Telit Communications S p A WE9223GR User Guide

xE922-3GR

Hardware User Guide

1VV0301272

Rev.0.8 - 2017-01-05

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

PRODUCT

HE922-3GR

WE922-3GR

APPLICABILITY TABLE

APPLICABILITY TABLE 1

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

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Contents

1. Introduction ..................................................... 9

1.1. Scope ....................................................... 9

1.2. Audience ..................................................... 9

1.3. Contact Information, Support ....................................... 10

1.4. Text Conventions............................................... 10

1.5. Supporting documents ........................................... 11

1.6. Product Variants ............................................... 11

1.7. Abbreviations ................................................. 11

2. General Product Description ......................................... 13

2.1. Overview .................................................... 13

2.2. General Functionality and Main Features ............................... 15

2.3. Reference table of RF bands characteristics ............................. 19

2.3.1. Cellular network: ................................................. 19

2.3.2. WiFi/Bluetooth .................................................. 20

2.3.3. GNSS ........................................................ 20

2.4. Applications .................................................. 20

2.5. Sensitivity ................................................... 21

2.6. High level block Diagram ......................................... 22

2.7. Environmental requirements ....................................... 23

2.7.1. Temperature range ................................................ 23

2.8. xE922-3GR Mechanical Specifications ................................ 24

2.8.1. Dimensions ..................................................... 24

2.8.2. Weight ........................................................ 24

2.8.3. RoHS compliance ................................................ 24

3. xE922-3GR Module pin out .......................................... 25

3.1. PIN table .................................................... 25

3.2. LGA Pads Layout .............................................. 37

4. Electrical specifications ............................................. 39

4.1. Absolute maximum ratings – not operational ............................. 39

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4.2. Recommended operating conditions .................................. 39

4.3. Logic Level Specifications ........................................ 39

5. Power supply .................................................... 41

5.1. Input supply .................................................. 41

5.2. Output supply ................................................. 42

5.2.1. Linear voltage regulators .................................. 42

5.2.1.1. VAUX_1P8V ............................................... 42

5.2.1.2. VAUX_2P85V .............................................. 43

5.2.1.3. VAUX_3P0V ............................................... 43

5.2.1.4. VSIM1/2 ................................................. 44

5.2.2. DC/DC stepdown ................................................. 44

5.2.2.1. 1V8_OUT ................................................. 44

5.3. Typical system power consumption ................................... 45

5.4. RTC backup .................................................. 47

6. Power ON/OFF and reset control ...................................... 49

6.1. Power On .................................................... 49

6.1.1. ON_OFF key action ............................................... 49

6.1.2. Switching ON due to charging ........................................ 50

6.1.3. Switching on due to RTC alarm ....................................... 50

6.2. Power off .................................................... 50

6.2.1. Soft power off ................................................... 50

6.2.2. Emergency power off .............................................. 50

6.3. Reset ....................................................... 50

7. Battery management .............................................. 51

7.1. Coulomb counter ............................................... 51

7.2. Battery charging ............................................... 52

7.2.1. Block diagram ................................................... 52

7.2.2. Battery/charger-less operation ........................................ 54

8. USIM interface .................................................. 55

9. USB port ....................................................... 57

10. Display interface ................................................ 60

10.1. MIPI-DSI .................................................. 60

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10.2. LVDS ..................................................... 62

10.3. Backlight control ............................................. 64

10.4. LED_CURSINK ............................................. 65

10.5. Touch panel ................................................. 66

11. Camera interface ............................................... 67

12. Peripheral interfaces ............................................. 71

12.1. I2C ...................................................... 71

12.2. USIF ..................................................... 72

12.3. SDMMC/SDIO .............................................. 74

12.4. ADC ..................................................... 77

13. General purpose I/O ............................................. 78

14. Debug / flash interfaces ........................................... 81

14.1. USB2.0 HS ................................................. 81

14.2. USIF2 .................................................... 81

14.3. JTAG ..................................................... 81

14.4. Test pads ................................................... 81

15. Audio ........................................................ 82

15.1. Analog .................................................... 82

15.1.1. Analog IN...................................................... 83

15.1.2. Analog OUT .................................................... 86

15.1.2.1. Earpiece ................................................. 87

15.1.2.2. Headset .................................................. 87

15.1.2.3. Loudspeaker .............................................. 88

15.2. Digital .................................................... 90

15.2.1. I2S .......................................................... 90

15.2.2. Digital microphone ................................................ 90

16. Antenna(s) .................................................... 91

16.1. GSM/WCDMA Antenna Requirements ............................. 91

16.1.1. GSM/WCDMA Antenna – PCB line Guidelines............................. 92

16.1.2. GSM/WCDMA Antenna – Installation Guidelines ........................... 92

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16.2. WiFi/BT Antenna Requirements ................................... 93

16.3. GNSS Antenna Requirements .................................... 93

16.3.1. Combined GNSS Antenna .......................................... 94

16.3.2. Linear and Patch GNSS Antenna ..................................... 94

16.3.3. Front End Design Considerations ..................................... 94

16.3.4. GNSS Antenna - PCB Line Guidelines ................................. 95

16.3.5. GNSS Antenna – Installation Guidelines ................................ 95

17. Mounting the module on your board .................................. 96

17.1. General .................................................... 96

17.2. Finishing & Dimensions ........................................ 96

17.3. Recommended foot print for the application main board .................... 97

17.4. Stencil .................................................... 98

17.5. PCB Pad Design .............................................. 98

17.6. Recommendations for PCB Pad Dimensions (mm) ....................... 99

17.7. Solder Paste ................................................ 100

17.7.1. Solder Reflow .................................................. 100

18. Packing system ................................................ 102

18.1. Tray Drawing .............................................. 104

18.2. Moisture Sensitivity .......................................... 105

19. Safety Recommendations ......................................... 106

20. Conformity assessment issues ...................................... 107

20.1. FCC/IC Regulatory notices ...................................... 107

20.1.1. Modification statement ............................................ 107

20.1.2. Interference statement ............................................. 107

20.1.3. RF exposure ................................................... 107

20.1.4. FCC Class B digital device notice ..................................... 108

20.1.5. Labelling Requirements for the Host device .............................. 108

20.2. 1999/5/EC Directive .......................................... 109

21. Document History .............................................. 112

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1. Introduction

1.1. Scope

The aim of this document is to introduce Telit xE922-3GR modules as well as present possible and recommended hardware solutions useful for developing a product based on the xE922-3GR modules. All the features and solutions detailed are applicable to all xE922-3GR, where “xE922-3GR” refers to the modules listed in the applicability table.

If a specific feature is applicable to a specific product, it will be clearly highlighted.

NOTICE:

The description text “xE922-3GR” refers to all modules listed in the APPLICABILITY TABLE 1.

In this document all the basic functions of a wireless module will be taken into account; for each one of them a valid hardware solution will be suggested and usually incorrect solutions and common errors to be avoided will be highlighted. Obviously this document cannot embrace every hardware solution or every product that may be designed. Obviously avoiding invalid solutions must be considered as mandatory. Whereas the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit xE922-3GR module.

NOTICE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/WiFi/BT/GNSS xE922-3GR cellular module within user application must be done according to the design rules described in this manual.

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communication S.p.A. for its use, such as any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communication S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

1.2. Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit xE922-3GR module.

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1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at:

TS-NORTHAMERICA@telit.com if located in North America

For other regions, Collabnet Telit web portal can be used at https://teamforge.telit.com (account can be asked at support.collabnet@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users about the information provided.

1.4. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Type Number

Description

HE922-3GR

GSM/GPRS/EGPRS/WCDMA/HSPA+/WiFi/BT/GNSS

WE922-3GR

WiFi/BT/GNSS

Term

Definition

ABB

Analog baseband

ADC

Analog-to-digital converter

Application-Enabled

AES-NI

Advanced Encryption Standard New Instructions

AFE

Audio FrontEnd

CABC

Content Adaptive Backlight Control

CDP (USB)

Charging downstream port

CEU

Configurable Encryption Unit

CSI

Camera serial interface

DAC

Digital-to-analog converter

DBB

Digital baseband

DCP (USB)

Dedicated charging port

DBP

dead battery provision

DSI

Display serial interface

DSDS

Dual Sim Dual Standby

EOC

End of charge

EDID

Extended display identification data

FDD

Frequency division duplex

1.5. Supporting documents

· 1VV0301249_EVB USER GUIDE.pdf

· 1VV0301285_IFBD HW User Guide xE922-3GR.pdf

· 1VV0301324_MMI_EXT_CARD_xE922_3GR_HW USER GUIDE

· 80504NT11473A Thermal Guidelines.pdf

For further detailed information, HW/SW user manuals and application notes related to the INTEL chipset applied for this RF module, please consult Intel Business Link Support (IBL):

https://businessportal.intel.com

1.6. Product Variants

xE922-3GR is available in the following hardware variants:

1.7. Abbreviations

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GLONASS

Global orbiting navigation satellite system

GNSS

Global navigation satellite system

GPIO

General-purpose input/output

GPRS

General packet radio services

GPS

Global positioning system

GSM

Global system for mobile communications

HMI

Human machine interface

I2C

Inter-integrated circuit

ISP

Image Signal Processor

IDI

Inter die interface

Low Energy

LVDS

Low Voltage Differential Signaling

MIPI

Mobile Industry Processor Interface

Microstrip line

PMU

Power management unit

Secure digital

SDP (USB)

Standard downstream port

Strip line

SIM

Subscriber identity module

SOC

System-On-Chip

SOC

State of charge

SMEP

Supervisor Mode Execution Privilege

SPI

Serial peripheral interface

Tearing effect

UART

Universal asynchronous receiver transmitter

UMTS

Universal mobile telecommunications system

USB

Universal serial bus

USIF

Universal serial interface

VMM

Virtual machine manager

VT-x

Intel Virtual Technology

WCDMA

Wideband code division multiple access

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2. General Product Description

2.1. Overview

Telit’s module family xE922-3GR is based on Intel’s IoTG Atom x3 Quad Core processor dual chip platform.

DBB : SoC Atom x3

· CPU: Quad Core (Silvermont) 1.16 GHz

L1$ I/D 16KB/16KB ; L2$ 1MB

8-ch main application DMA / 4-ch secure DMA

Android 32bit, Linux Yocto 32bit

· GPU: GFX core modified Mali-450 MP4 600 MHz $128KB

· DSP : 2x TeakLite @277MHz

· Media Encode/Decode Engine: modified VeriSilicon Media Engine (dec G1/enc H1)

Video encoding:

• H.264 BP@level4.0, MP@level4.0, HP@level4.0

• Bit rate supported is from 10Kbps to 20Mbps

• JPEG Baseline

Video decoding:

• MPEG-1 Main Profile up to High Level

• MPEG-2 Main Profile up to High Level

• MPEG-4 Simple Profile up to Level 6, Advanced Profile up to Level 5

• H.264 up to HP Level 5.1, up to 1080p 30fps (yocto) /720p 50fps (android)

• HEVC Main Profile up to Level 4.1 High Tier, up to 1080p 30fps (yocto) /720p

50fps (android)

• VP6/VP8

• JPEG Baseline interleaved

· Security building blocks

ABB: AGOLD 620

· 2G/3G RF transceiver

· WLAN

· Bluetooth

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· GNSS

· Audio

· Analog measurement

· Power management

The module incorporates the following key technologies:

· 2G/3G cellular subsystem

· GNSS subsystem

· WiFi and Bluetooth subsystems

· Display subsystem

· Camera subsystem

· Audio subsystem

· Power management

xE922-3GR is designed for commercial (0C to70C) & industrial (extended temperature -40C to +85C) markets quality needs.

In its most basic use case, xE922-3GR can be applied as a wireless communication front-end for M2M products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.

The module supports data only communication, voice call is not supported.

xE922-3GR can further support customer software applications and security features. xE9223GR provides software application environment with sufficient system resources for creating rich on board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products which guarantee fraud prevention and tamper evidence without extra effort for additional security precautions.

xE922-3GR can be self-sufficient and serve as a fully integrated IoT solution. In such a case, customer would simply complement the module with a power supply, speaker amplifier, microphone, antennae and an HMI (if applicable).

xE922-3GR is offered with different variants per the list in Section 1.6:

· HE922-3GR: Cellular/WiFi/BT/GNSS

· WE922-3GR: WiFi/BT/GNSS

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2.2. General Functionality and Main Features

The xE922-3GR family of IoT modules features 2G/3G modem, GNSS and WiFi/BT connectivity together with an on-chip powerful application processor and a rich set of interfaces.

This overview sums all key interfaces offered by the module , consult the documentation on INTEL’s IBL supporting website for actual implementation state.

A) Modem subsystem for data only communication (HE922-3GR variant only)

· 2G technology 3GPP TS 45.005

o GSM/GPRS/EDGE (multislot class 10)

note : only EDGE RX mode supported

o Quad band support (GSM850/E-GSM900/DCS1800/PCS1900)

· 3G technology 3GPP TS 25.101 rel 7

o WCDMA (HSDPA 21Mbps cat14 / HSUPA 5.76Mbps cat6)

o Quad band support ( band 1 / 2 / 5 / 8)

o Class3 power class

· Two (U)SIM ports – dual voltage 1.8/3V

ISO 7816-3 IC card standard

B) GNSS subsystem

§ GPS/GLONASS receiver

§ Assisted GNSS

§ SBAS: WAAS, EGNOS

C) WiFi/Bluetooth subsystem

· WiFi 802.11 b/g/n 1x1 (1-14, max channel width 20MHz)

· BT 4.0 & BLE

· Single antenna shared for WiFi and BT

· Up to 72.2Mbps OTA throughput, 50Mbps actual throughput

D) Audio subsystem

· Embedded analog codec

o 2x microphone inputs + bias supply

o 1x stereo headset output

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o 1x mono earpiece output

o 1x mono speaker (classD 700mW/3.8V/8 ohm)

· Dual digital microphone

· I2S digital audio IO ( pinning multiplexed with USIF1 port)

E) Display subsystem

Up to 1080p, 24-bit color, 1080p 30fps (yocto) /720p 50fps (android)

· MIPI-DSI (one x4 lanes port, tearing effect timing control)

· LVDS (one x4 lanes port)

· 4 display layer

· Support color space conversion :YUV2RGB and RGB2YUV

· Support replication and dithering

· 2D Graphic Engine

· Backlight control (CABC input, BL feedback input, BL drive output)

· I2C port for touch panel control IC

F) Camera subsystem

Up to 13Mpix, 15 fps ( ISP throughput up to 221 Mpix/sec) (8Mpix, 25fps)

· 4 lanes MIPI-CSI for primary camera (up to 13Mpix/1080p)

· One lane MIPI-CSI for secondary camera (up to 5Mpix/720p)

· 1 camera at a time

· GPIO’s for camera control

· I2C port for camera subsystem control

· Camera auxiliary supply output

G) Power management

· External battery charger IC support

o I2C port dedicated to external charger IC control o Dedicated GPIO’s

o Fuel gauge input, VBAT/DC sourcing sense ADC input

· Ability to supply the module from DC source without external battery charger IC implementation

· Rich set of embedded power management functions are in place to permit minimization of the powerconsumption of the system in all operating modes.

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o Reduction of switching power consumption by clock gating.

o Reduction of leakage power by switching off non active logic.

o Dynamic Frequency Voltage Scaling reducing the supply voltage

depending on the perfomance requirements of the system

· The following system operating modes are defined :

o OFF : complete system switched off ( all context lost)

o WORKING : CPU executing scheduled tasks

o IDLE : CPU in power state HALT , waiting for interrupt

o DEEP SLEEP: CPU in power state DORMANT

H) Application processor

The Intel virtual machine manager (VMM) shares CPU resources of the quad core Atom between the cellular DBB modem high level protocol implementation, the applied OS and customer applications. Available BSP’s are 32bit Android and 32bit Linux (Yocto project).

The chipset external memory interface controller EMIC supports

· Low power LPDDR3 upto 2Gbyte

clock frequency up to 533MHz (data speed 1066 Mbps/pin)

· embedded MMC card interface eMMC4.51

clock frequency up to 52MHz ( data speed DDR 102 Mbps/pin)

(dataspeed DDR transfer)

Module embedded memory size implementation :

· FLASH eMMC: 8 Gbyte (x8 pin, data speed up to 833 Mbps)

· RAM LPDDR3: 1 Gbyte ( x32 pin, data speed up to 34112 Mbps)

I) Security capabilities of DBB:

Intergrated Trusted Executon Environment (TEE) based on Secure Virtual Machine and HW Crypto Unit (CEU)

· Atom Quad Core:

VT-x2 / AES-NI / SMEP ( Supervisor Mode Execution Privilege)

· Extensible Secure Execution Environment:

HW crypto accelerator – CEU / 256K SRAM

· Configurable execution unit (CEU):

o DES/3DES

o AES(128,192,256)

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o Exponentiation accelerator – supports RSA(1024.2048)

o Hashing engines : MD5, HMAC, SHA1/256

o True-RNG

· Secure memory : isolated memory region IMR for secure VM

· Secure boot : root of trust is SEC ROM

· Content protection : Widevine Level 1 DRM ( HW protected Video Path)

J) Rich set of module I/O interfaces, including:

· SDIO: SD 3.0, 1x 4bit, speed up to DDR50

only 1.8V supported

· SDMMC: 1x 4bit, default mode (26MHz)

including power supply (fixed 2.9V) and card detect

· USB2.0 (FS/HS DRD dual role device)

The USB port is typically used for:

o Flashing of firmware and module configuration

o Production testing o Accessing the Application Processor’s filesystem

o AT command access

o High speed WWAN access to external host

o Diagnostic monitoring and debugging

o Communication between Java application environment and an

external host CPU

o NMEA data to an external host CPU

o Connect to USB peripherals or hubs (note: application note available

from chipset provider on USB hub connectivity)

· Peripheral Ports

These can be applied to support several sensors like : accelerometer , gyroscope, magnetometer, proximity and ambient light sensors

Please consult Intel’s IBL Support website for AVL (approved vendor list), as well for recommended implemenation and port assignment

· 3x I2C port full speed:

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Mode

Freq. TX (MHz)

Freq. RX (MHz)

Channels

TX - RX offset

PCS 1900

1850.2 ~ 1909.8

1930.2 ~ 1989.8

512 ~ 810

80MHz

DCS 1800

1710 ~ 1785

1805 ~ 1880

512 ~ 885

95MHz

o I2C_AUX : auxiliary use

o I2C_CAM / I2C_TP : available when not applied for camera and/or

touchpad control

· USIF1 port: configurable as SPI or UART (up to 48MHz) (multiplexed with I2S)

· USIF2 port: configurable as SPI or UART (up to 26MHz)

· 26 general purpose GPIOs with at least 8 interrupts ( more can be available

depending on final product configuration)

· Analog audio I/F

· Antenna RF ports (GNSS, CELLULAR,WIFI/BT)

K) Form factor (40x34mm), 441 pin LGA

L) Single supply module. The module generates all its internal supply voltages.

M) Built-in RTC / backup supply pin for supercap

N) Two Operating temperature range specified for the xE922-3GR family:

· Commercial: 0 °C to +70 °C

· Industrial extended temperature: -40 °C to +85 °C

O) Cellular transmitter can work simultaneously with the transmitter in the 2.4GHz band. Only one of the 2.4 GHz modes works at a given moment and it can work simultaneously with any of the cellular modes.

2.3. Reference table of RF bands characteristics

2.3.1. Cellular network:

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Mode

Freq. TX (MHz)

Freq. RX (MHz)

Channels

TX - RX offset

GSM 850

824.2 ~ 848.8

869.2 ~ 893.8

128 ~ 251

45MHz

EGSM 900 890 ~ 915

935 ~ 960

0 ~ 124

45 MHz

880 ~ 890

925 ~ 935

975 ~ 1023

45 MHz

WCDMA 2100 – B1

1920 ~ 1980

2110 ~ 2170

Tx: 9612 ~ 9888 Rx: 10562 ~ 10838

190MHz

WCDMA 1900 – B2

1850 ~ 1910

1930 ~ 1990

Tx: 9262 ~ 9538 Rx: 9662 ~ 9938

80MHz

WCDMA 850

– B5

824 ~ 849

869

Tx: 4132 ~ 4233 Rx: 4357 ~ 4458

45MHz

WCDMA 900

– B8

880 ~ 915

925 ~ 960

Tx: 2712 ~ 2863 Rx: 2937 ~ 3088

45MHz

Frequency range

2402

2482

MHz

min

typ

max

unit

GPS

- 1575.5

MHz

Glonass

2.3.2. WiFi/Bluetooth

min typ max unit

~ 894

2.3.3. GNSS

- 1602 - MHz

2.4. Applications

xE922-3GR modules can be used for all kind of IoT Gateways.

Example applications can be:

- Reduction of production overheads

- Smart management of productions

- Remote device monitoring

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

- Data retrieval to prevent terror attacks

2.5. Sensitivity

· 3G =< -110 dBm

· 2G CS1 =< -111 dBm

· 2G CS4 =< -103 dBm

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

2.6. High level block Diagram

· Digital baseband DBB SoC:

Intel IoTG Atom x3 (quad-core CPU/GPU), multimedia & connectivity, cellular modem accelerators

MCP multi chip package memory subsystem ( eMMC+ LPDDR3)

· Analog baseband ABB :

Intel AG620 (WiFi-BT/cellular 2G/3G quad-band transceivers, GNSS receiver,power managemant unit PMU, audio frontend AFE)

· RF front end SAW filters / power amplifiers

Figure 1

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

Operating Temperature Range

-20 ~ +55

°C :

This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the

module with in this range.

extended temperature & commercial temperature 0~+70°C Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to

which means: some RF parameters may deviate from 3GPP specification in the order of few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities like

, USB communication, UART activation etc. will be maintained, and the effect of such degradations will not lead to malfunction.

Storage and nonoperating Temperature Range

–40°C

~ +105°C

2.7. Environmental requirements

2.7.1. Temperature range

-40 ~ +85°C :

3GPP requirements,

data connection, SMS

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

2.8. xE922-3GR Mechanical Specifications

2.8.1. Dimensions

The Telit xE922-3GR module overall dimensions are:

• Length: 34 mm, +/- 0.15 mm Tolerance

• Width: 40 mm, +/- 0.15 mm Tolerance

• Thickness: 3.0 mm, +/- 0.15 mm Tolerance

2.8.2. Weight

The nominal weight of the xE922-3GR module is 9.7 gram.

2.8.3. RoHS compliance

As a part of Telit corporate policy of environmental protection, the xE922-3GR complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

PAD

I/O

W17

USB_ID

USB_ID, USB DRD use

Analog

S17

USB_DP

I/O

USB differential Data (+)

Analog

U17

USB_DN

I/O

USB differential Data (-)

Analog

AR8

VBUS_DET

VBUS detection

Analog

Main Camera

D21

CSI1_DP0

Main Camera CSI Data0 Input Positive

Analog

F21

CSI1_DN0

Main Camera CSI Data0 Input Negative

Analog

M19

CSI1_DP1

Main Camera CSI Data1 Input Positive

Analog

K19

CSI1_DN1

Main Camera CSI Data1 Input Negative

Analog

F19

CSI1_DP2

Main Camera CSI Data2 Input Positive

Analog

H19

CSI1_DN2

Main Camera CSI Data2 Input Negative

Analog

E18

CSI1_DP3

Main Camera CSI Data3 Input Positive

Analog

G18

CSI1_DN3

Main Camera CSI Data3 Input Negative

Analog

C20

CSI1_CLKP

Main Camera CSI Clock Positive

Analog

E20

CSI1_CLKN

Main Camera CSI Clock Negative

Analog

P17

CAM_MCLK

Camera MCLK output

CMOS 1.8V

AM17

CAM_I2C_SDA

I/O

Camera I2C Data

CMOS 1.8V

AP17

CAM_I2C_SCL

I/O

Camera I2C Clock

CMOS 1.8V

CAM1_PD

I/O

Main Camera Power Down / GPIO

CMOS 1.8V

CAM1_RESET

I/O

Main Camera Reset / GPIO

CMOS 1.8V

CAM1_FLASH

I/O

Main Camera Flash Triger

CMOS 1.8V

CAM1_TORCH

I/O

Main Camera Torch Enable

CMOS 1.8V

Secondary Camera

A18

CSI2_DP

Sub Camera CSI Data Input Positive

Analog

C18

CSI2_DN

Sub Camera CSI Data Input Negative

Analog

B19

CSI2_CLKP

Sub Camera CSI Clock Positive

Analog

D19

CSI2_CLKN

Sub Camera CSI Clock Negative

Analog

CAM2_PD

I/O

Sub Camera Power Down / GPIO

CMOS 1.8V

CAM2_RESET

I/O

Sub Camera Reset / GPIO

CMOS 1.8V

MIPI DSI Display Interface

3. xE922-3GR Module pin out

3.1. PIN table

Signal

descriptions Type

USB 2.0 Interface

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

S19

DSI_DP0

LCD DSI Data_0 Positive

Analog

P19

DSI_DN0

LCD DSI Data_0 Negative

Analog

R20

DSI_DP1

LCD DSI Data_1 Positive

Analog

N20

DSI_DN1

LCD DSI Data_1 Negative

Analog

L20

DSI_DP2

LCD DSI Data_2 Positive

Analog

J20

DSI_DN2

LCD DSI Data_2 Negative

Analog

K21

DSI_DP3

LCD DSI Data_3 Positive

Analog

H21

DSI_DN3

LCD DSI Data_3 Negative

Analog

M21

DSI_CLKP

LCD DSI Clock Positive

Analog

P21

DSI_CLKN

LCD DSI Clock Negative

Analog

AP11

LCD_RESET

I/O

LCD Reset / GPIO

CMOS 1.8V

AP9

LCD_TE

I/O

LCD Tearing effect input

CMOS 1.8V

LVDS Display Interface

W19

LVDS_TA1P

LVDS Data A Positive

Analog

U19

LVDS_TA1N

LVDS Data A Negative

Analog

X18

LVDS_TB1P

LVDS Data B Positive

Analog

V18

LVDS_TB1N

LVDS Data B Negative

Analog

V20

LVDS_TC1P

LVDS Data C Positive

Analog

T20

LVDS_TC1N

LVDS Data C Negative

Analog

Y21

LVDS_TD1P

LVDS Data D Positive

Analog

W21

LVDS_TD1N

LVDS Data D Negative

Analog

U21

LVDS_TCLK1P

LVDS Clock Positive

Analog

S21

LVDS_TCLK1N

LVDS Clock Negative

Analog

LCD Backlight

AS15

CABC

Content Adaptive Backlight Control

Analog

AS17

LEDFB_DP

Backlight feedback Positive

Analog

AU17

LEDFB_DN

Backlight feedback Negative

Analog

AP13

LEDDRV

Backlight Drive

Analog

Touch Screen interface

AD17

TP_SDA

I/O

Touch panel I2C Data

CMOS 1.8V

AB17

TP_SCL

I/O

Touch panel I2C Clock

CMOS 1.8V

TP_RESET

I/O

Touch panel Reset

CMOS 1.8V

F11

TP_IRQ

I/O

Touch panel Interrupt

CMOS 1.8V

SD/MMC Card Interface

AP15

VDD_SD

Power supply out for MMC card 1.8/3V

PWR out

SD_CARD_DET

MMC card detect(active low)

CMOS_1.8V

SD_DAT0

I/O

MMC card data 0

CMOS_1.8/3V

SD_DAT1

I/O

MMC card data 1

CMOS_1.8/3V

SD_DAT2

I/O

MMC card data 2

CMOS_1.8/3V

SD_DAT3

MMC card data3

CMOS_1.8/3V

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

SD_CLK

MMC card clock

CMOS_1.8/3V

SD_CMD

I/O

MMC card command

CMOS_1.8/3V

SDIO Interface

SDIO_CLK

I/O

CLK

CMOS 1.8V

SDIO_CMD

I/O

CMD

CMOS 1.8V

SDIO_DAT0

I/O

SD0

CMOS 1.8V

SDIO_DAT1

I/O

SD1

CMOS 1.8V

SDIO_DAT2

I/O

SD2

CMOS 1.8V

SDIO_DAT3

I/O

SD3

CMOS 1.8V

USIF 1 (UART/SPI)

USIF1_RXD

UART1 / SPI1 Serial data input

CMOS 1.8V

USIF1_TXD

UART1 / SPI1 Serial data Output

CMOS 1.8V

USIF1_SCLK

I/O

UART1 CTS / SPI1 SCLK

CMOS 1.8V

USIF1_CS

UART1 RTS / SPI1 Chip Select

CMOS 1.8V

USIF 2 (UART/SPI)

AH3

USIF2_RXD

UART2 / SPI2 Serial data input

CMOS 1.8V

AE4

USIF2_TXD

UART2 / SPI2 Serial data Output

CMOS 1.8V

AD5

USIF2_SCLK

I/O

UART2 CTS / SPI2 SCLK

CMOS 1.8V

AJ2

USIF2_CS

UART2 RTS / SPI2 Chip Select

CMOS 1.8V

I2C Ports

AS1

AUX_I2C_SDA

I/O

I2C3 Data (AUX / Sensors)

CMOS 1.8V

AT2

AUX_I2C_SCL

I/O

I2C3 Clock (AUX / Sensors)

CMOS 1.8V

AC18

CHG_I2C_SCL

I/O

Charger I2C Clock

CMOS 1.8V

AE18

CHG_I2C_SDA

I/O

Charger I2C Data

CMOS 1.8V

SIM card interface 1

AM5

VSIM1

External SIM signal 1 – Power supply for the SIM

1.8 / 2.85V

AR6

SIMCLK1

External SIM signal 1 – Clock

1.8 / 2.85V

AN10

USIM1_DETECT

External SIM signal 1 – Card detect (Active low)

CMOS 1.8V

AT6

SIMIO1

I/O

External SIM signal 1 – Data I/O

1.8 / 2.85V

AN6

SIMRST1

External SIM signal 1 – Reset

1.8 / 2.85V

SIM card interface 2

AK3

VSIM2

External SIM signal 2 – Power supply for the SIM

1.8 / 2.85V

AS7

SIMCLK2

External SIM signal 2 – Clock

1.8 / 2.85V

AR10

USIM2_DETECT

External SIM signal 2 – Card detect (Active low)

CMOS 1.8V

AU7

SIMIO2

I/O

External SIM signal 2 – Data I/O

1.8 / 2.85V

AP7

SIMRST2

External SIM signal 2 – Reset

1.8 / 2.85V

Analog Audio

AK21

EP_P

Differential Earpiece Positive

Analog

AM21

EP_N

Differential Earpiece Negative

Analog

AG20

MICP1

Earpiece microphone 1 signal input; phase+

Analog

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

AE20

MICN1

Earpiece microphone 1 signal input; phase-

Analog

AF19

MICP2

Headset microphone 2 signal input; phase+

Analog

AH19

MICN2

Headset microphone 2 signal input; phase-

Analog

AJ18

VMIC_BIAS

Analog Microphone bias

PWR out

AJ20

HP_OUT_R

Headset Right Signal Out

Analog

AL20

HP_OUT_L

Headset Left Signal Out

Analog

AH21

SPKR_LP

Speaker Signal Out Positive

Analog

AF21

SPKR_LN

Speaker Signal Out Negative

Analog

Digital microphone

AV12

DIG_MIC_CLK

Digital microphone Clock Output

CMOS 1.8V

AN12

DIG_MIC_D1

Digital microphone 1 signal input;

CMOS 1.8V

AT12

DIG_MIC_D2

Digital microphone 2 Clock input;

CMOS 1.8V

AG18

MIC_VDD

MEMS/DIG Microphone Power Supply

PWR out

RF Antenna

AE2

ANT_MAIN

Main Cellular RF antenna

ANT_GPS

GPS Antenna

AV14

ANT_WIFI_BT

WiFi /BT Antenna

DIGITAL GPIO

AV8

GPIO0_EINT5

I/O

GPIO / External IRQ

CMOS 1.8V

AT8

I/O

GPIO / External IRQ, Used for SoC USB ID WU from Sleep

CMOS 1.8V

AS11

GPIO5_EINT7

I/O

GPIO / USB_FAULT IRQ

CMOS 1.8V

G10

GPIO44

I/O

GPIO

CMOS 1.8V

E10

GPIO45

I/O

GPIO

CMOS 1.8V

A10

GPIO46

I/O

GPIO

CMOS 1.8V

GPIO47

I/O

GPIO

CMOS 1.8V

GPIO48

I/O

GPIO

CMOS 1.8V

GPIO49

I/O

GPIO

CMOS 1.8V

GPIO50

I/O

GPIO

CMOS 1.8V

GPIO51

I/O

GPIO

CMOS 1.8V

GPIO52_EINT15

I/O

GPIO / External IRQ

CMOS 1.8V

H17

GPIO53

I/O

GPIO / MIPI Trace Clock

CMOS 1.8V

GPIO54_EINT1

I/O

GPIO / External IRQ

CMOS 1.8V

G14

GPIO55_EINT15

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO56

I/O

GPIO

CMOS 1.8V

B11

GPIO57_EINT9

I/O

GPIO / External IRQ

CMOS 1.8V

D11

GPIO58_EINT2

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO63_EINT8

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO64_EINT13

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO65

I/O

GPIO

CMOS 1.8V

GPIO66_EINT15

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO1_EINT2

xE922-3GR Hardware User Guide

1VV0301272 Rev.0.8 2017-01-05

GPIO67_EINT0

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO72_EINT9

I/O

GPIO / External IRQ

CMOS 1.8V

GPIO73_EINT10

I/O

GPIO / External IRQ

CMOS 1.8V

Miscellaneous Functions

AR16

ON_OFF

Power ON/OFF

AU5

MAIN_RESET_IN

MAIN_RESET

AR14

LED_CURSINK

GP LED Driver (Sink)

AS5

HW_KEY

Product ID for Production testing

AN8

GNSS_FTA

Used internally (do not connect)

AN14

CHG_RST_OUT

External Charger Reset

AB21

CHG_INT_IN

Charger IRQ

AN16

CHG_POK_IN

Charger Power OK indication

AW17

VBUS_PWR_EN

Enable External VBUS source for DRD

AV16

FG_IBATP

Battery Fuel Gauge Positive

AT16

FG_IBATN

Battery Fuel Gauge Negative

AM19

ADC_VBATMEAS

Battery/DC-supply measurement ADC

ADC Ports

AL18

ADC_IN0

Analog to Digital converter (Batt ID)

Analog

AK19

ADC_IN1

Analog to Digital converter (Batt Temp)

Analog

JTAG

AT4

JTAG_TDO

JTAG

CMOS 1.8V

AN4

JTAG_TDI

JTAG

CMOS 1.8V

AR4

JTAG_TMS

JTAG

CMOS 1.8V

AV4

JTAG_TCK

JTAG

CMOS 1.8V

AW5

JTAG_TRST

JTAG

CMOS 1.8V

AW3

JTAG_RTCK

JTAG

CMOS 1.8V

Power Supply In / OUT

AR18

V_BAT_1