/8
CLK
/2
/4
The average load presented by the switched capacitor
input can be modeled with an effective differential
impedance, as shown in Figure 40. Note that the effective
impedance is a function of f
AINP
Zeff = 16.4kΩ×(6.75MHz/f
AINN
MOD
.
)
MOD
AINN
AVDDAGND
ESD Protection
S
1
Figure 38. Equivalent Analog Input Circuitry
Figure 40. Effective Input Impedances
The ADS1271 is a very high-performance ADC. For
optimum performance, it is critical that the appropriate
circuitry be used to drive the ADS1271 inputs. See the
Application Information section for the recommended
circuits.
15
High-Resolution
Low-Power
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
VOLTAGE REFERENCE INPUTS (VREFP,
VREFN)
The voltage reference for the ADS1271 ADC is the
differential voltage between VREFP and VREFN:
V
= (VREFP−VREFN). The reference inputs use a
REF
structure similar to that of the analog inputs with the
equivalent circuitry on the reference inputs shown in
Figure 41. As with the analog inputs, the load presented by
the switched capacitor can be modeled with an effective
impedance, as shown in Figure 42.
VREFP
Figure 41. Equivalent Reference Input Circuitry
VREFPVREFN
Zeff = 4.2kΩ×(6.75MHz/f
Figure 42. Effective Reference Impedance
VREFN
Protection
)
MOD
AVDDAVDD
ESD
ESD diodes protect the reference inputs. To keep these
diodes from turning on, make sure the voltages on the
reference pins do not go below AGND by more than 0.1V,
and likewise do not exceed AVDD by 0.1V:
−0.1V < (VREFP or VREFN) < AVDD + 0.1V
A high-quality reference voltage wi th the appropriate drive
strength is essential for achieving the b est p erformance f rom
the ADS1271. Noise and drift on the reference degrade
overall system performance. See the ApplicationInformation section for example reference circuits.
CLOCK INPUT (CLK)
The ADS1271 requires an external clock signal to be
applied to the CLK input pin. As with any high-speed data
converter, a high-quality, low-jitter clock is essential for
optimum performance. Crystal clock oscillators are the
recommended clock source. Make sure to avoid excess
ringing on the clock input; keeping the clock trace as short
as possible using a 47Ω series resistor will help.
The ratio between the clock frequency and output data rate
is a function of the mode and format. Table 3 shows the
ratios when the SPI format is selected. Also included in this
table is the typical CLK frequency and the corresponding
data rate. When High-Speed mode is used, each
conversion takes 256 CLK periods. When
High-Resolution or Low-Power modes are selected, the
conversions take 512 CLK periods.
Table 4 shows the ratios when the Frame-Sync format is
selected. When using the Frame-Sync format in either
High-Resolution or Low-Power mode, the f
CLK/fDATA
can be 256 or 512. The ADS1271 automatically detects
which ratio is being used. Using a ratio of 512 allows the
CLK frequency to be reduced by a factor of two while
maintaining the same data rate. The output data rate
scales with the clock frequency. See the Serial Interface
section for more details on the Frame-Sync operation.
The ADS1271 supports three modes of operation:
High-Speed, High-Resolution, and Low-Power. The mode
selection is determined by the status of the digital input
MODE pin, as shown in Table 5. A high impedance, or
floating, condition allows the MODE pin to support a third
state. The ADS1271 constantly monitors the status of the
MODE pin during operation and responds to a change in
status after 12,288 CLK periods. When floating the MODE
pin, keep the total capacitance on the pin less than 100pF
and the resistive loading greater than 10MΩ to ensure
proper operation. Changing the mode clears the internal
offset calibration value. If onboard offset calibration is
being used, be sure to recalibrate after a mode change.
When daisy-chaining multiple ADS1271s together and
operating in High-Resolution mode (MODE pin floating), the
MODE pin of e ach d evice m ust be isolated from o ne another;
this ensures p roper d evice operation. T he MODE p ins can b e
tied together for High-Speed and Low-Power modes.
Table 5. Mode Selection
MODE PIN ST ATUSMODE SELECTION
Logic Low (DGND)High-Speed
(1)
Floating
Logic High (DVDD)Low-Power
(1)
Load on MODE: C < 100pF, R > 10MΩ
High-Resolution
When using the SPI format, DRDY is held high after a
mode change occurs until settled (or valid) data is ready,
as shown in Figure 43.
In Frame-Sync format, the DOUT pin is held low after a
mode change occurs until settled data is ready, as shown
in Figure 43. Data can be read from the device to detect
when DOUT changes to logic 1, indicating valid data.
FORMAT SELECTION (FORMAT)
To help connect easily to either microcontrollers or DSPs,
the ADS1271 supports two formats for the serial interface:
an SPI-compatible interface and a Frame-Sync interface.
The format is selected by the FORMAT pin, as shown in
Table 6. It is recommended that the FORMAT pin be
directly tied to the appropriate voltage. If the status of this
pin changes, perform a Sync operation afterwards to
ensure proper operation.
Table 6. Format Selection
FORMAT PIN STATUSSERIAL INTERFACE FORMAT
Logic Low (DGND)SPI
Logic High (DVDD)Frame-Sync
SPI
Format
Frame−Sync
Format
SYMBOL
MODE
Pin
CLK
ADS1271
Mode
DRDY
DOUT
t
MD
t
NDR
High−Speed
t
MD
Time to register MODE changes
Time for new data to be ready
Figure 43. Mode Change Timing
MINTYPMAXUNITSDESCRIPTION
12,288
Low−Power
t
NDR
Low−Power Mode
ValidData Ready
t
NDR
Low−Power Mode
ValidDataonDOUT
128
CLK periods
Conversions
)
(1/f
DATA
17
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
SYNCHRONIZATION
The SYNC/PDWN pin has two functions. When pulsed, it
synchronizes the start of conversions and, if held low for
more than 219 CLK cycles (t
Power-Down mode. See the Power-Down and OffsetCalibration section for more details.
The ADS1271 can be synchronized by taking
SYNC
/PDWN low. This stops the conversion process and
resets the internal counters used by the digital filter. Return
SYNC
/PDWN high on the rising edge of CLK to begin the
conversion process. Synchronization allows the
conversions to be aligned with an external event; for
example, the changing of an external multiplexer on the
analog inputs. It can also be used to synchronize the
conversions of multiple ADS1271s.
), places the ADS1271 in
SYN
CLK
t
SYNC/PDWN
DRDY
SYN
••••••
In the SPI format, DRDY goes high as soon as
/PDWN is taken low, as shown in Figure 44. After
SYNC
SYNC
/PDWN is returned high, DRDY stays high while the
digital filter is settling. Once valid data is ready for retrieval,
DRDY
goes low.
In the Frame-Sync format, DOUT goes low as soon as
SYNC
/PDWN is taken low, as shown in Figure 45. After
SYNC
/PDWN is returned high, DOUT stays low while the
digital filter is settling. Once valid data is ready for retrieval,
DOUT begins to output valid data. The device detects the
state of the SYNC
synchronizing multiple devices, set the SYNC
/PDWN pin on the falling edge. When
/PDWN pin
high on the rising edge of SCLK to ensure all devices are
restarted on the same S C L K p e r i o d . I t is recommended to
leave FSYNC and SCLK running during a
synchronization.
t
NDR
SYMBOL
t
SYN
t
NDR
SYMBOL
t
SYN
t
NDR
MINTYPMAXUNITSDESCRIPTION
Synchronize pulse width
Time for new data to be ready
1CLK periods
128
Figure 44. Synchronization Timing for SPI format
CLK
SYNC/PDWN
FSYNC
DOUT
Synchronize pulse width
Time for new data to be ready
••••••
t
SYN
t
NDR
MINTYPMAXUNITSDESCRIPTION
1CLK periods
128
18
2
Valid Data
18
2
129
Conversions
)
(1/f
DATA
Conversions
)
(1/f
DATA
18
Figure 45. Synchronization Timing for Frame-Sync Format
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SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
POWER-DOWN AND OFFSET CALIBRATION
In addition to controlling synchronization, the
SYNC
/PDWN pin also serves as the control for
Power-Down mode and offset calibration. To enter this
mode, hold the SYNC/PDWN pin low for at least 219 CLK
periods. While in Power-Down mode, both the analog and
digital circuitry are completely deactivated. The digital
inputs are internally disabled so that is not necessary to
shut down CLK and SCLK. To exit Power-Down mode,
return SYNC
The ADS1271 uses a chopper-stabilized modulator to
provide inherently very low offset drift. To further minimize
offset, the ADS1271 automatically performs an offset
self-calibration when exiting Power-Down mode. When
power down completes, the offset self-calibration begins
with the inputs AINP and AINN automatically
disconnected from the signal source and internally shorted
together. There is no need to modify the signal source
applied to the analog inputs during this calibration.
/PDWN high on the rising edge of CLK.
CLK
t
SYNC/PDWN
DRDY
PDWN
It is critical for the reference voltage to be stable when
exiting Power-Down mode; otherwise, the calibration will
be corrupted.
The offset self- calib r at ion on ly removes offset errors internal
to the device, not offset errors due to external sources.
NOTE: When an offset self-calibration is performed, the
resulting offset value will vary each time within the
peak-to-peak noise range of the converter. In High-Speed
mode, this is typically 178 LSBs.
The offset calibration value is cleared whenever the device
mode is changed (for example, from High-Speed mode to
High-Resolution mode).
When using the SPI format, DRDY
will stay high after
exiting Power-Down mode while the digital filter settles, as
shown in Figure 46.
When using the Frame-Sync format, DOUT will stay low
after exiting Power-Down mode while the digital filter
settles, as shown in Figure 47.
••••••
t
OFS
Post−Calibration
Data Ready
Status
ConvertingSyncPower DownConverting
SYMBOL
t
SYNC/PDWN
PDWNpulse width to enter Power−Down mode
t
Time for offset calibrationand filtersettling
OFS
Figure 46. Power-Down Timing for SPI format
CLK
t
SYNC/PDWN
FSYNC
DOUT
Status
SYMBOL
t
PDWN
t
OFS
ConvertingSyncPower DownConverting
SYNC/PDWN
Time for offset calibration and filter settling
PDWN
pulse width to enter Power−Down mode
Offset Cal and Filter Settling
MINTYPMAXUNITSDESCRIPTION
19
2
256
••••••
t
OFS
Offset Cal and Filter Settling
MINTYPMAXUNITSDESCRIPTION
19
2
CLK periods
Conversions
)
(1/f
DATA
Post−Calibration Data
CLK periods
Conversions
257256
(1/f
DATA
)
Figure 47. Power-Down Timing for Frame-Sync Format
19
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
POWER-UP SEQUENCE
The analog and digital supplies should be applied before
any analog or digital input is driven. The power supplies
may be sequenced in any order. Once the supplies and the
voltage reference inputs have stabilized, data can be read
from the device.
FREQUENCY RESPONSE
The digital f ilter s ets t he o verall f requency r esponse. T he f ilter
uses a multi-stage FIR topology to provide linear phase with
minimal passband ripple a nd h igh stopband attenuation. T he
oversampling ratio of the digital filter (that is, the ratio of the
modulator sampling to the output data rate: f
MOD/fDATA
function of the selected mode, as shown in Table 7. f
CLK/2 or CLK/4, depending on the mode.
Table 7. Oversampling Ratio versus Mode
MODEOVERSAMPLING RATIO (f
High-Speed64
High-Resolution128
Low-Power64
MOD/fDATA
High-Speed and Low-Power Modes
The digital filter configuration is the same in both
High-Speed and Low-Power modes with the oversampling
ratio set to 64. Figure 48 shows the frequency response in
High-Speed and Low-Power modes
normalized to f
Figure 49 shows the passband ripple. The transition from
passband to stop band is illustrated in Figure 50. The
overall frequency response repeats at 64x multiples of the
modulator frequency f
, as shown in Figure 51. These
MOD
image frequencies, if present in the signal and not
externally filtered, will fold back (or alias) into the
passband, causing errors. However, with such a wide
stopband, only a simple low-order, antialias filter is
typically required in front of the ADS1271 inputs to limit
out-of-band noise. See Table 8 for more detail.
0
−
20
−
40
−
60
−
80
Amplitude (dB)
−
100
−
120
−
140
00.20.60.81.0
Normalized Input Frequency (f
0.4
IN/fDATA
)
Figure 48. Frequency Response for High-Speed
and Low-Power Modes
) is a
MOD
)
DATA
is
0.02
0
−
0.02
−
0.04
−
Amplitude (dB)
0.06
−
0.08
−
0.10
00.10.30.40.50.6
0.2
Normalized Input Frequency (f
IN/fDATA
)
Figure 49. Passband Response for High-Speed
and Low-Power Modes
0
−
1
−
2
−
3
−
4
−
5
−
6
Amplitude (dB)
−
7
.
