Telit Wireless Solutions 1vv0300773a User Manual

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GE863-PRO3 Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

Contents

1 Overview ........................................................................................................................... 6

2 GE863-PRO3 Mechanical Dimensions ............................................................................ 7

3 GE863-PRO3 module connections .................................................................................. 8

3.1 BALL-OUT ................................................................................................................................ 8

3.2 BALLS LAYOUT ..................................................................................................................... 14

3.3 ARM Port IO multiplexing ....................................................................................................... 15

4 Hardware Commands .................................................................................................... 18

4.1 Turning ON the GE863-PRO

4.2 Turning OFF the GE863-PRO

4.2.1 Hardware shutdown ........................................................................................................................20

GSM/GPRS Engine ................................................................ 18

GSM/GPRS Engine .............................................................. 20

4.3 Hardware Unconditional Reboot of GSM/GPRS Engine ........................................................ 20

4.4 Turning ON/OFF the GE863-PRO

ARM ............................................................................... 21

5 Power Supply ................................................................................................................. 23

5.1 GSM Power Supply Requirements ......................................................................................... 23

5.2 ARM Power Supply Requirements ......................................................................................... 24

5.3 VRTC Backup supply ............................................................................................................. 24

5.4 General Design Rules ............................................................................................................ 25

5.4.1 Electrical design Guidelines ............................................................................................................25

5.4.1.1 + 5V input Source Power Supply Design Guidelines .................................................................26

5.4.1.2 + 12V input Source Power Supply Design Guidelines ...............................................................27

5.4.1.3 Battery Source Power Supply Design Guidelines ......................................................................28

5.4.1.4 Battery Charge control Circuitry Design Guidelines ...................................................................29

5.4.2 Thermal Design Guidelines ............................................................................................................31

5.4.3 Power Supply PCB layout Guidelines ............................................................................................32

6 Antenna ........................................................................................................................... 33

6.1 GSM Antenna Requirements .................................................................................................. 33

6.2 GSM Antenna - PCB line Guidelines ...................................................................................... 34

6.3 GSM Antenna - installation Guidelines ................................................................................... 35

6.4 Electro Magnetic Interference - Guidelines ............................................................................ 35

6.5 Logic level specifications ........................................................................................................ 36

6.5.1 GSM Reset signal ...........................................................................................................................38

7 Serial Ports ..................................................................................................................... 39

7.1 MODEM SERIAL PORT ......................................................................................................... 39

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

7.2 RS232 level translation ........................................................................................................... 41

8 Audio Section Overview ................................................................................................ 44

8.1 INPUT LINES (Microphone) ................................................................................................... 45

8.1.1 Short description .............................................................................................................................45

8.1.2 Input Lines Characteristics .............................................................................................................46

8.2 OUTPUT LINES (Speaker) ..................................................................................................... 47

8.2.1 Short description .............................................................................................................................47

8.2.2 Output Lines Characteristics ...........................................................................................................48

9 The Evaluation Kit for Telit GE863-PRO3 Modules ...................................................... 49

9.1.1 Short Description ............................................................................................................................49

10 GSM/GPRS General Purpose I/O................................................................................... 50

10.1 Using a GPIO Pad as INPUT ................................................................................................. 51

10.2 Using a GPIO Pad as OUTPUT ............................................................................................. 51

10.3 Using the RF Transmission Control GPIO7 ............................................................................ 51

10.4 Using the RFTXMON Output GPIO3 ...................................................................................... 51

10.5 Using the Alarm Output .......................................................................................................... 52

10.6 Using the Buzzer Output GPIO4 ............................................................................................ 52

10.7 Indication of network service availability ................................................................................. 53

10.8 RTC Bypass out ..................................................................................................................... 54

10.9 VAUX1 power output .............................................................................................................. 54

11 Mounting the GE863-PRO3 on the Application Board ................................................. 55

11.1 General ................................................................................................................................... 55

11.1.1 Stencil .............................................................................................................................................55

11.1.2 PCB pad Design .............................................................................................................................55

11.1.3 Solder paste ....................................................................................................................................56

11.1.4 GE863-PRO3 Solder Reflow ...........................................................................................................57

11.1.5 Packing System ..............................................................................................................................59

11.1.6 Moisture Sensibility .........................................................................................................................61

12 Conformity Assessment Issues .................................................................................... 62

13 SAFETY RECOMMANDATIONS..................................................................................... 63

14 Document Change Log .................................................................................................. 64

This document is relating to the following products:

GE863-PRO3 3990250691 GE863-PRO3 with Linux OS 3990250698

GE863-PRO

1vv0300773a Rev. 0 - 24/01/08

Hardware User Guide

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this document.

-PRO

1 Overview

GE863-PRO

1vv0300773a Rev. 0 - 24/01/08

Hardware User Guide

The scope of this document is the description of some hardware solutions useful for developing a product with

the Telit

In this document all the basic functions of a M2M device will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be

used as a guide and a starting point for properly developing your product with the Telit GE863-PRO3 module. For

further hardware details that may not be explained in this document refer to the Telit GE863-PRO Description document.

(EN) The integration of the GSM/GPRS GE863-PRO

done according to the design rules described in this manual.

GE863-PRO

module.

Product

NOTICE

cellular module within user application shall be

(IT) L’integrazione del modulo cellulare GSM/GPRS GE863-PRO3 all’interno dell’applicazione dell’utente

dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die integration des GE863-PRO3 GSM/GPRS Mobilfunk-Moduls in ein Gerät muß gemäß der in

diesem Dokument beschriebenen Kunstruktionsregeln erfolgen

(SL) Integracija GSM/GPRS GE863-PRO3 modula v uporabniški aplikaciji bo morala upoštevati projektna

navodila, opisana v tem piročniku.

(SP) La utilización del modulo GSM/GPRS GE863-PRO3 debe ser conforme a los usos para los cuales ha

sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS GE863-PRO3 dans l’application de l’utilisateur sera

faite selon les règles de conception décrites dans ce manuel.

GE863

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

2 GE863-PRO3 Mechanical Dimensions

The Telit GE863-PRO3 module overall dimension are:

• Length: 41,4 mm

• Width: 31,4 mm

• Thickness: 3,6 mm

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

3 GE863-PRO3 module connections

3.1 BALL-OUT

Ball Signal I/O Main Function

A1 RESERVED - RESERVED (3) - - -

A2 GND

A3 ANTENNA

A4 RESERVED - RESERVED (3) - - -

A5 GND -

A6 EAR_HF+

A7 EAR_HF-

A8 EAR_MT+

A9 EAR_MT-

A10 RESERVED - RESERVED (3) - - -

A11 RESERVED - RESERVED (3) - - -

A12 GND -

B1 RESERVED - RESERVED (3) - - -

B2 GND -

B3 GND -

B4 GND -

B5 GND -

B6 MIC_HF+

B7 MIC_HF-

B8 MIC_MT+

B9 MIC_MT-

B10

B11

B12

C1 VBATT

GPIO4 /

BUZZER

STAT_LED O Status indicator led GSM CMOS 1.8V

SIMIN I/O External SIM signal - Presence (active

- Ground - - Power

O GSM Antenna output - 50 ohm

Ground - - Power

AO Handsfree ear output, phase + GSM

AO Handsfree ear output, phase - GSM

AO Handset earphone signal output, phase - GSM

AO Handset earphone signal output, phase

Ground - - Power

AI Handsfree microphone input; phase + GSM

AI Handsfree microphone input; phase - GSM

AI Handset microphone signal input;

phase+

AI Handset microphone signal input; phase- GSM

I/O GPIO4 / BUZZER output GSM

low)

