Distributed VCC and GND Configuration
Minimizes High-Speed Switching Noise
D
EPIC
t
(Enhanced-Performance Implanted
CMOS) 1-mm Process
D
500-mA Typical Latch-Up Immunity at
125°C
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages Using 25-mil
Center-to-Center Pin Spacings, and 380-mil
Fine-Pitch Ceramic Flat (WD) Packages
Using 25-mil Center-to-Center Pin Spacings
description
The ’AC16244 are 16-bit buffers/line drivers
designed specifically to improve both the
performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. They can be used as
four 4-bit buffers, two 8-bit buffers, or one 16-bit
buffer. These devices provide true outputs and
symmetrical active-low output-enable (OE
inputs. When OE is low, the device passes
noninverted data from the A inputs to the Y
outputs. When OE
high-impedance state.
is high, the outputs are in the
54AC16244 . . . WD PACKAGE
74AC16244 . . . DGG OR DL PACKAGE
1OE
1Y1
1Y2
GND
1Y3
1Y4
V
CC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
V
CC
4Y1
4Y2
GND
4Y3
4Y4
4OE
(TOP VIEW)
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
V
CC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
V
CC
4A1
4A2
GND
4A3
4A4
3OE
)
The 74AC16244 is packaged in the TI’s shrink small-outline package, which provides twice the I/O pin count
and functionality of standard small-outline packages in the same printed-circuit-board area.
The 54AC16244 is characterized for operation over the full military temperature range of –55°C to 125°C. The
74AC16244 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each driver)
INPUTS
OEA
LHH
LLL
HXZ
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OUTPUT
Y
Copyright 1996, Texas Instruments Incorporated
1
54AC16244, 74AC16244
16-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
Input voltage range, VI (see Note 1) –0.5 V to V
Output voltage range, VO (see Note 1) –0.5 V to V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
3 V2.92.92.9
IOH = –50 µA
V
OH
V
OL
I
I
I
OZ
I
CC
C
i
C
o
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
IOH = –4 mA3 V2.582.482.48
= –24
OH
IOH = –75 mA
IOL = –50 µA
IOL = 12 mA3 V0.360.440.44
= 24
OL
IOL = 75 mA
VI = VCC or GND5.5 V±0.1±1±1µA
VI = VCC or GND5.5 V±0.5±5±5µA
VI = VCC or GND,IO = 05.5 V88080µA
VI = VCC or GND5 V4.5
VI = VCC or GND5 V12
†
†
4.5 V4.44.44.4
5.5 V5.45.45.4
4.5 V3.943.83.8
5.5 V4.944.84.8
5.5 V3.853.85
3 V0.10.10.1
4.5 V0.10.10.1
5.5 V0.10.10.1
4.5 V0.360.440.44
5.5 V0.360.440.44
5.5 V1.651.65
TA = 25°C54AC1624474AC16244
MINTYPMAXMINMAXMINMAX
V
V
p
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
UNIT
A
Y
ns
OE
Y
ns
OE
Y
ns
PARAMETER
UNIT
A
Y
ns
OE
Y
ns
OE
Y
ns
CpdPower dissipation capacitance per latch
C
f
pF
54AC16244, 74AC16244
16-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCAS120A – MARCH 1990 – REVISED APRIL 1996
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTO
(INPUT)(OUTPUT)
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTO
(INPUT)(OUTPUT)
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
TA = 25°C54AC1624474AC16244
MINTYPMAXMINMAXMINMAX
27.19.4210.8210.8
2.48.310.72.411.82.411.8
2.27.5102.211.52.211.5
2.910.4132.914.62.914.6
4.16.88.44.19.14.19.1
3.76.58.13.78.83.78.8
TA = 25°C54AC1624474AC16244
MINTYPMAXMINMAXMINMAX
1.64.66.31.67.11.67.1
25.3727.927.9
1.74.86.71.77.51.77.5
2.26.18.12.292.29
46.47.848.448.4
3.55.57.23.57.63.57.6
operating characteristics, V
p
p
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
p
Outputs enabled
Outputs disabled
= 50 pF,
L
p
= 1 MHz
43
p
7
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
54AC16244, 74AC16244
16-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCAS120A – MARCH 1990 – REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
500 Ω
500 Ω
S1
2 × V
Open
GND
CC
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 × V
GND
CC
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
50%50%
50% V
CC
50% V
CC
VOLTAGE WAVEFORMS
Figure 1. Load Circuit and Voltage Waveforms
t
PHL
50% V
t
PLH
50% V
CC
CC
V
0 V
V
V
V
V
CC
OH
OL
OH
OL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
CC
t
PZL
t
PZH
CC
CC
50%
20% V
80% V
50%
t
PLZ
50% V
t
PHZ
50% V
VOLTAGE WAVEFORMS
CC
CC
V
0 V
[
V
V
[
CC
V
OL
OH
0 V
CC
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2005
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
74AC16244DGGRACTIVETSSOPDGG482000 Green (RoHS &
no Sb/Br)
74AC16244DGGRE4ACTIVETSSOPDGG482000 Green (RoHS &
no Sb/Br)
74AC16244DLACTIVESSOPDL4825Green (RoHS &
no Sb/Br)
74AC16244DLRACTIVESSOPDL481000 Green (RoHS &
no Sb/Br)
74AC16244DLRG4ACTIVESSOPDL481000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
1
0.110 (2,79) MAX
0.0135 (0,343)
0.008 (0,203)
25
0.299 (7,59)
0.291 (7,39)
24
A
0.008 (0,20) MIN
0.005 (0,13)
0.420 (10,67)
0.395 (10,03)
Seating Plane
0.004 (0,10)
M
0.010 (0,25)
0.005 (0,13)
Gage Plane
0.010 (0,25)
0°–ā8°
0.040 (1,02)
0.020 (0,51)
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
0.380
(9,65)
0.370
(9,40)
4828
0.630
(16,00)
0.620
(15,75)
56
0.730
(18,54)
0.720
(18,29)
4040048/E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,50
48
1
1,20 MAX
0,27
0,17
25
24
A
0,15
0,05
0,08
M
6,20
8,30
6,00
7,90
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
DIM
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PINS **
A MAX
A MIN
48
12,60
12,40
56
14,10
13,90
64
17,10
16,90
4040078/F 12/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
ProductsApplications
Amplifiersamplifier.ti.comAudiowww.ti.com/audio
Data Convertersdataconverter.ti.comAutomotivewww.ti.com/automotive
DSPdsp.ti.comBroadbandwww.ti.com/broadband
Interfaceinterface.ti.comDigital Controlwww.ti.com/digitalcontrol
Logiclogic.ti.comMilitarywww.ti.com/military
Power Mgmtpower.ti.comOptical Networkingwww.ti.com/opticalnetwork
Microcontrollersmicrocontroller.ti.comSecuritywww.ti.com/security
Telephonywww.ti.com/telephony
Video & Imagingwww.ti.com/video
Wirelesswww.ti.com/wireless