Telit Wireless Solutions LE50-868 User Manual

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LE50-868 RF Module User Guide

1VV0300905 Rev.1 – 2011-05-18

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

APPLICABILITY TABLE

PRODUCT

LE50-868

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

Usage and Disclosure Restrictions License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

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Contents

1. Introduction ............................................................................................................. 7

1.1. Scope ............................................................................................................................ 7

1.2. Audience ....................................................................................................................... 7

1.3. Contact Information, Support ...................................................................................... 7

1.4. Document Organization ............................................................................................... 8

1.5. Text Conventions .......................................................................................................... 8

1.6. Related Documents ..................................................................................................... 9

2. Requirements ........................................................................................................ 10

2.1. General Requirements .............................................................................................. 10

2.2. Functional Requirements .......................................................................................... 12

2.3. Software ..................................................................................................................... 13

2.4. Temperature Requirements ...................................................................................... 13

3. General Characteristics ......................................................................................... 14

3.1. Mechanical Characteristics ....................................................................................... 14

3.2. Mechanical dimensions ............................................................................................. 15

3.3. Recommended Land pattern ..................................................................................... 15

3.4. DC Characteristics ..................................................................................................... 16

3.5. Functional Characteristics ........................................................................................ 16

3.6. Digital Characteristic ................................................................................................. 18

3.7. Absolut Maximum Ratings ......................................................................................... 18

3.8. Ordering Information ................................................................................................. 18

4. Technical Description ............................................................................................ 20

4.1. Pin-out of the module ................................................................................................ 20

4.2. Pin-out of the DIP Module ......................................................................................... 22

4.3. Description of the signals .......................................................................................... 23

5. Process Information............................................................................................... 24

5.1. Delivery ...................................................................................................................... 24

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5.2. Storage ....................................................................................................................... 24

5.3. Soldering pad pattern ................................................................................................ 25

5.4. Solder past ................................................................................................................. 25

5.5. Placement .................................................................................................................. 26

5.6. Soldering Profile (RoHS Process) ............................................................................. 26

6. Board Mounting Recommendation ......................................................................... 28

6.1. Electrical environment .............................................................................................. 28

6.2. Power supply decoupling on LE50-868 module ....................................................... 28

6.3. RF layout considerations ........................................................................................... 29

6.4. Antenna connections on printed circuit boards ........................................................ 29

6.5. LE50-868 Interfacing ................................................................................................ 31

7. Annexes ................................................................................................................. 32

7.1. Examples of propagation attenuation ....................................................................... 32

8. Safety Recommendations ....................................................................................... 33

9. Glossary ................................................................................................................. 34

10. Document History ............................................................................................... 35

1. Introduction

1.1. Scope

Scope of this document is to give an overview of the fonts, styles and general structure -- first chapter included -- to use when writing Telit documents. The aim of this document is to present the features and the application of the LE50-868 radio module. After the introduction, the characteristics of the LE50-868 radio module will be described within the following distinct chapters:

 Requirements

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 General Characteristics

 Technical description

 Process information

 Board Mounting Recommendations

 Antenna Considerations

1.2. Audience

This document is intended for developers using Telit LE50-868 Module..

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at:

TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

1.4. Document Organization

This document contains the following chapters

“Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

“Chapter 2: “General Requirement” gives an overview of the limitations imposed by

Reference standards.

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“Chapter 3: “General Characteristics” describes in details the characteristics of the product.

“Chapter 4: “Technical Description” describes in details the signals and pin-out of the

product.

“Chapter 5: “Process information” describes in details the delivery, storage, soldering and

placement of the product.

“Chapter 6: “Board Mounting Recommendations” describes in details the interface and

coupling of the product.

“Chapter 7: “Annexes” describe examples of propagation attenuation.

“Chapter 8: “Safety Recommendations” describes recommendation for proper usage.

“Chapter 39: “Document history” describes the revision history of the product.

1.5. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.6. Related Documents

 [1] EN 300 220-2 v2.3.1, ETSI Standards for SRD , February 2010

 [2] ERC Rec 70-03, ERC Recommendation for SRD, June 2010

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 [3] 2002/95/EC,

Directive of the European Parliament and of the Council, 27 January 2003

 [4] Tools : User Manual, 1VV300873 Short Range Tool User Guide

 [5] Star Network User Guide, 1vv0300899 M-ONE Protocol Stack User Guide

 [6] 2006/771/EC, Harmonization of the radio spectrum for use by short-range devices

 [7] 2009/381/EC, Amending Decision 2006/771/EC on harmonization of the radio

spectrum for use by short-range devices

2. Requirements

2.1. General Requirements

The LE50-868 module is a multi-band radio board, delivering up to 25 mW in the 868 MHz ISM band (unlicensed frequency band). It is dedicated to low power applications that require mesh network structure.

LE50-868 is also pin-to-pin compatible with Telit ZE Family (ZigBee 2007 and PRO stack), ME Family (Wireless M-bus) and LE Family (basic point to point, broadcast stack).

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The “ERC recommendation 70-03” describes the different usable sub-bands in the 868 MHz license free band, in terms of bandwidth, maximum power, duty cycle and channel spacing. It gives the following limitations:

ERC recommendation 70-03

Band Frequency band

(MHz)

Annex1 g 863.0 – 870.0 25 =< 100 for 47 or more channels 100 Annex1 g1 868.0 – 868.6 25 No channel spacing specified 1 Annex7 a 868.6 - 868.7 10 25 1 Annex1 g2 868.7 - 869.2 25 No channel spacing specified 0,1 Annex7 d 869.2 – 869.25 10 25 0.1 Annex7 b 869.25 – 869.3 10 25 0.1 Annex7 e 869.3 – 869.4 10 25 1 Annex1 g3 869.4 - 869.65 500 25 (for 1 or more channels) 10 Annex7 c 869.65 – 869.7 25 25 10 Annex1 g4 869.7 – 870.0 5 No channel spacing specified 100

These bands are free to use but the module and the user must respect some limitations. Most of these restrictions are integrated in the conception of the module, except the duty cycle. For example, the 869.400 to 869.650 MHz band is limited to a 10% duty cycle. This means that each module is limited to a total transmit time of 6 minutes per hour. It is the responsibility of the user to respect the duty cycle.

Maximum radiated power (mW)

Channel spacing (kHz)

Duty cycle (%)

Finally, the module complies with the new European Directive 2002/95/EC concerning the Restrictive Usage of Hazardous Substances (RoHS).

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National Restrictions for non specific SR devices Annex 1 band g1-g4:

Country Restriction Reason/Remark Band G

Austria Not Implemented Planned

Finland Limited Implementation

Audio, video and voice not allowed -

Planned 2011 Georgia Not Implemented Greece Limited Implementation to 863-865 MHz

Lithuania Limited implementation

Only 863-868 MHz and duty cycle can not

be increased to 1% Norway Not implemented

Russian Federation

Not Implemented

864-865 MHz with max e.r.p 25 mW,

duty cycle 0.1% or LBT. Forbidden to use

at the airports (aerodromes) Spain Limited implementation to the band 863-868 MHz Sweden Not Implemented The Netherlands Not Implemented Under study

Ukraine Limited implementation

863-865 / 868-868.6 / 868.6-868.7 /

869.2-869.25 MHz

Band G1

Georgia Not Implemented Russian

Federation

Not Implemented

Ukraine Not Implemented e.i.r.p. ≤25 mW

Band G3

Georgia Not Implemented Russian

Federation

Not Implemented

Ukraine Not Implemented

Band G4

Finland Limited implementation Only 5mW e.r.p. - Planned 2011

Georgia Not Implemented Russian Federation

Not Implemented

Ukraine Not Implemented

National Restrictions for non specific SR devices Annex 7 band a-e:

Country Restriction Reason/Remark Band A

France

Duty cycle limited to

0.1%

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Georgia No info Russian Federation

Not implemented

Ukraine Limited implementation The maximal transmitter power 10 mW

Band B

Georgia No info Russian Federation

Not implemented

Ukraine No info

Band C

Georgia No info Russian Federation

Not implemented

Ukraine Not implemented Under study

Band D

Georgia No info Russian Federation

Not implemented

Ukraine Limited implemented The maximal transmitter power 10 mW

Band E

France Not implemented Georgia No info Greece Not implemented Macedonia Not implemented Planned Russian Federation

Not implemented

Ukraine No info

2.2. Functional Requirements

The LE50-868 module is a complete solution from serial interface to RF interface. The LE50868 module has a digital part and a RF part. The radio link is a Half Duplex bi-directional link.

The digital part has the following functionalities:

 Communication interface

 I/O management

 Micro controller with embedded Telit RF proprietary Star Network stack

The RF part has the following functionalities:

 Frequency synthesis

 Front-end

 Low noise reception

 Power amplification

 Packet handling

2.3. Software

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The LE50-868 module is provided pre-flashed with Telit in-house Star Network stack. Please refer to Star Network Stack User Guide [5] for detail information.

2.4. Temperature Requirements

Minimum Typical Maximum Unit Operating

Temperature - 40 25 + 85 °C

Relative humidity @ 25°C

Storage

Temperature - 40 25 + 85 °C

20 75 %

3. General Characteristics

3.1. Mechanical Characteristics

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Size :

Height :

Weight :

PCB thickness:

Cover :

Components :

Connectors :

Mounting :

Number of pins :

Rectangular 25.8 x 15 mm

3 mm

1.7 g

0.8 mm

 Dimensions : 21 x 14.2 x 2.2mm  Thickness : 200µm

All SMD components, on one side of the PCB.

The terminals allowing conveying I/O signals are LGA

 SMD  LGA on the 4 external sides

3.2. Mechanical dimensions

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3.3. Recommended Land pattern

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3.4. DC Characteristics

Characteristics NE50 Min. Typ. Max.

Power Supply

(VDD):

+2.0V +3.3V +3.6V

Consumption

Transmission @ 25mW:

Reception :

Stand-by (32.768 khz On) :

I/O low level :

I/O high level :

45mA 50mA

26mA 30mA

3µA

GND - 0.2x VDD

0.8x VDD - VDD

3.5. Functional Characteristics

ERC/REC70-03 Frequency (MHz)

RF data rate

Numbers of channels

Channel width

Channel 0

Total Bandwidth

Band g

863.000 -

870.000

(1): 19.2 kbps (2): 38.4 kbps (3): 115.2 kbps

20 (1) 10 (2) 0 (3)

100 kHz (1) 200 kHz (2)

865.550 MHz (1)

865.600 MHz (2)

2 MHz 600 kHz 500 kHz 250 kHz 300 kHz

Band g1

868.000 -

868.600 Global

6 (1) 3 (2) 1 (3) 100 kHz (1) 200 kHz (2) 600 kHz (3)

868.050 MHz (1)

868.100 MHz (2)

868.300 MHz (3)

5 (1) 2 (2) 1 (3) 100 kHz (1) 200 kHz (2) 500 kHz (3)

868.750 MHz (1)

868.850 MHz (2)

868.950 MHz (3)

Band g2

868.700 -

869.200

1 (1) 1 (2) 0 (3)

250 kHz

869.5250 MHz

Band g3

869.400 -

869.650

Band g4

869.700 -

870.000

3 (1) 2 (2) 0 (3)

100 kHz (1) 150 kHz (2)

869.750 MHz (1)

869.775 MHz (2)

Transmission

Duty cycle

≤ 1% ≤ 1% ≤ 0.1% ≤ 10% No requirement

GFSK with ± 10 kHz deviation (1)

Modulation

GFSK with ± 20 kHz deviation (2) GFSK with ± 50 kHz deviation (3)

Max permitted e.r.p

e.r.p

25 mW 25 mW 25 mW 500 mW 5 mW

8 levels with 3dB steps from -8dBm (ATS202 = 0) to +13dBm (ATS202 = 7)

20 mW 20 mW 20 mW 20 mW 5 mW

Sensitivity for PER < 10

Remaining PER

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Reception

(1): Max - 104 dBm

-3

(2): Max - 101 dBm (3): Max - 99 dBm

< 1.10-6

Saturation for PER < 10-3

Frequency error

ACP

Modulation bandwidth

Unwanted emissions in the spurious domain

Up to - 10 dBm

ETSI EN 300 220 V2.3.1 (2009-12)

Transmission

+/- 12.5 kHz @ 25 kHz channelization

+/- 87 kHz (100 ppm) > 25 kHz channelization

- 37 dBm in 16 kHz BW under normal test conditions

- 32 dBm in 16 kHz BW under extreme test conditions

Reference

Bandwidth (RBW)

1 kHz

10 kHz

100 kHz

Frequency

State

Operating - 54 dBm (4 nW)

Standby - 57 dBm (2 nW) - 57 dBm (2 nW) - 47 dBm (20 nW)

47 MHz to 74 MHz 7,5

Limit Lower envelope

Minimum frequency

- 30 dBm (1 μW) f

- 36 dBm (250 nW) (f

- 36 d m (250 nW) (f

- 36 dBm (250 nW) (f

MHz to 118 MHz 174 MHz to 230 MHz 470

MHz to 862 MHz

e, lower

Other frequencies below

- 36 dBm (250 nW) - 30 dBm (1 μW)

point

e, lower

– 200 kHz)

– 400 kHz)

– 1 MHz)

e, lower

1 000 MHz

Upper envelope

maximum frequency

e, upper

Frequencies above 1

point

e, upper

+ 200 kHz)

+ 400 kHz)

+ 1 MHz)

000 MHz

Reception

Blocking for class 2

Frequency offset of the

unwanted signal

+/-2 MHz

Receiver bandwidth

10 kHz +/-2 MHz

100 kHz

250 kHz

Frequency offset of the

unwanted signal

equipments

+/-10 MHz

spurious radiation

10 kHz

+/-10 MHz

100 kHz

250 kHz

Below 1000 MHz Above 1000 MHz

- 57 dBm (2 nW)

- 47 dBm (20 nW)

3.6. Digital Characteristic

Function Characteristics

 32 kB + 4 kB in system programmable flash

µC

Serial link

 4 kB RAM

 2 kB E2PROM

 RS232 TTL Full Duplex

 1200 to 115200 bps

 7 or 8 bits

 Parity management

 Flow control

 None

 Software (Xon/Xoff)

 Hardware (RTS/CTS)

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 Star Network Telit RF proprietary stack

Embedded software functionality

 Flexibility:

 Pre flashed

 Customization capability

 Download over the air

3.7. Absolut Maximum Ratings

Voltage applied to Vcc, VDD :

Voltage applied to “TTL” Input :

3.8. Ordering Information

The following equipments can be ordered:

 The SMD version

-0.3V to +3.6V

-0.3V to VDD+0.3V

 The DIP interface version

 The Demo Kit

The versions below are considered standard and should be readily available. For other versions, please contact Telit. Please make sure to give the complete part number when ordering.

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Equipment and Part Number

SMD Version

LE50-868

DIP Version

LE50-868

Demo Kit

D LE50 DEMO

4. Technical Description

4.1. Pin-out of the module

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TOP VIEW (COVER SIDE)

Pin Pin name Pin type Signal level Function

J30 GND Gnd RF Ground connection for external antenna

J29 Ext_Antenna RF RF I/O connection to external antenna

J28 GND Gnd RF Ground connection for external antenna

J27 GND Gnd Ground

J26 GND Gnd Ground

J25 VDD Power Digital and Radio part power supply pin

J24 CTS I TTL Clear To Send

J23 RESET I TTL µC reset ( Active low with internal pull-up )

J22 RTS O TTL Request To Send

J21 RXD I TTL RxD UART – Serial Data Reception

J20 GND Gnd Ground

J19 TXD O TTL TxD UART – Serial Data Transmission

J18 STAND_BY I TTL Standby ( Active high with internal pull-down )

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J17 GND Gnd Ground

J16 PROG I TTL

J15 GND Gnd Ground

J14 PDI_DATA I/O TTL Program and Debug Interface DATA

J13 GND Gnd Ground

J12 GND Gnd Ground

J11 GND Gnd Ground

J10 PDI_CLK I TTL Program and Debug Interface CLOCK

J9 IO91

Status TX/RX

J8 IO8_AD_DA2

ACK TX

J7 IO7_A I/O TTL Digital I/O N°7 with interrupt

J6 IO6_A I/O analog ADC - Analog Input N°6 (Logic I/O capability)

J5 IO5_A I/O analog ADC - Analog Input N°5 (Logic I/O capability)

J4 IO4_A I/O analog ADC - Analog Input N°4 (Logic I/O capability)

J3 IO3_A I/O analog ADC - Analog Input N°3 (Logic I/O capability)

J2 IO2_P I/O TTL Logic I/O N°2 with interrupt

RX LED O TTL See reference document [5] Star Network Protocol Stack

J1 IO1_P I/O TTL Logic I/O N°1 with interrupt

TX LED O TTL See reference document [5] Star Network Protocol Stack

I/O

TTL Digital I/O N°9 with interrupt

TTL See reference document [5] Star Network Protocol Stack

TTL Digital I/O N°8 with interrupt

TTL See reference document [5] Star Network Protocol Stack

NOTE: reserved pins must not be connected

Signal for serial µC flashing ( Active high with internal pulldown )

User Guide

1, 2

In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since

reserved on these modules.

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4.2. Pin-out of the DIP Module

Version 1 Version 2

4.3. Description of the signals

Signals

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Description

Reset

TXD, RXD

CTS

RTS

STAND_BY

TX LED

RX LED

External hardware reset of the radio module. Active on low state.

Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state.

Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state).

Outgoing signal. Indicates whether the user can transmit serial data (active, on low state) or not (inactive, on high state).

I/O, configurable as input or as output.

See reference document [5]

Input signal which indicates to the module to switch to pre-selected lowpower mode.

See reference document [5]

Output signal set to VCC during radio transmission and set to GND the rest of the time

Output signal set to VCC as soon as a radio frame is detected with correct synchronization word. The signal returns to GND as soon as the frame reception is finished

In Addressed Secured mode, this signal rises to VCC when an ACK

ACK TX

STATUS TX/RX

hasn’t been received after frame transmission and repetition. This is the hardware version of “ERROR” serial message. It stays at VCC until next success addressed secured transmission

Output signal which indicates the status of the serial port. When serial port is transmitting, Status RX/TX signal goes VCC until the end of serial transmission. The signal stays to GND the rest of the time

5. Process Information

5.1. Delivery

LE50-868 modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

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5.2. Storage

The optimal storage environment for LE50-868 modules should be dust free, dry and the temperature should be included between -40°C and +85°C.

In case of a reflow soldering process, ME radio modules must be submitted to a drying bake at +60°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect. After being submitted to the drying bake, ME modules must be soldered on host boards within 168 hours.

Also, it must be noted that due to some components, LE50-868 modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed..

5.3. Soldering pad pattern

The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.

The recommended soldering pad layout on the host board for the LE50-868 is shown in the diagram below:

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All dimensions in mm

Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

5.4. Solder past

LE50-868 module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 μm .

The following diagram shows mounting characteristics for ME integration on host PCB:

5.5. Placement

The LE50-868 module can be automatically placed on host boards by pick-and-place machines like any integrated circuit

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5.6. Soldering Profile (RoHS Process)

It must be noted that LE50-868 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.

The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.

CAUTION

It must also be noted that if the host board is submitted to a wave soldering

after the reflow operation, a solder mask must be used in order to protect the

ME radio module’s metal shield from being in contact with the solder wave.

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The barcode label located on the module shield is able to withstand the reflow temperature.

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6. Board Mounting Recommendation

6.1. Electrical environment

The best performances of the LE50-868 module are obtained in a “clean noise” environment. Some basic recommendations must be followed:

 Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus

,...) must be placed as far as possible from the LE50-868 module.

 Switching components circuits (especially RS-232/TTL interface circuit power

supply) must be decoupled with a 100 µF tantalum capacitor. And the decoupling capacitor must be as close as possible to the noisy chip.

6.2. Power supply decoupling on LE50-868 module

The power supply of LE50-868 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, VDD .

Power Supply

Symbols Reference Value Manufacturer

L1 LQH31MN1R0K03 1µH Murata

C1 GRM31CF51A226ZE01 22µF Murata

C1 C2

C2 Ceramic CMS 25V 100nF Multiple

6.3. RF layout considerations

Basic recommendations must be followed to achieve a good RF layout :

 It is recommended to fill all unused PCB area around the module with ground plane

 The radio module ground pin must be connected to solid ground plane.

 If the ground plane is on the bottom side, a via (Metal hole) must be used in front of

each ground pad. Especially J28 and J30 (RF Gnd) pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing mismatch and losses.

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6.4. Antenna connections on printed circuit boards

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.

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PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

Table 1 : Values for double face PCB with ground plane around and under coplanar wave guide (recommended)

PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm)

FR4

0.8 1 0.3

1.6 1 0.2

0.8 1 0.22

1.6 1 0.23

Table 2 : Values for simple face PCB with ground plane around coplanar wave guide (not recommended)

6.5. LE50-868 Interfacing

Example of a full RS-232 connection between a PC or an Automat (PLC) and LE50-868

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7. Annexes

7.1. Examples of propagation attenuation

Factor

Open office Window Thin wall (plaster) Medium wall (wood) Thick wall (concrete) Armoured wall (reinforced concrete) Floor or ceiling Armoured floor or ceiling Rain and/or Fog

* = Attenuations increase along with the frequency. In some cases, it is

therefore difficult to determine loss and attenuation value.

Note = The table above is only indicative. The real values will depend on

the installation environment itself.

433 MHz 868 MHz 2.4 GHz

Attenuation Attenuation Attenuation

0 dB 0 dB 0 dB

< 1 dB 1 – 2 dB 3 dB

3 dB 3 – 4 dB 5 – 8 dB 4 – 6 dB 5 – 8 dB 10 – 12 dB 5 – 8 dB 9 – 11 dB 15 – 20 dB

10 – 12 dB 12 – 15 dB 20 – 25 dB

5 – 8 dB 9 – 11 dB 15 – 20 dB

10 – 12 dB 12 – 15 dB 20 – 25 dB 20 – 25 dB 25 – 30 dB ?? *

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8. Safety Recommendations

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific

environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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9. Glossary

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ACP AFA bps BW dB dBm E e.r.p ETSI GFSK I ISM kB kbps kcps kHz LBT LGA MHz mW O PER ppm RAM RF RoHS RxD SMD SRD TxD UART µC

PROM

Adjacent Channel Power Adaptive Frequency Agility Bits per second Bandwidth Decibel Power level in decibel milliwatt (10 log (P/1mW)) Electrically Erasable Programmable Read Only Memory Effective radiated power European Telecommunication Standard Institute Gaussian Frequency Shift Keying Input Industrial, Scientific and Medical KiloByte Kilobits per second Kilochips per second Kilo Hertz Listen Before Talk Land Grid Array Mega Hertz milliwatt Output Packet Error Rate Parts per million Random Access Memory Radio Frequency Restriction of Hazardous Substances Receive Data Surface Mounted Device Short Range Device Transmit Data Universal Asynchronous Receiver Transmitter microcontroller

10. Document History

Revision Date Changes

0 2011-05-18 First issue

LE50-868 RF Module User Guide

1VV0300905 rev.1 – 2011-05-18

Telit Wireless Solutions LE50-868 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual