Texas Instruments CY74FCT16245TPVCT, CY74FCT16245TPVC, CY74FCT16245TPACT, CY74FCT16245TPAC, CY74FCT16245ETPVCT Datasheet

...
16-Bit Transceivers
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
SCCS026 - July 1994 - Revised March 2000
Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
Features
FCT-E speed at 3.2 ns
Power-off disable outputs permits live insertion
Edge-rate control circuitry for significantly improved
noise characteristics
Typical output skew < 250 ps
ESD > 2000V
TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
Industrial temperature range of –40˚C to +85˚C
V
CC
= 5V ± 10%
CY74FCT16245T Features:
64 mA sink current, 32 mA source current
Typical V
OLP
(ground bounce)<1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162245T Features:
Balanced output drivers: 24 mA
Reduced system switching noise
Typical V
OLP
(ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
CY74FCT162H245T Features:
Bus hold on data inputs
Eliminates the need for external pull-up or pull-down
resistors
Functional Description
These 16-bit transceivers are designedfor use in bidirectional synchronous communication between two buses, where high speed and low power are required. With the exception of the CY74FCT16245T, these devices can be operated either as twoindependent octals or a single 16-bit transceiver. Direction of data flow is controlled by (DIR), the Output Enable (
OE) transfers data when LOW and isolates the buses when HIGH. The output buffers are designed with power off disable capa­bility to allow for live insertion of boards.
The CY74FCT16245T is ideally suited for driving high-capacitance loads and low-impedance backplanes.
The CY74FCT162245T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for mini­mal undershoot and reduced ground bounce. The CY74FCT162245T is ideal for driving transmission lines.
TheCY74FCT162H245T is a 24-mA balancedoutput part that has bus hold on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs.
GND
LogicBlock Diagrams CY74FCT16245T,CY74FCT162245T, CY74FCT162H245T
Pin
Configuration
1 2 3 4 5 6 7 8 9 10 11 12
33 32 31 30 29
25
26
27
28
36 35
1
DIR
34
SSOP/TSSOP
Top View
13 14 15 16 17 18 19 20 21 22 23 24
45 44 43 42 41
37
38
39
40
48 47 46
1B1 1B2
1B3 1B4
1A1 1A2
1A3 1A4
1
OE
GND
GND
V
CC
1B7 1B8
1B5 1B6
1A5 1A6
1A7 1A8
V
CC
GND
GND
2B3 2B4
2B1 2B2
2A1 2A2
2A3 2A4
GND
GND
V
CC
2B7 2B8
2B5 2B6
2A5 2A6
2A7 2A8
V
CC
GND
2
DIR
2
OE
FCT16245–1
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1
OE
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1
DIR
1A8
1B8
FCT16245–2
2A1
2A2
2A3
2A4
2A5
2A6
2A7
2
OE
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2
DIR
2A8
2B8
FCT16245–3
16245T 162245T 162H245T
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
2
Maximum Ratings
[3, 4]
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ........................Com’l -55°C to +125°C
Ambient Temperature with
Power Applied....................................Com’l -55°C to +125°C
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
Power Dissipation..........................................................1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Notes:
1. On CY74FCT162H245T these pins have bus hold.
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operationbeyondthe limitsset forthmayimpair theuseful lifeof the device.Unless otherwise noted,these limitsare overtheoperating free-airtemperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
Pin Description
Name Description
OE Three-State Output Enable Inputs (Active LOW) DIR Direction Control A Inputs or Three-State Outputs
[1]
B Inputs or Three-State Outputs
[1]
Function Table
[2]
Inputs
OutputsOE DIR
L L Bus B Data to Bus A L H Bus A Data to Bus B
H X High Z State
Operating Range
Range
Ambient
Temperature V
CC
Industrial –40°C to +85°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Input Hysteresis
[6]
100 mV
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
I
IH
Input HIGH Current Standard VCC=Max., VI=V
CC
±1 µA
Bus Hold ±100
I
IL
Input LOW Current Standard VCC=Max., VI=GND ±1 µA
Bus Hold ±100 µA
I
BBH
I
BBL
Bus Hold Sustain Current on Bus Hold Input
[7]
VCC=Min. VI=2.0V –50 µA
VI=0.8V +50
I
BHHO
I
BHLO
Bus Hold Overdrive Current on Bus Hold Input
[7]
VCC=Max., VI=1.5V TBD mA
I
OZH
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT
=2.7V ±1 µA
I
OZL
High Impedance Output Current (Three-State Output pins)
VCC=Max., V
OUT
=0.5V ±1 µA
I
OS
Short Circuit Current
[8]
VCC=Max., V
OUT
=GND –80 –140 –200 mA
I
O
Output Drive Current
[8]
VCC=Max., V
OUT
=2.5V –50 –180 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
4.5V
[9]
±1 µA
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
3
Output Drive Characteristics for CY74FCT16245T
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
OH
Output HIGH Voltage VCC=Min., IOH=–3 mA 2.5 3.5 V
VCC=Min., IOH=–15 mA 2.4 3.5 V VCC=Min., IOH=–32 mA 2.0 3.0 V
V
OL
Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V
Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
I
ODL
Output LOW Current
[8]
VCC=5V, VIN=VIH or VIL, V
OUT
=1.5V 60 115 150 mA
I
ODH
Output HIGH Current
[8]
VCC=5V, VIN=VIH or VIL, V
OUT
=1.5V –60 –115 –150 mA
V
OH
Output HIGH Voltage VCC=Min., IOH=–24 mA 2.4 3.3 V
V
OL
Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V
Notes:
5. Typical values are at V
CC
=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Pins with bus hold are described in Pin Description.
