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WE866C3
Users Guide
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Telit Communications S p A WE866C3 Users Guide

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WE866C3
HW Design Guide
1VV0301495 Rev. 8 – 2019-05-27
[01.2017]
Mod.0818 2017-01 Rev.0
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
1VV0301495 Rev. 8 Page 2 of 64 2019-05-27
USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High­Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third-Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
1VV0301495 Rev. 8 Page 3 of 64 2019-05-27
APPLICABILITY TABLE
PRODUCTS
WE866C3-P
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WE866C3_Hardware_Design_Guide
Contents
NOTICE 2
COPYRIGHTS .................................................................................................. 2
COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3
APPLICABILITY TABLE .................................................................................. 4
CONTENTS ...................................................................................................... 5
1. INTRODUCTION ............................................................................ 9
Scope ............................................................................................. 9
Audience ........................................................................................ 9
Contact Information, Support ......................................................... 9
Text Conventions ......................................................................... 10
Related Documents ...................................................................... 11
2. GENERAL PRODUCT DESCRIPTION ........................................ 12
Overview ...................................................................................... 12
Block Diagram .............................................................................. 12
Product Variants ........................................................................... 12
Target market ............................................................................... 13
Main features ................................................................................ 13
3. PINS ALLOCATION .................................................................... 15
Pin Type Definition ....................................................................... 15
Pin-out .......................................................................................... 15
LGA Pads Layout ......................................................................... 17
4. POWER SUPPLY ........................................................................ 18
Power Supply Requirements ........................................................ 18
Power Consumption ..................................................................... 19
4.2.1. Typical power consumption for WLAN low-power states ............. 19
4.2.2. Typical Power consumption for WLAN continuous Rx [2.4 GHz] . 19
4.2.3. Typical Power consumption for WLAN continuous Rx [5 GHz] .... 20
4.2.4. Typical Power consumption for WLAN continuous TX [2.4 GHz] . 20
4.2.5. Typical Power consumption for WLAN continuous TX [5 GHz] .... 21
4.2.6. Typical Power consumption for BT ............................................... 21
Power Supply Sequencing ........................................................... 23
5. DIGITAL SECTION ...................................................................... 24
DC electrical characteristics ......................................................... 24
Interface Ports and Signals .......................................................... 25
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5.2.1. WLAN Interfaces .......................................................................... 25
5.2.1.1. SDIO Interface .............................................................................. 25
5.2.1.2. WL_EN ......................................................................................... 25
5.2.1.3. WOW ............................................................................................ 25
5.2.1.4. LF_CLK_IN ................................................................................... 26
5.2.1.5. Coexistence UART Interface ........................................................ 26
BT Interface .................................................................................. 27
5.3.1.1. BT HCI-UART ............................................................................... 27
5.3.1.2. PCM/I2S ....................................................................................... 27
5.3.1.3. BT_EN .......................................................................................... 27
6. RF SECTION ................................................................................ 28
RF Frequencies ............................................................................ 28
TX Output power .......................................................................... 28
6.2.1. TX Output Power at Room Temperature ...................................... 28
6.2.1.1. 802.11b (2.4GHz) ......................................................................... 28
6.2.1.2. 802.11g (2.4GHz) ......................................................................... 28
6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 29
6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 29
6.2.1.5. 802.11a (5GHz) ............................................................................ 29
6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 29
6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 30
6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 30
6.2.1.9. Bluetooth TX power ...................................................................... 30
6.2.2. TX Output power at Cold Temperature ........................................ 30
6.2.2.1. 802.11b (2.4GHz) ......................................................................... 30
6.2.2.2. 802.11g (2.4GHz) ......................................................................... 30
6.2.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 31
6.2.2.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 31
6.2.2.5. 802.11a (5GHz) ............................................................................ 31
6.2.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 31
6.2.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 32
6.2.2.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 32
6.2.3.
TX Output power at Hot Temperature .......................................... 32
6.2.3.1. 802.11b (2.4GHz) ......................................................................... 32
6.2.3.2. 802.11g (2.4GHz) ......................................................................... 32
6.2.3.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 32
6.2.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 33
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6.2.3.5. 802.11a (5GHz) ............................................................................ 33
6.2.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 33
6.2.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 33
6.2.3.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 33
Receiver Sensitivity ...................................................................... 34
6.3.1. Receiver Sensitivity at Room Temperature .................................. 34
6.3.1.1. 802.11b (2.4GHz) ......................................................................... 34
6.3.1.2. 802.11g (2.4GHz) ......................................................................... 34
6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 34
6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 35
6.3.1.5. 802.11a (5GHz) ............................................................................ 35
6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 35
6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 35
6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 36
6.3.1.9. Bluetooth (BER < 0.1%) ............................................................... 36
6.3.2. Receiver Sensitivity at Cold Temperature .................................... 36
6.3.2.1. 802.11b (2.4GHz) ......................................................................... 36
6.3.2.2. 802.11g (2.4GHz) ......................................................................... 36
6.3.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 37
6.3.2.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 37
6.3.2.5. 802.11a (5GHz) ............................................................................ 37
6.3.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 37
6.3.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 38
6.3.2.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 38
6.3.3.
Receiver Sensitivity at Hot Temperature ...................................... 38
6.3.3.1. 802.11b (2.4GHz) ......................................................................... 38
6.3.3.2. 802.11g (2.4GHz) ......................................................................... 38
6.3.3.3. 802.11n, Channel BW = 20MHz (2.4GHz) ................................... 38
6.3.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) ................................... 39
6.3.3.5. 802.11a (5GHz) ............................................................................ 39
6.3.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................. 39
6.3.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................. 39
6.3.3.8. 802.11ac, Channel BW = 80MHz (5GHz) .................................... 39
7. DESIGN GUIDELINES ................................................................. 40
General PCB design guidelines ................................................... 40
SDIO interface .............................................................................. 40
Voltage regulator .......................................................................... 40
7.3.1. Recommended regulators ............................................................ 40
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7.3.2. Regulator operating conditions ..................................................... 41
Antenna requirements .................................................................. 42
7.4.1. Main Antenna ............................................................................... 42
7.4.2. Antenna Cable .............................................................................. 42
7.4.3. Antenna design ............................................................................ 43
7.4.4. Antenna installation Guidelines .................................................... 44
7.4.5. Antenna list ................................................................................... 44
8. MECHANICAL DESIGN............................................................... 45
Mechanical Dimensions ............................................................... 45
8.1.1. Mechanical Drawing ..................................................................... 45
8.1.2. Top View ...................................................................................... 45
8.1.3. Bottom View ................................................................................. 46
8.1.4. Side View ..................................................................................... 47
9. APPLICATION PCB DESIGN ...................................................... 48
Recommended footprint for the application .................................. 48
PCB pad design ........................................................................... 49
PCB pad dimensions .................................................................... 50
Stencil ........................................................................................... 51
Solder paste ................................................................................. 51
Cleaning ....................................................................................... 51
Solder reflow ................................................................................ 52
10. PACKING SYSTEM ..................................................................... 53
Tray .............................................................................................. 53
Tray Drawing ................................................................................ 54
Moisture sensitivity ....................................................................... 55
11. CONFORMITY ASSESSMENT ISSUES ..................................... 56
Declaration of Conformity ............................................................. 56
12. SAFETY RECOMMENDATIONS ................................................. 57
READ CAREFULLY ..................................................................... 57
13. FCC/IC COMPLIANCE ................................................................ 58
14. ACRONYMS ................................................................................ 62
15. DOCUMENT HISTORY ................................................................ 63
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1. INTRODUCTION
Scope
This document introduces the Telit WE866C3 module and presents possible and recommended hardware solutions for developing a product based on this module.
Obviously, this document cannot include every hardware solution or every product that can be designed. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit module.
Audience
This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit module.
Contact Information, Support
For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:
TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com TS-SRD@telit.com
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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Related Documents
LE910Cx HW Design Guide 1VV0301298 Telit EVB User Guide 1VV0301249 LE910Cx Multi Technology Interface 1VV0301508
Board TLB - HW User Guide
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WE866C3_Hardware_Design_Guide
2. GENERAL PRODUCT DESCRIPTION
Overview
The WE866C3 is a low power and low-cost wireless module solution based on Qualcomm QCA9377-3. It supports 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT 4.2 + HS + BLE, enabling seamless integration of WLAN/BT and low energy. It is a perfect companion solution for Telit cellular modules such as LE910Cx or LE920A4. WE866C3 supports low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. WE866C3 also supports BT-WLAN coexistence and uses the 2 wire ISM-LTE coexistence interface.
Block Diagram
The following figure shows a high-level block diagram of WE866C3 module and its major functional blocks.
Power supply SDIO PCM and UART RF Antenna
3.3V
VDD_IO
SDIO
WL _EN
WO W
32K _IN
LT E_COEX
BT_UART
BT_EN
I2S/PCM
QCA9377
Figure 1 Module Block Diagram
Product Variants
WE866C3 variants are listed below:
TX/RX
TX/RX
Filter
48M Hz
XO
5G
2.4G
Filter
5G PA
Diplexer
ANT
Cou pler
Product Description
WE866C3-P 1x1 WIFI/BT wireless module
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Target market
WE866C3 can be used in IoT applications complementing client data availability coverage of the Cellular modems, with low power and low cost, for example:
Bridging LTE / WLAN Industrial floor Healthcare instrument data terminals Smart Home automation and remote control
Main features
Feature Specification
Power
Interfaces
Supported Data Rate
Main supply voltage: 3.3V
VIO supply voltage: 1.8V or 3.3V
WLAN SDIO 3.0
BT UART
BT PCM/I2S
LTE Coexistence UART (WCI)
Low frequency 32.768KHz sleep clock
Single Antenna port, 50 Ohm
Control signals
802.11a (5GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11b (2.4GHz): 1, 2, 5.5, 11Mbps
802.11g (2.4GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11n (2.4GHz/5GHz):
20Mhz BW: Up to 72.2Mbps using short GI (MCS0-7)
40Mhz BW: Up to 144.4Mbps using short GI (MCS0-7)
802.11ac (5GHz): HT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)
802.11a / 54Mbps: 14 dbm
802.11b / 11Mbps: 18 dbm
802.11g / 54Mbps: 15 dbm
Transmission Power
802.11n / HT20 (MCS7): 15 dbm
802.11ac / HT20 (MCS0): 15.5 dbm
802.11ac / VHT40 (MCS9): 11 dbm
802.11ac / VHT80 (MCS9): 10.5 dbm
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Data Standard
Operating Modes
IEEE 802.11a/b/g/n/ac
Access Point
Station
Modulation BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM
Size: 15±0.15 x 13±0.15 x 2.15±0.15 mm
Mechanical
Package: LGA
Weight: 1g
1)
Temperature Range
Operating: -30°C to +85°C
Storage and non-operating: -40°C to +105°C
RoHS All hardware components are fully compliant with EU RoHS directive
Notes:
1) The module complies with IEEE standard.
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WE866C3_Hardware_Design_Guide
3. PINS ALLOCATION
Pin Type Definition
Type Description
DI Digital Input
DO Digital Output
PD Pull-Down
PU Pull-Up
OD Open-Drain Output
B Bi-Directional
AI Analog/RF Input
AO Analog/RF Output
P Power Input
Pins directions are with respect to the WE866C3 module.
Pin-out
Pin Pin name
BT UART interface
B3 BT_CTS VIO DI Bluetooth HCI-UART CTS signal B4 BT_RTS VIO DO Bluetooth HCI-UART RTS signal A5 BT_RXD VIO DI Bluetooth HCI-UART RXD signal A4 BT_TXD VIO DO Bluetooth HCI-UART TXD signal
BT PCM interface
C6 BT_I2S_SDI VIO DI, PU Bluetooth PCM/I2S Input signal, Internal Pull-Up C5 BT_I2S_WS VIO B Bluetooth PCM/I2S Frame Sync signal D5 BT_I2S_SCK VIO B, PD Bluetooth PCM/I2S Bit CLK signal D6 BT_I2S_SDO VIO DO Bluetooth PCM/I2S output signal
Low power Clock signal
B5 LF_CLK_IN VIO DI, PD External low–power 32.768 kHz clock input
Host wake pins
D4 WOW VIO
SDIO 3.0 interface
D7 SDIO_CLK VIO DI, PU SDIO clock signal Input, Internal Pull-Up E7 SDIO_CMD VIO B SDIO CMD line signal C7 SDIO_D0 VIO B SDIO data bus D0 B6 SDIO_D1 VIO B SDIO data bus D1 A6 SDIO_D2 VIO B, PU SDIO data bus D2, Internal Pull-Up B7 SDIO_D3 VIO B SDIO data bus D3
Pin Reference Voltage
Pin Type
OD, PU
Pin Description
Wake on Wireless. WIFI/BT Wakeup host. Active high, Internal Pull-Up
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Pin Pin name
Coexistence and control signals
C3 LTE_UART_RX VIO DI, PU
C4 LTE_UART_TX VIO DO
G5 WL_EN VIO DI, PD WLAN enable (Active high) G6 BT_EN VIO DI, PD Bluetooth enable (Active high)
RF Antennas
D1 ANT1 A AI, AO
G3 RFU ANT2 NA NA Reserved for Antenna 2.
Power
A1 VDD_3.3V 3.13 V to 3.46 V P Main Input voltage (WIFI & BT) A2 VDD_3.3V 3.13 V to 3.46 V P Main Input voltage (WIFI & BT) A3 VDDIO 1.8 V or 3.3 V P Voltage supply for all I/O signals (1.71V - 3.46V) G1 GND – – Power Ground A7 GND – – Power Ground B1 GND – – Power Ground B2 GND – – Power Ground C1 GND – – Power Ground C2 GND – – Power Ground D2 GND – – Power Ground E1 GND – – Power Ground E2 GND – – Power Ground F1 GND – – Power Ground F2 GND – – Power Ground F3 GND – – Power Ground F4 GND – – Power Ground G2 GND – – Power Ground G4 GND – – Power Ground G7 GND – – Power Ground
Factory use
D3 RFU NC - Reserved for future use. No connect.
E3 RFU NC - Reserved for future use. No connect.
E4 RFU NC - Reserved for future use. No connect.
E5 RFU NC - Reserved for future use. No connect.
E6 RFU NC - Reserved for future use. No connect.
F5 RFU NC - Reserved for future use. No connect.
F6 RFU NC - Reserved for future use. No connect.
F7 RFU NC - Reserved for future use. No connect.
Pin Reference Voltage
Pin Type
Pin Description
Secondary UART - LTE coexistence UART RXD / AUX UART RXD
Secondary UART - LTE coexistence UART_TXD / AUX_UART_TXD
Antenna 1 - Main Antenna for modules with a single antenna configuration
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LGA Pads Layout
A B C D E F G
1 VDD_3.3V GND GND ANT1 GND GND GND
2 VDD_3.3V GND GND GND GND GND GND
3 VDDIO
BT_TXD
4
5
6 SDIO_D2 SDIO_D1
7 GND SDIO_D3 SDIO_D0
(O)
BT_RXD
(I)
BT_CTS
(I)
BT_RTS
(O)
LF_CLK_IN
(I)
LTE_UART_RX
(I)
LTE_UART_TX
(O)
BT_I2S_WS
(I)
BT_I2S_SDI
(I)
RFU RFU GND RFU (ANT2)
WOW
(OD)
BT_I2S_SCK
(I)
BT_I2S_SDO
(O)
SDIO_CLK
(I)
RFU GND GND
RFU RFU
RFU RFU
SDIO_CMD RFU GND
WL_EN
(I)
BT_EN
(I)
TOP VIEW
WARNING
Reserved pins must not be connected.
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4. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.
Power Supply Requirements
There are 2 power supply inputs to the module. The main power supply, connected to
VDD_3.3V input and the VDDIO input, each must fulfil the following requirements:
VDD_3.3V Input Minimum Maximum
Absolute Maximum Voltage -0.3 V 3.65 V
Nominal Supply Voltage 3.3 V -
Normal Operating Voltage Range 3.135 V 3.465 V
VDDIO Input
Absolute Maximum Voltage -0.3 V 4.0 V
Nominal Supply Voltage 1.8V or 3.3V -
Normal Operating Voltage Range 1.71 V 3.46 V
NOTE:
The Maximum Voltage MUST never be exceeded; care must be
taken when designing the application’s power supply section to avoid
Minimum
Maximum
having an excessive voltage drop.
If the voltage drop is exceeding the limits it could lead to degradation
of performance or cause a Power Off of the module.
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WE866C3_Hardware_Design_Guide
(
V
)
(
)
Power Consumption
The below tables provides the typical current consumption values of the module for the various available modes.
4.2.1. Typical power consumption for WLAN low-power states
Total power
Mode
consumption [mA]
Mode Description
VDDIO = 1.8
Standby 0.2 Deep Sleep
1.3 DTIM=1
Power Save, 2.4GHz
Power Save, 5GHz
4.2.2. Typical Power consumption for WLAN continuous Rx [2.4 GHz]
Rate
11b 1Mbps 60
11b 11Mbps
11g 54Mbps
MCS0 HT20
0.8
0.6 DTIM=10
1.5 DTIM=1
0.9 DTIM=3
0.7 DTIM=10
DTIM=3
Total power consumption [mA]
VDDIO = 1.8V
62
70
67
MCS7 HT20
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(
(
4.2.3. Typical Power consumption for WLAN continuous Rx [5 GHz]
Rate
MCS0 HT20 96
MCS7 HT20 94
MCS8 VHT20
MCS0 HT40 94
MCS7 HT40 99
MCS8 VHT40 115
MCS9 VHT40 100
MCS7 VHT80 130
MCS8 VHT80 162
MCS9 VHT80 131
Total power consumption [mA]
VDDIO = 1.8V)
112
4.2.4. Typical Power consumption for WLAN continuous TX [2.4 GHz]
Rate
11b 1Mbps 365
11b 11Mbps 362
11g 54Mbps 340
MCS0 HT20 348
MCS7 HT20 335
Total power consumption [mA]
VDDIO = 1.8V)
1VV0301495 Rev. 8 Page 20 of 64 2019-05-27
(
(
4.2.5. Typical Power consumption for WLAN continuous TX [5 GHz]
Rate
MCS0 HT20 495
MCS7 HT20 432
MCS8 VHT20 422
MCS0 HT40
MCS7 HT40 435
MCS8 VHT40 432
MCS9 VHT40 429
MCS7 VHT80 440
MCS8 VHT80 438
MCS9 VHT80
Total power consumption [mA]
VDDIO = 1.8V)
475
436
4.2.6. Typical Power consumption for BT
Rate
Continuous Rx burst 25
Continuous TX Class 2 (+4 dBm) 42
Continuous TX Class 2 (+12.5 dBm) 70
1.28 sec page scan (non-interlaced)
1.28 sec LE ADV 0.23
1.28 sec Sniff as master 0.21
1.28 sec Sniff as slave 0.26
Total power consumption [mA]
VDDIO = 1.8V)
0.36
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WE866C3_Hardware_Design_Guide
NOTE:
Current consumptions specification refers to typical samples and typical material.
Values represent an average measurement done over few seconds.
Values may vary depending on network and environmental
conditions.
Power consumptions values obtained with VDD_3.3V = 3.3V and
VDDIO = 1.8V.
NOTE:
Current consumption is measured at the system level and is the sum
of both VDD_3.3V and VDDIO current consumpotions.
NOTE:
Current consumption related to WLAN and BT TX cases are
measured at typical TX output power as listed in 6.2.
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WE866C3_Hardware_Design_Guide
Power Supply Sequencing
The recommended power sequence between VDD_3.3V and VDDIO inputs is shown below:
Powe r up Normal O peration Powe r downNormal OperationRese t
VBATT
VDDIO
VDD_3.3V
WL_EN
BT_EN
90% of VDDIO to 10% of 3.3V Minimum 0 Sec
90% of 3.3V to WL_EN and BT_EN high Minimum 10 uSec
WLAN_EN valid to LF_CLK_IN Minim um 0 S ec
WL_EN and BT_EN low to 90% of 3.3V Minim um 10 uS ec
LF_CLK_IN
Notes:
1. VDDIO voltage should match VIO voltage of the host. In some applications, it may connect to 3.3 V matching the Host VIO voltage.
2. All host interface signals must stay floating or low before valid power on sequence WL_EN/BT_EN = ”High”, and after WL_EN/BT_EN = “Low”.
WARNING:
Please carefully follow the recommended power Up/Down sequencing. Not following the recommended procedure might damage the device and consequently void the warranty.
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WE866C3_Hardware_Design_Guide
5. DIGITAL SECTION
DC electrical characteristics
Parameter Min Typical Max Unit
High-level input voltage 0.7 * VDDIO - VDDIO + 0.3 V
Low-level input voltage -0.3 - 0.3 * VDDIO V
Input low leakage current (VIN = 0 V Supply = VDDIO max)
-5.0 0 5.0 μA
Input pull resistor
(Up or down)
High-level output voltage VDDIO - 0.4 - VDDIO V
Low-level output voltage 0 - 0.4 V
High-level output current 3 - - mA
Low-level output current - - -11 mA
Input capacitance - - 3 pF
-
1.8V IO: 120
- kΩ
3.3V IO: 70
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WE866C3_Hardware_Design_Guide
Interface Ports and Signals
5.2.1. WLAN Interfaces
The following figure shows the WLAN related interface connection between the WE866C3 module and the LTE modem module.
The following clauses describe the various interfaces
VBATT
Telit Module WE866C3
WIFI _SDCLK
WIFI_S DCMD
WIFI_S D0 WIFI_S D1 WIFI_S D2 WIFI_S D3
TGPIOx
WIFI_SDRST
WCI _RX WCI_TX
WLAN_SLEEP_CLK
5.2.1.1. SDIO Interface
SDIO is the main interface used for WLAN Data and control.
SDIO_CLK SDIO_CMD SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3
WO W
WL_EN
LTE _PR I/LT E_ TXD LTE _SY NC/LT E_R XD LF_CLK_IN
V. Reg
1.8V
VDDIO VDD_3.3VVBATT/VBATT_PA
V. Reg
3.3V
The WE866C3 has a 4-bit SDIO port which supports SDIO3.0 standard with up to 200Mhz clock. The figure above shows the SDIO interface connection diagram.
5.2.1.2. WL_EN
WL_EN is used to control the WLAN function of WE866C3 module. When WL_EN is at a high level, WLAN function will be enabled.
5.2.1.3. WOW
WOW (Wake on Wireless) signal purpose is to wake up the Modem module. When WOW signal is driven low it can wake up the modem module.
NOTE:
The corresponding modem GPIO which is used for wakeup should
support sleep wakeup functionality.
The selection of the modem GPIO input should be performed
according to software driver recommended input.
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5.2.1.4. LF_CLK_IN
The LF_CLK_IN 32 kHz clock is used in low-power modes such as IEEE power-save and sleep. It serves as a timer to determine when to wake up to receive beacons in various power-save schemes and to maintain basic logic operations when in sleep.
The module does not require an external 32 kHz clock. By default, it utilizes its internal clock shared with the WLAN and BT subsystem.
If the end application has a more accurate 32 kHz clock (as in the case of using the Telit LTE module solution), then it can be supplied externally via the LF_CLK_IN pin. The LF_CLK_IN pin must be grounded when using the default internal clock mode.
If an external 32 kHz clock is used, the requirements are:
Parameter Min Typical Max Unit
Frequency - 32.768 - KHz
Rise/Fall time 1 - 100 nS
Duty Cycle 15 - 85 %
Frequency stability -200 - 200 Ppm
Input High Voltage 0.8 x VDDIO - VDDIO + 0.2 V
Input Low Voltage -0.3 - 0.2 x VDDIO V
5.2.1.5. Coexistence UART Interface
Wireless Local Area Network (WLAN) and Bluetooth® (BT) share the same 2.4GHz ISM bands. LTE network bands (band 38/40/41 for TDD and band 7 for FDD uplink) are adjacent to the WLAN bands and as such can cause severe de-sensing of the WLAN receive. In the same way, WLAN transmission can cause severe de-sensing of the LTE receive path.
Interference is mostly relevant due to adjacent bands and the limited isolation when both reside in the same platform.
This interference can be mitigated to some extent with by sharing communication and network related information between LTE modem and WLAN/BT device.
This information is communicated between the 2 entities over the coexistence UART.
NOTE:
The coexistance interface can be used only with Telit recommended
bundling of LTE modem and WE866C3.
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WE866C3_Hardware_Design_Guide
BT Interface
The following figure shows the BT interface connection between the WE866C3 module and the modem module.
The BT controller consists of BT radio and digital baseband blocks. It is controlled by the host through the UART. The BT audio interface can be configured to UART/PCM (I2S). The BT power on/off is controlled through BT_EN.
VBATT
VBATT/VBATT_PA
Telit Module
BT _UA RT_ RX D
BT _UA RT_ TXD
BT _UA RT_ CTS BT _UA RT _R TS
5.3.1.1. BT HCI-UART
DVI_CLK
DVI_WAO
DVI_RX DVI_TX
TGPIOx
V. Reg
1.8V
VDDIO VDD_3.3V
WE866C3
BT _TX D BT _R XD BT _R TS BT _CT S
BT_I2S_SCK BT_I2S_WS BT _I2 S_ SDI BT_I2S_SDO
BT _E N
V. Reg
3.3V
The BT HCI-UART provides a communication interface between the host and BT controller.
5.3.1.2. PCM/I2S
This is the synchronous interface for audio data.
The BT synchronous audio interface can support either PCM or I2S protocols.
The BT asynchronous audio interface is for a stereo audio A2DP profile through HCI­UART.
Supports multiple codec types:
Narrowband speech with integrated CVSD codec over PCM or HCI Wideband speech with integrated SBC codec over PCM or HCI
The BT controller can configure the interface to master or slave mode for PCM or I2S. It defaults to slave mode to avoid driving PCM_SYNC and PCM_CLK signals.
The maximum I2S clock frequency is supported up to 2.4 MHz
5.3.1.3. BT_EN
This signal enables or disables BT by asserting or de-esserting it from the host.
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WE866C3_Hardware_Design_Guide
6. RF SECTION
RF Frequencies
The following table is listing the supported frequencies:
Parameter Conditions
WLAN Center channel frequency for 2.4 GHz
WLAN Center channel frequency for 5 GHz
BT Frequency range BT Specification:
Center frequency at 5 MHz spacing
Center frequency at 5 MHz spacing
2.4 ≤ f ≤ 2.4835
Center frequency f = 2402 + k, where k is the channel number.
2.412 – 2.484 GHz
4.9 – 5.925 GHz
2402 – 2480 MHz
TX Output power
The following clauses lists the measured TX output power of WE866C3.
Measurements are averaged and are done at the module Antenna pad.
The output power listed in the following tables indicates the highest level which allows to meet the 802.11x standard with regards to ACLR and EVM values.
6.2.1. TX Output Power at Room Temperature
The tables below are measured at 25°C with VDD_3.3V = 3.3V and VDDIO=1.8V.
6.2.1.1. 802.11b (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 1 Mbps 18 dBm QPSK 2 Mbps 18 dBm CCK 5.5Mbps 18 dBm CCK 11 Mbps 18 dBm
6.2.1.2. 802.11g (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 6 Mbps 16.5 dBm BPSK 9 Mbps 16.5 dBm QPSK 12 Mbps 16.5 dBm QPSK 18 Mbps 16.5 dBm 16 QAM 24 Mbps 15.5 dBm 16 QAM 36 Mbps 15.5 dBm 64 QAM 48 Mbps 15,5 dBm 64 QAM 54 Mbps 15 dBm
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6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 16.5 dBm QPSK MCS1 16,5 dBm QPSK MCS2 16,5 dBm 16 QAM MCS3 16 dBm 16 QAM MCS4 16 dBm 64 QAM MCS5 15,5 dBm 64 QAM MCS6 15,5 dBm 64 QAM MCS7 15 dBm
6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15 dBm QPSK MCS1 15 dBm QPSK MCS2 15 dBm 16 QAM MCS3 14,5 dBm 16 QAM MCS4 14.5 dBm 64 QAM MCS5 13.5 dBm 64 QAM MCS6 13.5 dBm 64 QAM MCS7 13 dBm
6.2.1.5. 802.11a (5GHz)
Modulation
BPSK 6 Mbps BPSK 9 Mbps QPSK 12 Mbps QPSK 18 Mbps 16 QAM 24 Mbps 16 QAM 36 Mbps 64 QAM 48 Mbps 64 QAM 54 Mbps
Data rate
Index
CHL/CHM/CHH Units
16.5
16.5
16.5
16.5
16.5
16.5
14.5 14
6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15.5 dBm QPSK MCS1 15.5 dBm QPSK MCS2 15.5 dBm 16 QAM MCS3 15 dBm 16 QAM MCS4 15 dBm 64 QAM MCS5 14 dBm 64 QAM MCS6 13.5 dBm 64 QAM MCS7 13 (ac Only) dBm
dBm dBm dBm dBm dBm dBm dBm dBm
1VV0301495 Rev. 8 Page 29 of 64 2019-05-27
6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15.5 dBm 256 QAM MCS9 11 (ac Only) dBm
6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15.5 dBm 256 QAM MCS9 10.5 dBm
6.2.1.9. Bluetooth TX power
BT Spec Modulation CHL/CHM/CHH Units
BR GFSK
EDR
π/4 DQPSK
8DPSK
BLE GFSK
3.9
2.4
2
-5.2
dBm dBm dBm dBm
6.2.2. TX Output power at Cold Temperature
The tables below are measured at -40°C with VDD_3.3V = 3.3V and VDDIO=1.8V.
