Telit Wireless Solutions ME70-169 User Manual

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ME70-169 RF Module User Guide

1vv0301021 rev.3 – 2014-11-14

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ME70-169 RF Module User Guide

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APPLICABILITY TABLE

PRODUCT

ME70-169

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

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Contents

Introduction ............................................................................................................... 7

1.1.

Scope .................................................................................................................... 7

1.2.

ME70-169 Product Description ............................................................................. 7

1.3.

Contact Information, Support ................................................................................ 7

1.4.

Text Conventions .................................................................................................. 8

1.5.

Related Documents .............................................................................................. 9

Regulatory Conformance Information ................................................................... 10

2.1.

169 MHz band Requirements ............................................................................. 10

2.2.

Other Regulatory Requirements ......................................................................... 11

General Features ..................................................................................................... 12

3.1.

Main Functionalities ............................................................................................ 12

3.2.

Software .............................................................................................................. 12

3.3.

Temperature Operating Range ........................................................................... 12

3.4.

Mechanical Specifications ................................................................................... 13

3.5.

Mechanical drawing ............................................................................................ 14

3.6.

DC Specifications ................................................................................................ 15

3.7.

Radio Specifications ........................................................................................... 16

3.8.

Power comsumption ........................................................................................... 18

3.9.

Digital Specifications ........................................................................................... 19

3.10.

Absolute Maximum Ratings ............................................................................. 19

3.11.

Ordering Information ........................................................................................ 20

Pin-out and signals description ............................................................................. 22

4.1.

Module Pin OUT (Top View) ............................................................................... 22

4.2.

Module Pin-out table ........................................................................................... 23

4.3.

Pin-out of the Module DIP ................................................................................... 24

4.4.

Dip-Module Pin-out correspondence table .......................................................... 25

4.5.

Signals description .............................................................................................. 26

Process Information ................................................................................................ 27

5.1.

Delivery ............................................................................................................... 27

5.2.

Storage ............................................................................................................... 28

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5.3.

Soldering pad pattern .......................................................................................... 28

5.4.

Solder past .......................................................................................................... 29

5.5.

Placement ........................................................................................................... 29

5.6.

Soldering Profile (RoHS Process) ....................................................................... 29

Board Mounting Recommendation ........................................................................ 31

6.1.

Electrical environment ......................................................................................... 31

6.2.

Power supply decoupling on ME70-169 module ................................................. 31

6.3.

RF layout considerations .................................................................................... 32

6.4.

Antenna connections on printed circuit boards ................................................... 33

6.5.

Antenna Installation Guidelines ......................................................................... 34

6.6.

ME70-169 Interfacing .......................................................................................... 34

EC Declaration of Conformity ................................................................................ 37

Safety Recommendations ....................................................................................... 38

Glossary ................................................................................................................... 39

10. Document History ................................................................................................... 40

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1. Introduction

1.1. Scope

Scope of this document is to present the features and the application of the Telit ME70-169 radio modules (ME70-169).

1.2. ME70-169 Product Description

The ME70-169 module is a multi-channel radio board, delivering up to 1W in the 169 MHz ISM band (unlicensed frequency band). The module is provided with a UART interface for serial communication and –configuration and one RF output pin.

It is delivered with preloaded protocol stack:

• ME70-169: “Wireless M-Bus Part 4 Mode N” Protocol stack.

ME70-169 is fully compatible with low power version ME50-169. ME70-169 is pin-to-pin compatible with LE, NE and ME modules working at different

frequencies. ME70-169 is also pin-to-pin compatible with Telit ZE Family (ZigBee PRO stack).

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at:

TS-SRD@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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1.4. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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1.5. Related Documents

• [1] EN 300 220-2 v2.4.1, ETSI Standards for SRD , May 2012

• [2] ERC Rec 70-03, ERC Recommendation for SRD, October 2012

• [3] 2002/95/EC, Directive of the European Parliament and of the Council, 27 January

2003

• [4] SR Tool User Guide, 1vv0300899

• [5] 2006/771/EC, Harmonization of the radio spectrum for use by short-range devices

• [6] 2009/381/EC, Amending Decision 2006/771/EC on harmonization of the radio

spectrum for use by short-range devices

• [7] Wireless M-Bus EN 13757-4:2013 User Guide 1vv0300953

• [8] EN 13757-4 : 2013 Wireless M-Bus Part 4, 2013

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2. Regulatory Conformance Information

The module radio transmitter operations must be compliant with some regulatory requirements in terms of frequency bands and emitted power, as detailed below.

2.1. 169 MHz band Requirements

The “ERC recommendation 70-03 Annex 2” describes the 169 MHz license free band for meter reading, in terms of bandwidth, maximum power, duty cycle and channel spacing. It gives the following limitations:

ERC recommendation 70-03

Band Frequency band

(MHz)

Maximum

radiated power

(mW)

Channel spacing

(kHz)

Duty cycle

(%)

2b 169.4 – 169.475 500 Max 50 khz 10

These bands are free to use but the module and the user must respect some limitations. Most of these restrictions are integrated in the conception of the module, except the duty cycle. For example, the 2b band is limited to a 10% duty cycle. This means that each module is limited to a total transmit time of 6 minutes per hour. It is the responsibility of the user to respect the duty cycle.

National Restrictions for non specific SR devices Annex 2 band B:

Country Restriction Reason/Remark Band F

Austria Not implemented Planned Belgium No info Bulgaria Not implemented The band is used for national security needs Croatia Limited implementation Individual licence required Cyprus Cyprus has implemented Decision 2005/928/EC Georgia Not implemented Greece Not implemented Norway Limited Maximum radiated power = 10 mW Russian Federation

Not implemented

The Netherlands

Implemented Channel spacing 12.5 khz

Ukraine Not implemented Under study

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2.2. Other Regulatory Requirements

Furthermore, the module complies with the ETSI 300 220-2 v2.4.1 standards (specific for SRD).

ME70-169 also complies which EN 13757-4 standards (Wireless M-Bus Part4). Finally, the module complies with the new European Directive 2002/95/EC concerning the

Restrictive Usage of Hazardous Substances (RoHS).

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3. General Features

3.1. Main Functionalities

The ME70-169 module has a digital part and a RF part. The radio link is a Half Duplex bidirectional link.

The digital part has the following functionalities:

• Communication interface

• I/O management

• Micro controller with embedded Telit Software Stack

The RF part has the following functionalities:

• Frequency synthesis

• Front-end

• Low noise reception

• Power amplification

• Packet handling

3.2. Software

The ME70-169 module is provided pre-flashed with Telit in-house Wireless M-Bus stack. Please refer to Protocol Stack User Guides [7] for detailed information.

3.3. Temperature Operating Range

Minimum Typical Maximum Unit Operating

Temperature - 40 25 + 80 °C Relative humidity @

25°C

20 75 %

Storage

Temperature - 40 25 + 80 °C

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3.4. Mechanical Specifications

Size :

Rectangular 25.8 x 15 mm

Height :

3 mm

Weight :

1.7 g

PCB thickness:

0.8 mm

Cover* :

• Dimensions : 25 x 14.2 x 2.2mm

• Thickness : 200µm

Components :

All SMD components, on one side of the PCB.

Connectors :

The terminals allowing conveying I/O signals are LGA

Mounting :

• SMD

• LGA on the 4 external sides

Number of pins :

The metallic shield used on ME70-169 covers all the SMD components

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3.5. Mechanical drawing

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3.6. DC Specifications

Characteristics ME70-169 Min. Typ. Max. Power Supply

(VDD):

+2.3V +3.0V +3.6V

I/O low level :

GND - 0.2x V

I/O high level :

0.8x V

- V

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3.7. Radio Specifications

Measured on DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance and default power register setting if nothing else noted.

Global

ERC Rec 70-03 Frequency Band

169.4 – 169,475 Mhz

EN_13757-4 Channels

Channel 1a Channel 1b Channel 2a Channel 2b Channel 3a Channel 3b Channel 0

Center frequency (MHz)

169,40625 169,41875 169,43125 169,44375 169,45625 169,46875 169,4375

Channel width (kHz)

12.5 50

RF data rate (kbps)

4.8

2.4 or

4.8

4.8 19.2

Transmission

Duty cycle

≤ 10%

Modulation Format

GMSK GFSK GMSK 4GFSK

Deviation (kHz)

+/- 2.4 +/- 2.4 +/- 2.4

-7.2, -2.4,

+2.4, +7.2

Frequency tolerance (kHz)

+/- 1.5 +/- 2.0 +/- 1.5 +/- 2.5

RF Output Power

Selectable by software (see Protocol Stack User Guides [7])

among the following levels (dBm): +12, +15, +18, +21, +24, +27, +30

Max permitted e.r.p

+27dBm (500 mW)

eception

Measured Sensitivity for PER< 0,8

-115 dBm

-119 dBm @ 2.4kbps

-115 dBm @ 4.8kbps

-115 dBm -107 dBm

Min permitted Sensitivity

for PER< 0,8*

-112 dBm

-115 dBm @ 2.4kbps

-112 dBm @ 4.8kbps

-112 dBm -104 dBm

Saturation for PER< 20%

Up to +10 dBm under 50Ω

*At a frame size of 20 bytes.

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ETSI EN 300 220 V2.3.1 (2009-12)

Transmission

Frequency error

+/- 6.25 kHz @ 12.5 kHz channelization

+/- 16.95 kHz (+/-100 ppm) > 25 kHz channelization

ACP

- 37 dBm in 8.5 kHz BW under normal test conditions

- 32 dBm in 8.5 kHz BW under extreme test conditions

Modulation bandwidth

Reference

Bandwidth (RBW)

Limit Lower envelope

point

Minimum frequency

Upper envelope

point

maximum frequency

1 kHz - 30 dBm (1 µW) f

e, lower

e, upper

1 kHz - 36 dBm (250 nW) (f

e, lower

– 200 kHz) (f

e, upper

+ 200 kHz)

10 kHz - 36 dBm (250 nW) (f

e, lower

– 400 kHz) (f

e, upper

+ 400 kHz)

100 kHz - 36 dBm (250 nW) (f

e, lower

– 1 MHz) (f

e, upper

+ 1 MHz)

Unwanted emissions in the spurious domain

Frequency 47 MHz to 74 MHz

7,5 MHz to 118 MHz 174 MHz to 230 MHz 470 MHz to 862 MHz

Other frequencies below 1 000 MHz

Frequencies above 1

000 MHz

State Operating - 54 dBm (4 nW) - 36 dBm (250 nW) - 30 dBm (1 µW) Standby - 57 dBm (2 nW) - 57 dBm (2 nW) - 47 dBm (20 nW)

Reception

Blocking for class 2 equipments

Frequency offset of the

unwanted signal

Receiver bandwidth

Minimum offset between

wanted and unwanted signals

+/-2 MHz

10 kHz ≥ 37 dB 40 kHz ≥ 31 dB

+/-10 MHz

10 kHz ≥ 62 dB 40 kHz ≥ 56 dB

Spurious radiation

Below 1000 MHz Above 1000 MHz

- 57 dBm (2 nW) - 47 dBm (20 nW)

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3.8. Power comsumption

Measured on DIP interface with T = 25°C, 50Ω impedance.

Operating mode Supply voltage (V)

Average current

consumption

Reception :

3.0 34mA

Stand-by (32.768 khz On) :

3.0 <2µA

Sleep (wake up on interruption) :

3.0 1.5µA

Trasmission 12dBm

3.0 135mA

Trasmission 15dBm

3.0 160mA

Trasmission 18dBm

3.0 205mA

Trasmission 21dBm

3.0 275mA

Trasmission 24dBm

3.0 375mA

Trasmission 27dBm

3.0 485mA

Trasmission 30dBm

3.6 730mA

Warning – Antenna mismatch can significantly change current consumption while in TX operating modes.

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3.9. Digital Specifications

Function Characteristics

µC

• 128 kB + 8 kB in system programmable flash

• 8 kB RAM

• 2 kB E2PROM

Serial link

• RS232 TTL Full Duplex

• 1200 to 115200 bps

• 7 or 8 bits

• Parity management

• Flow control

o Hardware (RTS/CTS)

Embedded software functionality

• Flexibility:

o Pre flashed o Customization capability o Download over the air

3.10. Absolute Maximum Ratings

Voltage applied to Vcc, VDD :

-0.3V to +3.6V

Voltage applied to “TTL” Input :

-0.3V to VDD+0.3V

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3.11. Ordering Information

The following equipments can be ordered:

• The SMD version (ME70-169)

• The DIP interface version (ME70-169)

• The Demo Case composed by:

o n.2 evaluation boards, o n.2 ME50 DIP interface boards, o n.2 ME70 DIP interface boards, o 2 RF antennas, o 2 USB cables, o 2 power supply o 2 batteries.

The versions below are considered standard and should be readily available. For other versions, please contact Telit. Please make sure to give the complete part number when ordering.

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Equipment and Part Number

SMD Version

B ME70-169/SMD

DIP Version

B ME70-169/DIP

Demo Case

D ME50_70-169/ Demo

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4. Pin-out and signals description

4.1. Module Pin OUT (Top View)

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4.2. Module Pin-out table

Pin Pin name Pin type Signal level Function

J30 GND Gnd RF Ground connection for external antenna J29 Ext_Antenna RF RF I/O connection to external antenna J28 GND Gnd RF Ground connection for external antenna J27 GND Gnd Ground J26 GND Gnd Ground J25 VDD Power Digital and Radio part power supply pin J24 CTS I TTL Clear To Send J23 RESET I TTL µC reset ( Active low with internal pull-up ) J22 RTS O TTL Request To Send J21 RXD I TTL RxD UART – Serial Data Reception J20 GND Gnd Ground J19 TXD O TTL TxD UART – Serial Data Transmission J18 WAKEUP I TTL Wake-up (Active high with internal pull-down: when set to 1 the

module is awakened) J17 GND Gnd Ground J16 PROG I TTL Signal for serial µC flashing (Active high with internal pull-down) J15 GND Gnd Ground J14 PDI_DATA I/O TTL Program and Debug Interface DATA J13 GND Gnd Ground J12 GND Gnd Ground J11 GND Gnd Ground J10 PDI_CLK I TTL Program and Debug Interface CLOCK

IO91

I/O

TTL

Digital I/O N°9 with interrupt

IO8_AD_DA2

I/O

analog

A to D and D to A I/O N°8 with interrupt (Logic I/O capability)

J7 IO7_A I/O analog Analog Input N°7 (Logic I/O capability) J6 IO6_A I/O analog Analog Input N°6 (Logic I/O capability) J5 IO5_A I/O analog Analog Input N°5 (Logic I/O capability) J4 IO4_A I/O analog Analog Input N°4 (Logic I/O capability) J3 IO3_A I/O analog Analog Input N°3 (Logic I/O capability) J2 STANDBY

STATUS

O TTL

Signal indicating stand-by status

J1 RADIO STATUS O TTL

Signal indicating reception or transmission of radio frame

1, 2

In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since

reserved on these modules.

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4.3. Pin-out of the Module DIP

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4.4. Dip-Module Pin-out correspondence table

Pin-Out correspondence between ME70-169/DIP, ME70-169/SMD and internal µC port

ME70-169/DIP ME70-169/SMD Comments

Connector Pin Name Pin Pin Name

1 2 GND 3 P1 J5 IO5_A 4 P2 J9 IO9_I3 Reserved Pin 5 P3 J2 STANDBY STATUS 6 P4 J1 RADIO STATUS 7 P5 J4 IO4_A 8 P6 J3 IO3_A 9 GND 10 J25 VDD

11 J16 PROG 12 J22 RTS 13 J24 CTS 14 J23 RESET 15 J21 RxD 16 J19 TxD 17 J18 WAKEUP 18 J22 RTS 19 P7 J6 IO6_A 20 GND

1 J14 PDI_DATA

J4 Connector for debugging

and flashing

2 J10 PDI_CLK 3 J23 RESET 4 J25 VDD 5 GND

J7 IO7_A J8 IO8_AD_DA4 Reserved Pin

RF connection

SMA connector

J29

Ext_Antenna (Unbalanced RF)

A 50 Ohm coplanar wave guide and a matching network connect J29 to J3

3, 4

In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected,

since reserved on these modules.

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4.5. Signals description

Signals Description

RESET

External hardware reset of the radio module. Active on low state.

TXD, RXD

Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state.

CTS

Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state).

RTS

Outgoing signal. Indicates whether the user can transmit serial data (active, on low state) or not (inactive, on high state).

I/O, configurable as input or as output.

WAKEUP

Input signal which indicates to the module to wake up from low-power mode. See reference document [7] for ME70-169

RADIO STATUS

Output signal which indicates the status of the radio. Set to VCC during radio transmission or as soon as a radio frame is detected with correct synchronization word. The signals returns to GND at the end of transmission or as soon as the frame reception is finished.

STANDBY STATUS

The ‘STAND BY STATUS’ output signal is set to logical ‘1’ while the module is operating and return to ‘0’ during stand by periods.

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5. Process Information

5.1. Delivery

ME70-169 modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

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5.2. Storage

The optimal storage environment for ME70-169 modules should be dust free, dry and the temperature should be included between -40°C and +80°C.

In case of a reflow soldering process, ME radio modules must be submitted to a drying bake at +125°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect. After being submitted to the drying bake, ME modules must be soldered on host boards within 168 hours.

Also, it must be noted that due to some components, ME70-169 modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed.

5.3. Soldering pad pattern

The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.

The recommended soldering pad layout on the host board for the ME70-169 is shown in the diagram below:

All dimensions in mm

Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

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5.4. Solder past

ME70-169 module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 µm.

The following diagram shows mounting characteristics for ME integration on host PCB:

5.5. Placement

The ME70-169 module can be automatically placed on host boards by pick-and-place machines like any integrated circuit

5.6. Soldering Profile (RoHS Process)

It must be noted that ME70-169 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.

The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.

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The barcode label located on the module shield is able to withstand the reflow temperature.

CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the ME70-169 radio module’s metal shield from being in contact with the solder wave.

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6. Board Mounting Recommendation

6.1. Electrical environment

The best performances of the ME70-169 module are obtained in a “clean noise” environment. Some basic recommendations must be followed:

• Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, Bus...)

must be placed as far as possible from the ME70-169 module.

CAUTION – A particular attention must be put on power supply DC-DC converter, due to switching frequency that generates spurious into the receiver band. It can strongly decrease module performances. It is then recommended to put a metallic shield covering DC conversion function.

• Switching components circuits (especially RS-232/TTL interface circuit power

supply) must be decoupled with a 100 µF tantalum capacitor. And the decoupling capacitor must be as close as possible to the noisy chip.

6.2. Power supply decoupling on ME70-169 module

The power supply of ME70-169 module must be nearby decoupled. A LC filter is strongly recommended in case of DC-DC conversion. It must be placed as close as possible to the radio module power supply pin, VDD.

Symbols Reference Value Manufacturer

L1 LQH32CN1R0M33 1µH Murata

C1 GRM31CF51A226ZE01 22µF Murata

C2 Ceramic CMS 25V 100nF Multiple

L1 must be chosen carefully with very low serial resistance in order to limit voltage drop.

Vdd

C1 C2

Power Supply

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6.3. RF layout considerations

Basic recommendations must be followed to achieve a good RF layout:

• It is recommended to fill all unused PCB area around the module with ground plane

• The radio module ground pin must be connected to solid ground plane.

• If the ground plane is on the bottom side, a via (Metal hole) must be used in front of

each ground pad. Especially J28 and J30 (RF Gnd) pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing mismatch and losses.

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6.4. Antenna connections on printed circuit boards

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.3

1.6 1 0.2

Table 1: Values for double face PCB with ground plane around and under coplanar wave guide (recommended)

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.22

1.6 1 0.23

Table 2: Values for simple face PCB with ground plane around coplanar wave guide (not recommended)

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6.5. Antenna Installation Guidelines

Antenna shall be installed according to antenna manufacturer instructions Antenna shall not be installed inside metal cases.

6.6. ME70-169 Interfacing

Example of a full RS-232 connection between a PC or an Automat (PLC) and ME50-169 It applies also for ME70-169, high power version.

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Example of a minimum PC connection with ME50-169. It applies also for ME70-169, high power version.

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Example for sensor connection with ME50-169. It applies also for ME70-169, high power version.

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7. EC Declaration of Conformity

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8. Safety Recommendations

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific

environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment’s introduced on the market. All the relevant information’s are available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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9. Glossary

ACP

Adjacent Channel Power

AFA

Adaptive Frequency Agility

bps

Bits per second

Bandwidth

Decibel

dBm

Power level in decibel milliwatt (10 log (P/1mW))

E2PROM

Electrically Erasable Programmable Read Only Memory

e.r.p

Effective radiated power

ETSI

European Telecommunication Standard Institute

GFSK

Gaussian Frequency Shift Keying

Input

ISM

Industrial, Scientific and Medical

KiloByte

kbps

Kilobits per second

kcps

Kilochips per second

kHz

Kilo Hertz

LBT

Listen Before Talk

LGA

Land Grid Array

MHz

Mega Hertz

milliwatt

Output

PER

Packet Error Rate

ppm

Parts per million

RAM

Random Access Memory

Radio Frequency

RoHS

Restriction of Hazardous Substances

RxD

Receive Data

SMD

Surface Mounted Device

SRD

Short Range Device

TxD

Transmit Data

UART

Universal Asynchronous Receiver Transmitter

µC

microcontroller

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10. Document History

Revision Date Changes

0 2012-10-02 First Release 1 2013-11-06 Inserted EC Declaration of Conformity 2 2014-01-31 Inserted clarification notes on table 4.4

Inserted new channel according to WMBUS part4 2013

3 2014-11-14 Changed overall document structure

Added power consumption table in par 3.8 Added par 6.5: Antenna installation guideline Removed “Audience” paragraph

Telit Wireless Solutions ME70-169 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual