Telit Communications S p A ME910C1NV, ME910C1NA Users Guide

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ME910C1

HW User Guide

1VV03001351 Rev. 2 – 2017-07-19

Mod. 0805 2016-08 Rev.5

ME910C1 HW User Guide

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE (REMOVE UNUSED)

PRODUCTS

ME910C1-NA

ME910C1-NV

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Contents

NOTICE 2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

I. License Agreements ..................................................................... 3

II. Copyrighted Materials ................................................................... 3

III. High Risk Materials ....................................................................... 3

IV. Trademarks .................................................................................. 3

V. Third Party Rights ......................................................................... 3

APPLICABILITY TABLE (REMOVE UNUSED) ............................................. 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 8

Scope ........................................................................................... 8

Audience....................................................................................... 8

Contact Information, Support ........................................................ 8

Text Conventions .......................................................................... 9

Related Documents ...................................................................... 9

2. OVERVIEW ................................................................................ 10

3. PINS ALLOCATION ................................................................... 12

Pin-out ........................................................................................ 12

LGA Pads Layout ........................................................................ 20

4. POWER SUPPLY ....................................................................... 21

Power Supply Requirements ....................................................... 21

Power Consumption* .................................................................. 23

General Design Rules ................................................................. 24

4.3.1. Electrical Design Guidelines ....................................................... 24

4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 24

4.3.1.2. +12V Source Power Supply Design Guidelines .......................... 25

4.3.1.3. Battery Source Power Supply Design Guidelines ........................ 26

4.3.2. Thermal Design Guidelines ......................................................... 27

4.3.3. Power Supply PCB layout Guidelines ......................................... 27

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VAUX Power Output ................................................................... 29

5. DIGITAL SECTION .................................................................... 30

Logic Levels ................................................................................ 30

Power On.................................................................................... 30

Power Off.................................................................................... 36

Unconditional Shutdown ............................................................. 38

Fast power down ........................................................................ 41

5.5.1. Fast Shut Down by Hardware ..................................................... 41

5.5.2. Fast Shut Down by Software....................................................... 43

Communication ports .................................................................. 44

5.6.1. USB 2.0 HS ................................................................................ 44

5.6.2. SPI.............................................................................................. 45

5.6.2.1. SPI Connections ......................................................................... 45

5.6.2.2. Modem serial port 1 (USIF0) ....................................................... 46

5.6.2.3. Modem serial port 2 (USIF1) ....................................................... 48

5.6.2.4. RS232 level translation ............................................................... 48

General purpose I/O ................................................................... 49

5.7.1. Using a GPIO as INPUT ............................................................. 50

5.7.2. Using a GPIO as OUTPUT ......................................................... 51

5.7.3. Indication of network service availability ..................................... 51

External SIM Holder .................................................................... 53

ADC Converter ........................................................................... 53

6. RF SECTION .............................................................................. 54

Bands Variants ........................................................................... 54

TX Output power ......................................................................... 54

RX Sensitivity ............................................................................. 54

Antenna requirements................................................................. 54

6.4.1. PCB Design guidelines ............................................................... 56

6.4.2. PCB Guidelines in case of FCC Certification .............................. 58

6.4.2.1. Transmission line design ............................................................ 58

6.4.2.2. Transmission Line Measurements .............................................. 59

6.4.2.3. Antenna Installation Guidelines ................................................... 61

7. AUDIO SECTION ....................................................................... 62

Electrical Characteristics ............................................................. 62

Codec examples ......................................................................... 62

8. MECHANICAL DESIGN ............................................................. 63

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Drawing ...................................................................................... 63

9. APPLICATION PCB DESIGN .................................................... 64

Footprint ..................................................................................... 64

PCB pad design .......................................................................... 65

PCB pad dimensions .................................................................. 66

Stencil ......................................................................................... 67

Solder paste ............................................................................... 67

Solder Reflow ............................................................................. 68

10. PACKAGING .............................................................................. 70

Tray ............................................................................................ 70

Reel ............................................................................................ 71

Carrier Tape detail ...................................................................... 72

Reel detail ................................................................................... 73

Packaging detail ......................................................................... 74

Moisture sensitivity ..................................................................... 74

11. CONFORMITY ASSESSMENT ISSUES .................................... 75

FCC/ISED Regulatory notices ..................................................... 75

12. SAFETY RECOMMENDATIONS................................................ 78

READ CAREFULLY .................................................................... 78

13. ACRONYMS ............................................................................... 79

14. DOCUMENT HISTORY .............................................................. 80

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1. INTRODUCTION

Scope

Scope of this document is to give a description of some hardware solutions useful for

developing a product with the Telit ME910C1 module.

Audience

This document is intended for Telit customers, who are integrators, about to implement

their applications using our ME910C1 modules.

Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

 TS-EMEA@telit.com  TS-AMERICAS@telit.com  TS-APAC@telit.com  TS-SRD@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

Related Documents

 Telit_xE910_Global_Form_Factor_Application_Note_r13  Telit_Modem_Integration_Design_Guide_r0  SIM Holder Design Guides, 80000NT10001a

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2. OVERVIEW

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit ME910C1 module. In this document all the basic functions of a m2m module will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit ME910C1 module. For further hardware details that may not be explained in this document refer to the Telit ME910C1 Product Description document where all the hardware information is reported.

NOTE:

(EN) The integration of the ME910C1 cellular module within user application shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare ME910C1 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des ME910C1 Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija ME910C1 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo ME910C1 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire ME910C1 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

(HE)

ME910C1

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any

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infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

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3. PINS ALLOCATION

Pin-out

Pin Signal I/O Function Type Comment

USB HS 2.0 COMMUNICATION PORT

B15 USB_D+ I/O USB differential Data (+)

C15 USB_D- I/O USB differential Data (-)

A13 VUSB I Power sense for the

internal USB transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15 C103/TXD I Serial data input from DTE CMOS 1.8V

M15 C104/RXD O Serial data output to DTE CMOS 1.8V

M14 C108/DTR I Input for (DTR) from DTE CMOS 1.8V

L14 C105/RTS I Input for Request to send

CMOS 1.8V

signal (RTS) from DTE

P15 C106/CTS O Output for Clear to Send

CMOS 1.8V

signal (CTS) to DTE

N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V

P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V

R14 C125/RING O Output for Ring (RI) to

CMOS 1.8V

DTE

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ME910C1 HW User Guide

SIM Card Interface

A6 SIMCLK

A7 SIMRST

A5 SIMIO

A4 SIMIN

A3 SIMVCC

External SIM signal – Clock 1.8 / 3V

External SIM signal – Reset 1.8 / 3V

I/O

External SIM signal – Data

I/O

External SIM signal – Presence (active low)

External SIM signal –

Power supply for the SIM

1.8 / 3V

CMOS 1.8

1.8 / 3V

Internal

pullup (47K)

Digital Voice Interface (DVI)

B9 DVI_WA0

Digital Audio Interface

(WA0)

1.8V

B6 DVI_RX I Digital Audio Interface (RX) 1.8V

B7 DVI_TX

B8 DVI_CLK

Digital Audio Interface (TX) 1.8V

Digital Audio Interface

(CLK)

1.8V

SPI

D15 SPI_MOSI I SPI MOSI CMOS 1.8V

E15 SPI_MISO O SPI_MISO CMOS 1.8V

F15 SPI_CLK I SPI Clock CMOS 1.8V

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DIGITAL IO

STAT LED

C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V

is alternate

C9 GPIO_02 I/O GPIO_02 CMOS 1.8V

C10 GPIO_03 I/O GPIO_03 CMOS 1.8V

C11 GPIO_04 I/O GPIO_04 CMOS 1.8V

B14 GPIO_05 I/O GPIO_05 CMOS 1.8V

C12 GPIO_06 I/O GPIO_06 CMOS 1.8V

C13 GPIO_07 I/O GPIO_07 CMOS 1.8V

K15 GPIO_08 I/O GPIO_08 CMOS 1.8V

function

L15 GPIO_09 I/O GPIO_09 CMOS 1.8V

G15 GPIO_10 I/O GPIO_10 CMOS 1.8V

RF SECTION

ANTENNA I/O

LTE Antenna

(50 ohm)

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GNSS Section

ANT_GNSS I

GNSS_LNA_ENA O

Miscellaneous Functions

R13

R12

R11

HW_SHUTDOWN* I

ON_OFF* I

VAUX/PWRMON O

Power Supply

VBATT -

GNSS Antenna

(50 ohm)

External GNSS LNA

Enable

HW Unconditional

Shutdown

Input command for power

Supply Output for external

accessories / Power ON

Monitor

Main power supply

(Baseband)

CMOS 1.8V

1.8V Active low

1.8V

Power

VBATT -

VBATT_PA -

Main power supply

(Baseband)

Main power supply (Radio

PA)

Main power supply (Radio

PA)

Main power supply (Radio

PA)

Main power supply (Radio

PA)

Power

GND - Ground Power

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GND - Ground Power

ME910C1 HW User Guide

GND - Ground Power

P10

R10

M12

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GND - Ground Power

ME910C1 HW User Guide

B13

P13

E14

RESERVED

GND - Ground Power

RESERVED

RESERVED - RESERVED

RESERVED

RESERVED - RESERVED

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RESERVED - RESERVED

ME910C1 HW User Guide

A10

N10

N11

P11

B12

D12

N12

P12

F14

G14

H14

J14

RESERVED - RESERVED

K14

N13

L13

J13

M13

K13

H13

G13

F13

B11

B10

RESERVED - RESERVED

E13

D13

D14

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RESERVED - RESERVED

ME910C1 HW User Guide

A14

A12

A11

H15

J15

RESERVED - RESERVED

WARNING:

Reserved pins must not be connected.

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LGA Pads Layout

TOP VIEW

A B C D E F G H J K L M N P R

VBATT_

1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT

2 GND RES RES RES GND GND GND GND GND GND GND VBATT

SIMVC

4 SIMIN RES RES GND GND GND GND GND

RES RES RES RES RES RES RES RES RES RES GND GND GND GND

VBATT_

GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

SIMRS

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES

10 RES RES GPIO_03 RES GND GND

11 RES RES GPIO_04 RES RES

12 RES RES GPIO_06 RES GND RES RES

13 VUSB GND GPIO_07 RES RES RES RES RES RES RES RES RES RES GND

14 RES GPIO_05 RES RES GND RES RES RES RES RES

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 RES RES GPIO_08 GPIO_09

DVI_TX RES RES RES

DVI_WA

GPIO_02 RES GND

C105/RTS C108/DTR C109/DCD C107/DSR C125/RI

C104/RXD C103/TXD C106/CT

GNSS_L

NA_EN

ANT_GN

VAUX/P WRMON

ON_OFF

HW_SH

UTDOW

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4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product

design and they strongly reflect on the product overall performances, hence read carefully

the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must

fulfil the following requirements:

Power Supply

Nominal Supply Voltage 3.8V

Normal Operating Voltage

3.40 V÷ 4.20 V

Range

Extended Operating

3.10 V÷ 4.50 V

Voltage Range

Value

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NOTE:

The Operating Voltage Range MUST never be exceeded;

care must be taken when designing the application’s

power supply section to avoid having an excessive voltage

drop. If the voltage drop is exceeding the limits it could

cause a Power Off of the module.

The Power supply must be higher than 3.10 V to power on

the module.

Overshoot voltage (regarding MAX Extended Operating

Voltage) and drop in voltage (regarding MIN Extended

Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only

with completely assumption and application of the HW

User guide suggestions.

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Power Consumption*

Mode Average

Mode Description

(mA)

Switched off 0.007mA Module supplied but switched off

IDLE mode

AT+CFUN=1 11.80 mA Normal mode: full functionality of the module

AT+CFUN=4 11.80 mA Disabled TX and RX; module is not registered on

the network

AT+CFUN=5 1.20 mA 2.56 secs DRx cycle

0.90 mA 81.92 secs DRx cycle

11.80mA RRC_CONNECTED (10.24 secs C-DRX)

0.70 mA RRC_IDLE (43.69 minutes I-DRx cycle)

Operative Mode

LTE Data call 130mA Channel BW 10MHz, RB=1, TX=0dBm

145mA Channel BW 10MHz, RB=1, TX=20dBm

190mA Channel BW 10MHz, RB=1, TX=23dBm

PSM Mode

AT#PSM=1 0.007mA No current drain from PSM pins

GPS

GNSS 29.00 mA GNSS Standalone 1Hz Tracking ( Non-Dpo)

*Preliminary data

NOTE: The electrical design for the Power supply should be made

ensuring it will be capable of a peak current output of at least:

0.8 A for LTE mode (3.80V supply).

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NOTE: The reported values are an average among all the product

variants and bands for each network wireless technology.

The support of specific network wireless technology depends on

product variant configuration.

General Design Rules

The principal guidelines for the Power Supply Design embrace three different design

steps:

 the electrical design

 the thermal design

the PCB layout.



4.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where

this power is drained. We will distinguish them into three categories:

 +5V input (typically PC internal regulator output)

 +12V input (typically automotive)

 Battery

4.3.1.1. +5V Source Power Supply Design Guidelines

 The desired output for the power supply is 3.8V, hence there's not a big difference

between the input source and the desired output and a linear regulator can be used.

A switching power supply will not be suited because of the low drop out

requirements.

 When using a linear regulator, a proper heat sink shall be provided in order to

dissipate the power generated.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks close to the Module, a 100μF capacitor is usually

suited.

 Make sure the low ESR capacitor on the power supply output rated at least 10V.

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An example of linear regulator with 5V input is:

Guidelines

4.3.1.2. +12V Source Power Supply Design Guidelines

 The desired output for the power supply is 3.8V, hence due to the big difference

between the input source and the desired output, a linear regulator is not suited and

shall not be used. A switching power supply will be preferable because of its better

efficiency.

 When using a switching regulator, a 500kHz or more switching frequency regulator

is preferable because of its smaller inductor size and its faster transient response.

This allows the regulator to respond quickly to the current peaks absorption.

 In any case the frequency and Switching design selection is related to the

application to be developed due to the fact the switching frequency could also

generate EMC interferences.

 For car PB battery the input voltage can rise up to 15,8V and this should be kept in

mind when choosing components: all components in the power supply must

withstand this voltage.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks, a 100μF capacitor is usually suited.

 Make sure the low ESR capacitor on the power supply output is rated at least 10V.

 For Car applications a spike protection diode should be inserted close to the power

input, in order to clean the supply from spikes.

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An example of switching regulator with 12V input is in the below schematic:

4.3.1.3. Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage

allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the

power to the Telit ME910C1 module.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks, a 100μF tantalum capacitor is usually suited.

 Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

 A protection diode should be inserted close to the power input, in order to save the

ME910C1 from power polarity inversion. Otherwise the battery connector should be

done in a way to avoid polarity inversions when connecting the battery.

 The battery must be rated to supply peaks of current up to 0.8 A for LTE.

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NOTE:

DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly

connected with ME910C1. Their use can lead to overvoltage on the

ME910C1 and damage it. USE ONLY Li-Ion battery types.

4.3.2. Thermal Design Guidelines

Worst case as reference values for thermal design of ME910C1 are:

 Average current consumption: 800 mA

 Supply voltage: 3.80V

NOTE:

Make PCB design in order to have the best connection of GND pads

to large surfaces.

NOTE:

The ME910C1 includes a function to prevent overheating.

4.3.3. Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR

capacitor on the output to cut the current peaks on the input to protect the supply from

spikes The placement of this component is crucial for the correct working of the circuitry.

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A misplaced component can be useless or can even decrease the power supply

performances.

 The Bypass low ESR capacitor must be placed close to the Telit ME910C1 power

input pads or in the case the power supply is a switching type it can be placed close

to the inductor to cut the ripple provided the PCB trace from the capacitor to the

ME910C1 is wide enough to ensure a dropless connection even during an 0.8 A

current peak.

 The protection diode must be placed close to the input connector where the power

source is drained.

 The PCB traces from the input connector to the power regulator IC must be wide

enough to ensure no voltage drops occur when an 2 A current peak is absorbed

(worst case of GSM mode).

 The PCB traces to the ME910C1 and the Bypass capacitor must be wide enough to

ensure no significant voltage drops occur. This is for the same reason as previous

point. Try to keep this trace as short as possible.

 To reduce the EMI due to switching, it is important to keep very small the mesh

involved; thus the input capacitor, the output diode (if not embodied in the IC) and

the regulator have to form a very small loop.This is done in order to reduce the

radiated field (noise) at the switching frequency (100-500 kHz usually).

 A dedicated ground for the Switching regulator separated by the common ground

plane is suggested.

 The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped

to any noise sensitive circuitry as the microphone amplifier/buffer or earphone

amplifier.

 The power supply input cables should be kept separate from noise sensitive lines

such as microphone/earphone cables.

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ME910C1 HW User Guide

 The insertion of EMI filter on VBATT pins is suggested in those designs where

antenna is placed close to battery or supply lines. A ferrite bead like Murata

BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this

purpose.

 The below figure shows the recommended circuit:

VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the

module. The signal is present on Pad R11 and it is in common with the PWRMON

(module powered ON indication) function.

This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Item Min Typical Max

Output voltage

Output current - - 60mA

Output bypass capacitor

(inside the module)

1.78V

1uF

1.80V

1.82V

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ME910C1 HW User Guide

5. DIGITAL SECTION

Logic Levels

Parameter Min Max

ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL

Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V

Operating Range - Interface levels (1.8V CMOS)

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9V

Output low level 0V 0.2V

Parameter AVG

CURRENT CHARACTERISTICS:

Output Current 1mA

Input Current 1uA

Power On

To turn on the ME910C1 the pad ON_OFF* must be tied low for at least 1 second and

then released.

The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.

Figure 1 illustrates a simple circuit to power on the module using an inverted buffer output.

Figure 1: Power-on Circuit

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NOTE:

Don't use any pull up resistor on the ON_OFF* line, it is

internally pulled up. Using pull up resistor may bring to

latch up problems on the ME910C1 power regulator and

improper power on/off of the module. The line ON_OFF*

must be connected only in open collector or open drain

configuration.

In this document all the lines that are inverted, hence have

active low signals are labelled with a name that ends

with”#",”*” or with a bar over the name.

To check if the device has powered on, the hardware line

PWRMON should be monitored.

It is mandatory to avoid sending data to the serial ports

during the first 200ms of the module start-up.

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ME910C1 HW User Guide

A flow chart showing the proper turn on procedure is displayed below:

“Modem ON Proc”

START

VBATT >

PWRMON=ON

ON_OFF* = LOW

Delay = 5 sec (see note

GO TO

“HW Shutdown

ON_OFF* = HIGH

PWRMON=ON

Delay = 1 sec

GO TO

“Start AT Commands””

“Modem ON Proc”

END

When the USB is connected or after the firmware updating,

Delay must be equal at least to 10 seconds.

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ME910C1 HW User Guide

A flow chart showing the AT commands managing procedure is displayed below:

“Start AT CMD”

START

Delay = 300 msec

Enter AT <CR>

AT answer in

1 sec ?

GO TO

“HW Shutdown

Unconditional”

“Start AT CMD”

END

GO TO

“Modem ON Proc.”

NOTE:

In order to avoid a back powering effect it is recommended

to avoid having any HIGH logic level signal applied to the

digital pins of the ME910C1 when the module is powered

off or during an ON/OFF transition.

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ME910C1 HW User Guide

For example:

1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:

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WARNING

It is recommended to set the ON_OFF* line LOW to power

on the module only after VBATT is higher than 3.10V.

In case this condition it is not satisfied you could use the

HW_SHUTDOWN* line to recover it and then restart the

power on activity using the ON_OFF * line.

An example of this is described in the following diagram.

Power ON diagram:

After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on

the module.

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ME910C1 HW User Guide

Power Off

Turning off of the device can be done in two ways:

• via AT command (see ME910C1 Software User Guide, AT#SHDN)

• by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will

not be reachable any more.

To turn OFF the ME910C1 the pad ON_OFF* must be tied low for at least 3 seconds and

then released.

NOTE:

To check if the device has been powered off, the hardware

line PWRMON must be monitored. The device is powered

off when PWRMON goes low.

In order to avoid a back powering effect it is recommended

to avoid having any HIGH logic level signal applied to the

digital pins of the ME910C1 when the module is powered

off or during an ON/OFF transition.

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Unconditional”

than 15s?

The following flow chart shows the proper turn off procedure:

“Modem OFF Proc.”

START

PWRMON=ON?

OFF Mode

AT#SHDN

PWRMON=ON?

Looping for more

ON_OFF* = LOW

Delay >= 3 sec

ON_OFF* = HIGH

“Modem OFF Proc.”

END

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GO TO

“HW SHUTDOWN

ME910C1 HW User Guide

Unconditional Shutdown

HW_SHUTDOWN* is used to unconditionally shutdown the ME910C1. Whenever this

signal is pulled low, the ME910C1 is reset. When the device is reset it stops any

operation. After the release of the line, the ME910C1 is unconditionally shut down, without

doing any detach operation from the network where it is registered. This behaviour is not a

proper shut down because any WCDMA device is requested to issue a detach request on

turn off. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a

proper power-on reset sequence, so there's no need to control this pin on start-up.

To unconditionally shutdown the ME910C1, the pad HW_SHUTDOWN* must be tied low

for at least 200 milliseconds and then released.

The signal is internally pulled up so the pin can be left floating if not used.

If used, then it must always be connected with an open collector transistor, to permit

to the internal circuitry the power on reset and under voltage lockout functions.

PIN DESCRIPTION

Signal Function I/O PAD

HW_SHUTDOWN*

Unconditional Shutdown of the Module

I R13

OPERATING LEVELS

Signal Status Min Max

HW_SHUTDOWN* Input high 1.5V 1.9V

HW_SHUTDOWN* Input low 0V 0.35V

WARNING:

The hardware unconditional Shutdown must not be used during

normal operation of the device since it does not detach the device

from the network. It shall be kept as an emergency exit procedure.

A typical circuit is the following:

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For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem

pole output of a +3/5 V microcontroller (uP_OUT2):

NOTE:

In order to avoid a back powering effect it is recommended to avoid

having any HIGH logic level signal applied to the digital pins of the

ME910C1 when the module is powered off or during an ON/OFF

transition.

In the following flow chart is detailed the proper restart procedure:

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ME910C1 HW User Guide

HW SHUTDOWN

START

HW SHUTDOWN

END

“

HW_SHUTDOWN* = LOW

Unconditional”

Delay = 200ms

Delay = 1s

HW_SHUTDOWN* = HIGH

Disconnect

VBATT

PWRMON = ON

“

Unconditional”

NOTE:

Do not use any pull up resistor on the HW_SHUTDOWN* line nor any

totem pole digital output. Using pull up resistor may bring to latch up

problems on the ME910C1 power regulator and improper functioning

of the module.

To proper power on again the module please refer to the related

paragraph (“Power ON”)

The unconditional hardware shutdown must always be implemented

on the boards and should be used only as an emergency exit

procedure.

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ME910C1 HW User Guide

Fast power down

The procedure to power off ME910C1 described in Chapter 5.3 normally takes more than

1 second to detach from network and make ME910C1 internal filesystem properly closed.

In case of unwanted supply voltage loss the system can be switched off without any risk of

filesystem data corruption by implementing Fast Shut Down feature.

Fast Shut Down feature permits to reduce the current consumption and the time-to-

poweroff to minimum values.

NOTE:

Refer to ME910C1 series AT command reference guide (Fast power

down - #FASTSHDN) in order to set up detailed AT command.

5.5.1. Fast Shut Down by Hardware

The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW

level transition of GPIO commands fast power down.

Example circuit:

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ME910C1 HW User Guide

NOTE:

In case of power on with slow ramp-up of Vbatt supply voltage while

ON/OFF* is tied to GND (case possibile if timing are not properly

controlled), HW_SHUTDOWN* line has to be used according to

power on diagram in chapter 5.2.

NOTE:

Consider voltage drop under max current conditions when defining

the voltage detector thereshold in order to avoid unwanted shutdown.

Tipical timings are reported in the plot above when testing the example circuit with

Ctank=47mF.

The capacitor is rated with the following formula:

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ME910C1 HW User Guide

where 80mA is a typical current during fast shut down procedure, 300ms is the typical

time to execute the shutdown and 0.5V is the minimum voltage marging from threshold of

ME910C1 hardware reset.

TIP:

Make the same plot during system verification to check timings and

voltage levels.

5.5.2. Fast Shut Down by Software

The Fast Power Down can be triggered by AT command.

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Communication ports

5.6.1. USB 2.0 HS

The ME910C1 includes one integrated universal serial bus (USB 2.0 HS) transceiver.

The following table is listing the available signals:

PAD Signal I/O Function Type NOTE

B15 USB_D+ I/O USB differential Data (+) 3.3V

C15 USB_D- I/O USB differential Data (-) 3.3V

A13 VUSB AI

Power sense for the internal USB transceiver.

Accepted range:

4.4V to 5.25V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.

The signal traces should be routed carefully. Trace lengths, number of vias and capacitive

loading should be minimized. The characteristic impedance value should be as close as

possible to 90 Ohms differential.

In case there is a need to add an ESD protection, the suggested connection is the

following:

NOTE:

VUSB pin should be disconnected before activating the

Power Saving Mode.

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5.6.2. SPI

The ME910C1 Module is provided by a standard 3-wire master SPI interface.

The following table is listing the available signals:

NOTE: Final Position of SPI still under definition

PAD Signal I/O Function Type NOTE

D15 SPI_MOSI O SPI MOSI

E15 SPI_MISO I SPI MISO

F15 SPI_CLK O SPI Clock

CMOS

1.8V

CMOS

1.8V

CMOS

1.8V

Shared

with

TX_AUX

Shared

with

RX_AUX

NOTE:

Due to the shared functions, when the SPI port is used, it is

not possible to use the AUX_UART port.

5.6.2.1. SPI Connections

ME910C1

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Serial Ports

The ME910C1 module is provided with by 2 Asynchronous serial ports:

• MODEM SERIAL PORT 1 (Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the

most common are:

• RS232 PC com port

• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may

be needed to make the system work. On the ME910C1 the ports are CMOS 1.8.

5.6.2.2. Modem serial port 1 (USIF0)

The serial port 1 on the ME910C1 is a +1.8V UART with all the 7 RS232 signals. It differs

from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

The following table is listing the available signals:

RS232

Signal PAD Name Usage

Output from the ME910C1

1 C109/DCD

N14

Data Carrier Detect

that indicates the carrier

presence

2 C104/RXD

3 C103/TXD

M15

N15

Transmit line *see Note

Receive line *see Note

Output transmit line of ME910C1 UART

Input receive of the ME910C1 UART

Input to the ME910C1 that

4 C108/DTR

M14

Data Terminal Ready

controls the DTE READY condition

M12

5 GND

B13,

Ground Ground

P13,

E14

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ME910C1 HW User Guide

6 C107/DSR

7 C106/CTS

8 C105/RTS

9 C125/RING

P14

P15

L14

R14

Data Set Ready

Clear to Send

Request to Send

Ring Indicator

Output from the ME910C1 that indicates the module is ready

Output from the ME910C1 that controls the Hardware flow control

Input to the ME910C1 that controls the Hardware flow control

Output from the ME910C1 that indicates the incoming call condition

NOTE:

According to V.24, some signal names are referred to the

application side, therefore on the ME910C1 side these

signal are on the opposite direction:

TXD on the application side will be connected to the

receive line (here named C103/TXD)

RXD on the application side will be connected to the

transmit line (here named C104/RXD)

For a minimum implementation, only the TXD, RXD lines

can be connected, the other lines can be left open provided

a software flow control is implemented.

In order to avoid a back powering effect it is recommended

to avoid having any HIGH logic level signal applied to the

digital pins of the ME910C1 when the module is powered

off or during an ON/OFF transition.

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5.6.2.3. Modem serial port 2 (USIF1)

The secondary serial port on the ME910C1 is a CMOS1.8V with only the RX and TX

signals.

The signals of the ME910C1 serial port are:

PAD Signal I/O Function Type NOTE

D15 TX_AUX O

E15 RX_AUX I

NOTE:

Due to the shared pins, when the Modem Serial port is

used, it is not possible to use the SPI functions.

In order to avoid a back powering effect it is recommended

to avoid having any HIGH logic level signal applied to the

digital pins of the ME910C1 when the module is powered

Auxiliary UART (TX Data to DTE)

Auxiliary UART (RX Data from DTE)

CMOS

1.8V

CMOS

1.8V

Shared with SPI_MOSI

Shared with SPI_MISO

off or during an ON/OFF transition.

5.6.2.4. RS232 level translation

In order to interface the ME910C1 with a PC com port or a RS232 (EIA/TIA-232)

application a level translator is required. This level translator must:

• invert the electrical signal in both directions;

• Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with

lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio

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ME910C1 HW User Guide

on the level translator. Note that the negative signal voltage must be less than 0V and

hence some sort of level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level

translator. There are a multitude of them, differing in the number of drivers and receivers

and in the levels (be sure to get a true RS232 level translator not a RS485 or other

standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.

The receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

An example of RS232 level

adaptation circuitry could be done

using a MAXIM transceiver

(MAX218)

In this case the chipset is capable

to translate directly from 1.8V to

the RS232 levels (Example done

on 4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following

layout:

General purpose I/O

The ME910C1 module is provided by a set of Configurable Digital Input / Output pins

(CMOS 1.8V). Input pads can only be read; they report the digital value (high or low)

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ME910C1 HW User Guide

present on the pad at the read time. Output pads can only be written or queried and set

the value of the pad output.

An alternate function pad is internally controlled by the ME910C1 firmware and acts

depending on the function implemented.

The following table shows the available GPIO on the ME910C1:

PAD Signal I/O Drive

Strength

C8 GPIO_01 I/O

C9 GPIO_02 I/O

C10 GPIO_03 I/O

C11 GPIO_04 I/O

B14 GPIO_05 I/O

C12 GPIO_06 I/O

C13 GPIO_07 I/O

K15 GPIO_08 I/O

L15 GPIO_09 I/O

G15 GPIO_10 I/O

(TBD) mA

Default

NOTE

State

INPUT Alternate function STAT LED

INPUT

5.7.1. Using a GPIO as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another

device and report its status, provided this device has interface levels compatible with the

1.8V CMOS levels of the GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface

levels different from the 1.8V CMOS, then it can be buffered with an open collector

transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.

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NOTE:

In order to avoid a back powering effect it is recommended

to avoid having any HIGH logic level signal applied to the

digital pins of the ME910C1 when the module is powered

off or during an ON/OFF transition.

5.7.2. Using a GPIO as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or

compatible hardware. When set as outputs, the pads have a push-pull output and

therefore the pull-up resistor may be omitted.

5.7.3. Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call

status.

The function is available as alternate function of GPIO_01 (to be enabled using the

AT#GPIO=1,0,2 command).

In the ME910C1 modules, the STAT_LED needs an external transistor to drive an

external

LED and its voltage level is defined accordingly to the table below:.

Device Status Led Status

Device off Permanently off

Not Registered Permanently on

Registered in idle Blinking 1sec on + 2 sec off

Registered in idle + power saving

Connecting Blinking 1 sec on + 2 sec off

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It depends on the event that triggers the wakeup (In sync with network paging)

ME910C1 HW User Guide

The reference schematic for LED indicator,

R3 must be calculated taking in account VBATT value and LED type. :

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ME910C1 HW User Guide

External SIM Holder

Please refer to Error! Reference source not found. the related User Guide (SIM Holder

Design Guides, 80000NT10001a).

ADC Converter

The ME910C1 is provided by one AD converter. It is able to read a voltage level in the

range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.

The input line is named as ADC_IN1 and it is available on Pad B1

The following table is showing the ADC characteristics:

Item Min Typical Max Unit

Input Voltage range 0 - 1.2 Volt

AD conversion - - 10 bits

Input Resistance 1 - - Mohm

Input Capacitance - 1 - pF

The ADC could be controlled using an AT command.

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this

function.

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ME910C1 HW User Guide

6. RF SECTION

Bands Variants

Product LTE bands

ME910C1-NV B4,B13

ME910C1-NA B2,B4,B12

TX Output power

Band dBm

LTE All bands 23(+-2)

RX Sensitivity

Measurement setup

Band

LTE Throughput >95& 10 Mhz

ME910C1-NA

ME910C1-NV

Band dBm

Band 2 -103.0 ( Preliminary)

Band 4 -102.5 ( Preliminary)

Band 12 -103.0 (Preliminary)

Band 13 -103.0 (Preliminary)

Antenna requirements

The antenna connection and board layout design are the most important aspect in the full

product design as they strongly affect the product overall performances, hence read

carefully and follow the requirements and the guidelines for a proper design.

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The antenna and antenna transmission line on PCB for a Telit ME910C1 device shall fulfil

the following requirements:

ME910C1-NA

ME910C1-NV

Item Value

Depending by frequency band(s) provided by the network

Frequency range

operator, the customer shall use the most suitable antenna for that/those band(s)

140 MHz in LTE Band 2

Bandwidth

445 MHz in LTE Band 4

47 MHz in LTE Band 12

41 MHz in LTE Band 13

Impedance 50 ohm

Input power > 24dBm Average power

VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)

VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)

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ME910C1 HW User Guide

6.4.1. PCB Design guidelines

When using the ME910C1, since there's no antenna connector on the module, the

antenna must be connected to the ME910C1 antenna pad (K1) by means of a

transmission line implemented on the PCB.

This transmission line shall fulfil the following requirements:

Item Value

Characteristic

Impedance

50 ohm (+-10%)

Max Attenuation 0,3 dB

Coupling Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be equipotential to the ME910C1 ground pins

The transmission line should be designed according to the following guidelines:

• Make sure that the transmission line’s characteristic impedance is 50ohm ;

• Keep line on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;

• Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt

curves;

• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar

Waveguide...) can be used for implementing the printed transmission line afferent the antenna;

• If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently

extended, so the geometry can be as similar as possible to the related canonical model;

• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this

layer as reference Ground plane for the transmission line;

• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal

tracks facing directly the antenna line track.

• Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;

• The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground

Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line

track;

• Place EM noisy devices as far as possible from ME910C1 antenna line;

• Keep the antenna line far away from the ME910C1 power supply lines;

• If EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the

ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surround

it with Ground planes, or shield it with a metal frame cover.

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• If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded

Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a

Stripline having same length;

The following image is showing the suggested layout for the Antenna pad

connection:

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ME910C1 HW User Guide

6.4.2. PCB Guidelines in case of FCC Certification

In the case FCC certification is required for an application using ME910C1, according to

FCC KDB 996369 for modular approval requirements, the transmission line has to be

similar to that implemented on ME910C1 interface board and described in the following

chapter.

6.4.2.1. Transmission line design

During the design of the ME910C1 interface board, the placement of components has

been chosen properly, in order to keep the line length as short as possible, thus leading to

lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been

chosen, since this kind of transmission line ensures good impedance control and can be

implemented in an outer PCB layer as needed in this case. A SMA female connector has

been used to feed the line.

The interface board is realized on a FR4, 4-layers PCB. Substrate material is

characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1

GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm,

clearance from coplanar ground plane = 0.3 mm each side. The line uses reference

ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height

of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω,

estimated line loss is less than 0.1 dB. The line geometry is shown below:

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ME910C1 HW User Guide

6.4.2.2. Transmission Line Measurements

An HP8753E VNA (Full-2-port calibration) has been used in this measurement session.

A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a

SMA connector has been soldered to the board in order to characterize the losses of the

transmission line including the connector itself. During Return Loss / impedance

measurements, the transmission line has been terminated to 50 Ω load.

Return Loss plot of line under test is shown below:

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ME910C1 HW User Guide

Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω

load) is shown in the following figure:

Insertion Loss of G-CPW line plus SMA connector is shown below:

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ME910C1 HW User Guide

6.4.2.3. Antenna Installation Guidelines

 Install the antenna in a place covered by the LTE signal.

 Antenna must not be installed inside metal cases

 Antenna shall also be installed according Antenna manufacturer instructions

 Antenna integration should optimize the Radiation Efficiency. Efficiency values >

50% are recommended on all frequency bands

 Antenna integration should not dramatically perturb the radiation pattern. It is

preferable to get, after antenna installation, an omnidirectional radiation pattern, at

least in one pattern cut

 Antenna Gain must not exceed values indicated in regulatory requirements, where

applicable, in order to meet related EIRP limitations. Typical antenna Gain in most

M2M applications does not exceed 2dBi

 If the device antenna is located farther than 20cm from the human body and there

are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the

end product

 If the device antenna is located closer than 20cm from the human body or there are

co-located transmitter then the additional FCC/IC testing may be required for the

end product (Telit FCC/IC approvals cannot be reused)

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7. AUDIO SECTION

The Telit digital audio interface (DVI) of the ME910C1 Module is based on the I2S serial

bus interface standard. The audio port can be directly connected to end device using

digital interface, or via one of the several compliant codecs (in case an analog audio is

needed).

Electrical Characteristics

The product is providing the DVI on the following pins:

Pin Signal I/O Function Internal

Pull Up

B9 DVI_WA0

B6 DVI_RX I Digital Audio Interface (RX) CMOS 1.8V

B7 DVI_TX O Digital Audio Interface (TX) CMOS 1.8V

B8 DVI_CLK I/O Digital Audio Interface (BCLK) CMOS 1.8V

I/O Digital Audio Interface (Word

Alignment / LRCLK)

CMOS 1.8V

Type

Codec examples

Please refer to the Digital Audio Application note.

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PIN B1

8. MECHANICAL DESIGN

Drawing

Dimensions in mm

Lead Free Alloy:

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9. APPLICATION PCB DESIGN

The ME910C1 modules have been designed in order to be compliant with a standard lead- free SMT process

Footprint

TOP VIEW

In order to easily rework the ME910C1 is suggested to consider on the application a 1.5

mm placement inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a

mechanical part of the application in direct contact with the module.

NOTE:

In the customer application, the region under WIRING

INHIBIT (see figure above) must be clear from signal or

ground paths.

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PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Copper

SMD

(Solder Mask Defined)

Solder Mask

PCB

NSMD

(Non Solder Mask Defined)

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PCB pad dimensions

The recommendation for the PCB pads dimensions are described in the following image

(dimensions in mm)

Solder resist openings

It is not recommended to place via or micro-via not covered by solder resist in an area of

0,3 mm around the pads unless it carries the same signal of the pad itself

Inhibit area for micro-via

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Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer Thickness (um) Properties

Electro-less Ni /

Immersion Au

3 –7 / 0.05 – 0.15 good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead-

free process. This issue should be discussed with the PCB-supplier. Generally, the

wettability of tin-lead solder paste on the described surface plating is better compared to

lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended

Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we

suggest a thickness of stencil foil ≥ 120 µm.

Solder paste

Item Lead Free

Solder Paste Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly

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Solder Reflow

Recommended solder reflow profile:

Profile Feature Pb-Free Assembly Free

Average ramp-up rate (TL to TP)

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

Tsmax to TL

– Ramp-up Rate

Time maintained above:

– Temperature (TL)

– Time (tL)

Peak Temperature (Tp)

Time within 5°C of actual Peak

Temperature (tp)

Ramp-down Rate

150°C

200°C

217°C

10-30 seconds

3°C/second max

60-180 seconds

3°C/second max

60-150 seconds

245 +0/-5°C

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

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NOTE:

All temperatures refer to topside of the package, measured

on the package body surface

WARNING:

THE ME910C1 MODULE WITHSTANDS ONE REFLOW

PROCESS ONLY.

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10. PACKAGING

Tray

The ME910 modules are packaged on trays that can be used in SMT processes for pick &

place handling.The first Marketing and Engineering samples of the ME910C1 series will

be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).

Please note that Telit is going to introduce a new packaging for the xE910 family, as per

the Product Change Notification PCN-0000-14-0055, therefore the mass production units

of ME910C1 will be shipped according to the following drawings:

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Reel

The ME910 can be packaged on reels of 200 pieces each. See figure for module

positioning into the carrier.

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Carrier Tape detail

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Reel detail

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Packaging detail

Moisture sensitivity

The ME910C1 is a Moisture Sensitive Device level 3, in according with standard

IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of

components.

Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity

(RH).

b) Environmental condition during the production: 30°C / 60% RH according to

IPC/JEDEC J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must

be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH

or more

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11. CONFORMITY ASSESSMENT ISSUES

FCC/ISED Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any

changes or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en

soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de

l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt

RSS standard(s). Operation is subject to the following two conditions: (1) this device may

not cause interference, and (2) this device must accept any interference, including

interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules.

Antenna gain must be below:

Band ME910C1-NA ME910C1-NV

FDD 4

FDD 2

FDD 12

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6,00 dBi 6,00 dBi

9,01 dBi --

6,63 dBi --

ME910C1 HW User Guide

FDD 13

-- 6,94 dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter

Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition.

Gain de l’antenne doit étre ci-dessous :

Band ME910C1-NA ME910C1-NV

FDD 4

FDD 2

6,00 dBi 6,00 dBi

9,01 dBi --

FDD 12

FDD 13

6,63 dBi --

-- 6,94 dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

CAN ICES-3 (B) / NMB-3 (B)

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This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

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12. SAFETY RECOMMENDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc.

 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available,

while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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13. ACRONYMS

TTSC

USB

DTE

UMTS

WCDMA

HSDPA

HSUPA

UART

HSIC

SIM

SPI

ADC

DAC

I/O

GPIO

CMOS

MOSI

MISO

CLK

RTC

PCB

ESR

VSWR

VNA

Telit Technical Support Centre

Universal Serial Bus

High Speed

Data Terminal Equipment

Universal Mobile Telecommunication System

Wideband Code Division Multiple Access

High Speed Downlink Packet Access

High Speed Uplink Packet Access

Universal Asynchronous Receiver Transmitter

High Speed Inter Chip

Subscriber Identification Module

Serial Peripheral Interface

Analog – Digital Converter

Digital – Analog Converter

Input Output

General Purpose Input Output

Complementary Metal – Oxide Semiconductor

Master Output – Slave Input

Master Input – Slave Output

Clock

Chip Select

Real Time Clock

Printed Circuit Board

Equivalent Series Resistance

Voltage Standing Wave Radio

Vector Network Analyzer

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14. DOCUMENT HISTORY

Revision Date Changes

0 2017-01-16 First issue (preliminary)

2017-02-10

2017-07-20

Power consumption and Pinout clarification

Added par.11 – Conformity Assesment Issues

1VV0301351 Rev. 2 Page 80 of 81 2017-07-19

Mod. 0805 2016-08 Rev.5

Telit Communications S p A ME910C1NV, ME910C1NA Users Guide

Specifications and Main Features

Frequently Asked Questions

User Manual