- Main GSM power supply GSM

Internal

Pull up

- GSM RF

GSM

47KΩ

ARM/ GSM Type

GSM CMOS 2.8V

Audio

CMOS 2.8V

Power

GE863-PRO

Ball Signal I/O Main Function

C2 VBATT

C3 VRTC

C4 C125/RING

C5 C107/DSR

C6 C108/DTR

C7 C109/DCD

C8 C105/RTS

C9 C106/CTS

C10

C11 SIMRST

C12 SIMIO

D3 RESERVED - RESERVED (3) - - -

D4 PB25 I/O ARM PIO Controller B pin 25 ARM CMOS 3.1V

D5 PB22 I/O ARM PIO Controller B pin 22 ARM CMOS 3.1V

GPIO7/

RFTXDISABLE

CHARGE AI Charger input GSM

VAUX1 - Power output for external accessories GSM

- Main GSM power supply GSM

AO VRTC Backup capacitor GSM-ARM

O Output for Ring indicator signal (RI) to

DTE

O Output for Data set ready signal (DSR)

to DTE

I Input for Data terminal ready signal

(DTR) from DTE

O Output for Data carrier detect signal

(DCD) to DTE

I Input for Request to send signal (RTS)

from DTE

O Output for Clear to send signal (CTS) to

DTE

I/O GPIO7 / RFTXDISABLE GSM

O External SIM signal – Reset GSM

I/O External SIM signal - Data I/O GSM

Internal

Pull up

GSM

ARM/ GSM Type

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

Power

CMOS 2.8V

1.8/3V ONLY

Power

D6 PB24 I/O ARM PIO Controller B pin 24 ARM CMOS 3.1V

D7 PB23 I/O ARM PIO Controller B pin 23 ARM CMOS 3.1V

D8 PB26 I/O ARM PIO Controller B pin 26 ARM CMOS 3.1V

D9 PB27 I/O ARM PIO Controller B pin 27 ARM CMOS 3.1V

D10 GND -

D11 SIMVCC

D12 SIMCLK

E1 GND -

PWRMON O Power ON Monitor GSM

E3 RESERVED - RESERVED (3) - - -

ON/OFF*-GSM I Input command for switching power ON

E5 RESET*-GSM

E6 GPIO1 / JDR

E7 GPIO5

E9 C103/TXD

GPIO3 /

RFTXMON

Ground - - Power

- External SIM signal – Power (2) GSM

O External SIM signal – Clock GSM

Ground - - Power

or OFF to GSM/GPRS Engine (toggle command).

I GSM/GPRS Engine Reset input

I/O GPIO1 Configurable general purpose I/O

pin / Jammer Detect Output (2)

I/O GPIO5 Configurable general purpose I/O

pin GPIO3 Configurable general purpose I/O

I/O

pin /

I Serial data input (TXD) from DTE GSM

47KΩ

GSM

1.8/3V ONLY

Pull up to VBATT

CMOS 2.8V

GE863-PRO

Ball Signal I/O Main Function

E10 C104/RXD

E11 PB8 I/O ARM PIO Controller B pin 8 ARM CMOS 3.1V

E12 PB9 I/O ARM PIO Controller B pin 9 ARM CMOS 3.1V

F1 PB13 I/O ARM PIO Controller B pin 13 ARM CMOS 3.1V

F2 PC30 I/O ARM PIO Controller C pin 30 ARM CMOS 1.8V-A

F3 PC21 I/O ARM PIO Controller C pin 21 ARM CMOS 1.8V-A

F4 PC28 I/O ARM PIO Controller C pin 28 ARM CMOS 1.8V-A

F5 PC29 I/O ARM PIO Controller C pin 29 ARM CMOS 1.8V-A

F6 NRST I RESET ARM

F7 ON/OFF*-AP I

F8 SHDN O Shutdown Control Output ARM CMOS VRTC

F9 PB4 I/O ARM PIO Controller B pin 4 ARM CMOS 3.1V

F10 PB5 I/O ARM PIO Controller B pin 5 ARM CMOS 3.1V

F11 PC8 I/O ARM PIO Controller C pin 8 ARM CMOS 1.8V-A

F12 PC10 I/O ARM PIO Controller C pin 10 ARM CMOS 1.8V-A

G1 PB12 I/O ARM PIO Controller B pin 12 ARM CMOS 3.1V

G2 RESERVED - RESERVED (3) - - -

G3 PC31 I/O ARM PIO Controller C pin 31 ARM CMOS 1.8V-A

G8 RESERVED - RESERVED (3) - - -

G9 PA5 I/O ARM PIO Controller A pin 5 ARM CMOS 3.1V

G10 PA4 I/O ARM PIO Controller A pin 4 ARM CMOS 3.1V

G11 PB10 I/O ARM PIO Controller B pin 10 ARM CMOS 3.1V

G12 PB11 I/O ARM PIO Controller B pin 11 ARM CMOS 3.1V

H1 PB6 I/O ARM PIO Controller B pin 6 ARM CMOS 3.1V

H2 PB29 I/O ARM PIO Controller B pin 29 ARM CMOS 3.1V

H3 GND -

H4 PB20 I/O ARM PIO Controller B pin 20 ARM CMOS 3.1V

H5 PB21 I/O ARM PIO Controller B pin 21 ARM CMOS 3.1V

H6 PB19 I/O ARM PIO Controller B pin 19 ARM CMOS 3.1V

H7 PB18 I/O ARM PIO Controller B pin 18 ARM CMOS 3.1V

H8 RESERVED - RESERVED (3) - - -

GPIO2 /

PCMCLK

GPIO8 /

PCMWAO

GPIO6 / PCMTX

GPIO9 –

PCMRX

O Serial data output to DTE GSM

Input command for turning power ON or OFF to ARM Engine (active high command).

I/O GPIO2 Configurable general purpose I/O

I/O GPIO8 Configurable general purpose I/O

I/O GPIO6 Configurable general purpose I/O

I/O GPIO9 Configurable general purpose I/O

Ground - - Power

Internal

Pull up

1 KΩ

47KΩ

4.7KΩ

GSM

GSM CMOS 2.8V

ARM/ GSM Type

ARM CMOS 3.1V

ARM

GSM

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

CMOS 2.8V

Pull up to VBATT2

CMOS 2.8V

GE863-PRO

Ball Signal I/O Main Function

H9 PC18 I/O ARM PIO Controller C pin 18 ARM CMOS 1.8V-A

H10 PB0 I/O ARM PIO Controller B pin 0 ARM CMOS 3.1V

H11 PB2 I/O ARM PIO Controller B pin 2 ARM CMOS 3.1V

H12 PB1 I/O ARM PIO Controller B pin 1 ARM CMOS 3.1V

J1 PB7 I/O ARM PIO Controller B pin 7 ARM CMOS 3.1V

J2 PB28 I/O ARM PIO Controller B pin 28 ARM CMOS 3.1V

J3 RESERVED - RESERVED (3) - - -

J4 PB16 I/O ARM PIO Controller B pin 16 ARM CMOS 3.1V

J5 PB17 I/O ARM PIO Controller B pin 17 ARM CMOS 3.1V

J6 PC15 I/O ARM PIO Controller C pin 15 ARM CMOS 1.8V-A

J7 PC14 I/O ARM PIO Controller C pin 14 ARM CMOS 1.8V-A

J8 RESERVED - RESERVED (3) - - -

J9 PC4 I/O ARM PIO Controller C pin 4 ARM CMOS 1.8V-A

J10 PC5 I/O ARM PIO Controller C pin 5 ARM CMOS 1.8V-A

J11 PC19 I/O ARM PIO Controller C pin 19 ARM CMOS 1.8V-A

J12 PC20 I/O ARM PIO Controller C pin 20 ARM CMOS 1.8V-A

K1 PA23 I/O ARM PIO Controller A pin 23 ARM CMOS 3.1V

K2 PA29 I/O ARM PIO Controller A pin 29 ARM CMOS 3.1V

K3 TMS I JTAG ARM - Test Mode Select Pull Down ARM CMOS 3.1V

K4 TCK I JTAG ARM – Test Clock ARM CMOS 3.1V

K5 RTCK O JTAG ARM – Returned Test Clock ARM CMOS 3.1V

K6 PA25 I/O ARM PIO Controller A pin 25 ARM CMOS 3.1V

K7 PC13 I/O ARM PIO Controller C pin 13 ARM CMOS 1.8V-A

K8 PC6 I/O ARM PIO Controller C pin 6 ARM CMOS 1.8V-A

K9 PC7 I/O ARM PIO Controller C pin 7 ARM CMOS 1.8V-A

K10 PB3 I/O ARM PIO Controller B pin 3 ARM CMOS 3.1V

K11 HDMA A USB Host Port A Data - ARM USB

K12 HDPA A USB Host Port A Data + ARM USB

L1 PA24 I/O ARM PIO Controller A pin 24 ARM CMOS 3.1V

L2 OSCSEL I Slow Clock Oscillator Selection Pull Down ARM CMOS VRTC

L3 NTRST I JTAG ARM - Test Reset Pull Up ARM CMOS 3.1V

L4 TDI I JTAG ARM - Test Data Input ARM CMOS 3.1V

L5 TDO O JTAG ARM - Test Data Output ARM CMOS 3.1V

L6 JTAGSEL I JTAG ARM – JTAG Type Selection Pull Down ARM CMOS 3.1V

L7 PA28 I/O ARM PIO Controller A pin 28 ARM CMOS 3.1V

L8 PA27 I/O ARM PIO Controller A pin 27 ARM CMOS 3.1V

L9 PA26 I/O ARM PIO Controller A pin 26 ARM CMOS 3.1V

Internal

Pull up

ARM/ GSM Type

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

GE863-PRO

Ball Signal I/O Main Function

L10 GND -

L11 HDMB A USB Host Port B Data - ARM USB

L12 HDPB A USB Host Port B Data + ARM USB

M1 XIN32 I Slow Clock Oscillator Input ARM CMOS VRTC

M2 XOUT32 O Slow Clock Oscillator Output ARM CMOS VRTC

M3 RESERVED - RESERVED (3) - - -

M4 RESERVED - RESERVED (3) - - -

M5 PB14 I/O ARM PIO Controller B pin 14 ARM CMOS 3.1V

M6 PB15 I/O ARM PIO Controller B pin 15 ARM CMOS 3.1V

M7 PC22 I/O ARM PIO Controller C pin 22 ARM CMOS 1.8V-A

M8 PC9 I/O ARM PIO Controller C pin 9 ARM CMOS 1.8V-A

M9 PA3 I/O ARM PIO Controller A pin 3 ARM CMOS 3.1V

M10 PA2 I/O ARM PIO Controller A pin 2 ARM CMOS 3.1V

M11 PA1 I/O ARM PIO Controller A pin 1 ARM CMOS 3.1V

M12 PA0 I/O ARM PIO Controller A pin 0 ARM CMOS 3.1V

N1 PA11 I/O ARM PIO Controller A pin 11 ARM CMOS 3.1V

N2 PA10 I/O ARM PIO Controller A pin 10 ARM CMOS 3.1V

N3 PA9 I/O ARM PIO Controller A pin 9 ARM CMOS 3.1V

N4 PA31 I/O ARM PIO Controller A pin 31 ARM CMOS 3.1V

N5 PA30 I/O ARM PIO Controller A pin 30 ARM CMOS 3.1V

N6 PB31 I/O ARM PIO Controller B pin 31 ARM CMOS 3.1V

N7 GND -

N8 PC16 I/O ARM PIO Controller C pin 16 ARM CMOS 1.8V-A

N9 PC17 I/O ARM PIO Controller C pin 17 ARM CMOS 1.8V-A

N10 RESERVED - RESERVED (3) - - -

N11 DDM A USB Device Port Data - ARM USB

N12 DDP A USB Device Port Data + ARM USB

P1 PA6 I/O ARM PIO Controller A pin 6 ARM CMOS 3.1V

P2 PA7 I/O ARM PIO Controller A pin 7 ARM CMOS 3.1V

P3 PA8 I/O ARM PIO Controller A pin 8 ARM CMOS 3.1V

P4 PC12 I/O ARM PIO Controller C pin 12 ARM CMOS 1.8V-A

P5 PB30 I/O ARM PIO Controller B pin 30 ARM CMOS 3.1V

P6 PC0 I/O ARM PIO Controller C pin 0 ARM CMOS 3.1V

P7 PC1 I/O ARM PIO Controller C pin 1 ARM CMOS 3.1V

P8 PC2 I/O ARM PIO Controller C pin 2 ARM CMOS 3.1V

P9 PC3 I/O ARM PIO Controller C pin 3 ARM CMOS 3.1V

P10 PA22 I/O ARM PIO Controller A pin 22 ARM CMOS 3.1V

Ground - - Power

Internal

Pull up

ARM/ GSM Type

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

GE863-PRO

Ball Signal I/O Main Function

P11 3.1V_OUT OA ARM 3.1V Power Output ARM -

P12 VBATT2 - Main ARM Power Supply ARM Power

R1 GND -

R2 GND -

R3 GND -

R4 PA21 I/O ARM PIO Controller A pin 21 ARM CMOS 3.1V

R5 PA18 I/O ARM PIO Controller A pin 18 ARM CMOS 3.1V

R6 PA17 I/O ARM PIO Controller A pin 17 ARM CMOS 3.1V

R7 PA19 I/O ARM PIO Controller A pin 19 ARM CMOS 3.1V

R8 PA16 I/O ARM PIO Controller A pin 16 ARM CMOS 3.1V

R9 RESERVED - RESERVED (3) - - -

R10 GND -

R11 GND -

R12 GND -

S1 RESERVED - RESERVED (3) - - -

S2 RESERVED - RESERVED (3) - - -

S3 GND -

S4 PA20 I/O ARM PIO Controller A pin 20 ARM CMOS 3.1V

S5 PA14 I/O ARM PIO Controller A pin 14 ARM CMOS 3.1V

S6 PA15 I/O ARM PIO Controller A pin 15 ARM CMOS 3.1V

S7 PA12 I/O ARM PIO Controller A pin 12 ARM CMOS 3.1V

S8 PA13 I/O ARM PIO Controller A pin 13 ARM CMOS 3.1V

S9 RESERVED - RESERVED (3) - - -

S10 GND -

S11 RESERVED - RESERVED (3) - - -

S12 RESERVED - RESERVED (3) - - -

Ground - - Power

(1) For the exclusive use of the Technical Support Service (2) On this pin a maximum of 10nF bypass capacitor is allowed. (3) Reserved Pins must be left UNCONNECTED

Internal

Pull up

ARM/ GSM Type

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

3.2 BALLS LAYOUT

TOP VIEW

GE863-PRO

1vv0300773a Rev. 0 - 24/01/08

Hardware User Guide

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

3.3 ARM Port IO multiplexing

ARM PIO Controller A multiplexing

IO line Peripheral A Peripheral B Comments Reset State Boot State

PA0 SPI0_MISO MCDB0

PA1 SPI0_MOSI MCCDB

PA2 SPI0_SPCK

PA3 SPI0_NPCS0 MCDB3 I/O SPI0_NPCS0

PA4 RTS2 MCDB2 I/O I with Pull-up

PA5 CTS2 MCDB1 I/O I with Pull-up

PA6 MCDA0 I/O I with Pull-up

PA7 MCCDA I/O I with Pull-up

PA8 MCCK I/O I with Pull-up

PA9 MCDA1 I/O I with Pull-up

PA10 MCDA2 ETX2 I/O I with Pull-up

PA11 MCDA3 ETX3 I/O I with Pull-up

PA12 ETX0 I/O I with Pull-up

PA13 ETX1 I/O I with Pull-up

PA14 ERX0 I/O I with Pull-up

PA15 ERX1 I/O I with Pull-up

PA16 ETXEN I/O I with Pull-up

PA17 ERXDV I/O I with Pull-up

PA18 ERXER I/O I with Pull-up

PA19 ETXCK I/O I with Pull-up

PA20 EMDC I/O I with Pull-up

PA21 EMDIO I/O I with Pull-up

PA22 ADTRG ETXER I/O I with Pull-up

PA23 TWD ETX2 I/O I with Pull-up

PA24 TWCK ETX3 I/O I with Pull-up

PA25 TCLK0 ERX2 I/O I with Pull-up

PA26 TIOA0 ERX3 I/O I with Pull-up

PA27 TIOA1 ERXCK I/O I with Pull-up

PA28 TIOA2 ECRS I/O I with Pull-up

PA29 SCK1 ECOL I/O I with Pull-up

PA30 SCK2 RXD4 I/O I with Pull-up

PA31 SCK0 TXD4 I/O I with Pull-up

Connected to internal dataflash

SO (1)

Connected to internal dataflash SI

(1)

Connected to internal dataflash

CLK (1)

I/O SPI0_MISO

I/O SPI0_MOSI

I/O SPI0_SPCK

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

ARM PIO Controller B multiplexing

IO line Peripheral

PB0 SPI1_MISO TIOA3 I/O I with Pull-up

PB1 SPI1_MOSI TIOB3 I/O I with Pull-up

PB2 SPI1_SPCK TIOA4 I/O I with Pull-up

PB3 SPI1_NPCS0 TIOA5 I/O I with Pull-up

PB4 TXD0 I/O I with Pull-up

PB5 RXD0 I/O I with Pull-up

PB6 TXD1 TCLK1 I/O I with Pull-up

PB7 RXD1 TCLK2 I/O I with Pull-up

PB8 TXD2 I/O I with Pull-up

PB9 RXD2 I/O I with Pull-up

PB10 TXD3 ISI_D8 I/O I with Pull-up

PB11 RXD3 ISI_D9 I/O I with Pull-up

PB12 TXD5 ISI_D10 I/O I with Pull-up

PB13 RXD5 ISI_D11 I/O I with Pull-up

PB14 DRXD I/O DRXD

PB15 DTXD I/O DTXD

PB16 TK0 TCLK3 I/O I with Pull-up

PB17 TF0 TCLK4 I/O I with Pull-up

PB18 TD0 TIOB4 I/O I with Pull-up

PB19 RD0 TIOB5 I/O I with Pull-up

PB20 RK0 ISI_D0 I/O I with Pull-up

PB21 RF0 ISI_D1 I/O I with Pull-up

PB22 DSR0 ISI_D2 I/O I with Pull-up

PB23 DCD0 ISI_D3 I/O I with Pull-up

PB24 DTR0 ISI_D4 I/O I with Pull-up

PB25 RI0 ISI_D5 I/O I with Pull-up

PB26 RTS0 ISI_D6 I/O I with Pull-up

PB27 CTS0 ISI_D7 I/O I with Pull-up

PB28 RTS1 ISI_PCK I/O I with Pull-up

PB29 CTS1 ISI_VSYNC I/O I with Pull-up

PB30 PCK0 ISI_HSYNC I/O I with Pull-up

PB31 PCK1 ISI_MCK I/O I with Pull-up

Peripheral B Comments Reset State Boot State

GE863-PRO

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ARM PIO Controller C multiplexing

IO line Peripheral

PC0 SCK3 AD0 I/O I with Pull-up

PC1 PCK0 AD1 I/O I with Pull-up

PC2 PCK1 AD2 I/O I with Pull-up

PC3 SPI1_NPCS3 AD3 I/O I with Pull-up

PC4 A23 SPI1_NPCS2 A23 I with Pull-up

PC5 A24 SPI1_NPCS1 A24 I with Pull-up

PC6 TIOB2 CFCE1 I/O I with Pull-up

PC7 TIOB1 CFCE2 I/O I with Pull-up

PC8 NCS4/CFCS0 RTS3 I/O I with Pull-up

PC9 NCS5/CFCS1 TIOB0 I/O I with Pull-up

PC10 A25/CFRNW CTS3 A25 I with Pull-up

PC11 NCS2 SPI0_NPCS1

PC12 IRQ0 NCS7 I/O I with Pull-up

PC13 FIQ NCS6 I/O I with Pull-up

PC14 NCS3/NANDCS IRQ2 I/O I with Pull-up

PC15 NWAIT IRQ1 I/O I with Pull-up

PC16 D16 SPI0_NPCS2 I/O

PC17 D17 SPI0_NPCS3 I/O

PC18 D18 SPI1_NPCS1 I/O I with Pull-up

PC19 D19 SPI1_NPCS2 I/O I with Pull-up

PC20 D20 SPI1_NPCS3 I/O I with Pull-up

PC21 D21 EF100 I/O I with Pull-up

PC22 D22 TCLK5 I/O I with Pull-up

PC23 D23

PC24 D24 NOT AVAILABLE on the Balls I/O -

PC25 D25 NOT AVAILABLE on the Balls I/O -

PC26 D26 NOT AVAILABLE on the Balls I/O -

PC27 D27 NOT AVAILABLE on the Balls I/O -

PC28 D28 I/O I with Pull-up

PC29 D29

PC30 D30 I/O I with Pull-up

PC31 D31 I/O I with Pull-up

Peripheral B Comments Reset State Boot State

Connected to internal dataflash

CS line

NOT AVAILABLE on the Balls

Enable of 6MHz internal ARM

Oscillator (active High)

NOT AVAILABLE on the Balls

GPIO that goes High and can be

connected externally keep ARM

powered ON

I/O SPI0_NPCS1

I/O O HIGH

SPI0_NPCS2

with pull-up

SPI0_NPCS3

with pull-up

GE863-PRO

TIP: For further documentation on ARM processor refer to ATMEL AT91SAM9260 datasheet

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4 Hardware Commands

4.1 Turning ON the GE863-PRO3 GSM/GPRS Engine

To turn on the GE863-PRO3 GSM/GPRS engine the pad ON/OFF*-GSM must be tied low for at least 1 second and then released. The maximum current that can be drained from the A simple circuit to do it is:

ON/OFF*-GSM pad is 0,1 mA.

ON#

Power ON impulse

GND

NOTE: don't use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper power on/off of the module. The line ON# must be connected only in open collector configuration.

NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with a "*" or with a bar over the name.

NOTE: The GE863-PRO on the VBATT pads).

TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line raised up the device could be considered powered on. PWRMON line rises up also when supplying power to the Charge pad

turns fully on also by supplying power to the Charge pad (Module provided with a battery

GE863-PRO

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For example: 1- Let's assume you need to drive the ON/OFF*-GSM pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

10k

+1,8/5 V

2- Let's assume you need to drive the ON/OFF*-GSM pad directly with an ON/OFF button:

GE863-PRO

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4.2 Turning OFF the GE863-PRO3 GSM/GPRS Engine

The turning off of the device can be done in two ways:

• by software command (see GE863- GE863-PRO

• by hardware shutdown

When the device is shut down by software command or by hardware shutdown, it issues to the network a detach request that informs the network that the device will not be reachable any more.

4.2.1 Hardware shutdown

To turn OFF the GE863-PRO3 the pad ON/OFF*-GSM must be tied low for at least 1 second and then released.

The same circuitry and timing for the power on shall be used. The device shuts down after the release of the ON/OFF*-GSM pad.

TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When PWRMON goes low, the device has powered off.

Software User Guide)

4.3 Hardware Unconditional Reboot of GSM/GPRS Engine

To unconditionally Reboot the GE863-PRO3, the pad RESET*-GSM must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the RESET*-GSM pad is 0,15 mA. A simple circuit to do it is:

Unconditional Reboot impulse

RESET*-GSM

GND

GE863-PRO

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NOTE: don't use any pull up resistor on the RESET*-GSM line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper functioning of the module. The line RESET*-GSM must be connected only in open collector configuration.

TIP: The unconditional hardware reboot should be always implemented on the boards and software should use it as an emergency exit procedure.

For example: 1- Let's assume you need to drive the RESET*-GSM ( RESET ) pad with a totem pole output of a +1.8/5 V microcontroller (uP_OUT2):

10k

4.4 Turning ON/OFF the GE863-PRO3 ARM

To turn on the GE863-PRO3 ARM the pad ON/OFF*-AP must be tied low and kept low, when pin is raised ( released ) the ARM will shutdown. The maximum current that can be drained from the

ON/OFF*-AP pad is 0,1 mA.

GE863-PRO

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A simple circuit to do it is:

ON/OFF*-AP #

Power ON/OFF

GND

NOTE: don't use any pull up resistor on the ON/OFF*-AP line, it is internally pulled up to VBATT2. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper power

on/off of the module. The line ON/OFF*-AP must be connected only in open collector configuration or tied to ground (if ARM needs to stay always on).

NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with a "*" or with a bar over the name.

TIP: To check if the device has powered on, the hardware line 3.1V_OUT can be monitored.

It is possible to use also the SHDN line to turn ON the device with the ARM RTC trigger by connecting it to the ON/OFF*-AP pin through a transistor buffer. After the Initial bootstrap, the line PC29 goes HIGH allowing the device to keep itself on; If you need a toggle command to turn on/off the device, then you can use the line PC29 to keep the ARM on after it’s start-up and connect the on/off button to the ON/OFF*-AP pin through a buffer transistor while connecting it to a GPIO to sense it’s toggling (e.g. PC31) for shutting down the ARM by lowering the PC29 pin.

TIP: To Keep the ARM ON you can use the PC29 pin that goes high right after the bootstrap

GE863-PRO

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5 Power Supply

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

In the GE863-PRO have been kept separate, VBATT is the input for the GSM/GPRS part, VBATT2 is the input for ARM. It is possible to connect together the two power inputs since they have compatible ranges, but if it is desired the two power supplies can be kept separate. The only power supply in common between the ARM and GSM/GPRS engine is the RTC voltage which is generated by the GSM/GPRS engine from VBATT power source and supplies both the GSM RTC and the ARM VDDBU part including the shutdown controller, RTC, 32 KHz oscillator. For this reason if it is planned to remove VBATT power supply, then a backup battery shall be provided on VTRC pin that guarantees that VRTC is still available.

NOTE: if you plan to remove VBATT power source, then you must provide an appropriate backup battery/capacitor on the VRTC pin in order to be able to turn on properly the ARM part when supplying VBATT2 only power pin.

the power supply inputs of the GSM/GPRS engine and the ARM processor part

5.1 GSM Power Supply Requirements

POWER SUPPLY

Nominal Supply Voltage 3.8 V Max Supply Voltage 4.2 V Supply voltage range 3.4 V - 4.2 V

GE863-PRO3GSM Engine

Mode Average (mA) Mode description

IDLE mode

AT+CFUN=1 24,0 Normal mode: full functionality of the module AT+CFUN=4 22,0 Disabled TX and RX; module is not registered on the network

Power saving: CFUN=0 module registered on the network and can

receive voice call or an SMS; but it is not possible to send AT

AT+CFUN=0 or

AT+CFUN=5

RX mode

1 slot in downlink 53,0 2 slot in downlink 66,0 3 slot in downlink 79,0 4 slot in downlink 89,0

7,20 / 3,561

commands; module wakes up with an unsolicited code (call or

SMS) or rising RTS line. CFUN=5 full functionality with power

saving; module registered on the network can receive incoming

Worst/best case depends on network configuration and is not under module control

Stand by mode; no call in progress

calls and SMS

GSM Receiving data mode

GE863-PRO

GSM TX and RX mode

GSM Sending data mode Min power level 78,0

Max power level 200,0

GPRS (class 10) TX and RX mode

GPRS Sending data mode Min power level 124,0

Max power level 371,0

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The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.

TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.

5.2 ARM Power Supply Requirements

POWER SUPPLY

Nominal Supply Voltage 3.8 V Operating Supply voltage range 3.4 V - 4.2 V Absolute Maximum voltage range 3.30 – 4.5 V

GE863-PRO

Mode Typical Average (mA) Mode description

Off < 2 μA (TBD)

Full Speed 140 (TBD)

Slow Clocking 1 (TBD) ARM is running on slow clock with peripherals disabled

ARM is operational at full speed 200MHz CPU Clock , Main Clock

100 MHz and all peripherals active

5.3 VRTC Backup supply

The RTC of the GSM/GPRS engine and the RTC & Shutdown controller of the ARM part are supplied by VRTC. This voltage supply is generated by a low quiescent current regulator inside the module that takes its power from VBATT pins. Since this voltage supply is needed to correctly boot the ARM part, if it is planned to remove the VBATT supply and still turn on the ARM part supplied by VBATT2, then an appropriate power supply must be provided to the VRTC pin.

To obtain several working years for the Real Time Clock of the GSM/GPRS engine and the RTC, 32KHz oscillator & Shutdown controller of the ARM part without VBATT power supply voltage, it is needed to make use of a lithium primary battery to supply the RTC circuits in the Telit Module.

The operative voltage for VRTC is lower than the voltage of primary lithium battery (3V nominal). It is therefore necessary to put a LDO voltage regulator in the circuit.

GE863-PRO

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The suggested circuit is:

GE863-PRO

VRTC

10K

3V Lithium primary battery

1μ

ceramic

S-817A19A

Seiko

1.2

μΑ

ceramic

The quoted current intensity are without VBATT power supply for the module. The S-817A19A Seiko LDO has a value of 1.2μA Typ for the quiescent current. Without VBATT power supply voltage, the VRTC Reverse Current is 7- 8 μA Typ. (depending on OSCSEL pin status) At ambient temperature 20°C, the BR2032 coin type (Panasonic 190 mAh) should be sufficient for 2-3 years with typical current intensity. The CR2032 coin type Panasonic 220 mAh) has an improved behaviour at low and high temperatures. When the VBATT voltage is present, the VRTC voltage exceeds the S-817 output voltage, so the current from the Lithium Primary Battery is only 1.2μA Typ (or less).

NOTE: the 2-3 years are given considering the worst case (VBATT always off)

5.4 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout

5.4.1 Electrical design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

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5.4.1.1 + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between the

input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power

generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks close to the GE863-PRO

, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at

least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO

from power polarity inversion.

An example of linear regulator with 5V input is:

GE863-PRO

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5.4.1.2 + 12V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the input

source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the GE863-PRO3.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable

because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when

choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at

least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in order

to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO

from power polarity inversion. This can be the same diode as for spike protection.

An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):

GE863-PRO

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5.4.1.3 Battery Source Power Supply Design Guidelines

• The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is

4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit GE863-PRO

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the GE863-PRO

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE863-PRO3. Their use can lead to overvoltage on the GE863-PRO3 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO

from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

module.

and damage it.

GE863-PRO

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• The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the

suggested capacity is from 500mAh to 1000mAh.

5.4.1.4 Battery Charge control Circuitry Design Guidelines

The charging process for Li-Ion Batteries can be divided into 4 phases:

• Qualification and trickle charging

• Fast charge 1 - constant current

• Final charge - constant voltage or pulsed charging

• Maintenance charge

The qualification process consists in a battery voltage measure, indicating roughly its charge status. If the battery is deeply discharged, that means its voltage is lower than the trickle charging threshold, then the charge must start slowly possibly with a current limited pre-charging process where the current is kept very low with respect to the fast charge value: the trickle charging. During the trickle charging the voltage across the battery terminals rises; when it reaches the fast charge threshold level the charging process goes into fast charge phase. During the fast charge phase the process proceeds with a current limited charging; this current limit depends on the required time for the complete charge and from the battery pack capacity. During this phase the voltage across the battery terminals still raises but at a lower rate. Once the battery voltage reaches its maximum voltage then the process goes into its third state: Final charging. The voltage measure to change the process status into final charge is very important. It must be ensured that the maximum battery voltage is never exceeded, otherwise the battery may be damaged and even explode. Moreover for the constant voltage final chargers, the constant voltage phase (final charge) must not start before the battery voltage has reached its maximum value, otherwise the battery capacity will be highly reduced. The final charge can be of two different types: constant voltage or pulsed. GE863-PRO voltage. The constant voltage charge proceeds with a fixed voltage regulator (very accurately set to the maximum battery voltage) and hence the current will decrease while the battery is becoming charged. When the charging current falls below a certain fraction of the fast charge current value, then the battery is considered fully charged, the final charge stops and eventually starts the maintenance. The pulsed charge process has no voltage regulation, instead the charge continues with pulses. Usually the pulse charge works in the following manner: the charge is stopped for some time, let's say few hundreds of ms, then the battery voltage will be measured and when it drops below its maximum value a fixed time length charging pulse is issued. As the battery approaches its full charge the off time will become longer, hence the duty-cycle of the pulses will decrease. The battery is considered fully charged when the pulse duty-cycle is less than a threshold value, typically 10%, the pulse charge stops and eventually the maintenance starts. The last phase is not properly a charging phase, since the battery at this point is fully charged and the process may stop after the final charge. The maintenance charge provides an additional charging process to compensate for the charge leak typical of a Li-Ion battery. It is done by issuing pulses with a fixed time length, again few hundreds of ms, and a duty-cycle around 5% or less. This last phase is not implemented in the GE863-PRO

internal charging algorithm, so that the battery once charged is left discharging down to a certain threshold so that it is cycled from full charge to slight discharge even if the battery charger is always inserted. This guarantees that anyway the remaining charge in the battery is a good percentage and that the battery is not damaged by keeping it always fully charged (Li-Ion rechargeable battery usually deteriorate when kept fully charged).

uses constant

GE863-PRO

Last but not least, in some applications it is highly desired that the charging process restarts when the battery is discharged and its voltage drops below a certain threshold, GE863-PRO

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internal charger

does it.

As you can see, the charging process is not a trivial task to be done; moreover all these operations should start only if battery temperature is inside a charging range, usually 5°C - 45°C. The GE863-PRO

measures the temperature of its internal component, in order to satisfy this last requirement, it's not exactly the same as the battery temperature but in common application the two temperature should not differ too much and the charging temperature range should be guaranteed.

NOTE: For all the threshold voltages, inside the GE863-PRO3 all thresholds are fixed in order to maximize Li-Ion battery performances and do not need to be changed.

NOTE: In this application the battery charger input current must be limited to less than 400mA. This can be done by using a current limited wall adapter as the power source.

NOTE: When starting the charger from Module powered off the startup will be in CFUN4; to activate the normal mode a command AT+CFUN=1 has to be provided. This is also possible using the POWER ON. There is also the possibility to activate the normal mode using the ON/OFF* signal.

In this case, when HW powering off the module with the same line (ON/OFF*) and having the charger still connected, the module will go back to CFUN4.

GE863-PRO

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5.4.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

• Average current consumption during transmission @PWR level max: 500mA

• Average current consumption during transmission @ PWR level min: 100mA

• Average current during Power Saving: 4mA

• Average current during idle (Power Saving disabled) 24mA

• Average current consumption of ARM@ full speed 140 mA

NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 500mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 500mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the GE863-PRO during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the GE863-PRO ensure that your application can dissipate it.

, you can consider it to be during transmission 1W max

; you must

GE863-PRO

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5.4.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit GE863-PRO

in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple, provided the PCB trace from the capacitor to the GE863-PRO

is wide enough to ensure a

dropless connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source is

drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure

a minimum voltage drop occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit GE863-PRO

, then this noise is not so disturbing and power

supply layout design can be more forgiving.

• The PCB traces to the GE863-PRO

and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.

power input pads or

• The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that

the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

GE863-PRO

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6 Antenna

The antenna connection and board layout design are the most important part in the full product design and they strongly reflect on the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

6.1 GSM Antenna Requirements

As suggested on the Product Description the antenna and antenna line on PCB for a Telit GE863-

PRO

device shall fulfil the following requirements:

ANTENNA REQUIREMENTS

Frequency range

Bandwidth

Gain Impedance Input power VSWR absolute max VSWR recommended

When using the Telit GE863-PRO must be connected to the GE863-PRO transmission line.

In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the GE863-PRO connector.

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band Gain < 3dBi 50 Ω > 2 W peak power <= 10:1

<= 2:1

, since there's no antenna connector on the module, the antenna

through the PCB with the antenna pad using a 50 Ω

, then a PCB line is needed in order to connect with it or with its

GE863-PRO

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This line of transmission shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS Impedance Max Attenuation

50 ohm 0,3 dB

No coupling with other signals allowed Cold End (Ground Plane) of antenna shall be equipotential to the GE863-PRO3 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply to the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the GE863-PRO

module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.

6.2 GSM Antenna - PCB line Guidelines

• Ensure that the antenna line impedance is 50 ohm;

• Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less

than 0,3 dB;

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

• Keep, if possible, one layer of the PCB used only for the Ground plane;

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other

signal tracks facing directly the antenna line track;

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least;

• Place EM noisy devices as far as possible from GE863-PRO

• Keep the antenna line far away from the GE863-PRO

• If you have EM noisy devices around the PCB hosting the GE863-PRO ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of GE863-PRO superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;

antenna line;

power supply lines;

, such as fast switching

, by using a strip-line on the

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6.3 GSM Antenna - installation Guidelines

• Install the antenna in a place covered by the GSM signal.

• The Antenna must be installed to provide a separation distance of at least 20 cm from all persons

and must not be co-located or operating in conjunction with any other antenna or transmitter;

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

6.4 Electro Magnetic Interference - Guidelines

The GE863-PRO3 has been particularly designed in order to keep to a minimum the Electro Magnetic Interferences between the ARM part and the GSM/GPRS engine, however especially the ARM part remains a noisy device that must be threaten with care in order to avoid that its EMI affect the GPRS part through an external coupling.

Therefore:

• Keep fast ARM lines far away from Antenna line in order to avoid direct coupling;

• Keep fast ARM lines buried in the inner layers, with Ground Layers [fenced with vias] on the

top/bottom layers;

• If your lines are long, place a series resistor [ in the range of 47Ω – 100 Ω ] close to the GE863-

• If your PCB lines are very long, place a terminator resistor close to the device line end.

PRO

ARM ball to reduce the ringing and the EM emissions of the signal

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6.5 Logic level specifications

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following

table shows the logic level specifications used in the Telit GE863-PRO

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any

digital pin when on

Input voltage on

analog pins when on

Voltage on Buffered

pins

-0.3V +3.6V

-0.3V +3.0 V

-0.3V 25V

Operating Range - Interface levels (CMOS 2.8V)

Level Min Max

Input high level 2.1V 3.3V

Input low level 0V 0.5V

Output high level 2.2V 3.0V

Output low level 0V 0.35V

Operating Range - Interface levels (CMOS 1.8V)

Level Min Max

Input high level 1.6V 3.3V

Input low level 0V 0.4V

Output high level 1,65V 2.2V

Output low level 0V 0.35V

Operating Range - Interface levels (CMOS 3.1V)

Level Min Max

Input high level 2.0V 3.4V

Input low level -0.3V 0.8V

Output high level 2.7V 3.2V

Output low level 0V 0.4V

interface circuits:

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Operating Range - Interface levels (CMOS 1.8V-ARM)

Level Min Max

Input high level 1.3V 2.1V

Input low level -0.3V 0.5V

Output high level 1.35V 1.9V

Output low level 0V 0.45V

Operating Range - Interface levels (CMOS VRTC)

Level Min Max

Input high level 1.3V 2.1V

Input low level -0.3V 0.5V

Output high level 1.3V 2.0V

Output low level 0V 0.5V

GSM GPIO Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA

CMOS 3.1V Current characteristics

Level Typical

Max Output Current 16 mA

Input Current 1uA

CMOS 1.8V-A Current characteristics

Level Typical

Max Output Current 4 mA

Input Current 1uA

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6.5.1 GSM Reset signal

Signal Function I/O Bga Ball

RESET*-GSM

RESET*-GSM is used to reset the GE863-PRO3 modules GSM/GPRS engine. Whenever this signal is pulled

low, the GSM/GPRS engine is reset. When the device is reset it stops any operation. After the release of the reset the GSM/GPRS engine is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the Reset signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The RESET*-GSM is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device

already on that is not responding to any command.

NOTE: do not use this signal to power off the GE863-PRO3 GSM/GPRS engine. Use the ON/OFF*-GSM signal to perform this function or the AT#SHDN command.

Reset Signal Operating levels:

Signal Min Max

RESET Input high 2.0V* 2.2V

RESET Input low 0V 0.2V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.

Phone reset I E5

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7 Serial Ports

The serial port on the Telit GE863-PRO3 is the core of the interface between the module engine and the ARM processor.

2 serial ports are available on the module engine:

• MODEM SERIAL PORT

• MODEM SERIAL PORT 2 (DEBUG)

6+1(DBG) serial ports are available on the ARM part.

No direct connection is present between the two parts, on the hosting PCB the two serial ports need to be interconnected. It is up to the user to select whatever serial port is most suited on the ARM part to exchange data with the GSM/GPRS engine; however the USART0 port on the ARM is the only supporting the full RS232 line signaling and should be preferred. In the ball-out of the GE863-PRO placed one next the other, allowing an easy routing of the connection.

the balls of the MODEM SERIAL port and ARM USART0 are

7.1 MODEM SERIAL PORT

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

• RS232 PC com port

• microcontroller UART @ 2.8V – 3.1V (Universal Asynchronous Receive Transmit)

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. The only configuration that doesn't need a level translation is the 2.8V –

3.1V UART and hence the GE863-PRO

serial port @ 3.1V CMOS. The serial port on the GE863-PRO While the serial ports on the ARM part are +3.1V UART. GE863-PRO levels.

serial ports differ from the PC-RS232 in the signal polarity (RS232 is reversed) and

GSM/GPRS engine can be directly connected with the ARM

GSM/GPRS engine is a +2.8V UART with all the 7 RS232 signals,

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The signals of the GE863-PRO

GSM/GPRS engine serial port are:

GE863-PRO

RS232 Pin

Number

1 DCD -

2 RXD -

3 TXD -

4 DTR -

5 GND All GND Ground Ground 6 DSR -

7 RTS -

8 CTS -

9 RI -

Signal

dcd_uart

tx_uart

rx_uart

dtr_uart

dsr_uart

rts_uart

cts_uart

ri_uart

GE863-PRO3

Ball

C7 Data Carrier Detect Output from the GE863-PRO3 GSM/GPRS engine

E10 Transmit line *see Note Output transmit line of GE863- PRO3 GSM/GPRS

E9 Receive line *see Note Input receive of the GE863- PRO3 GSM/GPRS

C6 Data Terminal Ready Input to the GE863- PRO3 GSM/GPRS engine that

C5 Data Set Ready Output from the GE863- PRO3 GSM/GPRS engine

C8 Request to Send Input to the GE863- PRO3 GSM/GPRS engine that

C9 Clear to Send Output from the GE863- PRO3 GSM/GPRS engine

C4 Ring Indicator Output from the GE863- PRO3 GSM/GPRS engine

Name Usage

that indicates the carrier presence

engine

controls the DTE READY condition

that indicates the module is ready

controls the Hardware flow control

that controls the Hardware flow control

that indicates the incoming call condition

NOTE: According to V.24, RX/TX signal names are referred to the application side, therefore on the GE 863-PRO

GSM/GPRS engine side these signal are on the opposite direction: TXD on the ARM application side will be connected to the receive line (here named TXD/ rx_uart ) of the GE863-PRO3 GSM/GPRS engine serial port and viceversa for RX.

TIP: For a minimum implementation, only the TXD and RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.

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7.2 RS232 level translation

In order to interface the Telit GE863-PRO3 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must

• invert the electrical signal in both directions

• change the level from 0/3V to +15/-15V

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562) , allowing for a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of driver and receiver and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-3V UART level to the RS232 level, while the receiver is the translator from RS232 level to 0-3V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 driver

• 3 receiver

NOTE: The digital input lines working at 2.8V/3.1VCMOS have an absolute maximum input voltage of 3,75V; therefore the level translator IC shall not be powered by the +3.8V supply of the module. Instead it shall be powered from a +2.8V / +3.1V (dedicated or 3.1V_OUT) power supply. This is because in this way the level translator IC outputs on the module side (i.e. GE863-PRO3 inputs) will work at +3.8V interface levels, stressing the module inputs at its maximum input voltage. This can be acceptable for evaluation purposes, but not on production devices.

NOTE: In order to be able to do in circuit reprogramming of the GE863-PRO3 GPRS firmware, the serial port on the Telit GE863-PRO3 shall be available for translation into RS232 and either it's controlling ARM device shall be placed into tristate, disconnected or as a gateway for the serial data when module reprogramming occurs. Only RXD, TXD, GND and the On/off module turn on pad are required to the reprogramming of the module, the other lines are unused. All applicator shall include in their design such a way of reprogramming the GE863-PRO3.

NOTE: In order to be able to do in circuit reprogramming of the GE863-PRO3 ARM Application software, the serial port DEBUG on the Telit GE863-PRO3 shall be available for translation into RS232 when module reprogramming occurs. Only DRXD, DTXD, GND and the ON/OFF*-AP module turn on pad are required to the reprogramming of the module, the other lines are unused. All applicator shall include in their design such a way of reprogramming the GE863-PRO3.

An example of level translation circuitry of this kind is:

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GE863-PRO

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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8 Audio Section Overview

The Base Band Chip of the GE863-PRO3 GSM/GPRS engine provides two different audio blocks; both

in transmit (Uplink) and in receive (Downlink) direction:

“MT lines” should be used for handset function, “HF lines” is suited for hands -free function (car kit).

These two blocks can be active only one at a time, selectable by AT command. The audio characteristics are equivalent in transmit blocks, but are different in the receive ones and this should be kept in mind when designing.

8.1 INPUT LINES (Microphone)

8.1.1 Short description

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active at a time, selectable by AXE hardware line or by AT command.

You must keep in mind the different audio characteristics of the transmit blocks when designing:

The “MIC_MT” audio path should be used for handset function, while the “MIC_HF” audio path is

suited for hands-free function (car kit).

TIP: being the microphone circuitry the more noise sensitive, its design and layout must be done with particular care. Both microphone paths are balanced and the OEM circuitry should be balanced designed to reduce the common mode noise typically generated on the ground plane. However also an unbalanced circuitry can be used for particular OEM application needs.

TIP: due to the difference in the echo canceller type, the “Mic_MT” audio path is suited for Handset applications, while the “Mic_HF”audio path is suited for hands-free function (car kit). The Earphone applications should be made using the “Mic_HF” audio path but DISABLING the echo canceller by software AT command. If the echo canceller is left active with the Earphone, then some echo might be introduced by the echo cancel algorithm.

provides two audio paths in transmit section. Only one of the two paths can be

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8.1.2 Input Lines Characteristics

“MIC_MT” 1st differential microphone path

Line Coupling AC*

Line Type Balanced

Coupling capacitor ≥ 100nF

Differential input resistance 50kΩ

Differential input voltage ≤ 1,03Vpp (365mV

Microphone nominal sensitivity -45 dBV

Analog gain suggested + 20dB

Echo canceller type Handset

rms

“MIC_HF” 2nd differential microphone path

Line Coupling AC*

Line Type Balanced

Coupling capacitor ≥ 100nF

Differential input resistance 50kΩ

Differential input voltage ≤ 65mVpp (23mV

Microphone nominal sensitivity -45 dBV

Analog gain suggested +10dB

Echo canceller type Car kit hands-free

rms

(*) WARNING: AC means that the signals from microphone has to be connected to input lines of the module by a CAPACITOR, which value must be ≥ 100nF. Not respecting this constraint,

the input stage will be damaged.

/Pa

rms

)

8.2 OUTPUT LINES (Speaker)

8.2.1 Short description

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active at a time, selectable by AXE hardware line or by AT command.

You must keep in mind the different audio characteristics of the receive blocks when designing:

the “EAR_MT” lines EPN1 and EPP1 are the Differential Line-Out Drivers ; they can drive an

external amplifier or directly a 16 Ω earpiece at –12dBFS (*) ;

Æ the “EAR_HF” lines EPPA1_2 and EPPA2 are the Fully Differential Power Buffers ; they can directly drive a 16Ω speaker in differential (balanced) or single ended (unbalanced) operation mode .

(*) FS : acronym of Full Scale. It is equal to 0dB, the maximum Hardware Analog Receive Gain of

BaseBand Chip.

The “EAR_MT” audio path should be used for handset function, while the “EAR_HF” audio path is

suited for hands-free function (car kit).

Both receiver outputs are B.T.L. type (Bridged Tie Load) and the OEM circuitry shall be designed bridged to reduce the common mode noise typically generated on the ground plane and to get the maximum power output from the device; however also a single ended circuitry can be designed for particular OEM application needs.

provides two audio paths in receive section. Only one of the two paths can be

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8.2.2 Output Lines Characteristics

“EAR_MT” Differential Line-out Drivers Path

Line Coupling DC

Line Type Bridged

Output load resistance ≥ 14 Ω

Internal output resistance 4 Ω (typical)

Signal bandwidth 150 – 4000 Hz @ -3 dB

Differential output voltage 328mVrms /16 Ω @ -12dBFS

SW volume level step - 2 dB

Number of SW volume steps 10

“EAR_HF” Power Buffers Path

Line Coupling DC

Line Type Bridged

Output load resistance ≥ 14 Ω

Internal output resistance 4 Ω ( >1,7 Ω )

Signal bandwidth 150 – 4000 Hz @ -3 dB

Max Differential output voltage 1310 mV

Max Single Ended output voltage 656 mV

SW volume level step - 2 dB

Number of SW volume steps 10

NOTE: For more detailed information about audio please consult Audio Settings Application Note 80000nt10007a.

(typ, open circuit)

rms

(typ, open circuit)

rms

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9 The Evaluation Kit for Telit GE863-

PRO

9.1.1 Short Description

Telit supplies the Evaluation Kit for Telit GE863-PRO

own applications based on GE863-PRO

The GE863-PRO

with RF antenna connectors.

It provides a fully functional solution for a complete M2M application. The motherboard has a power supply and is equipped with SIM card housing, RS 232 serial port level translator, direct USB2.0 Host & Device connection, Smartcard ISO7816 slot, SD-MMC Card slot and 10/100 Mb Ethernet.

The only items you have to provide are:

1) a personal computer or microcontroller ;

2) a SIM card with a valid Network subscription;

3) a power supply

The connection between the GE863-PRO

RS232 ports.

The communications between the application ARM and Telit GSM/GPRS engine is realized connecting the Asynchronous Serial Interfaces of the module’s ARM&GSM/GPRS by setting appropriately the Jumpers. Furthermore the communications between ARM and GSM/GPRS can be analyzed with two “sniffed” serial ports that can report both sides of the ARM-GSM/GPRS serial channel.

Modules

Telit module.

EVK is formed by a mother board and a dedicated Telit module Interface Board

EVK and your PC (or other DTE) are realized by standard

modules to assist the designer in developing his

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10 GSM/GPRS General Purpose I/O

The general purpose I/O pads can be configured to act in three different ways:

• input

• output

• alternate function (internally controlled)

The following GSM/GPRS engine GPIO are available on the GE863-PRO

Ball Signal I/O Function Type

E6 GPIO1 I/O GPIO01 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

55 GPIO2 I/O GPIO02 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT HIGH HIGH 4.7K Pull Up

32 GPIO3 I/O GPIO03 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

53 GPIO4 I/O GPIO05 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

54 GPIO5 I/O GPIO06 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

51 GPIO6 I/O GPIO07 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

6 GPIO7 I/O GPIO08 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

5 GPIO8 I/O GPIO09 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

4 GPIO9 I/O GPIO10 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

Input / output

current

Default

State

Input pads can only be read and report the digital value (high or low) present on the pad at the read time; output pads can only be written or queried and set the value of the pad output; an alternate function pad is internally controlled by the GE863-PRO

firmware and acts depending on the function

implemented.

All GPIO pads are 2.8V CMOS signals and their interface levels are the same specified in the paragraph 6.5.

ON/OFF

state

State

during

Reset

Note

Alternate function

(JDR)

Alternate function

(RFTXMON)

Alternate function

(BUZZER)

Alternate function (RF Transmission

Control)

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10.1 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 2.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 2.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to

2.8V.

10.2 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.

10.3 Using the RF Transmission Control GPIO7

The GPIO7 pin, when configured as RF Transmission Control Input, permits to disable the Transmitter when the GPIO is set to Low by the application.

10.4 Using the RFTXMON Output GPIO3

The GPIO3 pin, when configured as RFTXMON Output, is controlled by the GE863-PRO3 module and will rise when the transmitter is active and fall after the transmitter activity is completed. For example, if a call is started, the line will be HIGH during all the conversation and it will be again LOW after hanged up.

The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1sec after last TX burst.

10.5 Using the Alarm Output

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The GSM/GPRS engine GPIO pads, when configured as Alarm Output, can be controlled by the GE863-PRO command. This output can be used to power up the GE863-PRO you the possibility to program a timely system wake-up to achieve some periodic actions and completely turn off both the application processor and the GE863-PRO

module and will rise when the alarm starts and fall after the issue of a dedicated AT

application processor at the alarm time, giving

during sleep periods, dramatically reducing the sleep consumption to few μA. In battery-powered devices this feature will greatly improve the autonomy of the device.

10.6 Using the Buzzer Output GPIO4

The GPIO4 pad, when configured as Buzzer Output, is controlled by the GE863-PRO3 module and will drive with appropriate square waves a Buzzer driver. This permits to your application to easily implement Buzzer feature with ringing tones or melody played at the call incoming, tone playing on SMS incoming or simply playing a tone or melody when needed by your application.

A sample interface scheme is included below to give you an idea of how to interface a Buzzer to the GPIO7:

NOTE: To correctly drive a buzzer a driver must be provided, its characteri stics depend on the Buzzer and for them refer to your buzzer vendor.

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10.7 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. In the GE863 modules, the STAT_LED usually needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.

LED status Device Status

Permanently off Device off

Fast blinking (Period 1s, Ton 0,5s) Slow blinking (Period 3s, Ton 0,3s) Permanently on a call is active

Net search / Not registered / turning off Registered full service

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10.8 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

10.9 VAUX1 power output

A regulated power supply output is provided in order to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are:

Operating Range – VAUX1 power supply

Min Typical Max

Output voltage

2.75V 2.85V 2.95V

Output current

Output bypass capacitor

100mA

2.2μF

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11 Mounting the GE863-PRO3 on the

Application Board

11.1 General

The Telit GE863-PRO

process

module has been designed in order to be compliant with a standard lead-free SMT

11.1.1 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm.

11.1.2 PCB pad Design

“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

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Recommendations for PCB pad dimensions

Ball pitch [mm] Solder resist opening diameter A [mm] Metal pad diameter B [mm]

2 1,150 1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni / Immersion Au

3 –7 /

0.05 – 0.15

good solder ability protection, high shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

11.1.3 Solder paste

Solder paste

Lead free

Sn/Ag/Cu

11.1.4 GE863-PRO3 Solder Reflow

The following is the recommended solder reflow profile

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Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP)

Preheat: – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts)

Tsmax to TL: – Ramp-up Rate

Time maintained above: – Temperature (TL) – Time (tL)

Peak Temperature (Tp):

Time within 5°C of actual Peak Temperature (tp)

Ramp-down Rate

3°C/second max

150°C 200°C

60-180 seconds

3°C/second max

217°C

60-150 seconds

245 +0/-5°C

10-30 seconds

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE863-PRO3 module can accept only one reflow process

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11.1.5 Packing System

According to SMT processes for pick & place movement requirements, Telit GE863-PRO3 modules are

packaged on trays, each tray contains 20 pieces. Tray dimensions are:

320 ± 0,3

All quotes are in mm, general tolerance ± 0.1

Note that trays can withstand a maximum temperature of 65° C.

Sec t io n A-A

170 ± 0,3

6.1

Modules orientation on tray:

GE863-PRO

Ref. Not rounded corner of module’s printed board indicates pin 1 corner.

The modules in the tray are oriented as shown in A and the tray is oriented toward left as shown in B.

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11.1.6 Moisture Sensibility

The level of moisture sensibility of Telit GE863-PRO

J-STD-020, take care of all the relative requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) The shelf life of GE863 inside of the dry bag shall be 12 month from the bag seal date, when stored in a non-condensing atmospheric environment of <40°C / 90% RH

b) Environmental condition during the production: ≤ 30°C / 60% RH according to IPC/JEDEC J-STD033A paragraph 5

c) The maximum time between the opening of the sealed bag and the reflow process shall be 168 hours if the condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) A baking is required if conditions b) or c) are not respected

e) A baking is required if the humidity indicator inside the bag indicates 10% RH or more

modules is “3”, according with standard IPC/JEDEC

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12 Conformity Assessment Issues

The GE863-PRO3 module is assessed to be conform to the R&TTE Directive as stand-alone products, so If the module is installed in conformance with Dai Telecom installation instructions require no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of a

R&TTE Directive Notified Body for the final product.

In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating

the radio module must be assessed against Article 3.2 of the R&TTE Directive.

In all cases assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements.

The GE863-PRO

• R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)

• Low Voltage Directive 73/23/EEC and product safety

• Directive 89/336/EEC for conformity for EMC

In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the GE863-PRO module is compliant with the following standards:

module is conformed with the following European Union Directives:

• GSM (Radio Spectrum). Standard: EN 301 511 and 3GPP 51.010-1

• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-7

• LVD (Low Voltage Directive) Standards: EN 60 950

In this document and the Hardware User Guide, Software User Guide all the information you may need for developing a product meeting the R&TTE Directive is included.

The GE863-PRO

module is conformed with the following US Directives:

• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)

• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15

To meet the FCC's RF exposure rules and regulations:

- The system antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all the persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

- The system antenna(s) used for this module must not exceed 3 dBi for mobile and fixed or mobile operating configurations.

- Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and to have their complete product tested and approved for FCC compliance.

GE863-PRO

Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

13 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

14 Document Change Log

GE863-PRO

1vv0300773a Rev. 0 - 24/01/08

Hardware User Guide

RReevviissiioonn

ISSUE #0 24/01/08 First release

DDaattee

CChhaan

geess

Telit Wireless Solutions 1vv0300773a User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual