Application Note：
Assembly And Maintenance
Manual for Telink BLE 1x1
Test System 2.1
AN-16052600-E3
Ver 1.2.0
2016/9/26
TELINK SEMICONDUCTOR
Brief：
This document is the assembly and maintenance guide
for Telink BLE 1x1 Test System 2.1.
Telink for customer
Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
Telink for customer
Published by
Telink Semiconductor
Bldg 3, 1500 Zuchongzhi Rd,
Zhangjiang Hi-Tech Park, Shanghai, China
© Telink Semiconductor
All Right Reserved
Legal Disclaimer
Telink Semiconductor reserves the right to make changes without further notice to
any products herein to improve reliability, function or design. Telink Semiconductor
disclaims any and all liability for any errors, inaccuracies or incompleteness contained
herein or in any other disclosure relating to any product.
Telink Semiconductor does not assume any liability arising out of the application or
use of any product or circuit described herein; neither does it convey any license
under its patent rights, nor the rights of others
The products shown herein are not designed for use in medical, life-saving, or
life-sustaining applications. Customers using or selling Telink Semiconductor products
not expressly indicated for use in such applications do so entirely at their own risk
and agree to fully indemnify Telink Semiconductor for any damages arising or
resulting from such use or sale.
Information:
For further information on the technology, product and business term, please
contact Telink Semiconductor Company (www.telink-semi.com).
For sales or technical support, please send email to the address of:
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AN-16052600-E3 1 Ver 1.2.0
Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
Version
Major Changes
Date
Author
1.0.0
Initial release
2016/5
H.Z.F., L.X., Cynthia
1.1.0
Updated buzzer related contents,
including: buzzer module photo,
cable connection between buzzer
and EVK daughter board, cable
connection chart, test system photo,
Amic test item, buzzer spec in
hardware list, and dimension chart
of buzzer board.
2016/8
T.J.B., Cynthia
1.2.0
Updated the “spec” column in
hardware list.
2016/9
H.Z.F., Cynthia
Telink for customer
Revision History
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Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
Telink for customer
Table of contents
1 Overall Architecture Of 1x1 Test System 2.1 .......................................................... 5
2 Hardware Platform Building ................................................................................... 7
2.1 Check External Antenna ................................................................................... 7
2.2 Cable connection ............................................................................................. 8
2.2.1 Connection points on EVK daughter board .............................................. 8
2.2.2 Cable connection between EVK daughter board and PCB antenna ......... 9
2.2.3 Cable connection between EVK daughter board and buzzer ................... 9
2.2.4 Cable connection between EVK daughter board and Mechanical
structure ................................................................................................................. 9
2.2.5 Cable connection between EVK daughter board and DUT ..................... 10
2.2.6 Other cable connection .......................................................................... 11
3 Firmware Burning For EVK Daughter Board ......................................................... 12
3.1 Folder structure for Test Bench Firmware ..................................................... 12
3.2 Firmware burning for EVK daughter board ................................................... 15
4 Observe Test Result Via PC Software EvkMonitor ............................................... 18
5 Update PCBA (DUT) Firmware .............................................................................. 21
Appendix 1 Test Item List On PC Software “EvkMonitor” ...................................... 23
Appendix 2：Hardware List ......................................................................................... 26
Appendix 3：Dimension chart of EVK daughter board and buzzer board .................. 27
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Table of figures
Figure 1 EVK daughter board ............................................................................... 5
Figure 2 PCB antenna board and RF cable .......................................................... 5
Figure 3 Buzzer module ....................................................................................... 6
Figure 4 System connection chart ....................................................................... 6
Figure 5 Telink PCB antenna board ...................................................................... 7
Figure 6 Telink PCB antenna dimensions ............................................................. 7
Figure 7 Connection points on EVK daughter board ........................................... 8
Figure 8 Cable connection chart ........................................................................ 10
Figure 9 BLE 1x1 Test System 2.1 ....................................................................... 11
Figure 10 Connection chart between EVK daughter board and PC .................... 15
Figure 11 Firmware burning interface 1 for EVK daughter board ....................... 16
Figure 12 Firmware burning interface 2 for EVK daughter board ....................... 16
Figure 13 EvkMonitor tool interface ................................................................... 18
Figure 14 Dimension chart of EVK daughter board ............................................. 27
Figure 15 Dimension chart of buzzer board ........................................................ 28
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Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
1 Overall Architecture Of 1x1 Test System 2.1
Telink BLE 1x1 Test System 2.1 consists of test bench and mechanical structure.
The test bench includes hardware platform and firmware folder, and it’s provided by
Telink; while customer needs to make the mechanical structure suitable for DUT
(Device Under Test), and connect cables according to the guide in this document.
A set of 1x1 Test Bench mainly contains the following hardware resources.
1) An EVK daughter board provided by Telink. The EVK board should be burned with
the EVK firmware for test bench.
Figure 1 EVK daughter board
3) A buzzer module (Dimension: 50.2x16mm): The buzzer is connected to
corresponding GPIO and 3V3DUT of the EVK daughter board via Dupont cables.
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Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
EVK
DUT
GPIO
SWire
Power
Display
LED1
LED2
LED3
LED4
BUTTON
PCB
Antenna
ANT
Digital
buzzer
GPIO
Power
PC
USB
The buzzer module is used for Amic test, and it should be placed as close to Amic
as possible.
Note: Do not contact buzzer board with Amic directly, and there should be no
obstacle between them.
Figure 3 Buzzer module
4) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK
daughter board (refer to Section 3), and user can also observe test result via the
EvkMonitor (refer to Section 4).
Figure below shows the system connection chart.
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Figure 4 System connection chart
Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
RF
LED4 RED
LED1 Green
LED3 White
LED2 Yellow
Button
GND
3V3DUT
SWM
PIN45
PIN48
GND
GND
2.2 Cable connection
2.2.1 Connection points on EVK daughter board
Figure 7 marks connection points on EVK daughter board to be connected with
DUT, PCB antenna and mechanical structure in any application.
Figure 7 Connection points on EVK daughter board
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Connection points on EVK
daughter board
Connection points on buzzer board
PIN48
VCC
3V3DUT
3V3B
GND
GND
Connection points on EVK
daughter board
Connection points on Mechanical structure
LED1 Green
Green LED+
LED2 Yellow
Yellow LED+
LED3 White
White LED+
LED4 RED
Red LED+
Button
Button+
GND
Green LED-, Yellow LED-, White LED-, Red LED-, Button-
2.2.2 Cable connection between EVK daughter board and PCB antenna
The connection point “RF” on EVK daughter board should be connected with
PCB antenna board via an RF cable.
2.2.3 Cable connection between EVK daughter board and buzzer
Table 1 shows the connection correspondence between EVK daughter board
and buzzer board.
Table 1 Cable connection between EVK and buzzer
2.2.4 Cable connection between EVK daughter board and Mechanical structure
Table 2 shows the connection correspondence between EVK daughter board
and Mechanical structure.
Table 2 Cable connection between EVK and Mechanical structure
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Connection points on EVK daughter board
Connection points on DUT
3V3DUT
BAT+
GND
BAT-
SWM
SWS (DUT)
2.2.5 Cable connection between EVK daughter board and DUT
Table 3 shows the connection correspondence between EVK daughter board
and DUT.
Table 3 Cable connection between EVK and DUT
If the DUT is a remote control board, it’s also needed to connect wakeup pin of
the DUT with PIN45 of the EVK board.
Buzzer
3V3B
VCC
GND
EVK
PIN48
GND
Figure 8 Cable connection chart
GND
Mechanical Structure
Button
+ -
Yellow LED
+ -
Red LED
+ -
Green LED
+ -
White LED
+ -
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1 2 3
4
3 Firmware Burning For EVK Daughter Board
3.1 Folder structure for Test Bench Firmware
Telink test bench firmware folder is generally named as “BLE_System_V3.0_xxx”.
The structure of the “BLE_System_V3.0_xxx” folder is shown as below:
“DB”: This folder contains db files.
“Sch”: This folder contains schematics, cable connection illustration, and etc.
The structure of the “Script” folder is shown as below:
1) platform: This folder contains project files.
E.g.
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Double click “tlsr8266f512et32_1x1Jig_2in1” to open the following interface.
test.tls: Jig test script to determine PCBA test items.
product.ini: EVK product information to determine PCBA RF test frequency point
and ID.
boot.bin: Image file to download into PCBA finally.
2) uart: Double click “uart.bat” to open uart window and display real-time log for
the convenience of test status check. Only one uart window is allowed at the
same time.
3) conti_test_uart.bat: Double click the file, a uart window will pop up; data won’t
be available on the window, but only saved in “log.txt” under this directory for
convenience of analysis.
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4) Monitor: This folder contains the “EvkMonitor” tool on PC side.
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Connect EVK with PC via USB cable
EVK
3.2 Firmware burning for EVK daughter board
EVK daughter board should be burned with firmware before it’s ready for use.
First connect the EVK daughter board with PC via an USB cable, as shown in
Figure 10.
Figure 10 Connection chart between EVK daughter board and PC
Then double click the “EvkMonitor.exe” under the
“BLE_System_V3.0_xxx\Script\Monitor” folder.
Click “download” under the menu “Evk” to open the burning interface.
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test.tls
product.ini
Figure 11 Firmware burning interface 1 for EVK daughter board
First click the “Select Project Folder” button and select the target project folder
(i.e. the project under “platform”) in the pop-out window. The selected project path
will be available in the box next to the “Select Project Folder” button; test script and
product configuration information files will be available in the “test.tls” and
“product.ini” editing window, respectively.
Figure 12 Firmware burning interface 2 for EVK daughter board
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During first time of firmware burning, it’s needed to configure product
information (product.ini) for the EVK daughter board. Tick the “USB Id” box and set
“Evk number” as “0” (always).
Then click the “Download” button to start burning. The log window keeps
scrolling until it’s as shown in the figure below.
Now the EVK daughter board is already burned with evk_testbench.bin, test.tls,
product.ini, id and other bin files in the folder.
After power cycle, the EVK daughter board is ready for use.
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1
2
3 4 5
7 8 6
4 Observe Test Result Via PC Software EvkMonitor
Double click the “Monitor” folder under “BLE_System_V3.0_xxx\Script”.
Double click the “EvkMonitor.exe” to open the software interface. If a prompt
information of “NO usb device” pops up as shown below, it indicates communication
problem such as USB cable connection with the EVK and PC; though software
interface still pops up, user must check and make sure the connection is OK, then
restart the software.
After the software is started properly, the interface is shown as below:
Figure 13 EvkMonitor tool interface
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Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1
show log: Tick the “show log” box (as shown in mark 1 of Figure 13) to enable
the “log window” to display dynamic information.
log window: As shown in mark 2 of Figure 13, it’s the area to display dynamic
information.
Stop: As shown in mark 3 of Figure 13, the software is in the state of stop by
default.
File: Click “open” under the “File” menu (as shown in mark 4 of Figure 13), a
window to set the storage path for database files will pop up.
Select the storage path as needed, input file name and then click the “Open”
button. Test result will be automatically stored under the directory by the
software.
Note：Only storage path and file name in English are allowed, otherwise it will
invalidate the database creation.
start: Click the “start” icon (as shown in mark 5 of Figure 13), the software enters
the state waiting for receiving the test result.
Run: Click the “Run” icon (as shown in mark 6 of Figure 13) to start testing.
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status: As shown in mark 7 of Figure 13, it serves to display running state of the
EVK.
The figure above indicates the state of “Ongoing”.
The figure above indicates the state of “Success”.
The figure above indicates the state of “Failure”.
For convenience of subsequent maintenance, it’s highly recommended to mark
the error items and classify them.
data: As shown in mark 8 of Figure 13, it serves to display test result.
Please refer to Appendix 1 Test Item List On PC Software “EvkMonitor” for
details about test items and corresponding maintenance suggestions.
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5 Update PCBA (DUT) Firmware
Connect the EVK daughter board with PC via an USB cable.
Double click the “EvkMonitor.exe” under the folder
“BLE_System_V3.0_20160316\Script\Monitor”.
Click “download” under the menu “Evk” to open the burning interface.
To update firmware only, it’s not needed to modify test.tls and product.ini for
the EVK daughter board.
1. Tick the box in front of “Burning file”. Then click the “Burning file” button and
select the target bin file (no limitation to the file name) in the pop-out window.
The path of the selected bin file will be available in the box behind the “Burning
file” button. The MD5 code calculated by the bin file will be available in the box
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next to the “MD5”.
2. Click the “Download” button. The target bin file automatically replaces the
previous boot.bin under the project directory, and it will be burned into the EVK
daughter board.
After firmware is burned, user can check if the firmware is successfully updated
in the EVK daughter board by clicking the “Check boot.bin” button. The result will be
available in the log window and the box next to the “Check boot.bin” button.
Firmware update success
Firmware update failure
After the firmware is successfully updated, power cycle the EVK daughter board,
then it’s ready for use.
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Index
Name
Description
Parameter
Maintenance
Suggestion
0
CurProtection
current protection:
test DUT current
current value
Maybe soldering
problem.
Re-solder IC.
1
GpioShort
test if there is any GPIO pins
short wired
show the two pins if
there is a short;
if not, its value will
be 0
2
TpHigh
TP high/ low frequency test:
Carry out Tx modulation
calibration to ensure RF Tx
quality
cap value
RF related.
Test again; if
failed, temporarily
mark it as rejected
product, and wait
for subsequent
analysis.
3
TpLow
cap value
4
TxHiCnt
tx high frequency counting
value/power/frequency
offset/current test:
EVK receives packets
transmitted by DUT at high
frequency point, and thus to
test DUT Tx performance at
high frequency point.
Test parameters are DUT Tx
packet number, DUT Tx power,
DUT Tx frequency offset and
DUT Tx current, successively.
cnt num
5
TxHiPower
rf energy
6
TxHiFreoffset
frequency offset
7
TxHiCurrent
current value
8
TxLoCnt
tx low frequency counting
value/power/frequency
offset/current test:
EVK receives packets
transmitted by DUT at low
frequency point, and thus to
test DUT Tx performance at
low frequency point.
Test parameters are DUT Tx
packet number, DUT Tx power,
DUT Tx frequency offset and
DUT Tx current, successively.
cnt num
9
TxLoPower
rf energy
10
TxLoFreoffset
frequency offset
11
TxLoCurrent
current value
Appendix 1 Test Item List On PC Software “EvkMonitor”
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Index
Name
Description
Parameter
Maintenance
Suggestion
12
RxLoCnt
rx low frequency counting
value/power/current test:
DUT receives packets
transmitted by EVK at low
frequency point, and thus to
test DUT Rx performance at
low frequency point.
Test parameters are EVK Tx
packet number, EVK Tx power
and EVK Tx current,
successively.
cnt num
RF related.
Test again; if
failed, temporarily
mark it as rejected
product, and wait
for subsequent
analysis.
13
RxLoPower
rf energy
14
RxLoCurrent
current value
15
RxHiCnt
rx high frequency counting
value/power/current test:
DUT receives packets
transmitted by EVK at high
frequency point, and thus to
test DUT Rx performance at
high frequency point.
Test parameters are EVK Tx
packet number, EVK Tx power
and EVK Tx current,
successively.
cnt num
16
RxHiPower
rf energy
17
RxHiCurrent
current value
18
CancleFlashProtection
cancel flash protection:
Cancel DUT flash write
protection for following flash
erase and test.
0, always
Flash related.
Maybe soldering
problem, re-solder
pins related to
Flash.
19
FlashZero
set flash as 0/ 0xff:
Write DUT flash with all “0” or
all “1” to test flash write
operation.
size
20
FlashErase
size
21
DsSlpCur
deep sleep current/wakeup,
suspend current/wakeup test:
Make DUT enter low-power
mode (deep sleep/suspend)
and then wake it up via EVK,
thus to test current in deep
sleep mode, wakeup function
from deep sleep mode, current
in suspend mode and wakeup
function from suspend mode.
current value
Maybe bad
contact with
thimble. Check if
there’s enough
solder paste for
the test points of
thimble and PCBA.
22
DsSlpWkp
reg value
23
SuspendCur
current value
24
SuspendWkp
reg value
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Index
Name
Description
Parameter
Maintenance
Suggestion
25
IRCur
IR current test:
Make DUT enter IR state via
EVK and test the current at IR
state.
current value
IR current
problem. Check IR
circuit.
26
Amic
Amic test:
3V3DUT of EVK supplies power
for buzzer, while PIN48 outputs
high level to make buzzer
board generate square wave
signal which drives buzzer to
beep. Test DUT register value
at this state.
register value
Detect Amic circuit
27
FlashWrite
write flash:
write bin file into DUT flash
If err, err address;
if ok it’s 0
Flash related.
Maybe soldering
problem, re-solder
pins related to
Flash.
28
WriteID
write id(part of ieee id):
write ID information into DUT
flash
id
IEEE address to
verify Jig status.
Index 27 is fixed
value;
Index 28 is
dynamically
increasing value
29
WriteBytes
write bytes (part of ieee id):
write specific information into
DUT flash
id
30
FlashProtect
protect flash:
carry out write protect
operation for DUT flash
1, always
Flash related.
Maybe soldering
problem, re-solder
pins related to
Flash.
31
FlashWriteLarger
write flash:
check DUT flash content to
ensure correct burning
operation
If err, err address;
if ok it’s 0
32
Load
load status:
test connection between EVK
and DUT
No para
Contact problem.
Check contact
between thimble
and PCBA.
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Type
Number
Spec
BLE EVK daughter board
1
C1T42A20_V3.3
Buzzer board
1
C1T64A3_V2.0
Long RF cable
1
SMA-MMCX dual-shielded cable -30cm
Dupont cable
Several
Mini USB cable
1
USB2.0/28AWG/30cm,
30V/80℃/A3-B
Appendix 2：Hardware List
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Appendix 3：Dimension chart of EVK daughter board and buzzer board
Figure 14 Dimension chart of EVK daughter board
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Figure 15 Dimension chart of buzzer board
FCC COMPLIANCE STATEMENT:
This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
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