• Peripherals
– All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules (8 × 16-
Bit or 4 × 32-Bit Timer, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog
MUX
– Continuous Time Comparator
– Ultra-Low Power Analog Comparator
– Programmable Current Source
– UART
– 2 × SSI (SPI, MICROWIRE, TI)
– I2C
– I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
– True Random Number Generator (TRNG)
– 15 GPIOs
– Support for Eight Capacitive Sensing Buttons
– Integrated Temperature Sensor
• External System
– On-Chip internal DC-DC Converter
CC2650MOD
SWRS187 –AUGUST 2016
– No External Components Needed, Only Supply
Voltage
– Version With CC2592 Range Extender Available
• Low Power
– Wide Supply Voltage Range
•Operation from 1.8 to 3.8 V
– Active-Mode RX: 6.1 mA
– Active-Mode TX at 0 dBm: 6.1 mA
– Active-Mode TX at +5 dBm: 9.1 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller: 8.2 µA/MHz
– Standby: 1 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 100 nA (Wake Up on External
Events)
• RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth low energy (BLE) 4.1 Specification
and IEEE 802.15.4 PHY and MAC
– Excellent Receiver Sensitivity (–97 dBm for
Bluetooth low energy and –100 dBm for
802.15.4), Selectivity, and Blocking
Performance
– Programmable Output Power up to +5 dBm
– Integrated Antenna
– Pre-Certified for Compliance With Worldwide
Radio Frequency Regulations
•ETSI (Europe)
•IC (Canada)
•FCC (USA)
•ARIB STD-T66 (Japan)
• Tools and Development Environment
– Full-Feature and Low-Cost Development Kits
– Multiple Reference Designs for Different RF
Configurations
– Packet Sniffer PC Software
– Sensor Controller Studio
– SmartRF™ Studio
– SmartRF Flash Programmer 2
– IAR Embedded Workbench®for ARM
– Code Composer Studio™
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCTPREVIEW
CC2650MOD
SWRS187 –AUGUST 2016
1.2Applications
•Consumer Electronics
•Mobile Phone Accessories
•Sports and Fitness Equipment
•HID Applications
•Home and Building Automation
•Lighting Control
1.3Description
The CC2650MOD device is a SimpleLink™ wireless MCU module that targets Bluetooth Smart, ZigBee
and 6LoWPAN, and ZigBee®RF4CE remote control applications.
The module is based on the CC2650 Wireless MCU, a member of the CC26xx family of cost-effective,
ultra-low power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current
consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in
energy-harvesting applications.
The CC2650MOD contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor
and a rich peripheral feature set that includes a unique ultra-low power sensor controller. This sensor
controller is ideal for interfacing external sensors or for collecting analog and digital data autonomously
while the rest of the system is in sleep mode. Thus, the CC2650MOD device is ideal for applications
within a whole range of products including industrial, consumer electronics, and medical devices.
www.ti.com
•Alarm and Security
•Proximity Tags
•Medical
•Remote Controls
•Wireless Sensor Networks
®
The CC2650MOD is precertified for operation under the regulations of the FCC, IC, ETSI and ARIB.
These certifications save significant cost and effort for customers when integrating the module into their
products.
The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly
running on a separate ARM®Cortex®-M0 processor. This architecture improves overall system
performance and power consumption and makes more flash memory available.
The Bluetooth Smart and ZigBee stacks are available free of charge from www.ti.com.
PART NUMBERPACKAGEBODY SIZE
CC2650MODAMOHMOH (Module)16.90 mm × 11.00 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.
over operating free-air temperature range (unless otherwise noted)
VDDS Supply voltage–0.34.1V
Voltage on any digital pin
V
T
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) Including analog capable DIO.
5.2ESD Ratings
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Voltage on ADC input
in
Input RF level5dBm
Storage temperature–4085°C
stg
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ESD
Electrostatic discharge
(1)(2)
MINMAXUNIT
(3)
Voltage scaling enabled–0.3VDDS
Voltage scaling disabled, VDDS as reference–0.3VDDS / 2.9
Peripheral Current Consumption (Adds to core current I
I
peri
(1) I
is not supported in Standby or Shutdown.
