Telit WE866C3 User Manual

WE866C3

HW Design Guide

1VV0301495 Rev. 15 – 2021-03-31

WE866C3 Hardware Design Guide

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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WE866C3 Hardware Design Guide

USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High­Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third-Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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WE866C3 Hardware Design Guide

WE866C3-P

APPLICABILITY TABLE

PRODUCTS

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WE866C3 Hardware Design Guide

CONTENTS

NOTICE……………. ........................................................................................... 2

COPYRIGHTS .................................................................................................... 2

COMPUTER SOFTWARE COPYRIGHTS ........................................................ 2

USAGE AND DISCLOSURE RESTRICTIONS ................................................. 3

APPLICABILITY TABLE .................................................................................... 4

CONTENTS ........................................................................................................ 5

1. INTRODUCTION .............................................................................. 9

Scope ............................................................................................... 9

Audience........................................................................................... 9

Contact Information, Support ........................................................... 9

Text Conventions ........................................................................... 10

Related Documents ........................................................................ 11

2. GENERAL PRODUCT DESCRIPTION ......................................... 12

Overview......................................................................................... 12

Block Diagram ................................................................................ 12

Product Variants ............................................................................. 12

Target Market ................................................................................. 13

Main Features ................................................................................ 13

3. PINS ALLOCATION ...................................................................... 15

Pin Type Definition ......................................................................... 15

Pin-out ............................................................................................ 15

LGA Pads Layout ........................................................................... 17

4. POWER SUPPLY .......................................................................... 18

Power Supply Requirements ......................................................... 18

Power Consumption ....................................................................... 19

4.2.1. Typical Power Consumption for WLAN Low-Power States .......... 19

4.2.2. Typical Power Consumption for WLAN Continuous Rx [2.4 GHz] 19

4.2.3. Typical Power Consumption for WLAN Continuous Rx [5 GHz] ... 20

4.2.4. Typical Power Consumption for WLAN Continuous Tx [2.4 GHz] 20

4.2.5. Typical Power Consumption for WLAN Continuous Tx [5 GHz] ... 21

4.2.6. Typical Power consumption for BT ................................................ 21

Power Supply Sequencing ............................................................. 23

5. DIGITAL SPECIFICATION ............................................................ 24

DC Electrical Characteristics ......................................................... 24

Interface Ports and Signals ............................................................ 25

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5.2.1. WLAN Interfaces ............................................................................ 25

5.2.1.1. SDIO Interface................................................................................ 25

5.2.1.2. WL_EN ........................................................................................... 25

5.2.1.3. WOW .............................................................................................. 25

5.2.1.4. LF_CLK_IN ..................................................................................... 26

5.2.1.5. Coexistence Use Cases ................................................................. 26

BT Interface .................................................................................... 28

5.3.1.1. BT HCI-UART ................................................................................. 28

5.3.1.2. PCM/I2S ......................................................................................... 28

5.3.1.3. BT_EN ............................................................................................ 29

LE910Cx-WE866C3 Bundling Pin Map ......................................... 29

6. RF SPECIFICATION ...................................................................... 30

RF Frequencies .............................................................................. 30

Tx Output Power ............................................................................ 30

6.2.1. Tx Output Power at Room Temperature ....................................... 30

6.2.1.1. 802.11b (2.4GHz) ........................................................................... 30

6.2.1.2. 802.11g (2.4GHz) ........................................................................... 30

6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 31

6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 31

6.2.1.5. 802.11a (5GHz) .............................................................................. 31

6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 31

6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 32

6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 32

6.2.1.9. Bluetooth TX Power ....................................................................... 32

6.2.2. Tx Output Power at Cold Temperature .......................................... 32

6.2.2.1. 802.11b (2.4GHz) ........................................................................... 32

6.2.2.2. 802.11g (2.4GHz) ........................................................................... 32

6.2.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 33

6.2.2.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 33

6.2.2.5. 802.11a (5GHz) .............................................................................. 33

6.2.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 33

6.2.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 34

6.2.2.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 34

6.2.3. Tx Output Power at Hot Temperature ........................................... 34

6.2.3.1. 802.11b (2.4GHz) ........................................................................... 34

6.2.3.2. 802.11g (2.4GHz) ........................................................................... 34

6.2.3.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 34

6.2.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 35

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6.2.3.5. 802.11a (5GHz) .............................................................................. 35

6.2.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 35

6.2.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 35

6.2.3.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 35

Receiver Sensitivity ........................................................................ 36

6.3.1. Receiver Sensitivity at Room Temperature ................................... 36

6.3.1.1. 802.11b (2.4GHz) ........................................................................... 36

6.3.1.2. 802.11g (2.4GHz) ........................................................................... 36

6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 36

6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 37

6.3.1.5. 802.11a (5GHz) .............................................................................. 37

6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 37

6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 37

6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 38

6.3.1.9. Bluetooth (BER < 0.1%) ................................................................. 38

6.3.2. Receiver Sensitivity at Cold Temperature ..................................... 38

6.3.2.1. 802.11b (2.4GHz) ........................................................................... 38

6.3.2.2. 802.11g (2.4GHz) ........................................................................... 38

6.3.2.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 39

6.3.2.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 39

6.3.2.5. 802.11a (5GHz) .............................................................................. 39

6.3.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 39

6.3.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 40

6.3.2.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 40

6.3.3. Receiver Sensitivity at Hot Temperature ....................................... 40

6.3.3.1. 802.11b (2.4GHz) ........................................................................... 40

6.3.3.2. 802.11g (2.4GHz) ........................................................................... 40

6.3.3.3. 802.11n, Channel BW = 20MHz (2.4GHz) .................................... 40

6.3.3.4. 802.11n, Channel BW = 40MHz (2.4GHz) .................................... 41

6.3.3.5. 802.11a (5GHz) .............................................................................. 41

6.3.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz) .................................. 41

6.3.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz) .................................. 41

6.3.3.8. 802.11ac, Channel BW = 80MHz (5GHz) ..................................... 41

7. DESIGN GUIDELINES .................................................................. 42

General PCB Design Guidelines ................................................... 42

SDIO Interface................................................................................ 42

Voltage Regulator .......................................................................... 42

7.3.1. Recommended Regulators ............................................................ 42

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7.3.2. Regulator Operating Conditions .................................................... 43

7.3.3. ESD and Thermal Information ....................................................... 44

Antenna Requirements .................................................................. 45

7.4.1. Main Antenna ................................................................................. 45

7.4.2. Antenna Cable................................................................................ 45

7.4.3. Antenna Design .............................................................................. 46

7.4.4. Antenna Installation Guidelines ..................................................... 47

8. MECHANICAL DESIGN ................................................................ 48

Mechanical Dimensions ................................................................. 48

8.1.1. Mechanical Drawing ....................................................................... 48

8.1.1.1. Top View......................................................................................... 48

8.1.1.2. Bottom View ................................................................................... 49

8.1.1.3. Side View ....................................................................................... 50

9. APPLICATION PCB DESIGN ....................................................... 51

Recommended Footprint for the Application ................................. 51

PCB Pad Design ............................................................................ 52

PCB Pad Dimensions..................................................................... 53

Stencil ............................................................................................. 54

Solder Paste ................................................................................... 54

Cleaning ......................................................................................... 54

Solder Reflow ................................................................................. 55

10. PACKING SYSTEM ....................................................................... 56

Tray ................................................................................................ 56

Tray Drawing .................................................................................. 57

Moisture Sensitivity ........................................................................ 58

11. CONFORMITY ASSESSMENT ISSUES ...................................... 59

Declaration of Conformity .............................................................. 59

Product Regulatory Compliance Markings .................................... 59

12. SAFETY RECOMMENDATIONS .................................................. 60

READ CAREFULLY ....................................................................... 60

13. ACRONYMS .................................................................................. 61

14. DOCUMENT HISTORY ................................................................. 62

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WE866C3 Hardware Design Guide

1. INTRODUCTION

Scope

This document introduces the Telit WE866C3 module and presents possible and
recommended hardware solutions for developing a product based on this module.

Obviously, this document cannot include every hardware solution or every product that can
be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for properly
developing your product with the Telit module.

Audience

This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit module.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:

• [e-mail]

• [e-mail]

• [e-mail]

• [e-mail]

Alternatively, use:

https://www.telit.com/contact-us/

For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:

https://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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WE866C3 Hardware Design Guide

This information MUST be followed or catastrophic

Alerts the user to important points about

Provides advice and suggestions that may be

Text Conventions

Danger –
equipment failure or bodily injury may occur.

Caution or Warning –
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.

Tip or Information –
useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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WE866C3 Hardware Design Guide

Related Documents

• LE910Cx HW Design Guide 1VV0301298

• Telit EVB User Guide 1VV0301249

• LE910Cx Multi Technology Interface 1VV0301508

Board TLB - HW User Guide

1VV0301495 Rev. 15 Page 11 of 64 2021-01-20

WE866C3 Hardware Design Guide

QCA9377

5G

Fil ter

5G
PA

Diplexer

2.4G

Fil ter

48MH z

XO

TX/RX

TX/RX

SDI O

WL_EN

WO W

LT E_COEX

32K_IN

3.3V

VDD_IO

BT_UART

BT_EN

I2S/PCM

Cou pler

ANT

2. GENERAL PRODUCT DESCRIPTION

Overview

The WE866C3 is a low power and low-cost WIFI/BT wireless module solution based on
Qualcomm QCA9377-3. It supports 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT

4.2 + HS + BLE, enabling seamless integration of WLAN/BT and low energy. It is a perfect
companion solution for Telit cellular modules such as LE910Cx or LE920A4.
WE866C3 supports low-power SDIO 3.0 interface for WLAN and a UART/PCM interface
for BT. WE866C3 also supports BT-WLAN coexistence and uses the 2-wire ISM-LTE
coexistence interface.

Block Diagram

The following figure shows a high-level block diagram of WE866C3 module and its major
functional blocks.

• Power supply

• SDIO

• PCM and UART

• RF Antenna

Figure 1 WE866C3 Module Block Diagram

Product Variants

WE866C3 variants are listed below:

Product Description

WE866C3-P 1x1 WIFI/BT wireless module

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WE866C3 Hardware Design Guide

Target Market

WE866C3 can be used in IoT applications complementing client data availability coverage
of the Cellular modems, with low power and low cost, for example:

• Bridging LTE / WLAN

• Industrial floor

• Healthcare instrument data terminals

• Smart Home automation and remote control

Main Features

Feature Specification

Power

Interfaces

Supported
Data Rate

Main supply voltage: 3.3V

VIO supply voltage: 1.8V or 3.3V

WLAN SDIO 3.0

BT UART

BT PCM/I2S

LTE Coexistence UART (WCI)

Low frequency 32.768KHz sleep clock

Single Antenna port, 50 Ohm

Control signals

802.11a (5GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11b (2.4GHz): 1, 2, 5.5, 11Mbps

802.11g (2.4GHz): 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n (2.4GHz/5GHz):

• 20Mhz BW: Up to 72.2Mbps using short GI (MCS0-7)

• 40Mhz BW: Up to 144.4Mbps using short GI (MCS0-7)

802.11ac (5GHz): HT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)

802.11a / 54Mbps: 14 dbm

802.11b / 11Mbps: 18 dbm

802.11g / 54Mbps: 15 dbm

Transmission
Power

802.11n / HT20 (MCS7): 15 dbm

802.11ac / HT20 (MCS0): 15.5 dbm

802.11ac / VHT40 (MCS9): 11 dbm

802.11ac / VHT80 (MCS9): 10.5 dbm

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WE866C3 Hardware Design Guide

Data
Standard

Operating
Modes

IEEE 802.11a/b/g/n/ac

Access Point

Station

Modulation BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM

Size: 15±0.15 x 13±0.15 x 2.15±0.15 mm

Mechanical

Package: LGA

Weight: 1g

1)

Temperature
Range

Operating: -30°C to +85°C

Storage and non-operating: -40°C to +105°C

RoHS All hardware components are fully compliant with EU RoHS directive

Notes:

1) The module complies with IEEE standard.

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WE866C3 Hardware Design Guide

BT UART interface

B3

BT_CTS

VIO

DI

Bluetooth HCI-UART CTS signal

B4

BT_RTS

VIO

DO

Bluetooth HCI-UART RTS signal

A5

BT_RXD

VIO

DI

Bluetooth HCI-UART RXD signal

A4

BT_TXD

VIO

DO

Bluetooth HCI-UART TXD signal

BT PCM interface

C6

BT_I2S_SDI

VIO

DI, PU

Bluetooth PCM/I2S Input signal, Internal Pull-Up

C5

BT_I2S_WS

VIO B Bluetooth PCM/I2S Frame Sync signal

D5

BT_I2S_SCK

VIO

B, PD

Bluetooth PCM/I2S Bit CLK signal

D6

BT_I2S_SDO

VIO

DO

Bluetooth PCM/I2S output signal

Low power Clock signal

B5

LF_CLK_IN

VIO

DI, PD

External low–power 32.768 kHz clock input

Host wake pins

OD,
PU

Wake on Wireless. WIFI/BT Wakeup host.
Active Low, Internal Pull-Up

SDIO 3.0 interface

D7

SDIO_CLK

VIO

DI, PU

SDIO clock signal Input, Internal Pull-Up

E7

SDIO_CMD

VIO B SDIO CMD line signal

C7

SDIO_D0

VIO B SDIO data bus D0

B6

SDIO_D1

VIO B SDIO data bus D1

A6

SDIO_D2

VIO

B, PU

SDIO data bus D2, Internal Pull-Up

B7

SDIO_D3

VIO B SDIO data bus D3

signals

/ AUX UART RXD

Secondary UART - LTE coexistence UART_TXD
/ AUX_UART_TXD

3. PINS ALLOCATION

Pin Type Definition

Type Description

DI Digital Input

DO Digital Output

PD Pull-Down

PU Pull-Up

OD Open-Drain Output

B Bi-Directional

AI Analog/RF Input

AO Analog/RF Output

P Power Input

Note: Pins directions are with respect to the WE866C3 module.

Pin-out

Pin Pin Name

D4 WOW VIO

Pin Reference
Voltage

Pin
Type

Pin Description

Coexistence and control

C3 LTE_UART_RX VIO DI, PU

C4 LTE_UART_TX VIO DO

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Secondary UART - LTE coexistence UART RXD

WE866C3 Hardware Design Guide

G5

WL_EN

VIO

DI, PD

WLAN enable (Active high)

G6

BT_EN

VIO

DI, PD

Bluetooth enable (Active high)

RF Antennas

Antenna 1 - Main Antenna for modules with a
single antenna configuration

G3

RFU ANT2

NA

NA

Reserved for Antenna 2.

Power

A1

VDD_3.3V

3.13 V to 3.46 V

P

Main Input voltage (WIFI & BT)

A2

VDD_3.3V

3.13 V to 3.46 V

P

Main Input voltage (WIFI & BT)

A3

VDDIO

1.8 V or 3.3 V

P

Voltage supply for all I/O signals (1.71V - 3.46V)

A7

GND

– – Power Ground

B1

GND

– – Power Ground

B2

GND

– – Power Ground

C1

GND

– – Power Ground

C2

GND

– – Power Ground

D2

GND

– – Power Ground

E1

GND

– – Power Ground

E2

GND

– – Power Ground

F1

GND

– – Power Ground

F2

GND

– – Power Ground

F3

GND

– – Power Ground

F4

GND

– – Power Ground

G2

GND

– – Power Ground

G4

GND

– – Power Ground

G7

GND

– – Power Ground

Factory use

D3

RFU

NC - Reserved for future use. No connect.

E3

RFU

NC - Reserved for future use. No connect.

E4

RFU

NC - Reserved for future use. No connect.

E5

RFU

NC - Reserved for future use. No connect.

E6

RFU

NC - Reserved for future use. No connect.

F5

RFU

NC - Reserved for future use. No connect.

F6

RFU

NC - Reserved for future use. No connect.

F7

RFU

NC - Reserved for future use. No connect.

G1

RFU

NC - Reserved for future use. No connect.

Pin Pin Name

D1 ANT1 A AI, AO

Pin Reference
Voltage

Pin
Type

Pin Description

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WE866C3 Hardware Design Guide

LGA Pads Layout

A B C D E F G

1 VDD_3.3V GND GND ANT1 GND GND RFU

2 VDD_3.3V GND GND GND GND GND GND

3 VDDIO

BT_TXD

4

5

6 SDIO_D2 SDIO_D1

7 GND SDIO_D3 SDIO_D0

(O)

BT_RXD

(I)

BT_CTS

(I)

BT_RTS

(O)

LF_CLK_IN

(I)

LTE_UART_RX

(I)

LTE_UART_TX

(O)

BT_I2S_WS

(I)

BT_I2S_SDI

(I)

RFU RFU GND RFU (ANT2)

WOW

(OD)

BT_I2S_SCK

(I)

BT_I2S_SDO

(O)

SDIO_CLK

(I)

RFU GND GND

RFU RFU

RFU RFU

SDIO_CMD RFU GND

WL_EN

(I)

BT_EN

(I)

TOP VIEW

WARNING

Reserved pins must not be connected.

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WE866C3 Hardware Design Guide

4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product

design and they strongly reflect on the product overall performances, hence read carefully

the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

There are two power supply inputs to the module. The main power supply, connected to

VDD_3.3V input and the VDDIO input, each must fulfill the following requirements:

VDD_3.3V Input Minimum Maximum

Absolute Maximum Voltage -0.3 V 3.65 V

Nominal Supply Voltage 3.3 V -

Normal Operating Voltage Range 3.135 V 3.465 V

VDDIO Input Minimum Maximum

Absolute Maximum Voltage -0.3 V 4.0 V

Nominal Supply Voltage 1.8V or 3.3V -

Normal Operating Voltage Range 1.71 V 3.46 V

NOTE:

The Maximum Voltage MUST never be exceeded; care must be

taken when designing the application’s power supply section to avoid

having an excessive voltage drop.

If the voltage drop is exceeding the limits it could lead to degradation

of performance or cause a Power Off of the module.

1VV0301495 Rev. 15 Page 18 of 64 2021-01-20

WE866C3 Hardware Design Guide

Total power

(VDDIO = 1.8V)

Total power consumption [mA]

(VDDIO = 1.8V)

Power Consumption

The below tables provides the typical current consumption values of the module for the
various available modes.

4.2.1. Typical Power Consumption for WLAN Low-Power States

Mode

Standby 0.2 Deep Sleep

Power Save, 2.4GHz

Power Save, 5GHz

4.2.2. Typical Power Consumption for WLAN Continuous Rx [2.4 GHz]

consumption [mA]

1.3 DTIM=1

0.8

0.6 DTIM=10

1.5 DTIM=1

0.9 DTIM=3

0.7 DTIM=10

Mode Description

DTIM=3

Rate

11b 1Mbps 60

11b 11Mbps 62

11g 54Mbps

MCS0 HT20

MCS7 HT20

70

67

69

1VV0301495 Rev. 15 Page 19 of 64 2021-01-20

WE866C3 Hardware Design Guide

Total Power Consumption [mA]

(VDDIO = 1.8V)

Total Power Consumption [mA]

(VDDIO = 1.8V)

4.2.3. Typical Power Consumption for WLAN Continuous Rx [5 GHz]

Rate

MCS0 HT20 96

MCS7 HT20 94

MCS8 VHT20

MCS0 HT40 94

MCS7 HT40 99

MCS8 VHT40 115

MCS9 VHT40 100

MCS7 VHT80 130

MCS8 VHT80 162

MCS9 VHT80 131

4.2.4. Typical Power Consumption for WLAN Continuous Tx [2.4 GHz]

112

Rate

11b 1Mbps 365

11b 11Mbps 362

11g 54Mbps 340

MCS0 HT20 348

MCS7 HT20 335

1VV0301495 Rev. 15 Page 20 of 64 2021-01-20

WE866C3 Hardware Design Guide

Total Power Consumption [mA]

(VDDIO = 1.8V)

Total Power Consumption [mA]

(VDDIO = 1.8V)

4.2.5. Typical Power Consumption for WLAN Continuous Tx [5 GHz]

Rate

MCS0 HT20 495

MCS7 HT20 432

MCS8 VHT20 422

MCS0 HT40

MCS7 HT40 435

MCS8 VHT40 432

MCS9 VHT40 429

MCS7 VHT80 440

MCS8 VHT80 438

MCS9 VHT80

4.2.6. Typical Power consumption for BT

Rate

Continuous Rx burst 25

Continuous TX Class 2 (+4 dBm) 42

475

436

Continuous TX Class 2 (+12.5 dBm) 70

1.28 sec page scan (non-interlaced)

1.28 sec LE ADV 0.23

1.28 sec Sniff as master 0.21

1.28 sec Sniff as slave 0.26

1VV0301495 Rev. 15 Page 21 of 64 2021-01-20

0.36

WE866C3 Hardware Design Guide

NOTE:

Current consumptions specification refers to typical samples and
typical material.

Values represent an average measurement done over few seconds.

Values may vary depending on network and environmental

conditions.

Power consumptions values obtained with VDD_3.3V = 3.3V and

VDDIO = 1.8V.

NOTE:

Current consumption is measured at the system level and is the sum

of both VDD_3.3V and VDDIO current consumpotions.

NOTE:

Current consumption related to WLAN and BT TX cases are

measured at typical TX output power as listed in 6.2.

1VV0301495 Rev. 15 Page 22 of 64 2021-01-20

WE866C3 Hardware Design Guide

VBATT

VDD IO

VDD_3.3V

WL_EN

BT_EN

LF_CLK_IN

Powe r up N ormal Ope ration Powe r downNorm al OperationReset

90% of VDDIO to 10% of 3.3V
Minimum 0 Sec

90% of 3.3V to WL_E N and BT_EN high
Minimum 10 uSec

WLAN_EN valid to LF_CLK_IN
Minim um 0 Sec

WL_EN and BT_EN low to 90% of 3.3V
Minim um 10 uSec

might damage the device and

Power Supply Sequencing

The recommended power sequence between VDD_3.3V and VDDIO inputs is as shown
below:

Notes:

1. VDDIO voltage should match VIO voltage of the host. In some applications, it may
connect to 3.3 V matching the Host VIO voltage.

2. All host interface signals must stay floating or low before valid power on sequence
WL_EN/BT_EN = ”High”, and after WL_EN/BT_EN = “Low”.

Warning:

Please carefully follow the recommended power Up/Down sequencing.
Not following the recommended procedure
consequently void the warranty.

1VV0301495 Rev. 15 Page 23 of 64 2021-01-20

WE866C3 Hardware Design Guide

5. DIGITAL SPECIFICATION

DC Electrical Characteristics

Parameter Min Typical Max Unit

High-level input voltage 0.7 * VDDIO - VDDIO + 0.3 V

Low-level input voltage -0.3 - 0.3 * VDDIO V

Input low leakage current
(VIN = 0 V Supply =
VDDIO max)

-5.0 0 5.0 μA

Input pull resistor

(Up or down)

High-level output voltage VDDIO - 0.4 - VDDIO V

Low-level output voltage 0 - 0.4 V

High-level output current 3 - - mA

Low-level output current - - -11 mA

Input capacitance - - 3 pF

-

1.8V IO: 120

- kΩ

3.3V IO: 70

1VV0301495 Rev. 15 Page 24 of 64 2021-01-20

WE866C3 Hardware Design Guide

Interface Ports and Signals

5.2.1. WLAN Interfaces

The following figure shows the WLAN related interface connection between the WE866C3
module and the LTE modem module.

The following clauses describe the various interfaces.

5.2.1.1. SDIO Interface

SDIO is the main interface used for WLAN Data and control.

The WE866C3 has a 4-bit SDIO port which supports SDIO3.0 standard with up to 200Mhz
clock. The figure above shows the SDIO interface connection diagram.

5.2.1.2. WL_EN

WL_EN is used to control the WLAN function of WE866C3 module. When WL_EN is at a
high level, WLAN function will be enabled.

5.2.1.3. WOW

The purpose of the WOW (Wake on Wireless) signal is to wake up the host. When WOW
signal is driven low, it can wake up the host.

1VV0301495 Rev. 15 Page 25 of 64 2021-01-20

WE866C3 Hardware Design Guide

5.2.1.4. LF_CLK_IN

The LF_CLK_IN 32 kHz clock is used in low-power modes such as IEEE power-save and
sleep. It serves as a timer to determine when to wake up to receive beacons in various
power-save schemes and to maintain basic logic operations when in sleep.

The module does not require an external 32 kHz clock. By default, it utilizes its internal clock
shared with the WLAN and BT subsystem.

If the end application has a more accurate 32 kHz clock (as in the case of using the Telit
LTE module solution), then it can be supplied externally via the LF_CLK_IN pin. The
LF_CLK_IN pin must be grounded when using the default internal clock mode.

If an external 32 kHz clock is used, the requirements are:

Parameter Min Typical Max Unit

Frequency - 32.768 - KHz

Rise/Fall time 1 - 100 nS

Duty Cycle 15 - 85 %

Frequency stability -200 - 200 Ppm

Input High Voltage 0.8 x VDDIO - VDDIO + 0.2 V

Input Low Voltage -0.3 - 0.2 x VDDIO V

5.2.1.5. Coexistence Use Cases

Wireless Local Area Network (WLAN) and Bluetooth® (BT) share the same 2.4GHz ISM
bands. LTE network bands (band 38/40/41 for TDD and band 7 for FDD uplink) are adjacent
to the WLAN bands and as such can cause severe de-sensing of the WLAN receive. In the
same way, WLAN transmission can cause severe de-sensing of the LTE receive path.

Interference is mostly relevant due to adjacent bands and the limited isolation when both
reside in the same platform.

This interference can be mitigated to some extent with by sharing communication and
network related information between LTE modem and WLAN/BT device.

This information is communicated between the 2 entities over the coexistence UART.

NOTE:

The coexistance interface can be used only with Telit recommended

bundling of LE910Cx and WE866C3.

1VV0301495 Rev. 15 Page 26 of 64 2021-01-20

WE866C3 Hardware Design Guide

Design #1.

Design #2.

1VV0301495 Rev. 15 Page 27 of 64 2021-01-20

WE866C3 Hardware Design Guide

BT Interface

The following figure shows the BT interface connection between the WE866C3 module and
the modem module.

The BT controller consists of BT radio and digital baseband blocks. It is controlled by the
host through the UART. The BT audio interface can be configured to UART/PCM (I2S). The
BT power on/off is controlled through BT_EN.

5.3.1.1. BT HCI-UART

The BT HCI-UART provides a communication interface between the host and BT
controller.

5.3.1.2. PCM/I2S

This is the synchronous interface for audio data.

The BT synchronous audio interface can support either PCM or I2S protocols.

The BT asynchronous audio interface is for a stereo audio A2DP profile through HCI-UART.

Supports multiple codec types:

• Narrowband speech with integrated CVSD codec over PCM or HCI

• Wideband speech with integrated SBC codec over PCM or HCI

The BT controller can configure the interface to master or slave mode for PCM or I2S. It
defaults to slave mode to avoid driving PCM_SYNC and PCM_CLK signals.

The maximum I2S clock frequency is supported up to 2.4 MHz

1VV0301495 Rev. 15 Page 28 of 64 2021-01-20

WE866C3 Hardware Design Guide

J13

WiFi_SD0

I/O

C7

SDIO_D0

I/O

M13

WiFi_SD1

I/O

B6

SDIO_D1

I/O

K13

WiFi_SD2

I/O

A6

SDIO_D2

I/O

H13

WiFi_SD3

I/O

B7

SDIO_D3

I/O

L13

WiFi_SD_CLK

O

D7

SDIO_CLK

O

M15

C104/RXD

O

A5

BT_RXD

I

N15

C103/TXD

I

A4

BT_TXD

O

P15

C106/CTS

O

B3

BT_CTS

I

L14

C105/RTS

I

B4

BT_RTS

O

B9

DVI_WAO

O

C5

BT_I2S_WS

I

B7

DVI_TX

O

C6

BT_I2S_SDI

I

B8

DVI_CLK

O

D5

BT_I2S_SCK

I

B6

DVI_RX

I

D6

BT_I2S_SDO

O

C13

GPIO_07

O

G6

BT_EN

I

L4

WOW I D4

WOW

O

M8

WCI_TX

O

C3

LTE_UART_RX

I

M9

WCI_RX

I

C4

LTE_UART_TX

O

M11

WLAN_SLEEP_CLK

O

B5

LF_CLK_IN

I

E13

WLAN_PWR_EN

O

* see Note 1

5.3.1.3. BT_EN

This signal enables/ disables Bluetooth by asserting or de-esserting it from the host.

LE910Cx-WE866C3 Bundling Pin Map

LE910Cx

Pin #

LE910Cx

Signal

LE910Cx

I/O

WE866C3

Pin #

WE866C3

Signal

WE866C3

L12 WiFi_SDRST O G5 WL_EN I

N13 WiFi_SD_CMD O E7 SDIO_CMD I

I/O

Note 1:

Connect E13 to enable pin of power regulators which supply power to WE866C3
(3.3V & 1.8V)

If the LE910Cx main UART is already used for a specific function, pins F15, E15, D15, and
H14 can be used for BT interface of WE866C3. AT#PORTCFG=16 command is needed for
switching UART interface.

Pin # Signal I/O Pin# Signal I/O

F15 SPI_CLK/RTS O B3 BT_CTS I

E15 SPI_MISO/ RX_AUX I A4 BT_TXD O

D15 SPI_MOSI/TX_AUX O A5 BT_RXD I

H14 SPI_CS/GPIO11/CTS I B4 BT_RTS O

1VV0301495 Rev. 15 Page 29 of 64 2021-01-20

WE866C3 Hardware Design Guide

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

1 Mbps

14

17

18

dBm

QPSK

2 Mbps

14

17

18

dBm

CCK

5.5Mbps

14

17

18

dBm

CCK

11 Mbps

14

17

18

dBm

CHL/CHM/CHH

CHL/CHM/CHH

CHL/CHM/CHH

BPSK

6 Mbps

14

16.5

16.5

dBm

BPSK

9 Mbps

14

16.5

16.5

dBm

QPSK

12 Mbps

14

16.5

16.5

dBm

QPSK

18 Mbps

14

16.5

16.5

dBm

16 QAM

24 Mbps

14

15.5

15.5

dBm

16 QAM

36 Mbps

14

15.5

15.5

dBm

64 QAM

48 Mbps

14

15.5

15,5

dBm

64 QAM

54 Mbps

14

15

15

dBm

Parameter

Conditions

Frequency Range

6. RF SPECIFICATION

RF Frequencies

The following table is listing the supported frequencies:

WLAN Center channel
frequency for 2.4 GHz

WLAN Center channel
frequency for 5 GHz

BT Frequency range BT Specification:

Center frequency at 5 MHz
spacing

Center frequency at 5 MHz
spacing

2.4 ≤ f ≤ 2.4835

Center frequency f = 2402 + k,
where k is the channel number.

2.412 – 2.484 GHz

4.9 – 5.925 GHz

2402 – 2480 MHz

Tx Output Power

The following clauses lists the measured Tx output power of WE866C3.

Measurements are averaged and are done at the module Antenna pad.

The output power listed in the following tables indicates the highest level which allows to
meet the 802.11x standard with regards to ACLR and EVM values.

6.2.1. Tx Output Power at Room Temperature

The tables below are measured at 25°C with VDD_3.3V = 3.3V and VDDIO=1.8V.

6.2.1.1. 802.11b (2.4GHz)

Modulation Data rate

6.2.1.2. 802.11g (2.4GHz)

Modulation Data rate

FCC

ETSI

Other

Units

Units

1VV0301495 Rev. 15 Page 30 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

14

16.5

16.5

dBm

QPSK

MCS1

14

16.5

16.5

dBm

QPSK

MCS2

14

16.5

16.5

dBm

16 QAM

MCS3

14

16

16

dBm

16 QAM

MCS4

14

16

16

dBm

64 QAM

MCS5

14

15.5

15.5

dBm

64 QAM

MCS6

14

15.5

15.5

dBm

64 QAM

MCS7

14

15

15

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

12

15

15

dBm

QPSK

MCS1

12

15

15

dBm

QPSK

MCS2

12

15

15

dBm

16 QAM

MCS3

12

14.5

14.5

dBm

16 QAM

MCS4

12

14.5

14.5

dBm

64 QAM

MCS5

12

13.5

13.5

dBm

64 QAM

MCS6

12

13.5

13.5

dBm

64 QAM

MCS7

12

13

13

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

6 Mbps

14

15/15/9

16.5

dBm

BPSK

9 Mbps

14

15/15/9

16.5

dBm

QPSK

12 Mbps

14

15/15/9

16.5

dBm

QPSK

18 Mbps

14

15/15/9

16.5

dBm

16 QAM

24 Mbps

14

15/15/9

16.5

dBm

16 QAM

36 Mbps

14

15/15/9

16.5

dBm

64 QAM

48 Mbps

14

14.5/14.5/9

14.5

dBm

64 QAM

54 Mbps

14

14/14/9

14

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

14

15/15/9

15.5

dBm

QPSK

MCS1

14

15/15/9

15.5

dBm

QPSK

MCS2

14

15/15/9

15.5

dBm

16 QAM

MCS3

14

15/15/9

15

dBm

16 QAM

MCS4

14

15/15/9

15

dBm

64 QAM

MCS5

14

14/14/9

14

dBm

64 QAM

MCS6

13.5

13.5/13.5/9

13.5

dBm

64 QAM

MCS7

12 (ac Only)

13/13/9(ac Only)

13 (ac Only)

dBm

6.2.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

6.2.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

Units

Units

6.2.1.5. 802.11a (5GHz)

Modulation

6.2.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

Units

Units

1VV0301495 Rev. 15 Page 31 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

12

15/15/9

15.5

dBm

256 QAM

MCS9

9 (ac Only)

11/11/9(ac Only)

11 (ac Only)

dBm

Data rate

FCC

ETSI

Other

BPSK

MCS0

9

15/15/9

15.5

dBm

256 QAM

MCS9

9

10.5/10.5/9

10.5

dBm

BR

GFSK

7.7

dBm

π/4 DQPSK

4.7

dBm

8DPSK

4.7

dBm

BLE

GFSK

3.9

dBm

CHL/CHM/CHH

CHL/CHM/CHH

CHL/CHM/CHH

BPSK

1 Mbps

14.5

17.5

18.5

dBm

QPSK

2 Mbps

14.5

17.5

18.5

dBm

CCK

5.5Mbps

14.5

17.5

18.5

dBm

CCK

11 Mbps

14.5

17.5

18.5

dBm

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

6 Mbps

14.5

17

17

dBm

BPSK

9 Mbps

14.5

17

17

dBm

QPSK

12 Mbps

14.5

17

17

dBm

QPSK

18 Mbps

14.5

17

17

dBm

16 QAM

24 Mbps

14.5

16

16

dBm

16 QAM

36 Mbps

14.5

16

16

dBm

64 QAM

48 Mbps

14.5

16

16

dBm

64 QAM

54 Mbps

14.5

15.5

15.5

dBm

6.2.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

6.2.1.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

Index

CHL/CHM/CHH

CHL/CHM/CHH

CHL/CHM/CHH

6.2.1.9. Bluetooth TX Power

BT Spec Modulation CHL/CHM/CHH Units

EDR

6.2.2. Tx Output Power at Cold Temperature

The tables below are measured at -40°C with VDD_3.3V = 3.3V and VDDIO=1.8V.

Units

Units

6.2.2.1. 802.11b (2.4GHz)

Modulation Data rate

6.2.2.2. 802.11g (2.4GHz)

Modulation Data rate

FCC

ETSI

Other

Units

Units

1VV0301495 Rev. 15 Page 32 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

14.5

17

17

dBm

QPSK

MCS1

14.5

17

17

dBm

QPSK

MCS2

14.5

17

17

dBm

16 QAM

MCS3

14.5

16.5

16.5

dBm

16 QAM

MCS4

14.5

16.5

16.5

dBm

64 QAM

MCS5

14.5

16

16

dBm

64 QAM

MCS6

14.5

16

16

dBm

64 QAM

MCS7

14.5

15.5

15.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

12.5

15.5

15.5

dBm

QPSK

MCS1

12.5

15.5

15.5

dBm

QPSK

MCS2

12.5

15.5

15.5

dBm

16 QAM

MCS3

12.5

15

15

dBm

16 QAM

MCS4

12.5

15

15

dBm

64 QAM

MCS5

12.5

14

14

dBm

64 QAM

MCS6

12.5

14

14

dBm

64 QAM

MCS7

12.5

13.5

13.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

6 Mbps

14.5

15.5/15.5/9.5

17

dBm

BPSK

9 Mbps

14.5

15.5/15.5/9.5

17

dBm

QPSK

12 Mbps

14.5

15.5/15.5/9.5

17

dBm

QPSK

18 Mbps

14.5

15.5/15.5/9.5

17

dBm

16 QAM

24 Mbps

14.5

15.5/15.5/9.5

17

dBm

16 QAM

36 Mbps

14.5

15.5/15.5/9.5

17

dBm

64 QAM

48 Mbps

14.5

15/15/9.5

15

dBm

64 QAM

54 Mbps

14.5

14.5/14.5/9

14.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

14.5

15.5/15.5/9.5

16

dBm

QPSK

MCS1

14.5

15.5/15.5/9.5

16

dBm

QPSK

MCS2

14.5

15.5/15.5/9.5

16

dBm

16 QAM

MCS3

14.5

15.5/15.5/9.5

15.5

dBm

16 QAM

MCS4

14.5

15.5/15.5/9.5

15.5

dBm

64 QAM

MCS5

14.5

14.5/14.5/9.5

14.5

dBm

64 QAM

MCS6

14

14/14/9.5

14

dBm

13.5/13.5/9.5
(ac Only)

6.2.2.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

6.2.2.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

Units

Units

6.2.2.5. 802.11a (5GHz)

Modulation

6.2.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

Units

Units

64 QAM MCS7 12.5(ac Only)

1VV0301495 Rev. 15 Page 33 of 64 2021-01-20

13.5(ac Only) dBm

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

12.5

15.5/15.5/9.5

16

dBm

11.5/11.5/9.5
(ac Only)

Index

CHL/CHM/CHH

CHL/CHM/CHH

CHL/CHM/CHH

BPSK

MCS0

9.5

15.5/15.5/9.5

16

dBm

256 QAM

MCS9

9.5

11/11/9.5

11

dBm

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

1 Mbps

13.5

16.5

17.5

dBm

QPSK

2 Mbps

13.5

16.5

17.5

dBm

CCK

5.5Mbps

13.5

16.5

17.5

dBm

CCK

11 Mbps

13.5

16.5

17.5

dBm

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

6 Mbps

13.5

16

16

dBm

BPSK

9 Mbps

13.5

16

16

dBm

QPSK

12 Mbps

13.5

16

16

dBm

QPSK

18 Mbps

13.5

16

16

dBm

16 QAM

24 Mbps

13.5

15

15

dBm

16 QAM

36 Mbps

13.5

15

15

dBm

64 QAM

48 Mbps

13.5

15

15

dBm

64 QAM

54 Mbps

13.5

14.5

14.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

13.5

16

16

dBm

QPSK

MCS1

13.5

16

16

dBm

QPSK

MCS2

13.5

16

16

dBm

16 QAM

MCS3

13.5

15.5

15.5

dBm

16 QAM

MCS4

13.5

15.5

15.5

dBm

64 QAM

MCS5

13.5

15

15

dBm

64 QAM

MCS6

13.5

15

15

dBm

64 QAM

MCS7

13.5

14.5

14.5

dBm

6.2.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

256 QAM MCS9 9 .5(ac Only)

11.5(ac Only) dBm

6.2.2.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

Data rate

FCC

ETSI

Other

6.2.3. Tx Output Power at Hot Temperature

The tables below are measured at +85°C with VDD_3.3V = 3.3V and VDDIO=1.8V.

6.2.3.1. 802.11b (2.4GHz)

Modulation Data rate

Units

Units

Units

6.2.3.2. 802.11g (2.4GHz)

Modulation Data rate

6.2.3.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

Units

Units

1VV0301495 Rev. 15 Page 34 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

11.5

14.5

14.5

dBm

QPSK

MCS1

11.5

14.5

14.5

dBm

QPSK

MCS2

11.5

14.5

14.5

dBm

16 QAM

MCS3

11.5

14

14

dBm

16 QAM

MCS4

11.5

14

14

dBm

64 QAM

MCS5

11.5

13

13

dBm

64 QAM

MCS6

11.5

13

13

dBm

64 QAM

MCS7

11.5

12.5

12.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

6 Mbps

13.5

14.5/14.5/8.5

16

dBm

BPSK

9 Mbps

13.5

14.5/14.5/8.5

16

dBm

QPSK

12 Mbps

13.5

14.5/14.5/8.5

16

dBm

QPSK

18 Mbps

13.5

14.5/14.5/8.5

16

dBm

16 QAM

24 Mbps

13.5

14.5/14.5/8.5

16

dBm

16 QAM

36 Mbps

13.5

14.5/14.5/8.5

16

dBm

64 QAM

48 Mbps

13.5

14/14/8.5

14

dBm

64 QAM

54 Mbps

13.5

13.5/13.5/8.5

13.5

dBm

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

13.5

14.5/14.5/8.5

15

dBm

QPSK

MCS1

13.5

14.5/14.5/8.5

15

dBm

QPSK

MCS2

13.5

14.5/14.5/8.5

15

dBm

16 QAM

MCS3

13.5

14.5/14.5/8.5

14.5

dBm

16 QAM

MCS4

13.5

14.5/14.5/8.5

14.5

dBm

64 QAM

MCS5

13.5

13.5/13.5/8.5

13.5

dBm

64 QAM

MCS6

13

13/13/8.5

13

dBm

12.5/12.5/8.5
(ac Only)

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

11.5

14.5/14.5/8.5

15

dBm

10.5/10.5/8.5
(ac Only)

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

BPSK

MCS0

8.5

14.5/14.5/8.5

15

dBm

6.2.3.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

6.2.3.5. 802.11a (5GHz)

Modulation

Units

Units

6.2.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

64 QAM MCS7 11.5(ac Only)

6.2.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

256 QAM MCS9 8.5(ac Only)

6.2.3.8. 802.11ac, Channel BW = 80MHz (5GHz)

Units

12.5(ac Only) dBm

Units

10.5(ac Only) dBm

Modulation

1VV0301495 Rev. 15 Page 35 of 64 2021-01-20

Units

WE866C3 Hardware Design Guide

Data rate

Index

FCC

CHL/CHM/CHH

ETSI

CHL/CHM/CHH

Other

CHL/CHM/CHH

256 QAM

MCS9

8.5

10/10/8.5

10

dBm

Typical

BPSK

1 Mbps

-93

dBm

QPSK

2 Mbps

-91

dBm

CCK

5.5Mbps

-88

dBm

CCK

11 Mbps

-87

dBm

Typical

sensitivity

BPSK

6 Mbps

-89

dBm

BPSK

9 Mbps

-88

dBm

QPSK

12 Mbps

-87

dBm

QPSK

18 Mbps

-85

dBm

16 QAM

36 Mbps

-78

dBm

64 QAM

48 Mbps

-74

dBm

64 QAM

54 Mbps

-73

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-88

dBm

QPSK

MCS1

-85

dBm

QPSK

MCS2

-83

dBm

16 QAM

MCS3

-80

dBm

16 QAM

MCS4

-76

dBm

64 QAM

MCS5

-71

dBm

64 QAM

MCS6

-70

dBm

64 QAM

MCS7

-69

dBm

Modulation

Receiver Sensitivity

The following clauses lists the receiver sensitivity WE866C3.

Measurements are done at the module Antenna pad with 10% packet error rate.

6.3.1. Receiver Sensitivity at Room Temperature

All measurements data are taken at 25°C and VDDIO=1.8V.

6.3.1.1. 802.11b (2.4GHz)

Modulation Data rate

6.3.1.2. 802.11g (2.4GHz)

Modulation Data rate

sensitivity

Units

Units

Units

16 QAM 24 Mbps -82 dBm

6.3.1.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

Units

1VV0301495 Rev. 15 Page 36 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-85

dBm

QPSK

MCS1

-82

dBm

QPSK

MCS2

-80

dBm

16 QAM

MCS3

-77

dBm

16 QAM

MCS4

-73

dBm

64 QAM

MCS5

-68

dBm

64 QAM

MCS6

-67

dBm

64 QAM

MCS7

-66

dBm

Typical

sensitivity

BPSK

6 Mbps

-90

dBm

BPSK

9 Mbps

-89

dBm

QPSK

12 Mbps

-88

dBm

QPSK

18 Mbps

-86

dBm

16 QAM

24 Mbps

-83

dBm

16 QAM

36 Mbps

-79

dBm

64 QAM

48 Mbps

-75

dBm

64 QAM

54 Mbps

-74

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-89

dBm

QPSK

MCS1

-86

dBm

QPSK

MCS2

-84

dBm

16 QAM

MCS3

-81

dBm

16 QAM

MCS4

-77

dBm

64 QAM

MCS5

-72

dBm

64 QAM

MCS6

-71

dBm

64 QAM

MCS7

-70

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-86

dBm

64 QAM

MCS7

-67

dBm

256 QAM

MCS8

-65

dBm

256 QAM

MCS9

-64

dBm

6.3.1.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

6.3.1.5. 802.11a (5GHz)

Modulation Data rate

Units

Units

6.3.1.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

6.3.1.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

Units

Units

1VV0301495 Rev. 15 Page 37 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

Typical

sensitivity

256 QAM

MCS8

-63

dBm

256 QAM

MCS9

-62

dBm

Typical

sensitivity

BR

GFSK

-91

dBm

π/4 DQPSK

-90

dBm

-83

dBm

BLE

GFSK

-94

dBm

Typical

sensitivity

BPSK

1 Mbps

-94

dBm

QPSK

2 Mbps

-92

dBm

CCK

5.5Mbps

-89

dBm

CCK

11 Mbps

-88

dBm

Typical

BPSK

6 Mbps

-90

dBm

BPSK

9 Mbps

-89

dBm

QPSK

12 Mbps

-88

dBm

QPSK

18 Mbps

-86

dBm

16 QAM

24 Mbps

-83

dBm

64 QAM

54 Mbps

-73

dBm

6.3.1.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

6.3.1.9. Bluetooth (BER < 0.1%)

BT Spec Modulation

EDR

8DPSK

6.3.2. Receiver Sensitivity at Cold Temperature

All measurements data are taken at -40°C and VDDIO=1.8V.

6.3.2.1. 802.11b (2.4GHz)

Modulation Data rate

Units

Units

Units

6.3.2.2. 802.11g (2.4GHz)

Modulation Data rate

16 QAM 36 Mbps -79 dBm

64 QAM 48 Mbps -75 dBm

sensitivity

Units

1VV0301495 Rev. 15 Page 38 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-89

dBm

QPSK

MCS1

-86

dBm

QPSK

MCS2

-84

dBm

16 QAM

MCS3

-81

dBm

16 QAM

MCS4

-77

dBm

64 QAM

MCS5

-72

dBm

64 QAM

MCS6

-71

dBm

64 QAM

MCS7

-70

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-86

dBm

QPSK

MCS1

-83

dBm

QPSK

MCS2

-81

dBm

16 QAM

MCS3

-78

dBm

16 QAM

MCS4

-74

dBm

64 QAM

MCS5

-69

dBm

64 QAM

MCS6

-68

dBm

64 QAM

MCS7

-67

dBm

Typical

sensitivity

BPSK

6 Mbps

-91

dBm

BPSK

9 Mbps

-90

dBm

QPSK

12 Mbps

-89

dBm

QPSK

18 Mbps

-87

dBm

16 QAM

24 Mbps

-84

dBm

16 QAM

36 Mbps

-80

dBm

64 QAM

48 Mbps

-76

dBm

64 QAM

54 Mbps

-75

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-90

dBm

QPSK

MCS1

-87

dBm

QPSK

MCS2

-85

dBm

16 QAM

MCS3

-82

dBm

16 QAM

MCS4

-78

dBm

64 QAM

MCS5

-73

dBm

64 QAM

MCS6

-72

dBm

64 QAM

MCS7

-71

dBm

6.3.2.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

6.3.2.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

Units

Units

6.3.2.5. 802.11a (5GHz)

Modulation Data rate

6.3.2.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

Units

Units

1VV0301495 Rev. 15 Page 39 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-87

dBm

64 QAM

MCS7

-68

dBm

256 QAM

MCS8

-66

dBm

256 QAM

MCS9

-65

dBm

Data rate

Index

Typical

sensitivity

256 QAM

MCS8

-64

dBm

256 QAM

MCS9

-63

dBm

Typical

sensitivity

BPSK

1 Mbps

-92

dBm

QPSK

2 Mbps

-90

dBm

CCK

5.5Mbps

-87

dBm

CCK

11 Mbps

-86

dBm

sensitivity

BPSK

6 Mbps

-88

dBm

QPSK

12 Mbps

-86

dBm

QPSK

18 Mbps

-84

dBm

16 QAM

24 Mbps

-81

dBm

16 QAM

36 Mbps

-77

dBm

64 QAM

48 Mbps

-73

dBm

64 QAM

54 Mbps

-72

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-87

dBm

QPSK

MCS1

-84

dBm

QPSK

MCS2

-82

dBm

16 QAM

MCS3

-79

dBm

16 QAM

MCS4

-75

dBm

64 QAM

MCS5

-70

dBm

64 QAM

MCS6

-69

dBm

64 QAM

MCS7

-68

dBm

6.3.2.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

6.3.2.8. 802.11ac, Channel BW = 80MHz (5GHz)

Modulation

6.3.3. Receiver Sensitivity at Hot Temperature

All measurements data are taken at +85°C and VDDIO=1.8V.

6.3.3.1. 802.11b (2.4GHz)

Modulation Data rate

Units

Units

Units

6.3.3.2. 802.11g (2.4GHz)

Modulation Data rate

Typical

BPSK 9 Mbps -87 dBm

6.3.3.3. 802.11n, Channel BW = 20MHz (2.4GHz)

Modulation

Units

Units

1VV0301495 Rev. 15 Page 40 of 64 2021-01-20

WE866C3 Hardware Design Guide

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-84

dBm

QPSK

MCS1

-81

dBm

QPSK

MCS2

-79

dBm

16 QAM

MCS3

-76

dBm

16 QAM

MCS4

-72

dBm

64 QAM

MCS5

-67

dBm

64 QAM

MCS6

-66

dBm

64 QAM

MCS7

-65

dBm

Typical

sensitivity

BPSK

6 Mbps

-89

dBm

BPSK

9 Mbps

-88

dBm

QPSK

12 Mbps

-87

dBm

QPSK

18 Mbps

-85

dBm

16 QAM

24 Mbps

-82

dBm

16 QAM

36 Mbps

-78

dBm

64 QAM

48 Mbps

-74

dBm

64 QAM

54 Mbps

-73

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-86

dBm

QPSK

MCS1

-85

dBm

QPSK

MCS2

-83

dBm

16 QAM

MCS3

-80

dBm

16 QAM

MCS4

-76

dBm

64 QAM

MCS5

-71

dBm

64 QAM

MCS6

-70

dBm

64 QAM

MCS7

-69

dBm

Data rate

Index

Typical

sensitivity

BPSK

MCS0

-85

dBm

64 QAM

MCS7

-66

dBm

256 QAM

MCS8

-64

dBm

256 QAM

MCS9

-63

dBm

Data rate

Index

Typical

sensitivity

256 QAM

MCS8

-62

dBm

256 QAM

MCS9

-61

dBm

6.3.3.4. 802.11n, Channel BW = 40MHz (2.4GHz)

Modulation

6.3.3.5. 802.11a (5GHz)

Modulation Data rate

Units

Units

6.3.3.6. 802.11n/ac, Channel BW = 20MHz (5GHz)

Modulation

6.3.3.7. 802.11n/ac, Channel BW = 40MHz (5GHz)

Modulation

6.3.3.8. 802.11ac, Channel BW = 80MHz (5GHz)

Units

Units

Modulation

1VV0301495 Rev. 15 Page 41 of 64 2021-01-20

Units

WE866C3 Hardware Design Guide

Manufacturer

Type

Part number

7. DESIGN GUIDELINES

General PCB Design Guidelines

• Ground stitch any ground planes to improve thermal dissipation.

• The VDD_3.3V main power rail must support > 700 mA (average).

• It is recommended to place a 10µF capacitor near the VDD_3.3V pins and a 2.2µF

on the VDDIO pin.

• Keep power traces as wide as possible to lower the risk of IR drop.

• Wherever possible, add 30% current margin for all trace widths.

SDIO Interface

The SDIO bus is the WLAN host interface and should be treated as a high-speed bus. Any
design issue related SDIO signal integrity will result in lower bus speed thus lower data
throughput

The recommendations below should be followed during the design:

• Do not break the ground reference plane below any of the SDIO traces.

• Total trace length should be less than 4-inch and maximum 20 pF.

• SDIO signals trace length should be matched

o Reduce SDIO bus length as much as possible
o Use SDIO_CLK as the target length.
o Allow max of ±1mm variance with respect to SDIO_CLK

• Spacing between traces: 2~3 times of trace width.

• Trace impedance: 50 Ω±10%

• Continue GND plane under top/bottom of SDIO traces are required.

• SDIO clock must be well isolated and via shielded where possible.

Voltage Regulator

This section describes the VDD_3.3V power regulator requirements for designs using the
WE866C3. It is intended for selecting the proper DC-DC regulator in the platform. There are
a couple of options for supplying the required VDD_3.3V input such as Buck-boost, Buck
or a Boost power regulator.

7.3.1. Recommended Regulators

Texas Instruments buck-boost TPS630242

Texas Instruments buck LM3281

Please refer to vendor reference design for typical application and PCB layout
requirements.

1VV0301495 Rev. 15 Page 42 of 64 2021-01-20

WE866C3 Hardware Design Guide

Parameter

Condition

Min

Type

Max

Unit

7.3.2. Regulator Operating Conditions

Below table shows the recommended operating conditions of the VDD_3.3V Buck-Boost
voltage regulator:

Input Voltage range 2.5

4.75 V

Shutdown supply current 1 5 µA

Quiescent current IOUT=0mA, VOUT=3.3V 30 60 µA

Output voltage 3.3 V

Load Current 0.9 A

Output Voltage accuracy

(output voltage should be

PWM mode -2 2 2 %

maintained within these
limits during all conditions
including line voltage, load

PFM mode -4 4 4 %

current variations)

PWM mode 20 mVpp

Output ripple voltage

PFM mode 50 mVpp

Vout=3.3V, Iout=1300mA 85 90 %

Power efficiency

Vout=3.3V, Iout=1mA 80 85 %

IOUT = 0.2A to 1.2A

Overshoot/Undershoot

100 mV

IOUT = 1.2A to 0.2A

Buck mode, time taken for
VOUT to reach 95% of its
nominal value. VIN=4V,

1 mS

IOUT=200mA

Startup time

Boost mode, time taken for
VOUT to reach 95% of its
nominal value. VIN=3V,

2 mS

IOUT=200mA

Switching frequency 1.5 6 MHz

PFM mode

Output current to enter
PFM mode

100 mA

Short circuit current limit 2.5 A

1VV0301495 Rev. 15 Page 43 of 64 2021-01-20

WE866C3 Hardware Design Guide

7.3.3. ESD and Thermal Information

• WE866C3 Absolute Maximum ESD sensitivity level is HBM ±2000 V.

• WE866C3 Maximum Thermal resistance:

Symbols

T

Case Temperature 115 °C

CASE

PsiJT

Junction to the top of the package
thermal resistance

Parameters

Maximum Case

Temperature

0.5 °C/W

Table 7-1 Thermal Data

• WE866C3 Shield material, soldering material, and Pad material information for

thermal calculation and analysis are as follows:

o Material of metal casing: CRS 1008/1010, Thickness: 0.2mm
o Infill material: Air
o Material of conductive tabs thickness: 12 µm
o Approximate area of coverage: 12.3% approx. (total area=15x13=195,

footprint area=0.7x0.7x49=24.01)

Unit

1VV0301495 Rev. 15 Page 44 of 64 2021-01-20

WE866C3 Hardware Design Guide

Frequency Range

Requirements

Type

Requirements

Antenna Requirements

7.4.1. Main Antenna

The antenna connection and board layout design are the most important aspect in the full

product design as they strongly affect the product overall performances, hence read

carefully and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit device shall fulfil the following

requirements:

2.412 ~ 2.484GHz

VSWR < 2:1 recommended

Gain (dBi) 1 typical

Max Input Power (W) 50

Input Impedance (Ω) 50

Polarization Type Vertical

7.4.2. Antenna Cable

2.412 ~ 2.484GHz Cable insertion loss <1dB

4.9 ~ 5.925GHz Cable insertion loss <1dB

2.412~2.484GHz

4.9~5.925GHz

1VV0301495 Rev. 15 Page 45 of 64 2021-01-20

WE866C3 Hardware Design Guide

Item

Value

7.4.3. Antenna Design

When using the WE866C3, since there's no antenna connector on the module, the antenna

must be connected to the WE866C3 antenna pad by means of a transmission line

implemented on the PCB.

This transmission line shall fulfil the following requirements:

Characteristic Impedance 50 Ohm

Max Attenuation 0.3 dB

Coupling Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be
equipotential to the module ground pins

The transmission line should be designed according to the following guidelines:

• Ensure that the antenna line impedance is 50 ohm.

• Keep the antenna line on the PCB as short as possible, since the antenna line loss

shall be less than 0.3 dB.

• Avoid right angles whenever possible and route on the top layer only.

• Antenna line must have uniform characteristics, constant cross section, avoid

meanders, and abrupt curves.

• Keep, if possible, one layer of the PCB used only for the Ground plane.

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid

having other signal tracks facing directly the antenna line track.

• The ground around the antenna line on PCB has to be strictly connected to the

Ground Plane by placing vias every 2mm at least.

• Place EM noisy devices as far as possible from module antenna line.

• Keep the antenna line far away from the module power supply lines.

• If you have EM noisy devices around the PCB hosting the module, such as fast

switching ICs, take care of the shielding of the antenna line by burying it inside the

layers of PCB and surround it with Ground planes, or shield it with a metal frame

cover.

• If cases where EMI is not a concern, using a micro strip on the superficial copper

layer for the antenna line is recommended as the line attenuation will be lower than

a buried one.

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NOTE:

The following image is

showing the suggested

layout for the Antenna pad

connection (dimensions in mm):

7.4.4. Antenna Installation Guidelines

Install the antenna in a place with WiFi signal coverage.

Antenna shall not be installed inside metal cases.

Antenna shall be installed according to antenna manufacturer instructions.

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8. MECHANICAL DESIGN

Mechanical Dimensions

The WE866C3 overall dimensions are:

• Length: 15 mm

• Width: 13 mm

• Thickness: 2.15 mm

• Weight: 1 g

8.1.1. Mechanical Drawing

8.1.1.1. Top View

The figure below shows the mechanical top view of the WE866C3 module.

Dimensions are in mm

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8.1.1.2. Bottom View

The figure below shows the mechanical Bottom view of the WE866C3 module.

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8.1.1.3. Side View

The figure below shows mechanical side view of the WE866C3 module.

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9. APPLICATION PCB DESIGN

The modules have been designed to be compliant with a standard lead-free SMT process.

Recommended Footprint for the Application

Figure 2 Copper Pad Outline Top View

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In order to easily rework the module, it is suggested to add a 1.5 mm placement inhibit area

around the module. It is also suggested, as common rule for an SMT component, to avoid

having a mechanical part of the application in direct contact with the module.

The area under WIRING INHIBIT (see figure above) must be clear from signal or ground

paths.

PCB Pad Design

Non-solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Copper

Pad

Solder Mask

PCB

(Solder Mask Defined)

SMD

(Non-Solder Mask Defined)

NSMD

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PCB Pad Dimensions

The recommendation for the PCB pads dimensions are described in the following image

(dimensions in mm)

It is not recommended to place via or micro-via not covered by solder resist in an area of

0,3 mm around the pads unless it carries the same signal of the pad itself

Holes in pad are allowed only for blind holes and not for through holes.

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Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au

3 –7 / 0.05 – 0.15

good solder ability protection,

Recommendations for PCB pad surfaces:

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead­free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.

Stencil

Minimum stencil thickness recommended is 125um (5mil)

Solder Paste

We recommend using only “no clean” solder paste in order to avoid the cleaning of the

modules after assembly.

Cleaning

In general, cleaning the module mounted on the carrier board is not recommended.

• Residues between module and host board cannot be easily removed with any

cleaning method.

• Cleaning with water or any organic solvent can lead to capillary effects where the

cleaning solvent is absorbed into the gap between the module and the host board

or even leak inside the module (due to the gap between the module shield and PCB) .

The combination of soldering flux residues and encapsulated solvent could lead to

short circuits between conductive parts. The solvent could also damage the module

label.

• Ultrasonic cleaning could damage the module permanently. Especially for crystal

oscillators where the risk of damaging is very high.

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does not guarantee adequate adherence of the module to the customer

Solder Reflow

Below figure shows the recommended solder reflow profile.

Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat

– Temperature Min (T

– Temperature Max (T

– Time (min to max) (t

T

to TL

smax

smin

smax

)

s

– Ramp-up rate

Time maintained above:

– Temperature (T

– Time (t

)

L

)

L

)

)

150°C

200°C

60-180 seconds

3°C/second max

217°C

60-150 seconds

Peak temperature (Tp) 245 +0/-5°C

Time within 5°C of actual peak temperature (tp) 10-30 seconds

Ramp-down rate 6°C/second max.

Time 25°C to peak temperature 8 minutes max.

WARNING:

The above solder reflow profile represents the typical SAC reflow limits and

application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall system
considering such factors as thermal mass and warpage.

The module withstands one reflow process only.

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10. PACKING SYSTEM

Tray

The WE866C3 modules are packaged on trays of 144 pieces each. These trays can be
used in SMT processes for pick & place handling.

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Tray Drawing

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Moisture Sensitivity

The module is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC
J-STD-020. Customer should take care about all the related requirements for using this kind
of components.

Moreover, the customer must take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must
be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more.

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11. CONFORMITY ASSESSMENT ISSUES

Declaration of Conformity

Hereby, Telit Communications S.p.A declares that the WIFI/BT Wireless Module is in
compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:

http://www.telit.com\red

Product Regulatory Compliance Markings

Below table shows the product regulatory compliance markings.

Regulatory Compliance Country Marking

Regulatory Compliance
Mark (RCM)

NOTE:

Due to the small dimensions of the product, it is not practical to place
the RCM mark on it.

The RCM mark is thus placed on the product packaging and in the
product Hardware User Guide.

Australia/New Zealand

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12. SAFETY RECOMMENDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required.
The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific
environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty
validity. We recommend following the instructions of the hardware user guides for correct
wiring of the product. The product has to be supplied with a stabilized voltage source and
the wiring has to be conformed to the security and fire prevention regulations. The product
has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM,
checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.

The system integrator is responsible for the functioning of the final product; therefore, care
has to be taken to the external components of the module, as well as any project or
installation issue, because the risk of disturbing the GSM network or external devices or
having impact on the security. Should there be any doubt, please refer to the technical
documentation and the regulations in force. Every module has to be equipped with a proper
antenna with specific characteristics. The antenna has to be installed with care in order to
avoid any interference with other electronic devices and has to guarantee a minimum
distance from the body (20 cm). In case this requirement cannot be satisfied, the system
integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment
introduced on the market. All the relevant information is available on the European
Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available,

while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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TTSC

Telit Technical Support Center

USB

Universal Serial Bus

HS

High Speed

DTE

Data Terminal Equipment

UART

Universal Asynchronous Receiver Transmitter

I/O

Input Output

GPIO

General Purpose Input Output

CMOS

Complementary Metal – Oxide Semiconductor

CLK

Clock

RTC

Real Time Clock

PCB

Printed Circuit Board

ESR

Equivalent Series Resistance

VSWR

Voltage Standing Wave Radio

VNA

Vector Network Analyzer

RED

Radio Equipment Directive

13. ACRONYMS

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14. DOCUMENT HISTORY

Revision Date Changes

1 2018-02-07 First issue

2 2018-03-16 Updated mechanical drawings

Added note related to reflow cycles

3 2018-04-26 General updates following marketing samples verification

Updating package information

Update RF power values

4 2018-07-05 Updated Tx Output power

5 2018-10-23 Updated current consumption values

Updated Tx Output power values

6 2019-02-14 Updated Operating temperature range

Updated Packing system

7 2019-03-21 Added note related to Solder reflow

8 2019-07-10 Changed description of G1 pad from GND to RFU.

G1 pad should leave open.

9 2019-10-04 Updated section 3.2 Pin-out list

Updated section 5.2.1.5 Coexistence Use Cases

Added section 5.4 LE910Cx-WE866C3 Bundling Pin Map

Updated chapter 10 Packing System

Updated section 11.1 Declaration of Conformity

Minor editorial changes.

10 2019-11-08 Updated Bluetooth TX Power Values

11 2019-11-12

12 2020-01-29 Updated section 5.2.1. WLAN Interface – Block diagram

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Updated section 6.2.1.9 Bluetooth TX Power with new
Values

WE866C3 Hardware Design Guide

Updated section 5.3. BT Interface – Block diagram

Updated section 5.4. – LE910Cx-WE866C3 Bundling Pin
Map

13 2020-06-03

Added section 11.2 Product Regulatory Compliance
Markings

Added section 7.3.3 ESD and Thermal Information

14 2021-01-20 Removed Design 3 and Design 4 under WLAN interface.

15 2021-03-31 Added FCC, ETSI power section 6.2 TX output power

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