Telit Wireless Solutions LE910Cx Hardware User's Manual

LE910Cx

Hardware User Guide

1VV0301298 Rev. 1.05 - 2017-06-18

LE910Cx Hardware User Guide

1VV0301298 Rev. 1.05 - 2017-06-18

Applicability Table

This documentation applies to the following products:

Table 1: Applicability Table

Module Name Description

LE910C1-NA North America – AT&T with global

roaming

LE910C1-NS North America - Sprint variant

LE910C1-AP APAC variant

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in the content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey any license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include, or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute, and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged, or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

Telit and third-party software (SW) products described in this instruction manual may include copyrighted Telit and other third-party computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other third-party SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other thirdparty SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit.

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of nuclear facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such high risk activities.

Trademarks

TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications S.p.A. in the Unites States and/or other countries. All other product or service names are the property of their respective owners.

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Contents

1. Introduction ..................................................................................................... 13

1.1. Scope ................................................................................................................ 13

1.2. Audience .......................................................................................................... 13

1.3. Contact Information, Support .......................................................................... 13

1.4. Text Conventions ............................................................................................. 14

1.5. Related Documents .......................................................................................... 15

1.6. Abbreviations ................................................................................................... 16

2. General Product Description ............................................................................ 17

2.1. Overview .......................................................................................................... 17

2.2. Applications ..................................................................................................... 17

2.3. General Functionality and Main Features ....................................................... 18

2.4. Block Diagram .................................................................................................. 21

2.5. Environmental Requirements .......................................................................... 22

2.5.1. Temperature Range .............................................................................. 22

2.5.2. RoHS Compliance.................................................................................. 22

2.6. Frequency Bands .............................................................................................. 23

2.6.1. RF Bands per Regional Variant ............................................................. 23

2.6.2. Reference Table of RF Bands Characteristics ....................................... 24

2.7. Sensitivity ......................................................................................................... 26

2.8. LE910Cx Mechanical Specifications ................................................................. 27

2.8.1. Dimensions ........................................................................................... 27

2.8.2. Weight .................................................................................................. 27

3. LE910Cx Module Connections ........................................................................... 28

3.1. Pin-out .............................................................................................................. 28

3.2. LE910Cx - Signals That Must Be Connected ..................................................... 39

3.3. LGA Pads Layout ............................................................................................... 41

3.4. Backward Compatibility to xE910 Family ........................................................ 42

4. Electrical Specifications .................................................................................... 43

4.1. Absolute Maximum Ratings – Not Operational ............................................... 43

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4.2. Recommended Operating Conditions ............................................................. 43

4.3. Logic Level Specifications ................................................................................. 44

4.3.1. 1.8V Pads - Absolute Maximum Ratings ............................................... 44

4.3.2. 1.8V Standard GPIOs ............................................................................ 44

4.3.3. 1.8V SD Card Pads ................................................................................. 45

4.3.4. 1.8V SIM Card Pads ............................................................................... 45

4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ................................. 46

4.3.6. SD Card Pads @ 2.95V .......................................................................... 46

4.3.7. SIM Card Pads @2.95V ......................................................................... 47

5. Hardware Commands ....................................................................................... 48

5.1. Turning on the LE910Cx Module ...................................................................... 48

5.2. Initialization and Activation State .................................................................... 48

5.3. Turning OFF the LE910Cx Module ................................................................... 50

5.3.1. Shutdown by Software Command ....................................................... 50

5.3.2. Hardware Shutdown ............................................................................. 51

5.3.4. Unconditional Hardware Shutdown ..................................................... 52

6. Power Supply ................................................................................................... 53

6.1. Power Supply Requirements............................................................................ 53

6.2. General Design Rules ....................................................................................... 55

6.2.1. Electrical Design Guidelines .................................................................. 55

6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 55

6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 57

6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 59

6.2.2. Thermal Design Guidelines ................................................................... 60

6.2.3. Power Supply PCB Layout Guidelines ................................................... 61

7. Antenna(s) ....................................................................................................... 62

7.1. GSM/WCDMA/LTE Antenna Requirements ..................................................... 62

7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 63

7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 64

7.4. Antenna Diversity Requirements ..................................................................... 64

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7.5. GNSS Antenna Requirements .......................................................................... 65

7.5.1. Combined GNSS Antenna ..................................................................... 65

7.5.2. Linear and Patch GNSS Antenna ........................................................... 65

7.5.3. Front End Design Considerations ......................................................... 65

7.5.4. GNSS Antenna – PCB Line Guidelines ................................................... 66

7.5.5. GNSS Antenna – Installation Guidelines ............................................... 67

8. Hardware Interfaces......................................................................................... 68

8.1. USB Port ........................................................................................................... 69

8.2. HSIC Interface .................................................................................................. 70

8.3. SGMII Interface (optional) ............................................................................... 70

8.3.1. Ethernet Control interface ................................................................... 70

8.4. Serial Ports ....................................................................................................... 71

8.4.1. Modem Serial Port 1 Signals ................................................................. 72

8.4.2. Modem Serial Port 2 ............................................................................. 73

8.4.3. RS232 Level Translation ........................................................................ 74

8.5. Peripheral Ports ............................................................................................... 76

8.5.1. SPI – Serial Peripheral Interface ........................................................... 76

8.5.2. I2C - Inter-integrated Circuit ................................................................ 77

8.5.3. SD/MMC Card Interface ....................................................................... 77

8.5.4. WiFi SDIO Interface .............................................................................. 79

8.6. Audio Interface ................................................................................................ 81

8.6.1. Digital Audio ......................................................................................... 81

8.6.1.1. Short Frame Timing Diagrams .............................................. 82

8.6.1.2. Long Frame Timing Diagrams ............................................... 84

8.7. General Purpose I/O ........................................................................................ 86

8.7.1. Using a GPIO Pad as Input .................................................................... 88

8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ............................. 88

8.7.3. Using a GPIO Pad as Output ................................................................. 88

9. Miscellaneous Functions .................................................................................. 90

9.1. Indication of Network Service Availability ....................................................... 90

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9.2. Indication of Software Ready ........................................................................... 91

9.3. RTC – Real Time Clock ...................................................................................... 91

9.4. VAUX Power Output ........................................................................................ 91

9.5. ADC Converter ................................................................................................. 92

9.5.1. Description............................................................................................ 92

9.5.2. Using the ADC Converter ...................................................................... 92

9.6. Using the Temperature Monitor Function ...................................................... 92

9.7. GNSS Characteristics ........................................................................................ 93

10. Mounting the Module on your Board ............................................................... 94

10.1. General ............................................................................................................. 94

10.2. Finishing & Dimensions .................................................................................... 94

10.3. Recommended Footprint for the Application ................................................. 97

10.4. Stencil ............................................................................................................... 98

10.5. PCB Pad Design ................................................................................................ 98

10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 99

10.7. Solder Paste ................................................................................................... 100

10.7.1. Solder Reflow ...................................................................................... 100

11. Application Guide ........................................................................................... 102

11.1. Debug of the LE910Cx Module in Production ................................................ 102

11.2. Bypass Capacitor on Power Supplies ............................................................. 103

11.3. SIM Interface .................................................................................................. 104

11.3.1. SIM Schematic Example ...................................................................... 104

11.4. EMC Recommendations ................................................................................. 105

11.5. Download and Debug Port ............................................................................. 106

11.5.1. Fast Boot mode................................................................................... 106

11.5.2. Recovery Boot Mode .......................................................................... 106

12. Packing System ............................................................................................... 107

12.1. Packing system – Tray .................................................................................... 107

12.2. Tape & Reel .................................................................................................... 109

12.3. Moisture Sensitivity ....................................................................................... 111

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13. Safety Recommendations ................................................................................ 112

14. Conformity assessment issues ......................................................................... 113

14.1. FCC/ISED Regulatory notices ........................................................................ 113

15. Document History ........................................................................................... 116

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List of Tables

Table 1: Applicability Table ................................................................................................................. 2

Table 2: Related Documents ............................................................................................................ 15

Table 3: RF Bands per Regional Variant ............................................................................................ 23

Table 4: RF Bands Characteristics ..................................................................................................... 24

Table 5: LE910Cx Pin-out .................................................................................................................. 28

Table 6: Mandatory Signals .............................................................................................................. 39

Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43

Table 8: Recommended Operating Conditions ................................................................................ 43

Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44

Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 44

Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45

Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45

Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46

Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46

Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47

Table 16: Power Supply Requirements ............................................................................................ 53

Table 17: LE910Cx Current Consumption ......................................................................................... 53

Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 62

Table 19: Antenna Line on PCB Requirements ................................................................................. 62

Table 20: Antenna Diversity Requirements ...................................................................................... 64

Table 21: Antenna Line on PCB Requirements ................................................................................. 66

Table 22: LE910Cx Hardware Interfaces ........................................................................................... 68

Table 23: USB Interface Signals ........................................................................................................ 69

Table 25: Ethernet Control Interface Signals .................................................................................... 70

Table 24: Modem Serial Port 1 Signals ............................................................................................. 72

Table 25 Modem Serial Port 2 Signals .............................................................................................. 73

Table 26: SPI Signals ......................................................................................................................... 76

Table 27: SD Card Signals .................................................................................................................. 78

Table 28: WiFi SDIO Interface Signals ............................................................................................... 79

Table 29: Digital Audio Interface (DVI) Signals ................................................................................. 81

Table 30: PCM_CODEC Timing Parameters ...................................................................................... 83

Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 85

Table 32: Primary GPIOs ................................................................................................................... 86

Table 33: Network Service Availability Indication ............................................................................ 90

Table 34: Operating Range – VAUX Power Supply ........................................................................... 91

Table 35: ADC Parameters ................................................................................................................ 92

The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 93

Table 37: Recommendations for PCB Pad Surfaces ......................................................................... 99

Table 38: Solder Profile Characteristics .......................................................................................... 101

Table 39: SIM Interface – C1 Range ................................................................................................ 104

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Table 40: EMC Recommendations ................................................................................................. 105

Table 41: Document Revision History ............................................................................................ 116

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List of Figures

Figure 1: LE910Cx Block Diagram ..................................................................................................... 21

Figure 2: LGA Pads Layout ................................................................................................................ 41

Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) ........................................................... 42

Figure 4: Power-on Circuit ................................................................................................................ 48

Figure 5: LE910Cx Initialization and Activation ................................................................................ 49

Figure 6: Shutdown by Software Command ..................................................................................... 50

Figure 7: Hardware Shutdown .......................................................................................................... 51

Figure 8: Circuit for Unconditional Hardware Shutdown ................................................................. 52

Figure 9 Power down timing using HW_SHUTDOWN_N ................................................................. 52

Figure 10: Example of Linear Regulator with 5V Input ..................................................................... 57

Figure 11: Example of Switching Regulator with 12V Input – Part 1 ................................................ 58

Figure 12: Example of Switching Regulator with 12V Input – Part 2 ................................................ 58

Figure 13: RS232 Level Adaption Circuitry Example ......................................................................... 74

Figure 14: RS232 Serial Port Lines Connection Layout ..................................................................... 75

Figure 15: SPI Signal Connectivity ..................................................................................................... 76

Figure 16: SD/MMC Interface Connectivity ...................................................................................... 78

Figure 17: Primary PCM Timing ........................................................................................................ 82

Figure 18: Auxiliary PCM Timing ....................................................................................................... 84

Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 89

Figure 20: Status LED Reference Circuit ........................................................................................... 90

Figure 21: LE910Cx Mechanical Dimensions (bottom view) ............................................................ 94

Figure 22: LE910Cx Mechanical Dimensions (Top view) .................................................................. 95

Figure 23: LE910Cx Mechanical Dimensions (Side view) .................................................................. 96

Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view). ...... 97

Figure 25: PCB Pad Design ................................................................................................................ 98

Figure 26: PCB Pad Dimensions ........................................................................................................ 99

Figure 27: Solder Reflow Profile ..................................................................................................... 100

Figure 28: SIM Schematics .............................................................................................................. 104

Figure 29: Packing ........................................................................................................................... 107

Figure 30: Tray Drawing .................................................................................................................. 108

Figure 31: Module Positioning into the Carrier .............................................................................. 109

Figure 32: Carrier Tape Detail ......................................................................................................... 109

Figure 33: Reel Detail ...................................................................................................................... 110

Figure 34: Reel Box Detail ............................................................................................................... 111

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LE910Cx Hardware User Guide

1. Introduction

1.1. Scope

This document introduces the Telit LE910Cx module and presents possible and recommended hardware solutions for developing a product based on the LE910Cx module. All the features and solutions detailed in this document are applicable to all LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table.

If a specific feature is applicable to a specific product only, it will be clearly marked.

NOTE:

LE910Cx refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out.

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Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE910Cx module.

NOTE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx cellular module within a user application must be done according to the design rules described in this manual.

1.2. Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE910Cx module.

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at:

• TS-EMEA@telit.com

• TS-AMERICAS@telit.com

• TS-APAC@telit.com

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Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users about the information provided.

1.4. Text Conventions

The following conventions are used to emphasize specific types of information:

Danger:

This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning:

Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction.

NOTE:

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, that is, YYYY-MM-DD.

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1.5. Related Documents

Table 2: Related Documents

Document Title Document Number

Ref 1: LE9x0 AT Command User Guide 80407ST10116A

Ref 2: Telit EVB HW User Guide 1VV0301249

Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323

Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A

Ref 5: Telit_LE920A4_LE910Cx_Wi-Fi_Interface_Application_Note_r1 80490NT11511A

Ref 6: Antenna Detection Application Note 80000NT10002A

Ref 7: High-Speed Inter-Chip USB Electrical Specification, version 1.0

(a supplement to the USB 2.0 specification, Section 3.8.2)

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1.6. Abbreviations

Term Definition

ADC Analog-to-digital converter

AE Application-enabled

DAC Digital-to-analog converter

DTE Data Terminal Equipment

FDD Frequency division duplex

GLONASS Global orbiting navigation satellite system

GNSS Global navigation satellite system

GPIO General-purpose input/output

GPRS General packet radio services

GPS Global positioning system

GSM Global system for mobile communications

HSIC High-speed inter-chip

I2C Inter-integrated circuit

LTE Long term evolution

SD Secure digital

SGMII Serial Gigabit media-independent interface

SIM Subscriber identity module

SOC System-on-Chip

SPI Serial peripheral interface

UART Universal asynchronous receiver transmitter

UMTS Universal mobile telecommunications system

USB Universal serial bus

WCI Wireless Coexistence Interface

WCDMA Wideband code division multiple access

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LE910Cx Hardware User Guide

2. General Product Description

2.1. Overview

LE910Cx is Telit’s new LTE series for IoT applications.

In its most basic use case, LE910Cx can be applied as a wireless communication front-end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.

LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per Regional Variant.

2.2. Applications

LE910Cx can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

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• Emergency call

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

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2.3. General Functionality and Main Features

The LE910Cx series of cellular modules features LTE and multi-RAT modem together with an onchip powerful application processor and a rich set of interfaces.

The major functions and features are listed below:

Function Features

Modem

Digital audio subsystem

Two USIM ports – dual voltage

• Multi-RAT cellular modem for voice and data communication

o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL). o Carrier aggregation is not supported o GSM/GPRS/EDGE o WCDMA up to DC HSPA+, Rel.9

• Support for European eCall , US E911, and ERA Glonass

• Support for SIM profile switching

• Regional variants with optimal choice of RF bands for worldwide

coverage of countries and MNOs

• State-of-the-art GNSS solution with

GPS/GLONASS/BeiDou/Galileo/QZSS receiver

• PCM/I2S digital audio interface

• Up to 48 kHz sample rate, 16 bit words

• Class B and Class C support

• Hot swap support

• Clock rates up to 4 MHz

Application processor

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Application processor to run customer application code

• 32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating

system

• Flash + DDR are large enough to allow for customer’s own

software applications

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Function Features

Interfaces Rich set of interfaces, including:

• SD/MMC Card Interface supporting SD3.0 standard

• SDIO for external WiFi transceiver supporting SDIO3.0 standard

• SGMII for external Ethernet transceiver (optional)

o Compliant with IEEE802.3 o Full duplex operation at 1 Gbps o Half/full duplex operation at 10/100 Mbps o Support for VLAN tagging o Support for IEEE1588, PTP (Precision Time Protocol)

• USB2.0 – USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an

external host CPU

o NMEA data to an external host CPU

• HSIC o High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host

driver compatible with traditional USB cable connected topologies

o Bidirectional data strobe signal (STROBE) o Bidirectional data signal (DATA) o No power consumption unless a transfer is in progress o Maximum trace length 10 cm o Signals driven at 1.2V standard LVCMOS levels

• Peripheral Ports – SPI, I2C, UART

• GPIOs

• Antenna ports

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Function Features

Form factor Form factor (28x28mm), accommodating the multiple RF bands in each

region variant

Environment and quality

The entire module is designed and qualified by Telit for satisfying the environment and quality requirements.

requirements

Single supply

The module generates all its internal supply voltages.

module

RTC No dedicated RTC supply, RTC is supplied by VBATT

Operating temperature

Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature

Range).

NOTE:

The following interfaces are unique for the LE910Cx and may not be supported on other (former or future) xE910 family. Special care must be taken when designing the application board if future compatibility is required:

- SGMII for Ethernet connectivity

- SDIO for WIFI connectivity

- SD/MMC for SD Card connectivity

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ANT

DIAG

MEMORIES

FRONTEND

GNSS Antennna

GPIO

Cellular antenna 1

Cellular antenna 2

PCM In/out

SIM

GNSS_Sync

APPLICATION

PROCESSOR

MODEM

LOCATION

HSICI2C

ANT

DIAG

USB2.0SGMIISPI

UART

JTAG

2xSDIO

PMIC

VBATT ADC

VBATT_PA

RTC

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2.4. Block Diagram

Figure 1 shows an overview of the internal architecture of the LE910Cx module.

It includes the following sub-functions:

• Application processor, Modem subsystem and Location processing with their external

interfaces. These three functions are contained in a single SOC.

• RF front end, including antenna diagnosis circuitry

• Analog Audio codec for attaching external speaker amplifier and microphone

• Rich IO interfaces. Depending on which LE910Cx software features are enabled, some of its

interfaces that are exported due to multiplexing may be used internally and thus may not be usable by the application.

• PMIC with the RTC function inside

Figure 1: LE910Cx Block Diagram

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communication). Telit guarantees its modules to comply with all the

there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF

Even so, all the functionalities, such as call connection, SMS, USB

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2.5. Environmental Requirements

2.5.1. Temperature Range

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Operating temperature range

Storage and nonoperating temperature range

-20 ~ +55°C.

This range is defined by 3GPP (the global standard for wireless mobile

3GPP requirements and to have full functionality of the module with in this range.

-40 ~ +85°C.

Telit guarantees full functionality within this range as well. However,

parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded.

communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction.

–40°C ~ +85°C

2.5.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LE910Cx complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).

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2.6. Frequency Bands

The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications.

2.6.1. RF Bands per Regional Variant

Table 3 summarizes all region variants within the LE910Cx family, showing the supported band sets in each variant.

Table 3: RF Bands per Regional Variant

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Region

Variant

LE910C1-NA 2, 4, 12 - 1, 2, 4, 5, 8 - 2, 3, 5, 8

LE910C1-NS 2, 4, 5, 12, 25, 26 - - - -

LE910C1-AP 1, 3, 5, 8, 28 - 1, 5, 8 - -

LTE FDD LTE TDD HSPA+ TD-

SCDMA

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2.6.2. Reference Table of RF Bands Characteristics

Table 4: RF Bands Characteristics

Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz

DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz

GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz

EGSM 900 890 ~ 915 935 ~ 960 0 ~ 124 45 MHz

880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz

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WCDMA 2100 – B1

WCDMA 1900 – B2

WCDMA 1800 – B3

WCDMA AWS – B4

1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888

Rx: 10562 ~ 10838

1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538

Rx: 9662 ~ 9938

1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288

Rx: 1162 ~ 1513

1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513

Rx: 1537 ~ 1738

WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233

Rx: 4357 ~ 4458

WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863

Rx: 2937 ~ 3088

WCDMA 1800 – B9

1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912

Rx: 9237 ~ 9387

190 MHz

80 MHz

95 MHz

400 MHz

45 MHz

95 MHz

WCDMA 800 – B19

TDSCDMA 2000 – B34

830 ~ 845 875 ~ 890 Tx: 312 ~ 363

Rx: 712 ~ 763

2010 ~ 2025 2010 ~ 2025 Tx: 10054 ~ 10121

Rx: 10054 ~ 10121

45 MHz

0 MHz

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

TDSCDMA 1900 – B39

1880 ~ 1920 1880 ~ 1920 Tx: 9404 ~ 9596

Rx: 9404 ~ 9596

LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599

Rx: 0 ~ 599

LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199

Rx: 600 ~ 1199

LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949

Rx: 1200 ~ 1949

LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399

Rx: 1950 ~ 2399

LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649

Rx: 2400 ~ 2649

LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449

0 MHz

190 MHz

80 MHz

95 MHz

400 MHz

45 MHz

120 MHz

Rx: 2750 ~ 3449

LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799

Rx: 3450 ~ 3799

LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149

Rx: 3800 ~ 4149

LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749

Rx: 4150 ~ 4749

LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179

Rx : 5010 ~ 5179

LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659

Rx : 9210 ~ 9659

LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849

Rx: 5730 ~ 5849

45 MHz

95 MHz

400 MHz

30 MHz

-31 MHz

30 MHz

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149

Rx: 6000 ~ 6149

LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449

Rx: 6150 ~ 6449

LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599

Rx: 6450 ~ 6599

LTE 1900+ – B25 1930 ~ 1995 1850 ~ 1915 Tx: 26040 ~ 26689

Rx: 8040 ~ 8689

LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039

Rx: 8690 ~ 9039

LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659

LTE TDD 2600 – B38

Rx : 9210 ~ 9659

2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38250

Rx: 37750 ~ 38250

45 MHz

-41 MHz

48 MHz

80 MHz

45 MHz

0 MHz

LTE TDD 1900 –

1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38650

B39

LTE TDD 2300 –

2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39650

B40

LTE TDD 2500 –

2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41590

B41

2.7. Sensitivity

LE910Cx typical sensitivity levels are as follow:

• -108 dBm @ 2G

• -113.5 dBm @ 3G

• -103 dBm @ 4G (BW=5 MHz)

Rx: 38250 ~ 38650

Rx: 38650 ~ 39650

Rx: 39650 ~ 41590

0 MHz

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2.8. LE910Cx Mechanical Specifications

2.8.1. Dimensions

The LE910Cx module’s overall dimensions are:

• Length: 28.2 mm, +/- 0.15 mm Tolerance

• Width: 28.2 mm, +/- 0.15 mm Tolerance

• Thickness: 2.2 mm, +/- 0.22 mm Tolerance

2.8.2. Weight

The nominal weight of the LE910Cx module is 9.0 gram.

1VV0301298 Rev. 1.05 - 2017-06-18

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3. LE910Cx Module Connections

3.1. Pin-out

Table 5: LE910Cx Pin-out

PAD Signal I/O Function Type Comment

USB HS 2.0 Communication Port

B15 USB_D+ I/O USB differential Data(+)

C15 USB_D- I/O USB differential Data(-)

A13 USB_VBUS AI Power sense for the internal USB

transceiver

A14 USB_ID AI USB ID See note below

Asynchronous UART

N15 C103/TXD I Serial data input (TXD) from DTE 1.8V

M15 C104/RXD O Serial data output to DTE 1.8V

L14 C105/RTS I Input for Request to send signal (RTS)

from DTE

P15 C106/CTS O Output for Clear to send signal (CTS) to

DTE

P14 C107/DSR O Output for Data Set Ready (DSR) to DTE 1.8V Alternate Fn GPIO_32

M14 C108/DTR I Input for Data Terminal Ready (DTR)

from DTE

N14 C109/DCD O Output for Data Carrier Detect (DCD) to

DTE

Power 2.5V – 5.5V

1.8V

1.8V Alternate Fn GPIO_34

1.8V Alternate Fn GPIO_33

R14 C125/RING O Output for Ring Indication (RI) to DTE 1.8V Alternate Fn GPIO_31

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SPI – Serial Peripheral Interface / AUX UART

F15 SPI_CLK O SPI Clock output 1.8V

E15 SPI_MISO/ RX_AUX I SPI data Master Input Slave output /

1.8V

RX_AUX

D15 SPI_MOSI/TX_AUX O SPI data Master Output Slave input/

1.8V

TX_AUX

H14 SPI_CS/GPIO11 O SPI Chip select output / GPIO11 1.8V See note below

SD/MMC Card Digital I/O

J12 SD/MMC_CMD O SD Command 1.8/2.95V

F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V

E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V

G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V

K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V

H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V

G13 SD/MMC_CD I SD card detect input 1.8V Active Low

F13 VMMC - Power supply for MMC card pull-up

resistors

1.8/2.95V

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WiFi (SDIO) Interface

N13 WiFi_SD_CMD O Wi-Fi SD Command 1.8V

L13 WiFi_SD_CLK O Wi-Fi SD Clock 1.8V

J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 1.8V

M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 1.8V

K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 1.8V

H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V

L12 WiFi_SDRST O Wi-Fi Reset / Power enable control 1.8V Active Low

M11 WLAN_SLEEP_CLK O Wi-Fi Sleep clock output 1.8V

M10 RFCLK2_QCA O Wi-Fi low noise RF clock output 1.8V

LTE-WiFi Coexistence

M8 WCI_TX O Wireless coexistence interface TXD 1.8V

M9 WCI_RX I Wireless coexistence interface RXD 1.8V

SIM Card Interface 1

A6 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V

A7 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V

A5 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 20 kΩ

to SIMVCC1

A4 SIMIN1 I External SIM 1 signal - Presence 1.8V Active low

A3 SIMVCC1 - External SIM 1 signal – Power supply for

1.8/2.85V

SIM 1

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+ 87 hidden pages

Telit Wireless Solutions LE910Cx Hardware User's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Introduction

1.1. Scope

1.2. Audience

1.3. Contact Information, Support

1.4. Text Conventions

1.5. Related Documents

1.6. Abbreviations

2. General Product Description

2.1. Overview

2.2. Applications

2.3. General Functionality and Main Features

2.4. Block Diagram

2.5. Environmental Requirements

2.5.1. Temperature Range

2.5.2. RoHS Compliance

2.6. Frequency Bands

2.6.1. RF Bands per Regional Variant

2.6.2. Reference Table of RF Bands Characteristics

2.7. Sensitivity

2.8. LE910Cx Mechanical Specifications

2.8.1. Dimensions

2.8.2. Weight

3. LE910Cx Module Connections

3.1. Pin-out