TEXAS INSTRUMENTS ADS1110 Technical data

∆Σ A/D

Converter

I2C

Interface

Clock

Oscillator

V

IN+

V

IN–

SCL

SDA

V

DD

GND

A = 1, 2, 4, or 8

PGA

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ADS1100

BAAI

SBAS239 – MAY 2002

Self-Calibrating, 16-Bit

ANALOG-TO-DIGITAL CONVERTER

FEATURES

● COMPLETE DATA ACQUISITION SYSTEM IN A

TINY SOT23-6 PACKAGE

● 16-BITS NO MISSING CODES

● INL: 0.0125% of FSR MAX

● CONTINUOUS SELF-CALIBRATION

● SINGLE-CYCLE CONVERSION

● PROGRAMMABLE GAIN AMPLIFIER

GAIN = 1, 2, 4, OR 8

● LOW NOISE: 4

µVp-p

● PROGRAMMABLE DATA RATE: 8SPS to 128SPS

● INTERNAL SYSTEM CLOCK

● I2CTM INTERFACE

● POWER SUPPLY: 2.7V TO 5.5V

● LOW CURRENT CONSUMPTION: 90µA

APPLICATIONS

● PORTABLE INSTRUMENTATION

● INDUSTRIAL PROCESS CONTROL

● SMART TRANSMITTERS

● CONSUMER GOODS

● FACTORY AUTOMATION

● TEMPERATURE MEASUREMENT

DESCRIPTION

The ADS1100 is a precision, continuously self-calibrating
Analog-to-Digital (A/D) converter with differential inputs and
up to 16 bits of resolution in a small SOT23-6 package.
Conversions are performed ratiometrically, using the power
supply as the reference voltage. The ADS1100 uses an

2

I

C-compatible serial interface and operates from a single

power supply ranging from 2.7V to 5.5V.
The ADS1100 can perform conversions at rates of 8, 16, 32,

or 128 samples per second. The onboard programmable­gain amplifier, which offers gains of up to 8, allows smaller
signals to be measured with high resolution. In single­conversion mode, the ADS1100 automatically powers down
after a conversion, greatly reducing current consumption
during idle periods.

The ADS1100 is designed for applications requiring high­resolution measurement, where space and power consump­tion are major considerations. Typical applications include
portable instrumentation, industrial process control and smart
transmitters.

I2C is a registered trademark of Philips Incorporated.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2002, Texas Instruments Incorporated

www.ti.com

ABSOLUTE MAXIMUM RATINGS

VDD to GND ........................................................................... –0.3V to +6V

Input Current ............................................................... 100mA, Momentary

Input Current .................................................................10mA, Continuous

Voltage to GND, V

Voltage to GND, SDA, SCL .....................................................–0.5V to 6V

Maximum Junction Temperature ................................................... +150°C

Operating Temperature .................................................... –40°C to +85°C

Storage Temperature...................................................... –60°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.

+, VIN–........................................ –0.3V to VDD + 0.3V

IN

This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han­dling and installation procedures can cause damage.

ESD damage can range from subtle performance degrada­tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its

ELECTROSTATIC
DISCHARGE SENSITIVITY

published specifications.

PACKAGE/ORDERING INFORMATION

PRODUCT I

ADS1100 1001 000 SOT23-6 DBV –40°C to +85°C BAAI ADS1100IDBVT Tape and Reel, 250

2

C ADDRESS

(1)

PACKAGE-LEAD DESIGNATOR

PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT

"" """"ADS1100IDBVR Tape and Reel, 3000

NOTES: (1) Contact TI or your local sales representative for more information on the availability of other addresses. (2) For the most current specifications and
package information, refer to our web site at www.ti.com.

(2)

SPECIFIED

RANGE MARKING NUMBER MEDIA, QUANTITY

PIN CONFIGURATION

Top View SOT

V

IN–VDD

654

SDA

BAAI

123

GND SCL

V

IN+

NOTE: Marking text direction indicates pin 1.

2

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ADS1100

SBAS239

ELECTRICAL CHARACTERISTICS

All specifications at –40°C to +85°C, VDD = 5V, GND = 0V, all PGAs, unless otherwise noted.

ADS1100

PARAMETER CONDITIONS MIN TYP MAX UNITS
ANALOG INPUT

Full-Scale Input Voltage (V
Analog Input Voltage V
Differential Input Impedance 2.4/PGA MΩ
Common-Mode Input Impedance 8MΩ

SYSTEM PERFORMANCE

Resolution and No Missing Codes DR = 00 12 12 Bits

Conversion Rate DR = 00 104 128 184 SPS

Output Noise See Typical Characteristic Curves
Integral Nonlinearity DR = 11, PGA = 1, End Point Fit
Offset Error ±2.5/PGA ±5/PGA mV
Offset Drift PGA = 1 1.5 8 µV/°C

Gain Error 0.01 0.1 %
Gain Error Drift 2 ppm/°C
Common-Mode Rejection At DC, PGA = 8 94 100 dB

DIGITAL INPUT/OUTPUT

Logic Level

V

IH

V

IL

V

OL

Input Leakage

I

IH

I

IL

POWER-SUPPLY REQUIREMENTS

Power-Supply Voltage V
Supply Current Power Down 0.05 2 µA

Power Dissipation

NOTES: (1) 99% of full-scale. (2) FSR = Full-Scale Range = 2 • V

+) – (VIN–) ±VDD/PGA V

IN

+, VIN– to GND GND – 0.2 VDD + 0.2 V

IN

DR = 01 14 14 Bits
DR = 10 15 15 Bits
DR = 11 16 16 Bits

DR = 01 26 32 46 SPS
DR = 10 13 16 23 SPS
DR = 11 6.5 8 11.5 SPS

(1)

±0.003 ±0.0125 % of FSR

PGA = 2 1.0 4 µV/°C
PGA = 4 0.7 2 µV/°C
PGA = 8 0.6 2 µV/°C

At DC, PGA = 1 85 dB

0.7 • V

DD

GND – 0.5 0.3 • V

IOL = 3mA GND 0.4 V

6V

DD

VIH = 5.5V 10 µA
VIL = GND –10 µA

DD

2.7 5.5 V

Active Mode 90 150 µA

V

= 5.0V 450 750 µW

DD

V

= 3.0V 210 µW

DD

/PGA.

DD

(2)

V

ADS1100

SBAS239

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3

TYPICAL CHARACTERISTICS

At TA = 25°C, VDD = 5V, unless otherwise noted.

120

100

(µA)

80

VDD

I

60

40

–60 –40 –20 0 20 40 60 80 100 120 140

2.0

1.0

0.0

SUPPLY CURRENT vs TEMPERATURE

VDD = 5V

VDD = 2.7V

Temperature (°C)

OFFSET ERROR vs TEMPERATURE

VDD = 5V

PGA = 8 PGA = 4 PGA = 2 PGA = 1

SUPPLY CURRENT vs I2C BUS FREQUENCY

25°C

125°C

10 100 1k 10k

2

I

C Bus Frequency (kHz)

OFFSET ERROR vs TEMPERATURE

(µA)
I

VDD

250
225
200
175
150
125
100

75
50

2.0
VDD = 2.7V

1.0

PGA = 8 PGA = 4 PGA = 2 PGA = 1

0.0

–40°C

Offset Error (mV)

–1.0

–2.0

–60 –40 –20 0 20 40 60 80 100 120 140

Temperature (°C)

0.04
VDD = 5V

0.03

0.02

0.01

0.00

–0.01

Gain Error (%)

–0.02
–0.03
–0.04

–60 –40 –20 0 20 40 60 80 100 120 140

GAIN ERROR vs TEMPERATURE

PGA = 8

PGA = 4

PGA = 1

PGA = 2

Temperature (°C)

Offset Error (mV)

–1.0

–2.0

–60 –40 –20 0 20 40 60 80 100 120 140

Temperature (°C)

0.010

0.005

0.000

–0.005

Gain Error (%)

–0.010

–0.015

–0.020

VDD = 2.7V

–60 –40 –20 0 20 40 60 80 100 120 140

GAIN ERROR vs TEMPERATURE

PGA = 4

PGA = 8

PGA = 1

PGA = 2

Temperature (°C)

4

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ADS1100

SBAS239