Telit Wireless Solutions xE50-868 series, LE50-868, ME50-868 User Manual

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xE50-868 RF Module User Guide

1VV0300905 Rev.14 – 2018-01-2503-16

xE50-433/868 RF Module User Guide

1VV0300905 Rev.14 – 2018-103-16

APPLICABILITY TABLE

PRODUCT

LE50-868

ME50-868

xE50-433/868 RF Module User Guide

1VV0300905 Rev.14 – 2018-103-16

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccu racies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the ri ght to make changes to any products d escribed herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license un der its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, th e purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by o peration o f law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

xE50-433/868 RF Module User Guide

1VV0300905 Rev.14 – 2018-103-16

Usage and Disclosure Restrictions License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All ot her product or service names are the property of their respective owners.

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Contents

1. Introduction ......................................................... 7

1.1. Scope ................................................................... 7

1.2. Audience .......................................................... 7

1.3. Contact Information, Support ................... 7

1.4. Document Organization .............................. 8

1.5. Text Conventions .......................................... 8

1.6. Related Documents ....................................... 9

2. Requirements .................................................... 10

2.1. General Requirements ............................... 10

2.2. 868 MHz band Requirements .................. 10

2.3. Other Requirements ................................... 12

2.4. Functional Requirements ......................... 12

2.5. Software ........................................................ 12

2.6. Temperature Requirements ..................... 12

3. General Characteristics .................................. 13

3.1. Mechanical Characteristics ...................... 13

3.2. Mechanical dimensions ............................. 14

3.3. Recommended Land pattern .................... 14

3.4. DC Characteristics ...................................... 15

3.5. LE50-868 Functional Characteristics . 16

3.6. ME50-868 Functional Characteristics 19

3.7. Digital Characteristic ................................ 22

3.8. Absolute Maximum Ratings .................... 22

3.9. Ordering Information ............................... 23

4. Technical Description ..................................... 25

4.1. Module Top View (cover side) ................. 25

4.2. Pin-out of the module LE50-868 ........... 26

4.3. Pin-out of the module ME50-868 ........... 27

4.4. Pin-out of the DIP Module ........................ 28

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4.5. Description of the signals ......................... 29

5. Process Information ....................................... 30

5.1. Delivery ........................................................ 30

5.2. Storage ............................................................ 31

5.3. Moisture sensibility .................................... 31

5.4. Additional Precautions .............................. 31

5.5. Soldering pad pattern ................................. 31

5.6. Solder paste .................................................. 32

5.7. PCB pad design ........................................... 33

5.8. PCB pad dimensions ................................. 33

5.9. Placement ..................................................... 34

5.10. Soldering Profile (RoHS Process) ...... 34

6. Board Mounting Recommendation ............. 36

6.1. Electrical environment ............................. 36

6.2. Power supply decoupling on xE50-868

module ...................................................................... 36

6.3. RF layout considerations .......................... 37

6.4. Antenna requirements .............................. 38

Antenna connections on printed circuit boards

6.5. ............................................................................. 38

6.6. xE50-868 Interfacing .............................. 40

7. Annexes .............................................................. 41

7.1. Examples of propagation attenuation ...... 41

7.2. EU Declaration of conformity ................ 42

7.3. Safety Recommendations ........................ 42

8. Glossary ............................................................. 43

9. Document History ........................................... 44

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1. Introduction

1.1. Scope

Scope of this document is to present the features and the application of the Telit xE50-868 radio modules (LE50-868 and ME50-868).

1.2. Audience

This document is intended for developers using Telit xE50-868 radio modules.

1.3. Contact Information,

Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at:

TS-SRD@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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1.4. Document Organization

This document contains the following chapters

“Chapter 1: “Introduction”

provides a scope for this document, target au dience, contact and

support information, and text conventions.

“Chapter 2: “Requirements” gives an overview of the limitations imposed by Reference

standards.

“Chapter 3: “General Characteristics” describes in detail the characteristics of the product. “Chapter 4: “Technical Description” describes in detail the signals and pin-out of the product. “Chapter 5: “Process information” describes in detail the delivery, storage, soldering and

placement of the product.

“Chapter 6: “Board Mounting Recommendations” describes in detail the interface and

coupling of the product.

“Chapter 7: “Annexes” describes examples of propagation attenuation. “Chapter 8: “Safety Recommendations” describes recommendation for proper usage. “Chapter 9: “Glossary” shows acronyms used in the document. “Chapter 10: “Document history” describes the revision history of the document.

1.5. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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1.6. Related Documents

• [1] EN 300 220-1, EN 300 220-2 v3.1.1, ETSI Standards for SRD,

• [2] ERC Rec 70 -03 version of 13 October 2017

• [3] RoHS 2 Directive 2011/65/EU

• [4] SR Tool User Guide, 1vv0300899

• [5] 2011/829/EU,, Harmonization of the radio spectrum for use by short-range

devices

• [6] 2009/381/EC, Amending Decision 2006/771/EC on harmonization of the radio

spectrum for use by short-range devices

• [7] Star Network Protocol Stack User Guide, 1vv0300873

• [11] EN 13757-4: 2013 Wireless M-Bus

• [12] Telit_Wireless_M-bus_2013_Part4_User_Guide 1vv0300953

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2. Requirements

2.1. General Requirements

The LE50-868 and ME50-868 (or simply xE50-868) modules are multi-band radio boards, delivering up to 25 mW in the 868 MHz ISM band (unlicensed frequency band).

They are delivered with preloaded protocol stacks:

• LE50-868: “Star Network” Protocol stack

• ME50-868: “Wireless M-Bus Part4:2013” Protocol stack.

LE50-868 and ME50-868 are pin-to-pin compatible with LE and ME modules working at different frequencies.

LE50-868 and ME50-868 are also pin-to-pin compatible with Telit ZE Family (ZigBee PRO stack).

2.2. 868 MHz band

Requirements

The “ERC recommendation 70-03” describes also the different usable sub-bands in the 868 MHz license free band, in terms of bandwidth, maximum power, duty cycle and channel spacing. LE50-868/ME50-868 can operate on Annex 1 bands where “ERC recommendation 70-03” gives the following limitations.

ERC recommendation 70-03

Band

Frequency band

(MHz)

Maximum

radiated power

(mW)

Channel spacing

(kHz)

Duty cycle

(%)

Annex1 g

863.0 – 870.0

=< 100 for 47 or more channels

100

Annex1 g1

868.0 – 868.6

No channel spacing specified

Annex1 g2

868.7 - 869.2

No channel spacing specified

0,1

Annex1 g3

869.4 - 869.65

500

25 (for 1 or more channels)

Annex1 g4

869.7 – 870.0

No channel spacing specified

100

These bands are free to use but the module and the user must res pect some limitations. Most of these restrictions are integrated in the co nception of the module, except the duty cy cle. For example, the 869.400 to 869.650 MHz band is limited to a 10% duty cycle. This means that each module is limited to a total transmit time of 6 minutes per hour.

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National Restrictions for non-specific SR devices Annex 1 band g1-g4:

Country

Restriction

Reason/Remark

Band G

Austria

Not Implemented

Planned

Finland Limited Implementation

Audio, video and voice not allowed Planned 2011

Georgia

Not Implemented

Greece

Limited Implementation

to 863-865 MHz

Lithuania Limited implementation

Only 863-868 MHz and duty cycle cannot be increased to 1%

Norway

Not implemented

Russian Federation

Not Implemented

864-865 MHz with max e.r.p 25 mW,

duty cycle 0.1% or LBT. Forbidden to use

at the airports (aerodromes)

Spain

Limited implementation

to the band 863-868 MHz

Sweden

Not Implemented

The Netherlands

Not Implemented

Under study

Ukraine Limited implementation

863-865 / 868-868.6 / 868.6-868.7 /

869.2-869.25 MHz

Band G1

Georgia

Not Implemented

Russian Federation

Not Implemented

Ukraine

Not Implemented

e.i.r.p. ≤25 mW

Band G3

Georgia

Not Implemented

Russian Federation

Not Implemented

Ukraine

Not Implemented

Band G4

Finland

Limited implementation

Only 5mW e.r.p. - Planned 2011

Georgia

Not Implemented

Russian Federation

Not Implemented

Ukraine

Not Implemented

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2.3. Other Requirements

Furthermore, the module complies with the ETSI 300-220-2 standards (specific for SRD) which main requirements are described in Appendix 1.

ME50-868 also complies which EN 13757-4 standards (Wireless M-Bus Part4). Finally, the module complies with the new Eu ropean Directive 2011/75/EU concerning the

Restrictive Usage of Hazardous Substances (Ro HS 2).

2.4. Functional Requirements

The xE50-868 module is a complete solution from serial interface to RF interface. The xE50868 module has a digital part and a RF part. The radio link is a Half-Duplex bi-directional link.

The digital part has the following functionalities:

• Communication interface

• I/O management

• Micro controller with embedded Telit Software Stack

The RF part has the following functionalities:

• Frequency synthesis

• Front-end

• Low noise reception

• Power amplification

• Packet handling

2.5. Software

The xE50-868 module is provided pre-flashed with one of the available Telit in-house Protocol Stack.

Please refer to Protocol Stack User Guides [7] or [12] for detailed information.

2.6. Temperature

Requirements

Minimum

Typical

Maximum

Unit

Operating

Temperature - 40 25 + 85 °C

Relative humidity @ 25°C

20 75 %

Storage

Temperature - 40 25 + 85 °C

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3. General Characteristics

3.1. Mechanical

Characteristics

Size : Rectangular 25.8 x 15 mm

Height : 3 mm

Weight : 1.7 g

PCB thickness: 0.8 mm

Cover :

• Dimensions: 21 x 14.2 x 2.2mm

• Thickness: 200µm

Components : All SMD components, on on e side of the PCB.

Connectors : The terminals allowing conveying I/O signals are LGA

Mounting :

• SMD

• LGA on the 4 external sides

Number of pins : 30

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3.2. Mechanical dimensions

3.3. Recommended Land

pattern

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3.4. DC Characteristics

Characteristics xE50

Min.

Typ.

Max.

Power Supply (VDD):

+2.0V +3.3V +3.6V

Consumption

xE50-868 - Transmission @ 10mW: 33mA 38mA xE50-868 - Transmission @ 25mW: 45mA 50mA

Reception: 26mA 30mA

Stand-by (32.768 khz On):

1.5µA 3µA

Sleep (wake up on interruption):

<1µA 1µA

I/O low level: GND - 0.2x V

I/O high level: 0.8x V

- V

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3.5. LE50-868 Functional

Characteristics

ERC/REC70-03 Frequency (MHz)

Band g

863.000 -870.000

Band M

EU Band 48

868.000 -868.600

Band N

EU Band 50

868.700 -869.200

Band P

EU Band 54b

869.400 -869.650

Band Q

EU Band 56a

869.700 -870.000

Global

RF data rate

(1): 4.8 kbps (2): 9.6 kbps

Numbers of channels

12 (1) 12 (2)

10 (1) 10 (2)

1 (1) 1 (2)

6 (1) 6 (2)

Channel width

50 kHz

250 kHz

50 kHz

Channel 0

868.025 MHz

868.725 MHz

869.525 MHz

869.725 MHz

Total Bandwidth

600 kHz

500 kHz

250 kHz

300 kHz

Transmission

Duty cycle

≤ 1%

≤ 0.1%

≤ 10%

No requirement

Modulation

GFSK with ±7 kHz deviation (1) GFSK with ±7 kHz deviation (2)

Max permitted e.r.p

25 mW 25 mW 25 mW 500 mW 5 mW

e.r.p

8 levels from -8dBm to +14dBm (except for g4 band, 6 levels from -8dBm to 7dBm)

25 mW

5 mW

Reception

Sensitivity for PER < 10-3

(1): Max - 109 dBm (2): Max - 108 dBm

Remaining PER

< 1.10-6

Saturation for PER < 10-3

Up to - 10 dBm

The module uses values and methods required to comply with polite spectrum access as specified in clause

5.21.3 of EN 300 220 V3.1.1.

• Minimum CCA time = 4 msec

• Dead Time = < 1msec

• Randomize method = pseudo random algorithm with production signature row used as a seed (not

enabled by default, it must be enabled by customer using ATS227=1)

• Unit of deferral period = 1 msec

• Max and min deferral time = 4-67 msec (not enabled by default, it must be enabled by customer using

ATS227=1)

• Max tx time = 900 msec (max 256 bytes)

• Tx timeoff = 100 msec added by customer every 256 bytes

Therefore, DUTY CYCLE limitations as per Annex 1 band (band 48, 50 and 54b) must apply. If we consider band 48, it means a max transmission time of <36s per hour To fulfill the specification, integrator must count the frames to be transmitted and do not exceed 36s. For the

lower Data rate, it means not transmitting more than 90 frames per hour.

xE50-433/868 RF Module User Guide

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ERC/REC70-03 Frequency (MHz)

Band g

863.000-870.000

Band M

EU Band 48

868.000-868.600

Band N

EU Band 50

868.700-869.200

Band P

EU Band 54b

869.400-869.650

Band Q

EU Band 56a

869.700-870.000

Global

RF data rate

(1): 19.2 kbps

(2): 38.4 kbps

(3): 115.2 kbps

Numbers of channels

6 (1)

3 (2)

1 (3)

5 (1)

2 (2)

1 (3)

1 (1)

1 (2)

0 (3)

3 (1)

2 (2)

0 (3)

Channel width

100 kHz (1)

200 kHz (2)

600 kHz (3)

100 kHz (1)

200 kHz (2)

500 kHz (3)

250 kHz

100 kHz (1) 150 kHz (2)

Channel 0

868.050 MHz (1)

868.100 MHz (2)

868.300 MHz (3)

868.750 MHz (1)

868.850 MHz (2)

868.950 MHz (3)

869.5250 MHz

869.750 MHz (1)

869.775 MHz (2)

Total Bandwidth

600 kHz 500 kHz 250 kHz 300 kHz

Transmission

Duty cycle

≤ 1% ≤ 1% ≤ 0.1% ≤ 10% No requirement

Modulation

GFSK with ± 10 kHz deviation (1)

GFSK with ± 20 kHz deviation (2)

GFSK with ± 50 kHz deviation (3)

Max permitted e.r.p

25 mW 25 mW 25 mW 500 mW 5 mW

e.r.p

8 levels from -8dBm to +14dBm (except for g4 band, 6 levels from -8dBm to 7dBm)

25 mW

5 mW

Reception

Sensitivity for PER < 10

-3

(1): Max - 104 dBm

(2): Max - 101 dBm

(3): Max - 99 dBm

Remaining PER < 1.10-6 Saturation

for PER < 10-3

Up to - 10 dBm

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ETSI EN 300 220

Transmission

Frequency error

+/- 12.5 kHz @ 25 kHz channelization

+/- 87 kHz (100 ppm) > 25 kHz channelization

ACP

- 37 dBm in 16 kHz BW under normal test conditions

- 32 dBm in 16 kHz BW under extreme test conditions

Modulation bandwidth

Reference Bandwidth

(RBW)

Limit Lower envelope point

Minimum frequency

Upper envelope point

maximum frequency

1 kHz - 30 dBm (1 μW) f

e, lower

e, upper

1 kHz  36 dBm (250 nW) (f

e, lower

– 200 kHz)

e, upper

+ 200 kHz)

10 kHz - 36 dBm (250 nW) (f

e, lower

– 400 kHz)

e, upper

+ 400 kHz)

100 kHz - 36 dBm (250 nW) (f

e, lower

– 1 MHz)

e, upper

+ 1 MHz)

Unwanted emissions in the spurious domain

Frequency 47 MHz to 74 MHz 7,5

MHz to 118 MHz 174 MHz to 230 MHz 470

MHz to 862 MHz

Other frequencies below

1 000 MHz

Frequencies above 1 000

MHz

State Operating - 54 dBm (4 nW) - 36 dBm (250 nW) - 30 dBm (1 μW) Standby - 57 dBm (2 nW) - 57 dBm (2 nW) - 47 dBm (20 nW)

Reception

Blocking for class 2 equipments

Frequency offset of the unwanted

signal

Receiver bandwidth

Minimum offset between wanted

and unwanted signals

+/-2 MHz

10 kHz ≥ 37 dB 100 kHz ≥ 27 dB 250 kHz ≥ 23 dB

+/-10 MHz

10 kHz ≥ 62 dB 100 kHz ≥ 52 dB 250 kHz ≥ 48 dB

spurious radiation

Below 1000 MHz Above 1000 MHz

- 57 dBm (2 nW) - 47 dBm (20 nW)

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3.6. ME50-868 Functional

Characteristics

M-Bus (Meter-Bus) is a European Standard for remote reading of gas, water or electricity meters. M-Bus is also usable for other types of consu mpti on meters. The M-Bus interface is made for communication on two wires, making it very cost effective. This protocol exists with several physical layers such as paired wires, optical fiber or radio link.

The radio variant of M-Bus is called Wireless M-Bus and is specified in EN 13757-4. It is dedicated to the European ISM frequency bands at 169, 433 and 868 MHz.

It means that modules embedding the Wireless M-bus stack must comply with the general

SRD standard EN 300 220.

ME50-868 supports S, T, and C modes designed for the 868 MHz frequency band.

DUTY CYCLE limitations as per Annex 1 band (band 48, 50 and 54b) must apply. If we consider band 48, it means a max transmission time of <36s per hour. To fulfill the specification, integrator must count the frames to be transmitted and do not

exceed 36s (band 48),

xE50-433/868 RF Module User Guide

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ERC/REC70-03 Frequency (MHz)

Band g

863.000-870.000

Band M

EU Band 48

868.000-868.600

Band N

EU Band 50

868.700-869.200

Band P

EU Band 54b

869.400-869.650

Band Q

EU Band 56a

869.700-

870.000

Global

RF data rate

(1): 32,768 kbps

(2): 100 kbps (3): 100 kbps

(4): 50 kbps

Numbers of channels

1 (1)

1 (2) 1 (3)

1 (4)

Channel width

600 kHz 500 kHz 250 kHz

Channel 0

868.300 MHz 868.950 MHz 869.525 MHz

Total Bandwidth

600 kHz 500 kHz 250 kHz

Transmission

Duty cycle

≤ 1% ≤ 1% ≤ 0.1% ≤ 10% No requirement

Modulation

FSK with ± 50 kHz deviation (1)

FSK with ± 50 kHz deviation (2) FSK with ± 45 kHz deviation (3)

GFSK with ± 25 kHz deviation (4)

Max permitted e.r.p

25 mW 25 mW 25 mW 500 mW 5 mW

e.r.p

8 levels from -8dBm to +14dBm (except for g4 band, 6 levels from -8dBm to 7dBm)

25 mW

5 mW

WMBUS Modes

S1/ S2

T2-other

T1-meter,

T2-meter,

C1-meter

C2-meter

C2-other

Rx bandwidth

S modes: 232KHz

T2: 208.4KHz

T/C modes :

208.4 kHz

C2: 112KHz

Reception

Sensitivity for PER < 10

-3

(1): Max - 103 dBm

(2/3): Max - 100 dBm

(4): Max - 101 dBm

Remaining PER < 1.10-6 Saturation

for PER < 10-3

Up to - 10 dBm

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ETSI EN 300 220

Transmission

Frequency error

+/- 12.5 kHz @ 25 kHz channelization

+/- 87 kHz (100 ppm) > 25 kHz channelization

ACP

- 37 dBm in 16 kHz BW under normal test conditions

- 32 dBm in 16 kHz BW under extreme test conditions

Modulation bandwidth

Reference Bandwidth

(RBW)

Limit Lower envelope point

Minimum frequency

Upper envelope point

maximum frequency

1 kHz - 30 dBm (1 μW) f

e, lower

e, upper

1 kHz  36 dBm (250 nW) (f

e, lower

– 200 kHz)

e, upper

+ 200 kHz)

10 kHz - 36 dBm (250 nW) (f

e, lower

– 400 kHz)

e, upper

+ 400 kHz)

100 kHz - 36 dBm (250 nW) (f

e, lower

– 1 MHz)

e, upper

+ 1 MHz)

Unwanted emissions in the spurious domain

Frequency 47 MHz to 74 MHz 7,5

MHz to 118 MHz 174 MHz to 230 MHz 470

MHz to 862 MHz

Other frequencies below

1 000 MHz

Frequencies above 1 000

MHz

State Operating - 54 dBm (4 nW) - 36 dBm (250 nW) - 30 dBm (1 μW) Standby - 57 dBm (2 nW) - 57 dBm (2 nW) - 47 dBm (20 nW)

Reception

Blocking for class 2 equipments

Frequency offset of the unwanted

signal

Receiver bandwidth

Minimum offset between wanted

and unwanted signals

+/-2 MHz

10 kHz ≥ 37 dB 100 kHz ≥ 27 dB 250 kHz ≥ 23 dB

+/-10 MHz

10 kHz ≥ 62 dB 100 kHz ≥ 52 dB 250 kHz ≥ 48 dB

spurious radiation

Below 1000 MHz Above 1000 MHz

- 57 dBm (2 nW) - 47 dBm (20 nW)

The module uses values and methods required to comply with polite spectrum access as specified in clause

5.21.3 of EN 300 220 V3.1.1. The parameters declared for this module are:

• Minimum CCA time = 5 msec

• Dead Time = < 1msec

• Randomize method = pseudo random algorithm with production signature row used as a seed (not

enabled by default, it must be enabled using ATS453=2)

• Unit of deferral period = 1 msec

• Max and min deferral time = 5-10 msec

• Max tx time = 160 msec

• Tx timeoff = 100 msec added by customer after each frame

Tcum_on = customer should count the frames to be transmitted and not exceed duty Cycle limitations. For the lower Data rate, 32,768 kbps, band 48, it means not transmitting more than 300 frames per hour.

xE50-433/868 RF Module User Guide

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3.7. Digital Characteristic

Function Characteristics

µC

• 32 kB + 4 kB in system programmable flash

• 4 kB RAM

• 2 kB E2PROM

Serial link

• RS232 TTL Full Duplex

• 1200 to 115200 bps

• 7 or 8 bits

• Parity management

• Flow control

o None o Software (Xon/Xoff)

Hardware (RTS/CTS)

Embedded software functionality

• 2 variants

o Star Network Telit RF proprietary stac k o W-MBUS stack

• Flexibility:

o Pre- flashed o Customization capability

Download over the air

3.8. Absolute Maximum

Ratings

Voltage applied to Vcc, VDD : -0.3V to +3.6V

Voltage applied to “TTL” Input : -0.3V to V

+0.3V

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3.9. Ordering Information

The following equipment’s can be ordered:

• The SMD version ( LE50-868 ME50-868)

• The DIP interface version (LE50-868 ME50-868)

• The Demo Kit (LE50-868) composed by n.2 evaluation boards, n.2 DIP interface

boards, RF antennas, serial cables, batteries.

• The Demo Case (for ME50-868) composed by n.3 evaluation boards, n.3 DIP

interface boards, RF antennas, serial cables, batteries.

Equipment and Part Number

SMD Version

LE50-868 ME50-868

DIP Version

LE50-868, ME50-868

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Demo Kit/Democase

D LE50 DemoKit /DME50 Democase

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4. Technical Description

4.1. Module Top View (cover

side)

CAUTION: reserved pins must not be connected

CAUTION: In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reser ved on these modules (see foot notes on PinOut tables.

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4.2. Pin-out of the module

LE50-868

Pin Pin name Pin type Signal level Function

J30

GND

Gnd

RF Ground connection for external antenna

J29

Ext_Antenna

RF I/O connection to external antenna

J28

GND

Gnd

RF Ground connection for external antenna

J27

GND

Gnd

Ground

J26

GND

Gnd

Ground

J25

VDD

Power

Digital and Radio part power supply pin

J24

CTS I TTL

Clear To Send

J23

RESET I TTL

µC reset ( Active low with internal pull-up )

J22

RTS O TTL

Request To Send

J21

RXD I TTL

RxD UART – Serial Data Reception

J20

GND

Gnd

Ground

J19

TXD O TTL

TxD UART – Serial Data Transmission

J18

STAND_BY

TTL

Standby (Active high with internal pull-down: when set to 1 the module is put in stand-by)

J17

GND

Gnd

Ground

J16

PROG I TTL

Signal for serial µC flashing ( Active high with internal pull-down )

J15

GND

Gnd

Ground

J14

PDI_DATA

I/O

TTL

Program and Debug Interface DATA

J13

GND

Gnd

Ground

J12

GND

Gnd

Ground

J11

GND

Gnd

Ground

J10

PDI_CLK

TTL

Program and Debug Interface CLOCK

IO91

I/O

TTL

Digital I/O N°9 with interrupt

Status TX/RX

TTL

See reference document [5] Star Network Protocol Stack User Guide

IO8_AD_DA2

I/O

TTL

Digital I/O N°8 with interrupt

ACK TX O TTL

See reference document [5] Star Network Protocol Stack User Guide

IO7_A

I/O

TTL

Digital I/O N°7 with interrupt

IO6_A

I/O

analog

ADC - Analog Input N°6 (Logic I/O capability)

IO5_A

I/O

analog

ADC - Analog Input N°5 (Logic I/O capability)

IO4_A

I/O

analog

ADC - Analog Input N°4 (Logic I/O capability)

IO3_A

I/O

analog

ADC - Analog Input N°3 (Logic I/O capability)

IO2_P

I/O

TTL

Logic I/O N°2 with interrupt

RX LED O TTL

See reference document [5] Star Network Protocol Stack User Guide

IO1_P

I/O

TTL

Logic I/O N°1 with interrupt

TX LED O TTL

See reference document [5] Star Network Protocol Stack User Guide

1, 2

In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since

reserved on these modules.

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4.3. Pin-out of the module

ME50-868

Pin name

Pin type

Signal level

Function

J30

GND

Gnd

RF Ground connection for external antenna

J29

Ext_Antenna

RF I/O connection to external antenna

J28

GND

Gnd

RF Ground connection for external antenna

J27

GND

Gnd

Ground

J26

GND

Gnd

Ground

J25

VDD

Power

Digital and Radio part power supply pin

J24

CTS I TTL

Clear To Send

J23

RESET I TTL

µC reset ( Active low with internal pull-up )

J22

RTS O TTL

Request To Send

J21

RXD I TTL

RxD UART – Serial Data Reception

J20

GND

Gnd

Ground

J19

TXD O TTL

TxD UART – Serial Data Transmissi o n

J18

WAKEUP I TTL

Wake-up (Active high with internal pull-down: when set to 1 the

module is awakened)

J17

GND

Gnd

Ground

J16

PROG I TTL

Signal for serial µC flashing (Active high with internal pull-down)

J15

GND

Gnd

Ground

J14

PDI_DATA

I/O

TTL

Program and Debug Interface DATA

J13

GND

Gnd

Ground

J12

GND

Gnd

Ground

J11

GND

Gnd

Ground

J10

PDI_CLK I TTL

Program and Debug Interface CLOCK

IO95

I/O

TTL

Digital I/O N°9 with interrupt

IO8_AD_DA6

I/O

analog

A to D and D to A I/O N°8 with interrupt (Logic I/O capability)

IO7_A

I/O

analog

Analog Input N°7 (Logic I/O capability)

IO6_A

I/O

analog

Analog Input N°6 (Logic I/O capability)

IO5_A

I/O

analog

Analog Input N°5 (Logic I/O capability)

IO4_A

I/O

analog

Analog Input N°4 (Logic I/O capability)

IO3_A

I/O

analog

Analog Input N°3 (Logic I/O capability)

STANDBY STATUS

TTL

Signal indicating stand-by status

RADIO STATUS

TTL

Signal indicating reception or transmission of radio frame

5, 6

In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since

reserved on these modules.

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4.4. Pin-out of the DIP Module

Version 1 Version 2

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4.5. Description of the signals

Signals Description

Reset

External hardware reset of the radio module. Active on low state.

TXD, RXD

Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state.

CTS

Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state).

RTS

Outgoing signal. Indicates whether the user can transmit serial data (active, on low state) or not (inactive, on high state).

I/O, configurable as input or as output. See reference document [7] for LE50-868. Available upon request f or ME50-868

STANDBY

(LE50-868)

Input signal which indicates to the module to switch to pre-selected lowpower mode. See reference document [7] for LE50-868

WAKEUP

(ME50-868)

Input signal which indicates to the module to wake up from low-power mode. See reference document [9] for ME50-868.

TX LED

(LE50-868 only)

Output signal set to VCC during radio transmission and set to GND the rest of the time

RX LED

(LE50-868 only)

Output signal set to VCC as soon as a radio frame is detected with correct synchronization word. The signal returns to GND a s soon as the frame reception is finished

ACK TX

(LE50-868 only)

In Addressed Secured mode , this signal rises to VCC when an ACK hasn’t been received after frame transmission and repetition. This is the hardware version of “ERROR” serial message. It stays at VCC until next success addressed secured transmission

STATUS TX/RX

(LE50-868 only)

Output signal which indicates the status of the serial port. When serial port is transmitting, Status RX/TX signal goes VCC until the end of serial transmission. The signal stays to GND the rest of the time

STANDBY STATUS

(ME50-868 only)

The ‘STAND BY STATUS’ output signal is set to logical ‘1’ while the module is operating and return to ‘0’ during stand by periods.

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5. Process Information

5.1. Delivery

xE50-868 modules are delivered in plastic tr ay packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

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5.2. Storage

The optimal storage environment for ME70-169 modules should be dust free, dry and the temperature should be included between -40°C and +85°C.

5.3. Moisture sensibility

The level of moisture sensibility of the Product i s “3” according with standard IPC/JEDEC JSTD-020, take care of all the relative requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) The shelf life of the Product inside of the dry bag must be 12 months from the bag seal

date,

b) when stored in a non-condensing atmospheric environment of <= 30°C / 60% RH

according to IPC/JEDEC J-STD-033A paragraph 5

c) T he max i mum time betwe en t he op ening of the seal ed b ag and the r eflo w pro cess must be

168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more.

5.4. Additional Precautions

Also, it must be noted that due to some components, ME50/LE50 are ESD sensitive dev ice.

Therefore, ESD handling precautions should be carefully observed.

5.5. Soldering pad pattern

The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.

The recommended soldering pad layout on the host board for the xE50-868 is shown in the diagram below:

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All dimensions in mm

Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

5.6. Solder paste

xE50-868 module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. Stencil apertures layout can have the same dimensions as the copper pads. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 μm The following diagram shows mounting characteristics for ME integration on host PCB:

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5.7. PCB pad design

Non-Solder Mask Defined (NSMD) type is recommended for the solder pads on the host pcb:

5.8. PCB pad dimensions

The recommended PCB pad dimensions are describ ed in the following picture: as can be seen, solder mask apertures are 0.1mm larger than the copper pad:

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5.9. Placement

The xE50-868 module can be automatically placed on host boards by pick-and-place machines like any integrated circuit

5.10. Soldering Profile (RoHS

Process)

It must be noted that xE50-433/868 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.

The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.

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The barcode label located on the module shield is able to withstand the reflow temperature.

CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the xE50-868 radio module’s metal shield from being in contact with the solder wave.

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6. Board Mounting

Recommendation

6.1. Electrical environment

The best performances of the xE50-868 module is obtained in a “clean noise” environment. Some basic recommendations must be foll owed:

• Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus

,...) must be placed as far as possible from the LE50-868 module.

• Switching components circuits (especially RS-232/TTL interface circuit power

supply) must be decoupled with a 100 µF tantalum capacitor. And the decoupling capacitor must be as close as possible to the noisy chip.

6.2. Power supply decoupling

on xE50-868 module

The power supply of xE50-868 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, VDD.

Symbols Reference Value Manufacturer

L1 LQH31MN1R0K03 1µH Murata

C1 GRM31CF51A226ZE01 22µF Murata

C2 Ceramic CMS 25V 100nF Multiple

Vdd

Power Supply L1

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6.3. RF layout considerations

Basic recommendations must be followed to achieve a good RF layout:

• It is recommended to fill all unused PCB area around the module with ground plane

• The radio module ground pin must be connected to solid ground plane.

• If the ground plane is on the bottom side, a via (Metal hole) must be used in front of

each ground pad. Especially J28 and J30 (RF Gnd) pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing mismatch and losses.

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6.4. Antenna requirements

Special care must be taken during the design of the RF section on the application board.

RF performance degradation, and infringements of emission limits, may

arise if the following recommendations are not r espected.

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms but other choices are possible, such as a chip or a printed one. In case an integrated or printed antenna is used, it is recommended to place it on the edge of the application board. Since it may be necessary to tune the antenna impedance to 50Ω, it is recommended to foresee a PI matching network between the XE50-868 and the antenna, at least during first prototyping: if not required, a series 0Ω-resistor can be used, leaving the two shunt components unpopulated. In order to be able to reuse Telit’s RED certification, the antenna on the application board shall have a gain equal to the one recommended by Telit, or lower.

The antenna used for RED compliance assessment is

• Antenna Factor ANT-868-CW-HWR ½-wave center-fed dipole (SMA connector)

o Impedance 50Ω o Frequency Range 853MHz to 883MHz o Peak Gain -2,3dBi

The ME50-868 module was mounted on a DIP interface board. Antenna was plugged on the SMA connector.

Antenna gain influences many parts of the RE D compliance assessment.

1. SAR according to EN 62311

2. Spurious Emissision according to EN 300 220

3. EMC according to EN 301 489-1, 3, 17

Please evaluate necessary re-assessment step, if the use of another antenna is

intended.

6.5. Antenna connections on

printed circuit boards

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.

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PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.3

1.6 1 0.2

Table 1: Values for double face PCB with ground plane around and under coplanar wave guide (recommended)

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.22

1.6 1 0.23

Table 2 : Values for simple face PCB with ground plane around coplanar wave guide (not recommended)

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6.6. xE50-868 Interfacing

Example of a full RS-232 connection between a PC or an Automat (PLC) and xE50-868

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7. Annexes

7.1. Examples of propagation

attenuation

Factor

433 MHz

868 MHz

2.4 GHz

Attenuation

Open office

0 dB

Window

< 1 dB

1 – 2 dB

3 dB

Thin wall (plaster)

3 dB

3 – 4 dB

5 – 8 dB

Medium wall (wood)

4 – 6 dB

5 – 8 dB

10 – 12 dB

Thick wall (concrete)

5 – 8 dB

9 – 11 dB

15 – 20 dB

Armoured wall (reinforced concrete)

10 – 12 dB 12 – 15 dB 20 – 25 dB

Floor or ceiling

5 – 8 dB

9 – 11 dB

15 – 20 dB

Armoured floor or ceiling

10 – 12 dB

12 – 15 dB

20 – 25 dB

Rain and/or Fog

20 – 25 dB

25 – 30 dB

* = Attenuations increase along with the freq uency. In some cases, it is

therefore difficult to determine loss and attenuation value.

Note = The table above is only indicative. The real values will depend on

the installation environment itself.

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7.2. EU Declaration of

conformity

The LE50-868 and ME50-868 are to be considered radio equipment and therefore they are subject to 2014/53/EU Directive, also known as Radio Equipment Directive (RED). Therefore,

Hereby, We, Telit Communications S.p.A, via Stazione di Prosecco 5/B, Sgonico 34010 – Trieste Italy, declare that the radio equipment type LE50-868 and ME50-868 are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.telit.com/RED

The conformity to Radio Equipment Directive of LE50-868 and ME50-868 cannot be extended to the integrating radio equipment without further assessment to demonstrate compliance with the essential requirements of the Directive 2014/53/EU.

7.3. Safety Recommendations

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific

environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source, Safety Extra Low Voltage, with no energy hazard. The wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the modu l e, as well as of any project or installation issue, because the risk of disturbing external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. When installed in final product, a fire protection enclosure must be provided. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm).

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8. Glossary

ACP

Adjacent Channel Power

AFA

Adaptive Frequency Agility

bps

Bits per second

Bandwidth

Decibel

dBm

Power level in decibel milliwatt (10 log (P/1mW))

E2PROM

Electrically Erasable Programmable Read Only Memory

e.r.p

Effective radiated power

ETSI

European Telecommunication Standard Institute

GFSK

Gaussian Frequency Shift Keying

Input

ISM

Industrial, Scientific and Medical

KiloByte

kbps

Kilobits per second

kcps

Kilochips per second

kHz

Kilo Hertz

LBT

Listen Before Talk

LGA

Land Grid Array

MHz

Mega Hertz

milliwatt

Output

PER

Packet Error Rate

ppm

Parts per million

RAM

Random Access Memory

Radio Frequency

RoHS

Restriction of Hazardous Substances

RxD

Receive Data

SMD

Surface Mounted Device

SRD

Short Range Device

TxD

Transmit Data

UART

Universal Asynchronous Receiver Trans mitter

µC

microcontroller

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9. Document History

Revision

Date

Changes

2011-02-22

First Release

2011-05-18

• Updated pin-out table

• New DIP module

•

Adding RF Layout drawing

2011-06-23

• Updated Related Documents

• Added a table in 3.5

2011-07-05

• Updated 2.1

• Updated 3.5

2011-07-27

• Users Guides “NE50-868 RF Module User Guide

1vv0300897” and “ME50-

868 RF Module User

Guide 1vv0300892” are integrated into the present User Guide

• Added 7.2

2011-08-10

• Updated 1.4

• Updated 3.8

• Updated 3.10

• Updated 4.3

• Updated 4.4

2011-09-20

• Name of the present User Gu ide is updated

• LE50-433 module is integrat ed in the p resent U ser

Guide

• Updated 3.9

• Updated 3.11

2011-12-16

• NE50-433 module is integrated in the presen t User

Guide

2012-03-14

• Updated J18 Pin description in 4.2

• Updated J2 and

J18 Pin name and description in

4.3

• Updated J1, J2, J18 Pin name and description in

4.4

• Updated 4.5

• Updated 4.6

2012-06-14

• Updated 3.5 to 3.8 with modified output power

level steps

• Updated 7.2

• Updated 8

2012-09-28

• Updated 7.2

2012-06-20

• Updated 3.5 to 3.9 & 1.6 & 2.1& 2.6

2015-06-19

• Updated Process Information

2015-07-28

• Updated mounting footprint information

2018-01-03-16

• Removed NE50-433/NE50-868 products

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• Removed LE50-433

• Updated standards, Clarify Duty cycle

• Antenna requirements

• Updated 1999/5/EC references to RED and added

simplify EU DoC

• Added ME50-868 functional characteristics

Telit Wireless Solutions xE50-868 series, LE50-868, ME50-868 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual