Telit Wireless Solutions G30 Hardware User's Manual

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G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

PRODUCT

G30

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

APPLICABILITY TABLE

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the United States and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the United States and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners.

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Contents

1. Introduction ......................................................................................................... 12

1.1. Scope .......................................................................................................................... 12

1.2. Audience ..................................................................................................................... 12

1.3. Contact Information, Support .................................................................................... 12

1.3.1. Required Query Information .......................................................................................... 13

1.4. Testing a Standalone Unit .......................................................................................... 14

1.4.1. Test Setup ...................................................................................................................... 14

1.4.2. Test Procedure............................................................................................................... 15

1.5. Document Organization ............................................................................................. 16

1.6. Text Conventions ........................................................................................................ 16

1.7. Related Documents ................................................................................................... 16

1.8. Regulatory Requirements .......................................................................................... 16

1.9. Regulatory Statement (Safety) ................................................................................... 17

1.10. FCC Notice to Users ............................................................................................... 17

1.11. Precautions ............................................................................................................. 18

1.12. Antenna and Transmission Safety Precautions ..................................................... 18

1.12.1. User Operation ............................................................................................................... 18

1.12.2. Antenna Installation ....................................................................................................... 18

1.12.3. Section 15.203 - Antenna Requirements ....................................................................... 19

1.13. Standards................................................................................................................ 19

1.14. General Safety ........................................................................................................ 20

1.14.1. Remember!. . . safety depends on you!......................................................................... 20

1.14.2. Ground the instrument .................................................................................................. 20

1.14.3. Do not operate in an explosive atmosphere .................................................................. 20

1.14.4. Do not service or adjust alone ....................................................................................... 20

1.14.5. Keep away from live circuits .......................................................................................... 21

1.14.6. Do not substitute parts or modify equipment ................................................................ 21

1.14.7. Dangerous procedure warnings .................................................................................... 21

1.15. Caring for the Environment .................................................................................... 21

1.15.1. Disposal of Telit equipment in EU countries ................................................................. 21

1.15.2. Disposal of Telit equipment in non-EU countries .......................................................... 21

1.15.3. Turkey ............................................................................................................................ 22

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2. General Product Description ................................................................................ 23

2.1. Product Specifications ............................................................................................... 23

2.2. Regulatory and Approvals .......................................................................................... 27

2.2.1. European Union Directives Conformance Statement .................................................... 28

2.2.2. CFR 47 Part 15.19 specifies label requirements ........................................................... 28

2.2.3. CFR 47 Part 15.21 Information to user .......................................................................... 28

2.2.4. CFR 47 Part 15.105 Information to the user .................................................................. 28

3. Hardware Interface Description ........................................................................... 30

3.1. Architecture Overview ............................................................................................... 30

3.1.1. Baseband ....................................................................................................................... 31

3.1.2. RF Block ......................................................................................................................... 31

3.2. Operating Modes ........................................................................................................ 31

3.3. Power Supply ............................................................................................................. 33

3.3.1. Power Supply Design ..................................................................................................... 33

3.3.2. Power Consumption ....................................................................................................... 34

3.4. Power On/Off Operation ............................................................................................. 35

3.4.1. Turning the G30 On ........................................................................................................ 35

3.4.2. Power Supply Turn-on ................................................................................................... 36

3.4.3. Turning the G30 On Using PWR_ON .............................................................................. 36

3.4.4. Turning the G30 Off ........................................................................................................ 36

3.4.5. Turning the G30 Off Using PWR_ON .............................................................................. 37

3.4.6. Power Loss shut down ................................................................................................... 37

3.4.7. Turning the G30 Off Using AT+MRST ............................................................................. 37

3.5. Low Power Mode ........................................................................................................ 37

3.5.1. Activating Low Power Mode ........................................................................................... 37

3.5.2. Serial Interface During Low Power Mode ...................................................................... 38

3.5.3. Terminating Low Power Mode ....................................................................................... 39

3.6. Real Time Clock ......................................................................................................... 41

3.7. Serial Interfaces......................................................................................................... 41

3.7.1. UART .............................................................................................................................. 41

3.7.2. Serial Peripheral Interface (SPI) .................................................................................... 43

3.7.3. Flashing and Data Logging ............................................................................................ 44

3.7.4. I

C Bus Interface ............................................................................................................ 46

3.8. SIM Interface .............................................................................................................. 47

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3.8.1. External SIM Card .......................................................................................................... 48

3.8.2. Embedded SIM ............................................................................................................... 49

3.8.3. eSIM Connection ............................................................................................................ 49

3.9. Audio Interface ........................................................................................................... 50

3.9.1. Handset Microphone Port .............................................................................................. 50

3.9.2. Headset Microphone Port .............................................................................................. 51

3.9.3. Differential Speaker (Handset) Port .............................................................................. 53

3.9.4. Mono Speaker (Headset) Port ........................................................................................ 54

3.9.5. Headset Detection .......................................................................................................... 55

3.9.6. Digital Audio Interface ................................................................................................... 56

3.9.7. Voiceband Audio ............................................................................................................. 56

3.9.8. Operating Modes ............................................................................................................ 57

3.9.9. Audio Programming Interface ....................................................................................... 59

3.9.10. Audio Design .................................................................................................................. 60

3.10. A/D Interface ........................................................................................................... 61

3.10.1. Power Supply A/D .......................................................................................................... 62

3.10.2. General Purpose A/D ..................................................................................................... 62

3.11. Controls and Indicators Interface .......................................................................... 63

3.11.1. Reset .............................................................................................................................. 65

3.11.2. VREF Reference Regulator ............................................................................................ 65

3.11.3. VRTC ............................................................................................................................... 66

3.11.4. Wakeup Out .................................................................................................................... 66

3.11.5. Antenna Detection .......................................................................................................... 67

3.11.6. GPRS Detection .............................................................................................................. 68

3.11.7. General Purpose I/O ...................................................................................................... 68

3.12. Antenna Interface ................................................................................................... 68

4. Electrical and Environmental Specifications ........................................................ 71

4.1. Absolute Maximum Ratings ....................................................................................... 71

4.2. Operating Parameters ............................................................................................... 72

4.2.1. Supply/power Pins ......................................................................................................... 72

4.2.2. Digital Pins ..................................................................................................................... 73

4.2.3. Audio Pins ...................................................................................................................... 77

4.2.4. ADC Pins ........................................................................................................................ 80

4.3. Environmental Specifications .................................................................................... 81

4.4. Application Interface Specifications .......................................................................... 82

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5. Mechanical Specifications .................................................................................... 92

5.1. Board Dimensions ..................................................................................................... 92

5.2. LGA Tape & Reel Specification .................................................................................. 94

5.3. Interface Connector Specifications ........................................................................... 95

5.3.1. Mating Connector ........................................................................................................... 96

5.4. U.FL Connector Specifications .................................................................................. 96

5.4.1. Mating Connector ........................................................................................................... 98

5.5. G30 Mounting ............................................................................................................. 98

5.6. Layout Recommendation ........................................................................................... 99

5.6.1. Soldering Footprint ...................................................................................................... 100

5.6.2. RF Recommendation ................................................................................................... 100

5.7. Soldering Re-flow .................................................................................................... 101

6. Acronyms and abbreviations .............................................................................. 103

6.1. Document history ..................................................................................................... 104

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List of tables

Table 2-1: G30 Product Specifications .............................................................................................................. 27

Table 3-1: G30 Operating Modes ...................................................................................................................... 32

Table 3-2: Power supply Signals ....................................................................................................................... 33

Table 3-3: Recommended Power supply filtering ............................................................................................. 34

Table 3-4: G30 Current Ratings ......................................................................................................................... 35

Table 3-5: SPI Interface Connections ................................................................................................................ 44

Table 3-6: Data Logging and SW Upgrading Application Connector ............................................................... 46

Table 3-7: I2C Interface Connections ................................................................................................................ 47

Table 3-8: SIM Interface Signals ....................................................................................................................... 48

Table 3-9: Handset Microphone Port Specifications ......................................................................................... 51

Table 3-10: Headset Microphone Port Specifications ....................................................................................... 52

Table 3-11: Speaker Port Specifications ............................................................................................................ 54

Table 3-12: Mono Speaker Port Specifications ................................................................................................. 55

Table 3-13: Digital Audio Modes ...................................................................................................................... 56

Table 3-14: Basic Mode Audio Paths ................................................................................................................ 58

Table 3-15: Advanced Mode Commands .......................................................................................................... 59

Table 3-16: Speech Processing Features ............................................................................................................ 60

Table 3-17: Gain Control Features..................................................................................................................... 60

Table 3-18: Supply A/D Specifications ............................................................................................................. 62

Table 3-19: GPAD Specifications...................................................................................................................... 63

Table 3-20: Controls and indicators ................................................................................................................... 65

Table 3-21: VREF Specifications ...................................................................................................................... 66

Table 3-22: Antenna Interface Specifications .................................................................................................... 70

Table 4-1: Maximum Ratings ............................................................................................................................ 71

Table 4-2: Input Characteristics ......................................................................................................................... 72

Table 4-3: Output Characteristics ...................................................................................................................... 72

Table 4-4: Input Characteristics ......................................................................................................................... 73

Table 4-5: Output Characteristics ...................................................................................................................... 75

Table 4-6: Pad Pull-up and Pull-down Characteristics ...................................................................................... 76

Table 4-7: Audio Transmit Path Characteristics ................................................................................................ 78

Table 4-8: Microphone Supply Characteristics ................................................................................................. 78

Table 4-9: G30 Low Power Single-ended Audio Receive Path Characteristics ................................................ 79

Table 4-10: G30 High Power Differential Audio Receive Path Characteristics ................................................ 80

Table 4-11: Input Characteristics ....................................................................................................................... 81

Table 4-12: Environmental Ratings ................................................................................................................... 82

Table 4-13: Interface Specifications .................................................................................................................. 91

Table 5-1: Interface Connector Specifications ................................................................................................... 95

Table 5-2: U.FL Connector Specifications ........................................................................................................ 98

Table 5-3: Soldering Re-flow Process ............................................................................................................. 101

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List of figures

Figure 1-1: Test Setup ........................................................................................................................................ 15

Figure 3-1: G30 Block Diagram ........................................................................................................................ 30

Figure 3-2: Transmission Power Drops ............................................................................................................. 33

Figure 3-3: Power Supply Turn-on .................................................................................................................... 36

Figure 3-4: PWR_ON Power On Timing .......................................................................................................... 36

Figure 3-5: PWR_ON Power Off Timing .......................................................................................................... 37

Figure 3-6: ATS24 Operation ............................................................................................................................ 38

Figure 3-7: CTS Signal During Sleep Mode ...................................................................................................... 38

Figure 3-8: WKUPI Signal Operation ............................................................................................................... 39

Figure 3-9: Serial Interface Data ........................................................................................................................ 40

Figure 3-10: UART Interface Signals ................................................................................................................ 42

Figure 3-11: RI Behaviour When Receiving A Call .......................................................................................... 42

Figure 3-12: G30 External SIM Interface .......................................................................................................... 48

Figure 3-13: G30 eSIM Interface ....................................................................................................................... 49

Figure 3-14: Audio Interface Topology ............................................................................................................. 50

Figure 3-15: Handset Microphone Circuit ......................................................................................................... 51

Figure 3-16: Headset Microphone Circuit ......................................................................................................... 52

Figure 3-17: Differential Speaker Circuit .......................................................................................................... 53

Figure 3-18: Single-ended Speaker Circuit ........................................................................................................ 53

Figure 3-19: Mono Speaker (Headset) Circuit ................................................................................................... 54

Figure 3-20: I2S BUS Format ............................................................................................................................ 57

Figure 3-21: Voiceband Mode PCM Bus Coding Format ................................................................................. 57

Figure 3-22: Audio Programming Interface ....................................................................................................... 59

Figure 3-23: WKUPO Operation ....................................................................................................................... 67

Figure 4-1: G30 - 70 Pin Connector Quick Integration Connections ................................................................ 83

Figure 4-2: G30 - 81 Pin LGA Interface Quick Integration Connections .......................................................... 84

Figure 5-1: G30 Mechanical Characteristics - 81 Pin LGA Interface................................................................ 92

Figure 5-2: G30 Mechanical Characteristics - B2B Connector (70 Pin) ........................................................... 93

Figure 5-3: LGA Tape & Reel Specification ..................................................................................................... 94

Figure 5-4: Mating Connector Dimensions ....................................................................................................... 96

Figure 5-5: U.FL Connector Dimensions .......................................................................................................... 97

Figure 5-6: U.FL Mating Connector .................................................................................................................. 98

Figure 5-7: G30 Mounting Area ........................................................................................................................ 99

Figure 5-8: G30 Soldering Footprint (Top View) ............................................................................................ 100

Figure 5-9: Soldering Re-flow Process ............................................................................................................ 101

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1. Introduction

1.1. Scope

This manual provides the electrical, mechanical and environmental requirements for properly integrating the G30 module in a host application. This manual gives a complete set of hardware features and functions that may be provided by G30. The availability of any feature or function, which is described in this manual, depends on the hardware revision and software version of a specific G30 model. The parameters and values provided in this manual are defined under typical conditions. These values may vary when subject to different conditions, such as SW version, network status, application settings and environmental conditions.

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1.2. Audience

This manual is intended for all members of the integration team who are responsible for integrating the G30 module into the host OEM device, including representatives from hardware, software and RF engineering disciplines.

1.3. Contact Information, Support

This section provides contact information for any possible queries that may arise, for example:

• Have questions?

• Having trouble getting the Developer Board set up?

• Technical questions?

• Configuration questions/problems?

• Technical operating problems?

• Need documentation?

