Telit Communications S p A LE910CXLA Users Manual

LE910Cx

HW User Guide

Doc#: 1VV0301298

Rev. 14.0 – 2019-07-15

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been
carefully checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes
from time to time in content hereof with no obligation to notify any person of revisions or
changes. Telit does not assume any liability arising out of the application or use of any
product, software, or circuit described herein; neither does it convey license under its
patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve
for Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under
the copyrights, patents or patent applications of Telit, as arises by operation of law in the
sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner
without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,
the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive,
royalty free license to use that arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with
the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such
High-Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply
with all terms and conditions imposed on you in respect of such separate software. In
addition to Third Party Terms, the disclaimer of warranty and limitation of liability
provisions in this License shall apply to the Third-Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD
PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS

FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND

THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE
SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF
SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),
HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER
LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF
THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER
OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE
FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE

This documentation applies to the following products:

Table 1: Applicability Table

Module Name

Description

LE910C1-NA

North America – AT&T with global roaming

LE910C1-NS

North America - Sprint variant

LE910C1-AP

APAC variant CAT1 variant

LE910C4-AP

APAC variant CAT4 variant

LE910C4-EU

Europe CAT4 variant

LE910C1-EU

Europe CAT1 variant

LE910C4-NF

North America CAT4 variant

LE910C1-NF

North America CAT1 variant

LE910C1-SA

North America CAT1 variant – AT&T

LE910C1-ST

North America CAT1 variant – T Mobile

LE910C1-SV

North America CAT1 variant – Verizon

LE910C1-LA

Latin America CAT1 variant

LE910C4-LA

Latin America CAT4 variant

LE910C4-CN

China CAT4 variant

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CONTENTS

1. INTRODUCTION .............................................................................................9

Scope ............................................................................................................. 9

Audience......................................................................................................... 9

Contact Information, Support .......................................................................... 9

Text Conventions ...........................................................................................10

Related Documents .......................................................................................11

2. PRODUCT DESCRIPTION ............................................................................ 12

Overview........................................................................................................12

Applications ...................................................................................................13

General Functionality and Main Features.......................................................13

Block Diagram ...............................................................................................16

Environmental Requirements .........................................................................17

2.5.1. Temperature Range .......................................................................................17

2.5.2. RoHS Compliance .........................................................................................17

Operating Frequency Bands ..........................................................................18

2.6.1. RF Bands per Regional Variant .....................................................................18

2.6.2. Reference Table of RF Bands Characteristics ...............................................19

RF Parameters ..............................................................................................22

2.7.1. Sensitivity ......................................................................................................22

2.7.2. Output power .................................................................................................22

Mechanical Specifications ..............................................................................23

2.8.1. Dimensions ....................................................................................................23

2.8.2. Weight ...........................................................................................................23

3. MODULE CONNECTIONS ............................................................................ 24

Pin-out ...........................................................................................................24

Signals That Must Be Connected ...................................................................33

LGA Pads Layout ...........................................................................................35

Backward Compatibility to xE910 Family .......................................................35

4. ELECTRICAL SPECIFICATIONS ................................................................. 37

Absolute Maximum Ratings – Not Operational ...............................................37

Recommended Operating Conditions ............................................................37

Logic Level Specifications ..............................................................................38

4.3.1. 1.8V Pads - Absolute Maximum Ratings ........................................................38

4.3.2. 1.8V Standard GPIOs ....................................................................................38

4.3.3. 1.8V SD Card Pads .......................................................................................39

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4.3.4. 1.8V SIM Card Pads ......................................................................................40

4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ...........................................40

4.3.6. SD Card Pads @ 2.95V .................................................................................40

4.3.7. SIM Card Pads @2.95V.................................................................................41

5. HARDWARE COMMANDS ........................................................................... 42

Turning on the LE910Cx Module ...................................................................42

Initialization and Activation State ...................................................................42

Turning off the LE910Cx Module ...................................................................45

5.3.1. Shutdown by Software Command ..................................................................46

5.3.2. Hardware Shutdown ......................................................................................47

5.3.3. Unconditional Hardware Shutdown ................................................................48

Powering OFF the Module .............................................................................49

Fast Power Down ..........................................................................................50

5.5.1. Fast Shut Down by Hardware ........................................................................50

5.5.2. Fast Shut Down by Software..........................................................................52

6. POWER SUPPLY .......................................................................................... 53

Power Supply Requirements ..........................................................................53

Power Consumption ......................................................................................53

General Design Rules ....................................................................................55

6.3.1. Electrical Design Guidelines ..........................................................................55

6.3.1.1. + 5V Input Source Power Supply – Design Guidelines ...................................55

6.3.1.2. + 12V Input Source Power Supply – Design Guidelines .................................56

6.3.1.3. Battery Source Power Supply – Design Guidelines ........................................57

6.3.2. Thermal Design Guidelines ............................................................................58

6.3.3. Power Supply PCB Layout Guidelines ...........................................................59

7. ANTENNA(S) ................................ ................................................................ 60

GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ...............................60

GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................61

GSM/WCDMA/LTE Antenna – Installation Guidelines....................................62

Antenna Diversity Requirements ....................................................................62

GNSS Antenna Requirements .......................................................................63

7.5.1. Combined GNSS Antenna .............................................................................63

7.5.2. Linear and Patch GNSS Antenna ..................................................................64

7.5.3. Front End Design Considerations ..................................................................64

7.5.4. GNSS Antenna – PCB Line Guidelines ..........................................................64

8. HARDWARE INTERFACES .......................................................................... 66

USB Port........................................................................................................67

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HSIC Interface (Optional) ...............................................................................68

SGMII Interface..............................................................................................68

8.3.1. Ethernet Control interface ..............................................................................68

Serial Ports ....................................................................................................70

8.4.1. Modem Serial Port 1 Signals..........................................................................70

8.4.2. Modem Serial Port 2 ......................................................................................72

8.4.3. RS232 Level Translation ................................................................................72

Peripheral Ports .............................................................................................74

8.5.1. SPI – Serial Peripheral Interface ....................................................................74

8.5.2. I2C - Inter-integrated Circuit ...........................................................................75

8.5.3. SD/MMC Card Interface .................................................................................75

8.5.4. WiFi SDIO Interface .......................................................................................77

Audio Interface ..............................................................................................79

8.6.1. Digital Audio ..................................................................................................79

8.6.1.1. Short Frame Timing Diagrams .......................................................................80

8.6.1.2. Long Frame Timing Diagrams ........................................................................81

General Purpose I/O ......................................................................................83

8.7.1. Using a GPIO Pad as Input ............................................................................85

8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ......................................85

8.7.3. Using a GPIO Pad as Output .........................................................................86

9. MISCELLANEOUS FUNCTIONS .................................................................. 87

Indication of Network Service Availability .......................................................87

Indication of Software Ready .........................................................................88

RTC – Real Time Clock .................................................................................88

VAUX Power Output ......................................................................................88

ADC Converter ..............................................................................................88

9.5.1. Description .....................................................................................................88

9.5.2. Using the ADC Converter ..............................................................................89

Using the Temperature Monitor Function .......................................................89

GNSS Characteristics ....................................................................................90

10. MOUNTING THE MODULE ON YOUR BOARD ........................................... 91

General ..........................................................................................................91

Finishing & Dimensions .................................................................................91

Recommended Footprint for the Application ..................................................94

Stencil ............................................................................................................95

PCB Pad Design ............................................................................................95

Recommendations for PCB Pad Dimensions (mm) ........................................96

Solder Paste ..................................................................................................97

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10.7.1. Solder Reflow ................................................................ ................................97

10.7.2. Cleaning ........................................................................................................99

11. APPLICATION GUIDE ................................................................................ 100

Debug of the LE910Cx Module in Production .............................................. 100

Bypass Capacitor on Power Supplies .......................................................... 101

SIM Interface ............................................................................................... 102

11.3.1. SIM Schematic Example .............................................................................. 102

EMC Recommendations .............................................................................. 103

Download and Debug Port ........................................................................... 103

11.5.1. Fast Boot mode ........................................................................................... 104

11.5.2. Recovery Boot Mode ................................................................................... 104

12. PACKING SYSTEM .................................................................................... 105

Packing System – Tray ................................................................................ 105

Tape & Reel ................................................................................................. 107

Moisture Sensitivity ...................................................................................... 109

13. SAFETY RECOMMENDATIONS................................................................. 110

14. CONFORMITY ASSESSMENT ISSUES ..................................................... 111

FCC/ISED Regulatory Notices ..................................................................... 111

JTBL Regulatory Notices ............................................................................. 116

15. ACRONYMS ................................................................................................ 117

16. DOCUMENT HISTORY ............................................................................... 120

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1. Introduction

Scope

This document introduces the Telit LE910Cx module and presents possible and
recommended hardware solutions for developing a product based on the LE910Cx
module. All the features and solutions detailed in this document are applicable to all
LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table.

If a specific feature is applicable to a specific product only, it will be clearly marked.

NOTE:

LE910Cx refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; suggests a
valid hardware solution for each function and points out incorrect solutions and common
errors to be avoided.

Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Obviously, avoiding invalid solutions must be considered mandatory.
Where the suggested hardware configurations need not be considered mandatory, the
information given should be used as a guide and a starting point for properly developing
your product with the Telit LE910Cx module.

NOTE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx
cellular module within a user application must be done according to the
design rules described in this manual.

Audience

This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LE910Cx module.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors, contact Telit Technical Support at:

• [e-mail]

• [e-mail]

• [e-mail]

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Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.

Telit appreciates feedback from the users of our information.

Text Conventions

The following conventions are used to emphasize specific types of information:

DANGER:

Danger – This information MUST be followed, or catastrophic equipment
failure or bodily injury may occur.

WARNING:

Caution or Warning – Alerts the user to important points about integrating the
module, if these points are not followed, the module and end user equipment
may fail or malfunction.

NOTE:

Tip or Information – Provides advice and suggestions that may be useful
when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents

Table 2: Related Documents

Document Title

Document Number

Ref 1: LE920x4/LE910Cx AT Command User Guide

80490ST10778A

Ref 2: Telit EVB HW User Guide

1VV0301249

Ref 3: LE910Cx Interface Board HW User Guide

1VV0301323

Ref 4: LE910/LE920 Digital Voice Interface Application
Note

80000NT11246A

Ref 5: Telit_LE920A4_LE910Cx_Wi­Fi_Interface_Application_Note_r1

80490NT11511A
Ref 6: Antenna Detection Application Note

80000NT10002A

Ref 7: High-Speed Inter-Chip USB Electrical Specification,
version 1.0

(a supplement to the USB 2.0 specification, Section 3.8.2)

Ref 8: ETH_Expansion_board_Application Note

80490NT11622A

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2. Product Description

Overview

LE910Cx is Telit’s new LTE series for IoT applications.
In its most basic use case, LE910Cx can be applied as a wireless communication front-

end for telematics products, offering GNSS and mobile communication features to an
external host CPU through its rich interfaces.

LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For
differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per

Regional Variant.

The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents
or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied
in Telit products. This document is subject to change without notice.

NOTE:
(EN) The integration of the LE910Cx cellular module within user application

shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare LE910Cx all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo

manuale.
(DE) Die Integration des LE910Cx Mobilfunk-Moduls in ein Gerät muß gemäß

der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija LE910Cx modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo LE910Cx debe ser conforme a los usos para
los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire LE910Cx dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

(HE)

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Applications

LE910Cx can be used for telematics applications where tamper-resistance, confidentiality,
integrity, and authenticity of end-user information are required, for example:

• Emergency call

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

General Functionality and Main Features

The LE910Cx series of cellular modules features an LTE and multi-RAT modem together
with a powerful on-chip application processor and a rich set of interfaces.

The major functions and features are listed below:

Table 3: Features Table

Function

Features

Modem

• Multi-RAT cellular modem for voice and data communication

o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).
o Carrier aggregation is not supported
o GSM/GPRS/EDGE
o WCDMA up to DC HSPA+, Rel.9

• Support for SIM profile switching

• Regional variants with optimal choice of RF bands for

worldwide coverage of countries and MNOs

• State-of-the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver

Digital audio
subsystem

• PCM/I2S digital audio interface

• Up to 48 kHz sample rate, 16-bit words

Two USIM ports
– dual voltage

• Class B and Class C support

• Hot swap support

• Clock rates up to 5 MHz

Application
processor

Application processor to run customer application code

• 32-bit ARM Cortex-A7 up to 1.3 GHz running the Linux
operating system

• Flash + DDR are large enough to allow for customer’s own
software applications

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Function

Features

Interfaces

Rich set of interfaces, including:

• SD/MMC Card Interface supporting SD3.0 standard

• SDIO for external WiFi transceiver supporting SDIO3.0

standard

• SGMII for external Ethernet transceiver

o Compliant with IEEE802.3
o Full duplex operation at 1 Gbps
o Half/full duplex operation at 10/100 Mbps
o Support for VLAN tagging
o Support for IEEE1588, PTP (Precision Time Protocol)

• USB2.0 – USB port is typically used for:

o Flashing of firmware and module configuration
o Production testing
o Accessing the Application Processor’s file system
o AT command access
o High-speed WWAN access to external host
o Diagnostic monitoring and debugging
o NMEA data to an external host CPU

• HSIC (Optional)

o High-speed 480 Mbps (240 MHz DDR) USB transfers are

100% host driver compatible with traditional USB cable
connected topologies

o Bidirectional data strobe signal (STROBE)
o Bidirectional data signal (DATA)
o No power consumption unless a transfer is in progress
o Maximum trace length 10 cm
o Signals driven at 1.2V standard LVCMOS levels

• Peripheral Ports – SPI, I2C, UART

• GPIOs

• Antenna ports

Form factor

Form factor (28x28mm), accommodating the multiple RF bands in
each region variant

Environment
and quality
requirements

The entire module is designed and qualified by Telit for satisfying the
environment and quality requirements.

Single supply
module

The module generates all its internal supply voltages.
RTC

No dedicated RTC supply, RTC is supplied by VBATT

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Function

Features

Operating
temperature

Range -40 °C to +85 °C (conditions as defined in Section 2.5.1,

Temperature Range).

NOTE:

The following interfaces are unique for the LE910Cx and may not be
supported on other (former or future) xE910 family. Special care must be
taken when designing the application board if future compatibility is required:

- SGMII for Ethernet connectivity

- SDIO for WIFI connectivity

- SD/MMC for SD Card connectivity

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Block Diagram

Figure 1 shows an overview of the internal architecture of the LE910Cx module.
It includes the following sub-functions:

• Application processor, Modem subsystem and Location processing with their

external interfaces. These three functions are contained in a single SOC.

• RF front end and antenna ports.

• Digital Audio interface for external codec.

• Rich IO interfaces. Depending on which LE910Cx software features are enabled,

some of its interfaces that are exported due to multiplexing may be used internally
and thus may not be usable by the application.

• PMIC with the RTC function inside

Figure 1: LE910Cx Block Diagram

MEMORIES

RF

FRONTEND

GNSS Antennna

GPIO

Cellular antenna 1

Cellular antenna 2

PCM In/out

SIM

GNSS_Sync

APPLICATION

PROCESSOR

MODEM

LOCATION

HSICI2C USB2.0SGMIISPI

UART

JTAG

2xSDIO

PMIC

VBATT

ADC

VBATT_PA

RTC

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Environmental Requirements

2.5.1. Temperature Range

Operating
temperature
range

-40 ~ +85°C Ambient.
Temperatures outside of the range –20°C ÷ +55°C might slightly

deviate from ETSI specifications. The module is fully functional,
able to make and receive voice calls, data calls, SMS and GPRS
traffic.

Storage and non­operating
temperature
range

–40°C ~ +90°C

2.5.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LE910Cx complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union
(EU directive 2011/65/EU).

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Operating Frequency Bands

The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes conform to the 3GPP specifications.

2.6.1. RF Bands per Regional Variant

Table 4 summarizes all region variants within the LE910Cx family, showing the supported
band sets in each variant.

Table 4: RF Bands per Regional Variant

Region
Variant

2G

HSPA+

LTE FDD

LTE TDD

TD-SCDMA

LE910C1-NA

2, 3, 5, 8

1, 2, 4, 5, 8

2, 4, 12

-

-

LE910C1-NS

- - 2, 4, 5, 12, 25, 26

-

-

LE910C1-AP

-

1, 5, 6, 8, 19

1, 3, 5, 8, 9, 18, 19,
26, 28

-

-

LE910C4-AP

-

1, 5, 6, 8, 19

1, 3, 5, 8, 9, 18, 19,
26, 28

-

-

LE910C4-EU

3, 8

1, 3, 8

1, 3, 7, 8, 20, 28A

-

-

LE910C1-EU

3, 8

1, 3, 8

1, 3, 7, 8, 20, 28A

-

-

LE910C4-NF

-

2, 4, 5

2, 4, 5, 12, 13, 14,
66, 71

-

-

LE910C1-NF

-

2, 4, 5

2, 4, 5, 12, 13, 14,
66, 71

-

-

LE910C1-SA

- - 2, 4, 12, 14, 66

-

-

LE910C1-ST

- - 2, 4, 12, 66, 71

-

-

LE910C1-SV

- - 4, 13

- - LE910C1-LA

2, 3, 5, 8

1, 2, 4, 5

1, 2, 3, 4, 5, 7, 28

-

-

LE910C4-LA

2, 3, 5, 8

1, 2, 4, 5

1, 2, 3, 4, 5, 7, 28

-

-

LE910C4-CN

3, 8

1, 8

1, 3, 5, 8, 38, 39,
40, 41M

-

34, 39

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2.6.2. Reference Table of RF Bands Characteristics

Table 5: RF Bands Characteristics

Mode

Freq. Tx (MHz)

Freq. Rx (MHz)

Channels

Tx-Rx

Offset

PCS 1900

1850.2 ~ 1909.8

1930.2 ~ 1989.8

512 ~ 810

80 MHz

DCS 1800

1710 ~ 1785

1805 ~ 1880

512 ~ 885

95 MHz

GSM 850

824.2 ~ 848.8

869.2 ~ 893.8

128 ~ 251

45 MHz

EGSM 900
890 ~ 915

935 ~ 960

0 ~ 124

45 MHz

880 ~ 890

925 ~ 935

975 ~ 1023

45 MHz

WCDMA 2100 – B1

1920 ~ 1980

2110 ~ 2170

Tx: 9612 ~ 9888
Rx: 10562 ~ 10838

190 MHz

WCDMA 1900 – B2

1850 ~ 1910

1930 ~ 1990

Tx: 9262 ~ 9538
Rx: 9662 ~ 9938

80 MHz

WCDMA 1800 – B3

1710 ~ 1785

1805 ~ 1880

Tx: 937 ~ 1288
Rx: 1162 ~ 1513

95 MHz

WCDMA AWS – B4

1710 ~ 1755

2110 ~ 2155

Tx: 1312 ~ 1513
Rx: 1537 ~ 1738

400 MHz

WCDMA 850 – B5

824 ~ 849

869 ~ 894

Tx: 4132 ~ 4233
Rx: 4357 ~ 4458

45 MHz

WCDMA 900 – B8

880 ~ 915

925 ~ 960

Tx: 2712 ~ 2863
Rx: 2937 ~ 3088

45 MHz

WCDMA 1800 – B9

1750 ~ 1784.8

1845 ~ 1879.8

Tx: 8762 ~ 8912
Rx: 9237 ~ 9387

95 MHz

WCDMA 800 – B19

830 ~ 845

875 ~ 890

Tx: 312 ~ 363
Rx: 712 ~ 763

45 MHz

TDS CDMA 2000 – B34

2010 ~ 2025

2010 ~ 2025

Tx: 10054 ~ 10121
Rx: 10054 ~ 10121

0 MHz

TDS CDMA 1900 – B39

1880 ~ 1920

1880 ~ 1920

Tx: 9404 ~ 9596
Rx: 9404 ~ 9596

0 MHz

LTE 2100 – B1

1920 ~ 1980

2110 ~ 2170

Tx: 18000 ~ 18599
Rx: 0 ~ 599

190 MHz

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Mode

Freq. Tx (MHz)

Freq. Rx (MHz)

Channels

Tx-Rx

Offset

LTE 1900 – B2

1850 ~ 1910

1930 ~ 1990

Tx: 18600 ~ 19199
Rx: 600 ~ 1199

80 MHz

LTE 1800 – B3

1710 ~ 1785

1805 ~ 1880

Tx: 19200 ~ 19949
Rx: 1200 ~ 1949

95 MHz

LTE AWS – B4

1710 ~ 1755

2110 ~ 2155

Tx: 19950 ~ 20399
Rx: 1950 ~ 2399

400 MHz

LTE 850 – B5

824 ~ 849

869 ~ 894

Tx: 20400 ~ 20649
Rx: 2400 ~ 2649

45 MHz

LTE 2600 – B7

2500 ~ 2570

2620 ~ 2690

Tx: 20750 ~ 21449
Rx: 2750 ~ 3449

120 MHz

LTE 900 – B8

880 ~ 915

925 ~ 960

Tx: 21450 ~ 21799
Rx: 3450 ~ 3799

45 MHz

LTE 1800 – B9

1749.9 ~ 1784.9

1844.9 ~ 1879.9

Tx: 21800 ~ 2149
Rx: 3800 ~ 4149

95 MHz

LTE AWS+ – B10

1710 ~ 1770

2110 ~ 2170

Tx: 22150 ~ 22749
Rx: 4150 ~ 4749

400 MHz

LTE 700a – B12

699 ~ 716

729 ~ 746

Tx: 23010 ~ 23179
Rx: 5010 ~ 5179

30 MHz

LTE 700c – B13

777 ~ 787

746 ~ 756

Tx: 23180 ~ 23279
Rx: 5180 ~ 5279

-31 MHz

LTE 700PS – B14

788 ~ 798

758 ~ 768

Tx: 23280 ~ 23379
Rx: 5280 ~ 5379

-30 MHz

LTE 700b – B17

704 ~ 716

734 ~ 746

Tx: 23730 ~ 23849
Rx: 5730 ~ 5849

30 MHz

LTE 800 – B19

830 ~ 845

875 ~ 890

Tx: 24000 ~ 24149
Rx: 6000 ~ 6149

45 MHz

LTE 800 – B20

832 ~ 862

791 ~ 821

Tx: 24150 ~ 24449
Rx: 6150 ~ 6449

-41 MHz

LTE 1500 – B21

1447.9 ~ 1462.9

1495.9 ~ 1510.9

Tx: 24450 ~ 24599
Rx: 6450 ~ 6599

48 MHz

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Mode

Freq. Tx (MHz)

Freq. Rx (MHz)

Channels

Tx-Rx

Offset

LTE 1900+ – B25

1850 ~ 1915

1930 ~ 1995

Tx: 26040 ~ 26689
Rx: 8040 ~ 8689

80 MHz

LTE 850+ – B26

814 ~ 849

859 ~ 894

Tx: 26690 ~ 27039
Rx: 8690 ~ 9039

45 MHz

LTE 700 – B28A

703 ~ 733

758 ~ 788

Tx: 27210 ~ 27510
Rx: 9210 ~ 9510

55 MHz

LTE 700 – B28

703 ~ 748

758 ~ 803

Tx: 27210 ~ 27659
Rx: 9210 ~ 9659

55 MHz

LTE AWS-3 – B66

1710 ~ 1780

2210 ~ 2200

Tx: 131972-132671
Rx: 66436-67335

400 MHz

LTE600 – B71

663 ~ 698

617 ~ 652

Tx: 133122-133471
Rx: 68568-68935

46 MHz

LTE TDD 2600 – B38

2570 ~ 2620

2570 ~ 2620

Tx: 37750 ~ 38250
Rx: 37750 ~ 38250

0 MHz

LTE TDD 1900 – B39

1880 ~ 1920

1880 ~ 1920

Tx: 38250 ~ 38650
Rx: 38250 ~ 38650

0 MHz

LTE TDD 2300 – B40

2300 ~ 2400

2300 ~ 2400

Tx: 38650 ~ 39650
Rx: 38650 ~ 39650

0 MHz

LTE TDD 2500 – B41M

2555 ~ 2655

2555 ~ 2655

Tx: 40265 ~ 41215
Rx: 40265 ~ 41215

0 MHz

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RF Parameters

2.7.1. Sensitivity

Typical sensitivity levels are as follows:

• -106 dBm @ 2G

• -111 dBm @ 3G

• -101 dBm @ 4G FDD (BW=5 MHz)

2.7.2. Output power

Typical values for Max output level are as follow:

• 2G:

- LB: 32.5dBm ±0.5dBm

- HB: 29.5dBm ±0.5dBm

• 3G/TD-SCDMA: 23.5dBm ±0.5dBm

• 4G (FDD & TDD): 23dBm ±0.5dBm @1RB

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Mechanical Specifications

2.8.1. Dimensions

The module’s overall dimensions are:

• Length: 28.2 mm, +/- 0.15 mm tolerance

• Width: 28.2 mm, +/- 0.15 mm tolerance

• Thickness: 2.2 mm, +/- 0.15 mm tolerance

NOTE:

LE910C1-SV’s thickness is only 2.3mm, +/- 0.15 mm tolerance.

NOTE:

Consider a typical label thickness of 0.1 mm in addition to the module
thickness.

2.8.2. Weight

The nominal weight of the LE910Cx module is 9.0 gram.

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3. Module Connections

Pin-out

Table 6: Pin-out

PAD

Signal

I/O

Function

Type

Comment

USB HS 2.0 Communication Port

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

USB_VBUS

AI

Power sense for the internal
USB transceiver

Power

A14

USB_ID

AI

USB ID

See note
below

Asynchronous UART

N15

C103/TXD

I

Serial data input (TXD) from
DTE

1.8V

M15

C104/RXD

O

Serial data output to DTE

1.8V

L14

C105/RTS

I

Input for Request to send
signal (RTS) from DTE

1.8V

P15

C106/CTS

O

Output for Clear to send signal
(CTS) to DTE

1.8V

P14

C107/DSR

O

Output for Data Set Ready
(DSR) to DTE

1.8V

Alternate Fn
GPIO_32

M14

C108/DTR

I

Input for Data Terminal Ready
(DTR) from DTE

1.8V

Alternate Fn
GPIO_34

N14

C109/DCD

O

Output for Data Carrier Detect
(DCD) to DTE

1.8V

Alternate Fn
GPIO_33

R14

C125/RING

O

Output for Ring Indication (RI)
to DTE

1.8V

Alternate Fn
GPIO_31

SPI – Serial Peripheral Interface / AUX UART

F15

SPI_CLK

O

SPI Clock output

1.8V

E15

SPI_MISO/ RX_AUX

I

SPI data Master Input Slave
output / RX_AUX

1.8V

D15

SPI_MOSI/TX_AUX

O

SPI data Master Output Slave
input/ TX_AUX

1.8V

H14

SPI_CS/GPIO11

O

SPI Chip select output /
GPIO11

1.8V

See note
below

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PAD

Signal

I/O

Function

Type

Comment

SD/MMC Card Digital I/O

J12

SD/MMC_CMD

O

SD Command

1.8/2.95V

F12

SD/MMC_CLK

O

SD Card Clock

1.8/2.95V

E12

SD/MMC_DATA0

I/O

SD Serial Data 0

1.8/2.95V

G12

SD/MMC_DATA1

I/O

SD Serial Data 1

1.8/2.95V

K12

SD/MMC_DATA2

I/O

SD Serial Data 2

1.8/2.95V

H12

SD/MMC_DATA3

I/O

SD Serial Data 3

1.8/2.95V

G13

SD/MMC_CD

I

SD card detect input

1.8V

Active Low

F13

VMMC

-

Power supply for MMC card
pull-up resistors

1.8/2.95V

WiFi (SDIO) Interface

N13

WiFi_SD_CMD

O

Wi-Fi SD Command

1.8V

L13

WiFi_SD_CLK

O

Wi-Fi SD Clock

1.8V

J13

WiFi_SD_DATA0

I/O

Wi-Fi SD Serial Data 0

1.8V

M13

WiFi_SD_DATA1

I/O

Wi-Fi SD Serial Data 1

1.8V

K13

WiFi_SD_DATA2

I/O

Wi-Fi SD Serial Data 2

1.8V

H13

WiFi_SD_DATA3

I/O

Wi-Fi SD Serial Data 3

1.8V

L12

WiFi_SDRST

O

Wi-Fi Reset / Power enable
control

1.8V

Active Low

M11

WLAN_SLEEP_CLK

O

Wi-Fi Sleep clock output

1.8V

M10

RFCLK2_QCA

O

Wi-Fi low noise RF clock
output

1.8V

LTE-WiFi Coexistence

M8

WCI_TX

O

Wireless coexistence interface
TXD

1.8V

M9

WCI_RX

I

Wireless coexistence interface
RXD

1.8V

SIM Card Interface 1

A6

SIMCLK1

O

External SIM 1 signal – Clock

1.8/2.85V

A7

SIMRST1

O

External SIM 1 signal – Reset

1.8/2.85V

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PAD

Signal

I/O

Function

Type

Comment

A5

SIMIO1

I/O

External SIM 1 signal - Data
I/O

1.8/2.85V

Internally PU
10 kΩ to
SIMVCC1

A4

SIMIN1

I

External SIM 1 signal ­Presence

1.8V

Active low

A3

SIMVCC1

-

External SIM 1 signal – Power
supply for SIM 1

1.8/2.85V

SIM Card Interface 2

C1

SIMCLK2

O

External SIM 2 signal – Clock

1.8/2.85V

D1

SIMRST2

O

External SIM 2 signal – Reset

1.8/2.85V

C2

SIMIO2

I/O

External SIM 2 signal – Data
I/O

1.8/2.85V

Internally PU
10kΩ to
SIMVCC2

G4

SIMIN2

I

External SIM 2 signal –
Presence

1.8V

Active low

D2

SIMVCC2

-

External SIM 2 signal – Power
supply for SIM 2

1.8/2.85V

Digital Voice Interface (DVI)

B9

DVI_WAO

O

Digital Voice interface (WAO
master output)

1.8V

B6

DVI_RX

I

Digital Voice interface (Rx)

1.8V

B7

DVI_TX

O

Digital Voice interface (Tx)

1.8V

B8

DVI_CLK

O

Digital Voice interface (CLK
master output)

1.8V

B12

REF_CLK

O

Reference clock for external
Codec

1.8V

See Note
below

General Purpose Digital I/O

C8

GPIO_01

I/O

GPIO_01 / STAT_LED

1.8V

Alternate Fn
I2C

C9

GPIO_02

I/O

GPIO_02

1.8V

Alternate Fn
I2C

C10

GPIO_03

I/O

GPIO_03

1.8V

Alternate Fn
I2C

C11

GPIO_04

I/O

GPIO_04

1.8V

Alternate Fn
I2C

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PAD

Signal

I/O

Function

Type

Comment

B14

GPIO_05

I/O

GPIO_05

1.8V

Alternate Fn
I2C

C12

GPIO_06

I/O

GPIO_06

1.8V

Alternate Fn
I2C

C13

GPIO_07

I/O

GPIO_07

1.8V

Alternate Fn
I2C

K15

GPIO_08

I/O

GPIO_08 / SW_RDY

1.8V

Alternate Fn
I2C

L15

GPIO_09

I/O

GPIO_09

1.8V

Alternate Fn
I2C

G15

GPIO_10

I/O

GPIO_10

1.8V

Alternate Fn
I2C

RF Section

K1

Antenna

I/O

GSM/EDGE/UMTS/LTE Main
antenna (50 Ohm)

RF F1

ANT_DIV

I

UMTS/LTE antenna diversity
input (50 Ohm)

RF

GPS Section

R9

ANT_GPS

I

GPS antenna (50 Ohm)

RF

R7

GPS_LNA_EN

O

Enables the external regulator
for GPS LNA

1.8V

N9

GPS_SYNC

O

GPS sync signal for Dead
Reckoning

1.8V

Miscellaneous Functions

R12

ON_OFF_N

I

Power ON / Power OFF input

Active low

R13

HW_SHUTDOWN_N

I

Unconditional Shutdown input

Active low

R11

VAUX/PWRMON

O

Supply output for external
accessories /

Power ON monitor

1.8V

E13

VIO_1V8

O

IO voltage for internal ICs
It should be turned off

1.8V

B1

ADC_IN1

AI

Analog/Digital Converter Input
1

Analog

H4

ADC_IN2

AI

Analog/Digital Converter Input
2

Analog

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PAD

Signal

I/O

Function

Type

Comment

D7

ADC_IN3

AI

Analog/Digital Converter Input
3

Analog

SGMII Interface

E4

SGMII_RX_P

AI

SGMII receive – plus

PHY

F4

SGMII_RX_M

AI

SGMII receive – minus

PHY

D5

SGMII_TX_P

AO

SGMII transmit – plus

PHY

D6

SGMII_TX_M

AO

SGMII transmit - minus

PHY

HSIC Interface

A12

HSIC_DATA

I/O

High-speed inter-chip interface

- data

1.2V

Optional

A11

HSIC_STB

I/O

High-speed inter-chip interface

- strobe

1.2V

Optional

I2C Interface

B11

I2C_SCL

I/O

I2C clock

1.8V

Internally PU

2.2kΩ to 1.8V

B10

I2C_SDA

I/O

I2C Data

1.8V

Internally PU

2.2kΩ to 1.8V

Power Supply

M1

VBATT

-

Main Power Supply (Digital
Section)

Power

M2

VBATT

-

Main Power Supply (Digital
Section)

Power

N1

VBATT_PA

-

Main Power Supply (RF
Section)

Power

N2

VBATT_PA

-

Main Power Supply (RF
Section)

Power

P1

VBATT_PA

-

Main Power Supply (RF
Section)

Power

P2

VBATT_PA

-

Main Power Supply (RF
Section)

Power

A2

GND

-

Ground

B13

GND

Ground

D4

GND

-

Ground

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PAD

Signal

I/O

Function

Type

Comment

E1

GND

-

Ground

E2

GND

-

Ground

E14

GND

-

Ground

F2

GND

-

Ground

G1

GND

-

Ground

G2

GND

-

Ground

G7

GND

-

Ground

G8

GND

-

Ground

G9

GND

-

Ground

H1

GND

-

Ground

H2

GND

-

Ground

H7

GND

-

Ground

H8

GND

-

Ground

H9

GND

-

Ground

J1

GND

-

Ground

J2

GND

-

Ground

J7

GND

-

Ground

J8

GND

-

Ground

J9

GND

-

Ground

K2

GND

-

Ground

L1

GND

-

Ground

L2

GND

-

Ground

M3

GND

-

Ground

M4

GND

-

Ground

M12

GND

-

Ground

N3

GND

-

Ground

N4

GND

-

Ground

N5

GND

-

Ground

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PAD

Signal

I/O

Function

Type

Comment

N6

GND

-

Ground

P3

GND

-

Ground

P4

GND

-

Ground

P5

GND

-

Ground

P6

GND

-

Ground

P8

GND

-

Ground

P9

GND

-

Ground

P10

GND

-

Ground

P13

GND

-

Ground

R2

GND

-

Ground

R3

GND

-

Ground

R5

GND

-

Ground

R6

GND

-

Ground

R8

GND

-

Ground

R10

GND

-

Ground

Reserved

A8

Reserved

-

Reserved

A9

Reserved

-

Reserved

A10

Reserved

-

Reserved

B2

Reserved

-

Reserved

B3

Reserved

-

Reserved

B4

Reserved

-

Reserved

B5

Reserved

-

Reserved

C3

Reserved

-

Reserved

C4

Reserved

-

Reserved

C5

Reserved

-

Reserved

C6

Reserved

-

Reserved

C7

Reserved

-

Reserved