Telit Communications S p A LE910SVL Users Guide

LE910 V2 HARDWARE USER GUIDE

1VV0301200 Rev.8 – DRAFT1 2016-10-07

LE910-NA V2

LE910-SV V2

LE910-EU V2

LE910-AU V2

LE910-SV1

LE910-NA1

LE910-EU1

LE910-SVL

LE910B1-EU

LE910-JN1

APPLICABILITY TABLE

PRODUCTS

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 2 of 84

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

LEGAL NOTICE

These Specifications are general guidelines pertaining to product selection and application and may not be appropriate for your particular project. Telit (which hereinafter shall include, its agents, licensors and affiliated companies) makes no representation as to the particular products identified in this document and makes no endorsement of any product. Telit disclaims any warranties, expressed or implied, relating to these specifications, including without limitation, warranties or merchantability, fitness for a particular purpose or satisfactory quality. Without limitation, Telit reserves the right to make changes to any products described herein and to remove any product, without notice. It is possible that this document may contain references to, or information about Telit products, services and programs, that are not available in your region. Such references or information must not be construed to mean that Telit intends to make available such products, services and programs in your area.

USE AND INTELLECTUAL PROPERTY RIGHTS

These Specifications (and the products and services contained herein) are proprietary to Telit and its licensors and constitute the intellectual property of Telit (and its licensors). All title and intellectual property rights in and to the Specifications (and the products and services contained herein) is owned exclusively by Telit and its licensors. Other than as expressly set forth herein, no license or other rights in or to the Specifications and intellectual property rights related thereto are granted to you. Nothing in these Specifications shall, or shall be deemed to, convey license or any other right under Telit’s patents, copyright, mask work or other intellectual property rights or the rights of others.

You may not, without the express written permission of Telit: (i) copy, reproduce, create derivative works of, reverse engineer, disassemble, decompile, distribute, merge or modify in any manner these Specifications or the products and components described herein; (ii) separate any component part of the products described herein, or separately use any component part thereof on any equipment, machinery, hardware or system; (iii) remove or destroy any proprietary marking or legends placed upon or contained within the products or their components or these Specifications; (iv) develop methods to enable unauthorized parties to use the products or their components; and (v) attempt to reconstruct or discover any source code, underlying ideas, algorithms, file formats or programming or interoperability interfaces of the products or their components by any means whatsoever. No part of these Specifications or any products or components described herein may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without the prior express written permission of Telit.

HIGH RISK MATERIALS

Components, units, or third-party products contained or used with the products described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 3 of 84

Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities").

Telit, its licensors and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

TRADEMARKS

You may not and may not allow others to use Telit or its third party licensors’ trademarks. To the extent that any

portion of the products, components and any accompanying documents contain proprietary and confidential notices or legends, you will not remove such notices or legends.

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 4 of 84

CONTENTS

1 Introduction 8

1.1 Scope 8

1.2 Audience 8

1.3 Contact Information, Support 8

1.4 List of acronyms 9

1.5 Text Conventions 11

1.6 Related Documents 11

2 Overview 12 3 Pins Allocation 13

3.1 Pin-out 13

3.2 LGA Pads Layout 19

4 Power Supply 20

4.1 Power Supply Requirements 20

4.2 Power Consumption 21

4.3 General Design Rules 23

4.3.1 Electrical Design Guidelines 23

4.3.1.1 +5V Source Power Supply Design Guidelines 23

4.3.1.3 Battery Source Power Supply Design Guidelines 25

4.3.1.4 Thermal Design Guidelines 26

4.3.1.5 Power Supply PCB layout Guidelines 27

4.4 RTC Bypass out 29

4.5 VAUX Power Output 29

5 Digital Section 30

5.1 Logic Levels 30

5.2 Power on 31

5.3 Power off 36

5.4 Unconditional Shutdown 38

5.5 Fast power down 41

5.5.1 Fast Shut Down by Hardware 41

5.5.2 Fast Shut Down by Software 42

5.6 Communication ports 43

5.6.1 USB 2.0 HS 43

5.6.2 SPI 44

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5.6.2.1 SPI Connections 44

5.6.3 Serial Ports 45

5.6.3.1 Modem serial port 1 (USIF0) 45

5.6.3.2 Modem serial port 2 (USIF1) 46

5.6.3.3 RS232 level translation 47

5.7 General Purpose I/O 48

5.7.1 Using a GPIO as INPUT 49

5.7.2 Using a GPIO as OUTPUT 49

5.7.3 Indication of network service availability 49

5.8 External SIM Holder 51

5.9 ADC Converter 51

6 RF Section 52

6.1 Bands Variants 52

6.2 TX Output Power 53

6.3 RX Sensitivity 54

6.4 Antenna Requirements 56

6.4.1 PCB design guidelines 59

6.4.2 PCB Guidelines in case of FCC Certification 60

6.4.2.1 Transmission line design 60

6.4.2.2 Transmission Line Measurements 61

6.4.2.3 Antenna Installation Guidelines 63

6.5 Second Antenna Requirements 64

6.5.1 Single Antenna Operation 66

7 Audio Section Overview 67

7.1 Electrical Characteristics 67

7.2 Codec examples 67

8 Mechanical Design 68

8.1 Drawing 68

9 Application PCB Design 69

9.1 Footprint 69

9.2 PCB pad design 70

9.3 PCB pad dimensions 70

9.4 Stencil 72

9.5 Solder paste 72

9.6 Solder reflow 72

10 Packaging 74

10.1 Tray 74

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10.2 Reel 76

10.2.1 Carrier Tape detail 76

10.2.2 Reel detail 77

10.2.3 Packaging detail 78

10.3 Moisture sensitivity 78

11 Conformity Assessment Issues 79

11.1 FCC/ISED Regulatory notices 79

12 Safety Recommendations 82

12.1 READ CAREFULLY 82

13 Document History 83

13.1 Revisions 83

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 7 of 84

1 INTRODUCTION

1.1 Scope

Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit LE910 V2 module.

1.2 Audience

This document is intended for Telit customers, who are integrators, about to implement their applications using our LE910 V2 modules.

1.3 Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 8 of 84

Acronym

Description

LTE

Long Term Evolution

RF

Radio Frequency

EMC

Electromagnetic Compatibility

FDD

Frequency Division Duplexing

EM

Electromagnetic

EMI

Electromagnetic Interference

PCB

Printed Circuit Board

USB

Universal Serial Bus

HS

High Speed

DTE

Data Terminal Equipment

UMTS

Universal Mobile Telecommunication System

WCDMA

Wideband Code Division Multiple Access

HSDPA

High Speed Downlink Packet Access

HSUPA

High Speed Uplink Packet Access

UART

Universal Asynchronous Receiver Transmitter

HSIC

High Speed Inter Chip

SIM

Subscriber Identification Module

SPI

Serial Peripheral Interface

ADC

Analog – Digital Converter

DAC

Digital – Analog Converter

I/O

Input Output

GPIO

General Purpose Input Output

CMOS

Complementary Metal – Oxide Semiconductor

MOSI

Master Output – Slave Input

MISO

Master Input – Slave Output

CLK

Clock

1.4 List of acronyms

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 9 of 84

Acronym

Description

DVI

Digital Voice Interface

MRDY

Master Ready

SRDY

Slave Ready

CS

Chip Select

RTC

Real Time Clock

ESR

Equivalent Series Resistance

VSWR

Voltage Standing Wave Radio

VNA

Vector Network Analyzer

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 10 of 84

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

1.5 Text Conventions

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.6 Related Documents

● Telit_xE910_Global_Form_Factor_Application_Note_r13

● Telit_Event_Monitor_Application_Note_r6

● Telit_SIM/USIM_Toolkit_Application_Note_r4

● Telit_Modem_Integration_Design_Guide_r0

● SIM Holder Design Guides, 80000NT10001a

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 11 of 84

NOTE: (EN) The integration of the LE910 V2 cellular module within user application shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare LE910 V2 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des LE910 V2 Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija LE910 V2 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo LE910 V2 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire LE910 V2 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

(HE)

LE910 V2

2 OVERVIEW

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE910 V2 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit LE910 V2 module. For further hardware details that may not be explained in this document refer to the Telit LE910 V2 Product Description document where all the hardware information is reported.

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 12 of 84

Signal

I/O

Function

Type

Comment

USB HS 2.0 COMMUNICATION PORT

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

VUSB

I

Power sense for the

internal USB transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15

C103/TXD

I

Serial data input from

DTE

CMOS 1.8V

M15

C104/RXD

O

Serial data output to DTE

CMOS 1.8V

M14

C108/DTR

I

Input for (DTR) from DTE

CMOS 1.8V

L14

C105/RTS

I

Input for Request to send

signal (RTS) from DTE

CMOS 1.8V

P15

C106/CTS

O

Output for Clear to Send

signal (CTS) to DTE

CMOS 1.8V

N14

C109/DCD

O

Output for (DCD) to DTE

CMOS 1.8V

P14

C107/DSR

O

Output for (DSR) to DTE

CMOS 1.8V

R14

C125/RING

O

Output for Ring (RI) to

DTE

CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

D15

TX_AUX

O

Auxiliary UART (TX Data

to DTE)

CMOS 1.8V

E15

RX_AUX

I

Auxiliary UART (RX Data

from DTE)

CMOS 1.8V

SIM card interface

A6

SIMCLK

O

External SIM signal –

Clock

1.8 / 3V

A7

SIMRST

O

External SIM signal –

Reset

1.8 / 3V

3 PINS ALLOCATION

3.1 Pin-out

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 13 of 84

A5

SIMIO

I/O

External SIM signal –

Data I/O

1.8 / 3V

A4

SIMIN

I

External SIM signal – Presence (active low)

CMOS 1.8

Internal pullup

47K

A3

SIMVCC

-

External SIM signal –

Power supply for the SIM

1.8 / 3V

Digital Voice Interface (DVI)

B9

DVI_WA0

I/O

Digital Audio Interface

(WA0)

1.8V

B6

DVI_RX

I

Digital Audio Interface

(RX)

1.8V

B7

DVI_TX

I/O

Digital Audio Interface

(TX)

1.8V

B8

DVI_CLK

I/O

Digital Audio Interface

(CLK)

1.8V

SPI

D15

SPI_MOSI

I

SPI MOSI

CMOS 1.8V

E15

SPI_MISO

O

SPI_MISO

CMOS 1.8V

F15

SPI_CLK

I

SPI Clock

CMOS 1.8V

DIGITAL IO

C8

GPIO_01

I/O

GPIO_01 /STAT LED

CMOS 1.8V

STAT LED is

alternate function

C9

GPIO_02

I/O

GPIO_02

CMOS 1.8V

C10

GPIO_03

I/O

GPIO_03

CMOS 1.8V

C11

GPIO_04

I/O

GPIO_04

CMOS 1.8V

B14

GPIO_05

I/O

GPIO_05

CMOS 1.8V

C12

GPIO_06

I/O

GPIO_06

CMOS 1.8V

C13

GPIO_07

I/O

GPIO_07

CMOS 1.8V

K15

GPIO_08

I/O

GPIO_08

CMOS 1.8V

L15

GPIO_09

I/O

GPIO_09

CMOS 1.8V

G15

GPIO_10

I/O

GPIO_10

CMOS 1.8V

ADC

B1

ADC_IN1

AI

Analog / Digital converter

input

A/D

Accepted values 0

to 1.2V DC

RF SECTION

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K1

ANTENNA

I/O

GSM/EDGE/UMTS

Antenna

(50 ohm)

RF

F1

ANT_DIV

I

Antenna Diversity Input

(50 ohm)

RF

Miscellaneous Functions

R13

HW_SHUTDOWN*

I

HW Unconditional

Shutdown

1.8V

Active low

R12

ON_OFF*

I

Input command for power

ON

1.8V

Active low

C14

VRTC

I

VRTC Backup capacitor

Power

backup for the

embedded RTC

supply (1.8V)

R11

VAUX/PWRMON

O

Supply Output for

external accessories /

Power ON Monitor

1.8V

Power Supply

M1

VBATT

-

Main power supply

(Baseband)

Power

M2

VBATT

-

Main power supply

(Baseband)

Power

N1

VBATT_PA

-

Main power supply

(Radio PA)

Power

N2

VBATT_PA

-

Main power supply

(Radio PA)

Power

P1

VBATT_PA

-

Main power supply

(Radio PA)

Power

P2

VBATT_PA

-

Main power supply

(Radio PA)

Power

E1

GND

-

Ground

Power

G1

GND

-

Ground

Power

H1

GND

-

Ground

Power

J1

GND

-

Ground

Power

L1

GND

-

Ground

Power

A2

GND

-

Ground

Power

E2

GND

-

Ground

Power

F2

GND

-

Ground

Power

G2

GND

-

Ground

Power

H2

GND

-

Ground

Power

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J2

GND

-

Ground

Power

K2

GND

-

Ground

Power

L2

GND

-

Ground

Power

R2

GND

-

Ground

Power

M3

GND

-

Ground

Power

N3

GND

-

Ground

Power

P3

GND

-

Ground

Power

R3

GND

-

Ground

Power

D4

GND

-

Ground

Power

M4

GND

-

Ground

Power

N4

GND

-

Ground

Power

P4

GND

-

Ground

Power

R4

GND

-

Ground

Power

N5

GND

-

Ground

Power

P5

GND

-

Ground

Power

R5

GND

-

Ground

Power

N6

GND

-

Ground

Power

P6

GND

-

Ground

Power

R6

GND

-

Ground

Power

P8

GND

-

Ground

Power

R8

GND

-

Ground

Power

P9

GND

-

Ground

Power

P10

GND

-

Ground

Power

R10

GND

-

Ground

Power

M12

GND

-

Ground

Power

B13

GND

-

Ground

Power

P13

GND

-

Ground

Power

E14

GND

-

Ground

Power

RESERVED

C1

RESERVED

-

RESERVED

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D1

RESERVED

-

RESERVED

B2

RESERVED

-

RESERVED

C2

RESERVED

-

RESERVED

D2

RESERVED

-

RESERVED

B3

RESERVED

-

RESERVED

C3

RESERVED

-

RESERVED

D3

RESERVED

-

RESERVED

E3

RESERVED

-

RESERVED

F3

RESERVED

-

RESERVED

G3

RESERVED

-

RESERVED

H3

RESERVED

-

RESERVED

J3

RESERVED

-

RESERVED

K3

RESERVED

-

RESERVED

L3

RESERVED

-

RESERVED

B4

RESERVED

-

RESERVED

C4

RESERVED

-

RESERVED

B5

RESERVED

-

RESERVED

C5

RESERVED

-

RESERVED

C6

RESERVED

-

RESERVED

C7

RESERVED

-

RESERVED

N7

RESERVED

-

RESERVED

P7

RESERVED

-

RESERVED

N8

RESERVED

-

RESERVED

N9

RESERVED

-

RESERVED

A10

RESERVED

-

RESERVED

N10

RESERVED

-

RESERVED

N11

RESERVED

-

RESERVED

P11

RESERVED

-

RESERVED

B12

RESERVED

-

RESERVED

D12

RESERVED

-

RESERVED

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WARNING: Reserved pins must not be connected.

N12

RESERVED

-

RESERVED

P12

RESERVED

-

RESERVED

F14

RESERVED

-

RESERVED

G14

RESERVED

-

RESERVED

H14

RESERVED

-

RESERVED

J14

RESERVED

-

RESERVED

K14

RESERVED

-

RESERVED

N13

RESERVED

-

RESERVED

L13

RESERVED

-

RESERVED

J13

RESERVED

-

RESERVED

M13

RESERVED

-

RESERVED

K13

RESERVED

-

RESERVED

H13

RESERVED

-

RESERVED

G13

RESERVED

-

RESERVED

F13

RESERVED

-

RESERVED

B11

RESERVED

-

RESERVED

B10

RESERVED

-

RESERVED

A9

RESERVED

-

RESERVED

A8

RESERVED

-

RESERVED

E13

RESERVED

-

RESERVED

D13

RESERVED

-

RESERVED

D14

RESERVED

-

RESERVED

A14

RESERVED

-

RESERVED

A12

RESERVED

-

RESERVED

A11

RESERVED

-

RESERVED

H15

RESERVED

-

RESERVED

J15

RESERVED

-

RESERVED

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A B C D E F

G H J K L M N P R

1 ADC_IN1

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

PA

VBATT_

PA

2

GND

RES

GND

VBATT

VBATT_

PA

VBATT_

PA

GND

3

SIMVC

C

RES

GND

4

SIMIN

RES

GND GND

GND

5

SIMIO

RES

RES GND

GND

6

SIMCLK

DVI_RX

RES GND

GND

7

SIMRS

T

DVI_TX

RES RES

RES

8

RES

DVI_CLK

GPIO_01 RES

GND

9

RES

DVI_WA

0

GPIO_02 RES

GND

RES

10

RES

GPIO_03 RES

GND

11

RES

GPIO_04 RES

RES

VAUX/P

WRMON

12

RES

GPIO_06

RES GND

RES

ON_OFF

*

13

VUSB

GND

GPIO_07

RES

GND

HW_SH UTDOW

N*

14

RES

GPIO_05

VRTC

RES

GND

RES

C105/RTS C108/DTR C109/DC

D

C107/DSR C125/RI

NG

15 USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

DY

SPI_SR

DY

GPIO_08

GPIO_09

C104/RXD C103/TX

D

C106/CT

S

3.2 LGA Pads Layout

TOP VIEW

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 19 of 84

Power Supply

Value

Nominal Supply Voltage

3.8V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.10 V÷ 4.50 V

NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when

designing the application’s power supply section to avoid having an excessive voltage

drop. If the voltage drop is exceeding the limits it could cause a Power Off of the module. The Power supply must be higher than 3.10 V to power on the module.

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only with completely assumption

and application of the HW User guide suggestions.

4 POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

4.1 Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements:

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 20 of 84

Mode

Average

(mA)

Mode Description

Switched Off

0.095

Module supplied but switched off

IDLE mode

AT+CFUN=1

LTE

13

Normal mode: full functionality of the module

WCDMA

15

GSM

14

AT+CFUN=4 11

Disabled TX and RX; module is not registered on the network

AT+CFUN=5

LTE

5.8

Paging cycle #32 frames (0.32 sec DRx cycle)

3.5

Paging cycle #64 frames (0.64 sec DRx cycle)

2

Paging cycle #128 frames (1.28 sec DRx cycle)

1.8

Paging cycle #256 frames (2.56 sec DRx cycle)

WCDMA

1.7

DRx7

GSM

2.2

DRx2

1.7

DRx5

1.5

DRx9

Operative mode

LTE Data call

190

Channel BW 5MHz, RB=1, TX=0dBm

LTE Data call

Max power

500

Channel BW 5MHz, RB=1, TX=22dBm

WCDMA Voice

140

WCDMA voice call (TX = 9dBm)

WCDMA HSDPA

Max power

440

WCDMA data call (RMC, TX = 23dBm)

EDGE 2TX+3RX

Low Band Gamma 7

290

EDGE Sending data mode

High Band Gamma 6

220

GSM TX and RX

Low Band PL5

300

GSM VOICE CALL

High Band PL0

180

GPRS 2TX+3RX

Low band Gamma 3

580

GPRS Sending data mode

High band Gamma 3

350

4.2 Power Consumption

The reported values in the following table has to be considered preliminary:

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NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least:

0.8 A for WCDMA and LTE mode (3.80V supply). 2A for GSM mode (3.80V supply).

NOTE: The reported values are an average among all the product variants and bands for each network wireless technology. The support of specific network wireless technology depends on product variant configuration.

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4.3 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

 the electrical design  the thermal design

 the PCB layout.

4.3.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

 +5V input (typically PC internal regulator output)  +12V input (typically automotive)  Battery

4.3.1.1 +5V Source Power Supply Design Guidelines

 The desired output for the power supply is 3.8V, hence there's not a big difference between the input

source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

 When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power

generated.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption

peaks close to the Module, a 100μF capacitor is usually suited.

 Make sure the low ESR capacitor on the power supply output rated at least 10V.

An example of linear regulator with 5V input is:

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4.3.1.2 + 12V input Source Power Supply Design Guidelines

 The desired output for the power supply is 3.8V, hence due to the big difference between the input source

and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency.

 When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because

of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

 In any case the frequency and Switching design selection is related to the application to be developed due

to the fact the switching frequency could also generate EMC interferences.

 For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing

components: all components in the power supply must withstand this voltage.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption

peaks, a 100μF capacitor is usually suited.

 Make sure the low ESR capacitor on the power supply output is rated at least 10V.  For Car applications a spike protection diode should be inserted close to the power input, in order to clean

the supply from spikes.

An example of switching regulator with 12V input is in the below schematic:

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NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with LE910 V2. Their use can lead to overvoltage on the LE910 V2 and damage it. USE ONLY Li-Ion battery types.

4.3.1.3 Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single

3.7V Li-Ion cell battery type is suited for supplying the power to the Telit LE910 V2 module.

 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption

peaks, a 100μF tantalum capacitor is usually suited.

 Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.  A protection diode should be inserted close to the power input, in order to save the LE910 V2 from power

polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

 The battery must be rated to supply peaks of current up to 0.8 A for LTE and WCDMA mode and 2A for

GSM mode.

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NOTE: Make PCB design in order to have the best connection of GND pads to large surfaces.

NOTE: The LE910 V2 includes a function to prevent overheating.

4.3.1.4 Thermal Design Guidelines

Worst case as reference values for thermal design of LE910 V2 are:

 Average current consumption: 800 mA  Supply voltage: 3.80V

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