For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at:

TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

1.3.1. Required Query Information

Every new call/problem report, directly from a Direct Customer or from a distributor, should be directed to the help desk email address noted previously. It is recommended to report each individual issue in a separate email. The following information is required when reporting a problem:

• Customer name and address

• Customer contact information for this request, including:

– Name – Telephone – Fax number – Mobile number – Email address

• Product name (G30)

• Software version of the unit (ATI8 command) or model number

• PCB version (located on the PCB near the RF connector)

• Severity of the problem

• Problem description, including:

– Operator name – Type of SIM card (for example, Test, Pre-paid, or 3v) – Setup Configuration (such as Developer Board, handset, host, connections, and so on) – Detailed scenario from startup – Log of all the commands and the responses, beginning from startup

• Answers to the following questions:

– Was the same scenario tested on the Developer Board and the PC to reproduce the

problem?

– How many units do you have, and how many of them have this problem? – How often does the problem recur?

In addition to the information requested above, send the following AT commands and the HyperTerminal log with the responses:

• AT+CMEE=2 // to get textual error message

• AT+CPIN? // to get SIM card status

• AT+CREG? // to see if the TXVR is registered to the network

• AT+CSQ // to get the signal strength (RX level)

• AT+CGSN // to read the IMEI number of the unit

• ATI8I9 // to get the software version of the TXVR

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• AT+CMER=0,0,1,1 // to get messages and indicators from the handset

display to the DTE

1.4. Testing a Standalone Unit

This section describes how to perform a G30 functionality test, whose purpose is to:

• Introduce the user to the G30

• Explain how to work with the G30 unit

• Describe how to evaluate basic G30 features

The test setup provides a wide platform through which a G30 unit can be evaluated. The specific test procedure described below covers only a few of the G30’s many features. Using this setup, you can perform several additional tests on the G30. The test is performed using two modems, one of which is the G30. The modems communicate with each other through a single computer, which also controls their operation. The test requires knowledge about the operation of the G30 Developer’s Kit, terminal applications and AT commands. Refer to relevant documentation for assistance. To perform the test, you need the following:

• A G30 OEM cellular engine unit

• A G30 Developer's Kit

• A desktop or laptop computer, which includes:

– A free serial communications port (RS232) – A connected and active line modem (internal or external) – A terminal application (such as HyperTerminal)

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1.4.1. Test Setup

To Setup the G30 Test

Follow this procedure (see following figure) to set up your equipment before performing the test:

1. Verify that the computer you intend to use for the test is equipped with a working

line modem

You can use a second G30 unit instead of the line modem. When doing so, you must repeat the setup procedure that follows for the additional G30.

2. Set up the G30 and the Developer Board as described in “Initial Setup” in

“ Developer Board and Interfaces Description” in the “G30 Developer’s Kit Guide”

3. Verify that the G30 has adequate reception from the local GSM network

4. Connect the Developer Board’s RS232 port to the computer’s serial port

5. Open a terminal application window (such as HyperTerminal) and configure it to operate

with the serial port occupied by the G30

6. Open a second terminal window and configure it to operate with the serial port occupied

by the line

modem

Computer

Developer Board

with G30 unit

Line Modem

(internal or external)

To telephone line

wall outlet

RS232

Port

Serial

Port

Serial

Port

Serial Cable

1.4.2. Test Procedure

To Perform the G30 Test

Follow the procedure below to perform the G30 test:

1. Verify that the line modem is functioning and communicating with the computer by

entering the AT command at in the modem’s terminal window

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Figure 1-1: Test Setup

This common AT command prompts a properly working modem to reply OK.

2. Verify that the G30 is functioning and communicating with the computer by performing

the following AT commands in the G30 terminal window:

• ati7 — prompts G30 identification

The G30 will reply G30 OEM Module.

• ati8 — prompts the G30 software version

3. Make a CSD call from the G30 to the line modem or the reverse using the atd and ata

commands in the appropriate window

4. Verify that a connection between the two modems is established

5. Select any file to transfer between the two modems

The file can be any existing file, or a new file created specifically for the test.

6. Send the file either from the G30, or to the G30, through the terminal application using

the terminal application’s send/receive file options

7. When the file transfer is complete, use the ath command in any of the terminal windows

to terminate the call

This step completes the test. You can now continue to perform additional tests using the same setup, or change the setup as required.

1.5. Document Organization

This manual contains the following chapters:

• Chapter 1 — introduces the G30 unit and provides important safety instructions, support

and contact information.

• Chapter 2 — provides a detailed hardware description of the blocks and components

comprising the G30.

• Chapter 3 — provides a hardware interface description for G30 connectors.

• Chapter 4 — provides electrical and environmental specifications.

• Chapter 5 — provides mechanical specifications for G30.

• Chapter 6 — provides acronyms, abbreviations and the document’s revisions log.

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1.6. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.7. Related Documents

• G30 Developer’s Kit Guide

• G30 AT Commands Reference Guide

1.8. Regulatory Requirements

The Federal Communications Commission (FCC) requires application for certification of digital devices in accordance with CFR Title 47, Part 2 and Part 15. This includes MPE

calculation. As the G30 modem is not a standalone transceiver but is an integrated module, the G30 cannot be tested by itself for EME certification. It is, however, the integrator’s responsibility to have the completed device tested for EME certification.

CAUTION:

Unauthorized repairs or modifications could result in permanent damage to the equipment and void your warranty and your authority to operate this device under Part 15 of the FCC Rules.

1.9. Regulatory Statement (Safety)

The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating the G30 module. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel, and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Telit assumes no liability for customer failure to comply with these precautions.

• G30 module must be powered by a Limited Power Source (LPS - as defined by EN-

60950-1:2006 section 2.5)

• G30 module should not be assembled when voltage is supplied (applicable for 70 pin

connector model only)

• G30 module must be operated at the voltages described in the technical documentation

• G30 module must not be mechanically nor electrically changed. Use of connectors

should follow the guidance of the technical documentation

• G30 module is designed to meet the EMC requirements of EN 301 489-07

• When integrating the G30 module into a system, Telit recommends testing the system to

EN 301 489-07

• You must not remove any label from the G30 module

• Systems using the G30 module are subject to mandatory EMC/RF/Safety (including

EME) testing under R&TTE directive 1999/5/EC (to://www.newapproach.org/Directives/). Other directives, such, 2002/95/EC (RoHS), WEEE Directive 2002/96/EC should also apply to a system using the G30 module.

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1.10. FCC Notice to Users

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user's authority to operate the equipment. See 47 CFR Sec.

15.21. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. See 47 CFR Sec. 15.19(3). If your mobile device or accessory has a USB connector, or is otherwise considered a computer peripheral device whereby it can be connected to a computer for purposes of transferring data, then it is considered a Class B device and the following statement applies: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates

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uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit different from that to which the receiver is

connected. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.

1.11. Precautions

Interface connector and some of the module circuits are not shielded. Be sure to take appropriate precautionary measures in order to avoid ESD while handling the module. ESD can damage the G30 modules. Integrators need to design ESD protection on all external interfaces.

1.12. Antenna and Transmission Safety Precautions

1.12.1. User Operation

Do not operate your unit when a person is within 8 inches (20 centimeters) of the antenna. A person or object within 8 inches (20 centimeters) of the antenna could impair call quality and may cause the phone to operate at a higher power level than necessary.

IMPORTANT:

The unit must be installed in a manner that provides a minimum separation distance of 20 cm or more between the antenna and persons and must not be co-located or operate in conjunction with any other antenna or transmitter to satisfy FCC RF exposure requirements for mobile transmitting devices.

To comply with the FCC RF exposure limits and satisfy the categorical exclusion requirements for mobile transmitters, the requirements described in the following section,

“Antenna Installation”, must be met.

1.12.2. Antenna Installation

• The antenna installation must provide a minimum separation distance of 20 cm from

users and nearby persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

• Antenna installation should be done by a professional installer and should meet all FCC

requirements as given in FCC part 15.

• Combined cable loss and antenna gain

• R&TTE requirements

• 900 MHz GSM band: The combined cable loss and antenna gain must not exceed

4.08 dBi

• 1800 MHz DCS band: The combined cable loss and antenna gain must not exceed

9.47 dBi

• FCC requirements

• 800 MHz cellular band: The combined cable loss and antenna gain must not

exceed

2.85 dBi

• 1900 MHz PCS band: The combined cable loss and antenna gain must not exceed

2.5 dBi OEM installers must be provided with antenna installation instruction and transmitter operating conditions for satisfying RF exposure compliance.

1.12.3. Section 15.203 - Antenna Requirements

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An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213,

15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section

15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded.

1.13. Standards

Electromagnetic Compatibility: Principles and Applications by David A Weston, published by Marcel Dekker, Inc., 270 Madison Avenue, New York, NY 10016 USA. GSM 07.07 - prETS 300 916, Digital cellular telecommunication system (Phase 2+); AT command set for GSM Mobile Equipment (ME), Version 5.2.0 or higher, Reference RE/SMG-040707QR1. GSM 07.05, Digital cellular telecommunication system (Phase 2+); Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS), Version 5.3.0, August, 1997, Reference TS/SMG-040705QR2. GSM 03.40, Digital cellular telecommunication system (Phase 2+); Technical realization of the Short Message Service (SMS) Point-to-Point (PP), Version 5.3.0, July 1996, Reference TS/SMG-040340QR2. GSM 04.11 Digital cellular telecommunication system (Phase 2+); Point-to-Point (PP) Short Message Service (SMS) support on mobile radio interface, Version 5.1.0, March 1996, Reference TS/SMG-030411QR. GSM 03.38, Digital cellular telecommunication system (Phase 2+); Alphabets and languagespecific information, Version 5.3.0, July 1996, Reference TS/SMG-040338QR2.

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GSM 11.10-1, Digital cellular telecommunication system (Phase 2); Mobile Station (MS) Conformance specification; Part 1: Conformance specification. Draft pr ETS 300 607-1, March 1998, Reference RE/SMG-071110PR6-1. GSM Specifications are orderable from Global Engineering Documents, 15 Inverness Way East, Englewood, Colorado 80112-5704 USA 303-792-2181 800-624-3974. ETSI Standard PCS - 11.10-1.

GSM 02.30 Supplementary services. GSM 03.90 USSD stage 2. GSM 11.14 SIM toolkit.

ITU-T V.25ter G30 AT Command Reference Guide, ETSI standard SMG31. GSM 05.02. ETSI 07.60. ETSI 0.7.07 Ver. 7.5.0.

1.14. General Safety

1.14.1. Remember!. . . safety depends on you!

The following general safety precautions must be observed during all phases of operation, service, and repair of the equipment described in this manual. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the equipment. Telit assumes no liability for the customer’s failure to comply with these requirements. The safety precautions listed below represent warnings of certain dangers of which we are aware. You, as the user of this product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.

1.14.2. Ground the instrument

To minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground. If the equipment is supplied with a three-conductor AC power cable, the power cable must be either plugged into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter. The three-contact to two-contact adapter must have the grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet. The power jack and mating plug of the power cable must meet International Electrotechnical Commission (IEC) safety standards.

1.14.3. Do not operate in an explosive atmosphere

Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical equipment in such an environment constitutes a definite safety hazard.

1.14.4. Do not service or adjust alone

Do not attempt internal service or adjustment unless another person, capable of rendering first aid is present.

1.14.5. Keep away from live circuits

Operating personnel must:

• not remove equipment covers. Only Factory Authorized Service Personnel or other

qualified maintenance personnel may remove equipment covers for internal subassembly, or component replacement, or any internal adjustment

• not replace components with power cable connected. Under certain conditions, dangerous

voltages may exist even with the power cable removed

• always disconnect power and discharge circuits before touching them

1.14.6. Do not substitute parts or modify equipment

Because of the danger of introducing additional hazards, do not install substitute parts or perform any unauthorized modification of equipment. Contact Telit for service and repair to ensure that safety features are maintained.

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1.14.7. Dangerous procedure warnings

Warnings, such as the example below, precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed. You should also employ all other safety precautions that you deem necessary for the operation of the equipment in your operating environment. Warning example:

WARNING:

Dangerous voltages, capable of causing death, are present in this equipment. Use extreme caution when handling, testing, and adjusting.

1.15. Caring for the Environment

The following information is provided to enable regulatory compliance with the European Union (EU) Directive 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) when using Telit equipment in EU countries.

1.15.1. Disposal of Telit equipment in EU countries

Please do not dispose of Telit equipment in landfill sites. In the EU, Telit in conjunction with a recycling partner will ensure that equipment is collected and recycled according to the requirements of EU environmental law. Please contact the Telit Technical Support Center (TTSC) for assistance.

1.15.2. Disposal of Telit equipment in non-EU countries

In non-EU countries, dispose of Telit equipment in accordance with national and regional

regulations.

1.15.3. Turkey

1.15.3.1. Limitation of Liability

The Products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body; in other applications intended to support or sustain life; for the planning, construction, maintenance, operation or use of any nuclear facility; for the flight, navigation, communication of aircraft or ground support equipment; or in any other application in which the failure of the Product could create a situation where personal injury or death may occur. If CUSTOMER should use any Product or provide any Product to a third party for any such use, CUSTOMER hereby agrees that TELIT is not liable, in whole or in part, for any claims or damages arising from such use, and further agrees to indemnify and hold TELIT harmless from any claim, loss, cost or damage arising from such use. EXCEPT AS SPECIFICALLY STATED ABOVE, THE PRODUCTS ARE PROVIDED "AS IS" AND TELIT MAKES NO OTHER WARRANTIES EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE REGARDING THE PRODUCTS. TELIT SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, OR ARISING FROM A COURSE OF DEALING OR USAGE OF TRADE. Under no circumstances shall TELIT be liable to CUSTOMER or any other party for any costs, lost revenue or profits or for any other special, incidental or consequential damages, even if TELIT has been informed of such potential loss or damage. And in no event shall TELIT's liability to CUSTOMER for damages of any nature exceed the total purchase price CUSTOMER paid for the Product at issue in the dispute, except direct damages resulting from patent and/or copyright infringement, which shall be governed by the "INDEMNITY" Section of this Agreement. The preceding states TELIT's entire liability for TELIT's breach or failure to perform under any provision of this Agreement.

