Telit Wireless Solutions LN930, LN930-AP User Manual

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

LN930 M.2 Hardware User Guide

1VV0301078 Rev.10 – 2015-11-11

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APPLICABILITY TABLE

PRODUCT

LN930

LN930-AP

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

Copyright © Telit Communications S.p.A. 2011.

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Contents

1 Introduction ......................................................................................................... 11

1.1 Scope .......................................................................................................................... 11

1.2 Purpose ...................................................................................................................... 11

1.3 Audience ..................................................................................................................... 11

1.4 Contact Information, Support .................................................................................... 11

1.5 Document Organization ............................................................................................. 12

1.6 Text Conventions ........................................................................................................ 12

1.7 Related Documents ................................................................................................... 12

2 M.2 Overview ........................................................................................................ 13

2.1 SKUs - 2G/3G/LTE M.2 Modules ................................................................................ 13

2.2 M.2 Module – Block Diagrams ................................................................................... 17

2.2.1 M.2 HN930 Module ......................................................................................................... 17

2.2.2 M.2 LN930-AP Module ................................................................................................... 19

2.2.3 M.2 LN930 Module ......................................................................................................... 20

2.3 Host Interface Signals ............................................................................................... 21

3 M.2 Module Interface Details ............................................................................... 26

3.1 Interprocessor Interface (IPC) ................................................................................... 26

3.1.1 USB 2.0 High-Speed – IPC Interface .............................................................................. 26

3.1.2 USB Super-speed IC (Reserved) .................................................................................... 28

3.2 (U)SIM Interface ......................................................................................................... 29

3.2.1 SIM Design Recommendations ...................................................................................... 29

3.3 GNSS Interface ........................................................................................................... 30

3.4 System Control Interface ........................................................................................... 32

3.4.1 Power On & Reset .......................................................................................................... 33

3.4.2 Host Radio Disable Operation ........................................................................................ 33

3.4.3 LED Interface – Status Indicator .................................................................................... 35

3.4.4 Wake on WWAN Signal ................................................................................................... 36

3.4.5 Dynamic Power Reduction ............................................................................................. 37

3.5 Tunable Antenna Control Interface ........................................................................... 39

3.6 In-Device Coexistence Interface ................................................................................ 40

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3.7 Power Supply Interface .............................................................................................. 42

3.8 Trace & Debug Interface ............................................................................................ 42

3.9 Configuration Pins ..................................................................................................... 43

3.10 Audio Pins (Reserved) ................................................................................................ 43

3.11 No Connect Pins ......................................................................................................... 45

3.12 Antenna Interface ...................................................................................................... 45

4 Development Tools ............................................................................................... 47

4.1 Carrier Board ............................................................................................................. 47

4.1.1 FlashTool........................................................................................................................ 48

4.1.2 PhoneTool ...................................................................................................................... 48

4.1.3 System Trace Tool .......................................................................................................... 49

4.1.4 RF Calibration ................................................................................................................ 49

4.1.5 Noise Profiling Scan Tool ............................................................................................... 50

5 Windows Software Components ........................................................................... 51

5.1 MBIM Toolkit .............................................................................................................. 54

5.1.1 Windows® 7 MBIM driver .............................................................................................. 54

5.1.2 GNSS UMDF driver for Windows® 7 and

Windows® 8

................................................. 54

5.1.3 M.2 module Firmware Update ....................................................................................... 54

5.1.4 End User Trace Tool....................................................................................................... 54

6 Linux/Chrome Software Architecture ................................................................... 55

6.1 Overview ..................................................................................................................... 55

6.2 CMUX Multiplexer ...................................................................................................... 56

6.3 USB 2.0 HS Features .................................................................................................. 57

6.4 USB Configuration ..................................................................................................... 57

6.4.1 Modem Connection ........................................................................................................ 57

6.4.2 Network Connection ...................................................................................................... 57

6.4.3 Default Configuration ..................................................................................................... 57

6.5 LPM ............................................................................................................................ 58

6.5.1 Suspend/Resume and Remote Wake-up ....................................................................... 58

6.5.2 Android Software Components ...................................................................................... 58

6.5.3 Chrome Software Components ...................................................................................... 59

Figure 16 Chrome Software Architecture .................................................................................... 60

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7 Operating Environment ........................................................................................ 61

8 Power Delivery Requirements .............................................................................. 62

8.1 Electrical Parameters (3.3 V Power Supply) ............................................................. 62

8.2 Electrical Parameters - Host Interface Signals ........................................................ 63

8.3 Power Consumption ................................................................................................... 64

9 Other Information ................................................................................................ 66

9.1 EMI/EMC and Platform Noise .................................................................................... 66

9.2 Platform Noise Mitigation - Adaptive Clocking ......................................................... 66

9.3 Thermal Monitoring ................................................................................................... 66

9.4 Seamless Roaming / Wifi Offload .............................................................................. 67

9.5 Conducted Transmit Power ....................................................................................... 67

9.6 Receiver Sensitivity .................................................................................................... 68

9.7 Antenna Recommendations ...................................................................................... 71

9.8 GNSS Sensitivity ......................................................................................................... 72

10 3GPP Compliance.............................................................................................. 73

11 WWAN Card Type 3042-S3-B ............................................................................. 74

11.1 Mechanical Dimensions ............................................................................................. 74

11.2 Land Pattern .............................................................................................................. 76

11.3 Antenna Connector Locations ................................................................................... 78

12 Safety Recommendations .................................................................................. 79

13 Conformity assessment issues.......................................................................... 80

13.1 1999/5/EC Directive ................................................................................................... 80

13.2 CE RF Exposure Compliance ..................................................................................... 82

13.3 R&TTE Regulation:..................................................................................................... 83

14 FCC/IC Regulatory notices ................................................................................ 84

14.1 Modification statement .............................................................................................. 84

14.2 Manual Information to the End User ......................................................................... 84

14.3 Interference statement .............................................................................................. 84

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14.4 FCC Class B digital device notice .............................................................................. 84

14.5 Radiation Exposure Statement .................................................................................. 85

14.6 End Product Labeling ................................................................................................ 85

15 Document History ............................................................................................. 86

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Figure 1 M.2 HSPA+ Block Diagram ................................................................................................................ 18

Figure 2

M.2 APAC LTE Module Block Diagram

............................................................................................ 19

Figure 3 M.2 LTE Module Block Diagram........................................................................................................ 20

Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine .................................................................. 21

Figure 5 PCI Express M.2 Module Interface ..................................................................................................... 22

Figure 6

GNSS Connections and Interface

........................................................................................................ 31

Figure 7 Typical LED Connection ..................................................................................................................... 36

Figure 8 Antenna Control – Connections Detail ................................................................................................ 39

Figure 9 In-Device Coexistence Architecture .................................................................................................... 40

Figure 10 RF Antenna – Coaxial Connector Location ....................................................................................... 46

Figure 11

M.2 Carrier Board

.............................................................................................................................. 48

Figure 12

Windows 7 Software Architecture

..................................................................................................... 52

Figure 13

Windows 8 Software Architecture

..................................................................................................... 53

Figure 14 Linux Software Architecture ............................................................................................................. 55

Figure 15 Android Software Architecture .......................................................................................................... 59

Figure 16 Chrome Software Architecture .......................................................................................................... 60

Figure 17 WWAN Card 3042 Mechanical Dimensions .................................................................................... 74

Figure 18 WWAN Card 3042 Slot Key Details ................................................................................................. 75

Figure 19 WWAN Card Type 3042 Top-Side Mounting Land Pattern ............................................................. 76

Figure 20 WWAN Card 3042 Mid-plane Land Pattern with Slot Key Removed .............................................. 77

Figure 21 Antenna Connector Location ............................................................................................................. 78

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Table 1 M.2 Module - General Feature .............................................................................................................. 14

Table 2. M.2 Module - RF Band Support ......................................................................................................... 15

Table 3. M.2 Module - Data Services ................................................................................................................ 17

Table 4

M.2 Host Interface Signals

.................................................................................................................... 22

Table 5 USB HS Interprocessor Communications In

ter

face .............................................................................. 27

Table 6 USB SSIC – ICP Interface .................................................................................................................... 28

Table 7

(U)SIM Interface Signals

...................................................................................................................... 29

Table 8 X-GOLD™ Baseband to GNSS Interface Signals ................................................................................ 32

Table 9

GNSS Module Interface Signals

........................................................................................................... 32

Table 10

Power-on & Reset Signals

.................................................................................................................. 33

Table 11

Radio Disable Signal

........................................................................................................................... 34

Table 12 Host Radio Disable Interface (W_DISABLE#) .................................................................................. 35

Table 13

LED#1 Signal

...................................................................................................................................... 36

Table 14

LED State Indicator

............................................................................................................................ 36

Table 15

Wake on WWAN Signal

..................................................................................................................... 37

Table 16

DPR#/ SAR Support Signal

................................................................................................................ 38

Table 17

Tunable Antenna Control Signals

....................................................................................................... 39

Table 18 Coexistence – Hardware Synchronization Signals .............................................................................. 41

Table 19

Power & Ground Signals

.................................................................................................................... 42

Table 20

M.2 Configuration Pins

....................................................................................................................... 43

Table 21

Audio Signals (Future development)

................................................................................................. 43

Table 22

No Connect Pins

................................................................................................................................. 45

Table 23

Antenna Requirements

........................................................................................................................ 45

Table 24

Operating Environment

....................................................................................................................... 61

Table 25 M.2 Module Power Delivery Requirements - Ultrabook .................................................................... 62

Table 26 VBAT Power Delivery Requirements – Direct Connections (Tablet) ................................................ 62

Table 27 DC Specification for 3.3V Logic Signaling ........................................................................................ 63

Table 28 DC Specification for 1.8V Logic Signaling ........................................................................................ 63

Table 29

LTE Power Consumption

.................................................................................................................... 64

Table 30

UMTS Power Consumption

................................................................................................................ 64

Table 31

GSM Power Consumption

.................................................................................................................. 65

Table 32 Conducted Transmit Power – 2G ........................................................................................................ 67

Table 33 Conducted Transmit Power – 3G ........................................................................................................ 67

Table 34 Conducted Transmit Power – LTE ..................................................................................................... 68

Table 35 Rx Sensitivity - GSM .......................................................................................................................... 68

Table 36 Rx Sensitivity - UMTS ....................................................................................................................... 69

Table 37 Rx Sensitivity - LTE ........................................................................................................................... 69

Table 38 Antenna Recommendation .................................................................................................................. 71

Table 39 Antenna Recommendation - Bandwidth of Main & Diversity Antenna ............................................. 71

Table 40 GNSS Sensitivity ................................................................................................................................ 72

Table 40 Antenna Connector Assignment ......................................................................................................... 78

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1

Introduction

This document is a technical specifi cation for Telit’s next generation form factor M.2 module
family. The next generation form factor M.2 module family is a natural transition from the
PCI Express Mini Card and Half Mini Card to a smaller form factor size.
The M.2 Card Type 3042 offers single sided component mounting, 75 pins (8 dedicated for
key), in a compact size (30 mm x 42 mm). A range of 2G/3G/4G (LTE) M.2 modules
supporting multiple operating systems and unique features in the WWAN Card Type 3042
form factor are available.

1.1 Scope

The document will cover the features of the M.2 modules presently available. It will also
identify the M.2 module application interface along with hardware, software, reliability, and
mechanical specifications.

1.2 Purpose

The intent of this document is to provide design guidelines and information for each M.2
module.
In addition to the M.2 module family features and performance metrics, this document
describes the interface signals, operating conditions, physical and mechanical requirements of
the M.2 cards.

1.3 Audience

This document is intended for editors who are about to write or edit documentation for Telit.

1.4 Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Cent er (T TSC) at:

[e-mail]
[e-mail]
[e-mail]
[e-mail]

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:

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http://www.telit.com

To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.

Telit appreciates feedback from the users of our information.

1.5 Document Organization

This document contains the following chapters (sample):

“Chapter 1: “Introduction”

provides a scope for this document, target audience, contact and

support information, and text conventions.

“Chapter 2: “Chapter two” gives an overview of the features of the product.
“Chapter 3: “Chapter three” describes in details the characteristics of the product.

“Chapter 6: “Conformity Assessment Issues” provides some fundamental hints about the
conformity assessment that the final application might need.

“Chapter 7: “Safety Recommendation” provides some safety recommendations that must be
follow by the customer in the design of the application that makes use of the AA99-XXX.

1.6 Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.7 Related Documents

• TBA

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2

M.2 Overview

This section will provide an overview of the standard features of a M.2 Card, information on
the various SKUs of 2G/3G/4G (LTE) M.2 modules along with a respective functional block
diagram of each SKU.

2.1 SKUs - 2G/3G/LTE M.2 Modules

There are five different M.2 modules available in the M.2 Card Type 3042 form factor:

• HN930 - HSPA+

• LN930-AP - APAC LTE

• LN930 - LTE

A comparison of the features, RF band Support, and data rates for the various M.2 modules is
shown in Table 1 through Table 3

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Table 1 M.2 Module - General Feature

Feature

Description

Additional Information

M.2 module

HN930

LN930-AP

LN930

Mechanical

M.2 Card Type 3042

Slot B

30 mm x 42 mm

Pin count: 75
(67 usable, 8 slot)

x x x

Operating

Voltage

3.3 V +/- 5%

-

x x x

Operating

Temperature

-10˚C to +55˚C – Normal

+55˚C to +70˚C –
Extended

E

xtreme - This is the

surrounding air temperature of
the module inside the platform
when the card is fully ope rating
at worst case condition

x x x

Application

Interface
(75 pin card)

Interprocessor

Communications

USB 2.0 High-speed

x x x

USIM w/ Card Detect

SIM_CLK, SIM_RESET,

SIM_IO, SIM_PWR,

SIM_DETECT

x x x

M.2 Control

Full_Card_Power_On_Off

x x x

Reset#

x x x

W_DISABLE#

x x x

LED #1

x x x

DPR (Body SAR)

x x x

Wake on WWAN

x x x

GNSS Disable

x x x

Global Positioning

(GPS/ GLONASS)

I2C_SCL, I2C_SDA, I2_IRQ,

CLKOUT, TX_BLANKING

x x x

Antenna Tun ing

(4) GPO (RF Transceiver)

- x x

RF Coexistence

(3) GPIO

- x x

RF Antenna

Main & Diversity/ GNSS

Separate coax connectors

x x x

Debug

JTAG

-

x x x

ETM11

-

- x x

MIPI PTI

-

- x X

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Table 2. M.2 Module - RF Ban d Support

RF Band

UE Transmit

UE Receive

M.2 Module

HN930

LN930-AP

LN930

GSM

UMTS

LTE

GSM

UMTS

LTE

GSM

UMTS

LTE

001 I

1920 MHz -

1980 MHz

2110 MHz -

2170 MHz

x x x x x

002 II

1850 MHz -

1910 MHz

1930 MHz -

1990 MHz

x x x x x

003 III

1710 MHz -

1785 MHz

1805 MHz -

1880 MHz

x x x

x

004 IV

1710 MHz -

1755 MHz

2110 MHz -

2155 MHz

x x x

005 V

824 MHz -

849 MHz

869 MHz -

894 MHz

x x

x x x

006 VI

830 MHz -

840 MHz

875 MHz -

885 MHz

x

007 VII

2500 MHz -

2570 MHz

2620 MHz -

2690 MHz

x

008 VIII

880 MHz -

915 MHz

925 MHz -

960 MHz

x x x x x x x

009 IX

1749.9 MHz -

1784.9 MHz

1844.9 MHz -

1879.9 MHz

x

010 X

1710 MHz -

1770 MHz

2110 MHz -

2170 MHz

011 XI

1427.9 MHz -

1447.9 MHz

1475.9 MHz -

1495.9 MHz

x x

012 XII

699 MHz -

716 MHz

729 MHz -

746 MHz

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013 XIII

777 MHz -

787 MHz

746 MHz -

756 MHz

x

014 XIV

788 MHz -

798 MHz

758 MHz -

768 MHz

017 XVII

704 MHz -

716 MHz

7734 MHz -

746 MHz

x

018 XVIII

815 MHz -830

MHz

860 MHz -875

MHz

x x

019 XIX

830 MHz -

845 MHz

875 MHz -

890 MHz

x x

x

020 XX

832 MHz -

862 MHz

791 MHz -

821 MHz

x

021 XXI

1447.9 MHz -

1462.9 MHz

1495.9 MHz -

1510.9 MHz

x

022 XXII

3410 MHz -

3490 MHz

3510 MHz -

3590 MHz

023 XXIII

2000 MHz -

2020 MHz

2180 MHz -

2200 MHz

024 XXIV

1626.5 MHz -

1660.5 MHz

1525 MHz -

1559 MHz

025 XXV

1850 MHz -

1915 MHz

1930 MHz -

1995 MHz

026 XXVI

814 MHz -

849 MHz

859 MHz -

894 MHz

x

027 XXVII

806 MHz -

824 MHz

851 MHz -

869 MHz

028 XXVIII

703 MHz -

748 MHz

758 MHz -

803 MHz

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029 XXIX

1850 MHz -

1910 MHz
or
1710 MHz ­1755 MHz

716 MHz -

728 MHz

001 I

1920 MHz -

1980 MHz

2110 MHz -

2170 MHz

Table 3. M.2 Module - Data Services

Data Service

M.2 module

HN930

LN930-AP

LN930

GPRS Class 33: DL 85.6 kbps, UL 85.6 kbps

x - x

EDGE Class 33: DL 236.8 kbps, UL 236.8 kbps

x - x
WCDMA: DL 384 kbps, UL 384 kbps

x x x

HSPA+: DL 21 Mbps, UL 5.7 Mbps

x x x

HSPA+: DL 42 Mbps, UL 5.7 Mbps

- x x

LTE FDD: DL: 100 Mbps, UL 50 Mbps

- x x

LTE FDD: DL: 150 Mbps, UL 50 Mbps

- x x

Module supports DL 150 Mbps in LN930. This is only for generic SW and VZW SW, but not
for AT&T SW.

2.2 M.2 Module – Block Diagrams

2.2.1 M.2 HN930 Module

The M.2 HSPA+ module is Intel’s Next Generation Form Factor design based on Intel’s
XMM™6260 modem platform. The M.2 HSPA+ card is a dual-mode (UMTS/GSM) 3GPP
release 7 HSPA+ modem.

The M.2 HSPA+ module includes support at the 75 pin application interface for
M.2 Control, USB 2.0 HS, GNSS, and USIM. Antenna Tuning is not supported.

A block diagram of the M.2 HSPA+ module is shown in

Figure 1.

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Figure 1 M.2 HSPA+ Block Di agra m

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2.2.2 M.2 LN930-AP Module

The M.2 APAC LTE module is another Intel design based on the XMM™7160 modem
platform. The module has a targeted area of operation in the Asia Pacific rim and offers 3G
and LTE datacard functionality, 2G Functionality is not supported.

The M.2 APC LTE module includes support at the 75 pin application interface for M.2
Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning.

A block diagram of the M.2 APAC LTE module is shown in

Figure 2.

Figure 2

M.2 APAC LTE Module Block Diagram

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2.2.3 M.2 LN930 Module

The M.2 LTE module is based on Intel’s XMM™7160 modem platform. The M.2 LTE
module is a triple-mode (2G, 3G, and 4G) 3GPP release 9 modem providing datacard
functionality.

The M.2 LTE module includes support at the 75 pin application interface for
M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning.

A block diagram of the M.2 LTE module is shown in

Figure 3.

Figure 3 M.2 LTE Module Block Diagram

A more detailed interconnect diagram of the RF Engine utilized on the M.2 LTE Module is
shown in Figure 4.

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SMARTi

TM

4G

PMB5740

RD

_

H1

RD_H1X

RD

_

H3

RD

_

H3

X

RD_

M1

RD

_M

1

X

RD_

L

1

RD

_L

1X

RD

_L

2

RD

_L

2

X

RD_

L4

RD_

L4

X

Clock and

Control

DigRF

VBAT

SD2

_1

V

8

AFC_

DAC

REF OSC

XO_

SUP

XO

VCTCXO

Measurement Unit

M1
M2
M3

Battery

RFE_NTC

RFE

_PADCDC_

MI

XOX

Diversity
Receiver

Combined

Receiver

RX_H2

RX

_H

2

X

RX_H3

RX

_

H3

X

RX_H4

RX

_

H4

X

RX

_

M1

RX_M1X

RX_M2

RX_

M

2X

RX

_

L1

RX

_L

1X

RX_L2

RX

_L

2

X

RX_L4

RX_

L

4X

RFFE

RFFE_VIO

RFFE_SDATA

RFFE_

SCLK

Transmitter

TQ

_X
TQ_H
TQ_L
TP_H
TP_L

PA Control

PADACS

PADACF

PADACF_P

FBR

FBR

_RF1

FBR

_RF2

XGOLD

TM

716

B

7

B1

/B

4

Diversity Switch

&

Filter Module

Diversity
Antenna

RFE_RFFE

_VIO

RFE_

RFFE_SDATA

RFE_RFFE

_SCLK

RFE

_RFFE

_VIO

RFE_

RFFE

_SCLK

RFE_RFFE_SDATA

Main Switch

&

Duplexer Module

B7

Duplexer

B

7

Div Filter

B

20 Div Filter

Coupler

Main

Antenna

RFE_RFFE_VIO

RFE_RFFE_SCLK

RFE

_RFFE

_

SDATA

PA

DCDC

RFE_

TQ_H

RFE_

TP_H

RFE_

TP_L

RFE

_TQ_

L

B2/B

25

VBAT

VBAT

VBAT

RFE_VCC

1_ET

RFE_

VDD_

ET

B7 PA

RFE_PADCDC

_MI

SCPA

RD

_M

2

RD

_M

2

X

RD_

L

3

RD_

L

3X

B

20

RX

_

L

3

RX_L3X

B2

/B

25

B3

B

5/B26

B

13/

B17

B

8

B

20 Duplexer

B7

B20

B1

B4

B2/B25

B3

B5/B26

B8

B13/B17

B1
B4

B3

GSM_HB

GSM_LB

B

8

B5/

B26

B20

B17
B13

RFE_PADACS

VBAT

RFFE CONTROL

VBAT

RFE_VBATAMP

Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine

2.3 Host Interface Signals

This section describes the signals available to the host processor at the 75 pin application
interface. Eight signals are eliminated by the notch on the host connector, leaving 67 usable
signals. A diagram of the M.2 module identifying the 75 pin interface is shown in Figure 5.

Note that the M.2 module has all components mounted on the top side. Odd pin numbers are on the top
side while even pins on the bottom side.

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Figure 5 PCI Express M.2 Module Interface

A complete description of all interface signals available at the host interface is listed in Table

4. Some features, such as GNSS and Antenna Tuning, are not available on every M.2 module.
On those modules, the signals at the application interface are not connected on the M.2
module.

Table 4

M.2 Host Interface Signals

Pin

Signal Name

I/O

Description

Supply

1

CONFIG_3 O Presence Indication:

WWAN M.2 Connects to GND
internally

-

2

3.3V P M.2 Supply Pin 3.3 V

3.3 V

3

GND P Ground

- 4 3.3V P M.2 LTE Supply Pin 3.3 V

3.3 V

5

GND P Ground

-

6

FULL_CARD_POWER_OFF#

I

Control signal to power On/Off

M.2.

1.8 V
7

USB D+

IO

USB 2.0 HS DPLUS Signal

8

W_DISABLE#

I

Active low signal to Disable

Radio Operation

3.3 V

9

USB D–

IO

USB 2.0 HS DMINUS Signal

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10

LED#1

O

Open Drain, active low signal

used for add-in card to

provide status

3.3 V
11

GND P Ground

-

12

SLOT KEY

13

SLOT KEY

14

SLOT KEY

15

SLOT KEY

16

SLOT KEY

17

SLOT KEY

18

SLOT KEY

19

SLOT KEY

20

AUDIO0 IO PC M C lock (I2S_CLK) 1.8 V

21

CONFIG_0 O Configuration Status.

Presently not connected on
WWAN M.2 module.

­22

AUDIO1 I PCM In (I2S_RX) 1.8 V

23

WAKE_WWAN#

O

Wake On WWAN

Use by M.2 to wake up host.

1.8 V

24

AUDIO2 O PCM Out (I2S_TX) 1.8 V

25

DPR I Dynamic Power Reduction ­Body SAR control signal

1.8 V

26

GNSS_DISABLE#

I

Disable GNSS function

1.8 V
27

GND P Ground

-

28

AUDIO3 IO PCM Sync (I2S_WA0) 1.8 V

29

SSIC_RxN

I

SSIC Receive N
(Not Supported)

-

30

UIM-RESET

O

SIM Reset (I)

1.8
V/3.0 V

31

SSIC_RxP

I

SSIC Receive P
(Not Supported)

-

32

UIM-CLK

O

SIM Clock (I)

1.8

V/3.0 V

33

GND - Ground

-

34

UIM-DATA

IO

SIM Data (I/O)

1.8

V/3.0 V

35

SSIC_TxN

O

SSIC Transmit N
(Not Supported)

-

36

UIM-PWR

O

SIM power

1.8

V/3.0 V

37

SSIC_TxP

O

SSIC Transmit P
(Not Supported)

-

38

N/C - Not connected internally on
M.2

­39

GND P Ground

-

40

I2C_SCL

IO

I2C Clock – GNSS Support

1.8 V

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41

N/C - Not connected internally on
M.2

­42

I2C_SDA

IO

I2C Data – GNSS Support

1.8 V

43

N/C - Not connected internally on
M.2

44

I2C_IRQ

I

GNSS Interrupt Request –

GNSS Support

1.8 V
45

GND P Ground

-

46

SYSCLK

O

26 MHz reference Clock

output for external GNSS
module

1.8 V
47

N/C - Not connected internally on
M.2

-

48

TX_BLANKING

O

GNSS Blanking Signal used to

indicate 2G Tx burst and LTE

band 13 Tx burst.

1.8 V
49

N/C - Not connected internally on
M.2

-

50

N/C - Not connected internally on
M.2

­51

GND P Ground

-

52

N/C - Not connected internally on
M.2

-

53

N/C - Not connected internally on
M.2

-

54

N/C - Not connected internally on
M.2

-

55

N/C - Not connected internally on
M.2

-

56

N/C - Not connected internally on
M.2

­57

GND P Ground

-

58

N/C - Not connected internally on
M.2

-

59

ANTCTL0

O

RF Antenna Tuning Control

Signal 0

1.8 V

60

COEX3

O

Wireless Coexistence between

WWAN and WiFi/BT
modules. IDC_LteDtxEnv

1.8 V
61

ANTCTL1

O

RF Antenna Tuning Control
Signal 1

1.8 V

62

COEX2

I

Wireless Coexistence between

WWAN and WiFi/BT
modules. IDC_CwsPriority

1.8 V
63

ANTCTL2

O

RF Antenna Tuning Control

Signal 2

1.8 V

64

COEX1

O

Wireless Coexistence between

WWAN and WiFi/BT
modules. IDC_LteFrameSync

1.8 V
65

ANTCTL3

O

RF Antenna Tuning Control
Signal 3

1.8 V

66

SIM DETECT

I

SIM Card Detection (I) (low

active).

• Pull-up resistor on WWAN
M.2 module

1.8 V

67

RESET#

I

Single control to reset WWAN

1.8 V

68

N/C - Not connected internally on
M.2

-

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69

CONFIG_1 O Configuration Status

WWAN M.2 Connects to GND
internally

-

70

3.3V P WWAN Supply Pin 3.3 V

-

71

GND P Ground

-

72

3.3V P WWAN Supply Pin 3.3 V

-

73

GND P Ground

-

74

3.3V P WWAN Supply Pin 3.3 V

-

75

CONFIG_2 O Configuration Status

WWAN M.2 Connects to GND
internally

-

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3

M.2 Module Interface Details

This section provides details on the various interfaces available M.2 modules.

3.1 Interprocessor Interface (IPC)

There are two interfaces on the M.2 host interface that suppor t int erp roce sso r com m un ications
(ICP); however, for the WWAN M.2 modules covered by the Product Description only the
USB 2.0 High-speed port will be supported.

The other ICP interface, USB Super-speed Inter-Chip (USB_SSIC), is not supported and the
signals should not be connected at the host.

The host processor, connected via an ICP interface, has access to the functions of the WWAN
card.

3.1.1 USB 2.0 High-Speed – IPC Interface

The USB 2.0 High-speed interface supports the following device classe s: CDC-MBIM, CDC­ACM, and CDC-NCM.

The USB Controller is compliant to the USB 2.0 Specification and with the Link Power
Management (LPM) Addendum. LPM introduces a new sleep state (L1) which significantly
reduces the transitional latencies between the defined power states; hence, improving the
responsiveness of the WWAN platform regarding connecting to the internet (Quick Connect).

• USB2.0 LPM L1 Support

• Support for OS assisted fast dormancy

• Selective Suspend support

• Very low power when in Selective Suspend:

 <4mw when connected to network (wake)
 <1 mW no wake

It supports High-speed (HS, 480 MBit/s); Full-speed (FS, 12 MBit/s) transfers. Low- speed
mode is not supported. Because there is not a separate USB-controlled voltage bus, USB
functions implemented on the M.2 module are expected to report as self-powered devices

General Features

• In device mode : High-speed (480 MBit/s) and Full-speed (12 MBit/s)

• In host mode: High-speed (480 MBit/s), Full-speed (12 MBit/s). Low-speed mode

(1.5

Mbit/s) is not supported.

• Support for 16 bidirectional end points and channels including the end point 0.

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Table 5 USB HS Interprocessor Communications In

ter

face

Signal Name

Description

Pin

Direction
(WWAN)

Voltage
Level

USB_D+

USB Data Plus

7

I, O

Per USB 2.0

specification

USB_D–

USB Data
Minus

9

I, O