Telit Wireless Solutions WE866E4-P Hardware User's Manual

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WE866E4-P AT Command Reference Guide

WE866E4-P Module Hardware User Guide

1VV0301487 Rev. 1.2 - 2018-07-27

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80572ST10887A Rev. 1.2 1 2018-07-27

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

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COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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WE866E4-P Module Hardware User Guide

Chapter 1 Introduction ....................................................................................................................... 7

1.1 Scope ......................................................................................................................................7

1.2 Audience ..................................................................................................................................7

1.3 Contact Information, Support ...................................................................................................7

1.4 Text Convention ......................................................................................................................8

1.5 Related Documents ................................................................................................................. 8

1.5.1 Related Documents and Download ................................................................................8

1.5.2 Related Documents requiring a Non Disclosure Agreement ..........................................9

Chapter 2 Overview ......................................................................................................................... 11

Chapter 3 Pin Allocation .................................................................................................................. 13

3.1 Pins Out .................................................................................................................................13

3.2 A Pad Layout ......................................................................................................................... 16

Chapter 4 Power Supply .................................................................................................................. 17

4.1 Power Supply Requirements ................................................................................................. 17

4.2 Power Consumption ..............................................................................................................17

4.3 General Design Rules ...........................................................................................................18

Chapter 5 Digital Section ................................................................................................................. 19

5.1 Logic Levels ...........................................................................................................................19

5.2 Power Up/Down Sequence ...................................................................................................20

5.3 Power ON Reset Time ...........................................................................................................20

5.4 Unconditional Shutdown ........................................................................................................20

5.5 Communication Ports ............................................................................................................21

5.5.1 High Speed UART ........................................................................................................21

5.5.2 Low Speed UART ........................................................................................................21

5.5.3 SDIO ............................................................................................................................22

5.5.4 SPI ...............................................................................................................................22

5.5.5 I2C ................................................................................................................................22

5.5.6 USB ..............................................................................................................................22

5.6 General Purpose Input/Output ...............................................................................................22

5.6.1 ADC Converter .............................................................................................................22

Chapter 6 RF Section ...................................................................................................................... 23

6.1 RF Variants ............................................................................................................................23

6.1.1 Wi-Fi .............................................................................................................................23

6.1.2 Bluetooth ......................................................................................................................23

6.2 TX Output Power ................................................................................................................... 24

6.2.1 Wi-Fi .............................................................................................................................24

6.2.2 Bluetooth ......................................................................................................................26

6.3 RX Sensitivity ........................................................................................................................26

6.3.1 Wi-Fi .............................................................................................................................26

6.3.2 Bluetooth ......................................................................................................................27

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6.2.1.1 For 2.4GHz ..........................................................................................................24

6.2.1.2 For 5GHz .............................................................................................................25

6.3.1.1 For 2.4GHz ..........................................................................................................26

6.3.1.2 For 5GHz .............................................................................................................26

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6.4 Wi-Fi Antenna Requirements ................................................................................................27

6.4.1 PCB Design Guidelines ................................................................................................28

6.4.2 PCB Guidelines in case of FCC Certification ............................................................... 29

6.5 BlueTooth Antenna Requirements ........................................................................................29

6.5.1 PCB Design Guidelines ................................................................................................29

6.5.2 PCB Guidelines in case of FCC Certification ............................................................... 29

Chapter 7 Audio Section .................................................................................................................. 31

7.1 Electrical Characteristics .......................................................................................................31

7.2 Codec Examples ...................................................................................................................31

Chapter 8 Mechanical Design .......................................................................................................... 33

8.1 Drawing .................................................................................................................................33

Chapter 9 Application PCB Design. ................................................................................................. 35

9.1 Footprint ................................................................................................................................35

9.2 PCB Pad Design ....................................................................................................................37

9.3 PCB Pad Dimension ..............................................................................................................38

9.3.1 Recommendations for PCB Pad Surface .....................................................................39

9.4 Stencil ....................................................................................................................................39

9.5 Solder Paste .......................................................................................................................... 39

9.6 Solder Re-flow ....................................................................................................................... 39

Chapter 10 Packaging ..................................................................................................................... 43

10.1 Tray .....................................................................................................................................43

10.2 Reel .....................................................................................................................................44

10.3 Moisture Sensitivity ..............................................................................................................46

Chapter 11 Conformity Assessment Issue ...................................................................................... 47

11.1 FCC/IC Regulatory Notice ...................................................................................................47

Chapter 12 Safety Recommendation ............................................................................................... 49

12.1 Read Carefully .....................................................................................................................49

Chapter 13 Acronyms ...................................................................................................................... 51

Document History 53

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Chapter 1 Introduction

• Scope, page 7

• Audience, page 7

• Contact Information, Support, page 7

• Text Convention, page 8

• Related Documents, page 8

1.1 Scope

The aim of this document is to describe the hardware solutions useful for developing a product with Telit WE866E4-P module.

1.2 Audience

This document is intended for Telit customers, who are integrators, about to implement their applications using our WE866E4-P modules.

1.3 Contact Information, Support

For general contact, technical support services, technical questions and report

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documentation errors contact Telit Technical Support at:

• TS-SRD@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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1.4 Text Convention

The following table shows the symbol conventions used in this manual for notification and important instructions.

Icon Type Description

Note

Table 1 Symbol Conventions

Provides helpful suggestions needed in understanding a feature or references to material not available in the manual.

Alert

Caution

Warning

Electro-Static Discharge (ESD)

Danger

All dates are in ISO 8601 format, i.e. YYYY-MM-DD

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1.5 Related Documents

Please refer to http://www.telit.com/gnss/ for current documentation and downloads.

Alerts you of potential damage to a program, device, or system or the loss of data or service.

Cautions you about a situation that could result in minor or moderate bodily injury if not avoided.

Warns you of a potential situation that could result in death or serious bodily injury if not avoided.

Notifies you to take proper grounding precautions before handling a product.

Indicates information MUST be followed or catastrophic equipment failure or bodily injury may occur

1.5.1 Related Documents and Download

– Datasheets

– Product User Guides

– EVK User Guides

– Software User Guides

– Application Notes

– TelitView installation and documentation

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1.5.2 Related Documents requiring a Non Disclosure Agreement

– Authorized Software User Guides

– Product firmware

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Chapter 2 Overview

The aim of this document is to describe some hardware solutions useful for developing a product with Telit WE866E4-P module. All the basic functions of a mobile phone is considered and certified for an appropriate hardware solution, common errors and wrong solution that can be avoided are documented. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for proper development of a product with the Telit WE866E4-P module.

For further hardware details refer to the “Telit WE866E4-P Product Description” document where all the hardware information is reported.

NOTE:

1).(EN) The integration of WE866E4-P WiFi+BT module within user application shall be done according to the design rules describe in this manual.

2).(IT)

3).(DE)

4).(SL)

5).(FR)

6).(HE)

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Chapter 3 Pin Allocation

• Pins Out, page 13

• A Pad Layout, page 16

3.1 Pins Out

Table 2, page 13 describes the WE866E4-P module pin signal description.

Table 2 WE866E4-P Module Pin Signal Description

Pins Name Input/Output Function Type Comments

USB HS 2.0 COMMUNICATION PORT

E5 USB_D+ Input/Output USB differential Data+

E6 USB_D- Input/Output USB differential Data -

E4 VUSB Input Power sense for USB

High Speed Asynchronous Serial Port (USIF0)

A4 UART0_TXD Output Serial data output

A5 UART0_RXD Input Serial data input CMOS VIO

B4 UART0_RTS Output Output CMOS VIO

B3 UART0_CTS Input Input CMOS VIO

Low Speed Asynchronous Serial Port (USIF0)

C3 UART1_RXD Input Serial data input CMOS VIO

C4 UART1_TXD Output Serial data input CMOS VIO

Serial Peripheral Interface (SPI) CMOS VIO

A3 SPI_MISO Input Pull-down (see Note 1) CMOS VIO Master

B2 SPI_MOSI Output Pull-down (see Note 1) CMOS VIO Master

A2 SPI_CLK Output Pull-down (see Note 1) CMOS VIO Master

D9 SPI_CS Output Pull-down CMOS VIO Master

Secure Digital Input Output (SDIO)

A6 SDIO_D2 Input/Output DATA2 CMOS VIO

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CMOS VIO

B6 SDIO_D1 Input/Output DATA1 CMOS VIO

B7 SDIO_D3 Input/Output DATA3 CMOS VIO

C7 SDIO_D0 Input/Output DATA0 CMOS VIO

D7 SDIO_CLK Input/Output Clock CMOS VIO

E7 SDIO_CMD Input/Output Command CMOS VIO

Inter - Integrated Circuit Interface

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Table 2 WE866E4-P Module Pin Signal Description (Continued)

Pins Name Input/Output Function Type Comments

F8 I2C_SDA Input/Output Data CMOS VIO

G8 I2C_SCL Input/Output Clock CMOS VIO GPIO_7

Analog Interface

A8 ADC_IN1 Input 12 BITS 1Mhz VIO 1V8 only

A9 ADC_IN2 Input 12 BITS 1Mhz VIO 1V8 only

B9 ADC_IN3 Input 12 BITS 1Mhz VIO 1V8 only

Digital Audio Interface (I2S) Master/Slave

C5 I2S_SYNC Input/Output Synchronization CMOS VIO

D5 I2S_SCK Input/Output Clock CMOS VIO

C6 I2S_SDI Input Input Data CMOS VIO

D6 I2S_SDO Output Output Data CMOS VIO

GP IO_6

Miscellaneous Functions

G5 WiFI_EN Input Power Enable CMOS VIO Active HI

G6 BT_EN Input Power Enable CMOS VIO Active HI

D1 ANT_1 Input/Output Wi-Fi 2.4G and 5G RF 50Ohms

G3 ANT_2 Input/Output BT 2.4G CMOS VIO 50Ohms

D3 GPIO_1 Input/Output GENERIC IO CMOS VIO WAKEUP

E3 GPIO_2 Input/Output GENERIC IO CMOS VIO BT_PRIORITY

F5 GPIO_3 Input/Output GENERIC IO CMOS VIO WI-FI ACTIVE

F6 GPIO_4 Input/Output GENERIC IO CMOS VIO BT_ACTIVE

F7 GPIO_5 Input/Output GENERIC IO CMOS VIO DAC_OUT

Power Supply

A1 VDD_BLE Input Main BLE Power Supply Power

A2 VDD_WLAN Input Main Wi-Fi Power Supply Power

A3 VIO Input Digital I/O Power Supply Power

B1 GND Ground Power

B2 GND Ground Power

C1 GND Ground Power

C2 GND Ground Power

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D2 GND Ground Power

E1 GND Ground Power

E2 GND Ground Power

F1 GND Ground Power

F2 GND Ground Power

F3 GND Ground Power

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Table 2 WE866E4-P Module Pin Signal Description (Continued)

Pins Name Input/Output Function Type Comments

F4 GND Ground Power

G1 GND Ground Power

G2 GND Ground Power

G4 GND Ground Power

G7 GND Ground Power

A7 GND Ground Power

C9 GND Ground Power

Reversed

B5 RESERVED RESERVED

D4 RESERVED RESERVED

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3.2 A Pad Layout

The following representation shows the top view of the Pad layout:

ABCDEFG

1 VDD_BLE GND GND ANT_1 GND GND GND

2 VDD_WLAN GND GND GND GND GND GND

3 VIO UART0_CTS UART1_RX

4 UART0_TXD UART0_RTS UART_TX RES USB_VDD GND GND

5 UART0_RX RES I2S_SYNC I2S_SCK USB_DP

6 SDIO_D2 SDIO_D1 I2S_SDI I2S_SDO USB_DM

SDIO_D3

7 GND

8 ADC_IN1 JTAG_TCK JTAG_TD0 JTAG_TMS JTAG_TDI

SPI_MOSI

UART0_RTS

SDIO_D0

SPI_MISO

UART0_RXD

GPIO_1

WAKEUP

SDIO_CLK

SPI_CLK

UART0_CTS

GPIO_2

BT_PRIORITY

SDIO_CMD

SPI_CS

UART0_TXD

GND ANT_2

GPIO_3

Wi-Fi Active

GPIO_4

BT_ACTIVE

GPIO_5

DAC_OUT1

GPIO_6

I2C_SDA

WiFi_EN

BT_EN

GPIO_7

I2C_SCL

GND

9 ADC_IN2 ADC_IN3 GND

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SPI_CS

(MASTER)

GPIO

SPI_CLK

(MASTER)

GPIO

SPI_MOSI

(MASTER)

GPIO

SPI_MISO

(MASTER)

GPIO

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Chapter 4 Power Supply

• Power Supply Requirements, page 17

• Power Consumption, page 17

• General Design Rules, page 18

4.1 Power Supply Requirements

Table 3, page 17 provide the Power supply requirements of WE866E4-P module.

Power Supply Minimum Typical Maximum

Table 3 Power Supply Requirements

Absolute Maximum to avoid permanent damage at any power supply pin

Recommended-VDD_BLE, VDD_WLAN, USB_VDD

Recommended VIO 3.14/1.71V 3.3V/1.8V 3.46V/1.86V

Note: The ADC cannot be used if VIO is not equal to 1V8.

4.2 Power Consumption

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Table 4, page 17 lists the types of Power Consumption.

-0.3V 4.0V

3.14V 3.3V 3.46V

Table 4 Power Consumption

Power Consumption Typical

POWER DOWN WiFi_EN=0, BT_EN=0 TBD μA

Suspend TBD μA

Host OFF TBD μA

Sleep TBD μA

ON; Radio OFF TBD mA

BLE RX TBD mA

BLE TX TBD mA

WiFi RX TBD mA

WiFi TX TBD mA

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DTIM=1 TBD mA

DTIM=3 TBD μA

DTIM=10 TBD μA

4.3 General Design Rules

It is recommended to provide a 10μF capacitors right next to the VDD_WLAN and BT pins, and 2.2μF at each of the other power supply pins like VIO.

Table 4 Power Consumption

Power Consumption Typical

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Chapter 5 Digital Section

• Logic Levels, page 19

• Power Up/Down Sequence, page 20

• Power ON Reset Time, page 20

• Unconditional Shutdown, page 20

• Communication Ports, page 21

• General Purpose Input/Output, page 22

5.1 Logic Levels

Table 5, page 19 describes the logic level of the voltage between signal and ground.

Table 5 Logic Level

Parameter Minimum Maximum

Input level on any digital pin -0.3V VIO + 0.3V

Levels with VIO = 3.3V

Input high level 2.4V 3.6V

Input low level -0.3V 0.3V

Output high level 3.0V 3.6V

Output high level -0.3V 0.4V

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Levels with VIO = 3.3.V Typical

Input current

Output current

60 μA (Rod is ON)

0.1 μA (Rpd is OFF)

60 μA (Rod is ON)

0.1 μA (Rpd is OFF)

5mA (x4 drive strength)

3.3mA (x2 drive strength)

2.6(x1 drive strength)

5mA (x4 drive strength)

Output current

Note: The ADC cannot be used if VIO is not equal to 1V8.

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3.3mA (x2 drive strength)

2.6(x1 drive strength)

WE866E4-P Module Hardware User Guide

5.2 Power Up/Down Sequence

The BT_EN is the main power enable pin including the WIFI_EN. All supplies should be stable for a minimum of 10 μs before BT_EN is de-asserted (i.e, greater than VIL for VIO). If VIO = 3.3V, then VDD_BLE, VDD_WLAN, and VIO shares the same 3.3V power (see Figure 1, page 20).

Figure 1 Power Up/Down Sequence

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5.3 Power ON Reset Time

Table 6, page 20 describes the Power ON reset time.

Parameter Description Minimum Maximum Units

Rise time of poweer to 90% of final voltage

Minimum of 10 uS before BLE_EN is asserted

Table 6 Power ON Reset Time

N/A 25 ms

10 N/A μs

5.4 Unconditional Shutdown

The BT_EN is used for unconditional shutdown.

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5.5 Communication Ports

5.5.1 High Speed UART

High-speed Universal Asynchronous Receiver/Transmitter (UART) interfaces is configured to serve either as a host interface link or a debug message console.

Two HS UART interfaces are present, one with dedicated pin out and second sharing the pins with the SDIO interface pins.

Table 7, page 21 describes the High Speed UART Configuration for WE866E4-P.

Property Configuration

Table 7 High Speed UART Configuration

5.5.2 Low Speed UART

High-speed Universal Asynchronous Receiver/Transmitter (UART) interfaces is

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configured to serve either as debug port.

Table 8, page 21 describes the Low Speed UART Configuration for WE866E4-P.

Baudrate

Data Bits 8-Bits

Flow Control CTS/RTS

Parity None

Stop Bits 1

Bit Order LS Bit First

Property Configuration

Baudrate Up to 115200 bps, no auto-baud rate detection, debug port

115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command

Table 8 Low Speed UART Configuration

Data Bits 8-Bits

Flow Control CTS/RTS

Parity None

Stop Bits 1

Bit Order LS Bit First

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5.5.3 SDIO

One SDIO Slave interface.

– Compliant to SDIO v2.0 specification

– Interface clock frequency up to 48 MHz

– Data transfer modes: 4-bit SDIO, 1-bit SDIO, SPI

5.5.4 SPI

The two general-purpose SPI interfaces are one configured as dedicated master and the other configured as master/slave pin-mux with SDIO interface pins.

– Interface clock frequency up to 48 MHz

5.5.5 I2C

The I2C Master/Salve interface have weak internal processing unit. So add external processing unit of 4.7K down to 1K, if needed.

5.5.6 USB

USB 2.0 device interface, provide a simplified, high-speed and scalable manufacturing test and configuration for QCA4020-based systems.

5.6 General Purpose Input/Output

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It is a special signaling GPIO.

5.6.1 ADC Converter

Analog to Digital Converter (ADC) measurements for inputs:

– 12-bit ADC up to 1Msps

– Alternatively 1 differential input, -1.75V to +1.75V, common mode 0.875V

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Chapter 6 RF Section

• RF Variants, page 23

• TX Output Power, page 24

• RX Sensitivity, page 26

• Wi-Fi Antenna Requirements, page 27

• BlueTooth Antenna Requirements, page 29

6.1 RF Variants

6.1.1 Wi-Fi

6.1.2 Bluetooth

Table 9, page 23 describes the Wi-Fi RF Frequency band.

Table 9 Wi-Fi Frequency Band

RF Frequency Channel Range Units

2.4GHz RF Frequency range

5GHz RF Frequency range

Center channel frequency at 5MHz spacing

2.412 ≤ Fc ≤

2.484

4.9 ≤ Fc ≤ 5.925 GHz

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Table 10, page 23 describes the Bluetooth RF Frequency band.

Table 10 Wi-Fi Frequency Band

RF Frequency Channel Range Units

RF Frequency range

Fc=2402 + k × 2 MHz,

where k = 0, ..., 39

2.4 ≤ F ≤ 2.4835. GHz

GHz

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6.2 TX Output Power

6.2.1 Wi-Fi

6.2.1.1 For 2.4GHz

Table 11, page 24 lists the Wi-Fi RF Frequency Transmission for 2.4GHz.

Table 11 Wi-Fi RF Frequency Transmission for 2.4GHZ

Standard Modulation Data rates

Index

BPSK 1 Mbps 19 NA NA dBm

802.11b

802.11g

QPSK 2 Mbps 19 NA NA dBm

CCK 5.5 Mbps 19 NA NA dBm

CCK 11 Mbps 19 NA NA dBm

BPSK 6 Mbps 19 NA NA dBm

BPSK 9 Mbps 19 NA NA dBm

QPSK 12 Mbps 19 NA NA dBm

QPSK 18 Mbps 18 NA NA dBm

16 QAM 24 Mbps 18 NA NA dBm

16 QAM 36 Mbps 18 NA NA dBm

64 QAM 48 Mbps 18 NA NA dBm

64 QAM 54 Mbps 18 NA NA dBm

BPSK MCS0 NA 19 18 dBm

QPSK MCS1 NA 19 18 dBm

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2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask compliance at balun output at 25 °

802.11b/g 802.11n 20 MHz 802.11n 40 MHz Unit

Typ Typ Ty p

QPSK MCS2 NA 19 18 dBm

802.11n

Note: The performance includes balun, but excludes external duplexer, filter and external switch loss.

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16 QAM MCS3 NA 18 18 dBm

16 QAM MCS4 NA 18 18 dBm

64 QAM MCS5 NA 17 17 dBm

64 QAM MCS6 NA 17 17 dBm

64 QAM MCS7 NA 17 17 dBm

WE866E4-P Module Hardware User Guide

6.2.1.2 For 5GHz

Table 12, page 25 lists the Wi-Fi RF Frequency Transmission for 5GHz.

Table 12 Wi-Fi RF Frequency Transmission for 5GHZ

Standard Modulation Data rates

Index

BPSK 6 Mbps 16 NA NA dBm

BPSK 9 Mbps 16 NA NA dBm

QPSK 12 Mbps 16 NA NA dBm

QPSK 18 Mbps 16 NA NA dBm

802.11b 16 QAM 24 Mbps 16 NA NA dBm

16 QAM 36 Mbps 14 NA NA dBm

64 QAM 48 Mbps 13 NA NA dBm

64 QAM 54 Mbps 13 NA NA dBm

BPSK 6 Mbps 19 NA NA dBm

BPSK 9 Mbps 19 NA NA dBm

QPSK 12 Mbps 19 NA NA dBm

QPSK 18 Mbps 18 NA NA dBm

802.11g 16 QAM 24 Mbps 18 NA NA dBm

16 QAM 36 Mbps 18 NA NA dBm

2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask compliance at balun output at 25 ° Degrees

802.11b/g 802.11n 20 MHz 802.11n 40 MHz Unit

Typ Ty p Typ

64 QAM 48 Mbps 18 NA NA dBm

64 QAM 54 Mbps 18 NA NA dBm

BPSK MCS0 NA 16 15 dBm

QPSK MCS1 NA 16 15 dBm

QPSK MCS2 NA 15 14 dBm

16 QAM MCS3 NA 15 14 dBm

802.11n 16 QAM MCS4 NA 14 13 dBm

64 QAM MCS5 NA 14 13 dBm

64 QAM MCS6 NA 13 12 dBm

64 QAM MCS7 NA 13 12 dBm

Note: The performance includes balun, but excludes external duplexer, filter and external switch loss.

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6.2.2 Bluetooth

Table 13, page 26 lists the Bluetooth Transmission.

TX Characteristic Rate Min Type Max Units

Table 13 Bluetooth Transmission

Max RF Output Power

LE 1M 1.5 4 4.3 dBm

LE 2M 1.5 4 4.2 dBm

Note:

1).Measurement data is at chip output, 25°C, 1.8V IO. 2).When Tx power higher than 4dBm, an external BPF is required for out of band emission. BPF spec is upon the external PA is selected.

6.3 RX Sensitivity

6.3.1 Wi-Fi

6.3.1.1 For 2.4GHz

Table 14, page 26 lists the RX Sensitivity for 2.4GHz.

Table 14 RX Sensitivity for 2.4GHZ

Standard Modulation Data rates

Index

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BPSK 1 Mbps 19 NA NA dBm

2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask compliance at balun output at 25 °Degrees

802.11b/g 802.11n 20 MHz 802.11n 40 MHz Unit

Typ Typ Ty p

802.11b

802.11g

Note: The performance includes balun, but excludes external duplexer, filter and external switch loss.

6.3.1.2 For 5GHz

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QPSK 2 Mbps 19 NA NA dBm

CCK 5.5 Mbps 19 NA NA dBm

CCK 11 Mbps 19 NA NA dBm

BPSK 6 Mbps 19 NA NA dBm

BPSK 9 Mbps 19 NA NA dBm

Table 15, page 27 lists the RX Sensitivity for 5GHz.

WE866E4-P Module Hardware User Guide

Table 15 RX Sensitivity for 5GHZ

Standard Modulation Data rates

Index

BPSK 6 Mbps -93 NA NA dBm

802.11b 64 QAM 54 Mbps -75.5 NA NA dBm

BPSK MCS0 NA -93 -90 dBm

802.11g 64 QAM MCS7 NA -72.5 -69 dBm

Note: The performance includes balun, but excludes external duplexer, filter and external switch loss.

6.3.2 Bluetooth

Table 16, page 27 lists the Bluetooth RX Sensitivity.

Table 16 Bluetooth RX Sensitivity

RX Characteristic Rate Min Type Max Units

RX Sensitivity 1Mbps <-= -70dBM -97 -99 dBm

Note: Measurement data is at chip output, 25°C, 1.8V IO.

2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask

802.11b/g 802.11n 20 MHz 802.11n 40 MHz Unit

Typ Typ Ty p

compliance at balun output at 25 °

6.4 Wi-Fi Antenna Requirements

Special care must be taken during the design of the RF section on the application board.

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CAUTION! : If The below recommendation is strictly not followed then RF performance degradation and infringements of emission limits will occur

A 50Ω antenna is required with Telit’s WE866E4-P module interface features an SMA connector for an external antenna, alternatively a chip or a printed antenna can be used.

If an integrated or printed antenna is used, it is recommended to place it at the edge of the application board. Since the antenna impedance is required to be tuned to 50Ω.

It is recommended to foresee a PI matching network between the WE866E4-P module and the antenna during first prototyping. If not, a series 0Ω-resistor can be used, leaving the two shunt components unpopulated.

To meet Telit’s FCC certification standard, the antenna on the application board should have a gain value equal/less then the one recommended by Telit.

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6.4.1 PCB Design Guidelines

The WE866E4-P module provides a 50Ω antenna pad, which is routed to the antenna connector (or the integrated antenna) by means of a transmission line.

It is important that the impedance of this line is controlled to 50Ω. The line should be as short as possible with a constant cross section and without abrupt curves. It is isolated from any other noise sources and cross overs from other lines in adjacent layers. Instead, a continuous ground plane is recommended under the antenna trace and a ground via curtain should connect to the coplanar ground planes.

An example of implementation - the details of the antenna trace on the WE866E4-P interface board is as described:

A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as required in this case. A SMA female connector has been used to feed the line.

The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width of 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of the trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB.

Figure 2, page 28 shows the line geometry:

Figure 2 PCB Design

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6.4.2 PCB Guidelines in case of FCC Certification

TBD

6.5 BlueTooth Antenna Requirements

6.5.1 PCB Design Guidelines

TBD

6.5.2 PCB Guidelines in case of FCC Certification

TBD

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Chapter 7 Audio Section

• Electrical Characteristics, page 31

• Codec Examples, page 31

7.1 Electrical Characteristics

The audio interface is only digital, through the I2S.The voltage of this interface pins have same electrical characteristics as for digital pins and are related to the power bank VIO.

7.2 Codec Examples

TBD

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Chapter 8 Mechanical Design

• Drawing, page 33

8.1 Drawing

Figure 3, page 33 shows the Mechanical Design of the module.

Figure 3 Mechanical Design

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Figure 4, page 34 shows the Top View of WE866E4-P module.

Figure 4 Top View of WE866E4-P Module

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Chapter 9 Application PCB Design.

• Footprint, page 35

• PCB Pad Design, page 37

• PCB Pad Dimension, page 38

• Stencil, page 39

• Solder Paste, page 39

• Solder Re-flow, page 39

9.1 Footprint

Figure 5, page 35 shows the top view Footprint of copper pad pattern.

Figure 5 Copper pad Pattern - Top View

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Figure 6, page 36 shows the Pad A details.

Figure 6 Pad A Details

Figure 7, page 36 shows the Pad details.

Figure 7 Pad Details

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Figure 8, page 37 shows the top view of Solder resist pattern.

Figure 8 Solder Resist Pattern-Top View

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9.2 PCB Pad Design

Non-Solder Mask Defined (NSMD) type is recommended for the solder pads on the PCB.

Figure 9, page 38 shows the PCB pad design.

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Figure 9 Solder Pads on PCB

9.3 PCB Pad Dimension

It is not recommended to place or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself. Holes in the pad are allowed only for blind holes and not for through holes. Figure 10, page 38 shows the Pad dimension:

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Figure 10 Solder Resist Pattern-Top View

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9.3.1 Recommendations for PCB Pad Surface

Table 17, page 39 provides the recommendation for PCB Pad Surface.

Table 17 Recommendation for PCB Pad Surface

9.4 Stencil

9.5 Solder Paste

Finish Layer Thickness

(um)

Electro-less Ni/Immersion Au

The PCB must be able to resist higher temperatures which occurs at the lead-free process. This issue should be discussed with the PCB supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

It is not necessary to panel the application PCB, however it is suggested to use milled contours and pre-drilled board breakouts. Scoring or v-cut solutions are not recommended.

3 - 7/ 0.03 - 0.15

Good solderability protection, high shear force values

Properties

Stencil’s apertures layout can be the same of the recommended footprint (1:1), a thickness of stencil foil ≥ 120 μm is suggested.

It is recommended to use only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. The lead-free solder paste is Sn/Ag/Cu.

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9.6 Solder Re-flow

Figure 11, page 40 shows the recommended solder profile re-flow:

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Figure 11 Solder Re-flow Profile

Table 18, page 40 provides the Solder re-flow profile features and its Pb-Free Assembly.

Table 18 Solder Re-flow Parameters

Profile Features Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat

Temperature Min (Tsmin) 150°C

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Temperature Max (Tsmax) 200°C

Time (min to max) (ts) 60-180 seconds

Tsmax to TL

Ramp-up rate 3°C/second max

Time Maintained

Temperature (TL) 217°C

Time (t) 60-150 seconds

Peak Temperature (Tp) 245 +0/-5°C

Time within 5°C of actual Peak Temperature (tp)

10-30 seconds

Ramp-down Rate 6°C/second max

Time 25°C to Peak Temperature 8 minutes max

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NOTE: All temperatures refer to topside of the package, measured on the package body surface.

CAUTION! WE866E4 module withstands one re-flow process only.

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Chapter 10 Packaging

• Tray, page 43

• Reel, page 44

• Moisture Sensitivity, page 46

10.1 Tray

The WE866E4-P modules are packaged in trays of 50 pieces each where small quantities are required (i.e. for test and evaluation purposes). Trays are not designed to be used in SMT processes for pick and place handling.

Figure 12 Packaging in Trays

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10.2 Reel

Figure 13, page 44 shows WE866E4-P modules that are packaged on reels of 200 pieces

each.

Figure 13 Reel - Packaging

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Figure 14, page 45 shows the schematic representation of Packaging.

Figure 14 Reel - Packaging in Trays

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CAUTION! These trays can withstand a maximum temperature of 65°C.

10.3 Moisture Sensitivity

According to IPC/JEDEC J-STD-020 standards the moisture sensitivity level of the WE866E4-P module Product is “3”. To use such a component the customer has to take care of the following conditions:

a. The shelf life of the Product inside the dry bag is 12 months - from the seal date of

the bag, when stored in a non-condensing atmospheric environment of < 40°C and < 90% RH.

b. Environmental condition during the production: <= 30°C / 60% RH according to

IPC/JEDEC J-STD-033B.

c. The maximum time between the opening of the sealed bag and the re-flow process

must be 168 hours if condition (b) “IPC/JEDEC J-STD-033B paragraph 5.2” is followed.

d. Baking is required if conditions (b) or (c) are not followed.

e. Baking is required if the humidity indicator inside the bag indicates 10% RH or

more.

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Chapter 11 Conformity Assessment Issue

• FCC/IC Regulatory Notice, page 47

11.1 FCC/IC Regulatory Notice

TBD

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Chapter 12 Safety Recommendation

• Read Carefully, page 49

12.1 Read Carefully

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the GSM network or external devices or

PRELIMINAR

having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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Chapter 13 Acronyms

TTSC

USB

DTE

UMTS

WCDMA

HSDPA

HSUPA

UART

HSIC

BLE

SPI

ADC

DAC

Telit Technical Support Centre

Universal Serial Bus

High Speed

Data Terminal Equipment

Universal Mobile Telecommunication System

Wide band Code Division Multiple Access

High Speed Downlink Packet Access

High Speed Uplink Packet Access

Universal Asynchronous Receiver Transmitter

High Speed Inter Chip

Bluetooth low energy

Serial Peripheral Interface

Analog – Digital Converter

Digital – Analog Converter

I/O

PRELIMINAR

GPIO

CMOS

MOSI

MOSO

CLK

MRDY

SRDY

RTC

PCB

ESR

VSWR

Input Output

General Purpose Input Output

Complementary Metal – Oxide Semiconductor

Master Output – Slave Input

Master Input – Slave Output

Clock

Master Ready

Slave Ready

Chip Select

Real Time Clock

Printed Circuit Board

Equivalent Series Resistance

Voltage Standing Wave Radio

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VNA

Vector Network Analyzer

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Document History

Revision Date Changes

0.0 January 2018 Initial Release.

1.0 March 2018

1.1 May 2018 Watermarked “PRELIMINARY”.

1.2 July 2018

Added Figure 4Top View of WE866E4-P

Module, page 34

Updates to Figure 3, page 33, Figure 4,

page 34

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Telit Wireless Solutions WE866E4-P Hardware User's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

Chapter 1 Introduction

1.1 Scope

1.2 Audience

1.3 Contact Information, Support

1.4 Text Convention

Table 1 Symbol Conventions

1.5 Related Documents

1.5.1 Related Documents and Download

1.5.2 Related Documents requiring a Non Disclosure Agreement

Chapter 2 Overview

Chapter 3 Pin Allocation

3.1 Pins Out

Table 2 WE866E4-P Module Pin Signal Description

3.2 A Pad Layout

Chapter 4 Power Supply

4.1 Power Supply Requirements

Table 3 Power Supply Requirements

4.2 Power Consumption

Table 4 Power Consumption

4.3 General Design Rules

Chapter 5 Digital Section

5.1 Logic Levels

Table 5 Logic Level

5.2 Power Up/Down Sequence

5.3 Power ON Reset Time

Table 6 Power ON Reset Time

5.4 Unconditional Shutdown

5.5 Communication Ports

5.5.1 High Speed UART

Table 7 High Speed UART Configuration

5.5.2 Low Speed UART

Table 8 Low Speed UART Configuration

5.5.3 SDIO

5.5.4 SPI

5.5.5 I2C

5.5.6 USB

5.6 General Purpose Input/Output

5.6.1 ADC Converter

Chapter 6 RF Section

6.1 RF Variants

6.1.1 Wi-Fi

6.1.2 Bluetooth

Table 9 Wi-Fi Frequency Band

Table 10 Wi-Fi Frequency Band

6.2 TX Output Power

6.2.1 Wi-Fi

6.2.1.1 For 2.4GHz

Table 11 Wi-Fi RF Frequency Transmission for 2.4GHZ

6.2.1.2 For 5GHz

Table 12 Wi-Fi RF Frequency Transmission for 5GHZ

6.2.2 Bluetooth

Table 13 Bluetooth Transmission

6.3 RX Sensitivity

6.3.1 Wi-Fi

6.3.1.1 For 2.4GHz

Table 14 RX Sensitivity for 2.4GHZ

6.3.1.2 For 5GHz

Table 15 RX Sensitivity for 5GHZ

6.3.2 Bluetooth

Table 16 Bluetooth RX Sensitivity

6.4 Wi-Fi Antenna Requirements

6.4.1 PCB Design Guidelines

6.4.2 PCB Guidelines in case of FCC Certification

6.5 BlueTooth Antenna Requirements

6.5.1 PCB Design Guidelines

6.5.2 PCB Guidelines in case of FCC Certification

Chapter 7 Audio Section

7.1 Electrical Characteristics

7.2 Codec Examples

Chapter 8 Mechanical Design

8.1 Drawing

Chapter 9 Application PCB Design.

9.1 Footprint

9.2 PCB Pad Design

9.3 PCB Pad Dimension