Telit Communications S p A HE910 User Manual

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HE910 Hardware User Guide

1vv03700925 Rev.9 07-02-2012

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PRODUCT

HE910

HE910-GA

HE910-D

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Applicability Table

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

DISCLAIMER

The information contained in this document is the proprietary information of Telit Communication any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this application note.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Contents

1 INTRODUCTION ......................................................................................................................................................... 6

1.1 SCOPE ................................................................................................................................................................................ 6

1.2 AUDIENCE ........................................................................................................................................................................... 6

1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 6

1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 7

1.5 TEXT CONVENTIONS .............................................................................................................................................................. 8

1.6 RELATED DOCUMENTS ........................................................................................................................................................... 8

1.7 DOCUMENT HISTORY ............................................................................................................................................................ 9

2 OVERVIEW .............................................................................................................................................................. 10

3 HE910 MODULE CONNECTIONS ............................................................................................................................... 11

3.1 PIN-OUT ......................................................................................................................................................................... 11

3.1.1 LGA Pads Layout (HE910 and HE910-GA) .............................................................................................................. 17

3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 18

4 HARDWARE COMMANDS ........................................................................................................................................ 19

4.1 TURNING ON THE HE910 ................................................................................................................................................... 19

4.2 TURNING OFF THE HE910 .................................................................................................................................................. 24

4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 27

5 POWER SUPPLY ....................................................................................................................................................... 30

5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 30

5.2 POWER CONSUMPTION ....................................................................................................................................................... 31

5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 32

5.3.1 Electrical Design Guidelines ................................................................................................................................... 32

5.3.2 Thermal Design Guidelines ..................................................................................................................................... 36

5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 37

6 GSM/WCDMA ANTENNA......................................................................................................................................... 38

6.1 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 38

6.2 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 40

6.3 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 41

6.4 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 42

6.5 GPS ANTENNA REQUIREMENTS (HE910 AND HE910-GA) ....................................................................................................... 43

6.5.1 Combined GPS Antenna ......................................................................................................................................... 43

6.5.2 Linear and Patch GPS Antenna ............................................................................................................................... 43

6.5.3 LNA and Front End Design Considerations ............................................................................................................. 43

6.5.4 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 44

6.5.5 GPS Antenna - Installation Guidelines .................................................................................................................... 45

7 LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 46

7.1 RESET SIGNAL .................................................................................................................................................................... 47

8 USB PORT ................................................................................................................................................................ 48

8.1 USB 2.0 HS ...................................................................................................................................................................... 48

9 SPI PORT ................................................................................................................................................................. 49

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HE910 Hardware User Guide

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9.1 SPI CONNECTIONS .............................................................................................................................................................. 50

10 SERIAL PORTS .......................................................................................................................................................... 51

10.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 52

10.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 54

10.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 55

11 AUDIO SECTION OVERVIEW .................................................................................................................................... 57

11.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 57

11.1.1 CODEC Examples .................................................................................................................................................. 57

12 GENERAL PURPOSE I/O ........................................................................................................................................... 58

12.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 59

12.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 60

12.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 60

12.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 61

12.5 RTC BYPASS OUT ............................................................................................................................................................. 62

12.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 62

12.7 VAUX POWER OUTPUT ..................................................................................................................................................... 62

13 MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 63

13.1 GENERAL ........................................................................................................................................................................ 63

13.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 63

13.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 64

13.4 STENCIL .......................................................................................................................................................................... 65

13.5 PCB PAD DESIGN .............................................................................................................................................................. 65

13.6 RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM): .......................................................................................................... 66

13.7 SOLDER PASTE .................................................................................................................................................................. 68

13.7.1 HE910 Solder reflow ............................................................................................................................................. 68

14 PACKING SYSTEM .................................................................................................................................................... 70

14.1 MOISTURE SENSITIVITY ...................................................................................................................................................... 72

15 SAFETY RECOMMANDATIONS ................................................................................................................................. 73

16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 75

16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 75

16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 79

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1 Introduction

1.1 Scope

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module.

1.2 Audience

This document is intended for Telit customers, who are integrators, about to implement their applications using our HE910 modules.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

1.3 Contact Information, Support

For general contact, technical support, to report documentation errors and to order

Center (TTSC) at:

TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact

ical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.

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1.4 Document Organization

This document contains the following chapters:

provides a scope for this document, target audience, contact

and support information, and text conventions.

provides an overview of the document.

Chapter3 HE910 Module Connections

Chapter 4 How to operate on the module via hardware.

Chapter 5 Power supply requirements and general design rules.

Chapter 6 The antenna connection and board layout design are the most important parts in the full product design.

Chapter 7 Specific values adopted in the implementation of logic levels for this module.

Chapter 8 The USB port on the Telit HE910 is the core of the interface between the module and OEM hardware

PI port Refers to the SPI port of the Telit HE910

Chapter 10 Refers to the serial ports of the Telit HE910

Chapter 11 Refers to the audio blocks of the Base Band Chip of the HE910 Telit Modules.

Chapter 12 How the general purpose I/O pads can be configured.

Chapter 13 HE910 Mechanical dimensions and recomm

Chapter 14 Conformity Assessment Issues Information related to the Conformity Assessments.

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1.5 Text Conventions

Danger This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

1.6 Related Documents

HE910 Digital Voice Interface Application Note 80000NT10050A HE910 SPI Port Application Note 80000NT10053A HE910 Product description 80378ST10085a SIM Holder Design Guides 80000NT10001a AT Commands Reference Guide 80378ST10091A Telit EVK2 User Guide 1vv0300704

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RReevviissiioonn

DDaattee

CChhaannggeess

ISSUE#0

2011-03-31

Preliminary Version

ISSUE#1

2011-05-19

Updated pinout on UART1

ISSUE#2

2011-05-25

Update chapter 13

ISSUE#3

2011-07-25

Added DVI app note references; chapter 4.1

ISSUE#4

2011-07-29

Updated audio, on_off/reset and digital sections

ISSUE#5

2011-10-18

Added STAT_LED info, Updated SPI pinout

ISSUE#6

2011-12-22

Power supply extended to 3.3 V

ISSUE#7

2012-01-16

Added HE910-GA and D; added Conformity assessment chapter

ISSUE#8

2012-02-03

Chapter 5.1 updated

ISSUE#9

2012-02-07

Chapter 4.2 updated

1.7 Document History

HE910 Hardware User Guide

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Page 10

HE910

2 Overview

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit HE910 module. For further hardware details that may not be explained in this document refer to the Telit HE910 Product Description document where all the hardware information is reported.

NOTICE: (EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall be done according to the design rules described in this manual.

(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(HE)

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

HE910 Hardware User Guide

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/WCDMA HE910

azioni progettuali descritte in questo manuale.

du module cellulaire GSM/GPRS/WCDMA HE910

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PAD

Signal

I/O

Function

Type

COMMENT

USB HS 2.0 COMMUNICATION PORT

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

VUSB

Power sense for the internal USB

transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15

C103/TXD

Serial data input from DTE

CMOS 1.8V

M15

C104/RXD

Serial data output to DTE

CMOS 1.8V

M14

C108/DTR

Input for (DTR) from DTE

CMOS 1.8V

L14

C105/RTS

Input for Request to send signal

(RTS) from DTE

CMOS 1.8V

P15

C106/CTS

Output for Clear to Send signal

(CTS) to DTE

CMOS 1.8V

N14

C109/DCD

Output for (DCD) to DTE

CMOS 1.8V

P14

C107/DSR

Output for (DSR) to DTE

CMOS 1.8V

R14

C125/RING

Output for Ring (RI) to DTE

CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

D15

TX_AUX

Auxiliary UART (TX Data to DTE)

CMOS 1.8V

E15

RX_AUX

Auxiliary UART (RX Data from

DTE)

CMOS 1.8V

D13

VDD_IO1

IO1 SUPPLY Input

This pin has to be connected

to E13

E13

VIO1_1V8

VIO1 Supply output (1.8V)

To be used only to supply

VDD_IO1

SIM card interface

SIMCLK

External SIM signal – Clock

1.8 / 3V

SIMRST

External SIM signal – Reset

1.8 / 3V

SIMIO

I/O

External SIM signal – Data I/O

1.8 / 3V

SIMIN

External SIM signal – Presence

(active low)

CMOS 1.8

SIMVCC

External SIM signal – Power

supply for the SIM

1.8 / 3V

Digital Voice Interface (DVI) (See NOTE 1)

DVI_WA0

I/O

Digital Audio Interface (WA0)

CMOS 1.8V

DVI_RX

I/O

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

I/O

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (CLK)

CMOS 1.8V

SPI

D15

SPI_MOSI

SPI MOSI

CMOS 1.8V

Shared with TX_AUX

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3 HE910 module connections

3.1 PIN-OUT

Page 12

E15

SPI_MISO

CMOS 1.8V

Shared with RX_AUX

F15

SPI_CLK

SPI Clock

CMOS 1.8V

H15

SPI_MRDY

CMOS 1.8V

J15

SPI_SRDY

CMOS 1.8V

DIGITAL IO

GPIO_01

I/O

GPIO_01 /STAT LED

CMOS 1.8V

Alternate Function STAT LED

GPIO_02

I/O

GPIO_02

CMOS 1.8V

C10

GPIO_03

I/O

GPIO_03

CMOS 1.8V

C11

GPIO_04

I/O

GPIO_04

CMOS 1.8V

B14

GPIO_05

I/O

GPIO_05

CMOS 1.8V

C12

GPIO_06

I/O

GPIO_06

CMOS 1.8V

C13

GPIO_07

I/O

GPIO_07

CMOS 1.8V

K15

GPIO_08

I/O

GPIO_08

CMOS 1.8V

L15

GPIO_09

I/O

GPIO_09

CMOS 1.8V

G15

GPIO_10

I/O

GPIO_10

CMOS 1.8V

RF SECTION

ANTENNA

I/O

GSM/EDGE/UMTS Antenna

(50 ohm)

