Texas Instruments ADC3224EVM, ADC3241EVM, ADC3242EVM, ADC3221EVM, ADC3243EVM User Manual
...
User's Guide
SLAU579D–June 2014–Revised August 2018
ADC3xxxEVM and ADC3xJxxEVM
This document is a user’s guide for the ADC3xxxEVM and ADC3xJxxEVM. The EVMs provide a platform
for evaluating the ADC3xxx and ADC3xJxx. The ADC3xxx is a dual-channel or quad-channel, 12-bit or 14bit, serial LVDS interface analog-to-digital converter (ADC). The ADC3xxx comes with sampling speed
grades of 25 MSPS, 50 MSPS, 80 MSPS, and 125 MSPS. The ADC3xJxx is a dual-channel or quadchannel, 12-bit or 14-bit, JESD204B-compliant interface ADC. The ADC3xJxx comes with sampling speed
grades of 50 MSPS, 80 MSPS, 125 MSPS, and 160 MSPS. This family of converters requires only a
single 1.8-V supply, provides flexible input clock dividers, and provides internal features for improved 1/f
(ADC32xx, ADC34xx) and SFDR performance. Throughout this document, the abbreviations EVM and
ADC3xxxx, and the term evaluation module are synonymous with the ADC3xxx EVM and ADC3xJxx EVM,
unless otherwise noted.
Contents
1 Introduction ................................................................................................................... 3
1.1 EVM Block Diagram................................................................................................ 4
1.2 EVM Power Supply................................................................................................. 6
1.3 EVM Connectors and Jumpers ................................................................................... 8
1.4 EVM ADC Input Circuit Configurations......................................................................... 12
1.5 EVM DC-Coupling Configuration ............................................................................... 12
2 Software Control............................................................................................................ 15
2.1 Installation Instructions ........................................................................................... 15
2.2 Software Operation ............................................................................................... 15
3 Basic Test Procedure...................................................................................................... 24
3.1 Test Block Diagram with ADC32xx and ADC34xx............................................................ 24
3.2 Test Set-up Connection .......................................................................................... 25
3.3 ADC32/34xx and TSW1400 Setup Guide...................................................................... 25
3.4 Test Block Diagram with ADC32Jxx and ADC34Jxx ......................................................... 27
3.5 Test Set-up Connection (Onboard LMK04828 Clock)........................................................ 28
3.6 ADC32J/34Jxx and TSW14J56 Setup Guide.................................................................. 29
1 Simplified ADC344x EVM Block Diagram................................................................................ 4
2 Simplified ADC34J4x EVM Block Diagram............................................................................... 5
3 Simplified EVM Power Supply ............................................................................................. 6
4 ADC34Jxx EVM Connector and Jumper Locations ..................................................................... 8
5 ADC34xx EVM Connector and Jumper Locations ...................................................................... 9
6 ADC3xxxx ADC Input Circuit Options ................................................................................... 12
7 ADC34xx Clock Input Circuit ............................................................................................. 12
8 ADC32xxVM Input Coupling Configuration Resistors ................................................................ 13
9 ADC3xJxx Input Coupling Configuration Resistors ................................................................... 14
10 Common Tab ............................................................................................................... 16
11 ADC32xx Tab............................................................................................................... 17
12 ADC34xx Tab............................................................................................................... 19
13 ADC32Jxx Tab ............................................................................................................. 21
14 ADC34Jxx Tab ............................................................................................................. 23
15 ADC32xx/ADC34xx and TSW1400 Test Setup Block Diagram...................................................... 24
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List of Figures
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ADC3xxxEVM and ADC3xJxxEVM
1
16 Select ADC32xx or 34xx in the HSDC Pro GUI Program............................................................. 25
17 ADC3xxx Operating in 14-Bit Mode at 125 MSPS With a 10-MHz Input Signal................................... 26
18 ADC32Jxx/ADC34Jxx and TSW14J56 Test Setup Block Diagram.................................................. 27
19 Select ADC32Jxx or 34Jxx in the HSDC Pro GUI Program.......................................................... 29
20 ADC32Jxx Operating in 14-Bit Mode at 160 MSPS With a 10-MHz Input Signal ................................. 30
1 ADC3xxx Family of Devices and EVMs .................................................................................. 3
2 Power Supply Options ...................................................................................................... 7
3 ADC3xxxx EVM Connectors.............................................................................................. 10
4 ADC3xxxx EVM Jumper Options......................................................................................... 11
5 ADC3xxxx EVM LED Indicators.......................................................................................... 11
6 ADC32xxEVM AC-DC Coupling Resistor Swap ....................................................................... 13
7 ADC3xJxxEVM AC-DC Coupling Resistor Swap ...................................................................... 14
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List of Tables
2
ADC3xxxEVM and ADC3xJxxEVM
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1 Introduction
The family of parts and 32 associated EVMs are categorized in Table 1.