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I
OS
tests should be performed last.
9. Tested at +25˚C.
Capacitance
[6]
(TA = +25˚C, f = 1.0 MHz)
Parameter Description Test Conditions Typ.
[5]
Max. Unit
C
IN
Input Capacitance VIN = 0V 4.5 6.0 pF
C
OUT
Output Capacitance V
OUT
= 0V 5.5 8.0 pF
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
4
Power Supply Characteristics
Parameter Description Test Conditions Typ.
[5]
Max. Unit
I
CC
Quiescent Power Supply Current VCC=Max. VIN<0.2V,
V
IN>VCC
-0.2V
5 500 µA
I
CC
Quiescent Power Supply Current (TTL inputs HIGH)
VCC=Max. VIN=3.4V
[10]
0.5 1.5 mA
I
CCD
Dynamic Power Supply Current
[11]
VCC=Max., One Input Toggling, 50%DutyCycle,OutputsOpen, OE=DIR=GND
VIN=VCC or V
IN
=GND
60 100 µA/MHz
I
C
Total Power Supply Current
[12]
VCC=Max., f1=10 MHz, 50%DutyCycle,OutputsOpen, One Bit Toggling, OE=DIR=GND
VIN=VCC or V
IN
=GND
0.6 1.5 mA
VIN=3.4V or V
IN
=GND
0.9 2.3 mA
VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=DIR=GND
VIN=VCC or V
IN
=GND
2.4 4.5
[13]
mA
VIN=3.4V or V
IN
=GND
6.4 16.5
[13]
mA
Notes:
10. Per TTL driven input (V
IN
=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. I
C
=I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
IC=ICC+ICCDHNT+I
CCD(f0
/2 + f1N1)
I
CC
= Quiescent Current with CMOS input levels
I
CC
= Power Supply Current for a TTL HIGH input (VIN=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
f
1
= Input signal frequency
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
5
]
Switching Characteristics Over the Operating Range
[14]
Description
74FCT16245T
74FCT162245T
74FCT16245AT
74FCT162245AT
74FCT162H245AT
Fig.
No.
[15]
Parameter Min. Max. Min. Max. Unit
t
PLH
t
PHL
Propagation Delay Data to Output A to B, B to A
1.5 7.0 1.5 4.5 ns 1, 3
t
PZH
t
PZL
Output Enable Time OE to A or B
1.5 9.5 1.5 6.2 ns 1, 7, 8
t
PHZ
t
PLZ
Output Disable Time OE to A or B
1.5 7.5 1.5 5.0 ns 1, 7, 8
t
PZH
t
PZL
Output Enable Time DIR to A or B
1.5 9.5 1.5 6.2 ns 1, 7, 8
t
PHZ
t
PLZ
Output Disable Time DIR to A or B
1.5 7.5 1.5 5.0 ns 1, 7, 8
t
SK(O)
Output Skew
[16]
0.5 0.5 ns
Description
74FCT16245CT
74FCT162245CT
74FCT162H245CT
74FCT16245ET
74FCT162245ET
74FCT162H245ET
Fig.
No.
[15]
Parameter Min. Max. Min. Max. Unit
t
PLH
t
PHL
Propagation Delay Data to Output A to B, B to A
1.5 4.1 1.5 3.2 ns 1, 3
t
PZH
t
PZL
Output Enable Time OE to A or B
1.5 5.8 1.5 4.4 ns 1, 7, 8
t
PHZ
t
PLZ
Output Disable Time OE to A or B
1.5 4.8 1.5 4.0 ns 1, 7, 8
t
PZH
t
PZL
Output Enable Time DIR to A or B
1.5 5.8 1.5 4.8 ns 1, 7, 8
t
PHZ
t
PLZ
Output Disable Time DIR to A or B
1.5 4.8 1.5 4.0 ns 1, 7, 8
t
SK(O)
Output Skew
[16]
0.5 0.5 ns
Note:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16245
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
3.2 CY74FCT16245ETPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16245ETPVC/PVCT O48 48-Lead (300-Mil) SSOP
4.1 CY74FCT16245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16245CTPVC/PVCT O48 48-Lead (300-Mil) SSOP
4.5 CY74FCT16245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16245ATPVC/PVCT O48 48-Lead (300-Mil) SSOP
7.0 CY74FCT16245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT16245TPVC/PVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
6
Ordering Information CY74FCT162245
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
3.2 74FCT162245ETPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162245ETPVC O48 48-Lead (300-Mil) SSOP 74FCT162245ETPVCT O48 48-Lead (300-Mil) SSOP
4.1 CY74FCT162245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162245CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162245CTPVCT O48 48-Lead (300-Mil) SSOP
4.5 74FCT162245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162245ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162245ATPVCT O48 48-Lead (300-Mil) SSOP
7.0 CY74FCT162245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162245TPVC/PVCT O48 48-Lead (300-Mil) SSOP
Ordering Information CY74FCT162H245
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
3.2 74FCT162H245ETPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162H245ETPVC O48 48-Lead (300-Mil) SSOP 74FCT162H245ETPVCT O48 48-Lead (300-Mil) SSOP
4.1 74FCT162H245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162H245CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162H245CTPVCT O48 48-Lead (300-Mil) SSOP
4.5 74FCT162H245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162H245ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162H245ATPVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16245T/2245T
CY74FCT16445T/2H245T
7
Package Diagrams
48-Lead Shrunk Small Outline Package O48
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
8
Package Diagrams
48-Lead Thin Shrunk Small Outline Package Z48
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...