Telit GL865-QUAD User Manual

[0

Mod. 08

GL865-QUAD V4

HW User Guide

1VV0301518 Rev. 5 – 2020-09-23

1.2017]

05 2017-01 Rev.6

GL865-QUAD V4 Hardware User Guide

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.

It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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GL865-QUAD V4 Hardware User Guide

USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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GL865-QUAD V4

APPLICABILITY TABLE

PRODUCTS

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Contents

NOTICE 2

COPYRIGHTS .................................................................................................... 2

COMPUTER SOFTWARE COPYRIGHTS ........................................................ 2

USAGE AND DISCLOSURE RESTRICTIONS ................................................. 3

I. License Agreements ........................................................................ 3

II. Copyrighted Materials ...................................................................... 3

III. High Risk Materials .......................................................................... 3

IV. Trademarks ...................................................................................... 3

V. Third Party Rights ............................................................................ 3

APPLICABILITY TABLE .................................................................................... 4

CONTENTS ........................................................................................................ 5

1. INTRODUCTION .............................................................................. 8

Scope ............................................................................................... 8

Audience........................................................................................... 8

Contact Information, Support ........................................................... 8

Text Conventions ............................................................................. 9

Related Documents .......................................................................... 9

2. GENERAL PRODUCT DESCRIPTION ......................................... 10

Overview......................................................................................... 10

Product Variants and Frequency Bands ........................................ 10

Target Market ................................................................................. 10

Main features .................................................................................. 11

TX Output Power ............................................................................ 11

RX Sensitivity ................................................................................. 11

Mechanical Specifications .............................................................. 12

2.7.1. Dimensions ..................................................................................... 12

2.7.2. Weight ............................................................................................ 12

Temperature Range ....................................................................... 12

3. PINS ALLOCATION ...................................................................... 13

Pin-out ............................................................................................ 13

VQFN Pads Layout ........................................................................ 18

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4. POWER SUPPLY .......................................................................... 19

Power Supply Requirements ......................................................... 19

Power Consumption ....................................................................... 20

General Design Rules .................................................................... 21

4.3.1. Electrical Design Guidelines .......................................................... 21

4.3.1.1. +5V Source Power Supply Design Guidelines .............................. 21

4.3.1.2. +12V Source Power Supply Design Guidelines ............................ 22

4.3.1.3. Battery Source Power Supply Design Guidelines ......................... 23

4.3.2. Thermal Design Guidelines ............................................................ 23

4.3.3. Power Supply PCB layout Guidelines ........................................... 24

RTC ................................................................................................ 25

VAUX Power Output ...................................................................... 25

5. DIGITAL SECTION ........................................................................ 27

Logic Levels ................................................................................... 27

Auto-Turning ON ............................................................................ 28

Power Off ....................................................................................... 30

Reset .............................................................................................. 31

Communication ports ..................................................................... 34

5.5.1. Serial Ports ..................................................................................... 34

5.5.1.1. Modem serial port 1 (USIF0).......................................................... 34

5.5.1.2. Modem serial port 2 (USIF1).......................................................... 36

General purpose I/O ....................................................................... 37

5.6.1. Using a GPIO as INPUT ................................................................ 38

5.6.2. Using a GPIO as OUTPUT ............................................................ 38

External SIM Holder ....................................................................... 39

ADC Converter ............................................................................... 39

5.8.1. Using ADC Converter..................................................................... 39

DAC Converter ............................................................................... 39

5.9.1. Enabling DAC ................................................................................. 40

5.9.2. LOW Pass filter Example ............................................................... 40

6. RF SECTION .................................................................................. 41

Bands Variants ............................................................................... 41

TX Output power ............................................................................ 41

Antenna requirements .................................................................... 41

6.3.1. PCB Design guidelines .................................................................. 42

7. MECHANICAL DESIGN ................................................................ 43

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Drawing .......................................................................................... 43

8. APPLICATION PCB DESIGN ....................................................... 44

Footprint ......................................................................................... 44

PCB pad design ............................................................................. 46

PCB pad dimensions...................................................................... 46

Stencil ............................................................................................. 47

Solder paste ................................................................................... 47

Solder Reflow ................................................................................. 47

9. SAFETY RECOMMENDATIONS .................................................. 50

READ CAREFULLY ....................................................................... 50

10. ACRONYMS .................................................................................. 51

11. DOCUMENT HISTORY ................................................................. 53

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1. INTRODUCTION

Scope

This document introduces the GL865-QUAD V4 module and presents possible and
recommended hardware solutions for developing a product based on this module. All the
features and solutions detailed in this document are applicable to all the variants listed in
the applicability table.

Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for properly
developing your product with the Telit module.

Audience

This document is intended for Telit customers, who are integrators, about to implement their
applications using our GL865-QUAD V4 modules.

Contact Information, Support

For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:

• [e-mail]

• [e-mail]

• [e-mail]

• [e-mail]

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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This information MUST be followed or catastrophic

Alerts the user to important points about

Provides advice and suggestions that may be

Text Conventions

Danger –
equipment failure or bodily injury may occur.

Caution or Warning –
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.

Tip or Information –
useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

Related Documents

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2. GENERAL PRODUCT DESCRIPTION

Overview

The GL865-QUAD V4 module is a quad-band 850/900/1800/1900 MHz GSM / GPRS
communication product which allows integrators to plan on availability for even the longest
lifecycle applications, highly recommended for new designs specified for 2G coverage
worldwide.

The product is fully voice capable, the analog audio interface make it suitable for
applications such as voice enabled alarm panels, mHealth patient monitors and specialty
phones such as those for the elderly or sensory-impaired.

The GL865-QUAD V4 operates with 2.8 V GPIOs, minimizing power consumption and
making it even more ideally suited for battery powered and wearable device applications.

Product Variants and Frequency Bands

Product 2G Band (MHz) 3G Band (MHz) 4G Band (MHz) Region

GL865-QUAD V4 850, 900,

1800, 1900

Refer to “RF Section” for details information about frequencies and bands.

- - -

Target Market

GL865-QUAD V4 can be used for telematics applications where tamper-resistance,
confidentiality, integrity, and authenticity of end-user information are required, for example:

• Emergency call

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

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Main features

Function Features

Modem

Audio

Intefaces

TX Output Power

Band Power Class

850/900 MHz Class 4 (2W)

• 2G (GSM/GPRS) Quad Band

• SMS support (text and PDU)

• Alarm management

• Real Time Clock

• Analog audio

• Main UART is typically used for AT command access

• Secondary UARTused for Diagnostic monitoring and

debugging

• 8 GPIOs

• Antenna port

1800/1900 MHz Class 1 (1W)

RX Sensitivity

1800 MHz -110

1900 MHz -108

Band Sensitivity (dBm)

850 MHz -110

900 MHz -110

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Mechanical Specifications

2.7.1. Dimensions

The overall dimensions of GL865-QUAD V4 are:

• Length: 24.4 mm

• Width: 24.4 mm

• Thickness: 2.6 mm

2.7.2. Weight

The nominal weight of the module is 2.6 grams.

Temperature Range

Note

The module is fully

Operating Temperature

Range

–40°C ÷ +85°C

functional(*) in all the

temperature range, and it

fully meets the 3GPP

specifications.

Storage and non-operating

Temperature Range

–40°C ÷ +85°C

(*) Functional: the module is able to make and receive voice calls, data calls, SMS
and make data traffic.

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accordingly and

3. PINS ALLOCATION

Warning: GL865-QUAD V4 is adopting a modified 56-pin xL865 Form
Factor, pin to pin compatible with the previous 48-pin xL865 FF and
with 8 additional pads.

The numbering of the pins has been changed
attention has to be paid when comparing with previous 48-pin xL865
FF design.

Pin-out

Pin Signal I/O Function Type Comment

Audio

24 EAR- O Earphone signal (-) Audio

25 EAR+ O Earphone signal (+) Audio

26 MIC- I Microphone signal (-) Audio

28 MIC+ I Microphone signal (+) Audio

23 GND - -

SIM card interface

11 SIMVCC -

External SIM signal - Power

1.8 / 3V

supply for the SIM

12 SIMRST O External SIM signal - Reset 1.8 / 3V

13 SIMCLK O External SIM signal – Clock 1.8 / 3V

14 SIMIO I/O External SIM signal - Data I/O 1.8 / 3V

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Asynchronous Auxiliary Serial Port

53 TX_AUX O

52 RX_AUX I

Prog. / Data + HW Flow Control

1 C109/DCD O

2 C125/RING O

3 C107/DSR O

4 C108/DTR I

Auxiliary UART
(TX Data to DTE)

Auxiliary UART
(RX Data from DTE)

Output for Data carrier detect
signal (DCD) to DTE

Output for Ring indicator signal
(RI) to DTE

Output for Data set ready
signal (DSR) to DTE

Input for Data terminal ready
signal (DTR) from DTE

CMOS 2.8V

CMOS 2.8V

CMOS 2.8V

CMOS 2.8V

CMOS 2.8V

CMOS 2.8V

5 C105/RTS I

Input for Request to send

CMOS 2.8V

signal (RTS) from DTE

6 C106/CTS O

Output for Clear to send signal

CMOS 2.8V

(CTS) to DTE

9 C103/TXD I Serial data input from DTE CMOS 2.8V

10 C104/RXD O Serial data output to DTE CMOS 2.8V

DIGITAL IO

48 GPIO_01 I/O GPIO_01

CMOS

2.8V

47 GPIO_02 I/O GPIO_02

CMOS

2.8V

46 GPIO_03 I/O GPIO_03

CMOS

2.8V

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Power ON Monitor

45 GPIO_04 I/O GPIO_04

CMOS

2.8V

33 GPIO_05 I/O GPIO_05

CMOS

2.8V

32 GPIO_06 I/O GPIO_06

CMOS

2.8V

31 GPIO_07 I/O GPIO_07

CMOS

2.8V

30 GPIO_08 I/O GPIO_08

CMOS

2.8V

ADC

15 ADC_IN1 AI Analog / Digital converter input A/D

16 ADC_IN2 AI Analog / Digital converter input A/D

DAC

17 DAC_OUT AO Digital/Analog converter output D/A

RF SECTION

40 ANTENNA I/O Main Antenna (50 ohm) RF

Miscellaneous Functions

34 VRTC AO VRTC Backup 2.8V

55 RESET* I Reset Input 1.8V

51 VAUX O

Supply Output for

2.8V

external accessories /

Power Supply

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44 VBATT - Main power supply (Baseband) Power

43 VBATT_PA - Main power supply (Radio PA) Power

27 GND - Ground Power

21 GND - Ground Power

38 GND - Ground Power

39 GND - Ground Power

41 GND - Ground Power

42 GND - Ground Power

54 GND - Ground Power

RESERVED

7 RESERVED - RESERVED

8 RESERVED - RESERVED

18 RESERVED - RESERVED

19 RESERVED - RESERVED

20 RESERVED - RESERVED

22 RESERVED - RESERVED

29 RESERVED - RESERVED

35 RESERVED - RESERVED

36 RESERVED - RESERVED

37 RESERVED - RESERVED

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49 RESERVED - RESERVED

50 RESERVED - RESERVED

56 RESERVED - RESERVED

WARNING:

Reserved pins must not be connected.

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VQFN Pads Layout

TOP VIEW

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be taken when designing the application’s power supply section to
avoid having an excessive voltage drop. If the voltage drop is

4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.

Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfil the following requirements:

Power Supply Value

Nominal Supply Voltage 3.8V

Normal Operating Voltage Range 3.40 V÷ 4.20 V

NOTE:

The Operating Voltage Range MUST never be exceeded; care must

exceeding the limits it could cause a Power Off of the module.

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Power Consumption

The values reported in the following table have been measured in nominal conditions
(3.8V@25°C) with 5% max error:

Mode Band Average (mA) Mode Description

IDLE mode

AT+CFUN=1 All 13 (DRX9)

Power Saving Disabled
(+ESLP=0)

AT+ESLP=1 All 1 (DRX9) Power Saving Enabled

See AT Commands Guide

Operative Mode

GSM900 220 PCL5

GSM Voice Call

DCS1800 145 PCL0

GSM900 360

GPRS Data Call

PS Class 10 @ Gamma3

DCS1800 210

The GSM system is made in a way that the RF transmission is not continuous, but it is
packed into bursts at a base frequency of approx. 217 Hz, and the relative current peaks
can be as high as about 2A. Therefore the power supply has to be designed to withstand
these current peaks without big voltage drops; this means that both the electrical design
and the board layout must be designed for this current flow.

If the layout of the PCB is not well designed a strong noise floor is generated on the ground
and the supply; this will reflect on all the audio paths producing an audible annoying noise
at approx. 217 Hz; if the voltage drop during the peak current absorption is too much, then
the device may even shutdown as a consequence of the supply voltage drop.

NOTE:

The electrical design for the Power supply should be made ensuring it
will be capable of a peak current output of at least 2A (3.80V supply).

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General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout

4.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where
this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

4.3.1.1. +5V Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference

between the input source and the desired output and a linear regulator can be used.
A switching power supply will not be suited because of the low drop out
requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to

dissipate the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks close to the Module, a 100μF capacitor is usually

suited.

• Make sure the low ESR capacitor on the power supply output rated at least 10V.

An example of linear regulator with 5V input is:

delines

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4.3.1.2. +12V Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference

between the input source and the desired output, a linear regulator is not suited and
shall not be used. A switching power supply will be preferable because of its better
efficiency.

• When using a switching regulator, a 500kHz or more switching frequency regulator

is preferable because of its smaller inductor size and its faster transient response.
This allows the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the

application to be developed due to the fact the switching frequency could also
generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in

mind when choosing components: all components in the power supply must
withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks, a 100μF capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output is rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power

input, in order to clean the supply from spikes.

An example of switching regulator with 12V input is in the below schematic:

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MH, and Pb battery types directly

Ion battery

4.3.1.3. Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed
is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the
Telit GL865-QUAD V4 module.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the

GL865-QUAD V4 from power polarity inversion. Otherwise the battery connector
should be done in a way to avoid polarity inversions when connecting the battery.

• The battery must be rated to supply peaks of current up to 2A.

NOTE:

DON'T USE any Ni-Cd, Ni­connected with GL865-QUAD V4. Their use can lead to overvoltage
on the GL865-QUAD V4 and damage it. USE ONLY Li­types.

4.3.2. Thermal Design Guidelines

Worst case as reference values for thermal design of GL865-QUAD V4 are:

• Average current consumption: 500 mA

• Supply voltage: 3.80V

NOTE:

Make PCB design in order to have the best connection of GND pads
to large surfaces.

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4.3.3. Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor
on the output to cut the current peaks on the input to protect the supply from spikes The
placement of this component is crucial for the correct working of the circuitry. A misplaced
component can be useless or can even decrease the power supply performance.

• The Bypass low ESR capacitor must be placed close to the Telit GL865-QUAD V4

power input pads or in the case the power supply is a switching type it can be placed
close to the inductor to cut the ripple provided the PCB trace from the capacitor to
the GL865-QUAD V4 is wide enough to ensure a dropless connection even during
an 2A current peak.

• The protection diode must be placed close to the input connector where the power

source is drained.

• The PCB traces to the GL865-QUAD V4 and the Bypass capacitor must be wide

enough to ensure no significant voltage drops occur. This is for the same reason as
previous point. Try to keep this trace as short as possible.

• To reduce the EMI due to switching, it is important to keep very small the mesh

involved; thus the input capacitor, the output diode (if not embodied in the IC) and
the regulator have to form a very small loop.This is done in order to reduce the
radiated field (noise) at the switching frequency (100-500 kHz usually).

• A dedicated ground for the Switching regulator separated by the common ground

plane is suggested.

• The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped
to any noise sensitive circuitry as the microphone amplifier/buffer or earphone
amplifier.

• The power supply input cables should be kept separate from noise sensitive lines

such as microphone/earphone cables.

• The insertion of EMI filter on VBATT pins is suggested in those designs where

antenna is placed close to battery or supply lines. A ferrite bead like Murata
BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this
purpose.

The below figure shows the recommended circuit:

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RTC

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of
the digital part, allowing having only RTC going on when all the other parts of the device
are off.

To this power output a backup battery can be added in order to increase the RTC
autonomy during power off of the main battery (power supply). NO Devices must be
powered from this pin.

For additional details on the Backup solutions please refer to the related application note
(xL865 RTC Backup Application Note).

VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the
module. The signal is present on pin 51 and it is in common with the PWRMON (module
powered ON indication) function.

This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Item Min Typical Max

Output voltage 2.7V 2.8V 2.9V

Output current - - 10mA

Output bypass capacitor

1uF

(inside the module)

NOTE:

The Output Current MUST never be exceeded; care must be taken
when designing the application section to avoid having an excessive
current consumption.

If the Current is exceeding the limits it could cause a Power Off of the
module.

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tput current is shared with the other GPIOs for a

increases the modem

NOTE:

VAUX max ou
maximum load of 10mA.

WARNING:

The current consumption from VAUX
temperature if the max output current is exceeded.

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5. DIGITAL SECTION

Logic Levels

ABSOLUTE MAXIMUM RATINGS:

Parameter Min Max

Input level on any digital pin (CMOS 2.8)
with respect to ground

OPERATING RANGE - INTERFACE VOLTAGE LEVELS (2.8V CMOS):

Parameter Min Max

Input high level 2.1V 3.1V

Input low level 0V 0.7V

Output high level 2.4V 3.1V

Output low level 0V 0.4V

CURRENT CHARACTERISTICS:

-0.3V +3.1V

Parameter AVG

Output Current 1mA

Input Current 1uA

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“Modem ON Proc”

PWR

supply=ON?

PWRMON=ON

?

Enter AT<CR>

PWRMON=ON

?

Delay = 1 sec

END

AT answer in

1second ?

Auto-Turning ON

To Auto-turn on the GL865-QUAD V4, the power supply must be applied on the power pins
VBATT and VBATT_PA, after 250 m-seconds, the VAUX pin will be at the high logic
level and the module can be consider fully operating.

A flow chart (draft) showing the proper turn on procedure is displayed below:

START

Delay = 1 sec

“Modem ON Proc”

Delay 1s -5s for Low

Voltage Operation

GO TO

“Modem Reset Proc”

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GO TO

“Start AT CMD”

GL865-QUAD V4 Hardware User Guide

or during an

Delay = 300 msec

Enter AT <CR>

AT answer in

1 sec ?

A flow chart (draft) showing the AT commands managing procedure is displayed below:

“Start AT CMD”

START

Disconnect Power Supply

“Start AT CMD”

END

GO TO

“Modem ON Proc.”

NOTE:

In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
GL865-QUAD V4 when the module is powered off
ON/OFF transition.

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GL865-QUAD V4 Hardware User Guide

or during an

Power Off

Turning off of the device can be done with General turn OFF.

General turn OFF – disconnect the power supply from the both power pins VBATT
and VBATT_PA at the same time. In this case all parts of the module are in OFF
condition, any power consumption is present. Before this action, the AT+EPOF command
must be send to the module with a time out up to 10 seconds in order to correctly de-attach
from the network and internal filesystem properly closed.

NOTE:

In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
GL865-QUAD V4 when the module is powered off
ON/OFF transition.

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Reset

RESET* is used to restart the GL865-QUAD V4. Whenever this signal is pulled low, the
GL865-QUAD V4 is reset. When the device is reset it stops any operation. After the release
of the line, the GL865-QUAD V4 is restarted, without doing any detach operation from the
network where it is registered.

To restart the GL865-QUAD V4, the pad RESET* must be tied low for at least 200
milliseconds and then released.

The signal is internally pulled up so the pin can be left floating if not used.

If used, then it must always be connected with an open collector transistor, to permit
to the internal circuitry the power on reset and under voltage lockout functions.

PINS DESCRIPTION

Signal Function I/O PAD

RESET* Restart of the Module I 55

WARNING:

The hardware restart must not be used during normal operation of the
device since it does not detach the device from the network. It shall be
kept as an emergency exit procedure.

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when the module is powered off or during an

A typical circuit is the following:

For example:

Let us assume you need to drive the RESET* pad with a totem pole output of a +3/5 V
microcontroller:

NOTE:

In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
GL865-QUAD V4
ON/OFF transition.

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GL865-QUAD V4 Hardware User Guide

To proper power on again the module please refer to the related

NOTE:

Do not use any pull up resistor on the RESET* line nor any totem pole
digital output. Using pull up resistor may bring to latch up problems on
the GL865-QUAD V4 power regulator and improper functioning of the
module.

paragraph (“Power ON”)

The restart must always be implemented on the boards and should be
used only as an emergency exit procedure.

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Communication ports

5.5.1. Serial Ports

The GL865-QUAD V4 module is provided with by 2 Asynchronous serial ports:

• MODEM SERIAL PORT 1 (Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the
most common are:

• RS232 PC com port

• microcontroller UART @ 2.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART @ 5V or other voltages different from 2.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may
be needed to make the system work. On the GL865-QUAD V4 the ports are CMOS 2.8.

5.5.1.1. Modem serial port 1 (USIF0)

The serial port 1 on the GL865-QUAD V4 is a +2.8V UART with all the 7 RS232 signals. It
differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

The following table is listing the available signals:

RS232

Signal Pad Name Usage

Pin

1 C109/DCD 1

Data Carrier
Detect

2 C104/RXD 10

Transmit line
*see Note

3 C103/TXD 9

Receive line
*see Note

4 C108/DTR 4

Data Terminal
Ready

5 GND

21, 38,

Ground Ground
39, 41,
42, 54

Output from the GL865-QUAD V4
that indicates the carrier presence

Output transmit line of GL865­QUAD V4 UART

Input receive of the
GL865-QUAD V4 UART

Input to the GL865-QUAD V4 that
controls the DTE READY condition

6 C107/DSR 3 Data Set Ready

Output from the GL865-QUAD V4
that indicates the module is ready

7 C106/CTS 6 Clear to Send

Output from the GL865-QUAD V4
that controls the Hardware flow
control

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For a minimum implementation, only the TXD, RXD lines can be

having any HIGH logic level signal applied to the digital pins of the

when the module is powered off or during an

8 C105/RTS 5

Request to

Send

9 C125/RING 2 Ring Indicator

NOTE:

According to V.24, some signal names are referred to the application
side, therefore on the GL865-QUAD V4 side these signal are on the
opposite direction:

TXD on the application side will be connected to the receive line (here
named C103/TXD)

RXD on the application side will be connected to the transmit line (here
named C104/RXD)

connected, the other lines can be left open provided a software flow
control is implemented.

Input to the GL865-QUAD V4 that
controls the Hardware flow control

Output from the GL865-QUAD V4
that indicates the incoming
call condition

In order to avoid a back powering effect it is recommended to avoid

GL865-QUAD V4
ON/OFF transition.

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GL865-QUAD V4 Hardware User Guide

when the module is powered off or during an

5.5.1.2. Modem serial port 2 (USIF1)

The secondary serial port on the GL865-QUAD V4 is a CMOS 2.8V with only the RX and
TX signals.

The signals of the GL865-QUAD V4 serial port are:

PAD Signal I/O Function Type NOTE

53 TX_AUX O

52 RX_AUX I

NOTE:

Serial port 2 is currently used only for debug purposes.

NOTE:

In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
GL865-QUAD V4
ON/OFF transition.

Auxiliary UART
(TX Data to DTE)

Auxiliary UART
(RX Data from DTE)

CMOS 2.8V

CMOS 2.8V

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General purpose I/O

The GL865-QUAD V4 module is provided by a set of Configurable Digital Input / Output
pins (CMOS 2.8V). Input pads can only be read; they report the digital value (high or low)
present on the pad at the read time. Output pads can only be written or queried and set the
value of the pad output.

An alternate function pad is internally controlled by the GL865-QUAD V4 firmware and acts
depending on the function implemented.

The following table shows the available GPIO on the GL865-QUAD V4:

PAD Signal I/O

Drive

Strength

Default

State

48 GPIO_01 I/O 1 mA INPUT

47 GPIO_02 I/O 1 mA INPUT

46 GPIO_03 I/O 1 mA INPUT

45 GPIO_04 I/O 1 mA INPUT

33 GPIO_05 I/O 1 mA INPUT

32 GPIO_06 I/O 1 mA INPUT

31 GPIO_07 I/O 1 mA INPUT

30 GPIO_08 I/O 1 mA INPUT

NOTE

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GL865-QUAD V4 Hardware User Guide

when the module is powered off or during an

5.6.1. Using a GPIO as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device
and report its status, provided this device has interface levels compatible with the 2.8V
CMOS levels of the GPIO.

NOTE:

In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
GL865-QUAD V4
ON/OFF transition.

5.6.2. Using a GPIO as OUTPUT

The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.

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GL865-QUAD V4 Hardware User Guide

External SIM Holder

Please refer to 0 the related User Guide (SIM Holder Design Guides, 80000NT10001a).

ADC Converter

The GL865-QUAD V4 is provided by two AD converter. It is able to read a voltage level in
the range of 0÷2.8 volts applied on the ADC pin input, store and convert it into 10 bit word.

The input lines are named as ADC_IN1 (available on Pad 15) and ADC_IN2 (available on
Pad 16).

The following table is showing the ADC characteristics:

Item Min

Input Voltage range 0 - 2.8 Volt

AD conversion - - 10 bits

5.8.1. Using ADC Converter

The ADC could be controlled using an AT command.

The command is AT#ADC=1,2 to read ADC_IN1 and AT#ADC=2,2 to read ADC_IN2.

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.

Typical

Max Unit

DAC Converter

The GL865-QUAD V4 provides a Digital to Analog Converter. The signal (named
DAC_OUT) is available on pin 17 of the GL865-QUAD V4. The on board DAC is a 10 bit
converter, able to generate an analogue value based on a specific input in the range from
0 up to 1023. However, an external low-pass filter is necessary.

The following table is showing the ADC characteristics:

Item Min Max Unit

Voltage range (filtered) 0 2.8 Volt

Range 0 1023 Steps

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GL865-QUAD V4 Hardware User Guide

The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated
voltage could be calculated with the following formula:

Integrated output voltage = (2 *value) / 1023

DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain
an analog voltage.

5.9.1. Enabling DAC

An AT command is available to use the DAC function.

The command is: AT#DAC= [<enable> [, <value>]]

<value> - scale factor of the integrated output voltage (0..1023 – 10 bit precision)

it must be present if <enable>=1

Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.

NOTE:

The DAC frequency is selected internally. D/A converter must not be
used during POWERSAVING.

5.9.2. LOW Pass filter Example

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Input power

VSWR absolute max

VSWR recommended

6. RF SECTION

Bands Variants

The following table is listing the supported Bands:

Product Supported 2G bands

GL865-QUAD V4 GSM900, GSM850, DCS1800, PCS1900

TX Output power

Product Band Power Class

GL865-QUAD V4

GSM900, GSM850,
DCS1800, PCS1900

Class 4 (2W) @ 850/900
MHz, Class 1 (1W) @
800/1900 MHz

Antenna requirements

The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read
carefully and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit GL865-QUAD V4 device
shall fulfil the following requirements:

Item Value

Frequency range 824-894 MHz GSM850 band

880-960 MHz GSM900 band

1710-1885MHz DCS1800 band

1850-1990MHz PCS1900 band

Gain 2.95dBi @GSM900 and 8.84dBi @DCS1800

Impedance 50 ohm

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2.95dBi @GSM850 and 8.84dBi @PCS1900

> 2W

≤ 10:1 (limit to avoid permanent damage)

≤ 2:1 (limit to fulfill all regulatory requirements)

GL865-QUAD V4 Hardware User Guide

6.3.1. PCB Design guidelines

When using the GL865-QUAD V4, since there's no antenna connector on the module, the
antenna must be connected to the GL865-QUAD V4 antenna pad by means of a
transmission line implemented on the PCB.

This transmission line shall fulfil the following requirements:

Item Value

Characteristic Impedance 50 ohm (+-10%)

Max Attenuation 0,3 dB

Coupling Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be
equipotential to the GL865-QUAD V4 ground pins

The transmission line should be designed according to the following guidelines:

• Make sure that the transmission line’s characteristic impedance is 50ohm ;

• Keep line on the PCB as short as possible, since the antenna line loss shall be less

than about 0,3 dB;

• Line geometry should have uniform characteristics, constant cross section, avoid

meanders and abrupt curves;

• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded

Coplanar Waveguide...) can be used for implementing the printed transmission line
afferent the antenna;

• If a Ground plane is required in line geometry, that plane has to be continuous and

sufficiently extended, so the geometry can be as similar as possible to the related
canonical model;

• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If

possible, use this layer as reference Ground plane for the transmission line;

• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid

having other signal tracks facing directly the antenna line track.

• Avoid crossing any un-shielded transmission line footprint with other signal tracks

on different layers;

• The ground surrounding the antenna line on PCB has to be strictly connected to the

main Ground Plane by means of via holes (once per 2mm at least), placed close to
the ground edges facing line track;

• Place EM noisy devices as far as possible from GL865-QUAD V4 antenna line;

• Keep the antenna line far away from the GL865-QUAD V4 power supply lines;

• If EM noisy devices (such as fast switching ICs, LCD and so on) are present on the

PCB hosting the LE910, take care of the shielding of the antenna line by burying it
in an inner layer of PCB and surround it with Ground planes, or shield it with a metal
frame cover.

• If EM noisy devices are not present around the line, the use of geometries like

Microstrip or Grounded Coplanar Waveguide has to be preferred, since they
typically ensure less attenuation if compared to a Stripline having same length;

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7. MECHANICAL DESIGN

Drawing

NOTE:

Dimensions in mm.

General Tolerance ±0.1, Angular Tolerance ±1°, The tolerance is not
cumulative.

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8. APPLICATION PCB DESIGN

The GL865-QUAD V4 modules have been designed in order to be compliant with a standard
lead-free SMT process.

Footprint

TOP VIEW

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GL865-QUAD V4 Hardware User Guide

In order to easily rework the GL865-QUAD V4 is suggested to consider on the application
a 1.5 mm placement inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.

NOTE:

In the customer application, the region under WIRING INHIBIT (see
figure above) must be clear from signal or ground paths.

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PCB

Copper

SMD

NSMD

(Non Solder Mask Defined)

PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

Solder Mask

(Solder Mask Defined)

PCB pad dimensions

The recommendation for the PCB pads dimensions are 1:1 with module pads.

It is not recommended to place via or micro-via not covered by solder resist in an area of
0,3 mm around the pads unless it carries the same signal of the pad itself

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer Thickness (um) Properties

Electro-less Ni /

3 –7 / 0.03 – 0.15

Immersion Au

The PCB must be able to resist the higher temperatures which are occurring at the lead­free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.

good solder ability protection,
high shear force values

It is not necessary to panel the application’s PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.

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GL865-QUAD V4 Hardware User Guide

Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest
a thickness of stencil foil ≥ 120 µm.

Solder paste

Item Lead Free

Solder Paste Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.

Solder Reflow

Recommended solder reflow profile:

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GL865-QUAD V4 Hardware User Guide

All temperatures refer to topside of the package, measured on the

MODULE WITHSTANDS ONE REFLOW

Profile Feature Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max

Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)

Tsmax to TL

150°C
200°C
60-180 seconds

3°C/second max

– Ramp-up Rate

Time maintained above:
– Temperature (TL)
– Time (tL)

217°C
60-150 seconds

Peak Temperature (Tp) 245 +0/-5°C

Time within 5°C of actual Peak

10-30 seconds

Temperature (tp)

Ramp-down Rate 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

NOTE:

package body surface

WARNING:

THE GL865-QUAD V4
PROCESS ONLY.

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and does not guarantee adequate adherence of the module to the

range. Customer

WARNING:

The above solder reflow profile represents the typical SAC reflow limits

customer application throughout the temperature
must optimize the reflow profile depending on the overall system taking
into account such factors as thermal mass and warpage.

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9. SAFETY RECOMMENDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required.
The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as

hospitals, airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific
environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty
validity. We recommend following the instructions of the hardware user guides for a correct
wiring of the product. The product has to be supplied with a stabilized voltage source and
the wiring has to be conforming to the security and fire prevention regulations. The product
has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM,
checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care
has to be taken to the external components of the module, as well as of any project or
installation issue, because the risk of disturbing the network or external devices or having
impact on the security. Should there be any doubt, please refer to the technical
documentation and the regulations in force. Every module has to be equipped with a proper
antenna with specific characteristics. The antenna has

to be installed with care in order to avoid any interference with other electronic devices and
has to guarantee a minimum distance from the body (20 cm). In case of this requirement
cannot be satisfied, the system integrator has to assess the final product against the SAR
regulation.

The European Community provides some Directives for the electronic equipment
introduced on the market. All the relevant information’s are available on the European
Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available, while
the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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LTE

Long Term Evolution
RF

Radio Frequency
EMC

Electromagnetic Compatibility
FDD

Frequency Division Duplexing
EM

Electromagnetic
EMI

Electromagnetic Interference
PCB

Printed Circuit Board
USB

Universal Serial Bus
HS

High Speed
DTE

Data Terminal Equipment
UMTS

Universal Mobile Telecommunication System
WCDMA

Wideband Code Division Multiple Access
HSDPA

High Speed Downlink Packet Access
HSUPA

High Speed Uplink Packet Access
UART

Universal Asynchronous Receiver Transmitter
HSIC

High Speed Inter Chip
SIM

Subscriber Identification Module
SPI

Serial Peripheral Interface
ADC

Analog – Digital Converter
DAC

Digital – Analog Converter
I/O

Input Output

10. ACRONYMS

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GPIO

General Purpose Input Output
CMOS

Complementary Metal – Oxide Semiconductor
MOSI

Master Output – Slave Input
MISO

Master Input – Slave Output
CLK

Clock
MRDY

Master Ready
SRDY

Slave Ready
CS

Chip Select
RTC

Real Time Clock
ESR

Equivalent Series Resistance
VSWR

Voltage Standing Wave Radio
VNA

Vector Network Analyzer
PSM

Power Saving Mode according to 3GPP Rel.12
NAS

Non-Access Stratum

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Review of par 4.3.3

Updated Chapter 4.2 Power Consumption

11. DOCUMENT HISTORY

Revision Date Changes

0 2018-03-07 First issue

1 2018-06-28

2 2018-10-25

3 2019-04-05

4 2020-09-17

5 2020-09-23

Adding ADC_IN1 and DAC support

Review of chapter 2

Adding Power Consumption figures

Updating Antenna gain requirements

Warning note added to par 8.6

Updated Chapter 2.GENERAL PRODUCT
DESCRIPTION

Updated audio interface

Updated Chapter 5.3 Power Off

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[0

Mod. 08

1.2017]

05 2017-01 Rev.6