Texas Instruments CY74FCT16827CTPVC, CY74FCT16827CTPACT, CY74FCT16827CTPAC, CY74FCT16827ATPVCT, CY74FCT16827ATPVC Datasheet

20-Bit Buffers/Line Drivers

CY74FCT16827T

CY74FCT162827T

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.

SCCS064 - August 1994 - Revised March 2000

Copyright © 2000, Texas Instruments Incorporated

1CY74FCT162827T

Features

• FCT-E speed at 3.2 ns

• Power-off disable outputs permits live insertion

• Edge-rate control circuitry for significantly improved
noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages

• Industrial temperature range of −40˚C to +85˚C

•V

CC

= 5V ± 10%

CY74FCT16827T Features:

• 64 mA sink current, 32 mA source current

• Typical V

OLP

(ground bounce) <1.0V at VCC = 5V,

TA = 25˚C

CY74FCT162827T Features:

• Balanced 24 mA output drivers

• Reduced system switching noise

• Typical V

OLP

(ground bounce) <0.6V at VCC = 5V,

TA= 25˚C

Functional Description

The CY74FCT16827T 20-bit buffer/line driver and the
CY74FCT162827T 20-bit buffer/line driver provide
high-performance bus interf ace b uff ering for wide data/address
pathsor busescarrying parity .Thesepartscanbeusedas a single
20-bit buffer or two 10-bit buff ers. Each 10-bit buff er has a pair of
NANDed

OEforincreasedflexibility. The outputs are designed with

a power-off disable f eature to allow f or liv e insertion of boards.
The CY74FCT16827T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.
The CY74FCT162827T has 24-mA balanced output drivers

with current-limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162827T is ideal for driving transmission lines.

GND

Logic Block Diagrams Pin Configuration

1
2
3
4
5
6
7
8
9
10
11
12

33
32
31

30
29

36
35

1OE1

34

SSOP/TSSOP

Top View

1Y1

13
14

15
16
17
18
19
20
21
22
23
24

45
44
43
42
41

37

38

39

40

48
47

46

1A1

1OE1

1Y1
1Y2

1Y3
1Y4

1A1
1A2

1A3
1A4

1OE2

GND

GND

V

CC

2Y3

2Y4

2Y1
2Y2

1A6

V

CC

GND

GND

2OE1

FCT16827-1

1OE2

TO 9 OTHER CHANNELS

2A1

2OE1

TO 9 OTHER CHANNELS

2OE2

2Y1

1Y5
1Y6
1Y7

1Y8
1Y9

1Y10

2Y5

2Y9

2Y7
2Y8

V

CC

2Y6

2Y10

GND

25
26
27
28

55
54
53
52
51
50
49

56

1A5

1A7

1A9

1A8

1A10

2A3

2A4

2A2

GND

2A5

2A9

2A7
2A8

V

CC

2A6

2A10

2A1

GND

2OE2

FCT16827-2

FCT16827-3

CY74FCT16827T

CY74FCT162827T

2

Maximum Ratings

[2, 3]

(Above which the useful life may be impaired. For user
guidelines, not tested.)

Storage Temperature............................... −55°C to +125°C

Ambient Temperature with

Power Applied.......................................... −55°C to +125°C

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Pin Description

Name Description

OE Output Enable Inputs (Active LOW)
A Data Inputs
Y Three-State Outputs

Function Table

[1]

Inputs Outputs

OE

1

OE

2

A Y

L L L L

L L H H
H X X Z
X H X Z

Operating Range

Range

Ambient

Temperature V

CC

Industrial −40°C to +85°C 5V ± 10%

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.

[4]

Max. Unit

V

IH

Input HIGH Voltage 2.0 V

V

IL

Input LOW Voltage 0.8 V

V

H

Input Hysteresis

[5]

100 mV

V

IK

Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V

I

IH

Input HIGH Current VCC=Max., VI=V

CC

±1 µA

I

IL

Input LOW Current VCC=Max., VI=GND ±1 µA

I

OZH

High Impedance Output
Current (Three-State Output pins)

VCC=Max., V

OUT

=2.7V ±1 µA

I

OZL

High Impedance Output
Current (Three-State Output pins)

VCC=Max., V

OUT

=0.5V ±1 µA

I

OS

Short Circuit Current

[6]

VCC=Max., V

OUT

=GND −80 −140 −200 mA

I

O

Output Drive Current

[6]

VCC=Max., V

OUT

=2.5V −50 −180 mA

I

OFF

Power-Off Disable VCC=0V, V

OUT

≤4.5V

[7]

±1 µA

Output Drive Characteristics for CY74FCT16827T

Parameter Description Test Conditions Min. Typ.

[4]

Max. Unit

V

OH

Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V

VCC=Min., IOH=−15 mA 2.4 3.5
VCC=Min., IOH=−32 mA 2.0 3.0

V

OL

Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.Z = HIGH Impedance.

2. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.

3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

4. Typical values are at V

CC

= 5.0V, TA= +25˚C ambient.

5. This parameter is specified but not tested.

6. Not more than one output should be shorted at a time. Duration ofshort should not exceedonesecond. The use of high-speed test apparatus and/or sample
and hold techniques are preferablein order to minimize internal chip heating and more accurately reflect operationalvalues. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I

OS

tests should be performed last.

7. Tested at +25˚C.

CY74FCT16827T

CY74FCT162827T

3

Output Drive Characteristics for CY74FCT162827T

Parameter Description Test Conditions Min. Typ.

[4]

Max. Unit

I

ODL

Output LOW Current

[6]

VCC=5V, VIN=VIH or VIL, V

OUT

=1.5V 60 115 150 mA

I

ODH

Output HIGH Current

[6]

VCC=5V, VIN=VIH or VIL, V

OUT

=1.5V −60 −115 −150 mA

V

OH

Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V

V

OL

Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance

[5]

(TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.

[4]

Max. Unit

C

IN

Input Capacitance VIN = 0V 4.5 6.0 pF

C

OUT

Output Capacitance V

OUT

= 0V 5.5 8.0 pF

Power Supply Characteristics

Parameter Description Test Conditions Min. Typ.

[4]

Max. Unit

I

CC

Quiescent Power Supply
Current

VCC=Max. VIN<0.2V,

V

IN>VCC

−0.2V

— 5 500 µA

∆I

CC

Quiescent Power Supply
Current (TTL inputs HIGH)

VCC=Max. VIN=3.4V

[8]

— 0.5 1.5 mA

I

CCD

Dynamic Power Supply
Current

[9]

VCC=Max.,
One Input Toggling,
50% Duty Cycle,
Outputs Open,
OE1=OE2=GND,

VIN=VCC or
V

IN

=GND

— 60 100 µA/MHz

I

C

Total Power Supply Current

[10]

VCC=Max.,
f

1

=10 MHz,
50% Duty Cycle,
Outputs Open,
One Bit Toggling,
OE1=OE2=GND

VIN=VCC or
V

IN

=GND

— 0.6 1.5 mA

VIN=3.4V or
V

IN

=GND

— 0.9 2.3

VCC=Max.,
f

1

=2.5 MHz,
50% Duty Cycle,
Outputs Open,
Twenty Bits Toggling,
OE1=OE2=GND

VIN=VCC or
V

IN

=GND

— 3.0 5.5

[11]

VIN=3.4V or
V

IN

=GND

— 8.0 20.5

[11]

Notes:

8. Per TTL driven input (V

IN

=3.4V); all other inputs at VCC or GND.

9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

10. I

C

=I

QUIESCENT

+ I

INPUTS

+ I

DYNAMIC

IC=ICC+∆ICCDHNT+I

CCD(f0

/2 + f1N1)

I

CC

= Quiescent Current with CMOS input levels

∆I

CC

= Power Supply Current for a TTL HIGH input (VIN=3.4V)

D

H

= Duty Cycle for TTL inputs HIGH

N

T

= Number of TTL inputs at D

H

I

CCD

= Dynamic Current caused by an input transition pair (HLH or LHL)

f

0

= Clock frequency for registered devices, otherwise zero

f

1

= Input signal frequency

N

1

= Number of inputs changing at f

1

All currents are in milliamps and all frequencies are in megahertz.

11. Values for these conditions are examples of the I

CC

formula. These limits are specified but not tested.