TEXAS INSTRUMENTS ADS1240, ADS1241 Technical data

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A
D
S
1
2
4
0
ADS1240
ANALOG-TO-DIGITAL CONVERTER
FEATURES
24 BITS NO MISSING CODES
SIMULTANEOUS 50Hz AND 60Hz REJECTION
(–90dB MINIMUM)
0.0015% INL
21 BITS EFFECTIVE RESOLUTION
PGA GAINS FROM 1 TO 128
SINGLE CYCLE SETTLING
PROGRAMMABLE DATA OUTPUT RATES
EXTERNAL DIFFERENTIAL REFERENCE
OF 0.1V TO 5V
ON-CHIP CALIBRATION
SPI™ COMPATIBLE
2.7V TO 5.25V SUPPLY RANGE
600µW POWER CONSUMPTION
UP TO EIGHT INPUT CHANNELS
UP TO EIGHT DATA I/O
APPLICATIONS
INDUSTRIAL PROCESS CONTROL
WEIGH SCALES
LIQUID / GAS CHROMATOGRAPHY
BLOOD ANALYSIS
SMART TRANSMITTERS
PORTABLE INSTRUMENTATION
AV
24-Bit
DESCRIPTION
The ADS1240 and ADS1241 are precision, wide dynamic range, delta-sigma, Analog-to-Digital (A/D) converters with 24-bit resolution operating from 2.7V to 5.25V power supplies. The delta-sigma A/D converter provides up to 24 bits of no missing code performance and effective resolution of 21 bits.
The input channels are multiplexed. Internal buffering can be selected to provide very high input impedance for direct connection to transducers or low-level voltage signals. Burnout current sources are provided that allow for detection of an open or shorted sensor. An 8-bit Digital-to-Analog (D/A) converter provides an offset cor­rection with a range of 50% of the Full-Scale Range (FSR).
The Programmable Gain Amplifier (PGA) provides selectable gains of 1 to 128, with an effective resolution of 19 bits at a gain of 128. The A/D conversion is accomplished with a 2nd-order delta-sigma modu­lator and programmable Finite-Impulse Response (FIR) filter that provides a simultaneous 50Hz and 60Hz notch. The reference input is differential and can be used for ratiometric conversion.
The serial interface is SPI compatible. Up to eight bits of data I/O are also provided that can be used for input or output. The ADS1240 and ADS1241 are designed for high-resolution measure­ment applications in smart transmitters, industrial process control, weigh scales, chromatography, and portable instrumentation.
AGNDAV
DD
DD
2µA
A
D
S
1
2
4
1
SBAS173C – JUNE 2001 – REVISED NOVEMBER 2003
V
REF+VREF–
Offset
DAC
ADS1241
X
X
IN
OUT
Clock Generator
0/D0
A
IN
1/D1
A
IN
2/D2
A
IN
3/D3
A
IN
4/D4
A
IN
5/D5
A
IN
6/D6
A
IN
7/D7
A
IN
A
INCOM
ADS1241
Only
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
MUX
2µA
AGND
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A = 1:128
BUF PGA
+
2nd-Order Modulator
DD
Copyright © 2001-2003, Texas Instruments Incorporated
Digital
Filter
Controller Registers
Serial Interface
DSYNCPDWN RESET DRDYBUFEN DGNDDV
POL SCLK D
IN
D
OUT
CS
ABSOLUTE MAXIMUM RATINGS
AVDD to DGND ...................................................................... –0.3V to +6V
DV
to DGND...................................................................... –0.3V to +6V
DD
Input Current ............................................................... 100mA, Momentary
DGND to AGND ....................................................................–0.3V to 0.3V
Input Current ................................................................. 10mA, Continuous
A
.................................................................AGND –0.5V to AVDD + 0.5V
IN
Digital Input Voltage to DGND ................................. –0.3V to DV
Digital Output Voltage to DGND ..............................–0.3V to DV
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ......................................... –40°C to +85°C
Storage Temperature Range .......................................... –60°C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.
(1)
DD DD
+ 0.3V + 0.3V
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru­ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
EVALUATION MODULE ORDERING INFORMATION
PRODUCT DESCRIPTION
ADS1241EVM ADS1240 and ADS1241 Evaluation Module
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE-LEAD DESIGNATOR
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
ADS1240 SSOP-24 DB –40°C to +85°C ADS1240E ADS1240E Rails, 60
(1)
"" " ""ADS1240E/1K Tape and Reel, 1000
ADS1241 SSOP-28 DB –40°C to +85°C ADS1241E ADS1241E Rails, 48
"" " ""ADS1241E/1K Tape and Reel, 1000
SPECIFIED
RANGE MARKING NUMBER MEDIA, QUANTITY
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
DIGITAL CHARACTERISTICS: –40°C to +85°C, DVDD 2.7V to 5.25V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Digital Input/Output Logic Family CMOS Logic Level: V
Input Leakage: I
Master Clock Rate: f Master Clock Period: t
IH
V
IL
V
OH
V
OL
IH
I
IL
OSC
OSC
IOH = 1mA DVDD – 0.4 V IOL = 1mA DGND DGND + 0.4 V VI = DV
DD
VI = 0 –10 µA
1/f
OSC
0.8 • DV
DD
DGND 0.2 • DV
15MHz
200 1000 ns
DV
DD
DD
10 µA
V V
2
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ADS1240, 1241
SBAS173C
ELECTRICAL CHARACTERISTICS: AVDD = 5V
All specifications T
PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT
Analog Input Range Buffer OFF AGND – 0.1 AV
Full-Scale Input Range
Differential Input Impedance Buffer OFF 5/PGA M
Bandwidth
f
= 3.75Hz –3dB 1.65 Hz
DATA
f
= 7.50Hz –3dB 3.44 Hz
DATA
f
= 15.00Hz –3dB 14.6 Hz
DATA
Programmable Gain Amplifier User-Selectable Gain Ranges 1 128 Input Capacitance 9pF Input Leakage Current Modulator OFF, T = 25°C5 pA Burnout Current Sources 2 µA
OFFSET DAC
Offset DAC Range RANGE = 0 ±V
Offset Monotonicity 8 Bits Offset DAC Gain Error ±10 % Offset DAC Gain Error Drift 1 ppm/°C
SYSTEM PERFORMANCE
Resolution No Missing Codes 24 Bits Integral Nonlinearity End Point Fit ±0.0015 % of FS Offset Error Offset Drift Gain Error 0.005 % Gain Error Drift Common-Mode Rejection at DC 100 dB
Normal-Mode Rejection f
Output Noise See Typical Characteristics Power-Supply Rejection at DC, dB = –20 log(∆V
VOLTAGE REFERENCE INPUT
V
REF
Reference Input Range REF IN+, REF IN– 0 AV
Common-Mode Rejection at DC 120 dB Common-Mode Rejection f Bias Current
POWER-SUPPLY REQUIREMENTS
Power-Supply Voltage AV Analog Current PDWN = 0, or SLEEP 1 nA
Digital Current Normal Mode, DV
Power Dissipation PGA = 1, Buffer OFF, DV
NOTES: (1) Calibration can minimize these errors to the level of the noise.
(2) ∆V (3) 12pF switched capacitor at f
to T
MIN
, AVDD = +5V, DVDD = +2.7V to 5.25V, f
MAX
(AIN0 – AIN7, A
(1)
(1)
(1)
(3)
is a change in digital result.
OUT
INCOM
= 19.2kHz, PGA = 1, Buffer ON, f
MOD
)
Buffer ON AGND + 0.05 AV
(In+) – (In–), See Block Diagram, RANGE = 0
RANGE = 1
Buffer ON 5 G
RANGE = 1 ±V
f
= 60Hz, f
CM
f
= 50Hz, f
CM
= 50Hz, f
SIG
f
= 60Hz, f
SIG
V
(REF IN+) – (REF IN–), RANGE = 0
REF
= 15Hz 130 dB
DATA
= 15Hz 120 dB
DATA
= 15Hz 100 dB
DATA
= 15Hz 100 dB
DATA
/VDD)
OUT
RANGE = 1 0.1 AV
VREFCM
= 60Hz, f
V
REF
= 15Hz 120 dB
DATA
= 2.5V 1.3 µA
DD
PGA = 1, Buffer OFF 120 250 µA
PGA = 128, Buffer OFF 400 675 µA
PGA = 1, Buffer ON 160 300 µA
PGA = 128, Buffer ON 760 1275 µA
= 5V 80 125 µA
SLEEP Mode, DV
Read Data Continuous Mode, DVDD = 5V
DD
= 5V 60 µA
DD
PDWN 0.5 nA
= 5V 1.1 1.9 mW
DD
clock frequency.
SAMP
= 15Hz, and V
DATA
= +2.5V, unless otherwise specified.
REF
ADS1240 ADS1241
+ 0.1 V
DD
– 1.5 V
DD
±V
/PGA V
REF
±V
/(2 • PGA)
REF
/(2 • PGA) V
REF
/(4 • PGA) V
REF
V
7.5 ppm of FS
0.02 ppm of FS/°C
0.5 ppm/°C
(2)
80 95 dB
0.1 2.5 2.6 V
DD DD
V V
4.75 5.25 V
230 µA
ADS1240, 1241
SBAS173C
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3
ELECTRICAL CHARACTERISTICS: AVDD = 3V
All specifications –40°C to +85°C, AVDD = +3V, DVDD = +2.7V to 5.25V, f
PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT
(AIN0 – AIN7, A
Analog Input Range Buffer OFF AGND – 0.1 AV
INCOM
)
Buffer ON AGND + 0.05 AV
Full-Scale Input Voltage Range
(In+) – (In–) See Block Diagram, RANGE = 0
RANGE = 1 Input Impedance Buffer OFF 5/PGA M Differential Buffer ON 5 G Bandwidth
f
= 3.75Hz –3dB 1.65 Hz
DATA
f
= 7.50Hz –3dB 3.44 Hz
DATA
f
= 15.00Hz –3dB 14.6 Hz
DATA
Programmable Gain Amplifier User-Selectable Gain Ranges 1 128 Input Capacitance 9pF Input Leakage Current Modulator OFF, T = 25°C5 pA Burnout Current Sources 2 µA
OFFSET DAC
Offset DAC Range RANGE = 0 ±V
RANGE = 1 ±V
Offset DAC Monotonicity 8 Bits Offset DAC Gain Error ±10 % Offset DAC Gain Error Drift 2 ppm/°C
SYSTEM PERFORMANCE
Resolution No Missing Codes 24 Bits Integral Nonlinearity End Point Fit ±0.0015 % of FS Offset Error Offset Drift Gain Error 0.01 % Gain Error Drift
(1)
(1)
(1)
Common-Mode Rejection at DC 100 dB
f
= 60Hz, f
CM
f
= 50Hz, f
Normal-Mode Rejection f
Output Noise See Typical Characteristics
CM SIG
f
SIG
= 50Hz, f = 60Hz, f
Power-Supply Rejection at DC, dB = –20 log(∆V
VOLTAGE REFERENCE INPUT
V
REF
Reference Input Range REF IN+, REF IN– 0 AV
V
(REF IN+) – (REF IN–), RANGE = 0
REF
RANGE = 1 0.1 2.5 2.6 V Common-Mode Rejection at DC 120 dB
Common-Mode Rejection f Bias Current
(3)
VREFCM
= 60Hz, f
V
REF
POWER-SUPPLY REQUIREMENTS
Power-Supply Voltage AV Analog Current PDWN = 0, or SLEEP 1 nA
PGA = 1, Buffer OFF 107 225 µA
PGA = 128, Buffer OFF 355 600 µA
PGA = 1, Buffer ON 118 275 µA
PGA = 128, Buffer ON 483 1225 µA
Digital Current Normal Mode, DV
SLEEP Mode, DV
Read Data Continuous Mode, DVDD = 3V
PDWN = 0 0.5 nA
Power Dissipation PGA = 1, Buffer OFF, DV
NOTES: (1) Calibration can minimize these errors to the level of the noise.
(2) ∆V (3) 12pF switched capacitor at f
is a change in digital result.
OUT
clock frequency.
SAMP
= 19.2kHz, PGA = 1, Buffer ON, f
MOD
= 15Hz, and V
DATA
= +1.25V, unless otherwise specified.
REF
ADS1240 ADS1241
+ 0.1 V
DD
– 1.5 V
DD
±V
/PGA V
REF
±V
/(2 • PGA)
REF
/(2 • PGA) V
REF
/(4 • PGA) V
REF
15 ppm of FS
0.04 ppm of FS/°C
1.0 ppm/°C
= 15Hz 130 dB
DATA
= 15Hz 120 dB
DATA
= 15Hz 100 dB
DATA
= 15Hz 100 dB
DATA
(2)
OUT
/VDD)
75 90 dB
0.1 1.25 1.30 V
DD
= 15Hz 120 dB
DATA
= 1.25 0.65 µA
DD
= 3V 50 100 µA
DD
= 3V 40 µA
DD
= 3V 0.6 1.2 mW
DD
2.7 3.3 V
113 µA
V
V
4
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ADS1240, 1241
SBAS173C
PIN CONFIGURATION (ADS1240)
PIN CONFIGURATION (ADS1241)
Top View SSOP Top View SSOP
DV
DGND
X
X
OUT
RESET
DSYNC
PDWN
DGND
V
REF+
V
REF–
AIN0/D0 A
1/D1
IN
1
DD
2 3
IN
4 5 6
ADS1240
7 8
9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
BUFEN DRDY SCLK D
OUT
D
IN
CS POL AV
DD
AGND A
INCOM
AIN3/D3 A
2/D2
IN
PIN DESCRIPTIONS (ADS1240)
PIN
NUMBER NAME DESCRIPTION
1DV 2 DGND Digital Ground 3X 4X 5 RESET Active LOW, resets the entire device. 6 DSYNC Active LOW, Synchronization Control 7 PDWN Active LOW, Power Down. The power down func-
8 DGND Digital Ground
9V 10 V 11 A 12 A
REF+
REF– IN IN
13 AIN2/D2 Analog Input 2 / Data I/O 2 14 A 15 A
IN
INCOM
16 AGND Analog Ground 17 AV 18 POL Serial Clock Polarity 19 CS Active LOW, Chip Select 20 D 21 D 22 SCLK Serial Clock, Schmitt Trigger 23 DRDY Active LOW, Data Ready 24 BUFEN Buffer Enable
Digital Power Supply
DD
Clock Input
IN
Clock Output, used with external crystals.
OUT
tion shuts down the analog and digital circuits.
Positive Differential Reference Input
Negative Differential Reference Input 0/D0 Analog Input 0 / Data I/O 0 1/D1 Analog Input 1 / Data I/O 1
3/D3 Analog Input 3 / Data I/O 3
Analog Input Common, connect to AGND if unused.
Analog Power Supply
DD
Serial Data Input, Schmitt Trigger
IN
Serial Data Output
OUT
DV
DGND
X
X
OUT
RESET
DSYNC
PDWN DGND
V
REF+
V
REF–
AIN0/D0
1/D1
A
IN
A
4/D4
IN
A
5/D5
IN
1
DD
2 3
IN
4 5 6 7
ADS1241
8
9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
BUFEN DRDY SCLK D
OUT
D
IN
CS POL AV
DD
AGND A
INCOM
AIN3/D3
2/D2
A
IN
A
7/D7
IN
A
6/D6
IN
PIN DESCRIPTIONS (ADS1241)
PIN
NUMBER NAME DESCRIPTION
1DV 2 DGND Digital Ground 3X 4X 5 RESET Active LOW, resets the entire device.
OUT
6 DSYNC Active LOW, Synchronization Control 7 PDWN Active LOW, Power Down. The power down func-
8 DGND Digital Ground
9V 10 V 11 A 12 A 13 A 14 A 15 A 16 A 17 A 18 A 19 A 20 AGND Analog Ground
REF+
REF– IN IN IN IN IN IN IN IN
INCOM
21 AV 22 POL Serial Clock Polarity 23 CS Active LOW, Chip Select 24 D 25 D 26 SCLK Serial Clock, Schmitt Trigger 27 DRDY Active LOW, Data Ready 28 BUFEN Buffer Enable
Digital Power Supply
DD
Clock Input
IN
Clock Output, used with external crystals.
tion shuts down the analog and digital circuits.
Positive Differential Reference Input
Negative Differential Reference Input 0/D0 Analog Input 0 / Data I/O 0 1/D1 Analog Input 1 / Data I/O 1 4/D4 Analog Input 4 / Data I/O 4 5/D5 Analog Input 5 / Data I/O 5 6/D6 Analog Input 6 / Data I/O 6 7/D7 Analog Input 7 / Data I/O 7 2/D2 Analog Input 2 / Data I/O 2 3/D3 Analog Input 3 / Data I/O 3
Analog Input Common, connect to AGND if unused.
Analog Power Supply
DD
Serial Data Input, Schmitt Trigger
IN
Serial Data Output
OUT
ADS1240, 1241
SBAS173C
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5
TIMING DIAGRAMS
SCLK
(POL = 0)
SCLK
(POL = 1)
CS
D
t
3
t
4
IN
MSB
t
1
t
5
t
2
t
6
t
2
t
10
t
11
LSB
D
OUT
(Command or Command and Data)
NOTE: (1) Bit order = 0.
SCLK Reset Waveform
t
13
SCLK
t
12
DIAGRAM 1.
t
DATA
DRDY
t
17
SCLK
t
19
DIAGRAM 2.
TIMING CHARACTERISTICS TABLES
t
7
MSB
ADS1240 or ADS1241
Resets On
t
13
t
14
t
18
t
15
Falling Edge
t
8
(1)
300 t t13 : > 5 t 550 t 1050 t
RESET, DSYNC, PDWN
< t12 < 500 t
OSC
OSC
< t14 < 750 t
OSC
< t15 < 1250 t
OSC
LSB
t
9
(1)
OSC
OSC
OSC
t
16
SPEC DESCRIPTION MIN MAX UNITS
t
1
SCLK Period 4t
3 DRDY Periods
t
2
t
3
t
4
t
5
t
6
(1)
t
7
(1)
t
8
t
9
t
10
t
11
SCLK Pulse Width, HIGH and LOW 200 ns CS low to first SCLK Edge; Setup Time
(2)
0ns DIN Valid to SCLK Edge; Setup Time 50 ns Valid DIN to SCLK Edge; Hold Time 50 ns Delay between last SCLK edge for DIN and first SCLK edge for D
OUT
:
RDATA, RDATAC, RREG, WREG 50 t
SCLK Edge to Valid New D SCLK Edge to D Last SCLK Edge to D NOTE: D
OUT
, Hold Time 0 ns
OUT
Tri-State 6 10 t
OUT
goes tri-state immediately when CS goes HIGH.
OUT
50 ns
CS LOW time after final SCLK edge. 0 ns Final SCLK edge of one command until first edge SCLK
of next command:
RREG, WREG, DSYNC, SLEEP, RDATA, RDATAC, STOPC
4t
SELFGCAL, SELFOCAL, SYSOCAL, SYSGCAL 2 DRDY Periods SELFCAL 4 DRDY Periods RESET (also SCLK Reset or RESET Pin) 16 t
t
16
t
17
t
18
t
19
Pulse Width 4t Allowed analog input change for next valid conversion. 5000 t DOR update, DOR data not valid. 4 t First SCLK after DRDY goes LOW:
RDATAC Mode 10 t Any other mode 0 t
NOTES: (1) Load = 20pF10k to DGND.
(2) CS may be tied LOW.
OSC
OSC
OSC
OSC
OSC OSC OSC OSC
OSC OSC
Periods
Periods
Periods
Periods
Periods Periods Periods Periods
Periods Periods
6
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ADS1240, 1241
SBAS173C
TYPICAL CHARACTERISTICS
POWER SUPPLY REJECTION RATIO
vs FREQUENCY
Frequency of Power Supply (Hz)
110 1k100 10k 100k
PSRR (dB)
140
120
100
80
60
40
20
0
Buffer ON
All specifications, AVDD = +5V, DVDD = +5V, f
= 2.4576MHz, PGA = 1, f
OSC
= 15Hz, and V
DATA
(REF IN+) – (REF IN–) = +2.5V, unless otherwise specified.
REF
21.5
21.0
20.5
20.0
19.5
19.0
ENOB (rms)
18.5
18.0 Buffer OFF
17.5
17.0
20.5
20.0
19.5
19.0
18.5
18.0
ENOB (rms)
17.5
17.0
16.5
16.0
EFFECTIVE NUMBER OF BITS vs PGA SETTING
DR = 10
DR = 01
DR = 00
1 2 4 8 16 1286432
PGA Setting
EFFECTIVE NUMBER OF BITS vs PGA SETTING
DR = 10
DR = 01
DR = 00
Buffer OFF, V
1 2 4 8 16 64 12832
REF
= 1.25V
PGA Setting
EFFECTIVE NUMBER OF BITS vs PGA SETTING
22
21
DR = 00
PGA Setting
V
IN
DR = 10
DR = 01
(V)
20
19
18
ENOB (rms)
17
Buffer ON
16
15
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
Noise (rms, ppm of FS)
0.4
0.2
1 2 4 8 16 1286432
NOISE vs INPUT SIGNAL
0
–2.5 –1.5 0.5–0.5 1.5 2.5
COMMON-MODE REJECTION RATIO
140
120
100
80
60
CMRR (dB)
40
20
Buffer ON
0
1 10 100 1k 10k 100k
Frequency of Power Supply (Hz)
ADS1240, 1241
SBAS173C
vs FREQUENCY
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7
TYPICAL CHARACTERISTICS (Cont.)
All specifications, AVDD = +5V, DVDD = +5V, f
= 2.4576MHz, PGA = 1, f
OSC
= 15Hz, and V
DATA
(REF IN+) – (REF IN–) = +2.5V, unless otherwise specified.
REF
OFFSET vs TEMPERATURE
(Cal at 25°C)
50
PGA1
0
50
100
Offset (ppm of FS)
150
200
50 30 1010 30 50 70 90
PGA128
PGA64
Temperature (°C)
10
–2
INL (ppm of FS)
468
10
INTEGRAL NONLINEARITY vs INPUT SIGNAL
8 6 4
+85°C
2 0
2.5 2.0 1.0 0.51.5 0 0.5 1.0 1.5 2.0 2.5
40°C
+25°C
(V)
V
IN
PGA16
1.00010
1.00006
1.00002
0.99998
0.99994
Gain (Normalized)
0.99990
0.99986 –50 –30 10–10 30 50 70 90
150 140 130 120 110 100
90
Current (µA)
80 70
Buffer OFF
60 50
–50 –30 10–10 30 50 70 90
GAIN vs TEMPERATURE
(Cal at 25°C)
Temperature (°C)
ANALOG CURRENT vs TEMPERATURE
AV
= 5
DD
AV
= 3
DD
Temperature (°C)
8
900 800 700 600 500
(µA)
400
ANALOG
I
300 200 100
ANALOG CURRENT vs PGA
AVDD = 5V, Buffer = ON
AVDD = 3V, Buffer = ON
Buffer = OFF
0
1 2 4 8 16 1286432
Buffer = OFF
PGA Setting
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300
DIGITAL CURRENT vs SUPPLY
250
200
(µA)
150
DIGITAL
I
100
SLEEP
4.91MHz
Normal
4.91MHz
50
Power Down
0
3.0 3.5 4.0 4.5 5.0
V
(V)
DD
ADS1240, 1241
Normal
2.45MHz
SLEEP
2.45MHz
SBAS173C
TYPICAL CHARACTERISTICS (Cont.)
All specifications, AVDD = +5V, DVDD = +5V, f
3500
10k Readings V
= 0V
500
0
IN
3.5 3.0
2.5 2.0 1.5 1 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
3000
2500
2000
1500
1000
Number of Occurrences
NOISE HISTOGRAM
ppm of FS
= 2.4576MHz, PGA = 1, f
OSC
= 15Hz, and V
DATA
(REF IN+) – (REF IN–) = +2.5V, unless otherwise specified.
REF
OFFSET DAC
OFFSET vs TEMPERATURE
200 170 140 110
80 50 20
–10
Offset (ppm of FSR)
4070
100
50 30 1010 30 50 70 90
(Cal at 25°C)
Temperature (°C)
1.00020
1.00016
1.00012
1.00008
1.00004
1.00000
0.99996
0.99992
Gain (Normalized)
0.99988
0.99984
0.99980
0.99976 –50 –30 10–10 30 50 70 90
OFFSET DAC
GAIN vs TEMPERATURE
(Cal at 25°C)
Temperature (°C)
OFFSET DAC
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Noise (rms, ppm of FS)
0.1 0
–128 –96 –64 –32 0 32 64 96 128
NOISE vs SETTING
Offset DAC Setting
ADS1240, 1241
SBAS173C
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9
OVERVIEW
INPUT MULTIPLEXER
The input multiplexer provides for any combination of differ­ential inputs to be selected on any of the input channels, as shown in Figure 1. For example, if A positive differential input channel, any other channel can be selected as the negative terminal for the differential input
A
0/D0
IN
1/D1
A
IN
2/D2
A
IN
0 is selected as the
IN
AV
DD
Burnout Current Source
channel. With this method, it is possible to have up to eight single-ended input channels or four independent differential input channels for the ADS1241, and four single-ended input channels or two independent differential input channels for the ADS1240. Note that A
can be treated as an input
INCOM
channel. The ADS1240 and ADS1241 feature a single-cycle settling
digital filter that provides valid data on the first conversion after a new channel selection. In order to minimize the settling error, synchronize MUX changes to the conversion beginning, which is indicated by the falling edge of
DRDY
. In
other words, issuing a MUX change through the WREG command immediately after
DRDY
goes LOW minimizes the settling error. Increasing the time between the conversion beginning ( mand (t
DRDY
goes LOW) and the MUX change com-
) results in a settling error in the conversion
DELAY
data, as shown in Figure 2.
AIN3/D3
4/D4
A
IN
5/D5
A
IN
6/D6
A
ADS1241
Only
IN
7/D7
A
IN
A
INCOM
AGND
FIGURE 1. Input Multiplexer Configuration.
New Conversion Begins,
Complete Previous Conversion
DRDY
SCLK
(POL = 0)
Input Buffer
Burnout Current Source
t
DELAY
Previous Conversion Data
BURNOUT CURRENT SOURCES
The Burnout Current Sources can be used to detect sensor short-circuit or open-circuit conditions. Setting the Burnout Current Sources (BOCS) bit in the SETUP register activates two 2µA current sources called burnout current sources. One of the current sources is connected to the converters nega­tive input and the other is connected to the converter’s positive input.
Figure 3 shows the situation for an open-circuit sensor. This is a potential failure mode for many kinds of remotely con­nected sensors. The current source on the positive input acts as a pull-up, causing the positive input to go to the positive analog supply, and the current source on the negative input acts as a pull-down, causing the negative input to go to ground. The ADS1240/41 therefore outputs full-scale (7FFFFF Hex).
New Conversion Complete
DIN
FIGURE 2. Input Multiplexer Configuration.
10
MSB LSB
SETTLING ERROR vs DELAY TIME
10.000000
1.000000
0.100000
0.010000
0.001000
Settling Error (%)
0.000100
0.000010
0.000001 2 4 6 8 10 12 14 160
f
= 2.4576MHz
CLK
Delay Time, t
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DELAY
(ms)
ADS1240, 1241
SBAS173C
AV
DD
2µA
AV
DD
0V
ADC
CODE = 0x7FFFFF
OPEN CIRCUIT
2µA
FIGURE 3. Burnout detection while sensor is open-circuited.
The buffer draws additional current when activated. The current required by the buffer depends on the PGA setting. When the PGA is set to 1, the buffer uses approximately 50µA; when the PGA is set to 128, the buffer uses approxi-
mately 500µA.
PGA
H
The Programmable Gain Amplifier (PGA) can be set to gains of 1, 2, 4, 8, 16, 32, 64, or 128. Using the PGA can improve the effective resolution of the A/D converter. For instance, with a PGA of 1 on a 5V full-scale signal, the A/D converter can resolve down to 1µV. With a PGA of 128 and a full-scale signal of 39mV, the A/D converter can resolve down to 75nV. AV
DD
current increases with PGA settings higher than 4.
Figure 4 shows a short-circuited sensor. Since the inputs are shorted and at the same potential, the ADS1240/41 signal outputs are approximately zero. (Note that the code for shorted inputs is not exactly zero due to internal series
resistance, low-level noise and other error sources.)
AV
DD
2µA
AVDD/2
SHORT
CIRCUIT
AV
2µA
ADC
/2
DD
CODE 0
FIGURE 4. Burnout detection while sensor is short-circuited.
INPUT BUFFER
The input impedance of the ADS1240/41 without the buffer enabled is approximately 5M/PGA. For systems requiring very high input impedance, the ADS1240/41 provides a chopper-stabilized differential FET-input voltage buffer. When activated, the buffer raises the ADS1240/41 input impedance to approximately 5GΩ.
The buffers input range is approximately 50mV to AV
1.5V. The buffers linearity will degrade beyond this range. Differential signals should be adjusted so that both signals are within the buffers input range.
The buffer can be enabled using the BUFEN pin or the BUFEN bit in the ACR register. The buffer is on when the BUFEN pin is high and the BUFEN bit is set to one. If the BUFEN pin is low, the buffer is disabled. If the BUFEN bit is set to zero, the buffer is also disabled.
DD
OFFSET DAC
The input to the PGA can be shifted by half the full-scale input range of the PGA using the Offset DAC (ODAC) register. The ODAC register is an 8-bit value; the MSB is the sign and the seven LSBs provide the magnitude of the offset. Using the offset DAC does not reduce the performance of the A/D converter. For more details on the ODAC, please refer to TI application report SBAA077.
MODULATOR
The modulator is a single-loop second-order system. The modulator runs at a clock speed (f the external clock (f
). The frequency division is deter-
OSC
) that is derived from
MOD
mined by the SPEED bit in the SETUP register, as shown in Table I.
f
OSC
2.4576MHz 0 19,200Hz 15Hz 7.5Hz 3.75Hz 50/60Hz
4.9152MHz 0 38,400Hz 30Hz 15Hz 7.5Hz 100/120Hz
SPEED DR BITS 1st NOTCH
BIT f
MOD
1 9,600Hz 7.5Hz 3.75Hz 1.875Hz 25/30Hz
1 19,200Hz 15Hz 7.5Hz 3.75Hz 50/60Hz
00 01 10 FREQ.
TABLE I. Output Configuration.
CALIBRATION
The offset and gain errors can be minimized with calibration. The ADS1240 and ADS1241 support both self and system calibration.
Self-calibration of the ADS1240 and ADS1241 corrects inter­nal offset and gain errors and is handled by three commands: SELFCAL, SELFGAL, and SLEFOCAL. The SELFCAL com­mand performs both an offset and gain calibration. SELFGCAL performs a gain calibration and SELFOCAL performs an offset calibration, each of which takes two t complete. During self-calibration, the ADC inputs are discon­nected internally from the input pins. The PGA must be set to 1 prior to issuing a SELFCAL or SELFGCAL command. Any PGA is allowed when issuing a SELFOCAL command. For example, if using PGA = 64, first set PGA = 1 and issue
periods to
DATA
ADS1240, 1241
SBAS173C
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11
SELFGCAL. Afterwards set PGA = 64 and issue SELFOCAL.
C
1
Crystal
X
IN
X
OUT
C
2
For operation with a reference voltage greater than (AV
DD
1.5) volts, the buffer must also be turned off during gain self­calibration to avoid exceeding the buffer input range.
System calibration corrects both internal and external offset and gain errors. While performing system calibration, the appropriate signal must be applied to the inputs. The system offset calibration command (SYSOCAL) requires a zero input differential signal (see Table IV, page 18). It then computes the offset that nullifies the offset in the system. The system gain calibration command (SYSGCAL) requires a positive full-scale input signal. It then computes a value to nullify the gain error in the system. Each of these calibrations takes two t
periods to complete. System gain calibration is recom-
DATA
mended for the best gain calibration at higher PGAs. Calibration should be performed after power on, a change in
temperature, or a change of the PGA. The RANGE bit (ACR bit
2) must be zero during calibration. Calibration removes the effects of the ODAC; therefore, dis-
able the ODAC during calibration, and enable again after calibration is complete.
At the completion of calibration, the
DRDY
signal goes low, indicating the calibration is finished. The first data after calibration should be discarded since it may be corrupt from calibration data remaining in the filter. The second data is always valid.
EXTERNAL VOLTAGE REFERENCE
The ADS1240 and ADS1241 require an external voltage reference. The selection for the voltage reference value is made through the ACR register.
The external voltage reference is differential and is repre­sented by the voltage difference between the pins: +V and –V –V
REF,
. The absolute voltage on either pin, +V
REF
can range from AGND to AVDD. However, the follow-
REF
REF
or
ing limitations apply: For AV
V
REF
For AV V
REF
For AV V
REF
For AV V
REF
= 5.0V and RANGE = 0 in the ACR, the differential
DD
must not exceed 2.5V.
= 5.0V and RANGE = 1 in the ACR, the differential
DD
must not exceed 5V.
= 3.0V and RANGE = 0 in the ACR, the differential
DD
must not exceed 1.25V.
= 3.0V and RANGE = 1 in the ACR, the differential
DD
must not exceed 2.5V.
CLOCK GENERATOR
The clock source for the ADS1240 and ADS1241 can be provided from a crystal, oscillator, or external clock. When the clock source is a crystal, external capacitors must be provided to ensure start-up and stable clock frequency. This is shown in both Figure 5 and Table II. X crystals and it should not be used as a clock driver for external
circuitry.
is only for use with external
OUT
FIGURE 5. Crystal Connection.
CLOCK PART
SOURCE FREQUENCY C
Crystal 2.4576 0-20pF 0-20pF ECS, ECSD 2.45 - 32 Crystal 4.9152 0-20pF 0-20pF ECS, ECSL 4.91 Crystal 4.9152 0-20pF 0-20pF ECS, ECSD 4.91 Crystal 4.9152 0-20pF 0-20pF CTS, MP 042 4M9182
C
1
2
NUMBER
TABLE II. Recommended Crystals.
DIGITAL FILTER
The ADS1240 and ADS1241 have a 1279 tap linear phase Finite Impulse Response (FIR) digital filter that a user can configure for various output data rates. When a 2.4576MHz crystal is used, the device can be programmed for an output data rate of 15Hz, 7.5Hz, or 3.75Hz. Under these conditions, the digital filter rejects both 50Hz and 60Hz interference. Figure 6 shows the digital filter frequency response for data output rates of 15Hz, 7.5Hz, and 3.75Hz.
If a different data output rate is desired, a different crystal frequency can be used. However, the rejection frequencies shift accordingly. For example, a 3.6864MHz master clock with the default register condition has:
(3.6864MHz/2.4576MHz) 15Hz = 22.5Hz data output rate
and the first and second notch is:
1.5 (50Hz and 60Hz) = 75Hz and 90Hz
DATA I/O INTERFACE
The ADS1240 has four pins and the ADS1241 has eight pins that serve a dual purpose as both analog inputs and data I/O. These pins are powered from AV through the IOCON, DIR, and DIO registers. These pins can be individually configured as either analog inputs or data I/O. See Figure 7 (page 14) for the equivalent schematic of an Analog/Data I/O pin.
The IOCON register defines the pin as either an analog input or data I/O. The power-up state is an analog input. If the pin is configured as an analog input in the IOCON register, the DIR and DIO registers have no effect on the state of the pin.
If the pin is configured as data I/O in the IOCON register, then DIR and DIO are used to control the state of the pin. The DIR register controls the direction of the data pin, either as an input or output. If the pin is configured as an input in the DIR register, then the corresponding DIO register bit reflects the state of the pin. Make sure the pin is driven to a
and are configured
DD
12
ADS1240, 1241
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SBAS173C
ADS1240 AND ADS1241
0
FILTER RESPONSE WHEN f
DATA
20406080
100
Gain (dB)
120140160180
020 8040 60 100 120 140 160 180 200
Frequency (Hz)
= 15Hz
FREQUENCY RESPONSE FROM 45Hz to 65Hz
–40
WHEN f
DATA
= 15Hz
5060708090
100
Magnitude (dB)
110120130140
45 50 55 60 65
Frequency (Hz)
ADS1240 AND ADS1241
0
FILTER RESPONSE WHEN f
DATA
= 7.5Hz
20406080
100
Gain (dB)
120140160180
020 8040 60 100 120 140 160 180 200
Frequency (Hz)
ADS1240 AND ADS1241
0
FILTER RESPONSE WHEN f
DATA
= 3.75Hz
20406080
100
Gain (dB)
120140160180
020 8040 60 100 120 140 160 180 200
Frequency (Hz)
FREQUENCY RESPONSE FROM 45Hz to 65Hz
–40
WHEN f
DATA
= 7.5Hz
5060708090
100
Magnitude (dB)
110120130140
45 50 55 60 65
Frequency (Hz)
FREQUENCY RESPONSE FROM 45Hz to 65Hz
–40
WHEN f
DATA
= 3.75Hz
5060708090
100
Magnitude (dB)
110120130140
45 50 55 60 65
Frequency (Hz)
f
OSC
DATA –3dB
OUTPUT RATE BANDWIDTH f
15Hz 14.6Hz –80.8dB –87.3dB –68.5dB –76.1dB
7.5Hz 3.44Hz –85.9dB –87.4dB –71.5dB –76.2dB
3.75Hz 1.65Hz –93.8dB –88.6dB –86.8dB –77.3dB
FIGURE 6. Filter Frequency Responses.
ADS1240, 1241
SBAS173C
= 2.4576MHz, SPEED = 0 or f
= 4.9152MHz, SPEED = 1
OSC
ATTENUATION
= 50 ± 0.3Hz fIN = 60 ± 0.3Hz fIN = 50 ± 1Hz fIN = 60 ± 1Hz
IN
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13
logic one or zero when configured as an input to prevent excess current dissipation. If the pin is configured as an output in the DIR register, then the corresponding DIO register bit value determines the state of the output pin (0 = AGND, 1 = AV
DD
).
It is still possible to perform A/D conversions on a pin configured as data I/O. This may be useful as a test mode, where the data I/O pin is driven and an A/D conversion is done on the pin.
IOCON DIR
DIO WRITE
AINx/Dx
T o Analog Mux
DIO READ
FIGURE 7. Analog/Data Interface Pin.
SERIAL PERIPHERAL INTERFACE
The Serial Peripheral Interface (SPI) allows a controller to communicate synchronously with the ADS1240 and ADS1241. The ADS1240 and ADS1241 operate in slave-only mode. The serial interface is a standard four-wire SPI ( D
and D
IN
) interface that supports both serial clock
OUT
CS
, SCLK,
polarities (POL pin).
Chip Select (CS)
The chip select (CS) input must be externally asserted before communicating with the ADS1240 or ADS1241.
CS
must stay LOW for the duration of the communication. Whenever
CS
goes HIGH, the serial interface is reset.
CS
may be hard-wired LOW.
Serial Clock (SCLK)
The serial clock (SCLK) features a Schmitt-triggered input and is used to clock D
and D
IN
data. Make sure to have
OUT
a clean SCLK to prevent accidental double-shifting of the data. If SCLK is not toggled within 3
DRDY
pulses, the serial interface resets on the next SCLK pulse and starts a new communication cycle. A special pattern on SCLK resets the entire chip; see the RESET section for additional information.
Clock Polarity (POL)
The clock polarity input (POL) controls the polarity of SCLK. When POL is LOW, data is clocked on the falling edge of SCLK and SCLK should be idled LOW. Likewise, when POL is HIGH, the data is clocked on the rising edge of SCLK and SCLK should be idled HIGH.
Data Input (DIN) and Data Output (D
The data input (DIN) and data output (D data from the ADS1240 and ADS1241. D ance when not in use to allow D together and driven by a bidirectional bus. Note: the Read
and D
IN
OUT
)
OUT
) receive and send
is high imped-
OUT
to be connected
OUT
Data Continuous Mode (RDATAC) command should not be issued when D mode, D either of these 8-bit bytes appear on D nected to D
DATA READY
The
DRDY
and D
IN
looks for the STOPC or RESET command. If
IN
), the RDATAC mode ends.
IN
DRDY
are connected. While in RDATAC
OUT
(which is con-
OUT
PIN
line is used as a status signal to indicate when
data is ready to be read from the internal data register.
DRDY
goes LOW when a new data word is available in the DOR register. It is reset HIGH when a read operation from the data register is complete. It also goes HIGH prior to the updating of the output register to indicate when not to read from the device to ensure that a data read is not attempted while the register is being updated.
The status of 7 of the ACR register (address 2 operate in 3-wire mode by tying the case, the SCLK, D
DRDY
can also be obtained by interrogating bit
). The serial interface can
H
CS
input LOW. In this
, and D
IN
lines are used to communi-
OUT
cate with the ADS1240 and ADS1241. This scheme is suitable for interfacing to microcontrollers. If
CS
is required as a decoding signal, it can be generated from a port bit of the microcontroller.
DSYNC OPERATION
Synchronization can be achieved either through the pin or the DSYNC command. When the
DSYNC
the digital circuitry is reset on the falling edge of While
DSYNC
Reset is released when
is LOW, the serial interface is deactivated.
DSYNC
is taken HIGH. Synchroni­zation occurs on the next rising edge of the system clock after
DSYNC
is taken HIGH.
When the DSYNC command is sent, the digital filter is reset on the edge of the last SCLK of the DSYNC command. The modulator is held in RESET until the next edge of SCLK is detected. Synchronization occurs on the next rising edge of the system clock after the first SCLK following the DSYNC command.
DSYNC
pin is used,
DSYNC
POWER-UPSUPPLY VOLTAGE RAMP RATE
The power-on reset circuitry was designed to accommodate digital supply ramp rates as slow as 1V/10ms. To ensure proper operation, the power supply should ramp monotoni­cally.
RESET
The user can reset the registers to their default values in three different ways: by asserting the the RESET command; or by applying a special waveform on the SCLK (the
SCLK Reset Waveform
Timing Diagram). Note: if both POL and SCLK pins are held high, applying the SCLK Reset Waveform to the resets the part.
RESET
pin; by issuing
, as shown in the
CS
pin also
.
14
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ADS1240, 1241
SBAS173C
ADS1240 AND ADS1241
tion needed to configure the part, such as data format, multiplexer settings, calibration settings, data rate, etc. The
REGISTER
set of the 16 registers are shown in Table III.
The operation of the device is set up through individual registers. Collectively, the registers contain all the informa-
ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
00 01 02 03 04 05 06 07 08 09 0A
0B 0C 0D 0E 0F
H H H H H H H H H H
H H H H H
H
SETUP ID ID ID ID BOCS PGA2 PGA1 PGA0
MUX PSEL3 PSEL2 PSEL1 PSEL0 NSEL3 NSEL2 NSEL1 NSEL0
ACR DRDY U/B SPEED BUFEN BIT ORDER RANGE DR1 DR0
ODAC SIGN OSET6 OSET5 OSET4 OSET3 OSET2 OSET1 OSET0
DIO DIO_7 DIO_6 DIO_5 DIO_4 DIO_3 DIO_2 DIO_1 DIO_0 DIR DIR_7 DIR_6 DIR_5 DIR_4 DIR_3 DIR_2 DIR_1 DIR_0
IOCON IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0
OCR0 OCR07 OCR06 OCR05 OCR04 OCR03 OCR02 OCR01 OCR00 OCR1 OCR15 OCR14 OCR13 OCR12 OCR11 OCR10 OCR09 OCR08 OCR2 OCR23 OCR22 OCR21 OCR20 OCR19 OCR18 OCR17 OCR16
FSR0 FSR07 FSR06 FSR05 FSR04 FSR03 FSR02 FSR01 FSR00 FSR1 FSR15 FSR14 FSR13 FSR12 FSR11 FSR10 FSR09 FSR08
FSR2 FSR23 FSR22 FSR21 FSR20 FSR19 FSR18 FSR17 FSR16 DOR2 DOR23 DOR22 DOR21 DOR20 DOR19 DOR18 DOR17 DOR16 DOR1 DOR15 DOR14 DOR13 DOR12 DOR11 DOR10 DOR09 DOR08 DOR0 DOR07 DOR16 FSR21 DOR04 DOR03 DOR02 DOR01 DOR00
TABLE III. Registers.
DETAILED REGISTER DEFINITIONS
SETUP (Address 00H) Setup Register
Reset Value = iiii0000
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
ID ID ID ID BOCS PGA2 PGA1 PGA0
bit 7-4 Factory Programmed Bits bit 3 BOCS: Burnout Current Source
0 = Disabled (default) 1 = Enabled
bit 2-0 PGA2: PGA1: PGA0: Programmable Gain Amplifier
Gain Selection 000 = 1 (default) 001 = 2 010 = 4 011 = 8 100 = 16 101 = 32 110 = 64 111 = 128
MUX (Address 01H) Multiplexer Control Register Reset Value = 01
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
PSEL3 PSEL2 PSEL1 PSEL0 NSEL3 NSEL2 NSEL1 NSEL0
H
bit 7-4 PSEL3: PSEL2: PSEL1: PSEL0: Positive Channel
Select 0000 = A 0001 = A 0010 = A 0011 = A 0100 = A 0101 = A 0110 = A 0111 = A
0 (default)
IN
1
IN
2
IN
3
IN
4
IN
5
IN
6
IN
7
IN
1xxx = AINCOM (except when xxx = 111) 1111 = Reserved
bit 3-0 NSEL3: NSEL2: NSEL1: NSEL0: Negative Channel
Select 0000 = A 0001 = A 0010 = A 0011 = A 0100 = A 0101 = A 0110 = A 0111 = A
0
IN
1 (default)
IN
2
IN
3
IN
4
IN
5
IN
6
IN
7
IN
1xxx = AINCOM (except when xxx = 111) 1111 = Reserved
ADS1240, 1241
SBAS173C
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15
ACR (Address 02H) Analog Control Register Reset Value = X0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
DRDY U/B SPEED BUFEN
H
BIT ORDER
RANGE DR1 DR0
ODAC (Address 03 ) Offset DAC Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SIGN OSET6 OSET5 OSET4 OSET3 OSET2 OSET1 OSET0
H
bit 7
DRDY
: Data Ready (Read Only)
This bit duplicates the state of the
B
bit 6 U/
: Data Format 0 = Bipolar (default) 1 = Unipolar
U/B ANALOG INPUT DIGITAL OUTPUT (Hex)
0 Zero 0x000000
1 Zero 0x000000
+FSR 0x7FFFFF
–FSR 0x800000 +FSR 0xFFFFFF
–FSR 0x000000
bit 5 SPEED: Modulator Clock Speed
0 = f 1 = f
MOD MOD
= f = f
OSC OSC
/128 (default) /256
bit 4 BUFEN: Buffer Enable
0 = Buffer Disabled (default) 1 = Buffer Enabled
bit 3 BIT ORDER: Data Output Bit Order
0 = Most Significant Bit Transmitted First (default) 1 = Least Significant Bit Transmitted First
This configuration bit controls only the bit order within the byte of data that is shifted out. Data is always shifted out of the part most significant byte first. Data is always shifted into the part most significant bit first.
bit 2 RANGE: Range Select
0 = Full-Scale Input Range equal to ±V
(default).
1 = Full-Scale Input Range equal to ±1/2 V NOTE: This allows reference voltages as high as
AV
, but even with a 5V reference voltage the
DD
calibration must be performed with this bit set to 0.
bit 1-0 DR1: DR0: Data Rate
(f
= 2.4576MHz, SPEED = 0)
OSC
00 = 15Hz (default) 01 = 7.5Hz 10 = 3.75Hz 11 = Reserved
DRDY
pin.
REF
REF
bit 7 Sign
0 = Positive 1 = Negative
V
=
2 PGA
=
4
V
REF
REF
PGA
Offset
Offset
NOTE: The offset DAC must be enabled after calibration or the calibration
nullifies the effects.
OSET[6 : 0]
OSET
127
127
60
[:]
RANGE 0
RANGE
=
=
1
DIO (Address 04H) Data I/O Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
DIO 7 DIO 6 DIO 5 DIO 4 DIO 3 DIO 2 DIO 1 DIO 0
H
If the IOCON register is configured for data, a value written to this register appears on the data I/O pins if the pin is configured as an output in the DIR register. Reading this register returns the value of the data I/O pins.
Bit 4 to bit 7 is not used in ADS1240.
DIR (Address 05 Reset Value = FF
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 DIR7 DIR6 DIR5 DIR4 DIR3 DIR2 DIR1 DIR0
) Direction Control for Data I/O
H
H
Each bit controls whether the corresponding data I/O pin is an output (= 0) or input (= 1). The default power-up state is as inputs.
Bit 4 to bit 7 is not used in ADS1240.
IOCON (Address 06H) I/O Configuration Register Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0
H
bit 7-0 IO7: IO0: Data I/O Configuration
0 = Analog (default) 1 = Data
Configuring the pin as a data I/O pin allows it to be controlled through the DIO and DIR registers.
Bit 4 to bit 7 is not used in ADS1240.
16
OCR0 (Address 07H) Offset Calibration Coefficient (Least Significant Byte) Reset Value = 00
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H
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
OCR07 OCR06 OCR05 OCR04 OCR03 OCR02 OCR01 OCR00
ADS1240, 1241
SBAS173C
OCR1 (Address 08H) Offset Calibration Coefficient (Middle Byte) Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
OCR15 OCR14 OCR13 OCR12 OCR11 OCR10 OCR09 OCR08
H
FSR2 (Address 0CH) Full-Scale Register (Most Significant Byte) Reset Value = 55
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
FSR23 FSR22 FSR21 FSR20 FSR19 FSR18 FSR17 FSR16
H
OCR2 (Address 09H) Offset Calibration Coefficient (Most Significant Byte) Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
OCR23 OCR22 OCR21 OCR20 OCR19 OCR18 OCR17 OCR16
H
FSR0 (Address 0AH) Full-Scale Register (Least Significant Byte) Reset Value = 59
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
FSR07 FSR06 FSR05 FSR04 FSR03 FSR02 FSR01 FSR00
H
FSR1 (Address 0BH) Full-Scale Register (Middle Byte) Reset Value = 55
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
FSR15 FSR14 FSR13 FSR12 FSR11 FSR10 FSR09 FSR08
H
DOR2 (Address 0DH) Data Output Register (Most Significant Byte) (Read Only) Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
DOR23 DOR22 DOR21 DOR20 DOR19 DOR18 DOR17 DOR16
H
DOR1 (Address 0EH) Data Output Register (Middle Byte) (Read Only) Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
DOR15 DOR14 DOR13 DOR12 DOR11 DOR10 DOR09 DOR08
H
DOR0 (Address 0FH) Data Output Register (Least Significant Byte) (Read Only) Reset Value = 00
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
DOR07 DOR06 DOR05 DOR04 DOR03 DOR02 DOR01 DOR00
H
ADS1240, 1241
SBAS173C
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17
ADS1240 AND ADS1241 CONTROL COMMAND DEFINITIONS
The commands listed in Table IV control the operations of the ADS1240 and ADS1241. Some of the commands are stand-alone commands (e.g., RESET) while others require additional bytes (e.g., WREG requires the count and data bytes).
COMMANDS DESCRIPTION OP CODE 2nd COMMAND BYTE
RDATA Read Data 0000 0001 (01
RDATAC Read Data Continuously 0000 0011 (03
STOPC Stop Read Data Continuously 0000 1111 (0F
RREG Read from REG “rrrr” 0001 rrrr(1x WREG Write to REG “rrrr” 0101 rrrr(5x
SELFCAL Offset and Gain Self Cal 1111 0000 (F0 SELFOCAL Self Offset Cal 1111 0001 (F1 SELFGCAL Self Gain Cal 1111 0010 (F2
SYSOCAL Sys Offset Cal 1111 0011 (F3
SYSGCAL Sys GainCal 1111 0100 (F4
WAKEUP Wakup from SLEEP Mode 1111 1011 (FB
DSYNC Sync DRDY 1111 1100 (FC SLEEP Put in SLEEP Mode 1111 1101 (FD RESET Reset to Power-Up Values 1111 1110 (FE
NOTE: The received data format is always MSB First; the data out format is set by the BIT ORDER bit in the ACR register.
Operands: n = count (0 to 127) r = register (0 to 15) x = dont care
)
H
)
H
)
H
) xxxx_nnnn (# of regs-1)
H
) xxxx_nnnn (# of regs-1)
H
)
H
)
H
)
H
)
H
)
H
)
H
)
H
)
H
)
H
TABLE IV. Command Summary.
RDATA–Read Data
RDATAC–Read Data Continuous
Description: Read the most recent conversion result from the
Data Output Register (DOR). This is a 24-bit value.
Operands: None Bytes: 1 Encoding: 0000 0001 Data Transfer Sequence:
0000 0001
D
IN
D
OUT
NOTE: (1) For wait time, refer to timing specification.
(1)
xxxx xxxx xxxx xxxx xxxx xxxx
MSB Mid-Byte LSB
Description: Read Data Continuous mode enables the con­tinuous output of new data on each
DRDY
. This command
eliminates the need to send the Read Data Command on each
DRDY
. This mode may be terminated by either the STOPC
command or the RESET command. Wait at least 10 f
OSC
after
DRDY falls before reading.
Operands: None Bytes: 1 Encoding: 0000 0011 Data Transfer Sequence:
Command terminated when uuuu uuuu equals STOPC or RESET.
DRDY
D
IN
D
OUT
DRDY
D
OUT
NOTE: (1) For wait time, refer to timing specification.
0000 0011
(1)
uuuu uuuu uuuu uuuu uuuu uuuu
MSB Mid-Byte LSB
MSB Mid-Byte LSB
18
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ADS1240, 1241
SBAS173C
STOPC–Stop Continuous
D
IN
1111 0000
D
IN
1111 0010
SELFCAL–Offset and Gain Self Calibration
Description: Ends the continuous data output mode. Issue
after
DRDY
goes LOW.
Operands: None Bytes: 1 Encoding: 0000 1111 Data Transfer Sequence:
DRDY
D
IN
0000 1111xxx
RREG–Read from Registers
Description: Output the data from up to 16 registers starting
with the register address specified as part of the instruction. The number of registers read will be one plus the second byte count. If the count exceeds the remaining registers, the ad­dresses wrap back to the beginning.
Operands: r, n Bytes: 2 Encoding: 0001 rrrr xxxx nnnn Data Transfer Sequence:
Read Two Registers Starting from Register 01
(MUX)
H
Description: Starts the process of self calibration. The Offset Calibration Register (OCR) and the Full-Scale Register (FSR) are updated with new values after this operation.
Operands: None Bytes: 1 Encoding: 1111 0000 Data Transfer Sequence:
SELFOCAL–Offset Self Calibration
Description: Starts the process of self-calibration for offset.
The Offset Calibration Register (OCR) is updated after this operation.
Operands: None Bytes: 1 Encoding: 1111 0001 Data Transfer Sequence:
1111 0001
D
IN
0001 0001 0000 0001 xxxx xxxx xxxx xxxx
D
IN
D
OUT
NOTE: (1) For wait time, refer to timing specification.
(1)
MUX ACR
WREG–Write to Registers
Description: Write to the registers starting with the register
address specified as part of the instruction. The number of registers that will be written is one plus the value of the second byte.
Operands: r, n Bytes: 2 Encoding: 0101 rrrr xxxx nnnn Data Transfer Sequence:
Write Two Registers Starting from 04
0101 0100 xxxx 0001
D
IN
(DIO)
H
Data for DIO Data for DIR
SELFGCAL–Gain Self Calibration
Description: Starts the process of self-calibration for gain.
The Full-Scale Register (FSR) is updated with new values after this operation.
Operands: None Bytes: 1 Encoding: 1111 0010 Data Transfer Sequence:
ADS1240, 1241
SBAS173C
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19
SYSOCAL–System Offset Calibration
D
IN
1111 1110
DSYNC–Sync
DRDY
Description: Initiates a system offset calibration. The input should be set to 0V, and the ADS1240 and ADS1241 compute the OCR value that compensates for offset errors. The Offset Calibration Register (OCR) is updated after this operation. The user must apply a zero input signal to the appropriate analog inputs. The OCR register is automatically updated afterwards.
Operands: None Bytes: 1 Encoding: 1111 0011 Data Transfer Sequence:
1111 0011
D
IN
SYSGCAL–System Gain Calibration
Description: Starts the system gain calibration process. For
a system gain calibration, the input should be set to the reference voltage and the ADS1240 and ADS1241 compute the FSR value that will compensate for gain errors. The FSR is updated after this operation. To initiate a system gain calibration, the user must apply a full-scale input signal to the appropriate analog inputs. FCR register is updated automati­cally.
Operands: None Bytes: 1 Encoding: 1111 0100 Data Transfer Sequence:
1111 0100
D
IN
Description: Synchronizes the ADS1240 and ADS1241 to an external event.
Operands: None Bytes: 1 Encoding: 1111 1100 Data Transfer Sequence:
1111 1100
D
IN
SLEEP–Sleep Mode
Description: Puts the ADS1240 and ADS1241 into a low
power sleep mode. To exit sleep mode, issue the WAKEUP command.
Operands: None Bytes: 1 Encoding: 1111 1101 Data Transfer Sequence:
1111 1101
D
IN
RESET–Reset to Default Values
Description: Restore the registers to their power-up values.
This command stops the Read Continuous mode.
Operands: None Bytes: 1 Encoding: 1111 1110 Data Transfer Sequence:
WAKEUP
Description: Wakes the ADS1240 and ADS1241 from SLEEP
mode.
Operands: None Bytes: 1 Encoding: 1111 1011 Data Transfer Sequence:
1111 1011
D
IN
20
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ADS1240, 1241
SBAS173C
APPLICATION EXAMPLES
ADS1240.
GENERAL-PURPOSE WEIGH SCALE
Figure 8 shows a typical schematic of a general-purpose weigh scale application using the ADS1240. In this example, the internal PGA is set to either 64 or 128 (depending on the maximum output voltage of the load cell) so that the load cell output can be directly applied to the differential inputs of
EMI Filter
EMI Filter
Load Cell
EMI Filter
EMI Filter
HIGH PRECISION WEIGH SCALE
Figure 9 shows the typical schematic of a high-precision weigh scale application using the ADS1240. The front-end differential amplifier helps maximize the dynamic range.
2.7V ~ 5.25V
AV
DD
V
REF+
AIN0
ADS1240
AIN1
V
REF–
AGND DGND
DV
DD
DRDY
SCLK
D D
X
OUT
OUT
CS
X
OUT
SPI
IN
2.7V ~ 5.25V
V
DD
MSP430x4xx
or other µP
MCLK
GND
FIGURE 8. Schematic of a General-Purpose Weigh Scale.
2.7V ~ 5.25V
EMI Filter
EMI Filter
OPA2335
Load Cell
EMI Filter
EMI Filter
R
R
G
R
OPA2335
F
F
2.7V ~ 5.25V
AV
DD
V
REF+
R
I
R
I
AIN0
C
I
A
1
IN
V
REF–
AGND DGND
ADS1240 ADS1241
DV
DD
DRDY
SCLK
D
X
OUT
D
CS
X
OUT
SPI
IN
IN
V
DD
MSP430x4xx
or other µP
MCLK
GND
G = 1 + 2 RF/R
G
FIGURE 9. Block Diagram for a High-Precision Weigh Scale.
ADS1240, 1241
SBAS173C
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21
DEFINITION OF TERMS
An attempt has been made to be consistent with the termi­nology used in this data sheet. In that regard, the definition of each term is given as follows:
Analog Input Voltagethe voltage at any one analog input relative to AGND.
Analog Input Differential Voltage—given by the following equation: (IN+) – (IN–). Thus, a positive digital output is produced whenever the analog input differential voltage is positive, while a negative digital output is produced whenever the differential is negative.
For example, when the converter is configured with a 2.5V reference and placed in a gain setting of 1, the positive full-scale output is produced when the analog input differen­tial is 2.5V. The negative full-scale output is produced when the differential is –2.5V. In each case, the actual input voltages must remain within the AGND to AV
Conversion Cyclethe term
conversion cycle
to a discrete A/D conversion operation, such as that per­formed by a successive approximation converter. As used here, a conversion cycle refers to the t
DATA
Data RateThe rate at which conversions are completed. See definition for f
f
DATA
.
DATA
f
=
128 2 1280 2••
OSC
SPEED DR
SPEED = 0, 1
DR = 0, 1, 2
the frequency of the crystal oscillator or CMOS com-
f
OSC
patible input signal at the X
input of the ADS1240 and
IN
ADS1241.
f
the frequency or speed at which the modulator of the
MOD
ADS1240 and ADS1241 is running. This depends on the SPEED bit as given by the following equation:
SPEED = 0 SPEED = 1
mfactor 128 256
range.
DD
usually refers
time period.
f
f
MOD
f
the frequency, or switching speed, of the input sam-
SAMP
PGA SETTING SAMPLING FREQUENCY
1, 2, 4, 8
64, 128
OSC OSC
==
mfactor
16
32
128 2
f
SAMP
f
SAMP
f
SAMP
f
SAMP
f
SPEED
=
mfactor f
OSC
=
mfactor
f
OSC
=
mfactor
f
OSC
=
mfactor
f
OSC
2
4
8
pling capacitor. The value is given by one of the following equations:
f
the frequency of the digital output data produced by
DATA
the ADS1240 and ADS1241, f
is also referred to as the
DATA
Data Rate. Full-Scale Range (FSR)as with most A/D converters, the
full-scale range of the ADS1240 and ADS1241 is defined as the input, that produces the positive full-scale digital output minus the input, that produces the negative full-scale digital output.
For example, when the converter is configured with a 2.5V reference and is placed in a gain setting of 2, the full-scale range is: [1.25V (positive full-scale) minus –1.25V (negative full-scale)] = 2.5V.
Least Significant Bit (LSB) Weightthis is the theoretical amount of voltage that the differential voltage at the analog input has to change in order to observe a change in the output data of one least significant bit. It is computed as follows:
LSB Weight
Full Scale Range
=
N
21
where N is the number of bits in the digital output.
t
the inverse of f
DATA
, or the period between each data
DATA
output.
5V SUPPLY ANALOG INPUT
DIFFERENTIAL PGA OFFSET FULL-SCALE DIFFERENTIAL PGA SHIFT
GAIN SETTING FULL-SCALE RANGE INPUT VOLTAGES
15V±2.5V ±1.25V
22.5V±1.25V ±0.625V 4 1.25V ±0.625V ±312.5mV
8 0.625V ±312.5mV ±156.25mV 16 312.5mV ±156.25mV ±78.125mV 32 156.25mV ±78.125mV ±39.0625mV 64 78.125mV ±39.0625mV ±19.531mV
128 39.0625mV ±19.531mV ±9.766mV
NOTES: (1) With a 2.5V reference. (2) Refer to electrical specification for analog input voltage range.
(1)
(2)
RANGE RANGE INPUT VOLTAGES
TABLE VI. Full-Scale Range versus PGA Setting.
22
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2V
PGA
V PGA
REF
GENERAL EQUATIONS
REF
RANGE = 0
RANGE = 1
(2)
±V
REF
PGA
±•V
REF
2
PGA
ADS1240, 1241
SBAS173C
RANGE
±•V
REF
2
PGA
±•V
REF
4
PGA
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