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HE863NAG
Users Manual
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Telit Communications S p A HE863NAG Users Manual

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Page 1
HE863 Family
Hardware User Guide
1vv0300891 Rev.6 – 2011-04-14
Page 2
HE863 Family Hardware User Guide
R
R
1vv0300891 Rev.6
APPLICABLE PRODUCT
PRODUCT
HE863-EUD
HE863-EU
HE863-EUG
HE863-NAD
HE863-NA
HE863-NAG
HE863-AUD
HE863-AUG
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
Disclaimer
The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited. Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the SAFETY standards of the applicable country, and where applicable, with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this document.
Copyright: Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights are reserved.
Copyright © Telit Communications S.p.A. 2010.
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
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Contents
1. INTRODUCTION.................................................................................................................................................6
1.1. S
1.2. A
1.3. C
1.4. D
1.5. T
1.6. R
1.7. D
COPE.................................................................................................................................................................6
UDIENCE............................................................................................................................................................6
ONTACT INFORMATION, SUPPORT...................................................................................................................6
OCUMENT ORGANIZATION................................................................................................................................7
EXT CONVENTIONS...........................................................................................................................................8
ELATED DOCUMENTS.......................................................................................................................................8
OCUMENT HISTORY..........................................................................................................................................9
2. OVERVIEW.......................................................................................................................................................11
2.1. HE863
FAMILYPRODUCTSPECIFICATION...................................................................................................................12
3. HE863FAMILYMECHANICALDIMENSIONS.......................................................................................................14
4. HE863FAMILYMODULECONNECTIONS...........................................................................................................15
4.1. HE863-EUD/NAD/AUD
4.2. HE863-EUR/NAR
4.3. HE863-EUG/NAG/AUG
4.4. BALLS
LAYOUT.............................................................................................................................................30
PIN-OUT................................................................................................................15
PIN-OUT..........................................................................................................................20
PIN-OUT................................................................................................................25
5. HARDWARECOMMANDS.................................................................................................................................31
5.1. T
5.2. I
5.3. T
URNING ON THE HE863................................................................................................................................31
NITIALIZATION AND ACTIVATION STATE............................................................................................................31
URNING OFF THE HE863..............................................................................................................................34
5.3.1. Hardware Unconditional Restart.........................................................................................................36
5.4. S
UMMARY OF TURNING ON AND OFF THE HE863.........................................................................................37
6. POWERSUPPLY................................................................................................................................................38
6.1. P
6.2. G
OWER SUPPLY REQUIREMENTS..................................................................................................................... 38
ENERAL DESIGN RULES.................................................................................................................................40
6.2.1. Electrical Design Guidelines................................................................................................................40
6.2.1.1. +5VInputSourcePowerSupplyDesignGuidelines...............................................................................................40
6.2.1.2. +12VInputSourcePowerSupplyDesignGuidelines.............................................................................................41
6.2.2. Thermal Design Guidelines.................................................................................................................. 43
6.2.3. Power Supply PCB Layout Guidelines...............................................................................................44
7. ANTENNA(S)....................................................................................................................................................46
7.1. GSM/WCDMA
7.2. GSM/WCDMA
7.3. GSM/WCDMA
7.4. GPS
7.5. GPS
7.6. GPS
ANTENNA REQUIREMENTS (HE863-EUG/NAG/AUG ONLY)................................................................53
ANTENNA-PCB LINE GUIDELINES (HE863-EUG/NAG/AUG ONLY)....................................................54
ANTENNA-INSTALLATION GUIDELINES (HE863-EUG/NAG/AUG ONLY)..............................................58
ANTENNA REQUIREMENTS.....................................................................................................46
ANTENNA – PCB LINE GUIDELINES........................................................................................48
ANTENNA – INSTALLATION GUIDELINES.................................................................................52
8. LOGICLEVELSPECIFICATIONS...........................................................................................................................59
8.1. R
ESET SIGNAL..................................................................................................................................................60
9. SERIALPORTS..................................................................................................................................................61
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9.1. MODEM SERIAL PORT.......................................................................................................................................61
9.2. RS232
10. USBPORT....................................................................................................................................................65
LEVEL TRANSLATION............................................................................................................................63
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10.1.USB
TRANSCEIVER SPECIFICATIONS (TBD)....................................................................................................65
11. AUDIOSECTION(HE863EUR/EUG/NAR/NAG/AUGONLY)............................................................................66
11.1. S
11.2. M
ELECTION MODE..............................................................................................................................................66
ICROPHONE CHARACTERISTICS.....................................................................................................................68
11.2.1.Input Lines (MT and HF) Characteristics...........................................................................................68
11.3.OUTPUT
LINES (SPEAKER)...........................................................................................................................68
11.3.1.Output Lines Characteristic..................................................................................................................69
12. GENERALPURPOSEI/O................................................................................................................................71
12.1. L
12.2. U
12.3. U
12.4. U
12.5. I
12.6.RTC
12.7.VAUX1
OGIC LEVEL SPECIFICATIONS......................................................................................................................... 73
SING A GPIO PAD AS INPUT..........................................................................................................................73
SING A GPIO PAD AS OUTPUT......................................................................................................................73
SING THE ALARM OUTPUT GPIO6.................................................................................................................74
NDICATION OF NETWORK SERVICE AVAILABILITY...........................................................................................74
BYPASS OUT............................................................................................................................................75
POWER OUTPUT..................................................................................................................................75
13. DACANDADCSECTION................................................................................................................................77
13.1.DAC
CONVERTER.............................................................................................................................................77
13.1.1.Description............................................................................................................................... ...............77
13.1.2.Enabling DAC............................................................................................................................... ..........77
13.1.3.Low Pass Filter Example......................................................................................................................78
13.2.ADC
CONVERTER.............................................................................................................................................78
13.2.1.Description............................................................................................................................... ...............78
13.2.2. Using ADC Converter............................................................................................................................78
14. MOUNTINGTHEHE863FAMILYONYOURBOARD........................................................................................79
14.1. G
ENERAL...........................................................................................................................................................79
14.1.1.Recommended footprint for the application.......................................................................................79
14.1.2.Suggested Inhibit Area..........................................................................................................................80
14.1.3.Stencil............................................................................................................................... .......................80
14.1.4.PCB Pad Design....................................................................................................................................80
14.1.5. Solder paste...........................................................................................................................................81
14.1.6.HE863 Family Solder Reflow...............................................................................................................82
14.2.DEBUG
OF THE HE863 FAMILY IN PRODUCTION...................................................................................83
15. SIMHOLDERDESIGNGUIDE.........................................................................................................................84
15.1. O
15.2.SIM
VERVIEW.........................................................................................................................................................84
INTERFACE.................................................................................................................................................85
16. ANTENNADETECTIONDESIGNGUIDE...........................................................................................................87
17. CONFORMITYASSESSMENTISSUES..............................................................................................................88
18. SAFETYRECOMMENDATIONS......................................................................................................................91
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1. Introduction
1.1. Scope
The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE863-EUD/NAD/AUD/EUG/NAG/AUG/EUR/NAR module. All the features and solutions detailed are applicable to all HE863 family, whereas “family” is intended the modules listed in the applicability table.
When a specific feature is applicable to a specific product, it will be clearly highlighted.
1.2. Audience
This document is intended for Telit customers, who are integrators, about to implement their applications using our HE863-EUD/NAD/AUD/EUG/NAG/AUG/EUR/ NAR
HE863 Family Hardware User Guide
1vv0300891 Rev.6
module.
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1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s
Technical Support Center (TTSC) at:
TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support­center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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HE863 Family Hardware User Guide
1.4. Document Organization
This document contains the following chapters:
1vv0300891 Rev.6
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Chapter 1: “Introduction”
provides a scope for this document, target audience, contact and support information, and text conventions.
Chapter 2: “Overview”
provides an overview of the document.
Chapter 3: “HE863 Family Mechanical Dimensions”
deals with the
layout.
Chapter 4: “HE863 Family Module Connections”
Chapter 5: “Hardware Commands ”
How to control the module via
hardware
Chapter 6: ”Power Supply”
deals on supply and consumption.
Chapter 7: “Antenna(s)”
The antenna connection and board layout design are the most important parts in the full product design
Chapter 8: “Logic Level specifications”
Specific values
adopted in the implementation of logic levels for this module.
Chapter 9: “Serial ports”
Chapter 10: “USB Port”
Chapter 11: “Audio Section ”
Refers to the audio blocks and
electrical characteristics of the Base Band Chip .
Chapter 12: “General Purpose I/O”
How the general purpose I/O
pads can be configured.
Chapter 13 “DAC and ADC Section”
Deals with these two kind of
converters.
Chapter 14 “Mounting the HE863 Family on your board”
Chapter 15 “SIM holder design guide”
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HE863 Family Hardware User Guide
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Chapter 16 “Antenna detection design guide”
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Chapter 17: “Conformity Assessments Issues”
fundamental hints about the conformity assessment that the
final application might need.
Chapter 18: “Safety Recommendations”
recommendations that must be followed by the customer in the
design of the application that makes use of the HE863 Family.
1.5. Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating the module.
provides some
provides some safety
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6. Related Documents
x HE863 Product Description
x HE863 AT Command Manual
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1.7. Document History
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
RReevviissiioon
Rev.0 2010-07-23 First issue Rev.1 2010-07-27 Updated 4 HE863-EUD Modules Connections
Rev.2 2010-10-13 Added HE863-NAD/AUD/EUG/NAG/AUG characteristics
Rev.3 2010-11-24 Added HE863-EUR/NAR
Rev.4 2011-02-23 Updated 4.1 HE863-EUD/NAD/AUD PIN-OUT
Rev.5 2011-03-18 Updated 5.1 Turning ON the HE863
n
DDaatte
e
Updated 4.1 PIN-OUT Updated 5.2 Initialization and Activation state(TBD) Updated 5.3 Turning off the HE863-EUD Updated 5.4 Summary of Turning ON and OFF the HE863­EUD(TBD) Updated 8.1 Reset Signal Updated 14 SIM holder design guides Removed 17.1 The schematics of the HE863 interface board
Added 2.1 HE863 Family Product Specification Added 7.4 GPS Antenna Requirements(HE863-EUG/NAG/AUG only) Added 7.5 GPS Antenna-PCB Line Guidelines(HE863­EUG/NAG/AUG only) Added 7.6 GPS Antenna-Installation Guidelines(HE863­EUG/NAG/AUG only) Added 11 AUDIO Section(HE863-EUG/NAG/AUG only) Added 13 DAC and ADC section Updated 4 HE863 Family Modules Connections Updated 5.2 Initialization and Activation state Updated 6.1 Power Supply Requirements Updated 7 Antenna(s) Updated 9.2 RS232 Level Translation Renumbered chapters.
Updated 1 Introduction Updated 2.1 HE863 Family Product Specification Updated 4 HE863 Family Modules Connections Updated 6.1 Power Supply Requirements Updated 7 GSM/WCDMA Antenna Requirements Updated 11 AUDIO Section(HE863-EUR/EUG/NAR/NAG/AUG only)
Updated 4.2 HE863-EUR/NAR PIN-OUT Updated 4.3 HE863-EUG/NAG/AUG PIN-OUT Updated 5.1 Turning On the HE863 Removed 5.4 Summary of Turning ON and OFF Updated 6.1 Power Supply Requirements Updated 6.2.2 Thermal Design Guidelines Updated 8.1 Reset Signal Updated 11 Audio Section Updated 12 General Purpose I/O Updated 13 DAC And ADC Section Updated 15.2 SIM interface Added 16 Antenna detection design guide
CChhaannggees
s
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HE863 Family Hardware User Guide
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Updated 5.2 Initialization and Activation state Updated 5.3 Turning OFF the HE863 Added 5.4 Summary of Turning ON and OFF Updated 7.2 GSM/WCDMA Antenna – PCB line Guidelines Updated 7.3 GSM/WCDMA Antenna – Installation Guidelines Updated 7.5 GPS Antenna – PCB line Guidelines(HE863­EUG/NAG/AUG only) Updated 15.2 SIM interface Updated 17 Conformity Assessment Issues
Rev.6 2011-04-11 Updated 11.2.1 Input Lines (MT and HF)Characteristics
Updated 11.3.1 Output Lines Characteristics Updated 17 Conformity Assessment Issues
- 2011-04-14
Page 11
2. Overview
The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE863 Family module.
In this document all the basic functions of a M2M device will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided must be considered as mandatory, while the suggested hardware configurations must not be considered mandatory, instead the information given must be used as a guide and a starting point for properly developing your product with the Telit HE863 Family module.
.
HE863 Family Hardware User Guide
1vv0300891 Rev.6
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NOTICE:
The integration of the GSM/GPRS/EDGE/UMTS/HSPA HE863 Family cellular module within user application must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communication S.p.A. for its use, such as any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communication S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.
*C hanges or m odifications not expressly approved by the party responsible for com pliance could void the user's authority to operate the equipm ent.
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
2.1. HE863 Family Product Specification
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ITEM
Air
interfac
e
Size
Data
Service
Interfac
e
FEATURE
HE863-EUD HE863-EUR HE863-EUG HE863-NAD HE863-NAR HE863-NAG
 Dual-band
UMTS/HSPA 2100/900
 Quad-Band
GSM850/900
/1800/1900
 Data only
 Dual-band
UMTS/HSPA 2100/900
 Quad-Band
GSM850/900 /1800/1900
 Dual-band
UMTS/HSPA 2100/900
 Quad-Band
GSM850/900
/1800/1900
 Standalone
GPS
 Dual-band
UMTS/HSPA 1900/850
 Quad-Band
GSM850/900
/1800/1900
 Data only
 Dual-band
UMTS/HSPA 1900/850
 Quad-Band
GSM850/900
/1800/1900
41.4(L)X31.4(W)X2.9(T)
 HSPA UL 5.8Mbps, DL 7.2Mbps 
EDGE UL 118kbps, DL 236.8Kbps, GPRS UL 42.8kbps, DL 85.6 Kbps
 189 Balls Grid Array interface  22 general I/O ports maximum including multi-functional I/Os  Status LED output  3 A/D converters  1 D/A converter (PWM output)  Full RS232 CMOS UART: baud rate up to 6Mbps  Reserved two wires CMOS UART for debugging  USB 2.0, baud rate up to 480Mbps  1.8V/3V SIM interface
 Dual-band
UMTS/HSPA 1900/850
 Quad-Band
GSM850/900
/1800/1900
 Standalone
GPS
Antenna
External Antenna
 2 pairs of analog audio interface
Audio
 PCM interface for Digital audio (Audio only for HE863-EUG/EUR/NAG/NAR/AUG)
Message
SIM Card
SMS (MO/MT)
Support 1.8 and 3V UICC
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
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ITEM
Air
interfac
e
Size
Data
Service
Interfac
e
FEATURE
HE863-AUD HE863-AUG
 Dual-band
UMTS/HSPA 2100/850
 Quad-Band
GSM850/900
/1800/1900
 Data only
41.4(L)X31.4(W)X2.9(T)
 HSPA UL 5.8Mbps, DL 7.2Mbps 
EDGE UL 118kbps, DL 236.8Kbps, GPRS UL 42.8kbps, DL 85.6 Kbps
 189 Balls Grid Array interface  22 general I/O ports maximum including multi-functional I/Os  Status LED output  3 A/D converters  1 D/A converter (PWM output)  Full RS232 CMOS UART: baud rate up to 6Mbps  Reserved two wires CMOS UART for debugging  USB 2.0, baud rate up to 480Mbps  1.8V/3V SIM interface
 Dual-band
UMTS/HSPA 2100/850
 Quad-Band
GSM850/900
/1800/1900
 Standalone
GPS
Antenna
External Antenna
 2 pairs of analog audio interface
Audio
 PCM interface for Digital audio (Audio only for HE863-EUG/EUR/NAG/NAR/AUG)
Message
SIM Card
SMS (MO/MT)
Support 1.8 and 3V UICC
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
3. HE863 Family Mechanical Dimensions
The Telit HE863 Family module overall dimensions are:
• Length: 41.4 mm
• Width: 31.4 mm
• Thickness: 2.9 mm
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HE863 Family Hardware User Guide
1vv0300891 Rev.6
4. HE863 Family Module Connections
The HE863 Family features a 189 Balls Grid Array: in the following sections a description of the available signals and their position in the balls layout is presented.
4.1. HE863-EUD/NAD/AUD PIN-OUT
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Ball Signal I/O Function
SIM card interface
H11 SIMCLK O External SIM signal – Clock 1.8 / 3V
G12 SIMRST O External SIM signal – Reset 1.8 / 3V
F12 SIMIO I/O External SIM signal - Data I/O 1.8 / 3V
E12 SIMIN(TBD) I
H12 SIMVCC -
USB_SIM_D+
F11
(TBD)
USB_SIM_D-
G11
(TBD)
N4 TX_TRACE O Tx data for diagnostic monitor CMOS 1.8V
External SIM signal – Presence (active low)
External SIM signal – Power supply for the SIM
USB SIM(RESERVED)
I/O USB SIM data (+), TBD 1.8V/3.0V
I/O USB SIM data (-), TBD 1.8V/3.0V
Trace
Internal
Pull up
1.8
1.8 / 3V
Type
N3 RX_TRACE I Rx data for diagnostic monitor CMOS 1.8V
Prog. / Data + HW Flow Control
C125/RING
M4
(TBD)
C109/DCD
M3
(TBD)
C108/DTR
L3
(TBD)
C107/DSR
L4
(TBD)
Output for Ring indicator signal (RI) to DTE
O
Output for Data set ready
O
signal (DSR) to DTE
Input for Data terminal ready
I
signal (DTR) from DTE
Output for Data set ready
O
signal (DSR) to DTE
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Page 16
Ball Signal I/O Function
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
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Type
K4 C106/CTS O
K3 C105/RTS I
Output for Clear to send signal (CTS) to DTE
Input for Request to send signal (RTS) from DTE
CMOS 1.8V
CMOS 1.8V
J4 C104/RXD O Serial data output to DTE CMOS 1.8V
J3 C103/TXD I
Serial data input (TXD) from DTE
CMOS 1.8V
USB
S8 USB_VBUS
S9 USB_ID(TBD) AI
Power supply for the internal USB transceiver
Analog input used to sense whether a peripheral device is
5V
Analog
connected.
R9 USB_D+ I/O USB differential Data (+) 3.3V
R8 USB_D- I/O USB differential Data (-) 3.3V
DAC and ADC
S4 DAC_OUT AO Digital/Analog converter output Analog
S5 ADC_IN3 AI
Analog/Digital converter input 3/GPS ANT current detection
Analog
R5 ADC_IN2 AI
R4 ADC_IN1 AI
Analog/Digital converter input 2/GPS ANT voltage detection
Analog/Digital converter input 1/GPS ANT voltage detection
Analog
Analog
Miscellaneous Functions
G5 RESET* I Reset input Pull up 2.3V
C9 VRTC_2V3 AO VRTC Backup capacitor Power
B11 STAT_LED O Status indicator LED CMOS 1.8V
Input command for switching
G4 ON_OFF* I
power ON or OFF (toggle
Pull up 2.3V
command)
D10 PWRMON O Power ON Monitor CMOS 1.8V
A3 RF_ANT - Antenna for GSM/WCDMA – 50 ohm RF
MODEM_RDY
P7
(TBD)
Indicates that the boot
O
sequence completed successfully
CMOS 1.8V
Page 17
Ball Signal I/O Function
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
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Type
R6 WAKEUP(TBD) O
Wake up signal to external host system
CMOS 1.8V
P6 SLEEP(TBD) I Input for entering sleep mode CMOS 1.8V
CALL_KEY(TBD
S6
)
EMG_PWR_OFF
G6
(TBD)
Input for make/answer a call
I
(toggle command)
CMOS 1.8V
I Input for emergency power off Pull up CMOS 1.8V
N8 MODE1(TBD) Mode select 1(TBD)
N9 MODE2(TBD) Mode select 2(TBD)
SPI(TBD)
E5 VAUX1 -
6 pins for SPI
(F4,D4,F5,E4,D5,C11)
Power output for external accessories
Power
GPIO
L11 TGPIO_22 I/O Configurable GPIO #22 CMOS 1.8V
K12 TGPIO_21 I/O Configurable GPIO #21 CMOS 1.8V
M11 TGPIO_20 I/O Configurable GPIO #20 CMOS 1.8V
P10 TGPIO_19 I/O Configurable GPIO #19 CMOS 1.8V
M9 TGPIO_18 I/O Configurable GPIO #18 CMOS 1.8V
M7 TGPIO_17 I/O Configurable GPIO #17 CMOS 1.8V
N10 TGPIO_16 I/O Configurable GPIO #16 CMOS 1.8V
M12 TGPIO_15 I/O Configurable GPIO #15 CMOS 1.8V
P11 TGPIO_14 I/O Configurable GPIO #14 CMOS 1.8V
N11 TGPIO_13 I/O Configurable GPIO #13 CMOS 1.8V
L12 TGPIO_12 I/O Configurable GPIO #12 CMOS 1.8V
P12 TGPIO_11 I/O Configurable GPIO #11 CMOS 1.8V
M8 TGPIO_10 I/O Configurable GPIO #10 CMOS 1.8V
N12 TGPIO_09 I/O Configurable GPIO #09 CMOS 1.8V
B10 TGPIO_08 I/O Configurable GPIO #08 CMOS 1.8V
E9 TGPIO_07 I/O Configurable GPIO #07 CMOS 1.8V
E10
TGPIO_06
/ ALARM
Configurable GPIO #06
I/O
/ ALARM
CMOS 1.8V
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HE863 Family Hardware User Guide
Ball Signal I/O Function
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
F10 TGPIO_05 I/O Configurable GPIO #05 CMOS 1.8V
F9 TGPIO_04 I/O Configurable GPIO #04 CMOS 1.8V
K11 TGPIO_03 I/O Configurable GPIO #03 CMOS 1.8V
G9 TGPIO_02 I/O Configurable GPIO #02 CMOS 1.8V
J11 TGPIO_01 I/O Configurable GPIO #01 CMOS 1.8V
Power Supply
C1 VBATT Main power supply Power
D1 VBATT Main power supply Power
52 pins for Ground
(A2,A5,A12,B2,B3,B4,B5,B9,C2, C10,D6,D9,E1,E6,E11,F1,F6,G10,
GND
H5,H6,H7,H8,H9,H10,J5,J10,J12,
Power
K5,K10,L5,L6,L7,L8,L9,L10,M2, M5,M10,N6,N7,P8,P9,R1,R2,R3, R7,R10,R11,R12,S3,S7,S10)
Reserved
RESERVED
9 pins reserved
(J8,J7,J6,K9,K8,K7,K6,N5,M6)
20 pins reserved
RESERVED
(D3,E3,F3,G3,H3,D2,E2,F2,C4,C3, H2,J2,G2,K2,L1,K1,G1,J1,L2,H1)
RESERVED
RESERVED
RESERVED
7 pins reserved
(P5,P3,P2,M1,N1,N2,P1)
9 pins reserved
(G7,E7,D7,D8,E8,F8,G8,D11,F7)
6 pins reserved
(C5,B8,C7,C8,B7,C6)
17 pins reserved
RESERVED
(A7,A8,C12,J9,A1,A6,A9,A10,A11, B1,B6,B12,D12,H4,P4,S1,S12)
Page 19
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
NOTE:
RESERVED Pins must be UNCONNECTED to any circuit in a host system but be SOLDERED.
NOTE:
If not used, almost all pins must be left disconnected.
Page 20
HE863 Family Hardware User Guide
4.2. HE863-EUR/NAR PIN-OUT
1vv0300891 Rev.6
- 2011-04-14
Ball Signal I/O Function
Internal
Pull up
Audio
J6 EAR_MT+ AO Earphone signal output, phase + Audio
J7 EAR_MT- AO Earphone signal output, phase - Audio
J8 EAR_HF+ AO
Handsfree signal output, phase + (Single ended)
Audio
K6 MIC_MT+ AI Mic signal input, phase + Audio
K7 MIC_MT- AI Mic signal input, phase - Audio
K8 MIC_HF+ AI
K9 MIC_HF- AI
Handsfree mic signal input, phase +
Handsfree mic signal input, phase -
Audio
Audio
PCM interface
TGPIO_17/
M7
PCM_SYNC
M6 PCM_CLOCK I/O
GPIO 17/PCM sync signal of
I/O
digital voice interface
PCM clock of digital voice interface
CMOS 1.8V
CMOS 1.8V
Type
TGPIO_10/
M8
PCM_TX
TGPIO_18/
M9
PCM_RX
PCM data output of digital
I/O
voice interface
PCM data input of digital voice
I/O
interface
CMOS 1.8V
CMOS 1.8V
SIM card interface
H11 SIMCLK O External SIM signal – Clock 1.8 / 3V
G12 SIMRST O External SIM signal – Reset 1.8 / 3V
F12 SIMIO I/O External SIM signal - Data I/O 1.8 / 3V
E12 SIMIN(TBD) I
H12 SIMVCC -
External SIM signal – Presence (active low)
External SIM signal – Power supply for the SIM
1.8
1.8 / 3V
USB SIM(TBD)
USB_SIM_D+
F11
(TBD)
I/O USB SIM data (+), TBD 1.8V/3.0V
Page 21
HE863 Family Hardware User Guide
Ball Signal I/O Function
USB_SIM_D-
G11
(TBD)
I/O USB SIM data (-), TBD 1.8V/3.0V
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
Trace
N4 TX_TRACE O Tx data for diagnostic monitor CMOS 1.8V
N3 RX_TRACE I Rx data for diagnostic monitor CMOS 1.8V
Prog. / Data + HW Flow Control
C125/RING
M4
(TBD)
C109/DCD
M3
(TBD)
C108/DTR
L3
(TBD)
C107/DSR
L4
(TBD)
O
O
I
O
K4 C106/CTS O
K3 C105/RTS I
Output for Ring indicator signal (RI) to DTE
Output for Data set ready signal (DSR) to DTE
Input for Data terminal ready signal (DTR) from DTE
Output for Data set ready signal (DSR) to DTE
Output for Clear to send signal (CTS) to DTE
Input for Request to send signal (RTS) from DTE
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
J4 C104/RXD O Serial data output to DTE CMOS 1.8V
J3 C103/TXD I
Serial data input (TXD) from DTE
CMOS 1.8V
USB
S8 USB_VBUS
Power supply for the internal USB transceiver
5V
S9 USB_ID(TBD) AI
Analog input used to sense whether a peripheral device is
Analog
connected.
R9 USB_D+ I/O USB differential Data (+) 3.3V
R8 USB_D- I/O USB differential Data (-) 3.3V
DAC and ADC
S4 DAC_OUT AO Digital/Analog converter output Analog
S5 ADC_IN3 AI
Analog/Digital converter input 3/GPS ANT current detection
Analog
Page 22
Ball Signal I/O Function
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
R5 ADC_IN2 AI
R4 ADC_IN1 AI
Analog/Digital converter input 2/GPS ANT voltage detection
Analog/Digital converter input 1/GPS ANT voltage detection
Analog
Analog
Miscellaneous Functions
G5 RESET* I Reset input Pull up 2.3V
C9 VRTC_2V3 AO VRTC Backup capacitor Power
B11 STAT_LED O Status indicator LED CMOS 1.8V
Input command for switching
G4 ON_OFF* I
power ON or OFF (toggle
Pull up 2.3V
command)
D10 PWRMON O Power ON Monitor CMOS 1.8V
A3 RF_ANT - Antenna for GSM/WCDMA – 50 ohm RF
MODEM_RDY
P7
(TBD)
R6 WAKEUP(TBD) O
Indicates that the boot
O
sequence completed successfully
Wake up signal to external host system
CMOS 1.8V
CMOS 1.8V
P6 SLEEP(TBD) I Input for entering sleep mode CMOS 1.8V
CALL_KEY(TBD
S6
)
Input for make/answer a call
I
(toggle command)
CMOS 1.8V
N5 AXE(TBD) I Input for handsfree switching CMOS 1.8V
EMG_PWR_OFF
G6
(TBD)
I Input for emergency power off Pull up CMOS 1.8V
N8 MODE1(TBD) Mode select 1(TBD)
N9 MODE2(TBD) Mode select 2(TBD)
SPI(TBD)
E5 VAUX1 -
6 pins for SPI
(F4,D4,F5,E4,D5,C11)
Power output for external accessories
Power
GPIO
L11 TGPIO_22 I/O Configurable GPIO #22 CMOS 1.8V
K12 TGPIO_21 I/O Configurable GPIO #21 CMOS 1.8V
M11 TGPIO_20 I/O Configurable GPIO #20 CMOS 1.8V
Page 23
HE863 Family Hardware User Guide
Ball Signal I/O Function
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
P10 TGPIO_19 I/O Configurable GPIO #19 CMOS 1.8V
N10 TGPIO_16 I/O Configurable GPIO #16 CMOS 1.8V
M12 TGPIO_15 I/O Configurable GPIO #15 CMOS 1.8V
P11 TGPIO_14 I/O Configurable GPIO #14 CMOS 1.8V
N11 TGPIO_13 I/O Configurable GPIO #13 CMOS 1.8V
L12 TGPIO_12 I/O Configurable GPIO #12 CMOS 1.8V
P12 TGPIO_11 I/O Configurable GPIO #11 CMOS 1.8V
N12 TGPIO_09 I/O Configurable GPIO #09 CMOS 1.8V
B10 TGPIO_08 I/O Configurable GPIO #08 CMOS 1.8V
E9 TGPIO_07 I/O Configurable GPIO #07 CMOS 1.8V
E10
TGPIO_06
/ ALARM
Configurable GPIO #06
I/O
/ ALARM
CMOS 1.8V
F10 TGPIO_05 I/O Configurable GPIO #05 CMOS 1.8V
F9 TGPIO_04 I/O Configurable GPIO #04 CMOS 1.8V
K11 TGPIO_03 I/O Configurable GPIO #03 CMOS 1.8V
G9 TGPIO_02 I/O Configurable GPIO #02 CMOS 1.8V
J11 TGPIO_01 I/O Configurable GPIO #01 CMOS 1.8V
Power Supply
C1 VBATT Main power supply Power
D1 VBATT Main power supply Power
52 pins for Ground
(A2,A5,A12,B2,B3,B4,B5,B9,C2, C10,D6,D9,E1,E6,E11,F1,F6,G10,
GND
H5,H6,H7,H8,H9,H10,J5,J10,J12,
Power
K5,K10,L5,L6,L7,L8,L9,L10,M2, M5,M10,N6,N7,P8,P9,R1,R2,R3, R7,R10,R11,R12,S3,S7,S10)
Reserved
20 pins reserved
RESERVED
(D3,E3,F3,G3,H3,D2,E2,F2,C4,C3, H2,J2,G2,K2,L1,K1,G1,J1,L2,H1)
RESERVED
7 pins reserved
(P5,P3,P2,M1,N1,N2,P1)
Page 24
Ball Signal I/O Function
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
RESERVED
RESERVED
9 pins reserved
(G7,E7,D7,D8,E8,F8,G8,D11,F7)
6 pins reserved
(C5,B8,C7,C8,B7,C6)
17 pins reserved
RESERVED
(A7,A8,C12,J9,A1,A6,A9,A10,A11, B1,B6,B12,D12,H4,P4,S1,S12)
NOTE:
RESERVED Pins must be UNCONNECTED but be soldered.
NOTE:
If not used, almost all pins must be left disconnected.
Page 25
HE863 Family Hardware User Guide
1vv0300891 Rev.6
4.3. HE863-EUG/NAG/AUG PIN-OUT
- 2011-04-14
Ball Signal I/O Function
Internal
Pull up
Audio
J6 EAR_MT+ AO Earphone signal output, phase + Audio
J7 EAR_MT- AO Earphone signal output, phase - Audio
J8 EAR_HF+ AO
Handsfree signal output, phase + (Single ended)
Audio
K6 MIC_MT+ AI Mic signal input, phase + Audio
K7 MIC_MT- AI Mic signal input, phase - Audio
K8 MIC_HF+ AI
K9 MIC_HF- AI
Handsfree mic signal input, phase +
Handsfree mic signal input, phase -
Audio
Audio
PCM interface
TGPIO_17/
M7
PCM_SYNC
M6 PCM_CLOCK I/O
GPIO 17/PCM sync signal of
I/O
digital voice interface
PCM clock of digital voice interface
CMOS 1.8V
CMOS 1.8V
Type
TGPIO_10/
M8
PCM_TX
TGPIO_18/
M9
PCM_RX
PCM data output of digital
I/O
voice interface
PCM data input of digital voice
I/O
interface
CMOS 1.8V
CMOS 1.8V
SIM card interface
H11 SIMCLK O External SIM signal – Clock 1.8 / 3V
G12 SIMRST O External SIM signal – Reset 1.8 / 3V
F12 SIMIO I/O External SIM signal - Data I/O 1.8 / 3V
E12 SIMIN(TBD) I
H12 SIMVCC -
External SIM signal – Presence (active low)
External SIM signal – Power supply for the SIM
1.8
1.8 / 3V
USB SIM(TBD)
USB_SIM_D+
F11
(TBD)
I/O USB SIM data (+), TBD 1.8V/3.0V
G11 USB_SIM_D- I/O USB SIM data (-), TBD 1.8V/3.0V
Page 26
HE863 Family Hardware User Guide
Ball Signal I/O Function
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
(TBD)
Trace
N4 TX_TRACE O Tx data for diagnostic monitor CMOS 1.8V
N3 RX_TRACE I Rx data for diagnostic monitor CMOS 1.8V
Prog. / Data + HW Flow Control
C125/RING
M4
(TBD)
C109/DCD
M3
(TBD)
C108/DTR
L3
(TBD)
C107/DSR
L4
(TBD)
O
O
I
O
K4 C106/CTS O
K3 C105/RTS I
Output for Ring indicator signal (RI) to DTE
Output for Data set ready signal (DSR) to DTE
Input for Data terminal ready signal (DTR) from DTE
Output for Data set ready signal (DSR) to DTE
Output for Clear to send signal (CTS) to DTE
Input for Request to send signal (RTS) from DTE
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
J4 C104/RXD O Serial data output to DTE CMOS 1.8V
J3 C103/TXD I
Serial data input (TXD) from DTE
CMOS 1.8V
USB
S8 USB_VBUS
Power supply for the internal USB transceiver
5V
S9 USB_ID(TBD) AI
Analog input used to sense whether a peripheral device is
Analog
connected.
R9 USB_D+ I/O USB differential Data (+) 3.3V
R8 USB_D- I/O USB differential Data (-) 3.3V
DAC and ADC
S4 DAC_OUT AO Digital/Analog converter output Analog
S5 ADC_IN3 AI
R5 ADC_IN2 AI
Analog/Digital converter input 3/GPS ANT current detection
Analog/Digital converter input
Analog
Analog
Page 27
Ball Signal I/O Function
2/GPS ANT voltage detection
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
R4 ADC_IN1 AI
Analog/Digital converter input 1/GPS ANT voltage detection
Analog
Miscellaneous Functions
G5 RESET* I Reset input Pull up 2.3V
C9 VRTC_2V3 AO VRTC Backup capacitor Power
B11 STAT_LED O Status indicator LED CMOS 1.8V
Input command for switching
G4 ON_OFF* I
power ON or OFF (toggle
Pull up 2.3V
command)
D10 PWRMON O Power ON Monitor CMOS 1.8V
A3 RF_ANT - Antenna for GSM/WCDMA – 50 ohm RF
Antenna for GPS – 50 ohm
S1 GPS_ANT -
GPS_ANT for HE863-EUG/NAG/AUG
RF
only
MODEM_RDY
P7
(TBD)
R6 WAKEUP(TBD) O
Indicates that the boot
O
sequence completed successfully
Wake up signal to external host system
CMOS 1.8V
CMOS 1.8V
P6 SLEEP(TBD) I Input for entering sleep mode CMOS 1.8V
CALL_KEY(TBD
S6
)
AXE
N5
(TBD)
EMG_PWR_OFF
G6
(TBD)
Input for make/answer a call
I
(toggle command)
CMOS 1.8V
I Input for handsfree switching CMOS 1.8V
I Input for emergency power off Pull up CMOS 1.8V
N8 MODE1(TBD) Mode select 1(TBD)
N9 MODE2(TBD) Mode select 2(TBD)
SPI(TBD)
E5 VAUX1 -
6 pins for SPI
(F4,D4,F5,E4,D5,C11)
Power output for external accessories
Power
GPIO
Page 28
HE863 Family Hardware User Guide
Ball Signal I/O Function
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
L11 TGPIO_22 I/O Configurable GPIO #22 CMOS 1.8V
K12 TGPIO_21 I/O Configurable GPIO #21 CMOS 1.8V
M11 TGPIO_20 I/O Configurable GPIO #20 CMOS 1.8V
P10 TGPIO_19 I/O Configurable GPIO #19 CMOS 1.8V
N10 TGPIO_16 I/O Configurable GPIO #16 CMOS 1.8V
M12 TGPIO_15 I/O Configurable GPIO #15 CMOS 1.8V
P11 TGPIO_14 I/O Configurable GPIO #14 CMOS 1.8V
N11 TGPIO_13 I/O Configurable GPIO #13 CMOS 1.8V
L12 TGPIO_12 I/O Configurable GPIO #12 CMOS 1.8V
P12 TGPIO_11 I/O Configurable GPIO #11 CMOS 1.8V
N12 TGPIO_09 I/O Configurable GPIO #09 CMOS 1.8V
B10 TGPIO_08 I/O Configurable GPIO #08 CMOS 1.8V
E9 TGPIO_07 I/O Configurable GPIO #07 CMOS 1.8V
E10
TGPIO_06
/ ALARM
Configurable GPIO #06
I/O
/ ALARM
CMOS 1.8V
F10 TGPIO_05 I/O Configurable GPIO #05 CMOS 1.8V
F9 TGPIO_04 I/O Configurable GPIO #04 CMOS 1.8V
K11 TGPIO_03 I/O Configurable GPIO #03 CMOS 1.8V
G9 TGPIO_02 I/O Configurable GPIO #02 CMOS 1.8V
J11 TGPIO_01 I/O Configurable GPIO #01 CMOS 1.8V
Power Supply
C1 VBATT Main power supply Power
D1 VBATT Main power supply Power
Power
GND
52 pins for Ground
(A2,A5,A12,B2,B3,B4,B5,B9,C2, C10,D6,D9,E1,E6,E11,F1,F6,G10, H5,H6,H7,H8,H9,H10,J5,J10,J12, K5,K10,L5,L6,L7,L8,L9,L10,M2, M5,M10,N6,N7,P8,P9,R1,R2,R3, R7,R10,R11,R12,S3,S7,S10)
Page 29
Ball Signal I/O Function
Reserved
HE863 Family Hardware User Guide
1vv0300891 Rev.6
Internal
Pull up
- 2011-04-14
Type
20 pins reserved
RESERVED
(D3,E3,F3,G3,H3,D2,E2,F2,C4,C3, H2,J2,G2,K2,L1,K1,G1,J1,L2,H1)
RESERVED
RESERVED
RESERVED
7 pins reserved
(P5,P3,P2,M1,N1,N2,P1)
9 pins reserved
(G7,E7,D7,D8,E8,F8,G8,D11,F7)
6 pins reserved
(C5,B8,C7,C8,B7,C6)
16 pins reserved
RESERVED
(A7,A8,C12,J9,A1,A6,A9,A10,A11, B1,B6,B12,D12,H4,P4,S12)
NOTE:
RESERVED Pins must be UNCONNECTED but be soldered.
NOTE:
If not used, almost all pins must be left disconnected.
Page 30
4.4. BALLS LAYOUT
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
TOP VIEW
Page 31
5. Hardware Commands
5.1. Turning ON the HE863
To turn on HE863 Family, the pad ON/OFF# must be tied low for at least 1 second and then released.
The maximum current that can be drained from the ON/OFF# pad is 0.1 mA.
A simple circuit to do it is:
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
NOTE:
The HE863 Family turns fully on by supplying power more than
3.2V to the VBATT pads because of the first connect power on feature. This feature could be done only when Vbatt equals to almost 0V at the beginning. Normally the high value capacitor will be mounted on Vbatt line so the user should have a wait enoughly since vbatt is disabled till the remaining voltage on Vbatt is fully dischaged in order to do re-start by this feature.
Because the discharge time depends upon the capacitance on Vbatt in the application it should be definitely considered in the application side.
HE863 Family has dozens uF on Vbatt line inside.
5.2. Initialization and Activation state
Upon turning on HE863 Family, HE863 Family is not activated yet because the boot sequence of HE863 Family is still going on internally. It may take more than about 10 seconds to complete the initializing the module internally.
For this reason, it would be useless to try to access HE863 Family during Initialization state as below. To get the
Page 32
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
desirable stability, HE863 Family needs at least 10 seconds after the PWRMON goes High.
Following time charts can be referred according to the application design.
i. First time supplying the power more than 3.2V to Vbatt
By only first time supplying the power to Vbatt line, the HE863 Family will power on without toggling ON/OFF# pin.
ii. Using ON/OFF key when USB interface is not used
If the application will not use the usb interface of HE863 Family, that is, actually the usb interface is not connected between the devices, the hold time to tie ON/OFF# to GND should be 1 ~ 2 sec to make it powering on.
Page 33
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
iii. Using ON/OFF key when USB interface is used
If the application will use the usb interface of HE863 Family, that is, actually the usb interface is correctly connected between the devices and USB_VBUS is asserted, the hold time to tie ON/OFF# to GND should be 3 ~ 4 sec to make it powering on.
During the Initialization state, any kind of AT-command is not available. DTE must be waiting for the Activation state to communicate with HE863 Family.
NOTE:
To check if the HE863 Family has powered on, the hardware line PWRMON must be monitored. When PWRMON goes high, the module has powered on.
NOTE:
Do not use any pull up resistor on the ON/OFF# line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the HE863 Family power regulator and improper power on/off of the module. The line ON# must be connected only in open collector configuration.
NOTE:
In this document all the lines are inverted. Active low signals are labeled with a name that ends with a "#" or with a bar over the name.
Page 34
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
For example:
1- Let us assume you need to drive the ON/OFF# pad with a totem
pole output of a +1.8/5 V microcontroller (uP_OUT1):
2- Let us assume you need to drive the ON/OFF# pad directly
with an ON/OFF button:
5.3. Turning OFF the HE863
The turning off the device can be done by below ways:
- via AT command only (see HE863 Software User Guide)
- by tying low the ON/OFF# pad for at least 2 seconds.
Either ways the device issues to the network a detach request that informs the network that the device will not be reachable any more.
To turn OFF HE863 Family the pad ON/OFF# must be tied low for at least 2 seconds and then released.
Page 35
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
When the hold time of ON/OFF# reaches above 2 seconds, HE863 Family goes into the finalization state and finally will shut down PWRMON at the end of this state.
The period of the finalization state can differ from the situation in which the HE863 Family is so it cannot be fixed definitely.
Normally it will take above 10 seconds later from releasing ON/OFF# and DTE should monitor the status of PWRMON to see the actual power off.
TIP:
To check if the device has powered off, hardware line PWRMON must be monitored. When PWRMON goes low it can be considered the device has powered off.
Page 36
5.3.1. Hardware Unconditional Restart
WARNING:
The hardware unconditional Restart must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stacked waiting for some network or SIM responses.
To unconditionally restart the HE863 Family, the pad RESET# must be tied low for at least 200 milliseconds and then released.
A simple circuit to do it is:
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
NOTE:
Do not use any pull up resistor on the RESET# line or any totem pole digital output. Using pull up resistor may bring to latch up problems on the HE863 Family power regulator and improper functioning of the module. The line RESET# must be connected only in open collector configuration
TIP:
The unconditional hardware Restart must always be implemented on the boards and the software must use it as an emergency exit procedure.
Page 37
HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
For example:
1- Let us assume you need to drive the RESET# pad with a totem
pole output of a +1.8/5 V microcontroller (uP_OUT2):
This signal is internally pulled up so the pin can be left floating if not used.
5.4. Summary of Turning ON and OFF the HE863
Below chart describes the overall sequences for turning ON and OFF.
Page 38
HE863 Family Hardware User Guide
1vv0300891 Rev.6
6. Power Supply
The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances. Read carefully the requirements and the guidelines that will follow for a proper design.
6.1. Power Supply Requirements
The HE863 Family power requirements are:
Power Supply
Nominal Supply Voltage 3.8V Max Supply Voltage 4.2V Supply Voltage Range
HE863-EUD/NAD/AUD/EUG/NAG/AUG/EUR/NAR
Mode Average(mA) Mode Description
IDLE mode
AT+CFUN=0 - 60uA Shutdown mode(Power off)
AT+CFUN=1
AT+CFUN=4
WCDMA 34
GSM 33
WCDMA 33
GSM 33
Standby mode; no call in progress; GPS OFF (GPS for HE863-EUG/NAG/AUG only)
Normal mode; full functionality of the module
Disabled TX and RX; modules is not registered on the network
3.4V – 4.2V
- 2011-04-14
WCDMA 4/2*
AT+CFUN=5
GSM 4/2*
WCDMA TX and RX mode with GPS OFF GPS OFF (GPS for HE863-EUG/NAG/AUG only)
WCDMA Voice 600 WCDMA voice channel
WCDMA data 600 WCDMA data channel
HSDPA 680 HSDPA data channel HSUPA 610 HSUPA data channel
GSM TX and RX mode with GPS OFF GPS OFF (GPS for HE863-EUG/NAG/AUG only)
GSM Voice 250 GSM voice channel GPRS Class12 650 GPRS data channel EDGE Class12 470 EDGE data channel
* Worst/best case depends on network configuration and is not under module control.
CFN=5 full functionality with power saving; Module registered on the network can receive incoming call and SMS
Page 39
HE863 Family Hardware User Guide
1vv0300891 Rev.6
HE863-EUG/NAG/AUG only
Mode Average(mA) Mode Description
IDLE mode with GPS ON full power
mode*
WCDMA 62
AT+CFUN=1
AT+CFUN=4
AT+CFUN=5
GSM 61
WCDMA 61
GSM 61
WCDMA 54/53*
Standby mode; no call in progress; GPS ON
GSM 54/53*
WCDMA TX and RX mode with GPS ON
full power mode*
WCDMA Voice 630 WCDMA voice channel
WCDMA Data 630 WCDMA data channel
HSDPA 710 HSDPA data channel HSUPA 630 HSUPA data channel
GSM TX and RX mode with GPS ON
full power mode*
GSM Voice 280 GSM voice channel GPRS Class12 670 GPRS data channel EDGE Class12 500 EDGE data channel
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* except external active GPS antenna
TIP:
The electrical design for the Power supply must be made ensuring that it will be capable of a peak current output of at least 2A.
In GSM/GPRS mode, RF transmission is not continuous and it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed, a strong noise floor is generated on the ground; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drops during the peak, current absorption is too much. The device may even shut down as a consequence of the supply voltage drop.
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6.2. General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
x the electrical design
x the thermal design
x the PCB layout
6.2.1. Electrical Design Guidelines
The electrical design of the power supply depends strongly on the power source where this power is drained. We will distinguish them into two categories:
x +5V input (typically PC internal regulator output)
x +12V input (typically automotive)
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6.2.1.1. + 5V Input Source Power Supply Design Guidelines
x The desired output for the power supply is 3.8V, hence
there is not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop-out requirements.
x When using a linear regulator, a proper heat sink must
be provided in order to dissipate the power generated.
x A Bypass low ESR capacitor of adequate capacity must
be provided in order to cut the current absorption peaks close to HE863 Family, a 100F tantalum
capacitor is usually suited.
x Make sure the low ESR capacitor on the power supply
output (usually a tantalum one) is rated at least 10V.
x A protection diode must be inserted close to the power
input, in order to save HE863 Family from power polarity inversion.
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An example of linear regulator with 5V input is:
6.2.1.2. +12V Input Source Power Supply Design Guidelines
x The desired output for the power supply is 3.8V, hence
due to the big difference between the input source and the desired output, a linear regulator is not suited and must not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by HE863 Family.
x When using a switching regulator, a 500 kHz or more
switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.
x In any case, the frequency and Switching design
selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.
x For car PB battery the input voltage can rise up to
15.8V and this must be kept in mind when choosing components: all components in the power supply must withstand this voltage.
x A Bypass low ESR capacitor of adequate capacity must
be provided in order to cut the current absorption peaks. A 100F tantalum capacitor is usually suited
for this.
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x Make sure the low ESR capacitor on the power supply
output (usually a tantalum one) is rated at least 10V.
x For Car applications a spike protection diode must be
inserted close to the power input, in order to clean the supply from spikes.
x A protection diode must be inserted close to the power
input, in order to save HE863 Family from power polarity inversion. This can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):
Switching regulator
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6.2.2. Thermal Design Guidelines
The thermal design for the power supply heat sink must be done with the following specifications:
x Average current consumption during WCDMA/HSPA
transmission @PWR level max : 710mA
x Average current consumption during class12 GPRS
transmission @PWR level max : 670mA
x Average GPS current during GPS ON (Power Saving
disabled) in HE863-EUG/NAG/AUG : 55mA
NOTE:
The average consumption during transmissions depends on the power level at which the device is requested to transmit via the network. The average current consumption hence varies significantly.
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NOTE:
The thermal design for the Power supply must be made keeping an average consumption at the max transmitting level during calls of 750mA rms plus 100mA rms for GPS in tracking mode in HE863-EUG/NAG/AUG.
Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls.
If we assume that the device stays in transmission for short periods of time (let us say few minutes) and then remains for quite a long time in idle (let us say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated for 850mA maximum RMS current. There could even be a simple chip package (no heat sink).
Moreover in average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than 850mA (TBD, being usually around 150mA).
For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating.
For the heat generated by the HE863 Family, you can consider it to be during transmission 1W max during CSD/VOICE calls and
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2W max during class12 GPRS upload. This generated heat will be mostly conducted to the ground plane under the HE863 Family; you must ensure that your application can dissipate heat.
In the WCDMA/HSPA mode, since HE863 Family emits RF signals continuously during transmission, you must pay special attention how to dissipate the heat generated.
The current consumption will be up to about 710mA in HSPA continuously at the maximum TX output power (23dBm). Thus, you must arrange the PCB area as large as possible under HE863 Family which you will mount.
You must mount HE863 Family on the large ground area of your application board and make many ground vias to dissipate the heat.
The peak current consumption in the GSM mode is higher than that in WCDMA. However, considering the heat sink is more important in case of WCDMA.
As mentioned before, a GSM signal is bursty, thus, the temperature drift is more insensible than WCDMA. Consequently, if you prescribe the heat dissipation in the WCDMA mode, you
don’t need to think more about the GSM mode.
6.2.3. Power Supply PCB Layout Guidelines
As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
x The Bypass low ESR capacitor must be placed close to
the Telit HE863 Family power input pads, or in the case the power supply is a switching type, it can be placed close to the inductor to cut the ripple if the PCB trace from the capacitor to HE863 Family is wide enough to ensure a drop-less connection even during the 2A current peaks.
x The protection diode must be placed close to the input
connector where the power source is drained.
x The PCB traces from the input connector to the power
regulator. IC must be wide enough to ensure no voltage drops to occur when the 2A current peaks are absorbed.
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Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply (also introducing the noise floor at the burst base frequency.) For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have audio interface but only uses the data feature of the Telit HE863 Family, then this noise is not so disturbing and power supply layout design can be more forgiving.
x The PCB traces to HE863 Family and the Bypass
capacitor must be wide enough to ensure no significant voltage drops to occur when the 2A current peaks are absorbed. This is a must for the same above-mentioned reasons. Try to keep this trace as short as possible.
x The PCB traces connecting the Switching output to the
inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz).
x The use of a good common ground plane is suggested.
x The placement of the power supply on the board must be
done in a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
x The power supply input cables must be kept separately
from noise sensitive lines such as microphone/earphone cables.
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7. Antenna(s)
The antenna connection and board layout design are the most important parts in the full product design and they strongly
reflect on the product’s overall performances. Read carefully and follow the requirements and the guidelines for a proper design.
7.1. GSM/WCDMA Antenna Requirements
As suggested on the Product Description, the antenna for a Telit HE863 Family device must fulfill the following requirements:
GSM / WCDMA Antenna Requirements
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Frequency
range
Bandwidth
Gain
Impedance
Input power
VSWR
absolute max
VSWR
recommended
When using the Telit HE863 Family, since there’s no antenna connector on the module, the antenna must be connected to the HE863 Family through the PCB with the antenna pad using a 50 Ohm transmission line.
Depending by frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s)
HE863-EUD/EUR/EUG HE863-NAD/NAR/NAG HE863-AUD/AUG
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz in PCS 80 MHz in WCDMA900, 250 MHz in WCDMA2100 Gain < 4dBi 50 Ohm > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA <= 10:1
<= 2:1
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz in PCS 70 MHZ in WCDMA850, 140 MHz in WCDMA1900
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz in PCS 70 MHz in WCDMA850, 250 MHz in WCDMA2100
In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the HE863 Family, then a PCB line is needed in order to connect with it or with its connector.
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This line of transmission shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Impedance
Max Attenuation
50 ohm 0,3 dB
No coupling with other signals allowed Cold End (Ground Plane) of antenna shall be equipotential to the HE863 Family ground pins.
Furthermore if the device is developed for the US and/or Canada market, it must comply to the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the HE863 Family module. Antennas used for this OEM module must not exceed 4dBi gain for mobile and fixed operating configurations.
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7.2. GSM/WCDMA Antenna – PCB line Guidelines
x Antenna line must have uniform characteristics, constant
cross section, avoid meanders and abrupt curves;
x Keep, if possible, one layer of the PCB used only for the
Ground plane;
x Surround (on the sides, over and under) the antenna line
on PCB with Ground, avoid having other signal tracks facing directly the antenna line track;
x The ground around the antenna line on PCB has to be
strictly connected to the Ground Plane by placing via holes once per 2mm at least;
x Place EM noisy devices as far as possible from HE863
Family antenna line;
x Keep the antenna line far away from the HE863 Family power
supply lines;
x If you have EM noisy devices around the PCB hosting the
HE863 Family, such as fast switching ICs, take care of shielding it with a metal frame cover.
x HE863 Family can only be used with a host antenna circuit
trace layout according to below guidelines and a host system designer must follow the guidelines to keep the original Grant of HE863 Family. OEM, host system designer has to know that the strict compliance to the layout reference design which Telit will provide is required to ensure that only approved antenna shall be used in the host system.
If in a host system there is any difference from the trace layout already approved, OEM host system designer has to know that it requires a Class II permissive change or a new grant as appropriate as FCC defines. Compliance of this device in all final host configurations is the responsibility of the Grantee.
Here is the information of Telit’s approved interface board layout and please see carefully the pictures extracted from the gerber files for respective layer as attached below. This guidance should be referenced by OEM host.
Telit EVK for HE863 Family has a structure of six pcb layers.
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Layer1, Top layer: The ball in blue circle is A3 which is assigned to theGRF_ANT in the HE863 Family. It is the starting point from the HE863 Family to an AntennaGconnector in a host system. The trace info as; Thickness = 0.035 mm
Width = 1.0 mm
Length = 1.414 mm
Clearance = 0.775 mm (Signal to GND) The actual trace limits in a host system should be calculated to correspond to 50ohm and it may be provided by the pcb maker.
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Layer2, inner layer:
It needs a cut-out on layer2 to meet 50ohm.
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Layer3, inner layer:
There is no cut-out. The related via remains only.
Layer4, inner layer:
There is no cut-out. The related via remains only.
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Layer5, inner layer:
Same cut-out with layer 6’s should be applied to match 50ohm.
Layer6, Bottom layer:
The trace info as; Thickness = 0.035 mm
Width = 1.2 mm
Length = 18.42 mm
Clearance = 2.0 mm (Signal to GND)
The actual trace limits in a host system should be calculated to correspond to 50 ohm which may be provided by the pcb maker.
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7.3. GSM/WCDMA Antenna – Installation Guidelines
x Install the antenna in a place covered by the
GSM/WCDMA signal.
x The Antenna must be installed to provide a separation
distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter;
x Antenna shall not be installed inside metal cases;
x Antenna shall be installed also according Antenna
manufacturer instructions.
x FCC Section 15.203 describes that the use of a
standard antenna jack or electrical connector is prohibited.
Do NOT use this type of connector on the host system and the host system should have one of special ones.
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The host system designers should keep in mind this information before they start their actual design.
Below descriptions will make it clearer.
According to the FCC requirement, SMA type is prohibited because it is one of standard types but
the system designer can adopt RP-SMA type which is considered a special type.
RP-SMA represents “Reversed Polarized SMA”.
Useful pictures below;
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7.4. GPS Antenna Requirements (HE863-EUG/NAG/AUG only)
The use of combined GPS antennas is NOT recommended; this solution could generate an extremely poor GPS reception and also the combination antenna requires additional diplexer and adds a loss in the RF route.
The module is provided of an Antenna supply circuit with the following characteristics:
x Supply voltage referred to VBATT (Must accept values
from 3.4 to 4.2 V DC)
x Supply enable controlled internally by the BB.
When using the Telit HE863-EUG/NAG/AUG, since there’s no antenna connector on the module, the antenna must be connected to the HE863-EUG/NAG/AUG through the PCB with the antenna pad using a 50 Ohm transmission line.
In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the HE863-EUG/NAG/AUG, then a PCB line is needed in order to connect with it or with its connector.
This line of transmission shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Impedance No coupling with other signals allowed Cold End (Ground Plane) of antenna shall be equipotential to the HE863-EUG/NAG/AUG ground pins.
50 ohm
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Furthermore if the device is developed for the US and/or Canada market, it must comply to the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application.
7.5. GPS Antenna-PCB Line Guidelines (HE863­EUG/NAG/AUG only)
x Ensure that the antenna line impedance is 50 ohm;
x Keep the antenna line on the PCB as short as possible
to reduce the loss.
x Antenna line must have uniform characteristics,
constant cross section, avoid meanders and abrupt curves;
x Keep, if possible, one layer of the PCB used only for
the Ground plane;
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x Surround (on the sides, over and under) the antenna
line on PCB with Ground, avoid having other signal tracks facing directly the antenna line track;
x The ground around the antenna line on PCB has to be
strictly connected to the Ground Plane by placing vias once per 2mm at least;
x Place EM noisy devices as far as possible from HE863-
EUG/NAG/AUG antenna line;
x Keep the antenna line far away from the HE863-
EUG/NAG/AUG power supply lines;
x Keep the antenna line far away from the HE863-
EUG/NAG/AUG WCDMA/GSM RF lines;
x If you have EM noisy devices around the PCB hosting
the HE863-EUG/NAG /AUG, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.
x If you don't have EM noisy devices around the PCB of
HE863-EUG/NAG /AUG, by using a strip-line on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;
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Here is the guidance for GPS antenna path.
Layer1, Top layer: The ball in blue circle is S1 which is assigned to the GPS_ANT in the HE863 Family. It is the starting point from the HE863 Family to an AntennaGconnector in a host system. The trace info as; Thickness = 0.035 mm
Width = 1.0 mm
Length = 1.025 mm
Clearance = 0.775 mm (Signal to GND) The actual trace limits in a host system should be calculated to correspond to 50ohm and it may be provided by the pcb maker.
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Layer2, inner layer:
It needs a cut-out on layer2 to meet 50ohm.
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Layer3, inner layer:
There is no cut-out. The related via remains only.
Layer4, inner layer:
There is no cut-out. The related via remains only.
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Layer5, inner layer:
Same cut-out with layer 6’s should be applied to match 50ohm.
Layer6, Bottom layer:
The trace info as; Thickness = 0.035 mm
Width = 1.2 mm
Length = 13.395 mm
Clearance = 2.0 mm (Signal to GND)
The actual trace limits in a host system should be calculated to correspond to 50 ohm which may be provided by the pcb maker.
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7.6. GPS Antenna-Installation Guidelines (HE863­EUG/NAG/AUG only)
x The HE863-EUG/NAG/AUG due to its characteristics of sensitivity is
capable to perform a Fix inside the buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding)
x The Antenna must not be co-located or operating in conjunction with any
other antenna or transmitter;
x Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer
x
instructions.
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8. Logic Level Specifications
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the Telit HE863 Family interface circuits:
For 1.8V CMOS signals:
Absolute Maximum Ratings -Not Functional
Parameter Min Max
Input level on any digital pin when on Input voltage on analog pins when on
Operating Range - Interface levels
Level Min Max
Input high level Input low level -0.2V 0.36V
Output high level Output low level
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-0.3V +3.6V
-0.15V +3.0 V
1.26V 2.0 V
1.6V 1.8V
0V 0.2V
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8.1. Reset Signal
Signal Function I/O BGA Ball
RESET
RESET is used to reset the HE863 Family module. Whenever this signal is pulled low, HE863 Family is reset. When the device is reset it stops all operations. After the release of the reset HE863 Family is unconditionally shut down, without doing any detach operations from the network where it is registered. This behavior is not a proper shutdown because the device is requested to issue a detach request on turn off. For this reason, the Reset signal must not be used for normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response.
Phone reset
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I G5
The RESET is internally controlled on start-up to achieve always a proper power-on reset sequence. There is no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off HE863 Family.
Use AT#SHDN command to perform this function.
Reset Signal Operating levels:
Signal Min Max
RESET Input
high
2.0V* 2.6V
RESET Input low 0V 0.2V
* This signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, it must always be connected with an open collector transistor to permit the internal circuitry the power on reset and under voltage lockout functions.
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9. Serial Ports
The serial port on the Telit HE863 Family is the interface between the module and OEM hardware.
2 serial ports are available on the module:
x MODEM SERIAL PORT;
x MODEM SERIAL PORT 2 (DEBUG).
9.1. Modem Serial Port
Several configurations can be designed for the serial port on the OEM hardware. The most common are:
x RS232 PC com port;
x microcontroller UART @ 1.8V – 2.0V (Universal
Asynchronous Receive Transmit) ;
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Depending on the type of serial port on the OEM hardware, a level translator circuit may be needed to make the system work. The only configuration that does not need a level translation is the 1.8V – 2.0V UART.
The serial port on HE863 Family is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in signal polarity (RS232 is reversed) and levels. The levels for HE863 Family UART are the CMOS levels:
Absolute Maximum Ratings -Not Functional
Parameter Min Max
Input level on any digital pin when on Input voltage on analog pins when on
Operating Range - Interface levels
Level Min Max
Input high level 1.26V 2.0 V
Input low level -0.2V 0.36V
Output high level 1.6V 1.8V
Output low level 0V 0.2V
-0.3V +3.6V
-0.15V +3.0 V
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The signals of the HE863 Family serial port are:
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RS232
Pin
Number
1
2
3
4
5 GND All GND Ground ground
6
7
8
9
Signal
DCD -
dcd_uar
t
(TBD)
RXD -
Tx_uart
TXD -
Rx_uart
DTR -
dtr_uar
t
(TBD)
DSR -
dsr_uar
t (TBD)
RTS -
rts_uar
t CTS -
cts_uar
t
RI -
ri_uart
(TBD)
HE863
Family
Ball
M3
J4
J3
L3
L4
K3
K4 Clear to Send
M4
Name Usage
Data Carrier Detect
Transmit line *see Note
Receive line *see Note
Data Terminal Ready
Data Set Ready
Request to Send
Ring Indicator
Output from the HE863 Family that indicates the carrier presence
Output transmit line of HE863 Family UART
Input receive of the HE863 Family UART
Input to the HE863 Family that controls the DTE READY condition
Output from the HE863 Family that indicates the module is ready
Input to the HE863 Family that controls the Hardware flow control
Output from the HE863 Family that controls the Hardware flow control
Output from the HE863 Family that indicates the Incoming call condition
TIP:
For minimum implementation, only the TXD and RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore on the HE863 Family side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ rx_uart ) of the HE863 Family serial port and vice versa for RX.
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9.2. RS232 Level Translation
In order to interface the Telit HE863 Family with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:
x invert the electrical signal in both directions;
x Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-
562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
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By convention the driver is the level translator from the 0-
1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
x 5 drivers
x 3 receivers
NOTE:
The digital input lines working at 1.8V CMOS have an absolute maximum input voltage of 3.6V; therefore the level translator IC shall not be powered by the +3.8V supply of the module. Instead, it must be powered from a +1.8V / +2.0V (dedicated) power supply.
This is because in this way the level translator IC outputs on the module side (i.e. HE863 Family inputs) will work at +3.8V interface levels, damaging the module inputs.
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An example of level translation circuitry of this kind is:
The RS232 serial port lines are usually connected to a DB9 connector with the following layout: signal names and directions are named and defined from the DTE point of view.
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10. USB Port
The HE863 Family module includes a Universal Serial Bus (USB) transceiver, which operates at USB low-speed (1.5Mbits/sec), USB full-speed (12Mbits/sec) and USB high-speed (480Mbits/sec).
It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and data transfers.
The table below describes the USB interface signals:
Signal
USB_VBUS S8
USB_D- R8
USB D+ R9
USB_ID
(TBD)
Family
HE863
Ball
S9
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Usage
Power supply for the internal USB transceiver. This pin is configured as an analog input or an analog output depending upon the type of peripheral device connected. Minus (-) line of the differential, bi­directional USB signal to/from the peripheral device Plus (+) line of the differential, bi­directional USB signal to/from the peripheral device
Analog input used to sense whether a peripheral device is connected and if connected, to determine the peripheral type, host or slave
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TIP:
The HE863 Family does NOT support host device operation at the moment, that is, it works as a slave device.
10.1. USB transceiver specifications (TBD)
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11. Audio Section (HE863-EUR/EUG/NAR/NAG/AUG only)
The Baseband chip was developed for the cellular phones, which needed two separated amplifiers both in RX and in TX section. A couple of amplifiers had to be used with internal audio transducers while the other couple of amplifiers had to be used with external audio transducers. To distinguish the schematic signals and the Software identifiers, two different definitions were introduced, with the following meaning:
x internal audio transducers Æ HS/MT differential/Single
ended type (from HandSet or MicroTelephone )
x external audio transducers Æ HF only single-ended output
type (from HandsFree )
Actually the acronyms have not the original importance. In other words this distinction is not necessary, being the performances between the two blocks like the same.
Only if the customer needs higher output power to the speaker, he has a constraint. Otherwise the choice could be done in order to overcome the PCB design difficulties.
For these reasons we have not changed the HS and HF acronyms, keeping them in the Software and on the schematics.
11.1. Selection mode
Only one block can be active at a time, and the activation of the requested audio path is done via hardware by AXE line or via software by AT#CAP command.
Moreover the Sidetone functionality could be implemented by the amplifier fitted between the transmit path and the receive path, enabled at request in both modes.
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Single ended
100nF
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16
Differential
EAR_MT+ (EPP1)
Differential
EAR_MT- (EPN1)
Single ended
Bias
100nF
Differential or Single ended
MIC_MT- (MICN1)
100nF
MIC_MT+ (MICP1)
Single ended
Baseband AFE
16
Only Single ended
100nF
EAR_HF+ (EPPA2)
Reserved Ball
EAR_HF- (EPPA1)
Bias
Differential or Single ended
100nF
MIC_HF- (AUX2N)
100nF
MIC_HF+ (AUX1N)
Single ended
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11.2. Microphone Characteristics
TIP:
Being the microphone circuitry the more noise sensitive, its design and layout must be realized with particular care. Both microphone paths are balanced and the OEM circuitry must be balanced designed to reduce the common mode noise typically generated on the ground plane. However the customer can use the unbalanced circuitry for particular application.
11.2.1. Input Lines (MT and HF) Characteristics
Line coupling AC(*)
Line type Balanced/Unbalanced
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Coupling capacitor
Differential input impedance Differential input voltage input capacitance
(*) WARNING: AC means that the signals from the microphone have to be connected to input lines of the module through capacitors which value has to be  100nF, Not respecting this constraint, the input stages will be damaged.
When particular OEM application needs a Single Ended Input configuration, it is forbidden connecting the unused input directly to Ground, but only through a 100nF capacitor. Don’t forget that thus the useful input signal will be halved.
100nF 50K
Max 0.8Vpp
5pF(typ.)
11.3. OUTPUT LINES (Speaker)
We suggest driving the load differentially from both output drivers, thus the output swing will double and the need for the output coupling capacitor avoided. If a particular OEM application needs a Single Ended Output configuration the output power will be reduced four times.
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The OEM circuitry shall be designed to reduce the common mode noise typically generated on the ground plane and to get the maximum power output from the device (low resistance tracks).
(*) WARNING:
Using single ended configuration, the unused output line must be left open.
Not respecting this constraint, the output stage will be damaged.
DANGER:
Using HS/MT, the serial capacitors below 100nF must be connected in the output lines.
The handsfree mode only supports single ended type and reserved HF- Ball must be opened.
11.3.1. Output Lines Characteristic
Line coupling differential
single-ended
Output load impedance differential
Signal bandwidth 150 - 4000 Hz @ -3
Differential output voltage (typ.)
Max Output Power @ 16  Output load resistance 14 
Table 3. “Ear_MT” Output (EAR_EPx1 differential amplifier)
DC
AC
16 
dB 3700 mV
/Full scale
pp
differential open circuit voltage 100mW
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Line coupling
DC
single-ended
Output load impedance
AC
16 
single-ended S.E. output impedance
0,5  @ 1.02kHz
signal bandwidth 150 - 4000 Hz @ -3 dB
Single ended output voltage (max.)
2000 mV
/Full scale
pp
single ended open circuit voltage, bipolar mode
Max Output Power
30mW @ 16 Output load resistance 14 
Table 4. “Ear_HF” Output (EAR_EPPA2 amplifiers)
TIP:
If you need to raise the output power of HF, you should use an external Amplifier.
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12. General Purpose I/O
The general-purpose I/O pads can be configured to act in three different ways:
x input
x output
x alternate function (internally controlled)
Input pads can only be read and report the digital value (high or low) present on the pad at the read time; output pads can only be written or queried and set the value of the pad output; an alternate function pad is internally controlled by the HE863 Family firmware and acts depending on the function implemented.
The following GPIOs are available on the HE863 Family.
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Bal
Signal I/O Function Type
l
J11 TGPIO_01 I/O
G9 TGPIO_02 I/O
K11 TGPIO_03 I/O
F9 TGPIO_04 I/O
F10 TGPIO_05 I/O
E10 TGPIO_06 I/O
E9 TGPIO_07 I/O
B10 TGPIO_08 I/O
N12 TGPIO_09 I/O
GPIO01
Configura
ble GPIO
GPIO02
Configura
ble GPIO
GPIO03
Configura
ble GPIO
GPIO04
Configura
ble GPIO
GPIO05
Configura
ble GPIO
GPIO06
Configura
ble GPIO
GPIO07
Configura
ble GPIO
GPIO08
Configura
ble GPIO
GPIO09
Configura
ble GPIO
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
Drive
strength
Defaul
t
State
ON_OFF
State
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
Note
Alternate
function
(ALARM)
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M8 TGPIO_10 I/O
P12 TGPIO_11 I/O
L12 TGPIO_12 I/O
N11 TGPIO_13 I/O
P11 TGPIO_14 I/O
M12 TGPIO_15 I/O
N10 TGPIO_16 I/O
M7 TGPIO_17 I/O
M9 TGPIO_18 I/O
P10 TGPIO_19 I/O
M11 TGPIO_20 I/O
K12 TGPIO_21 I/O
L11 TGPIO_22 I/O
GPIO10
Configura
ble GPIO
GPIO11
Configura
ble GPIO
GPIO12
Configura
ble GPIO
GPIO13
Configura
ble GPIO
GPIO14
Configura
ble GPIO
GPIO15
Configura
ble GPIO
GPIO16
Configura
ble GPIO
GPIO17
Configura
ble GPIO
GPIO18
Configura
ble GPIO
GPIO19
Configura
ble GPIO
GPIO20
Configura
ble GPIO
GPIO21
Configura
ble GPIO
GPIO22
Configura
ble GPIO
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
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2mA INPUT LOW
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Alternate
function (PCM_TX)
-R/-G only
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT LOW
Alternate
2mA INPUT LOW
2mA INPUT LOW
function
(PCM_SYNC)
-R/-G only
Alternate
function (PCM_RX)
-R/-G only
2mA INPUT LOW
2mA INPUT LOW
2mA INPUT HIGH
2mA INPUT LOW
Not all GPIO pads support all these three modes:
x GPIO6 supports all three modes and can be input,
output, alarm output (Alternate function)
Some alternate functions for HE863 Family may be added if needed.
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12.1. Logic Level Specifications
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the HE863 Family interface circuits:
For 1.8V CMOS signals:
Absolute Maximum Ratings -Not Functional
Parameter Min Max
Input level on any digital pin when on Input voltage on analog pins when on
Operating Range - Interface levels
Level Min Max
Input high level Input low level -0.2V 0.36V
Output high level Output low level
-0.3V +3.6V
-0.15V +3.0 V
1.26V 2.0 V
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0V 0.2V
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12.2. Using a GPIO Pad as Input
The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the
1.8V CMOS levels of the GPIO.
If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor
with a 47K pull-up resistor to 1.8V.
12.3. Using a GPIO Pad as Output
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs,
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the pads have a push-pull output and therefore the pull-up resistor may be omitted.
12.4. Using the Alarm Output GPIO6
The GPIO6 pad, when configured as Alarm Output, is controlled by the HE863 Family module and will rise when the alarm starts and fall after the issue of a dedicated AT command.
This output can be used to power up the HE863 Family controlling microcontroller or application at the alarm time, giving you the possibility to program a timely system wake-up to achieve some periodic actions and completely turn off either the application or the HE863 Family during sleep periods. This will dramatically reduce the sleep consumption
to few A.
In battery-powered devices this feature will greatly improve the autonomy of the device.
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NOTE:
During RESET the line is set to HIGH logic level.
12.5. Indication of Network Service Availability
The STAT_LED pin status shows information on the network service availability and Call status. In the HE863 Family modules, the STAT_LED usually needs an external transistor to drive an external LED. Because of the above, the status indicated in the following table is reversed with respect to the pin status:
LED status Device Status
Permanently off Device off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on a call is active
Net search / Not registered / turning off
Registered full service
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12.6. RTC Bypass Out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery.
NOTE:
NO devices must be powered from this pin.
12.7. VAUX1 Power Output
A regulated power supply output is provided in order to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are:
Operating Range – VAUX1 power supply
Min Typical Max
Output voltage
1.75V 1.8V 1.85V
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Output current
Output bypass
capacitor
(Inside the module)
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100mA
1F
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13. DAC and ADC section
13.1. DAC Converter
13.1.1. Description
The HE863 Family module provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on BGA Ball S4 of the HE863 Family module.
The on board DAC is a 16-bit converter, able to generate an analogue value based on a specific input in the range from 0 up to 65535 but recalibrated in the range from 0 to 1023. However, an external low-pass filter is necessary.
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Voltage range
(filtered)
Range 0 1023 Steps
The precision is 1023 steps, so if we consider that the maximum voltage is 1.8V, the integrated voltage could be calculated with the following formula:
Integrated output voltage = 1.8 * value / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain an analog voltage.
13.1.2. Enabling DAC
An AT command is available to use the DAC function. The command is:AT#DAC[=<enable>[,<value>]]
<value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision)
it must be present if <enable>=1
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
Min Max Units
0 1.8 Volt
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during POWERSAVING.
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13.1.3. Low Pass Filter Example
13.2. ADC Converter
13.2.1. Description
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The on board ADCs are 10-bit converters. They are able to read a voltage level in the range of 0-1.2 volts applied on the ADC pin input and store and convert it into 10 bit word.
Input Voltage
range
AD conversion - 10 bits
Resolution - < 1.2 mV
The HE863 Family module provides 3 Analog to Digital Converters. The input lines are:
ADC_IN1 is available on BGA Ball R4 of the HE863 Family module.
ADC_IN2 is available on BGA Ball R5 of the HE863 Family module.
ADC_IN3 is available on BGA Ball S5 of the HE863 Family module.
13.2.2. Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2 The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
Min Max Units
0 1.2 Volt
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14. Mounting the HE863 Family on your board
14.1. General
The Telit HE863 Family module has been designed in order to be compliant with a standard lead-free SMT process.
14.1.1. Recommended footprint for the application
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14.1.2. Suggested Inhibit Area
In order to easily rework the HE863 Family it is suggested to consider on the application a 1.5mm Inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
14.1.3. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ˻ 120μm.
14.1.4. PCB Pad Design
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“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
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Placement of microvias not covered by solder resist is not recommended, unless the microvia carries the same signal of the pad itself.
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
14.1.5. Solder paste
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14.1.6. HE863 Family Solder Reflow
The following is the recommended solder reflow profile
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NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
WARNING:
HE863 Family module can accept only one reflow process.
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14.2. DEBUG OF THE HE863 Family IN PRODUCTION
To test and debug the mounting of HE863 Family, we strongly recommend foreseeing test pads on the host PCB, in order to check the connection between the HE863 Family itself and the application and to test the performance of the module connecting it with an external computer. Depending on the customer application, these pads include, but are not limited to the following signals:
x TXD
x RXD
x ON/OFF
x RESET
x GND
x VBATT
x TX_TRACE
x RX_TRACE
x PWRMON
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15. SIM holder design guide
15.1. Overview
In HE863 Family modules there are five pins for SIM card holder connection.
These lines are:
SIMVCC (SIM Power supply) SIMRST (SIM Reset) SIMIO (SIM Data) SIMIN (SIM Presence/Absence) (TBD) SIMCLK (SIM Clock)
SIM connection must take in account of three key issues:
1) Data Integrity: standard rules for digital layout and
routing must be followed taking in consideration that SIMCLK has frequency of 3.57 MHz and SIMIO has 9600Bps baud rate.
2) EMI/EMC: this is a key aspect to consider designing an application based on TELIT modules with internal antenna and/or without a proper-shielded box. Some of these conditions may occur:
- Antenna picks-up digital noise coming from SIM card lines.
- Antenna radiated field may interfere digital lines.
- Digital lines (in particular clock) may radiate spurious in the surrounding space.
To overcome all these potential problems, connection lines must be kept as short as possible and shielded. SIM-holder position has to be as far as possible from antenna. RF bypass capacitors (10pF...33pF) closed to SIM card SIM­holder are another good care. When connection is not short, insertion of 10..100ohm resistor with 10..33pF capacitor (RC filter) is a good caution to improve EMI from SIMCLK line. Do not insert resistor on SIMVCC, SIMRST and SIMIO lines, their use is not supported by SIM electrical interface.
3) ESD: take standard ESD caution if application based on TELIT module has SIM holder with contacts reachable from human body.
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NOTE:
SIMIN doesn’t require any pull-up resistor. It is built in.
SIM card is detected inserted when this line is short to ground.(TBD)
If in the application the SIM holder doesn’t foresee the switch for the presence/absence of the SIM card, the SIMIN line must be connected to ground.
15.2. SIM interface
When designing SIM interface on the application boards, the
following schematics are recommended.
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3GPP specifications define that the rise time and the fall
time of the IO signal shall not exceed 1 usec.
R1 and C2 are very closely related to the rise and fall time
of the SIMIO signal.
It can differ according to application board therefore it should be considered at the customer point of view.
It means that the values of R1,C1,C2,C3,C4,C5 may be necessary to be optimized according to the application design.
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Telit highly recommends that the customers should verify the relating specification when they design.
But in general there will be no issue if above schematics were made on the application board. All components are DNI but one component should be reserved for each line because they may need to debug in future.
HE863 Family modules already have internally 4.7kohm pull up resistor on SIMIO line.
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16. Antenna detection design guide
The following assumes that the application is using a commonly found 10K DC terminated antenna.
The figure below outlines the reference implementation, please keep in mind that these components are in the RF path and care must be taken when implementing this circuit.
The Vaux is a 1.8V regulated power source output from the module.
ADC is a 0 ~ 1200mV 10-bit Analog to Digital Converter input.
The software assumes the use of the ADC1 input and GPIO13 port of the module for this purpose.
For the detailed operation of this function, please find AT#GSMAD command in the HE863 AT Command Manual.
Component Value
R1
R2
R3
R4
L1
C1
68K
15K
68K
68K
47nH
33pF
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17. Conformity Assessment Issues
The Telit HE863 Family have been assessed in order to satisfy the essential requirements of the R&TTE Directive 1999/05/EC (Radio Equipment & Telecommunications Terminal Equipments) to demonstrate the conformity against the harmonized standards with the final involvement of a Notified Body.
If the module is installed in conformance to the Telit installation manuals, no further evaluation under Article 3.2 of the R&TTE Directive is needed and it is not required for further involvement of a R&TTE Directive Notified Body for the final product. In all other cases, or if the manufacturer of the final product is in doubt, then the equipment integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive. In all cases the assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles
3.1(a) and (b), Safety and EMC respectively, and any relevant Article 3.3 requirements. The Product Description, the Hardware User Guide and Software User Guide contain all the information the customer may need for developing a product meeting the R&TTE Directive.
The HE863 Family is FCC/IC Approved as module to be installed in other devices. This device should be used only for fixed and mobile applications and if the final product after integration is intended for portable use, a new application and FCC is required. The user is cautioned that this device should be used only as specified within this manual to meet RF exposure requirements. Use of this device in a manner inconsistent with this manual could lead to excessive RF exposure conditions. The HE863 Family is conforming to the following US Directives:
• Use of RF Spectrum. Standards: FCC47 Part 22&24
• EMC Standards: FCC47 Part 15
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) This device must accept any interference, including
interference that may cause undesired operation of the device.
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The user must refer to below information to meet the FCC/IC's RF exposure rules and regulations when they design:
• The system antenna(s) used for this transmitter must be
installed to provide a separation distance of at least 20 cm from all the persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
• The system antenna(s) used for this module must not exceed
4dBi for mobile and fixed or mobile operating configurations.
• Users and installers must be provided with antenna
installation instructions and transmitter operating conditions for satisfying RF exposure compliance. Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and to have their complete product tested and approved for FCC compliance.
• HE863 Family is intended for the OEM integrator only.
• The user is required to see the Grant of Equipment document
for other restrictions.
• HE863 Family must be operated and used with a locally approved
access point.
• The radio transmitter(IC ID:5131A-HE863NA & IC ID: 5131A-
HE863NAG) has been approved by Industry Canada to operate with the antenna type listed in this manual with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
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The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system incorporating an adapter in compliance with local regulations.
• Host system including HE863-NAD must be labeled with
“Contains transmitter module with FCC ID:RI7HE863NA and IC ID:5131A-HE863NA”.
• Host system including HE863-NAR must be labeled with
“Contains transmitter module with FCC ID:RI7HE863NA and IC ID:5131A-HE863NA”.
• Host system including HE863-NAG must be labeled with
“Contains transmitter module with FCC ID:RI7HE863NAG and IC ID:5131A-HE863NAG”.
• Host system including HE863-EUD must be labeled with
“Contains transmitter module with FCC ID:RI7HE863EU”.
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18. Safety Recommendations
Read carefully!
Be sure about that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:
x Where it can interfere with other electronic devices in
environments such as hospitals, airports, aircrafts, etc.
x Where there is risk of explosion such as gasoline stations,
oil refineries, etc.
It is responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
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We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to be installed with the guarantee of a minimum 20 cm distance from the body. In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information are available on the European Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
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The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
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