Telit Wireless Solutions GE864 User Manual

GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
This document is relating to the following products:
GE864-QUAD 3990250648 GE864-PY 3990250650
GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
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GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
Contents
1 Overview ...........................................................................................................................7
2 GE864 Mechanical Dimensions ......................................................................................8
3 GE864 module connections ............................................................................................9
3.1 PIN-OUT...................................................................................................................................9
3.1.1 BGA Balls Layout........................................................................................................................... 13
4 Hardware Commands ....................................................................................................15
4.1 Turning ON the GE864-QUAD / PY...................................................................................... 15
4.2 Turning OFF the GE86
4.2.1 Hardware shutdown....................................................................................................................... 17
4.2.2 Hardware Unconditional Restart.................................................................................................... 17
4-QUAD / PY....................................................................................17
5 Power Supply .................................................................................................................19
5.1 Power Supply Requirements...............................................................................................19
5.2 General Design Rules
5.2.1 Electrical Design Guidelines .......................................................................................................... 20
5.2.1.1+ 5V input Source Power Supply Design Guidelines ................................................................ 20
5.2.1.2+ 12V input Source Power Supply Design Guidelines .............................................................. 21
5.2.1.3Battery Source Power Supply Design Guidelines ..................................................................... 23
5.2.1.4Battery Charge control Circuitry Design Guidelines .................................................................. 24
5.2.2 Thermal Design Guidelines ........................................................................................................... 26
5.2.3 Power Supply PCB layout Guidelines ........................................................................................... 27
..........................................................................................................20
6 Antenna...........................................................................................................................28
6.1 GSM Antenna Requirements ...............................................................................................28
6.2 GSM Antenna – PCB li
6.3 GSM Anten
na – Installation Guidelines
ne Guidelines..................................................................................29
..............................................................................30
7 Logic level specifications..............................................................................................31
7.1 Reset signal ..........................................................................................................................32
8 Serial Ports .....................................................................................................................33
8.1 MODEM SERIAL PORT......................................................................................................... 33
8.2 RS232 level translation ........................................................................................................35
8.3 5V UART le
vel translation
....................................................................................................37
9 Audio Section Overview ................................................................................................39
9.1 INPUT LINES (Microphone) .................................................................................................40
9.1.1 Short description............................................................................................................................ 40
9.1.2 Input Lines Characteristics ............................................................................................................ 41
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9.2 OUTPUT LINES (Speaker)....................................................................................................42
9.2.1 Short description............................................................................................................................ 42
9.2.2 Output Lines Characteristics.......................................................................................................... 43
9.3 SIM Holder Implementation .................................................................................................43
10General Purpose I/O.......................................................................................................44
10.1GPIO Logic levels .................................................................................................................46
10.2Using a GPIO Pad as INPUT ................................................................................................47
10.3Using a GPIO Pad as OUTPUT
10.4Using the RF Transmission Control GPIO4
10.5Using the RFTXMON Output GPIO5
t
10.6Using the Alarm Outpu
GPIO6 ...........................................................................................48
............................................................................................47
.......................................................................48
....................................................................................48
10.7Using the Buzzer Output GPIO7..........................................................................................49
10.8Magnetic Buzzer Concepts
10.8.1 Short Description ........................................................................................................................... 50
10.8.2 Frequency Behaviour..................................................................................................................... 51
10.8.3 Power Supply Influence ................................................................................................................. 51
10.8.4 Warning.......................................................................................................................................... 51
10.8.5 Working Current Influence ............................................................................................................. 51
..................................................................................................50
10.9Using the Temperature Monitor Function ..........................................................................52
10.9.1 Short Description ........................................................................................................................... 52
10.9.2 Allowed GPIO ................................................................................................................................ 52
10.10 Indication of network service availability .......................................................................53
10.11 RTC Bypas
10.12 VAUX1 pow
s out ................................................................................................................54
er output ........................................................................................................54
11DAC and ADC section....................................................................................................55
11.1DAC Converter......................................................................................................................55
11.1.1 Description..................................................................................................................................... 55
11.1.2 Enabling DAC ................................................................................................................................ 56
11.1.3 Low Pass Filter Example ............................................................................................................... 56
11.2ADC Converter......................................................................................................................57
11.2.1 Description..................................................................................................................................... 57
11.2.2 Using ADC Converter .................................................................................................................... 57
12Mounting the GE864 on your Board .............................................................................58
12.1General ..................................................................................................................................58
12.1.1 Module finishing & dimensions ...................................................................................................... 58
12.1.2 Recommended foot print for the application (GE864) ................................................................... 59
12.1.3 Suggested Inhibit Area .................................................................................................................. 60
12.1.4 Debug of the GE864 in production ................................................................................................ 61
12.1.5 Stencil ............................................................................................................................................ 61
12.1.6 PCB pad design............................................................................................................................. 62
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12.1.7 Solder paste................................................................................................................................... 63
12.1.8 GE864 Solder reflow...................................................................................................................... 64
12.2Packing system ....................................................................................................................65
12.2.1 GE864 orientation on the tray........................................................................................................ 66
12.2.2 Moisture sensibility ........................................................................................................................ 66
13Conformity Assessment Issues....................................................................................67
14SAFETY RECOMMANDATIONS.....................................................................................68
15Document Change Log ..................................................................................................69
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DISCLAIMER
The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this application note.
All rights reserved.
© 2006 - 2008 Telit Communications S.p.A.
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1 Overview
The aim of this document is the description of some hardware solutions useful for developing a product with the
Telit GE864-QUAD / PY module.
In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit GE864-QUAD / PY module. For further hardware details that may not be explained in this document refer to the Telit GE864-QUAD / PY Product Description document where all the hardware information is reported.
NOTICE
(EN) The integration of the GSM/GPRS done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS GE864-QUAD / PY all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die integration des GE864-QUAD / PY GSM/GPRS Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen
(SL) Integracija GSM/GPRS GE864-QUAD / PY modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem piročniku.
(SP) La utilización del modulo GSM/GPRS GE864-QUAD / PY debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS GE864-QUAD / PY dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
GE864-QUAD / PY cellular module within user application shall be
GE864-QUAD / PY
The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.
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GE864 Hardware User Guide
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2 GE864 Mechanical Dimensions
The Telit GE864 module overall dimension are:
Length: 30 mm
Width: 30 mm
Thickness: 2.9 mm
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GE864 Hardware User Guide
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3 GE864 module connections
3.1 PIN-OUT
Ball Signal I/O Function Internal PULL UP Type
Audio
H9 EAR_MT- AO Handset earphone signal output, phase - Audio
G10 EAR_MT+ AO Handset earphone signal output, phase + Audio
H10 EAR_HF+ AO Handsfree ear output, phase + Audio
J10 EAR_HF- AO Handsfree ear output, phase - Audio
J8 MIC_MT+ AI Handset mic.signal input; phase+ Audio
G9 MIC_MT- AI Handset mic.signal input; phase- Audio
G8 MIC_HF+ AI Handsfree mic. input; phase + Audio
J9 MIC_HF- AI Handsfree mic.input; phase - Audio
F9 AXE I Handsfree switching 100K CMOS 2.8V
SIM card interface
C10 SIMCLK O External SIM signal – Clock 1,8 / 3V
E9 SIMRST O External SIM signal – Reset 1,8 / 3V
D10 SIMIO I/O External SIM signal – Data I/O 1,8 / 3V
C11 SIMIN I External SIM signal – Presence (active low) 47K 1,8 / 3V
D41 SIMVCC - External SIM signal – Power supply for the SIM 1,8 / 3V
Trace
D11 TX_TRACE O TX Data for debug monitor CMOS 2.8V
F10 RX_TRACE I RX Data for debug monitor CMOS 2.8V
Prog. / Data + HW Flow Control
E7 C103/TXD I Serial data input (TXD) from DTE CMOS 2.8V
H8 C104/RXD O Serial data output to DTE CMOS 2.8V
B7 C108/DTR I
F7 C105/RTS I
F6 C106/CTS O Output for Clear to send signal (CTS) to DTE CMOS 2.8V
D9 C109/DCD O
E11 C107/DSR O Output for Data set ready signal (DSR) to DTE CMOS 2.8V
B6 C125/RING O Output for Ring indicator signal (RI) to DTE CMOS 2.8V
Input for Data terminal ready signal (DTR) from DTE Input for Request to send signal (RTS) from DTE
Output for Data carrier detect signal (DCD) to DTE
DAC and ADC
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
1
On this line a maximum of 10nF bypass capacitor is allowed
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Ball Signal I/O Function Internal PULL UP Type
C7 DAC_OUT AO Digital/Analog converter output D/A
J11 ADC_IN1 AI Analog/Digital converter input A/D
H11 ADC_IN2 AI Analog/Digital converter input A/D
G11 ADC_IN3 AI Analog/Digital converter input A/D
Miscellaneous Functions
A2 RESET* I Reset input
E2 VRTC AO VRTC Backup capacitor Power
D8 STAT_LED O Status indicator led CMOS 1.8V
G1 CHARGE AI Charger input Power
G2 CHARGE AI Charger input Power
J5 ON_OFF* I
D5 VAUX1 - Power output for external accessories -
L8 PWRMON O Power ON Monitor CMOS 2.8V
L4 Antenna O Antenna output – 50 ohm RF
D7 DVI2_CLK - DVI2_CLK (Digital Voice Interface) 4.7K CMOS 2.8
G4 TGPIO_12 I/O Telit GPIO12 Configurable GPIO CMOS 2.8V
C2 TGPIO_03 I/O Telit GPIO03 Configurable GPIO CMOS 2.8V
B3 TGPIO_04 I/O
C3 TGPIO_20 I/O Telit GPIO20 Configurable GPIO CMOS 2.8V
B4 TGPIO_14 I/O Telit GPIO14 Configurable GPIO CMOS 2.8V
D1 TGPIO_11 I/O Telit GPIO11 Configurable GPIO CMOS 2.8V
B1 TGPIO_19 I/O Telit GPIO19 Configurable GPIO CMOS 2.8V
C1 TGPIO_01 I/O Telit GPIO01 Configurable GPIO CMOS 2.8V
K7 TGPIO_18 I/O
H5 TGPIO_17 I/O
F5 TGPIO_15 I/O Telit GPIO15 Configurable GPIO CMOS 2.8V
K11 TGPIO_08 I/O Telit GPIO08 Configurable GPIO CMOS 2.8V
B5 TGPIO_06 / ALARM I/O Telit GPIO06 Configurable GPIO / ALARM CMOS 2.8V
C9 TGPIO_09 I/O Telit GPIO09 GPIO I/O pin CMOS 2.8V
E6 TGPIO_02 / JDR I/O Telit GPIO02 I/O pin / Jammer detect report CMOS 2.8V
L9 TGPIO_07 / BUZZER I/O Telit GPIO07 Configurable GPIO / Buzzer CMOS 2.8V
H6 TGPIO_16 I/O Telit GPIO16 Configurable GPIO CMOS 2.8V
K10 TGPIO_13 I/O Telit GPIO13 Configurable GPIO CMOS 2.8V
K8 TGPIO_05 / RFTXMON I/O
L10 TGPIO_21 I/O Telit GPIO21 Configurable GPIO CMOS 2.8V
E8 TGPIO_22 I/O Telit GPIO22 Configurable GPIO
H3 TGPIO_10 I/O
Input command for switching power ON or OFF (toggle command).
GPIO
Telit GPIO04 Configurable GPIO / RF Transmission Control
Telit GPIO18 Configurable GPIO/ DVI2_RX (Digital Voice Interface) Telit GPIO17 Configurable GPIO / DVI2_WA (Digital Voice Interface)
Telit GPIO05 Configurable GPIO / Transmitter ON monitor
Telit GPIO10 Configurable GPIO / DVI2_TX (Digital Voice Interface)
Power Supply
47K Pull up to VBATT
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 1.8V (not 2.8V !!)
CMOS 2.8V
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Ball Signal I/O Function Internal PULL UP Type
J1 VBATT - Main power supply Power
K1 VBATT - Main power supply Power
J2 VBATT - Main power supply Power
K2 VBATT - Main power supply Power
A1 GND - Ground Power
F1 GND - Ground Power
H1 GND - Ground Power
L1 GND - Ground Power
H2 GND - Ground Power
L2 GND - Ground Power
J3 GND - Ground Power
K3 GND - Ground Power
L3 GND - Ground Power
K4 GND - Ground Power
K5 GND - Ground Power
D6 GND - Ground Power
K6 GND - Ground Power
L6 GND - Ground Power
A11 GND - Ground Power
F11 GND - Ground Power
L11 GND - Ground Power
RESERVED
A10 -
A3 -
A4 -
A5 -
A6 -
A7 -
A8 -
A9 -
B10 -
B11 -
B2 -
B8 -
B9 -
C4 -
C8 -
D2 -
D3 -
E1 -
E10 -
E3 -
E4 -
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GE864 Hardware User Guide
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Ball Signal I/O Function Internal PULL UP Type
F2 -
F3 -
F4 -
G6 -
G7 -
H4 -
H7 -
J4 -
J6 -
J7 -
K9 -
L5 -
E5 -
L7 -
G5 -
G3 -
C6 -
F8 -
C5 -
NOTE: RESERVED pins must not be connected
NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
pin signal
J1,K1,J2,K2 A1,F1,H1,L1,H2,L2,J3,K3,L3, K4,K5,D6,K6,L6,A11,F11,L11
J5
E7 A2 H8 F7
VBATT
GND
ON/OFF*
TXD
RESET*
RXD RTS2
2
RTS should be connected to the GND (on the module side) if flow control is not used
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3.1.1 BGA Balls Layout
TOP VIEW
A B C D E F G H J K L
GND TGPIO_19 TGPIO_01 TGPIO_11
1
RESET* - TGPIO_03 - VRTC - CHARGE GND VBATT VBATT GND
2
3
4
5
6
7
- TGPIO_04 TGPIO_20 - - - VMICN TGPIO_10 GND GND GND
-- TGPIO_14 - SIMVCC - - TGPIO_12 - - GND Antenna
-
-
-
TGPIO_06
/ ALARM
C125/RING
C108 /
DTR
GND
DAC_OUT
VAUX1 - TGPIO_15 VMICP TGPIO_17 ON_OFF* GND -
DVI2_CL
K
-
TGPIO_02
/ JDR
C103 /
TXD
GND CHARGE GND VBATT VBATT GND
C106 /
CTS
C105 /
RTS
-
TGPIO_16 - GND GND
- -
- TGPIO_18 -
8
9
10
11
- - -
- - TGPIO_09
- - SIMCLK SIMIO
GND - SIMIN
STAD_
C109 /
TX_TRACE
LED
DCD
TGPIO_22 - MIC_HF+
SIMRST AXE MIC_MT- EAR_MT- MIC_HF- -
- RX_TRACE
C107 /
DSR
GND ADC_IN3 ADC_IN2 ADC_IN1 TGPIO_08 GND
EAR_MT+ EAR_HF+ EAR_HF- TGPIO_13 TGPIO_21
C104 /
RXD
MIC_MT+
TGPIO_05
/
RFTXMON
PWRMON
TGPIO_07 / BUZZER
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AUDIO Signals balls
SIM CARD interface balls
TRACE Signals balls
Prog. / data + Hw Flow Control signals balls
DAC and ADC signals balls
MISCELLANEOUS functions signals balls
TELIT GPIO balls
POWER SUPPLY VBATT balls
POWER SUPPLY GND balls
RESERVED
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4 Hardware Commands
4.1 Turning ON the GE864-QUAD / PY
To turn on the GE864-QUAD / PY the pad ON# must be tied low for at least 1 second and then released. The maximum current that can be drained from the ON# pad is 0,1 mA. A simple circuit to do it is:
ON#
R1
Q1
Power ON impulse
R2
GND
NOTE: don’t use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the GE864-QUAD / PY power regulator and improper power on/off of the module. The line ON# must be connected only in open collector configuration.
NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with a “#” or with a bar over the name.
NOTE: The GE864-QUAD / PY turns fully on also by supplying power to the Charge pad (Module provided with a battery on the VBATT pads).
TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line raised up the device could be considered powered on. PWRMON line rises up also when supplying power to the Charge pad
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For example: Let’s assume you need to drive the ON# pad with a totem pole output of a +3/5 V micro controller (uP_OUT1):
10k
1s
Let’s assume you need to drive the ON# pad directly with an ON/OFF button:
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4.2 Turning OFF the GE864-QUAD / PY
The turning off of the device can be done in three ways:
by software command (see GE864-QUAD / PY Software User Guide)
by hardware shutdown
by Hardware Unconditional Restart
When the device is shut down by software command or by hardware shutdown, it issues to the network a detach request that informs the network that the device will not be reachable any more.
4.2.1 Hardware shutdown
To turn OFF the GE864-QUAD / PY the pad ON# must be tied low for at least 2 seconds and then released. The same circuitry and timing for the power on shall be used. The device shuts down after the release of the ON# pad.
TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When PWRMON goes low, the device has powered off.
4.2.2 Hardware Unconditional Restart
To unconditionally Restart the GE864-QUAD / PY, the pad RESET# must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the ON# pad is 0,15 mA. A simple circuit to do it is:
Unconditional Restart impulse
RESET#
GND
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NOTE: don’t use any pull up resistor on the RESET# line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the GE864-QUAD / PY power regulator and improper functioning of the module. The line RESET# must be connected only in open collector configuration.
TIP: The unconditional hardware Restart should be always implemented on the boards and software should use it as an emergency exit procedure.
For example:
Let’s assume you need to drive the RESET# pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):
10k
This signal is internally pulled up so the pin can be left floating if not used.
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5 Power Supply
The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.
5.1 Power Supply Requirements
POWER SUPPLY
Nominal Supply Voltage 3.8V
Max Supply Voltage 4.2
Supply Voltage Range 3.4 – 4.2
The GE864-QUAD / PY power consumptions are:
GE864-QUAD/PY
Mode Average (mA) Mode description
IDLE mode
AT+CFUN=1 23,9 Normal mode: full functionality of the module
AT+CFUN=4 22
AT+CFUN=0 or
AT+CFUN=5
RX mode
1 slot in downlink 52,3 2 slot in downlink 65,2 3 slot in downlink 78,6 4 slot in downlink 88,4
GSM TX and RX mode
Min power level 78,1
Max power level 200,1
GPRS (class 10) TX and RX mode
Min power level 123,7
Max power level 370,8
1
Worst/best case depends on network configuration and is not under module control
7,20 / 3,563
Disabled TX and RX; module is not registered on the
Power saving: CFUN=0 module registered on the network
and can receive voice call or an SMS; but it is not possible
to send AT commands; module wakes up with an
unsolicited code (call or SMS) or rising RTS line. CFUN=5
full functionality with power saving; module registered on
the network can receive incoming calls and SMS
Stand by mode; no call in progress
network
GSM Receiving data mode
GSM Sending data mode
GPRS Sending data mode
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The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.
TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.
5.2 General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
the electrical design
the thermal design
the PCB layout.
5.2.1 Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
5.2.1.1 + 5V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there’s not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the GE864-QUAD / PY, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the GE864-QUAD / PY from power polarity inversion.
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An example of linear regulator with 5V input is:
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5.2.1.2 + 12V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V; hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the GE864-QUAD/PY.
When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes.
A protection diode should be inserted close to the power input, in order to save the GE864­QUAD/PY from power polarity inversion. This can be the same diode as for spike protection.
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