Telit Communications S p A LE920A4NA User Manual

LE920A4 Auto
HW User Guide
Doc#: 1VV0301261
Rev. 4.3 – 2017-12-07
LE920A4 HW User Guide Doc#: 1VV0301261
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
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LE920A4 HW User Guide Doc#: 1VV0301261
USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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LE920A4 HW User Guide Doc#: 1VV0301261
APPLICABILITY TABLE
This documentation applies to the following products:
Table 1: Applicability Table
Module Name Description
LE920A4-NA North America regional variant (AT&T, T-Mobile)
LE920A4-NV (*) North America regional variant (Verizon)
LE920A4-EU Europe regional variant
HE920A-EU (*) Non-LTE Europe variant
LE920A4-CN China variant
LE920A4-AP (*) APAC variant
(*) Variants which were not designed yet
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LE920A4 HW User Guide Doc#: 1VV0301261
CONTENTS
1. INTRODUCTION .............................................................................................9
Scope ............................................................................................................. 9
Audience......................................................................................................... 9
Contact Information, Support .......................................................................... 9
Text Conventions ...........................................................................................10
Related Documents .......................................................................................11
2. GENERAL PRODUCT DESCRIPTION ......................................................... 12
Overview........................................................................................................12
Applications ...................................................................................................12
General Functionality and Main Features.......................................................13
Block Diagram ...............................................................................................15
Environmental Requirements .........................................................................17
2.5.1. Temperature Range .......................................................................................17
2.5.2. RoHS Compliance .........................................................................................17
Frequency Bands ...........................................................................................18
2.6.1. RF Bands per Regional Variant .....................................................................18
2.6.2. Reference Table of RF Bands Characteristics ...............................................18
RF parameters ...............................................................................................21
2.7.1. Sensitivity ......................................................................................................21
2.7.2. Output power .................................................................................................21
Mechanical Dimensions .................................................................................22
Weight ...........................................................................................................22
3. MODULE CONNECTIONS ............................................................................ 23
Pin-out ...........................................................................................................23
Signals That Must Be Connected ...................................................................37
LE940A4 LGA Pads Layout ...........................................................................40
4. ELECTRICAL SPECIFICATIONS ................................................................. 41
Absolute Maximum Ratings – Not Operational ...............................................41
Recommended Operating Conditions ............................................................41
Logic Level Specifications ..............................................................................41
4.3.1. 1.8V Pads - Absolute Maximum Ratings ........................................................42
4.3.2. 1.8V Standard GPIOs ....................................................................................42
4.3.3. 1.8V SD Card Pads .......................................................................................43
4.3.4. 1.8V SIM Card Pads ......................................................................................43
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ...........................................44
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4.3.6. SD Card Pads @ 2.95V .................................................................................44
4.3.7. SIM Card Pads @2.95V.................................................................................44
5. HARDWARE COMMANDS ........................................................................... 46
Turning on the Module ...................................................................................46
Initialization and Activation State ...................................................................46
Turning off the Module ...................................................................................48
5.3.1. Shutdown by Software Command ..................................................................49
5.3.2. Hardware Shutdown ......................................................................................49
5.3.3. Unconditional Hardware Reset ......................................................................51
5.3.4. Unconditional Hardware Shutdown ................................................................52
6. POWER SUPPLY .......................................................................................... 54
Power Supply Requirements ..........................................................................54
General Design Rules ....................................................................................56
6.2.1. Electrical Design Guidelines ..........................................................................56
6.2.1.1. + 5V Input Source Power Supply Design Guidelines ......................................56
6.2.1.2. + 12V Input Source Power Supply Design Guidelines ....................................57
6.2.1.3. Battery Source Power Supply Design Guidelines ...........................................59
6.2.2. Thermal Design Guidelines ............................................................................59
6.2.3. Power Supply PCB Layout Guidelines ...........................................................60
7. ANTENNA(S) ................................................................................................ 62
GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ...............................62
GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................63
GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines ................64
Antenna Diversity Requirements ....................................................................64
GPS/GNSS Antenna Requirements ...............................................................65
7.5.1. Combined GPS/GNSS Antenna .....................................................................65
7.5.2. Linear and Patch GPS/GNSS Antenna ..........................................................66
7.5.3. Front End Design Considerations ..................................................................66
7.5.4. GPS/GNSS Antenna – PCB Line Guidelines .................................................66
7.5.5. GPS/GNSS Antenna – Installation Guidelines ...............................................67
8. HARDWARE INTERFACES .......................................................................... 68
USB Port........................................................................................................69
8.1.1. USB OTG support ..........................................................................................70
HSIC Interface ...............................................................................................70
Ethernet Connectivity (optional) .....................................................................71
8.3.1. SGMII Interface..............................................................................................71
8.3.2. Ethernet Control Interface ..............................................................................71
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Serial Ports ....................................................................................................72
8.4.1. Modem Serial Port 1 ......................................................................................72
8.4.2. Modem Serial Port 2 ......................................................................................74
8.4.3. RS232 Level Translation ................................................................................75
Peripheral Ports .............................................................................................77
8.5.1. SPI – Serial Peripheral Interface ....................................................................77
8.5.2. I2C - Inter-integrated Circuit ...........................................................................78
8.5.3. SD/MMC Card Interface .................................................................................78
8.5.4. WiFi (SDIO) Control Interface ........................................................................80
Audio Interface ..............................................................................................81
8.6.1. Analog Audio .................................................................................................81
8.6.2. Analog Audio Characteristics .........................................................................82
8.6.2.1. Analog Inputs Characteristics ........................................................................82
8.6.2.2. Analog Output Characteristics .......................................................................84
8.6.3. Digital Audio ..................................................................................................85
8.6.3.1. Short Frame Timing Diagrams .......................................................................86
8.6.3.2. Long Frame Timing Diagrams ........................................................................88
General Purpose I/O ......................................................................................90
8.7.1. Using a GPIO Pad as Input ............................................................................91
8.7.2. Using a GPIO Pad as an Interrupt Source .....................................................92
8.7.3. Using a GPIO Pad as Output .........................................................................92
9. MISCELLANEOUS FUNCTIONS .................................................................. 93
Indication of Network Service Availability .......................................................93
RTC – Real Time Clock .................................................................................93
VAUX Power Output ......................................................................................93
ADC Converter ..............................................................................................95
9.4.1. Description .....................................................................................................95
9.4.2. Using ADC Converter ....................................................................................95
Using the Temperature Monitor Function .......................................................95
Fuel Gauge (optional) ....................................................................................95
GNSS Characteristics ....................................................................................97
10. MOUNTING THE MODULE ON YOUR BOARD ........................................... 98
General ..........................................................................................................98
Finishing & Dimensions .................................................................................98
Recommended Foot Print for the Application .................................................99
Stencil ............................................................................................................99
PCB Pad Design .......................................................................................... 100
Recommendations for PCB Pad Dimensions (mm) ...................................... 100
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Solder Paste ................................................................................................ 101
10.7.1. Solder Reflow .............................................................................................. 101
11. APPLICATION GUIDE ................................................................................ 103
Debug of the Module in Production .............................................................. 103
Bypass Capacitor on Power Supplies .......................................................... 104
SIM Interface ............................................................................................... 105
11.3.1. SIM Schematic Example .............................................................................. 105
EMC Recommendations .............................................................................. 105
Download and Debug Port ........................................................................... 106
11.5.1. Fast Boot Mode ........................................................................................... 106
11.5.2. Recovery Boot Mode ................................................................................... 106
Antenna Detection ....................................................................................... 107
12. PACKING SYSTEM .................................................................................... 108
Tray ............................................................................................................. 108
Tape & Reel ................................................................................................. 111
Moisture Sensitivity ...................................................................................... 112
13. SAFETY RECOMMENDATIONS................................................................. 113
14. CONFORMITY ASSESSMENT ISSUES ..................................................... 114
FCC/ISED Regulatory notices ...................................................................... 114
15. ACRONYMS ................................................................................................ 116
16. DOCUMENT HISTORY ............................................................................... 119
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LE920A4 HW User Guide Introduction Doc#: 1VV0301261 Scope
1. Introduction
Scope
This document introduces the Telit LE920A4 module and presents possible and recommended hardware solutions for developing a product based on this module. All the features and solutions detailed in this document are applicable to all module variants, where “module” refers to the variants listed in the applicability table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
NOTE:
Module refers to all modules listed in the Applicability Table.
This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out.
Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit module.
NOTE:
The integration of the module within a user application must be done according to the design rules described in this manual.
Audience
This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit module.
Contact Information, Support
For general contact, technical support services, technical questions and report documentation errors, contact Telit Technical Support at:
TS-EMEA@telit.com
TS-AMERICAS@telit.com
TS-APAC@telit.com
TS-SRD@telit.com
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LE920A4 HW User Guide Introduction Doc#: 1VV0301261 Text Conventions
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
Text Conventions
The following conventions are used to emphasize specific types of information:
DANGER:
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
WARNING:
Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.
NOTE:
Tip or Information – Provides advice and suggestions that may be useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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LE920A4 HW User Guide Introduction Doc#: 1VV0301261 Related Documents
Related Documents
Table 2: Related Documents
Document Title Document Number
Ref 1: LE920A4 AT Command User Guide 80490ST10778A
Ref 2: LE920A4 Software Guide 1VV0301332
Ref 3: Generic EVB HW User Guide 1VV0301249
Ref 4: LE920A4 Interface Board HW User Guide 1VV0301248
Ref 5: Digital Voice Interface_Application_Note 80000NT11246A
Ref 6: Telit_LE920A4_LE910Cx_Wi­Fi_Interface_Application_Note_r1
Ref 7: Antenna Detection Application Note 80000NT10002A
Ref 8: High-Speed Inter-Chip USB Electrical Specification, version 1.0
(a supplement to the USB 2.0 specification, Section 3.8.2)
Ref 9: ETH_Expansion_board_Application Note
80490NT11511A
80490NT11622A
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Overview
2. General Product Description
Overview
The LE920A4 module is Telit’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies:
4G cellular for voice and data communication
GNSS (optional) - GPS, GLONASS, BeiDou, Galileo, QZSS, for positioning
service
Embedded security
o ARM Trust Zone services (optional)
Designed for automotive markets1 quality needs
In its most basic use case, the module can be applied as a wireless communication front­end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.
The module can further support customer software applications and security features. The module provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions.
The module can be self-sufficient and serve as a fully integrated solution for applications, such as location-based cellular telematics, navigation, road pricing and eCall. In such a case, the customer would simply complement the module with a power supply, speaker amplifier, microphone, antennas, and an HMI (if applicable).
The module is available in hardware variants as listed in Table 1: Applicability Table. The designated RF band sets per each variant are detailed in Section 2.6, Frequency Bands.
Applications
The module can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:
Emergency call
Telematics services
Road pricing
Pay-as-you-drive insurance
Stolen vehicles tracking
Internet connectivity
1
In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests
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LE920A4 HW User Guide General Product Description
Up to 48
kHz sample rate, 16 bit words
Data rates up to 4 MHz
4 Gbit DDR.
Doc#: 1VV0301261 General Functionality and Main Features
General Functionality and Main Features
The LE920A4 family of automotive cellular modules features an advanced LTE and multi­RAT modem together with a powerful on-chip application processor and a rich set of interfaces.
The major functions and features are listed below:
Table 3: Main Features
Function Features
Modem
Audio subsystem
Two USIM ports – dual voltage
Multi-RAT cellular modem for voice and data communication
o LTE FDD/TDD Cat4 (150/50 Mbps DL/UL) o GSM/GPRS/EDGE o WCDMA up to DC HSPA+, Rel.9 o TD-SCDMA (China variant only)
Support for European eCall , US E911, and ERA Glonass
Support for SIM profile switching
Regional variants with optimal choice of RF bands for
worldwide coverage of countries and MNOs
State-of-the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver
Embedded analog codec with two microphone inputs
Embedded analog codec with one stereo or two mono
outputs
PCM/I2S digital audio interface
Class B and Class C support
Hot-swap support
Application processor
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Application processor to run customer application code
32 bit ARM Cortex-A7 up to 1.2 GHz running the Linux
operating system
Flash + DDR are large enough to allow for customer’s own
software applications
Default memory configuration is 4 Gb (512 MB) Flash + 2 Gb
(256 MB) RAM
Other memory configurations can be supported upon request,
for example: 2 Gbit Flash + 2 Gbit DDR or 4 Gbit Flash +
LE920A4 HW User Guide General Product Description
Antenna ports
Doc#: 1VV0301261 General Functionality and Main Features
Function Features
Interfaces Rich set of interfaces, including:
SD/MMC Card Interface supporting SD3.0 standard
SDIO for external WiFi transceiver supporting SDIO3.0
standard
SGMII for external Ethernet transceiver (optional)
o Compliant with IEEE802.3 o Full duplex operation at 1 Gbps o Half/full duplex operation at 10/100 Mbps o Support for VLAN tagging o Support for IEEE1588, PTP (Precision Time Protocol)
USB2.0 – USB port is typically used for:
o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment
and an external host CPU
o NMEA data to an external host CPU
HSIC
o High-speed 480 Mbps (240 MHz DDR) USB transfers are
100% host driver compatible with traditional USB cable connected topologies
o Bidirectional data strobe signal (STROBE) o Bidirectional data signal (DATA) o No power consumption unless a transfer is in progress o Maximum trace length 10 cm o Signals driven at 1.2V standard LVCMOS levels
Peripheral Ports – SPI, I2C, UART
GPIOs
Analog audio I/F
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Block Diagram
Function Features
Major software features
Advanced security features
o Boot integrity of firmware up to customer applications o Disable/secure re-enable of debug o Embedded security
FOTA (optional)
Telit Unified AT command set
Java VM (optional) with the following features:
o Rich and standardized application environment for
customer applications
o State-of-the-art and high performance Java SE8
embedded Virtual Machine
o Oracle Java SE8 Embedded, Compact Profile 1 o JIT-enabled
Form factor Form factor (40x34mm), accommodating the multiple RF bands in
each region variant
Environment and quality requirements
The entire module is designed and qualified by Telit for satisfying the environment and quality requirements for use in automotive applications2.
Single supply
The module generates all its internal supply voltages.
module RTC RTC is maintained as long as VBATT is supplied Operating
temperature
Range -40 °C to +85 °C (conditions as defined in Section 2.5.1,Temperature Range)
Block Diagram
Figure 1 shows an overview of the internal architecture of the module. It includes the following sub-functions:
Application processor, Modem subsystem and Location processing with their
external interfaces. These three functions are contained in a single SOC.
RF front end, including antenna diagnosis circuitry
Analog Audio codec for attaching external speaker amplifier and microphone
Rich IO interfaces. Depending on which of the module’s software features are
enabled, some of its interfaces that are exported through multiplexing may be used internally and thus may not be usable by the application.
PMIC with the RTC function inside
2
In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Block Diagram
Figure 1: High-level Block Diagram
GNSS_Sync
GNSS Antennna
ANT
DIAG
Location
JTAG
HSICI2C
Memories
Modem
Application
Processor
UART
GPIO
USB2.0SGMIISPI
Frontend
2xSDIO
RF
RTC
PMIC
Audio
CODEC
ANT
DIAG
Ear / Line out
Microphone
SIM PCM In/out
VBATT_PA
Cellular Antenna 1
Cellular Antenna 2
VBATT ADC
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Environmental Requirements
Environmental Requirements
2.5.1. Temperature Range
Table 4: Temperature Range
Operating temperature range
Storage and non­operating temperature range
-20 ~ +55°C This range is defined by 3GPP (the global standard for
wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range.
-40 ~ +85°C Telit guarantees full functionality within this range as well.
However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded.
Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction.
–40°C ~ +95°C eCall must be functional (until the module is broken)
–40°C ~ +105°C
2.5.2. RoHS Compliance
As a part of Telit corporate policy of environmental protection, the module complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Frequency Bands
Frequency Bands
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications.
2.6.1. RF Bands per Regional Variant
Table 5 summarizes of all region variants within the module family, showing the supported band sets in each variant.
Table 5: RF Bands per Regional Variant
Region Variant
LE920A4-NA 2, 4, 5, 7, 12 - 2, 4, 5 - 2, 5 LE920A4-NV
(TBD)
LE920A4-EU 1, 3, 5(*), 7, 8, 20, 28(*) - 1, 3, 5(*), 8 - 3, 8 HE920A-EU
(Non-LTE,
TBD)
LE920A4-CN 1, 3, 5, 8, 26 38, 39, 40, 41M 1, 5, 8 34, 39 3, 8 LE920A4-AP
(TBD)
2, 4, 5, 7(*), 13 - 2, 5 - -
- - 1, 3, 5, 8 - 2, 3, 5,
1, 3, 5, 7, 8, 19, 21, 26, 28
LTE FDD LTE TDD HSPA+
- 1, 3, 5, 6, 8, 19
TD-
SCDMA
8
- 2, 3, 5, 8
NOTE:
(*) Optional bands with a different schedule than the standard configuration,
can be removed if not required Band 41M for China: 2,555-2,655 MHz
2G
2.6.2. Reference Table of RF Bands Characteristics
Table 6: RF Bands Characteristics
Mode
Freq. Tx
(MHz)
PCS 1900 1850.2 ~
1909.8 DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz
GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz
EGSM 900 890 ~ 915 935 ~ 960 0 ~ 124 45 MHz
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Freq. Rx
(MHz)
1930.2 ~
1989.8
Channels
Tx-Rx
Offset
512 ~ 810 80 MHz
LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Frequency Bands
Mode
Freq. Tx
(MHz)
Freq. Rx
(MHz)
Channels
880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz
WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888
Rx: 10562 ~ 10838
WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538
Rx: 9662 ~ 9938
WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288
Rx: 1162 ~ 1513
WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513
Rx: 1537 ~ 1738
WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233
Rx: 4357 ~ 4458
Tx-Rx
Offset
190 MHz
80 MHz
95 MHz
400 MHz
45 MHz
WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863
Rx: 2937 ~ 3088
WCDMA 1800 – B9 1750 ~
1784.8
1845 ~ 1879.8 Tx: 8762 ~ 8912
Rx: 9237 ~ 9387
WCDMA 800 – B19 830 ~ 845 875 ~ 890 Tx: 312 ~ 363
Rx: 712 ~ 763
TDSCDMA 2000 – B34
TDSCDMA 1900 – B39
2010 ~ 2025 2010 ~ 2025 Tx: 10054 ~ 10121
Rx: 10054 ~ 10121
1880 ~ 1920 1880 ~ 1920 Tx: 9404 ~ 9596
Rx: 9404 ~ 9596
LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599
Rx: 0 ~ 599
LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199
45 MHz
95 MHz
45 MHz
0 MHz
0 MHz
190 MHz
80 MHz
Rx: 600 ~ 1199
LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949
95 MHz
Rx: 1200 ~ 1949
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LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Frequency Bands
Mode
Freq. Tx
(MHz)
Freq. Rx
(MHz)
Channels
LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399
Rx: 1950 ~ 2399
LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649
Rx: 2400 ~ 2649
LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449
Rx: 2750 ~ 3449
LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799
Rx: 3450 ~ 3799
LTE 1800 – B9 1749.9 ~
1784.9
1844.9 ~
1879.9
Tx: 21800 ~ 2149 Rx: 3800 ~ 4149
LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749
Tx-Rx
Offset
400 MHz
45 MHz
120 MHz
45 MHz
95 MHz
400 MHz
Rx: 4150 ~ 4749
LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179
Rx : 5010 ~ 5179
LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659
Rx : 9210 ~ 9659
LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849
Rx: 5730 ~ 5849
LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149
Rx: 6000 ~ 6149
LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449
Rx: 6150 ~ 6449
LTE 1500 – B21 1447.9 ~
1462.9
1495.9 ~
1510.9
Tx: 24450 ~ 24599 Rx: 6450 ~ 6599
30 MHz
-31 MHz
30 MHz
45 MHz
-41 MHz
48 MHz
LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039
45 MHz
Rx: 8690 ~ 9039
Rev. 4.3 Page 20 of 123 2017-12-07
LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 RF parameters
Mode
LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659
LTE TDD 2600 – B38
LTE TDD 1900 – B39
LTE TDD 2300 – B40
LTE TDD 2500 – B41M
Freq. Tx
(MHz)
2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38250
1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38650
2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39650
2555 ~ 2655 2555 ~ 2655 Tx: 40265 ~ 41215
Freq. Rx
(MHz)
Channels
Rx : 9210 ~ 9659
Rx: 37750 ~ 38250
Rx: 38250 ~ 38650
Rx: 38650 ~ 39650
Rx: 40265 ~ 41215
RF parameters
Tx-Rx
Offset
45 MHz
0 MHz
0 MHz
0 MHz
0 MHz
2.7.1. Sensitivity
The module’s maximum sensitivity levels are as follows:
-108 dBm @ 2G
-113 dBm @ 3G
-102 dBm @ 4G FDD (BW=5 MHz)
2.7.2. Output power
LE920A4 typical values for Max output level are as follow:
2G:
- LB: 33dBm
- HB: 30dBm
3G/TD-SCDMA: 24dBm
4G (FDD & TDD):23dBm @1RB.
Rev. 4.3 Page 21 of 123 2017-12-07
LE920A4 HW User Guide General Product Description Doc#: 1VV0301261 Mechanical Dimensions
Mechanical Dimensions
The module’s overall dimensions are as follows:
Length: 34 mm, +/- 0.15 mm tolerance
Width: 40 mm, +/- 0.15 mm tolerance
Thickness: 2.9 mm, +/- 0.15 mm tolerance
NOTE:
A typical label thickness of 0.11 mm should be considered in addition to the module thickness
Weight
The nominal weight of the module is 9.0 gram.
Rev. 4.3 Page 22 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
3. Module Connections
Pin-out
Table 7: Pin-out
PAD Signal I/O Function Type Comment
USB HS 2.0 Communication Port
D19 USB_D+ I/O USB differential data(+) F19 USB_D- I/O USB differential data(-) A18 USB_VBUS AI Power sense for the internal USB
transceiver
B19 USB_ID AI USB ID for supporting USB2.0
OTG
Asynchronous UART
AH19 C103/TXD I Serial data input (TXD) from DTE 1.8V AF19 C104/RXD O Serial data output to DTE 1.8V AA18 C105/RTS I
AK19 C106/CTS O Output for Clear To Send signal
AG18 C107/DSR O Output for Data Set Ready (DSR)
AC18 C108/DTR I Input for Data Terminal Ready
AE18 C109/DCD O Output for Data Carrier Detect
Input for Request To Send signal (RTS) from DTE
(CTS) to DTE
to DTE
(DTR) from DTE
(DCD) to DTE
Power
1.8V
1.8V
1.8V Alternate Fn
1.8V Alternate Fn
1.8V Alternate Fn
GPIO_32
GPIO_34
GPIO_33
AJ18 C125/RING O
Asynchronous Auxiliary UART
AB19 TX_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RX_AUX I Auxiliary UART (Rx Data from
SPI – Serial Peripheral Interface
P19 SPI_CLK O SPI clock output 1.8V
M19 SPI_MISO I
Output for Ring Indication (RI) to DTE
DTE)
SPI data Master Input Slave Output
1.8V
1.8V
1.8V
Alternate Fn GPIO_31
Rev. 4.3 Page 23 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
K19 SPI_MOSI O
N18 SPI_CS O SPI chip select output 1.8V
SD/MMC Card Interface
AH17
AD17 SD/MMC_CLK O SD card clock 1.8/2.95V
Y17
AF17
AB17
W17
U17 SD/MMC_CD I SD card detect input 1.8V Active Low
SD/MMC_CM D
SD/MMC_DAT A0
SD/MMC_DAT A1
SD/MMC_DAT A2
SD/MMC_DAT A3
SPI data Master Output Slave Input
I/O SD command 1.8/2.95V
I/O SD Serial Data 0 1.8/2.95V
I/O SD Serial Data 1 1.8/2.95V
I/O SD Serial Data 2 1.8/2.95V
I/O SD Serial Data 3 1.8/2.95V
1.8V
S17 VMMC -
WiFi (SDIO) Interface
AB3
AM3 WiFi_SD_CLK O WiFi SD clock 1.8V
AD3
AF3
AH3
AK3
Y3 WiFi_SDRST O WiFi Reset / Power enable control 1.8V Active Low
AA4
WiFi_SD_CM D
WiFi_SD_DAT A0
WiFi_SD_DAT A1
WiFi_SD_DAT A2
WiFi_SD_DAT A3
WLAN_SLEEP _CLK
Power supply for MMC card pull­up resistors
I/O WiFi SD command 1.8V
I/O WiFi SD Serial Data 0 1.8V
I/O WiFi SD Serial Data 1 1.8V
I/O WiFi SD Serial Data 2 1.8V
I/O WiFi SD Serial Data 3 1.8V
O WiFi Sleep clock output 1.8V
1.8/2.95V
X4 RFCLK2_QCA O WiFi low-noise RF clock output 1.8V
Rev. 4.3 Page 24 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
LTE-WiFi Coexistence
AS3 WCI_TX O
AT2 WCI_RX
SIM Card Interface 1
A10 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V B11 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V B9 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V
B7 SIMIN1 I External SIM1 signal - Presence 1.8V Active low A8 SIMVCC1 - External SIM1 signal – power
E8 Reserved for
ESIM_RST
SIM Card Interface 2
Wireless coexistence interface TXD
Wireless coexistence interface
I
RXD
supply for SIM1
I Reserved for eSIM signal – Reset 1.8/2.85V Reserved
1.8V
1.8V
Internally PU 20 k to SIMVCC1
1.8/2.85V
C16 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V D17 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V E16 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.85V Internally PU
20k to
SIMVCC2 C18 SIMIN2 I External SIM 2 signal – Presence 1.8V Active low D15 SIMVCC2 - External SIM2 signal – Power
supply for SIM2
Analog Audio interface
B5 EAR1_MT+ AO Earphone signal output1, phase + Audio A4 EAR1_MT- AO Earphone signal output1, phase - Audio B3 MIC1_MT+ AI Mic signal input1, phase + Audio A2 MIC1_MT- AI Mic signal input1, phase - Audio G6 MICBIAS AO Mic BIAS Audio
1.8/2.85V
E2 EAR2_MT+ AO Earphone signal output2, phase + Audio
Rev. 4.3 Page 25 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
D1 EAR2_MT- AO Earphone signal output2, phase - Audio C2 MIC2_MT+ AI Mic signal input2, phase + Audio B1 MIC2_MT- AI Mic signal input2, phase - Audio
Digital Voice Interface (DVI)
D11 DVI_WA0 O Digital Voice interface (WA0
master output) C8 DVI_RX I Digital Voice interface (Rx) 1.8V D9 DVI_TX O Digital Voice interface (Tx) 1.8V C10 DVI_CLK O Digital Voice interface (CLK master
output) C12 REF_CLK O Reference clock for external
Codec
General Purpose Digital I/O
F9 GPIO_01 I/O GPIO_01 1.8V Alternate Fn
E10 GPIO_02 I/O GPIO_02 1.8V Alternate Fn
F11 GPIO_03 I/O GPIO_03 1.8V Alternate Fn
E12 GPIO_04 I/O GPIO_04 1.8V Alternate Fn
1.8V
1.8V
1.8V
I2C
I2C
I2C
I2C
F13 GPIO_05 I/O GPIO_05 1.8V
E14 GPIO_06 I/O GPIO_06 1.8V Alternate Fn
W19 GPIO_10 I/O GPIO_10 1.8V Alternate Fn
AN4 GPIO_20 I/O GPIO_20 1.8V
RF Section
AD1 Antenna I/O GSM/EDGE/UMTS/LTE main
antenna (50 Ohm) AU9 ANT_DIV I UMTS/LTE antenna diversity input
(50 Ohm)
RF
RF
Alternate Fn I2C
I2C
I2C
Rev. 4.3 Page 26 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
GPS Section
S1 ANT_GPS I GPS antenna (50 Ohm) RF V2 GPS_LNA_EN O Enables the external regulator for
GPS LNA W3 GPS_SYNC O GPS sync signal for Dead
Reckoning
Miscellaneous Functions
AN8 RESET_N I Reset input Active low AS1 ON_OFF_N I Power ON / Power OFF input Active low AN12 SHDN_N I Unconditional Shutdown input Active low P17 VAUX/PWRM
ON D5 ADC_IN1 AI Analog/Digital Converter Input 1 Analog E6 ADC_IN2 AI Analog/Digital Converter Input 2 Analog F7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog AU3 STAT_LED O Status Indicator LED 1.8V
O Supply output for external
accessories / Power ON monitor
1.8V
1.8V
1.8V
AN10 SW_RDY O Indicates that the boot sequence
has completed successfully
SGMII Interface
ZZ11 SGMII_RX_P AI SGMII receive - plus PHY ZZ13 SGMII_RX_M AI SGMII receive - minus PHY ZZ15 SGMII_TX_P AO SGMII transmit - plus PHY ZZ17 SGMII_TX_M AO SGMII transmit - minus PHY
Ethernet PHY Control Interface
G14 MAC_MDC O MAC to PHY Clock 2.85V G12 MAC_MDIO I/O MAC to PHY Data 2.85V G8 ETH_RST_N O Ethernet PHY Reset 2.85V G10 ETH_INT_N I Ethernet PHY Interrupt 1.8V
1.8V
Rev. 4.3 Page 27 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
HSIC Interface
A14 HSIC_DATA I/O High-speed inter-chip interface -
data
A16 HSIC_STB I/O High-speed inter-chip interface -
strobe
I2C Interface
C14 I2C_SCL I/O I2C clock 1.8V
D13 I2C_SDA I/O I2C Data 1.8V Internal PU
Power Supply
AP17 VBATT - Main Power Supply (Digital
Section)
AP19 VBATT -
AR18 VBATT - Main Power Supply (Digital
Main Power Supply (Digital Section)
Section)
1.2V
1.2V
Internal PU
2.2 k to
1.8V
2.2 k to
1.8V
Power
Power
Power
AR20 VBATT - Main Power Supply (Digital
Section) AS17 VBATT_PA - Main Power Supply (RF Section) Power AS19 VBATT_PA - Main Power Supply (RF Section) Power AT18 VBATT_PA - Main Power Supply (RF Section) Power AU17 VBATT_PA - Main Power Supply (RF Section) Power AU19 VBATT_PA - Main Power Supply (RF Section) Power AT20 VBATT_PA - Main Power Supply (RF Section) Power A0 GND - Ground N0 GND Ground R0 GND - Ground T0 GND - Ground V0 GND - Ground
Power
X0 GND - Ground
Rev. 4.3 Page 28 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
AA0 GND - Ground AC0 GND - Ground AE0 GND - Ground AG0 GND - Ground AJ0 GND - Ground AL0 GND - Ground AN0 GND - Ground AR0 GND - Ground AV0 GND - Ground ZZ1 GND - Ground F1 GND - Ground M1 GND - Ground P1 GND - Ground U1 GND - Ground W1 GND - Ground Y1 GND - Ground AB1 GND - Ground AF1 GND - Ground AH1 GND - Ground AK1 GND - Ground AU1 GND - Ground N2 GND - Ground R2 GND - Ground T2 GND - Ground X2 GND - Ground AA2 GND - Ground AC2 GND - Ground AE2 GND - Ground
Rev. 4.3 Page 29 of 123 2017-12-07
LE920A4 HW User Guide Module Connections Doc#: 1VV0301261 Pin-out
PAD Signal I/O Function Type Comment
AG2 GND - Ground AJ2 GND - Ground AL2 GND - Ground AN2 GND - Ground AR2 GND - Ground D3 GND - Ground P3 GND - Ground AP3 GND - Ground C4 GND - Ground AR4 GND - Ground AT4 GND - Ground AP5 GND - Ground AS5 GND - Ground AU5 GND - Ground A6 GND - Ground C6 GND - Ground AR6 GND - Ground AT6 GND - Ground D7 GND - Ground AP7 GND - Ground AS7 GND - Ground AU7 GND - Ground T8 GND - Ground V8 GND - Ground X8 GND - Ground AA8 GND - Ground AR8 GND - Ground AT8 GND - Ground
Rev. 4.3 Page 30 of 123 2017-12-07
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