Interface Number of Channels ADC Device Number of Bits Maximum MSPS EVM
sLVDS Dual
sLVDS Quad
Introduction
Table 1. ADC3xxx Family of Devices and EVMs
ADC3221 12 25 ADC3221EVM
ADC3222 12 50 ADC3222EVM
ADC3223 12 80 ADC3223EVM
ADC3224 12 125 ADC3224EVM
ADC3241 14 25 ADC3241EVM
ADC3242 14 50 ADC3242EVM
ADC3243 14 80 ADC3243EVM
ADC3244 14 125 ADC3244EVM
ADC3421 12 25 ADC3421EVM
ADC3422 12 50 ADC3422EVM
ADC3423 12 80 ADC3423EVM
ADC3424 12 125 ADC3424EVM
ADC3441 14 25 ADC3441EVM
ADC3442 14 50 ADC3442EVM
ADC3443 14 80 ADC3443EVM
ADC3444 14 125 ADC3444EVM
ADC32J22 12 50 ADC32J22EVM
ADC32J23 12 80 ADC32J23EVM
ADC32J24 12 125 ADC32J24EVM
JESD204B Dual
JESD204B Quad
ADC32J25 12 160 ADC32J25EVM
ADC32J42 14 50 ADC32J42EVM
ADC32J43 14 80 ADC32J43EVM
ADC32J44 14 125 ADC32J44EVM
ADC32J45 14 160 ADC32J45EVM
ADC34J22 12 50 ADC34J22EVM
ADC34J23 12 80 ADC34J23EVM
ADC34J24 12 125 ADC34J24EVM
ADC34J25 12 160 ADC34J25EVM
ADC34J42 14 50 ADC34J42EVM
ADC34J43 14 80 ADC34J43EVM
ADC34J44 14 125 ADC34J44EVM
ADC34J45 14 160 ADC34J45EVM
There are three package sizes and pinouts for all of these parts. The sLVDS dual devices use a 7-mm ×
7-mm, 48-pin QFN package. The sLVDS quad devices use an 8-mm × 8-mm, 56-pin QFN package. The
dual and quad JESD204B device share the same package using a 7-mm × 7-mm, 48-pin QFN package
The dual ADCs comprise two buffered inputs, two ADC cores, and a common input clock circuit. The quad
ADCs comprise four buffered inputs, four ADC cores, and a common input clock circuit. The sLVDS
versions have a 2-wire interface per ADC (two pairs of p/n signals)—for the dual, this means two sets of 2wire interfaces (four p/n pairs), the quad has four sets of 2-wire interfaces (eight p/n pairs). Each of these
2-wire interfaces can be operated in 1-wire mode (14x serialization), or 2-wire mode (7x serialization). For
the 12-bit devices, this equates to 12x and 6x serialization. The JESD204B versions have one lane per
ADC core. For the dual, this means there are two lanes per device, and four lanes per device for the
quad. See the respective device data sheet for more information on sLVDS serialization and JESD204B
lane configurations.
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ADC3xxxEVM and ADC3xJxxEVM
3
CLK IN
14bit
ADC
14bit
ADC
14bit
ADC
14bit
ADC
Digital
Block
+
Output
Formatter
DCLK
DAB P/M sLVDS
2
DCD P/M sLVDS
2
Power
Supply
Circuits
USB
To
SPI
5V
USB
ADC34xx
CH A
CH B
CH C
CH D
FCLK
Introduction
1.1 EVM Block Diagram
Figure 1 and Figure 2 show simplified block diagrams of the default configuration of the EVM. The two or
four analog inputs are supplied to the EVM through a single-ended SMA connection, then transformer
coupled to turn the single-ended signal into a balanced differential signal, and then input to the ADC32xxx
or ADC34xxx. A dual transformer input circuit is used for better phase and amplitude balance of the input
signal than is typically produced by a single transformer input circuit.
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Figure 1. Simplified ADC344x EVM Block Diagram
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ADC3xxxEVM and ADC3xJxxEVM
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14bit
ADC
14bit
ADC
14bit
ADC
14bit
ADC
Digital
Block
+
Output
Formatter
SYNC
SERDES Lane 0,1
2
SERDES Lane 3,4
2
Power
Supply
Circuits
USB
To
SPI
5V
USB
ADC34Jxx
CLK IN
CH A
CH B
CH C
CH D
SYSREF
LMK04828
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Introduction
Figure 2. Simplified ADC34J4x EVM Block Diagram
The clock input is supplied by way of a single-ended signal to an SMA connector, and transformer coupled
to produce a differential clock signal for the ADC32/34xx EVM. For the ADC32J/34Jxx EVM, the clock
input can be generated onboard using the LMK04828.
Power to the ADC3xxx EVM is typically supplied from a 5-V bench supply using the onboard barrel
connector and the provided cable, or from an appropriate 5-V, 3-A minimum power brick. All necessary
voltages for the ADC EVM are derived from the 5-V input connection.
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ADC3xxxEVM and ADC3xJxxEVM
5
GND
5V
TPS62080
1
TPS7A4700
1.8V To
ADC
4V to Amp
TPS2400
1
TPS7A4700
Overvoltage
Protection Circuit
DC/DC Converter
Low Noise LDO
Low Noise LDO
ADC32/34xx EVM
GND
5V
TPS62080
1
TPS7A4700
1.8V To
ADC
4V to Amp
TPS2400
1
TPS7A4700
Overvoltage
Protection Circuit
DC/DC Converter
Low Noise LDO
Low Noise LDO
ADC32J/34Jxx EVM
TPS62080
1
TPS7A4700
3.3V to
LMK04828
1
Low Noise LDO
Introduction
1.2 EVM Power Supply
Figure 3 illustrates the power supply options available on the ADC3xxx EVM. Jumpers are used to choose
the power-supply options, with the default jumper positions indicated by the darker portion of the jumper
that represents the presence of the jumper. See Table 2 for jumper and feedback resistor configuration.
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ADC3xxxEVM and ADC3xJxxEVM
Figure 3. Simplified EVM Power Supply
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The default power path has an efficient, dual-output, DC/DC switching power supply to first step down the
input supplies from 5 V to 4 V, and 2.8 V for the subsequent low-noise LDOs. The 4 V is used by an LDO
to derive 3.3 V for the LMK04828 clock circuits on the ADC3xJxx EVMs. The 2.8 V is used by an LDO to
derive a 1.8-V supply for the ADC and USB circuits.