peri
= 3.0 V with internal DC-DC converter, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAX UNIT
Reset. RESET_N pin asserted or VDDS below
Power-on-Reset threshold
Shutdown. No clocks running, no retention150
Standby. With RTC, CPU, RAM and (partial)
register retention. RCOSC_LF
Standby. With RTC, CPU, RAM and (partial)
register retention. XOSC_LF
Standby. With Cache, RTC, CPU, RAM and
Core current consumption
Peripheral power domainDelta current with domain enabled20µA
Serial power domainDelta current with domain enabled13µA
RF Core
µDMADelta current with clock enabled, module idle130µA
TimersDelta current with clock enabled, module idle113µA
I2CDelta current with clock enabled, module idle12µA
I2SDelta current with clock enabled, module idle36µA
SSIDelta current with clock enabled, module idle93µA
UARTDelta current with clock enabled, module idle164µA
(partial) register retention. RCOSC_LF
Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF
Idle. Supply systems and RAM powered.550
Active. Core running CoreMark
Radio RX6.1
Radio TX, 5-dBm output power9.1
Delta current with power domain enabled, clock
enabled, RF Core Idle
for each peripheral unit activated)
core
CC2650MOD
SWRS187 –AUGUST 2016
100
1
1.2
2.5
2.7
1.45 mA +
31 µA/MHz
(1)
237µA
nA
µA
mARadio TX, 0-dBm output power6.1
5.5General Characteristics
Tc= 25°C, V
FLASH MEMORY
Supported flash erase cycles before
failure
Flash page/sector erase currentAverage delta current12.6mA
Flash page/sector erase time
Flash page/sector size4KB
Flash write currentAverage delta current, 4 bytes at a time8.15mA
Flash write time
(1) This number is dependent on Flash aging and will increase over time and erase cycles
Blocking and desensitization,
5 MHz from upper band edge
Blocking and desensitization,
10 MHz from upper band edge
Blocking and desensitization,
20 MHz from upper band edge
Blocking and desensitization,
50 MHz from upper band edge
Blocking and desensitization,
–5 MHz from lower band edge
Blocking and desensitization,
–10 MHz from lower band edge
Blocking and desensitization,
–20 MHz from lower band edge
Blocking and desensitization,
–50 MHz from lower band edge
Spurious emissions,
30 MHz to 1000 MHz
Spurious emissions,
1 GHz to 12.75 GHz
Frequency error tolerance
RSSI dynamic range100dB
RSSI accuracy±4dB
www.ti.com
Differential mode, delivered to a single-ended 50-Ω load
through a balun
Measured on CC2650EM-4XS, delivered to a single-ended
50-Ω load
f < 1 GHz, outside restricted bands–43dBm
f < 1 GHz, restricted bands ETSI–65dBm
f < 1 GHz, restricted bands FCC–76dBm
f > 1 GHz, including harmonics–46dBm
Wanted signal at –82 dBm, modulated interferer at ±5 MHz,
PER = 1%
Wanted signal at –82 dBm, modulated interferer at ±10 MHz,
PER = 1%
Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4
modulated channel, stepped through all channels 2405 to
2480 MHz, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
Difference between center frequency of the received RF
signal and local oscillator frequency
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
(1)
f < 1 GHz, restricted bands ETSI–65
f < 1 GHz, restricted bands FCC–76
f > 1 GHz, including harmonics–46
dBm
5.13 24-MHz Crystal Oscillator (XOSC_HF)
Tc= 25°C, V
Crystal frequency24MHz
Crystal frequency tolerance
Start-up time
(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per
Bluetooth and IEEE 802.15.4 specification
(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection
= 3.0 V, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
(2)
(3)
5.14 32.768-kHz Crystal Oscillator (XOSC_LF)
Tc= 25°C, V
Crystal frequency32.768kHz
Crystal frequency tolerance, Bluetooth low
energy applications
= 3.0 V, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
5.15 48-MHz RC Oscillator (RCOSC_HF)
Tc= 25°C, V
Frequency48MHz
Uncalibrated frequency accuracy±1%
Calibrated frequency accuracy
Start-up time5µs
(1) Accuracy relatively to the calibration source (XOSC_HF).
= 3.0 V, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
(1)
(1)
–4040ppm
150µs
–250250ppm
±0.25%
5.16 32-kHz RC Oscillator (RCOSC_LF)
Tc= 25°C, V
Calibrated frequency32.8kHz
Temperature coefficient50ppm/°C
= 3.0 V and voltage scaling enabled, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Input voltage range0V
Resolution12Bits
Sample rate200ksps
OffsetInternal 4.3-V equivalent reference
Gain errorInternal 4.3-V equivalent reference
Differential nonlinearity>–1LSB
Integral nonlinearity±3LSB
Total harmonic
distortion
Signal-to-noise and
distortion ratio
SFDR
(1) Using IEEE Std 1241™-2010 for terminology and test methods.
(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24.
(4) For a typical example, see Figure 5-25.
(5) Applied voltage must be within absolute maximum ratings (Section 5.1) at all times.
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
9.6-kHz input tone
Internal 1.44-V reference, voltage scaling disabled, 32
samples average, 200 ksps, 300-Hz input tone
(2)
Equivalent fixed internal reference (input voltage
scaling enabled). For best accuracy, the ADC
conversion should be initiated through the TI-RTOS™
API in order to include the gain or offset compensation
factors stored in FCFG1.
Fixed internal reference (input voltage scaling
disabled). For best accuracy, the ADC conversion
should be initiated through the TI-RTOS API in order
to include the gain or offset compensation factors
stored in FCFG1. This value is derived from the scaled
value (4.3 V) as follows: V
= 4.3 V × 1408 / 4095
ref
VDDS as reference (Also known as RELATIVE) (input
voltage scaling enabled)
VDDS as reference (Also known as RELATIVE) (input
voltage scaling disabled)
200 ksps, voltage scaling enabled. Capacitive input,
input impedance depends on sampling frequency and
sampling time
DDS
2LSB
2.4LSB
9.8
11.1
–65
–71
60
69
67
73
0.66mA
(2)(5)
4.3
1.48V
VDDSV
VDDS /
(5)
2.82
>1MΩ
V
BitsVDDS as reference, 200 ksps, 9.6-kHz input tone10
dBVDDS as reference, 200 ksps, 9.6-kHz input tone–69
dBVDDS as reference, 200 ksps, 9.6-kHz input tone63
dBVDDS as reference, 200 ksps, 9.6-kHz input tone72
Resolution4°C
Range–4085°C
Accuracy±5°C
Supply voltage coefficient
(1) Automatically compensated when using supplied driver libraries.
= 3.0 V, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
(1)
3.2°C/V
5.19 Battery Monitor
Tc= 25°C, V
Resolution50mV
Range1.83.8V
Accuracy13mV
= 3.0 V, unless otherwise noted
DDS
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
5.20 Continuous Time Comparator
Tc= 25°C, V
Input voltage range0V
External reference voltage0V
Internal reference voltageDCOUPL as reference1.27V
Offset3mV
Hysteresis<2mV
Decision timeStep from –10 mV to +10 mV0.72µs
Current consumption when enabled
(1) Additionally the bias module needs to be enabled when running in standby mode.
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
The SimpleLink CC2650MOD Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs
the application and the higher layers of the protocol stack.
The CM3 processor provides a high-performance, low-cost platform that meets the system requirements
of minimal memory implementation, and low-power consumption, while delivering outstanding
computational performance and exceptional system response to interrupts.
CM3 features include:
•32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
•Outstanding processing performance combined with fast interrupt handling
•ARM Thumb®-2 mixed 16- and 32 bit instruction set delivers the high performance expected of a 32-bit
ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the
range of a few kilobytes of memory for microcontroller-class applications:
– Single-cycle multiply instruction and hardware divide
– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
– Unaligned data access, enabling data to be efficiently packed into memory
•Fast code execution permits slower processor clock or increases sleep mode time
•Harvard architecture characterized by separate buses for instruction and data
•Efficient processor core, system, and memories
•Hardware division and fast digital-signal-processing oriented multiply accumulate
•Saturating arithmetic for signal processing
•Deterministic, high-performance interrupt handling for time-critical applications
•Enhanced system debug with extensive breakpoint and trace capabilities
•Serial wire trace reduces the number of pins required for debugging and tracing
•Migration from the ARM7™ processor family for better performance and power efficiency
•Optimized for single-cycle flash memory use
•Ultra-low power consumption with integrated sleep modes
•1.25 DMIPS per MHz
www.ti.com
6.4RF Core
The RF Core contains an ARM®Cortex®-M0 processor that interfaces the analog RF and base-band
circuitries, handles data to and from the system side, and assembles the information bits in a given packet
structure. The RF core offers a high level, command-based API to the main CPU.
The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (802.15.4
RF4CE and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for
the user application.
The RF core has a dedicated 4KB SRAM block and runs initially from separate ROM memory. The ARM
Cortex-M0 processor is not programmable by customers.
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals
in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized
CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly
reducing power consumption and offloading the main CM3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and
typical use cases may be (but are not limited to):
•Analog sensors using integrated ADC
•Digital sensors using GPIOs and bit-banged I2C or SPI
•UART communication for sensor reading or debugging
•Capacitive sensing
•Waveform generation
•Pulse counting
•Keyboard scan
•Quadrature decoder for polling rotation sensors
•Oscillator calibration
The peripherals in the Sensor Controller include the following:
•The low-power clocked comparator can be used to wake the device from any state in which the
comparator is active. A configurable internal reference can be used in conjunction with the comparator.
The output of the comparator can also be used to trigger an interrupt or the ADC.
•Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take
care of baseline tracking, hysteresis, filtering and other related functions.
•The ADC is a 12-bit, 200 ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources, including timers, I/O pins, software, the analog
comparator, and the RTC.
•The Sensor Controller also includes a SPI/I2C digital interface.
•The analog modules can be connected to up to eight different GPIOs.
CC2650MOD
SWRS187 –AUGUST 2016
The peripherals in the Sensor Controller can also be controlled from the main application processor.
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system
programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two
4KB blocks and two 6KB blocks. Retention of the RAM contents in standby mode can be enabled or
disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,
the 8KB cache can be used as a general-purpose RAM.
Table 6-1. GPIOs Connected to the Sensor Controller
ANALOG CAPABLE16.9 × 11 MOH DIO NUMBER
Y14
Y13
Y12
Y11
Y9
Y10
Y8
Y7
N4
N3
N2
N1
N0
(1) Up to 13 pins can be connected to the Sensor Controller. Up to eight
of these pins can be connected to analog modules
(1)
The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack
software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that
can be used to reprogram the device using SPI or UART.
6.7Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface.
Sensor ControllerAvailableAvailableAvailableOffOff
Wake up on RTCAvailableAvailableAvailableOffOff
Wake up on pin edgeAvailableAvailableAvailableAvailableOff
Wake up on reset pinAvailableAvailableAvailableAvailableAvailable
Brown Out Detector (BOD)ActiveActiveDuty Cycled
Power On Reset (POR)ActiveActiveActiveActiveN/A
(1) Not including RTOS overhead
(2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold
between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases
it. To avoid this, it is recommended that STANDBY mode is avoided if there is a risk that the supply voltage (VDDS) may drop below the
specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a
battery replacement, triggers a Power-on-reset by ensuring that the VDDS decoupling network is fully depleted before applying supply
voltage again (for example, inserting new batteries).
(1)
ACTIVEIDLESTANDBYSHUTDOWN
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
SOFTWARE CONFIGURABLE POWER MODES
–14 µs151 µs1015 µs1015 µs
XOSC_HF or
RCOSC_HF
XOSC_LF or
RCOSC_LF
OffOffOff
XOSC_LF or
RCOSC_LF
(2)
OffOff
OffN/A
RESET PIN
HELD
In active mode, the application CM3 CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or
sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention
do not need to be reconfigured when waking up again, and the CPU continues execution from where it
went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.
The I/Os are latched with the value they had before entering shutdown mode. A change of state on any
I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The
CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the
reset status register. The only state retained in this mode is the latched I/O state and the Flash memory
contents.
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the main CPU, which means that the main CPU does not have to wake up, for
example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current
and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to
configure the sensor controller and choose which peripherals are controlled and which conditions wake up
the main CPU.
6.9Clock Systems
The CC2650MOD device supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed
crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal
oscillator is not used.
www.ti.com
The 32-kHz clock source can be used as external clocking reference through GPIO.
6.10 General Peripherals and Modules
The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals
to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a
programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five
GPIOs have high-drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's
synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps .
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be
configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring
oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
The watchdog timer is used to regain control if the system fails due to a software error after an external
device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a
predefined time-out value is reached.
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the
available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The
µDMA controller has dedicated channels for each supported on-chip module and can be programmed to
automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
•Highly flexible and configurable channel operation of up to 32 channels
•Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-
•Data sizes of 8, 16, and 32 bits
CC2650MOD
SWRS187 –AUGUST 2016
peripheral
The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital
supply is off). This circuitry includes the following:
•The RTC can be used to wake the device from any state where it is active. The RTC contains three
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
•The battery monitor and temperature sensor are accessible by software and give a battery status
indication as well as a coarse temperature measure.
Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as
a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the
device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
6.12 Certification
The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable):
6.12.1 Federal Communications Commission Statement
You are cautioned that changes or modifications not expressly approved by the part responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. This device may not cause harmful interference and
2. This device must accept any interference received, including interference that may cause undesired
operation of the device.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End
users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter
must not be colocated or operating in conjunction with any other antenna or transmitter.
This device complies with Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired operation of
the device
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must not be co-located or
operating in conjunction with any other antenna or transmitter.
Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne
ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.
CC2650MOD
SWRS187 –AUGUST 2016
6.13 End Product Labeling
This module is designed to comply with the FCC statement, FCC ID : ZAT26M1. The host system using
this module must display a visible label indicating the following text:
"Contains FCC ID: ZAT26M1"
This module is designed to comply with the IC statement, IC : 451H-26M1. The host system using this
module must display a visible label indicating the following text:
"Contains IC: 451H-26M1"
6.14 Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as shown in this manual.
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1Application Information
7.1.1Typical Application Circuit
No external components are required for the operation of the CC2650MOD device. Figure 7-1 shows the
application circuit.
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2650MOD is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
XExperimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
PPrototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
nullProduction version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
CC2650MOD
SWRS187 –AUGUST 2016
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, MOH).
For orderable part numbers of CC2650MOD devices in the MOH package type, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules.
The following products support development of the CC2650MOD device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at
an early stage in the design process.
•Test functions for sending and receiving radio packets, continuous wave transmit and receive
•Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
•Can also be used without any hardware, but then only to generate, edit and export radio configuration
settings
•Can be used in combination with several development kits for TI's CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The
Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple
background tasks autonomously and independent of the System CPU state.
•Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
•Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller
machine code and associated definitions
•Allows for rapid development by using the integrated Sensor Controller task testing and debugging
functionality. This allows for live visualization of sensor data and algorithm verification.
www.ti.com
IDEs and Compilers:
Code Composer Studio:
•Integrated development environment with project management tools and editor
•Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
•Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
•High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
•Integrated development environment with project management tools and editor
•IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
•Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
•Integrated development environment with project management tools and editor
•RTOS plugin is available for TI-RTOS
For a complete listing of development-support tools for the CC2650MOD platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online CommunityTI's Engineer-to-Engineer (E2E)Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
8.4Texas Instruments Low-Power RF Website
TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news
and events updates. Go to www.ti.com/lprf.
CC2650MOD
SWRS187 –AUGUST 2016
8.5Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online CommunityTI's Engineer-to-Engineer (E2E)Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
•Forums, videos, and blogs
•RF design help
•E2E interaction
Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The
network consists of recommended companies, RF consultants, and independent design
houses that provide a series of hardware module products and design services, including:
•RF circuit, low-power RF, and ZigBee design services
•Low-power RF and ZigBee module solutions and development tools
•RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
SearchtheLow-PowerRFDeveloperNetworktofindasuitablepartner.
www.ti.com/lprfnetwork
www.ti.com
8.7Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various
software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.8Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SmartRF, Code Composer Studio, SimpleLink, TI-RTOS, E2E are trademarks of Texas Instruments.
ARM7 is a trademark of ARM Limited.
ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries).
ARM Thumb is a registered trademark of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.11 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9Mechanical Packaging and Orderable Information
CC2650MOD
SWRS187 –AUGUST 2016
9.1Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
ProductsApplications
Audiowww.ti.com/audioAutomotive and Transportationwww.ti.com/automotive
Amplifiersamplifier.ti.comCommunications and Telecomwww.ti.com/communications
Data Convertersdataconverter.ti.comComputers and Peripheralswww.ti.com/computers
DLP® Productswww.dlp.comConsumer Electronicswww.ti.com/consumer-apps
DSPdsp.ti.comEnergy and Lightingwww.ti.com/energy
Clocks and Timerswww.ti.com/clocksIndustrialwww.ti.com/industrial
Interfaceinterface.ti.comMedicalwww.ti.com/medical
Logiclogic.ti.comSecuritywww.ti.com/security
Power Mgmtpower.ti.comSpace, Avionics and Defensewww.ti.com/space-avionics-defense
Microcontrollersmicrocontroller.ti.comVideo and Imagingwww.ti.com/video
RFIDwww.ti-rfid.com
OMAP Applications Processorswww.ti.com/omapTI E2E Communitye2e.ti.com
Wireless Connectivitywww.ti.com/wirelessconnectivity