Telit ME910G1 User Manual

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Page 1

Telit Technical Documentation

ME910G1

HW Design Guide

1VV0301593 Rev. 8 – 2021-02-22

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ME910G1 HW Design Guide

APPLICABILITY TABLE

ME910G1-W1

ME910G1-WW

ME910G1-WWV

PRODUCTS

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ME910G1 HW Design Guide

APPLICABILITY TABLE 2

CONTENTS 3

1. INTRODUCTION 8

Scope 8 Audience 8 Contact Information, Support 8 Symbol Convention 9 Related Documents 9

2. GENERAL PRODUCT DESCRIPTION 10

Overview 10 Product Variants and Frequency Bands 10 Target Market 11 Main features 11 TX Output Power 12

ME910G1-W1 12 ME910G1-WW and ME910G1-WWV 12

RX Sensitivity 13

ME910G1-W1 13 ME910G1-WW and ME910G1-WWV 15

Mechanical Specifications 17

Dimensions 17 Weight 17

Temperature Range 17

3. PINS ALLOCATION 18

Pin-out 18 LGA Pads Layout 24

4. POWER SUPPLY 25

Power Supply Requirements 25 Power Consumption 26

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ME910G1 HW Design Guide

Idle mode 26 ME910G1-W1 Connected Mode 27 ME910G1-WW and ME910G1-WWV Connected Mode 28

General Design Rules 29

Electrical Design Guidelines of the power supply 29

+5V Source Power Supply Design Guidelines 29 +12V Source Power Supply Design Guidelines 30

Battery Source Power Supply Design Guidelines 31 Thermal Design Guidelines 31 Power Supply PCB layout Guidelines 32

VAUX Power Output 34 RTC Supply 34

5. DIGITAL SECTION 35

Logic Levels 35 Power On 36 Power Off 40 Wake from deep sleep mode 42 Unconditional Shutdown 42 Fast shut down 45

Fast Shut Down by Hardware 45 Fast Shut Down by Software 46

Communication ports 47

USB 2.0 HS 47 SPI 48

SPI Connections 48 Serial Ports 49

Modem serial port 1 (USIF0) 49

Modem serial port 2 (USIF1) 50

RS232 level translation 51

General purpose I/O 53

Using a GPIO as INPUT 53 Using a GPIO as OUTPUT 54

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ME910G1 HW Design Guide

Indication of network service availability 54

External SIM Holder 55

ADC Converter 55

6. RF SECTION 57

Antenna requirements 57

PCB Design guidelines 58 PCB Guidelines in case of FCC Certification 59

Transmission line design 60

Transmission Line Measurements 60

Antenna Installation Guidelines 62

7. AUDIO SECTION 63

Electrical Characteristics 63

8. GNSS SECTION 64

GNSS Signals Pin-out 64 RF Front End Design 64

Guidelines of PCB line for GNSS Antenna 64 Hardware-based solution for GNSS and LTE coexistence 65

GNSS Antenna Requirements 66

GNSS Antenna specification 66 GNSS Antenna – Installation Guidelines 66 Powering the External LNA (active antenna) 66

GNSS Characteristics 68

9. MECHANICAL DESIGN 69

Drawing 69

10. APPLICATION PCB DESIGN 70

Recommended footprint for the application 70 PCB pad design 72 Recommendations for PCB pad dimensions 73 Thermal performance 73 Stencil 74 Solder paste 75

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ME910G1 HW Design Guide

Solder Reflow 75 Inspection 76

11. PACKAGING 77

Tray 77 Reel 79 Carrier Tape detail 79 Reel detail 80 Packaging detail 81 Moisture sensitivity 81

12. CONFORMITY ASSESSMENT ISSUES 82

Approvals summary 82 RED approval 82

RED Declaration of Conformity 82 Antennas 82

FCC and ISED approval/

FCC certificates 83 ISED Certificate/ Applicable FCC and ISED rules/

applicables

FCC and ISED Regulatory notices/

ISDE

Antennas/Antennes 85 FCC label and compliance information 87 ISED label and compliance information/

ISDE certificates

de conformité ISDE

FCC et ISDE approbation

Liste des règles FCC et ISDE

Avis réglementaires de FCC et

Étiquette et informations

Information on test modes and additional testing requirements /

Informations sur les modes de test et les exigences de test supplémentaires

FCC Additional testing, Part 15 Subpart B disclaimer 89 ANATEL Regulatory Notices 89 NCC Regulatory Notices 90

13. PRODUCT AND SAFETY INFORMATION 91

Copyrights and Other Notices 91

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ME910G1 HW Design Guide

Copyrights 91

Computer Software Copyrights 91 Usage and Disclosure Restrictions 92

License Agreements 92

Copyrighted Materials 92

High Risk Materials 92

Trademarks 93

3rd Party Rights 93

Waiwer of Liability 93 Safety Recommendations 94

14. GLOSSARY 95

15. DOCUMENT HISTORY 96

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ME910G1 HW Design Guide

1. INTRODUCTION

Scope

Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910G1 module.

Audience

This document is intended for Telit customers, in particular system integrators, who are going to implement their applications using our ME910G1 modules.

Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

•

TS-EMEA@telit.com

•

TS-AMERICAS@telit.com

•

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users on our information.

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ME910G1 HW Design Guide

Danger:

or catastrophic

Warning: Alerts the user on important steps about the module

Note/Tip:

Electro-static Discharge:

Symbol Convention

This information MUST be followed,

equipment failure or personal injury may occur.

integration.

integrating the module.

precautions before handling the product.

Table 1: Symbol Conventions

Provides advice and suggestions that may be useful when

Notifies the user to take proper grounding

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

2. GENERAL PRODUCT DESCRIPTION

Overview

The ME910G1 module is a CATM/ NBIoT communication product which allows integrators to plan on availability for even the longest lifecycle applications, highly recommended for new designs specified for worldwide coverage.

The ME910G1-WWV product is fully voice capable, the digital audio interface make it suitable for applications such as voice enabled alarm panels, mHealth patient monitors and specialty phones such as those for the elderly or sensory-impaired.

The ME910G1 operates with 1.8 V GPIOs, minimizing power consumption and making it even more ideal for application with battery powered and wearable device.

Product Variants and Frequency Bands

B1, B2, B3, B4, B5,

850, 900, 1800, 1900

B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26,

Table 2: Product Variants and Frequency Bands * See note below

Refer to “RF Section” for details information about frequencies and bands.

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85,

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26,

- Y Worldwide

N Worldwide

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Cellular technologies and frequency bands that are enabled may vary based on used.

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ME910G1 HW Design Guide

Note:

Function

Features

Modem

• Real Time Clock

Interfaces

• Antenna port

“B86” is not a 3GPP band, it means the following: UL range: 787-788 MHz, DL range: 757-758 MHz that is available only in module where AT#BNDOPTIONS command

contains the string B86. i.e. AT#BNDOPTIONS? #BNDOPTIONS: 1,2,3,4,5,8,12,13,18,19,20,25,26,27,28,66,71,85,86

Target Market

ME910G1 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

Main features

• CATM and NBIoT technologies

• SMS support (text and PDU)

• Alarm management

• USB 2.0 HS (AT command1 , FW upgrade and module diagnostic)

• USIF0 Main UART (AT command

• USIF1 Auxiliary UART (AT Command

• 10 GPIOs

and FW upgrade)

, AppZone diagnostic)

Table 3: Functional features

Functionality depending on ports configuration

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ME910G1 HW Design Guide

Band

Mode

3GPP Class

RF power (dBm)

Nominal*

B1, B2, B3, B4, B5, B8, B12, B13, B14, B18, B19, B20, B25, B26, B27, B28, B66, B85

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85, B86

Band

Mode

Class

RF power (dBm)

Nominal*

850/900MHz GSM/GPRS 4 32.5

EGPRS

1800/1900MHz EGPRS

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85

B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B85

B71

(LTE) CAT-NB2 5 21

TX Output Power

ME910G1-W1

Table 4: Transmission Output power

ME910G1-WW and ME910G1-WWV

(LTE) CAT-M1 5 21

(LTE) CAT-NB2 5 21

GSM/GPRS 1 29.5

(LTE) CAT-M1 3 23

(LTE) CAT-NB2 3 23

Table 5: Transmission Output power ME910G1-WW and ME910G1-WWV

* Max output power tolerance range according to 3GPP TS 36.521-1 and 3GPP TS 51.010-1 or better

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ME910G1 HW Design Guide

Band

REFsens (dBm)

