Telemark 880 User Manual

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Telemark

Model 880

Thin Film

Deposition Controller

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START

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MANUAL

CONTROL

MANUAL

ZERO

MODEL 880

DEPOSITION CONTROLLER

STATUS

Users Manual

June 7 2003,

518-030 Preliminary

Model 880 DEPOSITION CONTROLLER

TFC-2002 JM

USERS MANUAL 518-030

Rev <preliminary> June 7, 2003

.current:

Telemark Model 880 Deposition Controller

RATE-A/SEC POWER-% THICKNESS-KA

MANUAL

MANUAL ZERO

CONTROL

I/O 4 1/O 3 I/O 2 I/O 1

INPUTS / OUTPUTS

SENSORS

7 5 3 1

8 6 4 2

7 5 3 1 8 6 4 2

SOURCE

RS232

MEM

COMM OPTION

MODEL 880

DEPOSITION CONTROLLER

FUSE: 2 x 2.00 AMP

QUICK-ACTING (F) 250v

90-264 vac, 50-60 Hz, 230VA MAX

WARNING

The power cord protective

grounding conductor must be connected to ground. No user serviceable parts inside. Refer servicing to qualified personnel.

STOP

START

.overview w/ generalizations only

intro to user interface, overview from general to specific = overview w/ generalizations and intro to specifics as generalizations are developed.

Telemark reserves the right to change any information contained in this manual without notice

AMPHENOL

is a registered trademark of Tyco/Amp, Inc.

AMP ConFlat

Is a registered trademark of IBM Corporation

IBM Microsoft Microdot SWAGELOK Windows

is a registered trademark of Allied Corporation

is a registered trademark of Varian Associates, Inc.

is a registered trademark of Microsoft Corporation

is a registered trademark of Microdot Inc.

is a trademark owned by Crawford Fitting Company

is a registered trademark of Microsoft Corporation

STATUS

SECTION 0.XX

e page 1 of 275 ^

Model 880 DEPOSITION CONTROLLER

Warranty

The model 880 Deposition Controller is guaranteed against faulty materials, function, and workmanship for a period of 12 months after delivery from Telemark. Components which are purchased by Telemark from other manufactures will be guaranteed for any lesser time that such manufacturer warrants its product to Telemark. This warranty is valid only for normal use where regular maintenance is performed as instructed. This warranty shall not apply if repair has been performed or an alteration made by anyone other than an authorized Telemark representative or if a malfunction occurs through abuse, misuse, negligence, or accident. No charge will be made for repairs made under warranty at Telemark's facilities. Freight costs both ways will be at customer's expense. Telemark reserves the right for final warranty adjustment.

User Responsibility

The user is responsible for proper operation an ordinary maintenance of the equipment, following procedures described in this manual, including reference documents. Proper operation includes timely replacement of parts that are missing, broken, or plainly worn. If the user has a reasonable doubt about understanding the use or installation of a component, Telemark Technical Service should be called.

It is vitally important that the user properly install the equipment as described in the Installation sections of this manual. The warranty will be void if the equipment is improperly installed.

Alteration of the design or any function of the equipment voids the warranty and is entirely the responsibility of the user.

Safety Warning

General Precautions: Human contact with the voltages present within and around a vacuum system can be fatal. Make sure that the input power is turned off before opening the doors or removing panels. Short all HV feedthrough connections with a grounding hook before accessing the controller main body.

Disclosure

The disclosure of this information is to assist owners of Telemark equipment to properly operate and maintain their equipment, and does not constitute the release of rights hereof. Reproduction of this information and equipment described herein is prohibited without prior written consent from Telemark.

SECTION 0.XX

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Model 880 DEPOSITION CONTROLLER

SECTION 1.0

.specifications/included materials

(no intro here) unpacking.

Introduction

Unpacking

The Model 880 interfaces and analog outputs (see the following spare parts included list). If the essential OSC-100A oscillator or crystals were ordered at the same time, they will also be included. The unit operates from 90 to 264 VAC with no adjustments required. If it is ever necessary to return the unit to Telemark, for any reason, call and obtain a Return Material Authorization number (RMA#).

comes with a power cord and connectors for the RS-232 interface, the I/O

Description

The Model 880 provides both automatic control of single or multi-layer film deposition in either a production or development environment and improved predictability and repeatability of deposited film characteristics through dependable digital control of the deposition process. It runs unattended in the fully automatic mode and provides a wide number of benefits including performance limit access and setting by the end user.

SECTION 1.1

.[please read and understand this manual before proceeding w/ equipment useage].

Please read and understand the contents of this manual before proceeding with equipment useage in a working system. This manual will take the reader through the appropriate setup and example steps, providing along the way, an understanding of how the Model 880 instrument is used. A test mode is available from the SERVICE menu for simulated out of system experiments. Crystal sensor head information is simulated (actually rate info is simulated for the film) allowing setup of various parameters/programming elements without crystal failure halting the simulated process. The power supply control voltage output is, however, active while in the test mode. All these terms will be described shortly. This manual is organized into a number of main sections: specifications, generalized overview, menu programming specifics and setup, hardware setup, detailed host communications, microbalance theory and maintenance. If any further assistance is needed, please contact Telemark (see section 1.6).

The specifications section describes Model 880 product specifics, both hardware and software, along with related necessary and optional product specifics. The software specifics include programmable parameter lists. The generalized overview section answers the what, the how is it used and the how does it work questions about the Model 880, that is, the solutions this product can provide. This section is intended to discuss the concepts of main functions and elements with only enough detail to make the conceptualization clear. In addition, rudimentary specifics are given in a number of other areas as an introduction or a primer for the next section. This is information you typically only need to look at once. Experienced users (those familiar with deposition controllers) should at least thumb through this section to take an inventory of what is available. The menu programming specifics and operational details section provides detailed information about product programming. Experienced users (those familiar with deposition controllers) may decide to start here. If some elements are unclear, check back to the previous section. The table of contents and index are helpful in this pursuit. This section provides descriptions for the programming of film parameters and process steps, descriptions of menu navigation, descriptions of screens, descriptions of fixed front panel keys, descriptions of run modes, parameter details, memory defaults, programming summaries, etc. The hardware setup section describes and illustrates connectors, interconnections, peripherals, mechanical connections, and the Model 880 as a component in a larger system. Detailed host communications are found in the following section x6. See section x7 for

MANUAL DESCRIPTION

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Microbalance theory and thickness reading calibration with its attendant density, z factor (a material reference table of elements is included) and tooling determination. Each section builds on the previous sections such that no new elements are used that haven't been defined.

.Some sage advice that is

seldom heeded.

If all else fails read the manual.

You can lead a customer to water

ut you can't make them read the

manual.

SECTION 1.2 DESCRIPTION OF SYMBOLS

Please familiarize yourself with the following warning/safety/caution symbols found within this manual and their general meaning:

Note

Caution

Static Sensitive

.note the following warning/safety/caution symbols [desc. of each].

Note: Highlights an important fact or condition.

Caution: Warns of a condition that could cause damage to deposition controller, connected or

associated equipment. Also warns if some action taken could result with an undesireable and/or unexpected outcome.

: Warns of a condition that will likely cause damage to the deposition controller, connected or

associated equipment. Also warns of a possible unsafe situation for the user. Examples are static sensitivities, maximum component ratings, broken fuses, etc.

Hazardous Voltages Present

SECTION 1.XX



: Warns of a condition that is hazardous to user, deposition controller, connected or associated

equipment.

e page 4 of 275 ^

Model 880 DEPOSITION CONTROLLER

SECTION 1.3

TABLE OF CONTENTS

TITLE PAGE................................................................................................................................................ 1

WARRANTY................................................................................................................................................ 2

INTRODUCTION [1.XX] ............................................................................................................................ 3

ECTION

1.0 ................................................................................................................................................ 3

Unpacking Instructions........................................................................................................................... 3

ECTION

1.1 ................................................................................................................................................ 3

Manual Description: Usage, Organization, Section Contents Summary ............................................... 3

ECTION

1.2 ................................................................................................................................................ 4

Description of Symbols Found in Manual .............................................................................................. 4

ECTION

1.3

 TABLE OF CONTENTS

...................................................................................................... 5

1.4 .............................................................................................................................................. 11

STC-Spare Parts (included w/ Model 880)........................................................................................... 11

STC-Optional Parts .............................................................................................................................. 11

ECTION

1.5 .............................................................................................................................................. 11

STC-Optional Crystal Sensor Parts...................................................................................................... 11

ECTION

1.6 .............................................................................................................................................. 12

Contact Information ............................................................................................................................. 12

ECTION

1.7 .............................................................................................................................................. 13

Product Specifications.......................................................................................................................... 13

ECTION

1.8 ............................................................................................................................................. 14

Programmable Parameter Lists........................................................................................................... 14

Programmable Parameter Dependency Lists ..................................................................................... 17

ECTION

1.9 .............................................................................................................................................. 19

Sensor Specifications............................................................................................................................ 19

SIMPLE QUICK GENERALIZED OVERVIEW [2.XX]..................................................................... 21

ECTION

2.0 .............................................................................................................................................. 21

For What Is The Model 880 Used? [The Problem, The Solution]........................................................ 21

ECTION

2.1 .............................................................................................................................................. 22

How Is It Used?.................................................................................................................................... 22

ECTION

2.2 .............................................................................................................................................. 26

How Does It Work? .............................................................................................................................. 26

Hardware Setup Discussion ................................................................................................................. 29

Sensor Head: Hardware Generalizations............................................................................................. 30

Power Supply Connection .................................................................................................................... 32

Strip Chart Recorder Connection......................................................................................................... 32

RS-232 Communications Connection................................................................................................... 32

Grounding Stud .................................................................................................................................... 33

Input Card Options............................................................................................................................... 33

Installation/Removal Of Sensor Cards, Input Cards, Output Cards .................................................... 34

Pendant (hand controller) .................................................................................................................... 35

LCD Contrast/Bias ............................................................................................................................... 35

Graphical Display ................................................................................................................................ 35

Mounting .............................................................................................................................................. 35

System Hardware Connections............................................................................................................. 35

Programmable Hardware Setup Discussion ........................................................................................ 36

Select RunTime Mode: Sequencing/Non-Sequencing, Manual Mode, Test Mode............................................ 36

Memory Storage of Menu Parameters ............................................................................................................... 36

Films & Processes / Active, Non-Active ........................................................................................................... 36

Menu Parameter Dependencies.......................................................................................................................... 36

Tooling: Material Density & Z-Factor............................................................................................................... 37

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Power Related Menu Parameters....................................................................................................................... 37

Power Related Menu Parameter Dependencies ................................................................................................. 38

Initial Programming Setups (menu parameters) .................................................................................. 40

Menu Parameter Values & Programming After Memory Purge........................................................................ 40

Menu Parameter Values & Programming After Factory Restored Memory ...................................................... 41

I/O Programming Introduction ............................................................................................................ 42

Boolean Logic Discussion ................................................................................................................................. 43

Simple I/O Program Examples .......................................................................................................................... 44

How To Develop I/O Programs............................................................................................................ 48

MENU PROGRAMMING AND OPERATION DETAILS [3.XX] ...................................................... 49

ECTION

3.0 .............................................................................................................................................. 49

LCD Touch Panel Overlay ................................................................................................................... 49

Front Panel Definitions ........................................................................................................................ 50

ECTION

3.1 .............................................................................................................................................. 56

Navigating Through Model 880 Menus................................................................................................ 56

Menu Tree............................................................................................................................................. 57

ECTION

3.2 .............................................................................................................................................. 58

RunTime Screen Description................................................................................................................ 58

ECTION

3.3 .............................................................................................................................................. 60

Main Menu Description........................................................................................................................ 60

ECTION

3.4 .............................................................................................................................................. 63

Films And Processes............................................................................................................................. 63

ECTION

3.5 .............................................................................................................................................. 63

Film Edit/Review Mode ........................................................................................................................ 63

Film Parameter Checksum................................................................................................................................. 67

Film Parameter Lock Code................................................................................................................................ 67

Film Parameter: Source Sensor Map Select....................................................................................................... 68

Review SS MAP................................................................................................................................................ 68

Selecting the Active Film in Non-Sequencing Mode......................................................................................... 69

Detailed Film Parameter Descriptions ................................................................................................ 71

Detailed Map Parameter Descriptions................................................................................................. 79

ECTION

3.6 ............................................................................................................................................. 83

Editing Processes................................................................................................................................. 83

Process Lock Code ............................................................................................................................................ 93

Factory Restoration vs. Purged Settings ............................................................................................................ 93

Changing Memory Settings ............................................................................................................................... 93

ECTION

3.7 .............................................................................................................................................. 93

Set Active Process................................................................................................................................. 93

ECTION

3.8 .............................................................................................................................................. 94

Non-Sequencing Differences ................................................................................................................ 94

ECTION

3.9 .............................................................................................................................................. 96

Software Controlled RunTime Screen Keys.......................................................................................... 96

L/Q key (Crystal Quality).................................................................................................................................. 96

SMPL key (Sample and Hold)........................................................................................................................... 96

ECTION

3.10 ............................................................................................................................................ 97

Manual Power Control......................................................................................................................... 97

Using Pendent.................................................................................................................................................... 97

Using LCD keys ................................................................................................................................................ 98

ECTION

3.11 ............................................................................................................................................ 99

Model 880 Shutter Delay...................................................................................................................... 99

ECTION

3.12 ............................................................................................................................................ 99

Deposition Source Control Loop Description ...................................................................................... 99

ECTION

3.13 .......................................................................................................................................... 101

Film Phases And Parameter Groups.................................................................................................. 101

ECTION

3.14 .......................................................................................................................................... 102

System Configuration ......................................................................................................................... 102

ECTION

3.15 .......................................................................................................................................... 103

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Detailed System Configuration Related Parameters.......................................................................... 103

ECTION

3.16 .......................................................................................................................................... 105

Communications Configuration Related Parameters......................................................................... 105

Detailed Communications Configuration Related Parameters......................................................................... 106

ECTION

3.17 .......................................................................................................................................... 108

Model 880 Crystal Failure Processing............................................................................................... 108

ECTION

3.18 .......................................................................................................................................... 112

Process Accounting ............................................................................................................................ 112

ECTION

3.19 .......................................................................................................................................... 114

OPTions/INFo .................................................................................................................................... 114

Checksum Validation ........................................................................................................................ 115

Checksums And Parameters After Purge............................................................................................116

ECTION

3.20 .......................................................................................................................................... 118

Memory Module Programming & Usage........................................................................................... 118

Memory Module Data Transfer ....................................................................................................................... 120

Memory Module Placement............................................................................................................................. 121

ECTION

3.21 .......................................................................................................................................... 122

Programming Example....................................................................................................................... 122

Entering The TEST Mode................................................................................................................................ 122

ECTION

3.22 .......................................................................................................................................... 130

Product Programming Summary........................................................................................................ 130

ELECTRICAL CONNECTIONS AND DESCRIPTIONS [4.XX] ..................................................... 135

ECTION

4.0 ............................................................................................................................................ 135

Sensor Head Installation .................................................................................................................... 135

ECTION

4.1 ............................................................................................................................................ 138

Electrical Connections And Descriptions........................................................................................... 138

ECTION

4.2 ............................................................................................................................................ 138

Line Power ......................................................................................................................................... 138

ECTION

4.3 ............................................................................................................................................ 138

Rack Mounting.................................................................................................................................... 138

ECTION

4.4 ............................................................................................................................................ 138

Vacuum System Grounding ................................................................................................................ 138

ECTION

4.5 ............................................................................................................................................ 140

Sensor Connections ............................................................................................................................ 140

ECTION

4.6 ............................................................................................................................................ 140

Analog Control Voltage Connections................................................................................................. 140

Control Voltage Output Connection................................................................................................... 140

ECTION

4.7 ............................................................................................................................................ 141

Analog Recorder Output Connection ................................................................................................. 141

Analog Recorder Output Specifications ............................................................................................. 141

ECTION

4.8 ............................................................................................................................................ 143

I/O Interface ....................................................................................................................................... 143

ECTION

4.9 ............................................................................................................................................ 146

Relay Outputs (Factory I/O Program) ............................................................................................... 146

ECTION

4.10 .......................................................................................................................................... 147

Remote Inputs (Factory I/O Program) ............................................................................................... 147

ECTION

4.11 .......................................................................................................................................... 147

RS-232 Serial Communications Interface........................................................................................... 147

ECTION

4.12 .......................................................................................................................................... 148

Communications Options ................................................................................................................... 148

I/O PROGRAMMING [5.XX]................................................................................................................ 149

ECTION

5.1 ............................................................................................................................................ 149

I/O Programming Introduction .......................................................................................................... 149

ECTION

SECTION 1.XX

5.2 ............................................................................................................................................ 153

e page 7 of 275 ^

Model 880 DEPOSITION CONTROLLER

Boolean Definitions............................................................................................................................ 153

ECTION

5.3 ............................................................................................................................................ 154

States And Events ............................................................................................................................... 154

ECTION

5.4 ............................................................................................................................................ 159

Steady State vs. Edges ........................................................................................................................ 159

ECTION

5.5 ............................................................................................................................................ 159

Input Functions................................................................................................................................... 159

ECTION

5.6 ............................................................................................................................................ 160

Output Functions................................................................................................................................ 160

ECTION

5.7 ............................................................................................................................................ 160

Softnodes And Sync Events................................................................................................................. 160

ECTION

5.8 ............................................................................................................................................ 161

Internal Operations ............................................................................................................................ 161

ECTION

5.9 ............................................................................................................................................ 162

Operate Menu..................................................................................................................................... 162

ECTION

5.10 .......................................................................................................................................... 162

Memory Menu..................................................................................................................................... 162

ECTION

5.11 .......................................................................................................................................... 163

Editing An I/O Program ..................................................................................................................... 163

I/O Programming Tree....................................................................................................................... 165

ECTION

5.12 .......................................................................................................................................... 168

I/O Setup Edit Menu ........................................................................................................................... 168

ECTION

5.13 .......................................................................................................................................... 169

Edit/Change Menu.............................................................................................................................. 169

COMPUTER INTERFACING [6.XX].................................................................................................. 191

ECTION

6.0 ............................................................................................................................................ 191

Host Port Interface............................................................................................................................. 191

THEORY AND CALIBRATION [7.XX] .............................................................................................. 261

ECTION

EASUREMENT THEORY

7.0 M

.................................................................................................... 261

Equation 1 .......................................................................................................................................... 261

ECTION

7.1 C

ALIBRATION

..................................................................................................................... 262

Thickness ............................................................................................................................................ 262

Density Determination....................................................................................................................... 262

Z-Factor Determination ..................................................................................................................... 262

Tooling Dtermination ......................................................................................................................... 262

Material Reference Table:.................................................................................................................. 264

Aluminum Through Indium............................................................................................................................. 264

Indium Intimonide Through Terium................................................................................................................ 265

Thallium Through Zirconium Oxide................................................................................................................ 266

MAINTENANCE/PROBLEM SOLUTIONS [8.XX]........................................................................... 267

ECTION

8.0 ............................................................................................................................................ 267

Warnings/Cautions ............................................................................................................................. 267

User Correctable System Problems.................................................................................................... 267

ECTION

8.1 R

EPLACING

ENSOR CRYSTAL

A S

....................................................................................... 268

Cautions/Procedural Steps................................................................................................................. 268

ECTION

8.2

PERSISTENT CRYSTAL FAIL INDICATION

........................................................................ 268

Discussion .......................................................................................................................................... 268

Hardware Issues ................................................................................................................................. 269

ECTION

8.3

8.4

SYSTEM BATTERY AND MEMORY CONSIDERATIONS

................................................................................................................................270

FAQ

..................................................... 270

Procedure to Change Battery ............................................................................................................. 270

GLOSSARY .............................................................................................................................................. 271

SECTION 1.XX

e page 8 of 275 ^

Model 880 DEPOSITION CONTROLLER

INDEX....................................................................................................................................................... 273

COPY PARAMETER LISTS.................................................................................................................. 274

FIGURES

Standard Sensors.................................................................................................................................. 20

Sequencing / Non-Sequencing Modes................................................................................................... 23

Process / Film / Map Relationships...................................................................................................... 25

Back Panel Connections (Overview).................................................................................................... 29

Electrical Connections From Crystal Through Remote Oscillator (Overview) ................................... 30

Input Bd. Jumpers (Overview).............................................................................................................. 33

Installation/Removal Of Back Panel PCB Cards ................................................................................. 35

I/O Programming Notation .................................................................................................................. 44

I/O Programming Description.............................................................................................................. 44

I/O Programming: User Programmable Front Panel Keys/LEDs....................................................... 45

Example I/O Programs......................................................................................................................... 45

I/O Programming: Modulo 100 Counter Addresses............................................................................. 47

Touch Panel Overlay............................................................................................................................ 49

Front Panel and Key Descriptions ....................................................................................................... 50

Typical RunTime Screen....................................................................................................................... 50

Status Key Screens................................................................................................................................ 51

Manual Mode Screens .......................................................................................................................... 52

Status Screen Selector Function ........................................................................................................... 54

Start Key Menu..................................................................................................................................... 54

Start (Key) Process Flowchart ............................................................................................................. 55

Menu Tree............................................................................................................................................. 57

RunTime Screen.................................................................................................................................... 58

Main Menu Screen................................................................................................................................ 60

Executive Menu .................................................................................................................................... 62

Films & Process Storage...................................................................................................................... 63

Review Film Menu................................................................................................................................ 64

Non-Sequencing Mode Screen.............................................................................................................. 69

Rate Sampling, Sample And Hold Operation ....................................................................................... 75

Main Process Review/Edit Screen........................................................................................................ 83

Service Menu, Memory Configurations................................................................................................ 93

Setting the Active Process (Sequencing Mode)..................................................................................... 94

Setting The Active Film (Non-Sequencing Mode.................................................................................. 94

RunTime Screen (Non-Sequencing Mode)............................................................................................ 95

RunTime Screen: L/Q ........................................................................................................................... 96

RunTime Screen: Sample & Hold......................................................................................................... 96

Hand Controller/Pendent ..................................................................................................................... 97

Manual Power Control......................................................................................................................... 98

Typical Run Cycle............................................................................................................................... 101

System Configuration Screens............................................................................................................ 102

Communications Menu Screen ........................................................................................................... 105

Process Accounting Screens............................................................................................................... 112

Options Info Screens........................................................................................................................... 114

Memory Module.................................................................................................................................. 118

RunTime Screen With Test Mode Enabled ......................................................................................... 122

Electrical Connections To Back Panel............................................................................................... 135

Crystal Head Mounting ...................................................................................................................... 135

Rear Panel.......................................................................................................................................... 138

Recommended System Grounding ...................................................................................................... 139

SECTION 1.XX

e page 9 of 275 ^

Model 880 DEPOSITION CONTROLLER

Rate Mode Recorder Output............................................................................................................... 142

I/O: Input Configuration Jumpers...................................................................................................... 143

I/O: Input Configuration Jumpers...................................................................................................... 145

RS232 Interface Cable........................................................................................................................ 148

I/O Programming Menu Screen.......................................................................................................... 149

Relay Ladder Notation........................................................................................................................ 153

Stack I/O Operations .......................................................................................................................... 161

I/O Programming Menu Screen Descriptions .................................................................................... 163

I/O Programming Menu Tree............................................................................................................. 165

I/O Programming Menu Descriptions................................................................................................ 166

I/O Programming Edit Menu Description.......................................................................................... 168

I/O Programming EDT/CHG Screens 1-5.......................................................................................... 171

I/O Programming: I/O program Entry ............................................................................................... 174

I/O Programming: Inserting An Empty Rung..................................................................................... 179

I/O Programming: Changing the Rung ..............................................................................................179

I/O Usage of Hand Controller/Pendent.............................................................................................. 188

Making An RS232 Cable..................................................................................................................... 191

Communications Setup Mode ............................................................................................................. 193

Equation 1 .......................................................................................................................................... 261

Density Calculation............................................................................................................................ 262

Z-Factor Calculation.......................................................................................................................... 262

Typical Tooling Factors ..................................................................................................................... 263

Sensor Feedthrough Connections....................................................................................................... 269

TABLES

ACTORY SETTINGS

OOLEAN LOGIC

ACTORY SETTINGS

HASES AND PARAMETERS

HECKSUMS AFTER PURGED

RODUCT PROGRAMMING SUMMARY TABLES

ACTORY RELAY OUTPUT PROGRAM

RUTH TABLE

VENT AND STATE

ACTORY INSTALLED

ODULO

IXED DELAY

ESPONSE CHARACTER TABLE

ATERIAL REFERENCE TABLE

......................................................................................................................................... 154

OUNTER PROGRAM

6 C

& P

ROCESS PROGRAMS

, P

............................................................................................... 41

....................................................................................................................................... 43

ROCESS PROGRAMS

, P

............................................................................................... 93

..................................................................................................................... 101

FTER FACTORY RESTORED MEMORY

/ A

................................................... 116

........................................................................................ 130

...................................................................................................... 146

IST

ID L ID L

.................................................................................................................... 155

IST

.................................................................................................................... 158

ROGRAM

I/O P

....................................................................................................... 181

............................................................................................................. 185

ULSE WIDTH

I/O P

ROGRAM

........................................................................................ 186

............................................................................................................... 194

................................................................................................................ 264

SECTION 1.XX

e page 10 of 275 ^

SECTION 1.4

.included parts: STC-2002, power cord, spare parts.

