Telit Communications S p A 863P3 User Manual

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GE863-PRO3 Hardware User Guide

1vv0300773a Rev. 1 DRAFT - 24/04/08

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GE863-PRO3 Hardware User Guide

1vv0300773a Rev. 1 DRAFT -

24/04/08

Contents

1 Overview ...........................................................................................................................7

2 GE863-PRO3 Mechanical Dimensions ............................................................................8

3 GE863-PRO3 module connections..................................................................................9

3.1 BALL-OUT............................................................................................................................. 9

3.2 BALLS LAYOUT.................................................................................................................. 15

3.3 ARM Port IO multiplexing..................................................................................................... 16

4 Hardware Commands ....................................................................................................19

4.1 Turning ON the GE863-PRO3 GSM Engine......................................................................... 19

4.2 Turning OFF the GE863-PRO3 GSM Engine ....................................................................... 21

4.2.1

Hardware shutdown........................................................................................................................21

4.3 Hardware Unconditional Reboot of GSM Engine................................................................. 21

4.4 Turning ON/OFF the GE863-PRO3 ARM............................................................................. 22

5 Power Supply..................................................................................................................24

5.1 GSM Power Supply Requirements....................................................................................... 24

5.2 ARM Power Supply Requirements....................................................................................... 25

5.3 VRTC Backup supply........................................................................................................... 25

5.4 General Design Rules.......................................................................................................... 26

5.4.1

Electrical design Guidelines............................................................................................................26

5.4.1.1 + 5V input Source Power Supply Design Guidelines .................................................................27

5.4.1.2 + 12V input Source Power Supply Design Guidelines ...............................................................28

5.4.1.3 Battery Source Power Supply Design Guidelines ......................................................................30

5.4.1.4 Battery Charge control Circuitry Design Guidelines...................................................................30

5.4.2

Thermal Design Guidelines ............................................................................................................32

5.4.3

Power Supply PCB layout Guidelines ............................................................................................33

6 Antenna...........................................................................................................................34

6.1 GSM Antenna Requirements............................................................................................... 34

6.2 GSM Antenna - PCB line Guidelines.................................................................................... 35

6.3 GSM Antenna - installation Guidelines................................................................................. 36

6.4 Electro Magnetic Interference - Guidelines.......................................................................... 36

6.5 Logic level specifications ..................................................................................................... 37

6.5.1

GSM Reset signal...........................................................................................................................39

7 Serial Ports .....................................................................................................................40

7.1 MODEM SERIAL PORT ...................................................................................................... 40

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7.2 RS232 level translation........................................................................................................ 42

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8 Audio Section Overview ................................................................................................45

8.1 Microphone Paths Characteristic and Requirements............................................................ 46

8.2 General Design Rules.......................................................................................................... 49

8.3 Other considerations............................................................................................................ 49

8.4 Microphone Biasing............................................................................................................. 50

8.4.1

Balanced Microphone Biasing ........................................................................................................50

8.4.2

Unbalanced Microphone Biasing....................................................................................................51

8.5 Microphone Buffering........................................................................................................... 53

8.5.1

Buffered Balanced Mic....................................................................................................................53

8.5.2

Buffered Unbalanced (Single Ended) Microphone.........................................................................55

9 OUTPUT LINES (Speaker)..............................................................................................58

9.1 Short description.................................................................................................................. 58

9.2 Output Lines Characteristics................................................................................................ 59

9.3 General Design Rules.......................................................................................................... 60

9.3.1

Noise Filtering.................................................................................................................................60

9.4 Handset Earphone Design................................................................................................... 61

9.5 Hands-Free Earphone (Low Power) Design......................................................................... 62

9.6 Car Kit Speakerphone Design.............................................................................................. 63

9.7 The Evaluation Kit for Telit GE863-PRO3 Modules............................................................... 64

9.7.1

Short Description ............................................................................................................................64

10 General Purpose I/O.......................................................................................................65

10.1

Using a GPIO Pad as INPUT ........................................................................................... 66

10.2

Using a GPIO Pad as OUTPUT........................................................................................ 66

10.3

Using the RF Transmission Control GPIO7...................................................................... 66

10.4

Using the RFTXMON Output GPIO3................................................................................ 66

10.5

Using the Alarm Output.................................................................................................... 67

10.6

Using the Buzzer Output GPIO4....................................................................................... 67

10.7

Indication of network service availability........................................................................... 68

10.8

RTC Bypass out............................................................................................................... 69

10.9

VAUX1 power output........................................................................................................ 69

11 Mounting the GE863-PRO3 on the Application Board.................................................70

11.1

General............................................................................................................................ 70

11.1.1 Recommended footprint for the application....................................................................................71

11.1.2 Stencil.............................................................................................................................................72

11.1.3 PCB pad Design .............................................................................................................................72

11.1.4 Solder paste....................................................................................................................................73

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11.1.5 GE863-PRO3 Solder Reflow ..........................................................................................................74

11.1.6 Packing System..............................................................................................................................76

11.1.7 Moisture Sensibility.........................................................................................................................78

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12 Conformity Assessment Issues....................................................................................79

13 SAFETY RECOMMANDATIONS.....................................................................................81

14 Document Change Log..................................................................................................82

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This document is relating to the following products:

GE863-PRO3 3990250691 GE863-PRO3 with Linux 3990250698

GE863-PRO3 Hardware User Guide

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GE863-PRO3 Hardware User Guide

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DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this document.

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GE863

PRO

1 Overview

GE863-PRO3 Hardware User Guide

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The scope of this document is the description of some hardware solutions useful for developing a product with the Telit In this document all the basic functions of a M2M device will be taken into account; for each one of them a

proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit

further hardware details that may not be explained in this document refer to the Telit GE863-PRO3 Product Description document.

(EN) The integration of the GSM/GPRS GE863-PRO3 cellular module within user application shall be done according to the design rules described in this manual.

GE863-PRO

module.

NOTICE

GE863-PRO

module. For

(IT) L’integrazione del modulo cellulare GSM/GPRS GE863-PRO3 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die integration des GE863-PRO3 GSM/GPRS Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen

(SL) Integracija GSM/GPRS GE863-PRO3 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem piročniku.

(SP) La utilización del modulo GSM/GPRS GE863-PRO3 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS GE863-PRO3 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

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GE863-PRO3 Hardware User Guide

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2 GE863-PRO3 Mechanical Dimensions

The Telit GE863-PRO3 module overall dimension are:

• Length: 41,4 mm

• Width: 31,4 mm

• Thickness: 3,6 mm

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3 GE863-PRO3 module connections

3.1 BALL-OUT

Ball

A1 RESERVED - RESERVED (3) - - A2 A3 ANTENNA A4 RESERVED - RESERVED (3) - - A5 A6 EAR_HF+ A7 EAR_HFA8 EAR_MT+

A9 EAR_MT-

A10 TX_TRACE A11 RX_TRACE A12

B1 RESERVED - RESERVED (3) - - B2 B3 B4 B5 B6 MIC_HF+ B7

B8 MIC_MT+

B9 MIC_MTB10 B11 B12

Signal I/O Main Function Internal

Pull up

GND

GND -

GND GND GND GND -

MIC_HF-

GPIO4 /

BUZZER

STAT_LED O Status indicator led GSM CMOS 1.8V

SIMIN I/O External SIM signal - Presence (active

VBATT

- Ground - - Power

O GSM Antenna output - 50 ohm

Ground - - Power AO Handsfree ear output, phase + GSM AO Handsfree ear output, phase - GSM AO Handset earphone signal output, phase AO Handset earphone signal output, phase

TX data for Debug (1) GSM

RX data for Debug (1)

Ground - - Power

AI Handsfree microphone input; phase + GSM AI Handsfree microphone input; phase - GSM AI Handset microphone signal input;

phase+

AI Handset microphone signal input; phase-

I/O GPIO4 / BUZZER output GSM

low)

- Main GSM power supply GSM

- GSM RF

GSM GSM

GSM

47KΩ

ARM/ GSM Type

Audio Audio Audio

Audio

CMOS 2.8V CMOS 2.8V

Audio Audio

CMOS 2.8V

GSM CMOS 2.8V

Power

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I/O

Configurable general purpose I/O

nfigurable general purpose I/O

Configurable general purpose I/O

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Ball

C2 C3

C4 C125/RING

C5 C107/DSR

C6 C108/DTR

C7 C109/DCD

C8 C105/RTS

C9 C106/CTS

C10 C11 SIMRST

C12

D1 D2 D3 RESERVED - RESERVED (3) - - D4 D5

Signal I/O Main Function Internal

Pull up

VBATT

VRTC

GPIO7/

RFTXDISABLE

SIMIO

CHARGE AI Charger input GSM

VAUX1 - Power output for external accessories GSM

PB25 I/O ARM PIO Controller B pin 25 ARM CMOS 3.1V PB22

- Main GSM power supply GSM

AO VRTC Backup capacitor GSM-ARM

O Output for Ring indicator signal (RI) to

DTE

O Output for Data set ready signal (DSR)

to DTE

I Input for Data terminal ready signal

(DTR) from DTE

O Output for Data carrier detect signal

(DCD) to DTE

I Input for Request to send signal (RTS)

from DTE

O Output for Clear to send signal (CTS) to

DTE

I/O GPIO7 / RFTXDISABLE GSM

O External SIM signal – Reset GSM

I/O External SIM signal - Data I/O GSM

ARM PIO Controller B pin 22 ARM CMOS 3.1V

GSM

ARM/ GSM Type

CMOS 2.8V

1.8/3V ONLY

Power Power

Power

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D6 D7

D9 D10 D11 SIMVCC D12 SIMCLK

E3 RESERVED - RESERVED (3) - - -

E5 RESET*-GSM

E6 GPIO1 / JDR

E9 C103/TXD

PB24 I/O ARM PIO Controller B pin 24 ARM CMOS 3.1V PB23 I/O ARM PIO Controller B pin 23 ARM CMOS 3.1V

PB26 I/O ARM PIO Controller B pin 26 ARM CMOS 3.1V PB27 I/O ARM PIO Controller B pin 27 ARM CMOS 3.1V

GND -

PWRMON O Power ON Monitor GSM

ON_OFF*-GSM I Input command for switching power ON

GPIO5

GPIO3 /

RFTXMON

Ground - - Power

- External SIM signal – Power (2) GSM

O External SIM signal – Clock GSM

Ground - - Power

or OFF to GSM Engine (toggle command).

I GSM Engine Reset input

I/O GPIO1

pin / Jammer Detect Output (2)

I/O GPIO5 Co

pin GPIO3

I/O

pin /

I Serial data input (TXD) from DTE GSM

47KΩ

GSM GSM

GSM

1.8/3V ONLY

CMOS 2.8V

Pull up to VBATT

CMOS 2.8V

CMOS 2.8V CMOS 2.8V

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ble general purpose I/O

Configurable general purpose I/O

al purpose I/O

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Ball

E10 C104/RXD E11 E12

F7 ON/OFF*-AP I

F10 F11 F12

G2 RESERVED - RESERVED (3) - - -

G8 RESERVED - RESERVED (3) - - -

G9 G10 G11 G12

H8 RESERVED - RESERVED (3) - - -

Signal I/O Main Function Internal

Pull up

O Serial data output to DTE GSM

PB8 I/O ARM PIO Controller B pin 8 ARM CMOS 3.1V

PB9 I/O ARM PIO Controller B pin 9 ARM CMOS 3.1V PB13 I/O ARM PIO Controller B pin 13 ARM CMOS 3.1V PC30 I/O ARM PIO Controller C pin 30 ARM CMOS 1.8V-A PC21 I/O ARM PIO Controller C pin 21 ARM CMOS 1.8V-A PC28 I/O ARM PIO Controller C pin 28 ARM CMOS 1.8V-A PC29 I/O ARM PIO Controller C pin 29 ARM CMOS 1.8V-A

NRST I RESET ARM

Input command for turning power ON or OFF to ARM Engine (active high command).

SHDN O Shutdown Control Output ARM CMOS VRTC

PB4 I/O ARM PIO Controller B pin 4 ARM CMOS 3.1V

PB5 I/O ARM PIO Controller B pin 5 ARM CMOS 3.1V

PC8 I/O ARM PIO Controller C pin 8 ARM CMOS 1.8V-A PC10 I/O ARM PIO Controller C pin 10 ARM CMOS 1.8V-A PB12 I/O ARM PIO Controller B pin 12 ARM CMOS 3.1V

PC31 I/O ARM PIO Controller C pin 31 ARM CMOS 1.8V-A

GPIO2 /

PCMCLK

GPIO8 /

PCMWAO

GPIO6 / PCMTX

GPIO9 –

PCMRX

PA5 I/O ARM PIO Controller A pin 5 ARM CMOS 3.1V

PA4 I/O ARM PIO Controller A pin 4 ARM CMOS 3.1V PB10 I/O ARM PIO Controller B pin 10 ARM CMOS 3.1V PB11 I/O ARM PIO Controller B pin 11 ARM CMOS 3.1V

PB6 I/O ARM PIO Controller B pin 6 ARM CMOS 3.1V PB29 I/O ARM PIO Controller B pin 29 ARM CMOS 3.1V

GND PB20 I/O ARM PIO Controller B pin 20 ARM CMOS 3.1V PB21 I/O ARM PIO Controller B pin 21 ARM CMOS 3.1V PB19 I/O ARM PIO Controller B pin 19 ARM CMOS 3.1V PB18 I/O ARM PIO Controller B pin 18 ARM CMOS 3.1V

I/O GPIO2 Configura

I/O GPIO8

I/O GPIO6

I/O GPIO9 Configurable gener

Ground - - Power

1 KΩ

47KΩ

4.7KΩ GSM

GSM CMOS 2.8V

ARM/ GSM Type

CMOS 2.8V

ARM CMOS 3.1V ARM

Pull up to VBATT2

GSM

CMOS 2.8V

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Ball

H9 H10 H11 H12

J1 J2 J3 RESERVED - RESERVED (3) - - J4 J5 J6 J7 J8 RESERVED - RESERVED (3) - - -

J9 J10 J11 J12

K1 K2 K3 K4 K5 K6 K7 K8

K9 K10 K11 K12

L6 JTAGSEL I JTAG ARM – JTAG Type Selection Pull Down

Signal I/O Main Function Internal

Pull up

PC18 I/O ARM PIO Controller C pin 18 ARM CMOS 1.8V-A

PB0 I/O ARM PIO Controller B pin 0 ARM CMOS 3.1V PB2 I/O ARM PIO Controller B pin 2 ARM CMOS 3.1V PB1 I/O ARM PIO Controller B pin 1 ARM CMOS 3.1V PB7 I/O ARM PIO Controller B pin 7 ARM CMOS 3.1V

PB28 I/O ARM PIO Controller B pin 28 ARM CMOS 3.1V

PB16 I/O ARM PIO Controller B pin 16 ARM CMOS 3.1V PB17 I/O ARM PIO Controller B pin 17 ARM CMOS 3.1V PC15 I/O ARM PIO Controller C pin 15 ARM CMOS 1.8V-A PC14 I/O ARM PIO Controller C pin 14 ARM CMOS 1.8V-A

PC4 I/O ARM PIO Controller C pin 4 ARM CMOS 1.8V-A

PC5 I/O ARM PIO Controller C pin 5 ARM CMOS 1.8V-A PC19 I/O ARM PIO Controller C pin 19 ARM CMOS 1.8V-A PC20 I/O ARM PIO Controller C pin 20 ARM CMOS 1.8V-A PA23 I/O ARM PIO Controller A pin 23 ARM CMOS 3.1V PA29 I/O ARM PIO Controller A pin 29 ARM CMOS 3.1V

TMS I JTAG ARM - Test Mode Select Pull Down

TCK I JTAG ARM – Test Clock ARM CMOS 3.1V

RTCK O JTAG ARM – Returned Test Clock ARM CMOS 3.1V

PA25 I/O ARM PIO Controller A pin 25 ARM CMOS 3.1V PC13 I/O ARM PIO Controller C pin 13 ARM CMOS 1.8V-A

PC6 I/O ARM PIO Controller C pin 6 ARM CMOS 1.8V-A

PC7 I/O ARM PIO Controller C pin 7 ARM CMOS 1.8V-A

PB3 I/O ARM PIO Controller B pin 3 ARM CMOS 3.1V

HDMA A USB Host Port A Data - ARM USB

HDPA A USB Host Port A Data + ARM USB

PA24 I/O ARM PIO Controller A pin 24 ARM CMOS 3.1V

OSCSEL I Slow Clock Oscillator Selection Pull Down

NTRST I JTAG ARM - Test Reset Pull Up ARM CMOS 3.1V

TDI I JTAG ARM - Test Data Input ARM CMOS 3.1V

TDO O JTAG ARM - Test Data Output ARM CMOS 3.1V

PA28 I/O ARM PIO Controller A pin 28 ARM CMOS 3.1V PA27 I/O ARM PIO Controller A pin 27 ARM CMOS 3.1V PA26 I/O ARM PIO Controller A pin 26 ARM CMOS 3.1V

ARM/ GSM Type

ARM CMOS 3.1V

ARM CMOS VRTC

ARM CMOS 3.1V

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GE863-PRO3 Hardware User Guide

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Ball

L10 L11 L12

M1 M2 M3 RESERVED - RESERVED (3) - - M4 RESERVED - RESERVED (3) - - M5 M6 M7 M8

M9 M10 M11 M12

N9 N10 RESERVED - RESERVED (3) - - N11 N12

P1 P2 P3 P4 P5 P6 P7 P8 P9

P10

Signal I/O Main Function Internal

Pull up

GND -

HDMB A USB Host Port B Data - ARM USB

HDPB A USB Host Port B Data + ARM USB

XIN32 I Slow Clock Oscillator Input ARM CMOS VRTC

XOUT32 O Slow Clock Oscillator Output ARM CMOS VRTC

PB14 I/O ARM PIO Controller B pin 14 ARM CMOS 3.1V PB15 I/O ARM PIO Controller B pin 15 ARM CMOS 3.1V PC22 I/O ARM PIO Controller C pin 22 ARM CMOS 1.8V-A

PC9 I/O ARM PIO Controller C pin 9 ARM CMOS 1.8V-A PA3 I/O ARM PIO Controller A pin 3 ARM CMOS 3.1V PA2 I/O ARM PIO Controller A pin 2 ARM CMOS 3.1V PA1 I/O ARM PIO Controller A pin 1 ARM CMOS 3.1V

PA0 I/O ARM PIO Controller A pin 0 ARM CMOS 3.1V PA11 I/O ARM PIO Controller A pin 11 ARM CMOS 3.1V PA10 I/O ARM PIO Controller A pin 10 ARM CMOS 3.1V

PA9 I/O ARM PIO Controller A pin 9 ARM CMOS 3.1V PA31 I/O ARM PIO Controller A pin 31 ARM CMOS 3.1V PA30 I/O ARM PIO Controller A pin 30 ARM CMOS 3.1V PB31 I/O ARM PIO Controller B pin 31 ARM CMOS 3.1V

GND PC16 I/O ARM PIO Controller C pin 16 ARM CMOS 1.8V-A PC17 I/O ARM PIO Controller C pin 17 ARM CMOS 1.8V-A

DDM A USB Device Port Data - ARM USB

DDP A USB Device Port Data + ARM USB

PA6 I/O ARM PIO Controller A pin 6 ARM CMOS 3.1V PA7 I/O ARM PIO Controller A pin 7 ARM CMOS 3.1V

PA8 I/O ARM PIO Controller A pin 8 ARM CMOS 3.1V PC12 I/O ARM PIO Controller C pin 12 ARM CMOS 1.8V-A PB30 I/O ARM PIO Controller B pin 30 ARM CMOS 3.1V

PC0 I/O ARM PIO Controller C pin 0 ARM CMOS 3.1V

PC1 I/O ARM PIO Controller C pin 1 ARM CMOS 3.1V

PC2 I/O ARM PIO Controller C pin 2 ARM CMOS 3.1V

PC3 I/O ARM PIO Controller C pin 3 ARM CMOS 3.1V PA22 I/O ARM PIO Controller A pin 22 ARM CMOS 3.1V

Ground - - Power

ARM/ GSM Type

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GE863-PRO3 Hardware User Guide

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Ball

P11 3.1V_OUT OA ARM 3.1V Power Output ARM P12 VBATT2 - Main ARM Power Supply ARM Power

R1 R2 R3 R4 R5 R6 R7 R8

R9 RESERVED - RESERVED (3) - - R10 R11 R12

S1 RESERVED - RESERVED (3) - - S2 RESERVED - RESERVED (3) - - S3 S4 S5 S6 S7 S8

S9 RESERVED - RESERVED (3) - - S10 S11 RESERVED - RESERVED (3) - - S12 RESERVED - RESERVED (3) - - -

Signal I/O Main Function Internal

Pull up

GND GND -

GND PA21 I/O ARM PIO Controller A pin 21 ARM CMOS 3.1V PA18 I/O ARM PIO Controller A pin 18 ARM CMOS 3.1V PA17 I/O ARM PIO Controller A pin 17 ARM CMOS 3.1V PA19 I/O ARM PIO Controller A pin 19 ARM CMOS 3.1V PA16 I/O ARM PIO Controller A pin 16 ARM CMOS 3.1V

GND -

GND PA20 I/O ARM PIO Controller A pin 20 ARM CMOS 3.1V PA14 I/O ARM PIO Controller A pin 14 ARM CMOS 3.1V PA15 I/O ARM PIO Controller A pin 15 ARM CMOS 3.1V PA12 I/O ARM PIO Controller A pin 12 ARM CMOS 3.1V PA13 I/O ARM PIO Controller A pin 13 ARM CMOS 3.1V

GND -

Ground - - Power Ground - - Power Ground - - Power

Ground - - Power

ARM/ GSM Type

(1) For the exclusive use of the Technical Support Service (2) On this pin a maximum of 10nF bypass capacitor is allowed. (3) Reserved Pins must be left UNCONNECTED

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3.2 BALLS LAYOUT

TOP VIEW

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Page 16

Connected to internal dataflash SI

3.3 ARM Port IO multiplexing

ARM PIO Controller A multiplexing

linel

PA0 SPI0_MISO MCDB0

Peripheral A Peripheral B Comments Reset State Boot State

Connected to internal dataflash

SO (1)

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I/O SPI0_MISO

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PA1 SPI0_MOSI MCCDB

PA2 SPI0_SPCK PA3 SPI0_NPCS0 MCDB3 I/O SPI0_NPCS0

PA4 RTS2 MCDB2 I/O I with Pull-up PA5 CTS2 MCDB1 I/O I with Pull-up PA6 MCDA0 I/O I with Pull-up PA7 MCCDA I/O I with Pull-up PA8 MCCK I/O I with Pull-up

PA9 MCDA1 I/O I with Pull-up PA10 PA11 PA12 PA13 PA14 PA15 PA16 PA17 PA18 PA19 PA20 PA21 PA22 PA23 PA24 PA25 PA26 PA27 PA28 PA29 PA30 PA31

MCDA2 ETX2 I/O I with Pull-up MCDA3 ETX3 I/O I with Pull-up

ETX0 I/O I with Pull-up

ETX1 I/O I with Pull-up ERX0 I/O I with Pull-up ERX1 I/O I with Pull-up

ETXEN I/O I with Pull-up ERXDV I/O I with Pull-up ERXER I/O I with Pull-up ETXCK I/O I with Pull-up

EMDC I/O I with Pull-up EMDIO I/O I with Pull-up ADTRG ETXER I/O I with Pull-up

TWD ETX2 I/O I with Pull-up

TWCK ETX3 I/O I with Pull-up

TCLK0 ERX2 I/O I with Pull-up

TIOA0 ERX3 I/O I with Pull-up

TIOA1 ERXCK I/O I with Pull-up

TIOA2 ECRS I/O I with Pull-up

SCK1 ECOL I/O I with Pull-up SCK2 RXD4 I/O I with Pull-up SCK0 TXD4 I/O I with Pull-up

Connected to internal dataflash

(1)

CLK (1)

I/O SPI0_MOSI

I/O SPI0_SPCK

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ARM PIO Controller B multiplexing

linel

PB0 SPI1_MISO TIOA3 I/O I with Pull-up PB1 SPI1_MOSI TIOB3 I/O I with Pull-up PB2 SPI1_SPCK TIOA4 I/O I with Pull-up PB3 SPI1_NPCS0 TIOA5 I/O I with Pull-up PB4 TXD0 I/O I with Pull-up PB5 RXD0 I/O I with Pull-up PB6 TXD1 TCLK1 I/O I with Pull-up PB7 RXD1 TCLK2 I/O I with Pull-up PB8 TXD2 I/O I with Pull-up

PB9 RXD2 I/O I with Pull-up PB10 PB11 PB12 PB13 PB14 PB15 PB16 PB17 PB18 PB19 PB20 PB21 PB22 PB23 PB24 PB25 PB26 PB27 PB28 PB29 PB30 PB31

Peripheral A Peripheral B Comments Reset State Boot State

TXD3 ISI_D8 I/O I with Pull-up RXD3 ISI_D9 I/O I with Pull-up TXD5 ISI_D10 I/O I with Pull-up RXD5 ISI_D11 I/O I with Pull-up

DRXD I/O I with Pull-up

DTXD I/O I with Pull-up

TK0 TCLK3 I/O I with Pull-up TF0 TCLK4 I/O I with Pull-up TD0 TIOB4 I/O I with Pull-up RD0 TIOB5 I/O I with Pull-up RK0 ISI_D0 I/O I with Pull-up

RF0 ISI_D1 I/O I with Pull-up DSR0 ISI_D2 I/O I with Pull-up DCD0 ISI_D3 I/O I with Pull-up DTR0 ISI_D4 I/O I with Pull-up

RI0 ISI_D5 I/O I with Pull-up RTS0 ISI_D6 I/O I with Pull-up CTS0 ISI_D7 I/O I with Pull-up RTS1 ISI_PCK I/O I with Pull-up CTS1 ISI_VSYNC I/O I with Pull-up PCK0 ISI_HSYNC I/O I with Pull-up PCK1 ISI_MCK I/O I with Pull-up

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GPIO that rises to keep externally

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ARM PIO Controller C multiplexing

linel

PC0 SCK3 AD0 I/O I with Pull-up PC1 PCK0 AD1 I/O I with Pull-up PC2 PCK1 AD2 I/O I with Pull-up PC3 SPI1_NPCS3 AD3 I/O I with Pull-up PC4 A23 SPI1_NPCS2 A23 I with Pull-up PC5 A24 SPI1_NPCS1 A24 I with Pull-up PC6 TIOB2 CFCE1 I/O I with Pull-up PC7 TIOB1 CFCE2 I/O I with Pull-up PC8 NCS4/CFCS0 RTS3 I/O I with Pull-up PC9 NCS5/CFCS1 TIOB0 I/O I with Pull-up

PC10 A25/CFRNW CTS3 A25 I with Pull-up

PC11

PC12 PC13 PC14 NCS3/NANDCS IRQ2 I/O I with Pull-up PC15

PC16

PC17 PC18

PC19 PC20 PC21 PC22

PC23

PC24 PC25 PC26 PC27

PC28

Peripheral A Peripheral B Comments Reset State Boot State

Connected to internal dataflash

NCS2 SPI0_NPCS1

NOT AVAILABLE on the Balls

IRQ0 NCS7 I/O I with Pull-up

FIQ NCS6 I/O I with Pull-up

NWAIT IRQ1 I/O I with Pull-up

D16 SPI0_NPCS2 I/O

D17 SPI0_NPCS3 I/O D18 SPI1_NPCS1 I/O I with Pull-up

D19 SPI1_NPCS2 I/O I with Pull-up D20 SPI1_NPCS3 I/O I with Pull-up D21 EF100 I/O I with Pull-up D22 TCLK5 I/O I with Pull-up

Enable of 6MHz internal ARM

D23

D24 NOT AVAILABLE on the Balls I/O D25 NOT AVAILABLE on the Balls I/O D26 NOT AVAILABLE on the Balls I/O D27 NOT AVAILABLE on the Balls I/O -

D28 I/O I with Pull-up

Oscillator (active High)

NOT AVAILABLE on the Balls

CS line

I/O SPI0_NPCS1

I/O O HIGH

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SPI0_NPCS2

with pull-up

SPI0_NPCS3

with pull-up

PC29 PC30

PC31

D29 D30 I/O I with Pull-up

D31 I/O I with Pull-up

ARM alive

I/O O HIGH

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TIP: For further documentation on ARM processor refer to ATMEL AT91SAM9260 datasheet

4 Hardware Commands

4.1 Turning ON the GE863-PRO3 GSM Engine

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To turn on the GE863-PRO3 GSM/GPRS engine the pad second and then released. The maximum current that can be drained from the A simple circuit to do it is:

Power ON impulse

ON_OFF*-GSM

pad is 0,1 mA.

GND

must be tied low for at least 1

ON#

NOTE: don't use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper power on/off of the module. The line ON# must be connected only in open collector configuration.

NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with a "*" or with a bar over the name.

NOTE: The GE863-PRO3 turns fully on also by supplying power to the Charge pad (Module provided with a battery on the VBATT pads).

TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line raised up the device could be considered powered on.

PWRMON line rises up also when supplying power to the Charge pad

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For example: 1- Let's assume you need to drive the ON_OFF*-GSM pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

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10k

2- Let's assume you need to drive the ON_OFF*-GSM pad directly with an ON/OFF button:

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4.2 Turning OFF the GE863-PRO3 GSM Engine

The turning off of the device can be done in two ways:

• by software command (see GE863- GE863-PRO

• by hardware shutdown

When the device is shut down by software command or by hardware shutdown, it issues to the network a detach request that informs the network that the device will not be reachable any more.

4.2.1 Hardware shutdown

To turn OFF the GE863-PRO3 the pad ON_OFF*-GSM must be tied low for at least 1 second and then released.

The same circuitry and timing for the power on shall be used. The device shuts down after the release of the ON_OFF*-GSM pad.

TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When

PWRMON goes low, the device has powered off.

Software User Guide)

4.3 Hardware Unconditional Reboot of GSM Engine

To unconditionally Reboot the GE863-PRO3 , the pad RESET*-GSM must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the RESET*-GSM pad is 0,15 mA. A simple circuit to do it is:

Unconditional Reboot impulse

RESET*-GSM

GND

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NOTE: don't use any pull up resistor on the RESET*-GSM line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper functioning of the module. The line RESET*-GSM must be connected only in open collector configuration.

TIP: The unconditional hardware reboot should be always implemented on the boards and software should use it as an emergency exit procedure.

For example: 1- Let's assume you need to drive the RESET*-GSM ( RESET ) pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):

10k

4.4 Turning ON/OFF the GE863-PRO3 ARM

To turn on the GE863-PRO3 ARM the pad raised ( released ) the ARM will shutdown. The maximum current that can be drained from the

A simple circuit to do it is:

ON_OFF*-ARM

must be tied low and kept low, when pin is

pad is 0,1 mA.

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Power ON/OFF

ON/OFF*-ARM#

GND

NOTE: don't use any pull up resistor on the ON/OFF*ARM line, it is internally pulled up to VBATT2. Using pull up resistor may bring to latch up problems on the GE863-PRO3 power regulator and improper power

on/off of the module. The line ON/OFF*-ARM must be connected only in open collector configuration or tied to ground (if ARM needs to stay always on).

NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with a "*" or with a bar over the name.

TIP: To check if the device has powered on, the hardware line 3.1V_OUT can be monitored.

It is possible to use also the SHDN line to turn ON the device with the ARM RTC trigger by connecting it to the ON/OFF*-ARM pin through a transistor buffer. After the Initial bootstrap, the line PC29 goes HIGH allowing the device to keep itself on; If you need a toggle command to turn on/off the device, then you can use the line PC29 to keep the ARM on after it’s start-up and connect the on/off button to the ON/OFF*ARM pin through a buffer transistor while connecting it to a GPIO to sense it’s toggling (e.g. PC31) for shutting down the ARM by lowering the PC29 pin.

TIP: To Keep the ARM ON you can use the PC29 pin that goes high right after the bootstrap

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5 Power Supply

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

In the GE863-PRO3 the power supply inputs of the GSM engine and the ARM processor part have been kept separate, VBATT is the input for the GSM part, VBATT2 is the input for ARM. It is possible to connect together the two power inputs since they have compatible ranges, but if it is desired the two power supplies can be kept separate. The only power supply in common between the ARM and GSM engine is the RTC voltage which is generated by the GSM engine from VBATT power source and supplies both the GSM RTC and the ARM VDDBU part including the shutdown controller, rtc, 32 KHz oscillator. For this reason if it is planned to remove VBATT power supply, then a backup battery shall be provided on VTRC pin that guarantees that VRTC is still available.

NOTE: if you plan to remove VBATT power source, then you must provide an appropriate backup battery/capacitor on the VRTC pin in order to be able to turn on properly the ARM part when supplying VBATT2 only power pin.

5.1 GSM Power Supply Requirements

POWER SUPPLY

Nominal Supply Voltage 3.8 V Max Supply Voltage 4.2 V Supply voltage range 3.4 V - 4.2 V

GE863-PRO3 GSM Engine

Mode Average (mA) Mode description

IDLE mode

AT+CFUN=1 24,0 Normal mode: full functionality of the module AT+CFUN=4 22,0 Disabled TX and RX; module is not registered on the network

Power saving: CFUN=0 module registered on the network and can

receive voice call or an SMS; but it is not possible to send AT

AT+CFUN=0 or

AT+CFUN=5

RX mode

1 slot in downlink 53,0 2 slot in downlink 66,0 3 slot in downlink 79,0 4 slot in downlink 89,0

7,20 / 3,561

commands; module wakes up with an unsolicited code (call or

SMS) or rising RTS line. CFUN=5 full functionality with power

saving; module registered on the network can receive incoming

Worst/best case depends on network configuration and is not under module control

Stand by mode; no call in progress

calls and SMS

GSM Receiving data mode

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GSM TX and RX mode

Min power level 78,0

Max power level 200,0

GPRS (class 10) TX and RX mode

Min power level 124,0

Max power level 371,0

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GSM Sending data mode

GPRS Sending data mode

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The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.

TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.

5.2 ARM Power Supply Requirements

POWER SUPPLY

Nominal Supply Voltage 3.8 V Operating Supply voltage range 3.4 V - 4.2 V Absolute Maximum voltage range 3.30 – 4.5 V

GE863-PRO3

Mode Typical Average (mA) Mode description

Off < 2 µA (TBD)

Full Speed 140 (TBD)

Slow Clocking 1 (TBD) ARM is running on slow clock with peripherals disabled

ARM is operational at full speed 200MHz CPU Clock , Main Clock

100 MHz and all peripherals active

5.3 VRTC Backup supply

The RTC of the GPRS Engine and the RTC & Shutdown controller of the ARM part are supplied by VRTC. This voltage supply is generated by a low quiescent current regulator inside the module that takes its power from VBATT pins. Since this voltage supply is needed to correctly boot the ARM part, if it is planned to remove the VBATT supply and still turn on the ARM part supplied by VBATT2, then an appropriate power supply must be provided to the VRTC pin.

To obtain several working years for the Real Time Clock of the GPRS engine and the RTC, 32KHz oscillator & Shutdown controller of the ARM part without VBATT power supply voltage, it is needed to make use of a lithium primary battery to supply the RTC circuits in the Telit Module.

The operative voltage for VRTC is lower than the voltage of primary lithium battery (3V nominal). It is therefore necessary to put a LDO voltage regulator in the circuit.

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GE863

PRO

ΩΩΩΩ

1µ

1µ1µ

1µ

µΑ

µΑµΑ

µΑ

1µ

1µ1µ

1µ

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The suggested circuit is:

VRTC

10K

3V Lithium primary battery

ceramic

S-817A19A Seiko

1.2

ceramic

The quoted current intensity are without VBATT power supply for the module. The S-817A19A Seiko LDO has a value of 1.2µµµµA Typ for the quiescent current. Without VBATT power supply voltage, the VRTC Reverse Current is 7- 8 µµµµA Typ. (depending on OSCSEL pin status) At ambient temperature 20°C, the BR2032 coin type ( Panasonic 190 mAh) should be sufficient for 2-3 years with typical current intensity. The CR2032 coin type Panasonic 220 mAh) has an improved behaviour at low and high temperatures. When the VBATT voltage is present, the VRTC voltage exceeds the S-817 output voltage, so the current from the Lithium Primary Battery is only 1.2µµµµA Typ (or less).

NOTE: the 2-3 years are given considering the worst case (VBATT always off)

5.4 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design.

• the PCB layout.

5.4.1 Electrical design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

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5.4.1.1 + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the GE863-PRO3 , a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO3 from power polarity inversion.

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An example of linear regulator with 5V input is:

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5.4.1.2 + 12V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the GE863-PRO3.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO3 from power polarity inversion. This can be the same diode as for spike protection.

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An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):

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5.4.1.3 Battery Source Power Supply Design Guidelines

• The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is

4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit GE863-PRO3 module.

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the GE863-PRO3 and damage it.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE863-PRO3 . Their use can lead to overvoltage on the GE863-PRO3 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE863-PRO3

from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

• The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.

5.4.1.4 Battery Charge control Circuitry Design Guidelines

The charging process for Li-Ion Batteries can be divided into 4 phases:

• Qualification and trickle charging

• Fast charge 1 - constant current

• Final charge - constant voltage or pulsed charging

• Maintenance charge

The qualification process consists in a battery voltage measure, indicating roughly its charge status. If the battery is deeply discharged, that means its voltage is lower than the trickle charging threshold, then the charge must start slowly possibly with a current limited pre-charging process where the current is kept very low with respect to the fast charge value: the trickle charging. During the trickle charging the voltage across the battery terminals rises; when it reaches the fast charge threshold level the charging process goes into fast charge phase. During the fast charge phase the process proceeds with a current limited charging; this current limit depends on the required time for the complete charge and from the battery pack capacity. During this phase the voltage across the battery terminals still raises but at a lower rate. Once the battery voltage reaches its maximum voltage then the process goes into its third state: Final charging. The voltage measure to change the process status into final charge is very important. It must be ensured that the maximum battery voltage is never exceeded, otherwise the battery may be damaged and even explode. Moreover for the constant voltage final chargers, the constant voltage phase (final charge) must not start before the battery voltage has reached its maximum value, otherwise the battery capacity will be highly reduced.

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The final charge can be of two different types: constant voltage or pulsed. GE863-PRO3 uses constant voltage. The constant voltage charge proceeds with a fixed voltage regulator (very accurately set to the maximum battery voltage) and hence the current will decrease while the battery is becoming charged. When the charging current falls below a certain fraction of the fast charge current value, then the battery is considered fully charged, the final charge stops and eventually starts the maintenance. The pulsed charge process has no voltage regulation, instead the charge continues with pulses. Usually the pulse charge works in the following manner: the charge is stopped for some time, let's say few hundreds of ms, then the battery voltage will be measured and when it drops below its maximum value a fixed time length charging pulse is issued. As the battery approaches its full charge the off time will become longer, hence the duty-cycle of the pulses will decrease. The battery is considered fully charged when the pulse duty-cycle is less than a threshold value, typically 10%, the pulse charge stops and eventually the maintenance starts. The last phase is not properly a charging phase, since the battery at this point is fully charged and the process may stop after the final charge. The maintenance charge provides an additional charging process to compensate for the charge leak typical of a Li-Ion battery. It is done by issuing pulses with a fixed time length, again few hundreds of ms, and a duty-cycle around 5% or less. This last phase is not implemented in the GE863-PRO3 internal charging algorithm, so that the battery once charged is left discharging down to a certain threshold so that it is cycled from full charge to slight discharge even if the battery charger is always inserted. This guarantees that anyway the remaining charge in the battery is a good percentage and that the battery is not damaged by keeping it always fully charged (Li-Ion rechargeable battery usually deteriorate when kept fully charged). Last but not least, in some applications it is highly desired that the charging process restarts when the battery is discharged and its voltage drops below a certain threshold, GE863-PRO3 internal charger does it.

As you can see, the charging process is not a trivial task to be done; moreover all these operations should start only if battery temperature is inside a charging range, usually 5°C - 45°C. The GE863-PRO3 measures the temperature of its internal component, in order to satisfy this last requirement, it's not exactly the same as the battery temperature but in common application the two temperature should not differ too much and the charging temperature range should be guaranteed.

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NOTE: For all the threshold voltages, inside the GE863-PRO3 all thresholds are fixed in order to maximize Li-Ion battery performances and do not need to be changed.

NOTE: In this application the battery charger input current must be limited to less than 400mA. This can be done by using a current limited wall adapter as the power source.

NOTE: When starting the charger from Module powered off the startup will be in CFUN4; to activate the normal mode a command AT+CFUN=1 has to be provided. This is also possible using the POWER ON. There is also the possibility to activate the normal mode using the

In this case, when HW powering off the module with the same line (ON_OFF*) and having the charger still connected, the module will go back to CFUN4.

ON_OFF* signal.

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5.4.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

• Average current consumption during transmission @PWR level max: 500mA

• Average current consumption during transmission @ PWR level min: 100mA

• Average current during Power Saving: 4mA

• Average current during idle (Power Saving disabled) 24mA

• Average current consumption of ARM@ full speed 140 mA

NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 500mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 500mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the GE863-PRO3 , you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the GE863-PRO3 ; you must ensure that your application can dissipate it.

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5.4.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit GE863-PRO3 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple, provided the PCB trace from the capacitor to the GE863-PRO3 is wide enough to ensure a dropless connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure a minimum voltage drop occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit GE863-PRO3, then this noise is not so disturbing and power supply layout design can be more forgiving.

• The PCB traces to the GE863-PRO3 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.

• The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that

the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

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6 Antenna

The antenna connection and board layout design are the most important part in the full product design and they strongly reflect on the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

6.1 GSM Antenna Requirements

As suggested on the Product Description the antenna and antenna line on PCB for a Telit GE863PRO3 device shall fulfil the following requirements:

ANTENNA REQUIREMENTS

Frequency range

Bandwidth Gain

Impedance Input power VSWR absolute max VSWR recommended

When using the Telit GE863-PRO3, since there's no antenna connector on the module, the antenna must be connected to the GE863-PRO3 through the PCB with the antenna pad using a 50 Ω transmission line.

In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the GE863-PRO3, then a PCB line is needed in order to connect with it or with its connector.

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band Gain < 3dBi 50 Ω > 2 W peak power <= 10:1

<= 2:1

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This line of transmission shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS Impedance Max Attenuation No coupling with other signals allowed Cold End (Ground Plane) of antenna shall be equipotential to the GE863-PRO3 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply to the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integrators must ensure that the end user has no manual instructions to remove or install the GE863-PRO3 module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.

50 ohm 0,3 dB

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6.2 GSM Antenna - PCB line Guidelines

• Ensure that the antenna line impedance is 50 ohm;

• Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less

than 0,3 dB;

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

• Keep, if possible, one layer of the PCB used only for the Ground plane;

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other

signal tracks facing directly the antenna line track;

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least;

• Place EM noisy devices as far as possible from GE863-PRO3 antenna line;

• Keep the antenna line far away from the GE863-PRO3 power supply lines;

• If you have EM noisy devices around the PCB hosting the GE863-PRO3 , such as fast switching

ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of GE863-PRO3 , by using a strip-line on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;

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6.3 GSM Antenna - installation Guidelines

• Install the antenna in a place covered by the GSM signal.

• The Antenna must be installed to provide a separation distance of at least 20 cm from all persons

and must not be co-located or operating in conjunction with any other antenna or transmitter;

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

6.4 Electro Magnetic Interference - Guidelines

The GE863-PRO3 has been particularly designed in order to keep to a minimum the Electro Magnetic Interferences between the ARM part and the GSM/GPRS engine, however especially the ARM part remains a noisy device that must be threaten with care in order to avoid that its EMI affect the GPRS part through an external coupling.

Therefore:

• Keep fast ARM lines far away from Antenna line in order to avoid direct coupling;

• Keep fast ARM lines buried in the inner layers, with Ground Layers [fenced with vias] on the

top/bottom layers;

• If your lines are long, place a series resistor [ in the range of 47Ω – 100 Ω ] close to the GE863- PRO3 ARM ball to reduce the ringing and the EM emissions of the signal

• If your PCB lines are very long, place a terminator resistor close to the device line end.

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Input level on any

Input voltage on

Buffered

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6.5 Logic level specifications

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following table shows the logic level specifications used in the Telit GE863-PRO3 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

-0.3V +3.6V

digital pin when on

-0.3V +3.0 V analog pins when on Voltage on pins

Operating Range - Interface levels (CMOS 2.8V)

Level Min Max

Input high level 2.1V 3.3V Input low level 0V 0.5V Output high level 2.2V 3.0V Output low level 0V 0.35V

Operating Range - Interface levels (CMOS 1.8V)

Level Min Max

Input high level 1.6V 3.3V Input low level 0V 0.4V Output high level 1,65V 2.2V Output low level 0V 0.35V

Operating Range - Interface levels (CMOS 3.1V)

Level Min Max

Input high level 2.0V 3.4V Input low level -0.3V 0.8V Output high level 2.7V 3.2V Output low level 0V 0.4V

-0.3V 25V

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Operating Range - Interface levels (CMOS 1.8V-A)

Level Min Max

Input high level 1.3V 2.1V Input low level -0.3V 0.5V Output high level 1.35V 1.9V Output low level 0V 0.45V

Operating Range - Interface levels (CMOS VRTC)

Level Min Max

Input high level 1.3V 2.1V Input low level -0.3V 0.5V Output high level 1.3V 2.0V Output low level 0V 0.5V

GSM GPIO Current characteristics

Level Typical

Output Current 1mA Input Current 1uA

CMOS 3.1V Current characteristics

Level Typical

Max Output Current 16 mA Input Current 1uA

CMOS 1.8V-A Current characteristics

Level Typical

Max Output Current 4 mA Input Current 1uA

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6.5.1 GSM Reset signal

Signal Function I/O Bga Ball

RESET*-GSM

RESET*-GSM is used to reset the GE863-PRO3 modules GSM engine. Whenever this signal is pulled low, the GSM/GPRS engine is reset. When the device is reset it stops any operation. After the release of

the reset the GSM/GPRS engine is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the Reset signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The RESET*-GSM is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command.

NOTE: do not use this signal to power off the GE863-PRO3 GSM engine. Use the ON/OFF*-GSM signal to perform this function or the AT#SHDN command.

Reset Signal Operating levels:

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.

Phone reset I E5

Signal Min Max

RESET Input high 2.0V* 2.2V RESET Input low 0V 0.2V

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7 Serial Ports

The serial port on the Telit GE863-PRO3 is the core of the interface between the module engine and the ARM processor.

2 serial ports are available on the module engine:

• MODEM SERIAL PORT

• MODEM SERIAL PORT 2 (DEBUG)

6+1(DBG) serial ports are available on the ARM part. No direct connection is present between the two parts, on the hosting PCB the two serial ports need to

be interconnected. It is up to the user to select whatever serial port is most suited on the ARM part to exchange data with the GPRS engine; however the USART0 port on the ARM is the only supporting the full RS232 line signaling and should be preferred. In the ball-out of the GE863-PRO3 the balls of the MODEM SERIAL port and ARM USART0 are placed one next the other, allowing an easy routing of the connection.

7.1 MODEM SERIAL PORT

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

• RS232 PC com port

• microcontroller UART @ 2.8V – 3.1V (Universal Asynchronous Receive Transmit)

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. The only configuration that doesn't need a level translation is the 2.8V –

3.1V UART and hence the GE863-PRO3 GPRS engine can be directly connected with the ARM serial port @ 3.1V CMOS. The serial port on the GE863-PRO3 GPRS engine is a +2.8V UART with all the 7 RS232 signals, While the serial ports on the ARM part are +3.1V UART. GE863-PRO3 serial ports differ from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE863-PRO3 UART are the CMOS levels:

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The signals of the GE863-PRO3 GPRS engine serial port are:

RS232 Pin

Number

1 DCD 2 RXD 3 TXD 4 DTR 5 GND All GND Ground Ground

6 DSR 7 RTS 8 CTS 9 RI -

Signal

dcd_uart

tx_uart rx_uart

dtr_uart

dsr_uart

rts_uart cts_uart

ri_uart

GE863-PRO3

Ball

C7 Data Carrier Detect Output from the GE863-PRO3 GPRS engine that

E10 Transmit line *see Note Output transmit line of GE863-PRO3 GPRS engine

E9 Receive line *see Note Input receive of the GE863-PRO3 GPRS engine C6 Data Terminal Ready Input to the GE863-PRO3 GPRS engine that

C5 Data Set Ready Output from the GE863-PRO3 GPRS engine that C8 Request to Send Input to the GE863-PRO3 GPRS engine that C9 Clear to Send Output from the GE863-PRO3 GPRS engine that C4 Ring Indicator Output from the GE863-PRO3 GPRS engine that

Name Usage

indicates the carrier presence

controls the DTE READY condition

indicates the module is ready controls the Hardware flow control controls the Hardware flow control

indicates the incoming call condition

NOTE: According to V.24, RX/TX signal names are referred to the application side, therefore on the GE863-PRO3 GPRS engine side these signal are on the opposite direction: TXD on the ARM application side will be connected to the receive line (here named TXD/ rx_uart ) of the GE863-PRO3 GPRS engine serial port and viceversa for RX.

TIP: For a minimum implementation, only the TXD and RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.

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7.2 RS232 level translation

In order to interface the Telit GE863-PRO3 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must

• invert the electrical signal in both directions

• change the level from 0/3V to +15/-15V

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562) , allowing for a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of driver and receiver and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-3V UART level to the RS232 level, while the receiver is the translator from RS232 level to 0-3V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 driver

• 3 receiver

NOTE: The digital input lines working at 2.8V/3.1VCMOS have an absolute maximum input voltage of 3,75V; therefore the level translator IC shall not be powered by the +3.8V supply of the module. Instead it shall be powered from a +2.8V / +3.1V (dedicated or 3.1V_OUT) power supply. This is because in this way the level translator IC outputs on the module side (i.e. GE863-PRO3 inputs) will work at +3.8V interface levels, stressing the module inputs at its maximum input voltage. This can be acceptable for evaluation purposes, but not on production devices.

NOTE: In order to be able to do in circuit reprogramming of the GE863-PRO3 GPRS firmware, the serial port on the Telit GE863-PRO3 shall be available for translation into RS232 and either it's controlling ARM device shall be placed into tristate, disconnected or as a gateway for the serial data when module reprogramming occurs. Only RXD, TXD, GND and the On/off module turn on pad are required to the reprogramming of the module, the other lines are unused. All applicator shall include in their design such a way of reprogramming the GE863-PRO3 .

NOTE: In order to be able to do in circuit reprogramming of the GE863-PRO3 ARM Application software, the serial port DEBUG on the Telit GE863-PRO3 shall be available for translation into RS232 when module reprogramming occurs. Only DRXD, DTXD, GND and the On/off*-AP module turn on pad are required to the reprogramming of the module, the other lines are unused. All applicator shall include in their design such a way of reprogramming the GE863-PRO3.

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An example of level translation circuitry of this kind is:

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The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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8 Audio Section Overview

The Base Band Chip of the GE863-PRO3 GPRS engine provides two different audio blocks; both in transmit (Uplink) and in receive (Downlink) direction:

“MT lines” should be used for handset function, “HF lines” is suited for hands -free function (car kit).

These two blocks can be active only one at a time, selectable by AT command. The audio characteristics are equivalent in transmit blocks, but are different in the receive ones and this should be kept in mind when designing.

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8.1 Microphone Paths Characteristic and Requirements

TIP: being the microphone circuitry the more noise sensitive, its design and layout must be done with particular care. Both microphone paths are balanced and the OEM circuitry should be balanced designed to reduce the common mode noise typically generated on the ground plane. However also an unbalanced circuitry can be used for particular OEM application needs .

TIP: due to the difference in the echo canceller type, the “Mic_MT” audio path is suited for Handset applications, while the “Mic_HF”audio path is suited for hands-free function (car kit). The Earphone applications should be made using the “Mic_HF” audio path but DISABLING the echo canceller by software AT command. If the echo canceller is left active with the Earphone, then some echo might be introduced by the echo cancel algorithm.

“Mic_MT” 1st differential microphone path

• line coupling AC

• line type balanced

• coupling capacitor ≥ 100nF

• differential input resistance 50kΩ

• differential input voltage ≤ 1,03Vpp (365mV

• microphone nominal sensitivity -45 dBV

• analog g

ain suggested

+ 20dB

/Pa

rms

• echo canceller type handset

“Mic_HF” 2nd differential microphone path

• line coupling AC

• line type balanced

• coupling capacitor ≥ 100nF

• differential input resistance 50kΩ

• differential input voltage ≤ 65mVpp (23mV

• microphone nominal sensitivity -45 dBV

rms

/Pa

• analog

gain suggested

+10dB

• echo canceller type car kit hands-free

rms

)

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(

)

[

]

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TIP: definition of the nominal sensitivity of the microphone lines .

The nominal sensitivity of the microphone lines indicates the voltage level on the GE863-PRO3 pins present during "normal spoken" conditions. For a handset , the "normal spoken” conditions take place when the talker mouth is 7cm far from the microphone ; under these conditions the voice will produce an acoustic pressure of -4,7dBPa @1kHz on the microphone membrane .

TIP: electrical equivalent signal and operating voice levels .

At "normal spoken" conditions, a microphone having the suggested nominal sensitivity of - 45dBV

/Pa , will produce

rms

the electrical equivalent signal :

that means :

MicLevel = ( -45) + (-4.7) = -49.7 dB

MicVoltage = 10

= 3.3* 10

During a call, this level varies according to the volume of the talker voice; usually the following rough thumb rule for the dynamic range may be used :

1) the talker is screaming . This is the strongest voice level condition: the signal increases by +20dB;

2) the talker is whispering. This is the lowest voice level condition: the voice level decreases by – 50dB.

These changes must be considered for designing the external microphone amplifier.

TIP: example of external microphone amplifier calculation .

Let’s suppose to use the 1stdifferential microphone path .In this case the maximum differential input voltage to “Mic_MT” lines is 365mV Now we can calculate the maximum voltage gain of an external microphone amplifier GA :

94,20=

G−=+− 209,40

dBG

you can set GA= +20dB to use standard resistor values .

76,8207,49 −=++−

76,820 −=++

(1,03Vpp) corresponding to –8,76dBV.

rms

dBVGdBMicLevel

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TIP: environment consideration .

For hands-free/car kit microphone, you must take into account the voice attenuation, due to the distance between the microphone itself and the talker, when designing the external microphone amplifier. Not only, you must consider that the microphone will pick up also ambient noise; to overcome this problem it is preferable to set the gain of the microphone 10dB lower with respect to the calculated value for a nominal sensitivity. The corresponding reduction in signal level will be compensated by an increased voice volume of the talker which will speak louder because of the ambient noise. For a car cabin usually the distance between the microphone itself and the talker is 40/50cm ; in these conditions the attenuation can be considered as a thumb rule around 20dB .

For the earphone we shall distinguish two different types: the earphones having the microphone sustained close to the mouth and the ones having the microphone on the earpiece cable. The same considerations for the additional voice attenuation due to the distance from the microphone and the noise pick up can be made for the earphone having the microphone on the earpiece cable, while the other kind of earphone shall be threaten as a handset.

TIP: how to compensate the losses in car cabin hands-free condition.

The voice signal , that in the "normal spoken” conditions produces on the microphone membrane an acoustic pressure of -4,7dBPa at 1kHz , will have a further attenuation of 20dB due the 50cm distance .

Therefore a microphone having the suggested nominal sensitivity of -45dBV

/Pa,will produce a lower

rms

electrical equivalent signal :

MicLevel = ( -45) + (-4.7)-20 = -69.7

that means :

MicVoltage = 10

= 0,33* 10

Setting the “microphone gain” at +10dB (3 times), the signal in the nominal conditions on the “Mic_HF” inputs s of GE863-PRO3 Telit Module will be :

“Mic_HF” Level = 0,33* 10

* 3=1* 10

Hence in these conditions the signal level on the“Mic_HF” input pads of the GE863-PRO3 is 10 dB (3 times) lower than the nominal, as suggested.

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8.2 General Design Rules

There are several configurations for the audio paths, but the most effective difference is between balanced and unbalanced microphone configuration. It is highly recommended to keep the whole microphone path balanced even if this means having 2 wires connecting the microphone instead of one needed (plus ground) in the unbalanced case. The balanced circuitry is more suited because of its good common mode noise rejection, reducing the 216 Hz burst noise produced during the GSM transmissions.

• Where possible use balanced microphone circuitry

• Keep the microphone traces on the PCB and wires as short as possible.

• If your application requires an unbalanced microphone, then keep the lines on the PCB balanced

and "unbalance" the path close to the microphone wire connector if possible.

• For the microphone biasing voltage use a dedicated voltage regulator and a capacitor multiply circuit.

• Make sure that the microphone traces in the PCB don't cross or run parallel to noisy traces (especially the power line)

• If possible put all around to the microphone lines a ground trace connected to the ground plane by several vias. This is done in order to simulate a shielded trace on the PCB.

• The biasing circuit and eventually the buffer can be designed in the same manner for the internal and external microphones.

8.3 Other considerations

If your application is a hands-free/car kit scenario , but you need to put microphone and speaker inside the same box :

• try to have the maximum possible distance between them, at least 7cm ;

• since the microphone type is very important, if you use an omni-directional one ( and this is the

typical application ) please seal it on the rear side (no back cavity) in order not to collect unwanted signals ;

• try to make divergent the main axes of the two devices .

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8.4 Microphone Biasing

The electret microphones usually need a biasing voltage to work properly. Refer to your microphone provider for the characteristics required.

NOTE: The microphones have a hot wire were the positive biasing must be connected. Usually it is indicated by a + symbol or a red point. If the polarity of the bias is reversed, then the microphone will not work properly. For this reason be sure to respect the mic. biasing polarity.

8.4.1 Balanced Microphone Biasing

The balanced microphone bias voltage should be obtained from a dedicated voltage regulator, in order to eliminate the noise present on the power lines. This regulator can be the same for all the audio paths. The microphone should be supplied from a capacitor multiply circuit. For example a circuit for the balanced microphone biasing can be:

NOTE: In the balanced application the resistors R2 and R3 must have the same value to keep the circuit balanced.

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NOTE: The cable to the microphone should not be shielded, instead a twisted pair cable shall be used.

NOTE: The microphone sensitivity changes with the value of R2 and R3. Usually the microphones are characterized with 2kΩ biasing resistance, so try to keep the sum of R2 and R3 around 2kΩ. Refer to your microphone manufacturer for the mic. characteristics.

8.4.2 Unbalanced Microphone Biasing

The unbalanced microphone biasing voltage should be obtained from a dedicated voltage regulator, in order to eliminate the noise present on the power lines. This regulator can be the same for all the audio paths. The microphone should be supplied from a capacitor multiply circuit. For example a circuit for the unbalanced microphone biasing can be:

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NOTE: In the unbalanced application the capacitor C3 shall be > 200nF otherwise the frequency response will be cut at low band frequencies (down to 300Hz). This capacitor can be placed close to the MIC- pad (MIC_HF- or MIC_MT- depending on the audio path chosen) or if possible it should be placed close to the shielded cable connector. If the ground return path is well designed, then it is possible to eliminate the C3 capacitor, provided the buffer is close to the mic. input.

NOTE: The cable to the microphone should be shielded.

NOTE: The microphone changes with the value of R2. Usually the microphone sensitivity is characterized with 2kΩ biasing resistance, so try to keep the value of R2 around 2kΩ. For mic. characteristics refer to the manufacturer.

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8.5 Microphone Buffering

As seen previously, a microphone shall be connected to the input pins of the GE863-PRO3 through a buffer amplifier that boosts the signal level to the required value. Again the buffered microphone circuitry can be balanced or unbalanced: where possible it is always preferable a balanced solution. The buffering circuit shall be placed close to the microphone or close to the microphone wire connector.

8.5.1 Buffered Balanced Mic

A sample circuit can be:

+20dB

15K

270pF

15K

270pF

This circuit has a gain of 10 times (+20 dB), and is therefore suited for the “Mic_MT “ input if you have a microphone with a sensitivity close to the suggested one (-45 dBV

Pa). If your microphone has a

rms/

different sensitivity or if the buffer is connected to the “Mic_HF “ inputs , then a gain adjustment shall be done by changing resistors R604 and R606 ( if the required value is not a standard one , you can change R605 e R607 ) and as a consequence the capacitors C636 and C637 to maintain the bandwidth 150-4000Hz (at -3dB).

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607

605

636*606*21637*604*2

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The buffer gain is given by the formula:

Gain ==

604RR

606

The C636 and C637 capacitors are placed in order to cut off the gain at higher frequencies than the transmitted GSM band, the cutoff frequency (-3dB) should be 3500Hz in order to have -1dB at 3kHz. The cutoff frequency is given by the formula:

freq

[Hz]

ππ

TIP: example of calculation .

Let's assume you have a microphone with a sensitivity of -45 dBV differential microphone path (“Mic_MT” inputs) in "normal spoken" conditions at acoustic pressure of

-4.7dBPa. As reported at page 33 , the electrical level output from the microphone will be :

MicLevel = ( -45) + (-4.7) = -49.7 dB

corresponding to:

MicVoltage = 10

= 3.3* 10

When the talker is screaming ,we will have a signal of 330 mV

rms

20dB higher Mic Level (see TIP 1) with a buffer gain GA :

GA =20 log (AmplifierOutput / MicVoltage) =20 log (330 * 10 -3 )/( 33 * 10 -3 ) = 20 log 10=20dB

The corresponding values for the resistors on the buffer could be ( if we keep the input resistance 10kΩ )

R604 = R606 = gain* R607= gain* R605 = 10* 15 = 150 kΩ The commercial values of 150kΩ & 15kΩ are then chosen. As a consequence the values of the capacitors C636 and C637 shall be:

C636=C637= 1/ (2π*4000*R606)= 265 *10

A commercial value of 270pF gives a cutoff frequency of 3931Hz with an errorless than 1,8% .

/Pa and you want to use it in 1st

rms

on the “Mic_MT “ inputs due to a

-12

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GE863

Mic+

2,7nF

6,8nF

GE863

Mic-

The above schematic can be used for a single ended (buffered unbalanced) microphone; the required biasing circuitry is not included. Note also that the capacitor C3 is not needed. The gains of the two amplifiers are given by the formulas:

719

( )

Gain +=

1buffer invertingnot

( )

Gain =

buffer inverting

711

Assigning half of overall gain to each amplifier, you will obtain the requested gain because of doubling the microphone signal path; in fact by the use of two amplifiers (the upper as “inverting” and the lower as “not inverting” configuration ) we obtain an additional +6dB gain (2 times) .

Remember: the “not inverting“ amplifier section gain shall not be less than 1 . Like for the balanced buffered microphone, the amplifier overall gain can be modify changing the value of resistor R719/R720 and R711 and as a consequence the capacitors C726 and C727. It is advisable to change R708 only if you have difficulty to find a commercial value for R711; in this case change R708 as little as possible.

The -3dB bandwidth is given by the approximated formula (considering C725 >> C726):

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ππ

The buffer bandwidth at -3dB shall be 4KHz. Note that the biasing of the operational amplifier is given for the inverting amplifier by the series divider R714-R715. The 100nF capacitor C719 is needed to filter the noise that could be coupled to that divider. For the not inverting operational amplifier the biasing is given by a different divider R715-R717 with the capacitor C720 and through a series resistor R718 of 470KΩ.

TIP: example of calculation.

Llet's assume you have a microphone with a sensitivity of -45dBV differential microphone path (“Mic_HF” inputs) in "normal spoken" conditions at acoustic pressure of -4.7dBPa. As reported at page XX , the electrical level output from the microphone will be :

MicLevel = ( -45) + (-4.7) = -49.7 dBV

but we have to consider 20dB loss due to the higher distance from the mouth of the talker ( 50cm ) .

MicLevel = ( -49.7) + (-20) = -69.7 dBV

corresponding to

MicVoltage = 10

= 0,33* 10

In order to have a signal of 1 mV

at the “Mic_HF” inputs , as suggested at TIP “environment

rms

consideration “, the buffer must have a gain or +10 dB

GA= “Mic_HF /MicVoltage = (1*10

Keeping in mind that “ balancing the line will double the signal”, to calculate the resistor values assign half of required gain G

to each amplifier section . And therefore GS =1,5times (or +3,52dB) .

Choosing as 10kΩ as the input resistance , the corresponding values for the resistors on the buffer will be :

R711 = GS * R708= 1.5*10 =15 kΩ

R719 = (GS -1) * R720 = (1.5 -1)*10 =5 kΩ

The commercial values of 15kΩ and 5.6kΩ be accepted . As a consequence of the assigned values of the resistors, the nominal values of C726 and C727 are :

/Pa and you want to use it in 2nd

rms

)/(0,33*10

)=3

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C726= 1/ (2π*4000*R719)= 7.10 *10 -9 F C727= 1/ (2π*4000*R711)= 2,65 *10 -9 F

modified in 6,8nF (fc1=4181Hz ) and 2,7nF (fc2=3931Hz) because of commercial values .

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9 OUTPUT LINES (Speaker)

9.1 Short description

The Telit GE863-PRO3 provides two audio paths in receive section. Only one of the two paths can be active at a time, selectable by AXE hardware line or by AT command.

You must keep in mind the different audio characteristics of the receive blocks when designing:



the “Ear_MT” lines EPN1 and EPP1 are the Differential Line-Out Drivers ; they can drive an external amplifier or directly a 16 Ω earpiece at –12dBFS (*) ;  the “Ear_HF” lines EPPA1_2 and EPPA2 are the Fully Differential Power Buffers ; they can directly drive a 16Ω speaker in differential (balanced) or single ended (unbalanced) operation mode .

(*) FS : acronym of Full Scale. It is equal to 0dB, the maximum Hardware Analog Receive Gain of BaseBand Chip.

The “Ear_MT” audio path should be used for handset function, while the “Ear_HF” audio path is suited for hands-free function (car kit).

Both receiver outputs are B.T.L. type (Bridged Tie Load) and the OEM circuitry shall be designed bridged to reduce the common mode noise typically generated on the ground plane and to get the maximum power output from the device; however also a single ended circuitry can be designed for particular OEM application needs.

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9.2 Output Lines Characteristics

“Ear_MT” Differential Line-out Drivers Path

• line coupling: DC

• line type: bridged

• output load resistance : ≥ 14 Ω

• internal output resistance: 4 Ω (typical)

• signal bandwidth: 150 - 4000 Hz @ -3 dB

• max. differential output voltage 1310 mV

• differential output voltage 328mVrms /16 Ω @ -12dBFS

• SW volume level step - 2 dB

• number of SW volume steps 10

“Ear_HF” Power Buffers path

• line coupling: DC

• line type: bridged

• output load resistance : ≥ 14 Ω

• internal output resistance: 4 Ω ( >1,7 Ω )

• signal bandwidth: 150 - 4000 Hz @ -3 dB

• max. differential output voltage 1310 mV

• max. single ended output voltage 656 mV

• SW volume level step - 2 dB

• number of SW volume steps 10

(typ, open circuit)

rms

(typ, open circuit)

rms

(typ, open circuit)

rms

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9.3 General Design Rules

There are several configurations for the audio output path, but the various design requirements can be grouped into three different categories:

• handset earphone (low power, typically a handset)

• hands-free earphone (low power, typically a earphone)

• car kit speakerphone (high power, typically a speaker)

The three groups have different power requirements, usually the first two applications need only few mW of power, which can be directly drained from the GE863-PRO3 pads, provided a suited speaker is used. This direct connect design is the cheaper and simpler solution and will be suited for the most of the earphone design requirements. There's no need to decouple the output ear lines if a suited earpiece is connected. For the last group, the speakerphone, a power amplifier is required to raise the output power up to 5-10W required in a car cabin application. All the designs shall comply with the following guidelines:

• Where possible use a bridged earphone circuitry, to achieve the maximum power output from the device.

• Keep the earphone traces on the PCB and wires as short as possible.

• If your application requires a single ended earpiece and you want a direct connection, then leave

one of the two output lines open and use only the other referred to ground. Remember that in this case the power output is 4 times lower than the bridged circuit and may not be enough to ensure a good voice volume.

• Make sure that the earphone traces in the PCB don't cross or run parallel to noisy traces (especially the power line)

• The cable to the speaker shall be a twisted pair with both the lines floating for the bridged output type, shielded with the shield to ground for the single ended output type.

9.3.1 Noise Filtering

The I/O of the PCB should have a noise filter close to the connector, to filter the high frequency GSM noise. The filter can be a Π formed by 2 capacitor and a inductance, with the one capacitor of 39pF - 0603 case, and the other capacitor of 1nF - 0603; the inductance shall have a value of 39µH .

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9.4 Handset Earphone Design

As seen previously, a 16Ω earpiece can be directly connected to the output pads EAR_MT+ and EAR_MT- of the GE863-PRO3. This solution is often the more cost effective, reducing the components count to a minimum. There are several limitations to the use of this solution: speaker direct connect imposes the speaker characteristics to be almost exactly the suggested ones, otherwise the power output may be reduced (if speaker impedance is bigger than 16Ω) or the GE863-PRO3 ear port may be damaged (if speaker impedance is less than 15Ω). The other limitation of the speaker direct connection is the power output capability of the GE863- PRO3 which is limited and for some particular applications may not be enough. For these reasons, when the power output of the GE863-PRO3 is not enough or if the speaker characteristics are different from the suggested, then it is preferable to use an amplifier to increase the power and current output capabilities. Again the output from the GE863-PRO3 is bridged and both lines should be used, where possible, as inputs to the power amplifier. This ensures a higher common mode rejection ratio, reducing the GSM current busts noise on the speaker output. In this case the “EAR_MT” lines from the GE863-PRO3 should be AC coupled with a ceramic capacitor of 100nF (or bigger ) . It is always desirable to have a mute control on the amplifier, in order to turn it off while the device is not sending signal to the output, in this manner the amplifier background noise which may be audible during idle conditions is cut off. A principle schematic may be:

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The resulting gain and high pass cut can be obtained with the formula:

Gain =

freqπ=

And an example of internal Ear amplifier could be:

[Hz]

+12dB

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GE863-PRO3

Some amplifier require a low impedance load at high frequency in order to avoid auto oscillation, this can be made with a capacitor (100nF) in series with a resistor (15Ω).

When designing your application, remember to provide an adequate bypass capacitor to the amplifier and place it close to the power input pin of the IC, keeping the traces as short as possible.

9.5 Hands-Free Earphone (Low Power) Design

The same design considerations made for the handset are valid for the hands-free earphone.

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9.6 Car Kit Speakerphone Design

For the car kit speaker phone function the power output requirement is usually at least 4W, therefore an amplifier is needed to boost the GE863-PRO3 output. The design of the amplifier shall comply with the following guidelines:

• The input to the amplifier MUST be taken from the “Ear_HF” audio path of the GE863-PRO3, because of its echo canceller parameters suited to a car cabin use.

• The amplifier shall have a gain of 30-40 times (29-32 dB) to provide the desired output power of 510W with the signal from the GE863-PRO3 “Ear_HF” audio output lines.

• If the amplifier has a fixed gain then it can be adjusted to the desired value by reducing the input signal with a resistor divider network.

• The amplifier shall have a mute control to be used while not in conversation. This results in two benefits: eliminating the background noise when not in conversation and saving power.

• The power to the amplifier should be decoupled as much as possible from the GE863-PRO3 power supply, by either keeping separate wires and placing bypass capacitors of adequate value close to the amplifier power input pads.

• The biasing voltage of the amplifier shall be stabilized with a low ESR (e.g. a tantalum) capacitor of adequate value.

NOTE: The GE863-PRO3 audio path connected to the car kit hands-free amplifier MUST be “Ear_HF” one, otherwise the echo cancellation will not be done due to the difference in the echo canceller characteristics of the GE863-PRO3 internal audio path from the external audio path.

Example of car kit amplifier schematic.

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9.7 The Evaluation Kit for Telit GE863-PRO3 Modules

9.7.1 Short Description

Telit supplies the Evaluation Kit for Telit GE863-PRO3 modules to assist the designer in developing his own applications based on GE863-PRO3 Telit module.

The GE863-PRO3 EVK is formed by a mother board and a dedicated Telit module Interface Board with RF antenna connectors. It provides a fully functional solution for a complete M2M application. The motherboard has a power supply and is equipped with SIM card housing, RS 232 serial port level translator, direct USB2.0 Host & Device connection, Smartcard ISO7816 slot, SD-MMC Card slot and 10/100 Mb Ethernet.

The only items you have to provide are:

1) a personal computer or microcontroller ;

2) a SIM card with a valid Network subscription;

3) a power supply

The connection between the GE863-PRO3 EVK and your PC (or other DTE) are realized by standard RS232 ports.

The communications between the application ARM and Telit GPRS Engine is realized connecting the Asynchronous Serial Interfaces of the module’s ARM&GSM/GPRS by setting appropriately the Jumpers. Furthermore the communications between ARM and GSM/GPRS can be analyzed with two “sniffed” serial ports that can report both sides of the ARM-GSM/GPRS serial channel.

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10 General Purpose I/O

The general purpose I/O pads can be configured to act in three different ways:

• input

• output

• alternate function (internally controlled)

The following GPIO are available on the GE863-PRO3 :

Ball Signal I/O Function Type

E6 55 32

53 54

5 4

GPIO1 I/O GPIO01 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW GPIO2 I/O GPIO02 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT HIGH HIGH 4.7K Pull Up GPIO3 I/O GPIO03 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

GPIO4 I/O GPIO05 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW GPIO5 I/O GPIO06 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

GPIO6 I/O GPIO07 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

GPIO7 I/O GPIO08 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

GPIO8 I/O GPIO09 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW GPIO9 I/O GPIO10 Configurable GPIO CMOS 2.8V 1uA / 1mA INPUT LOW

Input / output

current

Default

State

Input pads can only be read and report the digital value (high or low) present on the pad at the read time; output pads can only be written or queried and set the value of the pad output; an alternate function pad is internally controlled by the GE863-PRO3 firmware and acts depending on the function implemented.

ON_OFF

state

State

during

Reset

Note

Alternate function

(JDR)

Alternate function

(RFTXMON)

Alternate function

(BUZZER)

Alternate function (RF Transmission

Control)

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All GPIO pads are 2.8V CMOS signals and their interface levels are the same specified in the paragraph 6.5.

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10.1 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 2.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 2.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to

2.8V.

10.2 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.

10.3 Using the RF Transmission Control GPIO7

The GPIO7 pin, when configured as RF Transmission Control Input, permits to disable the Transmitter when the GPIO is set to Low by the application.

10.4 Using the RFTXMON Output GPIO3

The GPIO3 pin, when configured as RFTXMON Output, is controlled by the GE863-PRO3 module and will rise when the transmitter is active and fall after the transmitter activity is completed. For example, if a call is started, the line will be HIGH during all the conversation and it will be again LOW after hanged up.

The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1sec after last TX burst.

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10.5 Using the Alarm Output

The GPRS Engine GPIO pads, when configured as Alarm Output, can be controlled by the GE863PRO3 module and will rise when the alarm starts and fall after the issue of a dedicated AT command. This output can be used to power up the GE863-PRO3 application processor at the alarm time, giving you the possibility to program a timely system wake-up to achieve some periodic actions and completely turn off both the application processor and the GE863-PRO3 during sleep periods, dramatically reducing the sleep consumption to few µA. In battery-powered devices this feature will greatly improve the autonomy of the device.

10.6 Using the Buzzer Output GPIO4

The GPIO4 pad, when configured as Buzzer Output, is controlled by the GE863-PRO3 module and will drive with appropriate square waves a Buzzer driver. This permits to your application to easily implement Buzzer feature with ringing tones or melody played at the call incoming, tone playing on SMS incoming or simply playing a tone or melody when needed by your application.

A sample interface scheme is included below to give you an idea of how to interface a Buzzer to the GPIO7:

NOTE: To correctly drive a buzzer a driver must be provided, its characteristics depend on the Buzzer and for them

refer to your buzzer vendor.

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10.7 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. In the GE863 modules, the STAT_LED usually needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.

LED status Device Status Permanently off Device off Fast blinking

(Period 1s, Ton 0,5s) Slow blinking (Period 3s, Ton 0,3s) Permanently on a call is active

Net search / Not registered / turning off Registered full service

10.8

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RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

10.9 VAUX1 power output

A regulated power supply output is provided in order to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are:

Operating Range – VAUX1 power supply

Min Typical Max Output voltage Output current Output bypass capacitor

2.75V 2.85V 2.95V 100mA

2.2µF

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11 Mounting the GE863-PRO3 on the

Application Board

11.1 General

The Telit GE863-PRO3 module has been designed in order to be compliant with a standard lead-free SMT process

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11.1.1 Recommended footprint for the application

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11.1.2 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm.

11.1.3 PCB pad Design

“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

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Recommendations for PCB pad dimensions

Ball pitch [mm] Solder resist opening diameter A [mm] Metal pad diameter B [mm]

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

2,4 1,10 1 ± 0.05

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Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni / Immersion Au

3 –7 /

0.05 – 0.15

good solder ability protection, high shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

11.1.4 Solder paste

Solder paste

Lead free

Sn/Ag/Cu

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11.1.5 GE863-PRO3 Solder Reflow

The following is the recommended solder reflow profile

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Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP)

Preheat: – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts)

Tsmax to TL: – Ramp-up Rate

Time maintained above: – Temperature (TL) – Time (tL)

Peak Temperature (Tp):

Time within 5°C of actual Peak Temperature (tp)

Ramp-down Rate

3°C/second max

150°C 200°C

60-180 seconds

3°C/second max

217°C

60-150 seconds

245 +0/-5°C

10-30 seconds

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE863-PRO3 module can accept only one reflow process

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320 ± 0,3

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11.1.6 Packing System

According to SMT processes for pick & place movement requirements, Telit GE863-PRO3 modules are packaged on trays, each tray contains 20 pieces. Tray dimensions are:

Note that trays can withstand a maximum temperature of 65° C.

All quotes are in mm, general tolerance ± 0.1

Section A-A

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Modules orientation on tray:

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Ref. Not rounded corner of module’s printed board indicates pin 1 corner.

The modules in the tray are oriented as shown in A and the tray is oriented toward left as shown in B.

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11.1.7 Moisture Sensibility

The level of moisture sensibility of Telit GE863-PRO3 modules is “3”, according with standard IPC/JEDEC J-STD-020, take care of all the relative requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions: a) The shelf life of GE863 inside of the dry bag shall be 12 month from the bag seal date, when stored

in a non-condensing atmospheric environment of <40°C / 90% RH b) Environmental condition during the production: ≤ 30°C / 60% RH according to IPC/JEDEC J-STD-

033A paragraph 5 c) The maximum time between the opening of the sealed bag and the reflow process shall be 168

hours if the condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) A baking is required if conditions b) or c) are not respected e) A baking is required if the humidity indicator inside the bag indicates 10% RH or more

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12 Conformity Assessment Issues

The GE863-PRO3 module is assessed to be conform to the R&TTE Directive as stand-alone product, so If the module is installed in conformance with Telit installation instructions it will require no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of a R&TTE Directive Notified Body for the final product. In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive.

In all cases assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements.

The GE863-PRO3 module is conform with the following European Union Directives:

• R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)

• Low Voltage Directive 73/23/EEC and product safety

• Directive 89/336/EEC for conformity for EMC

In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the GE863-PRO3 module is compliant with the following standards:

• GSM (Radio Spectrum). Standard: EN 301 511 and 3GPP 51.010-1

• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-7

• LVD (Low Voltage Directive) Standards: EN 60 950

In this document and the Hardware User Guide, all the information you may need for developing a product meeting the R&TTE Directive is included.

Furthermore the Telit GE863-PRO3 modules are FCC Approved as module to be installed in other devices. These devices have to be used only for fixed and mobile applications. If the final product after

integration is intended for portable use, a new application and FCC ID is required.

The GE863-PRO3 module is conform with the following US Directives:

• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM850 - GSM 1900)

• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telit Communications S.p.A. may void the user’s authority to operate the equipment.

To meet the FCC's RF exposure rules and regulations:

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- The system antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all the persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

- The system antenna(s) used for this module must not exceed 3 dBi for mobile and fixed or mobile operating configurations.

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and to have their complete product tested and approved for FCC compliance.

The Telit GE863-PRO3 module complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

• this device may not cause harmful interference, and

• this device must accept any interference received, including interference that may

cause undesired operation. For questions regarding your product or this FCC declaration, contact: Telit wireless solutions Inc.

Americas 3131 RDU Center Drive,

USA – 27560 Morrisville, NC 27560, USA Phone: +1 888 846 9773 Fax: + 1 888 846 9774 e-mail: americas.info@telit.com

To identify this product, refer to the Part, Series, or Model number found on the product.

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13 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc It is responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the

product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

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14 Document Change Log

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RReevviissiioonn DDaattee

ISSUE #0 21/01/08 First release ISSUE #1 11 - Mounting the GE863-PRO3 on the Application Board – updated

CChhaannggeess

12 - Conformity Assessment Issues updated

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GE863-PRO3 Product Description

80285ST10036a Rev. 1 DRAFT- 24/04/08

Page 85

This document is relating to the following products:

GE863-PRO3 Product Description

80285ST10036a Rev. 1 DRAFT- 24/04/08

GE863-PRO3 3 990 250 691

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Contents

GE863-PRO3 Product Description

80285ST10036a Rev. 1 DRAFT- 24/04/08

1 Overview ...........................................................................................................................7

2 General Product Description.........................................................................................11

2.1 Dimensions ........................................................................................................................ 11

2.2 Weight ................................................................................................................................ 13

2.3 Environmental requirements ............................................................................................ 14

2.3.1

Temperature range.........................................................................................................................14

2.3.2

Vibration Test (non functional)........................................................................................................14

2.3.3

RoHS compliance...........................................................................................................................14

3 GSM/GPRS Engine.........................................................................................................15

3.1 Operating Frequency......................................................................................................... 15

3.2 Transmitter output power.................................................................................................. 15

3.3 Reference sensitivity......................................................................................................... 15

3.4 Antenna.............................................................................................................................. 16

3.4.1

GSM Antenna .................................................................................................................................16

3.5 Supply voltage................................................................................................................... 16

3.6 Power consumption........................................................................................................... 16

3.7 Embodied Battery charger................................................................................................ 17

3.8 User Interface..................................................................................................................... 17

3.9 Speech Coding................................................................................................................... 17

3.10 SIM Reader......................................................................................................................... 18

3.11 SMS..................................................................................................................................... 18

3.12 Real Time Clock and Alarm............................................................................................... 18

3.13 Data/fax transmission........................................................................................................ 19

3.14 Local security management.............................................................................................. 19

3.15 Call control......................................................................................................................... 19

3.16 Phonebook......................................................................................................................... 19

3.17 Characters management................................................................................................... 19

3.18 SIM related functions......................................................................................................... 19

3.19 Call status indication......................................................................................................... 20

3.20 Automatic answer (Voice, Data or FAX)........................................................................... 20

3.21 Supplementary services (SS)............................................................................................ 20

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3.22 Acoustic signalling............................................................................................................ 20

3.23 Buzzer output..................................................................................................................... 21

3.24 RF Transmission Monitor.................................................................................................. 21

3.25 EMC .................................................................................................................................... 21

3.26 Logic level specifications.................................................................................................. 21

3.27 Reset signal ....................................................................................................................... 21

3.28 RTC Bypass out................................................................................................................. 22

3.29 VAUX1 power output......................................................................................................... 22

3.30 Audio levels specifications............................................................................................... 23

3.31 Software Features.............................................................................................................. 24

3.31.1 Enhanced Easy GPRS Extension ..................................................................................................24

3.31.1.1 Overview.................................................................................................................................24

3.31.1.2 Easy GPRS definition .............................................................................................................25

3.31.2 Multisocket......................................................................................................................................25

3.31.3 Jammed Detect & Report Extension...............................................................................................27

3.31.3.1 Overview.................................................................................................................................27

3.31.4 CMUX .............................................................................................................................................27

3.31.4.1 Product architecture................................................................................................................27

3.31.4.2 Implementation feature and limitation.....................................................................................28

3.31.5 SAP: SIM Access Profile ................................................................................................................29

3.31.5.1 Product architecture................................................................................................................29

3.31.5.2 Implementation feature...........................................................................................................29

3.31.5.3 Remote SIM Message Command Description .......................................................................29

3.31.6 AT Commands................................................................................................................................30

4 ARM9 Application Engine..............................................................................................31

4.1 General Description........................................................................................................... 31

4.2 Supply voltage................................................................................................................... 31

4.3 Power consumption........................................................................................................... 31

4.4 USARTs.............................................................................................................................. 32

4.5 SPI bus ............................................................................................................................... 32

4.6 Image Sensor Interface ..................................................................................................... 32

4.7 IIC bus ................................................................................................................................ 33

4.8 ISO7816 T0/T1 Interface .................................................................................................... 33

4.9 MultiMedia Card interface ................................................................................................. 33

4.10 Sinchronous Serial Controller .......................................................................................... 33

4.11 Ethernet controller............................................................................................................. 34

4.12 ADC with ADC trigger........................................................................................................ 34

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4.13 DAC Converter................................................................................................................... 34

4.14 USB Device port................................................................................................................. 35

4.15 USB Host port .................................................................................................................... 35

4.16 Clock outputs..................................................................................................................... 35

4.17 GPIO ports.......................................................................................................................... 35

4.18 JTAG Debug Interface ....................................................................................................... 36

4.19 Debug UART....................................................................................................................... 36

5 Mounting the GE863-PRO3 on the Application Board.................................................37

5.1.1

General...........................................................................................................................................37

5.1.2

Packing system...............................................................................................................................37

6 Evaluation Kit EVK-PRO3...............................................................................................40

7 Conformity Assessment Issues....................................................................................41

7.1 GE863-PRO3: Conformity Assessment............................................................................. 43

7.2 GE863-PRO3 : FCC Equipment Authorization................................................................. 45

7.3 GE863- PRO3 : IC Equipment Authorization..................................................................... 46

7.4 GE863-PRO3: RoHS certificate.......................................................................................... 47

8 Safety Recommandations .............................................................................................48

9 GE863-PRO3 Technical Support....................................................................................49

10 List of acronyms.............................................................................................................50

11 Document Change Log..................................................................................................53

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DISCLAIMER

The information contained in this document is proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

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Managemen

Power

8MB

4MB

Management

Power

Antenna Conn.

Bus

Processor

GSM/GPRS Baseband

Oscillator

26MHz

External Interconnections between ARM processor and GSM/GPRS baseband

GE863-PRO3 Product Description

80285ST10036a Rev. 1 DRAFT- 24/04/08

1 Overview

The GE863-PRO3 is the Telit latest product generation deriving from the top reliable BGA GE863 product family now including a quad-band GSM/GPRS class 10 engine as well as a dedicated ARM9 application processor (the ATMEL standard microcontroller AT91SAM9260) and FLASH & RAM memories.

SDRAM

Data

ARM9 AT91SAM9260

Peripherals

FLASH

internal 32KHz

SPI

GGEE886633--PPRRO

6 MHz

Ball Grid Array

GSM Radio

Crystal

32 KHz

Crystal

Supply ARM

Supply GSM

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This innovative dual core architecture allows one consistent product for all global GSM networks that is also capable of managing complex and demanding customer applications, giving impressive advantages in terms of

 final application time-to-market

 final application cost reduction by saving R&D, approvals & certifications, logistic & production

costs

 production yield by BoM part count reduction

 optimization of final application total cost of ownership (increased reliability of integrated

architecture compared to the discrete one)

 final application overall dimension (exploiting the compact telit design) The proven unique Telit Ball-Grid-Array (BGA) package concept enables a very low profile and a small

product size to design extremely compact applications using location technology. Since all connectors are eliminated, the solution cost is significantly reduced compared to conventional mounting concepts.

Furthermore thanks to the successful cooperation with ATMEL, the dimensions of the ARM package have been considerably decreased so that our clients can reduce the dimensions of the entire system that integrates GPRS, the additional processor and the memories, giving a competitive advantage in comparison to a non integrated architecture and maintaining at the same time the flexibility of a standard ATMEL ARM9 product (AT91SAM9260)

With its low profile design and extended programming capabilities in C++ and/or Python, fast ROM and RAM plus power management, 4MB serial flash (expandible) and 8MB SDRAM (standard)

expandable up to 64MB for custom designs, the Telit GE863-PRO3 is the perfect and complete hardware platform for all compact complex and individual customer solutions.

Interfaces such as SPI, IIC, SD/MMC and USB give connectivity to external peripherals (camera, keyboard, display), complementary short range wireless technologies (Wi-Fi, Bluetooth, ZigBee) and position location technology (GPS) for which Telit can offer you complete reference designs.

The ARM core also includes real-time OS (LINUX), multitasking and fully available 200MIPS, fundamental for complex and demanding real-time applications. However Telit can also provide products without operating system giving with these an unlimited possibility for clients who want to use their own system environment on our modules.

As a part of Telit’s corporate policy of environmental protection, all products comply to the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU Directive 2002/95/EG).

Other than the above mentioned features, the Telit dual-core GE863-PRO3 maintains the following functionalities:

• EASY GPRS (AT driven embedded TCP/IP protocol stack, including FTP client)

• EASY SCAN (full GSM frequency scanning)

• JAMMING DETECT & REPORT (detect the presence of disturbing devices)

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• CMUX

• SAP (SIM Access Profile)

• Multisocket

From the interface point of view, the GE863-PRO3 provides the following:

• 1 Full GSM engine RS232 UART, CMOS level (ASC0) interface for AT commands:

- Auto-bauding from 2.4 up to 57.6 Kbps

- Fixed baud rate up to 115.2 Kbps

• 1 FULL ARM9 RS232 USART, CMOS level (UART0) interface for AT command drive

• 3 Four wires ARM9 RS232 USART, CMOS level

• 2 Two wires ARM9 RS232 UART, CMOS level

• 2 ARM9 SPI interfaces for up to 18 slaves

• 1 ARM9 Image Sensor Interface ITU-B 601/656

• 1 ARM9 IIC bus

• 1 ARM9 ISO7816 T0/T1 SAM/Smartcard interface

• 1 ARM9 SD/MMC Multimedia Card Interface

• 1 ARM9 Synchronous Serial Controller ( I2S ) interface for digital audio

• 1 ARM9 Ethernet controller

• 4 ARM9 ADC with ADC trigger input

• 6 ARM9 DAC (PWM)

• 1 ARM9 USB Device port

• 2 ARM9 USB Host port

• 2 ARM9 clock output pins

• 1 ARM9 Debug Trace Serial port

• 1 ARM9 JTAG debug port

• 2 analog GSM audio path

• SIM card interface, 3 volts and 1.8 volts

• 90 ARM9 + 9 GSM GPIO ports (max)

• 1 GSM buzzer output

• 1 GSM alarm output

• 1 GSM led status output indicator

In order to meet the competitive OEM and vertical market stringent requirements, Telit supports its customers with a dedicated Technical Support Policy with:

• Telit GE863-PRO3 Evaluation Kit to help you to develop your application;

• a Website with all updated information available;

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• a high level technical support to assist you in your development;

For more updated information concerning product Roadmap and availability, technical characteristics, commercial and other issues, please check on the Telit website www.telit.com > Products > Modules.

NOTE: Some of the performances of the Telit GE863-PRO3 modules depend on the SW version installed on the module itself.

The Telit GE863-PRO3 SW group is continuously working in order to add new features and improve the overall performances.

The Telit GE863-PRO3 modules are easily upgradeable by the developer using the Telit GE863-

PRO3 module Flash Programmer.

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GE863-PRO3 Product Description

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2 General Product Description

The Telit GE863-PRO3 module includes the GSM/GPRS engine plus a dedicated ARM9 application processor and memories.

The two processors [GSM/GPRS engine & Application processor] are kept as much as possible distinct: they have different power sources but with the same voltage range, so that, either power management can be optimized, by splitting GSM and application supplies, or cost can be optimized, by using the same power source to supply the two parts. Furthermore in order to give the maximum flexibility the two engines can be operated independently each other.

NOTE: The illustrations in this Product Description are only schematic and do not assure fidelity to construction or layout details, finishes, writings or colors.

2.1 Dimensions

The Telit GE863-PRO3 module overall dimensions are:

• Length: 41,4 mm

• Width: 31,4 mm

• Thickness: 3,6 mm

The layout of the Telit GE863-PRO3 module is shown in the following figure:

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GE863-PRO3 Product Description

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Top View

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GE863-PRO3 Product Description

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Bottom View

2.2 Weight

The Telit GE863-PRO3 module weight is 9 gr.

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2.3 Environmental requirements

The Telit GE863-PRO3 module is compliant to the applicable ETSI reference documentation GSM 05.05 Release1998.

2.3.1 Temperature range

Temperature in normal operating conditions

Temperature in extreme operating conditions*

Temperature in not functional conditions

Temperature exceeding the range of normal functional conditions can affect the sensitivity, the performance and the

MTBF of the module.

GE863-PRO3

–10°C ÷ +55°C –35°C ÷ +85°C

(TBD)

–40°C ÷ +85°C

2.3.2 Vibration Test (non functional)

• 10 ÷12Hz ASD = 1.92m 2 /s 3

• 12 ÷ 150Hz –3dB/oct

2.3.3 RoHS compliance

The Telit GE863-PRO3 module family is fully compliant to EU regulation on RoHS.

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3 GSM/GPRS Engine

3.1 Operating Frequency

The operating frequencies in GSM, DCS, PCS modes are conform to the GSM specifications.

Mode Freq. TX (MHz) Freq. RX (MHz) Channels (ARFC) TX - RX offset

E-GSM-900

GSM-850 DCS-1800 PCS-1900

890.0 - 914.8 935.0 - 959.8 0 – 124 45 MHz

880.2 - 889.8 925.2 - 934.8 975 - 1023 45MHz

824.2 - 848.8 869.2 - 893.8 128 - 251 45 MHz

1710.2 - 1784.8 1805.2 - 1879.8 512 – 885 95 MHz

1850.2 - 1909.8 1930.2 - 1989.8 512 - 810 80 MHz

3.2 Transmitter output power

GSM–850 / 900

The Telit GE863-PRO3 modules in GSM–850 / 900 operating mode are of class 4 in accordance with the specification which determine the nominal 2W peak RF power (+33dBm) on 50 Ohm.

DCS–1800 / PCS–1900

The Telit GE863-PRO3 modules in DCS–1800/PCS–1900 operating mode are of class 1 in accordance with the specifications, which determine the nominal 1W peak RF power (+30dBm) on 50 Ohm.

3.3 Reference sensitivity

GSM–850 / 900 The sensitivity of the Telit GE863-PRO3 modules according to the specifications for the class 4 GSM–

850/900 portable terminals is –107 dBm typical in normal operating conditions.

DCS–1800 / PCS-1900

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The sensitivity of the Telit GE863-PRO3 modules according to the specifications for the class 1 portable terminals DCS-1800 / PCS-1900 is –106 dBm typical in normal operating conditions.

3.4 Antenna

3.4.1 GSM Antenna

The antenna that the customer chooses to use, should fulfill the following requirements:

Depending by frequency band(s) provided by the network operator,

Frequency range

Bandwidth

For further information please refer to the GE863-PRO3 Hardware User Guide.

the customer shall use the most suitable antenna for that/those band(s). 70 MHz in GSM 850, 80 MHz in GSM 900, 170 MHz in DCS, 140 MHz PCS band

3.5 Supply voltage

The external power supply must be connected to VBATT signal pin (see Hardware User Guide) and must fulfill the following requirements:

Nominal operating voltage Operating voltage range Absolute Minimum voltage Absolute Maximum voltage

NOTE: Operating voltage range must never be exceeded; care must be taken in order to fulfill

absolute min/max voltage requirements.

3.8 V

3.4 V – 4.2 V

3.30V

4.50 V

3.6 Power consumption

The typical current consumption of the GSM/GPRS part of the Telit GE863-PRO3 module is:

Power off current (typical) Stand–by current (GSM Idle) Operating current in voice channel

< 28 µA; < 17 mA (< 4 mA using command AT+CFUN) < 200 mA @ worst network conditions

Operating current in GPRS class 10

< 370 mA @ worst network conditions

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The total power consumption of GE863-PRO3 is the sum of the consumptions of GSM and ARM9 processor part.

3.7 Embodied Battery charger

The battery charger is suited for a 3.7V Li-Ion rechargeable battery (suggested capacity 5001000mAh). The Charger needs only a CURRENT LIMITED power source input and charges the battery directly through VBATT connector pins.

Battery charger input pin Battery pins Battery charger input voltage min Battery charger input voltage typical Battery charger input voltage max Battery charger input current max Battery type

NOTE: If embodied battery charger is used, then a LOW ESR capacitor of at least 100µF must be

mounted in parallel to VBATT pin. NOTE: when power is supplied to the CHARGE pin, a battery must always be connected to the

CHARGE VBATT, GND

5.0 V

5.5 V

7.0 V 400mA Li-Ion rechargeable

VBATT pins of the GE863-PRO3.

3.8 User Interface

The user interface of the Telit GE863-PRO3 GSM/GPRS engine is managed by AT commands specified on the ITU-T V.250, GSM 07.07 and GSM 07.05 specifications.

3.9 Speech Coding

The Telit GE863-PRO3 modules voice codec supports the following rates:

• Half Rate

• Full rate

• Enhanced Full Rate

• Adaptive Multi Rate

Telit Communications S p A 863P3 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual