Telit Wireless Solutions ZE51-2.4, ZE61-2.4 User Manual

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ZE51/61-2.4 RF Module User Guide

1VV0300868 Rev.4 – 23/06/2011

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ZE51/61-2.4 RF module User G uide

1VV0300868 Rev.4 – 23/06/2011

ZE51/61-2.4 RF Module User Guide

1VV0300868 Rev.4 – 23/06/2011

DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this document.

Copyright: Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights are reserved.

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CONTENTS

CHAPTER I. INTRODUCTION ................................................................................................................... 6

I.1. AIM OF THE DOCUMENT .................................................................................................................................................................................... 6

I.2. CONTACT INFORMATION, SUPPORT .................................................................................................................................................................. 6

I.3. REFERENCE DOCUMENTS ................................................................................................................................................................................. 7

I.4. DOCUMENT CHANGE LOG ................................................................................................................................................................................. 7

I.5. GLOSSARY ...................................................................................................................................................................................................... 8

CHAPTER II. REQUIREMENTS ................................................................................................................ 9

II.1. REGULATIONS REQUIREMENTS ........................................................................................................................................................................ 9

II.2. FUNCTIONAL REQUIREMENTS........................................................................................................................................................................ 12

II.3. SOFTWARE .................................................................................................................................................................................................. 12

II.4. TEMPERATURE REQUIREMENTS .................................................................................................................................................................... 13

CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14

III.1. MECHANICAL CHARACTERISTICS ................................................................................................................................................................. 14

III.2. MECHANICAL DIMENSIONS ........................................................................................................................................................................... 15

III.3. DC CHARACTERISTICS ................................................................................................................................................................................ 16

III.4. FUNCTIONAL CHARACTERISTICS .................................................................................................................................................................. 17

III.5. DIGITAL CHARACTERISTICS ......................................................................................................................................................................... 20

III.6. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................................... 21

III.7. ORDERING INFORMATION ............................................................................................................................................................................ 22

CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 23

IV.1. PIN-OUT OF THE SMD MODULE .................................................................................................................................................................... 23

IV.2. DIP MODULE MECHANICAL DIMENSIONS AND PIN-OUT ................................................................................................................................... 25

IV.3. PIN-OUT CORRESPONDENCE TABLE .............................................................................................................................................................. 26

IV.4. DESCRIPTION OF THE SIGNALS ..................................................................................................................................................................... 27

CHAPTER V. PROCESS INFORMATION ............................................................................................... 28

V.1. DELIVERY ..................................................................................................................................................................................................... 28

V.2. STORAGE ..................................................................................................................................................................................................... 29

V.3. SOLDERING PAD PATTERN ............................................................................................................................................................................. 29

V.4. SOLDER PASTE COMPOSITION (ROHS PROCESS) ........................................................................................................................................... 31

V.5. PLACEMENT .................................................................................................................................................................................................. 31

V.6. SOLDERING PROFILE (ROHS PROCESS) ......................................................................................................................................................... 32

CHAPTER VI. BOARD MOUNTING RECOMMENDATION ..................................................................... 34

VI.1. ELECTRICAL ENVIRONMENT .......................................................................................................................................................................... 34

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VI.2. POWER SUPPLY DECOUPLING ON ZE51/61-2.4 MODULE ............................................................................................................................... 35

VI.3. RF LAYOUT CONSIDERATIONS ...................................................................................................................................................................... 36

VI.4. ANTENNA CONNECTION ON PRINTED CIRCUIT BOARDS ................................................................................................................................. 37

VI.5. ZE51/61-2.4 INTERFACING : ........................................................................................................................................................................ 38

CHAPTER VII. ANTENNA CONSIDERATIONS....................................................................................... 41

VII.1. ANTENNA RECOMMENDATIONS ................................................................................................................................................................... 41

VII.2. ANTENNA MATCHING .................................................................................................................................................................................. 42

VII.3. ANTENNA TYPES ........................................................................................................................................................................................ 43

VII.4. EXTERNAL ANTENNA .................................................................................................................................................................................. 43

VII.5. EMBEDDABLE ANTENNAS ............................................................................................................................................................................ 45

CHAPTER VIII. ANNEXES ....................................................................................................................... 48

VIII.1. DECLARATION OF CONFORMITY ................................................................................................................................................................ 48

VIII.2. CONFORMITY ASSESSMENT ISSUES FCC/IC.............................................................................................................................................. 52

VIII.3. EXAMPLES OF PROPAGATION ATTENUATION ............................................................................................................................................... 53

VIII.4. OUTPUT POWER PROGRAMMING................................................................................................................................................................ 54

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CHAPTER I. INTRODUCTION

I.1. Aim of the Document

The aim of this document is to present the features and the application of the ZE51/61-2.4 radio module. After the introduction, the characteristics of the ZE51/61-2.4 radio module will be described within the following distinct chapters:

- Requirements

- General Characteristics

- Technical description

- Process information

- Board Mounting Recommendations

- Antenna Considerations

I.2. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at:

TS-SRD@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.

I.3. Reference documents

[1] IEEE Std. 802.15.4-2006

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Wireless MAC and PHY Specifications for Low Rate - WPANs

[2] ERC Rec 70-03 [3] EN 300 328-1 V1.7.1 (Europe) [4] EN 300 440-1 V1.6.1 (Europe) [5] 2002/95/EC

[6] CFR47 Part 15 (US) [7] ARIB STD-T66 (Japan) [8] Z-One Pro Protocol Stack User

Guide [9] 2006/771/EC [10] 2009/381/EC

[11] SR Manager Tool User Guide [12] ZigBee PRO Democase Getting

Started [13] ZigBee PRO Democase User Guide

ERC Recommendation for SRD, October 2010

ETSI Standards for SRD , October 2006

ETSI Standards for SRD , August 2010

Directive of the European Parliament and of the Council, 27 January

2003

FCC Standards for SRD

ARIB Standards for SRD

1vv0300902

Harmonization of the radio spectrum for use by short-range devices

Amending Decision 2006/771/EC on harmonization of the radio

spectrum for use by short-range devices

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1vv0300901

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I.4. Document change log

RReevviissiioonn DDaattee

ISSUE # 0 11/05/10 First Release ISSUE # 1 28/07/10 Added ZE61-2.4 ISSUE # 2 04/02/11 Updated regulation requirements and schematics in VI.5 ISSUE # 3 14/03/11 Added link for ZE51 USB dongle drivers, info regarding CC debugger.

ISSUE # 4 23/05/11 Added text regarding Conformity Assessment Issues FCC/IC and

CChhaan

Added in Annex paragraph regarding Conformity Assessment Issues FCC/IC and Declaration of conformity

FCC/IC Certification Update of Reference documents, DC characteristics, Functional characteristics, Absolute maximum ratings, DIP module mechanical dimensions and pin-out labels, Correspondence table and Antenna matching

dded ZE61-2.4/DIP board radiation pattern

geess

(

)

(

))

I.5. Glossary

ARIB BER Bits/s CEPT CFR Chips

CW dBm DSSS EIRP EMC EPROM ERC ETR ETSI Technical Report ETSI FCC IEEE Institute of Electrical and Electronics Engineers ISM KB

bps kilobits/s LBT LNA MAC Medium Access Control MHz Mchip/s

PCB PROM PER PHY NRZ RF RoHS RSSI Rx SRAM SRD SMD Tx

ia WPANs

Association of Radio Industries and Businesses Bit Error Rate Bits per second European Conference of Postal and Telecommunications Administrations Code of Federal Regulations Chip or chip sequence refers to a spreading-code used to transform the original data to DSSS Continuous Wave Power level in decibel milliwatt Direct Sequence Spread Spectrum Effective Isotropic Radiated Power Electro Ma Electrical Programmable Read Only Memory European Radiocommunications Committee

European Telecommunication Standard Institute Federal Communications Commission

Industrial, Scientific and Medical 1024 bytes (1 byte = 8 bits)

Listen Before Talk Low Noise Amplifier

Mega Hertz (1 MHz = 1000 kHz) Mega chips per second (A measure of the speed with which chips are generated in DSSS) Printed Circuit Board Programmable Read Only Memory Packet Error Rate Physical Layer Non return to Zero Radio Frequency Restriction of Hazardous Substances Receive Strength Signal Indicator Reception Static Random Access Memory Short Range Device Surface Mounted Device Transmission Metal Hole on a printed circuit board Wireless Personal Area Networks

1000 bits/s = 1Kbps = 1Kbaud

10 log (P/1mW

netic Compatibilit

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ZE51/61-2.4 RF Module User Guide

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CHAPTER II. REQUIREMENTS

II.1. Regulations requirements

The ZE51/61-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed

frequency band).

Europe Regulation:

The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth, maximum power, duty cycle, channel spacing and type of application. It gives the following limitations:

Class Frequency

band

Annex 1h

(Non-Specific

Short range

Devices)

Annex 3a

(Wideband Data

Transmission

systems)

(*) Compliant to the EU Commission Decision [9], [10]. Techniques to access spectrum and mitigate interference

that provide at least equivalent performance to the techniques described in harmonized standards adopted under

Directive 1999/5/EC must be used.

2400 – 2483.5

MHz

2400 – 2483.5

MHz

Maximum radiated power Channel

spacing

No channel

10 mW e.i.r.p.

100 mW e.i.r.p. and 100

mW/100 kHz e.i.r.p. density

applies when frequency

hopping modulation is used,

10 mW/MHz e.i.r.p. density

applies when other types of

modulation are used.(*)(**)

spacing

specified

No channel

spacing

specified.

Duty cycle Notes

restriction

For wide band

restriction

modulations other than FHSS, the maximum e.i.r.p. density is limited to 10 mW/MHz

 

(**) For IEEE802.15.4 DSSS modulation used by ZigBee, the modulated signal is spread over 2MHz. So, the maximum radiated power is 20mW. The output power must therefore be reduced to approximately +13 dBm in order to get CE approval. The final output power level will depend on the antenna used.

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Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz:

Country Restriction Reason/Remark

This subsection does not apply for the

Norway Implemented

Russian

Federation

Bluetooth

geographical area within a radius of 20 km

from the centre of N

-Ålesund

Ukraine Limited implementation e.i.r.p. ≤100 mW

Restrictions for Wideband Data Transmission systems Annex 3a 2400-2483.5MHz:

Country Restriction Reason/Remark

Military Radiolocation use. Reforming of

Outdoor use limited to 10

France

mW e.i.r.p. within the band 2454-2483.5 MHz

Italy

Ukraine Limited Implemented

Norway Implemented

Russian

Federation

the 2.4 GHz band has been ongoing in recent years to allow current relaxed regulation. Full implementation planned 2012 For private use, a general authorisation is required if WAS/RLAN’s are used outside own premises. For public use, a general authorization is required

e.i.r.p. ≤100 mW with built-in antenna with amplification factor up to 6 dBi

This subsection does not apply for the

geographical area within a radius of 20 km

from the centre of Ny-Ålesund

1. SRD with FHSS modulation

1.1. Maximum 2.5 mW e.i.r.p.

1.2. Maximum 100 mW e.i.r.p. Permitted for use SRD for outdoor applications without restriction on installation height only for purposes of gathering telemetry information for automated monitoring and resources accounting systems. Permitted to use SRD for other purposes for outdoor applications only when the installation height is not exceeding 10 m above the ground surface.

1.3.Maximum 100 mW e.i.r.p. Indoor applications

2. SRD with DSSS and other than FHSS wideband modulation

2.1. Maximum mean e.i.r.p. density is 2 mW/MHz. Maximum 100 mW e.i.r.p.

2.2. Maximum mean e.i.r.p. density is 20 mW/MHz. Maximum 100 mW e.i.r.p. Permitted to use SRD for outdoor applications only for purposes of gathering telemetry information for automated monitoring and

ZE51/61-2.4 RF Module User Guide

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resources accounting systems or security systems.

2.3. Maximum mean e.i.r.p. density is 10 mW/MHz. Maximum 100 mW e.i.r.p. Indoor applications

For the complete document please refer to [2

] and EU Commission Decision [9], [10].

The 2.4 Ghz band is a harmonized band in most of Europe. So the product must be declared in compliance with the harmonized ETSI standards EN 300 440 (Class 1h) or EN 300 228 (Class 3a).

Finally, the module complies with the new European Directive 2002/95/EC concerning the Restrictive Usage of Hazardous Substances (RoHS).

USA Regulation:

In the United States the FCC is responsible for the regulation of all RF devices. Our module intended for unlicensed operation is regulated by CFR 47, Part 15 [6]. The 2.4 GHz band used for unlicensed radio equipment is regulated by section 15.247.

Japan regulation

In Japan the unlicensed use of short range devices in the 2.4 GHz ISM band is regulated by the ARIB standard STD-T66 [7].

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II.2. Functional Requirements

The ZE51/61-2.4 module is a complete solution from serial interface to RF interface. The ZE51/61-2.4 module has a digital part and a RF part.

The digital part has the following functionalities:

- Communication interface

- I/O management

- Micro controller with embedded software

The RF part has the following functionalities:

- 2.4 GHz IEEE 802.15.4 compliant RF transceiver

- Half Duplex bi-directional link

- RF front-end component with low noise Rx amplification and Tx power amplification (ZE61-2.4 module

only)

II.3. Software

The ZE51/61-2.4 module is provided pre-flashed with Telit in-house ZigBee® PRO stack. Please refer to ZigBee PRO Protocol Stack User Guide [8] for detail information.

In case the customer needs to develop his own software, different tools are available:

 8051 compiler from IAR : http://www.iar.se/website1/1.0.1.0/244/1/

 CC debugger: http://focus.ti.com/docs/toolsw/folders/print/cc-debugger.html

The technical support for these tools will be done by the providing company.

All necessary drivers for ZE51-2.4 Usb dongle can be found under the following link:

http://www.ftdichip.com/Drivers/VCP.htm

A complete correspondence table of the connections between the CC2530 and the pin out of the module, as well as the connections to the included STM M24C64 EEPROM can be found in chapter IV.3.

 In case, the customer wants to test the RF performances of the module, Telit can provide its own

proprietary test software that is available in the download zone together with description of all the functionalities.

II.4. Temperature Requirements

Minimum Typical Maximum Unit

Operating

Temperature - 40 25 + 85 °C

Relative humidity @ 25°C 20 75 %

Storage

Temperature - 40 25 + 85 °C

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CHAPTER III. GENERAL CHARACTERISTICS

III.1. Mechanical Characteristics

Size : Rectangular 26 x 15 mm

Height : 3 mm

Weight : 1,7 g

PCB thickness: 0.8 mm

Cover :

Components : All SMD components, on one side of the PCB.

Connectors : The terminals allowing conveying I/O signals are half-moons located around.

Mounting :

Number of pins : 30

 Dimensions : 21 x 14 x 2.2mm  Thickness : 200µm

 SMD  Half moons on the 4 external sides

III.2. Mechanical dimensions

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III.3. DC Characteristics

Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else noted. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2V to 3.6V and all channels.

Characteristics ZE51 Min. Typ. Max.

Power Supply (V

DD):

+2.0V +3.6V

Transmission :

Reception :

Stand-by (32.768 khz On) :

Sleep (wake up on

interruption) :

35mA 39mA*

26mA 29mA

2µA 2.7µA

1µA

I/O low level : GND - 0.9 V

I/O high level : V

- 0.7V - VDD

Characteristics ZE61 Min. Typ. Max.

Power Supply (V

DD):

Transmission :

Reception :

Stand-by (32.768 khz On) :

Sleep (wake up on

interruption) :

+2.0V +3.6V

160mA 195mA*

31mA 33mA

2,2µA 2.9µA

1,5µA

I/O low level : GND - 0.9 V

I/O high level : V

- 0.7V - VDD

* : Maximum Tx consumption is reached for T= -40°C , Vdd=3.6 Volts and default power register setting. In this condition, the ZE61 RF output power achieves until 21dBm.

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III.4. Functional characteristics

Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else noted.

Global

Frequency band 2400 - 2483.5 MHz

Channel spacing 5 MHz

Channel number

16 : Channel 11 (2405MHz)  Channel 26 (2480MHz)

Technology DSSS

Modulation O-QPSK with half sine pulse shaping

Radio bit rate 250 kbps

Transmit chip rate 2 Mchip/s

Transmission ZE 5 1 Min. Typ. Max.

Output Power +4dBm ± 1 dB on the whole band

(selectable by software )

Harmonics

2 3

harmonic

Spurious emission 30 - 1000 MHz

1 - 12.75 GHz

1.8 - 1.9 GHz

5.15 - 5.3 GHz

-45 dBm

-59 dBm

-36 dBm

-30 dBm

-47 dBm

(Complies with [3], [4],

[6],[7])

Error Vector Magnitude (EVM)

5% 15%

Transmission ZE 6 1 Min. Typ. Max.

Output Power* +19dBm ± 1 dB on the whole band

(selectable by software )

Harmonics

2 3

harmonic

Spurious emission 30 - 1000 MHz

1 - 12.75 GHz

1.8 - 1.9 GHz

5.15 - 5.3 GHz

-42 dBm

-44 dBm

-36 dBm

-30 dBm

-47 dBm

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(Complies with [3], [4],

[6], [7])

Error Vector Magnitude (EVM)

5% 15%

* : It’s the responsibility of Telit customers to check that RF output power of the final product is compliant with the local regulation. See the table in chapter VIII.5 which shows the typical output power for different power settings.

Reception ZE51 Min. Typ. Max.

Sensitivity for PER=1% - -96 dBm -97 dBm

Saturation for PER=1% - 10 dBm -

Adjacent channel

- 49 dB -

rejection +/- 5 MHz channel spacing

Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 5 MHz,

for PER = 1 %.

Alternate channel

- 54 dB -

rejection +/- 10 MHz channel spacing

Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 10 MHz,

for PER = 1 %.

Blocking/Desensitisation @ ±5MHz

@ ±10MHz @±20MHz @±50MHz

- 40 dBm

- 35 dBm

- 38 dBm

- 37 dBm

Spurious emission in 30 MHz - 12.75 GHz

Wanted signal 3 dB above the sensitivity level, CW jammer,

for PER = 1%.

(Measured according to EN 300 440 class 2)

- - -47 dBm (Complies with [3], [4],

[6],[7])

ZE51/61-2.4 RF Module User Guide

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Reception ZE61 Min. Typ. Max.

Sensitivity for PER=1% - -99 dBm -100dBm

Saturation for PER=1% - 0 dBm -

Adjacent channel rejection +/- 5 MHz channel spacing

Alternate channel rejection +/- 10 MHz channel spacing

Blocking/Desensitisation @ ±5MHz

@ ±10MHz @±20MHz @±50MHz

Spurious emission in 30 MHz - 12.75 GHz

- 49 dB -

Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 5 MHz,

for PER = 1 %.

- 54 dB -

Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 10 MHz,

for PER = 1 %.

- 35 dBm

- 33 dBm

- 35 dBm

Wanted signal 3 dB above the sensitivity level, CW jammer,

for PER = 1%.

(Measured according to EN 300 440 class 2)

- - -47 dBm (Complies with [3], [4],

[6],[7])

III.5. Digital Characteristics

Microcontroller 8051 core

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Microcontroller Memory

Peripheral memory 8 KB EEPROM

Serial link* Managed by application.

Flow control* Managed by application.

Other Ultra low power voltage detector and µC supervisory circuit

Specific signals

Flashing

Embedded functionality

256KB Flash, 8KB SRAM,

 Full Duplex, from 1200 to 115200 bps  7 or 8 bits, with or without parity, 1 or 2 stop bits  Protocol Type : RS-232, TTL level

None, Software (Xon/Xoff) or Hardware (RTS/CTS)

 Serial : Tx, Rx, RTS, CTS  Inputs : Reset, Stand-By, Prog  I/O : 7 I/O (among those 5 analog inputs with 7 to 12 bits resolution)

 Through serial  Through the air : DOTA (Download Over The Air) functionality

 Point-to-point stack for test purpose available in download zone  ZigBee Pro stack from Telit

*: In ZigBee Democase : 115.200 bps,8 bits, without parity, 1 stop bit, No flow control

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III.6. Absolute Maximum Ratings

ZE51

Voltage applied to VDD -0.3V to +3.9V

Voltage applied to any digital pin

Input RF level

-0.3V to V

+0.3V, max 3.9 V

10 dBm

ZE61

Voltage applied to VDD -0.3V to +3.6V

Voltage applied to any digital pin

-0.3V to V

+0.3V, max 3.6 V

Input RF level

CAUTION

It must be noted that due to some components, ZE51/ZE61 module is

an ESD sensitive device. Therefore, ESD handling precautions should

be carefully observed.

0 dBm

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III.7. Ordering information

The following equipments can be ordered:

- The SMD version

- The DIP interface version

- The USB dongle

- The Demo Case

The versions below are considered standard and should be readily available. For other versions, please contact Telit. Please make sure to give the complete part number when ordering.

Equipment and Part Number

SMD Version

ZE51/61-2.4/SMD-IA (With Integrated Antenna) ZE51/61-2.4/SMD-WA (Without Integrated Antenna)

DIP Version

ZE51/61-2.4/DIP-IA (With Integrated Antenna) ZE51/61-2.4/DIP-WA (Without Integrated Antenna)

USB Dongle

M ZE51/USB

Demo Case

D ZE51/61 DEMO

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CHAPTER IV. TECHNICAL DESCRIPTION

IV.1. Pin-out of the SMD Module

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Pin Pin name Pin type Signal level Function

J30 GND Gnd RF Ground connection for external antenna J29 Ext_Antenna RF RF I/O connection to external antenna J28 GND Gnd RF Ground connection for external antenna J27 GND Gnd Ground J26 GND Gnd Ground J25 VDD Power Digital and Radio part power supply pin J24 CTS I TTL Clear To Send J23 RESET I TTL µC reset ( Active low with internal pull-up ) J22 RTS O TTL Request To Send J21 RXD I TTL RxD UART – Serial Data Reception J20 GND Gnd Ground J19 TXD O TTL TxD UART – Serial Data Transmission J18 STAND_BY I TTL Standby ( Active high with internal pull-down ) J17 GND Gnd Ground J16 PROG I TTL

J15 GND Gnd Ground J14 DEBUG_D I/O TTL Debug data. J13 GND Gnd Ground J12 GND Gnd Ground J11 GND Gnd Ground J10 DEBUG_C I/O TTL Debug clock

J9 RESERVED - - J8 RESERVED - - J7 IO7_A I/O analog

J6 IO6_A I/O analog

J5 IO5_A I/O analog

J4 IO4_A I/O analog

J3 IO3_A I/O analog

J2 IO2_P I/O TTL Digital I/O N°2 with 20mA sink/source capability J1 IO1_P I/O TTL Digital I/O N°1 with 20mA sink/source capability

NOTE: reserved pins must not be connected

Signal for serial µC flashing ( Active high with internal pull-down )

ADC - Analog Input N°7 (Digital I/O capability) ADC - Analog Input N°6 (Digital I/O capability) ADC - Analog Input N°5 (Digital I/O capability) ADC - Analog Input N°4 (Digital I/O capability) ADC - Analog Input N°3 (Digital I/O capability)

IV.2. DIP Module mechanical dimensions and pin-out

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IV.3. Pin-out correspondence table

Pin-Out correspondence between ZE51/61-2.4/DIP, ZE51/61-2.4/SMD and CC2530 SOC.

ZE51/61-2.4/DIP ZE51/61-2.4/SMD

Connector Pin Pin Pin Name Pin Pin Name

1 2 GND GND 3 J5 P1 15 P0_4 5 J2 P3 9 P1_1

J8 12 P0_7

J1 4

RF connection

6 J1 P4 11 P1_0 7 J4 P5 16 P0_3 8 J3 P6 17 P0_2 9 GND GND 10 J25 VDD AVDD,DVDD

11 J16 PROG 36 P2_0 12 J22 RTS 7 P1_3 13 J24 CTS 8 P1_2 14 J23 Reset 20 Reset_N 15 J21 RxD 6 P1_4 16 J19 TxD 5 P1_5 17 J18 STAND_BY 37 P1_7 18 J22 RTS 7 P1_3 19 J6 P7 14 P0_5 20 GND GND

1 J14 Debug D 35 P2_1 2 J10 Debug C 34 P2_2 3 J23 Reset 20 Reset_N 4 J25 VDD AVDD,DVDD 5 GND GND

J7 13 P0_6

J9 J7 13 P0_6

SMA connector

J29

Ext_Antenna (Unbalanced RF )

CC2530 SOC

J4 Connector for debugging

38 P1_6

RF Connection to 50 ohm antenna

Comments

and flashing

ZE51

ZE61

Reserved

Not internally connected

IV.4. Description of the Signals

Signals

Reset

TXD, RXD

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Description

External hardware reset of the radio module. Active on low state.

Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state.

CTS

RTS

STAND_BY

Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state).

Outgoing signal. Indicates whether the user can transmit serial data (active, on low state) or not (inactive, on high state).

I/O, configurable as input or as output. (Available upon request only)

Indicates to the module to switch to pre-selected low-power mode. (Available upon request)

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CHAPTER V. PROCESS INFORMATION

V.1. Delivery

ZE51/61-2.4/SMD modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

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V.2. Storage

The optimal storage environment for ZE51/61-2.4/SMD modules should be dust free, dry and the temperature should be included between -40°C and +85°C.

In case of a reflow soldering process, tiny radio modules must be submitted to a drying bake at +60°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect. After being submitted to the drying bake, tiny modules must be soldered on host boards within 168 hours.

Also, it must be noted that due to some components, ZE51/61-2.4/SMD modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed.

V.3. Soldering pad pattern

The surface finished on the printed circuit board pads should be made of Nickel/Gold surface. The recommended soldering pad layout on the host board for the ZE51/61-2.4/SMD-WA, is shown in the diagram

below:

All dimensions in mm

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The recommended soldering pad layout on the host board for the ZE51/61-2.4/SMD-IA, is shown in the diagram below:

All dimensions in mm

Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

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V.4. Solder paste composition (RoHS process)

ZE51/61-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 μm .

The following diagram shows mounting characteristics for tiny integration on host PCB:

V.5. Placement

The ZE51/61-2.4/SMD module can be automatically placed on host boards by pick-and-place machines like any integrated circuit.

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V.6. Soldering profile (RoHS process)

It must be noted that ZE51/61-2.4/SMD module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.

The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.

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The barcode label located on the module shield is able to withstand the reflow temperature.

CAUTION

It must also be noted that if the host board is submitted to a wave

soldering after the reflow operation, a solder mask must be used in

order to protect the tiny radio module’s metal shield from being in

contact with the solder wave.

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CHAPTER VI. BOARD MOUNTING RECOMMENDATION

VI.1. Electrical environment

The best performances of the ZE51/61-2.4 module are obtained in a “clean noise” environment. Some basic recommendations must be followed:

 Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus ,...) must be placed as

far as possible from the ZE51/61-2.4 module.

 Switching components circuits (especially RS-232/TTL interface circuit power supply) must be decoupled

with a 100 µF tantalum capacitor. And the decoupling capacitor must be as close as possible to the noisy chip.

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VI.2. Power supply decoupling on ZE51/61-2.4 module

The power supply of ZE51/61-2.4 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, V

Power Supply

Symbols Reference Value Manufacturer

L1 LQH31MN1R0K03 1µH Murata C1 GRM31CF51A226ZE01 22µF Murata C2 Ceramic SMD 25V 100nF Multiple

Vdd

C1 C2

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VI.3. RF layout considerations

Basic recommendations must be followed to achieve a good RF layout :

 It is recommended to fill all unused PCB area around the module with ground plane, except in case of

integrated antenna (no ground plane must be placed in front of the antenna and on the bottom side).

 The radio module ground pin must be connected to solid ground plane.  If the ground plane is on the bottom side, a via (Metal hole) must be used in front of each ground pad.

Especially J28 and J30 (RF Gnd) pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing mismatch and losses.

Example of GND layout Top View (with and without integrated antenna)

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VI.4. Antenna connection on Printed Circuit Boards

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

Table 1 : Values for double face PCB with ground plane around and under coplanar wave guide (recommended)

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.3

1.6 1 0.2

0.8 1 0.22

1.6 1 0.23

Table 2 : Values for simple face PCB with ground plane around coplanar wave guide

(not recommended)

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VI.5. ZE51/61-2.4 interfacing :

Example of a full RS-232 connection between a PC or an Automat (PLC) and ZE51/61-2.4/SMD-WA

Example of a minimum PC connection with ZE51/61-2.4/SMD-IA .

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Example for sensor connection with ZE51/61-2.4/SMD-IA.

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ZE51/61-2.4 RF Module User Guide

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CHAPTER VII. ANTENNA CONSIDERATIONS

VII.1. Antenna recommendat ions

ZE51/61-2.4 performances when used in a product are strongly dependent on the antenna type and its location. Particular cautions are required on the following points:

 Use a good and efficient antenna designed for the 2.4 GHz band.

 Antenna must be fixed in such a location that electronic noise cannot affect the performances. (Outside

location is ideal if available).

 Antenna directivity must be low (Omni directional antenna is usually the best choice).

Recommended antenna specifications:

 Frequency Band : 2440MHz +/- 100MHz

 Radiation Pattern : Omni directional

 Nominal Impedance: 50 

 VSWR: 1.5:1 max.

 Gain: 0dBi  Polarization: Vertical

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VII.2. Antenna matching

Impedance matching can be required to deliver the maximum possible power from the module to the antenna and vice versa. This is typically accomplished by inserting a matching network into a circuit between the source and the load.

This matching network must be established as close as possible to the ZE51/61 module.

J29 RF

Input/Output

Track 1 Track 2

Antenna Connection

Hereafter an example of matching network used on the DIP interface board :

Symbols Reference Package Value Comments

Resistor 0603 0 ohm ZE51-2.4/DIP-WA

Z1 *

Z2, Z3 *

Track 1, Track 2

Plated holes

Antenna connection

*: These values should be measured and optimized with a Network Analyzer. If no impedance matching is necessary, replace Z

Monolithic Ceramic capacitor COG

- - Not mounted ZE51-2.4/DIP-WA

- - Not mounted ZE61-2.4/DIP-WA

Coplanar Waveguide

Ground vias :

drill of 0,35 mm pad of 0,75 mm

Coaxial cable Pad:

Hot point: 2*2mm Ground pad:2*4mm

Or a specific SMA connector can be used.

1 by a 0 ohm resistor, and let Z2 and Z3 not mounted.

0603 1.5 pF ZE61-2.4/DIP-WA

 Track 1 length (as short as possible)  Track 2 length (as short as possible)

See the layouts §VI.3 to have an idea of the antenna matching implantation.

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VII.3. Antenna types

The following are the antenna examples that may be suitable for ZE51/61-2.4/SMD-WA applications. We distinguish two types of antenna:

 External antenna (antenna is mounted outside of the device)  Embeddable antenna (antenna is integrated inside the device)

VII.4. External antenna

External antenna is recommended when the range performance is primordial. For example, for base stations and access points, where a better antenna gain may be required.

¼ Wave Monopole antenna:

The ¼ Wave antenna is 3 cm long @ 2.4 Ghz. Shorter compensated antennas could be used as long as they are adapted to 2.4 GHz frequency.

Best range may be achieved if the ¼ Wave antenna is placed perpendicular in the middle of a solid ground plane measuring at least 5 cm radius. In this case, the antenna should be connected to the module via some 50 ohm characteristic impedance coaxial cable.

¼ Wave Antenna,

connected to hot point.

Ground plane

connected to coaxial

ground

Coaxial hot and ground soldered

on the ZE51 RF output

WARNING

The metallic plane must be ideally under the antenna (balanced radiation). Never

short-circuit the hot and cold pins!

The installation directives are the following:

 Solder the coaxial cable on the hot and ground pad antenna (of the ZE51/61-2.4 module.)  Fix the antenna on a metallic plane or on a metallic box with the metallic screw provided with the antenna.

 If the ZE51/61-2.4 module is integrated in a plastic box, use a metal tape (copper) glued on the plastic

side under the antenna.

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Half Wave Dipole antenna:

The ½ Wave Dipole antenna is around 6 cm long. In a ½ Wave Dipole antenna the metallic plane is replaced by a second ¼ Wave antenna balancing the radiation.

Half wave monopole antenna typically offers a ground-independent design with favorable gain, excellent radiation pattern. It has a high impedance and requires an impedance-matching circuit (See paragraph IX.3)

Box

1/2 wave antenna Core linked to hot point

Coaxial hot and ground

plug on the tiny RF

output

WARNING

It is recommended to place the ½ wave dipole antenna away from all metallic

object, which will detuned it.

Particularity it is not recommended to place this type of antenna directly on a

metallic box, but the antenna can be deported away through a 50 ohm coaxial

cable.

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VII.5. Embeddable antennas

In this section you will find antennas designed to be directly attached to ZE51/61-2.4/SMD-WA module, inside the product casing. These antennas are only used in application where security, cosmetics, size or environmental issues make an external antenna impractical. This type of antenna is used when the integration factor becomes primordial (for mobile and handheld devices) to the range performances.

The basic recommendations are:

 The radio module must not be placed in a metallic casing or close to metallic devices.  The internal antenna must be far from noisy electronic.

Ceramic antenna:

Ceramic antenna is a SMD component to be mounted directly on the PCB. It is designed so that it resonates and be 50 ohms at the desired frequency. But we recommended to place an impedance-matching circuit (See paragraph VII.2).

The place under and around the ceramic antenna must be free of any track or ground plane. (refer to the antenna constructor requirements). It usually has a hemispherical radiation pattern has described below.

Miniaturized antenna:

This type of antenna features a through-hole feedline to directly attach it to the PCB. This antenna acts like a ¼ wave antenna so that a minimum ground plane is required.

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ZE51-2.4/SMD-IA: Integrated antenna:

ZE51-2.4 module is available with an integrated chip antenna, allowing very compact integration for small space application.

Radiation Pattern of ZE51-2.4/DIP board

It is very important to avoid ground plane around and below the antenna, so ZE51-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5.

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ZE61-2.4/SMD-IA: Integrated antenna:

ZE61-2.4 module is available with an integrated chip antenna, allowing very compact integration for small space application.

RADIATIONPATTERN

Horizontalplane(X , Y)

285

270

300

315

330

345

20,00

15,00

10,00

5,00

0,00

‐5,00

‐10,00

135

120

105

Test

255

240

225

210

195

Testa ntennaVerti c a l

Testa ntennaHori zonta l

180

165

150



RADIATION PATTERN Vert ica lplane(Y, Z )

285

270

255

300

240

315

225

20,00

345

330

15,00

10,00

5,00

0,00

‐5,00

‐10,00

210

195

Testa ntennaVerti c a l

Testa ntennaHorizontal

180

165

150

135

105

120

Test antenna



Radiation Pattern of ZE61-2.4/DIP board

It is very important to avoid ground plane around and below the antenna, so ZE61-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5.



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CHAPTER VIII. ANNEXES

VIII.1. Declaration of Conformity

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VIII.2. Conformity Assessment Issues FCC/IC

Modules ZE51/61 are FCC/IC approved as modules to be installed in other devices. If the final product after integration is intended for portable use, a new application and FCC/IC is required.

FCC Notice

The FCC notifies users that any changes or modifications made to this device that are not expressly approved by Telit Communications S.P.A. may void the user’s authority to operate the equipment.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Wireless notice:

This product emits radio frequency energy, but the radiated output power of this device is far below the FCC radio frequency exposure limits. This equipment complies with FCC RF radiation exposure limits forth for an uncontrolled environment. Nevertheless, the device should be used in such a manner that the potential for human contact with the antenna during normal operation is minimized.

IC Notice

This Class B digital apparatus complies with Canadian ICES-003, RSS-Gen and RSS-210.

Cet appareil numérique de la classe B est conforme à la norme NMB-003, CNR-Gen et CNR-210 du Canada

These radio transmitters ID: 5131A-ZE51 and 5131A-XE61 has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Les présent émetteures radio ID: 5131A-ZE51 e 5131A-XE61 a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

Fractus Micro Reach Xtend

Chip antenna Antenna gain 2 dBi 5 dBi Antenna impedance

50  50 

Taoglas Dipole Stub

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Wireless notice

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Label recommendations

If neither FCC ID nor IC ID is visible when the module is installed inside another device, then the outside of the device into which the module is installed will display a label referring to the enclosed module by labelling the host device in this manner: “Contains FCC ID: RI7ZE51 and IC ID: 5131A -ZE51” or “Contains FCC ID: RI7XE61 and IC ID: 5131A –XE61”

Safety recommendations

The device must maintain a distance of at least 20 cm from the user’s body when transmitting. In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

VIII.3. Examples of propagation attenuation

Factor

Open office 0 dB 0 dB 0 dB Window < 1 dB 1 – 2 dB 3 dB Thin wall (plaster) 3 dB 3 – 4 dB 5 – 8 dB Medium wall (wood) 4 – 6 dB 5 – 8 dB 10 – 12 dB Thick wall (concrete) 5 – 8 dB 9 – 11 dB 15 – 20 dB Armoured wall (reinforced concrete) 10 – 12 dB 12 – 15 dB 20 – 25 dB Floor or ceiling 5 – 8 dB 9 – 11 dB 15 – 20 dB Armoured floor or ceiling 10 – 12 dB 12 – 15 dB 20 – 25 dB Rain and/or Fog 20 – 25 dB 25 – 30 dB *

* = Attenuations increase along with the frequency. In some cases, it

is therefore difficult to determine loss and attenuation value.

Note = The table above is only indicative. The real values will depend on

the installation environment itself.

433 MHz 868 MHz 2.4 GHz

Attenuation Attenuation Attenuation

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VIII.4. Output power programming

The results are measured on the ZE61-2.4/DIP interface with T = 25°C, Vdd = 3 V, 2440 Mhz, 50 ohm impedance if nothing else noted.

TxPower register

ATS202

0 20 175 Not recommended 1 19.5 160 Default value 2 19 145 3 18.5 135 4 17.5 124 5 16.5 113 6 15 102 7 14 96 8 12.5 89 9 11 84

10 9 80

Power (dBm) Current (dBm) Comments

Telit Wireless Solutions ZE51-2.4, ZE61-2.4 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual