TEXAS INSTRUMENTS ADS1217 Technical data

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A
D
S
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SBAS260B – MAY 2002 – REVISED OCTOBER 2004
8-Channel, 24-Bit
ANALOG-TO-DIGITAL CONVERTER
ADS1217
FEATURES
24 BITS NO MISSING CODES
INL: 0.0012% of FSR (max)
REF
PGA FROM 1 TO 128
22 BITS EFFECTIVE RESOLUTION
(PGA = 1), 19 BITS (PGA = 128)
SINGLE CYCLE SETTLING MODE
PROGRAMMABLE DATA OUTPUT RATES
UP TO 1kHz
ON-CHIP 1.25V/2.5V REFERENCE
ON-CHIP CALIBRATION
SPI COMPATIBLE
POWER SUPPLY: 2.7V to 5.25V
< 1mW POWER CONSUMPTION, VDD = 3V
APPLICATIONS
INDUSTRIAL PROCESS CONTROL
LIQUID/GAS CHROMATOGRAPHY
BLOOD ANALYSIS
SMART TRANSMITTERS
PORTABLE INSTRUMENTATION
WEIGH SCALES
PRESSURE TRANSDUCERS
IDAC2
IDAC1
DESCRIPTION
The ADS1217 is a precision, wide dynamic range, delta­sigma, Analog-to-Digital (A/D) converter with 24-bit resolu­tion operating from 2.7V to 5.25V supplies. The delta-sigma, A/D converter provides up to 24 bits of no missing code performance and effective resolution of 22 bits.
The eight input channels are multiplexed. Internal buffering can be selected to provide a very high input impedance for direct connection to transducers or low-level voltage signals. Burnout current sources are provided that allow for the detection of an open or shorted sensor. An 8-bit Digital-to­Analog Converter (DAC) provides an offset correction with a range of 50% of the FSR (Full-Scale Range).
The PGA (Programmable Gain Amplifier) provides selectable gains of 1 to 128 with an effective resolution of 19 bits at a gain of 128. The A/D conversion is accomplished with a 2nd-order, delta-sigma modulator and programmable sinc filter. The reference input is differential and can be used for ratiometric measurements. The onboard current DACs operate indepen­dently with the maximum current set by an external resistor.
The serial interface is SPI compatible. Eight bits of digital I/O are also provided that can be used for input or output. The ADS1217 is designed for high-resolution measurement appli­cations in smart transmitters, industrial process control, weigh scales, chromatography, and portable instrumentation.
V
AGND AV
R
REFOUTVRCAPVREF+VREF–
8-Bit
IDAC
8-Bit
IDAC
DAC
Voltage
Reference
DD
X
X
IN
Clock Generator
OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
A
IN
A
IN
A
IN
A
IN
A
IN
A
IN
A
IN
A
IN
A
INCOM
0 1 2 3 4 5 6 7
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MUX
Offset DAC
+
BUF PGA
PDWN DYSNC
2nd-Order Modulator
DD
Program-
mable Digital
Filter
Digital I/O
Interface
Controller
D7BUFEN ...D0DGNDDV
Registers
Serial Interface
RAM
RESET
POL SCLK D
IN
D
OUT
CS DRDY
Copyright © 2002-2004, Texas Instruments Incorporated
ABSOLUTE MAXIMUM RATINGS
(1)
AVDD to AGND ...................................................................... –0.3V to +6V
DV
to DGND...................................................................... –0.3V to +6V
DD
Input Current ............................................................... 100mA, Momentary
Input Current ................................................................. 10mA, Continuous
A
................................................................... GND –0.5V to AVDD + 0.5V
IN
AV
to DVDD........................................................................... –6V to +6V
DD
AGND to DGND ................................................................. –0.3V to +0.3V
Digital Input Voltage to GND.................................... –0.3V to DV
Digital Output Voltage to GND ................................. –0.3V to DV
Maximum Junction Temperature ................................................... +150°C
+ 0.3V
DD
+ 0.3V
DD
Operating Temperature Range ......................................... –40°C to +85°C
Storage Temperature Range .......................................... –60°C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru­ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
ADS1217 TQFP-48 PFB –40°C to +85°C ADS1217 ADS1217IPFBT Tape and Reel, 250
" """"ADS1217IPFBR Tape and Reel, 2000
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
ELECTRICAL CHARACTERISTICS: AVDD = 5V
All specifications at –40°C to +85°C, AVDD = +5V, DVDD = +2.7V to 5.25V, f unless otherwise specified.
PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT
(AIN0 – AIN7, A
Full-Scale Input Voltage (A Analog Input Voltage Buffer OFF AGND – 0.1 AV
INCOM
)
) – (A
IN+
IN–
Buffer ON AGND + 0.05 AV Differential Input Impedance Buffer OFF 10/PGA M Input Current Buffer ON 0.5 nA Bandwidth
Fast Settling Filter –3dB 0.469f
2
Sinc
Filter –3dB 0.318f
3
Sinc
Filter –3dB 0.262f Programmable Gain Amplifier User Selectable Gain Ranges 1 128 Burnout Current Sources 2 µA
OFFSET DAC
Offset DAC Range ±V Offset DAC Monotonicity 8 Bits Offset DAC Gain Error ±1% Offset DAC Gain Error Drift 1 ppm/°C
SYSTEM PERFORMANCE
Resolution 24 Bits No Missing Codes Sinc
3
Filter 24 Bits
Integral Nonlinearity End Point Fit, Differential Input, 0.0003 0.0012 % of FSR
Buffer Off Offset Error Before Calibration 7.5 ppm of FSR Offset Drift 0.02 ppm of FSR/°C Gain Error Before Calibration 0.005 % Gain Error Drift 0.5 ppm/°C Common-Mode Rejection at DC 100 dB
f
= 60Hz, f
CM
f
= 50Hz, f
CM
f
= 60Hz, f
Normal-Mode Rejection f
Output Noise See Typical Characteristics
CM SIG
f
SIG
= 50Hz, f = 60Hz, f
DATA DATA DATA DATA DATA
Power-Supply Rejection at DC, dB = –20log(∆V
NOTES: (1) FSR is Full-Scale Range. (2) ∆V
is change in digital result. (3) 12pF switched capacitor at f
OUT
= 19.2kHz, PGA = 1, Buffer ON, R
MOD
= 150k, f
DAC
= 10Hz, and V
DATA
REF
ADS1217
) ±2V
/PGA V
REF
DATA DATA DATA
/(PGA) V
REF
+ 0.1 V
DD
– 1.5 V
DD
Hz Hz Hz
= 10Hz 130 dB = 50Hz 120 dB = 60Hz 120 dB = 50Hz 100 dB = 60Hz 100 dB
(2)
OUT
/VDD)
80 95 dB
clock frequency.
SAMP
= +2.5V,
(1)
2
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ADS1217
SBAS260B
ELECTRICAL CHARACTERISTICS: AVDD = 5V (Cont.)
All specifications at –40°C to +85°C, AVDD = +5V, DVDD = +2.7V to 5.25V, f unless otherwise specified.
PARAMETER CONDITIONS MIN TYP MAX UNITS
VOLTAGE REFERENCE INPUT
Reference Input (V Negative Reference Input (V Positive Reference Input (V Common-Mode Rejection at DC 120 dB Common-Mode Rejection f Bias Current
(3)
)V
REF
) AGND – 0.1 (V
REF–
)(V
REF+
(V
REF
VREFCM
V
REF
) – (V
REF+
= 60Hz, f
DATA
= 2.5V, PGA = 1 1.3 µA
ON-CHIP VOLTAGE REFERENCE
Output Voltage REF HI = 1 2.4 2.5 2.6 V
REF HI = 0 1.25 V Short-Circuit Current Source 8mA Short-Circuit Current Sink 50 µA Drift 15 ppm/°C Noise V Output Impedance Sourcing 100µA3
= 0.1µF, BW = 0.1Hz to 100Hz 10 µVrms
RCAP
Startup Time 5ms
IDAC
Full-Scale Output Current R
Current Setting Resistance (R Monotonicity R
)10k
DAC
Compliance Voltage 0AV
= 150k, Range = 1 0.5 mA
DAC
R
= 150k, Range = 2 1 mA
DAC
R
= 150k, Range = 3 2 mA
DAC
R
= 15k, Range = 3 20 mA
DAC
= 150k 8 Bits
DAC
Output Impedance See Typical Characteristics PSRR V Gain Error Individual IDAC 5 %
= AVDD/2, Code > 16 400 ppm/V
OUT
Gain Error Drift Individual IDAC 75 ppm/°C Gain Error Mismatch Gain Error Mismatch Drift
Between IDACs, Same Range and Code Between IDACs, Same Range and Code
POWER-SUPPLY REQUIREMENTS
Power-Supply Voltage AV Analog Current (I
A/D Converter Current (I
ADC
+ I
+ I
VREF
IDAC)
) PGA = 1, Buffer OFF 175 275 µA
ADC
PDWN = 0, or SLEEP 1 nA
PGA = 128, Buffer OFF 500 750 µA
DD
PGA = 1, Buffer ON 250 350 µA
PGA = 128, Buffer ON 900 1375 µA V I
REF
IDAC
Current (I Current (I
) 250 375 µA
VREF
) Excludes Load Current 480 675 µA
IDAC
Digital Current Normal Mode, DV
SLEEP Mode, DV
Read Data Continuous Mode, DV
PDWN = 0 1 nA
Power Dissipation PGA = 1, Buffer OFF, REFEN = 0, 1.8 2.8 mW
IDACs OFF, DV
NOTES: (1) FSR is Full-Scale Range. (2) ∆V
is change in digital result. (3) 12pF switched capacitor at f
OUT
= 19.2kHz, PGA = 1, Buffer ON, R
MOD
= 150k, f
DAC
= 10Hz, and V
DATA
ADS1217
) 0.1 2.5 2.6 V
REF–
) + 0.1 AVDD + 0.1 V
REF–
) – 0.1 V
REF+
= 60Hz 120 dB
– 1 V
DD
0.25 % 15 ppm/°C
4.75 5.25 V
= 5V 180 275 µA
DD
= 5V 150 µA
DD
DD
= 5V 230 µA
DD
= 5V
clock frequency.
SAMP
= +2.5V,
REF
ADS1217
SBAS260B
www.ti.com
3
ELECTRICAL CHARACTERISTICS: AVDD = 3V
All specifications at –40°C to +85°C, AVDD = +3V, DVDD = +2.7V to 5.25V, f unless otherwise specified.
PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT
(AIN0 – AIN7, A
Full-Scale Input Voltage Analog Input Range Buffer OFF AGND – 0.1 AV
INCOM
)
(A
) – (A
IN+
IN–
Buffer ON AGND + 0.05 AV Input Impedance Buffer OFF 10/PGA M Input Current Buffer ON 0.5 nA Bandwidth
Fast Settling Filter –3dB 0.469f
2
Sinc
Filter –3dB 0.318f
3
Sinc
Filter –3dB 0.262f Programmable Gain Amplifier User Selectable Gain Ranges 1 128 Burnout Current Sources 2 µA
OFFSET DAC
Offset DAC Range ±V Offset DAC Monotonicity 8 Bits Offset DAC Gain Error ±1% Offset DAC Gain Error Drift 2 ppm/°C
SYSTEM PERFORMANCE
Resolution 24 Bits No Missing Codes Sinc
3
Filter 24 Bits
Integral Nonlinearity End Point Fit, Differential Input, 0.0003 0.0012 % of FSR
Buffer Off, T = 25°C Offset Error Before Calibration 15 ppm of FSR Offset Drift 0.04 ppm of FSR/°C Gain Error Before Calibration 0.010 % Gain Error Drift 1.0 ppm/°C Common-Mode Rejection at DC 100 dB
f
= 60Hz, f
CM
f
= 50Hz, f
CM
f
= 60Hz, f
Normal-Mode Rejection f
Output Noise See Typical Characteristics
CM SIG
f
SIG
= 50Hz, f = 60Hz, f
DATA
DATA DATA DATA DATA
Power-Supply Rejection at DC, dB = –20 log(∆V
VOLTAGE REFERENCE INPUT
Reference Input (V Negative Reference Input (V Positive Reference Input (V Common-Mode Rejection at DC 120 dB Common-Mode Rejection f Bias Current
(3)
)V
REF
) AGND – 0.1 (V
REF–
)(V
REF+
REF
VREFCM
(V
) – (V
REF+
= 60Hz, f
DATA
V
= 1.25V 0.65 µA
REF
ON-CHIP VOLTAGE REFERENCE
Output Voltage REF HI = 0 1.2 1.25 1.3 V Short-Circuit Current Source 3mA Short-Circuit Current Sink 50 µA Drift 15 ppm/°C Noise V Output Impedance Sourcing 100µA3
= 0.1µF, BW = 0.1Hz to 100Hz 10 µVrms
RCAP
Startup Time 5ms
IDAC
Full-Scale Output Current R
Current Setting Resistance (R Monotonicity R
)10k
DAC
Compliance Voltage 0AV
= 75k, Range = 1 0.5 mA
DAC
R
= 75k, Range = 2 1 mA
DAC
R
= 75k, Range = 3 2 mA
DAC
R
= 15k, Range = 3 20 mA
DAC
= 75k 8 Bits
DAC
Output Impedance See Typical Characteristics PSRR V Gain Error Individual IDAC 5 %
= AVDD/ 2, Code > 16 600 ppm/V
OUT
Gain Error Drift Individual IDAC 75 ppm/°C Gain Error Mismatch Gain Error Mismatch Drift
NOTES: (1) FSR is Full-Scale Range. (2) ∆V
Between IDACs, Same Range and Code Between IDACs, Same Range and Code
is change in digital result. (3) 12pF switched capacitor at f
OUT
= 19.2kHz, PGA = 1, Buffer ON, R
MOD
= 75k, f
DAC
= 10Hz, and V
DATA
= +1.25V,
REF
ADS1217
)
±2V
/PGA V
REF
DATA DATA DATA
/(PGA) V
REF
+ 0.1 V
DD
– 1.5 V
DD
= 10Hz 130 dB
= 50Hz 120 dB = 60Hz 120 dB = 50Hz 100 dB = 60Hz 100 dB
(2)
/VDD)
OUT
) 0.1 1.25 1.3 V
REF–
75 90 dB
) – 0.1 V
) + 0.1 AVDD + 0.1 V
REF–
REF+
= 60Hz 120 dB
– 1 V
DD
0.25 % 15 ppm/°C
clock frequency.
SAMP
Hz Hz Hz
(1)
4
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ADS1217
SBAS260B
ELECTRICAL CHARACTERISTICS: AVDD = 3V (Cont.)
All specifications at –40°C to +85°C, AVDD = +3V, DVDD = +2.7V to 5.25V, f unless otherwise specified.
PARAMETER CONDITIONS MIN TYP MAX UNITS POWER-SUPPLY REQUIREMENTS
Power-Supply Voltage AV Analog Current (I
A/D Converter Current (I
ADC
+ I
+ I
VREF
ADC
) PDWN = 0, or SLEEP 1 nA
IDAC
) PGA = 1, Buffer OFF 160 250 µA
PGA = 128, Buffer OFF 450 700 µA
DD
PGA = 1, Buffer ON 230 325 µA
PGA = 128, Buffer ON 850 1325 µA V I
REF
IDAC
Current (I
Current (I
) 250 375 µA
VREF
) Excludes Load Current 480 675 µA
IDAC
Digital Current Normal Mode, DV
SLEEP Mode, DV
Read Data Continuous Mode, DVDD = 3V
PDWN = 0 1 nA
Power Dissipation PGA = 1, Buffer OFF, REFEN = 0, 0.8 1.4 mW
IDACs OFF, DV
NOTES: (1) FSR is Full-Scale Range. (2) ∆V
is change in digital result. (3) 12pF switched capacitor at f
OUT
= 19.2kHz, PGA = 1, Buffer ON, R
MOD
= 75k, f
DAC
= 10Hz, and V
DATA
ADS1217
2.7 3.3 V
= 3V 90 200 µA
DD
= 3V 75 µA
DD
DD
= 3V
113 µA
clock frequency.
SAMP
REF
ELECTRICAL CHARACTERISTICS: Digital
All specifications at –40°C to +85°C, and DVDD = +2.7V to 5.25V.
PARAMETER CONDITIONS MIN TYP MAX UNITS INPUT/OUTPUT
Logic Level
V
IH
(1)
V
IL
V
OH
V
OL
Input Leakage: I
IN
CLOCK RATES
Master Clock Rate: f Master Clock Period: t
NOTE: (1) Maximum V
OSC
OSC
for XIN is DGND + 0.05V.
IL
IOH = 1mA DVDD – 0.4 V
IOL = 1mA DGND DGND + 0.4 V
0 < VI < DV
DD
1/f
OSC
0.8 × DV
DD
DGND 0.2 × DV
DV
DD
DD
–10 10 µA
1 8 MHz
125 1000 ns
= +1.25V,
V V
ADS1217
SBAS260B
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5
PIN CONFIGURATION
Top View TQFP
AGND
V
REFOUT
V V
D0 D1 D2 D3 D4 D5 D6 D7
REF+
REF–
OUTDIN
D
SCLKCSDRDY
DVDDDGND
DSYNC
36 35 34 33 32 31 30 29 28 27 26
37 38 39 40 41 42
ADS1217
43 44 45 46 47 48
12345678910112512
0
1
2
3
4
5
IN
IN
IN
A
A
AV
DD
AGND
IN
IN
A
IN
A
A
A
POL
6
IN
A
PDWN
7
IN
A
OUTXIN
X
INCOM
A
AGND
24 23 22 21 20 19 18 17 16 15 14 13
RESET BUFEN DGND DGND DGND DGND DGND R
DAC
IDAC2 IDAC1 V
RCAP
AV
DD
PIN DESCRIPTIONS
PIN
NUMBER NAME DESCRIPTION
1AV
DD
2 AGND Analog Ground 3A 4A 5A 6A 7A 8A
9A 10 A 11 A
IN IN IN IN IN IN IN IN
INCOM
12 AGND Analog Ground 13 AV 14 V
DD
RCAP
15 IDAC1 Current DAC1 Output 16 IDAC2 Current DAC2 Output 17 R
DAC
18-22 DGND Digital Ground
23 BUFEN Buffer Enable Input 24 RESET Active LOW, resets the entire chip.
Analog Power Supply
0 Analog Input 0 1 Analog Input 1 2 Analog Input 2 3 Analog Input 3 4 Analog Input 4 5 Analog Input 5 6 Analog Input 6 7 Analog Input 7
Analog Input Common
Analog Power Supply V
Bypass Capacitor
REFOUT
Current DAC Resistor
PIN
NUMBER NAME DESCRIPTION
25 X 26 X
IN
OUT
Clock Input Clock Output, used with crystal or resonator.
27 PDWN Active LOW. Power Down. The power-down
function shuts down the analog and digital
circuits. 28 POL Serial Clock Polarity Input 29 DSYNC Active LOW, Synchronization Control Input 30 DGND Digital Ground 31 DV
DD
Digital Power Supply 32 DRDY Active LOW, Data Ready Output 33 CS Active LOW, Chip Select Input 34 SCLK Serial Clock, Schmitt Trigger 35 D 36 D
IN
OUT
Serial Data Input, Schmitt Trigger
Serial Data Output
37-44 D0-D7 Digital I/O 0-7
45 AGND Analog Ground 46 V 47 V 48 V
REFOUT
REF+ REF–
Voltage Reference Output
Positive Differential Reference Input
Negative Differential Reference Input
6
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ADS1217
SBAS260B
TIMING DIAGRAMS
CS
SCLK
(POL = 0)
SCLK
(POL = 1)
D
IN
t
3
t
4
MSB
t
1
t
5
t
2
t
6
t
2
t
10
t
11
LSB
t
D
OUT
(Command or Command and Data)
7
MSB
t
8
(1)
LSB
t
9
(1)
NOTE: (1) Bit Order = 0.
SCLK Reset Waveform
ADS1217
Resets On
Falling Edge
t
13
t
13
SCLK
t
12
t
14
t
15
t
t
17
RESET, DSYNC, PDWN
16
DRDY
TIMING CHARACTERISTICS
SPEC DESCRIPTION MIN MAX UNITS
t
1
t
2
t
3
t
4
t
5
t
6
(2)
t
7
(2)
t
8
t
9
t
10
t
11
t
12
t
13
t
14
t
15
t
16
t
17
NOTES: (1) CS may be tied LOW. (2) Load = 20pF.
SCLK Period 4t
3 DRDY Periods SCLK Pulse Width, HIGH and LOW 200 ns CS LOW to First SCLK Edge; Setup Time
(1)
0ns DIN Valid to SCLK Edge; Setup Time 50 ns Valid DIN to SCLK Edge; Hold Time 50 ns Delay Between Last SCLK Edge for DIN and First SCLK
Edge for D
RDATA, RDATAC, RREG, WREG, RRAM, WRAM 50 t
OUT
:
CSREG, CSRAMX, CSRAM 200 t
CSARAM, CSARAMX 1100 t SCLK Edge to Valid New D SCLK Edge to D Last SCLK Edge to D
NOTE: D
OUT
, Hold Time 0 ns
OUT
Tri-State 6 10 t
OUT
goes tri-state immediately when CS goes HIGH.
OUT
50 ns
CS LOW Time After Final SCLK Edge 0 ns Final SCLK Edge of One Op Code Until First Edge SCLK of Next Command:
RREG, WREG, RRAM, WRAM, CSRAMX, CSARAMX, t
CSRAM, CSARAM, CSREG, DSYNC, SLEEP, RDATA,
RDATAC, STOPC 4 t CREG, CRAM 220 t CREGA 1600 t SELFGCAL, SELFOCAL, SYSOCAL, SYSGCAL 7 DRDY Periods SELFCAL 14 DRDY Periods RESET (Input pin, command, or SCLK pattern) 16 t
300 500 t
5t
550 750 t
1050 1250 t Pulse Width 4t Data Not Valid 4 t
OSC
OSC OSC OSC
OSC
OSC
OSC OSC OSC
OSC OSC OSC OSC OSC OSC OSC
Periods
Periods Periods Periods
Periods
Periods
Periods Periods Periods
Periods
Periods Periods Periods
Periods Periods Periods
ADS1217
SBAS260B
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7
TYPICAL CHARACTERISTICS
AVDD = +5V, DVDD = +5V, f
= 2.4576MHz, PGA = 1, R
OSC
= 150k, f
DAC
= 10Hz, and V
DATA
= +2.5V, unless otherwise specified.
REF
EFFECTIVE NUMBER OF BITS
vs DECIMATION RATIO
22 21 20
PGA1
PGA8
PGA4
PGA2
19 18 17 16
ENOB (rms)
PGA16
PGA32
PGA64
PGA128
15 14 13
Sinc3 Filter, BUFFER OFF
12
0 500 1000 1500 2000
f
Decimation Ratio =
MOD
f
DATA
EFFECTIVE NUMBER OF BITS
vs DECIMATION RATIO
22 21
PGA1
PGA2
PGA4
PGA8
20 19 18 17 16
ENOB (rms)
PGA16
PGA32
PGA64
PGA128
15 14 13
Sinc3 Filter, V
= 1.25V, BUFFER OFF
REF
12
0 500 1000 1500 2000
f
Decimation Ratio =
MOD
f
DATA
EFFECTIVE NUMBER OF BITS
vs DECIMATION RATIO
22 21
PGA2
PGA1
PGA4
PGA8
20 19 18 17 16
ENOB (rms)
15 14 13
PGA16
PGA32
PGA64
Sinc3 Filter, BUFFER ON
PGA128
12
0 500 1000 1500 2000
f
Decimation Ratio =
MOD
f
DATA
EFFECTIVE NUMBER OF BITS
vs DECIMATION RATIO
22 21
PGA1
PGA2
PGA4
PGA8
20 19 18 17 16
ENOB (rms)
15 14 13 12
PGA32
PGA16
Sinc3 Filter, V
PGA64
REF
PGA128
= 1.25V, BUFFER ON
0 500 1000 1500 2000
Decimation Ratio
8
EFFECTIVE NUMBER OF BITS
vs DECIMATION RATIO
22 21
PGA1
PGA2
PGA4
20 19 18 17 16
ENOB (rms)
PGA32
PGA16 PGA64
15 14 13
Sinc2 Filter
12
0 500 1000 1500 2000
f
Decimation Ratio =
f
MOD DATA
PGA8
PGA128
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EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO
FAST SETTLING FILTER
22 21 20 19 18 17 16
ENOB (rms)
15 14 13
Fast Settling Filter
12
f
f
DATA
1500
MOD
0 500 1000 1500 2000
Decimation Ratio =
ADS1217
SBAS260B
TYPICAL CHARACTERISTICS (Cont.)
130 120 110 100
90 80 70 60 50 40 30 20 10
0
COMMON-MODE REJECTION RATIO vs FREQUENCY
Frequency of CM Signal (Hz)
1 10 100 1k 10k 100k
CMRR (dB)
140 120 100
80 60 40 20
0
2040
OFFSET vs TEMPERATURE
Offset (ppm of FS)
Temperature (°C)
–50 0 50 100
PGA128
PGA16
PGA64
PGA1
AVDD = +5V, DVDD = +5V, f
= 2.4576MHz, PGA = 1, R
OSC
= 150k, f
DAC
= 10Hz, and V
DATA
= +2.5V, unless otherwise specified.
REF
0.7
0.6
0.5
0.4
0.3
0.2
Noise (rms, ppm of FS)
0.1
0
–5 –3–4102–1–2345
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
120 110 100
90 80 70 60 50
PSRR (dB)
40 30 20 10
0
110 1k100 10k 100k
NOISE vs INPUT SIGNAL
V
(V)
IN
Frequency of Power Supply (Hz)
1.00010
1.00006
1.00002
0.99998
0.99994
Gain (Normalized)
0.99990
0.99986
ADS1217
–50 –30 10–10 30 50 70 90
SBAS260B
GAIN vs TEMPERATURE
Temperature (°C)
www.ti.com
INTEGRAL NONLINEARITY vs INPUT SIGNAL
6
–40°C
4
2
0
–2
INL (ppm of FS)
4
6
5 4 2 13 012345
+25°C
+85°C
(V)
V
IN
9
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