Typical

REFsens (dBm)*

3GPP limit

CATM1 / Band1

CAT M1 / Band2

CAT M1 / Band3

-107.6

-99.3

CAT M1 / Band4

CAT M1 / Band5

CAT M1 / Band8

-107.8

-99.8

CAT M1 / Band12

CAT M1 / Band13

CAT M1 / Band18

CAT M1 / Band19

CAT M1 / Band20

-107.8

-99.8

CAT M1 / Band25

CAT M1 / Band26

CAT M1 / Band27

CAT M1 / Band28

-107.9

-100.8

CAT M1 / Band66

CAT M1 / Band85

CAT NB2 / Band1

-116.8

-108.2

CAT NB2 / Band2

CAT NB2 / Band3

CAT NB2 / Band4

CAT NB2 / Band5

CAT NB2 / Band8

-116.4

-108.2

CAT NB2 / Band12

CAT NB2 / Band13

CAT NB2 / Band18

CAT NB2 / Band19

-116.8

-108.2

RX Sensitivity

ME910G1-W1

-107.6 -102.7

-108.0 -100.3

-107.8 -102.3

-107.9 -100.8

-107.8 -99.3

-108.0 -99.3

-108.0 -102.3

-108.0 -

-108.0 -100.3

-108.0 -100.8

-107.8 -

-107.6 -

-116.8 -108.2

-116.7 -

-116.7 -108.2

-116.8 -108.2

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ME910G1 HW Design Guide

Band

REFsens (dBm)

Typical

REFsens (dBm)*

3GPP limit

CAT NB2 / Band20

CAT NB2 / Band25

CAT NB2 / Band26

CAT NB2 / Band28

-116.9

-108.2

CAT NB2 / Band66

-116.6

-108.2

CAT NB2 / Band71

CAT NB2 / Band85

-116.6 -108.2

-116.8 -

-116.8 -108.2

-115.4 -

-116.8 -

Table 6: RX Sensitivity ME910G1-W1

* 3GPP TS 36.521-1 Release 15 Minimum performance requirement

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ME910G1 HW Design Guide

Band

REFsens (dBm)

Typical

3GPP REFsens (dBm)*

3GPP limit

CATM1 / Band1

-106.3

-102.7

CAT M1 / Band2

-107.3

-100.3

CAT M1 / Band3

CAT M1 / Band4

CAT M1 / Band5

-107.1

-100.8

CAT M1 / Band8

CAT M1 / Band12

CAT M1 / Band13

CAT M1 / Band18

CAT M1 / Band19

-106.8

-102.3

CAT M1 / Band20

CAT M1 / Band25

CAT M1 / Band26

-107.0

-100.3

CAT M1 / Band27

CAT M1 / Band28

CAT M1 / Band66

CAT M1 / Band85

-105.3

CAT NB2 / Band1

CAT NB2 / Band2

CAT NB2 / Band3

CAT NB2 / Band4

CAT NB2 / Band5

-116.5

-108.2

CAT NB2 / Band8

CAT NB2 / Band12

CAT NB2 / Band13

-116.8

-108.2

CAT NB2 / Band18

CAT NB2 / Band19

CAT NB2 / Band20

CAT NB2 / Band25

-116.2

ME910G1-WW and ME910G1-WWV

-106.6 -99.3

-106.7 -102.3

-107.3 -99.8

-106.5 -99.3

-107.9 -99.3

-107.6 -102.3

-107.4 -99.8

-107.0 -

-107.4 -100.8

-107.8 -100.8

-106.7 -

-115.4 -108.2

-116.2 -108.2

-116.4 -108.2

-115.6 -

-115.9 -108.2

-116.6 -108.2

-116.4 -108.2

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-116.0 -108.2

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ME910G1 HW Design Guide

Band

REFsens (dBm)

Typical

3GPP REFsens (dBm)*

3GPP limit

CAT NB2 / Band26

CAT NB2 / Band28

CAT NB2 / Band66

CAT NB2 / Band71

-113.7

CAT NB2 / Band85

-116.0

-116.1 -108.2

-116.8 -108.2

-115.6 -108.2

Table 7: RX Sensitivity ME910G1-WW and ME910G1-WWV

* 3GPP TS 36.521-1 Release 15 Minimum performance requirement

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ME910G1 HW Design Guide

Temperature Range

Note

Operating Temperature Range according to regulatory standards.

Storage Temperature Range to power supply

Note: (*) Functional: if applicable, the module is able to make and

Mechanical Specifications

Dimensions

The overall dimensions of ME910G1-W1, ME910G1-WW and ME910G1-WWV are:

• Length: 28.2 mm

• Width: 28.2 mm

• Thickness: 2.4 mm

Weight

The nominal weight of the ME910G1-W1 is 3.5 gr. The nominal weight of the ME910G1-WW and ME910G1-WW is 4 gr.

Temperature Range

Table 8: Temperature Range

receive voice calls, data calls, send and receive SMS and data traffic.

–40°C to +85°C

–40°C to +105°C

The module is fully functional (*) and compliant

The module is not powered and not connected

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data)

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13 transceiver.

Asynchronous Serial Port (USIF0) (FW upgrade and Data with Flow Control)

N15

1.8V

M15

CMOS

1.8V

M14

1.8V

L14 from DTE

1.8V

P15 DTE

1.8V

N14

1.8V

P14

1.8V

R14

1.8V

SIM Card Interface

SIMCLK

External SIM signal – Clock

1.8V A7

SIMIO

I/O

External SIM signal – Data I/O

1.8V

A4 low)

1.8

A3 the SIM

Digital Voice Interface (DVI)

DVI_WA0

I/O

Digital Audio Interface (WA0)

1.8V

3. PINS ALLOCATION

Pin-out

VUSB I

C103/TXD I Serial data input from DTE

C104/RXD O Serial data output to DTE

C108/DTR I Input for (DTR) from DTE

C105/RTS I

C106/CTS O

C109/DCD O Output for (DCD) to DTE

C107/DSR O Output for (DSR) to DTE

C125/RING O Output for Ring (RI) to DTE

Enable pin for the internal USB

Input for Request to send signal (RTS)

Output for Clear to Send signal (CTS) to

5 / 3V

CMOS

Internal PD

internal PU (100k)

(100K)

SIMRST

SIMIN

SIMVCC

External SIM signal – Reset 1.8V

External SIM signal – Presence (active

External SIM signal – Power supply for

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CMOS

1.8V

Internal PU (470K)

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

DVI_RX

Digital Audio Interface (RX)

1.8V B7

DVI_TX

I/O

Digital Audio Interface (TX)

1.8V B8

DVI_CLK

I/O

Digital Audio Interface (CLK)

1.8V

SPI

D15

1.8V

E15

1.8V

F15

1.8V

H14

1.8V

DIGITAL IO

C8 STAT LED is

alternate function

internal PD (100K)

1.8V

C10

CMOS

1.8V

C11

1.8V

B14

CMOS

1.8V

C12

1.8V

C13

1.8V

K15

1.8V

L15

1.8V

G15

1.8V

ADC

ADC_IN

Analog Digital Converter input

RF SECTION

SPI_MOSI I/O SPI MOSI

SPI_MISO I/O SPI_MISO

SPI_CLK I/O SPI Clock

SPI_CS I/O SPI Chip Select

GPIO_01 I/O GPIO_01 /STAT LED

GPIO_02 I/O GPIO_02

GPIO_03 I/O GPIO_03

GPIO_04 I/O GPIO_04

CMOS

1.8V

CMOS

internal PD (100K)

GPIO_05 I/O GPIO_05

GPIO_06 I/O GPIO_06

GPIO_07 I/O GPIO_07

GPIO_08 I/O GPIO_08

GPIO_09 I/O GPIO_09

GPIO_10 I/O GPIO_10

CMOS

internal PD (100K)

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

GNSS Section

Miscellaneous Functions

R13

HW_SHUTDOWN*

HW Unconditional Shutdown

VBATT

Active low

R12 wake from deep sleep mode

R11 Power ON Monitor

F14

1.8V

PD (100K)

Power Supply

VBATT

Main power supply (Baseband)

Power

VBATT

Main power supply (Baseband)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

VBATT_PA

Main power supply (Radio PA)

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

ANTENNA I/O

ANT_GNSS I

GNSS_LNA_EN O

ON_OFF*/WAKE* I

VAUX/PWRMON O

FORCED_USB_BOOT I Debug pin, connect to test point

LTE Antenna (50 ohm)

GNSS Antenna (50 ohm)

External GNSS LNA Enable

Input command for power ON and to

Supply Output for external accessories /

CMOS

1.8V

1.8V Active low

1.8V

CMOS

Active high, internal

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

P10

GND

Ground

Power

R10

GND

Ground

Power

M12

GND

Ground

Power

B13

GND

Ground

Power

P13

E14

GND

Ground

Power

RESERVED

GND - Ground Power

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

RESERVED

A10

RESERVED

N10

RESERVED

N11

RESERVED

P11

RESERVED

B12

D12

RESERVED

N12

RESERVED

P12

RESERVED

G14

RESERVED

J14

RESERVED - RESERVED

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ME910G1 HW Design Guide

Signal

I/O

Function

Type

Comment

K14

RESERVED

N13

RESERVED

L13

RESERVED

J13

RESERVED

M13

RESERVED

K13

RESERVED

H13

RESERVED

G13

RESERVED

F13

RESERVED

B11

RESERVED

B10

RESERVED

E13

RESERVED

D13

RESERVED

D14

RESERVED

A14

RESERVED

A12

RESERVED

A11

RESERVED

H15

RESERVED

J15

RESERVED

C14

RESERVED

Warning

E13 pins can be connected together in order to be

Table 9: Pin-out Information

: Reserved pins must not be connected.