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2. General Product Description

The G30 is the newest member of Telit's embedded cellular modules family. Designed with quad band GSM capabilities, which supports four GSM bands 850/900/1800/1900 MHz, and with GPRS multislot class 10, G30 can operate on any GSM/GPRS network to provide voice and data communications. The G30 is similar to a condensed cellular phone core, which can be integrated into any system or product that needs to transfer voice or data information over a cellular network. Thus, it significantly enhances the system's capabilities, transforming it from a standalone, isolated product to a powerful high-performance system with global communications capabilities. The G30 is designed as a complete GSM communications solution with all the controls, interfaces and features to support a broad range of applications:

• A powerful audio interface

• A large set of indicators and control signals

• Several advanced power-saving modes

• A variety of serial communications solutions.

All these features and interfaces are easily controlled and configured using a versatile AT command interface that provides full control over the G30 operation. The G30 comes with several hardware configurations (models) that gives the development engineer the option to select the best cost effective solution for their application. The hardware configuration is the combination of the following factors:

• User interface: 81 pin LGA interface for solder mounting, or 70 pin connector interface

with screw mounting

• Memory: 64Mb/16Mb or 128Mb/32Mb Flash/PSRAM internal memory

• RF Interface: U.FL connector or SMT pad (part of the LGA module)

• SIM interface: External SIM card interface, or internal Embedded SIM (eSIM)

The G30 series was designed for Zero time, Zero effort integration, getting you to market faster than ever. The G30 features both an 81 pin LGA interface form factor and an optional 70-pin B2B connector for various design possibilities. The optional connectorized platform maintains the same mounting design as the award winning G24 module, so you can leverage the G30’s rich feature set but remain with your connectorized design. The G30 Series also shares a unified software interface with the G24 family, including compatible AT commands and TCP/IP stacks.

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2.1. Product Specifications

IMPORTANT:

For safety regulations and requirements, see “Regulatory Requirements”, “Regulatory Statement (Safety)” and “Antenna and Transmission Safety Precautions” in “

Introduction”.

Product Features

Operating systems:

GSM 850/GSM 900

Physical Characteristics

Size (with 3 mm connector):

24.4x40x.3.5mm

Mounting:

SMT (LGA module) or two Ø2.4 mm holes (70 pin connector

Weight:

<6 grams

Environmental

Operational temperature:

-30°C to +85°C

Storage temperature:

-40°C to +85°C

Performance

Operating voltage:

3.3 - 4.2 V

Current consumption:

In AT mode: < 1.6 mA @ DRX9 (Sleep mode)

Maximum Tx output power:

GSM 850/GSM 900: Power class 4 (33 ± 2dBm)

Interfaces

Connectors:

81 pins LGA interface or via a single 70 pin connector

SIM Card:

External SIM connectivity

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NOTE:

Telit reserves the right to change the specifications without prior notice.

DCS 1800/PCS 1900

interface model)

DCS 1800/PCS 1900: Power class 1 (30 ± 2 dBm) GSM 850/GSM 900: GPRS 2 slot up (33 ± 2 dBm) DCS 1800/PCS 1900: GPRS 2 slot up (30 ± 2 dBm)

RF U.FL or via SMT pads

1.8 V / 3.0 V SIM Card support Embedded SIM

Connectivity:

UART:

RTC supply:

RTC supply output/Backup voltage supply input

Reset:

External Reset input

Data Features

GPRS:

Multislot Class 10

CSD:

CS data calls (Transparent / Non-Transparent) up to 9.6 kbps

SMS:

MO/MT Text and PDU modes

Voice Features

Telephony

Digital/Analog audio

Headset Mode

Handset Mode

Hands Free Mode

Ringer Mode

Supporting Midi files

Vocoders

EFR/HR/FR/AMR

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BR from 2400 bps to 230400 bps Auto BR up to 230400 bps I2C (Master, M2M Zone only): I2S or SPI (Master data logging only, AT command selection)

DL up to 85.6 Kbit/s UL up to 42.8 Kbit/s Mobile station class B CS1 to CS 4 supported Internal TCP/IP Embedded FTP

Modem type V.32, V.110

Cell broadcast (SMS CB) Reception of SMS during circuit-switched calls Reception of SMS via GSM or GPRS

DTMF support

Audio control:

Echo canceller, noise reduction, side tone and gain control,

GSM Supplementary Service

Call Hold/Resume (CH)

Call Waiting (CW)

Multi-Party (MTPY)

Call Forwarding (CF)

Call Divert

Explicit Call Transfer (ECT)

Call Barring (CB)

Call Completion to Busy Subscriber Advice of Charge (AoC)

Calling Line Identification Presentation

Calling Line Identification Restriction

Connected Line Identification

Unstructured Supplementary Services Network Identify and Time Zone (NITZ)

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Tx / Rx digital filter control

(CCBS)

(CLIP)

(CLIR)

Presentation (COLP)

Data (USSD)

Character Set

GSM

GSM default alphabet (GSM03.38)

HEX

Character strings consist only of hexadecimal numbers from

IRA

International Reference Alphabet (ITU-T T.50)

8859-1

ISO 8859 Latin 1 character set

UCS2

16-bit universal multiple-octet coded character set

AT Command Set

GSM 07.05

GSM 07.07

Legacy Motorola proprietary AT

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00 to FF; e.g. "032FE6" equals three 8-bit characters with decimal values 3, 47 and 230; no conversions to the original ME character set shall be done

(USO/IEC10646); UCS2 character strings are converted to hexadecimal numbers from 0000 to FFFF. Only the strings found in quotation marks are UCS2 coded, the rest of commands or responses, remains in IRA alphabet

commands

Table 2-1: G30 Product Specifications

2.2. Regulatory and Approvals

• R&TTE

• GCF

• FCC/IC

• PTCRB

• RoHS

• Anatel Brazil

Hereby, Telit declares that this product is in compliance with

0682

IM EI: 35 0034 /40 /39 4721 /9

Type: G30

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2.2.1. European Union Directives Conformance Statement

• The essential requirements and other relevant provisions of

Directive 1999/5/EC

• All other relevant EU Directives

The above gives an example of a typical Product Approval Number.

IMPORTANT:

The following paragraphs must be addressed by the integrator to ensure their host is in compliance to the G30 FCC grant and/or the FCC grant of the host device.

2.2.2. CFR 47 Part 15.19 specifies label requirements

The following text may be on the product, user's manual, or container. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

2.2.3. CFR 47 Part 15.21 Information to user

The user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.

2.2.4. CFR 47 Part 15.105 Information to the user

(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:

NOTE:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by

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turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

3. Hardware Interface Description

The following paragraphs describe in details the hardware requirements for properly interfacing and operating the G30 module.

3.1. Architecture Overview

The figure below illustrates the primary functional components of the G30.

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Figure 3-1: G30 Block Diagram

The G30 consists of the following blocks:

3.1.1. Baseband

The baseband IC is combined with the RF transceiver and the power management unit (PMU). This chipset provides all baseband and low power RF band functionality for GPRS/GSM, and includes:

• Micro-controller Unit (MCU) for system and user code execution.

• Digital Signal Processor (DSP) for voice and data processing.

• Serial communications interfaces.

• UART

• SPI for data logging/I2S

• SIM card

• I

C (via M2M Zone Platform)

• Power Management IC (PMIC).

• Internal regulators

• External VRTC regulator

• Voltage reference (applies for 70 pin connector interface model only)

• Analog audio interface management.

• Handset

• Headset

• Hands Free

• General purpose and dedicated A/D signals.

• A/D

• Voltage sensor

• Temperature sensor

• Real Time Clock (RTC) subsystem.

• RF transceiver.

The G30 base band system provides all necessary interfaces for hardware or software designing and debugging, which are available by means of the 81 board to board pads or the 70 pin connector interface.

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3.1.2. RF Block

The G30 RF section is designed with minimum discrete parts, making it more reliable. The RF block consists of:

• RF Transceiver/Receiver block in the same single chip IC as the MCU

• 2 Rx Filters

• RF power amplifier and Front End Module in single chip IC

3.2. Operating Modes

G30 incorporates several operating modes. Each operating mode is different in the active features and interfaces. The following table summarizes the general characteristics of the G30 operating modes and provides general guidelines for operation.

Not Powered

VCC supply is disconnected.

The G30 is Off.

RTC Mode

Valid VRTC supply.

The G30 Interfaces are Off. Only the internal

Off Mode

Valid VCC supply.

The G30 Interfaces are Off. Only the internal

Idle Mode

RESET_IN signal is disabled (high).

The G30 is fully active, registered to the

Sleep Mode

RESET_IN signal is high.

The G30 is in low power mode.

CSD call or

RESET_IN signal is high.

A GSM voice or data call is in

Sleep).

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Mode Description Features

VRTC is disconnected.

VCC supply is disconnected.

RESET_IN signal is enabled (low).

CTS and DSR signals are enabled (low).

CTS signal is disabled.

Any signals connected to the interface connector must be set tri-state.

RTC timer is operating. Any signals connected to the interface connector must be set tri-stated.

RTC timer is operating. Any signals connected to the interface connector must be set tri-stated. In this mode, the G30 waits for PWR_ON signal to turn ON.

GSM network and ready to communicate. This is the default power-up mode.

The application interfaces are disabled, but, G30 continues to monitor the GSM network.

GPRS data

TXEN signal is high.

progress.When the call terminates, G30 returns to the last operating state (Idle or

Table 3-1: G30 Operating Modes

65, 67-77

1-4

GND

Main ground connection for G30

78, 79

5-8

VCC

DC supply input for G30

bursts

3.3. Power Supply

The G30 power supply must be a single external DC voltage source of 3.3V to 4.2V. The power supply must be able to sustain the voltage level during a GSM transmit burst current surge, which may reach 2.0A. The G30 interface contacts for the main power supply, are described in the following table. All these contacts must be used for proper operation.

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Pin #

(81 pin LGA

interface)

Pin #

(70 pin

connector

interface)

Table 3-2: Power supply Signals

3.3.1. Power Supply Design

Special care must be taken when designing the power supply of the G30. The single external DC power source indirectly supplies all the digital and analog interfaces, but also directly supplies the RF power amplifier (PA). Therefore, any degradation in the power supply performance, due to losses, noises or transients, will directly affect the G30 performance. The burst-mode operation of the GSM transmission and reception, draws instantaneous current surges from the power supply, which causes temporary voltage drops of the power supply level. The transmission bursts consume the most instantaneous current, and therefore cause the largest voltage drop. If the voltage drops are not minimized, the frequent voltage fluctuations may degrade the G30 performance. The following figure illustrates the power supply behavior during GSM transmission.

Signal Name Description

module.

module. VIN = 3.3 V to 4.2 V I

= 350 mA during multislot

RMS

transmission I

= 2 A during transmit

MAX

Figure 3-2: Transmission Power Drops

Capacitor

Usage

Description

1000 uF

GSM Transmit current

Minimizes power supply

10 nF, 100 nF

Digital switching noise

Filters digital logic noises from clocks and data sources.

8.2 pF, 10 pF

1800/1900 MHz GSM

Filters transmission EMI.

33 pF, 39 pF

850/900 MHz GSM

Filters transmission EMI.

Parameter

Description

Conditions

Min

Typ

Max

Unit

RTC mode

µA

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NOTE:

1 TX slot is shown.

It is recommended that the voltage drops during a transmit burst will not exceed 300mV, measured on the G30 interface connector. In any case, the G30 supply input must not drop below the minimum operating level during a transmit burst. Dropping below the minimum operating level may result in a low voltage detection, which will initiate an automatic poweroff. To minimize the losses and transients on the power supply lines, it is recommended to follow these guidelines:

• Use a 1000 uF, or greater, low ESR capacitor on the G30 supply inputs. The capacitor

should be located as near to the G30 interface connector as possible.

• Use low impedance power source, cabling and board routing.

• Use cabling and routing as short as possible.

• Filter the G30 supply lines using filtering capacitors, as described in the following table.

serge

bands

Table 3-3: Recommended Power supply filtering

3.3.2. Power Consumption

The following table specifies typical G30 current consumption ratings in various operating modes. The current ratings refer to the overall G30 current consumption over the VCC supply.

losses during transmit bursts. Use maximum possible value.

OFF

Parameter

Description

Conditions

Min

Typ

Max

Unit

Idle mode

Low power mode

DRx 9 1.6

IDLE

SLEEP

Table 3-4: G30 Current Ratings

3.4. Power On/Off Operation

The G30 power on and off process includes two primary phases, which are indicated at the interface connector by the hardware input signal RESET_IN, and the output signal CTS. The RESET_IN is usually an input signal to the G30, and its main function is to initiate HW reset to the G30. However, this signal can also serve as "live indication" signal, and indicate whether G30 is powered on or off.

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NOTE:

When RESET_IN is used as "Live Indication", verify that the signal is connected to an input device (via a input buffer), with NO pull-up or pull-down resistors.

When this signal is enabled (low), G30 is powered-off. When it is disabled (high), G30 is powered-on. The CTS signal indicates the serial communications interface (UART) status. When this signal is high, the G30 serial interface is disabled. When it is low, the serial interface is enabled, and G30 is ready to communicate. When G30 is powered on, and after the CTS is enabled (Low) and once all G30 internal tests are done, the G30 initiates a "SIM READY" message via the UART serial interface. For more information, refer to "G30 AT Commands Reference Manual".

IMPORTANT:

Applying voltage to ADC lines before power up is forbidden and may cause G30 power up issues.

Do not operate the G30 out of its electrical or environmental limits. Refer to the specifications chapter for details of these limits.

3.4.1. Turning the G30 On

When the G30 power supply is stable above the minimum operating level and G30 is powered off, only the internal RTC timer is active. When G30 is turned on, by any of the methods described below, it will first perform an automatic internal system-test, during which basic functions are verified. The system-test duration is typically 1600 milliseconds. When the system-test has completed G30 resumes normal operation. During the internal system-test process G30 may toggle several interface signals, which are visible to the application. These signals do not represent any valid state or data, and should be ignored by the customer application until the system-test has completed.

3.4.2. Power Supply Turn-on

When connecting the power supply for the first time, or when reconnecting it after a power supply loss, G30 will power-on. The G30 is turned-on automatically when external power is applied above the minimum operating level. The following figure illustrates the G30 power on upon application of a power supply.

Figure 3-3: Power Supply Turn-on

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3.4.3. Turning the G30 On Using PWR_ON

The PWR_ON input signal is set high by an internal pull-up resistor whenever a power supply is applied to G30. Therefore, it is recommended to operate this signal using an open collector/drain circuit connection. Asserting the PWR_ON signal low for a minimum of 600 milliseconds (0.6 seconds) and a maximum of 1.5 seconds will cause the G30 to turn-on. Asserting the PWR_ON signal low for more than 1.5 seconds may cause the G30 to interpret the signal as a power-off command, and turn off immediately after turning on. The following figure illustrates the power-on process using the PWR_ON signal.

Figure 3-4: PWR_ON Power On Timing

3.4.4. Turning the G30 Off

There are several ways to turn the G30 off:

• Asserting the PWR_ON signal low for a minimum of 3 seconds.

• Low power automatic shut down.

• AT command.

3.4.5. Turning the G30 Off Using PWR_ON

The PWR_ON signal is set high using an internal pull up resistor when power is applied to G30. Asserting the PWR_ON signal low for a minimum of 3 seconds will turn G30 off. This will initiate a normal power-off process, which includes disabling of all applications interfaces (UART, SIM card, audio, etc.) and closing the network connection. The following figure illustrates the power-off timings when using the PWR_ON signal.

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Figure 3-5: PWR_ON Power Off Timing

3.4.6. Power Loss shut down

A low power shut down occurs when G30 senses the external power supply is below the minimal operating limit. The module will respond by powering down automatically without notice. This form of power-down is not recommended for regular use since the unexpected power loss may result in loss of data.

3.4.7. Turning the G30 Off Using AT+MRST

The AT+MRST command initiates a G30 system reset operation, which powers off the G30. This command emulates the PWR_ON signal operation for power off.

3.5. Low Power Mode

The G30 incorporates an optional low power mode, called Sleep Mode, in which it operates in minimum functionality, and therefore draws significantly less current. During low power mode the G30 network connection is not lost. G30 continues to monitor the GSM network constantly for any incoming calls or data. During low power mode, all of the G30 interface signals are inactive and are kept in their previous state, prior to activating low power mode. To save power, all the G30 internal clocks and circuits are shut down, and therefore serial communications is limited.

3.5.1. Activating Low Power Mode

By default, the G30 powers on in Idle mode. In this mode the G30 interfaces and features are functional and the module is fully active. Low power mode is activated by the ATS24 command. The value set by this command determines the inactive state duration required by G30, in seconds, after which G30 will enter sleep mode.

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For example:

ATS24 = 1 activates low power mode after 1 second of inactivity.

ATS24 = 5 activates low power mode after 5 seconds of inactivity.

ATS24 = 0 disables low power mode (default).

The following figure illustrates the ATS24 command operation.

Figure 3-6: ATS24 Operation

IMPORTANT:

G30 will not enter low power mode in any case when there is data present on the serial interface or incoming from the GSM network or an internal system task is running. Only when processing of any external or internal system task has completed, and G30 is inactive for the duration of ATS24, it will enter low power mode.

3.5.2. Serial Interface During Low Power Mode

During low power mode the G30 serial interfaces are disabled. This is indicated by the CTS signal high state. The G30 wakes up periodically from low power mode to page the GSM network for any incoming calls or data. After this short paging is completed, G30 returns to low power mode. During this short awake period, the serial interfaces are enabled and communications with the module is possible. The CTS signal is alternately enabled and disabled synchronously with the network paging cycle. CTS is enabled whenever G30 awakes to page the network. This indicates the G30 serial interfaces are active (see the following figure).

Figure 3-7: CTS Signal During Sleep Mode

The periodical enabling and disabling of the CTS signal during low power mode can be controlled by the AT+MSCTS command. Setting AT+MSCTS=1 permanently disables the serial interface during low power mode, even during a network page by G30. The CTS signal is disabled, and therefore the serial interfaces are blocked.

3.5.3. Terminating Low Power Mode

Terminating the low power mode, or wake-up, is defined as the transition of the G30 operating state from Sleep mode to Idle mode. There are several ways to wake-up G30 from low power mode as described below.

IMPORTANT:

During power saving mode the G30 internal clocks and circuits are disabled, in order to minimize power consumption. When terminating the power saving mode, and switching to Idle mode, G30 requires a minimal delay time to reactivate and stabilize its internal circuits before it can respond to application data. This delay is typically of 15 milliseconds, and is also indicated by the CTS signal inactive (high) state. The delay guarantees that data on the serial interface is not lost or misinterpreted.

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3.5.3.1. Temporary Termination of Low Power Mode

Temporary termination of low power mode occurs when G30 switches from Sleep mode to Idle mode for a defined period, and then returns automatically to Sleep mode. Low power mode may be terminated temporarily by several sources, some of which are user initiated and others are initiated by the system.

3.5.3.2. Using the WKUPI signal

The WKUPI signal is an active low input that is set high by default. By asserting this signal low the application can wake-up G30 from low power mode and switch to Idle mode. G30 will remain in Idle mode, awake and fully active, as long as WKUPI signal remains low. When this signal is disabled and set high again, G30 will return to Sleep mode automatically, according to the ATS24 settings (see the following figure).

Figure 3-8: WKUPI Signal Operation

The WKUPI signal is the recommended method to temporarily wake-up G30 from low power

mode. It provides the application full control of the G30 operating mode and guarantees that data on the serial interface will not be lost or misinterpreted. The WKUPI signal must be used to wake up G30 from low power mode if the serial interface has been disabled by the AT+MSCTS command.

3.5.3.3. Incoming Network Data

During low power mode, G30 continues monitoring the GSM network for any incoming data, message or voice calls. When G30 receives an indication from the network that an incoming voice call, message or data is available, it automatically wakes up from low power mode to alert the application. When G30 has completed to process all the tasks related to the incoming data, it will automatically return to low power mode according to the ATS24 settings. Depending on the type of network indication and the application settings, G30 may operate in several methods, which are configurable by AT commands, to alert the application of the incoming data:

• Enable the WKUPO signal to wake-up the application from low power.

• Send data to the application over the serial interface.

• Enable the serial interface's Ring Indicator (RI) signal.

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3.5.3.4. Data on the Serial interface

While G30 is temporarily awake in Idle mode, data may be transmitted on the serial interface. In case data is being transmitted in any direction, G30 will not return to low power mode. This is regardless of the original wake-up reason or source. G30 will remain awake while data is transferred. Only when the serial interface transfer is completed and the data has been processed, G30 will return to low power mode automatically, according to the ATS24 settings (seethe following figure).

Figure 3-9: Serial Interface Data

3.5.3.5. Permanent termination of Low Power Mode

The G30 low power mode is enabled and disabled by the ATS24 command. To permanently terminate the G30 low power mode, the ATS24 = 0 command must be used. Setting ATS24 = 0 disables the currently active low power mode and switches G30 to Idle mode. G30 will not return to low power mode until an ATS24 > 0 commands is set again. This command can be sent only when the serial interface is active.

In case the serial interface is disabled, it must first be activated before sending this command. To reactivate the serial interface, a temporary termination of the low power mode is required, as described in Temporary Termination of Low Power Mode. Following the temporary low power mode termination, the serial interface will activate and the ATS24 = 0 command can be received by G30.

3.6. Real Time Clock

G30 incorporates a Real Time Clock (RTC) mechanism that performs many internal functions, one of which is keeping time. The RTC subsystem is embedded in the PMU and operates in all of the G30 operating modes (Off, RTC, Idle, Sleep), as long as power is supplied above the minimum operating level. The G30 time and date can be set using the following methods:

• Automatically retrieved from the GSM network.

In case G30 is operated in a GSM network that supports automatic time zone updating, it will update the RTC with the local time and date upon connection to the network. The RTC will continue to keep the time from that point.

• Using the AT+CCLK command.

Setting the time and date manually by this AT commands overrides the automatic network update. Once the time and date are manually updated, the RTC timer will keep the time and date

synchronized regardless of the G30 operating state. When the power supply is disconnected from G30 and no voltage is supplied to the VRTC pin, the RTC timer will reset and the current time and date will be lost. On the next G30 power-up the time and date will need to be set again automatically or manually.

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NOTE:

A 47uF capacitor should be connected between ground and VRTC signal (pin 62 of the 81pin LGA interface/pin 60 of the 70-pin connector).

3.7. Serial Interfaces

G30 includes three completely independent serial communications interfaces, which may be used by the application for several purposes.

3.7.1. UART

The G30 UART is a standard 8-signal bus. The primary UART is used for all the communications with G30 - AT commands interface, GPRS data and CSD data, programming and software upgrades. The UART signals are active low CMOS level signals. For standard RS232 communications with a PC, an external transceiver is required. G30 is defined as a DCE device, and the user application is defined as the DTE device. These definitions apply for the UART signals naming conventions, and the direction of data flow, as described in the following figure.

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Figure 3-10: UART Interface Signals

The G30 UART supports baud rates 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, and 230400 bps. Auto baud rate detection is supported for baud rates up to 230400 bps. All flow control handshakes are supported: hardware, software, or none. Parity bit and Stop bit definitions are also supported. The UART default port configuration is 8 data bits, 1 stop bit and no parity, with hardware flow control and auto baud rate detect enabled.

IMPORTANT:

The G30 UART will not send data over the serial interface in case the DTR and/or RTS input signals are disabled (set high). Therefore, regardless of the handshake method, it is still required to enable these signals for proper operation, by asserting them low.

When G30 receives a call, the RI signal (Ring Indication), initiates pulse indication to the host. The RI behavior is shown in the following figure.

Figure 3-11: RI Behaviour When Receiving A Call

(81 pin LGA

SPI_IRQ

SPI Interrupt Input

Generic digital interfaces

I/O

Capture/Compare

I/O

GPIO

SPI_MOSI

Generic digital interfaces

3.7.2. Serial Peripheral Interface (SPI)

The G30 provides a synchronous SPI-compatible serial interface, used for data logging only, implemented with the synchronous serial controller hardware block of the G30. The SPI is a master-slave protocol: the module runs as a SPI master device. The SPI interface includes basically the following signals to transmit and receive data and to synchronize them:

• MOSI (master output, slave input) signal which is an output for the module while it runs

as SPI master;

• MISO (master input, slave output) signal which is an input for the module while it runs as

SPI master;

• Clock signal which is an output for the module while it runs as SPI master;

• Optional chip select signal which is an output for the module while it runs as SPI master;

• Input Interrupt request SPI_IRQ.

NOTE

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The SPI interface is internally connected to the I2S digital audio interface, and is controlled by means of software settings. Hence SPI interface is available only if the I

S digital audio

interface is disabled.

The SPI interface can be used as a data event logger by connecting SPI signals to an external SPI-UART dedicated interface, and enabling the data logging interface by SW.

NOTE:

In case that the M2M zone platform is being used, the SPI interface can be configured as GPIOs, disabling the I

S digital audio and SPI interface.

The board to board pins related to SPI interface description are given in the following table:

Pin #

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

voltage domain. Output driver class C. PU/PD class B. Value at reset: T/PD.

SPI sync data (MOSI) Short to pin 5

voltage domain. Output driver class D. PU/PD class B. Value at reset: T.

(81 pin LGA

SPI_CS

Generic digital interfaces

SPI_CLK

Generic digital interfaces

SPI_MISO

Generic digital interfaces

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Pin #

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

voltage domain. Output driver class D.

PU/PD class B. SPI chip select Short to pin 58

SPI Clock Short to Pin 57

Value at reset: T.

voltage domain.

Output driver class D.

PU/PD class B.

Value at reset: T.

3.7.3. Flashing and Data Logging

voltage domain.

Output driver class D.

PU/PD class B. SPI sync data (MISO) Short to pin 55

Value at reset: T.

Table 3-5: SPI Interface Connections

In the event of logging or reflashing the module SW, the host must provide access to several I/O lines especially when using the 81 pin LGA interface version. The G30 SPI interface is used for data logging, and therefore, it is recommended that the host application will have the ability to support it. In addition, in order to support G30 SW upgrade, the host application must have access to the G30 UART signals (TXD, RXD only). In order to support both data logging, and SW upgrade, it is recommended to use a single

(81 pin LGA

68-77

1-4

GND 1 78-79

5-8

VCC

SPI_IRQ

RESET_IN

SPI_CLK 2 60

SPI_MOSI

SPI_MISO

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header connector that will contain all required signals with additional SPI indication, VCC and GND signals.

NOTE:

When a header can’t be implemented due to engineering constrains (lack of place), the host application should support sufficient soldering pads or test points for wire-up.

It is recommended to implement the above in accordance with the following table:

Application Header

Connector Pin out

Pin #

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

SPI_CS

TXD 5 44

RXD

SPI connection

Flashing

indication**

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indication*

connection

Table 3-6: Data Logging and SW Upgrading Application Connector

NOTE:

* SPI connection indication - Input pin for the host, indicate that SPI logger device is attached and the SPI pins are routed to external logger pins. The host must verify that all pins for SPI and PCM should be TRI state from the host application when pin 11 is ‘L’ state. The host will implement an external 100K pull up resistor on pin 11.

** Flashing connection indication - Input pin for the host, indicate that flashing device is attached and the UART RXD/TXD pins are now connected to external device for reflashing. The host must verify that the UART RXD/TXD pins are left open from the host application when pin 12 is ‘L’ state. The host will implement an external 100K pull up resistor on pin 12.

Recommended application connector: SAMTEC TSM-106-02-S-DV-LC 12 pin.

3.7.4. I2C Bus Interface

The module provides an I2C bus interface which includes a serial data line and a clock line on the board to board pins. The G30 I the user only with M2M Zone Platform.

The I

C signals are pulled-up, using internal 4.7 kOhm resistors.

NOTE:

Do not connect any pull-up resistors when using signals as I2C interface.

The I2C Bus interface can only be activated by M2M Zone Platform. Otherwise, the I2C signals are configured as GPIOs.

The board to board pins related to I2C bus interface description is given in the following table:

C acts as master only. The I2C bus interface is available to

(81 pin LGA

GPIO4/SCL

I2C bus clock line

I2C interface voltage

I/O

GPIO

GPIO3/SDA

I/O

I2C bus data line

I2C interface voltage

I/O

GPIO

VSIM

2.85V/1.8V Supply to the SIM

SIM_RST

Active low External SIM reset

SIM_IO

Serial input and output data

SIM_CLK

Serial 3.25 MHz clock

SIM_PD_n

Active low SIM card presence

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Pin #

interface)

Pin #

(70 pin

connector

interface)

Table 3-7: I2C Interface Connections

3.8. SIM Interface

The G30 incorporates a SIM interface, which conforms to the GSM 11.11 and GSM 11.12 standards, that are based on the ISO/IEC 7816 standard. These standards define the electrical, signaling and protocol specifications of a GSM SIM card. Both 1.8 V and 3 V SIM types are supported; activation and deactivation with automatic voltage switch from 1.8 V to 3 V is implemented. G30 is designed to support two SIM card options with the same SIM signals: External SIM card, or an on board Embedded SIM (eSIM), depending on the G30 model. The following table details the SIM interface signals.

G30

Signal Name

G30

I/O

Function Remarks

domain. PU drain. Value at reset: T/OD.

Pin #

(81 pin LGA

interface)

Pin #

(70 pin

connector

interface)

Signal Name Description

signal

detection

eSIM_RESET

Active low Embedded SIM reset

Table 3-8: SIM Interface Signals

3.8.1. External SIM Card

G30 does not incorporate an on-board SIM card tray for SIM placement. The external SIM must be located on the user application board, external to the G30. The G30 SIM interface includes all the necessary signals, which are routed to the interface connector, for a direct and complete connection to an external SIM. G30 supports dynamic detection of the SIM card, through a dedicated SIM detection signal. G30 will detect a SIM card insertion or removal upon power up or during operation by the transitions on the SIM_PD_N signal.

3.8.1.1. External SIM Connection

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signal

The following figure illustrates a typical external SIM interface connection to G30. This connection type is implemented on the G30 Developer Board, using an FCI SIM tray.

Figure 3-12: G30 External SIM Interface

3.8.1.2. External SIM Design Guidelines

The SIM interface and signals design is extremely important for proper operation of G30 and the SIM card. There are several design guidelines that must be followed to achieve a robust and stable design that meets the required standards and regulations.

• Using the SIM detection signal, SIM_PD_N, is mandatory in case the SIM card is

accessible to the user and may be removed during G30 operation. To avoid any damage to the SIM or G30, the SIM interface signals must be deactivated before the SIM card contacts are mechanically removed from the SIM tray contacts. Therefore, the SIM_PD_N detection signal must be disabled before the SIM is removed from its tray.

• The SIM should be located, and its signals should be routed, away from any possible EMI

sources, such as the RF antenna and digital switching signals.

• The SIM interface signals length should not exceed 100 mm between the G30 interface

connector and the SIM tray. This is to meet with EMC regulations and improve signal integrity.

• To avoid crosstalk between the SIM clock and data signals (SIM_CLK and SIM_DIO), it

is recommended to rout them separately on the application board, and preferably isolated by a surrounding ground plane.

• The SIM card signals should be protected from ESD using very low capacitance

protective elements (zener diodes, etc.).

• The G30 interface does not support SIM programming through the VPP signal. This

signal should not be connected to G30.

3.8.2. Embedded SIM

The G30 incorporates an Embedded SIM (depending on G30 model). Embedded SIM (e.g. eSIM or chip SIM), is a secured micro controller IC, with the same pinout interface, and the same operation as an external SIM card. The eSIM main advantage is it robustness, making it an ideal solution for the M2M, and automotive application. Since an eSIM is actually an IC soldered on the G30, it can withstand wider temperature range than a regular external SIM card that is usually made of plastic, and gets twisted and bowed at high temperature, causing disconnection inside the SIM tray. For the same reason, the eSIM is more durable to vibration then a regular external SIM card. Hard vibration on an application with a SIM card socket may result in with an intermitted connection between the SIM card socket and the SIM card.

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NOTE:

When Embedded SIM is used, it is recommended to connect the SIM_PD_n signal to ground. However, in case the SIM detection is disabled by SW (+MSMPD command), this signal can be left disconnected.

3.8.3. eSIM Connection

The following figure illustrates a typical eSIM interface connection to G30.

Figure 3-13: G30 eSIM Interface

NOTE:

When Embedded SIM is used, SIM_RST signal must be connected to eSIM_RESET signal via an optional 0 ohm resistor.

3.9. Audio Interface

The G30 audio interface supports several audio devices and operating modes. The audio interface's operating modes, active devices, amplification levels and speech processing algorithms are fully controlled by the host application, through advanced programming options and a versatile AT commands set. The G30 supports the following audio devices:

• Two single-ended and biased mono analog microphone inputs for use in a variety of

modes.

• A single differential mono analog speaker output for use in a variety of modes.

• A digital serial interface using I

• A single-ended mono analog speaker output for use in a variety of modes.

The following figure shows the audio interface topology:

S coding.

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Figure 3-14: Audio Interface Topology

3.9.1. Handset Microphone Port

The handset microphone port is the G30 power-up default active audio input for voice calls. It is located on pin 51 at the G30 81 pin LGA interface, named MIC. It is designed as a single-ended input and should be referenced to the G30 analog ground. The microphone input includes all the necessary circuitry to support a direct connection to an external microphone device. It incorporates an internal bias voltage of 2.0V through a 3kΩ resistor, and has an impedance of 1kΩ. The following figure shows the microphone circuit and the following table gives the microphone specifications.

Parameter

Conditions

Min

Typ

Max

Unit

Input Voltage

No load

2.0

VPP

Gain

Programmable in

0 45

AC Input

1 kΩ

Bias voltage

= 3.0 kΩ

1.8

2.0

2.2

Bias Current

1 mA

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Figure 3-15: Handset Microphone Circuit

IMPORTANT:

The microphone circuit design depends on the type of microphone device. A series capacitor is required in case a passive microphone is used, or the application provides a separate bias voltage to an active microphone circuit.The internal G30 biasing circuit may also be used with an active microphone, which corresponds to the microphone port specifications.

AT+MMICG=0

3 dB steps

Impedance

BIAS

= 1 mA

BIAS

Table 3-9: Handset Microphone Port Specifications

3.9.2. Headset Microphone Port

The headset microphone port is designed for use with, but not limited to, a headset audio device. It is located at pin 53 on the G30 81 pin LGA interface, named MIC_HDST.

Parameter

Conditions

Min

Typ

Max

Unit

Input Voltage

No load

2.0

VPP

Gain

Programmable in

0 45

AC Input

1 kΩ

Bias voltage

= 3.0 kΩ

1.8

2.0

2.2

Bias Current

1 mA

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It is designed as a single-ended input and should be referenced to the G30 analog ground. The microphone input includes all the necessary circuitry to support a direct connection to a headset microphone device. It incorporates an internal bias voltage of 2.0V through a 3.0kΩ resistor, and has an impedance of 1kΩ. The following figure shows the microphone circuit and the next table gives the microphone specifications.

Figure 3-16: Headset Microphone Circuit

IMPORTANT:

The headset microphone circuit design depends on the type of microphone device. A series capacitor is required in case a passive microphone is used, or the application provides a separate bias voltage to an active microphone circuit. The internal G30 biasing circuit may also be used with an active microphone, which corresponds to the headset microphone port specifications.

AT+MMICG=0

1 dB steps

Impedance

BIAS

= 1 mA

BIAS

Table 3-10: Headset Microphone Port Specifications

3.9.3. Differential Speaker (Handset) Port

The analog differential speaker port is the G30 power-up default active output for voice calls and DTMF tones. It is located at pins 48 and 49 on the G30 81 pin LGA interface, named SPKR_N and SPKR_P respectively. It is designed as a differential output with 8Ω impedance, but may also be used as a singleended output referenced to the G30 analog ground. The differential speaker output is used for the handset audio path. The following figures show a differential speaker circuit and a single-ended speaker circuit and the next table gives the speaker specifications.

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Figure 3-17: Differential Speaker Circuit

IMPORTANT:

For safety regulations it is important to place series resistors on the speaker output lines, as illustrated in the following figure. The resistors value should be R = 0Ω at the design stage, but may be changed to a different value during audio safety testing, in case speaker level limitation is required.

Figure 3-18: Single-ended Speaker Circuit

IMPORTANT:

When implementing a single ended speaker design, it is required to place a series capacitor and resistor on the speaker output line, as illustrated in The capacitor should be of low tolerance with values of C = 10-22 uF.

figure 3-17.

Parameter

Conditions

Min

Typ

Max

Unit

Output

No load

2.7

VPP

Gain

Programmable in

-15 +9

AC Output

8 Ω DC Voltage

VCC/2

THD

8 Ω load

% Isolation

Speech, f> 4 kHz

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The resistor value depends on the speaker application:

- For a handset device, the resistor value should be R = 0

Ω at the design stage, but may be

changed to a different value during audio safety testing, in case speaker level limitation is required.

- For a headset device, safety regulations require the resistors value to be R > is the speaker impedance (e.g. 32 For example, when using a 32

Ω).

Ω speaker the series resistance would be R > 64Ω.

Ω, where R

Voltage

Impedance

Single ended

3 dB steps

300 Hz - 4 kHz

Table 3-11: Speaker Port Specifications

3.9.4. Mono Speaker (Headset) Port

The mono speaker port can be used for voice calls and DTMF tones. It is located at pin 47 on the G30 81 pin LGA interface, named HDST_SPK. It is designed as a single-ended output with 32Ω impedance, referenced to the G30 analog ground. The following figure shows the headset speaker circuit and the next table gives the headset speaker specifications.

Figure 3-19: Mono Speaker (Headset) Circuit

Parameter

Conditions

Min

Typ

Max

Unit

Output

No load

2.05

VPP

Gain

Programmable in

-18 0

AC Output

32 Ω DC Voltage

1.8 V

THD

32 Ω load

% Isolation

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IMPORTANT:

When implementing a single ended loudspeaker design, it is required to place a series capacitor and resistor on the alert output line, as illustrated in figure 3-18. The capacitor should be of low tolerance with values of C = 10-22 uF. The resistor value should be R = 0Ω at the design stage, but may be changed to a different value during audio safety testing, in case that alert level limitation is required.

Voltage

Impedance

Single ended

3 dB steps

300 Hz - 4 kHz

Table 3-12: Mono Speaker Port Specifications

3.9.5. Headset Detection

The G30 operates by default in the basic audio mode with the differential speaker (handset) audio path, for DTMF tones, speech, rings, and alert tones active. The headset (mono speaker) path is an alternate audio path in basic mode. It is designed for, but not limited to, a personal hands-free audio device, a headset, using the headset microphone input device and the headset speaker output device. When this path is selected, the differential speaker is disabled, and all the audio sounds are passed through to the headset path. The HDST_INT signal is used to switch between handset and headset audio paths in basic audio mode. This signal is set high by default at power up. Asserting the HDST_INT signal low enables the headset audio path and disables the handset path. Setting this signal high will disable the headset path and enable the handset path. The G30 supports dynamic switching between the handset and headset audio paths, during operation and call handling.

IMPORTANT:

The HDST_INT signal does not operate in advanced audio mode. This signal's functionality is overridden by the AT+MAPATH command settings.

Audio Mode

Sampling

Bit Clock

PCM

8 kHz

144 kHz

I2S

8 kHz

512 kHz

3.9.6. Digital Audio Interface

The G30 digital audio interface is a serial Pulse Code Modulation (PCM) bus, which uses linear 2's compliment coding. G30 is the PCM bus master, supplying the clock and sync signals to the application. The G30 digital interface is a 4 signal PCM bus, which includes a bit clock output signal for the bus timing, a frame sync output signal for audio sampling timing, and serial data input and output signals.

IMPORTANT:

The PCM bus signals are shared internally by the analog audio interface and the digital audio interface. Therefore, when using the analog audio interface the PCM bus signals must be tristated or disconnected at the interface connector.

The digital audio interface supports 2 types of audio data formats, which define the PCM bus configuration and data rates:

• Normal I

• PCM mode.

The PCM bus configuration is defined by the audio data format that is sounded through the digital audio path, as described in the following table.

S mode.

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Table 3-13: Digital Audio Modes

NOTE:

Switching between Audio Modes is done using AT+MAI2SY command. For detailed information, refer to G30 AT Commands Reference Manual.

3.9.7. Voiceband Audio

This digital voice audio format is used for speech during voice calls and for mono rings and alerts.

The I

S bus signal's configuration for voiceband audio is:

• I

S_CLK - 512 kHz serial clock

• I

S_FS - 8 kHz bit-wide frame-sync

• I

S_DOUT - 16-bit linear audio data output

S_DIN - 16-bit linear audio data input

• I

The bnext figure illustrates the I

Frame Sync

S bus format.

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Figure 3-20: I2S BUS Format

The PCM bus signal's configuration for voiceband audio is:

• PCM_CLK - 144 kHz serial clock

• PCM_FS - 8 kHz bit-wide frame-sync

• PCM_DOUT - 16-bit linear audio data output

• PCM_DIN - 16-bit linear audio data input

The 16-bit serial data is transferred in both directions after each sync signal's falling edge. The sync signal pulse duration is two clock periods, after which the serial data is transferred in both directions for 16 consecutive clock periods. Following the 16-bit data transfer, the serial input and output data signals inactivate until the next sync pulse, which occurs every 125 µS (8 kHz). It is recommended the serial data signals will be High-Z during the inactive period. The next figure illustrates the PCM bus format of the voiceband audio configuration.

Figure 3-21: Voiceband Mode PCM Bus Coding Format

3.9.8. Operating Modes

The G30 audio interface includes 2 modes of operation. Each operating mode defines the audio input and output devices to be used for each audio sound type and their programmable settings.

3.9.8.1. Basic Mode

Basic audio mode is the G30 default power-up audio configuration. Several audio paths are

Audio Path

Input Signal

Output Signal

Description

Handset

MIC

SPKR_N, SPKR_P

Default audio path for speech and

Headset

HDST_INT

HDST_SPK

Alternate path for headset device. Digital

PCM_DIN

PCM_DOUT

Enable digital path by

Command

Description

AT+MAPATH

Sets the input device for voice, and the

AT+MAFEAT

Enables and disables the speech processing AT+MAVOL

Sets the gain (amplification) level of the

AT+MMICG

Sets the gain (amplification) level of the AT+MMICV

Sets the MIC bias voltage.

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available in this mode, and their settings can be programmed through the AT command set. The following table describes the available audio paths in Basic mode.

DTMF tones and ring.

Enable by setting HDST_INT interface signal low.

AT+MADIGITAL=1

Table 3-14: Basic Mode Audio Paths

3.9.8.2. Advanced Mode

Advanced audio mode utilizes G30's unique set of AT commands for advanced audio programming. The expanded AT command set enables to define a specific audio path and setting, which are not part of the default configuration, for each type of audio sound (speech, DTMF tones, rings and alerts). Unlike basic audio mode, which provides predefined audio paths, the advanced audio mode provides full control over the G30 audio interface and its parameters, and differentiates between each type of audio sound. The following table describes the advanced mode audio programming features. These features are only a part of the complete advanced audio AT command set.

output devices for voice, DTMF tones, rings and alerts.

algorithms - Echo suppression, noise suppression and sidetone.

selected analog output device.

selected analog input device.

AT+MADIGITAL

Switches between analog and digital audio

paths.

Table 3-15: Advanced Mode Commands

3.9.9. Audio Programming Interface

The G30 incorporates a unique audio programming interface, through AT commands, which controls the following audio features:

• Audio Path - Defines the input and output devices for speech, DTMF tones, rings and

alerts.

• Audio Gain - Defines the amplification (gain) level for input and output audio devices.

• Audio Algorithm - Defines the speech processing features for voice calls.

The next figure describes the audio programming interface options, which are defined by AT commands.

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3.9.9.1. Audio Algorithms

The G30 audio interface features advanced speech processing algorithms for echo

suppression, noise suppression and side-tone feedback. Enabling or disabling the algorithms can be configured separately for each audio path and operating mode through the AT command interface.

Figure 3-22: Audio Programming Interface

Feature

AT Command

Setting

Description

Basic

Advanced

Echo Suppression

Controls the echo and noise

Noise Suppression

Sidetone

ATS94

AT+MAFEAT

Enabled

Controls the sidetone.

Device

Gain Command

Gain

Description

Basic

Advanced

Microphone

Sets input speech gain level.

Headset

Sets input speech gain level. Mono Speaker

AT+CLVL

Sets voice and DTMF gain.

Differential Speaker

AT+CRSL

Sets rings and alerts gain.

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The G30 also supports full rate (FR), half rate (HR), enhanced full rate (EFR) and adaptive multi-rate (AMR) speech coding algorithms, which are used by the GSM network. These algorithms are configured and operated by the GSM network provider. The next table gives the speech processing features.

Default

Table 3-16: Speech Processing Features

3.9.9.2. Gain Control

The amplification (gain) level for each input and output device can be configured through AT commands. Both basic and advanced audio modes provide AT commands to set the desired gain levels for each audio path and audio sound type. The following table gives the gain control features.

ATS96 AT+MAFEAT Disabled

AT+MMICG AT+MMICG

suppression.

Default

3.9.10. Audio Design

Microphone

AT+MAVOL

Table 3-17: Gain Control Features

The audio quality delivered by G30 is highly affected by the application audio design, particularly when using the analog audio interface. Therefore, special care must be taken

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when designing the G30 audio interface. Improper design and implementation of the audio interface will result in poor audio quality. Poor audio quality is a result of electrical interferences, or noises, from circuits surrounding the audio interface. There are several possible sources for the audio noise:

• Transients and losses on the power supply

• EMI from antenna radiations

• Digital logic switching noise

Most of the audio noise originates from the GSM transmit burst current surges (217 Hz TDMA buzz), which appear on the main power supply lines and antenna, but also indirectly penetrate the internal application's supplies and signals. The noises are transferred into the G30's audio circuits through the microphone input signals and then are amplified by the G30's internal audio amplifiers. To minimize the audio noise and improve the audio performance the microphone and speaker signals must be designed with sufficient protection from surrounding noises. The following guidelines should be followed to achieve best audio performance:

• Reference the microphone input circuits to the G30 AGND interface signal.

• If using single-ended audio outputs, they should be referenced to the G30 AGND

interface signal.

• Keep the audio circuits away from the antenna.

• Use RF filtering capacitors on the audio signals, as described in table 3-4.

• The audio signals should not be routed adjacent to digital signals.

• Isolate the audio signals by a surrounding ground plane or shields.

• Filter internal supplies and signals that may indirectly affect the audio circuits, from

noises and voltage drops.

3.9.10.1. Analog Ground

The G30 interface incorporates a dedicated analog ground contacts, AGND pads 52, 54 (of the 81 pin LGA interface), which are internally connected to the G30's ground. The AGND signal is intended to provide a separate ground connection for the application's external audio devices and circuits. This signal provides an isolated ground connection directly from G30, which is separated from the noisy digital ground of the application. It is recommended to connect this signal to analog audio devices and circuits used by the application. Using a separate analog ground minimizes audio noises and improves the audio circuit's immunity from external interferences.

3.10. A/D Interface

The G30 includes 3 Analog to Digital Converter (ADC) signals with 12-bit resolution, for environmental and electrical measurements. The ADC signals measure an analog DC voltage level on their inputs which is converted to a 12-bit digital value for further processing by G30 or the user application. The A/D signals operation and reporting mechanism is defined by the AT+MADCM command. Each A/D can be defined to provide several reports:

• A single measurement.

A single A/D measurement will take place and will be reported upon activation of the AT command.

Parameter

Conditions

Min

Typ

Max

Unit

Measurement

3.0 5.18

V Resolution

10 mV

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• An automatic periodical measurement.

The A/D measures its input signal at a rate that is defined by the user application. Every measurement will generate an unsolicited message over the serial interface.

• An automatic periodical measurement with predefined limits.

The A/D measures its input signal at a rate that is defined by the user. The user also defines upper and/or lower limits for the A/D measurements. Each measurement is compared to these limits, and an unsolicited message is generated only if these limits are exceeded.

IMPORTANT:

In case the defined periodical measurement rate is equal to, or shorter than, the defined sleep mode delay settings (ATS24), G30 will not enter low power mode.

Applying voltage to ADC lines before power up is forbidden and may cause G30 power up issues.

If some ADC signals are not used, a 47 kOhm pull-down resistor to GND must be connected for each of the unused ADC lines.

3.10.1. Power Supply A/D

The main power supply (VCC) is constantly monitored internally by the G30 through a dedicated A/D signal, which is not accessible on the interface connector. The measured VCC level can be read and monitored by the user application through the AT+MADCM command, which returns the measured VCC level in Volts times 1000. For example, a measured supply level of 3.65 Volts will be presented as 3650 by the MADCM command.

IMPORTANT:

During GSM transmissions the power supply may suffer voltage drops. This can cause frequent and wide changes in the power supply A/D measurements. This should be taken into account when designing and operating the G30 power supply A/D interface.

The following table gives the supply A/D specifications.

Range

Table 3-18: Supply A/D Specifications

3.10.2. General Purpose A/D

The G30 provides 2 general purpose A/D (GPAD) signals for customer application use. Each

ADC1

Analog-to-Digital

Resolution: 12 bits

ADC2

Analog-to-Digital

Resolution: 12 bits

RESET_IN

External reset input

External reset signal

VREF

Reference voltage supply

Max current source

VRTC

I/O

Real Time Clock Supply

VRTC = 2.0 V (typical)

WKUPO

I/O

GPIO (M2M Zone only)

Generic digital interfaces

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A/D signal can monitor a separate external voltage and report its measured level independently to the application, through the AT command interface. The GPAD signals measure a DC voltage level of 0 - 1.92 V, which is converted internally to a 12-bit digital value. The user application can monitor the A/D voltage level through the AT+MADCM command, which returns the measured DC level in Volts times 100. For example, a measured analog DC level of 1.75 Volts will be presented as 175 by the MADCM command. The following table gives the GPAD specifications.

Pin #

(81 pin

LGA

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

Converter Input

Table 3-19: GPAD Specifications

3.11. Controls and Indicators Interface

The G30 incorporates several interface signals for controlling and monitoring the module's operation. The following paragraphs describes these signals and their operation. The following table gives a description of the controls and indicators signals.

Pin #

(81 pin

LGA

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

Voltage span: 0V-1.92V

Voltage span: 0V-1.92V.

(Typ. 2.85V)

Output/Input

voltage domain.

30mA.

2mA

Connect a 47uF capacitor

to ground.

Wake-Up Out

voltage domain.

PU/PD class B.

WKUPI

I/O

Interrupt

Generic digital interfaces

Wake-Up In

ANT_DET

I/O

GPIO (M2M Zone only)

Generic digital interfaces

Antenna Detect

GPRS

I/O

GPIO (M2M Zone only)

Generic digital interfaces

GPRS

GPIO1

I/O

GPIO

Generic digital interfaces

GPIO2

I/O

GPIO

Generic digital interfaces

GPIO3/SDA

I/O

I2C bus data line (M2M

I2C interface

I/O

GPIO

GPIO4/SCL

I2C bus clock line (M2M I/O

GPIO

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Pin #

(81 pin

LGA

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

Output driver class F.

voltage domain.

Output driver class C.

PU/PD class B.

voltage domain.

Output driver class F.

PU/PD class B.

voltage domain.

Output driver class F.

PU/PD class B.

Zone only)

voltage domain.

Output driver class F.

PU/PD class B.

Value at reset: T.

voltage domain.

Output driver class F.

PU/PD class B.

voltage domain.

PU drain.

I2C interface

voltage domain.

PU drain.

Value at reset: T/OD.

GPIO5

I/O

GPIO

Generic digital interfaces

GPIO6

I/O

GPIO

Generic digital interfaces

GPIO7

I/O

GPIO

Generic digital interfaces

GPIO8

I/O

GPIO

Generic digital interfaces

GPIO9

I/O

GPIO

Generic digital interfaces

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Pin #

(81 pin

LGA

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

voltage domain.

Output driver class F.

PU/PD class B.

voltage domain.

Output driver class F.

PU/PD class B.

voltage domain.

Output driver class F.

PU/PD class B.

voltage domain.

Output driver class F.

PU/PD class B.

Table 3-20: Controls and indicators

3.11.1. Reset

To reset the module, RESET_IN must be used (see Table 3-21). This pin performs an external reset, also called hardware reset. Driving the RESET_IN pin low causes an asynchronous reset of the entire device except for the Real Time Clock block (RTC). The device then enters its power-on reset sequence.

NOTE:

As an external reset input, it is recommended that RESET_IN signal will be connected via a push button, or an open-drain transistor, or an open-collector transistor. In this way, when RESET_IN signal is not used, It will be at High-Z state. In any case, it is forbidden to connect this signal directly to any input voltage level.

3.11.2. VREF Reference Regulator

The G30 incorporates a regulated voltage output, VREF. The regulator provides a 2.85V output for use by the customer application. This regulator can source up to 30 mA of current to power any external digital circuits.

voltage domain.

Output driver class F.

PU/PD class B.

Parameter

Conditions

Min

Typ

Max

Unit

= 30 mA

-3%

2.8

+3%

Load

7 mV

Line

mV PSRR

50 Hz - 20 kHz

35 dB

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IMPORTANT: The VREF regulator is powered from the G30's main power supply, and therefore any current sourced through this regulator originates from the G30 VCC supply. The overall VCC current consumed by G30 is directly affected by the VREF operation. The G30 current consumption rises with respect to the current sourced through VREF.

The following table gives the VREF specifications.

3.11.3. VRTC

The G30 incorporates a real time block and is operated by the VRTC power located on pin 62 of the 81-pin LGA interface, or pin 60 of the 70-pin connector interface. For detailed explanation, refer to “Real Time Clock”.

NOTE:

A 47uF capacitor should be connected between ground and VRTC signal (pin 62 of the 81pin LGA interface/pin 60 of the 70-pin connector).

OUT

regulation

OUT

Table 3-21: VREF Specifications

3.11.4. Wakeup Out

Some applications incorporate their own power saving mode, in which they operate with minimal functionality, including disabling of interfaces and serial communications. The wakeup-out (WKUPO) signal is an active low output, which is designed to support a low power mode feature in the host application. This signal is used by G30 to indicate that it requires to communicate with the host application through the serial interface, due to an incoming call or data, or an unsolicited event. Applications that incorporate a low power mode should use this signal as an indication to switch from low power mode to normal operation, and activate the serial interface. The wakeup-out mechanism, using the WKUPO signal, is controlled by 2 AT commands (see figure 3-22):

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• ATS102 - Defines the delay time in milliseconds that G30 will wait, after asserting the

WKUPO signal low, before sending data on the serial interface. This delay is required to allow the application enough time to reactivate from low power mode and switch to normal mode. If ATS102=0, which is the default value, the WKUPO signal and mechanism is disabled. In case the serial interface incorporates hardware flow control signals, the data will be sent according to their state, after the ATS102 delay time has expired.

• ATS100 - Defines the application minimal wakeup duration, in seconds, for a single

wakeup event. This time definition is required to avoid frequent unnecessary wakeup events and consequent ATS102 delays. The application may return to low power mode after the serial interface has been inactive for the duration set by ATS100. This duration is measured from the last data sent or received on the serial interface.

Figure 3-23: WKUPO Operation

The following guidelines apply to the wakeup-out mechanism:

• G30 will set the WKUPO signal low to indicate that in has data to send through the serial

interface.

• G30 will start sending the data to the application after the delay defined by ATS102.

• The WKUPO signal will remain low while data is being sent to the host application.

• The host application should keep its serial interface active, and not switch to low power

mode, while the WKUPO signal is low.

• G30 will set the WKUPO signal high when it has completed sending the data.

• The application serial interface must stay active, and not switch to low power mode, for

the duration set by ATS100, after WKUPO is set high.

• G30 will not set the WKUPO signal low if it needs to send additional data during the

ATS100 delay time.

• The application may switch to low power mode after the WKUPO signal is set high and

the serial interface has been inactive for the duration set by ATS100.

3.11.5. Antenna Detection

The G30 incorporates an internal antenna detection circuit, which senses the physical connection and removal of an antenna or antenna circuit on the G30 antenna connector. The antenna detection state is reported to the application through the ANT_DET output signal, and

ANT

I/O

RF antenna

50Ω nominal impedance.

may also be queried by the ATS97 command. The detection circuit senses DC resistance to ground on the G30 antenna connector. A DC resistance below 100kohm (+10%) is defined as a valid antenna connection, and the ANT_DET output signal is set high.

NOTE:

Antenna detect indicator is valid after 2 second from power-up only.

3.11.6. GPRS Detection

The GPRS output signal indicates the network GPRS connection status. When G30 is connected to a GPRS network, this signal is enabled. When G30 is not connected to the GPRS network this signal is disabled.

3.11.7. General Purpose I/O

The G30 incorporates 9 general purpose IO signals in the 81 pin LGA interface, or 8 general purpose IO signals in the 70 pin connector interface for the user application. Each GPIO signal may be configured and controlled by AT command. These signals may be used to control or set external application circuits, or to receive indications from the external application.

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3.12. Antenna Interface

IMPORTANT:

G30 has two basic hardware models that are differ from one another in the antenna interface. The first uses antenna interface with a U.FL connector, and the second uses RF B2B pads in accordance with the table below. When a U.FL connector module is used, the RF B2B pads are not connected, but the design guidelines must be followed.

The board to board SMD pad 66 (ANT signal) has an impedance of 50Ω and it provides the

RF antenna interface (see table below). The two pads close to the ANT pin (pads 52 and 54) are ground pads and must be used to provide the connection of the RF antenna to the grounding plane.

Pin #

(81 pin

LGA

interface)

Pin #

(70 pin

connector

interface)

G30

Signal Name

G30

I/O

Function Remarks

(Applicable for G30

without U.FL connector

model)

65,67

GND

N/A

RF isolated Ground

Route Ground according

page 80.

ANT

I/O

RF Antenna (U.FL

50Ω nominal impedance.

Parameter

Conditions

Specifications

824 - 849 MHz

869 - 894 MHz

880 - 915 MHz

925 - 960 MHz

1710 - 1785 MHz

1805 - 1880 MHz

1850 - 1910 MHz

1930 - 1990 MHz

Gain For antenna gain refer to Impedance

50Ω

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to “RF

Recommendation” on

connector)

(Applicable for G30 with

U.FL connector model)

CAUTION:

A RF keepout area exists near the RF ANT pad of the LGA interface. Verify this area is left in-routed. Any use may result in permanent damage to the module. Special layout design rules must be followed, refer to “Layout Recommendations”.

If the module is soldered on a customized board, special care must be taken on the layout design for the RF antenna pad which needs to be designed for 50Ω impedance and suitable copper keep out must be implemented below the RF test point. The antenna or antenna application must be installed properly to achieve best performance. The following table gives the antenna interface specifications.

GSM 850

GSM 900

DCS 1800

PCS 1900

“Antenna Installation”

Parameter

Conditions

Specifications

VSWR

Less than: 2.5:1

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Table 3-22: Antenna Interface Specifications

It is the Integrator's responsibility to design the antenna or antenna assembly used with the G30. This will highly affect the RF performance of the G30 (dropped calls, battery consumption etc.). The following guidelines should be followed:

• Make sure that the antenna or antenna assembly matches the Antenna Interface

Specifications.

• Use low loss RF cable and connectors keeping cable runs to a minimum.

Limit Values

Min

Max

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4. Electrical and Environmental Specifications

4.1. Absolute Maximum Ratings

The following table gives the maximum electrical characteristics of the G30 interface signals.

CAUTION:

Exceeding the values may result in permanent damage to the module.

Description Name

Module Supply (AC Max = 0.35 Vpp)

Generic digital interfaces -0.30 V 3.60 V

I2C interface -0.30 V 3.60 V

SIM interface -0.30 V 3.60 V

RESET_IN signal 0.15 V 2.5 V

Audio pins

VCC -0.15 V 4.5 V

ADC pins -0.15 V 3.0 V

Table 4-1: Maximum Ratings

Limit Values

Min

Typ

Max

Limit Values

Min

Typ

Max

4.2. Operating Parameters

4.2.1. Supply/power Pins

Supply Description Name

Module Supply VCC 3.3 V 3.8 V 4.2 V

RTC Supply VRTC 1.86 V 2.0 V 2.14 V

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Table 4-2: Input Characteristics

Supply Description Name

1.75 V 1.80 V 1.85V

SIM Supply VSIM

2.76 V 2.85 V 2.94 V

RTC Supply VRTC 1.86 V 2.00 V 2.14 V

Reference voltage supply VREF 2.76 V 2.85 V 2.94 V

Table 4-3: Output Characteristics

Limit Values

Min

Typ

Max

4.2.2. Digital Pins

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Voltage Domain Parameter

L-level input -0.20 0.55 V

Generic digital interfaces

H-level input 2.05 3.30 V

L-level input -0.30 0.82 V

I2C interface

H-level input 2.05 3.30 V

Hysteresis 0.15 V

Unit Remarks

Voltage Domain = VIO = 2.85 V

In accordance with I2C bus specification.

0.37 V VSIM = 1.80 V

L-level input

0.60 V VSIM = 2.85 V

SIM interface

1.22 V VSIM = 1.80 V

H-level input

1.95 V VSIM = 2.85 V

L-level input 0.37 V

RESET_IN signal

H-level input 1.6 V

Table 4-4: Input Characteristics

Limit Values

Min

Typ

Max

slow

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Voltage Domain Parameter

L-level output for output driver class B

L-level output for output driver class C

L-level output for output driver class D

Unit Remarks

0.00 0.80 V IOL = +15.0 mA

0.00 0.35 V IOL = +5.0 mA

0.00 0.35 V IOL = +4.0 mA

0.00 0.35 V IOL = +2.0 mA

Generic digital interfaces

L-level output for output driver class E and F

H-level output for output driver class B

H-level output for output driver class C

H-level output for output driver class D

0.00 0.35 V IOL = +1.5 mA

2.05 2.85 V IOH = -15.0 mA

2.05 2.85 V IOH = -5.0 mA

2.05 2.85 V IOH = -4.0 mA

2.05 2.85 V IOH = -2.0 mA

Limit Values

H-level output

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Voltage Domain Parameter

for output driver class E and F

I2C interface L-level output 0.00 0.40 V IOL = +3.0 mA

L-level output

2.05 2.85 V IOH = -1.5 mA

0.00 0.20 V

0.00 0.35 V

0.00 0.20 V

Unit Remarks

VSIM = 1.80 V IOL = +1.0 mA

VSIM = 1.80 V IOL = +1.5 mA

VSIM = 2.85 V IOL = +1.0 mA

0.00 0.35 V

SIM interface

1.60 1.80 V

1.45 1.80 V

H-level output

2.65 2.85 V

2.50 2.85 V

VSIM = 2.85 V IOL = +1.5 mA

VSIM = 1.80 V IOH = -1.0 mA

VSIM = 1.80 V IOH = -1.5 mA

VSIM = 2.85 V IOH = -1.0 mA

VSIM = 2.85 V IOH = -1.5 mA

Table 4-5: Output Characteristics

Limit Values

Min

Typ

Max

down input

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Voltage Domain Parameter

Pull-up input current for pull class A

Pull-up input current for pull class B

Pull-up input current for pull

Generic digital interfaces or SIM interface

class C

Pullcurrent for pull class A

Unit Remarks

-450 uA

-100 uA

-30 uA

450 uA

Pullcurrent for pull class B

Pullcurrent for pull class C

100 uA

30 uA

Table 4-6: Pad Pull-up and Pull-down Characteristics

Limit Values

Min

Typ

Max

Gain stage = +24dB

Gain stage = +18dB

Gain stage = +0dB

UTX(t) = 1.075V+

4.2.3. Audio Pins

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Parameter

Differential input voltage 1.03 Vpp

Differential input impedance 50 kΩ

Input capacitance 5 10 pF

Signal to distortion 65 dB

75 dB

Signal-to-noise ratio

72 dB

Unit Remarks

Gain stage = +12dB Bandwidth = 300-3900Hz (GSM mode)

Gain stage = +12dB Bandwidth = 300-7000Hz (WAMR mode)

Power supply rejection

Cross talk (between Rx and Tx channel)

66 85 dB

62 dB

45 dB

-65 dB

(t) =

VDD

2.5V+0.15V•sin(2π•1kHz•t)

(t) =

VDD

2.5V+0.15V•sin(2π•1kHz•t)

(t) =

VDD

2.5V+0.15V•sin(2π•1kHz•t)

URX(t) =

0.775V•sin(2π•1kHz•t)

Limit Values

Min

Typ

Max

Settable to: 1.8 V, 2.0 V, 2.2

Gain stage = +0dB in

Limit Values

Min

Typ

Max

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Parameter

Cut-off frequency of anti-alias filter

Absolute gain drift ±2 %

16 kHz

Unit Remarks

Variation due to change in supply, temperature and life time.

Table 4-7: Audio Transmit Path Characteristics

Parameter

Output voltage of pin VMIC 2.20 V

Unit Remarks

V typ.

Microphone supply current 2.0 mA

crosstalk free conditions at

Power supply rejection of microphone supply

75 dB

board level

(t) =

VDD

2.6V+0.10V•sin(2π•1kHz•t)

Table 4-8: Microphone Supply Characteristics

Parameter

Maximum single-ended output voltage

Internal output resistance 1.7 4 Ω

1.65 1.85 2.05 Vpp

Unit Remarks

Full scale single-ended open circuit voltage.

Limit Values

Load = 16Ω, Gain stage = Load = 16Ω, Gain stage =

Load = 16Ω, Gain stage =

Gain stage = +0dB,

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Parameter

Output load resistance 16 Ω

Single-ended output load capacitance

Signal to noise 70 80 dB

Signal to distortion

10 nF

60 70 dB

Unit Remarks

+0dB,

Input signal = 0dBFS, Code 0, A-weighted

+0dB,

Input signal = 0dBFS

+0dB,

Input signal = -1dBFS

60 dB

Power supply rejection 60 66 dB

Passband ripple 0.5 dB f < 0.45 fs

Stopband attenuation 50 dB f > 0.55 fs

Absolute gain drift ±2 %

+0dB,

Input signal = -6dBFS

(t) =

VDD

2.5V+0.15V•sin(2π•1kHz•t)

Variation due to change in supply, temperature and life time.

Table 4-9: G30 Low Power Single-ended Audio Receive Path Characteristics

Limit Values

Min

Typ

Max

Load = 16Ω, Gain stage =

Limit Values

Min

Typ

Max

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Parameter

Maximum differential output voltage

Output load resistance 8 Ω

Single-ended output load capacitance

Inductive load 400 uH

Signal to noise 70 80 dB

10.4 Vpp

10 nF

Unit Remarks

Overdrive Gain stage = +9dB

Between output pins and GND with series resistance

+0dB,

Input signal = 0dBFS, Code 0, A-weighted

Signal to distortion 50 dB Load = 8Ω, 350mW

Power supply rejection 60 dB 1kHz

Table 4-10: G30 High Power Differential Audio Receive Path Characteristics

4.2.4. ADC Pins

Parameter

Resolution 12 Bits

Differential linearity error ±0.5 LSB

Unit Remarks

Limit Values

supply, temperature, and life

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Parameter

Integral linearity error ±4 LSB

Offset error ±10 LSB ADC input = 0V

Absolute gain drift ±2 %

Input voltage span 0 1.92 V

Throughput rate 4 Hz

Input resistance 1 MΩ

Unit Remarks

Variation due to change in supply, temperature and life time.

With current ADC SW driver.

With respect to AGND. If mode OFF is selected.

Input resistance in measurement mode

Internal voltage 0.46 0.48 0.50 V

Input leakage current 0.1 uA

288 480 672 kΩ

Table 4-11: Input Characteristics

4.3. Environmental Specifications

The following table gives the environmental operating conditions of the G30 module.

With respect to AGND. Variation due to process tolerances and change in

time.

With respect to AGND. Variation due to process tolerances and change in

time.

Parameter

Conditions

Min

Max

Unit

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

CAUTION:

Exceeding the values may result in permanent damage to the module.

Ambient Operating Temperature

Storage Temperature -40 85 °C

ESD

-30 85 °C

At antenna connector Contact Air At interface pads/connector

± 8 ± 15 ± 1

Table 4-12: Environmental Ratings

4.4. Application Interface Specifications

The following table summarizes the DC electrical specifications of the application interface connector signals.

IMPORTANT:

Interface signals that are not used by the customer application must be left unconnected. G30 incorporates the necessary internal circuitry to keep unconnected signal in their default state. Do not connect any components to, or apply any voltage on, signals that are not used by the application.

Signals that are defined as "Do Not Use", or DNU, must remain externally unconnected in any case. These signals are reserved for future use.

The following figures give a brief description of the 70 pins connector and the 81 pin LGA interface irrespectively for quick integration.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 4-1: G30 - 70 Pin Connector Quick Integration Connections

Pin No.

interface)

@70 Pin

Value @

If eSIM is being used short this pin to pin

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 4-2: G30 - 81 Pin LGA Interface Quick Integration Connections

Note: Refer to “Interface Connector Specifications” on page 74.

(81 pin

LGA

1 36

2 38

3 Not Connected

4 56 eSIM_RESE

Conn.

Name I/O Function

GPIO5 I/O GPIO

GPIO6 I/O GPIO

Embedded SIM

reset

Reset

I H 100K PU

Characteristics

(Operating Parameters)

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B

Pin No.

interface)

@70 Pin

Value @

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

G30 Hardware User Guide

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(81 pin

LGA

5 40

6 42

7 62

8-11 Not Connected

Conn.

Name I/O Function

GPIO7 I/O GPIO

GPIO8 I/O GPIO

SPI_IRQ I SPI Interrupt Input

I/O Capture/Compare

I/O GPIO

Reset

I H 100K PU

Characteristics

(Operating Parameters)

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B.

voltage domain. Output driver class C.

13 41

14 26

15 Not Connected

16 49

GPIO9 I/O GPIO

ANT_DET I/O

WKUPO I/O

GPRS I/O

GPIO (M2M Zone only)

O Antenna Detect

GPIO (M2M Zone only)

O Wake-Up Out H

GPIO (M2M Zone only)

I H 100K PU

L - No Antenna H - Valid Antenna

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B.

voltage domain. Output driver class F.

Pin No.

interface)

@70 Pin

Value @

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

G30 Hardware User Guide

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(81 pin

LGA

17 Not Connected

18 53

19 Not Connected

20 48

Conn.

Name I/O Function

O GPRS

PWR_ON I Power-on/off input T/PD

VSIM O SIM supply output

Reset

L - Valid GPRS connectio n H - No GPRS connectio n

Characteristics

(Operating Parameters)

RTC interface. (2.0V typ.) Use OC circuit only

VSIM = 1.80 V typical if SIM card = 1.8V type or VSIM = 2.85 V typical if SIM card = 3.0V type

21 44

22 52

23 46

24 Not Connected

25 16

SIM_RST O External SIM reset L

SIM_IO I/O SIM data

SIM_CLK O SIM clock L

WKUPI I/O Interrupt

I Wake-Up In

4.7K PU

I H 100K PU

SIM interface voltage domain (VSIM). Output driver class E. PU/PD class B.

voltage domain. Output driver class C.

Pin No.

interface)

@70 Pin

Value @

I2C interface

Value at reset: T/OD.

I2C interface

PU drain.

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

DCD

Data Carrier Detect

Generic digital interfaces (Typ. 2.85V)

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

(81 pin

LGA

26 Not Connected

27 25

28-32 Not Connected

33 34

34 32

Conn.

Name I/O Function

RESET_IN OC External reset input

GPIO4/SCL O

GPIO3/SDA I/O

I2C bus clock line (M2M Zone only)

I/O GPIO

I2C bus data line (M2M Zone only)

I/O GPIO

Reset

I H 19K PU

I H 100K PU

Characteristics

(Operating Parameters)

External reset signal voltage domain. Use OC circuit only

voltage domain. PU drain.

voltage domain.

35 43

36 37

37 23

ADC2 I

ADC1 I

RI O Ring Indicator H

Analog-to-Digital Converter Input

GPIO (M2M Zone

I/O

only)

Resolution: 12 bits Voltage span: 0V-1.92V

voltage domain. Output driver class D.

voltage domain. Output driver class B. PU/PD class B

Pin No.

interface)

@70 Pin

Value @

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

(81 pin

LGA

39 13

40 19

41 9

42 15

Conn.

Name I/O Function

DSR O Data Set Ready L

DTR I Data terminal ready

RTS I Ready to send 4.7K PU

CTS O Clear To Send

Reset

I H 100K PU

Characteristics

(Operating Parameters)

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class B slow. PU/PD class A.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class C. PU/PD class B.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class C.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class E. PU/PD class C.

43 21

44 11

45 66

46 Not Connected

47 54

48 63,67

TXD I Transmitted Data 200K PU

RXD O Received Data T

SPI_CLK O

HDST_SPK O

SPKR_N O

SPI Clock Short to Pin 57

Low power singleended analog audio output

High power differential analog audio output

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class E. PU/PD class C.

Generic digital interfaces (Typ. 2.85V)

voltage domain. Output driver class D. PU/PD class B.

Used in handset or in headset mode

Used in ring tones or in hands free mode

Pin No.

interface)

@70 Pin

Value @

Generic digital interfaces (Typ. 2.85V)

PU/PD class B.

Handset

analog reference

Headset

analog reference

G30 Hardware User Guide

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(81 pin

LGA

49 65,69

50 55

51 61

52 59

53 57

Conn.

Name I/O Function

High power

SPKR_P O

HDST_INT I

MIC I

AGND1 I

MIC_HDST I

differential analog audio output

Headset detection input

External interrupt

input

Headset microphone analog bias

microphone

Headset microphone analog bias

Reset

Characteristics

(Operating Parameters)

Used in ring tones or in hands free mode

voltage domain. Output driver class E.

Single ended supply output and signal input for Handset microphone. Used in handset or in hands free mode

Local ground of the Handset microphone

Single ended supply output and signal input for microphone. Used in headset mode

54 59

55 18

56 24

57 22

58 20

AGND2 I

RXD_DAI I

WA0_DAI O

CLK_DAI O

TXD_DAI O

microphone

I2S receive data Short to pin 61

I2S word alignment Short to pin 60

I2S clock Short to pin 45

I2S transmit data Short to pin 63

47K PU

Local ground of the Headset microphone

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class D. PU/PD class B.

Pin No.

interface)

@70 Pin

Value @

Real Time Clock

Output/Input

G30 Hardware User Guide

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(81 pin

LGA

59 50

60 68

61 64

62 60

63 70

Conn.

Name I/O Function

SIM_PD_n I SIM present detect OD/L

SPI sync data

SPI_MOSI O

SPI_MISO I

VRTC I/0

SPI_CS O

(MOSI) Shorted to pin 56

SPI sync data (MISO) Shorted to pin 55

Supply

SPI chip select Short to pin 58

Reset

47K PU

Characteristics

(Operating Parameters)

SIM interface voltage domain. Output driver class E. PU/PD class B.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class D. PU/PD class B

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class D. PU/PD class B.

VRTC = 2.0 V (typical) 2mA Connect a 47uF capacitor to ground.

Generic digital interfaces voltage domain (Typ. 2.85V). Output driver class D. PU/PD class B.

64 Not Connected

65 1,2,3,4

N.C

67 1,2,3,4

68 1,2,3,4

69 1,2,3,4

70 1,2,3,4

71 1,2,3,4

72 1,2,3,4

GND NA Ground

ANT I/O RF antenna 50 Ohm nominal impedance

GND NA Ground

GND pins are internally shorted between them.

Pin No.

interface)

@70 Pin

Value @

82-89

Not Connected

Not Connected – Refer to “RF Recommendation” on

G30 Hardware User Guide

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(81 pin

LGA

73 1,2,3,4

74 1,2,3,4

75 1,2,3,4

76 1,2,3,4

77 1,2,3,4

78 5,6,7,8

79 5,6,7,8

80 28

Conn.

Name I/O Function

GND NA Ground

VCC I

GPIO1 I/O GPIO

Voltage Supply Input

Reset

I H 100K PU

Characteristics

(Operating Parameters)

GND pins are internally shorted between them.

VCC pins are internally shorted between them.

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B.

81 30

RF TP

page 80.

NOTE:

PU - Pull up, PD - Pull down, I - Input, H - High logic state, L - Low logic state, OC - open collector, O - Output, NA - Not Applicable

GPIO2 I/O GPIO

VREF O

Reference voltage supply

H 100K PU

2.85V Max current source 30mA

Table 4-13: Interface Specifications

Generic digital interfaces (Typ. 2.85V) voltage domain. Output driver class F. PU/PD class B.

5. Mechanical Specifications

5.1. Board Dimensions

The following pictures describe the G30 mechanical characteristics.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-1: G30 Mechanical Characteristics - 81 Pin LGA Interface

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-2: G30 Mechanical Characteristics - B2B Connector (70 Pin)

5.2. LGA Tape & Reel Specification

The following picture shows LGA Tape & Reel specification.

Each reel contains 500 units.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-3: LGA Tape & Reel Specification

G30 Connector

Mating Connector

Stacking Height

Molex 53748-0708

Molex 52991-0708

3.0 mm

Parameter

53748 (3.0 mm)

Contacts

Rows

Pitch

0.5 mm

Maximum Current

500 mA

Maximum Voltage

50 V

Contact Resistance

50 mΩ maximum

Insulation Resistance

100 MΩ minimum

Durability

50 mated cycles maximum

Stacking Height

3.0 mm

Mates with

Molex 52991-0708

5.3. Interface Connector Specifications

The G30 uses a single 70-pin, 0.5 mm pitch, board to board connector for the application interface.

G30 interface connector option

shows the G30 interface connector.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

G30 Interface Connector

The following table describes the G30 interface connector characteristics.

Table 5-1: Interface Connector Specifications

5.3.1. Mating Connector

The mating connector incorporate the same electrical and mechanical characteristics as the corresponding G30 interface connectors, which are described in table 5-1.

The following figure provides a reference drawing of the mating connectors mechanical dimensions.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-4: Mating Connector Dimensions

For more information on the G30 mating connector, please refer to the Molex web site at http://www.molex.com/molex/index.jsp.

5.4. U.FL Connector Specifications

The G30 uses a standard U.FL receptacle connector for the radio interface.

The following figure shows the U.FL connector dimensions.

Parameter

Specifications

Characteristic Impedance

50 Ohms

Frequency Range

DC to 6 GHz

1.30 max DC to 3 GHz

1.40 max 3 to 6 GHz (cable dependent)

Insertion Loss (connectors only)

0.24 dB max DC to 6 GHz

Rated voltage

60 VAC (rms) - standard receipt (Styles A, B)

Dielectric Withstanding Voltage

200 VAC, 50 Hz for 1 min (at sea level)

Insulation Resistance

500 Megaohms min

20 milliohms max (Center)

10 milliohms max (Outer, Receptacle)

Durability

30 cycles - standard receipt (Styles A, B)

2N min perpendicular 4N min orthogonal

Center Contact Retention force

0.15N min

Tape/Reel Packaging (receptacle)

12mm carrier per EIA-481

Operating Temperature

40°C to + 90°C

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-5: U.FL Connector Dimensions

The following table describes the U.FL connector characteristics.

VSWR (mated pair)

Contact Resistance (connectors only)

10 milliohms max (Outer, Plug)

Disengagement Force

Table 5-2: U.FL Connector Specifications

5.4.1. Mating Connector

The RF mating connector should be a standard U.FL plug connector or cable assembly, which corresponds to the G30 U.FL connector specifications.

Only Hirose U.FL mating cable may be mated with G30. A family of Hirose mating cables are available.

Such a cable assembly example is the Hirose U.FL-LP-040 is U.FL-R-SMT, which is illustrated in

See U.FL Mating Connector..

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-6: U.FL Mating Connector

For more details regarding Hirose mating cable assemblies, refer to http://www.hirose.co.jp/cataloge_hp/e32119372.pdf.

5.5. G30 Mounting

NOTE:

This section applies to G30 70 pin connector Model only.

The G30 incorporates 2 mechanical holes for installing the module onto the application board. The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical elements.

Several mechanical approaches may be applied to mount and fasten G30 to the application board. Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is a recommended design.

WARNING:

Due to shield opening restriction, the spacer diameter must not exceed 3.7mm.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Special attention must be paid to the area surrounding the G30 mounting holes. A grounding pad of 4.4 millimeters in diameter surrounds these holes. The diameter and area of this pad must not be exceeded by any mechanical or electrical element. Several electrical components, which are not shielded, are located near the holes. These components must not be in contact with the mounting elements or with other parts of the application board, and care must be taken to avoid any damage.

The following picture depicts the G30 mounting area.

Figure 5-7: G30 Mounting Area

The holes are used for mechanical mounting of G30 to the application board but also for grounding support. Using conductive elements to install G30, significantly improves the overall grounding of the module and therefore improves the G30 performance and stability.

It is required to use screws or other mechanical elements to fasten G30 to the application board, but it is highly recommended to use conductive elements to improve the module's performance.

The preferred mounting screw head types are:

• "Allen" head with a champer - the best choice.

• "Star" head - good.

• "Philips" head - may cause damage to nearby components.

5.6. Layout Recommendation

NOTE:

This section applies to G30 LGA Model only.

5.6.1. Soldering Footprint

The following figure gives a layout recommendation for the G30.

G30 Hardware User Guide

1VV0300919 Rev.0 – 2011-05-04

Figure 5-8: G30 Soldering Footprint (Top View)

• Routing signals other then GND (Ground) within inner soldering footprint area of

G30 (under G30) is not recommended.

• Vias inside pads are not recommended.

• Verify GND pads are well tied to ground plane layer by vias.

5.6.2. RF Recommendation

NOTE:

The restrictions below are valid for both U.FL connector and RF PAD.

• Avoid ANY routing below RF Test-Point Round circle, and RF pad, Pin-66.

• Keep the RF TP area and its clearance area cleared from Routing and GND (internal

layers also), at least 0.45mm below the G30.

• RF PAD must be connected with a 50 ohm controlled impedance Line.

Telit Wireless Solutions G30 Hardware User's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual