Telit Communications S p A XE866A1NA User Manual

Mod.0818 2017-01 Rev.0

LE866

Hardware Design Guide

1VV0301355 Rev. 3 – 2017-09-07

LE866 Hardware Design Guide

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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LE866 Hardware Design Guide

USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities”). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM

WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE

USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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LE866 Hardware Design Guide

LE866-SV1

LE866A1-NA

LE866A1-KK

LE866A1-JS

LE866A1-KS

APPLICABILITY TABLE

PRODUCTS

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Contents

NOTICE 2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

I. License Agreements ..................................................................... 3

II. Copyrighted Materials ................................................................... 3

III. High Risk Materials ....................................................................... 3

IV. Trademarks .................................................................................. 3

V. Third Party Rights ......................................................................... 3

APPLICABILITY TABLE ................................................................................ 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 9

Scope ................................ ........................................................... 9

Audience....................................................................................... 9

Contact Information, Support ........................................................ 9

Text Conventions ........................................................................ 10

Related Documents .................................................................... 11

2. GENERAL PRODUCT DESCRIPTION ...................................... 12

Overview..................................................................................... 12

Product Variants and Frequency Bands ...................................... 12

Target market ................................ ............................................. 13

Main features .............................................................................. 13

TX Output Power ........................................................................ 14

RX Sensitivity ............................................................................. 14

Mechanical specifications ........................................................... 15

2.7.1. Dimensions ................................................................................. 15

2.7.2. Weight ........................................................................................ 15

Temperature range ..................................................................... 15

3. PINS ALLOCATION ................................................................... 16

Pin-out ........................................................................................ 16

LGA Pads Layout ........................................................................ 23

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4. POWER SUPPLY ....................................................................... 24

Power Supply Requirements ....................................................... 24

Power Consumption ................................................................... 25

General Design Rules ................................................................. 26

4.3.1. Electrical Design Guidelines ....................................................... 26

4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 26

4.3.2. +12V Source Power Supply Design Guidelines .......................... 28

4.3.2.1. Battery Source Power Supply Design Guidelines ........................ 29

4.3.3. Thermal Design Guidelines ......................................................... 30

4.3.4. Power Supply PCB layout Guidelines ......................................... 31

RTC Bypass out .......................................................................... 33

VAUX Power Output ................................................................... 34

VDDIO_IN Power Input ............................................................... 35

3GPP Power Saving Mode (PSM) .............................................. 36

5. DIGITAL SECTION .................................................................... 37

Logic Levels ................................................................................ 37

Power On.................................................................................... 38

Power Off.................................................................................... 40

Unconditional Restart.................................................................. 41

Fast System Turn Off .................................................................. 44

5.5.1. Fast Turn Off by Hardware ......................................................... 44

5.5.2. Fast Shut Down by Software....................................................... 45

Communication ports .................................................................. 46

5.6.1. USB 2.0 HS ................................................................................ 46

5.6.2. Serial Ports ................................................................................. 47

5.6.2.1. MODEM SERIAL PORT 1 (USIF0) ............................................. 47

5.6.2.2. MODEM SERIAL PORT 2 (USIF1) ............................................. 49

5.6.2.3. RS232 LEVEL TRANSLATION ................................................... 49

General purpose I/O ................................................................... 51

5.7.1. Using a GPIO as INPUT ............................................................. 52

5.7.2. Using a GPIO as OUTPUT ......................................................... 53

5.7.3. Indication of network service availability ..................................... 53

5.7.4. SIMIN Detection .......................................................................... 54

External SIM Holder .................................................................... 55

ADC Converter ........................................................................... 55

DAC Converter ........................................................................... 56

5.10.1. Enabling DAC ............................................................................. 56

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5.10.2. LOW Pass filter Example ............................................................ 57

6. RF SECTION .............................................................................. 58

Antenna requirements................................................................. 58

6.1.1. Main Antenna ............................................................................. 58

6.1.2. PCB Design guidelines ............................................................... 59

6.1.3. PCB Guidelines in case of FCC Certification .............................. 60

6.1.3.1. Transmission line design ............................................................ 60

6.1.3.2. Transmission Line Measurements .............................................. 61

6.1.3.3. Antenna Installation Guidelines ................................................... 63

Second Antenna requirements .................................................... 64

6.2.1. Single Antenna Operation ........................................................... 65

7. AUDIO SECTION ....................................................................... 66

Electrical Characteristics ............................................................. 66

Codec examples ......................................................................... 66

8. MECHANICAL DESIGN ............................................................. 67

9. APPLICATION PCB DESIGN .................................................... 68

Footprint ..................................................................................... 68

PCB pad design .......................................................................... 69

PCB pad dimensions .................................................................. 69

Stencil ......................................................................................... 70

Solder paste ............................................................................... 71

Solder Reflow ................................ ............................................. 71

10. PACKAGING .............................................................................. 73

Tray ............................................................................................ 73

Moisture sensitivity ..................................................................... 75

11. CONFORMITY ASSESSMENT ISSUES .................................... 76

Approvals.................................................................................... 76

Declaration of Conformity ........................................................... 76

FCC certificates .......................................................................... 76

IC/ISED certificates ..................................................................... 76

FCC/ISED Regulatory notices LE866-SV1 .................................. 76

FCC/ISED Regulatory notices LE866A1-NA ............................... 80

12. SAFETY RECOMMENDATIONS................................................ 83

READ CAREFULLY .................................................................... 83

13. REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 84

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14. ACRONYMS ............................................................................... 87

15. DOCUMENT HISTORY .............................................................. 89

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1. INTRODUCTION

Scope

This document introduces the Telit LE866 modules and presents possible and recommended hardware solutions for developing a product based on this module. All the features and solutions detailed in this document are applicable to all LE866 variants, where LE866 refers to the variants listed in the applicability table.

Obviously, this document cannot embrace every hardware solution or every product that can be designed. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit module.

Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit module.

Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

 TS-EMEA@telit.com  TS-AMERICAS@telit.com  TS-APAC@telit.com  TS-SRD@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

Text Conventions

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents

 SIM Holder Design Guides, 80000NT10001A  LE866 AT Commands Reference Guide, 80471ST10691A  Telit EVK2 User Guide, 1vv0300704  xE866 Interfaces User Guide, 1vv0301260

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LE866 Hardware Design Guide

Product

2G Band (MHz)

3G Band (MHz)

4G Band (MHz)

Region

LE866-SV1

B4 (AWS1700) B13 (700)

North America Verizon

LE866A1-NA

B2 (1900) B4 (AWS1700) B12 (700)

North America AT&T

LE866A1-KK

B3 (1800) B8 (900)

Korea KT

LE866A1-KS

B3 (1800) B5 (850)

Korea SKT

LE866A1-JS

B1 (2100) B8 (900)

Japan Softbank

2. GENERAL PRODUCT DESCRIPTION

Overview

LE866 is Telit’s new LTE series for IoT applications. In its most basic use case, LE866 can be applied as a wireless communication front-end

for telematics products, offering mobile communication features to an external host CPU through its interfaces.

Product Variants and Frequency Bands

All LE866 variants are single mode LTE. Different bands combinations are available:

Refer to Chapter 13 for details information about frequencies and bands.

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Function

Features

Modem

 Multi-RAT cellular modem for voice and data communication

o LTE FDD Cat1 (10/5Mbps DL/UL). o Carrier aggregation is not supported

 SMS support (text and PDU)  Alarm management  Real Time Clock  SIM phonebook  Internal IP stack

GNSS

 Not supported

Digital audio subsystem

 PCM/I2S digital audio interface  Up to 16 kHz sample rate, 16 bit words

Interfaces

 USB2.0 – USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o AT command access o Diagnostic monitoring and debugging

 Peripheral Ports – UART  7 GPIOs  Antenna ports

Target market

LE866 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

 Emergency call  Telematics services  Road pricing  Pay-as-you-drive insurance  Stolen vehicles tracking  Internet connectivity

Main features

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LE866 Hardware Design Guide

Band

Power class

LTE All Bands

Class 3 (0.2W)

Technology

3GPP Compliance

4G LTE

Throughput >95% 10MHz Dual Receiver

Product

Band

Sensitivity (dBm)

LE866-SV1

LTE FDD B4 LTE FDD B13

-102.0

LE866A1-NA

LTE FDD B2 LTE FDD B4 LTE FDD B12

-102.0

LE866A1-KK

LTE FDD B3 LTE FDD B8

-102.0

LE866A1-JS

LTE FDD B1 LTE FDD B8

-102.0

TX Output Power

RX Sensitivity

Below the 3GPP measurement conditions used to define the RX sensitity:

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LE866 Hardware Design Guide

Note

Operating Temperature

Range

–20°C ÷ +55°C

The module is fully

functional(*) in all the

temperature range, and it

fully meets the 3GPP

specifications.

–40°C ÷ +85°C

The module is fully

functional (*) in all the

temperature range.

Storage and non-

operating Temperature

Range

–40°C ÷ +85°C

Mechanical specifications

2.7.1. Dimensions

The overall dimensions of LE866 family are:

 Length: 25 mm  Width: 15 mm  Thickness: 2.2 mm

2.7.2. Weight

The nominal weight of the module is 1.80 grams.

Temperature range

(*) Functional: the module is able to make and receive voice calls, data calls, SMS and make data traffic.

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Signal

I/O

Function

Type

Comment

USB HS 2.0 COMMUNICATION PORT

E5

USB_D+

I/O

USB differential Data (+)

-

E6

USB_D-

I/O

USB differential Data (-)

-

Asynchronous Serial Port (USIF0) – Prog. / Data + HW Flow Control

A4

C103/TXD

I

Serial data input (TXD) from DTE

CMOS 1.8V

A5

C104/RXD

O

Serial data output to DTE

CMOS 1.8V

A2

C108/DTR

I

Input for (DTR) from DTE

CMOS 1.8V

A1

C105/RTS

I

Input for Request to send signal (RTS) from DTE

CMOS 1.8V

B1

C106/CTS

O

Output for Clear to send signal (CTS) to DTE

CMOS 1.8V

B2

C109/DCD

O

Output for (DCD) to DTE

CMOS 1.8V

A3

C107/DSR

O

Output for (DSR) to DTE

CMOS 1.8V

B3

C125/RING

O

Output for Ring (RI) to DTE

CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

C1

TX_AUX

O

Auxiliary UART (TX Data to DTE)

CMOS 1.8V

C2

RX_AUX

I

Auxiliary UART (RX Data from DTE)

CMOS 1.8V

SIM card interface

C7

SIMVCC

-

External SIM signal – Power supply for the SIM

1.8V Only

B7

SIMRST

O

External SIM signal – Reset

CMOS 1.8

A7

SIMCLK

O

External SIM signal – Clock

CMOS 1.8

3. PINS ALLOCATION

Pin-out

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LE866 Hardware Design Guide

A6

SIMIO

I/O

External SIM signal – Data I/O

CMOS 1.8

X SIMIN

I

Presence SIM input

CMOS 1.8

See next chapters

DIGITAL IO

C5

GPIO_01 DVI_WA0

SIM_IN

I/O

INT

Main Function: GPIO01 Configurable GPIO Alternate function 1: Digital Audio Interface (WA0) Alternate Function 2: SIM_IN

CMOS 1.8V

C6

GPIO_02

DVI_RX

SIM_IN

I/O

INT

Main Function: GPIO02 Configurable GPIO Alternate Function 1: Digital Audio Interface (RX) Alternate Function 2: SIM_IN

CMOS 1.8V

D6

GPIO_03

DVI_TX

SIM_IN

I/O

INT

General Purpose IO Alternate Function 1: Digital Audio Interface (TX) Alternate Function 2: SIM_IN

CMOS 1.8V

D5

GPIO_04 DVI_CLK

SIM_IN

I/O

INT

Main Function: GPIO04 Configurable GPIO Alternate Function1: Digital Audio Interface (CLK) Alternate Function 2: SIM_IN

CMOS 1.8V

B5

GPIO_05

SIM_IN

I/O

INT

Main Function: GPIO05 Configurable GPIO Alternate Function 1: SIM_IN

CMOS 1.8V

B4

GPIO_06

ALARM

SIM_IN

I/O

INT

Main Function: GPIO06 Configurable GPIO Alternate Function 1: ALARM Alternate Function 2: SIM_IN

CMOS 1.8V

C4

GPIO_07

STAT_LED

SIM_IN

I/O

INT

Main Function: GPIO07 Configurable GPIO Alternate Function 1: STATLED Alternate Function 2: SIM_IN

CMOS 1.8V

D8

VDDIO_IN

I

IO bus Supply input

Power

ADC and DAC

F4

ADC_IN1

AI

Analog/Digital converter input

A/D

Accepted values 0

to 1.0V DC

E4

DAC_OUT

AO

Digital/Analog converter output

D/A

RF Section

G2

MAIN_ANT

I/O

LTE Main Antenna (50 ohm)

RF

C0

DIV_ANT

I

LTE RX Diversity Antenna (50 ohm)

RF

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Miscellaneous Functions

G4

RESET*

I

Reset Input

VBATT

Pull up to VBATT

(10Kohm)

G6

VAUX/PWRMON

O

1.8V stabilized output Power ON monitor

Power

3GPP Rel12 PSM (Power Saving Mode)

D3

PSM_WAKE

I

3GPP Rel12 PSM Wake Up

Analog

E8

PSM_STATUS

O

3GPP Rel12 PSM Status

CMOS 1.8V

F8

PSM_ENA_OUT

O

3GPP Rel12 PSM Enable for external LDOs

CMOS 1.8V

Power Supply

E2

VBATT

-

Main power supply (Baseband)

Power

E0

VBATT_PA

-

Main power supply (Radio PA)

Power

E1

VBATT_PA

-

Main power supply (Radio PA)

Power

B0

GND

-

Ground

Power

D0

GND

-

Ground

Power

F0

GND

-

Ground

Power

G0

GND

-

Ground

Power

D1

GND

-

Ground

Power

F1

GND

-

Ground

Power

G1

GND

-

Ground

Power

D2

GND

-

Ground

Power

F2

GND

-

Ground

Power

C3

GND

-

Ground

Power

E3

GND

-

Ground

Power

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F3

GND

-

Ground

Power

G3

GND

-

Ground

Power

F6

GND

-

Ground

Power

A8

GND

-

Ground

Power

G8

GND

-

Ground

Power

A11

GND

-

Ground

Power

G11

GND

-

Ground

Power

RESERVED

A0

RESERVED

-

RESERVED

G5

RESERVED

-

RESERVED

B6

RESERVED

-

RESERVED

D7

RESERVED

-

RESERVED

E7

RESERVED

-

RESERVED

F7

RESERVED

-

RESERVED

G7

RESERVED

-

RESERVED

B8

RESERVED

-

RESERVED

C8

RESERVED

-

RESERVED

A9

RESERVED

-

RESERVED

B9

RESERVED

-

RESERVED

C9

RESERVED

-

RESERVED

D9

RESERVED

-

RESERVED

E9

RESERVED

-

RESERVED

F9

RESERVED

-

RESERVED

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WARNING

Reserved pins must not be connected.

G9

RESERVED

-

RESERVED

A10

RESERVED

-

RESERVED

B10

RESERVED

-

RESERVED

C10

RESERVED

-

RESERVED

D10

RESERVED

-

RESERVED

E10

RESERVED

-

RESERVED

F10

RESERVED

-

RESERVED

G10

RESERVED

-

RESERVED

B11

RESERVED

-

RESERVED

C11

RESERVED

-

RESERVED

D4

RESERVED

-

RESERVED

F5

RESERVED

-

RESERVED

F11

RESERVED

-

RESERVED

E11

RESERVED

-

RESERVED

D11

RESERVED

-

RESERVED

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Pad

Signal

Note

E2

VBATT

E0

VBATT_PA E1

VBATT_PA

B0, D0, F0, G0, D1, F1, G1, D2, F2, C3, E3, F3, G3, F6,

A8, G8, A11, G11

GND

G2

Main Antenna

C0

Diversity Antenna

A4

C103/TXD