The ADS1240 and ADS1241 are precision, wide dynamic range,
delta-sigma, Analog-to-Digital (A/D) converters with 24-bit resolution
operating from 2.7V to 5.25V power supplies. The delta-sigma A/D
converter provides up to 24 bits of no missing code performance and
effective resolution of 21 bits.
The input channels are multiplexed. Internal buffering can be
selected to provide very high input impedance for direct connection
to transducers or low-level voltage signals. Burnout current sources
are provided that allow for detection of an open or shorted sensor.
An 8-bit Digital-to-Analog (D/A) converter provides an offset correction with a range of 50% of the Full-Scale Range (FSR).
The Programmable Gain Amplifier (PGA) provides selectable gains of
1 to 128, with an effective resolution of 19 bits at a gain of 128. The
A/D conversion is accomplished with a 2nd-order delta-sigma modulator and programmable Finite-Impulse Response (FIR) filter that
provides a simultaneous 50Hz and 60Hz notch. The reference input
is differential and can be used for ratiometric conversion.
The serial interface is SPI compatible. Up to eight bits of data
I/O are also provided that can be used for input or output. The
ADS1240 and ADS1241 are designed for high-resolution measurement applications in smart transmitters, industrial process control,
weigh scales, chromatography, and portable instrumentation.
AGNDAV
DD
DD
2µA
A
D
S
1
2
4
1
SBAS173C – JUNE 2001 – REVISED NOVEMBER 2003
V
REF+VREF–
Offset
DAC
ADS1241
X
X
IN
OUT
Clock Generator
0/D0
A
IN
1/D1
A
IN
2/D2
A
IN
3/D3
A
IN
4/D4
A
IN
5/D5
A
IN
6/D6
A
IN
7/D7
A
IN
A
INCOM
ADS1241
Only
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
AVDD to DGND ...................................................................... –0.3V to +6V
DV
to DGND...................................................................... –0.3V to +6V
DD
Input Current ............................................................... 100mA, Momentary
DGND to AGND ....................................................................–0.3V to 0.3V
Input Current ................................................................. 10mA, Continuous
A
.................................................................AGND –0.5V to AVDD + 0.5V
IN
Digital Input Voltage to DGND ................................. –0.3V to DV
Digital Output Voltage to DGND ..............................–0.3V to DV
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ......................................... –40°C to +85°C
Storage Temperature Range .......................................... –60°C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
(1)
DD
DD
+ 0.3V
+ 0.3V
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
EVALUATION MODULE ORDERING INFORMATION
PRODUCTDESCRIPTION
ADS1241EVMADS1240 and ADS1241 Evaluation Module
PACKAGE/ORDERING INFORMATION
PRODUCTPACKAGE-LEADDESIGNATOR
PACKAGETEMPERATUREPACKAGEORDERINGTRANSPORT
ADS1240SSOP-24DB–40°C to +85°CADS1240EADS1240ERails, 60
(1)
"" " ""ADS1240E/1KTape and Reel, 1000
ADS1241SSOP-28DB–40°C to +85°CADS1241EADS1241ERails, 48
"" " ""ADS1241E/1KTape and Reel, 1000
SPECIFIED
RANGEMARKINGNUMBERMEDIA, QUANTITY
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
DIGITAL CHARACTERISTICS: –40°C to +85°C, DVDD 2.7V to 5.25V
PARAMETERCONDITIONSMINTYPMAXUNITS
Digital Input/Output
Logic FamilyCMOS
Logic Level: V
Input Leakage: I
Master Clock Rate: f
Master Clock Period: t
IH
V
IL
V
OH
V
OL
IH
I
IL
OSC
OSC
IOH = 1mADVDD – 0.4V
IOL = 1mADGNDDGND + 0.4V
VI = DV
DD
VI = 0–10µA
1/f
OSC
0.8 • DV
DD
DGND0.2 • DV
15MHz
2001000ns
DV
DD
DD
10µA
V
V
2
www.ti.com
ADS1240, 1241
SBAS173C
ELECTRICAL CHARACTERISTICS: AVDD = 5V
All specifications T
PARAMETERCONDITIONSMINTYPMAXUNITS
ANALOG INPUT
Analog Input RangeBuffer OFFAGND – 0.1AV
Full-Scale Input Range
Differential Input ImpedanceBuffer OFF5/PGAM Ω
Bandwidth
f
= 3.75Hz–3dB1.65Hz
DATA
f
= 7.50Hz–3dB3.44Hz
DATA
f
= 15.00Hz–3dB14.6Hz
DATA
Programmable Gain AmplifierUser-Selectable Gain Ranges1128
Input Capacitance9pF
Input Leakage CurrentModulator OFF, T = 25°C5 pA
Burnout Current Sources2µA
OFFSET DAC
Offset DAC RangeRANGE = 0±V
Offset Monotonicity8Bits
Offset DAC Gain Error±10%
Offset DAC Gain Error Drift1ppm/°C
SYSTEM PERFORMANCE
ResolutionNo Missing Codes24Bits
Integral NonlinearityEnd Point Fit±0.0015% of FS
Offset Error
Offset Drift
Gain Error0.005%
Gain Error Drift
Common-Mode Rejectionat DC100dB
Common-Mode Rejectionat DC120dB
Common-Mode Rejectionf
Bias Current
POWER-SUPPLY REQUIREMENTS
Power-Supply VoltageAV
Analog CurrentPDWN = 0, or SLEEP1nA
Digital CurrentNormal Mode, DV
Power DissipationPGA = 1, Buffer OFF, DV
NOTES: (1) Calibration can minimize these errors to the level of the noise.
(2) ∆V
(3) 12pF switched capacitor at f
to T
MIN
, AVDD = +5V, DVDD = +2.7V to 5.25V, f
MAX
(AIN0 – AIN7, A
(1)
(1)
(1)
(3)
is a change in digital result.
OUT
INCOM
= 19.2kHz, PGA = 1, Buffer ON, f
MOD
)
Buffer ONAGND + 0.05AV
(In+) – (In–), See Block Diagram, RANGE = 0
RANGE = 1
Buffer ON5GΩ
RANGE = 1±V
f
= 60Hz, f
CM
f
= 50Hz, f
CM
= 50Hz, f
SIG
f
= 60Hz, f
SIG
V
≡ (REF IN+) – (REF IN–), RANGE = 0
REF
= 15Hz130dB
DATA
= 15Hz120dB
DATA
= 15Hz100dB
DATA
= 15Hz100dB
DATA
/∆VDD)
OUT
RANGE = 10.1AV
VREFCM
= 60Hz, f
V
REF
= 15Hz120dB
DATA
= 2.5V1.3µA
DD
PGA = 1, Buffer OFF120250µA
PGA = 128, Buffer OFF400675µA
PGA = 1, Buffer ON160300µA
PGA = 128, Buffer ON7601275µA
= 5V80125µA
SLEEP Mode, DV
Read Data Continuous Mode, DVDD = 5V
DD
= 5V60µA
DD
PDWN0.5nA
= 5V1.11.9mW
DD
clock frequency.
SAMP
= 15Hz, and V
DATA
= +2.5V, unless otherwise specified.
REF
ADS1240
ADS1241
+ 0.1V
DD
– 1.5V
DD
±V
/PGAV
REF
±V
/(2 • PGA)
REF
/(2 • PGA)V
REF
/(4 • PGA)V
REF
V
7.5ppm of FS
0.02ppm of FS/°C
0.5ppm/°C
(2)
8095dB
0.12.52.6V
DD
DD
V
V
4.755.25V
230µA
ADS1240, 1241
SBAS173C
www.ti.com
3
ELECTRICAL CHARACTERISTICS: AVDD = 3V
All specifications –40°C to +85°C, AVDD = +3V, DVDD = +2.7V to 5.25V, f
PARAMETERCONDITIONSMINTYPMAXUNITS
ANALOG INPUT
(AIN0 – AIN7, A
Analog Input RangeBuffer OFFAGND – 0.1AV
INCOM
)
Buffer ONAGND + 0.05AV
Full-Scale Input Voltage Range
(In+) – (In–) See Block Diagram, RANGE = 0
RANGE = 1
Input ImpedanceBuffer OFF5/PGAMΩ
DifferentialBuffer ON5GΩ
Bandwidth
f
= 3.75Hz–3dB1.65Hz
DATA
f
= 7.50Hz–3dB3.44Hz
DATA
f
= 15.00Hz–3dB14.6Hz
DATA
Programmable Gain AmplifierUser-Selectable Gain Ranges1128
Input Capacitance9pF
Input Leakage CurrentModulator OFF, T = 25°C5 pA
Burnout Current Sources2µA
OFFSET DAC
Offset DAC RangeRANGE = 0±V
RANGE = 1±V
Offset DAC Monotonicity8Bits
Offset DAC Gain Error±10%
Offset DAC Gain Error Drift2ppm/°C
SYSTEM PERFORMANCE
ResolutionNo Missing Codes24Bits
Integral NonlinearityEnd Point Fit±0.0015% of FS
Offset Error
Offset Drift
Gain Error0.01%
Gain Error Drift
(1)
(1)
(1)
Common-Mode Rejectionat DC100dB
f
= 60Hz, f
CM
f
= 50Hz, f
Normal-Mode Rejectionf
Output NoiseSee Typical Characteristics
CM
SIG
f
SIG
= 50Hz, f
= 60Hz, f
Power-Supply Rejectionat DC, dB = –20 log(∆V
VOLTAGE REFERENCE INPUT
V
REF
Reference Input RangeREF IN+, REF IN–0AV
V
≡ (REF IN+) – (REF IN–), RANGE = 0
REF
RANGE = 10.12.52.6V
Common-Mode Rejectionat DC120dB
Common-Mode Rejectionf
Bias Current
(3)
VREFCM
= 60Hz, f
V
REF
POWER-SUPPLY REQUIREMENTS
Power-Supply VoltageAV
Analog CurrentPDWN = 0, or SLEEP1nA
PGA = 1, Buffer OFF107225µA
PGA = 128, Buffer OFF355600µA
PGA = 1, Buffer ON118275µA
PGA = 128, Buffer ON4831225µA
Digital CurrentNormal Mode, DV
SLEEP Mode, DV
Read Data Continuous Mode, DVDD = 3V
PDWN = 00.5nA
Power DissipationPGA = 1, Buffer OFF, DV
NOTES: (1) Calibration can minimize these errors to the level of the noise.
(2) ∆V
(3) 12pF switched capacitor at f
is a change in digital result.
OUT
clock frequency.
SAMP
= 19.2kHz, PGA = 1, Buffer ON, f
MOD
= 15Hz, and V
DATA
= +1.25V, unless otherwise specified.
REF
ADS1240
ADS1241
+ 0.1V
DD
– 1.5V
DD
±V
/PGAV
REF
±V
/(2 • PGA)
REF
/(2 • PGA)V
REF
/(4 • PGA)V
REF
15ppm of FS
0.04ppm of FS/°C
1.0ppm/°C
= 15Hz130dB
DATA
= 15Hz120dB
DATA
= 15Hz100dB
DATA
= 15Hz100dB
DATA
(2)
OUT
/∆VDD)
7590dB
0.11.251.30V
DD
= 15Hz120dB
DATA
= 1.250.65µA
DD
= 3V50100µA
DD
= 3V40µA
DD
= 3V0.61.2mW
DD
2.73.3V
113µA
V
V
4
www.ti.com
ADS1240, 1241
SBAS173C
PIN CONFIGURATION (ADS1240)
PIN CONFIGURATION (ADS1241)
Top ViewSSOPTop ViewSSOP
DV
DGND
X
X
OUT
RESET
DSYNC
PDWN
DGND
V
REF+
V
REF–
AIN0/D0
A
1/D1
IN
1
DD
2
3
IN
4
5
6
ADS1240
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
BUFEN
DRDY
SCLK
D
OUT
D
IN
CS
POL
AV
DD
AGND
A
INCOM
AIN3/D3
A
2/D2
IN
PIN DESCRIPTIONS (ADS1240)
PIN
NUMBERNAMEDESCRIPTION
1DV
2DGNDDigital Ground
3X
4X
5RESETActive LOW, resets the entire device.
6DSYNCActive LOW, Synchronization Control
7PDWNActive LOW, Power Down. The power down func-
The input multiplexer provides for any combination of differential inputs to be selected on any of the input channels, as
shown in Figure 1. For example, if A
positive differential input channel, any other channel can be
selected as the negative terminal for the differential input
A
0/D0
IN
1/D1
A
IN
2/D2
A
IN
0 is selected as the
IN
AV
DD
Burnout Current Source
channel. With this method, it is possible to have up to eight
single-ended input channels or four independent differential
input channels for the ADS1241, and four single-ended input
channels or two independent differential input channels for
the ADS1240. Note that A
can be treated as an input
INCOM
channel.
The ADS1240 and ADS1241 feature a single-cycle settling
digital filter that provides valid data on the first conversion
after a new channel selection. In order to minimize the
settling error, synchronize MUX changes to the conversion
beginning, which is indicated by the falling edge of
DRDY
. In
other words, issuing a MUX change through the WREG
command immediately after
DRDY
goes LOW minimizes the
settling error. Increasing the time between the conversion
beginning (
mand (t
DRDY
goes LOW) and the MUX change com-
) results in a settling error in the conversion
DELAY
data, as shown in Figure 2.
AIN3/D3
4/D4
A
IN
5/D5
A
IN
6/D6
A
ADS1241
Only
IN
7/D7
A
IN
A
INCOM
AGND
FIGURE 1. Input Multiplexer Configuration.
New Conversion Begins,
Complete Previous Conversion
DRDY
SCLK
(POL = 0)
Input
Buffer
Burnout Current Source
t
DELAY
Previous Conversion Data
BURNOUT CURRENT SOURCES
The Burnout Current Sources can be used to detect sensor
short-circuit or open-circuit conditions. Setting the Burnout
Current Sources (BOCS) bit in the SETUP register activates
two 2µA current sources called burnout current sources. One
of the current sources is connected to the converter’s negative input and the other is connected to the converter’s
positive input.
Figure 3 shows the situation for an open-circuit sensor. This
is a potential failure mode for many kinds of remotely connected sensors. The current source on the positive input acts
as a pull-up, causing the positive input to go to the positive
analog supply, and the current source on the negative input
acts as a pull-down, causing the negative input to go to
ground. The ADS1240/41 therefore outputs full-scale (7FFFFF
Hex).
New Conversion Complete
DIN
FIGURE 2. Input Multiplexer Configuration.
10
MSBLSB
SETTLING ERROR vs DELAY TIME
10.000000
1.000000
0.100000
0.010000
0.001000
Settling Error (%)
0.000100
0.000010
0.000001
2468101214160
f
= 2.4576MHz
CLK
Delay Time, t
www.ti.com
DELAY
(ms)
ADS1240, 1241
SBAS173C
AV
DD
2µA
AV
DD
0V
ADC
CODE = 0x7FFFFF
OPEN CIRCUIT
2µA
FIGURE 3. Burnout detection while sensor is open-circuited.
The buffer draws additional current when activated. The
current required by the buffer depends on the PGA setting.
When the PGA is set to 1, the buffer uses approximately
50µA; when the PGA is set to 128, the buffer uses approxi-
mately 500µA.
PGA
H
The Programmable Gain Amplifier (PGA) can be set to gains
of 1, 2, 4, 8, 16, 32, 64, or 128. Using the PGA can improve the
effective resolution of the A/D converter. For instance, with a
PGA of 1 on a 5V full-scale signal, the A/D converter can
resolve down to 1µV. With a PGA of 128 and a full-scale signal
of 39mV, the A/D converter can resolve down to 75nV. AV
DD
current increases with PGA settings higher than 4.
Figure 4 shows a short-circuited sensor. Since the inputs are
shorted and at the same potential, the ADS1240/41 signal
outputs are approximately zero. (Note that the code for
shorted inputs is not exactly zero due to internal series
resistance, low-level noise and other error sources.)
AV
DD
2µA
AVDD/2
SHORT
CIRCUIT
AV
2µA
ADC
/2
DD
CODE ≅ 0
FIGURE 4. Burnout detection while sensor is short-circuited.
INPUT BUFFER
The input impedance of the ADS1240/41 without the buffer
enabled is approximately 5MΩ/PGA. For systems requiring
very high input impedance, the ADS1240/41 provides a
chopper-stabilized differential FET-input voltage buffer. When
activated, the buffer raises the ADS1240/41 input impedance
to approximately 5GΩ.
The buffer’s input range is approximately 50mV to AV
1.5V. The buffer’s linearity will degrade beyond this range.
Differential signals should be adjusted so that both signals
are within the buffer’s input range.
The buffer can be enabled using the BUFEN pin or the
BUFEN bit in the ACR register. The buffer is on when the
BUFEN pin is high and the BUFEN bit is set to one. If the
BUFEN pin is low, the buffer is disabled. If the BUFEN bit is
set to zero, the buffer is also disabled.
DD
–
OFFSET DAC
The input to the PGA can be shifted by half the full-scale input
range of the PGA using the Offset DAC (ODAC) register. The
ODAC register is an 8-bit value; the MSB is the sign and the
seven LSBs provide the magnitude of the offset. Using the
offset DAC does not reduce the performance of the A/D
converter. For more details on the ODAC, please refer to TI
application report SBAA077.
MODULATOR
The modulator is a single-loop second-order system. The
modulator runs at a clock speed (f
the external clock (f
). The frequency division is deter-
OSC
) that is derived from
MOD
mined by the SPEED bit in the SETUP register, as shown in
Table I.
f
OSC
2.4576MHz019,200Hz 15Hz 7.5Hz 3.75Hz50/60Hz
4.9152MHz038,400Hz 30Hz15Hz7.5Hz100/120Hz
SPEEDDR BITS1st NOTCH
BITf
MOD
19,600Hz 7.5Hz 3.75Hz 1.875Hz25/30Hz
119,200Hz 15Hz 7.5Hz 3.75Hz50/60Hz
000110FREQ.
TABLE I. Output Configuration.
CALIBRATION
The offset and gain errors can be minimized with calibration.
The ADS1240 and ADS1241 support both self and system
calibration.
Self-calibration of the ADS1240 and ADS1241 corrects internal offset and gain errors and is handled by three commands:
SELFCAL, SELFGAL, and SLEFOCAL. The SELFCAL command performs both an offset and gain calibration. SELFGCAL
performs a gain calibration and SELFOCAL performs an
offset calibration, each of which takes two t
complete. During self-calibration, the ADC inputs are disconnected internally from the input pins. The PGA must be set to
1 prior to issuing a SELFCAL or SELFGCAL command. Any
PGA is allowed when issuing a SELFOCAL command. For
example, if using PGA = 64, first set PGA = 1 and issue
periods to
DATA
ADS1240, 1241
SBAS173C
www.ti.com
11
SELFGCAL. Afterwards set PGA = 64 and issue SELFOCAL.
C
1
Crystal
X
IN
X
OUT
C
2
For operation with a reference voltage greater than (AV
DD
–
1.5) volts, the buffer must also be turned off during gain selfcalibration to avoid exceeding the buffer input range.
System calibration corrects both internal and external offset
and gain errors. While performing system calibration, the
appropriate signal must be applied to the inputs. The system
offset calibration command (SYSOCAL) requires a zero input
differential signal (see Table IV, page 18). It then computes
the offset that nullifies the offset in the system. The system
gain calibration command (SYSGCAL) requires a positive
full-scale input signal. It then computes a value to nullify the
gain error in the system. Each of these calibrations takes two
t
periods to complete. System gain calibration is recom-
DATA
mended for the best gain calibration at higher PGAs.
Calibration should be performed after power on, a change in
temperature, or a change of the PGA. The RANGE bit (ACR bit
2) must be zero during calibration.
Calibration removes the effects of the ODAC; therefore, dis-
able the ODAC during calibration, and enable again after
calibration is complete.
At the completion of calibration, the
DRDY
signal goes low,
indicating the calibration is finished. The first data after
calibration should be discarded since it may be corrupt from
calibration data remaining in the filter. The second data is
always valid.
EXTERNAL VOLTAGE REFERENCE
The ADS1240 and ADS1241 require an external voltage
reference. The selection for the voltage reference value is
made through the ACR register.
The external voltage reference is differential and is represented by the voltage difference between the pins: +V
and –V
–V
REF,
. The absolute voltage on either pin, +V
REF
can range from AGND to AVDD. However, the follow-
REF
REF
or
ing limitations apply:
For AV
V
REF
For AV
V
REF
For AV
V
REF
For AV
V
REF
= 5.0V and RANGE = 0 in the ACR, the differential
DD
must not exceed 2.5V.
= 5.0V and RANGE = 1 in the ACR, the differential
DD
must not exceed 5V.
= 3.0V and RANGE = 0 in the ACR, the differential
DD
must not exceed 1.25V.
= 3.0V and RANGE = 1 in the ACR, the differential
DD
must not exceed 2.5V.
CLOCK GENERATOR
The clock source for the ADS1240 and ADS1241 can be
provided from a crystal, oscillator, or external clock. When the
clock source is a crystal, external capacitors must be provided
to ensure start-up and stable clock frequency. This is shown in
both Figure 5 and Table II. X
crystals and it should not be used as a clock driver for external
The ADS1240 and ADS1241 have a 1279 tap linear phase
Finite Impulse Response (FIR) digital filter that a user can
configure for various output data rates. When a 2.4576MHz
crystal is used, the device can be programmed for an output
data rate of 15Hz, 7.5Hz, or 3.75Hz. Under these conditions,
the digital filter rejects both 50Hz and 60Hz interference. Figure
6 shows the digital filter frequency response for data output
rates of 15Hz, 7.5Hz, and 3.75Hz.
If a different data output rate is desired, a different crystal
frequency can be used. However, the rejection frequencies
shift accordingly. For example, a 3.6864MHz master clock with
the default register condition has:
(3.6864MHz/2.4576MHz) • 15Hz = 22.5Hz data output rate
and the first and second notch is:
1.5 • (50Hz and 60Hz) = 75Hz and 90Hz
DATA I/O INTERFACE
The ADS1240 has four pins and the ADS1241 has eight pins
that serve a dual purpose as both analog inputs and data
I/O. These pins are powered from AV
through the IOCON, DIR, and DIO registers. These pins
can be individually configured as either analog inputs or data
I/O. See Figure 7 (page 14) for the equivalent schematic of
an Analog/Data I/O pin.
The IOCON register defines the pin as either an analog input
or data I/O. The power-up state is an analog input. If the pin
is configured as an analog input in the IOCON register, the
DIR and DIO registers have no effect on the state of the pin.
If the pin is configured as data I/O in the IOCON register,
then DIR and DIO are used to control the state of the pin.
The DIR register controls the direction of the data pin, either
as an input or output. If the pin is configured as an input in
the DIR register, then the corresponding DIO register bit
reflects the state of the pin. Make sure the pin is driven to a
logic one or zero when configured as an input to prevent
excess current dissipation. If the pin is configured as an
output in the DIR register, then the corresponding DIO
register bit value determines the state of the output pin
(0 = AGND, 1 = AV
DD
).
It is still possible to perform A/D conversions on a pin
configured as data I/O. This may be useful as a test mode,
where the data I/O pin is driven and an A/D conversion is
done on the pin.
IOCON
DIR
DIO WRITE
AINx/Dx
T o Analog Mux
DIO READ
FIGURE 7. Analog/Data Interface Pin.
SERIAL PERIPHERAL INTERFACE
The Serial Peripheral Interface (SPI) allows a controller to
communicate synchronously with the ADS1240 and ADS1241.
The ADS1240 and ADS1241 operate in slave-only mode.
The serial interface is a standard four-wire SPI (
D
and D
IN
) interface that supports both serial clock
OUT
CS
, SCLK,
polarities (POL pin).
Chip Select (CS)
The chip select (CS) input must be externally asserted
before communicating with the ADS1240 or ADS1241.
CS
must stay LOW for the duration of the communication.
Whenever
CS
goes HIGH, the serial interface is reset.
CS
may be hard-wired LOW.
Serial Clock (SCLK)
The serial clock (SCLK) features a Schmitt-triggered input
and is used to clock D
and D
IN
data. Make sure to have
OUT
a clean SCLK to prevent accidental double-shifting of the
data. If SCLK is not toggled within 3
DRDY
pulses, the serial
interface resets on the next SCLK pulse and starts a new
communication cycle. A special pattern on SCLK resets the
entire chip; see the RESET section for additional information.
Clock Polarity (POL)
The clock polarity input (POL) controls the polarity of SCLK.
When POL is LOW, data is clocked on the falling edge of
SCLK and SCLK should be idled LOW. Likewise, when POL
is HIGH, the data is clocked on the rising edge of SCLK and
SCLK should be idled HIGH.
Data Input (DIN) and Data Output (D
The data input (DIN) and data output (D
data from the ADS1240 and ADS1241. D
ance when not in use to allow D
together and driven by a bidirectional bus. Note: the Read
and D
IN
OUT
)
OUT
) receive and send
is high imped-
OUT
to be connected
OUT
Data Continuous Mode (RDATAC) command should not be
issued when D
mode, D
either of these 8-bit bytes appear on D
nected to D
DATA READY
The
DRDY
and D
IN
looks for the STOPC or RESET command. If
IN
), the RDATAC mode ends.
IN
DRDY
are connected. While in RDATAC
OUT
(which is con-
OUT
PIN
line is used as a status signal to indicate when
data is ready to be read from the internal data register.
DRDY
goes LOW when a new data word is available in the
DOR register. It is reset HIGH when a read operation from
the data register is complete. It also goes HIGH prior to the
updating of the output register to indicate when not to read
from the device to ensure that a data read is not attempted
while the register is being updated.
The status of
7 of the ACR register (address 2
operate in 3-wire mode by tying the
case, the SCLK, D
DRDY
can also be obtained by interrogating bit
). The serial interface can
H
CS
input LOW. In this
, and D
IN
lines are used to communi-
OUT
cate with the ADS1240 and ADS1241. This scheme is
suitable for interfacing to microcontrollers. If
CS
is required
as a decoding signal, it can be generated from a port bit of
the microcontroller.
DSYNC OPERATION
Synchronization can be achieved either through the
pin or the DSYNC command. When the
DSYNC
the digital circuitry is reset on the falling edge of
While
DSYNC
Reset is released when
is LOW, the serial interface is deactivated.
DSYNC
is taken HIGH. Synchronization occurs on the next rising edge of the system clock
after
DSYNC
is taken HIGH.
When the DSYNC command is sent, the digital filter is reset
on the edge of the last SCLK of the DSYNC command. The
modulator is held in RESET until the next edge of SCLK is
detected. Synchronization occurs on the next rising edge of
the system clock after the first SCLK following the DSYNC
command.
DSYNC
pin is used,
DSYNC
POWER-UP—SUPPLY VOLTAGE RAMP RATE
The power-on reset circuitry was designed to accommodate
digital supply ramp rates as slow as 1V/10ms. To ensure
proper operation, the power supply should ramp monotonically.
RESET
The user can reset the registers to their default values in
three different ways: by asserting the
the RESET command; or by applying a special waveform on
the SCLK (the
SCLK Reset Waveform
Timing Diagram). Note: if both POL and SCLK pins are held
high, applying the SCLK Reset Waveform to the
resets the part.
RESET
pin; by issuing
, as shown in the
CS
pin also
.
14
www.ti.com
ADS1240, 1241
SBAS173C
ADS1240 AND ADS1241
tion needed to configure the part, such as data format,
multiplexer settings, calibration settings, data rate, etc. The
REGISTER
set of the 16 registers are shown in Table III.
The operation of the device is set up through individual
registers. Collectively, the registers contain all the informa-
ACR (Address 02H) Analog Control Register
Reset Value = X0
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DRDYU/BSPEEDBUFEN
H
BIT ORDER
RANGEDR1DR0
ODAC (Address 03 ) Offset DAC
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
SIGNOSET6OSET5OSET4OSET3OSET2OSET1OSET0
H
bit 7
DRDY
: Data Ready (Read Only)
This bit duplicates the state of the
B
bit 6U/
: Data Format
0 = Bipolar (default)
1 = Unipolar
U/BANALOG INPUTDIGITAL OUTPUT (Hex)
0Zero0x000000
1Zero0x000000
+FSR0x7FFFFF
–FSR0x800000
+FSR0xFFFFFF
–FSR0x000000
bit 5SPEED: Modulator Clock Speed
0 = f
1 = f
MOD
MOD
= f
= f
OSC
OSC
/128 (default)
/256
bit 4BUFEN: Buffer Enable
0 = Buffer Disabled (default)
1 = Buffer Enabled
bit 3BIT ORDER: Data Output Bit Order
0 = Most Significant Bit Transmitted First (default)
1 = Least Significant Bit Transmitted First
This configuration bit controls only the bit order
within the byte of data that is shifted out. Data is
always shifted out of the part most significant byte
first. Data is always shifted into the part most
significant bit first.
bit 2RANGE: Range Select
0 = Full-Scale Input Range equal to ±V
(default).
1 = Full-Scale Input Range equal to ±1/2 V
NOTE: This allows reference voltages as high as
AV
, but even with a 5V reference voltage the
DD
calibration must be performed with this bit set to 0.
NOTE: The offset DAC must be enabled after calibration or the calibration
nullifies the effects.
OSET[6 : 0]
•
OSET
•
127
127
60
[:]
RANGE 0
RANGE
=
=
1
DIO (Address 04H) Data I/O
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DIO 7DIO 6DIO 5DIO 4DIO 3DIO 2DIO 1DIO 0
H
If the IOCON register is configured for data, a value written
to this register appears on the data I/O pins if the pin is
configured as an output in the DIR register. Reading this
register returns the value of the data I/O pins.
Bit 4 to bit 7 is not used in ADS1240.
DIR (Address 05
Reset Value = FF
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DIR7DIR6DIR5DIR4DIR3DIR2DIR1DIR0
) Direction Control for Data I/O
H
H
Each bit controls whether the corresponding data I/O pin is
an output (= 0) or input (= 1). The default power-up state is
as inputs.
Bit 4 to bit 7 is not used in ADS1240.
IOCON (Address 06H) I/O Configuration Register
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
IO7IO6IO5IO4IO3IO2IO1IO0
H
bit 7-0 IO7: IO0: Data I/O Configuration
0 = Analog (default)
1 = Data
Configuring the pin as a data I/O pin allows it to be controlled
through the DIO and DIR registers.
DOR2 (Address 0DH) Data Output Register
(Most Significant Byte) (Read Only)
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DOR23DOR22DOR21DOR20DOR19DOR18DOR17DOR16
H
DOR1 (Address 0EH) Data Output Register
(Middle Byte) (Read Only)
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DOR15DOR14DOR13DOR12DOR11DOR10DOR09DOR08
H
DOR0 (Address 0FH) Data Output Register
(Least Significant Byte) (Read Only)
Reset Value = 00
bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0
DOR07DOR06DOR05DOR04DOR03DOR02DOR01DOR00
H
ADS1240, 1241
SBAS173C
www.ti.com
17
ADS1240 AND ADS1241 CONTROL COMMAND DEFINITIONS
The commands listed in Table IV control the operations of
the ADS1240 and ADS1241. Some of the commands are
stand-alone commands (e.g., RESET) while others require
additional bytes (e.g., WREG requires the count and data
bytes).
COMMANDSDESCRIPTIONOP CODE2nd COMMAND BYTE
RDATARead Data0000 0001 (01
RDATACRead Data Continuously0000 0011 (03
STOPCStop Read Data Continuously0000 1111 (0F
RREGRead from REG “rrrr”0001 rrrr(1x
WREGWrite to REG “rrrr”0101 rrrr(5x
SELFCALOffset and Gain Self Cal1111 0000 (F0
SELFOCALSelf Offset Cal1111 0001 (F1
SELFGCALSelf Gain Cal1111 0010 (F2
SYSOCALSys Offset Cal1111 0011 (F3
SYSGCALSys GainCal1111 0100 (F4
WAKEUPWakup from SLEEP Mode1111 1011 (FB
DSYNCSync DRDY1111 1100 (FC
SLEEPPut in SLEEP Mode1111 1101 (FD
RESETReset to Power-Up Values1111 1110 (FE
NOTE: The received data format is always MSB First; the data out format is set by the BIT ORDER bit in the ACR register.
Operands:
n = count (0 to 127)
r = register (0 to 15)
x = don’t care
)—
H
)—
H
)—
H
)xxxx_nnnn (# of regs-1)
H
)xxxx_nnnn (# of regs-1)
H
)—
H
)—
H
)—
H
)—
H
)—
H
)—
H
)—
H
)—
H
)—
H
TABLE IV. Command Summary.
RDATA–Read Data
RDATAC–Read Data Continuous
Description: Read the most recent conversion result from the
Data Output Register (DOR). This is a 24-bit value.
Operands:None
Bytes:1
Encoding:0000 0001
Data Transfer Sequence:
0000 0001•••
D
IN
D
OUT
NOTE: (1) For wait time, refer to timing specification.
(1)
xxxx xxxxxxxx xxxxxxxx xxxx
MSBMid-ByteLSB
Description: Read Data Continuous mode enables the continuous output of new data on each
DRDY
. This command
eliminates the need to send the Read Data Command on each
DRDY
. This mode may be terminated by either the STOPC
command or the RESET command. Wait at least 10 f
OSC
after
DRDY falls before reading.
Operands:None
Bytes:1
Encoding:0000 0011
Data Transfer Sequence:
Command terminated when “uuuu uuuu” equals STOPC or
RESET.
DRDY
D
IN
D
OUT
DRDY
D
OUT
NOTE: (1) For wait time, refer to timing specification.
0000 0011•••
•••
(1)
uuuu uuuuuuuu uuuuuuuu uuuu
MSBMid-ByteLSB
MSBMid-ByteLSB
•••
18
www.ti.com
ADS1240, 1241
SBAS173C
STOPC–Stop Continuous
D
IN
1111 0000
D
IN
1111 0010
SELFCAL–Offset and Gain Self Calibration
Description: Ends the continuous data output mode. Issue
after
DRDY
goes LOW.
Operands:None
Bytes:1
Encoding:0000 1111
Data Transfer Sequence:
DRDY
D
IN
0000 1111xxx
RREG–Read from Registers
Description: Output the data from up to 16 registers starting
with the register address specified as part of the instruction.
The number of registers read will be one plus the second byte
count. If the count exceeds the remaining registers, the addresses wrap back to the beginning.
Operands:r, n
Bytes:2
Encoding:0001 rrrr xxxx nnnn
Data Transfer Sequence:
Read Two Registers Starting from Register 01
(MUX)
H
Description: Starts the process of self calibration. The Offset
Calibration Register (OCR) and the Full-Scale Register (FSR)
are updated with new values after this operation.
Operands:None
Bytes:1
Encoding:1111 0000
Data Transfer Sequence:
SELFOCAL–Offset Self Calibration
Description: Starts the process of self-calibration for offset.
The Offset Calibration Register (OCR) is updated after this
operation.
Operands:None
Bytes:1
Encoding:1111 0001
Data Transfer Sequence:
1111 0001
D
IN
0001 00010000 0001xxxx xxxxxxxx xxxx
D
IN
D
OUT
NOTE: (1) For wait time, refer to timing specification.
•••
(1)
MUXACR
WREG–Write to Registers
Description: Write to the registers starting with the register
address specified as part of the instruction. The number of
registers that will be written is one plus the value of the second
byte.
Operands:r, n
Bytes:2
Encoding:0101 rrrr xxxx nnnn
Data Transfer Sequence:
Write Two Registers Starting from 04
0101 0100xxxx 0001
D
IN
(DIO)
H
Data for DIOData for DIR
SELFGCAL–Gain Self Calibration
Description: Starts the process of self-calibration for gain.
The Full-Scale Register (FSR) is updated with new values after
this operation.
Operands:None
Bytes:1
Encoding:1111 0010
Data Transfer Sequence:
ADS1240, 1241
SBAS173C
www.ti.com
19
SYSOCAL–System Offset Calibration
D
IN
1111 1110
DSYNC–Sync
DRDY
Description: Initiates a system offset calibration. The input
should be set to 0V, and the ADS1240 and ADS1241 compute
the OCR value that compensates for offset errors. The Offset
Calibration Register (OCR) is updated after this operation. The
user must apply a zero input signal to the appropriate analog
inputs. The OCR register is automatically updated afterwards.
Operands:None
Bytes:1
Encoding:1111 0011
Data Transfer Sequence:
1111 0011
D
IN
SYSGCAL–System Gain Calibration
Description: Starts the system gain calibration process. For
a system gain calibration, the input should be set to the
reference voltage and the ADS1240 and ADS1241 compute
the FSR value that will compensate for gain errors. The FSR
is updated after this operation. To initiate a system gain
calibration, the user must apply a full-scale input signal to the
appropriate analog inputs. FCR register is updated automatically.
Operands:None
Bytes:1
Encoding:1111 0100
Data Transfer Sequence:
1111 0100
D
IN
Description: Synchronizes the ADS1240 and ADS1241 to an
external event.
Operands:None
Bytes:1
Encoding:1111 1100
Data Transfer Sequence:
1111 1100
D
IN
SLEEP–Sleep Mode
Description: Puts the ADS1240 and ADS1241 into a low
power sleep mode. To exit sleep mode, issue the WAKEUP
command.
Operands:None
Bytes:1
Encoding:1111 1101
Data Transfer Sequence:
1111 1101
D
IN
RESET–Reset to Default Values
Description: Restore the registers to their power-up values.
This command stops the Read Continuous mode.
Operands:None
Bytes:1
Encoding:1111 1110
Data Transfer Sequence:
WAKEUP
Description: Wakes the ADS1240 and ADS1241 from SLEEP
mode.
Operands:None
Bytes:1
Encoding:1111 1011
Data Transfer Sequence:
1111 1011
D
IN
20
www.ti.com
ADS1240, 1241
SBAS173C
APPLICATION EXAMPLES
ADS1240.
GENERAL-PURPOSE WEIGH SCALE
Figure 8 shows a typical schematic of a general-purpose
weigh scale application using the ADS1240. In this example,
the internal PGA is set to either 64 or 128 (depending on the
maximum output voltage of the load cell) so that the load cell
output can be directly applied to the differential inputs of
EMI Filter
EMI Filter
Load Cell
EMI Filter
EMI Filter
HIGH PRECISION WEIGH SCALE
Figure 9 shows the typical schematic of a high-precision
weigh scale application using the ADS1240. The front-end
differential amplifier helps maximize the dynamic range.
2.7V ~ 5.25V
AV
DD
V
REF+
AIN0
ADS1240
AIN1
V
REF–
AGNDDGND
DV
DD
DRDY
SCLK
D
D
X
OUT
OUT
CS
X
OUT
SPI
IN
2.7V ~ 5.25V
V
DD
MSP430x4xx
or other µP
MCLK
GND
FIGURE 8. Schematic of a General-Purpose Weigh Scale.
2.7V ~ 5.25V
EMI Filter
EMI Filter
OPA2335
Load Cell
EMI Filter
EMI Filter
R
R
G
R
OPA2335
F
F
2.7V ~ 5.25V
AV
DD
V
REF+
R
I
R
I
AIN0
C
I
A
1
IN
V
REF–
AGNDDGND
ADS1240
ADS1241
DV
DD
DRDY
SCLK
D
X
OUT
D
CS
X
OUT
SPI
IN
IN
V
DD
MSP430x4xx
or other µP
MCLK
GND
G = 1 + 2 • RF/R
G
FIGURE 9. Block Diagram for a High-Precision Weigh Scale.
ADS1240, 1241
SBAS173C
www.ti.com
21
DEFINITION OF TERMS
An attempt has been made to be consistent with the terminology used in this data sheet. In that regard, the definition
of each term is given as follows:
Analog Input Voltage—the voltage at any one analog input
relative to AGND.
Analog Input Differential Voltage—given by the following
equation: (IN+) – (IN–). Thus, a positive digital output is
produced whenever the analog input differential voltage is
positive, while a negative digital output is produced whenever
the differential is negative.
For example, when the converter is configured with a 2.5V
reference and placed in a gain setting of 1, the positive
full-scale output is produced when the analog input differential is 2.5V. The negative full-scale output is produced when
the differential is –2.5V. In each case, the actual input
voltages must remain within the AGND to AV
Conversion Cycle—the term
conversion cycle
to a discrete A/D conversion operation, such as that performed by a successive approximation converter. As used
here, a conversion cycle refers to the t
DATA
Data Rate—The rate at which conversions are completed.
See definition for f
f
DATA
.
DATA
f
=
128 21280 2•••
OSC
SPEEDDR
SPEED = 0, 1
DR = 0, 1, 2
—the frequency of the crystal oscillator or CMOS com-
f
OSC
patible input signal at the X
input of the ADS1240 and
IN
ADS1241.
f
—the frequency or speed at which the modulator of the
MOD
ADS1240 and ADS1241 is running. This depends on the
SPEED bit as given by the following equation:
SPEED = 0SPEED = 1
mfactor128256
range.
DD
usually refers
time period.
f
f
MOD
f
—the frequency, or switching speed, of the input sam-
SAMP
PGA SETTINGSAMPLING FREQUENCY
1, 2, 4, 8
64, 128
OSCOSC
==
mfactor
16
32
128 2•
f
SAMP
f
SAMP
f
SAMP
f
SAMP
f
SPEED
=
mfactor
f
OSC
=
mfactor
f
OSC
=
mfactor
f
OSC
=
mfactor
f
OSC
•2
•4
•8
pling capacitor. The value is given by one of the following
equations:
f
—the frequency of the digital output data produced by
DATA
the ADS1240 and ADS1241, f
is also referred to as the
DATA
Data Rate.
Full-Scale Range (FSR)—as with most A/D converters, the
full-scale range of the ADS1240 and ADS1241 is defined as
the input, that produces the positive full-scale digital output
minus the input, that produces the negative full-scale digital
output.
For example, when the converter is configured with a 2.5V
reference and is placed in a gain setting of 2, the full-scale
range is: [1.25V (positive full-scale) minus –1.25V (negative
full-scale)] = 2.5V.
Least Significant Bit (LSB) Weight—this is the theoretical
amount of voltage that the differential voltage at the analog
input has to change in order to observe a change in the
output data of one least significant bit. It is computed as
follows:
−
LSB Weight
Full Scale Range
=
N
21–
where N is the number of bits in the digital output.
NOTES: (1) With a 2.5V reference. (2) Refer to electrical specification for analog input voltage range.
(1)
(2)
RANGERANGEINPUT VOLTAGES
TABLE VI. Full-Scale Range versus PGA Setting.
22
www.ti.com
2• V
PGA
V
PGA
REF
GENERAL EQUATIONS
REF
RANGE = 0
RANGE = 1
(2)
±V
REF
PGA
±•V
REF
2
PGA
ADS1240, 1241
SBAS173C
RANGE
±•V
REF
2
PGA
±•V
REF
4
PGA
IMPORTANT NOTICE
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accordance with TI’s standard warranty . Testing and other quality control techniques are used to the extent TI
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