−
8
−
9
−
10
0.450.470.490.510.530.55
Normalized Input Frequency (f
IN/fDATA
)
Figure 50. Transition Band Response for
High-Speed and Low-Power Modes
20
0
−
20
−
40
−
60
−
80
Gain (dB)
−
100
−
120
−
140
−
160
016324864
Input Frequency (f
Figure 51. Frequency Response Out to f
High-Speed and Low-Power Modes
IN/fDATA
)
for
MOD
20
www.ti.com
ANTIALIAS
High-Resolution Mode
The oversampling ratio is 128 in High-Resolution mode.
Figure 52 shows the frequency response in
High-Resolution mode normalized to f
. Figure 53
DATA
shows the passband ripple, and the transition from
passband to stop band is illustrated in Figure 54. The
overall frequency response repeats at multiples of the
modulator frequency f
, (128 × f
MOD
), as shown in
DATA
Figure 55. With such an extremely wide stop band, only a
simple antialias filter is typically required in front of the
ADS1271 inputs to limit out-of-band noise. See T able 8 for
more detail.
0
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
0
−
1
−
2
−
3
−
4
−
5
−
6
Amplitude (dB)
−
7
−
8
−
9
−
10
0.450.470.490.510.530.55
Normalized Input Frequency (f
IN/fDATA
)
−
20
−
40
−
60
−
80
Amplitude (dB)
−
100
−
120
−
140
00.250.751
Normalized Input Frequency (f
0.50
IN/fDATA
)
Figure 52. Frequency Response for
High-Resolution Mode
0.02
0
−
0.02
−
0.04
Figure 54. Transition Band Response for
High-Resolution Mode
20
0
−
20
−
40
−
60
−
80
Gain (dB)
−
100
−
120
−
140
−
160
0326496128
Normalized Input Frequency (fIN/f
Figure 55. Frequency Response out to f
High-Resolution Mode
DATA
)
MOD
Table 8. Antialias Filter Order Image Rejection
for
−
Amplitude (dB)
0.06
−
0.08
−
0.10
00.10.30.40.50.6
0.2
Normalized Input Frequency (f
Figure 53. Passband Response for
High-Resolution Mode
IN/fDATA
IMAGE REJECTION (dB)
(f
FIL TER ORDER
at f
−3dB
HS, LPHR
DATA
)
13945
)
27587
3111129
21
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
PHASE RESPONSE
The ADS1271 incorporates a multiple stage, linear phase
digital filter. Linear phase filters exhibit constant delay time
versus input frequency (constant group delay). This
means the time delay from any instant of the input signal
to the same instant of the output data is constant and is
independent of input signal frequency. This behavior
results in essentially zero phase errors when analyzing
multi-tone signals.
SETTLING TIME
As with frequency and phase response, the digital filter
also determines settling time. Figure 56 shows the output
settling behavior after a step change on the analog inputs
normalized to conversion periods. The X axis is given in
units of conversion. Note that after the step change on the
input occurs, the output data changes very little prior to 30
conversion periods. The output data is fully settled after 76
conversion periods for High-Speed and Low-Power
modes, and 78 conversions for High-Resolution mode.
100
% Settling
Initial Value
0
Final Value
Fully Settled Data
at 76 Conversions
(78 Conversions for
High−Resolution mode)
Table 9. Ideal Output Code versus Input Signal
INPUT SIGNAL V
(AINP − AINN)
w +V
+V
223* 1
−V
223* 1
v −V
REF
(1)
Excludes effects of noise, INL, offset and gain errors.
IN
REF
REF
0000000h
REF
23
2
ǒ
223* 1
Ǔ
IDEAL OUTPUT CODE
7FFFFFh
000001h
FFFFFFh
800000h
(1)
SERIAL INTERFACE
Data is retrieved from the ADS1271 using the serial
interface. To provide easy connection to either
microcontrollers or DSPs, two formats are available for the
interface: SPI and Frame-Sync. The FORMA T pin selects
the interface. The same pins are used for both interfaces
(SCLK, DRDY
/FSYNC, DOUT and DIN), though their
respective functionality depends on the particular interface
selected.
SPI SERIAL INTERFACE
The SPI-compatible format is a simple read-only interface.
Data ready for retrieval is indicated by the DRDY
and is shifted out on the falling edge of SCLK, MSB first.
The interface can be daisy-chained using the DIN input
when using multiple ADS1271s. See the Daisy-Chaining
section for more information.
output
02010403060508070
Conversions (1/f
DATA
)
Figure 56. Settling Time for All Power Modes
DATA FORMAT
The ADS1271 outputs 24 bits of data in two’s complement
format.
A positive full-scale input produces an output code of
7FFFFFh, and the negative full-scale input produces an
output code of 800000h. The output clips at these codes
for signals exceeding full-scale. Table 9 summarizes the
ideal output codes for different input signals.
22
SCLK (SPI Format)
The serial clock (SCLK) features a Schmitt-triggered input
and shifts out data on DOUT on the falling edge. It also
shifts in data on the falling edge on DIN when this pin is
being used for daisy-chaining. The device shifts data out
on the falling edge and the user shifts this data in on the
rising edge. Even though the SCLK input has hysteresis,
it is recommended to keep SCLK as clean as possible to
prevent glitches from accidentally shifting the data. SCLK
should be held low after data retrieval. SCLK may be run
as fast as the CLK frequency. SCLK may be either in
free-running or stop-clock operation between
conversions. To maximize the converter performance, the
ratio of CLK to SCLK should be held to:
CLK
SCLK +
(
N
2
N + 0, 1,2AAA
)
.
www.ti.com
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
DRDY/FSYNC
In the SPI format, this pin functions as the DRDY output.
It goes low when data is ready for retrieval and then returns
high on the rising edge of the first subsequent SCLK. If
data is not retrieved (that is, SCLK is held low), DRDY
will
pulse high just before the next conversion data is ready , a s
shown in Figure 57. The new data is loaded within the
ADS1271 one CLK cycle before DRDY
goes low. All data
must be shifted out before this time to avoid being
overwritten.
1/f
CLK
DRDY
SCLK
1/f
DATA
Figure 57. DRDY Timing with No Readback
DOUT
The conversion data is shifted out on DOUT. The MSB
data is valid on DOUT when DRDY
goes low. The
subsequent bits are shifted out with each falling edge of
SCLK. If daisy-chaining, the data shifted in using DIN will
appear on DOUT after all 24 bits have been shifted out.
DIN
This input is used when multiple ADS1271s are to be
daisy-chained together. The DOUT pin of the first device
connects to the DIN pin of the next, etc. It can be used with
either the SPI or Frame-Sync formats. Data is shifted in on
the falling edge of SCLK. When using only one ADS1271,
tie DIN low. See the Daisy-Chaining section for more
information.
being used for daisy-chaining. Even though SCLK has
hysteresis, it is recommended to keep SCLK as clean as
possible to prevent glitches from accidentally shifting the
data. When using Frame-Sync format, SCLK must run
continuously. If it is shut down, the data readback will be
corrupted. Frame-Sync format requires a specific
relationship between SCLK and FSYNC, determined by
the mode shown in Table 10.
Table 10. SCLK Period When Using Frame-Sync
Format
MODEREQUIRED SCLK PERIOD
High-Speedτ
High-Resolutionτ
Low-Powerτ
FRAME
FRAME
FRAME
/64
/128
/64
DRDY/FSYNC
In Frame-Sync format, this pin is used as the FSYNC input.
The frame-sync input (FSYNC) sets the frame period. The
required FSYNC periods are shown in Table 11. For
High-Speed mode, the FSYNC period must be 256 CLK
periods. For both High-Resolution and Low-Power modes,
the FSYNC period can be either 512 or 256 CLK periods;
the ADS1271 will automatically detect which is being
used. If the FSYNC period is not the proper value, data
readback will be corrupted. It is recommended that
FSYNC be aligned with the falling edge of SCLK.
Table 11. FSYNC Period
MODEREQUIRED FSYNC PERIOD
High-Speed256 CLK Periods
High-Resolution256 or 512 CLK periods
Low-Power256 or 512 CLK periods
FRAME-SYNC SERIAL INTERFACE
Frame-Sync format is similar to the interface often used on
audio ADCs. It operates in slave fashion—the user must
supply framing signal FSYNC (similar to the left/right clock
on stereo audio ADCs) and the serial clock SCLK (similar
to the bit clock on audio ADCs). The data is output MSB
first or left-justified. When using Frame-Sync format, the
CLK, FSYNC and SCLK inputs must be synchronized
together, as described in the following sub-sections.
SCLK (Frame-Sync Format)
The serial clock (SCLK) features a Schmitt-triggered input
and shifts out data on DOUT on the falling edge. It also
shifts in data on the falling edge on DIN when this pin is
DOUT
The conversion data is shifted out on DOUT. The MSB
data becomes valid on DOUT on the SCLK rising edge
prior to FSYNC going high. The subsequent bits are
shifted out with each falling edge of SCLK. If
daisy-chaining, the data shifted in using DIN will appear on
DOUT after all 24 bits have been shifted out.
DIN
This input is used when multiple ADS1271s are to be
daisy-chained together. It can be used with either SPI or
Frame-Sync formats. Data is shifted in on the falling edge
of SCLK. When using only one ADS1271, tie DIN low.See
the Daisy-Chaining section for more information.
23
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
DAISY-CHAINING
Multiple ADS1271s can be daisy-chained together to
simplify the serial interface connections. The DOUT of one
ADS1271 is connected to the DIN of the next ADS1271.
The first DOUT provides the output data and the last DIN
in the chain is connected to ground. A common SCLK is
used for all the devices in the daisy chain. Figure 58 shows
an example of a daisy chain with four ADS1271s.
Figure 59 shows the timing diagram when reading back in
the SPI format. It takes 96 SCLKs to shift out all the data.
In SPI format, it is recommended to tie all the
SYNC
/PDWN inputs together, which forces
synchronization of all the devices. It is only necessary to
monitor the DRDY output of one device when multiple
devices are configured this way.
In Frame-Sync format, all of the devices are driven to
synchronization by the FSYNC and SCLK inputs. However,
to ensure synchronization to the same f
recommended to tie all SYNC
The device clocks the SYNC
. To ensure exact synchronization, the SYNC/PDWN
of f
CLK
/PDWN inputs together.
/PDWN pin on the falling edge
pin should transition on the rising edge of f
cycle, it is
CLK
CLK
Since DOUT and DIN are both shifted on the falling edge
of SCLK, the propagation delay on DOUT creates the
setup time on DIN. Minimize the skew in SCLK to avoid
timing violations. See Mode Selection section for MODE
pin use when daisy-chaining.
The SPI format offers the most flexibility when
daisy-chaining because there is more freedom in setting
the SCLK frequency. The maximum number of ADS1271s
that can be daisy-chained is determined by dividing the
conversion time (1/f
all 24 bits (24 × 1/f
) by the time needed to read back
DATA
).
SCLK
Consider the case where:
f
= 27MHz
CLK
mode = High-Resolution (52,734SPS)
format = SPI
f
= 27MHz
SCLK
The maximum length of the daisy-chain is:
27MHz/(24 × 52,734SPS) = 21.3
Rounding down gives 21 as the maximum number of
ADS1271s that can be daisy-chained.
Daisy-chaining also works in Frame-Sync format, but the
maximum number of devices that can be daisy-chained is
less than when using the SPI format. The ratio between the
frame period and SCLK period is fixed, as shown in
Table 10. Using these values, the maximum number of
devices is two for High-Speed and Low-Power modes, and
four for High-Resolution mode.
24
SYNC
SCLK
ADS1271
SYNC
DIN
SCLK
4
DOUT
ADS1271
SYNC
DIN
SCLK
3
DOUT
ADS1271
SYNC
DIN
SCLK
2
DOUT
ADS1271
SYNC
DIN
SCLK
1
DRDY
DOUT
Figure 58. Example of SPI-Format, Daisy-Chain Connection for Multiple ADS1271s
DRDY
SCLK1
DOUT
ADS1271
Bit 23 (MSB)
1
24257396
ADS1271
Bit 0 (LSB)
1
Bit 23 (MSB)
ADS1271
2
ADS1271
Bit 2 3 (MSB)
4
ADS1271
Bit 0(LSB)
4
Figure 59. Timing Diagram for Example in Figure 58 (SPI Format)
www.ti.com
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
APPLICATION INFORMATION
To obtain the specified performance from the ADS1271,
the following layout and component guidelines should be
considered.
1.Power Supplies: The device requires two power
supplies for operation: DVDD and A VDD. The allowed
range for DVDD is 1.65V to 3.6V, and AVDD is
restricted to 4.75V to 5.25V. Best performance is
achieved when DVDD = 1.8V. For both supplies, use
a 10µF tantalum capacitor, bypassed with a 0.1µF
ceramic capacitor, placed close to the device pins.
Alternatively, a single 10µF ceramic capacitor can be
used. The supplies should be relatively free of noise
and should not be shared with devices that produce
voltage spikes (such as relays, LED display drivers,
etc.). If a switching power supply source is used, the
voltage ripple should be low (< 2mV). The power
supplies may be sequenced in any order.
2.Ground Plane: A single ground plane connecting both
AGND and DGND pins can be used. If separate digital
and analog grounds are used, connect the grounds
together at the converter.
3.Digital Inputs: It is recommended to source terminate
the digital inputs to the device with 50Ω series
resistors. The resistors should be placed close to the
driving end of digital source (oscillator, logic gates,
DSP, etc.) This helps to reduce ringing on the digital
lines, which may lead to degraded ADC performance.
4.Analog/Digital Circuits: Place analog circuitry (input
buffer, reference) and associated tracks together,
keeping them away from digital circuitry (DSP,
microcontroller, logic). Avoid crossing digital tracks
across analog tracks to reduce noise coupling and
crosstalk.
5.Reference Inputs: It is recommended to use a
minimum 10µF tantalum with a 0.1µF ceramic
capacitor directly across the reference inputs, REFP
and REFN. The reference input should be driven by a
low-impedance source. For best performance, the
reference should have less than 3µV
broadband
RMS
noise. For references with noise higher than this,
external reference filtering may be necessary.
6.Analog Inputs: The analog input pins must be driven
differentially to achieve specified performance. A true
differential driver or transformer (AC applications) can
be used for this purpose. Route the analog inputs
tracks (AINP, AINN) as a pair from the buffer to the
converter using short, direct tracks and away from
digital tracks.
A 1nF to 10nF capacitor should be used directly
across the analog input pins, AINP and AINN. A low-k
dielectric (such as COG or film type) should be used to
maintain low THD. Capacitors from each analog input
to ground should be used. They should be no larger
than 1/10 the size of the difference capacitor (typically
100pF) to preserve the AC common-mode
performance.
7.Component Placement: Place the power supply,
analog input, and reference input bypass capacitors
as close as possible to the device pins. This is
particularly important for the small-value ceramic
capacitors. Surface-mount components are
recommended to avoid the higher inductance of
leaded components.
Figure 60 to Figure 62 illustrate basic connections and
interfaces that can be used with the ADS1271.
25
SBAS306A − NOVEMBER 2004 − REVISED DECEMBER 2004
www.ti.com
Ω
1k
10nF
+5V
Differential
Inputs
+5V
Tie to
Either
DVDD
or GND
100pF
0.1µF
50
50
100pF
Ω
Ω
+
1nF
10µF
1
2
3
4
5
6
7
8
ADS1271
AINP
AINN
AGND
AVDD
MODE
FORMAT
SYNC/
PDWN
DIN
0.1µF
OPA350
1.8V to 3.3V
Ω
50
(1)
27MHz
VREFP
VREFN
DGND
DVDD
CLK
16
15
14
13
+
12
+
10µF0.1µF
10µF
100
0.1µF
Ω
Source
Ω
SCLK
DRDY/
FSYNC
DOUT
11
10
9
50
Ω
50
Ω
50
Figure 60. Basic Connection Drawing
100
Clock
+5V
Ω
Ω
1k
0.1µF
REF3125
100µF
0.1µF
NOTE: (1) 1.8V recommended.
Ω
1k
Ω
1k
1000pF
(1)
+15V
V
REF
V
V
IN
OCM
OPA1632
0.1µF
(1)
−
15V
49.9
49.9
Ω
AINP
Ω
AINN
1000pF
Ω
1k
Ω
1k
NOTE: (1) Bypass with 10µF and 0.1µF capacitors.
Figure 61. Basic Differential Signal Interface
Ω
V
1k
IN
10k
Ω
1000pF
(1)
+15V
V
REF
V
OCM
OPA1632
0.1µF
(1)
−
15V
1000pF
Ω
1k
10k
Ω
49.9
AINP
Ω
49.9
AINN
=10×V
V
ODIFF
V
OCOMM=VREF
Ω
NOTE: (1) Bypass with 10µFand0.1µF capacitors.
Figure 62. Basic Single-Ended Signal Interface
IN
26
PACKAGE OPTION ADDENDUM
www.ti.com
27-Dec-2004
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
ADS1271IPWACTIVETSSOPPW1694NoneCULevel-2-240C-1 YEAR
ADS1271IPWRACTIVETSSOPPW162500NoneCULevel-2-240C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60
6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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