The low-noise LDOs can be bypassed to allow the DC/DC power supply to directly provide the ADC
power. Note that the feedback resistors of the DC/DC converter must be adjusted accordingly. See the
respective ADC EVM user's guide schematic for details.
Introduction
Table 2. Power Supply Options
Device Description
ADC32xx
JP6: 1-2, JP7: 1-2 Default connection for LDO 1.8-V supply, switch both to 2-3 to use the switcher U4, install R79 for 1.8-V
switcher output
ADC34xx
JP6: 1-2, JP7: 1-2 Default connection for LDO 1.8-V supply, switch both to 2-3 to use the switcher U4, install R79 for 1.8-V
switcher output
ADC342J/34Jxx
JP9: 1-2, JP10: 1-2 Default connection for LDO 1.8-V supply, switch both to 2-3 to use the switcher U8, install R152 for 1.8-V
switcher output
JP12: 1-2, JP13: 1-2 Default connection for LDO 3.3 V for LMK04828 power and onboard SPI/CPLD, switch both to 2-3 to use
U11 switcher output, install R163 for 3.3-V switcher output
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Introduction
1.3 EVM Connectors and Jumpers
Figure 4 and Figure 5 show the locations of the connectors, jumpers, pushbutton switches, and LEDs.
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Figure 4. ADC34Jxx EVM Connector and Jumper Locations
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Introduction
Figure 5. ADC34xx EVM Connector and Jumper Locations
The EVM has a barrel connector for 5-V power. The SMA connectors connect the ADC input and ADC
clock input to the ADC. Typically, the ADC inputs are transformer-coupled to accept single-ended
connections. The input circuit can be configured to connect to two SMA connectors for differential
signaling, if desired. Table 3 lists the connector information for the ADC3xxxx.
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Introduction
ADC32xx J1 AINP – positive input for A, Ch1 single ended input
ADC34xx J1 AINP – positive input for A, Ch1 single ended input
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Table 3. ADC3xxxx EVM Connectors
Device Connector Description
J2 AINM – negative input for A, DNI
J3 BINM – negative input for B, DNI
J4 BINP – positive input for B, Ch2 single ended input
J9 CLK_INP – positive CLK input, single ended clock input
J10 CLK_INM – negative CLK input, DNI
J11 SYSREF_INP – positive input for SYSREF frame clock, single ended input
J12 SYSREF_INM – negative SYSREF input, DNI
J13A, B HSMC data connector to TSW1400 evaluation platform
J14 Mini USB connector for SPI control
J15 Power connector for 5-V adapter
J2 AINM – negative input for A, DNI
J3 BINM – negative input for B, DNI
J4 BINP – positive input for B, Ch2 single ended input
J5 CINP – positive input for C, Ch3 single ended input
J6 CINM – negative input for C, DNI
J7 DINM – negative input for D, DNI
J8 DINP – positive input for D, Ch4 single ended input
J9 CLK_INP – positive CLK input, single ended clock input
J10 CLK_INM – negative CLK input, DNI
J11 SYSREF_INP – positive input for SYSREF frame clock, single ended input
J12 SYSREF_INM – negative SYSREF input, DNI
J13A, B HSMC data connector to TSW1400 evaluation platform
J14 Mini USB connector for SPI control
J15 Power connector for 5-V adapter
ADC32J/34Jxx J1 AIN_CH-AP – positive input for CHA, single ended input (DNI for ADC32Jxx)
J2 AIN_CH-AM – negative input, (DNI for ADC32Jxx and ADC34Jxx)
J3 BIN_CH-BP – positive input for CHB (CHA input for ADC32Jxx), single ended input
J4 BIN_CH-BM – negative input for CHB (CHA input for ADC32Jxx and ADC34Jxx)
J5 CIN_CH-CP – positive input for CHC (CHB input for ADC32Jxx), single ended input
J6 CIN_CH-CM – negative input for CHC (CHB input for ADC32Jxx and ADC34Jxx)
J7 DIN_CH-DP – positive input for CHD, single ended input (DNI for ADC32Jxx)
J8 DIN_CH-DM – negative input, (DNI for ADC32Jxx and ADC34Jxx)
J9 EXT_ADC_CLK – external ADC clock connection for ADC, if needed
J23 EXT SYSREF+ - external SYSREF connection for ADC, if needed (positive input)
J24 EXT SYSREF– - external SYSREF connection for ADC, if needed (negative input)
J10 LMK_CLKIN – external input clock for LMK use, if needed (for clock distribution mode)
J13 DCLKOUT6P – LMK output test point, positive
J14 DCLKOUT6N – LMK output test point, negative
J15 DCLKOUT7P – LMK output test point, positive
J16 DCLKOUT7N – LMK output test point, positive
J20 5-V input power jack
J18 Mini USB connector for SPI GUI control
J19 CPLD JTAG port
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The onboard jumper options allow configuration of onboard power supplies and ADC options. Many of the
jumper selections that involve dc inputs or static control signals are by way of push-on square post
jumpers. The jumper options listed in Table 4 show the default settings of the jumpers for the EVM as
normally shipped.
There is a pushbutton on the ADC3xxxx EVM – SW1. At power up, the ADC can either accept a hardware
reset by pressing SW1 or toggling the software reset switch on the ADC3xxxx EVM GUI. The default reset
configuration of the ADC is given in its respective data sheet.
LED D1 on the ADC32/34xxx is lit to show the presence of the 5-V supply voltage to the EVM. On the
ADC32J/34Jxx EVMs, LED D8 is used to show the presence of the 5-V supply voltage to the EVM.
Table 5 lists the description of each LED indicator.