Only D13compatible with HE910 module. All pull-up (PU) and pull-down (PD) are about 100K

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ME910G1 HW Design Guide

LGA Pads Layout

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT

2 GND RES RES RE S GND GND GND GND GND GND GND VBATT

3 SIMVCC RES RES RES RES RES RES RES RE S RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GN D

7 SIMRST DVI_ TX RES RES RES

8 RES DVI_CLK GPIO_ 01 RES GND GND

9 RES DVI_WA0 GPIO_02 RES GND ANT_GNSS

10 RES RE S GPIO_ 03 RES GND GND

11 RES RE S GPIO_ 04 RES RES

VBATT_PA VBATT_ PA

GND

GNSS_LNA

_EN

VAUX/PWR

MON

12 RES RE S GPIO_ 06 RES GND RES RES

13 VUSB GN D GPIO_ 07 RES RES RES RES RES RES RES RE S RES RES GND

RX_AUX

FORCE_U SB_BOOT

SPI_CLK GPIO_10 RES RES GPIO_08 GPIO_09 C104/RXD C103/TXD C106/CTS

RES SPI_CS RES RES C105/RTS C108/DTR C1 09/DCD C107/DSR C125/RING

14 RES GPIO_0 5 RES RES GND

15 USB_D+ USB_D-

SPI_MOSI

TX_AUX

SPI_MISO

ON_OFF*/

WAKE*

HW_SHUT

DOWN*

Figure 1: LGA Pads Layout

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ME910G1 HW Design Guide

Power Supply

Value

Nominal Supply Voltage

3.8V

Operating Voltage Range

3.2 V - 4.2 V

Extended Voltange Range

2.6 V - 4.5 V

VBATT

min

2.7V

Warning

Warning:

Note:

4. POWER SUPPLY

The power supply circuitry and the board layout are a very important part in the full product design and they strongly reflect on the product overall performances, so the requirements and the guidelines that will follow should be read carefully for a proper design.

Power Supply Requirements

The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements:

Table 10: Power Supply Requirements

: The range 2.6V - 3.2V can be used only if both USB and 2G

are disabled.

The supply voltage of the modem must never exceed the

Extended Operating Voltage Range. Wrong implementation of power supply guidelines described in this document may result in module fault.

For PTCRB approval on the final products the power supply is

required to be within the “Normal Operating Voltage Range”.

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ME910G1 HW Design Guide

Note:

drops beyond the limits of the

Note: When turning on the modem, the voltage must be at least

Note:

Mode

Measure (Typical)

Mode Description

IDLE mode

CATM (mA)

NBIoT (mA)

2G (mA)

AT+CFUN=1

AT+CFUN=4 network

AT+CFUN=5

0.101

655.36s eDRx cycle length (PTW=2.56s, DRX=1.28s)

Paging Multiframe 9

PSM mode

Typical (mA)

AT+CPSMS=1

3uA No current source or sink by any connected pin

The application’s power supply section must be designed with care to avoid an excessive voltage drop during transmission peak current absorptions. If the voltage Extended Operating Voltage range, an unintentional module power off can occur.

VBATTmin.

HW User Guide specifications shall be fully acknowledged and correctly implemented in order to use the module in its “Extended Operating Voltage Range”.

Power Consumption

Idle mode

9.5 9.2 9.0 Normal mode: full functionality of the module

7.5

1.20 0.95 - Paging cycle #256 frames (2.56s DRx cycle)

0.60 0.60 - 81.92s eDRx cycle length (PTW=2.56s, DRX=1.28s)

0.181 0.181 - 327.68s eDRx cycle length (PTW=2.56s, DRX=1.28s)

0.051 0.051 - 1310.72s eDRx cycle length (PTW=2.56s, DRX=1.28s)

Disabled TX and RX; module is not registered on the

0.031 0.031 - 2621.44s eDRx cycle length (PTW=2.56s, DRX=1.28s)

0.90

Table 11: Idle and PSM Mode

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PSM in between eDRX

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ME910G1 HW Design Guide

Note: The reported LTE CAT M1 and LTE CAT NB1 values are an

Mode

Measure* (Typical)

Mode Description

GPS

(mA)

Active State (GNSS ON, CFUN=4)

GPS+GLO, DPO off

Active State (GNSS ON, CFUN=5 eDRX)

Mode

Measure

(Typical)

Mode

Description

Connected mode

Average

(mA)

Peak (mA)

CATM all bands

NBIoT 15KHz, 12 SC, RU 1ms, TBS=5, QPSK,

21dBm, all bands

Acquisition 69.3

Navigation

55.9

Acquisition 68.5

15.7

Navigation

GPS+GLO, DPO on DWELL=280ms

GPS+GLO, DPO off

GPS+GLO, DPO on DWELL=280ms

GPS+GLO, DPO off

Table 12:GPS Mode *reference signal @-130 dbm with static scenario

average among all the product variants and bands for each network wireless technology.

The support of specific network wireless technology depends on the product variant configuration.

ME910G1-W1 Connected Mode

180 400

245 340 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, all bands

65 290

1 RB, RMC, TBS=5, QPSK, 21dBm,

Table 13: ME910G1-W1 Connected Mode

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ME910G1 HW Design Guide

Mode

Measure

(Typical)

Mode

Description

Connected mode

Average

(mA)

Peak (mA)

CATM

Band 85, 28, 12

Band 13, 26, 5, 18, 19, 20, 8

Band 3, 2, 25, 4, 1, 66

NBIoT

240

335

3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, Band 71

600

1000

3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 85, 28, 12

18, 19, 20, 8

1, 66

15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 21dBm, Band 71

15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 23dBm, Band 85, 28, 12

23dBm, Band 13, 26, 5, 18, 19, 20, 8

23dBm, Band 3, 2, 25, 4, 1, 66

GPRS

300

2000

1TX + 1RX, CS1, GMSK, Band 850, 900

170

1000

1TX + 1RX, CS1, GMSK, Band 1800, 1900

ME910G1-WW and ME910G1-WWV Connected Mode

380 1100

320 900

305 800

500 850

430 750

68 300

88 950

78 800

1 RB, RMC, TBS=5, QPSK, 23dBm,

1 RB, RMC, TBS=5, QPSK,23dBm,

1 RB, RMC, TBS=5, QPSK, 23dBm,

3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 13, 26, 5,

3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 3, 2, 25, 4,

15KHz, 12 SC, RU 1ms, TBS=5, QPSK,

77 730

Table 14: ME910G1-WW and ME910G1-WWV Connected Mode

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15KHz, 12 SC, RU 1ms, TBS=5, QPSK,

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ME910G1 HW Design Guide

General Design Rules

The main guidelines for the Power Supply Design include three different design steps:

• the electrical design of the power supply

• the thermal design

• the PCB layout

Electrical Design Guidelines of the power supply

The electrical design of the power supply strongly depends on the power source where this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

+5V Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, so there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited due to the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suitable.

• Make sure the low ESR capacitor on the power supply output rated at least 10V.

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Figure 2: An example of linear regulator with 5V input

+12V Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, so due to the big difference between the input source and the desired output, a linear regulator is not suitable and shall not be used. A switching power supply will be preferable because of its better efficiency.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to be developed since the switching frequency could also generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF capacitor is usually suitable.

• Make sure the low ESR capacitor on the power supply output is rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power

input, in order to clean the supply from the spikes.

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Note

Figure 3: An example of switching regulator with 12V input

Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit ME910G1 module.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the

ME910G1 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

• The battery must be rated to supply peaks of current up to 0.6 A for LTE.

: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with ME910G1. Their use can lead to overvoltage on the ME910G1 and damage it. You can use LI-Ion, Li-Po, , Li-FePO4 secondary batteries or hi current Lithium primary batteries.

Thermal Design Guidelines

Worst case as reference values for thermal design of ME910G1 are:

• Average current consumption: 700 mA (LTE CAT M1 and NB1 modes)

• Average current consumption: 700 mA (GPRS and EDGE modes)

• Supply voltage: 4.50V

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ME910G1 HW Design Guide

Note Note

: Make PCB design in order to have the best connection of GND

pads to large surfaces of copper.

: The ME910G1 includes a function to prevent overheating.

Power Supply PCB layout Guidelines

As seen on the guidelines for electrical design, the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes. The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit ME910G1 power input pads or, in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the ME910G1 is wide enough to ensure a voltage dropless connection even during an 0.6 A (LTE) or 2A (GSM) current peak.

• The protection diode must be placed close to the input connector where the power source is drained.

• The PCB’s traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when an 2 A current peak is absorbed (valid only for product supporting GSM mode).

• The PCB traces to the ME910G1 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur. This is for the same reason as previous point. Try to keep this trace as short as possible.

• To reduce the EMI due to switching, it is important to keep the mesh involved very small; therefore the input capacitor, the output diode (if not embodied in the IC) and the regulator shall form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

• A dedicated ground for the Switching regulator separated by the common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not

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ME910G1 HW Design Guide

overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

• The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata

BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.

The below figure shows the recommended circuit:

Figure 4: Recommended Circuit

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ME910G1 HW Design Guide

Item

Min

Typical

Max

Output voltage

1.78V

1.80V

1.82V

Output current

- - 60mA

Output bypass capacitor (inside the module)

Note

VAUX Power Output

A regulated power supply output is provided to supply small devices from the module, like: level translators, audio codec, sensors, and others.

Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command.

Host can only detect deep sleep mode by monitoring of VAUX/PWRMON output pin, since there is no pin dedicated to PSM status indicator.

The operating range characteristics of the supply are:

1uF

Table 15: Operating range characteristics of the supply

: If power saving configuration is enabled by AT+CPSMS

Command, VAUX during deep sleep mode period is OFF

RTC Supply

RTC is functional when ME910G1 is in PSM or OFF state and VBATT pin is supplied.

RTC settings are erased if VBATT supply is temporary disconnected.

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ME910G1 HW Design Guide

Parameter

Min

Max

ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL

Input level on any digital pin (CMOS 1.8) with respect to ground

Operating Range - Interface levels (1.8V CMOS)

Input high level

Input low level

Output high level

Output low level

Parameter

Max

Current characteristics:

Output Current

Input Current

1uA

5. DIGITAL SECTION

ME910G1 has four main operation states:

• OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state.

•

ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected.

• Sleep mode state: main baseband processor is intermittently switched ON and AT commands can be processed with some latency. ME910G1 is idle with low current consumption.

•

Deep sleep mode state: PSM defined in 3GPP Release 12. Baseband is switched OFF most of the time.

Logic Levels

Table 16: Logic levels Minimum and maximum

-0.3V 2.1V

1.5V 1.9V

0V 0.35V

1.6V 1.9V

0V 0.2V

Table 17: Logic levels average

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1mA

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ME910G1 HW Design Guide

Note:

power regulator and improper power

Power On

To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released.

The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA.

ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired.

To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set LOW for at least 5 seconds.

Figure 5: Power-on Circuit; illustrates a simple circuit to power on the module using an inverted buffer output.

Do not use any pull up resistor on the ON_OFF*/WAKE* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the ME910G1 on/off of the module. The line ON_OFF*/WAKE* must be connected only in open collector or open drain configuration.

In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#",”*” or with a bar over the name.

To check if the device has powered on, the hardware line PWRMON should be monitored.

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ME910G1 HW Design Guide

ON_OFF*/WAKE* = LOW

Delay = 5 sec

ON_OFF*/WAKE*= HIGH

Delay = 1 sec

A flow chart showing the proper turn on procedure is displayed below:

“Modem ON Proc”

VBATT>VBATT

min

PWRMON=ON ?

GO TO “HW Shutdown Unconditional”

Figure 6: Turn on procedure flow chart

PWRMON=ON ?

GO TO

“Start AT Commands””

“Modem ON Proc”

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ME910G1 HW Design Guide

Note

A flow chart showing the AT commands managing procedure is displayed below:

“Start AT CMD”

START

Delay = 300 msec

Enter AT <CR>

AT answer in

1 sec ?

GO TO “HW Shutdown Unconditional”

“Start AT CMD”

END

GO TO

“Modem ON Proc.”

Figure 7: AT commands managing procedure flow chart

: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.

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ME910G1 HW Design Guide

Warning

An example of this is described in the

For example:

1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button:

: It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V.In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF*/WAKE* line. following diagram.

After HW_SHUTDOWN* is released you could again use the ON_OFF*/WAKE* line to power on the module.

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ME910G1 HW Design Guide

Note: the hardware line PWRMON must be monitored. The device is

Warning

down procedures

might damage the device and consequently void the warranty.

Power Off

Turning off of the device can be done in two ways:

• via AT command (see ME910G1 Software User Guide, AT#SHDN)

• pin ON_OFF*/WAKE* for at least 3 seconds

Either ways, the device issues a detach request to network informing that the device will not be reachable any more.

To check if the device has been powered off or IN PSM mode,

powered off when PWRMON goes low.

In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.

: Not following the recommended shut-

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ME910G1 HW Design Guide

Modem OFF Proc.

START

ON OFF*/WAKE* = LOW

Delay >= 3 sec

ON_OFF*/WAKE* = HIGH

Unconditional”

Modem OFF Proc.

END

AT#SHDN

than 15s?

Key

The following flow chart shows the proper turn off procedure:

“

”

PWRMON=ON?

OFF Mode

PWRMON=ON?

Looping for more

GO TO

“HW SHUTDOWN

Figure 8: turn off procedure flow chart

“

”

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ME910G1 HW Design Guide

Signal

Function

I/O

PAD

HW_SHUTDOWN*

Unconditional Shutdown of the Module

R13

Warning

device from the network. It shall be kept as an emergency exit

Wake from deep sleep mode

ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wakeup time.

Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds.

Host can detect deep sleep mode by polling VAUX/PWRMON pin if previously configured.

Unconditional Shutdown

HW_SHUTDOWN* is used to unconditionally shutdown the ME910G1. Whenever this

signal is pulled low, the ME910G1 is reset. When the device is reset it stops any operation. After the release of the line, the ME910G1 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any cellular device is requested to issue a detach request on turn off. The HW_SHUTDOWN* is internally controlled on start-up to always achieve a proper power-on reset sequence, so there's no need to control this pin on start-up.

To unconditionally shutdown the ME910G1, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.

The signal is internally pulled up so the pin can be left floating if not used.

If used, then it

must always be connected with an open collector transistor, to permit to

the internal circuitry the power on reset and under voltage lockout functions.

During PSM mode, HW_SHUTDOWN toggle has no effect. The use of HW_SHUTDOWN* pin is valid only when ME910G1 has VAUX/PWRMON output HI.

PIN DESCRIPTION

Table 18: HW_SHUTDOWN* signal

: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the

procedure.

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ME910G1 HW Design Guide

A typical circuit is the following:

Figure 9: typical circuit

For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):

Figure 10: typical circuit

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ME910G1 HW Design Guide

Note

HW_SHUTDOWN* = LOW

Delay = 200ms

“HW SHUTDOWN

END

HW_SHUTDOWN* = HIGH

Delay = 1s

In the following flow chart the proper restart procedure is detailed:

“HW SHUTDOWN

Unconditional”

START

Disconnect

VBATT

PWRMON = ON

Unconditional”

Figure 11: restart procedure flow chart

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ME910G1 HW Design Guide

Note

on the boards and should be used only as an emergency exit

Note

: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the ME910G1 power regulator and improper functioning of the module.

To proper power on again the module please refer to the related paragraph (“Power ON”)

The unconditional hardware shutdown must always be implemented

procedure.

Fast shut down

The procedure to power off ME910G1 described in Chapter 5.3 normally takes more than 1 second to detach from the network and make ME910G1 internal filesystem properly closed.

In case of unwanted supply voltage loss the system can be switched off without any risk of filesystem data corruption by implementing Fast Shut Down feature.

Fast Shut Down feature permits to reduce the current consumption and the time-topoweroff to minimum values.

: Refer to ME910G1 series AT command reference guide (Fast shut down - #FASTSHDN) in order to set up detailed AT command.

Fast Shut Down by Hardware

The fast shut down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast shut down.

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ME910G1 HW Design Guide

Note

conditions when

Tip: Make the same plot during system verification to check

Example circuit:

Figure 12: example circuit

: Consider voltage drop under max current defining the voltage detector thereshold in order to avoid unwanted shutdown.

The capacitor is rated with the following formula:

timings and voltage levels.

Fast Shut Down by Software

The fast shut down can be triggered by AT command.

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ME910G1 HW Design Guide

Note

or USB are fine, however we recommend placing the pads for a

tor to port, for convenient access for network

certification testing and access during early development testing.

PAD

Signal

I/O

Function

NOTE

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

100K pull down

Communication ports

: It is suggested to add PCB test points at non-used module’s UART, UART_AUX and USB (for products that support USB), it can be useful to reflash, test and debug the application. Test points for UART

suitable connec

The USB connector can be “DNP” until needed. This may be more convenient than just test points alone.

USB 2.0 HS

The ME910G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver.

The following table lists the available signals:

Accepted range: 3.0V

VUSB AI Power sense for the internal USB transceiver.

Table 19: Available Signals

to 5.5V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz, therefore signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential.

ESD protection can be added to USB D+/D- lines in case of external connector for cable connection.

Proper components for USB 2.0 must be used.

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ME910G1 HW Design Guide

PAD

Signal

I/O

Function

Type

NOTE

D15

Shared with TX_AUX

E15 RX_AUX

F15

SPI_CLK

SPI Clock

CMOS 1.8V

H14

SPI_CS

SPI Chip Select

CMOS 1.8V

Note

series AT command reference guide for port

SPI MISO

SPI_MOSI

SPI_CLK

E15

D15

F15

ME910G1

Application

Processor

SPI_CS

H14

SPI

The ME910G1 Module is provided by a standard 3-wire master SPI interface + chip select control.

The following table lists the available signals:

SPI_MOSI O SPI MOSI CMOS 1.8V

SPI_MISO I SPI MISO CMOS 1.8V

Table 20: Available Signals

: Due to the shared functions, SPI port and TX_AUX/RX_AUX port cannot be used simultanously.

Refer to ME910G1 configuration.

SPI Connections

Shared with

Figure 13: SPI Connections

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ME910G1 HW Design Guide

RS232

Signal

PAD

Name

Usage

1 the carrier presence

C104/RXD

M15

Transmit line *see Note

Output transmit line of ME910G1 UART

C103/TXD

N15

Receive line *see Note

Input receive of the ME910G1 UART

4 DTE READY condition

6 the module is ready

7 Hardware flow control

8 the Hardware flow control

9 the incoming call condition

Serial Ports

The ME910G1 module is provided with by 2 Asynchronous serial ports:

• MODEM SERIAL PORT 1 (Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

• RS232 PC com port

• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART @ 5V or other voltages different from 1.8V

Depending on the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the ME910G1 the ports are CMOS 1.8.

Modem serial port 1 (USIF0)

The serial port 1 on the ME910G1 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

The following table is listing the available signals:

C109/DCD N14 Data Carrier Detect

C108/DTR M14 Data Terminal Ready

C107/DSR P14 Data Set Ready

Output from the ME910G1 that indicates

Input to the ME910G1 that controls the

Output from the ME910G1 that indicates

C105/RTS L14 Request to Send

C106/CTS P15 Clear to Send

C125/RING R14 Ring Indicator

Table 21: Available Signals

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Input to the ME910G1 that controls the

Output from the ME910G1 that controls

Output from the ME910G1 that indicates

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ME910G1 HW Design Guide

Note: According to V.24, some signal names are referred to the

For a minimum implementation, only the TXD, RXD lines can be

when the module is powered off or during an ON/OFF

PAD

Signal

I/O

Function

Type

NOTE

D15 SPI_MOSI

E15 SPI_MISO

Note: Due to the shared functions, TX_AUX/RX_AUX port and SPI port

when the module is powered off or during an ON/OFF

ide for port

application side, therefore on the ME910G1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD)

RXD on the application side will be connected to the transmit line (here named C104/RXD).

connected, the other lines can be left open provided a software flow control is implemented.

In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 transition.

Modem serial port 2 (USIF1)

The auxiliary serial port on the ME910G1 is a CMOS1.8V with only the RX and TX signals.

The signals of the ME910G1 serial port are:

TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V

RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V

Table 22: ME910G1 serial port signals

Shared with

cannot be used simultanously.

In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 transition.

Refer to ME910G1 series AT command reference gu configuration.

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RS232 level translation

In order to interface the ME910G1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:

• invert the electrical signal in both directions;

• Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218)

In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).

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Figure 14: example circuitry

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

Figure 15: example RS232 serial port lines

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PAD

Signal

I/O

Output Drive

Strength

Default State

NOTE

C8 STAT LED

GPIO_02

I/O

1mA

INPUT – PD (100K)

C10

GPIO_03

I/O

1mA

INPUT – PD (100K)

C11

GPIO_04

I/O

1mA

INPUT – PD (100K)

B14

GPIO_05

I/O

1mA

INPUT – PD (100K)

C12

GPIO_06

I/O

1mA

INPUT – PD (100K)

C13

GPIO_07

I/O

1mA

INPUT – PD (100K)

(*)

K15

GPIO_08

I/O

1mA

INPUT – PD (100K)

L15

GPIO_09

I/O

1mA

INPUT – PD (100K)

G15

GPIO_10

I/O

1mA

INPUT – PD (100K)

General purpose I/O

The ME910G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. The Output pads can only be written or queried and set the value of the pad output.

An alternate function pad is internally controlled by the ME910G1 firmware and acts depending on the function implemented.

The following table shows the available GPIO on the ME910G1:

GPIO_01 I/O 1mA INPUT – PD (100K)

Alternate function

Table 23: ME910G1 available GPIO

Using a GPIO as INPUT

The GPIO pads, when used as inputs, can be connected to another device’s digital output and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO.

If the digital output of the device to be connected with the GPIO input pad of ME910G1 has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.

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Note

Device Status

Led Status

Device off

Permanently off

Not Registered

Registered in idle

Blinking 1sec on + 2 sec off

Registered in idle + power saving sync with network paging)

Connecting

Using a GPIO as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pullup resistor may be omitted.

Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command).

In the ME910G1 modules, the STAT_LED needs an external transistor to drive an external

LED and its voltage level is defined accordingly to the table below:

Permanently on

It depends on the event that triggers the wakeup (In

Blinking 1 sec on + 2 sec off

Table 24: LED and its status

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Item

Min

Typical

Max

Unit

Input Voltage range

0 - 1.8

Volt

AD conversion

- - 10

bits

Input Resistance

1 - -

Mohm

Input Capacitance

- 1 -

In the following reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type:

Figure 16: LED indicator reference schematic

External SIM Holder

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

ADC Converter

The ME910G1 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.8 volts applied on the ADC pin input, store and convert it into 10 bit word.

The input line is named as ADC_IN1 and it is available on Pad B1

The following table is showing the ADC characteristics:

Table 25: ADC characteristics

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The ADC could be controlled using an AT command.

The command is

AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.

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Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

48 MHz in LTE Band 85

Impedance

50 ohm

Input power ME910G1-WW: > 33dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

6. RF SECTION

Antenna requirements

The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit ME910G1 device shall fulfil the following requirements:

250 MHz in LTE Band 1 140 MHz in LTE Band 2, PCS1900 170 MHz in LTE Band 3, DCS1800 445 MHz in LTE Band 4 70 MHz in LTE Band 5, GSM850 80 MHz in LTE Band 8, GSM900 47 MHz in LTE Band 12 41 MHz in LTE Band 13 60 MHz in LTE Band 18 60 MHz in LTE Band 19 71 MHz in LTE Band 20 145 MHz in LTE Band 25 80 MHz in LTE Band 26 62 MHz in LTE Band 27 100 MHz in LTE Band 28 490 MHz in LTE Band 66 81 MHz in LTE Band 71

ME910G1-W1: > 24dBm Average power

Table 26: ME910G1 Antenna and Antenna transmission line on PCB

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Item

Value

Characteristic Impedance

50 ohm (+-10%)

Max Attenuation

0,3 dB

Coupling

Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be equipotential to the ME910G1 ground pins

PCB Design guidelines

When using the ME910G1, since there's no antenna connector on the module, the antenna must be connected to the ME910G1 antenna pad (K1) by means of a transmission line implemented on the PCB.

This transmission line shall fulfil the following requirements:

Table 27: ME910G1 Antenna pad requirements

The transmission line should be designed according to the following guidelines:

• make sure that the transmission line’s characteristic impedance is 50 ohm;

• keep line on the PCB as short as possible, since the antenna line loss shall be less

than about 0,3 dB;

• line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

• any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used to implement the printed transmission line afferent the antenna;

• if a Ground plane is required in line geometry, that plane shall be continuous and sufficiently extended, so that the geometry can be as similar as possible to the related canonical model;

• keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;

• it is advisable to surround (on both sides) the PCB transmission line with Ground, avoiding that other signal tracks face directly the antenna line track.

• avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;

• the ground surrounding the antenna line on PCB shall be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing the line track;

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• place EM noisy devices as far as possible from ME910G1 antenna line;

• keep the antenna line far away from the ME910G1 power supply lines;

• if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the

PCB hosting the ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover.

• if EM noisy devices are not present around the line, the use of geometries such as Microstrip or Grounded Coplanar Waveguide is preferable, since they typically ensure less attenuation if compared to a Stripline of the same length.

The following image is showing the suggested layout for the Antenna pad connection:

Figure 17: Layout for the Antenna pad connection

PCB Guidelines in case of FCC Certification

In the case FCC certification is required for an application using ME910G1, according to FCC KDB 996369 for modular approval requirements, the transmission line must be similar to the one implemented on the ME910G1 interface board and described in the following chapter.

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Transmission line design

When designing the ME910G1 interface board, the placement of components was chosen properly, in order to keep the line length as short as possible, thus leading to the lowest possible power losses. A Grounded Coplanar Waveguide (G-CPW) line was chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line.

The interface board is made on a FR4, 4-layers PCB. The substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from a coplanar ground plane = 0.3 mm each side. The line uses the reference ground plane on layer 3, while copper is removed from layer 2 below the line. The height of the trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, the estimated line loss is less than 0.1 dB.

The line geometry is shown below:

Figure 18: Line geometry

Transmission Line Measurements

An HP8753E VNA (Full-2-port calibration) was used in this measurement session.

A calibrated coaxial cable was soldered to the pad corresponding to RF output; a SMA connector was soldered to the board in order to characterize the losses of the

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transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.

Return Loss plot of line under test is shown below:

Figure 19: Return Loss plot of line under test

Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure:

Figure 20: Line input impedance

Insertion Loss of G-CPW line plus SMA connector is shown below:

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Figure 21: Insertion Loss of G-CPW line plus SMA connector

Antenna Installation Guidelines

• Install the antenna in a place covered by the LTE signal with CAT-M1 support.

• The Antenna must not be installed inside metal cases.

• The Antenna must be installed according Antenna manufacturer instructions.

• The Antenna integration should optimize the Radiation Efficiency. Efficiency values

> 50% are recommended on all frequency bands.

• The Antenna integration should not perturb the radiation pattern described in the documentation of the Antenna manufacturer.

• It is preferable to get an omnidirectional radiation pattern.

• The Antenna Gain must not exceed the values indicated in regulatory requirements,

where applicable, in order to meet related EIRP limitations. Typical antenna Gain in most M2M applications does not exceed 2dBi.

• If the device antenna is located farther than 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product.

• If the device antenna is located closer than 20cm from the human body or there are co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused).

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Signal

I/O

Function

Internal

Pull Up

Type

Digital Audio Interface (Word Alignment / LRCLK)

DVI_RX

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (BCLK)

CMOS 1.8V

7. AUDIO SECTION

The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to the end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).

Electrical Characteristics

The product is providing the DVI on the following pins:

DVI_WA0 I/O

Table 28: Pins DVI

CMOS 1.8V

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Signal

I/O

Function

Type

ANT_GNSS

GNSS Antenna (50 ohm)

GNSS_LNA_EN

GNSS External LNA Enable

CMOS 1.8V

8. GNSS SECTION

The ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS.

GNSS Signals Pin-out

Table 29: GNSS Signals Pin-out

Warning: GNSS_1PPS is not currently supported by software and it will be implemented in future SW releases.

RF Front End Design

The ME910G1 Module contains a pre-select SAW filter but does not contain the LNA necessary to achieve the maximum sensitivity. Active antenna (antenna with a built-in low noise amplifier) must be used and must be supplied with a proper bias-tee circuit.

Guidelines of PCB line for GNSS Antenna

• Make sure that the antenna line impedance is 50ohm.

• Keep the antenna line on the PCB as short as possible to reduce the loss.

• The Antenna line must have uniform characteristics, constant cross section, avoid

meanders and abrupt curves.

• If possible, keep one layer of the PCB used only for the Ground plane.

• Surround (on both the sides, above and below) the antenna line on PCB with

Ground, avoid having other signal tracks facing directly the antenna line of track.

• The ground around the antenna line on PCB must be strictly connected to the Ground Plane by placing vias once per 2mm at least.

• Place EM noisy devices as far as possible from antenna line.

• Keep the antenna line far away from power supply lines.

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• Keep the antenna line far away from GSM RF lines.

• If there are noisy EM devices around the PCB hosting the module, such as fast

switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shielding it with a metal frame cover.

• If there are not noisy EM devices around the PCB hosting the module, use a strip- line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one.

Hardware-based solution for GNSS and LTE coexistence

When a stand-alone GNSS receiver is present in the user application, the LTE transmission may desensitize the GNSS receiver in particular if the decoupling between the LTE and GNSS antennas is low. A SAW filter can be added on LTE side, to protect GNSS receiver from LTE out-of-band emissions, as described in the schematic below.

When the GNSS receiver embedded in the ME910G1 module is used, there is no condition for degradation, since the LTE part and the GNSS part are never active simultaneously, therefore the filtering on the LTE side is not needed.

Figure 22: Reference schematic

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Item

Value

Frequency range

Gain

15 ~ 30dB

Impedance

50 ohm

Noise Figure of LNA

DC supply voltage

VSWR

≤ 3:1 (recommended)

Note

GNSS Antenna Requirements

GNSS active antenna must be used or integrated in the application.

GNSS Antenna specification

1559.0 ~ 1610.0 MHz

< 1.5 (recommended)

DC 1.8 ~ 3.3V

Table 30: GNSS Antenna specification

: In case of GNSS antenna placed close to module 15dB gain is

enough, in case of long cable the gain has to be increased up to 30dB.

GNSS Antenna – Installation Guidelines

• The antenna must be installed according to the antenna manufacturer’s instructions

to obtain the maximum performance of GNSS receiver.

• The antenna location must be carefully evaluated if operating in conjunction with any other antenna or transmitter.

• The antenna must not be installed inside metal cases or near any obstacle that may degrade features such as antenna lobes and gain.

Powering the External LNA (active antenna)

The LNA of active antenna needs a power source because 1.8V or 3V DC voltage required by the active antenna is not supplied by the ME910G1 module but can be easily included by the host design.

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Level

Min

Max

Output High Level

1.6V

1.9V

Output Low Level

0.3V

The electrical characteristics of the GPS_LNA_EN signal are:

Table 31: Electrical characteristics of the GPS_LNA_EN

Example of external antenna bias circuitry:

Figure 23: External antenna bias circuitry example

Be aware of max bias current in case of unwanted short on the antenna cable, since the decoupling inductor may be damaged.

In case of LNA with 1.8V supply, VAUX/POWERMON pin can be used to supply active GNSS antenna

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Parameters

Typical

Measurement

Notes

Sensitivity

-159 dBm

-155 dBm

TTFF

Hot

N/A

It will be available in next revision

<30s

Min Navigation update rate

CEP

GNSS Characteristics

The table below specifies the GNSS characteristics and expected performance:

Table 32: GNSS characteristics

Tracking Sensitivity

Navigation

Cold Start

Warm

Cold

-144 dBm

1Hz

<2m

GNSS Simulator test @-130dBm

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9. MECHANICAL DESIGN

Drawing

PIN B1

Lead Free Alloy:

Surface Finishing Ni/Au for all solder pads

Dimensions in mm

Figure 24: ME910G1 Mechanical Drawing

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10. APPLICATION PCB DESIGN

The ME910G1 modules have been designed in order to be compliant with a standard lead- free SMT process

Recommended footprint for the application

TOP VIEW

Figure 25: Footprint

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SOLDER RESIST PATTERN (dimensions in mm)

Figure 26:: Solder resist pattern

TOP TRANSPARENT VIEW

Figure 27: Top transparent view

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Note:

In order to easily rework the ME910G1 it is recommended to consider on the application a 1.5 mm placement inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

In the customer application, the region under WIRING INHIBIT

(see figure above) must be clear from signal or ground paths.

PCB pad design

In PCB design, the solder pads can be defined as either Solder Mask Defined (SMD) or Non-Solder Mask Defined (NSMD). The difference between these two solder mask pad definitions, is in the closeness of the solder mask to the metal pad. In SMD pads, the solder mask opening is smaller than the metal pad and overlaps the metal on all sides. The solder mask opening defines the solderable area of the pad. In NSMD pads, the solder mask opening is larger than the metal pad and does not overlap the metal. The metal edge defines the solderable area of the pad (see Figure below).

Since the metal etching process in PCB manufacture, has significantly tighter alignment and etching tolerances than the alignment registration of the solder masking process, which, a more accurate solder pad land pattern can be obtained with NSMD pads. In addition, with SMD pads, the solder mask that overlaps the metal pad introduces additional height above the metal surface that may affect solder joint adhesion and reliability. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Copper Pad Solder Mask

PCB

Figure 28: PCB solder pad recommendations

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(Solder Mask Defined)

SMD

NSMD

(Non Solder Mask Defined)

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Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au

3 –7 / 0.05 – 0.15

good solder ability protection, high shear force values

Inhibit area for micro-via

Recommendations for PCB pad dimensions

It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself

Figure 29: Pad dimensions recommendations

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Table 33: Recommendations for PCB pad surfaces

The PCB must be able to resist the higher temperatures that occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to the leadfree solder paste.

It is not necessary to panel the application’s PCB, however in that case it is recommended to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.

FR4 is one of the most commonly used PCB materials, it is a flame retardant composite material, composed by fiberglass-reinforced and epoxy laminate. One of the features of the FR4, is to have a very low thermal conductivity. An inexpensive way to improve thermal

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Thermal performance

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transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between the conductive layers. Vias are created by drilling holes and copper plating them, in the same way that a PTH or via is used for electrical interconnections between layers. A series of plated through-hole thermal vias, should be located in the GND area underneath Telit module of the PCB to provide a thermal connection from the PCB GND to additional metal layers of the PCB.

The application PCB layout should include plated through-hole thermal vias for efficient heat dissipation from the Telit module into the PCB. One of the following thermal via types should be used:

• Open plated through-hole vias that will provide lower PCB fabrication costs but

may fill with solder.

• Plugged and capped plated through-hole vias that will provide higher PCB

fabrication costs but will not fill with solder.

Telit recommends creating areas of 10 mil (0.254-mm) vias arranged on a 25 mil (0.635mm) rectilinear matrix. The reason for this choice is the combination of cost, performance and manufacturability. According to several PCB manufacturers, 10-mil holes and 25-mil spacing are reasonable and repeatable production choice.

A uniform metal plating thickness on the PCB will ensure reliable, high Telit module solder assembly yield.

Stencil

A silk-screen process will be required for the deposition of solder paste to the PCB, for reflow of the Telit module to the PCB. The silk-screen process requires the use of an aperture based metal stencil where solder paste is transferred through the apertures onto the solder pads of the application PCB. To minimize solder voids and ensure maximum electrical and thermal connectivity of the module to the PCB, large pads, solder volume, and solder straining must be considered in the stencil design. The design and fabrication of the stencil determines the quality of the solder paste deposition onto the PCB and the resulting solder joint after reflow. The primary stencil parameters are aperture size, thickness, and fabrication method. The stencil should be made from stainless steel and the apertures layout can be the same of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil). A stencil thickness of 152 µm (6 mil) can be used as well.

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Profile Feature

Pb-Free Assembly Free

Average ramp-up rate (TL to TP)

3°C/second max

Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts)

60-180 seconds

Tsmax to TL – Ramp-up Rate

3°C/second max

Time maintained above: – Temperature (TL) – Time (tL)

60-150 seconds

Peak Temperature (Tp)

245 +0/-5°C

Time within 5°C of actual Peak Temperature (tp)

Ramp-down Rate

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

Solder paste

Various types and grades of solder paste can be used for surface mounting Telit modules. For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any Type 3 solder paste that is either water-soluble or no clean is acceptable.

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.

Solder Reflow

Recommended solder reflow profile:

Figure 30: Recommended solder reflow profile

150°C 200°C

217°C

10-30 seconds

Table 34: Profile feature recommendations

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Note

Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.

Warning

guarantee adequate adherence of the

module to the customer application throughout the temperature

: All temperatures refer to topside of the package, measured on

the package body surface

: The above solder reflow profile represents the typical SAC

reflow limits and does not

range. Customer must optimize the reflow profile depending on the overall system taking into account such factors as thermal mass and warpage.

Inspection

An inspection of the solder joint between the solder pads of the Telit module and the application PCB should be performed. The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X-ray, which can identify defects such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder joints are not detrimental to the reliability of the solder joint).

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11. PACKAGING

Tray

The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each). Please note that Telit is going to introduce a new packaging for the xE910 family, as per the Product Change Notification PCN-0000-14-0055, therefore the mass production units of ME910G1 will be shipped according to the following drawings:

Figure 31: Tray packaging

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Figure 32: Tray dimensions

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Reel

The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier.

Figure 33: Module positioning into the carrier

Carrier Tape detail

Figure 34: Carrier Tape detail

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Reel detail

Figure 35: Reel detail

Figure 36: Detail

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Packaging detail

Figure 37: Packaging detail

Moisture sensitivity

The ME910G1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033D paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH

or more

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Type Approval

ME910G1-W1

ME910G1-WW

ME910G1-WWV

EU RED

Yes

US FCC

Yes

CA ISED

Yes

BRAZIL ANATEL

Yes

JAPAN JRF & JTBL

Yes

CHINA CCC - Ongoing

Model

Antenna Type

ME910G1-W1

ME910G1-WW

ME910G1-WWV

12. CONFORMITY ASSESSMENT ISSUES

Approvals summary

Table 35: Approvals summary

RED approval

RED Declaration of Conformity

Hereby, Telit Communications S.p.A declares that the ME910G1-W1, ME910G1-WW and ME910G1-WWV Modules are in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:

http://www.telit.com/red

Text of 2014/53/EU Directive (RED) can be found here:

https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32014L0053

Antennas

This radio transmitter has been approved under RED to operate with the antenna types listed below with the maximum permissible gain indicated. The usage of a different antenna in the final hosting device may need a new assessment of host conformity to RED.

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Table 36: RED Antenna Type

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Max Gain for RED (dBi)

Band

ME910G1-W1

ME910G1-WW

ME910G1-WWV

GSM 900

---

TBD

DCS 1800

---

TBD

GPRS/EGPRS 900

---

5.47

GPRS/EGPRS 1800

---

9.34

FDD 1

14.84

11.84

FDD 3

14.33

11.33

FDD 8

11.45

8.45

FDD 20

11.20

8.20

FDD 28

10.47

7.47

Model

Modèle

Applicable FCC Rules

Applicable ISED Rules

Règles ISDE applicables

ME910G1-W1

ME910G1-WW

ME910G1-WWV

Table 37: Max Gain for RED

FCC and ISED approval/

FCC et ISDE approbation

FCC certificates

The FCC Certificate is available here:

https://www.fcc.gov/oet/ea/fccid

ISED Certificate/

The ISED Certificate is available here /

https://smssgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en

Applicable FCC and ISED rules/

ISDE certificates

Le certificat ISDE est disponible ici

Liste des règles FCC et ISDE

Table 38: Applicable FCC and ISED rules

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applicables

47 CFR Part 2, 22, 24, 27, 90

RSS: 132 Issue3, 133 Issue 6, 130 Issue 2, 139 Issue 3; RSS-Gen Issue 5

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FCC and ISED Regulatory notices/

Avis réglementaires de FCC et

ISDE

Modification statement /

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement /

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

Déclaration de modification

Déclaration d'interférence

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice /

This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.

Wireless avis

Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps.

FCC Class B digital device notice (FCC only)

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

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Model

Antenna Type

ME910G1-W1

ME910G1-WW

ME910G1-WWV

reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by taking one or more of the following measures:

Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

CAN ICES-3 (B) / NMB-3 (B) (ISED only) /

(ISDE seulement)

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

Antennas/Antennes

FCC

This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

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Table 39: FCC Antenna Type

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Max Gain for FCC (dBi)

Band

ME910G1-W1

ME910G1-WW

ME910G1-WWV

GSM 850

---

8.44

GSM 1900

---

10.04

GPRS/EGPRS 850

---

6.93

GPRS/EGPRS 1900

---

10.42

FDD 2

11.0

12.01

FDD 4

8.0

12.01

FDD 5

12.4

9.41

FDD 12

11.6

8.70

FDD 13

12.1

9.16

FDD 25

11.0

12.01

FDD 26

12.3

9.36

FDD 66

8.0

12.01

FDD 71

11.4

11.47

FDD 85

11.6

8.69

FDD 86

12.1

---

Model

Modèle

Antenna Type

Type d’Antenne

ME910G1-W1

ME910G1-WW

ME910G1-WWV

Table 40: Max Gain for FCC (dBi)

ISED /

ISDE

This radio transmitter has been approved by ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio a été approuvé par ISDE pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

Omnidirectional Antenna Gain 2.14 dBi

Omnidirectionelle Gain de l’antenne 2.14 dBi

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Table 41: ISED Antenna Type

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Gain maximum pour ISED (dBi) /

Gain maximum pour ISDE (dBi)

Bande

ME910G1-W1

ME910G1-WW

ME910G1-WWV

GSM 850

5.15

GSM 1900

10.04

GPRS/EGPRS 850

---

3.64

GPRS/EGPRS 1900

---

5.13

FDD 2

11.0

8.52

FDD 4

8.0

8.29

FDD 5

9.1

6.12

FDD 12

8.6

5.63

FDD 13

8.9

5.95

FDD 25

11.0

8.52

FDD 26

9.0

6.09

FDD 66

8.0

8.29

FDD 71

8.4

8.48

FDD 85

8.6

5.63

Model

FCC ID

ME910G1-W1

RI7ME910G1W1

ME910G1-WW

ME910G1-WWV

Table 42: Gain maximum for ISED (dBi)

FCC label and compliance information

The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module The exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7ME910G1W1” or “Contains FCC ID: RI7ME910G1W1” for ME910G1-W1 and : “Contains Transmitter Module FCC ID: RI7ME910G1WW” or “Contains FCC ID: RI7ME910G1WW” for ME910G1-WW and ME910G1-WWV

Below list of all the models and related FCC ID:

RI7ME910G1WW

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Table 43: FCC ID

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Model

Modèle

ISED Certification Number

Num. de certification ISDE

ME910G1-W1

5131A-ME910G1W1

ME910G1-WW

ME910G1-WWV

ISED label and compliance information/

Étiquette et informations

de conformité ISDE

The host product shall be properly labelled to identify the modules within the host product.

The ISED certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labelled to display the ISED certification number for the module, preceded by the word "contains" or similar wording expressing the same meaning, as follows:

Contains IC: XXXXXX-YYYYYYYYYYY

In this case, XXXXXX-YYYYYYYYYYY is the module's certification number.

Le produit hôte devra être correctement étiqueté, de façon à permettre l'identification des modules qui s'y trouvent.

L'étiquette d'homologation d'un module d'ISDE devra être apposée sur le produit hôte à un endroit bien en vue, en tout temps. En l'absence d'étiquette, le produit hôte doit porter une étiquette sur laquelle figure le numéro d'homologation du module d'ISDE, précédé du mot « contient », ou d'une formulation similaire allant dans le même sens et qui va comme suit :

Contient IC : XXXXXX-YYYYYYYYYYY

Dans ce cas, XXXXXX-YYYYYYYYYYY est le numéro d'homologation du module.

5131A-ME910G1WW

Table 44: ISED Certification Number

Information on test modes and additional testing requirements /

Informations sur les modes de test et les exigences de test supplémentaires

The module has been evaluated in mobile stand-alone conditions. For different operational conditions from a stand-alone modular transmitter in a host (multiple, simultaneously transmitting modules or other transmitters in a host), additional testing may be required (collocation, retesting…)

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If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.

Le module a été évalué dans des conditions autonomes mobiles. Pour différentes conditions de fonctionnement d'un émetteur modulaire autonome dans un hôte (plusieurs modules émettant simultanément ou d'autres émetteurs dans un hôte), des tests supplémentaires peuvent être nécessaires (colocalisation, retesting…)

Si ce module est destiné à être utilisé dans un appareil portable, vous êtes responsable de l'approbation séparée pour satisfaire aux exigences SAR de la FCC Partie 2.1093 et IC RSS-102.

FCC Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end product with an embedded module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.

ANATEL Regulatory Notices

"Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar interferência em sistemas devidamente autorizados"

"This equipment is not entitled to protection against harmful interference and must not cause interference in duly authorized systems"

ME910G1-WW, ME310G1-WW, ML865G1-WW Homologation #: 08566-20-02618

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NCC Regulatory Notices

According to NCC Taiwan requirements, the module and the packaging shall be identified as described in the following lines. Shall be added also the specified safety warning statement.

Brand name: Telit

Model name: ME910G1-WW

Equipment name: WWAN module

NCC logo:

NCC ID: CCAF20NB0050T0

NCC safety warning statement: “減少電磁波影響，請妥適使用”

NCC Note:

注意：行動電話業務(2G)於 106 年 6 月停止提供服務後，本設備 2G 功能在國內將無法使用。

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13. PRODUCT AND SAFETY INFORMATION

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

Copyrights and Other Notices

Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information in this document has been carefully checked and is believed to be reliable. Telit reserves the right to make changes to any of the products described herein, to revise it and to make changes from time to time with no obligation to notify anyone of such revisions or changes. Telit does not assume any liability arising from the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

This document may contain references or information about Telit’s products (machines and programs), or services that are not announced in your country. Such references or information do not necessarily mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described herein may include or describe Telit’s copyrighted material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and in other countries reserve to Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive righ to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any of Telit’s or its licensors’ copyrighted material contained herein or described in this instruction manual, shall not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of the owner. Furthermore, the purchase of Telit’s products shall not be deemed to grant in any way, neither directly nor by implication, or estoppel, any license.

Computer Software Copyrights

Telit and the 3rd Party supplied Software (SW) products, described in this instruction manual may include Telit’s and other 3rd Party’s copyrighted computer programs stored in semiconductor memories or other media. Laws in Italy and in other countries reserve to Telit and other 3rd Party SW exclusive rights for copyrighted computer programs,

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including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the 3rd Party software supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or in any other way, any license under the copyrights, patents or patent applications of Telit or other 3

Party supplied SW, except for the normal non-exclusive,

royalty free license to use arising by operation of law in the sale of a product.

Usage and Disclosure Restrictions

License Agreements

The software described in this document is owned by Telit and its licensors. It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement.

Copyrighted Materials

The Software and the documentation are copyrighted materials. Making unauthorized copies is prohibited by the law. The software or the documentation shall not be reproduced, transmitted, transcribed, even partially, nor stored in a retrieval system, nor translated into any language or computer language, in any form or by any means, without prior written permission of Telit.

High Risk Materials

Components, units, or third-party goods used in the making of the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: operations of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness eligibility for such High Risk Activities.

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Trademarks

TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners.

3rd Party Rights

The software may include 3rd Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights. In addition to 3rd Party Terms, the disclaimer of warranty and limitation of liability provisions in this License, shall apply to the 3rd Party Rights software as well.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESSED OR IMPLIED FROM ANY 3RD PARTY REGARDING ANY SEPARATE FILES, ANY 3RD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY 3RD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODES”), AND THE USE OF ANY OR ALL OTHER CODES IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO 3RD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST OF PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODES OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Waiwer of Liability

IN NO EVENT WILL TELIT AND ITS AFFILIATES BE LIABLE FOR AY DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY INDIRECT DAMAGE OF ANY KIND WHATSOEVER, INCLUDING BUT NOT LIMITED TO REIMBURSEMENT OF COSTS, COMPENSATION OF ANY DAMAGE, LOSS OF PRODUCTION, LOSS OF PROFIT, LOSS OF USE, LOSS OF BUSINESS, LOSS OF DATA OR REVENUE, WHETHER OR NOT THE POSSIBILITY OF SUCH DAMAGES COULD HAVE BEEN REASONABLY FORESEEN, CONNECTD IN ANY WAY TO THE USE OF THE PRODUCT/S OR TO THE INFORMATION CONTAINED IN THE PRESENT DOCUMENTATION, EVEN IF TELIT AND/OR ITS AFFILIATES HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.

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Safety Recommendations

Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where:

• it can interfere with other electronic devices, particularly in environments such as

hospitals, airports, aircrafts, etc.

• there is a risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible for the functioning of the final product. Therefore, the external components of the module, as well as any project or installation issue, have to be handled with care. Any interference may cause the risk of disturbing the GSM network or external devices or having an impact on the security system. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed carefully in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The equipment is intended to be installed in a restricted area location.

The equipment must be supplied by an external specific limited power source in compliance with the standard EN 62368-1:2014.

The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

https://ec.europa.eu/growth/sectors/electrical-engineering_en

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ADC

Analog – Digital Converter

CLK

Clock

CMOS

Complementary Metal – Oxide Semiconductor

Chip Select

DAC

Digital – Analog Converter

DTE

Data Terminal Equipment

ESR

Equivalent Series Resistance

GPIO

High Speed

HSDPA

High Speed Downlink Packet Access

HSIC

High Speed Inter Chip

HSUPA

High Speed Uplink Packet Access

I/O

Input Output

MISO

Master Input – Slave Output

MOSI

Master Output – Slave Input

PCB

Printed Circuit Board

RTC

Real Time Clock

SIM

Subscriber Identification Module

SPI

Serial Peripheral Interface

TTSC

Telit Technical Support Centre

UART

Universal Asynchronous Receiver Transmitter

UMTS

Universal Mobile Telecommunication System

USB

Universal Serial Bus

VNA

Vector Network Analyzer

VSWR

Voltage Standing Wave Radio

WCDMA

Wideband Code Division Multiple Access

14. GLOSSARY

General Purpose Input Output

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Revision

Date

Changes

15. DOCUMENT HISTORY

2021-02-22 Section 3.2, LGA pads layout correction

2021-02-02 Reviewed template design and styles

2020-09-14 Section 2.5, TX Power update

Section 2.4, update

Chapter 4, update

Sections 6.1, 6.2, 6.3, removed (redundant)

Section 7.2, removed

Section 8.4, measurements update

Section 2.2, 2.5, 12.3, adding B86 update

Section 2.8, Temperature range update

Chapter 12, Conformity assessment update

2020-07-22 Conformity assessment update with ANATEL

2020-06-18

2020-06-10 Conformity assessment update

2020-01-23 Conformity assessment update

The title of chapter 5.7.3.2 has been changed from "Modem serial port 2" in "Modem serial port 2 (USIF1)".

The title of chapter 5.7.3.1 has been changed from "Modem serial port 1" in "Modem serial port 1 (USIF0)".

In the table of chapter 3.1, the "Asynchronous serial port" section title has been changed in "Asynchronous serial port (USIF0)".

TX Output Power update

Power Consumption section update

GNSS Section update

Applicability table update

Power consumption figures update

RX Sensitivity figures update

RF Section update

Pull-up/down values update

2019-08-29 Bands support updating

Added ME910G1-WW

Temperature range update

Added power consumption figures

Removed B14

Extended Voltage Range lower limit change

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Revision

Date

Changes

2019-04-12 First issue

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