Telit WE866C6 User Manual

Mod.0818 2017-01 Rev.0

WE866C6

HW Design Guide

1VV0301658 Rev. 4 – 2020-01-13

WE866C6 Hardware Design Guide

1VV0301658 Rev. 4 Page 2 of 59 2020-01-13

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High­Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third-Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM

WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE

USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE

PRODUCTS

WE866C6-P

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Contents

NOTICE………................................................................................................ 2

COPYRIGHTS ................................................................................................ 2

COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3

APPLICABILITY TABLE ................................................................................ 4

CONTENTS .................................................................................................... 5

1. INTRODUCTION .......................................................................... 8

Scope ................................ ........................................................... 8

Audience....................................................................................... 8

Contact Information, Support ........................................................ 8

Text Conventions .......................................................................... 9

Related Documents .................................................................... 10

2. GENERAL PRODUCT DESCRIPTION ...................................... 11

Overview..................................................................................... 11

Block Diagram ............................................................................ 11

Product Variants ......................................................................... 11

Target Market ................................ ............................................. 12

Main Features ............................................................................. 12

3. PINS ALLOCATION ................................................................... 14

Pin Type Definition ...................................................................... 14

Pin-out ........................................................................................ 14

LGA Pads Layout ........................................................................ 16

4. POWER SUPPLY ....................................................................... 17

Power Supply Requirements ....................................................... 17

Power Consumption ................................................................... 18

4.2.1. Typical Power Consumption for WLAN Low-Power States ......... 18

4.2.2. Typical Power Consumption for WLAN Continuous Rx [2.4 GHz] 18

4.2.3. Typical Power Consumption for WLAN Continuous Rx [5 GHz] .. 19

4.2.4. Typical Power Consumption for WLAN Continuous Tx [2.4 GHz] 19

4.2.5. Typical Power Consumption for WLAN Continuous Tx [5 GHz] .. 20

4.2.6. Typical Power consumption for BT.............................................. 20

Power Supply Sequencing .......................................................... 22

5. DIGITAL SPECIFICATION ......................................................... 23

DC Electrical Characteristics ....................................................... 23

Interface Ports and Signals ................................ ......................... 24

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5.2.1. WLAN Interfaces ......................................................................... 24

5.2.1.1. SDIO Interface ............................................................................ 24

5.2.1.2. WL_EN ....................................................................................... 24

5.2.1.3. WOW .......................................................................................... 24

5.2.1.4. LF_CLK_IN ................................................................ ................. 24

5.2.1.5. Coexistence Use Cases .............................................................. 25

BT Interface ................................................................................ 28

5.3.1.1. BT HCI-UART ............................................................................. 28

5.3.1.2. PCM/I2S ..................................................................................... 28

5.3.1.3. BT_EN ........................................................................................ 28

LE910Cx-WE866C6 Bundling Pin Map ....................................... 29

6. RF SPECIFICATION .................................................................. 30

RF Frequencies .......................................................................... 30

Tx Output Power ......................................................................... 30

6.2.1. Tx Output Power at Room Temperature ..................................... 30

6.2.1.1. 802.11b (2.4GHz) ....................................................................... 30

6.2.1.2. 802.11g (2.4GHz) ....................................................................... 30

6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................. 31

6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................. 31

6.2.1.5. 802.11a (5GHz) .......................................................................... 31

6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................ 31

6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................ 32

6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz) ................................... 32

6.2.1.9. Bluetooth TX power .................................................................... 32

Receiver Sensitivity .................................................................... 32

6.3.1. Receiver Sensitivity at Room Temperature ................................. 32

6.3.1.1. 802.11b (2.4GHz) ....................................................................... 32

6.3.1.2. 802.11g (2.4GHz) ....................................................................... 32

6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................. 33

6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................. 33

6.3.1.5. 802.11a (5GHz) .......................................................................... 33

6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) ................................ 33

6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) ................................ 34

6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz) ................................... 34

6.3.1.9. Bluetooth (BER < 0.1%) .............................................................. 34

7. DESIGN GUIDELINES ............................................................... 35

General PCB Design Guidelines ................................................. 35

SDIO Interface ............................................................................ 35

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Voltage Regulator ....................................................................... 35

7.3.1. Recommended Regulators ......................................................... 35

7.3.2. Regulator Operating Conditions .................................................. 36

ESD and Thermal Information ..................................................... 37

Antenna Requirements ............................................................... 37

7.5.1. Main Antenna ............................................................................. 37

7.5.2. Antenna Cable ............................................................................ 38

7.5.3. Antenna Design .......................................................................... 39

7.5.4. Antenna Installation Guidelines ................................................... 40

8. MECHANICAL DESIGN ............................................................. 41

Mechanical Dimensions .............................................................. 41

8.1.1. Mechanical Drawing ................................................................... 41

8.1.1.1. Top View..................................................................................... 41

8.1.1.2. Bottom View ............................................................................... 42

8.1.1.3. Side View.................................................................................... 43

9. APPLICATION PCB DESIGN .................................................... 44

Recommended Footprint for the Application ............................... 44

PCB Pad Design ......................................................................... 45

PCB Pad Dimensions ................................................................. 46

Stencil ......................................................................................... 47

Solder Paste ................................................................ ............... 47

Cleaning ..................................................................................... 47

Solder Reflow ................................ ............................................. 48

10. PACKING SYSTEM ................................................................... 49

Tray ............................................................................................ 49

Tray Drawing ................................................................ .............. 50

Moisture Sensitivity ..................................................................... 51

11. CONFORMITY ASSESSMENT ISSUES .................................... 52

Declaration of Conformity ........................................................... 52

FCC/IC Compliance .................................................................... 52

12. SAFETY RECOMMENDATIONS................................................ 56

READ CAREFULLY .................................................................... 56

13. ACRONYMS ............................................................................... 57

14. DOCUMENT HISTORY .............................................................. 58

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1. INTRODUCTION

Scope

This document introduces the Telit WE866C6 module and presents possible and
recommended hardware solutions for developing a product based on this module.

Obviously, this document cannot include every hardware solution or every product that can
be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for properly
developing your product with the Telit module.

Audience

This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit module.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:

• [e-mail]

• [e-mail]

• [e-mail]

• [e-mail]

Alternatively, use:

https://www.telit.com/contact-us/

For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:

https://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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Text Conventions

Danger – This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be
useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents

• LE910Cx HW Design Guide 1VV0301298

• Telit EVB User Guide 1VV0301249

• LE910Cx Multi Technology Interface 1VV0301508

Board TLB - HW User Guide

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2. GENERAL PRODUCT DESCRIPTION

Overview

The WE866C6 is a low power and low-cost WIFI/BT wireless module solution based on
Qualcomm QCA9377-3. It supports 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT

4.2 + HS + BLE, enabling seamless integration of WLAN/BT and low energy. It is a perfect

companion solution for Telit cellular modules such as LE910Cx or LE920A4.
WE866C6 supports low-power SDIO 3.0 interface for WLAN and a UART/PCM interface
for BT. WE866C6 also supports BT-WLAN coexistence and uses the 2-wire ISM-LTE
coexistence interface.

Block Diagram

The following figure shows a high-level block diagram of WE866C6 module and its major
functional blocks.

• Power supply

• SDIO

• PCM and UART

• RF Antenna

Figure 1 WE866C6 Module Block Diagram

Product Variants

WE866C6 variants are listed below:

Product

Description

WE866C6

1x1 WIFI/BT wireless module

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Target Market

WE866C6 can be used in IoT applications complementing client data availability coverage
of the Cellular modems, with low power and low cost, for example:

• Bridging LTE / WLAN

• Industrial floor

• Healthcare instrument data terminals

• Smart Home automation and remote control

Main Features

Feature

Specification

Power

Main supply voltage: 3.3V

VIO supply voltage: 1.8V or 3.3V

Interfaces

WLAN SDIO 3.0
BT UART
BT PCM/I2S
LTE Coexistence UART (WCI)
Low frequency 32.768KHz sleep clock
Single Antenna port, 50 Ohm
Control signals

Supported
Data Rate

802.11a (5GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11b (2.4GHz): 1, 2, 5.5, 11Mbps

802.11g (2.4GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n (2.4GHz/5GHz):

• 20Mhz BW: Up to 72.2Mbps using short GI (MCS0-7)

• 40Mhz BW: Up to 144.4Mbps using short GI (MCS0-7)

802.11ac (5GHz): HT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)

Transmission
Power

802.11a / 54Mbps: 12 dBm

802.11b / 11Mbps: 18 dBm

802.11g / 54Mbps: 16 dBm

802.11n / HT20 (MCS7): 15dBm / 11 dBm

802.11ac / HT20 (MCS0): 15 dBm

802.11ac / VHT40 (MCS9): 9 dBm

802.11ac / VHT80 (MCS9): 8 dBm

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Data
Standard

IEEE 802.11a/b/g/n/ac

Operating
Modes

Access Point
Station

Modulation

BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM

Mechanical

Size: 15±0.15 x 13±0.15 x 2.15±0.15 mm
Package: LGA
Weight: 1g

Temperature
Range

Operating: -40°C to +85°C 1)
Storage and non-operating: -40°C to +105°C

RoHS

All hardware components are fully compliant with EU RoHS directive

Notes:

1) The module complies with IEEE standard.

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3. PINS ALLOCATION

Pin Type Definition

Type

Description

DI

Digital Input

DO

Digital Output

PD

Pull-Down

PU

Pull-Up

OD

Open-Drain Output

B

Bi-Directional

AI

Analog/RF Input

AO

Analog/RF Output

P

Power Input

Note: Pins directions are with respect to the WE866C6 module.

Pin-out

Pin

Pin Name

Pin Reference
Voltage

Pin
Type

Pin Description

BT UART interface

B3

BT_CTS

VIO

DI

Bluetooth HCI-UART CTS signal

B4

BT_RTS

VIO

DO

Bluetooth HCI-UART RTS signal

A5

BT_RXD

VIO

DI

Bluetooth HCI-UART RXD signal

A4

BT_TXD

VIO

DO

Bluetooth HCI-UART TXD signal

BT PCM interface

C6

BT_I2S_SDI

VIO

DI, PU

Bluetooth PCM/I2S Input signal, Internal Pull-Up

C5

BT_I2S_WS

VIO B Bluetooth PCM/I2S Frame Sync signal

D5

BT_I2S_SCK

VIO

B, PD

Bluetooth PCM/I2S Bit CLK signal

D6

BT_I2S_SDO

VIO

DO

Bluetooth PCM/I2S output signal

Low power Clock signal

B5

LF_CLK_IN

VIO

DI, PD

External low–power 32.768 kHz clock input

Host wake pins

D4

WOW

VIO

OD,
PU

Wake on Wireless. WIFI/BT Wakeup host.
Active Low, Internal Pull-Up

SDIO 3.0 interface

D7

SDIO_CLK

VIO

DI, PU

SDIO clock signal Input, Internal Pull-Up

E7

SDIO_CMD

VIO B SDIO CMD line signal

C7

SDIO_D0

VIO B SDIO data bus D0

B6

SDIO_D1

VIO B SDIO data bus D1

A6

SDIO_D2

VIO

B, PU

SDIO data bus D2, Internal Pull-Up

B7

SDIO_D3

VIO B SDIO data bus D3

Coexistence and control
signals

C3

LTE_UART_RX

VIO

DI, PU

Secondary UART - LTE coexistence UART RXD
/ AUX UART RXD

C4

LTE_UART_TX

VIO

DO

Secondary UART - LTE coexistence UART_TXD
/ AUX_UART_TXD

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Pin

Pin Name

Pin Reference
Voltage

Pin
Type

Pin Description

G5

WL_EN

VIO

DI, PD

WLAN enable (Active high)

G6

BT_EN

VIO

DI, PD

Bluetooth enable (Active high)

RF Antennas

D1

ANT1

A

AI, AO

Antenna 1 - Main Antenna for modules with a
single antenna configuration

G3

RFU ANT2

NA

NA

Reserved for Antenna 2.

Power

A1

VDD_3.3V

3.13 V to 3.46 V

P

Main Input voltage (WIFI & BT)

A2

VDD_3.3V

3.13 V to 3.46 V

P

Main Input voltage (WIFI & BT)

A3

VDDIO

1.8 V or 3.3 V

P

Voltage supply for all I/O signals (1.71V - 3.46V)

A7

GND

– – Power Ground

B1

GND

– – Power Ground

B2

GND

– – Power Ground

C1

GND

– – Power Ground

C2

GND

– – Power Ground

D2

GND

– – Power Ground

E1

GND

– – Power Ground

E2

GND

– – Power Ground

F1

GND

– – Power Ground

F2

GND

– – Power Ground

F3

GND

– – Power Ground

F4

GND

– – Power Ground

G2

GND

– – Power Ground

G4

GND

– – Power Ground

G7

GND

– – Power Ground

Factory use

D3

RFU

NC - Reserved for future use. No connect.

E3

RFU

NC - Reserved for future use. No connect.

E4

RFU

NC - Reserved for future use. No connect.

E5

RFU

NC - Reserved for future use. No connect.

E6

RFU

NC - Reserved for future use. No connect.

F5

RFU

NC - Reserved for future use. No connect.

F6

RFU

NC - Reserved for future use. No connect.

F7

RFU

NC - Reserved for future use. No connect.

G1

RFU

NC - Reserved for future use. No connect.

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LGA Pads Layout

A B C D E F

G

1

VDD_3.3V

GND

GND

ANT1

GND

GND

RFU

2

VDD_3.3V

GND

GND

GND

GND

GND

GND

3

VDDIO

BT_CTS

(I)

LTE_UART_RX

(I)

RFU

RFU

GND

RFU (ANT2)

4

BT_TXD

(O)

BT_RTS

(O)

LTE_UART_TX

(O)

WOW

(OD)

RFU

GND

GND

5

BT_RXD

(I)

LF_CLK_IN

(I)

BT_I2S_WS

(I)

BT_I2S_SCK

(I)

RFU

RFU

WL_EN

(I)

6

SDIO_D2

SDIO_D1

BT_I2S_SDI

(I)

BT_I2S_SDO

(O)

RFU

RFU

BT_EN

(I)

7

GND

SDIO_D3

SDIO_D0

SDIO_CLK

(I)

SDIO_CMD

RFU

GND

TOP VIEW

WARNING

Reserved pins must not be connected.

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4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

There are two power supply inputs to the module. The main power supply, connected to
VDD_3.3V input and the VDDIO input, each must fulfill the following requirements:

VDD_3.3V Input

Minimum

Maximum

Absolute Maximum Voltage

-0.3 V

3.65 V

Nominal Supply Voltage

3.3 V

-

Normal Operating Voltage Range

3.135 V

3.465 V

VDDIO Input

Minimum

Maximum

Absolute Maximum Voltage

-0.3 V

4.0 V

Nominal Supply Voltage

1.8V or 3.3V

-

Normal Operating Voltage Range

1.71 V

3.46 V

NOTE:
The Maximum Voltage MUST never be exceeded; care must be

taken when designing the application’s power supply section to avoid

having an excessive voltage drop.
If the voltage drop is exceeding the limits it could lead to degradation
of performance or cause a Power Off of the module.

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Power Consumption

The below tables provide the typical current consumption values of the module for the
various available modes.

4.2.1. Typical Power Consumption for WLAN Low-Power States

Mode

Total power

consumption [mA]

(VDDIO = 1.8V)

Mode Description

Standby

0.2

Deep Sleep

Power Save, 2.4GHz

1.3

DTIM=1

0.8

DTIM=3

0.6

DTIM=10

Power Save, 5GHz

1.5

DTIM=1

0.9

DTIM=3

0.7

DTIM=10

4.2.2. Typical Power Consumption for WLAN Continuous Rx [2.4 GHz]

Rate

Total power consumption [mA]

(VDDIO = 1.8V)

11b 1Mbps

60

11b 11Mbps

62

11g 54Mbps

70

MCS0 HT20

67

MCS7 HT20

69

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4.2.3. Typical Power Consumption for WLAN Continuous Rx [5 GHz]

Rate

Total Power Consumption [mA]

(VDDIO = 1.8V)

MCS0 HT20

96

MCS7 HT20

94

MCS8 VHT20

112

MCS0 HT40

94

MCS7 HT40

99

MCS8 VHT40

115

MCS9 VHT40

100

MCS7 VHT80

130

MCS8 VHT80

162

MCS9 VHT80

131

4.2.4. Typical Power Consumption for WLAN Continuous Tx [2.4 GHz]

Rate

Total Power Consumption [mA]

(VDDIO = 1.8V)

11b 1Mbps

365

11b 11Mbps

362

11g 54Mbps

340

MCS0 HT20

348

MCS7 HT20

335

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4.2.5. Typical Power Consumption for WLAN Continuous Tx [5 GHz]

Rate

Total Power Consumption [mA]

(VDDIO = 1.8V)

MCS0 HT20

495

MCS7 HT20

432

MCS8 VHT20

422

MCS0 HT40

475

MCS7 HT40

435

MCS8 VHT40

432

MCS9 VHT40

429

MCS7 VHT80

440

MCS8 VHT80

438

MCS9 VHT80

436

4.2.6. Typical Power consumption for BT

Rate

Total Power Consumption [mA]

(VDDIO = 1.8V)

Continuous Rx burst

25

Continuous TX Class 2 (+4 dBm)

42

1.28 sec page scan (non-interlaced)

0.36

1.28 sec LE ADV

0.23

1.28 sec Sniff as master

0.21

1.28 sec Sniff as slave

0.26

WE866C6 Hardware Design Guide

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NOTE:

Current consumptions specification refers to typical samples and
typical material.

Values represent an average measurement done over few seconds.

Values may vary depending on network and environmental
conditions.
Power consumptions values obtained with VDD_3.3V = 3.3V and
VDDIO = 1.8V.

NOTE:
Current consumption is measured at the system level and is the sum
of both VDD_3.3V and VDDIO current consumpotions.

NOTE:
Current consumption related to WLAN and BT TX cases are
measured at typical TX output power as listed in 6.2.

WE866C6 Hardware Design Guide

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Power Supply Sequencing

The recommended power sequence between VDD_3.3V and VDDIO inputs is as shown
below:

VBATT

VDDIO

VDD_3.3V

WL_EN

BT_EN

LF_CLK_IN

Power up Normal Operation Power downNormal OperationReset

90% of VDDIO to 10% of 3.3V

Minimum 0 Sec

90% of 3.3V to WL_EN and BT_E N high

Minimum 10 uSec

WLAN_EN valid to LF_CLK_IN

Minimum 0 Sec

WL_EN and BT_EN low to 90% of 3.3V
Minimum 10 uSec

Notes:

1. VDDIO voltage should match VIO voltage of the host. In some applications, it may

connect to 3.3 V matching the Host VIO voltage.

2. All host interface signals must stay floating or low before valid power on sequence

WL_EN/BT_EN = ”High”, and after WL_EN/BT_EN = “Low”.

Warning:
Please carefully follow the recommended power Up/Down sequencing.

Not following the recommended procedure might damage the device and
consequently void the warranty.

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5. DIGITAL SPECIFICATION

DC Electrical Characteristics

Parameter

Min

Typical

Max

Unit

High-level input voltage

0.7 * VDDIO

-

VDDIO + 0.3

V

Low-level input voltage

-0.3

-

0.3 * VDDIO

V

Input low leakage current
(VIN = 0 V Supply =
VDDIO max)

-5.0 0 5.0

μA

Input pull resistor
(Up or down)

-

1.8V IO: 120

3.3V IO: 70

-

kΩ

High-level output voltage

VDDIO - 0.4

-

VDDIO

V

Low-level output voltage

0 - 0.4

V

High-level output current

3 - -

mA

Low-level output current

- - -11

mA

Input capacitance

- - 3

pF

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Interface Ports and Signals

5.2.1. WLAN Interfaces

The following figure shows the WLAN related interface connection between the WE866C6
module and the LTE modem module.

The following clauses describe the various interfaces.

5.2.1.1. SDIO Interface

SDIO is the main interface used for WLAN Data and control.
The WE866C6 has a 4-bit SDIO port which supports SDIO3.0 standard with up to 200Mhz

clock. The figure above shows the SDIO interface connection diagram.

5.2.1.2. WL_EN

WL_EN is used to control the WLAN function of WE866C6 module. When WL_EN is at a
high level, WLAN function will be enabled.

5.2.1.3. WOW

The purpose of the WOW (Wake on Wireless) signal is to wake up the host. When WOW
signal is driven low, it can wake up the host.

5.2.1.4. LF_CLK_IN

The LF_CLK_IN 32 kHz clock is used in low-power modes such as IEEE power-save and
sleep. It serves as a timer to determine when to wake up to receive beacons in various
power-save schemes and to maintain basic logic operations when in sleep.

The module does not require an external 32 kHz clock. By default, it utilizes its internal clock
shared with the WLAN and BT subsystem.

WE866C6 Hardware Design Guide

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If the end application has a more accurate 32 kHz clock (as in the case of using the Telit
LTE module solution), then it can be supplied externally via the LF_CLK_IN pin. The
LF_CLK_IN pin must be grounded when using the default internal clock mode.

If an external 32 kHz clock is used, the requirements are:

Parameter

Min

Typical

Max

Unit

Frequency

-

32.768

-

KHz

Rise/Fall time

1 - 100

nS

Duty Cycle

15 - 85

%

Frequency stability

-200

-

200

Ppm

Input High Voltage

0.8 x VDDIO

-

VDDIO + 0.2

V

Input Low Voltage

-0.3

-

0.2 x VDDIO

V

5.2.1.5. Coexistence Use Cases

Wireless Local Area Network (WLAN) and Bluetooth® (BT) share the same 2.4GHz ISM
bands. LTE network bands (band 38/40/41 for TDD and band 7 for FDD uplink) are adjacent
to the WLAN bands and as such can cause severe de-sensing of the WLAN receive. In the
same way, WLAN transmission can cause severe de-sensing of the LTE receive path.

Interference is mostly relevant due to adjacent bands and the limited isolation when both
reside in the same platform.

This interference can be mitigated to some extent with by sharing communication and
network related information between LTE modem and WLAN/BT device.

This information is communicated between the 2 entities over the coexistence UART.

NOTE:
The coexistance interface can be used only with Telit recommended
bundling of LE910Cx and WE866C6.

Design #1.

WE866C6 Hardware Design Guide

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Design #2.

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Design #3.

Design #4.

NOTE:
Among the four bundling designs as shown above, coexistence
feature is supported only in Designs #1 and 2.

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BT Interface

The following figure shows the BT interface connection between the WE866C6 module and
the modem module.

The BT controller consists of BT radio and digital baseband blocks. It is controlled by the
host through the UART. The BT audio interface can be configured to UART/PCM (I2S). The
BT power on/off is controlled through BT_EN.

5.3.1.1. BT HCI-UART

The BT HCI-UART provides a communication interface between the host and BT
controller.

5.3.1.2. PCM/I2S

This is the synchronous interface for audio data.
The BT synchronous audio interface can support either PCM or I2S protocols.
The BT asynchronous audio interface is for a stereo audio A2DP profile through HCI-UART.
Supports multiple codec types:

• Narrowband speech with integrated CVSD codec over PCM or HCI

• Wideband speech with integrated SBC codec over PCM or HCI

The BT controller can configure the interface to master or slave mode for PCM or I2S. It
defaults to slave mode to avoid driving PCM_SYNC and PCM_CLK signals.

The maximum I2S clock frequency is supported up to 2.4 MHz

5.3.1.3. BT_EN

This signal enables/ disables Bluetooth by asserting or de-esserting it from the host.

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LE910Cx-WE866C6 Bundling Pin Map

LE910Cx

Pin #

LE910Cx

Signal

LE910Cx

I/O

WE866C6

Pin #

WE866C6

Signal

WE866C6

I/O

L12

WiFi_SDRST

O

G5

WL_EN

I

N13

WiFi_SD_CMD

O

E7

SDIO_CMD

I

J13

WiFi_SD0

I/O

C7

SDIO_D0

I/O

M13

WiFi_SD1

I/O

B6

SDIO_D1

I/O

K13

WiFi_SD2

I/O

A6

SDIO_D2

I/O

H13

WiFi_SD3

I/O

B7

SDIO_D3

I/O

L13

WiFi_SD_CLK

O

D7

SDIO_CLK

O

M15

C104/RXD

O

A5

BT_RXD

I

N15

C103/TXD

I

A4

BT_TXD

O

P15

C106/CTS

O

B3

BT_CTS

I

L14

C105/RTS

I

B4

BT_RTS

O

B9

DVI_WAO

O

C5

BT_I2S_WS

I

B7

DVI_TX

O

C6

BT_I2S_SDI

I

B8

DVI_CLK

O

D5

BT_I2S_SCK

I

B6

DVI_RX

I

D6

BT_I2S_SDO

O

C13

GPIO_07

O

G6

BT_EN

I

L4

WOW I D4

WOW

O

M8

WCI_TX

O

C3

LTE_UART_RX

I

M9

WCI_RX

I

C4

LTE_UART_TX

O

M11

WLAN_SLEEP_CLK

O

B5

LF_CLK_IN

I

E13

WLAN_PWR_EN

O

* see Note 1

Note 1:

Connect E13 to enable pin of power regulators which supply power to WE866C6
(3.3V & 1.8V)

If the LE910Cx main UART is already used for a specific function, pins F15, E15, D15, and
H14 can be used for BT interface of WE866C6. AT#PORTCFG=16 command is needed for
switching UART interface.

Pin #

Signal

I/O

Pin#

Signal

I/O

F15

SPI_CLK/RTS

O

B3

BT_CTS

I

E15

SPI_MISO/ RX_AUX

I

A4

BT_TXD

O

D15

SPI_MOSI/TX_AUX

O

A5

BT_RXD

I

H14

SPI_CS/GPIO11/CTS

I

B4

BT_RTS

O

WE866C6 Hardware Design Guide

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6. RF SPECIFICATION

RF Frequencies

The following table is listing the supported frequencies:

Tx Output Power

Measurements are averaged and are done at the module Antenna pad.
The output power listed in the following tables indicates the highest level which allows to

meet the 802.11x standard with regards to ACLR and EVM values.

6.2.1. Tx Output Power at Room Temperature

The tables below are measured at 25°C with VDD_3.3V = 3.3V, VDDIO=1.8V

6.2.1.1. 802.11b (2.4GHz)

Modulation

Data rate

CHL/CHM/CHH

Units

BPSK

1 Mbps

18

dBm

QPSK

2 Mbps

18

dBm

CCK

5.5Mbps

18

dBm

CCK

11 Mbps

18

dBm

6.2.1.2. 802.11g (2.4GHz)

Modulation

Data rate

CHL/CHM/CHH

Units

BPSK

6 Mbps

16.5

dBm

BPSK

9 Mbps

16.5

dBm

QPSK

12 Mbps

16.5

dBm

QPSK

18 Mbps

16.5

dBm

16 QAM

24 Mbps

15.5

dBm

16 QAM

36 Mbps

15.5

dBm

64 QAM

48 Mbps

15.5

dBm

64 QAM

54 Mbps

15

dBm

Parameter

Conditions

Frequency Range

WLAN Center channel
frequency for 2.4 GHz

Center frequency at 5 MHz
spacing

2.412 – 2.484 GHz

WLAN Center channel
frequency for 5 GHz

Center frequency at 5 MHz
spacing

4.9 – 5.925 GHz

BT Frequency range

BT Specification:

2.4 ≤ f ≤ 2.4835

Center frequency f = 2402 + k,
where k is the channel number.

2402 – 2480 MHz

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6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

MCS0

16.5

dBm

QPSK

MCS1

16.5

dBm

QPSK

MCS2

16.5

dBm

16 QAM

MCS3

16

dBm

16 QAM

MCS4

16

dBm

64 QAM

MCS5

15.5

dBm

64 QAM

MCS6

15.5

dBm

64 QAM

MCS7

15

dBm

6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

MCS0

15

dBm

QPSK

MCS1

15

dBm

QPSK

MCS2

15

dBm

16 QAM

MCS3

14.5

dBm

16 QAM

MCS4

14.5

dBm

64 QAM

MCS5

13.5

dBm

64 QAM

MCS6

13.5

dBm

64 QAM

MCS7

13

dBm

6.2.1.5. 802.11a (5GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

6 Mbps

15

dBm

BPSK

9 Mbps

15

dBm

QPSK

12 Mbps

15

dBm

QPSK

18 Mbps

15

dBm

16 QAM

24 Mbps

15

dBm

16 QAM

36 Mbps

14

dBm

64 QAM

48 Mbps

13

dBm

64 QAM

54 Mbps

12

dBm

6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

MCS0

15

dBm

QPSK

MCS1

15

dBm

QPSK

MCS2

15

dBm

16 QAM

MCS3

14

dBm

16 QAM

MCS4

14

dBm

64 QAM

MCS5

13

dBm

64 QAM

MCS6

13

dBm

64 QAM

MCS7

11 (ac Only)

dBm

WE866C6 Hardware Design Guide

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6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

MCS0

14

dBm

256 QAM

MCS9

9 (ac Only)

dBm

6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

Data rate

Index

CHL/CHM/CHH

Units

BPSK

MCS0

14

dBm

256 QAM

MCS9

8

dBm

6.2.1.9. Bluetooth TX power

BT Spec

Modulation

maximum

Units

BR

GFSK 7 dBm

EDR

8DPSK

4

dBm

BLE

GFSK 4 dBm

Receiver Sensitivity

Measurements are done at the module Antenna pad with 10% packet error rate.

6.3.1. Receiver Sensitivity at Room Temperature

All measurements data are taken at 25°C, VDDIO=1.8V, and BW=20MHz.

6.3.1.1. 802.11b (2.4GHz)

Modulation

Data rate

Typical

sensitivity

Units

BPSK

1 Mbps

-93

dBm

QPSK

2 Mbps

-91

dBm

CCK

5.5Mbps

-88

dBm

CCK

11 Mbps

-87

dBm

6.3.1.2. 802.11g (2.4GHz)

Modulation

Data rate

Typical

sensitivity

Units

BPSK

6 Mbps

-89

dBm

BPSK

9 Mbps

-88

dBm

QPSK

12 Mbps

-87

dBm

QPSK

18 Mbps

-85

dBm

16 QAM

24 Mbps

-82

dBm

16 QAM

36 Mbps

-78

dBm

64 QAM

48 Mbps

-74

dBm

64 QAM

54 Mbps

-73

dBm

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6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

Data rate

Index

Typical

sensitivity

Units

BPSK

MCS0

-88

dBm

QPSK

MCS1

-85

dBm

QPSK

MCS2

-83

dBm

16 QAM

MCS3

-80

dBm

16 QAM

MCS4

-76

dBm

64 QAM

MCS5

-71

dBm

64 QAM

MCS6

-70

dBm

64 QAM

MCS7

-69

dBm

6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

Data rate

Index

Typical

sensitivity

Units

BPSK

MCS0

-85

dBm

QPSK

MCS1

-82

dBm

QPSK

MCS2

-80

dBm

16 QAM

MCS3

-77

dBm

16 QAM

MCS4

-73

dBm

64 QAM

MCS5

-68

dBm

64 QAM

MCS6

-67

dBm

64 QAM

MCS7

-66

dBm

6.3.1.5. 802.11a (5GHz)

Modulation

Data rate

Typical

sensitivity

Units

BPSK

6 Mbps

-90

dBm

BPSK

9 Mbps

-89

dBm

QPSK

12 Mbps

-88

dBm

QPSK

18 Mbps

-86

dBm

16 QAM

24 Mbps

-83

dBm

16 QAM

36 Mbps

-79

dBm

64 QAM

48 Mbps

-75

dBm

64 QAM

54 Mbps

-74

dBm

6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

Data rate

Index

Typical

sensitivity

Units

BPSK

MCS0

-89

dBm

QPSK

MCS1

-86

dBm

QPSK

MCS2

-84

dBm

16 QAM

MCS3

-81

dBm

16 QAM

MCS4

-77

dBm

64 QAM

MCS5

-72

dBm

64 QAM

MCS6

-71

dBm

WE866C6 Hardware Design Guide

1VV0301658 Rev. 4 Page 34 of 59 2020-01-13

Modulation

Data rate

Index

Typical

sensitivity

Units

64 QAM

MCS7

-70

dBm

6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

Data rate

Index

Typical

sensitivity

Units

BPSK

MCS0

-86

dBm

64 QAM

MCS7

-67

dBm

256 QAM

MCS8

-63

dBm

256 QAM

MCS9

-62

dBm

6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

Data rate

Index

Typical

sensitivity

Units

256 QAM

MCS8

-60

dBm

256 QAM

MCS9

-59

dBm

6.3.1.9. Bluetooth (BER < 0.1%)

BT Spec

Modulation

Typical

sensitivity

Units

BR

GFSK

-90

dBm

EDR

8DPSK

-85

dBm

BLE

GFSK

-90

dBm

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7. DESIGN GUIDELINES

General PCB Design Guidelines

• Ground stitch any ground planes to improve thermal dissipation.

• The VDD_3.3V main power rail must support > 700 mA (average).

• It is recommended to place a 10µF capacitor near the VDD_3.3V pins and a 2.2µF

on the VDDIO pin.

• Keep power traces as wide as possible to lower the risk of IR drop.

• Wherever possible, add 30% current margin for all trace widths.

SDIO Interface

The SDIO bus is the WLAN host interface and should be treated as a high-speed bus. Any
design issue related SDIO signal integrity will result in lower bus speed thus lower data
throughput

The recommendations below should be followed during the design:

• Do not break the ground reference plane below any of the SDIO traces.

• Total trace length should be less than 4-inch and maximum 20 pF.

• SDIO signals trace length should be matched

o Reduce SDIO bus length as much as possible
o Use SDIO_CLK as the target length.
o Allow max of ±1mm variance with respect to SDIO_CLK

• Spacing between traces: 2~3 times of trace width.

• Trace impedance: 50 Ω±10%

• Continue GND plane under top/bottom of SDIO traces are required.

• SDIO clock must be well isolated and via shielded where possible.

Voltage Regulator

This section describes the VDD_3.3V power regulator requirements for designs using the
WE866C6. It is intended for selecting the proper DC-DC regulator in the platform. There are
a couple of options for supplying the required VDD_3.3V input such as Buck-boost, Buck
or a Boost power regulator.

7.3.1. Recommended Regulators

Manufacturer

Type

Part number

Texas Instruments

buck-boost

TPS630242

Texas Instruments

buck

LM3281

Please refer to vendor reference design for typical application and PCB layout
requirements.

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7.3.2. Regulator Operating Conditions

Below table shows the recommended operating conditions of the VDD_3.3V Buck-Boost
voltage regulator:

Parameter

Condition

Min

Type

Max

Unit

Input Voltage range

2.5 4.75

V

Shutdown supply current

1 5 µA

Quiescent current

IOUT=0mA, VOUT=3.3V

30

60

µA

Output voltage

3.3 V

Load Current

0.9

A

Output Voltage accuracy
(output voltage should be

maintained within these
limits during all conditions
including line voltage, load
current variations)

PWM mode

-2 2 2

%

PFM mode

-4 4 4

%

Output ripple voltage
PWM mode

20

mVpp

PFM mode

50

mVpp

Power efficiency
Vout=3.3V, Iout=1300mA

85

90 %

Vout=3.3V, Iout=1mA

80

85 %

Overshoot/Undershoot

IOUT = 0.2A to 1.2A
IOUT = 1.2A to 0.2A

100

mV

Startup time
Buck mode, time taken for

VOUT to reach 95% of its
nominal value. VIN=4V,
IOUT=200mA

1

mS

Boost mode, time taken for
VOUT to reach 95% of its
nominal value. VIN=3V,
IOUT=200mA

2

mS

Switching frequency

1.5 6

MHz

PFM mode

Output current to enter
PFM mode

100 mA

Short circuit current limit

2.5 A

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ESD and Thermal Information

• WE866C6 Absolute Maximum ESD sensitivity level is HBM ±2000 V.

• WE866C6 Maximum Thermal resistance:

Symbols

Parameters

Maximum Case

Temperature

Unit

T

CASE

Case Temperature

115

°C

PsiJT

Junction to the top of the package
thermal resistance

0.5

°C/W

Table 7-1 Thermal Data

• WE866C6 Shield material, soldering material, and Pad material information for

thermal calculation and analysis are as follows:

o Material of metal casing: CRS 1008/1010, Thickness: 0.2mm
o Infill material: Air
o Material of conductive tabs thickness: 12 µm
o Approximate area of coverage: 12.3% approx. (total area=15x13=195,

footprint area=0.7x0.7x49=24.01)

Antenna Requirements

7.5.1. Main Antenna

The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read
carefully and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit device shall fulfil the following
requirements:

Frequency Range

Requirements

Frequency bands

2.412~2.484GHz

4.9~5.925GHz

VSWR

< 2.2:1 recommended

Gain (dBi)

2.412~2.484GHz: 2.5

4.9~5.925GHz: 4.5

Max Input Power (W)

50

Input Impedance (Ω)

50

Polarization Type

Vertical

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7.5.2. Antenna Cable

Type

Requirements

2.412 ~ 2.484GHz

Cable insertion loss <1dB

4.9 ~ 5.925GHz

Cable insertion loss <1dB

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7.5.3. Antenna Design

When using the WE866C6, since there's no antenna connector on the module, the antenna
must be connected to the WE866C6 antenna pad by means of a transmission line
implemented on the PCB.
This transmission line shall fulfil the following requirements:

The transmission line should be designed according to the following guidelines:

• Ensure that the antenna line impedance is 50 ohm.

• Keep the antenna line on the PCB as short as possible, since the antenna line loss

shall be less than 0.3 dB.

• Avoid right angles whenever possible and route on the top layer only.

• Antenna line must have uniform characteristics, constant cross section, avoid

meanders, and abrupt curves.

• Keep, if possible, one layer of the PCB used only for the Ground plane.

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid

having other signal tracks facing directly the antenna line track.

• The ground around the antenna line on PCB has to be strictly connected to the

Ground Plane by placing vias every 2mm at least.

• Place EM noisy devices as far as possible from module antenna line.

• Keep the antenna line far away from the module power supply lines.

• If you have EM noisy devices around the PCB hosting the module, such as fast

switching ICs, take care of the shielding of the antenna line by burying it inside the
layers of PCB and surround it with Ground planes, or shield it with a metal frame
cover.

• If cases where EMI is not a concern, using a micro strip on the superficial copper

layer for the antenna line is recommended as the line attenuation will be lower than
a buried one.

Item

Value

Characteristic Impedance

50 Ohm

Max Attenuation

0.3 dB

Coupling

Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be
equipotential to the module ground pins

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NOTE:
The following image is
showing the suggested
layout for the Antenna pad
connection (dimensions in mm):

7.5.4. Antenna Installation Guidelines

Install the antenna in a place with WiFi signal coverage.
Antenna shall not be installed inside metal cases.
Antenna shall be installed according to antenna manufacturer instructions.

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8. MECHANICAL DESIGN

Mechanical Dimensions

The WE866C6 overall dimensions are:

• Length: 15 mm

• Width: 13 mm

• Thickness: 2.15 mm

• Weight: 1 g

8.1.1. Mechanical Drawing

8.1.1.1. Top View

The figure below shows the mechanical top view of the WE866C6 module.

Dimensions are in mm

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8.1.1.2. Bottom View

The figure below shows the mechanical Bottom view of the WE866C6 module.

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8.1.1.3. Side View

The figure below shows mechanical side view of the WE866C6 module.

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9. APPLICATION PCB DESIGN

The modules have been designed to be compliant with a standard lead-free SMT process.

Recommended Footprint for the Application

Figure 2 Copper Pad Outline Top View

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In order to easily rework the module, it is suggested to add a 1.5 mm placement inhibit area
around the module. It is also suggested, as common rule for an SMT component, to avoid
having a mechanical part of the application in direct contact with the module.
The area under WIRING INHIBIT (see figure above) must be clear from signal or ground
paths.

PCB Pad Design

Non-solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

PCB

Copper

Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non-Solder Mask Defined)

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PCB Pad Dimensions

The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)

It is not recommended to place via or micro-via not covered by solder resist in an area of
0,3 mm around the pads unless it carries the same signal of the pad itself

Holes in pad are allowed only for blind holes and not for through holes.

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Recommendations for PCB pad surfaces:

Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au

3 –7 / 0.05 – 0.15

good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead­free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is suggested to

use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.

Stencil

Minimum stencil thickness recommended is 125um (5mil)

Solder Paste

We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.

Cleaning

In general, cleaning the module mounted on the carrier board is not recommended.

• Residues between module and host board cannot be easily removed with any

cleaning method.

• Cleaning with water or any organic solvent can lead to capillary effects where the

cleaning solvent is absorbed into the gap between the module and the host board
or even leak inside the module (due to the gap between the module shield and PCB) .
The combination of soldering flux residues and encapsulated solvent could lead to
short circuits between conductive parts. The solvent could also damage the module
label.

• Ultrasonic cleaning could damage the module permanently. Especially for crystal

oscillators where the risk of damaging is very high.

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Solder Reflow

Below figure shows the recommended solder reflow profile.

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TL to TP)

3°C/second max

Preheat
– Temperature Min (T

smin

)

– Temperature Max (T

smax

)

– Time (min to max) (ts)

150°C
200°C
60-180 seconds

T

smax

to TL

– Ramp-up rate

3°C/second max

Time maintained above:

– Temperature (TL)
– Time (tL)

217°C
60-150 seconds

Peak temperature (Tp)

245 +0/-5°C

Time within 5°C of actual peak temperature (tp)

10-30 seconds

Ramp-down rate

6°C/second max.

Time 25°C to peak temperature

8 minutes max.

WARNING:

The above solder reflow profile represents the typical SAC reflow limits and

does not guarantee adequate adherence of the module to the customer
application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall system
considering such factors as thermal mass and warpage.

The module withstands one reflow process only.

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10. PACKING SYSTEM

Tray

The WE866C6 modules are packaged on trays of 144 pieces each. These trays can be
used in SMT processes for pick & place handling.

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Tray Drawing

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Moisture Sensitivity

The module is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC
J-STD-020. Customer should take care about all the related requirements for using this kind
of components.

Moreover, the customer must take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC

J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must

be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more.

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11. CONFORMITY ASSESSMENT ISSUES

Declaration of Conformity

Hereby, Telit Communications S.p.A declares that the WIFI/BT Wireless Module is in
compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:

http://www.telit.com\red

FCC/IC Compliance

Hereby, Telit Communications S.p.A declares that the WE866C6 Module is in compliance
with:

- USA: Applicable parts of the Title 47 of the Code of Federal Regulations (CFR);

- Canada: Radio Standard Procedure RSP-100, applicable Radio Standards
Specifications (RSS).

Note: In Canada, the device won’t operate in the frequency range 5600 – 5650

MHz (channels within this range won’t be used)”

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes

or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit

la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de
l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause

undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled
environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102
of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located

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or operating in conjunction with any other antenna or transmitter. The antenna should be
installed and operated with minimum distance of 20 cm between the radiator and your body.

Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un
environnement non contrôlé et répond aux directives d'exposition de la fréquence de la
FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition.
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou
autre émetteur. L'antenne doit être installée de façon à garder une distance minimale de 20
centimètres entre la source de rayonnements et votre corps.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation.

This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

CAN ICES-3 (B) / NMB-3 (B)

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

List of applicable FCC rules

Parts 15C, 15E, 2.1091

Limited module procedures

N/A

Trace antenna designs

N/A

Antennas

This radio transmitter has been approved by FCC and ISED to operate with the antenna
types listed below with the maximum permissible gain indicated. Antenna types not included

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in this list, having a gain greater than the maximum gain indicated for that type, are strictly
prohibited for use with this device.

Type Max Gain
Omnidirectional 2.5dBi@2.4GHz band and 4.5dBi@5GHz band
Le présent émetteur radio a été approuvé par ISDE pour fonctionner avec les types

d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne
non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont
strictement interdits pour l'exploitation de l'émetteur.

Type Gain maximal
Omnidirectional 2.5dBi@2.4GHz band and 4.5dBi@5GHz band

Label and compliance information

The product has a FCC ID label on the device itself. Also, the OEM host end product
manufacturer will be informed to display a label referring to the enclosed module. The

exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7WE866C6” or
“Contains FCC ID: RI7WE866C6”.

Information on test modes and additional testing requirements

The module has been evaluated in mobile stand-alone conditions. For different operational
conditions from a stand-alone modular transmitter in a host (multiple, simultaneously
transmitting modules or other transmitters in a host), additional testing may be required
(collocation, retesting…).

If this module is intended for use in a portable device, you are responsible for separate
approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.

Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC
transmitter rules) listed on the grant, and that the host product manufacturer is responsible
for compliance to any other FCC rules that apply to the host not covered by the modular
transmitter grant of certification. If the grantee markets their product as being Part 15
Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the
grantee shall provide a notice stating that the final host product still requires Part 15 Subpart
B compliance testing with the modular transmitter installed. The end product with an
embedded module may also need to pass the FCC Part 15 unintentional emission testing
requirements and be properly authorized per FCC Part 15.

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The transmissions are controlled by the application software in the module.
The application software ceases to trigger transmissions in case of either
absence of information to transmit or operational failure occurs. Therefore, the
device is in compliance with FCC section 15.407 (c) requirements.

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12. SAFETY RECOMMENDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required.
The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific
environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty
validity. We recommend following the instructions of the hardware user guides for correct
wiring of the product. The product has to be supplied with a stabilized voltage source and
the wiring has to be conformed to the security and fire prevention regulations. The product
has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM,
checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.

The system integrator is responsible for the functioning of the final product; therefore, care
has to be taken to the external components of the module, as well as any project or
installation issue, because the risk of disturbing the GSM network or external devices or
having impact on the security. Should there be any doubt, please refer to the technical
documentation and the regulations in force. Every module has to be equipped with a proper
antenna with specific characteristics. The antenna has to be installed with care in order to
avoid any interference with other electronic devices and has to guarantee a minimum
distance from the body (20 cm). In case this requirement cannot be satisfied, the system
integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment
introduced on the market. All the relevant information is available on the European
Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available,
while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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13. ACRONYMS

TTSC

Telit Technical Support Center

USB

Universal Serial Bus

HS

High Speed

DTE

Data Terminal Equipment

UART

Universal Asynchronous Receiver Transmitter

I/O

Input Output

GPIO

General Purpose Input Output

CMOS

Complementary Metal – Oxide Semiconductor

CLK

Clock

RTC

Real Time Clock

PCB

Printed Circuit Board

ESR

Equivalent Series Resistance

VSWR

Voltage Standing Wave Radio

VNA

Vector Network Analyzer

RED

Radio Equipment Directive

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14. DOCUMENT HISTORY

Revision

Date

Changes

0

2020-05-11

First issue

1

2020-08-13

Section 5.2.1. – Updated block diagram of WLAN Interface
Section 5.3. – Updated block diagram of BT Interface
Section 5.4. – Updated LE910Cx-WE866C6 Bundling Pin

Map table
Section 7.4. – Added ESD and Thermal Information

2

2020-09-15

11. Conformity Assessment Issues

3

2020-09-22

14.1. Updated operating temperature.

4

2020-01-13

Corrections in section 6.2.1.2, 6.2.1.3 and 6.2.1.4

Mod.0818 2017-01 Rev.0