The integrated circuit, U208B, is designed as a phase control circuit in bipolar technology with internal
supply-voltage monitoring. As the voltage is built up, uncontrolled output pulses are avoided by internal
Features
D
Automatic retriggering
D
Triggering pulse typ. 125 mA
D
Voltage and current synchronisation
U208B
monitoring. Furthermore, it has internal-current and voltage synchronisation. It is recommended as a low cost
open-loop control.
D
Internal supply voltage monitoring
D
Current requirement ≤ 2.5 mA
Package: DIP8
Block Diagram
220 kW/
0.5 W
4
R
2
180 k
W
R
6
18 k
W
100 k
120 k
W
R
5
W
6
R
3
7
Voltage
detector
R
4
470 kW/
0.5 W
8
Current
detector
Phase
control unit
ö
= f (V6)
Automatic
retriggering
Output
pulse
Supply
voltage
limitation
Voltage
monitoring
95 11224
V
=
M
230 V ~
N
L
D
BYT77
18 kW/
2 W
R
10 nF
C
2
–V
GND
S
180
7
W
C
3
5
2
1
1
M
R
1
TIC
236N
22 mF/
1
25 V
TELEFUNKEN Semiconductors
Rev . A1, 28-May-96
Figure 1. Block diagram for simple phase control system
1 (7)
U208B
Description
Mains Supply
The U208B is fitted with voltage limiting and can therefore be supplied directly from the mains. The supply
voltage between Pin 1 (+ pol/ă) and Pin 2 builds up
and R
across D
1
series resistance can be approximated using figure 1:
+
R
1
Further information regarding the design of the mains
supply can be found in the data sheets in the appendix.
Operation using an externally stabilized DC voltage is not
recommended.
If the supply cannot be taken directly from the mains
because the power dissipation in R
then the circuit shown in the following figure 2 should be
employed.
~
24 V~
and is smoothed by C1. The value of the
1
VM–V
S
2I
S
would be too large,
1
123
4
5
When the potential on Pin 5 reaches the given value of
Pin 6, then a trigger pulse is generated whose width t
determined by the value of C
(the value of C
2
and hence
2
is
p
the pulse width can be evaluated by assuming 8 ms/nF).
The current sensor on Pin 8 ensures that, for operation
with inductive loads, no pulse will be generated in a new
half cycle as long as the current from the previous half
cycle is still flowing in the opposite direction to the supply voltage at that instant. This makes sure that ”Gaps” in
the load current are prevented. The control signal on Pin
6 can be in the range 0 V to –7 V (reference point Pin 1).
If V
= –7 V then the phase angle is at maximum =
pin6
a
max
i.e., the current flow angle is a minimum. The minimum
phase angle
a
min
is when V
pin6
= V
pin1
.
Voltage Monitoring
As the voltage is built up, uncontrolled output pulses are
avoided by internal voltage surveillance. At the same
time, all of the latches in the circuit are reset. Used with
a switching hysteresis of 300 mV, this system guarantees
defined start–up behavior each time the supply voltage is
switched on ,or after short interruptions of the mains
supply.
Pulse Output Stage
C
R
1
Figure 2. Supply voltage for high current requirements
1
95 10362
Phase Control
The function of the phase control is largely identical to
that of the well known component TEA1007. The phase
angle of the trigger pulse is derived by comparing the
ramp voltage, which is mains synchronized by the voltage
detector, with the nominal value predetermined at the
control input Pin 6. The slope of the ramp is determined
and its charging current. The charging current can
by C
2
be varied using R
can also be adjusted using R2.
a
max
on Pin 4. The maximum phase angle
2
The pulse output stage is short circuit protected and can
typically deliver currents of 125 mA. For the design of
smaller triggering currents, the function I
= f (RGT) has
GT
been given in the data sheets in the appendix. In contrast
to the TEA1007, the pulse output stage of the U 208 B has
no gate bypass resistor.
Automatic Retriggering
The automatic retriggering prevents half cycles without
current flow, even if the triacs is turned of f earlier e.g. due
to a collector which is not exactly centered (brush lifter)
or in the event of unsuccessful triggering. If it is necessary, another triggering pulse is generated after a time
lapse of t
triac fires or the half cycle finishes.
= 4.5 tp and this is repeated until either the
pp
2 (7)
TELEFUNKEN Semiconductors
Rev . A1, 28-May-96
General Hints and Explanation of Terms
q
To ensure safe and trouble–free operation, the following
points should be taken into consideration when circuits
are being constructed or in the design of printed circuit
boards.
Mains
Supply
U208B
V
p
/2
p
3/2
95 10716
p
2
p
D
The connecting lines from C
to Pin 5 and Pin 1 should
2
be as short as possible, and the connection to Pin 1
should not carry any additional high current such as
e.g. the load current.
D
When selecting C
, a low temperature coefficient is
2
Trigger
Pulse
desirable.
Load
Voltage
Load
Current
Absolute Maximum Ratings
Reference point Pin 1, unless otherwise specified
ParametersSymbolValueUnit
Current requirementPin 2–I
t ≤ 10 ms
Synchronisation currentPin 8
Pin 7
t < 10 msPin 8
t < 10 msPin 7
Phase control
Input voltagePin 6
Input currentPin 6
Pin 4
Power dissipation
T
= 45°C
amb
T
= 80°C
amb
Storage temperature rangeT
Junction temperatureT
Ambient temperature rangeT
V
GT
t
p
V
L
I
L
Figure 3. Explanation of terms in phase relationship
= 25 °C, reference point pin 1, unless otherwise specified
amb
Pin 2–V
–I
= 30 mA
S
"
II = 5 mAPin 8
Pin 7
Pin 3
= 10 nFPin 5-1t
R
thJA
S
–V
S
S
SON
SOFF
sync.I
sync.V
"
V
"
V
5
Ref
VRef
I
o
or
p
pp
120
220
140
13.0V
14.6
14.7
1.02.22.5mA
11.213.0V
9.910.9V
0.353.5mA
0.353.5mA
I
I
8.0
8.0
8.9
8.9
120
1.061.131.18V
–0.5mV/K
100125150mA
0.013.0
80
34.56t
Limit
16.6
16.8
9.5
9.5
K/W
V
V
V
A
A
s
p
4 (7)
TELEFUNKEN Semiconductors
Rev . A1, 28-May-96
U208B
240
200
°
160
120
Phase Angle ( )
80
0
95 10302
6
5
4
3
(R1)
P ( W )
2
1
0
95 10317
Phase Control
Reference Point Pin 2
10nF4.7nF
2.2nF
C
=1.5nF
/t
00.20.40.60.8
R ( M )
Figure 4.
Mains Supply
03 6 912
I
( mA )
tot
Figure 5.
1.0
15
(R1)
P ( W )
95 10316
GT
I ( mA )
95 10313
6
5
Mains Supply
4
3
2
1
0
0102030
( k )
R
1
Figure 6.
100
Pulse Output
80
60
40
1.4V
20
0
0200400600800
V
GT
= 0.8V
RGT ( )
40
1000
Design Calculations for Mains Supply
The following equations can be used for evaluating the
series resistor R
+
1max
1min
+
0.85
V
R
R
where:
= Mains voltage
V
M
= Supply voltage on Pin 4
V
S
= T otal DC current requirement of the circuit
I
tot
=I
+ Ip + I
S
IS= Current requirement of the IC in mA
= Average current requirement of the triggering
I
p
pulses
= Current requirement of other peripheral
I
x
components
can be easily evaluated from figures 6 and 8
R
1
TELEFUNKEN Semiconductors
Rev . A1, 28-May-96
for worst case conditions:
1
V
–V
Mmax
2I
–V
Smax
x
Mmin
Mmin
2I
Smax
tot
P(
R1max
–V
(V
Mmax
)
+
2R
)
Smin
1
Figure 7.
50
40
2
30
1
R ( k )
20
10
0
04812
95 10315
Mains Supply
I
( mA )
tot
16
Figure 8.
5 (7)
U208B
Application
L
230 V~
N
TIC
236N
M
22 mF/
1N4004
R
4
470 k
W
25 V
D
1
R
1
18 k
1.5 W
C
R
3
220 k
W
W
/
1 mF/
25 V
8
7
U208B
123
1
R
5
47 k
W
C
2
3.3 nF/
C
3
63 V
65
4
R
2
470 k
R
15
100 k
W
W
R
150 k
95 11225
6
W
Dimensions in mm
Package: DIP8
Figure 9. Phase control (power control) for electric tools
94 8873
6 (7)
TELEFUNKEN Semiconductors
Rev . A1, 28-May-96
U208B
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It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol ( 1987) and its London Amendments (1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or