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CC2650MOD SimpleLink™ Multistandard Wireless MCU Module

1 Device Overview

1.1 Features

• Microcontroller – Powerful ARM®Cortex®-M3 – EEMBC CoreMark®Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultra-Low Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA)

• Ultra-Low Power Sensor Controller – Can Run Autonomous From the Rest of the

System – 16-Bit Architecture – 2KB of Ultra-Low Leakage SRAM for Code and

Data

• Efficient Code Size Architecture, Placing Drivers,

Bluetooth®low energy Controller, IEEE 802.15.4

MAC, and Bootloader in ROM

• Integrated Antenna

• Peripherals – All Digital Peripheral Pins Can Be Routed to

Any GPIO

– Four General-Purpose Timer Modules (8 × 16-

Bit or 4 × 32-Bit Timer, PWM Each)

– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog

MUX – Continuous Time Comparator – Ultra-Low Power Analog Comparator – Programmable Current Source – UART – 2 × SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 15 GPIOs – Support for Eight Capacitive Sensing Buttons – Integrated Temperature Sensor

• External System – On-Chip internal DC-DC Converter

CC2650MOD

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– No External Components Needed, Only Supply

Voltage

– Version With CC2592 Range Extender Available

• Low Power – Wide Supply Voltage Range

• Operation from 1.8 to 3.8 V – Active-Mode RX: 6.1 mA – Active-Mode TX at 0 dBm: 6.1 mA – Active-Mode TX at +5 dBm: 9.1 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller: 8.2 µA/MHz – Standby: 1 µA (RTC Running and RAM/CPU

Retention)

– Shutdown: 100 nA (Wake Up on External

Events)

• RF Section – 2.4-GHz RF Transceiver Compatible With

Bluetooth low energy (BLE) 4.1 Specification and IEEE 802.15.4 PHY and MAC

– Excellent Receiver Sensitivity (–97 dBm for

Bluetooth low energy and –100 dBm for

802.15.4), Selectivity, and Blocking

Performance – Programmable Output Power up to +5 dBm – Integrated Antenna – Pre-Certified for Compliance With Worldwide

Radio Frequency Regulations

• ETSI (Europe)

• IC (Canada)

• FCC (USA)

• ARIB STD-T66 (Japan)

• Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF

Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench®for ARM – Code Composer Studio™

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice.

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1.2 Applications

• Consumer Electronics

• Mobile Phone Accessories

• Sports and Fitness Equipment

• HID Applications

• Home and Building Automation

• Lighting Control

1.3 Description

The CC2650MOD device is a SimpleLink™ wireless MCU module that targets Bluetooth Smart, ZigBee and 6LoWPAN, and ZigBee®RF4CE remote control applications.

The module is based on the CC2650 Wireless MCU, a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications.

The CC2650MOD contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low power sensor controller. This sensor controller is ideal for interfacing external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MOD device is ideal for applications within a whole range of products including industrial, consumer electronics, and medical devices.

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• Alarm and Security

• Proximity Tags

• Medical

• Remote Controls

• Wireless Sensor Networks

The CC2650MOD is precertified for operation under the regulations of the FCC, IC, ETSI and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products.

The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM®Cortex®-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available.

The Bluetooth Smart and ZigBee stacks are available free of charge from www.ti.com.

PART NUMBER PACKAGE BODY SIZE

CC2650MODAMOH MOH (Module) 16.90 mm × 11.00 mm

(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.

Device Information

(1)

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Main CPU:

128KB

Flash

Sensor Controller

cJTAG

20KB

SRAM

ROM

ARM

Cortex

-M3

DC/DC converter

RF core

ARM

Cortex®-M0

DSP Modem

4KB

SRAM

ROM

Sensor Controller Engine

2× Analog Comparators

12-bit ADC, 200ks/s

Constant Current Source

SPI / I2C Digital Sensor IF

2KB SRAM

Time to Digital Converter

General Peripherals / Modules

4× 32-bit Timers

2× SSI (SPI, µWire,TI)

Watchdog Timer

Temp. / Batt. Monitor

RTC

I2C

UART

I2S

10 / 15 / 31 GPIOs

AES

32 ch. µDMA

ADC ADC

Digital PLL

SimpleLinkTM CC2650MOD Wireless MCU Module

TRNG

8KB

Cache

24MHz Crystal

Oscillator

32.768kHz Crystal

Oscillator

RF Balun

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1.4 Functional Block Diagram

Figure 1-1 is a block diagram for the CC2650MOD device.