ANT_DIV

Antenna Diversity Input

(50 ohm)

GPS SECTION (see NOTE1)

ANT_GPS

GPS Antenna (50 ohm)

GPS_LNA_EN

Output enable for External LNA

supply

CMOS 1.8V

Miscellaneous Functions

R13

RESET*

Reset input

CMOS 1.8V

Active low

R12

ON_OFF*

Input command for power ON

CMOS 1.8V

Active low

C14

VRTC

VRTC Backup capacitor

Power

backup for the embedded

RTC supply

R11

VAUX/PWRMON

Supply Output for external

accessories / Power ON Monitor

1.8V

Power Supply

VBATT

Main power supply (Baseband)

Power

VBATT

Main power supply (Baseband)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

HE910 Hardware User Guide

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Page 13

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

GND - Ground

Power

P10

GND - Ground

Power

R10

GND - Ground

Power

M12

GND - Ground

Power

B13

GND - Ground

Power

P13

GND - Ground

Power

E14

GND - Ground

Power

RESERVED

HE910 Hardware User Guide

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RESERVED

A10

RESERVED

N10

RESERVED

N11

RESERVED

P11

RESERVED

B12

RESERVED

D12

RESERVED

N12

RESERVED

P12

RESERVED

F14

RESERVED

G14

RESERVED

H14

RESERVED

J14

RESERVED

K14

RESERVED

N13

RESERVED

L13

RESERVED

J13

RESERVED

M13

RESERVED

K13

RESERVED

H13

RESERVED

G13

RESERVED

F13

RESERVED

A11

RESERVED

A12

RESERVED

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B11

RESERVED

B10

RESERVED

D14

RESERVED

A14

RESERVED

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

WARNING: Reserved pins must not be connected.

NOTE1: The Audio and GPS functions are not supported on HE910-D The following PADS have to be considered as RESERVED: B6, B7, B8, B9, R7, R9

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PAD

signal

M1,M2,N1,N2,P1,P2

VBATT & VBATT_PA

E1,G1,H1,J1,L1,A2,E2,F2,G2,H2, J2,K2,L2,R2,M3,N3,P3,R3,D4,M4, N4,P4,R4,N5,P5,R5,N6,P6,R6,P8, R8,P9,P10,R10,M12,B13,P13,E14

GND

R12

ON/OFF*

R13

RESET*

B15

USB_D+

C15

USB_D-

A13

VUSB

N15

C103/TXD

M15

C104/RXD

L14

C105/RTS

P15

C106/CTS

D15

TXD_AUX

E15

RXD_AUX

D13

VDD_IO1

E13

VIO1_1V8

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the

following pins:

RTS pin should be connected to the GND (on the module side) if flow control is not used. The above pins are also necessary to debug the application when the module is assembled on it.

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A B C D E F

G H J K L M N P R

1 RES

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND GND

GND

SIMIO

RES

RES GND

GND

SIMCLK

DVI_RX

RES GND

GND

SIMRS

DVI_TX

RES RES

RES

GPS_LN

A_EN

RES

DVI_CLK

GPIO_01 RES

GND

RES

DVI_WA

GPIO_02 RES

GND

ANT_GP

RES

GPIO_03 RES

GND

RES

GPIO_04 RES

RES

VAUX/P

WRMON

RES

GPIO_06

RES GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO1 VIO1_1V

RES

GND

RESET*

RES

GPIO_05

VRTC

RES

GND

RES

C105/RTS C108/DT

C109/DCD C107/DSR C125/RI

15 USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TXD C106/CT

3.1.1 LGA Pads Layout (HE910 and HE910-GA)

TOP VIEW

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin

in the application.

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A B C D E F

G H J K L M N P R

1 RES

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND GND

GND

SIMIO

RES

RES GND

GND

SIMCLK

RES

RES GND

GND

SIMRS

RES

RES RES

RES

GPIO_01 RES

GND

RES

GPIO_02 RES

GND

RES

GPIO_03 RES

GND

RES

GPIO_04 RES

RES

VAUX/P

WRMON

RES

GPIO_06

RES GND

RES

ON_OFF

VUSB

GND

GPIO_07

VDD_IO1 VIO1_1V

RES

GND

RESET*

RES

GPIO_05

VRTC

RES

GND

RES

C105/RTS C108/DT

C109/DCD C107/DSR C125/RI

15 USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RX

C103/TXD C106/CT

3.1.2 LGA Pads Layout (HE910-D)

TOP VIEW

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin

in the application.

Page 19

4 Hardware Commands

4.1 Turning ON the HE910

To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then released.

The maximum current that can be drained from the ON# pad is 0,1 mA. A simple circuit to do it is:

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull

up resistor may bring to latch up problems on the HE910 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: In this document all the lines that are inverted, hence have active low signals are

labelled with a name that ends with or with a bar over the name.

TIP: To check if the device has powered on, the hardware line PWRMON should be

monitored.

NOTE: It is mandatory to avoid sending data to the serial ports during the first 200ms of the

module start-up.

Page 21

Modem ON Proc.

HW unconditional

SHUTDOWN

AT init sequence.

Start AT CMD.

PWMON = ON?

AT answer in 1Sec ?

Delay 1s

DELAY= 300mSec

ON_OFF = LOW

Delay = 5 Sec

ON_OFF = HIGH

Enter AT<CR>

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

A flow chart showing the proper turn on procedure is displayed below:

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

Page 22

AT answer in

1Sec ?

Start AT CMD.

DELAY= 300mSec

Enter AT<CR>

AT init sequence.

Modem ON Proc.

HW unconditional

SHUTDOWN

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

A flow chart showing the AT command managing procedure is displayed below:

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HE910 Hardware User Guide

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For example: 1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:

Page 24

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

4.2 Turning OFF the HE910

Turning off of the device can be done in two ways:

via AT command (see HE910 Software User Guide, AT#SHDN) by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will not be reachable any more. To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 2 seconds and then released.

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Modem OFF Proc.

HW unconditional

SHUTDOWN

PWMON = ON?

Delay 15s

ON_OFF = LOW

Delay = 2 Sec

ON_OFF = HIGH

Modem ON Proc.

PWMON = ON?

The following flow chart shows the proper turnoff procedure:

HE910 Hardware User Guide

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HE910 Hardware User Guide

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TIP: To check if the device has been powered off, the hardware line PWRMON must be

monitored. The device is powered off when PWRMON goes low.

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

4.3 HE910 Unconditional Shutdown

The Unconditional Shutdown of the module could be activated using the RESET* line (pad R13).

WARNING: The hardware unconditional Shutdown must not be used during normal operation of

the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.

To unconditionally shutdown the HE910, the pad RESET* must be tied low for at least 200 milliseconds and then released.

NOTE: Do not use any pull up resistor on the RESET* line nor any totem pole digital output.

Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper functioning of the module. The line RESET* must be connected only in open collector configuration.

The RESET* is generating an unconditional shutdown of the module without an automatic restart.

TIP: The unconditional hardware shutdown must always be implemented on the boards and

should be used only as an emergency exit procedure.

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A typical circuit is the following:

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

For example:

1- Let us assume you need to drive the RESET* pad with a totem pole output of a +3/5

V microcontroller (uP_OUT2):

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

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HW unconditional

SHUTDOWN

Reset# = LOW

Delay 200ms

Reset# = HIGH

PWRMON = ON

Delay 1s

Modem ON Proc.

Disconnect PWR

supply

Modem ON Proc.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

In the following flow chart is detailed the proper restart procedure:

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POWER SUPPLY

Nominal Supply Voltage

3.8 V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.20 V÷ 4.20 V

5 Power Supply

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

5.1 Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements:

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken in order to

fulfil min/max voltage requirement.

NOTE: Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage

(regarding MIN Extended Operating Voltage) MUST never be exceeded;

ely assumption

and application of the HW User guide suggestions.

Page 31

HE910

Mode

Average

(mA)

Mode description

Stand by mode (WCDMA)

Stand By 3G

1.2*

Disabled TX and RX; module is not registered on the network; DRX7

IDLE mode (GSM)

Stand By 2G

1.1*

Disabled TX and RX; module is not registered on the network, DRX5

Operative mode (WCDMA)

WCDMA Voice

538

WCDMA voice call (23.5dBm; High Band)

HSDPA

557

HSDPA data call (23.5dBm; High Band, CAT10)

Operative mode (GSM)

CSD TX and RX mode

GSM VOICE CALL GSM900 CSD PL5

209

DCS1800 CSD PL0

176

5.2 Power Consumption

The HE910 power consumptions are described in the following table (Preliminary values):

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

* depending on network configuration and not under module control.

The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.

NOTE: The electrical design for the Power supply should be made ensuring it will be capable

of a peak current output of at least 2 A.

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5.3 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

the electrical design the thermal design the PCB layout.

5.3.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

+5V input (typically PC internal regulator output) +12V input (typically automotive) Battery

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

5.3.1.1 + 5V input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence there's not a big difference

between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

When using a linear regulator, a proper heat sink shall be provided in order to dissipate

the power generated.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks close to the HE910, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one)

is rated at least 10V.

A protection diode should be inserted close to the power input, in order to save the

HE910 from power polarity inversion.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

An example of linear regulator with 5V input is:

5.3.1.2 + 12V input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence due to the big difference

between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the HE910.

When using a switching regulator, a 500kHz or more switching frequency regulator is

preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

In any case the frequency and Switching design selection is related to the application to

be developed due to the fact the switching frequency could also generate EMC interferences.

For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind

when choosing components: all components in the power supply must withstand this voltage.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one)

is rated at least 10V.

For Car applications a spike protection diode should be inserted close to the power

input, in order to clean the supply from spikes.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

A protection diode should be inserted close to the power input, in order to save the

HE910 from power polarity inversion. This can be the same diode as for spike protection.

An example of switching regulator with 12V input is in the below schematic:

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

5.3.1.3 Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit HE910 module.

WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types

USED DIRECTLY

since their maximum voltage can rise over the absolute maximum

MUST NOT BE

voltage for the HE910 and damage it.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910.

Their use can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V. A protection diode should be inserted close to the power input, in order to save the

HE910 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

The battery capacity must be at least 500mAh in order to withstand the current peaks

of 2A; the suggested capacity is from 500mAh to 1000mAh.

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5.3.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

Average current consumption during HSDPA transmission @PWR level max :

600 mA

Average current during idle:

1.5 mA

NOTE: The average consumption during transmissions depends on the power level at which

the device is requested to transmit by the network. The average current consumption hence varies significantly.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 600mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 600mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the HE910, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the HE910; you must ensure that your application can dissipate it.

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5.3.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

The Bypass low ESR capacitor must be placed close to the Telit HE910 power input

pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the HE910 is wide enough to ensure a dropless connection even during the 2A current peaks.

The protection diode must be placed close to the input connector where the power

source is drained.

The PCB traces from the input connector to the power regulator IC must be wide

enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit HE910, then this noise is not so disturbing and power supply layout design can be more forgiving.

The PCB traces to the HE910 and the Bypass capacitor must be wide enough to ensure

no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.

The PCB traces connecting the Switching output to the inductor and the switching diode

must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

The use of a good common ground plane is suggested. The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

The power supply input cables should be kept separate from noise sensitive lines such

as microphone/earphone cables.

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Page 38

ANTENNA REQUIREMENTS

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE)

70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band

Bandwidth (WCDMA)

70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 460 MHz in WCDMA Band IV (see NOTE1) 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I

Impedance

50 ohm

Input power

> 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA

VSWR absolute max

≤ 5:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfil all regulatory requirements)

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

6 GSM/WCDMA Antenna

The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

6.1 GSM/WCDMA Antenna Requirements

As suggested on the Product Description the antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the following requirements:

When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (K1) by means of a transmission line implemented on the PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.

Page 39

ANTENNA LINE ON PCB REQUIREMENTS

Characteristic Impedance

50 ohm

Max Attenuation

0,3 dB

Coupling with other signals shall be avoided

Cold End (Ground Plane) of antenna shall be equipotential to the HE910 ground pins

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

This transmission line shall fulfil the following requirements:

Furthermore if the device is developed for the US market and/or Canada market, it shall comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Antennas used for this OEM module must not exceed the following gains for mobile and fixed operating configurations:

GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi FDD IV: 6.45 dBi

NOTE1: The HE910-GA is not supporting the FDD BAND IV

Page 40

6.2 GSM/WCDMA - PCB line Guidelines

Make sure that the impedance is 50ohm ; Keep line on the PCB as short as possible, since the antenna line loss shall be less

than around 0,3 dB;

Line geometry should have uniform characteristics, constant cross section, avoid

meanders and abrupt curves;

Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded

Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna;

If a Ground plane is required in line geometry, that plane has to be continuous and

sufficiently extended, so the geometry can be as similar as possible to the related canonical model;

Keep, if possible, at least one layer of the PCB used only for the Ground plane; If

possible, use this layer as reference Ground plane for the transmission line;

It is wise to surround (on both sides) the PCB transmission line with Ground, avoid

having other signal tracks facing directly the antenna line track.

Avoid crossing any un-shielded transmission line footprint with other signal tracks on

different layers;

The ground surrounding the antenna line on PCB has to be strictly connected to the

main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;

Place EM noisy devices as far as possible from HE910 antenna line; Keep the antenna line far away from the HE910 power supply lines; If EM noisy devices are present on the PCB hosting the HE910, such as fast switching

ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

If EM noisy devices are not present around the line, the use of geometries like

Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;

HE910 Hardware User Guide

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

6.3 GSM/WCDMA Antenna - Installation Guidelines

Install the antenna in a place covered by the GSM signal. If the device antenna is located greater then 20cm from the human body and there are

no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product

If the device antenna is located less then 20cm from the human body or there are no

co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)

Antenna shall not be installed inside metal cases Antenna shall be installed also according Antenna manufacturer instructions.

Page 42

ANTENNA REQUIREMENTS

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE)

70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band

Bandwidth (WCDMA)

70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 460 MHz in WCDMA Band IV (see NOTE1) 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I

Impedance

50 ohm

6.4 Antenna Diversity Requirements

This product is including an input for a second RX antenna to improve the radio sensitivity. The function is called Antenna Diversity.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.

The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application.

NOTE1: The HE910-GA is not supporting the FDD BAND IV

Page 43

Antenna Requirements

Frequency range

1575.42 MHz (GPS L1)

Bandwidth

± 1.023 MHz

Impedance

50ohm

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

6.5 GPS Antenna Requirements (HE910 and HE910-GA)

The HE910 module is already provided with an internal LNA amplifier so it is also possible to develop an application including a passive Antenna.

The use of an active antenna is required to achieve a better performance especially when the GPS antenna distance from the module is quite high. The module is provided of a Digital Output signal to enable the external LNA (pad R7)

6.5.1 Combined GPS Antenna

The use of combined GPS antennas is NOT recommended; this solution could generate an extremely poor GPS reception and also the combination antenna requires additional diplexer and adds a loss in the RF route.

In addition, the combination of antennas requires an additional diplexer, which adds significant power losses in the RF path.

6.5.2 Linear and Patch GPS Antenna

Using this type of antenna introduces at least 3 dB of loss if compared to a circularly polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain response could aggravate the multipath behaviour & create poor position accuracy.

6.5.3 LNA and Front End Design Considerations

The optional external LNA (embedded or not inside antenna) should be dimensioned to compensate antenna line losses and to avoid an excessive LNA gain that can introduce jamming spurs, degrade 3IP, and saturate the receiver.

The external active antenna for a Telit HE910 device must fulfill the following requirements:

Page 44

Antenna Line on PCB Requirements

Impedance

50 ohm

No coupling with other signals allowed

Cold End (Ground Plane) of antenna must be equipotential to

the HE910 ground pins

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

When using the Telit HE910, since there is no antenna connector on the module, the antenna must be connected to the HE910 through the PCB with the antenna pad. In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.

This line of transmission must fulfill the following requirements:

Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application.

6.5.4 GPS Antenna - PCB Line Guidelines

Ensure that the antenna line impedance is 50ohm. Keep the antenna line on the PCB as short as possible to reduce the loss. Antenna line must have uniform characteristics, constant cross section,

avoid meanders and abrupt curves.

Keep one layer of the PCB used only for the Ground plane, if possible. Surround (on the sides, over and under) the antenna line on PCB with

Ground, avoid having other signal tracks facing directly the antenna line of track.

The ground around the antenna line on PCB has to be strictly connected to

the Ground Plane by placing vias once per 2mm at least.

Place EM noisy devices as far as possible from HE910 antenna line. Keep the antenna line far away from the HE910 power supply lines. Keep the antenna line far away from the HE910 GSM RF lines. If you have EM noisy devices around the PCB hosting the HE910, such as fast

switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

Page 45

If you do not have EM noisy devices around the PCB of HE910, use a strip-

line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one.

6.5.5 GPS Antenna - Installation Guidelines

The HE910 due to its characteristics of sensitivity is capable to perform a Fix

inside the buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding).

The Antenna must not be co-located or operating in conjunction with any

other antenna or transmitter.

Antenna must not be installed inside metal cases.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Antenna must be installed also according to the Antenna manufacturer

instructions.

Page 46

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with

respect to ground

-0.3V

3.1V Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

Level

Typical

Output Current

100uA

Input Current

1uA

7 Logic level specifications

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Operating Range - Interface levels (1.8V CMOS)

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Current characteristics (Preliminary values)

Page 47

Signal

Function

I/O

PAD

RESET*

Phone reset

R13

Signal

Min

Max

RESET Input high

1.5V

1.9V

RESET Input low

0.35V

7.1 Reset signal

RESET* is used to reset the HE910. Whenever this signal is pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release of the reset HE910 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the Reset signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The RESET* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this

function or the AT#SHDN command.

Reset Signal Operating levels:

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.

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PAD

Signal

I/O

Function

Type

NOTE

B15

USB_D+

I/O

USB differential Data (+)

3.3V

C15

USB_D-

I/O

USB differential Data (-)

3.3V

A13

VUSB

Power sense for the internal USB

transceiver.

Accepted range:

4.4V to 5.25V

HE910 Hardware User Guide

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8 USB Port

The HE910 includes one integrated universal serial bus (USB) transceiver:

USB 2.0 HS

8.1 USB 2.0 HS

This port is compliant with the USB 2.0 specifications. The following table is listing the available signals:

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal

traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The impedance value should be as close as possible to 90 Ohms differential.

Page 49

PAD

Signal

I/O

Function

Type

COMMENT

D15

SPI_MOSI I SPI MOSI

CMOS 1.8V

Shared with TX_AUX

E15

SPI_MISO O SPI MISO

CMOS 1.8V

Shared with RX_AUX

F15

SPI_CLK I SPI Clock

CMOS 1.8V

H15

SPI_MRDY

CMOS 1.8V

J15

SPI_SRDY O SPI_SRDY

CMOS 1.8V

NOTE: Due to the shared functions, when the SPI port is used, it is not possible to use the

AUX_UART port.

HE910 Hardware User Guide

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9 SPI port

The HE910 Module is provided by one SPI interface. The SPI interface defines two handshake lines for flow control and mutual wake-up of the

modem and the Application Processor: SRDY (slave ready) and MRDY (master ready). The AP has the master role, that is, it supplies the clock.

The following table is listing the available signals:

The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to properly supply this digital section.

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SPI_MISO

E15

D15

F15 H15

J15

D13

E13

D14

SPI_MOSI

SPI_CLK

SPI_MRDY

SPI_SRDY

VDD_IO1

VIO1_1V8

9.1 SPI Connections

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Page 51

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with

respect to ground

-0.3V

3.1V Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

10 Serial Ports

The HE910 module is provided with by 2 Asynchronous serial ports:

MODEM SERIAL PORT 1 (Main) MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

RS232 PC com port microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the HE910 the ports are CMOS 1.8..

The electrical characteristics of the Serial ports are explained in the following tables:

Absolute Maximum Ratings -Not Functional

HE910 Hardware User Guide

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Operating Range - Interface levels (1.8V CMOS)

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RS232

Pin #

Signal

HE910

Pad Number

Name

Usage

C109/DCD

N14

Data Carrier Detect

Output from the HE910 that indicates the carrier

presence

C104/RXD

M15

Transmit line *see Note

Output transmit line of HE910 UART

C103/TXD

N15

Receive line *see Note

Input receive of the HE910 UART

C108/DTR

M14

Data Terminal Ready

Input to the HE910 that controls the DTE READY

condition

GND

M12, B13, P13,

Ground

C107/DSR

P14

Data Set Ready

Output from the HE910 that indicates the module is

ready

C106/CTS

P15

Clear to Send

Output from the HE910 that controls the Hardware

flow control

C105/RTS

L14

Request to Send

Input to the HE910 that controls the Hardware flow

control

C125/RING

R14

Ring Indicator

Output from the HE910 that indicates the incoming

call condition

STATE

RTS DTR TXD

Pull up tied to

5K to 12K

1V8

OFF

Schottky diode

RESET

Schottky diode

POWER SAVING

5K to 12K

1V8

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

10.1 MODEM SERIAL PORT 1 (USIF0)

The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

The following table shows the typical input value of internal pull-up resistors for RTS DTR and TXD input lines and in all module states:

Line in OFF and RESET state can be treated as in picture below

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: According to V.24, some signal names are referred to the application side, therefore on

the HE910 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD)

NOTE: For a minimum implementation, only the TXD, RXD lines can be connected, the other

lines can be left open provided a software flow control is implemented.

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

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PAD

Signal

I/O

Function

Type

COMMENT

D15

TX_AUX

Auxiliary UART (TX Data to DTE)

CMOS 1.8V

SHARED WITH

SPI_MTSR

E15

RX_AUX

Auxiliary UART (RX Data from

DTE)

CMOS 1.8V

SHARED WITH

SPI_MRST

NOTE: Due to the shared pins, when the Modem Serial port is used, it is not possible to use the

SPI functions.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

10.2 MODEM SERIAL PORT 2 (USIF1)

The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX signals. The signals of the HE910 serial port are:

The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to properly supply this digital section.

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

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10.3 RS232 level translation

In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:

invert the electrical signal in both directions; Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need:

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

5 drivers 3 receivers

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HE910 Hardware User Guide

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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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Digital Voice Interface (DVI)

PAD

Signal

I/O

Function

Note

Type

DVI_WA0

I/O

Digital Audio Interface (Word Alignment / LRCLK)

CMOS 1.8V

DVI_RX

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (BCLK)

CMOS 1.8V

11 Audio Section Overview

The Audio of the HE910 Module is carried by DVI digital audio interface. The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).

NOTE: Audio Supported by HE910 and HE910-GA only

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

11.1 Electrical Characteristics

The product is providing the Digital Audio Interface (DVI) on the following Pins:

11.1.1 CODEC Examples

Please refer to the HE910 Digital Audio Application note.

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PAD

Signal

I/O

Function

Type

Drive

strength

Default

State

Note

GPIO_01

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

Alternate function STAT LED

GPIO_02

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C10

GPIO_03

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C11

GPIO_04

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

B14

GPIO_05

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C12

GPIO_06

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

C13

GPIO_07

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

K15

GPIO_08

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be connected

to VIO1_1V8

L15

GPIO_09

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be connected

to VIO1_1V8

G15

GPIO_10

I/O

Configurable GPIO

CMOS 1.8V

0.1 mA

INPUT

VDD_IO1 has to be connected

to VIO1_1V8

12 General Purpose I/O

The HE910 module is provided by a set of Digital Input / Output pins

Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the HE910 firmware and acts depending on the function implemented.

The following table shows the available GPIO on the HE910:

HE910 Hardware User Guide

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Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with

respect to ground

-0.3V

3.1V Level

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9

Output low level

0.2V

12.1 GPIO Logic levels

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Operating Range - Interface levels (1.8V CMOS)

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12.2 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V.

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH

logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

12.3 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.

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LED status

Device Status

Permanently off

Device off

Fast blinking (Period 1s, Ton 0,5s)

Net search / Not registered / turning off

Slow blinking (Period 3s, Ton 0,3s)

Registered full service

Permanently on

a call is active

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

12.4 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.

A schematic example could be:

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Level

Min

Typical

Max

Output voltage

1.78V

1.80V

1.82V

Output current

60mA

Output bypass capacitor

(inside the module)

1uF

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

12.5 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

12.6 External SIM Holder Implementation

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

12.7 VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

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Pad B1

Lead Free Alloy

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

13 Mounting the HE910 on the application

13.1 General

The HE910 modules have been designed in order to be compliant with a standard lead-free SMT process.

13.2 Module finishing & dimensions

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Top View

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

13.3 Recommended foot print for the application

In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

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PCB

Copper Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

13.4 Stencil

suggest a thickness of stencil foil ≥ 120 µm.

13.5 PCB pad design

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

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Solder resist openings

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

13.6 Recommendations for PCB pad dimensions (mm):

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Finish

Layer thickness [µm]

Properties

Electro-less Ni / Immersion Au

3 7 / 0.05 0.15

good solder ability protection, high shear force values

Inhibit area for micro-via

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure).

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

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Lead free

Solder paste

Sn/Ag/Cu

13.7 Solder paste

modules after assembly.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

13.7.1 HE910 Solder reflow

The following is the recommended solder reflow profile

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Profile Feature

Pb-Free Assembly

Average ramp-up rate (TL to TP)

3°C/second max

Preheat

Temperature Min (Tsmin) Temperature Max (Tsmax) Time (min to max) (ts)

150°C 200°C 60-180 seconds

Tsmax to TL

Ramp-up Rate

3°C/second max

Time maintained above:

Temperature (TL) Time (tL)

217°C 60-150 seconds

Peak Temperature (Tp)

245 +0/-5°C

Time within 5°C of actual Peak Temperature (tp)

10-30 seconds Ramp-down Rate

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

NOTE: All temperatures refer to topside of the package, measured on the package

body surface

WARNING: The HE910 module withstands one reflow process only.

NOTE: It is not allowed to apply any pressure on the top surface of the module when

used in the application

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14 Packing system

The HE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling.

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WARNING: These trays can withstand at the maximum temperature of 65° C.

14.1 Moisture sensitivity

The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 4 months at <40°C and <90% relative

humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process

respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

-STD- is

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HE910 Hardware User Guide

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15 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

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HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

The European Community provides some Directives for the electronic equipments

Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

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Bulgarian

С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на съществените изисквания и другите приложими изисквания на Директива

1999/5/ЕС.

Czech

Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish

Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Dutch

Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.

English

Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC.

Estonian

Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele.

German

Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek

ΜΕ ΣΗΝ ΠΑΡΟΤ΢Α Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΣΙ 2G/3G module ΢ΤΜΜΟΡΦΩΝΕΣΑΙ ΠΡΟ΢ ΣΙ΢ ΟΤ΢ΙΩΔΕΙ΢ ΑΠΑΙΣΗ΢ΕΙ΢ ΚΑΙ ΣΙ΢ ΛΟΙΠΕ΢ ΢ΥΕΣΙΚΕ΢ ΔΙΑΣΑΞΕΙ΢ ΣΗ΢ ΟΔΗΓΙΑ΢ 1999/5/ΕΚ.

Hungarian

Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Finnish

Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.

French

Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.

Icelandic

Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian

Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

16 Conformity assessment issues

16.1 1999/5/EC Directive

The HE910, HE910-D and HE910-GA modules have been evaluated against the essential requirements of the 1999/5/EC Directive.

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Latvian

Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

Lithuanian

Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese

Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.

Norwegian

Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish

Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy

1999/5/EC

Portuguese

Telit Communications S.p.A. declara que este 2G/3G module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovak

Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian

Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.

Spanish

Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.

Swedish

Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.

RF spectrum use (R&TTE art. 3.2)

EN 300 440-2 V1.4.1 EN 301 511 V9.0.2 EN 301 908-1 V4.2.1 EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1 EN 301 489-3 V1.4.1 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

HE910 Hardware User Guide

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In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910 and HE910-GA modules are compliant with the following standards:

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RF spectrum use (R&TTE art. 3.2)

EN 301 511 V9.02 EN 301 908-1 V4.2.1 EN 301 908-2 V4.2.1

EMC (R&TTE art. 3.1b)

EN 301 489-1 V1.8.1 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a)

EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

1909

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

The HE910-D module is compliant with the following standards:

The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body:

AT4 wireless, S.A. Parque Tecnologico de Andalucía C/ Severo Ochoa 2 29590 Campanillas Málaga SPAIN Notified Body No: 1909

Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:

http://www.telit.com/

There is no restriction for the commercialisation of the HE910, HE910-D and HE910-GA modules in all the countries of the European Union.

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RF spectrum use (R&TTE art. 3.2)

It will depend on the antenna used on the final product.

EMC (R&TTE art. 3.1b)

Testing Health & Safety (R&TTE art. 3.1a)

Testing

HE910 Hardware User Guide

1vv0300925 Rev.9 – 07-02-2012

Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the following assessments:

Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art.

3.1a) essential requirements can be done against the essential requirements of the EMC and the LVD Directives:

Low Voltage Directive 2006/95/EC and product safety Directive EMC 2004/108/EC for conformity for EMC

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16.2 FCC/IC Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi FDD IV: 6.45 dBi (not applicable to HE910-GA module)

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

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HE910 Hardware User Guide

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Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi

au module HE910-GA)

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Telit Communications S p A HE910 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual