WE866 HW User Guide
1VV0301330 Rev. 3 Page 6 of 54 2018-03-13
5. DIGITAL SECTION .................................................................... 22
Logic Levels ................................................................................ 22
Power On.................................................................................... 22
Power Off.................................................................................... 23
Low power deep sleep ................................................................ 24
Hibernate .................................................................................... 24
Shutdown.................................................................................... 24
Communication ports .................................................................. 25
5.7.1. SPI.............................................................................................. 25
5.7.2. UART .......................................................................................... 26
6. RF SECTION .............................................................................. 28
Bands Variants ........................................................................... 28
TX Output power ......................................................................... 29
RX Sensitivity ............................................................................. 30
Antenna requirements................................................................. 30
6.4.1. PCB Design guidelines ............................................................... 31
6.4.2. PCB Guidelines in case of FCC Certification .............................. 32
7. MECHANICAL DESIGN ............................................................. 33
Drawing ...................................................................................... 33
8. APPLICATION PCB DESIGN .................................................... 34
Footprint ..................................................................................... 34
PCB pad design .......................................................................... 36
PCB pad dimensions .................................................................. 36
Stencil ......................................................................................... 37
Solder paste ............................................................................... 38
Solder Reflow ............................................................................. 38
9. PACKAGING .............................................................................. 40
Tray ............................................................................................ 40
Reel ............................................................................................ 41
Moisture sensitivity ..................................................................... 43
10. CONFORMITY ASSESSMENT ISSUES .................................... 44
FCC/IC Regulatory notices ......................................................... 44
2014/53/EU Directive .................................................................... 47
11. SAFETY RECOMMENDATIONS................................................ 50
READ CAREFULLY .................................................................... 50