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Figure 1-1. CC2650MOD Block Diagram

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1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 2

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 3

2 Revision History ......................................... 4

3 Device Comparison ..................................... 5

4 Terminal Configuration and Functions.............. 6

4.1 Module Pin Diagram.................................. 6

4.2 Pin Functions ......................................... 7

5 Specifications ............................................ 8

5.1 Absolute Maximum Ratings .......................... 8

5.2 ESD Ratings.......................................... 8

5.3 Recommended Operating Conditions ................ 8

5.4 Power Consumption Summary ....................... 9

5.5 General Characteristics .............................. 9

5.6 Antenna ............................................. 10

5.7 1-Mbps GFSK (Bluetooth low energy) – RX ........ 10

5.8 1-Mbps GFSK (Bluetooth low energy) – TX ........ 11

5.9 2-Mbps GFSK (Bluetooth low energy) – RX ........ 11

5.10 2-Mbps GFSK (Bluetooth low energy) – TX ........ 12

5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

RX ................................................... 12

5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

TX ................................................... 13

5.13 24-MHz Crystal Oscillator (XOSC_HF) ............. 13

5.14 32.768-kHz Crystal Oscillator (XOSC_LF).......... 13

5.15 48-MHz RC Oscillator (RCOSC_HF) ............... 13

5.16 32-kHz RC Oscillator (RCOSC_LF)................. 13

5.17 ADC Characteristics................................. 14

5.18 Temperature Sensor ................................ 15

5.19 Battery Monitor...................................... 15

5.20 Continuous Time Comparator....................... 15

5.21 Low-Power Clocked Comparator ................... 15

5.22 Programmable Current Source ..................... 16

5.23 DC Characteristics .................................. 16

5.24 Thermal Resistance Characteristics for MOH

Package ............................................. 17

5.25 Timing Requirements ............................... 17

5.26 Switching Characteristics ........................... 17

5.27 Typical Characteristics .............................. 20

6 Detailed Description ................................... 25

6.1 Overview ............................................ 25

6.2 Functional Block Diagram........................... 25

6.3 Main CPU ........................................... 26

6.4 RF Core ............................................. 26

6.5 Sensor Controller ................................... 27

6.6 Memory.............................................. 28

6.7 Debug ............................................... 28

6.8 Power Management................................. 29

6.9 Clock Systems ...................................... 30

6.10 General Peripherals and Modules .................. 30

6.11 System Architecture................................. 32

6.12 Certification.......................................... 32

6.13 End Product Labeling ............................... 33

6.14 Manual Information to the End User ................ 33

7 Application, Implementation, and Layout ......... 34

7.1 Application Information .............................. 34

8 Device and Documentation Support ............... 35

8.1 Device Nomenclature ............................... 35

8.2 Tools and Software ................................. 36

8.3 Documentation Support ............................. 37

8.4 Texas Instruments Low-Power RF Website ........ 37

8.5 Low-Power RF eNewsletter ......................... 37

8.6 Community Resources .............................. 38

8.7 Additional Information ............................... 38

8.8 Trademarks.......................................... 38

8.9 Electrostatic Discharge Caution..................... 39

8.10 Export Control Notice ............................... 39

8.11 Glossary............................................. 39

9 Mechanical Packaging and Orderable

Information .............................................. 39

9.1 Packaging Information .............................. 39

2 Revision History

DATE REVISION NOTES

August 2016 * Initial Release

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3 Device Comparison

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Table 3-1. Device Family Overview

DEVICE PHY SUPPORT

CC2650MODAMOH Multiprotocol 128 20 15 MOH

FLASH

(KB)

RAM (KB) GPIO PACKAGE

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CC2650MOD

(Exposed GND Pads)

1 2

4 5 6 7 19

21 20

18 17

23 22

10 11 12 13 14 15 16

Antenna

GND DIO 0 DIO 1

DIO 2 DIO 3 DIO 4

JTAG_TMS

VDD VDD

DIO 14 DIO 13 DIO 12 DIO 11 DIO 10

JTAG_TCK

DIO 5/JTAG_TDO

DIO 6/JTAG_TDI

nRESET

DIO 7

DIO 8

DIO 9

8 9

25 24

GND GND

G1 G2

G3 G4

NC NC

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4 Terminal Configuration and Functions

4.1 Module Pin Diagram

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(1) The following I/O pins marked in bold in the pinout have high-drive capabilities:

• DIO 2

• DIO 3

• DIO 4

• JTAG_TMS

• DIO 5/JTAG_TDO

• DIO 6/JTAG_TDI

(2) The following I/O pins marked in italics in the pinout have analog capabilities:

• DIO 7

• DIO 8

• DIO 9

• DIO 10

• DIO 11

• DIO 12

• DIO 13

• DIO 14

Figure 4-1. MOH Package

(16.9-mm × 11-mm) Module Pinout

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4.2 Pin Functions

Table 4-1. Signal Descriptions – MOH Package

PIN NAME PIN NO. PIN TYPE DESCRIPTION

DIO_0 4 Digital I/O GPIO, Sensor Controller DIO_1 5 Digital I/O GPIO, Sensor Controller DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog EGP G1, G2, G3, G4 Power Ground – Exposed ground pad GND 1, 25 — Ground JTAG_TCKC 10 Digital I/O JTAG TCKC JTAG_TMSC 9 Digital I/O JTAG TMSC, high-drive capability

NC 2, 24 NC RESET_N 13 Digital input Reset, active low. No internal pullup

VDDS 22, 23 Power 1.8-V to 3.8-V main chip supply

Not Connected—TI recommends that these pins are left floating

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

VDDS Supply voltage –0.3 4.1 V

Voltage on any digital pin

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

(2) All voltage values are with respect to ground, unless otherwise noted. (3) Including analog capable DIO.

5.2 ESD Ratings

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Voltage on ADC input

Input RF level 5 dBm Storage temperature –40 85 °C

stg

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

ESD

Electrostatic discharge

(1)(2)

MIN MAX UNIT

(3)

Voltage scaling enabled –0.3 VDDS

Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9

Human body model (HBM), per ANSI/ESDA/JEDEC

(1)

JS001

Charged device model (CDM), per JESD22-C101

(2)

–0.3 VDDS + 0.3, max 4.1 V

All pins ±2500 RF pins ±750

Non-RF pins ±750

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VVoltage scaling disabled, internal reference –0.3 1.49

VALUE UNIT

5.3 Recommended Operating Conditions

MIN MAX UNIT

Ambient temperature –40 85 °C

For operation in battery-powered and 3.3-V

Operating supply voltage (VDDS)

systems (internal DC-DC can be used to minimize power consumption)

1.8 3.8 V

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5.4 Power Consumption Summary

Tc= 25°C, V

core

Peripheral Current Consumption (Adds to core current I

peri

(1) I

is not supported in Standby or Shutdown.

peri

= 3.0 V with internal DC-DC converter, unless otherwise noted

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold

Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial)

Core current consumption

Peripheral power domain Delta current with domain enabled 20 µA Serial power domain Delta current with domain enabled 13 µA

RF Core µDMA Delta current with clock enabled, module idle 130 µA

Timers Delta current with clock enabled, module idle 113 µA I2C Delta current with clock enabled, module idle 12 µA I2S Delta current with clock enabled, module idle 36 µA SSI Delta current with clock enabled, module idle 93 µA UART Delta current with clock enabled, module idle 164 µA

(partial) register retention. RCOSC_LF Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. XOSC_LF Idle. Supply systems and RAM powered. 550

Active. Core running CoreMark Radio RX 6.1

Radio TX, 5-dBm output power 9.1

Delta current with power domain enabled, clock enabled, RF Core Idle

for each peripheral unit activated)

core

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100

1.2

2.5

2.7

1.45 mA +

31 µA/MHz

(1)

237 µA

µA

mARadio TX, 0-dBm output power 6.1

5.5 General Characteristics

Tc= 25°C, V

FLASH MEMORY

Supported flash erase cycles before failure

Flash page/sector erase current Average delta current 12.6 mA Flash page/sector erase time Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash write time

(1) This number is dependent on Flash aging and will increase over time and erase cycles

= 3.0 V, unless otherwise noted

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(1)

100 k Cycles

8 ms

4 bytes at a time 8 µs

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5.6 Antenna

Tc= 25°C, V

Polarization Linear Peak Gain 2450 MHz 1.26 dBi Efficiency 2450 MHz 56.9 %

= 3.0 V, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, V

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity BER = 10 Receiver saturation BER = 10

Frequency error tolerance Data rate error tolerance –750 750 ppm Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

Selectivity, ±5 MHz or more

Selectivity, Image frequency Selectivity,

Image frequency ±1 MHz Out-of-band blocking Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm

Intermodulation

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

RSSI dynamic range 70 dB RSSI accuracy ±4 dB

(1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz (3) Excluding one exception at F

(1)

(3)

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–3 –3

Difference between center frequency of the received RF signal and local oscillator frequency.

Wanted signal at –67 dBm, modulated interferer in channel, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10

–3

–350 350 kHz

–97 dBm

4 dBm

–6 dB

(2)

7 / 3

(2)

34 / 25

(2)

38 / 26

(2)

42 / 29

32 dB

25 dB

(2)

3 / 26

30 MHz to 2000 MHz –20 dBm

Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level

–34 dBm

Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440

–71 dBm

class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Conducted measurement in a 50-Ω single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440

–62 dBm

class 2, FCC CFR47, Part 15 and ARIB STD-T-66

/ 2, per Bluetooth Specification

wanted

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5.8 1-Mbps GFSK (Bluetooth low energy) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, V

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting 5 dBm Output power, lowest setting –21 dBm

f < 1 GHz, outside restricted bands –43 dBm

Spurious emission conducted measurement

(1)

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

f < 1 GHz, restricted bands ETSI –65 dBm f < 1 GHz, restricted bands FCC –76 dBm f > 1 GHz, including harmonics –46 dBm

5.9 2-Mbps GFSK (Bluetooth low energy) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, V

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity

Receiver saturation

Frequency error tolerance

Data rate error tolerance

Co-channel rejection

Selectivity, ±2 MHz

Selectivity, ±4 MHz

Selectivity, ±6 MHz

Alternate channel rejection, ±7

(1)

MHz

Selectivity, Image frequency

(1)

±2 MHz

Out-of-band blocking

(1)

(3)

Out-of-band blocking 2003 MHz to 2399 MHz –15 dBm Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –10 dBm

Intermodulation

(1) Numbers given as I/C dB. (2) X / Y, where X is +N MHz and Y is –N MHz. (3) Excluding one exception at F

Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10

Difference between the incoming carrier frequency and the internally generated carrier frequency

Difference between incoming data rate and the internally generated data rate

Wanted signal at –67 dBm, modulated interferer in channel, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz BER = 10

Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ≥ ±7 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at

(1)

image frequency, BER = 10

Note that Image frequency + 2 MHz is the Cochannel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10

30 MHz to 2000 MHz –33 dBm

Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level

wanted

–3

/ 2, per Bluetooth Specification.

CC2650MOD

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–91.7 dBm

4 dBm

–300 500 kHz

–1000 1000 ppm

–7 dB

(2)

8 / 4

(2)

31 / 26

(2)

37 / 38

(2)

37 / 36

4 dB

(2)

–7 / 26

–45 dBm

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5.10 2-Mbps GFSK (Bluetooth low energy) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, V

= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting

Output power, highest setting Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm

Spurious emission conducted measurement

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

(1)

5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, V

= 3.0 V, unless otherwise noted.

DDS

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity PER = 1% –100 dBm Receiver saturation PER = 1% +4 dBm

Adjacent channel rejection

Alternate channel rejection

Channel rejection, ±15 MHz or more

Blocking and desensitization, 5 MHz from upper band edge

Blocking and desensitization, 10 MHz from upper band edge

Blocking and desensitization, 20 MHz from upper band edge

Blocking and desensitization, 50 MHz from upper band edge

Blocking and desensitization, –5 MHz from lower band edge

Blocking and desensitization, –10 MHz from lower band edge

Blocking and desensitization, –20 MHz from lower band edge

Blocking and desensitization, –50 MHz from lower band edge

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

Frequency error tolerance RSSI dynamic range 100 dB

RSSI accuracy ±4 dB

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Differential mode, delivered to a single-ended 50-Ω load through a balun

Measured on CC2650EM-4XS, delivered to a single-ended 50-Ω load

f < 1 GHz, outside restricted bands –43 dBm f < 1 GHz, restricted bands ETSI –65 dBm f < 1 GHz, restricted bands FCC –76 dBm f > 1 GHz, including harmonics –46 dBm

Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1%

Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1%

Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1%

Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%

Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66

Difference between center frequency of the received RF signal and local oscillator frequency

5 dBm

2 dBm

39 dB

52 dB

57 dB

64 dB

65 dB

68 dB

63 dB

65 dB

67 dB

–71 dBm

–62 dBm

>200 ppm

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+ 28 hidden pages

Texas Instruments 26M1 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Device Overview

1.1 Features

1.2 Applications

1.3 Description

1.4 Functional Block Diagram

Table of Contents

2 Revision History

3 Device Comparison

4 Terminal Configuration and Functions

4.1 Module Pin Diagram

4.2 Pin Functions

5 Specifications

5.1 Absolute Maximum Ratings

5.2 ESD Ratings

5.3 Recommended Operating Conditions

5.4 Power Consumption Summary

5.5 General Characteristics

5.6 Antenna

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

5.8 1-Mbps GFSK (Bluetooth low energy) – TX

5.9 2-Mbps GFSK (Bluetooth low energy) – RX

5.10 2-Mbps GFSK (Bluetooth low energy) – TX

5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX