Telit Communications S p A ZE51 User Manual
ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
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ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
DISCLAIMER
The information contained in this document is the proprietary information of Telit Communications S.p.A.
and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the
officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior
written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the
foregoing, Telit does not make any warranty as to the information contained herein, and does not accept
any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices characterized in this document,
and notes that the application of the device must comply with the safety standards of the applicable
country, and where applicable, with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document due to
typographical errors, inaccurate information, or improvements to programs and/or equipment at any time
and without notice. Such changes will, nevertheless be incorporated into new editions of this document.
Copyright: Transmittal, reproduction, dissemination and/or editing of this document as well as utilization
of its contents and communication thereof to others without express authorization are prohibited.
Offenders will be held liable for payment of damages. All rights are reserved.
© Copyright Telit RF Technologies 2011.
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
CONTENTS
CHAPTER I. INTRODUCTION ................................................................................................................... 6
I.1. AIM OF THE DOCUMENT .................................................................................................................................................................................... 6
I.2. REFERENCE DOCUMENTS ................................................................................................................................................................................. 7
I.3. DOCUMENT CHANGE LOG ................................................................................................................................................................................. 7
I.4. GLOSSARY ...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................ 9
II.1. REGULATIONS REQUIREMENTS ........................................................................................................................................................................ 9
II.2. FUNCTIONAL REQUIREMENTS........................................................................................................................................................................ 12
II.3. SOFTWARE .................................................................................................................................................................................................. 12
II.4. TEMPERATURE REQUIREMENTS .................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14
III.1. MECHANICAL CHARACTERISTICS ................................................................................................................................................................. 14
III.2. MECHANICAL DIMENSIONS ........................................................................................................................................................................... 15
III.3. DC CHARACTERISTICS ................................................................................................................................................................................ 16
III.4. FUNCTIONAL CHARACTERISTICS .................................................................................................................................................................. 17
III.5. DIGITAL CHARACTERISTICS ......................................................................................................................................................................... 20
III.6. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................................... 21
III.7. ORDERING INFORMATION ............................................................................................................................................................................ 22
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 23
IV.1. PIN-OUT OF THE SMD MODULE .................................................................................................................................................................... 23
IV.2. PIN-OUT OF THE DIP MODULE ...................................................................................................................................................................... 25
IV.3. CORRESPONDENCE ..................................................................................................................................................................................... 26
IV.4. DESCRIPTION OF THE SIGNALS ..................................................................................................................................................................... 27
CHAPTER V. PROCESS INFORMATION ............................................................................................... 28
V.1. DELIVERY ..................................................................................................................................................................................................... 28
V.2. STORAGE ..................................................................................................................................................................................................... 29
V.3. SOLDERING PAD PATTERN ............................................................................................................................................................................. 29
V.4. SOLDER PASTE COMPOSITION (ROHS PROCESS) ........................................................................................................................................... 31
V.5. PLACEMENT .................................................................................................................................................................................................. 31
V.6. SOLDERING PROFILE (ROHS PROCESS) ......................................................................................................................................................... 32
CHAPTER VI. BOARD MOUNTING RECOMMENDATION ..................................................................... 34
VI.1. ELECTRICAL ENVIRONMENT .......................................................................................................................................................................... 34
VI.2. POWER SUPPLY DECOUPLING ON ZE51/61-2.4 MODULE ............................................................................................................................... 35
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ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
VI.3. RF LAYOUT CONSIDERATIONS ...................................................................................................................................................................... 36
VI.4. ANTENNA CONNECTION ON PRINTED CIRCUIT BOARDS ............................................................................................................................. 37
VI.5. ZE51/61-2.4 INTERFACING : ........................................................................................................................................................................ 38
CHAPTER VII. ANTENNA CONSIDERATIONS....................................................................................... 41
VII.1. ANTENNA RECOMMENDATIONS ................................................................................................................................................................... 41
VII.2. ANTENNA MATCHING .................................................................................................................................................................................. 42
VII.3. ANTENNA TYPES ........................................................................................................................................................................................ 43
VII.4. EXTERNAL ANTENNA .................................................................................................................................................................................. 43
VII.5. EMBEDDABLE ANTENNAS ............................................................................................................................................................................ 45
CHAPTER VIII. ANNEXES ....................................................................................................................... 47
VIII.1. EXAMPLES OF PROPAGATION ATTENUATION ............................................................................................................................................... 47
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
CHAPTER I. INTRODUCTION
I.1. Aim of the Document
The aim of this document is to present the features and the application of the ZE51/61-2.4 radio module. After the
introduction, the characteristics of the ZE51/61-2.4 radio module will be described within the following distinct
chapters:
- Requirements
- General Characteristics
- Technical description
- Process information
- Board Mounting Recommendations
- Antenna Considerations
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g
I.2. Reference documents
ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
[1] IEEE Std. 802.15.4-2006
[2] ERC Rec 70-03
[3] EN 300 328-1 V1.7.1 (Europe)
[4] EN 300 440-1 V1.4.1 (Europe)
[5] 2002/95/EC
[6] CFR47 Part 15 (US)
[7] ARIB STD-T66 (Japan)
[8] Z-One Pro Protocol Stack User
Guide
[9] 2006/771/EC
[10] 2009/381/EC
[11] SR Manager Tool User Guide
Wireless MAC and PHY Specifications for Low Rate - WPANs
ERC Recommendation for SRD, June 2009
ETSI Standards for SRD , October 2006
ETSI Standards for SRD , March 2009
Directive of the European Parliament and of the Council, 27 January
2003
FCC Standards for SRD
ARIB Standards for SRD
1vv0300902
Harmonization of the radio spectrum for use by short-range devices
Amending Decision 2006/771/EC on harmonization of the radio
spectrum for use by short-range devices
1vv0300899
[12] ZigBee PRO Democase Getting
Started
[13] ZigBee PRO Democase User Guide
I.3. Document change log
RReevviissiioonn DDaattee
ISSUE # 0 11/05/10 First Release
ISSUE # 1 28/07/10 Added ZE61-2.4
ISSUE # 2 04/02/11 Updated regulation requirements and schematics in VI.5
ISSUE # 3 14/03/11 Added link for ZE51 USB dongle drivers, info regarding CC debugger.
ISSUE # 4 31/03/11 Added text regarding Conformity Assessment Issues FCC/IC
geess
n
CChhaan
Added in Annex paragraph regarding Conformity Assessment Issues
FCC/IC and Declaration of conformity
1vv0300901
1vv0300900
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I.4. Glossary
ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
ARIB
BER
Bits/s
CER
CEPT
CFR
Chips
dBm
EMC
DSSS
EPROM
ERC
ETR
ETSI
FCC
IEEE
ISM
KB
kbps
LBT
LNA
MAC
MHz
Mchip/s
PCB
PROM
PER
PHY
NRZ
RF
RoHS
RSSI
Rx
SRAM
SRD
SMD
Tx
Via
WPANs
Association of Radio Industries and Businesses
Bit Error Rate
Bits per second (1000 bits/s = 1Kbps = 1Kbaud)
Character Error Rate
European Conference of Postal and Telecommunications Administrations
Code of Federal Regulations
Chip or chip sequence refers to a spreading-code used to transform the original
data to DSSS
Power level in decibel milliwatt (10 log (P/1mW))
Electro Magnetic Compatibility
Direct Sequence Spread Spectrum
Electrical Programmable Read Only Memory
European Radiocommunications Committee
ETSI Technical Report
European Telecommunication Standard Institute
Federal Communications Commission
Institute of Electrical and Electronics Engineers
Industrial, Scientific and Medical
1024 bytes (1 byte = 8 bits)
kilobits/s
Listen Before Talk
Low Noise Amplifier
Medium Access Control
Mega Hertz (1 MHz = 1000 kHz)
Mega chips per second (A measure of the speed with which chips are generated
in DSSS)
Printed Circuit Board
Programmable Read Only Memory
Packet Error Rate
Physical Layer
Non return to Zero
Radio Frequency
Restriction of Hazardous Substances
Receive Strength Signal Indicator
Reception
Static Random Access Memory
Short Range Device
Surface Mounted Device
Transmission
Metal Hole on a printed circuit board
Wireless Personal Area Networks
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ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
CHAPTER II. REQUIREMENTS
II.1. Regulations requirements
The ZE51/61-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed
frequency band).
Europe Regulation:
The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth,
maximum power, duty cycle, channel spacing and type of application. It gives the following limitations:
Class Frequency
band
Annex 1h
(Non-Specific
Short range
Devices)
Annex 3a
(Wideband Data
Transmission
systems)
(*)Compliant to the EU Commission Decision [9], [10]. Techniques to access spectrum and mitigate interference
that provide at least equivalent performance to the techniques described in harmonized standards adopted under
Directive 1999/5/EC must be used.
(**) For IEEE802.15.4 DSSS modulation used by ZigBee, the modulated signal is spread over 2MHz. So, the
maximum radiated power is 20mW.
2400 – 2483.5
MHz
2400 – 2483.5
MHz
Maximum radiated power Channel
spacing
No channel
10 mW e.i.r.p.
100 mW e.i.r.p. and 100
mW/100 kHz e.i.r.p. density
applies when frequency
hopping modulation is used,
10 mW/MHz e.i.r.p. density
applies when other types of
modulation are used.(*)(**)
spacing
specified
No channel
spacing
specified.
Duty cycle Notes
No
restriction
For wide band
No
restriction
modulations other than
FHSS, the maximum
e.i.r.p. density is limited
to 10 mW/MHz
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz:
Country Restriction Reason/Remark
This subsection does not apply for the
Norway Implemented
geographical area within a radius of 20 km
from the centre of Ny-Ålesund
Russian
Federation
Bluetooth
Ukraine Limited implementation e.i.r.p. ≤100 mW
Restrictions for Wideband Data Transmission systems Annex 3a 2400-2483.5MHz:
Country Restriction Reason/Remark
Military Radiolocation use. Reforming of
Outdoor use limited to 10
France
mW e.i.r.p. within the
band 2454-2483.5 MHz
Italy
Ukraine Limited Implemented
Norway Implemented
Russian
Federation
the 2.4 GHz band has been ongoing in
recent years to allow current relaxed
regulation. Full implementation planned
2012
For private use, a general authorisation is
required if WAS/RLAN’s are used outside
own premises. For public use, a general
authorization is required
e.i.r.p. ≤100 mW with built-in antenna with
amplification factor up to 6 dBi
This subsection does not apply for the
geographical area within a radius of 20 km
from the centre of Ny-Ålesund
1. SRD with FHSS modulation
1.1. Maximum 2.5 mW e.i.r.p.
1.2. Maximum 100 mW e.i.r.p. Permitted for
use SRD for
outdoor applications without restriction on
installation height
only for purposes of gathering telemetry
information for
automated monitoring and resources
accounting systems.
Permitted to use SRD for other purposes for
outdoor applications only when the installation
height is not exceeding 10 m above the ground
surface.
1.3.Maximum 100 mW e.i.r.p. Indoor
applications
2. SRD with DSSS and other than FHSS
wideband
modulation
2.1. Maximum mean e.i.r.p. density is 2
mW/MHz. Maximum
100 mW e.i.r.p.
2.2. Maximum mean e.i.r.p. density is 20
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ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
mW/MHz. Maximum
100 mW e.i.r.p. Permitted to use SRD for
outdoor applications
only for purposes of gathering telemetry
information for
automated monitoring and resources
accounting systems or
security systems.
2.3. Maximum mean e.i.r.p. density is 10
mW/MHz. Maximum
100 mW e.i.r.p. Indoor applications
For the complete document please refer to [2
The 2.4 Ghz band is a harmonized band in most of Europe. So the product must be declared in compliance with
the harmonized ETSI standards EN 300 440 (Class 1h) or EN 300 228 (Class 3a).
Finally, the module complies with the new European Directive 2002/95/EC concerning the Restrictive Usage of
Hazardous Substances (RoHS).
] and EU Commission Decision [9], [10].
USA Regulation:
In the United States the FCC is responsible for the regulation of all RF devices. Our module intended for
unlicensed operation is regulated by CFR 47, Part 15 [6].
The 2.4 GHz band used for unlicensed radio equipment is regulated by section 15.247.
Japan regulation
In Japan the unlicensed use of short range devices in the 2.4 GHz ISM band is regulated by the ARIB standard
STD-T66 [7].
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
II.2. Functional Requirements
The ZE51/61-2.4 module is a complete solution from serial interface to RF interface. The ZE51/61-2.4 module has
a digital part and a RF part.
The digital part has the following functionalities:
- Communication interface
- I/O management
- Micro controller with embedded software
The RF part has the following functionalities:
- 2.4 GHz IEEE 802.15.4 compliant RF transceiver
- Half Duplex bi-directional link
- RF front-end component with low noise Rx amplification and Tx power amplification (ZE61-2.4 module
only)
II.3. Software
The ZE51/61-2.4 module is provided pre-flashed with Telit in-house ZigBee® PRO stack. Please refer to ZigBee
PRO Protocol Stack User Guide [8] for detail information.
In case the customer needs to develop his own software, different tools are available:
8051 compiler from IAR : http://www.iar.se/website1/1.0.1.0/244/1/
CC debugger: http://focus.ti.com/docs/toolsw/folders/print/cc-debugger.html
The technical support for these tools will be done by the providing company.
All necessary drivers for ZE51-2.4 Usb dongle can be found under the following link:
http://www.ftdichip.com/Drivers/VCP.htm
A complete correspondence table of the connections between the CC2530 and the pin out of the module, as well
as the connections to the included STM M24C64 EEPROM can be found in chapter IV.3.
In case, the customer wants to test the RF performances of the module, Telit can provide its own
proprietary test software that is available in the download zone together with description of all the
functionalities.
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II.4. Temperature Requirements
Minimum Typical Maximum Unit
Operating
Temperature - 40 25 + 85 °C
Relative humidity @ 25°C 20 75 %
Storage
Temperature - 40 25 + 85 °C
ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
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ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
CHAPTER III. GENERAL CHARACTERISTICS
III.1. Mechanical Characteristics
Size :
Height :
Weight :
PCB thickness:
Cover :
Components :
Connectors :
Mounting :
Number of pins :
Rectangular 26 x 15 mm
3 mm
1,7 g
0.8 mm
Dimensions : 21 x 14 x 2.2mm
Thickness : 200µm
All SMD components, on one side of the PCB.
The terminals allowing conveying I/O signals are half-moons located around.
SMD
Half moons on the 4 external sides
30
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III.2. Mechanical dimensions
ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
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