Telit Communications S p A LE910C1ST, LE910C1SA User Manual
LE910Cx
HW User Guide
Doc#: 1VV0301298
Rev.8 – 2018-12-12
LE910Cx HW User Guide
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Rev. 2.0 Page 2 of 121 2018-12-12
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been
carefully checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes
from time to time in content hereof with no obligation to notify any person of revisions or
changes. Telit does not assume any liability arising out of the application or use of any
product, software, or circuit described herein; neither does it convey license under its
patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve
for Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under
the copyrights, patents or patent applications of Telit, as arises by operation of law in the
sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner
without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,
the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive,
royalty free license to use that arises by operation of law in the sale of a product.
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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with
the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such
High-Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply
with all terms and conditions imposed on you in respect of such separate software. In
addition to Third Party Terms, the disclaimer of warranty and limitation of liability
provisions in this License shall apply to the Third-Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD
PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS
FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND
THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE
SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF
SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),
HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER
LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF
THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER
OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE
FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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APPLICABILITY TABLE
This documentation applies to the following products:
Table 1: Applicability Table
Module Name
Description
LE910C1-NA
North America – AT&T with global roaming
LE910C1-NS
North America - Sprint variant
LE910C1-AP
APAC variant
LE910C4-EU
Europe CAT4 variant
LE910C1-EU
Europe CAT1 variant
LE910C4-NF
North America CAT4 variant
LE910C1-NF
North America CAT1 variant
LE910C1-SA
North America CAT1 variant – AT&T
LE910C1-ST
North America CAT1 variant – T Mobile
LE910C1-SV
North America CAT1 variant – Verizon
LE910C1-LA
Latin America CAT1 variant
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CONTENTS
1. INTRODUCTION .............................................................................................9
Scope ............................................................................................................. 9
Audience......................................................................................................... 9
Contact Information, Support .......................................................................... 9
Text Conventions ...........................................................................................10
Related Documents .......................................................................................11
2. PRODUCT DESCRIPTION ............................................................................ 12
Overview........................................................................................................12
Applications ...................................................................................................13
General Functionality and Main Features.......................................................13
Block Diagram ...............................................................................................16
Environmental Requirements .........................................................................17
2.5.1. Temperature Range .......................................................................................17
2.5.2. RoHS Compliance .........................................................................................17
Operating Frequency Bands ..........................................................................18
2.6.1. RF Bands per Regional Variant .....................................................................18
2.6.2. Reference Table of RF Bands Characteristics ...............................................19
RF Parameters ..............................................................................................22
2.7.1. Sensitivity ......................................................................................................22
2.7.2. Output power .................................................................................................22
Mechanical Specifications ..............................................................................23
2.8.1. Dimensions ....................................................................................................23
2.8.2. Weight ...........................................................................................................23
3. MODULE CONNECTIONS ............................................................................ 24
Pin-out ...........................................................................................................24
Signals That Must Be Connected ...................................................................33
LGA Pads Layout ...........................................................................................35
Backward Compatibility to xE910 Family .......................................................36
4. ELECTRICAL SPECIFICATIONS ................................................................. 37
Absolute Maximum Ratings – Not Operational ...............................................37
Recommended Operating Conditions ............................................................37
Logic Level Specifications ..............................................................................38
4.3.1. 1.8V Pads - Absolute Maximum Ratings ........................................................38
4.3.2. 1.8V Standard GPIOs ....................................................................................38
4.3.3. 1.8V SD Card Pads .......................................................................................39
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4.3.4. 1.8V SIM Card Pads ......................................................................................40
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ...........................................40
4.3.6. SD Card Pads @ 2.95V .................................................................................41
4.3.7. SIM Card Pads @2.95V.................................................................................41
5. HARDWARE COMMANDS ........................................................................... 42
Turning on the LE910Cx Module ...................................................................42
Initialization and Activation State ...................................................................43
Turning off the LE910Cx Module ...................................................................45
5.3.1. Shutdown by Software Command ..................................................................46
5.3.2. Hardware Shutdown ......................................................................................47
5.3.3. Unconditional Hardware Shutdown ................................................................48
Powering OFF the Module .............................................................................49
6. POWER SUPPLY .......................................................................................... 50
Power Supply Requirements ..........................................................................50
Power Consumption ......................................................................................51
General Design Rules ....................................................................................53
6.3.1. Electrical Design Guidelines ..........................................................................53
6.3.1.1. + 5V Input Source Power Supply – Design Guidelines ...................................53
6.3.1.2. + 12V Input Source Power Supply – Design Guidelines .................................54
6.3.1.3. Battery Source Power Supply – Design Guidelines ........................................55
6.3.2. Thermal Design Guidelines ............................................................................55
6.3.3. Power Supply PCB Layout Guidelines ...........................................................56
7. ANTENNA(S) ................................ ................................................................ 58
GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ...............................58
GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................59
GSM/WCDMA/LTE Antenna – Installation Guidelines....................................60
Antenna Diversity Requirements ....................................................................60
GNSS Antenna Requirements .......................................................................61
7.5.1. Combined GNSS Antenna .............................................................................61
7.5.2. Linear and Patch GNSS Antenna ..................................................................61
7.5.3. Front End Design Considerations ..................................................................62
7.5.4. GNSS Antenna – PCB Line Guidelines ..........................................................62
7.5.5. GNSS Antenna – Installation Guidelines ........................................................63
8. HARDWARE INTERFACES .......................................................................... 64
USB Port........................................................................................................65
HSIC Interface (Optional) ...............................................................................66
SGMII Interface..............................................................................................66
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8.3.1. Ethernet Control interface ..............................................................................66
Serial Ports ....................................................................................................68
8.4.1. Modem Serial Port 1 Signals..........................................................................68
8.4.2. Modem Serial Port 2 ......................................................................................71
8.4.3. RS232 Level Translation ................................................................................71
Peripheral Ports .............................................................................................73
8.5.1. SPI – Serial Peripheral Interface ....................................................................73
8.5.2. I2C - Inter-integrated Circuit ...........................................................................74
8.5.3. SD/MMC Card Interface .................................................................................75
8.5.4. WiFi SDIO Interface .......................................................................................77
Audio Interface ..............................................................................................78
8.6.1. Digital Audio ..................................................................................................78
8.6.1.1. Short Frame Timing Diagrams .......................................................................79
8.6.1.2. Long Frame Timing Diagrams ........................................................................80
General Purpose I/O ......................................................................................82
8.7.1. Using a GPIO Pad as Input ............................................................................84
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ......................................84
8.7.3. Using a GPIO Pad as Output .........................................................................85
9. MISCELLANEOUS FUNCTIONS .................................................................. 86
Indication of Network Service Availability .......................................................86
Indication of Software Ready .........................................................................87
RTC – Real Time Clock .................................................................................87
VAUX Power Output ......................................................................................87
ADC Converter ..............................................................................................88
9.5.1. Description .....................................................................................................88
9.5.2. Using the ADC Converter ..............................................................................88
Using the Temperature Monitor Function .......................................................88
GNSS Characteristics ....................................................................................89
10. MOUNTING THE MODULE ON YOUR BOARD ........................................... 90
General ..........................................................................................................90
Finishing & Dimensions .................................................................................90
Recommended Footprint for the Application ..................................................93
Stencil ............................................................................................................94
PCB Pad Design ............................................................................................94
Recommendations for PCB Pad Dimensions (mm) ........................................95
Solder Paste ..................................................................................................95
10.7.1. Solder Reflow ................................................................ ................................96
10.7.2. Cleaning ........................................................................................................98
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11. APPLICATION GUIDE .................................................................................. 99
Debug of the LE910Cx Module in Production ................................................99
Bypass Capacitor on Power Supplies .......................................................... 100
SIM Interface ............................................................................................... 101
11.3.1. SIM Schematic Example .............................................................................. 101
EMC Recommendations .............................................................................. 102
Download and Debug Port ........................................................................... 102
11.5.1. Fast Boot mode ........................................................................................... 103
11.5.2. Recovery Boot Mode ................................ ................................................... 103
12. PACKING SYSTEM .................................................................................... 104
Packing System – Tray ................................................................................ 104
Tape & Reel ................................................................................................. 106
Moisture Sensitivity ...................................................................................... 108
13. SAFETY RECOMMENDATIONS................................................................. 109
14. CONFORMITY ASSESSMENT ISSUES ..................................................... 110
FCC/ISED Regulatory Notices ..................................................................... 110
15. ACRONYMS ................................................................................................ 114
16. DOCUMENT HISTORY ............................................................................... 117
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1. Introduction
Scope
This document introduces the Telit LE910Cx module and presents possible and
recommended hardware solutions for developing a product based on the LE910Cx
module. All the features and solutions detailed in this document are applicable to all
LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
NOTE:
LE910Cx refers to all modules listed in the Applicability Table.
This document takes into account all the basic functions of a wireless module; suggests a
valid hardware solution for each function and points out incorrect solutions and common
errors to be avoided.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Obviously, avoiding invalid solutions must be considered mandatory.
Where the suggested hardware configurations need not be considered mandatory, the
information given should be used as a guide and a starting point for properly developing
your product with the Telit LE910Cx module.
NOTE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx
cellular module within a user application must be done according to the
design rules described in this manual.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LE910Cx module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors, contact Telit Technical Support at:
• TS-EMEA@telit.com
• TS-AMERICAS@telit.com
• TS-APAC@telit.com
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Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
Text Conventions
The following conventions are used to emphasize specific types of information:
DANGER:
Danger – This information MUST be followed, or catastrophic equipment
failure or bodily injury may occur.
WARNING:
Caution or Warning – Alerts the user to important points about integrating the
module, if these points are not followed, the module and end user equipment
may fail or malfunction.
NOTE:
Tip or Information – Provides advice and suggestions that may be useful
when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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Related Documents
Table 2: Related Documents
Document Title
Document Number
Ref 1: LE920x4/LE910Cx AT Command User Guide
80490ST10778A
Ref 2: Telit EVB HW User Guide
1VV0301249
Ref 3: LE910Cx Interface Board HW User Guide
1VV0301323
Ref 4: LE910/LE920 Digital Voice Interface Application
Note
80000NT11246A
Ref 5: Telit_LE920A4_LE910Cx_WiFi_Interface_Application_Note_r1
80490NT11511A
Ref 6: Antenna Detection Application Note
80000NT10002A
Ref 7: High-Speed Inter-Chip USB Electrical Specification,
version 1.0
(a supplement to the USB 2.0 specification, Section 3.8.2)
Ref 8: ETH_Expansion_board_Application Note
80490NT11622A
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2. Product Description
Overview
LE910Cx is Telit’s new LTE series for IoT applications.
In its most basic use case, LE910Cx can be applied as a wireless communication front-
end for telematics products, offering GNSS and mobile communication features to an
external host CPU through its rich interfaces.
LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For
differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per
Regional Variant.
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents
or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied
in Telit products. This document is subject to change without notice.
NOTE:
(EN) The integration of the LE910Cx cellular module within user application
shall be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare LE910Cx all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo
manuale.
(DE) Die Integration des LE910Cx Mobilfunk-Moduls in ein Gerät muß gemäß
der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija LE910Cx modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo LE910Cx debe ser conforme a los usos para
los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire LE910Cx dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
(HE)
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Applications
LE910Cx can be used for telematics applications where tamper-resistance, confidentiality,
integrity, and authenticity of end-user information are required, for example:
• Emergency call
• Telematics services
• Road pricing
• Pay-as-you-drive insurance
• Stolen vehicles tracking
• Internet connectivity
General Functionality and Main Features
The LE910Cx series of cellular modules features an LTE and multi-RAT modem together
with a powerful on-chip application processor and a rich set of interfaces.
The major functions and features are listed below:
Table 3: Features Table
Function
Features
Modem
• Multi-RAT cellular modem for voice and data communication
o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).
o Carrier aggregation is not supported
o GSM/GPRS/EDGE
o WCDMA up to DC HSPA+, Rel.9
• Support for SIM profile switching
• Regional variants with optimal choice of RF bands for
worldwide coverage of countries and MNOs
• State-of-the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver
Digital audio
subsystem
• PCM/I2S digital audio interface
• Up to 48 kHz sample rate, 16-bit words
Two USIM ports
– dual voltage
• Class B and Class C support
• Hot swap support
• Clock rates up to 5 MHz
Application
processor
Application processor to run customer application code
• 32-bit ARM Cortex-A7 up to 1.3 GHz running the Linux
operating system
• Flash + DDR are large enough to allow for customer’s own
software applications
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Function
Features
Interfaces
Rich set of interfaces, including:
• SD/MMC Card Interface supporting SD3.0 standard
• SDIO for external WiFi transceiver supporting SDIO3.0
standard
• SGMII for external Ethernet transceiver
o Compliant with IEEE802.3
o Full duplex operation at 1 Gbps
o Half/full duplex operation at 10/100 Mbps
o Support for VLAN tagging
o Support for IEEE1588, PTP (Precision Time Protocol)
• USB2.0 – USB port is typically used for:
o Flashing of firmware and module configuration
o Production testing
o Accessing the Application Processor’s file system
o AT command access
o High-speed WWAN access to external host
o Diagnostic monitoring and debugging
o NMEA data to an external host CPU
• HSIC (Optional)
o High-speed 480 Mbps (240 MHz DDR) USB transfers are
100% host driver compatible with traditional USB cable
connected topologies
o Bidirectional data strobe signal (STROBE)
o Bidirectional data signal (DATA)
o No power consumption unless a transfer is in progress
o Maximum trace length 10 cm
o Signals driven at 1.2V standard LVCMOS levels
• Peripheral Ports – SPI, I2C, UART
• GPIOs
• Antenna ports
Form factor
Form factor (28x28mm), accommodating the multiple RF bands in
each region variant
Environment
and quality
requirements
The entire module is designed and qualified by Telit for satisfying the
environment and quality requirements.
Single supply
module
The module generates all its internal supply voltages.
RTC
No dedicated RTC supply, RTC is supplied by VBATT
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Function
Features
Operating
temperature
Range -40 °C to +85 °C (conditions as defined in Section 2.5.1,
Temperature Range).
NOTE:
The following interfaces are unique for the LE910Cx and may not be
supported on other (former or future) xE910 family. Special care must be
taken when designing the application board if future compatibility is required:
- SGMII for Ethernet connectivity
- SDIO for WIFI connectivity
- SD/MMC for SD Card connectivity
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Block Diagram
Figure 1 shows an overview of the internal architecture of the LE910Cx module.
It includes the following sub-functions:
• Application processor, Modem subsystem and Location processing with their
external interfaces. These three functions are contained in a single SOC.
• RF front end and antenna ports.
• Digital Audio interface for external codec.
• Rich IO interfaces. Depending on which LE910Cx software features are enabled,
some of its interfaces that are exported due to multiplexing may be used internally
and thus may not be usable by the application.
• PMIC with the RTC function inside
Figure 1: LE910Cx Block Diagram
MEMORIES
RF
FRONTEND
GNSS Antennna
GPIO
Cellular antenna 1
Cellular antenna 2
PCM In/out
SIM
GNSS_Sync
APPLICATION
PROCESSOR
MODEM
LOCATION
HSICI2C USB2.0SGMIISPI
UART
JTAG
2xSDIO
PMIC
VBATT
ADC
VBATT_PA
RTC
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Environmental Requirements
2.5.1. Temperature Range
Operating
temperature
range
-40 ~ +85°C Ambient.
Temperatures outside of the range –20°C ÷ +55°C might slightly
deviate from ETSI specifications. The module is fully functional,
able to make and receive voice calls, data calls, SMS and GPRS
traffic.
Storage and nonoperating
temperature
range
–40°C ~ +90°C
2.5.2. RoHS Compliance
As a part of the Telit corporate policy of environmental protection, the LE910Cx complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union
(EU directive 2011/65/EU).
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Operating Frequency Bands
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes conform to the 3GPP specifications.
2.6.1. RF Bands per Regional Variant
Table 4 summarizes all region variants within the LE910Cx family, showing the supported
band sets in each variant and the supported band pairs for 2x carrier aggregation.
Table 4: RF Bands per Regional Variant
Region
Variant
2G
HSPA+
LTE FDD
LTE TDD
TD-SCDMA
LE910C1-NA
2, 3, 5, 8
1, 2, 4, 5, 8
2, 4, 12
-
-
LE910C1-NS
- - 2, 4, 5, 12, 25, 26
-
-
LE910C1-AP
-
1, 5, 6, 8, 19
1, 3, 5, 8, 9, 19, 28
-
-
LE910C4-EU
3, 8
1, 3, 8
1, 3, 7, 8, 20, 28A
-
-
LE910C1-EU
3, 8
1, 3, 8
1, 3, 7, 8, 20, 28A
-
-
LE910C4-NF
-
2, 4, 5
2, 4, 5, 12, 13, 14,
66, 71
- - LE910C1-NF
-
2, 4, 5
2, 4, 5, 12, 13, 14,
66, 71
-
-
LE910C1-SA
- - 2, 4, 12, 14, 66
-
-
LE910C1-ST
- - 2, 4, 12, 66, 71
- - LE910C1-SV
- - 4, 13
-
-
LE910C1-LA
2, 3, 5, 8
1, 2, 4, 5
1, 2, 3, 4, 5, 7, 28
-
-
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2.6.2. Reference Table of RF Bands Characteristics
Table 5: RF Bands Characteristics
Mode
Freq. Tx (MHz)
Freq. Rx (MHz)
Channels
Tx-Rx
Offset
PCS 1900
1850.2 ~ 1909.8
1930.2 ~ 1989.8
512 ~ 810
80 MHz
DCS 1800
1710 ~ 1785
1805 ~ 1880
512 ~ 885
95 MHz
GSM 850
824.2 ~ 848.8
869.2 ~ 893.8
128 ~ 251
45 MHz
EGSM 900
890 ~ 915
935 ~ 960
0 ~ 124
45 MHz
880 ~ 890
925 ~ 935
975 ~ 1023
45 MHz
WCDMA 2100 – B1
1920 ~ 1980
2110 ~ 2170
Tx: 9612 ~ 9888
Rx: 10562 ~ 10838
190 MHz
WCDMA 1900 – B2
1850 ~ 1910
1930 ~ 1990
Tx: 9262 ~ 9538
Rx: 9662 ~ 9938
80 MHz
WCDMA 1800 – B3
1710 ~ 1785
1805 ~ 1880
Tx: 937 ~ 1288
Rx: 1162 ~ 1513
95 MHz
WCDMA AWS – B4
1710 ~ 1755
2110 ~ 2155
Tx: 1312 ~ 1513
Rx: 1537 ~ 1738
400 MHz
WCDMA 850 – B5
824 ~ 849
869 ~ 894
Tx: 4132 ~ 4233
Rx: 4357 ~ 4458
45 MHz
WCDMA 900 – B8
880 ~ 915
925 ~ 960
Tx: 2712 ~ 2863
Rx: 2937 ~ 3088
45 MHz
WCDMA 1800 – B9
1750 ~ 1784.8
1845 ~ 1879.8
Tx: 8762 ~ 8912
Rx: 9237 ~ 9387
95 MHz
WCDMA 800 – B19
830 ~ 845
875 ~ 890
Tx: 312 ~ 363
Rx: 712 ~ 763
45 MHz
TDS CDMA 2000 – B34
2010 ~ 2025
2010 ~ 2025
Tx: 10054 ~ 10121
Rx: 10054 ~ 10121
0 MHz
TDS CDMA 1900 – B39
1880 ~ 1920
1880 ~ 1920
Tx: 9404 ~ 9596
Rx: 9404 ~ 9596
0 MHz
LTE 2100 – B1
1920 ~ 1980
2110 ~ 2170
Tx: 18000 ~ 18599
Rx: 0 ~ 599
190 MHz
LE910Cx HW User Guide
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Rev. 2.0 Page 20 of 121 2018-12-12
Mode
Freq. Tx (MHz)
Freq. Rx (MHz)
Channels
Tx-Rx
Offset
LTE 1900 – B2
1850 ~ 1910
1930 ~ 1990
Tx: 18600 ~ 19199
Rx: 600 ~ 1199
80 MHz
LTE 1800 – B3
1710 ~ 1785
1805 ~ 1880
Tx: 19200 ~ 19949
Rx: 1200 ~ 1949
95 MHz
LTE AWS – B4
1710 ~ 1755
2110 ~ 2155
Tx: 19950 ~ 20399
Rx: 1950 ~ 2399
400 MHz
LTE 850 – B5
824 ~ 849
869 ~ 894
Tx: 20400 ~ 20649
Rx: 2400 ~ 2649
45 MHz
LTE 2600 – B7
2500 ~ 2570
2620 ~ 2690
Tx: 20750 ~ 21449
Rx: 2750 ~ 3449
120 MHz
LTE 900 – B8
880 ~ 915
925 ~ 960
Tx: 21450 ~ 21799
Rx: 3450 ~ 3799
45 MHz
LTE 1800 – B9
1749.9 ~ 1784.9
1844.9 ~ 1879.9
Tx: 21800 ~ 2149
Rx: 3800 ~ 4149
95 MHz
LTE AWS+ – B10
1710 ~ 1770
2110 ~ 2170
Tx: 22150 ~ 22749
Rx: 4150 ~ 4749
400 MHz
LTE 700a – B12
699 ~ 716
729 ~ 746
Tx: 23010 ~ 23179
Rx: 5010 ~ 5179
30 MHz
LTE 700c – B13
777 ~ 787
746 ~ 756
Tx: 23180 ~ 23279
Rx: 5180 ~ 5279
-31 MHz
LTE 700PS – B14
788 ~ 798
758 ~ 768
Tx: 23280 ~ 23379
Rx: 5280 ~ 5379
-30 MHz
LTE 700b – B17
704 ~ 716
734 ~ 746
Tx: 23730 ~ 23849
Rx: 5730 ~ 5849
30 MHz
LTE 800 – B19
830 ~ 845
875 ~ 890
Tx: 24000 ~ 24149
Rx: 6000 ~ 6149
45 MHz
LTE 800 – B20
832 ~ 862
791 ~ 821
Tx: 24150 ~ 24449
Rx: 6150 ~ 6449
-41 MHz
LTE 1500 – B21
1447.9 ~ 1462.9
1495.9 ~ 1510.9
Tx: 24450 ~ 24599
Rx: 6450 ~ 6599
48 MHz
LE910Cx HW User Guide
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Rev. 2.0 Page 21 of 121 2018-12-12
Mode
Freq. Tx (MHz)
Freq. Rx (MHz)
Channels
Tx-Rx
Offset
LTE 1900+ – B25
1930 ~ 1995
1850 ~ 1915
Tx: 26040 ~ 26689
Rx: 8040 ~ 8689
80 MHz
LTE 850+ – B26
814 ~ 849
859 ~ 894
Tx: 26690 ~ 27039
Rx: 8690 ~ 9039
45 MHz
LTE 700 – B28A
703 ~ 733
758 ~ 788
Tx: 27210 ~ 27510
Rx: 9210 ~ 9510
55 MHz
LTE 700 – B28
703 ~ 748
758 ~ 803
Tx: 27210 ~ 27659
Rx: 9210 ~ 9659
55 MHz
LTE AWS-3 – B66
1710 ~ 1780
2210 ~ 2200
Tx: 131972-132671
Rx: 66436-67335
400 MHz
LTE600 – B71
663 ~ 698
617 ~ 652
Tx: 133122-133471
Rx: 68568-68935
46 MHz
LTE TDD 2600 – B38
2570 ~ 2620
2570 ~ 2620
Tx: 37750 ~ 38250
Rx: 37750 ~ 38250
0 MHz
LTE TDD 1900 – B39
1880 ~ 1920
1880 ~ 1920
Tx: 38250 ~ 38650
Rx: 38250 ~ 38650
0 MHz
LTE TDD 2300 – B40
2300 ~ 2400
2300 ~ 2400
Tx: 38650 ~ 39650
Rx: 38650 ~ 39650
0 MHz
LTE TDD 2500 – B41M
2555 ~ 2655
2555 ~ 2655
Tx: 40265 ~ 41215
Rx: 40265 ~ 41215
0 MHz
LE910Cx HW User Guide
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Rev. 2.0 Page 22 of 121 2018-12-12
RF Parameters
2.7.1. Sensitivity
Typical sensitivity levels are as follows:
• -108 dBm @ 2G
• -113.5 dBm @ 3G
• -103 dBm @ 4G FDD (BW=5 MHz)
2.7.2. Output power
Typical values for Max output level are as follow:
• 2G:
- LB: 33dBm
- HB: 30dBm
• 3G/TD-SCDMA: 24dBm
• 4G (FDD & TDD): 23dBm @1RB.
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Rev. 2.0 Page 23 of 121 2018-12-12
Mechanical Specifications
2.8.1. Dimensions
The module’s overall dimensions are:
• Length: 28.2 mm, +/- 0.15 mm tolerance
• Width: 28.2 mm, +/- 0.15 mm tolerance
• Thickness: 2.2 mm, +/- 0.15 mm tolerance
NOTE:
Consider a typical label thickness of 0.1 mm in addition to the module
thickness.
2.8.2. Weight
The nominal weight of the LE910Cx module is 9.0 gram.
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Rev. 2.0 Page 24 of 121 2018-12-12
3. Module Connections
Pin-out
Table 6: Pin-out
PAD
Signal
I/O
Function
Type
Comment
USB HS 2.0 Communication Port
B15
USB_D+
I/O
USB differential Data (+)
C15
USB_D-
I/O
USB differential Data (-)
A13
USB_VBUS
AI
Power sense for the internal
USB transceiver
Power
A14
USB_ID
AI
USB ID
See note
below
Asynchronous UART
N15
C103/TXD
I
Serial data input (TXD) from
DTE
1.8V
M15
C104/RXD
O
Serial data output to DTE
1.8V
L14
C105/RTS
I
Input for Request to send
signal (RTS) from DTE
1.8V
P15
C106/CTS
O
Output for Clear to send signal
(CTS) to DTE
1.8V
P14
C107/DSR
O
Output for Data Set Ready
(DSR) to DTE
1.8V
Alternate Fn
GPIO_32
M14
C108/DTR
I
Input for Data Terminal Ready
(DTR) from DTE
1.8V
Alternate Fn
GPIO_34
N14
C109/DCD
O
Output for Data Carrier Detect
(DCD) to DTE
1.8V
Alternate Fn
GPIO_33
R14
C125/RING
O
Output for Ring Indication (RI)
to DTE
1.8V
Alternate Fn
GPIO_31
SPI – Serial Peripheral Interface / AUX UART
F15
SPI_CLK
O
SPI Clock output
1.8V
E15
SPI_MISO/ RX_AUX
I
SPI data Master Input Slave
output / RX_AUX
1.8V
D15
SPI_MOSI/TX_AUX
O
SPI data Master Output Slave
input/ TX_AUX
1.8V
H14
SPI_CS/GPIO11
O
SPI Chip select output /
GPIO11
1.8V
See note
below
LE910Cx HW User Guide
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Rev. 2.0 Page 25 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
SD/MMC Card Digital I/O
J12
SD/MMC_CMD
O
SD Command
1.8/2.95V
F12
SD/MMC_CLK
O
SD Card Clock
1.8/2.95V
E12
SD/MMC_DATA0
I/O
SD Serial Data 0
1.8/2.95V
G12
SD/MMC_DATA1
I/O
SD Serial Data 1
1.8/2.95V
K12
SD/MMC_DATA2
I/O
SD Serial Data 2
1.8/2.95V
H12
SD/MMC_DATA3
I/O
SD Serial Data 3
1.8/2.95V
G13
SD/MMC_CD
I
SD card detect input
1.8V
Active Low
F13
VMMC
-
Power supply for MMC card
pull-up resistors
1.8/2.95V
WiFi (SDIO) Interface
N13
WiFi_SD_CMD
O
Wi-Fi SD Command
1.8V
L13
WiFi_SD_CLK
O
Wi-Fi SD Clock
1.8V
J13
WiFi_SD_DATA0
I/O
Wi-Fi SD Serial Data 0
1.8V
M13
WiFi_SD_DATA1
I/O
Wi-Fi SD Serial Data 1
1.8V
K13
WiFi_SD_DATA2
I/O
Wi-Fi SD Serial Data 2
1.8V
H13
WiFi_SD_DATA3
I/O
Wi-Fi SD Serial Data 3
1.8V
L12
WiFi_SDRST
O
Wi-Fi Reset / Power enable
control
1.8V
Active Low
M11
WLAN_SLEEP_CLK
O
Wi-Fi Sleep clock output
1.8V
M10
RFCLK2_QCA
O
Wi-Fi low noise RF clock
output
1.8V
LTE-WiFi Coexistence
M8
WCI_TX
O
Wireless coexistence interface
TXD
1.8V
M9
WCI_RX
I
Wireless coexistence interface
RXD
1.8V
SIM Card Interface 1
A6
SIMCLK1
O
External SIM 1 signal – Clock
1.8/2.85V
A7
SIMRST1
O
External SIM 1 signal – Reset
1.8/2.85V
LE910Cx HW User Guide
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Rev. 2.0 Page 26 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
A5
SIMIO1
I/O
External SIM 1 signal - Data
I/O
1.8/2.85V
Internally PU
10 kΩ to
SIMVCC1
A4
SIMIN1
I
External SIM 1 signal Presence
1.8V
Active low
A3
SIMVCC1
-
External SIM 1 signal – Power
supply for SIM 1
1.8/2.85V
SIM Card Interface 2
C1
SIMCLK2
O
External SIM 2 signal – Clock
1.8/2.85V
D1
SIMRST2
O
External SIM 2 signal – Reset
1.8/2.85V
C2
SIMIO2
I/O
External SIM 2 signal – Data
I/O
1.8/2.85V
Internally PU
10kΩ to
SIMVCC2
G4
SIMIN2
I
External SIM 2 signal –
Presence
1.8V
Active low
D2
SIMVCC2
-
External SIM 2 signal – Power
supply for SIM 2
1.8/2.85V
Digital Voice Interface (DVI)
B9
DVI_WAO
O
Digital Voice interface (WAO
master output)
1.8V
B6
DVI_RX
I
Digital Voice interface (Rx)
1.8V
B7
DVI_TX
O
Digital Voice interface (Tx)
1.8V
B8
DVI_CLK
O
Digital Voice interface (CLK
master output)
1.8V
B12
REF_CLK
O
Reference clock for external
Codec
1.8V
See Note
below
General Purpose Digital I/O
C8
GPIO_01
I/O
GPIO_01 / STAT_LED
1.8V
Alternate Fn
I2C
C9
GPIO_02
I/O
GPIO_02
1.8V
Alternate Fn
I2C
C10
GPIO_03
I/O
GPIO_03
1.8V
Alternate Fn
I2C
C11
GPIO_04
I/O
GPIO_04
1.8V
Alternate Fn
I2C
LE910Cx HW User Guide
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Rev. 2.0 Page 27 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
B14
GPIO_05
I/O
GPIO_05
1.8V
Alternate Fn
I2C
C12
GPIO_06
I/O
GPIO_06
1.8V
Alternate Fn
I2C
C13
GPIO_07
I/O
GPIO_07
1.8V
Alternate Fn
I2C
K15
GPIO_08
I/O
GPIO_08 / SW_RDY
1.8V
Alternate Fn
I2C
L15
GPIO_09
I/O
GPIO_09
1.8V
Alternate Fn
I2C
G15
GPIO_10
I/O
GPIO_10
1.8V
Alternate Fn
I2C
RF Section
K1
Antenna
I/O
GSM/EDGE/UMTS/LTE Main
antenna (50 Ohm)
RF F1
ANT_DIV
I
UMTS/LTE antenna diversity
input (50 Ohm)
RF
GPS Section
R9
ANT_GPS
I
GPS antenna (50 Ohm)
RF
R7
GPS_LNA_EN
O
Enables the external regulator
for GPS LNA
1.8V
N9
GPS_SYNC
O
GPS sync signal for Dead
Reckoning
1.8V
Miscellaneous Functions
R12
ON_OFF_N
I
Power ON / Power OFF input
Active low
R13
HW_SHUTDOWN_N
I
Unconditional Shutdown input
Active low
R11
VAUX/PWRMON
O
Supply output for external
accessories /
Power ON monitor
1.8V
B1
ADC_IN1
AI
Analog/Digital Converter Input
1
Analog
H4
ADC_IN2
AI
Analog/Digital Converter Input
2
Analog
D7
ADC_IN3
AI
Analog/Digital Converter Input
3
Analog
LE910Cx HW User Guide
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Rev. 2.0 Page 28 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
SGMII Interface
E4
SGMII_RX_P
AI
SGMII receive – plus
PHY
F4
SGMII_RX_M
AI
SGMII receive – minus
PHY
D5
SGMII_TX_P
AO
SGMII transmit – plus
PHY
D6
SGMII_TX_M
AO
SGMII transmit - minus
PHY
HSIC Interface
A12
HSIC_DATA
I/O
High-speed inter-chip interface
- data
1.2V
Optional
A11
HSIC_STB
I/O
High-speed inter-chip interface
- strobe
1.2V
Optional
I2C Interface
B11
I2C_SCL
I/O
I2C clock
1.8V
Internally PU
2.2kΩ to 1.8V
B10
I2C_SDA
I/O
I2C Data
1.8V
Internally PU
2.2kΩ to 1.8V
Power Supply
M1
VBATT
-
Main Power Supply (Digital
Section)
Power
M2
VBATT
-
Main Power Supply (Digital
Section)
Power
N1
VBATT_PA
-
Main Power Supply (RF
Section)
Power
N2
VBATT_PA
-
Main Power Supply (RF
Section)
Power
P1
VBATT_PA
-
Main Power Supply (RF
Section)
Power
P2
VBATT_PA
-
Main Power Supply (RF
Section)
Power
A2
GND
-
Ground
B13
GND
Ground
D4
GND
-
Ground
E1
GND
-
Ground
E2
GND
-
Ground
LE910Cx HW User Guide
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Rev. 2.0 Page 29 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
E14
GND
-
Ground
F2
GND
-
Ground
G1
GND
-
Ground
G2
GND
-
Ground
G7
GND
-
Ground
G8
GND
-
Ground
G9
GND
-
Ground
H1
GND
-
Ground
H2
GND
-
Ground
H7
GND
-
Ground
H8
GND
-
Ground
H9
GND
-
Ground
J1
GND
-
Ground
J2
GND
-
Ground
J7
GND
-
Ground
J8
GND
-
Ground
J9
GND
-
Ground
K2
GND
-
Ground
L1
GND
-
Ground
L2
GND
-
Ground
M3
GND
-
Ground
M4
GND
-
Ground
M12
GND
-
Ground
N3
GND
-
Ground
N4
GND
-
Ground
N5
GND
-
Ground
N6
GND
-
Ground
P3
GND
-
Ground
LE910Cx HW User Guide
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Rev. 2.0 Page 30 of 121 2018-12-12
PAD
Signal
I/O
Function
Type
Comment
P4
GND
-
Ground
P5
GND
-
Ground
P6
GND
-
Ground
P8
GND
-
Ground
P9
GND
-
Ground
P10
GND
-
Ground
P13
GND
-
Ground
R2
GND
-
Ground
R3
GND
-
Ground
R5
GND
-
Ground
R6
GND
-
Ground
R8
GND
-
Ground
R10
GND
-
Ground
Reserved
A8
Reserved
-
Reserved
A9
Reserved
-
Reserved
A10
Reserved
-
Reserved
B2
Reserved
-
Reserved
B3
Reserved
-
Reserved
B4
Reserved
-
Reserved
B5
Reserved
-
Reserved
C3
Reserved
-
Reserved
C4
Reserved
-
Reserved
C5
Reserved
-
Reserved
C6
Reserved
-
Reserved
C7
Reserved
-
Reserved
C14
Reserved
-
Reserved
D3
Reserved
-
Reserved
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