Introduction
Table 4. ADC3xxxx EVM Jumper Options
Device Jumper Description
ADC32xx/ADC34xx JP1 3 pin Jumper – 2-3 Default connection, 1-2 to enable PwDn function
JP2, J3, JP4,JP5 2 pin Jumper - SPI access points, if needed – default should be installed
JP6, JP7 3 pin , default 1-2 to use 1.8V LDO. Use pins 2-3 to bypass 1.8-V LDO
ADC32J/34Jxx JP1 3 pin Jumper – 2-3 Default connection, 1-2 to enable PwDn function
JP2, J3, JP4,JP5 2 pin Jumper - SPI access points, if needed – default should be installed
JP6 2 pin, default is connected for powering onboard VCXO
SJP1 3 pin, DNI, optional for VCXO that require enable on pin 2
JP8 3 pin, default 2-3 for USB SPI selection through CPLD, 1-2 used for FMC
connector based SPI port
JP9, JP10 3 pin, default 1-2 to use 1.8V LDO. Use pins 2-3 to bypass LDO
JP12, JP13 3 pin, default 1-2 to use 3.3V LDO. Use pins 2-3 to bypass LDO
Table 5. ADC3xxxx EVM LED Indicators
Device LED Description
ADC32xx/ADC34xx D1 5-V power indicator
ADC32J/34Jxx D1, D2 Status LED from CLKin SEL0/1 on LMK
D3, D4 Status LED used to indicate LMK Lock or PLL Lock
D5 Status LED for JESD SYNC
D6, D7 Spare LED indicators for FMC connector
D8 5-V power indicator
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11
1:4
0.1PF
0.1PF
:
:
0.1PF
14bit
ADC
Jp
Jn
39nH
39nH
:
:
:
:
0.1PF 0.1PF 0.1PF
0.1PF
15:
15:
:
:
10pF10pF
1:1 1:1
V
CM
0:
0:
0.1PF
0.1PF
14bit
ADC
Jp
Jn
:
:
:
:
0.1PF 0.1PF 0.1PF
0.1PF
:
:
:
:
56nH10pF
1:1 1:1
V
CM
10:
10:
0.1PF
0.1PF
Default ± Low Input Frequency
High Input Frequency
Introduction
1.4 EVM ADC Input Circuit Configurations
Figure 6 shows the ADC3xxxx ADC input circuit. The default setup has a dual 1:1 impedance ratio
transformer input circuit to achieve better phase and amplitude balance of the input signal than is typically
be produced by a single transformer input circuit.
The default input termination is 50 Ω, which is formed by two 25-Ω resistors connected to the ADC VCM
node. By default, the input circuit is set for operation within the 1st two Nyquist zones. For higher
frequency inputs, use the high-frequency input circuit shown in Figure 6.
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Figure 6. ADC3xxxx ADC Input Circuit Options
Figure 7 shows the ADC3xxxx clock input circuit. The clock signal goes through 1:4 impedance ratio
transformer to increase the clock amplitude by two (that is, 1:4 impedance ratio equals to 1:2 voltage
ratio). The two 100-Ω resistors impedance transform back to the primary side as 50-Ω load impedance for
the signal source generator. For ADC evaluation, set the signal generator output to approximately
+10 dBm.
Figure 7. ADC34xx Clock Input Circuit
1.5 EVM DC-Coupling Configuration
The ADC3xxxx EVM family has three different hardware configurations: dual-channel serial LVDS, quadchannel serial LVDS, and quad-channel JESD204B compliant. The following instructions are a guideline to
enable dc-coupling on the revision B EVM hardware, but can be used as a guide for other EVM revisions.
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ADC3xxxEVM and ADC3xJxxEVM
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1.5.1 ADC32xxEVM
The ADC32xx-EVM boards can be operated in either ac-coupling or dc-coupling mode. To operate the
board in dc-coupling mode, a few modifications must be made. On the back side of the EVM, the
unpopulated pads must be populated with the devices listed on the AMPLIFIER schematic diagram (page
4) of the ADC32XXXEVM-SCH_X.pdf located in the ADC32xx schematic design zip file. This schematic
details the components needed for dc-coupling using the THS4541RGT and all required circuitry.
After the amplifier components are installed on the bottom of the ADC32xx-EVM, the resistors on the top
of the board must be altered to change the output from ac-coupled to dc-coupled. Figure 8 shows the
three shared pad footprints per channel that must be modified. See Table 6 and the ADC32xx design files
to change the appropriate resistors.
Mode Install Uninstall
AC-Coupled R3, R4, R14R18, R142, R139 R135, R7, R120, R121R138, R20, R144,
DC-Coupled R135, R7, R120, R121R138, R20, R144,
Introduction
Table 6. ADC32xxEVM AC-DC Coupling Resistor Swap
R141
R3, R4, R14R18,R142, R139
R141
Figure 8. ADC32xxVM Input Coupling Configuration Resistors
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Introduction
1.5.2 ADC3xJxxEVM
The ADC34JxxEVM boards come with the THS4541RGT amplifiers installed. To operate the EVM in dccoupled mode, only the topside resistors must be changed. The output channels for dc-coupled signals
are B and C, and the resistors are located near the baluns of the channel, as shown in Figure 9. See
Table 7 and the ADC34JxxEVM design files to change the appropriate resistors.
Mode Install Uninstall
AC-Coupled R217, R258, R226R219, R233, R234 R137, R216, R225, R227R228, R218,
DC-Coupled R137, R216, R225, R227R228, R218,
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Table 7. ADC3xJxxEVM AC-DC Coupling Resistor Swap
R232,R235
R217, R258, R226R219, R233, R234
R232,R235
14
Figure 9. ADC3xJxx Input Coupling Configuration Resistors
ADC3xxxEVM and ADC3xJxxEVM
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2 Software Control
2.1 Installation Instructions
1. Open the folder named ADC3xxxx_Installer_vxpx (xpx represents the latest version)
2. Run Setup.exe
3. Follow the on-screen instructions
4. Once installed, launch by clicking on the ADC3xxxx_GUI_vxpx program in Start → All Programs →
Texas Instruments ADCs
5. When plugging in the USB cable for the first time, you are prompted by the Found-New-HardwareWizard to install the USB drivers.
a. When a pop-up screen opens, select Continue Downloading.
b. Follow the on-screen instructions to install the USB drivers
c. If needed, access the drivers directly in the install directory
2.2 Software Operation
The software allows programming control of the ADC3xxxx device. The front panel provides a tab for full
programming of the register map of the ADC3xxxx and an advanced tab that allows for custom register
accesses. The GUI tabs provide a convenient and simplified interface to the most used registers of each
device.
2.2.1 ADC3xxxx Control Options
The ADC3xxxx family shares some common registers. These common registers are organized within the
Common tab. Other specific device registers are in specific device tabs for the ADC3xxxx family and the
LMK04828 for the JESD204B devices. For a more detailed description of each register, see the respective
device data sheet.
Software Control
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15
Software Control
2.2.1.1 Common Register Tab
Figure 10 illustrates the following parts of the common tab.
• Software Reset – Resets the registers to default configuration – similar to pressing SW1, self clearing
• Global Power Down – power down the entire chip, default 0
• ADC Standby – All ADCs enter standby mode, default 0
• Configure PwDn pin function – either global power down or ADC standby mode
• Data Format – 0 – 2s Complement, 1- Offset Binary, default 0
• Disable SYSREF BUF – Disable SYSREF Buffer, default 0
• Clk Diver – Internal clock divider to allow harmonic clocking, a higher frequency clock can be provided
to the ADC and then divided down to the desired sample rate.
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ADC3xxxEVM and ADC3xJxxEVM
Figure 10. Common Tab
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2.2.1.2 ADC32xx Tab
Figure 11 illustrates the following parts of the ADC32xx tab.
• Disable Dither CHA – disables the dither circuit, if asserted, dither is on by default
• Disable Dither CHB – disables the dither circuit, if asserted, dither is on by default
• CHA PwDn – power down CHA
• CHB PwDn – power down CHB
• CHA Gain Enable – enable the digital gain block for CHA
• CHB Gain Enable – enable the digital gain block for CHB
• Gain CHA – digital gain setting from 0 dB to 6 dB
• Gain CHB – digital gain setting from 0 dB to 6 dB
• Enable Test Pattern – enable the use of test patterns instead of sample data
• Align Test Data – align all test data on the outputs
• Test Pattern CHA – different available test patterns
• Test Pattern CHB – different available test patterns
• Custom Pattern – 14-bit custom bit pattern used when Custom Pattern is selected
• Disable Chopper CHA – disable the chopper function which shifts 1/f nose to Fs/2, by default it is on
• Disable Chopper CHB – disable the chopper function which shifts 1/f nose to Fs/2, by default it is on
• Low Freq Mode – enable for sampling frequencies lower than 35 MHz
• OVR on LSB – over range indication on LSB, by default it is normal LSB function
• LVDS Swing – control the LVDS swing on the LVDS signals
Software Control
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Figure 11. ADC32xx Tab
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ADC3xxxEVM and ADC3xJxxEVM
17
Software Control
2.2.1.3 ADC34xx Tab
• Disable Dither CHA – disables the dither circuit, if asserted, dither is on by default
• Disable Dither CHB – disables the dither circuit, if asserted, dither is on by default
• Disable Dither CHC – disables the dither circuit, if asserted, dither is on by default
• Disable Dither CHD – disables the dither circuit, if asserted, dither is on by default
• CHA PwDn – power down CHA
• CHB PwDn – power down CHB
• CHC PwDn – power down CHC
• CHD PwDn – power down CHD
• CHA Gain Enable – enable the digital gain block for CHA
• CHB Gain Enable – enable the digital gain block for CHB
• CHC Gain Enable – enable the digital gain block for CHC
• CHD Gain Enable – enable the digital gain block for CHD
• Gain CHA – digital gain setting from 0 dB to 6 dB
• Gain CHB – digital gain setting from 0 dB to 6 dB
• Gain CHC – digital gain setting from 0 dB to 6 dB
• Gain CHD – digital gain setting from 0 dB to 6 dB
• Enable Test Pattern – enable the use of test patterns instead of sample data
• Align Test Data – align all test data on the outputs
• Test Pattern CHA – different available test patterns
• Test Pattern CHB – different available test patterns
• Test Pattern CHC – different available test patterns
• Test Pattern CHD – different available test patterns
• Custom Pattern – 14-bit custom bit pattern used when Custom Pattern is selected
• Disable Chopper CHA – disable the chopper function which shifts 1/f nose to Fs/2, default is on
• Disable Chopper CHB – disable the chopper function which shifts 1/f nose to Fs/2, default is on
• Disable Chopper CHC – disable the chopper function which shifts 1/f nose to Fs/2, default is on
• Disable Chopper CHD – disable the chopper function which shifts 1/f nose to Fs/2, default is on
• Low Freq Mode – enable for sampling frequencies lower than 35 MHz
• OVR on LSB – over range indication on LSB, by default it is normal LSB function
• LVDS Swing – control the LVDS swing on the LVDS signals
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Software Control
Figure 12. ADC34xx Tab
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Software Control
2.2.1.4 ADC32Jxx Tab
• Disable Dither CHA – disables the dither circuit if asserted, dither is on by default
• Disable Dither CHB – disables the dither circuit if asserted, dither is on by default
• CHA PwDn – power down CHA
• CHB PwDn – power down CHB
• CHA Gain Enable – enable the digital gain block for CHA
• CHB Gain Enable – enable the digital gain block for CHB
• Gain CHA – digital gain setting from 0 dB to 6 dB
• Gain CHB – digital gain setting from 0 dB to 6 dB
• Enable Test Pattern – enable the use of test patterns instead of sample data
• Align Test Data – align all test data on the outputs
• Test Pattern CHA – different available test patterns
• Test Pattern CHB – different available test patterns
• Custom Pattern – 14-bit custom bit pattern to be used when Custom Pattern is selected
• SerDes Test Pattern – available test patterns at the SerDes block
• Idle Sync Pattern – pattern used for SYNC request (K28.5 default)
• Test Mode Enable – option to enable long test pattern as per clause 5.1.6.3
• Flip ADC Data – normal operation is LSB first, enable for MSB first
• Insert Lane Alignment Chars – option to insert lane alignment chars as per clause 5.3.3.4
• TX Link Config – option to disable ILA when SYNC is de-asserted
• Ctrl K – default is 9 (20x mode), enable to use 0x31 for control
• Ctrl F – default is 2 (20x mode), enable to use 0x30 for control
• Scramble EN – optional scrambler
• Subclass – select subclass, default subclass 2
• Generate SYNC Request – generate Sync request
• JESD Buffer Output Current – change output buffer current, default 16 mA
• Link Layer RPAT – change running disparity in RPAT pattern test mode
• Link Layer Test Mode – generate test pattern per clause 5.3.3.8.2
• Pulse Detect Modes – select different Pulse Detection for SYSREF and SYNC
• Force LMF count – force LMF count
• LMF Count INIT – LMF count INIT
• Release ILA SEQ – delay generation of ILA sequence by 0, 1, 2, 3 MF after CGS
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ADC3xxxEVM and ADC3xJxxEVM
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Software Control
Figure 13. ADC32Jxx Tab
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Software Control
2.2.1.5 ADC34Jxx Tab
• Disable Dither CHA – disables the dither circuit if asserted, dither is on by default
• Disable Dither CHB – disables the dither circuit if asserted, dither is on by default
• Disable Dither CHC – disables the dither circuit if asserted, dither is on by default
• Disable Dither CHD – disables the dither circuit if asserted, dither is on by default
• CHA PwDn – power down CHA
• CHB PwDn – power down CHB
• CHC PwDn – power down CHC
• CHD PwDn – power down CHD
• CHA Gain Enable – enable the digital gain block for CHA
• CHB Gain Enable – enable the digital gain block for CHB
• CHC Gain Enable – enable the digital gain block for CHC
• CHD Gain Enable – enable the digital gain block for CHD
• Gain CHA – digital gain setting from 0 dB to 6 dB
• Gain CHB – digital gain setting from 0 dB to 6 dB
• Gain CHC – digital gain setting from 0 dB to 6 dB
• Gain CHD – digital gain setting from 0 dB to 6 dB
• Enable Test Pattern – enable the use of test patterns instead of sample data
• Align Test Data – align all test data on the outputs
• Test Pattern CHA – different available test patterns
• Test Pattern CHB – different available test patterns
• Test Pattern CHC – different available test patterns
• Test Pattern CHD – different available test patterns
• Custom Pattern – 14-bit custom bit pattern to be used when Custom Pattern is selected
• SerDes Test Pattern – available test patterns at the SerDes block
• Idle Sync Pattern – pattern used for SYNC request (K28.5 default)
• Test Mode Enable – option to enable long test pattern as per clause 5.1.6.3
• Flip ADC Data – normal operation is LSB first, enable for MSB first
• Insert Lane Alignment Chars – option to insert lane alignment chars as per clause 5.3.3.4
• TX Link Config – option to disable ILA when SYNC is de-asserted
• Ctrl K – default is 9 (20x mode), enable to use 0x31 for control
• Ctrl F – default is 2 (20x mode), enable to use 0x30 for control
• Scramble EN – optional scrambler
• Subclass – select subclass, default subclass 2
• Generate SYNC Request – generate Sync request
• JESD Buffer Output Current – change output buffer current, default 16 mA
• Link Layer RPAT – change running disparity in RPAT pattern test mode
• Link Layer Test Mode – generate test pattern per clause 5.3.3.8.2
• Pulse Detect Modes – select different pulse detection for SYSREF and SYNC
• Force LMF count – force LMF count
• LMF Count INIT – LMF count INIT
• Release ILA SEQ – delay generation of ILA sequence by 0, 1, 2, 3 MF after CGS
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Software Control
2.2.1.6 LMK04828
The registers for the LMK04828 are best described in the LMK04828 data sheet, and are not covered in
this user guide.
2.2.2 Low Level Register Control
• Send All: Sends the register configuration to all devices
• Read All: Reads register configuration from ADS58H40 device (not implemented in revision 1.x)
• Save Regs: Saves the register configuration for all devices
• Load Regs: Load a register file for all devices. Sample configuration files for common frequency plans
are located in the install directory.
– Select the Load Regs button
– Double click on the data folder
– Double click on the desired register file
– Click on Send All to ensure all the values are loaded properly
2.2.3 Misc Settings
• Reconnect FTDI: Toggle this button if the USB port is not responding. This generates a new USB
handle address
NOTE: Reset the board after every power cycle and then click the reconnect FTDI button on the GUI.
• File→Exit: Stops the program
Figure 14. ADC34Jxx Tab
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PC
USB
J15
J5
USB Mini-B
Signal Generator
(Input Source)
Signal
Generator
(CLK Source)
CLK
J9
CHB
J4
CHA
J1
+5V
J5
J12
TSW1400
J3
CHC
J5
CHD
J8
+5V
To A, B, C, D
Channels
BPF BPF
Synchronized
Sources
Basic Test Procedure
3 Basic Test Procedure
This section outlines the basic test procedure for testing the EVM. There are 2 test platforms which can be
used: (1) TSW1400 with ADC32xx and ADC34xx and (2) TSW14J56 or TSW14J50 with ADC32Jxx and
ADC34Jxx.
3.1 Test Block Diagram with ADC32xx and ADC34xx
Figure 15 shows the test set-up for evaluation of the ADC3xxxx EVM with the TSW1400 Capture Card. As
seen in this figure, the evaluation setup involves a clock from a high-quality signal generator and a sine
wave for the analog input from a high-quality signal generator. High order, narrow bandpass filters are
usually required on clock and input frequencies to remove phase noise and harmonic content from the
input sine waves. If the two signal generators are not synchronized by an external reference signal to
make the clock and input frequency coherent, then the resulting fast Fourier transform (FFT) will first need
to have a windowing function such as Blackman-Harris/Hamming/Hanning applied to the data.
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Figure 15. ADC32xx/ADC34xx and TSW1400 Test Setup Block Diagram
24
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3.2 Test Set-up Connection
1. Connect the ADC32xx/ADC34xx EVM J13 connector to the TSW1400 EVM J3 connector
2. Connect 5 V to the TSW1400 J12 supply input connector and 5 V to the ADC32xx/34xx EVM J15
supply input connector
3. Provide a sample clock at the ADC32xx/34xx EVM J9 SMA connector
4. Provide a sine wave for the ADC32xx EVM J1 or J4 analog input and J1, J4, J5, or J8 of the ADC34xx
EVM
5. Connect a USB cable from the TSW1400 to the programming computer
6. For basic testing, the USB/SPI connection is not needed on the ADC32/34xx. Press SW1 to perform a
hardware reset. This will work with the default settings.
7. Verify the following jumper connections on the ADC32/34xx EVM:
• JP1 – 2,3 default condition PDN is low
• JP2, JP3, JP4, JP5 – Closed – default condition for SPI connection
• JP6 – 1,2 default condition to select LDO power supply
• JP7 – 1,2 default condition to select LDO power supply
3.3 ADC32/34xx and TSW1400 Setup Guide
See the TSW1400 user’s guide for more detailed explanations of the TSW1400 set-up and operation. This
document assumes the High-Speed Data Converter (HSDC) Pro software and the TSW1400 hardware
are installed and functioning properly. The ADC32/34xx EVM requires High-Speed Data Converter Pro
software version 2.6 or higher with TSW1400 hardware of Rev D (or higher).
Single tone FFT test
1. Start the HSDC Pro GUI program. When the program starts, select the ADC tab and then select
ADC324x_2W_14bit.ini or ADC344x_2W_14bit.ini device in the Select ADC drop down menu.
Basic Test Procedure
Figure 16. Select ADC32xx or 34xx in the HSDC Pro GUI Program
2. When prompted with Load ADC Firmware?, select YES
3. Select Single Tone FFT Test under Test Selection
4. Select number of sample points (and resulting number of FFT bins) to be used. The example shown in
Figure 17 has 65536 samples.
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Basic Test Procedure
5. Enter the ADC32/34xx Sampling rate. The example shown in Figure 17 has the sample rate set at 125
MSPS (filtered clock input around 10 dBm).
6. Enter the input frequency desired. If the clock and input frequency signal generators are synchronized,
then make sure the checkbox for coherent frequency is checked and set the input frequency signal
generator to the input frequency displayed. The example shown in Figure 17 has the input frequency
set at 10MHz (9.98878479MHx if coherent). Filtered signal input around 10 dBm – adjust to achieve –1
dBFs on the HSDC Pro FFT.
7. Select channel 1, 2, 3, or 4 depending on the channel to which the signal generator is connected
8. Press the Capture button on the HSDC Pro GUI
9. Observe an FFT result similar to that of Figure 17
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Figure 17. ADC3xxx Operating in 14-Bit Mode at 125 MSPS With a 10-MHz Input Signal
If the basic capture at this point is correct, then the front panel options of the SPI GUI and the front panel
options of the TSW1400 GUI may be varied as desired to test out different device options.
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PC
USB
USB
J20
J17
USB Mini-B
Signal Generator
(Input Source)
LMK0
4828
CHB
J3
CHA
J1
+5V
J11
TSW14J56
J4
USB Mini-B
CHC
J5
CHD
J7
+5V
To A, B, C, D
Channels
BPF
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3.4 Test Block Diagram with ADC32Jxx and ADC34Jxx
The test set-up for evaluation of the ADC32J/34Jxx EVM with the TSW14J56 or TSW14J50 Capture Card
is shown in Figure 18. As seen in this figure, the evaluation setup involves a clock from a high quality on
board clock chip LMK04828 and a sine wave for the analog input from a high-quality signal generator.
High order, narrow bandpass filters are usually required to remove phase noise and harmonic content
from the input sine waves. Since the on board clock and input sinewave are not coherent then the
resulting FFT will need to have a windowing function such as Blackman-Harris/Hamming/Hanning applied
to the data.
Basic Test Procedure
Figure 18. ADC32Jxx/ADC34Jxx and TSW14J56 Test Setup Block Diagram
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Basic Test Procedure
3.5 Test Set-up Connection (Onboard LMK04828 Clock)
1. Connect J17 connector of ADC32Jxx/ADC34Jxx EVM to J4 connector of TSW14J56 EVM (or
TSW14J50 if desired)
2. Connect 5V to the J11 supply input connector of the TSW14J56 and 5V to the J20 supply input
connector of the ADC32Jxx/34Jxx EVM
3. Connect a USB cable from the ADC32J/34Jxx EVM to the PC for SPI programming. The
ADC32J/34Jxx EVMs require some programming for the on board clock requirements of the
JESD204B interface.
4. Provide a sine wave for the analog input at J3 or J6 of ADC32Jxx EVM and J1, J3, J5, or J7 of the
ADC34Jxx EVM.
5. Connect USB cable from the TSW14J56 to the programming computer
6. Verify the following jumper connections on the ADC32J/34Jxx EVM
• JP1 – 1,2 default condition PDN is low
• JP2, JP3, JP4, JP5 – closed – default condition for SPI connection
• JP6 – Closed – power for the onboard clock
• JP8 – 2,3 – default condition to select USB port for SPI communication
• JP9 – 1,2 – default condition select LDO power
• JP10 – 1,2 – default condition select LDO power
• JP12 – 1,2 – default condition select LDO power
• JP13 – 1,2 – default condition select LDO power
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3.6 ADC32J/34Jxx and TSW14J56 Setup Guide
See the TSW14J56 user’s guide for more detailed explanations of the TSW14J56 set-up and operation.
This document assumes the HSDC Pro software and the TSW14J56 hardware are installed and
functioning properly. The ADC32/34xx EVM requires HSDC Pro software version 2.6 or higher with
TSW14J56 hardware of Rev D (or higher).
Single Tone FFT Test
1. The evaluation of the ADC32J/34Jxx EVM requires programming the LMK04828 clock source with the
correct PLL settings to provide a 160 MSPS clock.
• Connect a USB cable from the ADC32J/34Jxx EVM to the PC.
• Open the ADC3000 GUI, and connect to the ADC32Jxx or ADC34Jxx EVM.
• Go to the Low Level tab and click Load Config.
• Browse and find the ADC3xJxx_160MSPS_Operation_LMK_Setting.cfg.
• Check that the PLL2 LED D4 is lit – this indicates that the PLL is programmed properly and the
correct clocks are being generated.
2. Start the HSDC Pro GUI program. When the program starts, select the ADC tab and then select
ADC32Jxx_LMF_222 or ADC34Jxx_LMF_442 device in the Select ADC drop-down menu.
Basic Test Procedure
Figure 19. Select ADC32Jxx or 34Jxx in the HSDC Pro GUI Program
3. When prompted by Load ADC Firmware?, select YES.
4. Select Single Tone FFT Test under Test Selection.
5. Select the number of sample points (and resulting number of FFT bins) to be used. The example
shown in Figure 20 has 65536 samples.
6. Enter the ADC32J/34Jxx sampling rate. The example shown in Figure 18 has the sample rate set at
160 MSPS.
7. Enter the input frequency desired. The example shown in Figure 18Figure 20 has the filtered input
frequency set at 10 MHz and around 10 dBm. Adjust to achieve –1 dBFs on the HSDC Pro FFT plot.
8. Select channel 1, 2, 3, or 4 depending on the channel connected to the signal generator.
9. Press the Capture button on the HSDC Pro GUI.
10. Observe an FFT result similar to that shown in Figure 18.
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Basic Test Procedure
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Figure 20. ADC32Jxx Operating in 14-Bit Mode at 160 MSPS With a 10-MHz Input Signal
If the basic capture at this point is correct, then the front panel options of the ADC3xxx SPI GUI and the
front panel options of the High Speed Data Converter Pro GUI may be varied as desired to test out
different device SPI options.
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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from C Revision (January 2016) to D Revision ............................................................................................... Page
• Added ADC34Jxx devices to Table 3 ................................................................................................. 10
• Added jumpers to Table 4 .............................................................................................................. 11
• Deleted jumper JP11 from Table 4.................................................................................................... 11
• Added new EVM DC Coupling Configuration section............................................................................... 12
Changes from B Revision (January 2016) to C Revision ............................................................................................... Page
• Deleted references to future EVM releases from the ADC3xxx Family of Parts and EVMs table. ............................. 3
• Added reference to TSW14J50 in the Basic Test Procedure section............................................................. 24
• Added reference to TSW14J50 in the Test Block Diagram with ADC32Jxx and ADC34Jxx section. ........................ 27
• Added reference to TSW14J50 in the Test Set-up Connection (Onboard LMK04828 Clock) section........................ 28
Changes from A Revision (September 2014) to B Revision .......................................................................................... Page
• Changed the power supply reference to include options for using a 5-V brick or the provided power supply cable with
barrel connector ........................................................................................................................... 5
Changes from Original (June 2014) to A Revision ......................................................................................................... Page
• Deleted future release note from ADC3224EVM, ADC3424EVM, ADC34J25EVM, and ADC34J44EVM in Table 1........ 3
• Added ADC32J22EVM, ADC32J42EVM, ADC34J22EVM, ADC34J42EVM to ADC3xxx Family of Parts and EVMs
table. ........................................................................................................................................ 3
• Deleted last sentence in paragraph following Power Supply Options table. ...................................................... 7
• Deleted last sentence in the first paragraph on the page........................................................................... 11
• Deleted entire paragraph preceding ADC3xxxx EVM Jumper Options table.................................................... 11
• Deleted several rows from ADC3xxxx EVM Jumper Options table ............................................................... 11
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Revision History
31
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
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(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
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will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
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POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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