Model 880 DEPOSITION CONTROLLER

Model 880 Spare Parts

POWER CORD [120 VAC] (1) 600-004 FUSES (2 x 2.00A 250VAC F-type) 356-014 OPTOCOUPLED INPUTS 25 PIN MALE CONNECTOR (1) 402-222 RELAY OUTPUTS 25 PIN FEMALE CONNECTOR (1) 404-020

EMI HOOD FOR 25 PIN CONNECTORS (2)..........................404-021

RS-232 9 PIN MALE CONNECTOR (1)..................................404-011

EMI HOOD FOR 9 PIN CONNECTOR (1)..............................404-009

RACK MOUNT EARS (2) ........................................................016-012

RACK MOUNT HDWR (4) ......................................................094-006

MANUAL (this manual)............................................................518-029

CONNECTOR KIT / PARTS ....................................................516-017

HAND CONTROLLER (1) .......................................................500-198

COMMUNICATIONS SOFTWARE TOOLS DISK (1)...........500-046

ASSEMBLY PART NUMBER

(included with Model 880)

Optional Model 880 Hardware / Software

MEMORY MODULE/STRIP CHART INTERFACE PCB 500-212

TRANSPORTABLE MEMORY MODULE (32K) ..................500-210

TRANSP. MEMORY MODULE SOFTWARE FOR PC..........500-TBD

TRANSP. MEMORY MODULE CABLE FOR PC..................500-TBD

SECTION 1.5

Optional Sensor Parts

Description................................................................. Telemark Part Number

Sensor Body (Low Profile) .......................................................550-222

Sensor Cap (Low Profile)...........................................................550-223

30 inch In-Vacuum Coax Cable ................................................500-024

10 inch In-Vacuum Coax Cable ................................................500-023

Crystals (box of 10) ...................................................................500-117

Standard Feedthroughs

1" BOLT STANDARD .............................................................500-016

2 3/4" ConFlat STANDARD ....................................................500-017

Standard Sensors

LOW PROFILE .........................................................................500-042

RIGHT ANGLE.........................................................................500-088

SECTION 1.XX

e page 11 of 275 ^

Model 880 DEPOSITION CONTROLLER



Cables

10' OSC TO CONTROL UNIT CABLE ...................................500-026

30' OSC TO CONTROL UNIT CABLE ...................................500-027

6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025



Crystal / Oscillator Package

6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025

10' OSC TO CONTROL UNIT CABLE ...................................500-026

OSCILLATOR UNIT ...............................................................OSC-100A

10 CRYSTALS ..........................................................................500-117

(includes the following 4 item numbers)

SECTION 1.6 Contact Information

Model 880

Model 880 DEPOSITION RATE CONTROLLER

Sensor Package and Feedthrough Not Included

500-109

Website www.telemark.com

SECTION 1.XX

page 12 of 275

Model 880 DEPOSITION CONTROLLER

SECTION 1.7 PRODUCT SPECIFICATIONS

Model 880 Thin-Film Thickness and Rate Controller Specifications

High Resolution ±0.02Hz(5-6MHz), 0.0088 Angstroms/Measurement (for Aluminum) High Accuracy ±0.5% thickness + 1 count High Speed Ten measurements/second Measurement Range 500KA Aluminum Equivalent Standard Sensor Crystal 6 MHz AT cut, Plano/Convex Sensor Capacity 2 per sensor PCB card [4 PCB cards max.] Displays 240 x 64 pixel monochrome LCD with Backlight

12 digit LED display (7 segments each digit)

4 discrete indicator LEDs Operation Menu driven "Windowing Type" LCD Touch Panel (12 x 4 key matrix) with 6 fixed function membrane keys and 4 user programmable fixed membrane keys Film Storage (Standard) 1 Active Film Program 98 Alternate Film Programs (with 30 Sensor maps) 9 Sequence recipes, 99 steps per recipe, system total is 250 steps External Storage (Optional) Film Parameters for films 1-99 and System Parameters I/O programs,

and Process Accounting Can be stored in Transportable Data Module

(Optional) Hardware I/O (Standard) per card: 8 SPDT Relays, 1.0 Amp @ 24 VDC Maximum

per card: 8 Optocoupled Inputs (Electrically Isolated), 5-24VDC [4

slots for input and/or output cards] Computer Interface RS-232C (Sycon Format or ASCII) Protocols Communication Options DeviceNet, PROFIBUS, CANopen, others Analog Outputs: 12 bit resolution (2 per sensor card, each for use as control or recorder)

As Control Outputs 2.5, 5, 10 volt @10ma. isolated output with range

menu programmable (maximum 2 control outputs per sensor card)

As Recorder Outputs 0 to 10 volt @ 10ma, isolated, function programmable

(rate, thickness, power, deviation, computer remote) (maximum 1

recorder output per sensor card and per system) Power Control:

Automatic Three Mode Closed Loop Control (PID)

Manual Hand Controller Rack Mount full width rack mount (std.). 3 Power Requirements 90-264VAC, 50-60Hz (

1.4A rms@120VAC, 0.7A rms@230VAC)

Weight (without options) 6 lbs. [with: 1 Sensor card, 1 Input Card, 1 Output Card]

card=0.216 lbs., Input card=0.135 lbs., Output card=0.14 lbs.

Operating Range 0 to 50°C ambient (power supply/LCD display) Humidity non-condensing: 5% - 85% RH

1/2

" H, 8

5/8

" D

Sensor

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

SECTION 1.8

.programmable parameter list (1.4).

__________________________________________________________________

key examples:

Full Parameter Name

Parameter Name ⇒ Param N

(text) ⇒ implied parameter text in parenthesis

__________________________________________________________________

Film Parameter List:

Review Film (Edit Film)

(Material) Density 0.40 to 99.99 gm/cc

(Material) Z-Factor 0.100 to 9.999

Setpoint Thickness Limit 0.000 to 999.999 KÅ

Final Thickness Limit (Trigger) 0.000 to 999.999 KÅ (non-sequencing only)

Setpoint Time Limit 0:00 to 99:59 MM:SS Soak 1 Power level Value 0.0 to 100.0% Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS Soak 2 Power level Value 0.0 to 100.0% Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS Soak 3 Power level Value 0.0 to 100.0% Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS Deposit Rate (requested) 0.0 to 999.9 A/S Rate Ramp Mode OFF / ON New Deposit Rate (Value) 0.0 to 999.9 A/S Rate Ramp Time (Duration) 0:00 to 99:59 MM:SS Rate Ramp (Thickn) Trigger Point 0 to 999.999 KÅ Control Loop –Proportional term- 1 to 9999 Control Loop –Integral term- 0.0 to 99.9 sec Control Loop –Derivative term- 0.0 to 99.9 sec Max Power Limit 0.0 to 100.0% Abort Max Power SWitch OFF/ON Max Power Dwell 0:01-99:59 MM:SS Shutter Delay Mode OFF, ON Shutter Delay TIMEOUT 0:01-99:59 MM:SS Shutter Delay QUALITY 1-50%

(XTAL) RATE SAMPLING OFF,TIMED,INTELL. (XTAL) SAMPLE INTERVAL 0:01-99:59 MM:SS (XTAL) SAMPLE DWELL TIME 0:01-99:59 MM:SS (XTAL) SAMPLE QUAL 1-50% (XTAL) SAMPLE ALARM TIME 0:01-99:59 MM:SS

FILM Fail Mode ABORT IF FAIL, TIME POWER Control Loop Qual Limits 0 to 9 XTAL Stability S (Limits) 0 to 9 XTAL Life Bounds 0.0-100.0% Plot Vert Scale Volts 1, 5, 10, 50, 100 Plot Horiz Scale H 1 to 600 samples Data Plot Type Rate /Rate Deviation /Power

Programmable Parameter Lists

⇒ Abbreviated Menu Name

[Menu end point: Review Film Menu path: Main/Review Film]

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Source Sensor MAP SELECT 1 - 30 POCKET SELECT 0 – 63 Pockets ETCHING MODE OFF/ON

Process Step elements:

Review Processes (Edit Process) (Edit Process Steps [1-99]) Mode (Skip, Stop, Auto,

[Menu end point: Review Processes Menu path: Main/Review Processes]

End, Wait), Film# (1-99), Thickness (0.0 - 999.999 KÅ)

Main Menu values:

[Menu end point: Main Menu Menu path: fixed front panel MENU key/ Main Menu]

Next Active Process (Select)* 1 of 9 processes [sequencing mode only] Next Active Film (Select)* 1 of 99 films [non-sequencing mode only]

[*NOTE: press touch key enclosing digit to select 1 of the 9 processes or 99 films (press digits + ENTer on invoked submenu)]

RunTime Screen parameters:

[Menu end point: RunTime screen Menu path: programming Menu/ fixed front panel STATUS key/RunTime screen]

(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx (Crystal Sample Select) (not selected [blank]), SMPL, SMPL+Time, HOLD+Time

START key sequence STOP key MANUAL key ZERO key MENU key STATUS key

(fixed front panel)

Zeroes the thickness value

Switches from RunTime screen to MAIN menu screen

PROCess X:

(Note

Stops the running process

message change after each START process key press)

(non-seq mode: stops the 1 inherent process [film])

Switches to manual mode from a running process only. Toggle action.

Switches to RunTime screen from any menu screen, to detailed power

and crystal info screens from RunTime screen Zero Power Zero Thickness Force Fail

Zero thickness does not affect film thickness value, only Source Sensor card value (use to set tooling factor, diagnose

problems, etc. )

If the PROCess X: status message does not change when the START key is pressed, check for "STOP: INValid XXX "

message or check the OPT/INF menu, page 2 for cards not installed which are enabled in software (MIA). Cycle AC power OFFON to re-sync.

System Configuration values:

[non-active process]

zero channel 1-8, zero all, re-verify

[non-active process]

zero channel 1-8, zero all [1st STATUS key press from RunTime]

fail channel 1-8, fail all, re-verify

[Menu end point: System Config Menu path: Main/Executive menu/System Configuration]

[2nd STATUS key press from RunTime]

LCD Contrast / Bias LOW, MEDIUM, HIGH Password Lock # 0 - 9999

(Process) Run Number 0 to 9999

Recorder Function Recorder Out Channel

Absolute Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O Control, Off

1 – 8 selects an analog output channel for use (if not off and not used as a source)

Real Clock Time HH/MM Real Clock Date MM/DD/YY

Need Source/Sensor Card 1 OFF/ON Need Source/Sensor Card 2 OFF/ON Need Source/Sensor Card 3 OFF/ON Need Source/Sensor Card 4 OFF/ON I/O Slot 1 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 2 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 3 Type UNUSED (DISABLED) / INPUT / OUTPUT I/O Slot 4 Type UNUSED (DISABLED) / INPUT / OUTPUT Memory Module IFC OFF/ON

Communication values:

[Menu end point: Comm. Setup Menu path: Main/Executive menu/Communications Setup]

COM/IO Lock Code 0 - 9999 Keyboard Beep OFF / ON RS232 Baud Rate 300, 1200, 2400, 9600 RS232 Protocol Sycon, ASCII

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Source Sensor Map elements:

[Menu end point: Review SS Map Menu path: Main/Review SS Map]

Source Sensor Full Power Volts 2.5, 5, 10 full scale volts Source Sensor Max Power Value 0.0% - 100.0% Source Sensor Analog Output Chnl 1 – 8 Channel Selection Master Tooling Value 10.0% - 400.0% Minimum Start Xtal Channels 1 – 8 minimum channels Minimum Backup Xtal Channels 0 – 7 minimum channels Minumum Active Xtal Channels 1 – 8 minimum channels (Xtal) Channel Drop Filter NONE, BALANCE

[Mask dropped Xtal channel Failure]

averaging mode only

Indexer Synchronization Mode NONE, DELAY, FEEDBACK Indexer Synchronization Time 2 – 999 seconds Channel 1 Start Mode OFF, ACTIVE, STANDBY Channel 1 Fail Action (Mode) NONE, ABORT FILM Channel 1 Backup List X – XXXXXXXX (1 item list to 8 item list), [where X = 1 to 8 (in

each position w/o redundancies, list extends to 0-8 for a 1 item list)] Channel 1 Tooling Value 10.0% - 400.0% Channel 1 Weight 10.0% - 400.0% Channel 2 Start Mode OFF, ACTIVE, STANDBY Channel 2 Fail Action (Mode) NONE, ABORT FILM Channel 2 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 2 Tooling Value 10.0% - 400.0% Channel 2 Weight 10.0% - 400.0%

Channel 3 Start Mode OFF, ACTIVE, STANDBY

[need 2nd Source Sensor Card for Channels 3 & 4]

Channel 3 Fail Action (Mode) NONE, ABORT FILM Channel 3 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 3 Tooling Value 10.0% - 400.0% Channel 3 Weight 10.0% - 400.0% Channel 4 Start Mode OFF, ACTIVE, STANDBY Channel 4 Fail Action (Mode) NONE, ABORT FILM Channel 4 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 4 Tooling Value 10.0% - 400.0% Channel 4 Weight 10.0% - 400.0% Channel 5 Start Mode OFF, ACTIVE, STANDBY

[need 3rd Source Sensor Card for Channels 5 & 6]

Channel 5 Fail Action (Mode) NONE, ABORT FILM Channel 5 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 5 Tooling Value 10.0% - 400.0% Channel 5 Weight 10.0% - 400.0% Channel 6 Start Mode OFF, ACTIVE, STANDBY Channel 6 Fail Action (Mode) NONE, ABORT FILM Channel 6 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 6 Tooling Value 10.0% - 400.0% Channel 6 Weight 10.0% - 400.0% Channel 7 Start Mode OFF, ACTIVE, STANDBY

[need 4th Source Sensor Card for Channels 7 & 8]

Channel 7 Fail Action (Mode) NONE, ABORT FILM Channel 7 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 7 Tooling Value 10.0% - 400.0% Channel 7 Weight 10.0% - 400.0% Channel 8 Start Mode OFF, ACTIVE, STANDBY Channel 8 Fail Action (Mode) NONE, ABORT FILM Channel 8 Backup List X – XXXXXXXX,

[X = 1 to 8 (in each position w/o redundancies)] see CH1

Channel 8 Tooling Value 10.0% - 400.0% Channel 8 Weight 10.0% - 400.0%

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

I/O Function elements:

I/O Relay Functions user I/O program

[Menu end point: I/O Setup Menu path: Main/Executive menu/ I/O Setup]

(8 Form C Relays per card [4 slots available for I or O cards])

I/O Input Functions user I/O program + PCB jumpers

(8 Inputs per card [4 slots for I or O cards])

I/O Setup Memory: save/swap, Operate: run/stop I/O Programming Edit (Program): IN, NOT, AND, OR, XOR, POSitive, NEGative,

OUT, TRiP, SET, CLeaR, ARM, DRoP, (events/states/logical

operators), (softnodes) and (numeric elements).

Arithmetic operators/elements: KON# (to input constants), ADD,

SUBtract, MULtiply, DIVide, MODulus, EQUals, GReaTer than,

LESs than, and SELect. Editing: backspace, left/right arrows (to move

cursor), delete, undo, insert/delete line. (Front Panel LEDs [4 discrete]) I/O programming elements (see table x in section 5xx and Section 2.2) (User Front Panel Keys [4]) I/O programming elements (see table x in section 5xx and Section 2.2) Pendent Keys (beyond specified Manual Mode use: I/O programming elements

[see table xxx in section 5xx ])

Service Menu values:

[Menu end point: Service Menu path: Main/Service]

(Test Mode Select) Test Off, Test On [Test Mode won't remain in effect if power is cycled) (Seq/Non-seq Mode Select) Seq(uencing Mode Select en)able, Non-seq(uencing Select enabled) (Memory Contents) as is (no modification), purged, factory (defaults) [see section x.2.2xx ] (Reset) Arm reset, reset armed [Provide a product reset when back panel power

switch is not accessible. Also, use to generate ACCEPT key if not

present (e.g. to end the Test mode when in the Test mode).]



<<< move the following depenency lists to end of section 2.22? >>>

[Prerequisite states that must be in effect for the following parameters to be fully functional]

Film Parameter Dependency List:

Material Density Not Applicable Material Z-Factor N.A.

Setpoint Thickness Limit N.A.

Final Thickness Limit (Trigger) Service Menu Parameter: Non Seq / Accept (Bug: 2

Setpoint Time Limit N.A. Soak 1 Power level Value N.A. Power Ramp 1 Time (to pwr level) N.A. Power Soak 1 Time (@ pwr level) N.A. Soak 2 Power level Value N.A. Power Ramp 2 Time (to pwr level) N.A. Power Soak 2 Time (@ pwr level) N.A. Soak 3 Power level Value N.A. Power Ramp 3 Time (to pwr level) N.A. Deposit Rate (requested) N.A. Rate Ramp Mode N.A. New Deposit Rate Value Film Parameter: Rate Ramp Mode = ON Rate Ramp Time Duration Film Parameter: Rate Ramp Mode = ON Rate Ramp (Thickn) Trigger Point Film Parameter: Rate Ramp Mode = ON Control Loop –Proportional term- N.A. Control Loop –Integral term- N.A. Control Loop –Derivative term- N.A. Max Power Limit N.A. Abort Max Power SW N.A. Max Power Dwell Film Parameter: Abort Max Power SW = ON

µP not reset)

SECTION 1.XX

e page 17 of 275 ^

Model 880 DEPOSITION CONTROLLER

Shutter Delay Mode N.A. Shutter Delay TIMEOUT Film Parameter: Shutter Delay Mode = ON Shutter Delay QUALITY Film Parameter: Shutter Delay Mode = ON

(XTAL) RATE SAMPLING N.A. (XTAL) SAMPLE INTERVAL (Film Parameter: (XTAL) RATE SAMPLING = Timed

or Film Parameter: (XTAL) RATE SAMPLING = Inteli)

(XTAL) SAMPLE DWELL TIME Film Parameter: (XTAL) RATE SAMPLING = Timed (XTAL) SAMPLE QUAL Film Parameter: (XTAL) RATE SAMPLING = Inteli (XTAL) SAMPLE ALARM TIME Film Parameter: (XTAL) RATE SAMPLING = Inteli

FILM Fail Mode N.A. Control Loop Qual Limits N.A. XTAL Stability S Limits N.A. XTAL Life Bounds N.A. Plot Vert Scale Volts N.A. Plot Horiz Scale H N.A. Data Plot Type N.A. Source Sensor MAP SELECT N.A. POCKET SELECT N.A. ETCHING MODE N.A.

Main Menu value Dependency List:

Next Active Process (Select) If N/A, must use START + Reset / Start Proc keys to start a process. Next Active Film (Select)

Service Menu: Sequence Able + Accept keys (for Sequencing Mode)2

Service Menu: Non-Sequence + Accept keys (Non-Sequencing Mode)2 Review Process (Select) Service Menu: Sequence Able + Accept keys (for Sequencing Mode) Review Film (Select) N.A. Review Source/Sensor Map (Sel)

[NOTE1: press to invoke number entry submenu, sequence of 1 or 2 digits is entered or discarded]

N.A.

Note2: [the Seq Able / Non Seq key shows the current mode upon entry into the Service menu, changing the mode toggles key text and generates the Accept key that in turn needs to be pressed to accept new mode described on the key in text]

RunTime Screen parameter Dependency List:

(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx Film Parameters (Crystal Sample Select) Film Parameter: (XTAL) Rate Sampling = Timed or Intelligent? Running in deposit mode (Crystal Select) System Config Parameter: Need Source/Sensor Card X Review Source Sensor Map Element Parameters: Minimum Start Xtal Channels

Minumum Active Xtal Channels

Channel X Start Mode (Process X) Main Menu Parameter: [Next Process] Digit Fixed Front Panel START key: sequence from N/A to 1

Service Menu: SEQuence enABLE

Layer X (layer = step) Review Processes X: EDIT: CHANGE, INSERT, DELETE

Service Menu: SEQuence enABLE FILM Review Processes X: EDIT: CHANGE, INSERT, DELETE films

Review Film X:

[non-sequencing mode]

(Manual mode) Running Process + Pressing fixed front panel MANUAL key +

attached Pendent

[sequencing mode]

Layers/steps

[sequencing mode]

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

MAP# Film Parameter: Review Source/Sensor Map Select SRC x Review Source/Sensor Map Parameter: Source Analog Output Channel

Film Parameter: Source/Sensor Map Select (select the map that contains the above selected Source Analog Output Channel)

NOTE: If SRC is zero, this is an indication that a source analog output control voltage has been assigned to a source sensor card that is not present, not working, etc. Remember that the System Configuration parameters: Need Source/Sensor Card X and I/O Slot X type are only evaluated on power up or on reset. Check the OPTions/INFo menu, page 2 and 3 to see what is currently in effect. To work correctly, the S/S x: line should end with OK. If it ends with EMPTY, the card is not present or not communicating. If the line ends with INCOMPATable!, the software versions in at least some of the various PCB cards is not compatible- check for field changed PCB cards. If the line ends with MIA, that sensor card is configured but is not present. [See OPTions/INFo menu]

RUN, PHASE automatic up/down timers. Function when process/film is started

(START key sequence). Effected by film parameters that control film

phases within the deposition cycle. RUN x System Configuration Parameter: Run Number TIME/Day of Week/DATE System Configuration Parameters: Clock Time, Clock Date Graph Film Parameters: Plot Vert Scale Volts, Plot Horiz Scale H,

Data Plot Type (process start) Carry out the following 2 key sequence up to 3 times.

Press the fixed front panel START key + 1 of 4 touch panel keys: Break Wait, Next Layer, Restart Layer, Reset / Start Process (see figure in end of section 3.0). Use the appropriate touch key for the task at hand. If unsure, use Reset / Start Process key in all 3 sequences. Please read and understand this manual before starting a live process. (Test mode) [to enter] Service Menu: Test Off ⇒ Test On (text toggles) + Accept (Test mode) [to exit] Service Menu: Arm Reset ⇒ Reset Armed (text toggles) + Accept

Password Dependencies:

(Communications values) Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock

Code [non-zero value enables the password dependency and is itself the

password.]** (I/O parameters) Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock

Code [non-zero value enables the password dependency and is itself the

password.]** (all other parameters) Main Menu/ Executive Menu/ System Configuration: Password Lock #

[non-zero value enables the password dependency and is itself the

password.]**

**Note: If password is forgotten and programming has not been saved in some

other media, call factory to eliminate passwords without purging memory.

SECTION 1.9

.sensor specs (1.5).

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

Sensor Specifications

Low Profile P/N 500-042 Right Angle P/N 500-088

Figure 1.1: Standard Sensors.

Operation

Maximum Temperature............................................................. 200 °C

Water Line and Coax Length .................................................... 30 inches

Sensor Mounting ......................................................................Rear of Body, #4-40 Tapped

Feedthrough Installation

Water

Connections ................................................................ Two Required

Type ........................................................................... 1/8 inch OD. Stainless Tubing

Flow Rate .................................................................... 0.2 to 0.3 gal/min.

Water Temp................................................................. 50 °C max.

Electrical

Connections ................................................................ One Coaxial Line

Type ........................................................................... MicroDot Miniature

Materials (in VAC)

Body and Water Lines ............................................... 304 Stainless

Insulators .................................................................... Alumina

Coax Insulator ............................................................ Teflon

Coax Conductor and Shields ...................................... Copper/Silver

Braze Material ............................................................ High VAC Ni/CR/Cu Alloy

Crystal Quartz with Gold Electrodes

SECTION 1.XX

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Model 880 DEPOSITION CONTROLLER

SIMPLE QUICK GENERALIZED OVERVIEW

SECTION 2.0

for what is the Model 880 used ? .(result). [the problem, the solution]

.deposit material on a target surface with a controlled and repeatable process.

The Model 880 addresses the needs of thin film deposition within the vacuum coating industry. The main function of the Model 880 is to provide the means for a controlled and repeatable process, which is the deposition of material on a target surface. [process in which material is deposited on a target surface] [process that deposits material on a target surface] (PVD)

<< ii, 2-1 >>

this product is the basis of a controlled and repeatable process.

Without such control, the power [supplies] used to start (or stop) the generation of deposits could be switched on (or off) at human reaction speeds. Once on, the power [supply] outputs could be altered to vary the deposit rate, again at human reaction speeds. From the human perspective, the relatively brief time intervals typically required would be unwieldy at best for accurate control of even a slow process. This kind of direct human control also assumes that a time versus deposition rate and final thickness is known for the various deposited materials. Factor in the many physical elements that effect deposition and the system user, with only time based control, would find it extremely difficult at best for even slowly accumulating thick depositions, and, for thin depositions, impossible to obtain the desired results, much less the consistent desired results. The first need is to at least monitor the deposition and know the thickness (and rate) at any point in time. The next is to be able to control the process based on the monitored information in real time such that the reaction time between monitor and control is at the needed speeds. Fortunately, the needed monitor/calculation/control speed is easily within the range of a moderately priced microprocessor.

The Model 880 has a microprocessor: on each sensor card, on the user interface board (includes interconnected displays, keys, touchscreens, etc.) and on the communications/control/database board. This multiprocessor approach provides greater bandwidth and dedication to specialized functions with obvious benefits: speed, control, etc. The microprocessors used are actually microcontrollers, which can include A/D, D/A, communications, etc. thus providing cost savings and greater reliability because of the higher degree of integration. .[in speed and control].

.[Along with an oscillator and crystal sensor(s), the STC-2002 instrument is the basis of a controlled and

repeatable material deposition process system. ].

Along with an oscillator and crystal sensor(s), the Model 880 instrument is the basis of process control and repeatability within a material deposition system. [of a material deposition system] The Model 880 can be used to monitor and control the process manually, or to monitor and control the process automatically. Utilizing the inherent flexibility of the Model 880, there are many possible levels of manual control (requiring human intervention at user determined points in the process). This is also true of the automatic process mode. During an automated process, for example, an input state or some other condition can be made to pause the process for user inspection. If satisfactory, the automated process can be resumed by another preprogrammed user input. In addition, reactions between monitor and control (response time, overshoot control, etching vs. depositing, etc.) can be tailored to meet various requirements by user programmable parameters (discussed in PID control section).

The material deposited on the target may be from a single element or a compound (alloy) to create single or multilayered metal deposits, lens coatings, the creation of an alloy combination that has special properties, metalized plastic, etc. The products range from sunglasses, jewelry, automotive decoration, CDs at the low end to optical lenses, mirrors, filters, semiconductors, superconductors, metallurgical research, etc. at the high end.

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

SECTION 2.1

how is it used ?

First, a few terms and their definitions are needed.

.the material to be deposited is referred to as an evaporant source.

The material to be deposited shall be alternately and henceforth referred to in this manual as an evaporant source.

.the target surface is referred to as a substrate.

The target surface shall be alternately and henceforth referred to as a substrate.

.the material is known as an evaporant when it has reached sufficient temp/excitation to leave the

source material supply prior to deposition.

The material is known as an evaporant when it has reached sufficient temperature/excitation to leave the surface of the source material supply prior to deposition. The Model 880 automatically, as it monitors material deposition rate and thickness, controls the power that generates the evaporant within the bounds of the user-defined parameters and other programming. The Model 880 is programmed through an LCD screen with a touch panel overlay. [All choices are deterministic or bounded by a screen specified range.] All choices are made within groups of predetermined menu selection alternatives or, as in the case of some data entries, bounded by a screen specified range with software enforcing the range of entry acceptance.

.layered metal deposits, lens coatings, create alloy combinations that have special properties, etc.

With the crystal sensor[s] in the same space as, but not necessarily in relative close proximity to, the substrate, the crystal sensor[s] should accumulate the same amount (or a ratio) of deposited material as the substrate. As the crystal frequency is proportionally related to a deposited mass (within specific bounds), thickness on a substrate can be inferred and deposition rate can be calculated based on thickness values through the progression of time. Other dependent factors such as the type of material deposited (as reflected in material density and z factor) and the physical positioning of the crystal sensor[s] (see tooling factor discussion) are also part of the deposition calculations and are included among the user programmable parameters of the Model 880.

In a typical case of evaporant stream generation, a high current (or high voltage) power supply is used to heat the material in a boat, crucible or coiled filament. This power supply is controlled by the control output voltage of the Model 880 sensor card. This power supply can thus be controlled through the Model 880 either manually or automatically. Manual mode can be used to setup the system before the auto mode is employed. The power supply, in this case, is manually controlled while the deposition is monitored. In non-sequencing mode (defined shortly), the final thickness parameter can be set to terminate the process when reached (evaporant source shutter closure). The power could be switched off via an output relay (a poor man's controller). In the auto mode (sequencing mode), a user programmable PID loop can be used for process monitor/power supply control with a relatively high degree of precision based on needed system speed elements. All methods of evaporant stream generation need power supply control. A power supply that is controlled by the Model 880 typically provides thermal excitation of the target material by laser, electron beam (accurate control), resistance heating (low cost/complexity) or sputter (large area) deposition, each process type having favorable attributes for specific process goals.

Regarding higher level system control, the Model 880 can be programmed to function in this capacity (keeping in mind failsafe measures). [On a higher level of system control]. Using one of the four user programmable fixed front panel keys and output relays, gates/valves could be closed and pumps could be activated as a prelude to the previously described automated process. A pressure monitoring device would signal the Model 880 through an opto-input when the pressure was correct and the automated deposition would begin. One of the user programmable front panel indicators could be used to show this and that of other points during the process had been reached.

[For additional information, search the web using "quartz crystal microbalances".]

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

<< control loop=2-12 >>

simplest case (seq, non-seq / 1 crystal). 1 process, 1 film, 1 material, 1 crystal, 1 deposit.

Returning to Model 880 specifics, some additional Model 880 terminology definitions must now be given.

Beyond sensor information and power supply control voltage, the Model 880 also allows the user to define the other parameters that are critical in the deposition process.

In Model 880 terminology, a film is defined as a list of user programmable deposition related parameters (see XXX). Typically, one material deposition is accomplished per film (describes specific: material, mechanical setup, timing, etc.). The Model 880 can store up to 99 films (referred to as a film recipe library). A process is a list of film implementations. Each film implementation is referred to as a layer (or step in the process). Process layers can use the same film many times or use any combination of different films (insert figure / see fig. xx).

The Model 880 has 2 basic process control modes: sequencing mode and non-sequencing mode. While in either one of these modes, manual mode (manual control of power) may be invoked. In addition, a test mode can be employed to simulate (w/ simulated rate information) a crystal sensor input while in any combination of the modes just described. Simply put, the sequencing / non-sequencing mode difference is that of having or not having a process. Non-sequencing mode does not have a process (or at least nothing named as such). Non-sequencing mode uses 1 implicit process which can run 1 film. The non-sequencing mode is easiest to configure (user programs an active film). The sequencing mode is more complicated only by the additional programming of a process[es] that calls out a film or films.

The Model 880 retains the non-sequencing mode for historical compatibility and for simple depositions.

On the subject of films and processes, that which is referred to as active is that which is queued to be run when the start sequence is initiated. In other words, except for a co-deposition process, only one film is being deposited at one time and one process (the active process) is calling out that one film in one of its steps. When a process is run (start key sequence), it uses the single process that was selected as the active process (on the Main Menu). Likewise, the film that was selected by the active process as the active film will become the running film. [The non-sequencing mode has only one inherent unspecified process and films are manually selected to be active. Only the film selected as active will be run (Main Menu in non seq mode).] Regardless of mode selection, an active process or active film can be edited (modified) while a process or film is running but only in a limited manner. This prevents potentially dangerous situations from occurring. The limitations, that is, the parameters that are not changeable while a process (or film ) is running include the following:

Film parameters: SS Map Select, Pocket Select, Etching Mode.

Map parameters: CH x Start Mode, Source full power, Source out channel, Indexer Sync Mode.

Min ~~~ XTALS

[3 parameters]

(evaluated at start only except for RE-VERIFY key usage).

Process: Film# of current running step, Process length (no step insertion/deletion).<<<move?>>>

SEQ MODE

1 active process (process selects 1 or more films) Up to 9 programmable processes

NON-SEQ MODE

1 implicit active process (user selects 1 active film)

1 ACTIVE FILM

(up to 99 programmable films) Film parameters define the constituent elements of the

osition

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

In terms of Model 880 usage, the simplest configurations would be either in sequencing mode with: 1 crystal, 1 oscillator, 1 process, 1 film, 1 material, and 1 deposit or in non-sequencing mode with: 1 crystal, 1 oscillator, 1 film, 1 material, and 1 deposit. Also for these simplest configurations, in either sequencing or non-sequencing mode, a single sensor input would be employed along with a single control voltage output (controls power to that which is generating the evaporant). The simplest means of evaporant stream generation would be resistive heating.

In terms of unit hardware, this translates into an Model 880 with 1 sensor card, 1 output card and 1 input card.

In terms of unit software (menu programming), a specific film is either called by a process (in sequencing mode) or called directly (in non-sequencing mode). The film, in turn, calls out a specific sensor map. Except for co-deposition applications, which will be explained elsewhere, only 1 process, only 1 film, only 1 map can be active (running) at a single point in time. A process can call a different film at each of its steps (or layers) up to 99 steps.

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

(SEQuencing Mode) Step# (or Layer#) Mode: Skip, Stop, Auto, End, Wait

Film #

Thickness

Implicit Process

(NON-SEQuencing Mode)

-OR-

Density Z Factor Setpoint Limits Rate Ramp Power/Time Soak Power/Time Deposit Rate Values PID Loop Max Power Values Shutter Parameters Rate Sampling Values Film Fail Mode Xtal Loop Stability/Quality Xtal Life Bounds Graph Plotting Values

Map Select

Pocket Select

Source Power Options Master Tooling Xtals: Start, Backup, Active Xtal Drop Filter Mask Indexer Channel X: Start mode Fail action Backup List Tooling

.general case usage .(differences: few) traditional.

The typical usage would not be much beyond the simplest case as described above. This would include more films (implying more materials), multiple deposits of the same or different materials or more processes. In addition, a multiple crystal head with an integral either/or shutter is sometimes used as an input to 2 sensor inputs. Although these configurations represent most systems, the capabilities of the Model 880 are far beyond these necessities.

input is not supported with this product (no switching with zeroing on a single input, etc.).]

[A multiple crystal head that is used as an input to a

single

sensor

.adding complications (more inputs, relays, crystals, ext. voltages, recorders, comm. terminals,

indexer, etc.)

Examples of added usage complications would be using (or using more) digital inputs, relays, more crystals, more sensor channels, external I/O voltages, strip chart recorders, communication terminals, ebeam source indexer (model: 376, 379 or 395), etc. A pendent is supplied for some remote front panel functions and manual mode usage. The pendent plugs into the front panel of the Model 880 and has a 6 foot coiled cord. A sensor card has 2 identical sensor inputs and 2 identical analog outputs. The 2 analog outputs, in a single sensor card system, are typically used as 1 control output voltage and 1 strip chart output voltage. When multiple sensor cards are used, the strip chart recorder output can be set up on any of the analog outputs but only one strip chart recorder function per system is programmatically allowed. Each of the two analog outputs arrive at the external connector in 2 polarities: isolated and a negative version of the isolated output. A less expensive non-isolated version of the card is TBD? There are slots for 4 sensor cards (1 sensor card is standard in the Model 880). Crystal sensor and control voltage output usage has been described above. If one of the analog outputs is programmed for strip chart recorder output, a software menu change can convert the strip chart output into a second isolated control voltage output. There is another group of 4 slots for either input cards and/or output cards (1 of each type in the first 2 slots are standard in the Model 880). Input cards have 8 opto-coupled inputs. Output cards have 8 form C (SPDT) relays. Inputs are typically used to trigger events at some meaningful point in the process or to

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

indicate to the system user that some point has been reached. Outputs (relays) are typically used to open/close shutters on material sources and crystal sensors, but are also used to control many other valves, relays, solenoids, etc. The card IDs (software addresses) of the PCBs (sensor, input, output cards) are not unique within their types nor are they programmed by hardware or software. It is the location into which they are connected that gives them their unique identity (software address). A communication port is used to interrogate the Model 880. By using a set of commands, various information can be downloaded or uploaded, front panel control can be simulated, process control can be modified/stopped/started/driven, etc. .other useages (i.e. limp along).

There are also other useages and subuseages. Some other useages would be test mode and rate sample/hold mode. Multiple material co-deposition are also possible with additional hardware and different software described in a different manual.

SECTION 2.2

how does it work ?

crystal osc, crystal sensor

Be forewarned that the general information contained herein is meant only as an overview of the system. The information presented here does not adequately describe the many hazardous situations that could occur brought about by the incorrect constellation of valve states, temperatures, pressures and voltages. The system needs to have safety provisions should inadvertent human intervention cause changes or should a power failure of any or all parts of the system occur. Safety concerns include electrocution and explosion.

techniques) needs a number of components. A vacuum chamber provides the space and environment in which the deposition process will occur. A vacuum is necessary to provide a decreased potential for atomic collisions and contamination (better dispersion with less impurities). Vacuum pumps are needed: roughing pump (starts vacuum), cryogenic pump (provides final high vacuum), etc. Relays, valves and solenoids to control the pumps, pump valves and seal/vent the chamber are needed. A vacuum gauge is needed to monitor the chamber vacuum. Additional vacuum gauges may be used to monitor other points in the vacuum system. At the appropriate pressures, the system user can close/open valves, start the deposition process, etc. A heat/excitation source (electron beam, resistive filament, etc.) to react with the source material to be deposited, the source material itself, a boat, coil or crucible, etc. into which the source material is placed, a power supply for the heat/excitation source, and the target (substrate) material are all needed. A source of water for cooling various components is also needed. An air compressor is necessary to activate solenoid controlled valves, shutters, etc. Various traps can be used to keep gases clean. Crystal sensor[s] and attendant oscillator need to be connected to the STC_2002. Shutters are usually placed to shield the crystal sensors or the source material's evaporant stream, at least during process startup. The Model 880 typically acts to tie most, or all, of these elements together to control the deposition process. For e-beam use, a sweeper control unit may also be needed. In multipocket e-beam gun systems, a pocket indexer or rotator would also be needed.

The roughing pump creates a low vacuum in the chamber first through the open gate valve, the cryopump and the open rough valve with the purge valve closed. When the desired level of low vacuum is attained, the roughing pump is powered off as the rough valve between the cryopump and roughing pump is closed. The cryopump begins to pump the chamber to a higher vacuum (by condensing gas molecules on an

extremely cold surface of a container). When the cryopump reaches saturation, the gate valve is closed and

the purge valve is opened so that the cryopump can be regenerated (a heater may be needed). After cryopump regeneration is complete (condensed gases have been dissipated), the purge valve is closed, the gate valve is opened and the pump-down to a higher vacuum using the cryopump continues.

vacuum deposition: vacuum chamber, roughing pump, heat source, evaporated material, p.s., cryogenic pump (which condenses gas molecules on an extremely cold surface of a container). uniform deposition of material in a vacuum, material deposition on crystal and target substrate.

A generalized, simple, thin film vacuum deposition system (using physical vapor deposition

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

Chamber

Gate Valve

Cryopump

Roughing Pump

Purge Valve Rough Valve

<< crystals 2.2 >>

cal and theory (ch 4, 1

page) [keep ch 4-like intact, repetition ok, use see ch 4 to link].

When the chamber is appropriately pumped down, the source material is heated/excited such that molecules become the evaporant stream and are dispersed.

To reiterate, the source material is known as an evaporant when it has reached sufficient temperature/excitation to leave the surface of the source material supply prior to deposition. A vacuum is necessary to provide a decreased potential for atomic collisions and contamination (better dispersion with less impurities). The Model 880 automatically, as it monitors material deposition rate and thickness, controls the power that generates the evaporant within the bounds of the user-defined parameters and other programming. The Model 880 is programmed through an LCD screen with a touch panel overlay. All choices are deterministic or bounded by a screen-specified range with software enforcing the range of entry acceptance. The Model 880 can also be programmed through the communication port. The Model 880 monitors material deposition rate and thickness by means of the crystal sensor, which occupies the same space as the substrate.

.<< control loop=2-12 >>.

As the deposition process is transpiring within a vacuum chamber, the resonant frequency of a quartz crystal sensor, also exposed to the same evaporant as the substrate within the chamber, accumulates deposited film[s] on its surface. The equation in section x7 describes the relationship between the mass of such a film deposition and the measured frequency of the sensor crystal. Knowing the frequency change due to accumulated mass, the film thickness can be determined. The rate of accumulated material thickness can be calculated using the film thickness along with other elements and progression through time. Contributing factors include crystal sensor placement, material characteristics, etc. The Model 880 numerically displays rate, thickness and power. It graphically displays rate, power or rate deviation.

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

As the Model 880 measures the rate of material deposition (in auto deposit mode), it compares this measured value to a user programmed rate setting. If there is a difference between the actual rate and the user programmed rate, the control voltage (from the sensor card) is used to generate a feedback to adjust the deposition source power supply keeping it in compliance with the user programmed rate setpoint value. This method of Model 880 control has automatic compensation for changing source conditions.

Since there are many different types of deposition power supplies and sources in use today, the deposition control voltage provided by the Model 880 has been made user configurable: can be wired positive isolated or negative isolated and menu scaled for 2.5, 5 or 10 volts full scale. The sense of the control loop can also be set for either deposition or etching applications by menu programming.

To accommodate the extremely wide range of control loop responses required for the diverse deposition sources available today, a P-I-D type of control loop has been implemented. With this type of control loop available to the user, it should be possible to achieve very good control of any deposition source (see section X3X).

All the control loop parameters interact to some degree in the overall response of the control loop resulting in many combinations of settings that will give equally satisfactory results. Also, the control loop that is optimized for steady state control will have quite different settings from one requiring fast control acquisition with minimal overshoot. By supplying real time rate, rate deviation, or control power to the graph on the Model 880 RunTime display, determination of control loop settings and performance can be made. By introducing a change into the control system and observing the graphical display responses, it is quite easy to "tune" the control loop. Source response is another contributing control consideration. Sources can be categorized as fast responding (electron beam), medium responding (resistive type boats, baskets, or filaments), or slow responding (Knudsen or induction heated types). User programmable shutter delay can also be used to achieve good deposition rate control before exposing substrates to the evaporant stream. Refer to the I/O programming information later in this section and in section x5x of this manual for a guide on selecting or implementing the logic used to control the substrate and/or sensor shutter[s].

There are several phases during a deposition layer of the Model 880 related to the source and deposition rate control. There are three main parts to a deposition layer: pre-deposition, deposition control, and post-deposition. The pre-deposition parameters control the source and material conditioning prior to the film deposition. The Model 880 can control a variety of different types of deposition sources. The typical run cycle phases (rise/soak/rise/soak/shutter delay/deposit/rate ramp/deposit/idle ramp/idle) are for an electron-beam, resistive element or other thermal source. There are also several film parameters (such as DENSITY and Z FACTOR) and associated map parameters (TOOLING, WEIGHT) which relate to the deposition material and sensor calibration. All of these issues will be described in greater detail later in this manual.

.<< co-dep 3-31 >>.

Co-deposition is the running of 2 process layers simultaneously (2 materials, 2 evaporants, 1 or more crystals for each of the 2 co-deposition processes). One of the 2 co-deposition processes will be designated as the one with a final thickness parameter that will terminate the entire co-deposition process. The codeposition process without the final thickness parameter designation will have a parameter specifying its percentage of the thickness rate of the other process. Another parameter unique to co-deposition is codeposition interaction which specifies quantitatively [by] how much each process contributes (is seen by) to the other process (the other crystal sensor). Multiple material co-deposition is possible with additional hardware (2

set of LED/LCD displays) and different software that is described in a different manual.

.<< multi-sensor dep >>.

In addition to the typical configuration of 1 crystal sensor, 1 oscillator, 1 control voltage output, the Model 880 can utilize (by means of the 2

sensor channel and optional sensor cards) multiple sensors to acquire evaporant stream data at various locations, insuring greater repeatability of process control as well as better process control (compensating for the vicissitudes of the evaporant stream in location and in time). A number of user programmable parameters effect multiple sensor depositions. Review Source Sensor Map

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

chooses the sensors that are part of the multiple sensor group. Since each sensor has a unique parameter group, programming 2 or more crystals as active automatically invokes an averaging mode. Lost channels during averaging are handled by menu programmed alternatives (Main Menu/Review SS Maps/Channel Drop Filter Mask). TBD multiple sensor deposition: averaging multiple, averaging weight, interaction calibration (among the crystal sensors) . [additive]

Although the Model 880 cannot control multiple depositions (multiple sources as is the case with co-deposition), but it can maintain other multiple sources (depending on installed and available sensor cards) such that one source output is controlled while other source outputs can be maintained at a non-zero power level. This would provide the ability to precondition other materials that could become activated (controlled) when the currently controlled source reaches its preset conditions. In other words, multiple source outputs can be providing some level of output to multiple power supplies while deposition control can be focused on a single source output (moved) among these. The preconditioning mentioned above would include the soak phases of the deposition process cycle. The soak phase is (or soak phases are) characterized by power being maintained at a constant level.

Ris e

Note soak power levels in deposition cycle

The more imaginative among us might, at this time, see an opportunity here to use the Model 880 for a co-deposition process (set the



Soak

Ris e

Soak2Shutt er

De l a

Depo s it

Rat e

Depos it

Idle

rate for a source output when active, select another source output as active and then allow the non-controlled output to deposit along with the controlled output deposition). The problem with this scenario is in the shutter control that is linked to the active output channel. Alternately, the shutter control could be accomplished with an I/O program but it would not control the process like a true co-

deposition unit nor would it have the same co-deposition oriented amenities

hardware setup discussion

(for actual installation details see Sections x3 & 4 but please read this section first)

.necessities: crystal sensor head, osc, bnc cables, vacuum chamber, etc.

Following is a diagram of a typical evaporator installation. This diagram is repeated and described further in Section 3 (see fig. 3.7).

NOTE: Chart recorder function through memory module connection uses optional hardware and TBD software.

I/O 4 1/O 3 I/O 2 I/O 1

INPUTS / OUTPUTS

CHAMBER

CRYSTAL SENSOR

SENSORS

7 5 3 1

8 6 4 2

7 5 3 1 8 6 4 2

SOURCE

RS232

MEM

COMM OPTION

FUSE: 2 x 2.00 AMP

QUICK-ACTING (F) 250v

90-264 vac, 50-60 Hz, 230VA MAX

WARNING

The power cord protective

connected to ground. No user

servicing to qualified personnel.

Memory Module

grounding conductor must be

serviceable parts inside. Refer

SHUTTER

DEPOSITION

SOURCE

OSCILLATOR

SECTION 2.XX

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COMPUTER

CHART RECORDER DATA AQUISITION

Model 880 DEPOSITION CONTROLLER

Sensor head hardware generalizations (see Section X4 for actual installation details): [discussion] A vacuum chamber usually has a number of ports with flanges allowing access to the chamber interior. A typical vacuum feedthrough is a threaded cylindrical piece of metal that fits into a chamber's flange (has the appearance of a large bolt with nut and washer). A vacuum feedthrough can provide for the passage of water pipes, compressed air and the electrical connection to the crystal through the chamber wall (or floor) without leaking under vacuum. The vacuum feedthrough typically has relatively short lengths of pipes passing through it from end to end, an electrical passthrough consisting of a microdot connector on the interior side (for the crystal connection) and a BNC connector on the exterior side (for the remote oscillator connection). Feedthrough placement defines the sensor to feedthrough cable length. Lengths over 30 inches negatively effect crystal stability and usable life. Another pipe may also be provided for compressed air (for shutter activation).

Electrical connections from crystal sensor through feedthrough to remote oscillator cable.

The typical crystal sensor has a microdot coaxial connector located on the perimeter of its body for electrical connection to the enclosed crystal. A teflon cable brings this connection to the chamber wall flange through which it proceeds to the exterior of the chamber via a vacuum feedthrough. The electrical cable from the sensor head to the vacuum feedthrough should be wrapped around the water lines [securing] using up all excess length in the process. The chamber, the sensor body, the outer conductor of the microdot connector and the outer conductor of the BNC connector are electrically interconnected and must be at earth ground for proper use with the remote oscillator and the Model 880. Grounding also provides safety benefits and lessens signal noise. The remote oscillator can be connected directly to the exterior of the feedthrough BNC if room permits. A 6 inch cable is used if there is not enough room. The cable from the remote oscillator to the Model 880 sensor card can be as long as 100 feet. These interconnects are 50 ohm coaxial cables. Each Model 880 sensor card has 2 crystal sensor inputs (BNC males) that, when installed in the Model 880, are labeled on the back panel as: 1 and 2 (for sensor card 1), 3 and 4 (for sensor card 2), 5 and 6 (for sensor card 3), and 7 and 8 (for sensor card 4). The text SENSORS also appears on the back panel to generally describe the connectors in this area.

Sensor side

The crystal sensor has an opening which presents an area of the crystal surface to the accumulating deposition material. During setup and initial evaporant material heating/outgassing, this opening on the

SECTION 2.XX

e page 30 of 275 ^

OSC-100A OSCILLATOR

Push to Test

Serial No.

4571

instruments

East Syracuse, NY

Model 880 side

Model 880 DEPOSITION CONTROLLER

sensor should be covered to prevent deposition on its surface. Typically a metal shutter (that can be controlled by an Model 880 output card and solenoid) is moved remotely to cover or expose the crystal surface and/or the evaporant source. The Model 880 also has a user programmable shutter delay. Tapped holes are provided on the sensor body for mounting the shutter assembly and/or a mounting bracket to secure the sensor from movement. The sensor body can be opened so that the crystal can be replaced. A "solenoid assembly" is used to provide the compressed air to the shutter and can be electrically controlled by one of the Model 880 output relays. There are available manual shutters activated through a feedthrough. The sensor head has a minimum distance to the evaporant source of 10 inches to preclude being struck by larger droplets that which in turn results in incorrect or no readings. These droplets are not part of the evaporant stream and are therefore meaningless to the deposition process measurement. The maximum distance is that which keeps [maintains] the crystal sensor within the evaporant stream. The crystal sensor's deposition surface should be perpendicular to the evaporation source. The sensor mounting must not be free to move or vibrate. If the rigidity of the pipes is not sufficient, secure the sensor with a mounting bracket and screws into the sensor's mounting holes. The evaporant stream needs a clear path (line of sight) to the crystal sensor's deposition surface otherwise intervening physical elements could cast a shadow in the evaporant stream.

#4-40 Tap -- 4 holes Equally Spaced

on o0.731 B.C.

Water Cooli

Microdot Coaxial Conne

The crystal sensor has a pipe bent around most of its circumference for the purpose of transferring heat away from the crystal. Water is sent through the pipe at a specified minimum flow rate to ensure proper cooling. The water lines are typically cut and bent to suit the needs of the chamber interior. The pipes, as previously noted, also provide mechanical support for the sensor. Sensor pipes can be TIG welded or silver soldered to feedthrough pipes. Swagelok compression fittings are an alternative to welding or soldering that allow the easy connect/disconnect of pipes (the long pipes attached to the crystal sensor pass through the Swagelok equipped feedthrough pipes). Covering the pipes and sensor cable as a group with fresh clean aluminum (or other metal) foil helps dissipate heat from the cable thus allowing higher temperature usage while minimizing cable movement. This also keeps deposition materials off the pipes and cable for a cleaner environment when the foil is changed frequently.

Caution

CAUTION Ensure that the water lines are clear of obstructions and restricting bends before operating the sensor above room temperature. (water flow rate details are in section X?.)

Crystal Sensor Variations: The so called "right angle" crystal sensor has the microdot connector emerging from the bottom flat surface along with the water cooling pipes (there are no shutter mounting holes on this unit). The so-called "Bakeable" crystal sensor has fixed length water pipes between the sensor body and a thick metal disc, which fits into a flange. Also between the sensor body and the thick metal disc, is a rigid fixed length tubing that houses the electrical connection to the crystal (this allows

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

higher temperatures than the teflon cable of the standard configuration). The ends of the water pipes and crystal connection are on the other side of the thick metal disc (places the 3 terminations outside the chamber). The electrical connection is terminated with a standard male BNC connector. The "bakeable" unit, therefore, presents itself on the outside of the flange like the standard crystal sensor. The so-called "Dual Shuttered Head" has 2 crystal sensors in tandem on a single assembly. As part of the assembly, a shutter always covers one crystal while exposing the other. When the shutter moves it exposes the formerly covered crystal and covers the formerly exposed crystal. The installation of a dual shuttered sensing head is similar to that of the single head. A second sensing input (Sensor 2) is used on the second crystal channel. (If other Sensor cards are installed, a second sensing input could be selected on these.) Automatic crystal switching by shutter is accomplished by I/O programming. The primary crystal sensor channel (Channel 1 in this example) has an associated shutter control bit weight value accessed through I/O programming (ID#81). The primary crystal sensor channel (Channel 1 in this example) and the secondary crystal sensor channel (CHannel 2 in this example) are set to the active state by menu programming. By opening or closing the shutter associated with the primary crystal sensor channel (Channel 1 in this example), the I/O programming performs the necessary functions for controlling the shutter of the dual sensor. Proper phasing between the sensor inputs and shutter control can easily be checked by installing a sensing crystal in only sensor 1 and observing the good and "failed" (absent) sensing crystal when switching manually between sensor 1 (good) and sensor 2 (failed).

Of course this mechanical method can be supplemented by using 2 sensors without shutters. The primary crystal sensor channel (Channel 1 in this example) and the secondary crystal sensor channel (CHannel 2 in this example) can also be selected by I/O programming commands or the active sensor can have a backup crystal sensor channel list that names channel 2 (or the secondary sensor channel) as the automatic replacement for the failed primary channel. (Sequence would be: fail primary [by command or 3 STATUS menu], backup list provides secondary, re-verify [by command or 3

STATUS menu] reinstates the primary.)

Power Supply Connection: This refers to the high current (or voltage) power supply that provides the energy to create the evaporant stream. The power supply connection on the Model 880 has the control voltage that controls the high current (or voltage) power supply. From the Model 880 point of view, this is known as the source control voltage. The word source describing the source material of the deposition process in the form of an evaporant stream. Along the bottom of the back panel, in the area where sensor cards may reside, is the text label SOURCE. This is meant to indicate the 9 pin D-sub connector that is part of the sensor card. The text labels ½, ¾, 5/6, 7/8 refer to control voltage outputs. In the first sensor card slot, this indicates control voltage 1 and control voltage 2. Control voltage 1 is meant to control the high current (or voltage) power supply just described. The 2

control voltage is typically used for the strip chart recorder control. These identical analog outputs can be interchanged. In fact, their function is assigned by means of menu programming. If the two functions (control voltage and recorder) are assigned by menu programming on the same analog channel, the control voltage will have precedence and the recorder function will be lost. After these programmed outputs are used in a film, a conflicting recorder function having been lost in this way would require a reboot to recognize a correcting change. The analog output used for the control voltage output has a number of programmable parameters associated with it. One in the MAIN/ REVIEW FILMS menu path is: SS MAP SELECT. Another one in the MAIN/ REVIEW MAPS menu path is: source out channel. Don't overlook the ground connection (connector shell). Shielding goes a long way toward noise reduction and ultimately contributes to a stable system. [Section 4.6X has more details]

Strip Chart Recorder Connection: This refers to the Model 880 output from the 9 pin D-sub on a sensor card that can provide the proper analog signal for a strip chart recorder. Along with the hardware connection, the analog output used for the strip chart recorder has a number of programmable parameters associated with it. Two in the MAIN/ EXEC/ SYSTEM CONFIG menu path are: recorder function I/O control and recorder out channel. Don't overlook the ground connection (connector shell). Shielding goes a long way toward noise reduction and ultimately contributes to a stable system. (See Power Supply

Connection above) [Section 4.7X has more details]

RS232 Communications Connection: Located in the approximate center of the back panel and labeled

with the text RS232 is a male 9 pin D-sub connector for the purpose of communications with a PC or

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

laptop computer. A straight through cable (that is, pin 1 at one end is connected to pin 1 at the other end, pin 2 to pin2, etc.) cannot be used. A cable configuration known as a null modem cable needs to be used. A diagram of the connections is shown in section 4.11XX. Operations (start/stop) and menu programming normally done through the front panel controls can be accomplished remotely by means of the interface. Software downloads that become the product firmware can also be accomplished through this port. Menu programming needs to be set for the proper baud rate and communication protocol (Main/Executive/Comm. Setup menus) [Section 3.15X and 3.16Y has more details]

Grounding Stud: Located on the back panel near the AC power connector/switch, the ground stud is a threaded screw embedded in the back panel providing an electrical connection to the chassis ground of the Model 880 as well as to the ground connection of the AC plug. This should be used to maintain the system equipment grounds, including the chamber, at the same potential as earth ground. As there are many potential sources of high-energy noise that are part of a deposition system, implementation of this ground system can substantially reduce noise resulting in improved system stability. [Section 4.XX has more details]

Input Card Options: An opto-isolated input card can be configured in a number of ways. Inputs can be isolated or non-isolated, internally powered or externally powered (individually or as a group). Jumpers on the input card are used to make the selections. All of the opto-coupler LED cathodes are brought out to the 25 pin D-sub female (i.e. pins 3,6,9,12,14,17,20,23

[(-) Input Pins]

). The opto-coupler LED anodes are brought into a jumper header (JP1) where each of the anodes can either be routed to a voltage source or sent out to the 25 pin D-sub female (i.e. pins 2,5,8,11,16,19,22,25

[(+) Input Pins]

). The voltage source itself is further selectable on a separate 3 pin jumper header (JP2) such that an internal voltage (+5VDC) can be selected or an external voltage can be selected (comes in on pin 1 of the 25 pin D-sub female). The voltage source, regardless of the JP2 selection, can therefore be applied to all of the anodes when JP1 selects the voltage source. Any one or more of the anodes can be alternately routed through JP1 to keep them isolated from the other anodes and the voltage source. Jumpers can short from the center to one of the ends. Since there are 8 anodes, there are also 8 JP1 sections. The depiction below is a generalization of a single LED input (1 of 8). [Section 4.8 has more details]

cathode D-sub

[(-) Input Pins]

D-sub

JP1

[(+) Input Pins]

anode

int. pwr.

JP2

D-sub (pin 1 only) ext. pwr.

dig. gnd. D-sub (pin 13 only)

SECTION 2.XX

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Model 880 DEPOSITION CONTROLLER

Installation/Removal of Sensor Cards, Input Cards, Output Cards: Although other combinations are possible, the following procedure is recommended for field installations and removals. There are human safety issues and component damage issues that are addressed by this procedure. Please read this procedure in its entirety first before commencing the actual work. Return of the unit is preferred.

1. Disconnect all electrical connections to the Model 880. This includes all I/O connections, Sensor card

connections, RS232 connections, other communications connections, pendent, memory card connections, ground wires and especially the power cord connection. Ensure that the power cord is removed from the back panel IEC 320 connector and that the Model 880 unit is on a properly grounded rubber mat (or equivalent). The person doing this work should also be properly grounded by wearing a grounding strap.

2. Remove the six screws that secure the top cover. Remove the top cover. Store these items together in

anticipation of reassembly.

3. With the top removed, look inside the Model 880. Disconnect the power connection between the IEC

320 connector/switch assembly (mounted on the back panel) and power supply. This will be a 3 position Molex type connector housing plugged onto a mating header that is part of the power supply. This will allow for the removal of the back panel. Next, disconnect the DC power wiring harness from the other end of the power supply. This will be a 6 position Molex type polarized connector housing. Finally, disconnect the 2 pin connector from the LED display board. The wiring harness is now free to move with the bus board. Refrain from flexing the wiring harness at the solder points on the bus board.

4. Locate the two screws on each of the side panels that hold the back panel in place. These are located on

the side panels near the back panel (the screws go through the side panels and into the back panel).

5. The back panel/PCB assembly can be pulled straight back away from the STC_2002. The back panel

assembly will include the power switch/receptacle/wire harness assembly, the PCB cards secured to the back panel, and the bus PCB that interconnects the other ends of the secured PCB cards. Before pulling the back panel away from the main unit, please note that the PCB that provides the RS232 connection on the back panel will disconnect from a PCB on standoffs running parallel to the front panel. This connection will obviously need to be reconnected upon reassembly. This is why the back panel / PCB assembly must be pulled out straight away from the unit: the header pins may be bent otherwise.

6. With the back panel / printed circuit board assembly on the grounded mat, remove the interconnecting

bus PCB from the secured back panel mounted PCB cards taking care to pull the bus board straight out to avoid bending header pins. Place the bus PCB on the grounded mat.

7. PCB cards may be added or removed from the back panel at this time. PCB mounting hardware is

removed or added. Securing the PCB cards to the back panel is accomplished by use of the connector mounting hardware.

8. Carefully align all back panel secured PCB connector headers with the mating socket headers on the bus

PCB. Start alignment at one end of the bus board, holding each back panel secured PCB lightly in place until all are aligned then press on the bus board such that all bus board connectors are fully engaged with the mating back panel secured PCBs.

9. Introduce the back panel assembly back into the unit moving it horizontally across the table while

maintaining its orientation such that the back panel remains parallel to the front panel. Ensure that the power connector harness wires are not pinched or that the insulation on the wires is not damaged. As the PCB (that provides the RS232 connection on the back panel) nears its mating connection, align the assemblies such that the header pins correctly engage and insert straight.

10. Secure the back panel assembly to the side panels with the 4 screws previously removed.

11. Check PCB interconnections for bent pins or misalignments. If there are problems, reverse process to

the point needed to correct the problem.

12. Reconnect the switch/IEC wiring assembly connector housing to the power supply header. Reconnect

the DC connector housings to the power supply header (6 positions) and LED display board (2 positions). The connectors are polarized.

13. Replace the top cover and secure it with the 6 screws.

14. Reconnect the power cord into the IEC connector.

15. Power on the unit.

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Model 880 DEPOSITION CONTROLLER

bus board

disconnects h

DC Header

power supply header

IEC switch/connector

back panel

Pendent:

Also called a hand controller,

may be connected by means of the front panel jack labeled Manual Control when certain front panel functions need to be duplicated remotely or when intending to utilize the Manual mode. When not in use, the pendent may be left plugged into the Model 880 unit or it may be removed. The pendent does not contain any active electronics nor is it polled to check for its presence.

LCD contrast/bias: The optimal viewing is designed for perpendicular to about 45° up and about 45° from perpendicular to either side. Within a few minutes of powering the unit on, there will be some thermal drift effecting color but this should be relatively unnoticeable. If, however, the unit will be in an environment having elevated ambient temperatures (above 30° Celsius), the LCD contrast/bias should be set to low through menu programming (Main/Executive/System Configuration menus).

Graphical Display: Although no hardware other than the LCD display is associated with this item, it needs to be setup. Three film parameters need to be programmed: Plot Vert Scale Volts, Plot Horiz Scale H, Data Plot Type. The graphical display, as the name implies, displays, in graph form: rate deviation, rate or power.

Rack Mounting: Rack mounting ears and screws are supplied with the Model 880 for the purpose of mounting the unit in a standard rack.

Rubber Feet: Rubber feet are not supplied with the Model 880. The anticipated usage of the product is within a rack. If, however, in the unlikely case where the usage will be on a shelf, table or some other flat surface, rubber feet should be used to prevent sliding with the possible resultant damage. They should be of the type that sticks on the bottom of the unit. These can be purchased cheaply at many retail outlets. The waxed paper is first removed from each foot. The foot is then applied to the bottom of the Model 880 such that they are placed in each corner an inch from the 2 corner surfaces. Subsequently, if the unit will be rack mounted, remove the rubber feet.

System Hardware Connections: Except for the generalized previous descriptions, complete system hardware setup is beyond the scope of this manual. Consult the manuals for each of the components in the system. The sum of the manuals is less than the whole: Be forewarned that the general information

contained herein is meant as an overview of the system only, an overview to describe how the Model 880 integrates with the other components in the system and some of its' typical usage's. The information

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presented here does not adequately describe the many hazardous situations that could occur brought about by the incorrect constellation of valve states, temperatures, pressures and voltages. The system needs to have safety provisions should inadvertent human intervention cause changes or should a power failure of any or all parts of the system occur. Safety concerns include electrocution and explosion. .(reiteration of

above).

programmable hardware setup discussion

(for detailed setup see Section x3 but please read this overview section first)

Synopsis: Select mode: sequencing/runtime, sequencing/test, non-sequencing/runtime, non-sequencing/test. Optional selects: manual mode and test mode. Select memory configuration: factory, purged, as-is. Program system parameters. Program film parameters (for a single film or multiple films) and process steps. Set active process. Select crystal. Start process.

The versatility of the Model 880 translates into many modes, parameters and configurations all of which arrive from the factory in default states. Except for the Input card hardware configurations (uses jumpers), all modes, parameters and configurations are menu programmable. The VAR or end user must tailor the unit to work with specific hardware for the desired deposition process.The VAR or end user must tailor the

unit to the specific hardware and deposition process at hand.

Run time mode is the general name for the mode used for the deposition process whose screen can

always be brought forth from any menu screen by pressing the fixed front panel key labeled STATUS.

[A second press of the STATUS key while the Run Time screen is displayed will invoke a screen showing, among other elements, active control output channel[s], pocket number[s] and power % expended on each. A third press of the STATUS key beginning when the Run Time screen was displayed will invoke a screen showing, among other elements, active sensor channels and their states, rates, thickness', stability's and crystal lives. This second screen can be used to fail or reinstate (re-verify) a crystal. has no effect on the deposition thickness.]

Zero thick

ness at this level is used for tooling setup or diagnostics and

The specific functional run time mode must be chosen: sequencing or non-sequencing. Either of these modes can be further switched between the normal run mode and the test mode. This results in 4 mode choices: sequencing/run, sequencing/test, non-sequencing/run, non-sequencing/test. Manual mode (manual control of power) can be selected while a process is running by pressing the fixed front panel MANUAL key with the pendent connected.

At the same time that these choices are being made, the programmable memory can be kept as it is, purged or set to factory defaults. A memory change can effect film parameters, process steps, run time mode, system configuration, I/O programming, process accounting, and communication parameters. Elsewhere in this manual (appears section 3.21) are tables and lists depicting memory element values after purge and after factory [settings] are invoked. This memory information by itself is also listed later in this section.

A film is programmed by selecting the film number (on the main menu), moving through the associated parameter list, and changing the values as needed. Some of the film parameters are not accessible or viable when another related film parameter predicates their availability. Up to 99 films can be programmed. In non-sequencing mode, only 1 film can be run at a time, as there is only one implicit process. In sequencing mode, a process can call for a film in a process step. There can be up to 99 steps in a process and up to 9 processes. A process is menu programmed by building each line (step) with a mode value, film number and thickness value.

In the non-sequencing mode, an active film must be menu selected (1 of 99). In the sequencing mode, an active process must be menu selected (1 of 9). In either case, active indicates that this is the film or process that will become active when the process starts (initiated by the front panel START key). In addition, neither a film nor a process may be altered by editing when either is being used in a running deposition (for safety reasons).

Some system configuration parameters also determine the status of some film and map parameters. Example configuration parameters that fall into this category are: need s/s card x and I/O slot x type. Check the film parameter dependency list in section X1.8X to find the parameter of interest (all parameters are listed there). Finally, set the status of the controlling parameter such that it allows the

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parameter of interest to be accessible and appropriately set. Dependencies are also listed later in this

section. There are some basic parameters that need to be setup. The Density and Z-Factor can be

obtained from table x4.1, in section x4.3 [Review Films menu]. Tooling [Review Source Sensor Map menu] for crystals can be determined empirically by running a trial deposition and using the equation (this will be found in section x4.2):

Tooling = 100 X (Substrate Thickness / Displayed Thickness).

Generally, Tooling is greater than 100% when the sensor sees less deposited material than the substrate (e.g. the sensor is further from the evaporant source than the crystal sensor). Generally, Tooling is less than 100% when the sensor sees more deposited material than the substrate (e.g. the sensor is closer to the evaporant source than the crystal sensor). If 2 crystal sensors are used (assuming a single sensor card is installed), Start Xtal (crystal) must match the hardware and positioning used. Obviously, the two crystal sensors cannot occupy the same space. Therefore each crystal sensor will have a different tooling factor. Crystal sensor tooling is coordinated by the sensor map menu that selects the sensor along with other sensor properties. The channel specific applicable Review SS Map menu parameter is CHx Tooling. There is also a Master Tooling parameter (Review SS Map Menu) that can be used change the ratio of all the crystal sensors simultaneously in addition to the individual channel tooling. This can be thought of as a global offset or multiplier used to alter the tooling of all

active crystal sensors. In any case, the Tooling factor is the attempt to describe the ratio of deposited material between the crystal sensor and the substrate. Max Power Limit, Deposit Rate, Soak Power Value, Power Ramp Time, Power Soak Time, Setpoint thickness and time limits need to be described. With these parameters entered, the Test mode could be utilized to check the process behavior. The Max Power indicators show when the Max Power parameter has been exceeded (LED blinks, LCD alternates with MAX!). To reiterate, the TEST mode only effects the crystal sensor information being processed, it does not effect anything else (this includes the control output voltages). This is not the point at which to begin experiments with a live system. This section is meant to provide a discussion of the issues to familiarize the user with functional themes. Please read further. [OK. Try these parameters while in the Test mode and with no external connections especially the

control output voltage unconnected: Max Power Limit:75%, Deposit Rate:3.7, Soak 1 Power Value:50%, Power Ramp 1 Time:1:00, Power Soak 1 Time:1:00, Setpoint thickness limit:9.999 and time limit:1:11, Data Plot Type:Power. With the above entered, and still in the Test mode, press the fixed front panel Start key + touch key Reset / Start Proc in sequence three times. The assumption is made that factory defaults are in effect. The Test mode is entered through the MENU, SERVICE, TEST OFF, ACCEPT keys. Film parameter entry: fixed front panel Menu key + touch key Review Film.]

.informational only, no connections except power (see fig. 3.6, read or copy 3.1,3.2)

alternates: boat, srt-400, e-beam.

When the Model 880 sensor card control voltage output is connected to the evaporant power supply, Review Source Sensor Map parameters need to be selected for a proper interface (

SOURCE FULL PoWeR, SOURCE MAX PoWeR

) and the Map itself needs to be selected by a Film parameter

SOURCE OUT CHaNneL,

(SS MAP SELECT). Following this, other power supply related parameters must also be contemplated. Some thermal excitation alternatives include: electron beam: wire fed electron beam source, high vacuum e-beam w/ small (~2cc) crucible, fixed pocket (large and small), rotary pocket indexers; resistive heater sources: metal filament boats, coils, oxide crucibles (all for organic material deposition). Crucible

capacities can range from a fraction of a cc to over 500cc. The input control requirements of the high

current (or voltage) power supply should be found in the power supply documentation. Don't assume there is a standard. With the Model 880 control voltage output controlling the power supply for these thermal sources (the 2

control output voltage used for power supply control is typically employed for the recorder

function), the film parameters effecting power (processes depend upon films) are:

Soak 1 Power level Value 0.0 to 100.0% Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS

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Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS Soak 2 Power level Value 0.0 to 100.0% Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS Soak 3 Power level Value 0.0 to 100.0% Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS Control Loop –P-roportional term 1 to 9999 Control Loop –I-ntegral term 0.0 to 99.9 sec

These parameters are presented here for the purpose of name familiarization and categorization of power related parameters across menu and screen

Control Loop –D-erivative term 0.0 to 99.9 sec Max Power Limit 0.0 to 100.0% Abort Max Power SW OFF/ON Max Power Dwell 0:01-99:59 MM:SS Control Loop Qual Limits 0 to 9 Plot Vert Scale Volts 1, 5, 10, 50, 100 ⇐ Graphical display function Plot Horiz Scale H 1 to 600 samples ⇐ Graphical display function Data Plot Type Rate /Power /Rate Deviation ⇐ Graphical display function Source Sensor Map Select 1 to 9

Etching Mode Off / On (

(Selects the Map that contains Source Sensor analog output parameters)

Rate Direction can be Positive or Negative)

The Power Related RunTime Screen parameters are: (Crystal Quality Indicator Select) L/Q, Loop x, Qual xx (Manual mode) (fixed front panel key) (Manual mode) (pendant arrow keys [increase / decrease power manually]) (Manual mode) (2 (Manual mode) (1 (Manual mode)

STATUS screen arrows:  [increase/decrease power manually])

STATUS screen: zero power key [LCD] on non-active channels)

(2nd STATUS screen: zero thick key [LCD] no effect on material thickness)

(Manual mode) (2nd STATUS screen: force fail key [LCD] fail/verify crystal channels)

The Power Related System Configuration values are:

Menu path: Main/Executive menu/System Configuration]

Recorder Functions Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O, Off

Recorder Analog Output ChaNneL

1 to 8 Channels (select 1 only)

[note possible conflict w/ Source Analog Output]

Need Source / Sensor Card x on/off

The Power Related Review Source Sensor Map values are:

Source FS Voltage Scaling PoWeR* Source Max PoWeR 0.0 – 100.0% Source Analog Output CHaNneL 1 to 8 Channels (select 1 only)

2.5/5/10 Full Scale VOLTS ⇐

The Power Related Service Menu values are:

Menu path: Main/Review SS Map]

see Power Supply input requirement

Menu path: Main/Service]

(Memory Contents) as is (no modification), purged, factory (defaults) [see section x3.21x ] note film parameter changes (Reset) Arm reset, reset armed [Provide a product reset when back panel power

switch is not accessible. Also, use to generate ACCEPT key if not present (e.g. to end the Test mode when in the Test mode).]

*NOTE: Of primary concern when connecting evaporant power supply to the sensor card.

Dependencies

[Prerequisite states that must be in effect for the following parameters to be fully functional]

The Power Related Film Parameter Dependency List is: Max Power Dwell Film Parameter: Abort Max Power SW = ON

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The Power Related RunTime Screen parameter Dependency List is: (Crystal Quality Indicator Select) L/Q, Loop x, Qual xx Film Parameters (Manual mode) Running Process + Pressing fixed front panel MANUAL key +

attached Pendent (or on 1

STATUS screen: , , zero CH x)

(process start) .PerformCarry out the following 2 key sequence up to 3 times.

Press the fixed front panel START key + 1 of 4 touch panel keys: Break Wait, Next Layer, Restart Layer, Reset / Start Process (see figure in end of section 2.7). Use the appropriate touch key for the task at hand. If unsure, use Reset / Start Process key in all 3 sequences. Please read and understand this manual before starting a live process.

.options

material selection (4-2 to 4-6).

substrate selection (4-2)

tooling factor (ch 4, 4-3) << fig. 10-9, equip list 10-10 >> << sensor inst. 11-3 >>

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Initial Programming Setups (menu parameters)

system configuration programming (factory/ default settings, stand alone / computer controlled)

If the Model 880 has: arrived directly from the factory or the factory settings key has been menu selected or the purged settings key has been menu selected, the following specifies the parameter values in effect. The following information will be repeated in later sections in greater detail along with additional related information. The intent here is to introduce the reader to baseline values and consequently what must be altered for the intended use. Purge values are listed first, followed by the factory differences

Film Parameter values after purge: Communication values after purge:

[non-SEQ adds "Final Thick Limit=0.0 KÅ"]

Material Density 1.00 gm/cc COM/IO Lock Code 0 Material Z-Factor 1.000 Keyboard Beep ON Setpoint thick limit 0.000 KÅ RS232 Baud Rate 9600 Setpoint time limit 0:00 MM:SS RS232 Protocol Sycon Soak 1 Power Value 0.0%

Power Ramp 1 Time 0:00 MM:SS Power Soak 1 Time 0:00 MM:SS Soak 2 Power Value 0.0% LCD Contrast MEDIUM Power Ramp 2 Time 0:00 MM:SS Password Lock # 0 Power Soak 2 Time 0:00 MM:SS Run Number 0 Soak 3 Power Value 0.0% Recorder Functions Off Power Ramp 3 Time 0:00 MM:SS Recorder Output Channel 1 Deposit Rate 0.0 A/S Clock Time no change (HH/MM/SS) Rate Ramp Mode OFF (w/o battery: 00/01/00) New Deposit Rate 0.0 A/S Clock Date no change (MM/DD/YY) Rate Ramp Time 0:00 MM:SS (w/o battery: 01/01/01) Rate Ramp Trigger 0.000 KÅ Need SS Card 1 ON Control Loop P 100 Need SS Card 2-4 Off Control Loop I 1.0 secs I/O Slot x Type Disabled Control Loop D 1.0 secs Max Power Limit 0.0% Run Time Screen after PURGE: Abort Max Power SW ON Max Power Dwell 0:30 MM:SS PROCess 1 Shutter Delay Mode Off Layer # Shutter Delay Timeout 0:30 MM:SS FILM (film in use) 1 Shutter Delay Quality 10 SRC Rate Sampling Off XTAL (blank) Sample Interval 0:30 MM:SS MAP# 1 Sample Dwell Time 0:30 MM:SS RUN time 0:00 Sample Quality 10 PHASE time 0:00 Sample Alarm Time 0:30 MM:SS RUN# 0 Film Fail Mode Time Power (Graph parameter) Rate Deviation Control Loop Quality L 0 Crystal Quality L/Q XTAL Stability S 0 XTAL Life Bounds 0.0% MAIN MENU Screen after PURGE: Plot Vert Scale Volts 100 Plot Horiz Scale H 1 Review Film (film 1 will be reviewed) Data Plot Type RATE DEV Review SS Map (Map 1 will be reviewed) SS Map Select 1 Next Process 1 Pocket Select 0 Review Processes Etching Mode Off (pos/neg)

note1: non-sequencing mode does not have this function (non-SEQ: ACTIVE FILM is 1).

System Configuration values after purge:

(note conflict: Source Sensor Out is also1)

Memory Module IFC OFF/ON (optional)

(Source Control Volts Channel)

(Process 1 will be reviewed)

(where x = 1 to 4)

note1

(Sample/Hold = blank)

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Review SS Map values after purge:

Source Sensor Full Power Volts 10 volts

[need 3rd Source Sensor Card for Channels 5 & 6]

Source Sensor Max Power Value 0.0% Channel 5 Start Mode OFF Source Sensor Analog Output Chnl 1 (Channel Select) Channel 5 Fail Action Mode NONE Master Tooling Value 100.0% Channel 5 Backup List 0 Minimum Start Xtal Channels 1 channel Channel 5 Tooling Value 100.0% Minimum Backup Xtal Channels 0 channels Channel 5 Weight 100.0% Minumum Active Xtal Channels 1 channel Channel 6 Start Mode OFF Xtal Channel Drop Filter NONE Channel 6 Fail Action Mode NONE Indexer Synchronization Mode NONE Channel 6 Backup List 0 Indexer Synchronization Time 2 seconds Channel 6 Tooling Value 100.0% Channel 1 Start Mode OFF Channel 6 Weight 100.0% Channel 1 Fail Action Mode NONE

[need 4th Source Sensor Card for Channels 7 & 8]

Channel 1 Backup List 0 Channel 7 Start Mode OFF Channel 1 Tooling Value 100.0% Channel 7 Fail Action Mode NONE Channel 1 Weight 100.0% Channel 7 Backup List 0 Channel 2 Start Mode OFF Channel 7 Tooling Value 100.0% Channel 2 Fail Action Mode NONE Channel 7 Weight 100.0% Channel 2 Backup List 0 Channel 8 Start Mode OFF Channel 2 Tooling Value 100.0% Channel 8 Fail Action Mode NONE Channel 2 Weight 100.0% Channel 8 Backup List 0

[need 2nd Source Sensor Card for Channels 3 & 4]

Channel 8 Tooling Value 100.0% Channel 3 Start Mode OFF Channel 8 Weight 100.0% Channel 3 Fail Action Mode NONE Channel 3 Backup List 0 I/O SETUP values /programs after PURGE: Channel 3 Tooling Value 100.0% Channel 3 Weight 100.0% I/O Programs A & B Cleared Channel 4 Start Mode OFF Memory Menu A Channel 4 Fail Action Mode NONE Operate Menu Running Channel 4 Backup List 0 Channel 4 Tooling Value 100.0% Channel 4 Weight 100.0%

Film parameter differences: factory restore has: max power limit set to 50% (purge = 0%).

Processes Step differences: As an example, the following is the difference between a factory setting and a

purged setting for PROCESS# 3. The factory setting has, for the first and only step (step 01): MODE=AUTO, FILM#=3, and THICK(Kå)=0.300. The purged setting has an END line as the first and only step (considered cleared). If process 3 were run with factory settings, AUTO mode would be invoked using film #3 and running until a final thickness of .300 Kå was achieved. If process 3 were run with purged settings, the END command would be encountered immediately thus stopping the process. The table below shows this information as well as information for the other processes.

Factory Settings table for All Process Numbers:

Proc# 1 Proc#2 Proc#3 Proc# 4 Proc#5 Proc#6 Proc#7 Proc#8 Proc#9

STEP 01 01 01 01 01 01 01 01 01 MODE AUTO AUTO AUTO AUTO AUTO AUTO AUTO AUTO AUTO FILM# 1 2 3 4 5 6 7 8 9 THICK 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900

All factory Processes have END as STEP 02.

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I/O programs are not factory restored because of the danger involved. Factory restore will not, therefore, clear or restore the factory I/O program[s] (it leaves them unchanged). Purge will, however, clear I/O programs. These selections will cause the unit to REBOOT with the new configuration in effect. The section describing the SERVICE menu will describe these elements in detail. As seen in the above lists, there are groups of settings (Film parameters, System configuration, Communications, Processes, I/O programs, etc.) that will be included in these configurations. Valuable process programming could be lost. The BYE key can be pressed to leave the SERVICE menu without changing anything.

If the password is forgotten and programming has not been saved in some other media, call the factory to eliminate passwords without purging memory.

.deposition programming (text discussions, the next section has details)

input/output programming (text discussions, the next section has details, ch 5).

I/O programming Introduction

The I/O programming is what controls the opto-isolated inputs on the Input card and the isolated relay contacts on the Output card. Similarly controlled, the front panel has 4 LEDs that are intended as user controlled outputs, 4 user programmable fixed keys that are intended as user controlled inputs and the pendent whose alternate function is user I/O programmable inputs. This I/O programming control extends to input acquisition of front panel key presses, elements of film deposition run cycle states (i.e. rise, soak, deposit, idle, etc.), various process state conditions, process switching, various crystal states or events, setpoint conditions, etc. I/O programming also controls by means of general variables, events and states.~ The I/O programming can discern whether an input has changed state and when it has changed state. When an input has both state information and temporal information, it is known as an edge event condition. When an input has only the state information, it is known as a steady state condition. Outputs also have analogous edge event and/ steady state conditionality. The output result is, correspondingly, either a pulse or a steady state.

To reiterate, Run time mode is the general name for the mode used to run the deposition process whose screen can always be brought forth from any menu screen by pressing the fixed front panel key labeled STATUS. The Run time mode of the Model 880 has 2 basic process control modes: sequencing mode and non-sequencing mode. While in either one of these modes, manual mode (manual control of power) may be invoked. The specific functional run time mode must be chosen by menu selection: sequencing or non-sequencing.

In addition, a test mode can be employed to simulate a crystal sensor input (w/ simulated rate information) while in any combination of the modes just described. Simply put, the sequencing / nonsequencing mode difference is that of having or not having a process. Non-sequencing mode does not have a process (or at least nothing named as such). Non-sequencing mode uses 1 implicit process which can run 1 film. The non-sequencing mode is easiest to configure (user programs an active film). The sequencing

mode is more complicated only by the additional programming of a process[es] that calls out a film or films.

Inputs, outputs and all the other states and events have a numeric representation called an ID number. An ID number is used to numerically represent: inputs, outputs and all the other states and events. They can be named by their description and classified by state/event condition. A table containing all I/O programming events and states can be found in this manual. After locating an event or state that the user needs as a pivotal point in their process, the identifying ID is found. Next, consideration of the needed I/O programming function type is assessed. The available function types are: Input, Output, Trip, Arm, Drop, Set and Clear. The combination of function type and ID number produces (in Model 880 terminology) a token. For the sake of LCD screen limitation imposed brevity, only the first letter of the function type is used to describe the function. Token constituent elements can also include other elements such as a single Boolean operator. Incorrect function type / ID pairings are identified for the user and not allowed as an entry. Although film parameters provide time, power and thickness based control, I/O programming provides not only these but added dimensions to the kind of control that is achievable. The number of conditional elements is increased dramatically.

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I/O programs are constructed using the LCD/touch panel menus. Programs are written in Reverse Polish Notation (RPN) by constructing one (or more) line entities that are called rungs. If a single I/O

programming task of the total work to be accomplished takes more than one line, an intermediate variable called a softnode can be used to carry the partial result of the task from one line into another line that completes the work.

Example illustrating softnodes:

(where x and y are used like softnodes in the following 3 generalizations)

2 + 3 + 5 = x 2 + 5 = y ← x + y – 3

← assignment of the x softnode, one program line (or rung)

assignment of the y softnode, another program line (or rung)

← combining the softnodes, another program line (or rung)

in Algebraic Notation

Example illustrating notations:

Algebraic Notation (2 + 3 x 5) vs RPN (2 3 5 x +) answer (in either notation): 17 Algebraic Notation ((2 + 3) x 5) vs RPN (5 3 2 + x) answer (in either notation): 25

[RPN is used to eliminate abiguous and error prone precedence rules determining the order of evaluation and

because of the stack oriented nature of RPN that is conducive to the I/O programming structures.]

The line length limitation is purely a result of LCD screen size limitations. Each program line (or rung) has an input statement, an output and a consecutive line number (for line identification). A softnode can be used as the output of the line (or rung). Aside from states and events, there are arithmetic, relational, selectional and logical (Boolean) operators used for I/O programming. The logical operators are AND, OR, XOR and NOT. A Boolean value can have only 2 states. There are many alternate names for these 2 states (respectively): true/false, on/off, 1/0, high/low, closed switch/open switch, system voltage/zero voltage, positive voltage/negative voltage, even negative voltage/positive voltage, etc. Logic levels conform to the following table:

Where logic level 0 = zero volts, logic level 1 = system high volts, Boolean value T = true and Boolean value F = false.

Logic Levels In Boolean Value In

0 F 1 T 00 FF F F F 01 FT F T T 10 TF F T T 11 TT T T F

(with 3 inputs )

000 FFF F F F 001 FFT F T T 010 FTF F T T 011 FTT F T F 100 TFF F T T 101 TFT F T F 110 TTF F T F 111 TTT T T T

AND [&] result OR [¦] result XOR [^] result NOT [!] result

(2 or more inputs only) (2 or more inputs only) (2 or more inputs only)

(using 2 AND operators ) (using 2 OR operators ) (using 2 XOR operators ) (uses 1 input only)

T F

(uses 1 input only)

Although the above table ends with three inputs, this does not imply an I/O programming input limitation as many elements can be OR'ed, XOR'ed or AND'ed together but there is a syntactical limit of 2 elements only per each OR, XOR or AND operator. These can be cascaded to the limit of the line length and, beyond that, using softnodes, to the limit of the program maximum length. The constituent parts of a program line (or rung) consist of logical operators and elements that are logically combined or altered by them. These elements involve what was previously described as a token. Token

constituent elements can also include a single Boolean operator.

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Incorrect function type / ID pairings are identified for the user by an error message and not allowed as an entry.

Examples:

(where I represents an input, the number an ID representing various system input states)

I90 I91 ¦ (this ORs inputs 90 and 91 together) I90 I91 I97 ¦ ¦ (this ORs inputs 91 and 97 together and ORs the result with 90) I90 I91 + I97 ¦ (this ORs inputs 90 and 91 together and ORs the result with I97

the same result as the 2nd example, an alternate way of writing it

[this has

])

I90 I91 I97 I100 ¦ ¦ ¦ (this ORs inputs 90, 91, 97 and 100 together) I90 I91 I97 I100 & & & (this ANDs inputs 90, 91, 97 and 100 together)

For those expecting something like I90 ⊕ I91 ⊕ I97 ⊕ I100 notation, the ID tokens are written first (at least

2) followed by the logical operator token for each pair of Or'ed elements.

( (I90 I91) I97) + +

two tokens are OR'ed, their result OR'ed with the last token

⇐

[parenthesis are not part of program, they indicate grouping only]

I/O Functions include: INput, OUTput, SET, CLeaR, ARM, DRoP and TRiP (KON may also be considered

as a numerical input). Logical operators include: AND, OR, XOR, NOT, POSitive and NEGative. Arithmetic Functions include: ADD, SUBtract, MULtiply, DIVide, MODulus, EQUality, GReaTer than,

LESs than, SELect, KON (numeric constant). Navigational/Editing functions are also included in the I/O programming menus: ←, → (cursor move),

ENTer (line ENTer [on 5/5] and value ENTer), UNDO, DELete, BAcKSPace, BAcK (1 menu position), MORe (menu screens), BAcK (leave edit w/o save).

On the LCD screen, the line (rung) number always appears above the token string for which the line has been constructed.

001: ⇐ the first line of the I/O program, the line number part [token string] ⇐ the first line of the I/O program, the token string part 002: ⇐ the second line of the I/O program, the line number part [token string] ⇐ the second line of the I/O program, the token string part 003: ⇐ the third line of the I/O program, the line number part END ⇐ the third line of the I/O program, the token string part

The shortest possible (though not useful) I/O program:

[has 1 line, line is not a screen line but a program line]

001: END

The following is an I/O program that inputs a user programmable front panel key and outputs the logical state of the input to a user programmable front panel LED. The ID numbers specify the rightmost key and LED. The TRIP function is used as an output; therefore the output will be pulsed. (Function types will be described in section 5X.) With this I/O program running, a press of the rightmost user key will result in the momentary (~1 second) illumination of the rightmost user LED. [An I/O program is running when the menu key run is selected from the choice pair RUN / STOP.] The duration is based on the speed at which the lines of the I/O program are processed (by an I/O program "clock" [approximately 1 second]).

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001: I71 T67 002: END

Starting with the above I/O program, the TRIP function is replaced with the OUTPUT function, and the Boolean NOT operator is inserted between the Input and the Output tokens. With this I/O program running, the LED is immediately illuminated. Pressing the rightmost key causes the rightmost LED to extinguish. The key is considered a logical False (low) when not pressed. The logical False (low) is converted to a logical True (high) by the Boolean NOT operator which is in turn sent to the LED output thus illuminating it. Pressing the key is considered a logical True (high). The logical True (high) is converted to a logical False (low) by the Boolean NOT operator which is in turn sent to the LED output thus extinguishing it.

001: I71 ! O67 002: END

The following is an I/O program that uses elements of the previous two programs to demonstrate the difference between the Trip and Output functions. Again, the I/O program inputs a user programmable front panel key and outputs the logical state of the input to a user programmable front panel LED. The Trip function will be pulsed whereas the Output function is not. If the 70 key is pressed and held, the 66 LED is illuminated for about a second, it must be released and pressed again to illuminate the 66 LED once more. If the 65 key is pressed and held, the 65 LED is illuminated for at least as long as the 65 key is held.

001:

Front Panel Leds >

I70 T66 Trip 002: I69 O65 Output

Front Panel Keys >

KEY

003: END

The following program provides indications of 2 Stopped Mode conditions. The first should be activated upon pressing the front panel STOP key (leftmost LED). The second LED is illuminated when a process stops due to failed crystal when running a deposition (LED 2

from the left). Please note that once the leftmost LED is illuminated, it will not be off until the deposition process is run again. The next LED will not be off until the deposition process is run again with the crystal replaced and re-verified (menu invoked

at the 2

press of the STATUS Key). Input 73 is not a simple Boolean value as was 71 in the above example but a scalar numeric value. In the first case (line 001), the Stopped Mode (73) is input and compared to the constant numeric value of 4 by the EQUality operator. If the input is equal to the value of 4 then it will be passed on to the Output at 64 as a Boolean True. If it is not equal to 4, then it will be passed on to the Output at 64 as a Boolean False. The LED will, in turn, indicate the result. Line 002 is similar except that the input is checked against the constant numeric value of 2 and the result is output to a different LED.

001: I73 #4 = O64 ⇐ inputs status of Stopped Mode from Front Panel. When true, LED = on 002: I73 #2 = O65 ⇐ inputs status of Stopped Mode-Crystal Bad. When true, LED = on 003: END

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Note: If these entries are added to the above examples in one program (by using higher rung #s), an error message will be

displayed: ERROR: 065 PHASE ERROR OK. This indicates that the 065 output has already been used and the

Model 880 software will not allow the rung to be entered as it is. If multiple sources could use the same output, the effect

would be difficult to trace back to all of the causes. The preferred way is to use intermediate elements to combine logic

before the single output. As programs are developed, editing over existing lines with the intent of complete replacement is

possible but there may be outputs used on lines beyond current edit line that may prevent the entry. Delete entire lines by

using the higher level menu key "DELete" to avoid this problem.

The following I/O program activates relay 2 (if relay card is installed in slot 2) when leftmost user programmable front panel key is pressed (relay activation can be heard).

001: I68 O9 ⇐ inputs status of leftmost user key, outputs to Relay 2 002: END

The following I/O program uses a modulo 100 counter (ID 401) to activate user programmable LEDs on the front panel. Starting with line (rung) 001, when leftmost user programmable front panel key is pressed, the counter is advanced on the positive edge (function type set). Line (rung) 002 inputs the value of the counter and compares this to the constant #0. The logical result of this compare (if it's equal or not) produces a True/False value output. This logic value is output to the rightmost front panel LED. If the logical value is true, this LED will be illuminated. Line (rung) 003 inputs the value of the counter, compares this to the constant #1, if it's equal (401 contents = 1) the result will be True. Whatever the result, this logic value is output to the next front panel LED[66]. If the logical value is true, the LED will be illuminated. Line (rung) 004 inputs the value of the counter, compares this to the constant #2, if it's equal (401 contents = 2) the result will be True. Whatever the result, this logic value is output to the next front panel LED[65]. If the logical value is true, the LED will be illuminated. Line (rung) 005 inputs the value of the counter, compares this to the constant #3, if it's equal (401 contents = 3) the result will be True. Whatever the result, this logic value is output to the leftmost front panel LED[64]. If the logical value is true, the LED will be illuminated. Line (rung) 006 inputs the value of the counter, compares this to the constant #6, if it's equal (401 contents = 6) the result will be True. If the result is True, the contents of address 401 is cleared (set to zero). If the result is False, the Clear is not performed and the contents of address 401 is not changed. The Model 880 schedules the entire I/O program to run every 100ms. Extremes of bandwidth availability, program length, line length and complication may limit this. There is space enough in each memory (A and B) for a 1000 tokens (2 kbytes each). As the leftmost user programmable key is repeatedly pressed, the user programmable front panel LEDs illuminate one at a time starting with the rightmost LED, proceeding to the leftmost with each key press. Two key presses after the leftmost LED is illuminated (and extinguished), the count gets cleared and the sequence cycles through again. Since this is a longer I/O program, now is a good time to discuss the program checksum. When the above program is entered correctly, the checksum should be A04241 (that is, if it's in the 'A' memory [the MEMORY key of the I/O programming menu will be described in Section 5X]). There are 2 nonvolatile memory areas in which I/O programs can be constructed and reside. One memory area is called 'A' and the other is called 'B'. Only one memory area can be run / edited at a time. By means of a menu key labeled SWAP, one memory is placed in the active edit/run position while the other memory is placed into the unused state. The checksum should be B04241 if it's in the 'B' memory.

Stopping and restarting the I/O program does not clear the counter value (I/O menu: RUN/STOP selections). Switching to the alternate memory and back again (from A to B to A or from B to A to B) will reinitialize the I/O program.

An alternate for line 001 that will automatically advance the counter once a second (see table

5.XX, ID # 224) is: I224 S401 [w/ program ID = A05027]. In cases where the count may have changed by the time a line is encountered and evaluated (and would need to wait for the counter to cycle around through the maximum count and return to the checked value), the greater than would ensure an immediate function as in: I401 #5 > C401.

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001: I68 S401 ⇐

inputs status of leftmost user key, outputs to counter on positive edge (Set to increment counter)

002: I401 #0 = O67 ⇐

inputs value of counter location, outputs logical evaluation of count (=0?) to rightmost LED

003: I401 #1 = O66 ⇐

inputs value of counter location, outputs logical evaluation of numeric count (=1?) to next LED

004: I401 #2 = O65 ⇐

inputs value of counter location, outputs logical evaluation of numeric count (=2?) to next LED

005: I401 #3 = O64 ⇐

inputs value of counter location, outputs logical evaluation of count (=3?) to leftmost LED

006: I401 #6 = C401 ⇐

inputs value of counter location, outputs logical evaluation of count clearing counter when true

007: END

As can be seen by the above program, the counter at address location 401 can be used as an input or an output. The counter can contain a number from 0 to 99. In line 001, it is used as an ouput (set) access point to advance the count (+1) of this specific counter. When the count increments, the result of some relational evaluation of the sequential count at the 401 address will be a logic value. In these example cases, evaluating true is based on that count value and to what it is compared by the equals function. The count that is needed (to trigger some process element) is selected by comparing it with the needed constant value to make the selection. For example, to count 50 things using the first Counter (see table X5.6), input the logic value from count address location 400, and evaluate it using some combination of arithmetic or logical elements.

Some ways to count 50 things...

To do the same with the 8

Counter: I407.

I400 #50 = [contents = 50?] I400 #49 > [contents > 49?] I400 #50 < ! [[contents < 50] Not ]

Modulo 100 counter addresses (address 401 is used as an example):

400

401

402

Contents of 401 is incremented from zero with a press of the 68 key (on Positive edge)

Set is used to increment the couter. When content value equals zero, the result of line 2 is True. Whenever the value contents equals zero, a logical True is what will be output to the LED 67.

Next Key press increments counter value +1. When 401 content value equals one, the result of line 3 is True.

Whenever the value contents equals one, a logical True is what will be output to the LED 66.

Next Key press increments counter value +1. When 401 content value equals two, the result of line 4 is True.

Whenever the value contents equals two, a logical True is what will be output to the LED 65.

etc.

Key presses increment counter value +1. When 401 content value equals six, the result of line 6 is True.

Whenever the value contents equals six, a logical True will effect a clear of 401 contents (to zero).

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403

404

405

406

407

408

409

Model 880 DEPOSITION CONTROLLER

How to Develop I/O Programs:

This discussion may seem like a lot to absorb for unknown benefits. However, this short introduction is needed to provide the user with the general I/O programming capabilities of the Model 880. Once this is known, the system user need only run (or setup) their process until specific needs become apparent. With a specific need in mind, a perusal of the Event and State ID List (Table x5.3) will match your need to one or more of the many possible solutions within the expansive repertoire of the Model 880. There has also been provided some example I/O programming segments with accompanying explanations in section x5. These can be used to construct larger programs that fulfill the overall process goal. Included with the Model 880 is a CD containing communications programs that allow the construction of I/O programs on a P.C. Writing I/O programs in this way is further enhanced as comments can be added using a comma as a delimiter and not having to use line numbers. The Windows® program running on the P.C. will strip the comma and all that follows on each line and add the line numbers as the I/O program is downloaded into the Model 880. I/O programs constructed on the Model 880 may also be uploaded to a P.C. using the same communication program. The following is an example of such a program constructed on a P.C. and from the P.C. view (this example [w/ checksum of 41779] is repeated with an explanation in a later chapter).

I73 #2 = S8, Stopped Xtal bad sets relay 1 slot 2. I228 C8, Begin Job/Film Event, clears relay 1 slot 2. I79 #1 = O9, Source 1 shutter connects to relay 2 slot 2. I81 #2 & O10, Sensor 2 shutter connects to relay 3 slot 2. I221 S11, Setpoint thickness trigger sets relay 4 slot 2. I228 C11, Begin Job/Film Event, clears relay 4 slot 2. I0 T216, Input 1 slot 1 is start unconditional.

I0 T202, I1 T200, Input 2 slot 1 is stop. I2 T217, Input 3 slot 1 is final thickness trigger input. I3 T219, Input 4 slot 1 is zero substrate thickness trigger. I68 O64, Input function key 1 to front panel LED 1.

.running a deposition

test mode (introduce concept of, defer desc., user can test drive w/o danger) run time mode: (concept of, text details only, implementation/screens deferred) manual mode: (concept of, text details only, implementation/screens deferred) non-sequencing mode (concept of, text details only, implementation/screens deferred) deposition cycle (text 2.11) product description (ch 2): front panel desc. (2.1: last 2/3rds) run time screen desc (2.3) main menu desc (2.4) navigating thru menus (2.2) other main menu options (2.9).

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SECTION 3.0

Menu Programming and Operation Details

Overview

To reiterate, the Model 880 is an extremely flexible and versatile deposition process controller. Through its soft key menus on the LCD display screen it can be configured to do almost any deposition process and conform to almost all system requirements. (Soft key refers to the LCD overlay touch keys whose definition, at any point, is software dependent.) It would be advantageous, while reading this manual, to take an Model 880 without add the AC power cord and switch the Model 880 to the power on position. With the unit unconnected from the system and powered-on, try (as far as possible) what is being read from this manual using the Model 880 hardware. The RunTime screen will always appear at power up after a correct initialization. Pressing the fixed front panel MENU key while the RunTime screen is displayed, provides access to these menus. The programming menus, which concern the deposition process, are the FILM parameters and the PROCESS listing. Film parameter menus along with an associated source sensor map contain material and source dependent parameters. Parameters for 99 material/source combinations can be stored in the Model 880. In the Model 880 these 99 films can be arranged to form a process of up to 99 layers, with each layer having an independent final thickness. Nine different processes can be stored. Only one film within one process can be actively controlling at a given time (non-active sources can be maintained at non-zero levels). The STATUS key returns the RunTime screen from any menu screen. In addition, the STATUS key provides detailed source information in two screens when pressed with the RunTime screen displayed. The unit utilizes the extremely sensitive and time proven 6 MHz quartz crystal as the sensor device. The Model 880 can operate from 90VAC to 264VAC (50-60Hz,

rms@230VAC

). Units are shipped from the factory with a 120V nominal line voltage cordset. Before

1.4A rms@120VAC, 0.7A

attempting to operate the unit with other than this cordset (voltages beyond the 120V nominal range), proper IEC-320 cordset must be selected as appropriate for the line voltage and mating receptacle configuration. See section 4.XX.

Deposition Programming

The Model 880 is a Deposition Rate Controller with LCD/LED displays. It uses keys along with menus for programming. Programming choices are defined or valid ranges are given. Invalid entries are ignored. There are three general categories of menu operations performed on the Model 880 that can be classified as programming of the instrument. There are a few interdependencies that cross group lines.

1) Deposition Programming 2) Input/Output Programming 3) System Configuration Programming

The I/O and System Configuration programming generally occur only at the initial installation or when the coating system is physically altered. The first part of Section's Group 3.XX of the manual describes the Deposition Programming and general operation of the Model 880. The later part of this section's group covers system configuration. If the Model 880 arrives installed in a system, Section 3.XX may be the only section of the manual that is required to be read. Section 4.XX covers the physical installation of the sensor and unit . Section 5.XX of this manual describes the operation and use of the programmable I/O which allows the Model 880 to be easily interfaced to most systems.

All of these programming functions are performed through the front panel keys of the Model 880 or alternately through one of the computer interfaces described in Section Group 6.XX Software controlled touch key areas on the LCD display are shown below. If anything is unclear, return to section group 2.XX.

connections,

LCD display has a 12 X 4 key touch panel overlay.

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Model 880 Front Panel

There are several areas of interest on the Front Panel. These are illustrated in Fig. 3.1.

Fixed Keys: STOP, START, MANUAL, ZERO, MENU, STATUS

STOP

START

RATE-A/SEC POWER-% THICKNESS-KA

MANUAL

CONTROL

ZERO

MODEL 880

DEPOSITION CONTROLLER

STATUS

Figure- 3.1: Model 880 Front Panel

pendant jack

and Key Descriptions

(manual mode)

LED displays (3 sections)

LCD Display/Touch Screen

Fixed USER programmable software controlled keys (4) and yellow LED indicators (4). Software control is accomplished by user entered I/O programming.

Fixed Keys and Software Controlled Keys (Touch Screen)

The software controlled touch keys and the fixed MENU key are used for programming entries, numeric and otherwise, and to navigate through the programming menus of the Model 880. When the Model 880 is initially turned on or generally when it is in operation, the display on the screen will be similar to the display shown in Figure 3.1. This is called the RunTime screen. It shows most of the vital parameters of the deposition process and is described more fully in Section x2.3. When the fixed MENU key is pressed the unit enters its programming menu tree. The touch keys select the menus and/or program the parameters. When the RunTime screen is displayed, some touch keys are active such as the area containing the text "L/Q". Pressing this area on the RunTime screen brings forth sequential text for the various control loop quality factors (crystal stability modes) (see Section. x2.10). This allows selection of the alternate modes (1-4). Forcing a sample, if crystal sample and hold is implemented, can also be selected by pressing the text "SMPL" (see Section. x2.10).

Typical Runtime screen.

The fixed STATUS key returns the Run Time Screen from any menu screen, when the Run Time screen is displayed, the STATUS key brings forth 2 consecutive screens: the first showing source control output/ pocket/ power and the next sensor channel contribution and status before returning to the RunTime screen.

To reiterate, the fixed front panel STATUS key is a multifunction key. The different navigational functions are based on the screen (or category of screen) that is displayed when the STATUS key is

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pressed. The following illustrates the 4 possibilities. Three are part of a sequence that begins with the RunTime screen and returns to the RunTime screen.

RunTime Screen

STATUS key pressed

1st (detailed) STATUS Screen

STATUS key pressed

2nd (detailed) STATUS Screen

3 Part Circular Sequence

2nd (detailed) STATUS Screen

STATUS key pressed

RunTime Screen

Any Menu Programming Screen

STATUS key pressed

RunTime Screen

The following 2 LCD screen depictions show the second and third parts of the above 3 part sequence. The following 2 screens will be called the 1

STATUS screen and the 2nd STATUS screen respectively.

1st STATUS screen

press of STATUS key from Runtime screen brings forth this screen.

2nd STATUS screen

press of STATUS key from Runtime screen brings forth this screen.

The following shows a RunTime screen that was put into manual mode by pressing the fixed front panel MANUAL key while running a deposition cycle. The text MANUAL appears on the screen in place of the text messages: rise 1, soak 1, rise 2, soak 2, deposit, etc.

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If manual mode is entered while in the rise, soak or deposit phases of a deposition, the following arrow key additions will appear on the 1

STATUS screen. They can be pressed to change the power% value. The Up arrow increases power. The Down arrow decreases power. If the pendant is connected, pendant arrow keys can be used in conjunction with the LCD arrow keys. If an LCD arrow key and a pendant arrow key are held depressed simultaneously, the last key pressed and held gets the attention.

pressing the fixed front panel MANUAL key while in rise, soak or deposit phases of a deposition.]

[Manual mode can be entered by

The ZERO POWER key is used to zero the power on non-active source outputs only. It has no effect on the active source output. Pressing the key (box) labeled ZERO POWER brings forth a key to the right of it that can have 3 possibilities (w/ 1 sensor card): ZERO CHannel 1, ZERO CHannel 2 and ZERO ALL. After the

key in the sequence, the area to the right of the zero power key reverts to blank. The ZERO POWER

3 key is used to select the desired function and the key to the right, which indicates the function, is pressed to make the selection. If more sensor cards are installed and they are ON (in SYS CONFIG menu), pressing the key (box) labeled ZERO POWER brings forth the key to the right with up to 9 possibilities (w/ 4 sensor cards): ZERO CHannel 1 through ZERO CHannel 8 and ZERO ALL. Again, after the ZERO ALL key in the sequence, the area to the right of the zero power key reverts to blank.

The ZERO THICK key is used for diagnostics and tooling set up only. It has no effect on the deposition thickness as seen on the LED display. What is zeroed is the raw value that comes from the sensor card[s]. For either FORCE FAIL or ZERO THICK selector keys, the selections appear to the right in the form of a key, that when pressed, will effect the named channel[s] with that function. Also, in either case, and depending upon how many sensor cards are installed and ON (in SYS CONFIG menu), pressing the key labeled FORCE FAIL or ZERO THICK brings forth the key to the right. The ZERO THICK key yields up to 9 possibilities (w/ 4 sensor cards): ZERO CHannel 1 through ZERO CHannel 8 and ZERO ALL and FAIL CHannel 1 through FAIL CHannel 8, FAIL ALL and RE-VERIFY (for FORCE FAIL key). The FORCE FAIL key yields up to 10 possibilities (w/ 4 sensor cards): FAIL CHannel 1 through FAIL CHannel 8, FAIL ALL and RE-VERIFY. The FORCE FAIL function can fail any crystal, including the active crystal[s]. When a crystal is failed, the system will look for a backup crystal or crystals. To re-

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evaluate/reinstate a failed crystal sensor, by force fail key or otherwise, the RE-VERIFY key is used. The RE-VERIFY key checks all potentially active crystals and re-verifies their status as good or bad. This is useful when a nearly loaded crystal is replaced as in the following example scenario.

Starting with 3 crystal sensors mounted in a chamber, each having external electrical connections and oscillators in place, one crystal sensor is connected to sensor channel 1, and one crystal sensor is connected to sensor channel 2. If channel 2 is programmed as its backup, automatic switching to the second crystal sensor on the second channel is accomplished when the crystal sensor on channel 1 is force failed. Replacing the broken/loaded crystal on the first channel (with the 3rd unconnected crystal sensor) and re-verifying allows the first channel to be used again. This example, meant as glimpse into some possibilities, presents only the effected topics here but there are other elements such as shutters, thickness values, etc. to be considered.

An example of a force fail selection appearing to the right.

An example of a zero thick selection appearing to the right.

An example of the 1

STATUS screen during a deposition when not in manual mode. Note the absence of

arrow keys.

An example of the 2

STATUS screen during a deposition when not in manual mode. The MORe key

reveals channels 5 through 8.

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The general function of the selector/result/select keys is illustrated below.

STATUS screen has only 1 selector.)

Selector A.

press here to scroll through selections shown at right.

Selector B.

press here to scroll through selections shown at right.

All Selections appear here. Press here to accept selection.

_____________________________________________________________________

Fixed Keys: Start and Stop Keys

The following 2 fixed keys are used to start and stop a deposition run. STOP -The fixed STOP key always terminates the automatic operation of the Model 880 and brings the source control voltage to 0 volts (0% Power). The STOP key is always active.

START - The fixed START key in the Model 880 is multifunctional. It is used to Reset and recover from abnormal Stop conditions (max. power conditions, sensor failure or manual stop button pushes) along with STARTing or proceeding through the multi-film process sequencing. When the START key is pushed a menu which defines all the functions of the START key is displayed. The START key is active during Run Time screen only. See Figure 3.2 for start menu, which appears in what is typically the graph display area. The START menu is automatically canceled after 15 seconds without user activity.

Figure- 3.2: Start Key Menu.

Note

SEQ

[Non-

uencing configuration: the boxes now containing “PROC 1: ABRT” and “LAYER #” in Fig. 3.3 will not exist. There will not be a

START key menu. See Non-

SEQ

uencing Section 2.20.]

When the START menu is displayed, press the text box required to select the desired operation of the start function. Not all selections on this menu are valid at all times. Whether a selection is valid depends on the state of the Model 880. For example, when the unit is first turned on or has experienced an abnormal stop the Model 880 is in an error state. The START key is first used to reset the error condition (RESET/START PROC). This brings the unit to a Process Resting state, at this point the operator has the option to restart the process from the beginning of the current film (RESTART FILM); to restart the process at the next layer (NEXT LAYER); or to reset the process to the beginning layer by pushing a START followed by pressing RESET/START PROC. Once the process is reset to its beginning (which is indicated by Layer = '#') the process can be started by pushing the START key followed by pressing RESET/START PROC. Take note of the changing PROC 1: xxxx messages as the start menu is used. The BREAK WAIT is valid when the layer sequencing has encountered a WAIT in its process layer list in the Process menu. (See Section 2.6). Under this condition pushing BREAK WAIT releases the wait and begins the sequence step. The wait can also be released via I/O or computer interface (see sections 5 & 6).

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Flow chart depicting the steps of a START process.

VERIFY XTAL

WAIT CHECK

RESET/START PROC

LAYER = #

ERROR

BUSY Proc

1st RESET/START

PROC

STOP

REST

2nd RESET/START PROC

First press of START key + RESET/START PROC key: to

Second press of START key + RESET/START PROC key: to

Third press of START key + RESET/START PROC key: to

REST

location.

STOP

location.

VERIFY CRYSTAL

location.

This sequence was presented to help provide an understanding of a start. Other sequences are possible.

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Fixed Key: Zero Key - Active during run time screen only.

ZERO - This fixed key zeros the thickness number used and displayed by the Model 880. Pushing the ZERO key stores a new zero reference for the sensing crystal. Any mass from previously deposited materials is subtracted from the new thickness calculations. Zero thick on 2 zero the calculated thickness, but is used as a setup/diagnostic to zero the value from the sensor card.

Fixed Key: Manual Key

MANUAL - Used to enable/disable the manual control of power. (See Section x2.8) This fixed key toggles the use of the manual power pendent. When in manual phase, the Automatic rate control of the Model 880 is inactive, the control voltage to the deposition source can be increased, decreased or set to ‘0’ (STOP) with the pendent buttons. Pressing the pendent up and down buttons simultaneously will zero the control voltage without aborting the run. The MANUAL key is only active after a film has been started and during Run Time screen and other screens available through the STATUS key only. When you leave MANUAL power control by pressing the MANUAL key a second time, the Model 880 goes to the Deposit phase of the film program without zeroing the thickness reading (see Section x2.8). The pendent STOP button is functional only in the MANUAL mode.

SECTION 3.1

NAVIGATING THROUGH Model 880 MENUS

STATUS key press does not

Menu Tree

An overview of the main programming menus and screens is shown in Figure 3.3. The keys to navigate from menu to menu are shown in screenlike boxes with arrows to a general function category. [These

boxes are not meant to be true LCD depictions.] For example, to display the Main Menu while on the Run Time screen, the fixed front panel MENU key is pressed, to display the Review Film Menu while on

the Main menu screen, the Review Film key is pressed. Refer to Figure 3.3. on the next page.

In the next section, the RunTime Screen and the information and data that appears on it will be described. The STATUS key returns the Run Time screen from any programming menu location (1 press). When the RunTime screen is displayed, pressing the STATUS key will invoke two other consecutive screens as described in the previous section.

The Sequencing mode is fully described in the menu tree whereas only the non-sequencing mode differences are shown.

Please note that the text boxes of the following menu tree are not meant to be true LCD screen depictions.

key

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Model 880 MENU TREE (process sequencing)

(non-SEQ differences only)

0.0 A/S 0.0 %PWR 0.000 KA

Review FILM# REVIEW SS MAP #

SERVICE Menu

NEXT ACTIVE FILM EXECUTIVE MENU

Active Film: (See Sect. 2.20 ) Set active film to user specified film number.

Review Film#: (See Sect. 2.4,2.5 ) Review or edit film parameters of user s

ecified film.

Active Process: (See Sect. 2.19, 2.7 ) Set active process to user specified process.

Communications setup:

(See Sect. 6.5 ) User specifies: Com I/O lock code, keybd. beep, RS232 baud and protocol.

[boxes not meant to be true LCD depictions]

I/O setup; Operations:

(See sects. 5.9, 5.20 ) User selects operations mode: run or stop or bak.

I/O setup; memory:

(See sects. 5.10, 5.20 )

Figure- 3.4: Menu Tree

User selects memory mode: save, swap or bak.

on Run Time Screen (press fixed MENU key).

0.0 A/S 0.0 %PWR 0.000 KA

Review FILM# Review SS Map #

SERVICE Menu

SQ/non-SQ. (S2.4) factory settings. purge stored data. TEST mode. (S2.7)

Communications setup

I/O Setup

I/O setup:

(See Sect. 5.1 ) View, scroll I/O rungs. View operations status (run/stop) and I.D.#. Further select: Operations, Edit rung (line) and Memory.

System configuration

Process accounting: (See Sect. 2.18 ) View process history accounting screen.

Review PROCESSES NEXT ACTIVE PROCESS

EXECUTIVE MENU

Review Processes: (See Sect. 2.5,2.6 ) Review or edit process to be s

ecified by user.

OPT/INF MAIN / EXECUTIVE MENU

Process accounting

I/O setup; Edit:

(See sects. 5.11, 5.12, 5.13, and

5.20 ) User edits selected line/rung using arrow keys or GOTO. Insert / delete rung line, and change rung.

I/O setup; Change:

Build/edit rung with command and logical operator keys. Edit with undo, delete last character.

Only the main menu screen has these RunTime values displayed at the top. All other menu screens have path information on the 1

Press fixed STATUS key for Run Time Screen

Review SS Map:

Source Sensor (See Sect. X)

Opt/Inf: (See Sect.2.21) Reports on installed internal and external options and reports info about versions, serial #s, checksums, build codes, error codes

System configuration:

(See Sect. 2.14, 2.13 ) User specifies: shutter delay enable, 2 sensor enable, rate sample enable, LCD contrast, password lock#, run#, recorder fnct, clock t&d, deployment of sensor cards and I/O cards.

etc.

line.

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SECTION 3.2

SEE SECTION x2.21 for proper initialization sequence.

When the instrument powers up and has fully initialized, you are presented with the RunTime Screen. When this display is present, you can start, stop, and view the operation of the Model 880. Figures

3.1 and 3.5, show typical RunTime Screens. While the RunTime screen is displayed, the 2 of the STATUS key will bring forth 2 screens showing detailed sensor channel information and live keys.

Note

→ The fixed STOP Key is active on any screen.

There are several areas of interest on the RunTime screen.

RunTime Display Description Area # 1: Rate, Power and Thickness

1. Rate, Power, and Thickness Values. These are the current values of the three most important process data and their units. These values are displayed on the LED displays in large format. They are also shown on the first line of the main menu screen. If you choose to review any data items on other screens, this information will always be present on the LED displays. When max power is reached: the text PWR% will alternate with [MAX!] (on MAIN menu) and the LED display section showing power will blink.

2. Current Phase. This tells you what phase or stage of your process that you are currently in. After you power up the Model 880 or you return from a power loss, it is in a STOPPED RESET state. Other main states are MANUAL, plus all of the phases associated with source conditioning and DEPOSITION.

3. Data Area. This shows a real-time view of your deposition process (an X/Y graph). Both the vertical and horizontal scale of this display area can be changed to make this display the most meaningful for your process. The data shown in this area during the DEPOSIT phase can be one of three types; rate deviation, rate, or power. The data type and scale are programmable as film parameters. This area is overwritten by the START menu options when the fixed start key is pressed (shown below).

RunTime Screen

and 3rd press

Area # 2: Current Phase

Area # 3: Data Area

SECTION 3.XX

Figure- 3.5: RunTime Screen

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Area # 4: Miscellaneous

4. Miscellaneous Area. This has several pieces of data in it. These are:

FILM - Shows film program that you are currently running (1 of 99).

SRC # - Indicates the Source Sensor Analog Output voltage channel. An SRC of zero indicates that a source analog output control voltage has been assigned to a source sensor card that is not present, not working, etc.

XTAL 1 to 8 - Shows which sensors are currently active or standby. Active crystals are

indicated by their numeric name. Standby crystals are indicated by their numeric name alternating on the screen with a dash at a ~1Hz. rate. Percentage of potential crystal life left can be viewed by pressing the STATUS key twice. When a new sensing crystal is installed it will indicate 99 to 95% of crystal life remaining. A sensing crystal will show 0% remaining when the mass deposited on the surface of the crystal has caused the sensing crystal to shift by 1 MHz. About 500,000 KÅ of aluminum causes a frequency shift of 1 MHz. Depending on the material being deposited, a sensor may fail considerably before showing 0% remaining life. This is due mainly to the high film stress generated by some materials or other characteristics of the deposition material which causes the sensing crystal and circuit to cease oscillation prior to the full MHz shift generally possible with deposition materials such as Al, or Cu . MAP # - Each sensor has various parameters. A map is an associative list of these source sensors with their parameters along with source power parameters, tooling, etc. This list can structure the sequence of which crystals start active, which are backups, etc. A unique map can be identified by its map number. Only one map can be active at a time. A Map is used when it is called out by the film parameter SS Map Select.

RUN TIME - Shows minutes and seconds into the film. PHASE TIME - Shows minutes and seconds remaining in the current timed phase, or

elapsed for indefinite duration phases (such as DEPOSIT). RUN # - A user programmable number that increments at the start of every Process.

Area # 5: Process Status Line

5. Process Status Line - These two in-line text boxes running horizontally in the top left section of the screen indicate: the process being used, the current layer number, and the process status when the unit is configured for SEQuencing (non-SEQuencing configuration blanks these 3 boxes). The process status has one of the five following messages displayed:

a) PROCESS STOP - This message is displayed when the last layer of the process has been

completed or the process has been reset (by using the (START-Reset/Start Proc) from a PROCESS RESTING. A process must be in this state to start a process from layer 1.

b) PROCESS WAITING- This message displayed when a WAIT has been encountered in

the layer sequence. A (START-Break Wait) or a programmed I/O input can release the wait. (START-Reset/Start Proc) takes the process to RESTING.

c) PROCESS RESTING - This message occurs during the reset (START- Reset/Start Proc)

of a PROCESS ERROR or PROCESS WAIT condition. While in this condition the user can reset (START-Reset/Start Proc) to PROCESS STOP, Restart the current layer (START-Restart Film) or start the next layer (START-Next Layer). These options allow the user to select the error recovery method.

d) PROCESS BUSY - This message occurs during an operation phase of a deposition

process.

e) ERROR IN RECIPE - This message occurs when a process is started which has no layer

information programmed.

f) ERROR-FILM ABORT - This message occurs when an abnormal event occurs during

the running of a film. Anything which stops or aborts a film program causes this message to occur (i.e. crystal failure, max. power abort, Front Panel STOP key, power loss, etc.). A reset (START- Reset/Start Proc) takes the process to the PROCESS RESTING phase where the user can select the path of error recovery desired.

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SECTION 3.3

From the RunTime Mode, you navigate into other parts of the Model 880 by using the fixed MENU key. After pressing it, the Main Menu screen will appear and the display will look like Figure 3.6.

Pressing the fixed STATUS key while navigating menus (including the MAIN MENU) restores the Run Time screen. Pressing the BYE key while navigating on other menus (highest level) will restore the MAIN MENU.

Figure- 3.6: Main Menu Screen.

Main Menu Description

Main Menu Selections

There are several options at this point. The keys that are used here are:

Choice: REVIEW FILM#

REVIEW FILM# -Goes into the review/edit film mode to the last film selected. Note that the film

selected for view/edit can be different than the active film. Pressing the Review Film key invokes

the 1

of the following 2 displays. Note on this display that film number 21 is specified. To select a different film for review/edit, press the GO2 FLM (go to film) key. When the numeric entry screen appears, enter the film number to edit or review by pressing the digit key[s] that represent the desired number (tens value first followed by units value or just the units value) and press ENTer to accept or BAcK to discard. See Section 3.4 for a detailed explanation of the review/edit capabilities. The current active film is also allowed for review/edit selection.

Main menu

REVIEW SS MAP - Allows viewing/editing of Source Sensor Maps. Goes into the review mode to the

last map selected. Note that the selected map can be different than the active map. Pressing the Review SS MAP key invokes the 1 number 2 is specified. To select a different Map for review/edit, press the GO2 MAP (go to map) key. When the numeric entry screen appears, enter the map number to edit or review by pressing the digit key[s] that represent the desired number (tens value first followed by units value or just the units value) and press ENTer to accept or BAcK to discard. See Section x3.4x for a detailed explanation of the review/edit capabilities. The current active map is also allowed for review/edit selection.

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of the following 2 displays. Note on this display that map

Choice: REVIEW SS MAP

Model 880 DEPOSITION CONTROLLER

Choice: Next Process

NEXT ACTIVE PROCESS - This key choice allows the user to change the active process. There is

storage in the Model 880 for 9 different processes. (See Sections x.x, x.x and x.x) (figure x.x). The box containing the text NEXT PROCESS is a key used to indirectly input a new active process number. Pressing the NEXT PROCESS key invokes the following display. Note on the main menu display above that the active process number specified is 1. To select a different active process, press the NEXT PROCESS key. When the numeric entry screen appears, enter the active process number needed by pressing the digit key that represents the desired number and press ENTer to accept or BAcK to discard. The number last entered immediately becomes the specified active process. At times during certain phases of normal product use, the number digit will be temporarily replaced with the text NA (not applicable) indicating that it would not be desirable to change the ACTIVE PROCESS at a time when it is running. Also, NA appears when beginning with a memory purged unit. The active process is the process that will begin with the next start. To change an active process, the Model 880 must be reset to the PROCESS STOP condition (Any error condition must be cleared and no process can be running). See Sections 3.6-x3.7x for full description.

Choice: Review Processes

REVIEW PROCESSES - This choice allows the product user to review and edit the process layer list

(recipe) of the selected process (1 through 9). Select the process number by pressing the REVIEW PROCESSES key (See Sections x.x and x.x). The process that was last edited is shown in the menu path (top line). associated digit key (see section 3.x). Pressing the REVIEW PROCESSES key invokes the 1

of the following 2 displays. To select a process for edit/review, press the GO2 PRC key. When the numeric entry screen appears, enter the number of the process to be edited/reviewed by pressing the digit key that represents the desired number and press ENTer to accept or BAcK to discard. Note that the process you are editing does not have to be the active process. The active process is indicated by a "+" on the menu path line of the REVIEW PROCESS menu.

Choice: Executive Menu

EXECUTIVE MENU - Changes how the Model 880 is configured (communications, system configuration

and I/O setups) and allows access to Process Accounting screen and OPTions/INFo. (See Section

x.x). A menu as shown in Figure 3.16 will appear. These are mainly system operations that

involve setups/configurations that are infrequently used. I/O setup is described in Section x, Communications Setup and computer interfacing in Section x, Process Accounting in Section x.x, and System Configuration/Communications setup in Section x.x. OPTions/INFo is described in section x.x.

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Figure- 3.7: Executive Menu.

fixed STATUS Key

Fixed STATUS key removes Main Menu (or any other menu screen) and returns the RunTime Screen. A second and third press of the STATUS key after the Runtime screen appears will invoke detailed power and crystal information by channel.

Service Menu

SERVICE menu – This choice brings up the Service MENU which provides selection of : SEQ vs. non-

SEQ product function, return to factory settings, purge ALL stored data, and test mode entry.

Keys toggle functions and key labels alternate between TEST on / TEST off, SEQ / non-SEQ, etc. To initiate any of the Service MENU personalities, any or all four of the choices are toggled on or off as needed and the Accept/Restart Product key is pressed. The product will restart with the selected personalities in effect. Only the user selected SEQ/non-SEQ personality will remain in effect upon subsequent product power cycles. AS IS, PURGED and FACTORY is a three way select. Optional Memory Card key allows saving or restoring all parameters, films, processes, and I/O programs in memory locations A and B to the memory card. ARM RESET allows restarting with same features selected. The service menu was not included for the casual user. If you are uncertain about these functions and their effects, do not proceed. See sections: x.x (factory settings), x.x (test mode) and x.x (password purge).

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SECTION 3.4

Films and Processes

STC - 2002 / SQ Film Process Data

FILM # 99 PARAMETERS

FILM # 8 PARAMETERS

FILM # 7 PARAMETERS

FILM # 6 PARAMETERS

FILM # 5 PARAMETERS

FILM # 4 PARAMETERS

FILM # 3 PARAMETERS

FILM # 2 PARAMETERS

FILM # 1 PARAMETERS

FILM RECIPE LIBRARY

PROCESS LIST # 1

Step Mode Film# Thickness KA

1 AUTO 3 0.030 2 AUTO 2 0.400 3 WAIT 3 0.600 4 AUTO 2 0.250

UP TO

PROCESS RECIPE LIBRARY

PROCESS LIST # 9

PROCESS LIST # 8

PROCESS LIST # 7

PROCESS LIST # 6

PROCESS LIST # 5

PROCESS LIST # 4

PROCESS LIST # 3

PROCESS LIST # 2

END

RUNTIME

INFORMATION

ACTIVE PROCESS 1-9

USE FILM #

LAYER #

Figure- 3.8: Film & Process Storage.

Films & Processes Description

A deposition process is controlled by the parameters programmed by the user in the film parameter and process sequencing lists. Figure 3.8, illustrates the film parameter and process data storage and the relationship to the RunTime mode. The figure shows a process (Process 1) sequencing through the layers (currently on layer 1) using the parameters of Film 3. The ending thickness for this layer is determined by the final thickness for step 1 (layer 1) programmed in the process list. Each of the nine processes can have a different set or arrangement of any or all of the nine films. A process list can repetitively use a film program for different layers as in the case for layer 1 & 3 of Process 1. The ending thickness for each layer is independent of the film parameters and determined by the value programmed in the process list.

SECTION 3.5

Film Edit/Review Mode

Editing Films

The Model 880 has storage for 99 sets of film parameters (99 films). Depending on the system and hardware configurations, up to 42 parameters per film can be stored. On the MAIN MENU, the Review Film key provides entry into the menu area containing all film edit/review menus. An unprogrammed unit will start with film 1 selected. When is the REVIEW FILM key pressed, this brings into view the film parameter list which was last selected as the film to review or edit on the last numeric entry screen. The film number that is currently being viewed and can potentially be edited, is indicated on the top line of the display (menu path/status/ID line) in the form EDIT x, where x is the film now open for viewing/editing. If the film number that is displayed when is the REVIEW FILM key pressed is not the film needed for viewing/editing, press the GO2 FLM (go to film) key to bring forth the numeric entry screen. This is simply a vehicle used to go to the film number as indicated by the entered number. This may or may not be the active film, that is, the current film that is in use. The Active Film number value can be seen, as was the edit film number, on the top line of the REVIEW FILM menu screen in the form ACTIVE x, where x is the film now active for a starting process. The Active Film number value is also indicated on the RunTIme screen [ FILM __ ]. To edit or review a different film while on the REVIEW FILMS menu , press the GO2 FLM key again and change digit[s] as required. The alternate film number will be selected whereupon editing/reviewing can commence on the subsequent menu screens as well as on the REVIEW FILM menu. The GO2 FLM key thus provides lateral navigation from film to film on that menu level. To reiterate,

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Selection of the edit film is indicated at this menu level by the text edit appearing in the path line. The value following the text edit is the current film for review/edit. Selection of the active film is indicated at this menu level by the text active appearing near the end of the path line. The value following the text active is the current active film. [note: active film selection will be discussed in detail later. An active film is

selected by a process step in sequencing mode and by the NEXT FILM key in non-sequencing mode.]

there are up to 42 parameters that can be programmed. The film parameters are in the format of a long list, where you have a viewing window which shows 6 parameters at a time and a cursor (*) within the viewing window that moves from line to line. The cursor indicates the parameter that is currently changeable. The UP↑ and DOWN↓ keys are used to scroll the screen and select the different parameters. When the cursor is forced beyond the limit of the 6 line window, the page scrolls up/down by five lines plus the line on which the cursor was last. The BYE key returns the MAIN menu screen.

Changing Parameters

For each film

Figure- 3.9: Review Film Menu.

The EDIT (EDT) key brings forth the REVIEW FILM edit screen where the parameter selected by the cursor is shown by itself. The specific parameter name, its current value, unit value name and value range appear. On this menu level, scrolling with the arrow keys traverses the list one parameter at a time. If a screen is password locked, a "LOCK CODE NEEDED" message screen will insert itself when an EDT entry is attempted (passwords will be discussed shortly).

Figure- 3.10: REVIEW FILM edit screen

Pressing the Change (CHG) key invokes a numeric keypad on which direct number or representative numeric values are entered. Scrolling at this hierarchical menu level traverses the list one parameter at a time with one notable exception which is the non-presentation of the list items prefixed with the "-".

REVIEW FILM change (CHG) entry screen

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Pressing the BAK key on the above menus cancels the current menu (or keypad) and moves back to the previous menu. Pressing the BAK key will also discard any edit value while pressing the ENTER (ENT) key accepts the entered edit value. Numeric keys can be pressed indefinitely and are shifted in from the right until either BAK or ENT are pressed. The entered value appears under the parameter name. In the above example, the value "1.00" is replaced by zeroes and the first number pressed becomes the rightmost digit (in the following case, a "1" was pressed). Also, as the first digit is pressed, a clear (CLR) key appears. Pressing the clear (CLR) key restores the original value. The fixed STATUS key returns the Run Time screen from any menu point.

REVIEW FILM change (CHG) entry screen after first entry

The next digit that is pressed appears in the rightmost position while the previous digit is shifted to the left. In other words, as key digits are pressed the numeric representations are built from the right and the entries can continue indefinitely (to make corrections). INVALID will appear if a numerical representation is incorrect. If an illegal value is ENTered, an error message will appear on the bottom of the screen: "ERROR: VALUE OUT OF RANGE". The legal range of values message is presented, as previously described, as a help guide.

When an out of range value has been entered for a parameter, the ERROR message can be cleared by pressing the OK key. Clear also restores the original parameter value. With the error message cleared, value entry can be resumed (or BAK can be used to abandon the change).

MENU/STATUS Key Descriptions

In order to get back to the RunTime Mode at any time, press the fixed STATUS key (a discussion about other menu options is found in Section x3.9?x). Because the most frequent menu activity is to change a parameter and see its effect on the RunTime Screen, pressing the fixed MENU and STATUS keys will become almost automatic to get back and forth between these two screens. Notice on returning back to the Review Films Screen that the same parameter appears that was last viewed. As you proceed through the parameter list, you may notice that some lines begin with a dash (-), this means that the parameter is dependent upon another parameter that is itself not used or not enabled. The parameters following RATE RAMP MODE are an example of this. Find this parameter in the Review Mode and set it to OFF. The 3 following parameters are all associated with RATE RAMP MODE. If it is set to OFF, then these 3 will have a "-" indicator. Rate Ramp is used to change the desired rate to a new setting during deposition. As the parameter list is traversed, note that the cursor will skip over the unused parameters (marked with a “-“) but they can still be viewed. These "-" prefixed parameters will not be presented if scrolling is accomplished when the single parameter screens are viewed

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These 3 parameters are dependent on the RATE RAMP MODE

arameter.

System Related Parameters

The number of film parameters displayed will not vary but the number of accessible elements may vary with the way the Model 880 is configured [e.g. SEQ / NON-SEQ mode differences]. The Model 880

determines that if it is configured for certain types of hardware ( example) there are parameters that do not make any sense. The Model 880 provides conflict information and only allows running with correct parameters depending on its configuration.

General description

To reiterate, there are 42 programmable parameters. There may be less parameters available at times due to parameter mode choices which preclude the availability of other related dependent parameters. The fixed MENU key is pressed to show the MAIN MENU. The REVIEW FILM key is pressed to enter the Review(/Edit) Films menu. Different films can be viewed/edited by pressing the GO2 FLM key. In Sequencing mode, the active film is set by the film value on the programmed lines (steps) of a process program. In non-sequencing mode, the active film is set by pressing the NEXT FILM key on the main menu.

The first line of the Review(/Edit) Films menu shows the menu path to the current menu in

hierarchical form. On the same line, the film now being viewed is named after the text "EDIT". Likewise, the film that is now active is named after the text "ACTIVE". The first parameter on the list will appear first (density) as this is a factory default setting. Thereafter, the last viewed parameter on which the cursor is left when exiting the menu, returns with the same cursor placement along with its adjacent list parameters as the point of interest when returning to the list. If the fixed STATUS key were pressed to leave the REVIEW FILM menu while individual parameters were being scrolled, a return to the REVIEW FILM menu would return the parameter list not the individual parameter view. The following shows the result of entering a number (123.456) into the temporary workspace. This was accomplished by pressing "1", "2", "3", "4", "5" and then "6". If a mistake were made, the sequence could begin again at any point in the sequence.

After the complete desired number is entered, pressing ENT will transfer the value from the temporary workspace to the saved parameter list value. Range boundaries will be enforced by software when not already enforced by available digits. Pressing the BAK or CLR keys will result in the abandonment of any values entered in the current temporary workspace. Clear maintains the screen and resets the workspace to zeroes. BAK returns the parameter list screen.

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Note

→ X12345 CHECKSUM

NOTE: observe the changing checksum of the parameter list as new parameter values are ENTered (designated by the X prefix). This checksum is an aid to identifying a parameter list (all parameter values together) as unique. This allows tracking of film numbers to obtain specific results and repeatability. When system problems occur, film numbers can be checked for integrity by use of this checksum. See section x3.19x, Checksum Validation.

For parameters whose values are not numeric, numerically represented values are selected per their descriptions on the help line. In the following example, there are three choices to be made: RATE, RATE DEVIATION, and POWER. The RATE choice is made by pressing the "1" key. The RATE DEVIATION choice is made by pressing the "2" key. The POWER (PWR) choice is made by pressing the "3" key.

Scrolling up beyond the first parameter wraps to the end of the parameter list. Similarly, scrolling down beyond the end of the parameter list wraps to the beginning of the parameter list. The beginning and end of the parameter list is demarcated with a list line having the following " - - - -". When starting from the main REVIEW FILM MENU screen (see Figure x3.9), pressing the EDiT key may generate the following screen if the PASSWORD LOCK# under the SYSTEM CONFIG. key on the EXECUTIVE menu has a value other than zero (a non-zero value enables the password and is itself the password). The EXECUTIVE menu key is on the MAIN menu.

Using PASSWORD LOCK, enter up to a four digit lock code as the password. Enter a zero to disable password entry. Unfortunately, when a password is in force, the password must be used to change it to zero, that is, to disable it.

MENU KEY DEFINITIONS

BYE: pressing BYE cancels the review film process and returns to the MAIN MENU screen. The fixed STATUS key returns the RunTime screen.

BAK: cancels the current menu level and returns the previous menu and/or screen. GO2 FLM: changes review/edit from current film to named film number via the numeric keypad.

SEQ/non-SEQ product differences (see sections x2.1 and x.x for additional information):

SQ: active film# is always selected by a process. non-SQ: active film# is selected in place of active process# (MAIN menu key label change is apparent

along with non-appearance of the REVIEW PROCESSES key and the associated digit key [see below]).

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The following reiterates information providing a starting place for parameter values when the Model 880 is received directly from the factory or the unit has had the memory purged or set to factory defaults. Section X.X describes the Service menu and memory configuration. Section x.x (end of next section) will also discuss how memory is changed. While viewing the LCD screen, some parameters are not accessible until other related parameters are in an appropriate state. These parameters are thus dependent upon the condition of other parameters. A list of these dependent parameters is given along with their controlling parameter (see section 1.7).

Film Parameter: Source Sensor Map Select

Source Sensor Map Select is a film parameter and as such a sensor map may be thought of as an extension of the film parameters. Each film calls out a specific map. Many different films can reuse a single map. Maps define many elements including the analog control output voltage and associated parameters, crystal activity and associated parameters, sensor channel activity and associated parameters.

To Program a sensor map, start with the film parameter Source Sensor Map Select. Select the map number that will be edited (or has been edited). Press ENTer to accept the value or BAcK to discard the enrty, if any. This will select a map as the active map when the calling film is itself active and running. See section

2.1. The MAP# in use is shown on the Runtime screen along with the calling Film.

Film Parameter

From the Main Menu, select the source sensor map named by the film parameter. This is initiated by pressing the REVIEW S S MAP key. See section 1.8 for all Map parameters.

Result of pressing the

To select a different map than the current map, press the used to enter the needed map number to be edited. There are 30 maps available.

Review SS MAP

As was the case with Film parameters, there are also Map parameters that are dependent upon other parameters for accessibility. Note the "-" Prefix.

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key Result of pressing the

GO2 MAP

Result of pressing GO2 MAP key.

key. A numeric entry screen will appear that is

EDiT

key

Model 880 DEPOSITION CONTROLLER

NON-SEQUENCING MODE:

SELECTING THE ACTIVE FILM

NON-SEQUENCING MODE Runtime screen.

NON-SEQUENCING MODE Main Menu (note missing REVIEW PROCESSES and change from NEXT PROCESS to NEXT FILM). (See section 2.1 for description of modes.)

To select the next active film in non-sequencing mode, begin by pressing the NEXT FILM key on the Main Menu above. This action will result in the following numeric entry screen. The entry made here will become the active film following the next START sequence. The BAcK key returns to the Main Menu without change. The ENTer key accepts the entry and returns to the Main Menu. The numeric entry, if made, will show itself within the "NEXT FILM" key legend and on the runtime screen following the text "NEXT FILM:" (see above).

When the running, this will become the active film and appear after the text "FILM".

Film Parameter values after memory purge:

[non-SEQ adds "Final Thick Limit=0.0 KÅ"]

See Section 1.8 for Programmable Parameter Lists and Programmable Parameter Dependency Lists. See Section 2.2 for Menu Parameter Values & Programming After Memory Purge and ...After Factory Restored Memory.

Film parameter difference (from purge) with a factory restore:

max power limit set to 50% (purge = 0%).

Related System Configuration values after memory purge:

LCD Contrast Medium Password Lock # 0 Run number 0  Recorder Functions Rate Recorder Output Channel 1  Need Source Sensor Card X Off  I/O Slot X Type Unused

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Related System Config differences (from purge) with factory restore has:

recorder function set to show POWER.

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____________________________________________________________________ Parameter DENSITY

Units gm/CC

Material Density

The Density parameter refers to the measured material in gm/CC. This constant is normally the bulk material value but is sometimes different due to deposition and film growth conditions. This value is utilized in the thickness equation to convert measured mass to a thickness value. See Table x4.1 in Section x4.3 for an extensive value list. See Section x4.2 for calibration information. ____________________________________________________________________ Parameter Z FACTOR Z FACTOR VALUE RANGE IS 0.100 - 9.999 Units None

Material Z-Factor

The Z-Factor parameter refers to the elastic properties of the measured material. This value is utilized in the thickness equation to match the acoustical properties of the film being measured to the acoustic properties of the base quartz material of the sensor crystal. This correction is necessary to insure accurate measurements when sensor crystal shifts of greater than 10% are realized. See Table 4.1 for an extensive material value list. See Section 4.2 for calibration information. ____________________________________________________________________ Parameter SETPOINT THK LIM THICKNESS VALUE RANGE IS 0 - 999.999 KA Units Kilo Angstroms

Setpoint Thickness Limit

The SETPOINT THICKNESS parameter is used to provide a comparison point for the Model 880 Thickness Setpoint Event. This event will be triggered whenever the thickness display equals or exceeds the setpoint value. The final or end thickness of a layer is layer dependent and is determined by the value programmed in the process, it should not be confused with this parameter which is film associated. ____________________________________________________________________

Parameter Final Thickness Limit (Trigger) non-sequencing only THICKNESS VALUE RANGE IS 0.000 to 999.999 KÅ Units Kilo Angstroms

Final Thickness Limit

The FINAL THICKNESS LIMIT parameter is only present in the non-sequencing mode. It is used to provide an end thickness value whose counterpart in the sequencing mode is the thickness value in a process program. This value determines the end of the deposit for the active film.

____________________________________________________________________ Parameter SETPOINT TIME LIM ELAPSED TIME RANGE IS 0:00 - 99:59 Units Min:Sec

Setpoint Time Limit

The SETPOINT TIME LIMIT parameter is used to provide a comparison point for the Model 880 Timer Setpoint Event status. The timer relay status is set when this time is exceeded. ____________________________________________________________________

Detailed Film Parameter Descriptions

DENSITY VALUE RANGE IS 0.40 - 99.99

Parameter SOAK 1 PWR VALUE

Percentage Value: Range is 0.0 - 100.0 Units Percent

Soak 1 Power Value

This parameter sets the deposition source power value to be used as the first level of soak power in the pre-deposition cycle. This power level will be maintained for the duration of the soak 1 timer. This

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level is typically used to out gas and condition the source material. A value of 0.0% causes the RISE/SOAK 1 phases to be skipped. ____________________________________________________________________ Parameter PWR RAMP 1 TIME Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Ramp Time To Soak 1

This parameter sets the duration of the power ramp from zero power to the power level set by the soak 1 power value parameter. The source is typically heated slowly enough to permit outgassing and melt conditioning without causing actual deposition to take place. _____________________________________________________________________ Parameter PWR SOAK 1 TIME Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Soak 1 Time

This parameter sets the time that the source will remain at the soak 1 power level following the completion of the ramp to this level. ____________________________________________________________________ Soak 2 Power Value Parameter SOAK 2 PWR VALUE Percentage Value; Range is 0.0 - 100.0 Units Percent

This parameter sets the deposition source power value to be used as the second level of soak power in the pre-deposition cycle. This power level will be maintained for the duration of the soak 2 timer. This level is typically used to further out gas and condition the source material and actually begin depositing material at a low rate. A value of 0.0% causes the RISE/SOAK 2 Phases to be skipped. ____________________________________________________________________ Parameter PWR RAMP 2 TIME Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Ramp Time to Soak 2

This parameter sets the duration of the power ramp from the soak 1 power value or the idle power value to the value set by the soak 2 power parameter. The source is typically heated slowly enough to permit further outgassing and melt conditioning and actual deposition may begin during this time period. ____________________________________________________________________ Parameter PWR SOAK 2 TIME Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Soak 2 Time

This parameter sets the time that the source will remain at the soak 2 power level following the completion of the ramp to this level. At the end of this time the deposition phase begins. An external input can be programmed using the programmable I/O to hold the film at soak until released (Soak Hold). ____________________________________________________________________ Parameter SOAK 3 PWR VALUE (IDLE PWR) Percentage Value; Range is 0.0 - 100.0 Units Percent

Idle Power Value

This parameter determines the final (idle) power setting at the completion of the entire deposition profile. If this power level is zero, a START command will begin a new power profile at rise 1, an idle power setting other than zero will cause the power profile to begin at rise 2 after a START. _____________________________________________________________________ Parameter PWR RAMP 3 TIME (IDLE RAMP TIME) Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Idle Ramp Time

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This parameter sets the duration of the power ramp from the power level at the time that final thickness was reached until the power reaches the value set by the soak 3 power value parameter. ____________________________________________________________________ Parameter DEPOSIT RATE Rate Value; Range is 0.0 - 999.9

Units Å/s (10-8 cm/s)

Deposition Rate

This parameter determines the material deposition rate that the closed loop control system will try to establish and maintain at the time that closed loop operation begins. ____________________________________________________________________ Parameter RATE RAMP MODE On/Off Units None

Enabling Rate Ramp Mode

This parameter is an enable/disable switch for the rate ramp function and associated film parameters. When set to Off the programming cursor window will skip over the associated parameters. When set to On all associated parameters are accessible and it will be possible to alter the deposition control rate profile during closed loop control. [The following 3 parameters are dependent upon this parameter.] ____________________________________________________________________ Parameter NEW DEP RATE Rate Value; Range is 0.0 - 999.9 Units Å/s

New Deposition Rate

This parameter sets the new deposition rate value that is to be reached at the end of the rate ramp operation. ____________________________________________________________________ Parameter RATE RAMP TIME Elapsed Time; Range is 0:00 - 99:59 Units Min:Sec

Rate Ramp Time

This parameter sets the duration of the rate ramp. The rate ramp starts at the rate control value at the time that the rate ramp trigger is reached and ends at the value set by the new deposition rate parameter. ____________________________________________________________________ Parameter RATE RAMP TRGR Thickness Value; Range is 0 - 999.999 Units Kilo Angstroms

Rate Ramp Trigger Point Thickness

This parameter sets the trigger point for a rate ramp to begin during the deposit phase. ____________________________________________________________________ Parameter CTL LOOP -P- Ctrl Loop Gain; Range is 1 - 9999 Units None

Control Loop Gain Term

This parameter sets the closed loop rate control proportional gain. ____________________________________________________________________ Parameter CTL LOOP -I- Control Loop Time Constant; 0.0 - 99.9 Units Seconds

Control Loop Integral Term

This parameter sets the closed loop rate control integral term time constant. ____________________________________________________________________ Parameter CTL LOOP -D- Control Loop Time Constant; 0.0 - 99.9 Units Seconds

Control Loop Differential Term

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This parameter sets the closed loop rate control derivative term time constant. ____________________________________________________________________ Parameter MAX POWER LIMIT Percentage Value; Range is 0.0 - 100.0 Units Percent

Max. Power Limit

This parameter sets the absolute maximum power level that will be allowed to occur at any time from the instrument (for the current film in use). Specifically, this parameter selects the maximum percent of power that will be allowed out of the controlled power supply (named by the SOURCE OUTPUT CHANNEL parameter). This parameter and the Map parameter Source Max Power are redundant but not without good reason. When a process is running, the lesser value of these two parameters will be used as the limiting value. Maps are intended to be more closely associated with the source supply in terms of their definition at setup. One map may be called by many Films and, as a consequence, a Film may inadvertently set the power at a level beyond what is desirable for the power supply, wiring, etc. This is a fail safe way to limit a power supply configuration in a place close to the hardware, that is, in a map configuration. ____________________________________________________________________ Parameter ABORT MAX PWR SW On/Off Value Units None

Abort On Max. Power Switch

This parameter is a switch value. When set to Off it has no effect on the deposition sequence and the programming data window will not access the associated max. power dwell parameter. When set to On a maximum power condition will be allowed for the time duration set by the now accessible max. power dwell parameter and then the Model 880 will abort the deposition sequence and power will be set to zero. ____________________________________________________________________ Parameter MAX POWER DWELL Elapsed Time; Range is 0:0 - 99:59 Units Min:Sec

Max. Power Dwell

This parameter is associated with the max. power abort switch parameter and sets the allowable duration of a maximum power condition before an abort will occur. ____________________________________________________________________

Shutter Delay (has 2 dependent parameters)

This operating mode, if enabled, allows precise rate control to be established before substrates are exposed. For this capability the sensor must be located on the source side of the substrate shutter. A sensor shutter may also be used if desired.

Parameter SHTR DELAY MODE On/Off Units None

Enabling Shutter Delay Mode

This switch type parameter will allow the shutter delay parameters to become active and the mode functional on an individual film basis. If set to Off, the parameter window cursor will not access the associated parameters. If set to On, the delayed shutter operation will be performed as specified by the following parameters. [The following 2 parameters are dependent upon this parameter.] ____________________________________________________________________ Parameter SHTR DLY TIMEOUT Process Timer; Range 0:01 - 99:59 Units Min:Sec

Shutter Delay Timeout

This parameter sets a time limit for the delayed shutter operation to be completed. The time period begins at the beginning of the shutter delay cycle. The sensor is exposed to evaporant with the substrates remaining shielded. When rate control is established to the programmed accuracy, three things happen.

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The substrate shutter is opened, accumulated thickness set to zero, and the programmed deposition profile is then started. If the specified rate control accuracy cannot be met within this time limit, the deposition will be aborted. ____________________________________________________________________ Parameter SHTR DLY QUALITY Range is 1 - 50 Units Percent

Shutter Delay Quality

This parameter sets the rate control accuracy that must be established for a period of five seconds in order to complete the delayed shutter sequence. The maximum accuracy settable is 1 percent of the desired setpoint. However, this is internally limited to 1 angstrom per second for noise and resolution restrictions. ____________________________________________________________________

Rate Sampling (has 4 dependent parameters)

This operating mode, when enabled, allows the user to expose the crystal sensor for short periods of time to the evaporant stream, establish rate control, and then shutter the sensor maintaining the power setting established during exposure. For relatively stable deposition sources or systems that must maintain vacuum integrity for long periods of time, crystal sensor life can be greatly extended. Two sampling modes are available. One has the exposure time strictly time controlled, the other will expose the sensor only long enough to establish the required accuracy. The exposure period for either mode is also triggerable externally.

Sample and Hold

Figure- 3.11: Rate Sampling, Sample and Hold Operation.

Parameter RATE SAMPLING Rate Sample choices (1 of 3): OFF TIMED MODE INTELLIGENT MODE Units None

Enabling Rate Sampling

This switch type parameter will allow the rate sampling parameters to become active and the mode functional on an individual film basis. If set to Off the parameter window cursor will not access the associated parameters. If Timed Mode is selected, the crystal sensor will be exposed to evaporant for the time specified by the sample dwell parameter, and will sample at the interval specified by the sample interval parameter. If Intelligent Mode is selected, then the duration of the sample will only be long enough to establish the desired accuracy. [The following 4 parameters are dependent upon this parameter.] ____________________________________________________________________ Parameter RATE SAMPLE

On/Off Value: Off or On

Units On/Off

Enabling Rate Sampling

This parameter assumes there is a shuttered head connected and that Rate Sampling can be used if the film parameters are programmed for such. (Without the shutter, deposit would be continuous and negate the advantage of this feature.) This feature extends the apparent life of the sensing crystal. It is used for thick coatings or in systems where it is not possible to break vacuum to change the sensing crystal. Depending on various factors in your particular system, the apparent crystal life can be extended up to 50

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times by using the rate sampling feature of the Model 880. Five film parameters which pertain to this feature are described in (Section 2.13). ____________________________________________________________________ Parameter SAMPLE INTERVAL Process Time; Range is 0:01 - 99:59 Units Min:Sec

Sample Interval Time

For either mode of operation this parameter will select the sampling interval of the sensor. ____________________________________________________________________ Parameter SAMPLE DWELL TIME Process Time; Range is 0:01 - 99:59 Units Min:Sec

Sample Dwell Time

For the Timed Mode selection this parameter sets the duration of sensor exposure. ____________________________________________________________________ Parameter SAMPLE QUALITY Quality Value; Range is 1 - 50 Units Percent

Sample Quality

In the Intelligent Mode this parameter sets the control quality required to terminate the exposure period of the sensor. ____________________________________________________________________ Parameter SAMPLE ALARM TIME Process Time; Range is 0:0 - 99:59 Units Min:Sec

Sample Alarm Time

In the Intelligent Mode this parameter sets the maximum allowable time allowed to complete the sensor exposure and control operation. The Model 880 will treat this as a crystal failure when this limit is exceeded. ____________________________________________________________________ Parameter FILM FAIL MODE Meas. Processing: select 1 of 2 choices; Abort If Fail Complete On Time Power Units: None

Enabling Measurement Fail Processing

This parameter allows the user to select the system execution path if it is no longer possible to get reliable measurement information from the sensor system. This is the last resort choice that will be made after all other system configuration options have been exhausted. Choice 1) Abort If Fail, will abort the deposition and set the output power to zero. Choice 2) Complete On Time Power, will set the unit into a time power completion mode. In this mode the last reliable control power level will be maintained and thickness accumulation will occur in a simulated fashion until the final thickness setpoint is reached. Post deposition processing then will occur as programmed. ____________________________________________________________________ Parameter CTL LOOP QUAL L Select Value; Range is 0 - 9 Units None

Control Loop Quality Limit

This parameter is used to set a threshold on acceptable control loop quality. When the threshold is exceeded a sensor fail condition is assumed and the system will process this condition as configured. A programmed value of 0 disables this test. A value of one gives the tightest limits (5%). ____________________________________________________________________

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Parameter XTL STABILITY Select Value; Range 0 - 9 Units None

Crystal Stability Limit

This parameter is used to set a threshold on acceptable sensing crystal performance. When the threshold is exceeded a sensor fail condition is assumed and the system will process this condition as configured. A programmed value of 0 disables this test. A value of one gives the tightest limits. ____________________________________________________________________ Parameter XTAL LIFE BOUNDS Percentage Value; Range is 0.0 - 100.0 Units Percent

Crystal Life Limit

This parameter is used to provide a setpoint on the allowable sensing crystal usage. This setpoint may be utilized through the I/O system as a warning or interlock that sensing crystals need attention. ____________________________________________________________________ The following three parameters are used to select the data type and scale factors for the RunTime screen graphics area. These parameter values are always reinstated when a film is started. ____________________________________________________________________ Parameter PLOT VERT SCALE Vertical Scale; Select Specific Values 1/5/10/50/100 Units Å/s or % Power as selected

Vertical Scale RunTime Display

This parameter sets the vertical scale factor of the graphics display on the RunTime Screen. If Rate deviation is the type of data being displayed, generally setting this value to 10 will give a good display of the deposition control. ____________________________________________________________________ Parameter PLOT HORIZ SCALE Horizontal Samples; Range is 1-600 Units Samples Per Display Point

Horizontal Scale RunTime Display

This parameter sets the horizontal sweep rate of the graphics display on the RunTime screen. Samples are taken at a rate of 4 per second. A programmed value of 1 will display every sample. The X-axis is 200 samples wide on the RunTime display. By increasing the sample number the sweep rate is slowed down. Proper selection of this number allows an entire deposition cycle to be displayed on one sweep of the screen, if desired. ____________________________________________________________________ Parameter DATA PLOT TYPE Initial Plot, Select 1 of 3 choices: Rate Rate Deviation Power Units Å/S or % Power as selected

Data Plot Type

This parameter selects the type of information to be displayed in the graphics area of the RunTime screen. ____________________________________________________________________ Parameter Source Sensor MAP SELECT Select Value; Range is 1 – 30 Units maps

Source Sensor Map Select

This parameter is used to associate a specific sensor map to a specific film. When a film becomes active, it will invoke the map number named by this parameter. The map itself is edited/changed within the REVIEW SS MAP menu. ____________________________________________________________________

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Parameter POCKET SELECT Select Value; Range is 0 – 63 Units Pockets

Pocket Select

This parameter is used to provide pocket information from a specific film in conjunction with the ss map parameter: indexer sync mode. If indexer sync mode is set for either delay or feedback, then following an XTAL verify, the indexer activity will commence before arriving at the RISE1 phase. Either a 1 of N or a binary (3 digit) value issued through output relays by I/O programming will select the correct pocket. If indexer sync mode is set to none, then the POCKET SELECT parameter has no effect. ____________________________________________________________________ Parameter ETCHING MODE Polarity Value: OFF/ON Units None

Etching Mode

This parameter sets the Model 880 for either a deposit mode (positive rate) when set to OFF or an etch mode (negative rate) when set to ON. ____________________________________________________________________

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____________________________________________________________________ Parameter SOURCE FULL POWER Full Scale Volts: [enter representative values 1,2,3 respectively] 2.5, 5, 10 Units Volts

Source full power Control Voltage Scale Select

This scales the control voltage of the Model 880 to match your power supply. Provides versatility to match supplies whose full power settings are one of these 3 selections. This allows 100% power from the Model 880 to be any of 2.5, 5, or 10 volts. (see section 3.9) ____________________________________________________________________ Parameter SOURCE MAX POWER Percentage Value: 0.0 – 100.0% Units power %

Source max power Select

This parameter selects the maximum percent of power that will be allowed out of the controlled power supply (named by the SOURCE OUTPUT CHANNEL parameter). This parameter and the Film parameter Max Power Limit are redundant but not without good reason. When a process is running, the lesser value of these two parameters will be used as the limiting value. Maps are intended to be more closely associated with the source supply in terms of their definition at setup. One map may be called by many Films and, as a consequence, a Film may inadvertently set the power at a level beyond what is desirable for the power supply, wiring, etc. This is a fail safe way to limit a power supply configuration in a place close to the hardware, that is, in a map configuration. ____________________________________________________________________ Parameter SOURCE OUTPUT CHANNEL Analog Output Channel Selection: 1 - 8 Units Channels

Source Output Channel Select

This parameter selects the channel that will be used as the control voltage output, that is the analog output from the Model 880 that controls the power supply that generates the evaporant stream. There are 2 identical analog outputs on each source sensor card with up to four source sensor cards possible. A source output channel (1-8) can be selected for use here and the other source output channel (per card) can be used for the strip chart recorder (defined by a System Configuration parameter: recorder out chnl). If the source output channel parameter and the recorder output channel are set to the same channel, the source output channel will be used and the recorder function will be lost. If this situation should occur, a reboot will be necessary to reassign the recorder output. ____________________________________________________________________ Parameter MASTER TOOLING TOOLING VALUE RANGE IS 10.0 - 400.0 Units Percent

Master Tooling

The TOOLING parameter is used as a correction factor to compensate for geometric position differences between the location of the sensor and the target substrate. Each of the 8 possible sensors has its own tooling factor. If no correction is required, both the substrate and sensor see the material source in an identical manner and the Tooling Parameter is set to 100%. Generally, if the sensor is farther from the source than the substrate, the tooling will be set to >100%. If the sensor is closer to the source, the tooling will be set to < 100%. Master tooling is used in conjunction with the individual tooling for each channel. The master tooling can be used as a global offset value for individual channel tooling or as a base tooling value upon which individual channel tooling is added. This is a parameter with global scope. ____________________________________________________________________ Parameter MINIMUM START XTALS Minimum Number of Start Crystal Channels: 1 - 8 Units Channels

Detailed Map Parameter Descriptions

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Selecting the minimum number crystal channels with which to start process

This parameter indicates the minimum number of crystals in the starting group when a process is begun. To reiterate, this is a START value. The intent is to provide a qualification minimum for run acceptability. If more than 1, averaging is assumed in conjunction with Channel x Start Mode map parameter programming to more than 1 active sensor. This is a parameter with global scope. ____________________________________________________________________ Parameter MINIMUM BACKUP XTALS Minimum Number of Backup Crystal Channels: 0 - 7 Units Channels

Selecting the minimum number crystal channels for possible use as backup crystals

This parameter indicates the minimum number of crystals to be used as backup crystals. This is a parameter with global scope. ____________________________________________________________________ Parameter MINIMUM ACTIVE XTALS Minimum Number of Active Crystal Channels: 1 - 8 Units Channels

Selecting the minimum number crystal channels that are active

This parameter indicates the minimum number of crystals that will be active when a process is started. The intent is to provide a guard for the minimum constellation of averaging crystal sensors the user decides are necessary. For a process to run, this value cannot be greater than that of the minimum start xtals map parameter value. This is a parameter with global scope. ____________________________________________________________________ Parameter CHANNEL DROP FILTER Channel Drop Filter Mask Status: none / balance Units None

Channel Drop Filter

This parameter enables/disables a filter mask for use during multi-sensor averaging. Each crystal sensor has a unique map parameter group. Programming 2 or more crystal sensor channels as active automatically invokes an averaging mode. Lost channels during averaging are handled by this Channel Drop Filter Mask parameter when enabled. An example of a crystal sensor/channel loss is crystal life failure. This parameter in the BALANCE setting, provides bumpless rate info if, for example, 3 channels are averaged and one channel fails and has no assigned backup crystal sensor/channel for the failing channel. This is done by keeping an historical buffer of the rate info stream for each of the 3 channels in this example case. When a channel fails (without backup), the historical rate info from each of the 3 channels is used to produce a composite multiplier based on the 3 channels when they were all working that will be used to fill in for the missing channel's contribution. This is, of course, a simplification for the purposes of discussion. When averaging, the preferred setting should be BALANCE. The setting of NONE allows the composite rate to jump when a channel is lost (without a backup). This parameter has no effect unless in averaging mode. This is a parameter with global scope. ____________________________________________________________________ Parameter INDEXER SYNCHRONIZATION MODE Indexer Synchronization: NONE, DELAY, FEEDBACK Units None

Indexer Synchronization Mode

This parameter is used to provide pocket information in conjunction with the Film parameters: Pocket Select and SS MAP SELECT. If indexer sync mode is set for either delay or feedback, then following an XTAL verify, the indexer activity will commence before arriving at the RISE1 phase. Either a 1 of N or a binary (3 digit) value issued through output relays by I/O programming will select the correct pocket. If indexer sync mode is set to none, then the POCKET SELECT parameter has no effect. This is a parameter with global scope. ____________________________________________________________________ Parameter INDEXER SYNCHRONIZATION TIME Indexer Synchronization Time: 2 – 999 seconds Units Seconds:

Indexer Synchronization Time

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This parameter provides the time value when the map parameter Indexer Synchronization Mode is set to DELAY. The indexer allowed a predetermined pocket search time. This is a parameter with global scope.??? ____________________________________________________________________ Parameter CHANNEL x START MODE [where x = any of 1 through 8] Channel Start Mode: Off, Active, Standby Units None

Channel x Start Mode

This indicates which of the crystal sensor channels will be active when a deposition run starts. Unless the crystal fails, or an I/O program processing event causes a configuration change, this crystal state will remain in effect throughout the process. ____________________________________________________________________ Parameter CHANNEL x FAIL ACTION [where x = any of 1 through 8] Channel Fail Action: None, Abort Film Units None

Channel x Fail Action

This indicates what will occur when a channel fails for whatever reason. NONE provides no fail action. Abort Film provides a film abort when a failure occurs on this channel. ____________________________________________________________________ Parameter CHANNEL x BACKUP LIST [where x = any of 1 through 8] Channel Backup List: Z – ZZZZZZZZ (1 item list to 8 item list)

[where Z = 1 to 8 (in each position w/o redundancies, list extends to 0-8 for a 1 item list)]

Units None

Channel x Fail Action

This parameter provides a list of potential backup crystal sensors should this channel fail for whatever reason. The crystal sensor channel switching is automatic when there is a sensor failure. Thickness and rate control is maintained during the switching operation. Also, for those multiple material depositions requiring extreme accuracy of measurement that mixing of materials on one sensor could degrade, it is possible to use a specific sensor for each material type. Example backup lists: comments: 0 (zero) no backups are defined 3 channel 3 is the one and only backup channel 237 backup channels are 2 then 3 then 7 2345678 backup channels are sequentially: 2345678 235637 incorrect list: 3 is repeated ____________________________________________________________________ Parameter CHANNEL x TOOLING [where x = any of 1 through 8] Tooling Value: RANGE IS 10.0 - 400.0 Units Percent

Channel x Tooling

This TOOLING parameter is used in conjunction with the MASTER TOOLING parameter as a correction factor to compensate for geometric position differences between the location of the sensor and the target substrate. All of the 8 possible sensors have their own tooling factor. If no correction is required, both the substrate and sensor see the material source in an identical manner and the Tooling Parameter is set to 100%. Generally, if the sensor is farther from the source than the substrate, the tooling will be set to >100%. If the sensor is closer to the source, the tooling will be set to < 100%. See Section x4.2 for calibration information. ____________________________________________________________________ Parameter CHANNEL x WEIGHT [where x = any of 1 through 8] Weight Value: RANGE IS 10.0 - 400.0 Units Percent

Channel x Weight

This parameter is used during a multi-sensor averaging process. Programming 2 or more crystal sensor channels as active automatically invokes an averaging mode. Weight provides the user with a method to assign each of the sensors a contribution percentage of the total used to determine thickness. When not in averaging mode, this parameter has no effect.

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____________________________________________________________________

There are programmable Film and Map parameters that are only viable for particular hardware configurations. Unless the hardware that is needed to support the programmable parameters is physically installed and configured appropriately (on the SYSTEM CONFIGURATION menu), the process will not run and will display various error messages indicating the cause. The SYSTEM CONFIGURATION menu is accessed through the EXECUTIVE menu which is located on the MAIN menu. ____________________________________________________________________ Examples: Repaired crystal channels (or channels failed by user programming) must be RE-VERIFY'd on the 2

STATUS screen before they can be recognized as good again.

If the typical PROCess X: status message does not change when the START key is pressed, check for

"STOP: INValid XXX " message and check the OPT/INF menu, page 2 for cards not installed

that are enabled in software (MIA). AC Power must be recycled OFFON to re-sync.

If SRC is zero, this is an indication that a source analog output control voltage has been assigned to a

source sensor card that is not present, not working, etc. Remember that the System Configuration parameters: Need Source/Sensor Card X and I/O Slot X type are only evaluated on power up or on reset. Check the OPTions/INFo menu, page 2 and 3 to see what is currently in effect. To work correctly, the S/S x: line should end with OK. If it ends with EMPTY, the card is not present or not communicating. If the line ends with INCOMPATable!, the software versions in at least some of the various PCB cards is not compatible- check for field changed PCB cards. If the line ends with MIA, that sensor card is configured but is not physically present. [See OPTions/INFo menu]

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Review or Edit Processes

Figure- 3.12: Main Process Review/Edit Screen.

SECTION 3.6

The Model 880 has the capability of sequencing through many layers of film. The sequential arrangement of films is called a process. The Model 880 has the capability of storing 9 processes. The maximum length of a single process is 99 layers. The total number of layers in use by the 9 processes is 250 layers. The following are equivalent: a layer, a process step, a line of process programming. To operate the Model 880, a process of at least one layer started with no layer information programmed, the message ERROR IN RECIPE will occur in the process status area of the screen. This also assumes the Model 880 is in Sequencing mode ( See section 2.1). [Memory Purge reduces all process programming to a 1 line process with an END command as the only function (program starts and ends itself). Factory defaulted memory yields 9 process programs each with an auto mode, a film number = process number, a thickness = 0.1 multiplied by the process number.] To edit or review a process, press the REVIEW PROCESSES key on the Main Menu. The screen appears initially as shown in Figure 3.11. Other sub-menu keys appear as needed. See below for a detailed description of menu keys. To select a different process for review/edit, press the GO2 PRC (go to process) key. This will bring forth a numeric entry screen whose number entry will select the needed process by its number name. Each process step (also called layer) has 3 programmable parameters associated with it and is a line in the process program. The steps range from 1 to 99. The programmable parameters available are: Start Mode, Film#, and Thickness. Pressing the EDT (EDIT) key invokes the Process Edit screen that allows line insertion, deletion and passage into the change/edit menu to modify and build steps using the CHG (change) key as the entry point. The change/edit menu provides entry of Mode, Film number and Thickness. The two editing selections that are available for inserting or deleting layers are intended for use in an existing process or a new process. When the mode key is pressed, there are five selections as to how the starting of the film will be handled by the layer sequencing of the Model 880. The mode choices appear as key legends after the mode key is pressed. The five choices for modes which control the layer starting are: END, AUTO, WAIT, SKIP, STOP. By selecting the appropriate start mode, a layer can be sequenced automatically or designed to wait for a Front Panel break-wait or remote break-wait to proceed to the next step or layer. Generally, in an actual process, only the first three start modes would be used.

Editing Processes

must be programmed. If a process is

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Process Start Mode Edit Key Descriptions

Mode Choice: End

The End mode would terminate the process. It is always inserted as the last step of a process.

Caution

layers that originally followed will be deleted.

Mode Choice: Auto

If AUTO is programmed to be the layer start mode, then this layer begins immediately upon completion of the previous layer. If layer 1 has AUTO programmed as its start mode then the first appropriate start command generated begins this layer. Key legend is AUT.

Note

Note The unit must be reset of any ERROR conditions, and not in the process RESTING mode but in the PROCESS STOP phase before a start command will be accepted. The fixed START key is also used to reset any process error conditions and initiate a process reset under some conditions. (See Section 3.0, START process)

Mode Choice: Wait

If WAIT is programmed to be the layer start mode, upon completion of the previous layer, the Model 880 enters a wait state. This is useful when some mechanical event such as rotation of a source pocket, or some process change like gas composition occurs between layers. The appropriate start command (START-Break Wait) breaks the wait state and starts the layer. The break-wait command can be issued from either a Front Panel function, a remote input or through one of the computer interfaces. Key legend is WAI.

Mode Choice: Skip

If SKIP is entered as the start mode, the layer is skipped over (key legend is SKP).

Mode Choice: Stop

If STOP is entered as the start mode, the process will continue until the stop is encountered. The STOP is similar to an END with the exception that if it is installed in the middle of a process list, the steps

following are not erased. The SKIP and STOP mode are normally not used in a process recipe. They can be useful during the development of a process or to recover a process which has been aborted. Key legend is STP.

INSERT and DELETE.

Two list editing choices also become available when the EDT (edit) key is pressed.

Mode Choice: INSERT

INSERT inserts a step in an existing list (key legend is INS) after the line with the cursor. [If END is at line 1, cannot use INSERT. Use MODE to change END to another mode choice and END will be auto advanced to position 2.]

CAUTION

If the END statement is entered in the middle of an existing process, all steps or

SECTION 3.XX

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Model 880 DEPOSITION CONTROLLER

Mode Choice: DELETE

DELETE removes a step from the process program list (key legend is DEL) indicated by the cursor. The mode for a step or layer can be edited while the process is running if the change is not on the active layer or the change does not alter the length of the process list. (END, INSERT, and DELETE generally changes the list length).

FILM# key legend is: FLM.

MODE key legend is: MOD.

THICK key legend is: THK.

ENTER key legend is: ENT.

After the mode is entered, the FILM# key (FLM) can be pressed. (Note that the MODE, FILM# and THICK keys can be pressed in any order.) After pressing the FILM# key, one of the ninety-nine stored films can be selected by pressing the digit key[s] followed by the ENTER key (ENT). This associates a layer or step in a process with a film program. The film program stores the material related parameters and calls out a sensor map that contains source, tooling and crystal related parameters . The same film can be assigned to multiple steps within a process. After entering the film number, the THICK key (THK) can be pressed. The desired final thickness for that layer is entered/edited by pressing the necessary digit keys followed by the ENTer key. The number is built by shifting in digits from right to left and can continue indefinitely until either ENTer or BAK is pressed. This allows entry correction by repeating the number sequence until correct.

While constructing/editing the elements of a line (MODE, FILM#, THICKNESS), an edit line will appear at the bottom of the LCD screen to indicate that an edit is in progress. The edit line consists of a prompt naming the edit type followed by the value being entered. The edit can either be accepted by pressing ENTer or abandoned by pressing BAK.

Additional steps can be added to the process by repeating the above procedure. A step or steps can be added to an existing process by positioning the cursor (>) at the step where the new step will be inserted. The new line will be inserted after the line with the cursor. The former line step occupant and all subsequent line steps are advanced in their list positions as the new step is added. Press the INSert key and then a new step will be inserted. When this is done, the default parameters of SKIP, film 1, and thickness

0.000 are entered for the inserted layer. These can then be edited to the desired values.

In multi-layer deposition the same deposition material and source combination are sometimes used in different film programs. Generally at least two film programs are associated with one material source combination. One of the film programs contains source parameters (rise and soak time and power levels) for the initial conditioning of the source or first layer or material usage, the other film program parameters would be for subsequent layers of the same material.

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">" is cursor.

Model 880 DEPOSITION CONTROLLER

Review / Edit Process Specifics.

The following shows the review processes screen. The top line contains the menu path to the current screen/menu followed by the process# currently being viewed. The Process# is selected by pressing the

GO2 PRC (go to process number) key and the digit key[s] on the subsequent numeric entry screen. A "

appears near the end of the top line (after path information) to indicate when the active process is being viewed. The recipe ID number is also on this line (use to determine process program integrity). The ID is a checksum of the entire program. The ID with only the END at step 01 is 00000. The second line contains the column headers, which remain fixed as the list is scrolled. The angle bracket pointing to Step 01 is the view/edit cursor.

"+" indicates active edit process.

"+" indicates current step is the active step.

BYE: pressing this key causes a return to the MAIN MENU. The fixed STATUS key returns the RunTime screen. GO2 STP: press this key to move cursor/list segment to indicate and display step number entered by numeric keys that appear after GO2 STP is pressed (GOTO Step). GO2 PRC: press this key to bring up a numeric keypad that allows changing the Process number (GOTO PROCESS). Enter PROCESS# and press ENTer to accept or BAK to abandon.

↑: pressing the UP ↑ key moves the edit cursor toward the first of the four list lines currently on the screen. When the edit cursor is on the first list line displayed (somewhere in the middle of a 20 line list, for example) subsequent UP ↑ presses result in moving the line at the top of the displayed section of the list to the last (4

) position of the displayed section. What were the last three list items are no longer seen and three consecutively lower, previously unseen, numbers are now occupying the first three of the four displayed lines. The cursor is always moved to a lesser numbered step number (list line) with each press of the UP ↑ key (except at step 1). When the edit cursor is coincidental with step number 1 and UP ↑ is pressed, no action is taken other than to beep the audio indicator. In other words, the UP/DN keys move the edit cursor up or down on the four list lines displayed and if UP/DN exceeds those list lines shown, the list lines will be advanced or receded by three lines except at the beginning and end of the list lines. ↓ (down): pressing the DN ↓ key moves the edit cursor toward the last of the four list lines currently displayed on the screen. When the edit cursor is on the last list line displayed, subsequent DOWN ↓ presses result in moving the line at the bottom of the displayed section of the list to the top (1 the displayed section. What were the first three list items are no longer seen and three consecutively higher,

SECTION 3.XX

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) position of

Model 880 DEPOSITION CONTROLLER

previously unseen, numbers are now occupying the last three of the four displayed lines. The cursor is always moved to a higher numbered step number (list line) with each press of the DOWN ↓ key (except at the last step). When the edit cursor is coincidental with the last step and DOWN ↓ is pressed, no action is taken other than activation of the beep annunciator. Starting with the cursor at step 01, pressing down ↓ three times moves the edit cursor alone. Scrolling has the same behavior in all places/menu levels.

Pressing the down ↓ key once again causes the four-line window into the list to be shifted ahead by three lines as shown below. The edit cursor moves to the newly appearing, next consecutive list line. At this point, the UP↑ key could be pressed one time and the down ↓ key could be pressed three times with only the edit cursor moving, that is, before the list lines in the four-line window would change.

The following sequence shows the scrolling behavior using the UP ↑ key. Again, scrolling has the same behavior in all places/menu levels.

Press the UP ↑ key three times for the following result.

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Model 880 DEPOSITION CONTROLLER

Press the UP ↑ key one more time for the following.

GO2 STP: pressing the GO2 STP (GOTO STEP) key takes you to the step/line whose number you enter and accept by pressing ENT on the number entry key menu. The following screen is the result of pressing the GO2STP key. If a number is entered that is greater than the last (END) line, the cursor would move to the last (END) line.

The following screen shows the result of pressing the "1" key followed by pressing the "5" key. This value can be accepted by pressing the ENT key, abandoned by pressing the BAK key or continued by pressing more number keys (shifting more digits into the two digit GOTO prompt area at the end of the last line).

the following screen shows the result of pressing GO2STP and entering 15 as the destination (the "1" key, the "5" key and the ENT key)...

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Model 880 DEPOSITION CONTROLLER

When the destination is greater than 2, the line list will appear with the destination as the third line four displayed lines with the edit cursor on this line. This gives a two previous and one succeeding line perspective for reference and relational purposes. Near the end of the list this display preference is not in effect.

Pressing the EDT (edit) key generates the following screen. If a password has been used (a non-zero value), an intermediate password entry screen will appear. See the end of this section for more details.

Process Edit menu

of the

Navigation remains as previously described. Three new edit related choices are now possible: change line (CHG), insert line (INS), and delete line (DEL). DEL deletes the line with cursor. INS inserts a new line after the line with the cursor. The following screens will help describe the change (CHG) line (that is, the edited line elements). BAK (back) always returns to the previous screen, discarding entries, if any were made. Pressing the CHG (change) key produces the next screen. Take note of the current values on the edited line (line with the cursor ">"). This screen is the starting point When a line element is edited(changed), an edit line appears at the bottom of the screen and shows the value in the temporary workspace.

Process Edit/Change menu

SECTION 3.XX

for modification of mode, film# and thickness.

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Pressing the MOD (mode) key brings forth the mode select menu as follows. SKIP is the default mode value used when the INSert key creates a new line.

Process MODE menu

Model 880 DEPOSITION CONTROLLER

Pressing the WAI (wait) key changes the proposed mode value as seen next on the edit line.

Now press ENT (enter) to accept WAIT.

Notice that WAIT replaces SKIP on the edited line. MOD (Mode) could be pressed again or FLM (Film) or THK (thick) could be pressed. The following screen shows the result of pressing the FLM (Film) key.

Enter a "3" for film number 3 by pressing the "3" key. Note change in edit line on the following screen. Up to 2 digits can be entered here as there can be up to 99 films.

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Process FILM# entry

Model 880 DEPOSITION CONTROLLER

Press BAK (back) to abandon FILM# value edit. Press ENT (enter) to accept entered film number value as seen next. Note that the FILM# on the edited line has been displaced by the new value of "3".

Once again, the change screen reappears from which any of the three choices could be made. The next screen depicts the result of pressing the THK (thick) key.

Process Thickness entry menu

Pressing the "1" key and then the "2" key produces the following screen. Numbers can be entered indefinitely until either the BAK or the ENT (enter) key is pressed.

Pressing the ENT (enter) key returns the change screen. Please note that the decimal point is fixed and that leading zeroes are suppressed.

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Model 880 DEPOSITION CONTROLLER

By using the arrow up/down keys, the order of entry could be to change the modes of lines 5, 6 and 7, then change the FILM#s of lines 5, 6, and 7 and then change the thickness of lines 5, 6, and 7. Once in the edit/change mode, different parameters can be changed without leaving the edit mode.

Special Cases

The following screen appears when all of the total unit memory has been used. As the message relates, recipe memory is used in its entirety. Although there can be up to 99 layers (steps) per process recipe and up to 9 recipes, there is not enough unit memory to have 99 layers for each of all nine recipes. Press the OK key to clear the message screen.

The following screen appears when an active process is running and someone is attempting to edit the process while it is running. Press the OK key to clear the message screen.

If the PASSWORD LOCK# under the SYSTEM CONFIG. key on the EXECUTIVE menu has a value other than zero (a non-zero value enables password and is itself the password) the following screen will appear when the EDT (edit) key is pressed. The EXECUTIVE menu key is on the MAIN menu.

Enter the lockcode number value in the same way as previously described for other number entries.

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Model 880 DEPOSITION CONTROLLER

Processes: Factory settings vs. purged settings.

The following example LCD displays show the difference between factory settings and purged settings for PROCESS# 2. The first screen is the factory setting and has, for step 01, MODE=AUTO, FILM#=2, and THICK(KA)=0.200. The second screen is the purged setting and has only the END line.

Typical Factory Setting Purged Setting

Factory (defaulted) Settings table for All Process Numbers:

Proc# 1 Proc#2 Proc#3 Proc# 4 Proc#5 Proc#6 Proc#7 Proc#8 Proc#9

STEP 01 01 01 01 01 01 01 01 01 MODE AUTO AUTO AUTO AUTO AUTO AUTO AUTO AUTO AUTO FILM# 1 2 3 4 5 6 7 8 9 THICK 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900

All factory Processes have END as STEP 02.

To restore factory settings or to purge settings, press the SERVICE key on the MAIN menu. This brings forth the SERVICE menu as shown below.

Please be aware that changing the memory contents by this means changes more than just the process values. See

Caution

section X for a complete description.

Press the AS IS key once for PURGED, twice for FACTORY, thrice to return to AS IS.

[See section x3.21, Check sum validation. See section x7.3, battery and memory loss.]

Press the ACCEPT (/ restart) key to accept the configuration as described by all of the key labels. This will also cause the unit to REBOOT with the new configuration in effect. Please see the section describing the SERVICE menu as there are groups of settings other than those which are PROCESS# related (Film parameters, I/O programs, etc.) that will be included in this configuration. Valuable process programming could be lost. No I/O programs are factory restored because of the danger involved. Purge will, however, clear I/O programs. See section x5.15 (table 5.4) for I/O program entry.

Press BYE to leave the SERVICE menu without accepting anything changed.

If the password is forgotten and programming has not been saved in some other media, call factory to eliminate passwords without purging memory.

SECTION 3.7

Set Active Process

General Description: (See Section moved here2.9 and figure 2.12) To change the active

process (only allowed when the instrument is in IDLE and the LAYER value is "#" indicating an at rest condition [observe the runtime screen]), press the fixed MENU key, which will produce the MAIN menu

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Model 880 DEPOSITION CONTROLLER

screen as shown in the following figure. Next, press the key area that is labeled on the MAIN menu as ‘NEXT PROCESS’ and sometimes referred to as the ‘NEXT ACTIVE PROCESS’ selection. The numeric entry screen will then appear at which time pressing the needed digit will select the next active process. Pressing the numeric digit keys allows any value from ‘1’ through ‘9’ to be entered as the next active process. ENTer accepts the entry, BAK discards the entry, if made, key needs to be pressed. The active process will be the value at which the digit value is left when ENTer is pressed. The next process started will use this process number. Press the fixed STATUS key to return to the Run Time screen. If an attempt to change the active process is made with the instrument in a non-idle condition either a temporary error message will appear saying ; “INHIBITED: UNIT MUST BE IDLED” or the text UNIT BUSY NA will appear in the key instead of NEXT PROCESS. When the text "NA" appears on the key, the product is not allowing the alteration because it would not be desirable to change the process while it is running. The result of pressing the key when UNIT BUSY NA appears will be an acknowledgement beep only. The process must be stopped. See START: Reset/Start Process diagram below.

Press to change ACTIVE Process

SECTION 3.8

Non-Sequencing Differences

Non-sequencing mode does not use processes but treats one of the ninety-nine possible films selected as active in a single implicit process.

Note that process related information is not shown on the Run Time screen.

Note that the "Next Process" label has changed to "Next Film" and that the Review Processes key have been removed.

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Model 880 DEPOSITION CONTROLLER

Pressing the NEXT FILM key brings forth the numeric entry screen that is used to select the next active film. BAcK returns the previous screen and discards the entry, if any. ENTer accepts the digit[s] entered as the next active film and returns to the previous screen.

If 14 were entered, upon return to the runtime screen, the message "Next Film: 14" would appear as shown below.

Programming the unit for non-sequencing involves the same type of communications and I/O setups, system configuration, and film parameter modifications. Process programming does not exist for non-sequencing product use. An added parameter is added to the film parameter list: Final Thick Limit. The final thickness, no longer part of process programming, becomes a parameter.

SEQ: active film# is always selected by a process.

non-SEQ: active film# is selected in place of active process# (MAIN menu key label change is apparent along with non-appearance of the REVIEW PROCESSES key).

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Model 880 DEPOSITION CONTROLLER

SECTION 3.9

Software Controlled RunTime Screen Keys

There are several software controlled keys that are active in the RunTime Mode.

Crystal Quality Display. L/Q Key

The rightmost single key area on the second row of the Run Time screen labeled "L/Q" is used to sequence through the crystal quality indicators displayed on the RunTime screen (as depicted below). The parameters that can be displayed are LOOP and QUAL. These are described in Section x2.17 under Model 880 Crystal Switch. Each press of the L/Q key, advances through the possibilities as shown. For those that are familiar with previous deposition control products, STABility is no longer presented by this method due to the increased complexity because of the added crystal possibilities. The STABility information can now be found on the 2

STATUS screen under the column header "S".

L/Q

LOOP 14

QUAL 12

L/Q

Stability

STABility now displayed on the 2

STATUS screen 

Related Film parameters: Control Loop Qual Limits 0 to 9

XTAL Stability S (Limits) 0 to 9

Sample and Hold. SMPL Key

Using the single key area below the L/Q key, the Model 880 will force a Sample to be taken and restart the toggling sequence of the Sample and Hold Phases when in a Sample and Hold mode. When in the Sample and Hold mode, this area will not be empty as is normally the case and will contain text and values appropriate to the activity which is running. See Section x2.13 for a description of Sample and Hold operation and the associated parameters (MAIN/REVIEW FILM).

SMPL

SMPL 2:27

HOLD 1:12

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Model 880 DEPOSITION CONTROLLER

Related Film Parameters: (XTAL) RATE SAMPLING OFF,TIMED,INTELL.

(XTAL) SAMPLE INTERVAL 0:01-99:59 MM:SS (XTAL) SAMPLE DWELL TIME 0:01-99:59 MM:SS (XTAL) SAMPLE QUAL 1-50% (XTAL) SAMPLE ALARM TIME 0:01-99:59 MM:SS

SECTION 3.10

The Manual Power Mode is a method of controlling the source power manually. It is useful to initially determine the operating point for the soak and deposition levels. The Manual Power Mode can be entered from the RunTime Screen or either of the 2 STATUS screens (see section 3.0). In addition, a film and process must be running (not stopped) to enter the Manual Power mode. Section 3.20 defines and describes a test program. With this test program is running, all of these functions can be exercised and their effects observed.

Hand Controller / Manual Power Mode

Although familiarization with the operation of the manual power control can be accomplished by reading alone, with the multilayered test deposition program mentioned above running and used as an aid, familiarization with the operation of the manual power control can be enhanced. By pressing the fixed front panel MANUAL key, the Model 880 is placed in a phase similar to DEPOSIT. MANUAL is shown as the current phase displayed on the RunTime screen. The I/O event status designated as source shutter will indicate open and the rate control loop is disabled during the Manual Power Mode (with test program running). When in the MANUAL mode, a means of power adjustment using either one of two vertical

ARROW keys on the pendent becomes available. After entering the MANUAL mode, press one of the two vertical ARROW keys (see figure 3.12) and observe the Run Time screen. The power value indication

shown by the middle LED display section (front panel is labeled with POWER-%) will increase or decrease depending on the arrow key pressed. You can also use the hand controller (pendent) to put the unit in a STOPPED state by pressing the pendent STOP button. Pressing both of the pendent arrow keys simultaneously, zeroes the power value. The twelve foot coiled cord of the hand controller (pendent) plugs into the jack in the lower left corner of the front panel labeled MANUAL CONTROL.

Manual Power Control

Figure- 3.13: Hand Controller (pendent).

SECTION 3.XX

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MANUAL POWER

INC

DEC

STOP

ress fixed MANUAL key for manual power adjustment using pendant

Model 880 DEPOSITION CONTROLLER

Figure- 3.14 Manual Power Control

INC DE C

STOP

When you leave the Manual Power Mode (by pressing the fixed MANUAL key again), the Model 880 will enter the DEPOSIT phase of the film in use. The control loop will be active at this point. If the Thickness number is greater than the programmed Final Thickness value when you leave MANUAL, the Model 880 will go to the next process step.

[The push buttons on the pendent hand controller can be used for other functions when the Model 880 is not in the Manual Power Mode. By using the programmable I/O, these keys can control internal I/O events or output to relays. One common use example is to assign one of these buttons as an I/O program input to manually trip the final thickness limit. An example of using these buttons for these functions is given in Example 5 of Section 5 of this manual.]

Manual Power Control (LCD keys)

If the pendent is missing or if the pendent's key functions have been re-programmed (reassigned functionality) by an I/O program, there are available arrow keys that accomplish the identical functions. These have already been discussed in section 3.0. To reiterate briefly, switching between DEPOSIT and MANUAL can be accomplished on the Runtime screen, 1

the 1

STATUS screen, two arrow keys appear when switching into MANUAL mode. Press the UP arrow

STATUS screen and 2nd STATUS screen. On

key to increase power % value. Press the DOWN arrow key to decrease power % value.

deposit  manual

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Model 880 DEPOSITION CONTROLLER

SECTION 3.11

Shutter Delay Operation

Shutter delay operation is desirable when it is necessary to bring the deposition rate into good control before exposing substrates to the evaporant stream. When this mode of operation is required it must be enabled in the Review Film menu parameter list. This is not a global enable and will allow the following associated film parameters of only this specific film to become active and programmable. These parameters are:

Parameter 1 Shutter Delay Mode (On/Off) This parameter enables the mode of operation for this specific film program and also allows the following parameters to be accessed when ON.

Parameter 2 Shutter Delay Time Out

Time-Out (Accuracy) 1 To 99:59 M/S This parameter determines how long the system will keep trying to obtain the control accuracy value before giving up and aborting the run (process time). When the desired control accuracy is maintained for a period of 3 seconds before the time-out limit, the thickness display is set to zero and the substrate shutter relay is energized. All associated crystal switch, crystal backup, or active sensor selections and operations remain valid in this mode. Proper control loop P-I-D settings should be previously determined. This will insure minimum delay times and will also optimize film consistency. Refer to the I/O programming in Section X5 of this manual for a guide on selecting the logic for use as the substrate and sensor shutter controls.

Parameter 3 Shutter Delay Quality

Control Quality (Accuracy) 1 To 50% Of Setpoint This parameter sets the desired accuracy of the control loop before the substrate shutter is opened. The maximum accuracy available is 1% of the deposit rate setpoint or 1 angstrom per second; whichever is greater. The control accuracy must be maintained for a period of 3 seconds.

Film Parameters (/menu): Shutter Delay Mode OFF, ON

Model 880 Shutter Delay

Shutter Delay TIMEOUT 0:01-99:59 MM:SS Shutter Delay QUALITY 1-50%

(Setting Up Shutter Delay Mode)

SECTION 3.12

The Model 880 instrument is designed to measure the rate of material deposition and compare this measured value to a programmed rate setting, the difference between the actual and programmed rate is used to generate a feedback control signal to the deposition source power supply. The power supply is then adjusted by this control signal to achieve the programmed rate setpoint value. This method of control allows the Model 880 to compensate automatically for source condition changes.

Control Output Voltage

Since there are many different types of deposition power supplies and sources in use today, the deposition control voltage provided by the Model 880 has been made user configurable. This control voltage can be wired to be either positive or negative volts full scale. Full scale corresponds to 100% on the LCD power digits. The control voltage has 12 bit resolution and 10 milliampere source or sink capability. The sense of the control loop can also be set for etching applications where it must operate in an inverted fashion. This configuration is done on the Review Films parameter list menu (Etching Mode: Off/On).

P-I-D Control Loop

Deposition Source Control Loop Description

from chassis ground and scaled for either 2.5, 5 ,or 10

SECTION 3.XX

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Telemark 880 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual