Telit Wireless Solutions NE866B1 Hardware Design Manual

Mod.0818 2017-01 Rev.0

NE866B1

HW Design Guide

1VV0301354 Rev. 6 – 2018-02-28

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM

WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE

USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE

PRODUCTS

NE866B1-E1

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Contents

NOTICE 2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

APPLICABILITY TABLE ................................................................................ 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 8

Scope ........................................................................................... 8

Audience....................................................................................... 8

Contact Information, Support ........................................................ 8

Text Conventions .......................................................................... 9

Related Documents .................................................................... 10

2. GENERAL PRODUCT DESCRIPTION ...................................... 11

Overview..................................................................................... 11

Product Variants and Frequency Bands ...................................... 11

Target market ................................................................ ............. 12

Main features .............................................................................. 12

TX Output Power ........................................................................ 13

RX Sensitivity ............................................................................. 13

Mechanical specifications ........................................................... 13

2.7.1. Dimensions ................................ ................................................. 13

2.7.2. Weight ................................ ........................................................ 13

Temperature range ..................................................................... 14

3. PINS ALLOCATION ................................................................... 15

Pin-out ........................................................................................ 15

LGA Pads Layout ........................................................................ 20

4. POWER SUPPLY ....................................................................... 21

Power Supply Requirements ....................................................... 21

Power Consumption ................................................................... 22

General Design Rules ................................................................. 23

4.3.1. Electrical Design Guidelines ....................................................... 23

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4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 23

4.3.1.2. +12V Source Power Supply Design Guidelines .......................... 24

4.3.1.3. Battery Source Power Supply Design Guidelines ........................ 25

4.3.2. Thermal Design Guidelines ......................................................... 26

4.3.3. Power Supply PCB layout Guidelines ......................................... 27

VAUX/PWRMON Power Output .................................................. 28

3GPP Power Saving Mode (PSM) .............................................. 29

4.5.1. LP_WAKE design guide .............................................................. 30

5. DIGITAL SECTION .................................................................... 31

Logic Levels ................................................................................ 31

Power On.................................................................................... 32

Unconditional Restart.................................................................. 34

Power OFF procedure ................................................................ 37

Communication ports .................................................................. 38

5.5.1. Serial Ports ................................................................................. 38

5.5.1.1. MODEM SERIAL PORT 1 .......................................................... 38

5.5.1.2. MODEM SERIAL PORT 2 .......................................................... 40

5.5.1.3. RS232 LEVEL TRANSLATION ................................................... 40

General purpose I/O ................................................................... 42

5.6.1. Using a GPIO as an INPUT ........................................................ 43

5.6.2. Using a GPIO as an OUTPUT .................................................... 43

I2C Port ...................................................................................... 44

SIM Interface .............................................................................. 44

5.8.1. SIMIN Detection .......................................................................... 44

ADC Converter ........................................................................... 44

6. RF SECTION .............................................................................. 45

Bands Variants ........................................................................... 45

TX Output power ......................................................................... 45

RX Sensitivity ............................................................................. 45

RED requirements ...................................................................... 45

Antenna requirements................................................................. 46

6.5.1. Main Antenna ............................................................................. 46

6.5.2. PCB design guidelines ................................................................ 47

6.5.3. Antenna installation Guidelines ................................................... 48

7. MECHANICAL DESIGN ............................................................. 49

Mechanical Dimensions .............................................................. 49

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7.1.1. Mechanical Drawing ................................................................... 49

7.1.2. Top View..................................................................................... 49

7.1.3. Bottom View (as seen from bottom side)..................................... 50

7.1.4. Side View.................................................................................... 51

8. APPLICATION PCB DESIGN ................................ .................... 52

Recommended footprint for the application ................................. 52

PCB pad design .......................................................................... 53

PCB pad dimensions .................................................................. 54

Stencil ......................................................................................... 55

Solder paste ............................................................................... 55

NE866B1 Solder reflow ............................................................... 56

9. PACKING SYSTEM ................................................................... 57

Tray ............................................................................................ 57

Tray Drawing .............................................................................. 59

Tape & Reel ................................................................................ 60

Carrier Tape Drawing.................................................................. 61

Moisture sensitivity ..................................................................... 61

10. CONFORMITY ASSESSMENT ISSUES .................................... 62

Declaration of Conformity ........................................................... 62

11. SAFETY RECOMMENDATIONS................................................ 63

READ CAREFULLY .................................................................... 63

12. REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 64

13. ACRONYMS ............................................................................... 67

14. DOCUMENT HISTORY .............................................................. 69

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1. INTRODUCTION

Scope

This document introduces the Telit NE866B1 module and presents possible and
recommended hardware solutions for developing a product based on this module. All the
features and solutions detailed in this document are applicable to all NE866B1 variants,
where NE866B1 refers to the variants listed in the applicability table.

Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for properly
developing your product with the Telit module.

Audience

This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit module.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:

• [e-mail]

• [e-mail]

• [e-mail]

• [e-mail]

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Text Conventions

Danger – This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be
useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents

• SIM INTEGRATION DESIGN GUIDE 80000NT10001A

• NE866B1_NL865B1_AT_Commands_Reference_Guide 80534ST10817A

• Telit EVB User Guide 1VV0301249

• xE866_IFBD_HW_USER_GUIDE 1VV0301368

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2. GENERAL PRODUCT DESCRIPTION

Overview

The NE866B1 is the first Category NB1 - aka Narrowband IoT (NB-IoT) - product in the Telit
portfolio. Specified in the Release 13 of the 3GPP standard, Cat NB1 devices are
specifically tailored for IoT applications, offering optimized power consumption and
enhanced coverage. In addition, with its ultra compact 15 x 19 mm LGA footprint, the
NE866B1 is designed for size sensitive applications.

This next generation of products supports the new features specified by 3GPP to boost IoT
applications, such as the Power Saving Mode (PSM) and the extended Discontinuous
Reception (eDRX), which allow the devices to wake up periodically to deliver only very small
amounts of data to the network and then go back to sleep for most of the time, thus allowing
longer battery operation. Enhanced coverage, with up to +20dB in maximum coupling loss
(MCL) compared to the other cellular technologies, is also one of the key benefits of this
new LTE flavor. LTE Cat NB1 devices are therefore optimized in cost, size and power
consumption compared to higher UE categories. These advantages make the NE866B1 the
perfect platform to enable a quick implementation of LTE technology in IoT/M2M where low
cost and low power are more relevant than high speed.

The NE866B1 helps increase the addressable market for LTE technology to include a broad
range of new applications and use cases best served with lower maximum data rate, ultra­low power, reduced complexity and cost. Some examples are smart metering, smart
parking, smart agriculture, waste collection, industrial sensors, healthcare monitors, home
automation, and many more low data rate IoT devices. The NE866B1 is offered in a dual­band configuration for deployment in the European and Chinese NB-IoT networks, either in
in-band, guard-band or standalone mode; additional regional variants will follow. It is highly
recommended for new designs, but also in particular as a migration path for existing GPRS
devices, both new and updated designs benefit from a significant extension in lifecycle with
LTE Cat NB1.

The NE866B1 supports embedded SIM chip as a mounting option, making it the ideal

solution for durable and rugged designs, and reducing BOM cost and size on the customer’s

application.

Product Variants and Frequency Bands

NE866B1 bands combinations are listed below:

Product

2G Band
(MHz)

3G Band
(MHz)

4G Band
(MHz)

Region

NE866B1-E1

B20 (800)
B8 (900)

Europe

Refer to Chapter 13 for details information about frequencies and bands.

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Target market

NE866B1 can be used for IoT applications, where low power consumption and enhanced
coverage are required rather than high speed data, for example:

• Smart metering

• Smart parking

• Smart agriculture

• Waste collection

• Industrial sensors

• Healthcare monitors

• Home automation

Main features

Function

Features

Modem

• NB-IoT cellular modem for low BW data communication

• Real Time Clock

• Internal IP stack

Interfaces

• Main UART for AT commands

• Auxiliary UART

• I2C

• SPI

• GPIOs

• ADC

• Antenna ports

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TX Output Power

Band

Power class

LTE All Bands

Class 3 (23dBm)

RX Sensitivity

Product

Band

Sensitivity (dBm)

NE866-B1-E1

B8, B20

-113

Mechanical specifications

2.7.1. Dimensions

The overall dimensions of NE866 family are:

 Length: 19 mm
 Width: 15 mm
 Thickness: 2.2 mm

2.7.2. Weight

The nominal weight of the module is 1.5 grams.

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Temperature range

Case

Range

Note

Operating Temperature

Range

–20°C ÷ +55°C

The module is fully

functional(*) in all the

temperature range, and it

fully meets the 3GPP

specifications.

–40°C ÷ +85°C

The module is fully

functional (*) in all the

temperature range.

Storage and non-

operating Temperature

Range

–40°C ÷ +85°C

(*) Functional: the module is able to make and receive data calls and SMS.

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3. PINS ALLOCATION

Pin-out

Pin

Signal

I/O

Function

Type

Comment

Asynchronous Serial Port - Prog. / Data / SPI / I2C / GPIO

A4

TXD

I

Serial data input

from DTE

CMOS 1.8V

A5

RXD

O

Serial data output

to DTE

CMOS 1.8V

B1

GPIO1

I/O

GPIO

CMOS 1.8V

Default

function

SPI_CS

O

SPI External CS

CMOS 1.8V

Alternate

Function

I2C_SDA

I/O

I2C Data

CMOS 1.8V

Alternate

Function

A1

SPI_CLK

O

SPI Clock

CMOS 1.8V

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Asynchronous Auxiliary Serial Port 2 / SPI / I2C / GPIO

C1

TX_AUX

O

Auxiliary UART

(TX Data to DTE)

CMOS 1.8V

Primary Logging

Port

Default Function

SPI_MOSI

O

SPI Master Data

Out

CMOS 1.8V

Alternate

Function

GPIO2

I/O

GPIO

CMOS 1.8V

Alternate

Function

C2

GPIO3

I/O

GPIO

CMOS 1.8V

Default Function

SPI_MISO

I

SPI Master Data

In

CMOS 1.8V

Alternate

Function

I2C_SCL

I/O

I2C Clock

CMOS 1.8V

Alternate

Function

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SIM card interface

C7

SIMVCC

-

External SIM signal

– Power supply for

the SIM

1.8V Only

See next
chapters

B7

SIMRST

O

External SIM signal

– Reset

CMOS 1.8

A7

SIMCLK

O

External SIM signal

– Clock

CMOS 1.8

A6

SIMIO

I/O

External SIM– Data

I/O

CMOS 1.8

B5

SIMIN

I

SIM Presence

input

CMOS 1.8

See next
chapters

ADC

F4

ADC_IN1

AI

Analog/Digital

converter input

A/D

RF Section

G2

ANT

I/O

LTE Main Antenna

(50 ohm)

RF

Miscellaneous Functions

G4

RESET*

I

Reset Input

VBATT

Pull up to

VBATT

(10Kohm)

G5

SLP_IND

O

Modem Sleep or

PSM Indication

CMOS 1.8

Do not Drive

this pad

G6

VAUX/POWE

RMON

O

1.8V stabilized
output

Power

D3

LP_WAKE

I

LPM / PSM Wake

Up

Analog

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Power Supply

E1

VBATT

-

Main power supply

(Baseband)

Power

E2

VBATT

-

Main power supply

(Baseband)

Power

D1

GND

-

Ground

Power

F1

GND

-

Ground

Power

G1

GND

-

Ground

Power

D2

GND

-

Ground

Power

F2

GND

-

Ground

Power

C3

GND

-

Ground

Power

E3

GND

-

Ground

Power

F3

GND

-

Ground

Power

G3

GND

-

Ground

Power

F6

GND

-

Ground

Power

Reserved pins

A2

RESERVED

-

RESERVED

A3

RESERVED

-

RESERVED

B2

RESERVED

-

RESERVED

B3

RESERVED

-

RESERVED

B4

RESERVED

-

RESERVED

B6

RESERVED

-

RESERVED

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C4

RESERVED

-

RESERVED

C5

RESERVED

-

RESERVED

C6

RESERVED

-

RESERVED

D4

RESERVED

-

RESERVED

D5

RESERVED

-

RESERVED

D6

RESERVED

-

RESERVED

D7

RESERVED

-

RESERVED

E4

RESERVED

-

RESERVED

E5

RESERVED

-

RESERVED

E6

RESERVED

-

RESERVED

E7

RESERVED

-

RESERVED

F5

RESERVED

-

RESERVED

F7

RESERVED

-

RESERVED

G7

RESERVED

-

RESERVED

WARNING:
Reserved pins must not be connected

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LGA Pads Layout

TOP VIEW

NOTE:
Alternate functions are marked with dark blue text while default
functions are black text
For more information, please refer to the related SW documentation

WARNING

Reserved pins must not be connected.

A B C D E F G

1 SPI_CLK

GPIO1

SPI_CS

I2C_SDA

TX AUX

SPI_MOSI

GPIO2

GND VBATT GND GND

2 RFU RFU

GPIO3

SPI_MISO

I2C_SCL

GND VBATT GND ANT

3 RFU RFU GND LP_WAKE GND GND GND

4 TXD RFU RFU RFU RFU ADC_IN1 RESET*

5 RXD SIM_IN RFU RFU RFU RFU SLP_IND

6 SIMIO RFU RFU RFU RFU GND VAUX/PWRMON

7 SIMCLK SIMRST SIMVCC RFU RFU RFU RFU

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4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

The external power supply must be connected to VBATT signal and must fulfil the
following requirements:

Power Supply

Value

Power Supply

Nominal Supply Voltage

3.8V

Nominal Supply Voltage

Normal Operating Voltage

Range

3.40 V÷ 4.20 V

Normal Operating Voltage

Range

Extended Operating

Voltage Range

3.10 V÷ 4.20 V

Extended Operating

Voltage Range

NOTE:
The Operating Voltage Range MUST never be exceeded; care must

be taken when designing the application’s power supply section to

avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off
of the module.
Overshoot voltage (regarding MAX Extended Operating Voltage) and
drop in voltage (regarding MIN Extended Operating Voltage) MUST
never be exceeded;

The “Extended Operating Voltage Range” can be used only with

completely assumption and application of the HW User guide
suggestions.