Telit Wireless Solutions LM960 Design Manual

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[01.2017]

Mod.08

18 2017-01 Rev.0

LM960

HW Design Guide

1VV0301485 Rev.1 –2018-05-30

LM960 HW Design Guide

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shal l not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-ex clusive, royalty free license to use that arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right so ftware. In this case y ou agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECT ION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LI MITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY W AY OUT OF THE USE OR DIS TRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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Applicability Table

PRODUCTS

LM960

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Contents

NOTICE 2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

APPLICABILITY TABLE ................................................................................ 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 9

Scope ........................................................................................... 9

Audience....................................................................................... 9

Contact Information, Support ........................................................ 9

Text Conventions ........................................................................ 11

Related Documents .................................................................... 12

2. GENERAL PRODUCT DESCRIPTION ...................................... 13

Overview..................................................................................... 13

Product Variants and Frequency Bands ...................................... 13

2.2.1. RF Bands per Regional Variant .................................................. 13

Target market ............................................................................. 14

Main features .............................................................................. 14

Block Diagram ............................................................................ 16

TX Output Power ........................................................................ 16

RX Sensitivity ............................................................................. 16

Mechanical specifications ........................................................... 18

2.8.1. Dimensions ................................................................................. 18

2.8.2. Weight ........................................................................................ 18

Environmental Requirements ...................................................... 18

2.9.1. Temperature Range .................................................................... 18

2.9.2. RoHS Compliance ...................................................................... 19

3. PINS ALLOCATION ................................................................... 20

Pin-out ........................................................................................ 20

LM960 Signals That Must Be Connected .................................... 24

Pin Layout ................................................................................... 25

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4. POWER SUPPLY ....................................................................... 26

Power Supply Requirements ....................................................... 26

Power Consumption ................................................................... 26

General Design Rules ................................................................. 27

4.3.1. Electrical Design Guidelines ....................................................... 27

4.3.1.1. + 5V Input Source Power Supply – Design Guidelines ................ 27

4.3.2. Thermal Design Guidelines ......................................................... 28

4.3.3. Power Supply PCB layout Guidelines ......................................... 29

RTC ............................................................................................ 29

Reference Voltage ...................................................................... 29

Internal LDO for GNSS bias ........................................................ 30

5. ELECTRICAL SPECIFICATIONS .............................................. 31

Absolute Maximum Ratings – Not Operational ............................ 31

Recommended Operating Conditions ......................................... 31

6. DIGITAL SECTION .................................................................... 32

Logic Levels ................................................................................ 32

6.1.1. 1.8V Pins – Absolute Maximum Ratings ..................................... 32

6.1.2. 1.8V Standard GPIOs ................................................................. 32

6.1.3. 1.8V SIM Card Pins .................................................................... 33

6.1.4. 2.85V Pins – Absolute Maximum Ratings ................................... 33

6.1.5. SIM Card Pins @2.85V ............................................................... 33

Power On.................................................................................... 34

6.2.1. Initialization and Activation State ................................................ 34

Power Off.................................................................................... 35

Reset .......................................................................................... 36

6.4.1. Graceful Reset ............................................................................ 36

6.4.2. Unconditional Hardware Reset ................................................... 37

Communication ports .................................................................. 37

6.5.1. USB Interface ............................................................................. 38

6.5.2. PCIe Interface ............................................................................. 40

6.5.3. SIM Interface .............................................................................. 42

6.5.3.1. SIM Schematic Example ............................................................. 42

6.5.4. Control Signals ........................................................................... 43

6.5.4.1. W_DISABLE_N........................................................................... 43

6.5.4.2. PCIE_WAKE_N .......................................................................... 44

6.5.4.3. WAN_LED_N .............................................................................. 44

6.5.5. General Purpose I/O ................................................................... 44

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6.5.5.1. Using a GPIO Pin as Input .......................................................... 45

6.5.5.2. Using a GPIO Pin as Output ....................................................... 45

6.5.6. I2C – Inter-integrated circuit ........................................................ 46

Using the Temperature Monitor Function .................................... 46

7. RF SECTION .............................................................................. 47

Antenna requirements................................................................. 47

Primary Antenna Requirements .................................................. 47

Secondary Antenna Requirements ............................................. 47

GNSS Receiver .......................................................................... 48

7.4.1. GNSS RF Front End Design ....................................................... 48

Antenna connection .................................................................... 49

7.5.1. Support bands in antenna port .................................................... 49

7.5.2. Antenna Connector ..................................................................... 49

7.5.3. Antenna Cable ............................................................................ 49

7.5.4. Antenna Installation Guidelines ................................................... 50

8. AUDIO SECTION ....................................................................... 51

Audio Interface ........................................................................... 51

Digital Audio ............................................................................... 51

9. MECHANICAL DESIGN ............................................................. 52

General ....................................................................................... 52

Finishing & Dimensions .............................................................. 52

Drawing (TBD) ............................................................................ 52

10. APPLICATION GUIDE ............................................................... 53

Debug of the LM960 Module in Production ................................. 53

Bypass Capacitor on Power Supplies ......................................... 53

EMC Recommendations ............................................................. 54

11. PACKAGING .............................................................................. 57

Tray ............................................................................................ 57

12. CONFORMITY ASSESSMENT ISSUES .................................... 59

Approvals.................................................................................... 59

Declaration of Conformity ........................................................... 59

FCC certificates .......................................................................... 59

IC certificates .............................................................................. 59

FCC/IC Regulatory notices ......................................................... 59

RED Regulatory notices .............................................................. 61

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13. SAFETY RECOMMENDATIONS................................................ 63

READ CAREFULLY .................................................................... 63

14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 64

15. ACRONYMS ............................................................................... 67

16. DOCUMENT HISTORY .............................................................. 69

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1. INTRODUCTION

Scope

This document introduces the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document a re applicable to all LM960 variants, where “LM960” refers to the variants listed in the Applicability Table.

If a specific feature is applicable to a specific product only, it will be clearly marked.

Information – LM960 refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out.

Obviously, this document cannot embrace every hardware solution or every product that can be designed. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LM960 module.

Information – The integration of the WCDMA/HSPA+/LTE LM960 cellular module within a user application must be done according to the design rules described in this manual.

Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LM960 module.

Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

 TS-EMEA@telit.com  TS-AMERICAS@telit.com  TS-APAC@telit.com  TS-SRD@telit.com

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For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Text Conventions

Danger –

This information MUST be followed or catastrophic

equipment failure or bodily injury may occur.

Caution or Warning –

Alerts the user to important points about

integrating the module, if these points are not follow ed, the module and end user equipment may fail or malfunction.

Tip or Information –

Provides advice and suggestions that may be

useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents

 LM960 SW User Guide, 1VV0301477  LM960 AT Commands Reference Guide, 80568ST10869A  Generic EVB HW User Guide, 1VV0301249  LM960 Interface Board HW User Guide, 1VV0301502  SIM Integration Design Guide Application Note Rev10, 80000NT10001A

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2. GENERAL PRODUCT DESCRIPTION

Overview

The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LM960 Mini PCIe module.

LM960 is Telit’s platform for Mini PCIe module for applications, such as M2M applications, industrial mobile router and table PC, based on the following technologies:

• LTE / WCDMA networks for data communication

• Designed for industrial grade quality

In its most basic use case, LM960 can be applied as a wireless communication front-end for mobile router products, offering mobile communication features to an external host CPU through its rich interfaces.

LM960 can further support customer software applications and security features. LM960 provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions.

LM960 is available in hardware variants as listed in Applicability Table The designated RF band sets per each variant are detailed in Section 2.2, Product

Variants and Frequency Bands.

Product Variants and Frequency Bands

The operating frequencies in LTE & WCDMA modes conform to the 3GPP specifications.

2.2.1. RF Bands per Regional Variant

This table summarizes the LM960, showing the supported band sets and the supported band pairs and triple for carrier aggregation.

RF Bands and Carrier Aggregation

LTE FDD LTE TDD HSPA+

Bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26,

28, 29, 30, 32, 66, 71

38, 39, 40, 41, 42, 46, 48

1, 2, 4, 5, 8, 9, 19

GNSS GPS, GLONASS, Be i Dou, Galil e o

LTE 2DL carrier aggregation combinations

TBD

LTE 3DL carrier aggregation combinations

TBD

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LTE 4DL carrier aggregation combinations

TBD

LTE 5DL carrier aggregation combinations

TBD

Refer to Chapter 13 for details information about frequencies and bands.

Target market

LM960 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

• Mobile router

• Industrial equipment

• Home network

• Internet connectivity

Main features

The LM960 family of industrial grade cellular modules features LTE and multi-RAT module together with an on-chip powerful application processor and a rich set of interfaces.

The major functions and features are listed below.

Main Features

Function Features

Module

• Multi-RAT cellular module for data communication

o LTE FDD/TDD Cat18(DL)/13(UL) (1.2 Gbps/150 Mbps) o WCDMA up to DC HSPA+, Rel.10

• Support for GPS, GLONASS, BeiDou and Galileo

Audio subsystem

• Support digital audio interface (optional)

Two USIM ports – dual voltage

• Support for dual SIM

• Class B and Class C support

• Clock rates up to 4 MHz

Application processor

Application processor to run customer application code

• 32 bit ARM Cortex-A7 up to 1.4 GHz running the Linux operating system

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Function Features

• 4Gbit NAND Flash + 2Gbit LPDDR2 MCP is supported to allow

for customer’s own software applications

Interfaces Rich set of interfaces, including:

• USB3.0 – USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and

an external host CPU

o NMEA data to an external host CPU

• PCIe(Optional)

• Peripheral Ports – GPIOs

Major software features

• Advanced security features

o Boot integrity of firmware up to customer applications o Disable/secure re-enable of debug o Embedded security

• FOTA (optional)

• Telit Unified AT command set

Form factor Mini PCIe Form factor (50.95x30x2.7mm), accommodating the

multiple RF bands

Environment and quality requirements

The entire module is designed and qualified by Telit for satisfying the environment and quality requirements for use in applications.

Single supply module

The module generates all its internal supply voltages.

RTC The real-time clock is supported.

Operating temperature

Range -40 °C to +85 °C (conditions as defined in Section 2.9.1, Temperature Range)

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Block Diagram

Below figure shows an overview of the internal architecture of the LM960 module.

LM960 Block Diagram

It includes the following sub-functions:

• Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC.

• RF front end

• Rich IO interfaces. Depending on which LM960 software features are enabled,

some of its interfaces that are exported through multiplexing may be used internally and thus may not be usable by the application.

• PMIC with the RTC function inside

TX Output Power

Band Power class

3G WCDMA Class 3 (0.2W)

LTE All Bands Class 3 (0.2W)

RX Sensitivity

Below the 3GPP measurement conditions used to define the RX sensitivity:

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Technology 3GPP Compliance

4G LTE Throughput >95% 10MHz Dual Receiver

3G WCDMA BER <0.1% 12.2 Kbps Dual Receiver

Product Band Typical Rx Sensitivity (dBm) * / **

(LTE BW = 10 MHz)

LM960

LTE FDD B1 LTE FDD B2 LTE FDD B3 LTE FDD B4 LTE FDD B5 LTE FDD B7 LTE FDD B8 LTE FDD B12 LTE FDD B13 LTE FDD B17 LTE FDD B18 LTE FDD B19 LTE FDD B20 LTE FDD B25 LTE FDD B26 LTE FDD B28 LTE FDD B30 LTE FDD B66 LTE TDD B38 LTE TDD B39 LTE TDD B40 LTE TDD B41 LTE TDD B42 LTE TDD B48 LTE FDD B71

TBD

LM960 WCDMA FDD B1 TBD

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WCDMA FDD B2

WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 WCDMA FDD B9 WCDMA FDD B19

* LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously. ** 3.3 Voltage / Room temperature

Mechanical specifications

2.8.1. Dimensions

The LM960 module’s overall dimensions are:

• Length: 50.95 mm, +/- 0.15 mm tolerance

• Width: 30.00 mm, +/- 0.15 mm tolerance

• Thickness: 2.70 mm, +/- 0.15 mm tolerance

2.8.2. Weight

The nominal weight of the LM960 module is TBD grams.

Environmental Requirements

2.9.1. Temperature Range

Note

Operating

Temperature Range

–20°C ~ +55°C

This range is defined by 3GPP (the global

standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements

and to have full

functionality of the module with in this range.

–40°C ~ +85°C

Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF

parameters

may deviate from the 3GPP

specification in t

he order of a few dB. For

example: receiver sensitivity or maximum

output power may be slightly degraded.

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Note

Even so, all the functionalities, such as call connection, SMS, USB communication,

UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction.

Storage and non-

operating

Temperature Range

–40°C ~ +85°C

2.9.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LM960 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).

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3. PINS ALLOCATION

Pin-out

LM960 Pin-out

Pin Signal I/O Function Type Comment

USB HS 2.0 Communication Port

38 USB_D+ I/O USB 2.0 Data Plus Analog

36 USB_D- I/O USB 2.0 Data Minus Analog

USB SS 3.0 Communication and PCIe Port

25 USB_TX_P

PCIE_TX_P

O USB 3.0 super-

speed/PCIe transmit

– plus

Analog

23 USB_TX_M

PCIE_TX_M

O USB 3.0 super-

speed/PCIe transmit

– minus

Analog

33 USB_RX_P

PCIE_RX_P

I USB 3.0 super-

speed/PCIe receive

– plus

Analog

31 USB_RX_M

PCIE_RX_M

I USB 3.0 super-

speed/PCIe receive

– minus

Analog

Peripheral Component Interconnect Express

7 PCIE_CLKREQ_N I/O PCIE reference

clock request signal.

1.8V

11 PCIE_REFCLK_M I PCI Express

differential reference

clock – minus

13 PCIE_REFCLK_P I PCI Express

differential reference

clock – plus

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22 PCIE_RESET_N I Functional reset to

the card

1.8V

SIM Card Interface 1

8 SIMVCC1 O Supply output for an

external UIM1 card

1.8V /

2.85V

Power

10 SIMIO1 I/O Data connection with

an external UIM1

card

1.8V /

2.85V

12 SIMCLK1 O Clock output to an

external UIM1 card

1.8V /

2.85V

14 SIMRST1 O Reset output to an

external UIM1 card

1.8V /

2.85V

SIM Card Interface 2

16 SIMVCC2 O Supply output for an

external UIM2 card

1.8 / 2.85V Power

19 SIMIO2 I/O Data connection with

an external UIM2

card

1.8 / 2.85V

17 SIMCLK2 O Clock output to an

external UIM2 card

1.8 / 2.85V

6 SIMRST2 O Reset output to an

external UIM2 card

1.8 / 2.85V

Digital I/O (GP IOs)

3 SIMIN1/GPIO_01 I/O Gener al purpose I/O

Can be used as

SIMIN1

1.8V

5 SIMIN2/GPIO_02 I/O Gener al purpose I/O

Can be used as

SIMIN2

1.8V

44 GPIO_03 I/O General purpose I/O

1.8V

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46 GPIO_04 I/O General purpose I/O

1.8V

Control Signal

1 PCIE_WAKE_N I/O PCIe wake-up 1.8V

20 W_DISABLE_N I RF disable Open-drain Internal

VBATT Pull-up

42 WAN_LED_N O LED control Open-drain

Miscellaneous Functions

28 VREG_L6_1P8 O Reference Voltage 1.8V Power

48 SYSTEM_RESET_N I Reset Input 1.8V

Digital Audio Interface

45 DVI _CLK O PC M Clock 1.8V

47 DVI _TX O PCM Data Out 1.8V

49 DVI _RX I PCM Data In 1.8V

51 DVI _WAO O PCM Frame Sync 1.8V

I2C Interface

30 I2C_SCL O I2C Clock 1.8V

32 I2C_SDA I/O I2C Data 1.8V

Power Supply

2 VBATT I Power supply Power

24 VBATT I Power supply Power

39 VBATT I Power supply Power

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Information – If the DVI and I2C inte rface are not u sed, the signals can be left floating.

41 VBATT I Power supply Power

52 VBATT I Power supply Power

GROUND

4 GND - Ground Ground

9 GND - Ground Ground

15 GND - Ground Ground

18 GND - Ground Ground

21 GND - Ground Ground

26 GND - Ground Ground

27 GND - Ground Ground

29 GND - Ground Ground

34 GND - Ground Ground

35 GND - Ground Ground

37 GND - Ground Ground

40 GND - Ground Ground

43 GND - Ground Ground

50 GND - Ground Ground

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Information – Unless otherwise specified, RESERVED pins must be left unconnected (Floating).

LM960 Signals That Must Be Connected

Below table specifies the LM960 signals that must be connected for a debugging purpose even if not used by the end application:

Mandatory Signals

Pin Signal Notes

2, 24, 39, 41, 52 VBATT 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43,

GND

38 USB_D+ If not used, connect to a test

point or an USB connector

36 USB_D- If not used, connect to a test

point or an USB connector

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Pin Layout

Top side

- Odd pins - Even pins

PCIE_WAKE_N

1 2

VBATT

GPIO_01

3 4

GND

GPIO_02

5 6

SIMRST2

PCIE_CLKREQ_N

7 8

SIMVCC1

GND

9 10

SIMIO1

PCIE_REFCLK_M

11 12

SIMCLK1

PCIE_REFCLK_P

13 14

SIMRST1

GND

15 16

SIMVCC2

SIMCLK2

17 18

GND

SIMIO2

19 20

W_DISABLE_N

GND

21 22

PCIE_RESET_N

USB/PCIE_TX_M

23 24

VBATT

USB/PCIE_TX_P

25 26

GND

27 28

VREG_L6M

GND

29 30

I2C_SCL

USB/PCIE_RX_M

31 32

I2C_SDA

USB/PCIE_RX_P

33 34

GND

35 36

USB_D-

GND

37 38

USB_D+

VBATT

39 40

GND

VBATT

41 42

WAN_LED_N

GND

43 44

GPIO_03

DVI_CLK

45 46

GPIO_04

DVI_TX

47 48

SYSTEM_RESET_N

DVI_RX

49 50

GND

DVI_WAO

51 52

VBATT

LM960 Pin Layout

Bottom side

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4. POWER SUPPLY

The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design.

Power Supply Requirements

The LM960 power requirements are as follows:

Power Supply Requirements

Nominal supply voltage 3.3V Supply voltage range 3.10V – 3.6V Maximum ripple on module input supply 30 mV

Power Consumption

Below table provides typical current consumption values of LM960 for various operation modes.

LM960 Current Consumption

Mode Average [Typ.] Mode Description

IDLE Mode

CFUN=1 20mA

No call connection USB3.0 is connected to a host

Power Saving Mode (PSMWDISACFG=1, W_DISABLE_N:Low)

CFUN=4 2.5mA

Tx and Rx are disabled; module is not registered on the network (Flight mode)

WCDMA 3mA DRx7 (1.28 sec DRx cycle)

LTE 3.3mA

Paging cycle #128 frames (1.28 sec DRx cycle)

Operative Mode (LTE)

LTE (22 dBm) TBD LTE data call (Non-CA BW 5MHz, RB=1)

TBD

LTE data call (CA_3A+7A+20A, 20MHz+20MHz+20MHz, Full RB, 256QAM DL / 64QAM UL, FDD 600Mbps DL / 75Mbps UL)

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Mode Average [Typ.] Mode Description

Operative Mode (WCDMA)

WCDMA Voice TBD WCDMA voice call (T x = 23 dBm) WCDMA HSPA

(22 dBm)

TBD

WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput)

* Worst/best case current values depend on network configuration - not under module control.

** Applied MPR –2dB 16-QAM full RB *** 3.3 voltage / room temperature

Information – The electrical design for the power supply must ensure a peak current output of at least 2A.

General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• Electrical design

• Thermal design

• PCB layout

4.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly on the power source where this power is drained.

4.3.1.1. + 5V Input Source Power Supply – Design Guidelines

• The desired output for the power supply is 3.3V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption.

• When using a linear regulator, a proper heat sink must be provided to dissipate the power generated.

• A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LM960 module. A 100 μF tantalum capacitor is usually suitable on VBATT.

• Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

• A protection diode must be inserted close to the power input to protect the LM960 module from power polarity inversion.

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4.3.2. Thermal Design Guidelines

The thermal design for the power supply heat sink must be done with the following specifications:

• Average current consumption during RF transmission @PWR level max in LM960 as shown in Section 4.2, Power Consumption table.

Information – T he average consumption during transmission depends on the power level at which the device is requested to transmit via the network.

Therefore, the average current consumption varies significantly.

Information – The thermal design for the power supply must be made keeping an average consumption at the maximum transmitting level during calls of LTE/HSPA.

Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during Data session.

In LTE/WCDMA/HSPA mode, the LM960 emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated.

While designing the application board, the designer must make sure that the LM960 module is located on a large ground area of the application board for effective heat dissipation.

Information – T he LM960 must be connected to the ground and metal

chassis of the host board for best RF performance and thermal

dispersion as well as to have module fixed.

• The two holes at the top of the module and the main ground of the host board must be fastened together.

• The shield cover of the module and the main board of the host board or the metal chassis of the host device should be connected with conductive materials.

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4.3.3. Power Supply PCB layout Guidelines

As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The bypass low ESR capacitor must be placed close to the LM960 power input pins, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LM960 is wide enough to ensure a drop-less connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks.

• The PCB traces to LM960 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible.

• The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100500 kHz).

• Use a good common ground plane.

• Place the power supply on the board in a way to guarantee that the high current

return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables.

RTC

The RTC within the LM960 module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply.

If VBATT power is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously.

Reference Voltage

1.8V regulated power supply output is provided as the reference voltage to a host board. This output is active when the module is ON and goes OFF when the module is shut down.

This table lists the VREG_L6_1P8 signal of LM960.

LM960 Reference Voltage

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PIN Signal I/O Function Type Comment

28 VREG_L6_1P8 O Reference Voltage power 1.8V

Internal LDO for GNSS bias

The LDO for GNSS bias is applied inside the LM960 model. The voltage supply come from LM960’s LDO to GNSS active antenna. This table lists the LDO for GNSS bias of LM960.

LM960 Reference Voltage when VBATT is 3.3

Symbol Parameter Min Typ Max Unit

GNSS DC bias

Voltage of Internal LDO for GNSS bias 2.9 3.1 3.15 [V]

GNSS DC bias

Current of Internal LDO for GNSS bias - - 100 [mA]

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5. ELECTRI CAL SPECIFICATIONS

Absolute Maximum Ratings – Not Operational

Caution – A deviation from the value ranges listed below may harm the LM960 module.

Absolute Maximum Ratings – Not Operational

Symbol Parameter Min Max Unit

VBATT Battery supply voltage on pin VBATT -0.5 +4.2 [V]

Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

amb

Ambient temperature -40 +25 +85 [°C]

VBATT Battery supply voltage on pin VBATT

3.1 3.3 3.6 [V]

VBATT +

VBATT_PA

Peak current to be used to dimension decoupling capacitors on pin VBATT

- 80 2500 [mA]

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6. DIGITAL SECTION

Logic Levels

Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface

circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.

Caution – Do not connect LM960’s digital logic signal directly to

OEM’s digital logic signal with a level higher than 2.3V for 1.8V

CMOS signals.

6.1.1. 1.8V Pins – Absolute Maximum Ratings

Absolute Maximum Ratings – Not Functional

Parameter Min Max

Input level on any digital pin when on -- +2.16V Input voltage on analog pins when on -- +2.16 V

6.1.2. 1.8V Standard GPIOs

Operating Range – Interface Levels (1.8V CMOS)

Parameter Min Max Unit Comment

VIH Input high level 1.17V 2.1V [V] VIL Input low level -0.3V 0.63V [V] VOH Output high level 1.35V 1.8V [V] VOL Output low level 0V 0.45V [V] IIL Low-level input leakage

current

-1 -- [uA] No pull-up

IIH High-level input leakage

current

-- 1 [uA] No pull-down

IILPU Low-level input leakage

current

-97.5 -27.5 [uA] With pull-up

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Parameter Min Max Unit Comment

IIHPD High-level input leakage

current

27.5 97.5 [uA] With pull-down

CI/o I/O capacitance -- 5 [pF]

6.1.3. 1.8V SIM Card Pins

Operating Range – SIM Pins Working at 1.8V

Parameter Min Max Unit Comment

VIH Input high level 1.26V 2.1V [V] VIL Input low level -0.3V 0.36V [V] VOH Output high level 1.44V 1.8V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage

current

-- 1000 [uA] No pull-up

IIH High-level input leakage

current

-20 20 [uA] No pull-down

6.1.4. 2.85V Pins – Absolute Maximum Ratings

Absolute Maximum Ratings – Not Functional

Parameter Min Max

Input level on any digital pin when on -- +3.42V Input voltage on analog pins when on -- +3.42 V

6.1.5. SIM Card Pins @2.85V

Operating Range – For SIM Pins Operating at 2.85V

Parameter Min Max Unit Comment

VIH Input high level 1.995V 3.15V [V] VIL Input low level -0.3V 0.57V [V] VOH Output high level 2.28V 2.85V [V] VOL Output low level 0V 0.4V [V]

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Parameter Min Max Unit Comment

IIL Low-level input leakage

current

-- 1000 [uA] No pull-up

IIH High-level input leakage

current

-20 20 [uA] No pull-down

Power On

The LM960 is automatically turning on when the VBATT is supplied.

Information – To turn on t he LM960 module, the SYSTEM_RESET_N pin must not be asserted low.

6.2.1. Initialization and Activation State

After turning on the LM960 module, the LM960 is not yet activated because the SW initialization process of the LM960 module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module.

For this reason, it is impossible to access LM960 during the Initialization state. As shown in below figure, the LM960 becomes operational (in the Activation state) at least

30 seconds after the VBATT is supplied.

LM960 Initialization and Activation

Information – To check if the LM96

0 has completely powered on,

LM960 and the host must be connected via USB. When USB driver

completely loaded, the module has completely powered on and is

ready to accept AT commands. Information – Active low signals are labeled with a name that ends w ith

“_N”

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Information – To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

Power Off

To turn off the LM960, SYSTEM_RESET_N pad must be asserted low more than 1 seconds and then it should be kept low.

When the SYSTEM_RESET_N is asserted low more than 1 seconds, LM960 goes into the finalization state and after the end of the finalization process VREG_L6_1P8 will go to low.

Usually, it takes LM960 less than 200 second from asserting SYSTEM_RESET_N until reaching a complete shutdown. The DTE should monitor the status of VREG_L6_1P8 to observe the actual power-off.

Information – To completely shut down the LM960 module, the SYSTEM_RESET_N pin must be asserted and kept low.

Otherwise, the LM960 w ill turn on again aft er shut down.

Warning – Not following the recommended shut-

down procedures

might damage the device and consequently void the warranty.

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Shutdown by SYSTEM_RESET_N Pad

Below figure shows a simple circuit for this action.

Circuit for Shutdown by SYSTEM_RESET_N

Reset

Reset the device can be done in two different ways:

• Graceful Reset by USB AT command AT#REBOOT

• Unconditional Reset using the SYSTEM_RESET_N

6.4.1. Graceful Reset

To gracefully restart the LM960 module, AT#REBOOT AT command must be sent via a USB communication.

Graceful Reset by AT#REBOOT

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6.4.2. Unconditional Hardware Reset

To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released.

Unconditional Hardware Reset by SYSTEM_RESET_N Pad

Information – The Unconditional Hardware Reset must be used only as an emergency exit procedure, and not as a normal power-off operation.

Information – Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latchup problems on the LM960 power regulator and improper functioning of the module. The RESET_N line must be connected only in an opencollector configuration.

Communication ports

Below table summarizes all the hardware interfaces of the LM960 module.

LM960 Hardware Interfaces

Interface LM960

USB Super-speed USB3.0 with high-speed USB2.0 PCIe Peripheral Component Interconnect Express USIM x2, dual voltage each (1.8V/2.85V) Control Signals W_DISABLE_N, WAKE_N, WAN_LED_N GPIO X4, GPIO

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6.5.1. USB Interface

The LM960 module includes super-speed USB3.0 with high-speed USB2.0 backward compatibility. It is compliant with Universal Serial Bus Specification, Revision 3.0 and can be used for control and data transfers as well as for diagnostic monitoring and firmware update.

The USB port is typically the main interface between the LM960 module and OEM hardware.

USB 3.0 needs series capacitors on the TX lines in both directions for AC coupling. In order to interface USB3.0 with an application board of customer, 0.1uF capacitors should be installed on USB_SS_RX_P/M lines of the LM960. There are already series capacitors on USB_SS_TX_P/M lines inside LM960 module.

The USB interface suggested connection is the following:

Connection for USB Interface

Information –

The USB signal traces must be routed carefully.

Minimize trace lengths, number of vias, and capacitive loading. The

impedance value should be as close as possible to 90 Ohms

differential.

I2C I2C (optional)

Audio I/F PCM (optional)

Antenna ports 4 for Cellular, 1 for GNSS

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Warning – At power-

up, LM960 success to enumerate SS_USB

interface. But if a hot-plug is attempted in case of SS_USB

, then

LM960 may fail to enumerate SS_USB.

Information – Acc ording to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Curr ently PCIe interface is not supported but will be enabled soon.

Below table lists the USB interface signals.

USB Interface Signals

PIN Signal I/O Function Type Comment

38 USB_D+ I/O USB 2.0 Data Plus Analog 36 USB_D- I/O USB 2.0 Data Minus Analog 33 USB_SS_RX_P I

USB 3.0 super-speed

receive – plus

Analog

31 USB_SS_RX_M I

USB 3.0 super-speed

receive – minus

Analog

25 USB_SS_TX_P O

USB 3.0 super-speed

transmit – plus

Analog

23 USB_SS_TX_M O

USB 3.0 super-speed

transmit – minus

Analog

Information – Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board.

At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update.

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Information – Consider placing a low-

capacitance ESD protection

component to protect LM960 against ESD strikes

If an ESD protection should be added, the suggested connectivity is as follows:

ESD Protection for USB2.0

ESD Protection for USB3.0

6.5.2. PCIe Interface

The LM960 will support PCIe interface

Below table lists the PCIe interface signals.

PCIe Interface Signals

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PIN Signal I/O Function Type Comment

1 PCIE_WAKE_N I/O PCIe wake-up Analog 7 PCIE_CLKREQ_N I/O

PCIe reference clock request

signal

Analog

11 PCIE_REFCLK_M I

PCIe differential reference

clock – minus

Analog

13 PCIE_REFCLK_P I

PICe differential reference

colock – plus

Analog 22 PCIE_RESET_N I Functional reset to the card Analog 23 PCIE_TX_M O PCIe transmit – minus Analog 25 PCIE_TX_P O PCIe transmit – plus Analog 31 PCIE_RX_M I PCIe receive – minus Analog 33 PCIE_RX_P I PCIe receive – plus Analog

Information – According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but

will be enabled soon.

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6.5.3. SIM Interface

The LM960 supports two external SIM interfaces (1.8V or 2.85V).

Below table lists the SIM interface signals.

SIM Interface Signals

6.5.3.1. SIM Schematic Example

The following Figures illustrate in particular how the application side should be designed.

SIM Schematics

PIN Signal I/O Function Type Comment

SIM Card Interface 1

SIMVCC1

Supply output for an

external UIM1 card

1.8V / 2.85V

Power

SIMIO1

I/O

Data connection with an

external UIM1 card

1.8V / 2.85V

SIMCLK1

Clock output to an

external UIM1 card

1.8V / 2.85V

SIMRST1

Reset output to an

external UIM1 card

1.8V / 2.85V

SIM Card Interface 2

SIMVCC2

Supply output for an

external UIM2 card

1.8 / 2.85V

Power

SIMIO2

I/O

Data connection with an

external UIM2 card

1.8 / 2.85V

SIMCLK2

Clock output to an

external UIM2 card

1.8 / 2.85V

SIMRST2

Reset output to an

external UIM2 card

1.8 / 2.85V

Digital I/O (GPIOs)

GPIO_01

UIM1 Card Present

Detect

1.8V

GPIO_01 can be

used as SIMIN1

GPIO_02

UIM2 Card Present

Detect

1.8V

GPIO_02 can be

used as SIMIN2

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Information – LM960 contains an internal pull-up resistor on SIMIO. It

is not necessary to install external pull – up resistor.

6.5.4. Control Signals

The LM960 supports the following control signals:

• W_DISABLE_N

• PCIE_WAKE_N

• WAN_LED_N

Below table lists the control signals of LM960.

Module Control Signal

PIN Signal I/O Function Type Comment

20 W_DISABLE_N I

RF disable (airplane mode)

Open-drain

Internal

VBATT

Pull-up

PCIE_WAKE_N

I/O

PCIe wake-up

1.8V

WAN_LED_N

LED control

Open-drain

6.5.4.1. W_DISABLE_N

The W_DISABLE_N signal is provided to make the LM960 goes into the airplane mode:

• Enter into the airplane mode: Low

• Normal operating mode: High or Leave the W_DISABLE_N not connected

LM960 contains an internal VBATT(Nominal 3.3V) pull-up resistor on W_DISABLE_N.

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6.5.4.2. PCIE_WAKE_N

The PCIE_WAKE_N signal is provided to supports wakeup or the OBFF function. LM960 contains an internal 1.8V pull-up resistor on PCIE_WAKE_N.

Recommended PCIE_WAKE_N connection is the following:

Recommended PCIE_WAKE_N connection

6.5.4.3. WAN_LED_N

The WAN_LED_N signal drives the LED output. The recommended WAN_LED_N connection is the following:

Recommended WAN_LED_N connection

6.5.5. General Purpose I/O

The general-purpose I/O pins can be configured to act in three different ways:

• Input

• Output

• Dedicate Function (Customer Requirement)

Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be written or queried and set the value of the pin output.

The following GPIOs are always available as a primary function on the LM960. Below table lists the GPIO signals of LM960.

GPIOs

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Pin no. Signal I/O Function Type Drive

Strength

3 GPIO_01 I/O Configurable

GPIO

Pull-Down

1.8V

2-16 mA

5 GPIO_02 I/O Configurable

GPIO

Pull-Down

1.8V

2-16 mA

44 GPIO_03 I/O Configurable

GPIO

Pull-Down

1.8V

2-16 mA

46 GPIO_04 I/O Configurable

GPIO

Pull-Down

1.8V

2-16 mA

6.5.5.1. Using a GPIO Pin as Input

GPIO pins, when used as inputs, can be tied to a digital output of another device and report its status, provided the device interface levels are compatible with the GPIO 1.8V CMOS levels.

If a digital output of a device is tied to GPIO input, the pin has interface levels different than 1.8V CMOS. It can be buffered with an open collector transistor with a 47 kΩ pull-up resistor to 1.8V.

6.5.5.2. Using a GPIO Pin as Output

GPIO pins, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pins have a push-pull output, and therefore the pullup resistor can be omitted.

GPIO Output Pin Equivalent Circuit

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6.5.6. I2C – Inter-integrated circuit

The LM960 supports an I2C interface on the following pins: Below table lists the I2C signals of LM960.

Module I2C Signal

PIN Signal I/O Function Type Comment

I2C_SCL

I2C Clock

CMOS 1.8V

I2C_SDA

I/O

I2C Data

CMOS 1.8V

The I2C interface is used for controlling peripherals inside the module (such as codec, etc.).

Information –

I2C is supported only on from Modem side as SW

emulation of I2C on GPIO lines. Please contact us if you use it.

Information – If the I2C interface is not used, the signals can be left floating.

Using the Temperature Monitor Function

The Temperature Monitor permits to monitor the module’s internal temperature and, if properly set (see the #TEMPSENS command in

LM960 AT Commands Reference Guide

), raises a GPIO to High Logic level when the maximum temperature is reached.

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7. RF SECTI O N

Antenna requirements

The antenna connection is one of the most important aspect in the full product design as it strongly affects the product overall performance. Hence read carefully and follow the requirements and the guidelines for a proper design.

The LM960 is provided with five RF connectors. The available connectors are:

• Primary RF antenna #0 and #1: TX/RX path

• Secondary RF antenna #0: Combined Rx Diversity and GNSS path

• Secondary RF antenna #1: Rx Diversity path

• GNSS antenna: Dedicated GNSS path

Primary Antenna Requirements

The antenna for the LM960 device must meet the following requirements:

WCDMA / LTE Antenna Requirements

Frequency range

Depending by frequency band(s) provided by the network

operator, the customer shall use the most suitable antenna for that/those band(s)

The bands supported by the LM960 is provided in Section 2.2,

Product Variants and Frequency Bands.

Impedance 50 Ohm Input power > 24 dBm average power in WCDMA & LTE VSWR absolute max <= 10:1 VSWR recommended <= 2:1

Secondary Antenna Requirements

This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity.

Antenna Diversity Requirements

Frequency range

Depending by frequency band(s) provided by the network

operator, the customer shall use the most suitable antenna for that/those band(s)

The bands supported by the LM960 is provided in Section 2.2,

Product Variants and Frequency Bands.

Impedance 50Ω VSWR recommended ≤ 2:1

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The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. For the same reason, the Rx antenna should also be cross-polarized with respect to the main antenna. Isolation between main antenna and Rx antenna must be at least 10 dB in all uplink frequency bands.

Envelope Correlation Coefficient (ECC) value should be as close as possible to zero, for best diversity performance. ECC values below 0.5 on all frequency bands are recommended.

GNSS Receiver

The LM960 integrates a GNSS receiver that could be used in Standalone mode and in AGPS (assisted GPS), according to the different configurations.

LM960 supports an active antenna.

Frequency range • Wide-band GNSS:

1559–1606 MHz recommended

• GPS:

2.046 MHz BW NB GPS (centered on 1575.42 MHz)

• Glonass (GLO): ~ 8.3 MHz BW (1597–1606 MHz)

• BeiDou (BDS):

4.092 MHz BW (1559.05 – 1563.14 MHz)

• Galileo (GAL):

4.092 MHz BW (centered on 1575.42 MHz) Gain 1.5 dBi < Gain < 3 dBi Impedance 50 Ohm Amplification 18 dB < Gain < 21 dB Supply Voltage 3.1 V Current consumption 20 mA Typical

7.4.1. GNSS RF Front End Design

The LM960 contains an integrated LNA and pre-selec t SAW filter. This allows the module to work well with a passive GNSS antenna. If the antenna cannot be located near the LM960, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used with an external dedicated power supply circuit.

GNSS rescive path uses either the dedicated GNSS connector or the shared Secondary #0 antenna connector.

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NOTE – Please refer to the LM960 AT Commands Reference Guide,

TBD for detailed information about GNSS operating modes and GNSS

Antenna selection.

Antenna connection

7.5.1. Support bands in antenna port

The LM960 has an assigned band depending on the antenna port.

The supported bands are:

• Primary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO

• Primary RF antenna #1: B7, B30, B32, B38, B40, B41, B42, B46, B48, B2(B25) for 4 x 4 MIMO, B4(B66) for 4 x 4 MIMO

• Secondary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO / GNSS

• Secondary RF antenna #1: B7, B30, B38, B40, B41, B42, B46, B48, B25(B2) for 4 x 4 MIMO, B66(B4) for 4 x 4 MIMO

• GNSS antenna: Dedicated GNSS

See the picture on the below for their position on the interface.

7.5.2. Antenna Connector

The LM960 is equipped with a set of 50 Ω RF MHF4 connectors from I-PEX 20449-001.

For more information about mating connectors visit the website https://www.i-pex.com

7.5.3. Antenna Cable

Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly.

If the host device is not designed to use the module’s GNSS antenna, terminate the interface with a 50Ω load.

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Minimize Antenna Cable Requirements

Impedance 50 Ohm Max cable loss 0.5 dB Avoid coupling with other signals.

7.5.4. Antenna Installation Guidelines

• Install the antenna in a location with access to the network radio signal.

• The antenna must be installed such that it provides a separation distance of at

least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

• The antenna must not be installed inside metal cases.

• The antenna must be installed according to the antenna manufacturer’s

instructions.

Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements.

Information

This device is to be used only for mobile and fixed application. The

antenna(s) used for this transmitter must be installed to provide a

separation distance of at least 20 cm from all pers ons and mu st not be co-located or operating in conjunction with any

other antenna or

transmitter. End-

Users must be provided with transmitter operation

conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LM960 module. Antennas used for this OEM module must not exceed gain of below table

for mobile and fixed operating

configurations. In the event that these conditions cannot be met (for example certain

laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product

(including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The

end user manual shall include all required regulatory

information/warning as show in this manual.

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8. AUDIO SECTION

Audio Interface

The LM960 module supports digital audio interfaces.

Digital Audio

The LM960 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface on the following pins:

Digital Audio Interface Signals

Pin no. Signal I/O Function Type COMMENT

51 DVI_WAO O

PCM Frame Sync

B-PD 1.8V

49 DVI_RX I PCM Data In B-PD 1.8V 47 DVI _TX O PCM Data Out B-PD 1.8V 45 DVI _CLK O PCM Clock B-PD 1.8V

LM960 PCM has the following characteristics:

• PCM Master mode using short or long frame sync modes

• 16 bit linear PCM format

• PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default)

• Frame size of 8, 16, 32, 64, 128 & 256 bits per frame

• Sample rates of 8 kHz and 16 kHz

NOTE – If the Digital Audio Interface is not used, the signals can be left floating.

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9. MECHANICAL DESIGN

General

The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector.

Finishing & Dimen s ions

The LM960 module’s overall dimensions are:

• Length: 50.95 mm

• Width: 30.00 mm

• Thickness: 2.70 mm

The module complies with the standard dimensions specified in the PCI Express Mini Card Electromechanical Specification Revision 1.1

Drawing (TBD)

This figure shows the mechanical dimensions of the LM960 module.

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10. APPLICATION GUIDE

Debug of the LM960 Module in Production

To test and debug the mounting of the LM960 module, we strongly recommend to add several test pins on the host PCB for the following purposes:

• Checking the connection between the LM960 itself and the application

• Testing the performance of the module by connecting it with an external computer

Depending on the customer application, these test pins include, but are not limited to the following signals:

• SYSTEM_RESET_N, W_DISABLE_N, PCIE_WAKE_N

• VBATT, GND

• VREG_L6_1P8

• USB_D-, USB_D+

• USB_SS_TX_M, USB_SS_TX_P, USB_SS_RX_M, USB_SS_RX_P

• PCIE_TX_M, PCIE_TX_P, PCIE_RX_M, PCIE_RX_P

In addition, the following signals are also recommended (but not mandatory):

• WAN_LED_N

• GPIO_01, GPIO_02, GPIO_03, GPIO_04

Bypass Capacitor on Power Supplies

When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction.

Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board.

The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly.

The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM.

Especially, a suitable bypass capacitor must be mounted on the following lines on the application board:

• VBATT Recommended values are:

• 100uF for VBATT Customers must still consider that the capacitance mainly depends on the conditions of

their application board.

Generally, more capacitance is required when the power line is longer. And if customers use the fast power down function, then more bypass capacitors should be mounted on the application board.

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EMC Recommendations

EMC protection on the pins in the table below should be designed by application side according to the customer’s requirement.

EMC Recommendations

Pin Signal I/O Function Type Comment

USB HS 2.0 Communication Port

38 USB_D+ I/O USB 2.0 Data Plus Analog

36 USB_D- I/O USB 2.0 Data Minus Analog

USB SS 3.0 Communication and PCIe Port

33 USB/PCIE_RX_P I USB 3.0 super-

speed/PCIe receive

– plus

Analog

31 USB/PCIE_RX_M I USB 3.0 super-

speed/PCIe receive

– minus

Analog

25 USB/PCIE_TX_P O USB 3.0 super-

speed/PCIe transmit

– plus

Analog

23 USB/PCIE_TX_M O USB 3.0 super-

speed/PCIe transmit

– minus

Analog

SIM Card Interface 1

14 SIMRST1 O Reset output to an

external UIM1 card

1.8 / 2.85V

12 SIMCLK1 O Clock output to an

external UIM1 card

1.8 / 2.85V

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10 SIMIO1 I/O Data connection with

an external UIM1

card

1.8 / 2.85V

8 SIMVCC1 O Supply output for an

external UIM1 card

1.8 / 2.85V Power

SIM Card Interface 2

6 SIMRST2 O Reset output to an

external UIM2 card

1.8 / 2.85V

17 SIMCLK2 O Clock output to an

external UIM2 card

1.8 / 2.85V

19 SIMIO2 I/O Data connection with

an external UIM2

card

1.8 / 2.85V

16 SIMVCC2 O Supply output for an

external UIM2 card

1.8 / 2.85V Power

Digital I/O (GP IOs)

3 GPIO_01 I/O General purpose I/O 1.8V

5 GPIO_02 I/O General purpose I/O 1.8V

44 GPIO_03 I/O General purpose I/O 1.8V

46 GPIO_04 I/O General purpose I/O 1.8V

1 PCIE_WAKE_N I/O PCIe wake-up 1.8V Active Low

42 WAN_LED_N O LED control Open-drain Active Low

Power ON/OFF Reset IN/OUT

20 W_DISABLE_N I RF ON/OFF Control Open-drain Active Low

(internal

VBATT pull

up)

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All other pins have the following characteristics:

Human Body Model (HBM): ± 1000 V Charged Device Model (CDM) JESD22-C101-C: ± 250 V

All Antenna pins up to TBD

Warning –

Do not touch without proper electrostatic protective

equipment. The product must be handled with care, avoiding any

contact with the pins because electrostatic discharge may damage the product itself.

22 PCIE_RESET_N I PCIe Reset Input 1.8V Active Low

48 SYSTEM_RESET_N I Reset Input 1.8V Active Low

1.8V Voltage Regulator

28 VREG_L6_1P8 O LDO out for 1.8V Power

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11. PACKAGING

Tray

The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling.

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12. CONFORMITY ASSESSMENT ISSUES

Approvals

 Full y type approved confirming with RE Directive (Directive 2014/53/EU)  CE, GCF  FCC, IC, PTCRB  RoHS and REACH  Approvals for major Mobile Network Operators

Declaration of Conformity

The DoC is available here: www.telit.com/RED/

FCC cert ificates

The FCC Certifcate is available here: www.fcc.gov/oet/ea/fccid

IC certificates

The IC Certifcate is available here:

https://sms-sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en

FCC/IC Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

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brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

RF exposure

This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distanc e minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the use r is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

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Labelling Requirements for the Host device

The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in th e host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:

L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et l’ISED du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit :

LM960 Contains FCC ID: TBD Contains IC: TBD

CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

RED Regulatory notices

RF Exposure Information (MPE)

This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20 cm separation distance to the user.

OEM/Host manufacturer responsibilities

OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the RED. This

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module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment.

The allowable Antenna Specipication

In all cases assessment of the final product must be met against the Essential requirements of the RE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements.

1. The following antenna was verified in the conformity testing, and for compliance the antenna shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations.

2. If any other simultaneous transmission radio is installed in the host pl atform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required.

Waste Electrical and Electronic Equipment (WEEE)

This symbol means that according to local laws and regulations your product and/or its battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment.

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13. SAFETY RECOMM E NDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc.

 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty

validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The syst em integr ator is responsible for t he functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the LTE & WC DMA network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

https://ec.europa.eu/commission/index_en

The text of the Directive 2014/35/EU regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS

RF Bands Characteristics

Mode Fr eq. Tx

(MHz)

Freq. Rx

(MHz)

Channels Tx-Rx

Offset

WCDMA 2100 – B1

1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888

Rx: 10562 ~ 10838

190 MHz

WCDMA 1900 – B2

1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538

Rx: 9662 ~ 9938

80 MHz

WCDMA AWS – B4

1710 ~ 1755 2110 ~ 2155 Tx: 1537 ~ 1738

Rx: 1312 ~ 1513

400 MHz

WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233

Rx: 4357 ~ 4458

45 MHz

WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863

Rx: 2937 ~ 3088

45 MHz

WCDMA 1800 Japan – B9

1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912

Rx: 9237 ~ 9387

95 MHz

WCDMA 800 Japan – B19

830 ~ 845 875 ~ 890 Tx: 312 ~ 363

Rx: 712 ~ 763

45 MHz

LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599

Rx: 0 ~ 599

190 MHz

LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199

Rx: 600 ~ 1199

80 MHz

LTE 1800+ – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949

Rx: 1200 ~ 1949

95 MHz

LTE AWS-1 – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399

Rx: 1950 ~ 2399

400 MHz

LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649

Rx: 2400 ~ 2649

45 MHz

LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449

Rx: 2750 ~ 3449

120 MHz

LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799

Rx: 3450 ~ 3799

45 MHz

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Mode Fr eq. Tx

(MHz)

Freq. Rx

(MHz)

Channels Tx-Rx

Offset

LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179

Rx : 5010 ~ 5179

30 MHz

LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659

Rx : 9210 ~ 9659

-31 MHz

LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849

Rx: 5730 ~ 5849

30 MHz

LTE 800 Lower – B18

815 ~ 830 860 ~ 875 Tx: 23850 ~ 23999

Rx: 5850 ~ 5999

45 MHz

LTE 800 Upper – B19

830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149

Rx: 6000 ~ 6149

45 MHz

LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449

Rx: 6150 ~ 6449

-41 MHz

LTE 1900+ – B25 1850 ~ 1915 1930 ~ 1995 Tx: 8040 ~ 8689

Rx: 26040 ~ 26689

80 MHz

LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 8690 ~ 9039

Rx: 26690 ~ 27039

45 MHz

LTE 700 APT – B28

703 ~ 748 758 ~ 803 Tx: 9210 ~ 9659

Rx: 27210 ~ 27659

55 MHz

LTE 700 d – B29 Downlink only 717 ~ 728 Rx: 9660 ~ 9769 –

LTE 2300 WCS – B30

2305 ~ 2315 2350 ~ 2360 Tx: 9770 ~ 9869

Rx: 27660 ~ 27759

45 MHz

LTE 1500 L-band – B32

Downlink only 1452 ~ 1496 Rx: 9920 ~ 10359 –

LTE AWS-3 – B66 1710 ~ 1780 2110 ~ 2200 T x: 66436 ~ 67335

Rx: 131972 ~ 132671

400 MHz

LTE 600 – B71 663 ~ 698 617 ~ 652 Tx: 133122 ~ 133471

Rx: 68586 ~ 68935

-46 MHz

LTE TDD 2600 – B38

2570 ~ 2620

T/Rx: 37750 ~ 38250 –

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Mode Fr eq. Tx

(MHz)

Freq. Rx

(MHz)

Channels Tx-Rx

Offset

LTE TDD 1900+ – B39

1880 ~ 1920 T/Rx: 38250 ~ 38649 –

LTE TDD 2300 – B40

2300 ~ 2400

T/Rx: 38650 ~ 39650 –

LTE TDD 2500 – B41

2496 ~ 2690

T/Rx: 39650 ~ 41589 –

LTE TDD 3500 – B42

3400 ~ 3600 T/Rx: 41590 ~ 43589 –

LTE TDD Unlicensed – B46

Downlink only 5150 ~ 5925 – –

LTE TDD 3600 – B48

3550 ~ 3700 T/Rx: 55240 ~ 56739 –

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15. ACRONYMS

TTSC

Telit Technical Support Centre USB

Universal Serial Bus HS

High Speed DTE

Data Terminal Equipment UMTS

Universal Mobile Telec ommunication System WCDMA

Wideband Code Division Multiple Access HSDPA

High Speed Downlink Packet Access HSUPA

High Speed Uplink Packet Access UART

Universal Asynchronous Receiver Transmitter HSIC

High Speed Inter Chip SIM

Subscriber Identification Module SPI

Serial Peripheral Interface ADC

Analog – Digital Converter DAC

Digital – Analog Converter I/O

Input Output GPIO

General Purpose Input Output CMOS

Complementary Metal – Oxide Semiconductor MOSI

Master Output – Slave Input MISO

Master Input – Slave Output CLK

Clock MRDY

Master Ready

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SRDY

Slave Ready CS

Chip Select RTC

Real Time Clock PCB

Printed Circuit Board ESR

Equivalent Series Resistance VSWR

Voltage Standing Wave Radio VNA

Vector Network Analyzer FDD

Frequency division duplex I2C

Inter-integrated circuit LTE

Long term evolution SOC

System-on-Chip

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16. DOCUMENT HIS TORY

Revision Date Changes 0 2018-2-09 First Draft 1 2018-5-30 Sec 1.5 Some of Doc’s Referrence Number Is

Updated Sec 3.3 Pin Layout Updated

Sec 4.2 Current Consumption Updated Sec 6 Power On, Power Off, Reset Updated

2 3

1.2017]

Mod.08

18 2017-01 Rev.0

Telit Wireless Solutions LM960 Design Manual

Specifications and Main Features

Frequently Asked Questions

User Manual