6.2.2.1. 802.11b (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 1 Mbps 18.5 dBm QPSK 2 Mbps 18.5 dBm CCK 5.5Mbps 18.5 dBm CCK 11 Mbps 18.5 dBm
6.2.2.2. 802.11g (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 6 Mbps 17 dBm BPSK 9 Mbps 17 dBm QPSK 12 Mbps 17 dBm QPSK 18 Mbps 17 dBm 16 QAM 24 Mbps 16 dBm 16 QAM 36 Mbps 16 dBm 64 QAM 48 Mbps 16 dBm 64 QAM 54 Mbps 15.5 dBm
1VV0301495 Rev. 8 Page 30 of 64 2019-05-27
6.2.2.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 17 dBm QPSK MCS1 17 dBm QPSK MCS2 17 dBm 16 QAM MCS3 16.5 dBm 16 QAM MCS4 16.5 dBm 64 QAM MCS5 16 dBm 64 QAM MCS6 16 dBm 64 QAM MCS7 15.5 dBm
6.2.2.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15.5 dBm QPSK MCS1 15.5 dBm QPSK MCS2 15.5 dBm 16 QAM MCS3 15 dBm 16 QAM MCS4 15 dBm 64 QAM MCS5 14 dBm 64 QAM MCS6 14 dBm 64 QAM MCS7 13.5 dBm
6.2.2.5. 802.11a (5GHz)
Modulation
BPSK 6 Mbps BPSK 9 Mbps QPSK 12 Mbps QPSK 18 Mbps 16 QAM 24 Mbps 16 QAM 36 Mbps 64 QAM 48 Mbps 64 QAM 54 Mbps
Data rate
Index
CHL/CHM/CHH Units
17 17 17 17 17 17 15
14.5
6.2.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 16 dBm QPSK MCS1 16 dBm QPSK MCS2 16 dBm 16 QAM MCS3 15.5 dBm 16 QAM MCS4 15.5 dBm 64 QAM MCS5 14.5 dBm 64 QAM MCS6 14 dBm 64 QAM MCS7 13.5(ac Only) dBm
dBm dBm dBm dBm dBm dBm dBm dBm
1VV0301495 Rev. 8 Page 31 of 64 2019-05-27
6.2.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 16 dBm 256 QAM MCS9 11 .5(ac Only) dBm
6.2.2.8. 802.11ac, Channel BW = 80MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 16 dBm 256 QAM MCS9 11 dBm
6.2.3. TX Output power at Hot Temperature
The tables below are measured at +85°C with VDD_3.3V = 3.3V and VDDIO=1.8V.
6.2.3.1. 802.11b (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 1 Mbps 17.5 dBm QPSK 2 Mbps 17.5 dBm CCK 5.5Mbps 17.5 dBm CCK 11 Mbps 17.5 dBm
6.2.3.2. 802.11g (2.4GHz)
Modulation Data rate CHL/CHM/CHH Units
BPSK 6 Mbps 16 dBm BPSK 9 Mbps 16 dBm QPSK 12 Mbps 16 dBm QPSK 18 Mbps 16 dBm 16 QAM 24 Mbps 15 dBm 16 QAM 36 Mbps 15 dBm 64 QAM 48 Mbps 15 dBm 64 QAM 54 Mbps 14.5 dBm
6.2.3.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 16 dBm QPSK MCS1 16 dBm QPSK MCS2 16 dBm 16 QAM MCS3 15.5 dBm 16 QAM MCS4 15.5 dBm 64 QAM MCS5 15 dBm 64 QAM MCS6 15 dBm 64 QAM MCS7 14.5 dBm
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6.2.3.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
BPSK MCS0 14.5 dBm QPSK MCS1 14.5 dBm QPSK MCS2 14.5 dBm 16 QAM MCS3 14 dBm 16 QAM MCS4 14 dBm 64 QAM MCS5 13 dBm 64 QAM MCS6 13 dBm 64 QAM MCS7 12.5 dBm
6.2.3.5. 802.11a (5GHz)
Modulation
BPSK 6 Mbps BPSK 9 Mbps QPSK 12 Mbps QPSK 18 Mbps 16 QAM 24 Mbps 16 QAM 36 Mbps 64 QAM 48 Mbps 64 QAM 54 Mbps
Data rate
Index
Data rate
Index
CHL/CHM/CHH Units
CHL/CHM/CHH Units
16 16 16 16 16 16 14
13,5
dBm dBm dBm dBm dBm dBm dBm dBm
6.2.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15 dBm QPSK MCS1 15 dBm QPSK MCS2 15 dBm 16 QAM MCS3 14.5 dBm 16 QAM MCS4 14.5 dBm 64 QAM MCS5 13.5 dBm 64 QAM MCS6 13 dBm 64 QAM MCS7 12.5(ac Only) dBm
6.2.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15 dBm 256 QAM MCS9 10.5(ac Only) dBm
6.2.3.8. 802.11ac, Channel BW = 80MHz (5GHz)
Modulation
Data rate
Index
CHL/CHM/CHH Units
BPSK MCS0 15 dBm 256 QAM MCS9 10 dBm
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WE866C3_Hardware_Design_Guide
Receiver Sensitivity
The following clauses lists the receiver sensitivity WE866C3.
Measurements are done at the module Antenna pad with 10% packet error rate.
6.3.1. Receiver Sensitivity at Room Temperature
All measurements data are taken at 25°C and VDDIO=1.8V.
6.3.1.1. 802.11b (2.4GHz)
Modulation Data rate
Typical
sensitivity
BPSK 1 Mbps -93 dBm QPSK 2 Mbps -91 dBm CCK 5.5Mbps -88 dBm CCK 11 Mbps -87 dBm
6.3.1.2. 802.11g (2.4GHz)
Modulation Data rate
Typical
sensitivity
BPSK 6 Mbps -89 dBm BPSK 9 Mbps -88 dBm
QPSK 12 Mbps -87 dBm
QPSK 18 Mbps -85 dBm
16 QAM 24 Mbps -82 dBm
16 QAM 36 Mbps -78 dBm
64 QAM 48 Mbps -74 dBm
64 QAM 54 Mbps -73 dBm
6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Units
Units
Modulation
Data rate
Index
Typical
sensitivity
Units
BPSK MCS0 -88 dBm QPSK MCS1 -85 dBm QPSK MCS2 -83 dBm 16 QAM MCS3 -80 dBm 16 QAM MCS4 -76 dBm 64 QAM MCS5 -71 dBm 64 QAM MCS6 -70 dBm 64 QAM MCS7 -69 dBm
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6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
BPSK MCS0 -85 dBm QPSK MCS1 -82 dBm QPSK MCS2 -80 dBm 16 QAM MCS3 -77 dBm 16 QAM MCS4 -73 dBm 64 QAM MCS5 -68 dBm 64 QAM MCS6 -67 dBm 64 QAM MCS7 -66 dBm
6.3.1.5. 802.11a (5GHz)
Modulation Data rate
BPSK 6 Mbps -90 dBm BPSK 9 Mbps -89 dBm QPSK 12 Mbps -88 dBm QPSK 18 Mbps -86 dBm 16 QAM 24 Mbps -83 dBm 16 QAM 36 Mbps -79 dBm 64 QAM 48 Mbps -75 dBm 64 QAM 54 Mbps -74 dBm
Data rate
Index
Typical
sensitivity
Typical
sensitivity
Units
Units
6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0
Typical
sensitivity
-89 QPSK MCS1 -86 dBm QPSK MCS2 -84 dBm 16 QAM MCS3 -81 dBm 16 QAM MCS4 -77 dBm 64 QAM MCS5 -72 dBm 64 QAM MCS6 -71 dBm 64 QAM MCS7
-70
6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0 64 QAM MCS7 256 QAM MCS8 256 QAM MCS9
Typical
sensitivity
-86
-67
-65 dBm
-64 dBm
Units
dBm
dBm
Units
dBm dBm
1VV0301495 Rev. 8 Page 35 of 64 2019-05-27
6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz)
Modulation
Data rate
Index
256 QAM MCS8 256 QAM MCS9
Typical
sensitivity
-63 dBm
-62 dBm
6.3.1.9. Bluetooth (BER < 0.1%)
BT Spec Modulation
BR GFSK
EDR
π/4 DQPSK
8DPSK
BLE GFSK
Typical
sensitivity
-91
-90
-83
-94
6.3.2. Receiver Sensitivity at Cold Temperature
All measurements data are taken at -40°C and VDDIO=1.8V.
6.3.2.1. 802.11b (2.4GHz)
Modulation Data rate
Typical
sensitivity
BPSK 1 Mbps -94 dBm QPSK 2 Mbps -92 dBm CCK 5.5Mbps -89 dBm CCK 11 Mbps -88 dBm
Units
Units
dBm dBm dBm dBm
Units
6.3.2.2. 802.11g (2.4GHz)
Modulation Data rate
BPSK 6 Mbps -90 dBm BPSK 9 Mbps -89 dBm
QPSK 12 Mbps -88 dBm
QPSK 18 Mbps -86 dBm
16 QAM 24 Mbps -83 dBm
16 QAM 36 Mbps -79 dBm
64 QAM 48 Mbps -75 dBm
64 QAM 54 Mbps -73 dBm
Typical
sensitivity
Units
1VV0301495 Rev. 8 Page 36 of 64 2019-05-27
6.3.2.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Modulation
Data rate
Index
Typical
sensitivity
BPSK MCS0 -89 dBm QPSK MCS1 -86 dBm QPSK MCS2 -84 dBm 16 QAM MCS3 -81 dBm 16 QAM MCS4 -77 dBm 64 QAM MCS5 -72 dBm 64 QAM MCS6 -71 dBm 64 QAM MCS7 -70 dBm
6.3.2.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
Data rate
Index
Typical
sensitivity
BPSK MCS0 -86 dBm QPSK MCS1 -83 dBm QPSK MCS2 -81 dBm 16 QAM MCS3 -78 dBm 16 QAM MCS4 -74 dBm 64 QAM MCS5 -69 dBm 64 QAM MCS6 -68 dBm 64 QAM MCS7 -67 dBm
Units
Units
6.3.2.5. 802.11a (5GHz)
Modulation Data rate
Typical
sensitivity
BPSK 6 Mbps -91 dBm BPSK 9 Mbps -90 dBm QPSK 12 Mbps -89 dBm QPSK 18 Mbps -87 dBm 16 QAM 24 Mbps -84 dBm 16 QAM 36 Mbps -80 dBm 64 QAM 48 Mbps -76 dBm 64 QAM 54 Mbps -75 dBm
6.3.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0
Typical
sensitivity
-90 QPSK MCS1 -87 dBm QPSK MCS2 -85 dBm 16 QAM MCS3 -82 dBm 16 QAM MCS4 -78 dBm 64 QAM MCS5 -73 dBm 64 QAM MCS6 -72 dBm 64 QAM MCS7
-71
Units
Units
dBm
dBm
1VV0301495 Rev. 8 Page 37 of 64 2019-05-27
6.3.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0 64 QAM MCS7 256 QAM MCS8 256 QAM MCS9
Typical
sensitivity
-87
-68
-66 dBm
-65 dBm
6.3.2.8. 802.11ac, Channel BW = 80MHz (5GHz)
Modulation
Data rate
Index
256 QAM MCS8 256 QAM MCS9
Typical
sensitivity
-64 dBm
-63 dBm
6.3.3. Receiver Sensitivity at Hot Temperature
All measurements data are taken at +85°C and VDDIO=1.8V.
6.3.3.1. 802.11b (2.4GHz)
Modulation Data rate
Typical
sensitivity
BPSK 1 Mbps -92 dBm QPSK 2 Mbps -90 dBm CCK 5.5Mbps -87 dBm CCK 11 Mbps -86 dBm
Units
dBm dBm
Units
Units
6.3.3.2. 802.11g (2.4GHz)
Modulation Data rate
Typical
sensitivity
BPSK 6 Mbps -88 dBm BPSK 9 Mbps -87 dBm
QPSK 12 Mbps -86 dBm
QPSK 18 Mbps -84 dBm
16 QAM 24 Mbps -81 dBm
16 QAM 36 Mbps -77 dBm
64 QAM 48 Mbps -73 dBm
64 QAM 54 Mbps -72 dBm
6.3.3.3. 802.11n, Channel BW = 20MHz (2.4GHz)
Modulation
Data rate
Index
Typical
sensitivity
BPSK MCS0 -87 dBm QPSK MCS1 -84 dBm QPSK MCS2 -82 dBm 16 QAM MCS3 -79 dBm 16 QAM MCS4 -75 dBm 64 QAM MCS5 -70 dBm 64 QAM MCS6 -69 dBm 64 QAM MCS7 -68 dBm
Units
Units
1VV0301495 Rev. 8 Page 38 of 64 2019-05-27
6.3.3.4. 802.11n, Channel BW = 40MHz (2.4GHz)
Modulation
BPSK MCS0 -84 dBm QPSK MCS1 -81 dBm QPSK MCS2 -79 dBm 16 QAM MCS3 -76 dBm 16 QAM MCS4 -72 dBm 64 QAM MCS5 -67 dBm 64 QAM MCS6 -66 dBm 64 QAM MCS7 -65 dBm
6.3.3.5. 802.11a (5GHz)
Modulation Data rate
BPSK 6 Mbps -89 dBm BPSK 9 Mbps -88 dBm QPSK 12 Mbps -87 dBm QPSK 18 Mbps -85 dBm 16 QAM 24 Mbps -82 dBm 16 QAM 36 Mbps -78 dBm 64 QAM 48 Mbps -74 dBm 64 QAM 54 Mbps -73 dBm
Data rate
Index
Typical
sensitivity
Typical
sensitivity
Units
Units
6.3.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0
Typical
sensitivity
-86 QPSK MCS1 -85 dBm QPSK MCS2 -83 dBm 16 QAM MCS3 -80 dBm 16 QAM MCS4 -76 dBm 64 QAM MCS5 -71 dBm 64 QAM MCS6 -70 dBm 64 QAM MCS7
-69
6.3.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz)
Modulation
Data rate
Index
BPSK MCS0 64 QAM MCS7 256 QAM MCS8 256 QAM MCS9
Typical
sensitivity
-85
-66
-64 dBm
-63 dBm
6.3.3.8. 802.11ac, Channel BW = 80MHz (5GHz)
Units
dBm
dBm
Units
dBm dBm
Modulation
Data rate
Index
256 QAM MCS8 256 QAM MCS9
1VV0301495 Rev. 8 Page 39 of 64 2019-05-27
Typical
sensitivity
-62 dBm
-61 dBm
Units
WE866C3_Hardware_Design_Guide
7. DESIGN GUIDELINES
General PCB design guidelines
Ground stitch any ground planes to improve thermal dissipation. The VDD_3.3V main power rail must support > 700 mA (average). It is recommended to place a 10µF capacitor near the VDD_3.3V pins and a 2.2µF
on the VDDIO pin.
Keep power traces as wide as possible to lower the risk of IR drop. Wherever possible, add 30% current margin for all trace widths.
SDIO interface
The SDIO bus is the WLAN host interface and should be treated as a high-speed bus. Any design issue related SDIO signal integrity will result in lower bus speed thus lower data throughput
The recommendations below should be followed during the design:
Do not break the ground reference plane below any of the SDIO traces. Total trace length should be less than 4-inch and maximum 20 pF. SDIO signals trace length should be matched
o Reduce SDIO bus length as much as possible o Use SDIO_CLK as the target length. o Allow max of ±1mm variance with respect to SDIO_CLK
Spacing between traces: 2~3 times of trace width. Trace impedance: 50 Ω±10% Continue GND plane under top/bottom of SDIO traces are required. SDIO clock must be well isolated and via shielded where possible.
Voltage regulator
This section describes the VDD_3.3V power regulator requirements for designs using the WE866C3. It is intended for selecting the proper DC-DC regulator in the platform. There are a couple of options for supplying the required VDD_3.3V input such as Buck-boost, Buck or a Boost power regulator.
7.3.1. Recommended regulators
Manufacturer
Texas Instruments buck-boost TPS630242
Texas Instruments buck LM3281
Please refer to vendor reference design for typical application and PCB layout requirements.
Type
Part number
1VV0301495 Rev. 8 Page 40 of 64 2019-05-27
7.3.2. Regulator operating conditions
Below table shows the recommended operating conditions of the VDD_3.3V Buck-Boost voltage regulator:
Parameter
Condition Min Typ Max
Unit
Input Voltage range 2.5 4.75 V
Shutdown supply current 1 5 uA
Quiescent current IOUT=0mA, VOUT=3.3V 30 60 uA
Output voltage 3.3 V
Load Current 0.9 A
Output Voltage accuracy
(output voltage should be
PWM mode -2 2 2 %
maintained within these limits during all conditions including line voltage, load
PFM mode -4 4 4 %
current variations)
PWM mode 20 mVpp
Output ripple voltage
PFM mode 50 mVpp
Vout=3.3V, Iout=1300mA 85 90 %
Power efficiency
Vout=3.3V, Iout=1mA 80 85 %
IOUT = 0.2A to 1.2A
Overshoot/Undershoot
100 mV
IOUT = 1.2A to 0.2A
Buck mode, time taken for VOUT to reach 95% of its nominal value. VIN=4V,
1 mS
IOUT=200mA
Startup time
Boost mode, time taken for VOUT to reach 95% of its nominal value. VIN=3V,
2 mS
IOUT=200mA
Switching frequency 1.5 6 MHz
PFM mode
Output current to enter PFM mode
100 mA
Short circuit current limit 2.5 A
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WE866C3_Hardware_Design_Guide
Antenna requirements
7.4.1. Main Antenna
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read
carefully and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit device shall fulfil the
following requirements:
Frequency Range
2.412 ~ 2.484GHz
VSWR < 2:1 recommended
Gain (dBi) 1 typical
Max Input Power (W) 50
Input Impedance (Ω) 50
Polarization Type Vertical
7.4.2. Antenna Cable
Type
2.412 ~ 2.484GHz Cable insertion loss <1dB
Requirements
2.412~2.484GHz
4.9~5.925GHz
Requirements
4.9 ~ 5.925GHz Cable insertion loss <1dB
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7.4.3. Antenna design
When using the WE866C3, since there's no antenna connector on the module, the
antenna must be connected to the WE866C3 antenna pad by means of a transmission
line implemented on the PCB.
This transmission line shall fulfil the following requirements:
Item
Value
Characteristic Impedance 50 Ohm
Max Attenuation 0.3 dB
Coupling Coupling with other signals shall be avoided
Ground Plane
Cold End (Ground Plane) of antenna shall be equipotential to the module ground pins
The transmission line should be designed according to the following guidelines:
Ensure that the antenna line impedance is 50 ohm.
Keep the antenna line on the PCB as short as possible, since the antenna line loss
shall be less than 0.3 dB.
Avoid right angles whenever possible and route on the top layer only.
Antenna line must have uniform characteristics, constant cross section, avoid
meanders and abrupt curves.
Keep, if possible, one layer of the PCB used only for the Ground plane.
Surround (on the sides, over and under) the antenna line on PCB with Ground,
avoid having other signal tracks facing directly the antenna line track.
The ground around the antenna line on PCB has to be strictly connected to the
Ground Plane by placing vias every 2mm at least.
Place EM noisy devices as far as possible from module antenna line.
Keep the antenna line far away from the module power supply lines.
If you have EM noisy devices around the PCB hosting the module, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the
layers of PCB and surround it with Ground planes, or shield it with a metal frame
cover.
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WE866C3_Hardware_Design_Guide
If cases where EMI is not a concern, using a micro strip on the superficial copper
layer for the antenna line is recommended as the line attenuation will be lower than a buried one.
NOTE:
The following image is
showing the suggested
layout for the Antenna pad
connection (dimensions in mm):
7.4.4. Antenna installation Guidelines
Install the antenna in a place with WiFi signal coverage.
Antenna shall not be installed inside metal cases.
Antenna shall be installed according to antenna manufacturer instructions.
7.4.5. Antenna list
A list of antennas included in the application for certification is the following.
Item
Value
Vendor ATEL
Frequency range 2400~2500MHz, 4900~5925MHz
Impedance 50 Ohm
VSWR 2.2
Polarization Vertical
Emission Omnidirectional
Gain (2400~2500MHz, 4900~5925MHz)
2.5/4.5dB
Connector SMA m
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WE866C3_Hardware_Design_Guide
8. MECHANICAL DESIGN
Mechanical Dimensions
The WE866C3 overall dimensions are:
Length: 15 mm
Width: 13 mm
Thickness: 2.15 mm
Weight: 1 g
8.1.1. Mechanical Drawing
8.1.2. Top View
The figure below shows the mechanical top view of the WE866C3
Dimensions are in mm
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8.1.3. Bottom View
The figure below shows the mechanical Bottom view of the WE866C3
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8.1.4. Side View
The figure below shows mechanical side view of the WE866C3
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WE866C3_Hardware_Design_Guide
9. APPLICATION PCB DESIGN
The modules have been designed to be compliant with a standard lead-free SMT process
Recommended footprint for the application
Figure 2 Copper Pad Outline Top View
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WE866C3_Hardware_Design_Guide
In order to easily rework the module, it is suggested to add a 1.5 mm placement inhibit
area around the module. It is also suggested, as common rule for an SMT component, to
avoid having a mechanical part of the application in direct contact with the module.
The area under WIRING INHIBIT (see figure above) must be clear from signal or ground
paths.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper
Pad
Solder Mask
PCB
(Solder Mask Defined)
SMD
(Non Solder Mask Defined)
NSMD
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WE866C3_Hardware_Design_Guide
PCB pad dimensions
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of
0,3 mm around the pads unless it carries the same signal of the pad itself
Holes in pad are allowed only for blind holes and not for through holes.
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WE866C3_Hardware_Design_Guide
Recommendations for PCB pad surfaces:
Finish Layer Thickness (um)Properties
Electro-less Ni / Immersion Au
The PCB must be able to resist the higher temperatures which are occurring at the lead­free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
3 –7 / 0.05 – 0.15 good solder ability protection,
high shear force values
Stencil
Minimum stencil thickness recommended is 125um (5mil)
Solder paste
We recommend using only “no clean” solder paste in order to avoid the cleaning of
the modules after assembly.
Cleaning
In general, cleaning the module mounted on the carrier board is not recommended.
Residues between module and host board cannot be easily removed with any
cleaning method.
Cleaning with water or any organic solvent can lead to capillary effects where the
cleaning solvent is absorbed into the gap between the module and the host board
or even leak inside the module (due to the gap between the module shield and
PCB) . The combination of soldering flux residues and encapsulated solvent could
lead to short circuits between conductive parts. The solvent could also damage the
module label.
Ultrasonic cleaning could damage the module permanently. Especially for crystal
oscillators where the risk of damaging is very high.
1VV0301495 Rev. 8 Page 51 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
Solder reflow
Recommended solder reflow profile
Profile Feature Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up rate
Time maintained above:
– Temperature (TL)
– Time (tL)
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
Peak temperature (Tp) 245 +0/-5°C
Time within 5°C of actual peak temperature (tp) 10-30 seconds
Ramp-down rate 6°C/second max.
Time 25°C to peak temperature 8 minutes max.
WARNING:
The above solder reflow profile represents the typical SAC reflow limits and
does not guarantee adequate adherence of the module to the customer application throughout the temperature range. Customer must optimize the reflow profile depending on the overall system taking into account such factors as thermal mass and warpage.
The module withstands one reflow process only.
1VV0301495 Rev. 8 Page 52 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
10. PACKING SYSTEM
Tray
The WE866C3 modules are packaged on trays of 126 pieces each. These trays can be used in SMT processes for pick & place handling.
1VV0301495 Rev. 8 Page 53 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
Tray Drawing
1VV0301495 Rev. 8 Page 54 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
Moisture sensitivity
The module is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD-020. Customer should take care about all the related requirements for using this kind of components.
Moreover, the customer must take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
1VV0301495 Rev. 8 Page 55 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
11. CONFORMITY ASSESSMENT ISSUES
Declaration of Conformity
Hereby, Telit Communications S.p.A declares that the NB IOT Module is in compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red
1VV0301495 Rev. 8 Page 56 of 64 2019-05-27
WE866C3_Hardware_Design_Guide
12. SAFETY RECOMMENDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc.
Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication equipment is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical/
1VV0301495 Rev. 8 Page 57 of 64 2019-05-27
13. FCC/IC COMPLIANCE
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’ en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice
This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.
Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS
‐
102 de la fréquence radio (RF) ISED règles d'exposition. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. L'antenne doit être installée de
façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
1VV0301495 Rev. 8 Page 58 of 64 2019-05-27
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
List of applicable FCC rules
Parts 15C, 15E, 2.1091
Summary of the specific operational use conditions
See apart 7.4 Antenna requirements
Item
Vendor ATEL
Frequency range 2400~2500MHz, 4900~5925MHz
Impedance 50 Ohm
VSWR 2.2
Value
Polarization Vertical
Emission Omnidirectional
Gain (2400~2500MHz, 4900~5925MHz) 2.5/4.5dBi
1VV0301495 Rev. 8 Page 59 of 64 2019-05-27
Limited module procedures
N/A
Trace antenna designs
See 7.4.3 Antenna design
Antennas
This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Type Max Gain
Omnidirectional
4.5 dBi
Le présent émetteur radio a été approuvé par ISDE pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Type Gain maximal
Omnidirectional
Label and compliance information
The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module. The exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7WE866C3” or “Contains FCC ID: RI7WE866C3”.
4.5 dBi
Information on test modes and additional testing requirements
The module has been evaluated in mobile stand-alone conditions. For different operational conditions from a stand-alone modular transmitter in a host (multiple, simultaneously transmitting modules or other transmitters in a host), additional testing may be required (collocation, retesting…)
If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.
1VV0301495 Rev. 8 Page 60 of 64 2019-05-27
Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end product with an embedded module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
1VV0301495 Rev. 8 Page 61 of 64 2019-05-27
t
14. ACRONYMS
TTSC Telit Technical Support Center
USB Universal Serial Bus
HS High Speed
DTE Data Terminal Equipmen
UART Universal Asynchronous Receiver Transmitter
I/O Input Output
GPIO General Purpose Input Output
CMOS Complementary Metal –Oxide Semiconductor
CLK Clock
RTC Real Time Clock
PCB Printed Circuit Board
ESR Equivalent Series Resistance
VSWR Voltage Standing Wave Radio
VNA Vector Network Analyzer
RED Radio Equipment Directive
1VV0301495 Rev. 8 Page 62 of 64 2019-05-27
15. DOCUMENT HISTORY
Revision Date Changes
1 2018-02-07 First issue
2 2018-03-16 Updated mechanical drawings
Added note related to reflow cycles
3 2018-04-26 General updates following marketing samples verification
Updating package information
Update RF power values
4 2018-07-05 Updated TX Output power
5 2018-10-23 Updated current consumption values
Updated TX Output power values
6 2019-02-14 Updated Operating temperature range
Updated Packing system
7 2019-03-21 Added note related to Solder reflow
8 2019-05-27 Added antenna list
Added FCC/ISED Regulatory notices
1VV0301495 Rev. 8 Page 63 of 64 2019-05-27
[01.2017]
Mod.0818 2017-01 Rev.0
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